LM5180QNGURQ1 - TEXAS INSTRUMENTS

November, 2018 − Rev. 9

1Publication Order Number:

NCP163/D

NCP163

250 mA, Ultra-Low Noise

and High PSRR LDO

Regulator for RF and

Analog Circuits

The NCP163 is a next generation of high PSRR, ultra−low noise

LDO capable of supplying 250 mA output current. Designed to meet

the requirements of RF and sensitive analog circuits, the NCP163

device provides ultra−low noise, high PSRR and low quiescent

current. The device also offer excelent load/line transients. The

NCP163 is designed to work with a 1 mF input and a 1 mF output

ceramic capacitor. It is available in two thickness ultra−small 0.35P,

WLCSP Packages, XDFN4 0.65P and industry standard SOT23−5L.

Features

•Operating Input Voltage Range: 2.2 V to 5.5 V

•Available in Fixed Voltage Option: 1.2 V to 5.3 V

•±2% Accuracy Over Load/Temperature

•Ultra Low Quiescent Current Typ. 12 mA

•Standby Current: Typ. 0.1 mA

•Very Low Dropout: 80 mV at 250 mA

•Ultra High PSRR: Typ. 92 dB at 20 mA, f = 1 kHz

•Ultra Low Noise: 6.5 mVRMS

•Stable with a 1 mF Small Case Size Ceramic Capacitors

•Available in − WLCSP4: 0.65 mm x 0.65 mm x 0.33 mm

− WLCSP4: 0.65 mm x 0.65 mm x 0.4 mm

− XDFN4: 1 mm x 1 mm x 0.4 mm

− SOT23−5: 2.9 mm x 2.8 mm x 1.2 mm

•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

Typical Applications

•Battery−powered Equipment

•Wireless LAN Devices

•Smartphones, Tablets

•Cameras, DVRs, STB and Camcorders

GND

OUT

OFF

Figure 1. Typical Application Schematics

VOUT

COUT

1 mF

Ceramic

VIN

NCP163

CIN

1 mF

Ceramic

WLCSP4

CASE 567KA

MARKING

DIAGRAMS

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X, XXX = Specific Device Code

M = Date Code

G= Pb−Free Package

See detailed ordering, marking and shipping information on

page 17 of this data sheet.

ORDERING INFORMATION

PIN CONNECTIONS

XDFN4

CASE 711AJ

A1 A2

B1 B2

IN OUT

EN GND

(Top View) (Top View)

WLCSP4

CASE 567JZ A1 X

XX M

A1 X

XXX MG

(Top View)

(Note: Microdot may be in either location)

SOT23−5L

CASE 527AH

GND

OUT

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Figure 2. Simplified Schematic Block Diagram

THERMAL

SHUTDOWN

MOSFET

DRIVER WITH

CURRENT LIMIT

INTEGRATED

SOFT−START

BANDGAP

REFERENCE

ENABLE

LOGIC

OUT

GND

* ACTIVE DISCHARGE

Version A only

PIN FUNCTION DESCRIPTION

Pin No.

WLCSP4

Pin No.

SOT23−5L

Pin No.

XDFN4

Name Description

A1 1 4 IN Input voltage supply pin

A2 5 1 OUT Regulated output voltage. The output should be bypassed with small 1 mF ceramic

capacitor.

B1 3 3 EN Chip enable: Applying VEN < 0.4 V disables the regulator, Pulling VEN > 1.2 V

enables the LDO.

B2 2 2 GND Common ground connection

−4−NC Not connected. Can be tied to ground plane.

− − EPAD EPAD Exposed pad. Can be tied to ground plane for better power dissipation.

ABSOLUTE MAXIMUM RATINGS

Rating Symbol Value Unit

Input Voltage (Note 1) VIN −0.3 V to 6V

Output Voltage VOUT −0.3 to VIN + 0.3, max. 6 V V

Chip Enable Input VCE −0.3 to 6 V V

Output Short Circuit Duration tSC unlimited s

Maximum Junction Temperature TJ150 °C

Storage Temperature TSTG −55 to 150 °C

ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V

ESD Capability, Machine Model (Note 2) ESDMM 200 V

ESD Capability, Charged Device Model (Note 2) ESDCDM 1000 V

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.

2. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per EIA/JESD22−A114

ESD Machine Model tested per EIA/JESD22−A115

ESD Charged Device Model tested per EIA/JESD22−C101, Field Induced Charge Model

Latchup Current Maximum Rating tested per JEDEC standard: JESD78.

NCP163

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THERMAL CHARACTERISTICS

Rating Symbol Value Unit

Thermal Characteristics, WLCSP4 (Note 3), Thermal Resistance, Junction−to−Air

RqJA

108

°C/W

Thermal Characteristics, XDFN4 (Note 3), Thermal Resistance, Junction−to−Air 198.1

Thermal Characteristics, SOT23−5 (Note 3), Thermal Resistance, Junction−to−Air 218

3. Measured according to JEDEC board specification. Detailed description of the board can be found in JESD51−7

ELECTRICAL CHARACTERISTICS −40°C ≤ TJ ≤ 125°C; VIN = VOUT(NOM) + 1 V; IOUT = 1 mA, CIN = COUT = 1 mF, unless otherwise

noted. VEN = 1.2 V. Typical values are at TJ = +25°C (Note 4).

