REVISIONS
LTR DESCRIPTION DATE (YR-MO-DA) APPROVED
A Add case outline 2 to device type 01. Update document. Editorial changes
throughout. 89-09-13 M. A. FRYE
B Delete vendor CAGE 64155. Change boilerplate to add one-part numbers.
Add delta test limit table. Make changes to IIO, IIB, and AVO tests as specified
under table I. 96-12-31 R. MONNIN
C Add radiation hardened assurance requirements. - ro 99-02-16 R. MONNIN
D Replaced reference to MIL-STD-973 with reference to MIL-PRF-38535.
Drawing updated to reflect current requirements. - gt 04-08-06 R. MONNIN
E Add a new footnote under paragraph 1.5 and Table I. - ro 05-08-10 R. MONNIN
F Add device type 04. Make changes to 1.2.2, table I, figure 1, and
table IIB. - ro 08-06-06 R. HEBER
G Make correction to the SMD number on sheets 2 through 12.
Under paragraph 1.5, delete Neutron and Dose rate latch up information.
Delete paragraphs 4.4.4.1.1 and 4.4.4.2. - ro 10-09-21 C. SAFFLE
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS REV G G G G G G G G G G G G
OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12
PMIC N/A PREPARED BY
JOSEPH A. KERBY
DLA LAND AND MARITIME
COLUMBUS, OHIO 4321 8-3990
http://www.dscc.dla.mil
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
RAYMOND MONNIN
APPROVED BY
MICHAEL A. FRYE
MICROCIRCUIT, LINEAR, DUAL PRECISION
JFET-INPUT OPERATIONAL AMPLIFIERS,
MONOLITHIC SILICON
DRAWING APPROVAL DATE
88-10-07
AMSC N/A
REVISION LEVEL
G SIZE
A CAGE CODE
67268
5962-88538
SHEET 1 OF 12
DSCC FORM 2233
APR 97 5962-E408-10
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88538
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
G SHEET 2
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APR 97
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (de vice class V). A choice of case outlines and lead finishes are available and are reflected in the Part
or Identifying Number (PIN). When availa ble, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following examples.
For device classes M and Q:
5962 - 88538 01 G A
Federal
stock class
designator
RHA
designator
(see 1.2.1)
Device
type
(see 1.2.2)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\ /
\/
Drawing number
For device class V:
5962 R 88538 01 V G A
Federal
stock class
designator
RHA
designator
(see 1.2.1)
Device
type
(see 1.2.2)
Device
class
designator
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\ / (see 1.2.3)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked dev ices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-385 35, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a n on-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type Generic number Circuit function
01 OP215A Dual, precision JFET – input operational amplifier
02 OP215B Dual, precision JFET – input operational amplifier
03 OP215B Dual, precision JFET – input operational amplifier
with balance adjust
04 OP215A Dual, precision JFET – input operational amplifier
with balance adjust
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as li sted
below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q
designators will not be included in the PIN and will not be marked on the device.
Device class Device requirements docum entation
M Vendor self-certification to the requireme nts for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Q or V Certification and qualification to MIL-PRF-38535
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
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DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
G SHEET 3
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1.2.4 Case outline(s). The case outline(s) are as desi gnated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style
G MACY1-X8 8 Can
P GDIP1-T8 or CDIP2-T8 8 Dual-in-line
2 CQCC1-N20 20 Square leadless chip carrier
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 1/
Supply voltage (VS) ......................................................................................... 22 V
Differential input voltage ................................................................................. 40 V
Input voltage (VIN) .......................................................................................... 20 V 2/
Output short-circuit duration ............................................................................ Indefinite
Internal power dissipation (PD) ....................................................................... 500 mW 3/
Junction temperature (TJ) ............................................................................... +150C
Storage temperature range .............................................................................. -65C to +150C
Lead temperature (soldering, 60 seconds) ...................................................... +300C
Thermal resistance, ju nction-to-case (JC) ..................................................... See MIL-STD-1835
1.4 Recommended operating conditions.
Supply voltage (VS) ......................................................................................... 15 V
Ambient operating temp erature (TA) ............................................................... -55C to +125C
1.5 Radiation features.
Maximum total dose available (dose rate = 50 - 300 rad(Si)/s) ....................... 100 krads(Si) 4/
_____
1/ Stresses above the absolute maximum rating may cause permanent damage to the d evi ce. Extended oper ation at the
maximum levels may degrade performance and affect relia bility.
2/ Unless otherwise specified, the absolute maximum negative input voltage is equal to the negative power supply voltage.
