NCV7683 Enhanced 100 mA Linear Current Regulator and Controller for Automotive Sequenced LED Lighting The NCV7683 consists of eight linear programmable constant current sources. The part is designed for use in the regulation and control of LED based Rear Combination Lamps and blinking functions for automotive applications. System design with the NCV7683 allows for two programmed levels for stop (100% Duty Cycle) and tail illumination (programmable Duty Cycle), or an optional external PWM control can be implemented. LED brightness levels are easily programmed (stop is programmed to the absolute current value, tail is programmed to the duty cycle) with two external resistors. The use of an optional external ballast FET allows for power distribution on designs requiring high currents. Set back power limit reduces the drive current during overvoltage conditions. This is most useful for low power applications when no external FET is used. Sequencing functionality is activated, controlled, and programmed by individual pins. In addition to programming of the sequence interval, the device can sequence 8 individual output channels, 4 pairs of output channels, 2 quad output channels, or all 8 at once (for multi IC use at high currents). Enhanced features of this device are a global enable function and display sequencing. The device is available in a SSOP-24 package with exposed pad. MARKING DIAGRAM NCV7683G AWLYYWW SSOP24 NB EP CASE 940AP NCV7683 = Specific Device Code A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb-Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device Package Shipping NCV7683DQR2G SSOP24-EP (Pb-Free) 2500 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Features * * * * * * * * * * * * www.onsemi.com Constant Current Outputs for LED String Drive LED Drive Current up to 100 mA per Channel Open LED String Diagnostic with Open-Drain Output in All Modes Slew Rate Control Eliminates EMI Concerns Low Dropout Operation for Pre-Regulator Applications External Modulation Capable On-chip 800 Hz Tail PWM Dimming Single Resistor for Stop Current Set Point Single Resistor for Tail Dimming Set Point Overvoltage Set Back Power Limitation Improved EMC Performance Applications Programmable Latch-Off function on Open String * Rear Combination Lamps (RCL) Restart Option of Unaffected Strings * Daytime Running Lights (DRL) Over Temperature Fault Reporting * Fog Lights Global Enable * Center High Mounted Stop Lamps (CHMSL) Arrays Display Sequencing * Turn Signal and Other Externally Modulated Applications SSOP-24 Fused Lead Package with Exposed Pad * Signature Lamp AEC-Q100 Qualified and PPAP Capable * * * * * * These are Pb-Free Devices (c) Semiconductor Components Industries, LLC, 2016 February, 2018 - Rev. 3 1 Publication Order Number: NCV7683/D NCV7683 Timer Circuit Timer Programming Current VP Output Drive Control ENABLE 200k Vref SEQTIME SEQ1 8 7 65 4 3 2 1 SEQ2 SEQON 200k DIAG Interface SEQOUT VP EMC Filter SEQOUT Open Load Detection LO Channel Control CC UVLO Overvoltage 1 of 8 Vreg Ballast Drive FB Soft Start, Bias and Reference + - FET Drive 200K Out1 Output Current Drive Channel Control Over temperature & Over voltage sense DIAG Inverface Control Logic STOP 200K Output Latch-Off Out5 Out6 50% IOUT Open Load Detect DIAG CC Vreg Oscillator and PWM V-I Converter Pin Current Limit Irstop 2.2V 0.4V + - IRSTOP x 150 Rtail + - 1.8V Open Circuit Restart RTAIL RSTOP Figure 1. Block Diagram ENABLE LO Figure 2. Pinout Diagram www.onsemi.com 2 Out3 Out4 Setback Current -20% 1V Out2 Out7 Out8 GND_Signal GND_DRV NCV7683 VSTRING MRA4003T3G TAIL NTD2955 STOP MRA4003T3G C1 0.68uF R1 10K C2 0.22uF C3 100nF R3 1K R4, 3.01K C4 10nF OUT1 OUT2 OUT3 OUT4 OUT5 OUT6 OUT7 OUT8 VP Ballast Drive FB STOP DIAG RSTOP RTAIL R5, 1.62K R6 9.53K GND_Signal GND_DRV ENABLE SEQOUT SEQ1 SEQ2 SEQON SEQTIME LO R2 R7 1K NCV7683 Figure 3. Application Diagram with External FET Ballast Transistor R6 and R7 values shown yield 10.5 V regulation on