Parameter Test Conditions Symbol Min Typ Max Unit

Operating Input Voltage VIN 2.2 5.5 V

Output Voltage Accuracy VIN = (VOUT(NOM) + 1 V) to 5.5 V

0 mA ≤ IOUT ≤ 250 mA

VOUT

−2 +2

VIN = (VOUT(NOM) + 1 V) to 5.5 V

0 mA ≤ IOUT ≤ 250 mA

(for VOUT < 1.8 V, XDFN4 package)

−3 +3

VIN = (VOUT(NOM) + 1 V) to 5.5 V

SOT23−5L Package Only −2 +2

Line Regulation VOUT(NOM) + 1 V ≤ VIN ≤ 5.5 V LineReg 0.02 %/V

Load Regulation

IOUT = 1mA to 250mA

WLCSP, XDFN4

LoadReg

0.001

%/mA

SOT23−5L 0.008 0.015

Dropout Voltage (Note 5)

IOUT = 250 mA

(WLCSP, XDFN4

Packages)

VOUT(NOM) = 1.8 V

VDO

180 250

VOUT(NOM) = 2.5 V 110 175

VOUT(NOM) = 2.8 V 95 160

VOUT(NOM) = 3.0 V 90 155

VOUT(NOM) = 3.2 V 85 149

VOUT(NOM) = 3.3 V 80 145

VOUT(NOM) = 3.5 V 75 140

VOUT(NOM) = 4.5 V 65 120

VOUT(NOM) = 5.0 V 75 105

Dropout Voltage (Note 5)

IOUT = 250 mA

(SOT23−5L

Package)

VOUT(NOM) = 1.8 V

VDO

205 280

VOUT(NOM) = 2.8 V 120 190

VOUT(NOM) = 3.0 V 115 185

VOUT(NOM) = 3.3 V 105 175

Output Current Limit VOUT = 90% VOUT(NOM) ICL 250 700

Short Circuit Current VOUT = 0 V ISC 690

Quiescent Current IOUT = 0 mA IQ12 20 mA

Shutdown Current VEN ≤ 0.4 V, VIN = 4.8 V IDIS 0.01 1 mA

EN Pin Threshold Voltage EN Input Voltage “H” VENH 1.2

EN Input Voltage “L” VENL 0.4

EN Pull Down Current VEN = 4.8 V IEN 0.2 0.5 mA

Turn−On Time COUT = 1 mF, From assertion of VEN to

VOUT = 95% VOUT(NOM) 120 ms

Power Supply Rejection Ratio IOUT = 20 mA f = 100 Hz

f = 1 kHz

f = 10 kHz

f = 100 kHz

PSRR

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ELECTRICAL CHARACTERISTICS −40°C ≤ TJ ≤ 125°C; VIN = VOUT(NOM) + 1 V; IOUT = 1 mA, CIN = COUT = 1 mF, unless otherwise

noted. VEN = 1.2 V. Typical values are at TJ = +25°C (Note 4).

Parameter UnitMaxTypMinSymbolTest Conditions

Output Voltage Noise f = 10 Hz to 100 kHz IOUT = 1 mA

IOUT = 250 mA VN8.0

6.5 mVRMS

Thermal Shutdown Threshold Temperature rising TSDH 160 °C

Temperature falling TSDL 140 °C

Active Output Discharge Resistance VEN < 0.4 V, Version A only RDIS 280 W

Line Transient (Note 6) VIN = (VOUT(NOM) + 1 V) to (VOUT(NOM) +

1.6 V) in 30 ms, IOUT = 1 mA

TranLINE

−1

VIN = (VOUT(NOM) + 1.6 V) to (VOUT(NOM) +

1 V) in 30 ms, IOUT = 1 mA +1

Load Transient (Note 6) IOUT = 1 mA to 200 mA in 10 ms

TranLOAD

−40

IOUT = 200 mA to 1mA in 10 ms+40

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at TA = 25°C.

Low duty cycle pulse techniques are used during the testing to maintain the junction temperature as close to ambient as possible.

5. Dropout voltage is characterized when VOUT falls 100 mV below VOUT(NOM).

6. Guaranteed by design.

NCP163

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TYPICAL CHARACTERISTICS

Figure 3. Output Voltage vs. Temperature −

VOUT = 1.8 V − XDFN Package

Figure 4. Output Voltage vs. Temperature −

VOUT = 3.3 V − XDFN Package

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

1201008060200−20−40

1.780

1.785

1.790

1.810

1.800

1.805

1.815

1.820

1201008060400−20−40

3.335

Figure 5. Output Voltage vs. Temperature −

VOUT = 5.0 V − XDFN Package

TJ, JUNCTION TEMPERATURE (°C)

1201008040200−20−40

4.990

5.040

Figure 6. Line Regulation vs. Temperature −

VOUT = 1.8 V

TJ, JUNCTION TEMPERATURE (°C)

