ACCTB16E 201109-T
2011.09 panasonic-electric-works.net/ac
For FPC Y3BW Series
FPC connectors
(0.3mm pitch)
Back lock with FPC holding contacts
1. Ultra slim and low profile design (Pitch: 0.3 mm)
The adoption of the back lock has achieved the ultra-slim body
with a 3.15 mm depth (including the lever).
The 0.9 mm low-profile facilitates the thickness and size
reduction of target equipment.
2. High holding force has been achieved in addition to a
structure able to temporarily hold the FPC.
3. Excellent workability
(1) The inserted FPC can be temporarily held until the lever is
(2) When the lever is closed, the holding contacts lock the FPC
by its notches, enhancing the FPC holding force.
4. Mechanical design freedom achieved by top and bottom
double contacts
5. Easy-to-handle back lock structure
6. Wiring patterns can be located underneath the connector.
7. Man-hours f or assembl y can be reduced by delivering the
connectors with their levers opened.
Compact mobile devices “Cellular phones, Smartphones,
Tablet PC, Digital cameras and DVC, etc”
Compliance with RoHS Directive
Unit: mm
Structure to lock
notches on both
ends of the FPC
with holding
FPC shapes
33: FPC Connector 0.3 mm pitch
(Back lock)
AYF 3 3 56
Number of contacts (2 digits)
Contact direction
6: Top and bottom contacts, lock holding type
Surface treatment (Contact portion / Terminal portion)
5: Au plating/Au flash plating (Ni barrier)
ACCTB16E 201109-T
Notes: 1. Order unit;
For mass production: in 1-inner carton (1-reel) units
Samples for mounting check: in 50-connector units. Please contact our sales office.
2. Please contact our sales office for connectors having a number of contacts other than those listed above.
1. Characteristics
2. Material and surface treatment
Height Number of contacts Part number Packing
Inner carton (1-reel) Outer carton
0.9 mm 11 AYF331165 5,000 pieces 10,000 pieces25 AYF332565
51 AYF335165
Item Specifications Conditions
Rated current 0.2A/contact
Rated voltage 50V AC/DC
Insulation resistance Min. 1,000M (initial) Using 250V DC megger (applied for 1 min.)
Breakdown voltage 150V AC for 1 min. No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Contact resistance Max. 100mBased on the contact resistance measurement method
specified by JIS C 5402.
FPC holding force Min. 0.13N/contacts × contacts + 1.00N (initial) Measurement of the maximum force applied until the
inserted compatible FPC is pulled out in the insertion axis
direction while the connector lever is closed
Contact holding force Min. 0.20N/contacts Measuring the maximum force.
As the contact and holding contact are axially pull out.
Ambient temperature –55°C to +85°CNo freezing at low temperatures. No dew condensation.
Storage temperature –55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Thermal shock resistance
(with FPC inserted)
5 cycles,
insulation resistance min. 100M,
contact resistance max. 100m
1. –55 °C, 30 minutes
2. ~ , Max. 5 minutes
3. 85 °C, 30 minutes
4. ~ , Max. 5 minutes
Humidity resistance
(with FPC inserted)
120 hours,
insulation resistance min. 100M,
contact resistance max. 100m
Bath temperature 40±2°C,
humidity 90 to 95% R.H.
Saltwater spray resistance
(with FPC inserted)
24 hours,
insulation resistance min. 100M,
contact resistance max. 100m
Bath temperature 35±2°C,
saltwater concentration 5±1%
H2S resistance
(with FPC inserted) 48 hours,
contact resistance max. 100mBath temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Soldering heat resistance Peak temperature: 260°C or less Reflow soldering
300°C within 5 sec. 350°C within 3 sec. Soldering iron
characteristics Insertion and removal life 20 times Repeated insertion and removal: min. 10 sec./time
Unit weight 51-contact type: 0.09 g
Part name Material Surface treatment
Molded portion Housing: LCP resin (UL94V-0)
Lever: LCP resin (UL94V-0)
Contact Copper alloy Contact por tion; Base: Ni plating, Surface: Au plating
Terminal por tion; Base: Ni plating, Surface: Au plating
Holding contact Copper alloy Base: Ni plating, Surface: Au plating
ACCTB16E 201109-T
Recommended FPC dimensions
0.60±0.10 (Contact pitch)
0.60±0.10 (Contact pitch)
Terminal coplanarity
(Contact and holding contact)
(1.35) (Suction area)
(1.35) (FPC insertion depth)
(0.30) (0.40)
Holding contacts
(The holding contacts cannot be used as conductors.)
0.30±0.10 (Contact pitch)
Number of contacts/
dimension A B C D
11 5.40 3.00 2.40 3.60
25 9.60 7.20 6.60 7.80
51 17.40 15.00 14.40 15.60
General tolerance: ±0.3
(Exposed part of the conductor)
3.00±0.50 (Support plates)
0.60±0.02 (Pitch)
0.60±0.02 (Pitch) 0.20±0.02
0.30±0.02 (Pitch)
0.10 max.