VSTRING. C1 is for line noise and stability considerations. C3 is for EMC considerations. Unused OUTx channels should be shorted to ground as OUT7 shows in this example. VSTRING MRA4003T3G TAIL STOP MRA4003T3G C3 100nF R1 10K C4 10nF OUT1 VP OUT2 Ballast OUT3 Drive FB OUT4 STOP OUT5 DIAG OUT6 R4, 3.01K RSTOP OUT7 RTAIL OUT8 R5, 1.62K GND_Signal GND_DRV C1 0.68uF ENABLE SEQOUT SEQ1 SEQ2 SEQON SEQTIME LO NCV7683 R2 Figure 4. Application Diagram without the FET Ballast Transistor When using the NCV7683 without the FET ballast transistor, tie the FB pin and Ballast Drive pin to GND. www.onsemi.com 3 NCV7683 Table 1. APPLICATION I/O TRUTH TABLE EN SEQON STOP INPUT TAIL MODE OUTx LATCH OFF (w/ LO = GND) OUTX CURRENT FAULT STATE* DIAG STATE** 1 X X X no OFF - 1 0 0 0 0 no OFF - 1 0 0 1 X no ISTOP NORMAL 0 0 0 1 X no ISTOP OPEN CIRCUIT*** 1 0 0 1 X yes OFF OPEN CIRCUIT*** 1 0 0 0 1 no PWM NORMAL 0 0 0 0 1 no PWM OPEN CIRCUIT*** PWM 0 1 X X no ISTOP NORMAL 0 0 1 X X no ISTOP OPEN CIRCUIT*** 1 0 1 X X yes OFF OPEN CIRCUIT*** 1 Reference Figures below. X = don't care 0 = LOW 1 = HIGH * Open Circuit, RSTOP Current Limit, Set Back Current Limit down 20%, and thermal shutdown **Pull-up resistor to DIAG and SEQOUT required. *** OPEN CIRCUIT = Any string or SEQOUT open. DIAG DIAG Open String Occurs Open String Removed Open String Occurs on on OUTx Current OUTx Current off off on OUTx Current Open String Removed on Outputs with no open string. OUTx Current off off Outputs with no open string. Figure 6. DIAG timing diagram WITHOUT Open String Latch Active No outputs are turned off. DIAG will report the state. Figure 5. DIAG timing diagram WITH Open String Latch Active All outputs latch off. www.onsemi.com 4 NCV7683 Sequence Programming Timing Diagrams The four timing diagrams show the options available for sequencing of the 8 outputs dependent on the state of SEQ1 and SEQ2. 1. 8 individual sequence intervals. 2. 4 pairs of sequence intervals. 3. 2 quads of sequence intervals. 4. 1 single sequence interval. Sequencing_on Sequencing_on ENABLE ENABLE OUT1 OUT1 (current) (current) OUT2 OUT2 (current) OUT3 (current) (current) Sequence Interval OUT3 (current) OUT4 OUT4 (current) (current) OUT5 OUT5 (current) Sequence Interval (current) OUT6 OUT6 (current) (current) OUT7 OUT7 (current) (current) OUT8 OUT8 (current) (current) SEQOUT SEQOUT Sequence Time Sequence Time Figure 7. Sequencing Timing Diagram (SEQ1 = 0, SEQ2 = 0) Figure 8. Sequencing Timing Diagram (SEQ1 = 1, SEQ2 = 0) Sequencing_on Sequencing_on ENABLE ENABLE OUT1 OUT1 (current) (current) OUT2 OUT2 (current) (current) OUT3 OUT3 (current) (current) OUT4 OUT4 (current) (current) OUT5 OUT5 (current) (current) OUT6 Sequence Interval OUT6 (current) (current) OUT7 OUT7 (current) (current) OUT8 OUT8 (current) (current) SEQOUT SEQOUT Sequence Time Sequence Time Figure 9. Sequencing Timing Diagram (SEQ1 = 0, SEQ2 = 1) Figure 10. Sequencing Timing Diagram (SEQ1 = 1, SEQ2 = 1) The sequencing function is triggered by a logic level high to low signal on the ENABLE pin. 0=ground 1=floating www.onsemi.com 5 NCV7683 Table 2. PIN FUNCTION DESCRIPTION SSOP-24 Exposed Pad Package Pin # Label Description 1 DIAG Open-drain diagnostic output. Requires a pull-up resistor. Reporting Open Circuit, RSTOP Current Limit, Set Back Current Limit down 20%, and thermal shutdown. Normal Operation = LOW. Open Load reset input. Ground if not used (only if latchoff is not used). 2 SEQ1 Grounding this pin changes the output sequencing. Reference the sequencing section of the datasheet. 3 SEQ2 Grounding this pin changes the output sequencing. Reference the sequencing section of the datasheet. 4 LO 5 RSTOP 6 RTAIL 7 SEQTIME 8 OUT8 Channel 8 constant current output to LED. Unused pin should be grounded (pin 13). 9 OUT7 Channel 7 constant current output to LED. Unused pin should be grounded (pin 13). 10 OUT6 Channel 6 constant current output to LED. Unused pin should be grounded (pin 13). 