1201008060200−20−40

0.05

VOUT

, OUTPUT VOLTAGE (V)

VOUT

, OUTPUT VOLTAGE (V)

VOUT

, OUTPUT VOLTAGE (V)

REGLINE, LINE REGULATION (%/V)

40 140

1.795

IOUT = 10 mA

IOUT = 250 mA

VIN = 2.8 V

VOUT = 1.8 V

CIN = 1 mF

COUT = 1 mF

20 140

IOUT = 10 mA

IOUT = 250 mA

VIN = 4.3 V

VOUT = 3.3 V

CIN = 1 mF

COUT = 1 mF

IOUT = 10 mA

IOUT = 250 mA

VIN = 5.5 V

VOUT = 5.0 V

CIN = 1 mF

COUT = 1 mF

60 140 40 140

VIN = 2.8 V

VOUT = 1.8 V

CIN = 1 mF

COUT = 1 mF

1.825

1.830

3.325

3.320

3.315

3.310

3.305

3.295

3.290

3.285

5.035

5.030

5.025

5.020

5.015

5.010

5.005

5.000

4.995

0.04

0.03

0.02

0.01

−0.01

−0.02

−0.03

−0.04

−0.05

3.300

3.330

Figure 7. Line Regulation vs. Temperature −

VOUT = 3.3 V

Figure 8. Load Regulation vs. Temperature −

VOUT = 1.8 V

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

1201008060200−20−40 1201008060200−20−40

REGLINE, LINE REGULATION (%/V)

40 140

VIN = 4.3 V

VOUT = 3.3 V

CIN = 1 mF

COUT = 1 mF

40 140

VIN = 2.8 V

VOUT = 1.8 V

CIN = 1 mF

COUT = 1 mF

REGLOAD, LOAD REGULATION (mV)

0.050

0.040

0.030

0.020

0.010

−0.010

−0.020

−0.030

−0.040

−0.050

NCP163

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TYPICAL CHARACTERISTICS

Figure 9. Load Regulation vs. Temperature −

VOUT = 3.3 V

Figure 10. Load Regulation vs. Temperature −

VOUT = 5.0 V

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

120806040200−20−40

1201008060200−20−40

Figure 11. Ground Current vs. Load Current −

VOUT = 1.8 V

IOUT

, OUTPUT CURRENT (mA)

22517515012510075250

1500

REGLOAD, LOAD REGULATION (mV)

IGND, GROUND CURRENT (mA)

100 140

VIN = 4.3 V

VOUT = 3.3 V

CIN = 1 mF

COUT = 1 mF

40 140

VIN = 5.5 V

VOUT = 5.0 V

CIN = 1 mF

COUT = 1 mF

50 200 250

VIN = 2.8 V

VOUT = 1.8 V

CIN = 1 mF

COUT = 1 mF

TJ = 125°C

TJ = 25°C

TJ = −40°C

1350

1200

1050

900

750

600

450

300

150

Figure 12. Ground Current vs. Load Current −

VOUT = 3.3 V

IOUT

, OUTPUT CURRENT (mA)

22517515012510075250

1500

IGND, GROUND CURRENT (mA)

50 200 250

1350

1200

1050

900

750

600

450

300

150

TJ = 125°C

TJ = 25°C

TJ = −40°C

VIN = 4.3 V

VOUT = 3.3 V

CIN = 1 mF

COUT = 1 mF

Figure 13. Ground Current vs. Load Current −

VOUT = 5.0 V

Figure 14. Dropout Voltage vs. Load Current −

VOUT = 1.8 V

IOUT

, OUTPUT CURRENT (mA) IOUT

, OUTPUT CURRENT (mA)

2251751501257550250

22520015012510050250

250

IGND, GROUND CURRENT (mA)

VDROP

, DROPOUT VOLTAGE (mV)

VIN = 5.5 V

VOUT = 5.0 V

CIN = 1 mF

COUT = 1 mF

TJ = 125°C

TJ = 25°C

TJ = −40°C

100 200 250 75 175 250

TJ = 125°C

TJ = 25°C

TJ = −40°C

1500

1350

1200

1050

900

750

600

450

300

150

VOUT = 1.8 V

CIN = 1 mF

COUT = 1 mF

225

200

175

150

125

100

NCP163

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TYPICAL CHARACTERISTICS

Figure 15. Dropout Voltage vs. Load Current −

VOUT = 3.3 V

Figure 16. Dropout Voltage vs. Load Current −

VOUT = 5.0 V

IOUT

, OUTPUT CURRENT (mA) IOUT

, OUTPUT CURRENT (mA)

2252001501007550250 22520015012510050250

120

150

VDROP

, DROPOUT VOLTAGE (mV)

VDROP

, DROPOUT VOLTAGE (mV)