0.10 max.
0.15 max.
(Contact width)
0.30 (Contact width)
(Finished thickness: t = 0.2±0.03)
The conductive parts should be based by Ni plating and then Au plating.
Number of contacts/
dimension A B C
11 4.20 3.00 2.40
25 8.40 7.20 6.60
51 16.20 15.00 14.40
ACCTB16E 201109-T
EMBOSSED T APE DIMENSIONS (Unit: mm) (Common for respective contact type)
• Dimension table (Unit: mm)
• Connector orientation with respect to embossed tape feeding direction
Number of contacts Type of taping A B C Quantity per reel
11 contacts Tape I 16.0 7.5 17.4 5,000
25 contacts Tape I 24.0 11.5 25.4 5,000
51 contacts Tape II 32.0 14.2 33.4 5,000
• Specifications for taping • Specifications for the plastic reel
(In accordance with EIAJ ET-7200B)
1.50 dia.
1.50 dia.
(B) (1.75)
Leading direction after packaging
A: Max. 24 mm
Tape I Tape II
A: 32 mm
28.40 (B) (1.75) (C±1)
380 dia.
Embossed mounting-hole
Embossed carrier tape
Top cover tape
Taping reel
of tape progress Y3BW
1. Recommended PC board and metal mask patterns
Appropriate control of solder amount is required to minimize
solder bridges and other defects for connectors with 0.2 mm or
0.3 mm pitch terminals, which require high-density mounting.
Refer to the recommended pattern.
Recommended PC board pattern
(Mount pad arrangement pattern) (TOP VIEW)
Recommended PC board pattern (TOP VIEW)
Recommended metal mask pattern
Metal mask thickness: When 120 µm
(Terminal opening ratio: 50%)
(Metal-part opening ratio: 51%)
Number of contacts/
dimension B C D
11 3.00 2.40 3.60
25 7.20 6.60 7.80
51 15.00 14.40 15.60
Connector outline Contacts
(lever opened)
Holding contacts
: Insulation area
: Insulation area
0.70±0.03 0.50±0.03
(0.39) (0.29)
ACCTB16E 201109-T
2. Holding contacts
The holding contacts cannot be used as conductors.
The holding contacts are located on both ends of the contacts,
and the shape of the soldered portions is the same as that of the
other contacts. Therefore, be careful to avoid any confusion.
3. Precautions for insertion/removal of FPC
Avoid touching the lever (applying any external force) until an
FPC is inserted. Do not open/close the lever without an FPC
inserted. Failure to follow this instruction will cause the contacts
to warp, leading to the contact tips interfering with the insertion
of an FPC, deforming the terminals. Failure to follow this
instruction may cause the lever to be removed, terminals to be
deformed, and/or the FPC insertion force to increase.
These connectors are of the back lock type, which has the FPC
insertion section on the opposite side of the lev er. Be careful not
to make a mistake in the FPC insertion position or the lever
opening/closing position. Otherwise, a contact failure or
connector breakage may occur.
These connectors have top and bottom double contacts. Do not
insert an FPC upside down. Inserting an FPC in a direction
opposite to that you intended may cause an operation failure or
Insert an FPC with the lever opened at right angle, that is, in the
factory default position.
Completely insert the FPC horizontally. An FPC inserted at an
excessive angle to the board may cause the deformation of
metal parts, FPC insertion failures, and FPC circuit breakages.
Insert the FPC to the full depth of the connector without altering
the angle.
Do not apply an excessive load to the lever in the opening
direction beyond its open position; otherwise, the lever may be
deformed or removed.
Do not apply an excessive load to the lever in a direction
perpendicular to the lever rotation axis or in the lever opening
direction; otherwise, the terminals may be deformed, and the
lever may be removed.
To close the lever, turn down the lever by pressing the entire
lever or both sides of the lever with the balls of fingers. Be
careful. If pressure to the le v er is applied une v enly, such as to an
edge only, it ma y deform or break. Also, make sure that the lev er
is closed completely. Not doing so will cause a faulty connection.
Avoid applying an excessiv e load to the top of the le v er during or
after closing the lever. Otherwise, the terminals may be
When opening the lever to remove the FPC, ensure that the
le ver will not go over the initial position; otherwise, the lever may
be removed.
To open the lev er, a load applied to the lev er une v enly or on only
one side may deform and break the lever.
Remove the FPC at parallel with the lever fully opened. If the
lever is closed, or if the FPC is forcedly pulled, the product or
FPC may break.
If a lever is accidentally detached during the handling of a
connector, do not use the connector any longer.