11 OUT5 Channel 5 constant current output to LED. Unused pin should be grounded (pin 13). 12 GND_Signal 13 GND_DRV 14 OUT4 Channel 4 constant current output to LED. Unused pin should be grounded (pin 13). 15 OUT3 Channel 3 constant current output to LED. Unused pin should be grounded (pin 13). 16 OUT2 Channel 2 constant current output to LED. Unused pin should be grounded (pin 13). 17 OUT1 Channel 1 constant current output to LED. Unused pin should be grounded (pin 13). 18 SEQOUT Latch Off. Ground this pin for latch off function. Stop current bias program resistor. Referenced to ground (pin 12). Tail current duty cycle PWM program resistor. Referenced to ground (pin 12). Ground pin if using external modulation. Sequence Time program resistor. Referenced to ground (pin 12). Low Current Logic Ground. High Current Driver Ground. Pin is fused to the epad. Open-drain output. Requires a pull-up resistor. Follows ENABLE pin after delay of OUT8 with SEQON high. 19 SEQON High turns on 1-8 output sequencing. 20 ENABLE Global enable input. Low turns device on. 21 VP 22 Ballast Drive 23 FB 24 STOP Stop Logic Input. External Modulation Input when VP is high. epad epad Ground. Do not connect to pcb traces other than GND. Supply voltage input. Gate drive for external power distribution PFET. Ground if not used. Feedback Sense node for VP regulation. Use feedback resistor divider or connect to GND. www.onsemi.com 6 NCV7683 Table 3. MAXIMUM RATINGS (Voltages are with respect to device substrate.) Value Rating Unit Supply Input (VP, Ballast Drive, STOP, DIAG, ENABLE, SEQON, SEQOUT) DC Peak Transient -0.3 to 40 40 Output Pin Voltage (OUTX) -0.3 to 40 V Output Pin Current (OUTX) 200 mA DIAG Pin Current 10 mA Input Voltage (RTAIL, RSTOP, FB, SEQTIME, SEQ1, SEQ2, LO) -0.3 to 3.6 V Junction Temperature, TJ -40 to 150 C 260 peak C Peak Reflow Soldering Temperature: Lead-free 60 to 150 seconds at 217C (Note 1) V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Table 4. ATTRIBUTES Characteristic Value ESD Capability Human Body Model Machine Model 4.0 kV 200 V Moisture Sensitivity (Note 1) MSL3 Storage Temperature -55 to 150C Package Thermal Resistance (Note 2) SSOP24 Junction-to-Board, RqJB Junction-to-Ambient, RqJA Junction-to-Lead, RqJL 18C/W 78C/W 54C/W 1. For additional information, see or download ON Semiconductor's Soldering and Mounting Techniques Reference Manual, SOLDERRM/D, and Application Note AND8003/D. 2. Values represent typical still air steady-state thermal performance on 1 oz. copper FR4 PCB with 645 mm2 copper area. www.onsemi.com 7 NCV7683 Table 5. ELECTRICAL CHARACTERISTICS (4.5 V < VP < 16 V, STOP = VP, RSTOP = 3.01 kW, RTAIL = 1.62 kW, RSEQTIME = 4.99 kW, -40C TJ 150C, unless otherwise specified.) Characteristic Conditions Min Typ Max Unit VP = 16 V VP = 16 V VP = 16 V, STOP = 0 V, OUTx = 0 mA, Disconnected output - - - 6 5 - 12 12 2.0 Driver Ground Pin Current (pin12) IOUT1 to IOUT8 = 50 mA - 400 500 mA Output Under Voltage Lockout VP Rising 3.8 4.1 4.4 V Output Under Voltage Lockout Hysteresis - 200 - mV Open Load Disable Threshold 7.2 7.7 8.2 V Open Load Disable Hysteresis - 200 - mV GENERAL PARAMETERS Quiescent Current (IOUTx = 50 mA) STOP mode Tail mode Fault mode mA THERMAL LIMIT Thermal Shutdown (Note 3) 150 175 - C Thermal Hysteresis (Note 3) - 15 - C Output Current OUTX = 0.5 V OUTX = 1 V, RSTOP = 1.5 K 45 90 50 100 55 110 mA Maximum Regulated Output Current 0.5V to 16V 100 - - mA -4 0 4 % CURRENT SOURCE OUTPUTS Current Matching 2IOUTx(min) IOUTx(min) * 1 ) IOUTx(max) 2IOUTx(max) IOUTx(min) * 1 ) IOUTx(max) 100 100 Line Regulation 9 V VP 16 V - 1.2 6.0 mA Open Circuit Detection Threshold 25 mA 50 mA 25 35 50 50 75 65 % of Output Current Current Slew Rate Iout = 44 mA, 10% to 90% points - 6 15 mA/ms Overvoltage Set Back Threshold @ 99% Iout 16.0 17.2 18.4 V Overvoltage Set Back Current VP = 20 V (Note 4) - 78 - %Iout - 80 - %Iout EN = high - - 1 mA FB = 1.5 V, Ballast Drive = 3 V FB = 0.5 V, Ballast Drive = 3 V - 4 1.0 13 2.4 20 0.92 1.00 1.08 V Input High Threshold 0.75 1.25 1.75 V Input Low Threshold 0.70 1.00 1.44 V VIN Hysteresis 100 250 400 mV 120 200 300 kW Diag Reporting of Set Back Current Output Off Leakage FET DRIVER Ballast Drive DC Bias Sink Current mA Ballast Drive Reference Voltage STOP / ENABLE / SEQON LOGIC Input Impedance Vin = 14 V 3. Designed to meet these characteristics over the stated voltage and temperature recommended operating ranges, though may not be 100% parametrically tested in production. 