3/ For case outline G at TA 80C, derate linearly at 7.1 mW/C. For case outline P at TA 75C, derate linearly at
6.7 mW/C. For case 2 at TA 80C, derate linearly at 7.5 mW/C.
4/ These parts may be dose rate sensitive in a space environment and may demonstrate e nhanced low dose rate
effects. Radiation end point limits for the noted parameters are guara nteed only for the conditions as specified in
MIL-STD-883, method 1019, condition A.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88538
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
G SHEET 4
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APR 97
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and han dbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-385 35 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Compone nt Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents ar e available online at http://assist.daps.dla.mil/quicksearch/ or from the Standardizatio n
Document Order Desk, 700 Robbins Avenue , Building 4D, Philadelphia, P A 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specif ied herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in acc ordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for devic e class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Radiation exposure circ uit. The radiation exposure circuit shall be as specified on figure 2.
3.3 Electrical performance characterist ics and postirradiation parameter limits. Unless otherwise specified herei n, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the devic e. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF - 38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88538
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
G SHEET 5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristi c s.
Test Symbol Conditions 1/ 2/
-55C TA +125C
VS = 15 V
Group A
subgroups
Device
type
Limits Unit
unless otherwise specified Min Max
Input offset voltage VIO R
S = 50 1 01,04
1.0 mV
02,03
2.0
2,3 01,04
2.0
02,03
3.0
M,D,P,L,R 1 01,04
3.0
Input offset current IIO TJ = +25C, -55C,
VCM = 0 V 1,3 3/ All
50.0 pA
TJ = +125C, VCM = 0 V 2
8.0 nA
M,D,P,L,R, VCM = 0 V 1 01,04
300 pA
Input bias current IIB T
J = +25C, -55C, 1,3 3/ 01,04 100 pA
VCM = 0 V 02,03
200
TJ = +125C,
VCM = 0 V 2 All
10 nA
M,D,P,L,R, VCM = 0 V 1 01,04
6
Large signal voltage gain AVO V
O = 10 V, RL 2 k 4 01,04 150 V/mV
02,03 750
5,6 All 30
M,D,P,L,R
VO = 10 V, RL = 2 k 4 01,04 10
Output voltage swing 4/ VO R
L 2 k 4 All
11 V
RL 10 k 5,6
12
Supply current IS V
O = 0 V, TA = +25C 1 All 8.5 mA
M,D,P,L,R, VO = 0 V 1 01,04 8.5
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88538
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
G SHEET 6
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristi c s – Continued.
Test Symbol Conditions 1/ 2/
-55C TA +125C
VS = 15 V
Group A
subgroups
Device
type
Limits Unit
unless otherwise specified Min Max
Slew rate 4/ SR AVCL = +1, RL 2 k, 4 01,04 10.0
V/s
CL = 100 pF 5,6 7.5
4 02,03 7.5
5,6 5.0
Settling time 4/ 5/ tS To 0.01 %, TA = +25C 9 All 3.0
s
To 0.05 %, TA = +25C 2.1
To 0.10 %, TA = +25C 1.8
Common-mode 4/
rejection ratio
CMRR VCM = IVR = 10.2 V 1 All 86 dB
2,3 82
Power supply rejection 4/
ratio
PSRR VS = 10 V to 16 V 1 01,04 51
V/V
02,03 80
2,3 All 100
Input voltage range 4/ 6/ IVR 1,2,3 All
10.2 V
Gain bandwidth 4/ 7/
product ABW T
A = +25C 4 All 3.5 MHz
1/ RHA devices supplied to this drawing have been characterized through all levels M, D, P, L, and R of irradiation.
However, this device is only tested at the “R” level. Pre and Post irradi ation values are identical unless otherwise specified
in Table I. When performing post irradiation electrica l mea s urements for any RHA level, TA = +25C.
2/ These parts may be dose rate sensitive in a space environment and may demo nstrate enhanced low dose rate effects.
Radi ation end point limits for the noted para m eters are guaranteed only for the conditions as specified in MIL-STD-883,
method 1019, condition A.
3/ TA = -55C for IIO and IIB tests, subgroup 3, is guaranteed by TA = +25C test.
4/ This parameter not tested post radiatio n.
5/ Settling time is defined here for a unit y gai n inverter connection using 2 k resistors. It is the time required for the error
voltag e (the voltage at the inverting input pin on the amplifier) to settle to within a specified percent of its final value from
the time a 10 V step input is applied to the inverter.
6/ IVR test is defined as the VCM range used for the CMRR test.