VOUT = 3.3 V

CIN = 1 mF

COUT = 1 mF

TJ = 125°C

TJ = 25°C

TJ = −40°C

125 175 250

VOUT = 5.0 V

CIN = 1 mF

COUT = 1 mF

TJ = 125°C

TJ = 25°C

TJ = −40°C

75 175 250

105

135

120

150

105

135

Figure 17. Dropout Voltage vs. Temperature −

VOUT = 1.8 V

Figure 18. Dropout Voltage vs. Temperature −

VOUT = 3.3 V

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

12010060200−20−40 12010060400−20−40

120

150

VDROP

, DROPOUT VOLTAGE (mV)

VDROP

, DROPOUT VOLTAGE (mV)

VOUT = 1.8 V

CIN = 1 mF

COUT = 1 mF

IOUT = 250 mA

IOUT = 10 mA

IOUT = 100 mA

40 80 140 20 80 140

105

135

100

125

200

250

175

225

150

Figure 19. Dropout Voltage vs. Temperature −

VOUT = 5.0 V

Figure 20. Current Limit vs. Temperature

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

12010060200−20−40 12010060400−20−40

520

540

580

600

620

680

720

VDROP

, DROPOUT VOLTAGE (mV)

ICL, CURRENT LIMIT (mA)

VOUT = 5.0 V

CIN = 1 mF

COUT = 1 mF

40 80 140

VIN = 4.3 V

VOUT = 90% VOUT(nom)

CIN = 1 mF

COUT = 1 mF

20 80 140

560

660

700

640

100

VOUT = 3.3 V

CIN = 1 mF

COUT = 1 mF

IOUT = 250 mA

IOUT = 10 mA

IOUT = 100 mA

IOUT = 250 mA

IOUT = 10 mA

IOUT = 100 mA

NCP163

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TYPICAL CHARACTERISTICS

Figure 21. Short Circuit Current vs.

Temperature

Figure 22. Enable Thresholds Voltage

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

12010060200−20−40 1201006040200−20−40

0.1

0.3

0.4

0.5

0.8

1.0

ISC, SHORT CIRCUIT CURRENT (mA)

VEN, ENABLE VOLTAGE THRESHOLD (V)

VIN = 4.3 V

VOUT = 0 V (SHORT)

CIN = 1 mF

COUT = 1 mF

40 80 140

OFF −> ON

80 140

0.2

0.7

0.9

0.6

500

520

560

580

600

660

700

540

640

680

620

Figure 23. Current to Enable Pin vs.

Temperature

Figure 24. Disable Current vs. Temperature

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

12010060200−20−40 12010060400−20−40

100

IEN, ENABLE PIN CURRENT (mA)

IDIS, DISABLE CURRENT (nA)

40 80 140 20 80 140

0.05

0.15

0.20

0.25

0.40

0.50

0.10

0.35

0.45

0.30

Figure 25. Discharge Resistance vs.

Temperature

Figure 26. Maximum COUT ESR Value vs. Load

Current

TJ, JUNCTION TEMPERATURE (°C) IOUT

, OUTPUT CURRENT (mA)

12010060200−20−40 250200150100500

0.1

100

RDIS, DISCHARGE RESISTIVITY (W)

ESR (W)

40 80 140

Unstable Operation

Stable Operation

300

200

210

230

240

250

280

300

220

270

290

260

VIN = 4.3 V

VOUT = 3.3 V

CIN = 1 mF

COUT = 1 mF

VIN = 4.3 V

VOUT = 3.3 V

CIN = 1 mF

COUT = 1 mF

ON −> OFF

VIN = 4.3 V

VOUT = 3.3 V

CIN = 1 mF

COUT = 1 mF

VIN = 4.3 V

VOUT = 3.3 V

CIN = 1 mF

COUT = 1 mF

NCP163

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TYPICAL CHARACTERISTICS

Figure 27. Output Voltage Noise Spectral Density – VOUT = 1.8 V

FREQUENCY (Hz)

100K10K1K10010

OUTPUT NOISE (nV/√Hz)

10K

VIN = 2.8 V

VOUT = 1.8 V

CIN = 1 mF

COUT = 1 mF

1 mA

10 mA

250 mA

RMS Output Noise (mV)

IOUT

1 mA

10 mA

250 mA

10 Hz − 100 kHz

7.73

7.12

7.11

100 Hz − 100 kHz

6.99

6.26

6.33

VIN = 3.8 V

VOUT = 2.8 V

CIN = 1 mF

COUT = 1 mF

100

Figure 28. Output Voltage Noise Spectral Density – VOUT = 2.8 V

FREQUENCY (Hz)

100K10K1K10010

OUTPUT NOISE (nV/√Hz)

10K

RMS Output Noise (mV)

IOUT

1 mA

10 mA

250 mA

10 Hz − 100 kHz

7.9

7.19

7.29

100 Hz − 100 kHz

7.07

6.25

6.38

100

1 mA

10 mA

250 mA

Figure 29. Power Supply Rejection Ratio −

VOUT = 1.8 V

Figure 30. Power Supply Rejection Ratio −

VOUT = 3.3 V

FREQUENCY (Hz) FREQUENCY (Hz)

10010

RR, RIPPLE REJECTION (dB)