4. The output current degrades at a rate of 8%/V. www.onsemi.com 8 NCV7683 Table 5. ELECTRICAL CHARACTERISTICS (4.5 V < VP < 16 V, STOP = VP, RSTOP = 3.01 kW, RTAIL = 1.62 kW, RSEQTIME = 4.99 kW, -40C TJ 150C, unless otherwise specified.) Characteristic Conditions Min Typ Max Unit Input High Threshold 0.75 1.25 1.75 V Input Low Threshold 0.70 1.00 1.44 V VIN Hysteresis 100 250 400 mV 5 10 20 mA 0.94 1.00 1.06 V - 150 - - SEQ1/SEQ2/LO LOGIC Input Pull-up Current SEQx = 0 V CURRENT PROGRAMMING RSTOP Bias Voltage Stop current programming voltage RSTOP K multiplier IOUTX/IRSTOP RSTOP Over Current Detection RSTOP = 0 V 0.70 1.00 1.45 mA RTAIL Bias Current Tail duty cycle programming current 290 330 370 mA Duty Cycle RTAIL = 0.49 V RTAIL = 0.76 V RTAIL = 1.66 V 3.5 17 59.5 5 20 70 6.5 23 80.5 % 0.94 1.00 1.06 V SEQTIME Voltage DIAG / SEQOUT OUTPUT Output Low Voltage Output Active, IDIAG,SEGOUT = 1 mA - 0.1 0.40 V DIAG Output Leakage VDIAG = 5 V - - 10 mA Open Load Reset Voltage on DIAG 1.6 1.8 2.0 V SEQOUT Open Load Detection Threshold Voltage 0.70 0.8 0.90 V 10 20 35 mA SEQOUT Open Load Detection Sink Current AC CHARACTERISTICS Stop Turn-on Delay Time V(STOP) > 1.75 V to I(OUTx) = 90% - 14 45 msec Stop Turn-off Delay Time V(STOP) < 0.75 V to I(OUTx) = 10% - 14 45 msec PWM Frequency STOP = 0 V 400 800 1200 Hz Open Circuit to DIAG Reporting 4.8 mA pull-up to VP, V(DIAG) >1.5 V 1 2 4 ms Sequence Time / RSEQTIME SEQTIME = 1K to 10K 45.5 49 52.5 msec kohm Sequence Re-Enable Time / RSEQTIME SEQTIME = 1K to 10K 45.5 49 52.5 msec kohm 0.55 0.80 1.2 msec VP Turn-on Time 3. Designed to meet these characteristics over the stated voltage and temperature recommended operating ranges, though may not be 100% parametrically tested in production. 4. The output current degrades at a rate of 8%/V. www.onsemi.com 9 NCV7683 TYPICAL CHARACTERISTICS 53 Iout, OUTPUT CURRENT (mA) 90 80 70 60 50 40 30 20 10 0 1 2 3 4 5 6 7 8 9 10 51 50 49 48 60 80 100 120 140 160 RSTOP (kW) TEMPERATURE (C) Figure 11. Iout vs. RSTOP Figure 12. Iout vs. Temperature 100 100 90 90 80 80 DUTY CYCLE (%) DUTY CYCLE (%) 0 52 RSTOP = 3.01 kW 47 -40 -20 0 20 40 T = 25C 70 60 50 40 30 20 70 60 50 40 30 20 10 0 10 0 RSTOP = 3.01 kW 0 1 2 3 4 5 6 7 0 0.5 1.0 1.5 2.0 RTAIL (kW) V(RTAIL) Figure 13. Duty Cycle vs. RTAIL Figure 14. Duty Cycle vs. V(RTAIL) 80 RTAIL = 5 kW 70 DUTY CYCLE (%) Iout OUTPUT CURRENT (mA) 100 60 50 40 30 RTAIL = 2.3 kW 20 10 RTAIL = 1.5 kW 0 -40 -20 0 20 40 60 80 100 120 140 160 TEMPERATURE (C) Figure 15. Duty Cycle vs. Temperature www.onsemi.com 10 2.5 NCV7683 TYPICAL CHARACTERISTICS 51.0 IOUT, OUTPUT CURRENT (mA) IOUT, OUTPUT CURRENT (mA) 60 50 40 30 20 10 RSTOP = 3.01 k 0 9 11 13 15 19 17 21 23 25 50.6 50.4 50.2 50.0 49.8 49.6 49.4 49.2 49.0 27 6 7 8 9 10 11 12 13 14 VP (V) VOUT (V) Figure 16. IOUT vs. VP Figure 17. IOUT Line Regulation 16 15 60 IOUT, OUTPUT CURRENT (mA) 60 IOUT, OUTPUT CURRENT (mA) 50.8 50 40 30 20 10 0 50 40 30 20 10 0 0 2 4 6 8 10 12 14 16 0 0.1 0.2 0.3 VOUT (V) VOUT (V) Figure 18. IOUT vs. VOUT Figure 19. IOUT vs. VOUT 14 0.5 0.4 500 450 12 400 350 TIME (msec) VSTRING (V) 10 8 6 300 250 200 150 4 100 per eq. 1 R7 = 1 kW 2 50 0 0 0 2K 4K 6K 8K 10K 12K 14K 0 1 2 3 4 5 6 7 8 9 R6 (W) RSEQTIME (kW) Figure 20. VSTRING vs. R6 Figure 21. (Sequence Time / Re-Enable Time) vs. RSEQTIME www.onsemi.com 11 10 NCV7683 TYPICAL CHARACTERISTICS 160 140 qJA (C/W) 120 1 oz 100 2 oz 80 60 40 20 0 0 100 200 300 400 500 COPPER HEAT SPREADER AREA 600 700 (mm2) Figure 22. qJA Copper