7/ Parameter guaranteed if not tested to the limits specified.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88538
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
G SHEET 7
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APR 97
Device types 01 and 02 01 03, 04
Case outlines G and P 2 2
Terminal number Terminal symbol
1 OUTPUT A NC NC
2 -INPUT A OUTPUT A -INPUT A
3 +INPUT A NC +INPUT A
4 -VS NC BALANCE A
5 +INPUT B -INPUT A NC
6 -INPUT B NC -VS
7 OUTPUT B +INPUT A NC
8 +VS NC BALANCE B
9 --- NC +INPUT B
10 ---
-VS -INPUT B
11 --- NC NC
12 --- +INPUT B BALANCE B
13 --- NC
+VS (B) (SEE NOTE 1)
14 --- NC OUTPUT B
15 --- -INPUT B NC
16 --- NC NC
17 --- OUTPUT B NC
18 --- NC OUTPUT A
19 --- NC
+VS (A) (SEE NOTE 1)
20 ---
+VS BALANCE A
NOTE:
1. +VS (A) and +VS (B) internally connected.
2. NC = No connection
FIGURE 1. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88538
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
G SHEET 8
DSCC FORM 2234
APR 97
FIGURE 2. Radiation exposure circuit.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88538
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
G SHEET 9
DSCC FORM 2234
APR 97
3.6 Certificate of compliance. For device classes Q and V, a certificate of complianc e shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of suppl y in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an appr oved source of
supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of
MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as require d for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38 535, appendix A shall be prov ided with each lot of microcircuits delivered to this dra wing.
3.8 Notification of change for device class M. For device class M, notification to DLA L and and Maritime-VA of change of
product (see 6.2 herein) inv olving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DLA Land and Mar itime, DLA Lan d and Maritime 's agent,
and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore
documentation shall be mad e available onshore at the option of the revie wer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 61 (see MIL-PRF-38535, appendix A).
4. VERIFICATION
4.1 Sampling and inspection. For device classes Q and V, sampling and inspecti on procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in
accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualific ation and technology confor m ance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall b e conducted on all devices prior to qualit y conformance inspection.
4.2.1 Additional criteria for device class M.
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintaine d b y the manufacturer u nd er document revision
level control and shall be ma de available to the preparing or acquiring activity upon request. T he test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordanc e with the intent specified in
method 1015.
(2) TA = +125C, minimum.
b. Interim and final electrical test parameters shall be as specified in table IIA herei n.
4.2.2 Additional criteria for device classes Q and V.
a. The burn-in test duration, test condition and test temperature, or approved alternatives shall b e as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revision level contro l of the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordanc e with the intent specified in
method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table IIA herei n.
c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
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DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
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TABLE IIA. Electrical test requirements.
Test requirements Subgroups
(in accordance with
MIL-STD-883,
method 5005, table I)
Subgroups
(in accordance with
MIL-PRF-38535, table III)
Device
class M Device
class Q Device
class V
Interim electrical
parameters (see 4.2) 1 1 1
Final electrical
parameters (see 4.2) 1,2,3,4,5,6 1/ 1,2,3,4,5,6 1/ 1,2,3, 1/ 2/
4,5,6
Group A test
requirements (see 4.4) 1,2,3,4,5,6,9 1,2,3,4,5,6,9 1,2,3,4,5,6,9
Group C end-point electrical
parameters (see 4.4) 1 1 1 2/
Group D end-point electrical
parameters (see 4.4) 1 1 1
Group E end-point electrical
parameters (see 4.4) --- --- 1,4
1/ PDA applies to subgroup 1.
2/ Delta limits as specified in table IIB shall be required where specified a nd the delta limits
shall be computed with reference to the previous interim electrical parameters.
TABLE IIB. Burn-in and operating life test delta parameters. 1/ 2/
Test Device Limit Delta Unit
type Min Max Min Max
VOS 01,04 -2.0 +2.0 -1.0 +1.0 mV
02 -3.0 +3.0 -1.0 +1.0
03 -5.0 +5.0 -1.0 +1.0
IIB 01,04 -150 +150 -75 +75 pA
02 -300 +300 -100 +100
03 -450 +450 -150 +150
1/ Deltas are performed at room temperature. TA = +25C.
2
/ 240 hour burn-in and 1,000 hour oper ating group C life test.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
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COLUMBUS, OHIO 43218-3990 REVISION LEVEL
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4.3 Qualification inspection for device classes Q and V. Qualification inspection for devic e classes Q and V shall be in
accordance with MIL-PRF-38535. Inspectio ns to be performed shall be those specified in MIL-PRF-38535 a nd herein for groups
A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. T echnolo gy conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified. Quality conforma nce inspection for device
class M shall be in accordanc e with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for
device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspecti ons
(see 4.4.1 through 4.4.4).