120

1 mA

10 mA

20 mA

100 mA

250 mA

VIN = 2.8 V+100mVpp

VOUT = 1.8 V

COUT = 1 mF MLCC 1206

100

1 mA

10 mA

20 mA

100 mA

250 mA

VIN = 4.3 V+100mVpp

VOUT = 3.3 V

COUT = 1 mF MLCC 1206

1K 10K 100K 1M 10M 10010

120

100

1K 10K 100K 1M 10M

NCP163

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TYPICAL CHARACTERISTICS

Figure 31. Power Supply Rejection Ratio −

VOUT = 5.0 V

FREQUENCY (Hz)

10010

RR, RIPPLE REJECTION (dB)

120

100

1K 10K 100K 1M 10M

1 mA

10 mA

20 mA

100 mA

250 mA

VIN = 5.5 V+100mVpp

VOUT = 5.0 V

COUT = 1 mF MLCC 1206

Figure 32. Enable Turn−on Response −

COUT = 1 mF, IOUT = 10 mA

Figure 33. Enable Turn−on Response −

COUT = 4.7 mF, IOUT = 10 mA

50 ms/div 50 ms/div

500 mV/div

VEN

IINPUT

VOUT

500 mV/div

1 V/div

VIN = 4.3 V

VOUT = 3.3 V

COUT = 4.7 mF (MLCC)

VEN

IINPUT

VOUT

Figure 34. Enable Turn−on Response −

COUT = 1 mF, IOUT = 250 mA

Figure 35. Enable Turn−on Response −

COUT = 4.7 mF, IOUT = 250 mA

50 ms/div 50 ms/div

500 mV/div

VEN

IINPUT

VOUT

500 mV/div

1 V/div

VEN

IINPUT

VOUT

200 mA/div

VIN = 4.3 V

VOUT = 3.3 V

COUT = 1 mF (MLCC)

200 mA/div

VIN = 4.3 V

VOUT = 3.3 V

COUT = 1 mF (MLCC) VIN = 4.3 V

VOUT = 3.3 V

COUT = 4.7 mF (MLCC)

NCP163

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TYPICAL CHARACTERISTICS

Figure 36. Line Transient Response −

IOUT = 10 mA

Figure 37. Line Transient Response −

IOUT = 10 mA

2 ms/div 2 ms/div

Figure 38. Line Transient Response −

IOUT = 250 mA

Figure 39. Line Transient Response −

IOUT = 250 mA

2 ms/div 2 ms/div

Figure 40. Load Transient Response −

1 mA to 250 mA

Figure 41. Load Transient Response −

250 mA to 1 mA

5 ms/div 10 ms/div

500 mV/div

VIN

3.3 V

VOUT

10 mV/div

2.3 V

500 mV/div10 mV/div

3.3 V

2.3 V

500 mV/div100 mA/div20 mV/div

500 mV/div

VIN

VOUT

10 mV/div100 mA/div20 mV/div

VIN = 3.8 V, VOUT = 3.3 V

CIN = 1 mF (MLCC)

IOUT

VOUT

tRISE = 1 ms

IOUT

VOUT

VIN

VOUT

tRISE = 1 ms

VIN

VOUT

tFALL = 1 ms

10 mV/div

tFALL = 1 ms

tRISE = 1 ms

VOUT = 1.8 V, IOUT = 10 mA

CIN = 1 mF (MLCC)

COUT = 1 mF (MLCC)

VOUT = 1.8 V, IOUT = 10 mA

CIN = 1 mF (MLCC)

COUT = 1 mF (MLCC)

tFALL = 1 ms

VOUT = 1.8 V, IOUT = 250 mA

CIN = 1 mF (MLCC)

COUT = 1 mF (MLCC)

3.3 V

2.3 V

VOUT = 1.8 V, IOUT = 250 mA

CIN = 1 mF (MLCC)

COUT = 1 mF (MLCC)

3.3 V

2.3 V

COUT = 1 mF

COUT = 4.7 mFVIN = 3.8 V, VOUT = 3.3 V

CIN = 1 mF (MLCC)

COUT = 1 mF

COUT = 4.7 mF

NCP163

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TYPICAL CHARACTERISTICS

Figure 42. Load Transient Response −

1 mA to 250 mA

Figure 43. Load Transient Response −

250 mA to 1 mA

5 ms/div 5 ms/div

Figure 44. Overheating Protection − TSD Figure 45. Turn−on/off − Slow Rising VIN

10 ms/div 2 ms/div

Figure 46. Enable Turn−off − Various Output

Capacitors

400 ms/div

100 mA/div

VOUT

20 mV/div

100 mA/div20 mV/div500 mV/div

1 V/div

VIN = 5.5 V, VOUT = 1.2 V

CIN = 1 mF (MLCC), COUT = 1 mF (MLCC)

IOUT

VOUT

100 mA/div

500 mV/div1 V/div

VIN = 3.8 V

VOUT = 2.8 V

CIN = 1 mF (MLCC)

VOUT

COUT = 10 mF

VOUT

TSD On

VOUT

IOUT VIN = 3.8 V, VOUT = 3.3 V

CIN = 1 mF (MLCC)