Spreader Area 100 50% R(t) (C/W) 20% 10 10% 5% 2% 1% 1 Single Pulse 0.1 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 PULSE TIME (sec) Figure 23. Thermal Duty Cycle Curves on 645 mm2 Spreader Test Board 1000 100 mm2 50 mm2 R(t) (C/W) 100 500 mm2 10 1 0.1 0.000001 0.00001 0.0001 0.001 0.01 0.1 PULSE TIME (sec) Figure 24. Single Pulse Heating Curve www.onsemi.com 12 1 10 100 1000 NCV7683 DETAILED OPERATING DESCRIPTION General Each output has its own sensing circuitry. An open string detection on any output latches off all 8 outputs when programmed (LO = low). There are three means to reinitiate the IC drivers. 1. Forcing the DIAG pin below the Open Circuit Reset Voltage (1.8 V typical). 2. Toggling the ENABLE input 3. A complete power down of the device below the Under Voltage Lockout threshold including hysteresis (3.9 V typical). The NCV7683 device is an eight channel LED driver whose output currents up to 100 mA/channel are programmed by an external resistor. The target application for the device is in automotive Rear Combination Lighting (RCL) systems and blinking functions. The STOP logic input switches the two modes of the IC. While in the STOP mode (high), the duty cycle of the outputs is at 100%. When STOP is low, the duty cycle of the outputs is programmed via an external resistor on the RTAIL pin. A mixture of sequencing options is available using the Sequencing ON, SEQ1, and SEQ2 pins. Sequencing options include individual channels 1-8, 4 paired combinations, 2 quad combinations, and an all on delay. A logic output (DIAG) communicates open circuit of the LED driver outputs and SEQOUT back to the microprocessor. Both DIAG and SEQOUT require a pull-up resistor for proper operation. An optional external control for a ballast transistor helps distribute the system power. The part features an enable input logic pin. Open Load Detection Open load detection has an under voltage lockout feature to remove the possibility of turning off the device while it is powering up. The Open Load Disable Threshold is 7.7 V (typ). Open load detection becomes active above this threshold. Current is monitored internal to the NCV7683 device and an open load is flagged when the current is 1/2 of the targeted output current. For multiple IC implementation of Open Load Detection and preservation of the Latch Off feature, multiple ballast transistors in series must be used as shown in Figure 25. Interruption of any of the series devices will provide an all off occurrence. The string voltage is set up by the feedback in just the first device. Any subsequent devices should connect their FB pin to ground. This will remove competition of voltage regulation points of Vstring. LO (Latch Off) and DIAG Automotive requirements sometime dictate all outputs turn off if one of the outputs is an open circuit. This eliminates driving with partial illuminated lights. The module will either display all LED strings or no LED strings at all. The option to turn all LED strings off with an open circuit detect on any of the 8 outputs is programmed by grounding the LO pin. This pin should be left open if this feature is not required. www.onsemi.com 13 NCV7683 TAIL D1 MRA4003T3G Q1 STOP D2 MRA4003T3G C1 0.68uF Q2 NVD2955 NVD2955 R1 C2 1K 0.22uF R2 C4 1K 0.22uF C3 0.68uF VSTRING C5 100nF D3 D6 D9 D12 D4 D7 D10 D13 D5 D8 D11 D14 1 -8 C6 100nF OUT1-OUT8 OUT1-OUT8 OUT1 VP Ballast Drive OUT8 OUT8 --------- --------- OUT1 VP Ballast Drive R3 9.53K FB FB R4 1K NCV7683 U1 GND GND NCV7683 U2 Figure 25. DIAG pins specific to each customer application. The Ballast Drive pin provides the drive in the feedback loop from the FB pin. In steady state, the voltage is regulated at the feedback voltage (FB). A simple voltage divider helps set the voltage at Vstring. Unlike other systems, the ballast drive current does not turn off in a leakage state when turned off (FB high), but instead provides 1 mA of current providing a faster response of the system loop. This sets