4.4.1 Group A inspection.
a. Tests shall be as specifi ed in table IIA herein.
b. Subgroups 7, 8, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted.
4.4.2 Group C inspection. The group C inspection end-point electrical par ameters shall be as specified in table IIA herein.
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
a. Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specifi ed in method 1005 of
MIL-STD-883.
b. TA = +125C, minimum.
c. Test duration: 1,000 hours, except as permitted by method 100 5 of MIL-STD-883.
4.4.2.2 Additional criteria for device classes Q and V. The steady-state lif e te st duration, test condition and test temperature,
or approved alternativ es shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The
test circuit shall be maintained under docum ent revision level control by the device manufac turer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiri ng or preparing activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specifi ed in method 1005 of
MIL-STD-883.
4.4.3 Group D inspection. The group D inspection end-point electrical par ameters shall be as specified in table IIA herein.
4.4.4 Group E inspection. Group E inspection is required onl y for parts intended to be marked as radiation hard ness assured
(see 3.5 herein).
a. End-point electrical parameters shall be as specified in table IIA herein.
b. For device cl asses Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as
specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to
radiation hardness assured tests as specified in MIL-PRF - 38535, appendix A for the RHA level being tested. All device
classes must meet the postirradiation end-point electrical parameter limits as defined in t able I at
T
A = +25C 5C, after exposure, to the subgroups specifie d in table IIA herein.
4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-ST D-883
method 1019, condition A and as specified herein.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
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COLUMBUS, OHIO 43218-3990 REVISION LEVEL
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5. PACKAGING
5.1 Packaging requirements. The requir eme nts for packaging shall be in accordance with MIL-PRF-38535 for device classes
Q and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Intended use. Microcircuits conforming t o this drawing are intended for use for Government microcircuit applications
(original equipment), desig n applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-
prepared specification or drawing.
6.2 Configuration control of SMD's. All proposed chan ges to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires
configuration control and which SMD's are applicable to tha t system. DLA Land and Maritime will maintain a record of users and
this list will be used for coordinatio n and distribution of changes to the drawings. Users of drawings covering microelectronic
devices (FSC 5962) should c ontact DLA Land and Maritime-VA, telephone (614) 6 92-0547.
6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3 990,
or telephone (614) 692-0540.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-133 1.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of suppl y for device classes Q and V are listed in QML-38535.
The vendors listed in QML-38535 h ave submitted a certificate of compliance (see 3. 6 herein) to DLA Land and Maritim e-VA and
have agreed to this drawing.
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.
The vendors listed in MIL-HDBK-103 h ave agreed to this drawing and a certificate of compliance (see 3.6 herein) has been
submitted to and accepted by DLA Land and Maritime-VA.
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 10-09-21
Approved sources of suppl y for SMD 5962-88538 are listed below for immediate acquisiti on information only and
shall be added to MIL-HDBK-103 an d QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been subm itted to and accepted by DLA Land and Maritime -VA. T his information
bulletin is superseded by the ne xt dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime
maintains an online database of all current sources of supply at http://www.dscc.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-8853801GA 3/ OP215AJ/883
3/ OP215AH/883
5962-8853801PA 24355 (2) OP215AZ
3/ OP215AJ8/883
5962-88538012A 3/ OP215ARC/833C
5962-8853801VGA 24355 (4) OP215AJ/QMLV
5962-8853801VPA 24355 (4) OP215AZ/QMLV
5962-8853801V2A 3/ OP215ARC/QMLV
5962-8853802GA 3/ OP215BJ/883
3/ OP215AH/883
5962-8853202PA 3/ OP215BZ/883
3/ OP215AJ8/883
5962-88538032A 3/ OP215BRC/883
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STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962R8853801VGA 24355 (4) OP215AJ/QMLR
5962R8853801VPA 24355 (4) OP215AZ/QMLR
5962R8853801V2A 3/ OP215ARC/QMLR
5962R8853804V2A 24355 (4) OP215ARC/QMLR
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number m ay not
satisfy the performance requirements of this drawing.
3/ Not available from an approved source of supply.
Vendor CAGE Vendor name
number and address
24355 (2) Analog Devices
Route 1 Industrial Park
P.O. Box 9106
Norwood, MA 02062
Point of contact: 804 Woburn Street
Wilmington, MA 01887-3462
24355 (4) Analog Devices
Route 1 Industrial Park
P.O. Box 9106
Norwood, MA 02062
Point of contact: 7910 Triad Center Drive
Greensboro, NC 27409-9605
The information contained herein is disseminated for conveni ence only and the
Government assumes no liability whatsoeve r for any inaccuracies in the
information bulletin.
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