COUT = 1 mF (MLCC)

tRISE = 1 ms

tRISE = 500 ns

IOUT VIN = 3.8 V, VOUT = 3.3 V

CIN = 1 mF (MLCC)

COUT = 1 mF (MLCC)

tRISE = 1 ms

tRISE = 500 ns

TSD Off

VIN

VIN = 3.8 V

VOUT = 3.3 V

CIN = 1 mF (MLCC)

COUT = 1 mF (MLCC)

IOUT = 10 mA

VEN

COUT = 1 mF

COUT = 4.7 mF

NCP163

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APPLICATIONS INFORMATION

General

The NCP163 is an ultra−low noise 250 mA low dropout

regulator designed to meet the requirements of RF

applications and high performance analog circuits. The

NCP163 device provides very high PSRR and excellent

dynamic response. In connection with low quiescent current

this device is well suitable for battery powered application

such as cell phones, tablets and other. The NCP163 is fully

protected in case of current overload, output short circuit and

overheating.

Input Capacitor Selection (CIN)

Input capacitor connected as close as possible is necessary

for ensure device stability. The X7R or X5R capacitor

should be used for reliable performance over temperature

range. The value of the input capacitor should be 1 mF or

greater to ensure the best dynamic performance. This

capacitor will provide a low impedance path for unwanted

AC signals or noise modulated onto constant input voltage.

There is no requirement for the ESR of the input capacitor

but it is recommended to use ceramic capacitors for their low

ESR and ESL. A good input capacitor will limit the

influence of input trace inductance and source resistance

during sudden load current changes.

Output Decoupling (COUT)

The NCP163 requires an output capacitor connected as

close as possible to the output pin of the regulator. The

recommended capacitor value is 1 mF and X7R or X5R

dielectric due to its low capacitance variations over the

specified temperature range. The NCP163 is designed to

remain stable with minimum effective capacitance of 0.7 mF

to account for changes with temperature, DC bias and

package size. Especially for small package size capacitors

such as 0201 the effective capacitance drops rapidly with the

applied DC bias. Please refer Figure 47.

Figure 47. Capacity vs DC Bias Voltage

There is no requirement for the minimum value of

Equivalent Series Resistance (ESR) for the COUT but the

maximum value of ESR should be less than 2 W. Larger

output capacitors and lower ESR could improve the load

transient response or high frequency PSRR. It is not

recommended to use tantalum capacitors on the output due

to their large ESR. The equivalent series resistance of

tantalum capacitors is also strongly dependent on the

temperature, increasing at low temperature.

Enable Operation

The NCP163 uses the EN pin to enable/disable its device

and to deactivate/activate the active discharge function.

If the EN pin voltage is <0.4 V the device is guaranteed to

be disabled. The pass transistor is turned−off so that there is

virtually no current flow between the IN and OUT. The

active discharge transistor is active so that the output voltage

VOUT is pulled to GND through a 280 W resistor. In the

disable state the device consumes as low as typ. 10 nA from

the VIN.

If the EN pin voltage >1.2 V the device is guaranteed to

be enabled. The NCP163 regulates the output voltage and

the active discharge transistor is turned−off.

The EN pin has internal pull−down current source with

typ. value of 200 nA which assures that the device is

turned−off when the EN pin is not connected. In the case

where the EN function isn’t required the EN should be tied

directly to IN.

Output Current Limit

Output Current is internally limited within the IC to a

typical 700 mA. The NCP163 will source this amount of

current measured with a voltage drops on the 90% of the

nominal VOUT. If the Output Voltage is directly shorted to

ground (VOUT = 0 V), the short circuit protection will limit

the output current to 690 mA (typ). The current limit and

short circuit protection will work properly over whole

temperature range and also input voltage range. There is no

limitation for the short circuit duration.

Thermal Shutdown

When the die temperature exceeds the Thermal Shutdown

threshold (TSD − 160°C typical), Thermal Shutdown event

is detected and the device is disabled. The IC will remain in

this state until the die temperature decreases below the

Thermal Shutdown Reset threshold (TSDU − 140°C typical).

Once the IC temperature falls below the 140°C the LDO is

enabled again. The thermal shutdown feature provides the

protection from a catastrophic device failure due to

accidental overheating. This protection is not intended to be

used as a substitute for proper heat sinking.

Power Dissipation

As power dissipated in the NCP163 increases, it might

become necessary to provide some thermal relief. The

maximum power dissipation supported by the device is

dependent upon board design and layout. Mounting pad

configuration on the PCB, the board material, and the

NCP163

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ambient temperature affect the rate of junction temperature

rise for the part.