the gate voltage of the NTD2955 to 1 V at 25C. The logic DIAG pins main function is to alert the controlling microprocessor an open string has occurred on one of the outputs (DIAG high = open string). Reference Table 1 for details on logic performance. Open circuit conditions are reported when the outputs are actively driven. When operating in STOP mode the DIAG signal is a DC signal. When operating in TAIL the DIAG signal is a PWM signal reporting open circuit when the output drive is active. Parallel Outputs Ballast Drive The maximum rating per output is 100 mA. In order to increase system level LED string current, parallel combinations of any number of outputs is allowed. Combining all 8 outputs will allow for a maximum system level string current design of 800 mA. The use of an external FET device (NTD2955) helps distribute the system power. A DC voltage regulation system is used which regulates the voltage at the top (anode) of the LED strings (Vstring). This has the effect of limiting the power in the NCV7683 by setting the voltage on the IOUTx www.onsemi.com 14 NCV7683 Unused Outputs subsequent output (OUT8) has been pulled in (in time) as shown by the 1st arrow. The 2nd arrow shows the SEQOUT signal has also been pulled in (in time). For instances which are coupled with others (in time) (e.g. SEQ1=1 and SEQ2=0 with OUT7 GND), there is no change in the ensuing waveforms. Figure 27 shows there is no impact for channel 8 when OUT7 is not used. Unused outputs should be shorted to ground. The NCV7683 detects the condition during power-up using the open load disable threshold and disables the open circuit detection circuitry. The timing diagrams below highlight the impacts in time with the sequencing function when an output is not used. In this example (Figures 26 and 27), OUT7 is not used and is grounded with SEQ1=0 and SEQ2=0. The Sequencing_on Sequencing_on ENABLE ENABLE OUT1 OUT1 (current) (current) OUT2 OUT2 (current) OUT3 (current) (current) Sequence Interval OUT3 (current) OUT4 OUT4 (current) (current) OUT5 OUT5 (current) (current) OUT6 OUT6 (current) (current) OUT7 OUT7 (current) (current) OUT8 OUT8 * (current) SEQOUT Sequence Interval (current) * SEQOUT Sequence Time Sequence Time *Sequence interval unaffected. Figure 26. Unused Output time shift. (SEQ1=0, SEQ2=0) Figure 27. Unused Output No Time Shift. (SEQ1=1, SEQ2=0) Sequencing (STOP=0) (Figure 29) will revert to TAIL mode. A device which was previously in STOP mode (STOP=1) Figure 30 will revert to STOP mode. Before a sequence event, SEQOUT is high impedance. After a sequence event, SEQOUT is high impedance. Output sequencing is controlled by the SEQON, SEQTIME, SEQ1, and SEQ2 pins. The SEQON pin must be high to enable any of the sequencing functions. With the SEQON pin in a low state, all 8 outputs turn on at the same time and SEQOUT remains high all the time (via the external pull-up resistor). The SEQ1 and SEQ2 programming pins are utilized by grounding them or leaving them floating. They follow Table 6 (reference timing diagrams in Figure 7, Figure 8, Figure 9, and Figure 10). The sequence interval is defined by the delay of the ENABLE pin going low to OUT2 turning on (OUT1 turns on coincident with ENABLE). The same sequence time interval is present for each additional sequential turn-on output of the IC. Forcing an ENABLE high or SEQON low will cause a device which is operating in the sequence mode to leave the sequence mode. ENABLE going from low to high (Figure 28) will turn off all outputs. With SEQON going high to low (Figure 29 and Figure 30), operation will continue as a device which is not using the sequence mode feature. A device which was previously in TAIL mode Sequence and Re-Enable Time Programming Sequence time is programmed using a resistor from the SEQTIME pin to ground. Figure 21 displays the expected time using the program resistor. Acceptable values for the resistor are between 1 K and 10 K. These provide 49 msec and 490 msec