After an FPC is inserted, carefully handle it so as not to apply
excessive stress to the base of the FPC.
Please follow the precautions below when wiring the connected
Depending on the conditions of use, conduction failures,
connector breakage, removal of the lever lock, FPC breaks/
damage, or other problems may be caused.
• Carefully wiring the FPC so as not to apply a load directly to
the connector.
• Avoid sharply bending the FPC by the base at the FPC
insertion point of the connector.
• Keep the wired points of the FPC free from a load.
• Fix the FPC if it is possible that a load may be applied to the
• Keep the FPC notches free from a bending load.
Bending stress tends to concentrate on notches and may cause
the FPC to be broken or damaged.
Without an FPC inserted
For other details, please verify with the product specification
FPC notches portion
6ACCTB16E 201109-T
Automation Controls Business Unit
Head Office: 1048, Kadoma, Kadoma-shi, Osaka 571-8686, Japan
Telephone: +81-6-6908-1050 Facsimile: +81-6-6908-5781 Specifications are subject to change without notice.
All Rights Reserved © 2011 COPYRIGHT Panasonic Electric Works
Panasonic Electric Works Co., Ltd.
Printed in Japan.panasonic-electric-works.net/ac ACCTB16E 201109-T
1. PC board design
Design the recommended foot pattern in order to secure the
mechanical strength in the soldered areas of the terminal.
2. FPC and equipment design
Design the FPC based on the recommended dimensions to
ensure the required connector performance.
In addition, carefully check the equipment design and take
required measures for the equipment to prevent the FPC from
being removed subsequent to a fall, vibration, or other impact
due to the FPC size, weight, or the reaction force of the routed
3. Connector mounting
In case the connector is pick ed up b y chuc king during mounting,
an e xcessiv e mounter chuc king force ma y deform the molded or
metal part of the connector. Consult us in advance if chucking is
to be applied.
4. Soldering
1) Manual soldering
• Due to the low profile, if an excessive amount of solder is
applied to this product during manual soldering, the solder may
creep up to near the contact points, or interference by solder
may cause imperfect contact.
• Make sure that the soldering iron tip is heated within the
temperature and time limits indicated in the specifications.
• Flux from the solder wire may adhere to the contact surfaces
during soldering operations. After soldering, carefully check the
contact surfaces and clean off any flux before use.
• Be aware that a load applied to the connector terminals while
soldering may displace the contact.
Thoroughly clean the iron tip.
2) Reflow soldering
• Screen-printing is recommended for printing paste solder
To determine the relationship between the screen opening area
and the PC board foot pattern area, refer to the diagrams in the
recommended patterns for PC boards and metal masks when
• Note that excess solder on the terminals prevents complete
insertion of the FPC, and that excess solder on the metal clips
prevents the lever from rotating.
• Note that excess solder inhibits the slider lock operation.
• Screen thickness of 120µm is recommended for paste solder
• Consult us when using a screen-printing thickness other than
that recommended.
• Depending on the size of the connector being used, self
alignment may not be possible. Accordingly, carefully position
the terminal with the PC board pattern.
The recommended reflow temperature profile is given in the
figure below.
Recommended reflow temperature profile
The temperature is measured on the surface of the PC board
near the connector terminal.
• Some solder and flux types may cause serious solder
creeping. Take the solder and flux characteristics into
consideration when setting the reflow soldering conditions.
When performing reflow soldering on the back of the PC board
after reflow soldering the connector , secure the connector using,
for example, an adhesive.
(Double reflow soldering on the same side is possible)
3) Reworking on a soldered portion
• Finish reworking in one operation.
• For reworking of the solder bridge, use a soldering iron with a
flat tip. Do not add flux, otherwise, the flux may creep to the
contact parts.
• Use a soldering iron whose tip temperature is within the
temperature range specified in the specifications.
5. Do not drop the product or handle carelessly. Otherwise,
the terminals may become def ormed due to e xcessive for ce
or the solderability during reflow soldering may degrade.
6. Don’t open/close the lever or insert/remove an FPC until
the connector is soldered. Forcibly applied external
pressure on the terminals can weaken the adherence of the
terminals to the molded part or cause the terminals to lose
their evenness. In addition, do not insert an FPC into the
connector before soldering the connector.
7. When cutting or bending the PC boar d after mounting the
connector, be careful that the soldered sections are
subjected to excessive forces.
8. Other notes
When coating the PC board after soldering the connector to
prevent the deterioration of insulation, perform the coating in
such a way so that the coating does not get on the connector.
The connectors are not meant to be used for switching.
Terminal Paste solder
PC board foot pattern
For other details, please verify with the product specification
Upper limit (Soldering heat resistance)
Lower limit (Solder wettability)
Peak temperature
25 sec.
70 sec.60 to 120 sec.
Do not the soldered areas to be subjected to forces