The maximum power dissipation the NCP163 can handle

is given by:

PD(MAX) +ƪ125oC*TAƫ

qJA

(eq. 1)

The power dissipated by the NCP163 for given

application conditions can be calculated from the following

equations:

PD[VIN @IGND )IOUTǒVIN *VOUTǓ(eq. 2)

Figure 48. qJA and PD (MAX) vs. Copper Area (CSP4)

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

100

110

120

130

140

150

160

0 100 200 300 400 500 600 700

PCB COPPER AREA (mm2)

qJA, JUNCTION TO AMBIENT THERMAL RESISTANCE (°C/W)

PD(MAX), MAXIMUM POWER DISSIPATION (W)

qJA, 2 oz Cu

qJA, 1 oz Cu

PD(MAX), TA = 25°C, 1 oz Cu

PD(MAX), TA = 25°C, 2 oz Cu

Figure 49. qJA and PD (MAX) vs. Copper Area (XDFN4)

0.3

0.4

0.5

0.6

0.8

0.7

0.9

1.0

150

160

170

180

190

200

210

220

0 100 200 300 400 500 600 700

PCB COPPER AREA (mm2)

qJA, JUNCTION TO AMBIENT THERMAL RESISTANCE (°C/W)

PD(MAX), MAXIMUM POWER DISSIPATION (W)

qJA, 2 oz Cu

qJA, 1 oz Cu

PD(MAX), TA = 25°C, 1 oz Cu

PD(MAX), TA = 25°C, 2 oz Cu

NCP163

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Figure 50. qJA and PD (MAX) vs. Copper Area (SOT23−5L)

0.1

0.2

0.3

0.5

0.4

0.6

0.7

150

175

200

225

250

275

300

325

0 100 200 300 400 500 600 700

PCB COPPER AREA (mm2)

qJA, JUNCTION TO AMBIENT THERMAL RESISTANCE (°C/W)

PD(MAX), MAXIMUM POWER DISSIPATION (W)

qJA, 2 oz Cu

qJA, 1 oz Cu

PD(MAX), TA = 25°C, 1 oz Cu

PD(MAX), TA = 25°C, 2 oz Cu

NCP163

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Reverse Current

The PMOS pass transistor has an inherent body diode

which will be forward biased in the case that VOUT > VIN.

Due to this fact in cases, where the extended reverse current

condition can be anticipated the device may require

additional external protection.

Power Supply Rejection Ratio

The NCP163 features very high Power Supply Rejection

ratio. If desired the PSRR at higher frequencies in the range

100 kHz – 10 MHz can be tuned by the selection of COUT

capacitor and proper PCB layout.

Turn−On Time

The turn−on time is defined as the time period from EN

assertion to the point in which VOUT will reach 98% of its

nominal value. This time is dependent on various

application conditions such as VOUT(NOM), COUT, TA.

PCB Layout Recommendations

To obtain good transient performance and good regulation

characteristics place CIN and COUT capacitors close to the

device pins and make the PCB traces wide. In order to

minimize the solution size, use 0402 or 0201 capacitors with

appropriate capacity. Larger copper area connected to the

pins will also improve the device thermal resistance. The

actual power dissipation can be calculated from the equation

above (Equation 2). Expose pad can be tied to the GND pin

for improvement power dissipation and lower device

temperature.

NCP163

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ORDERING INFORMATION (WLCSP4)

Device

Voltage

Option Marking Rotation Description Package Shipping†

NCP163AFCS120T2G 1.2 V 2 0

250 mA, Active Discharge WLCSP4

CASE 567KA

(Pb-Free)

5000 /

Tape &

Reel

NCP163AFCS180T2G 1.8 V Y 180

NCP163AFCS250T2G 2.5 V T 270

NCP163AFCS260T2G 2.6 V 4 180

NCP163AFCS270T2G 2.7 V V 270

NCP163AFCS280T2G 2.8 V 3 180

NCP163AFCS285T2G 2.85 V 5 180

NCP163AFCS290T2G 2.9 V 6 180

NCP163AFCS2925T2G 2.925 V 2 180

NCP163AFCS514T2G 5.14 V 3 270

NCP163BFCS180T2G 1.8 V Y 270

250 mA, Non−Active Discharge

NCP163BFCS2925T2G 2.925 V 2 270

NCP163AFCT120T2G 1.2 V A 0

250 mA, Active Discharge WLCSP4

CASE 567JZ

(Pb-Free)

5000 /

Tape &

Reel

NCP163AFCT180T2G 1.8 V Y 180

NCP163AFCT250T2G 2.5 V Y 90

NCP163AFCT260T2G 2.6 V 6 270

NCP163AFCT270T2G 2.7 V 5 180

NCP163AFCT280T2G 2.8 V 3 180

NCP163AFCT285T2G 2.85 V 5 270

NCP163AFCT290T2G 2.9 V 4 270

NCP163AFCT2925T2G 2.925 V 2 180

NCP163AFCT300T2G 3.0 V 3 270

NCP163AFCT330T2G 3.3 V 6 90

NCP163AFCT514T2G 5.14 V T 0

NCP163BFCT180T2G 1.8 V Y 270

250 mA, Non−Active Discharge

NCP163BFCT2925T2G 2.925 V 2 270

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

NCP163

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ORDERING INFORMATION (XDFN4)

Device

Voltage

Option Marking Description Package Shipping†

NCP163AMX120TBG* 1.2 V ME

250 mA, Active Discharge

XDFN4

CASE 711AJ

(Pb-Free)