times respectively. The Sequence Re-Enable Time uses the same internal timer as the Sequence Time. The Sequence Re-Enable Time is provided to prevent an immediate feedback triggering in a daisy chain setup. Reference Figures 33 and Figure 36 for details. The program resistor used can be calculated by using the electrical parameters 1. Sequence Time / RSEQTIME 2. Sequence Re-Enable Time / RSEQTIME www.onsemi.com 15 NCV7683 Sequence Time + Example: Electrical Parameter (typ) Sequence Time / RSEQTIME = 49 msec/kW RSEQTIME = 1 kW Sequence Time = 49 * 1 = 49 msec Sequence_Time @ R SEQTIME R SEQTIME Sequence ReEnable_Time + Sequence ReEnable_Time @ R SEQTIME R SEQTIME Table 6. SEQUENCING COMBINATIONS SEQ1 SEQ2 Sequencing Functionality 1 1 All On 1 0 Dual Output Combination 0 1 Quad Combination 0 0 Full 8 Channel Sequencing SEQON ENABLE OUTx (V) 0 = ground 1 = floating* SEQON = 1 *Internal pull-up to the internal power supply. SEQOUT Figure 28. Sequence Interrupt from EN STOP STOP SEQON SEQON ENABLE ENABLE OUTx (V) OUTx (V) SEQOUT SEQOUT Figure 29. Sequence Interrupt from SEQON (STOP=0) Figure 30. Sequence Interrupt from SEQON (STOP=1) Daisy Chain of the sequence can be achieved through the use of an optional capacitor. If the optional capacitor does not provide sufficient time at the end of the sequence, an NCV303 Voltage Detector can be added as shown in Figure 34. Figure 36 shows the timing diagram associated with the setup shown in Figure 33. As each NCV7683 device receives a turn on signal through its ENABLE pin, the output turns on an LED. There is an internal delayed response for the SEQOUT pin to go low which delays the turn-on of the next sequential LED. An alternative setup using NFET transistors instead of PFET transistors is shown in Figure 35. An open circuit detection circuit is implemented (refer to Figure 31) on the SEQOUT pin to enable the detection of the condition (open circuit), report the condition back to the NCV7683 devices can be daisy-chained as shown in Figure 32. Connections allow for a continuous stream of devices including all delays attributed to the previous sequence timing events from the previous integrated circuits. This setup ripples the signal through all devices until all devices are on. The example shows 3 devices, but as many devices as desired may be used. For retriggerable functionality such that once a signal reaches the end of the daisy chain string, all devices turn off, and the sequence starts again refer to Figure 33 or Figure 35. The NCV7683 device utilizes a Sequence Re-Enable time whereby a device turned off via the ENABLE pin will not turn back on until the Sequence Re-Enable time has passed. This allows all devices to turn off for a discernible time before reinitiating the sequence. Additional time at the end www.onsemi.com 16 NCV7683 controller via the DIAG pin, and turn off all driver ICs in the daisy chain eliminating any spurious lighting events. - + Open Load detection SEQOUT is not active during STOP/TAIL modes (SEQOUT=0). Vol VS R1 10K Sequence Output Input Control Sequence Output ENABLE Iol Output Turn-on Control NCV7683 GND NCV7683 IC1 Electronic module 1 IC2 Electronic module 2 Figure 31. Daisy Chain Interface between Multiple ICs Table 7. APPLICATION SPECIFIC TRUTH TABLE Input Fault State SEQON STOP LO Condition DIAG SEQOUT Current Sources Status X X X X 1 Hi Z ALL OFF 0 1 X X NORMAL 0 ACTIVE SEQUENCING 0 1 X X BIAS ERROR 1 ACTIVE SEQUENCING 0 1 X OPEN OPEN CIRCUIT 1 ACTIVE SEQUENCING 0 1 X X TSD 1 Hi Z ALL OFF 0 1 X SHORT TO GROUND OPEN CIRCUIT 1 Hi Z ALL OFF 0 1 X X SEQOUT OPEN 1 Hi Z SEQUENCING 0 0 1 X NORMAL 0 0 ALL ON 0 0 1 X BIAS ERROR 1 0 ALL ON 0 0 1 OPEN OPEN CIRCUIT 1 0 ALL ON 0 0 1 X TSD 1 0 ALL OFF 0 0 1 SHORT TO GROUND OPEN CIRCUIT 1 0 ALL OFF 0 0 0 X NORMAL 0 0 ALL PWM 0 0 0 X BIAS ERROR 1 0 ALL PWM 0 0 0 OPEN OPEN CIRCUIT PWM 0 ALL PWM 0 0 0 X TSD 1 0 ALL OFF 0 0 0 SHORT TO GROUND OPEN CIRCUIT 1 0 ALL OFF ENB OFF 1 TURN STOP TAIL BIAS ERROR = 20% current