3000 /

Tape &

Reel

NCP163AMX130TBG* 1.3 V MG

NCP163AMX150TBG 1.5 V MV

NCP163AMX180TBG 1.8 V MA

NCP163AMX1825TBG 1.825 V MC

NCP163AMX190TBG 1.9 V MH

NCP163AMX250TBG 2.5 V MU

NCP163AMX260TBG 2.6 V MN

NCP163AMX270TBG 2.7 V MX

NCP163AMX275TBG 2.75 V MD

NCP163AMX280TBG 2.8 V MM

NCP163AMX285TBG 2.85 V MQ

NCP163AMX290TBG 2.9 V MR

NCP163AMX300TBG 3.0 V MJ

NCP163AMX330TBG 3.3 V MK

NCP163AMX400TBG 4.0 V MY

NCP163AMX500TBG 5.0 V ML

NCP163AMX514TBG 5.14 V MW

NCP163BMX180TBG 1.8 V PA

250 mA, Non−Active Discharge

NCP163BMX1825TBG 1.825 V PC

NCP163BMX275TBG 2.75 V PD

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*Contact sales office for availability information.

ORDERING INFORMATION (SOT23−5L)

Device

Voltage

Option Marking Description Package Shipping†

NCP163ASN150T1G 1.5 V KAK

250 mA, Active Discharge

SOT23−5L

CASE 527AH

(Pb-Free)

3000 /

Tape &

Reel

NCP163ASN180T1G 1.8 V KAA

NCP163ASN250T1G 2.5 V KAD

NCP163ASN270T1G 2.7 V KAL

NCP163ASN280T1G 2.8 V KAE

NCP163ASN300T1G 3.0 V KAF

NCP163ASN330T1G 3.3 V KAG

NCP163ASN350T1G 3.5 V KAH

NCP163ASN500T1G 5.0 V KAJ

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

NCP163

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PACKAGE DIMENSIONS

WLCSP4, 0.64x0.64

CASE 567JZ

ISSUE A

ÈÈ

SEATING

PLANE

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

DIM

MIN NOM

−−−

MILLIMETERS

b0.195 0.210

e0.35 BSC

−−−

PIN A1

REFERENCE

A0.03 BC

0.05 C

4X b

0.05 C

0.04 0.06

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 3

A2 0.23 REF

PITCH 0.20

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.35

RECOMMENDED

A1 PACKAGE

OUTLINE

PITCH

MAX

0.610 0.640

0.225

0.33

0.08

0.670

WLCSP4, 0.64x0.64

CASE 567KA

ISSUE A

ÈÈ

SEATING

PLANE

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

DIM

MIN NOM

0.35

MILLIMETERS

b0.185 0.200

e0.35 BSC

0.40

PIN A1

REFERENCE

A0.05 BC

0.03 C

0.05 C

4X b

0.05 C

0.14 0.16

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 3

A2 0.25 REF

PITCH 0.20

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.35

RECOMMENDED

A1 PACKAGE

OUTLINE

PITCH

MAX

0.610 0.640

0.215

0.45

0.18

0.670

NCP163

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PACKAGE DIMENSIONS

XDFN4 1.0x1.0, 0.65P

CASE 711AJ

ISSUE A

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.20 mm FROM THE TERMINAL TIPS.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

ÉÉ

BOTTOM VIEW

NOTE 3

2X 0.05 C

PIN ONE

REFERENCE

TOP VIEW

2X 0.05 C

(A3)

0.05 C

CSEATING

PLANE

SIDE VIEW

DIM MIN MAX

MILLIMETERS

A0.33 0.43

A1 0.00 0.05

A3 0.10 REF

b0.15 0.25

D1.00 BSC

D2 0.43 0.53

E1.00 BSC

e0.65 BSC

L0.20 0.30

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

MOUNTING FOOTPRINT*

1.20

0.26

0.24 4X

DIMENSIONS: MILLIMETERS

0.39

RECOMMENDED

PACKAGE

OUTLINE

NOTE 4

e/2

45 5

0.05 BC

0.65

PITCH

DETAIL A

b2 0.02 0.12

L2 0.07 0.17

0.52

0.11

L24X

DETAIL A

b24X

NCP163

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PACKAGE DIMENSIONS

SOT−23, 5 Lead

CASE 527AH

ISSUE O

TOP VIEW

SIDE VIEW END VIEW

E1 E

PIN #1 IDENTIFICATION

L1 L

Notes:

(1) All dimensions in millimeters. Angles in degrees.

(2) Complies with JEDEC standard MO-178.

θ2

θ1

SYMBOL MIN NOM MAX

θ2 5° 15°

0.00

0.90

0.30

0.08

2.90 BSC

1.60 BSC

0.45

1.45

0.15

1.30

0.50

0.22

0.25 REF

1.15

2.80 BSC

L1 0.60 REF

0.30 0.60

0.95 BSC

0.90

10°

θ1 5° 15°10°

θ0° 8°4°

PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

NCP163/D

LITERATURE FULFILLMENT:

Literature Distribution Center for ON Semiconductor

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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your local

Sales Representative

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