foldback (via overvoltage on VP and/or over temperature) or RSTOP current limit. www.onsemi.com 17 NCV7683 VBAT OUT OUT 10K OUT 10K 10K ENABLE SEQOUT ENABLE SEQOUT ENABLE SEQOUT NCV7683 NCV7683 NCV7683 IC1 IC2 IC3 Figure 32. Daisy Chain Sequencing 5V VBAT R8 10k OUT OUT R2 10k R1 10k OUT R9 3.9k R3 10k R7, 10k ENABLE SEQOUT ENABLE SEQOUT ENABLE SEQOUT SEQON SEQON SEQON (Turn Control) R4 10k NCV7683 IC1 NCV7683 R5 10k IC2 R6 10k (optional) NCV7683 IC3 5V Figure 33. Retriggerable Daisy Chain Sequencing using the Sequence Re-Enable Time www.onsemi.com 18 NCV7683 5V VBAT R8 10k OUT OUT R2 10k R7 10k R9 10k OUT R3 10k Reset R7, 10k (Turn Control) R4 10k ENABLE SEQOUT ENABLE SEQOUT ENABLE SEQOUT SEQON SEQON SEQON NCV7683 IC1 5V NCV7683 R5 10k IC2 Input CD NCV303 NCV7683 R6 10k IC3 Figure 34. Extending the End of Sequence Time STOP VBAT TAIL TURN OUT R2 10k R7 10k R4 10k OUT OUT R9 10k R3 10k ENABLESEQOUT ENABLESEQOUT ENABLESEQOUT SEQON SEQON SEQON NCV7683 R5 10k IC1 NCV7683 IC2 R6 10k NCV7683 IC3 Figure 35. Alternate Retriggerable Daisy Chain Sequencing using Sequence Re-Enable Time www.onsemi.com 19 NCV7683 TURN ENABLE1 Re-Enable Time IC1 I out1-4 I out5-8 Sequence Interval Sequence Interval SEQOUT1 IC2 ENABLE2 I out1-4 I out5-8 SEQOUT2 ENABLE3 IC3 I out1-4 I out5-8 SEQOUT 3 Figure 36. Sequencing Timing Diagram with Re-Enable Time Delay www.onsemi.com 20 NCV7683 Programmability Duty Cycle will vary according to the changes in RTAIL Voltage and RTAIL Bias Current (generated from the current through RSTOP). Voltage errors encompass generator errors (0.4 V to 2.2 V) and comparator errors and are included in testing as the Duty Cycle. Typical duty cycle measurements are 5% with RTAIL = 0.49 V and 70% with RTAIL = 1.66 V. RTAIL Bias Current errors are measured as RTAIL Bias Current and vary as 290 mA (min), 330 mA (typ), and 370 mA (max) with RSTOP = 3.01 kW. The error duality originating from both the internal current source generated on the RSTOP pin and the comparator voltage thresholds of the RTAIL pin combined with the choice of duty cycle levels make it difficult to specify duty cycle minimum and maximum limits, but worst case conditions can be calculated when considering the variation in the voltage threshold and current source. Duty Cycle variation must include the direct duty cycle as specified in the electrical parameter table plus an additional error due to the Irstop current which generates this voltage in the system. Strings of LEDs are a common configuration for RCL applications. The NCV7683 provides eight matched outputs allowing individual string drive with current set by a single resistor. Output currents are mirrored and matched within 4% at hot temperature. A high STOP condition sets the output current using equation 1 below. A low STOP condition, modulates the output currents at a duty cycle (DC) programmed using equation 2 below. Note, current limiting on RSTOP limits the current which can be referenced from the RSTOP Pin. Exceeding the RSTOP Current Limit will set the output current to less than 100 mA, and the DIAG Pin will go high. This helps limit output current (brightness and power) for this type of fault. The average ISTOP Duty Cycle current provides the dimmed tail illumination function and assures a fixed brightness level for tail. The PWM generator's fixed frequency (800 Hz typ.) oscillator allows flicker-free illumination. PWM control is the preferred method for dimming LEDs. The diagnostic function allows the detection of an open in any one of the output circuits. The active-low diagnostic output (DIAG) is coincident with the STOP input and the ON state in the tail mode. DIAG remains high (pulled up) if an open load is detected in any LED string when STOP is high. RSTOP Over Current Protection Over Current protection has been included for the RSTOP pin. Without protection, the device performance could cause excessive high current and potential damage to the external LEDs. Detection of the RSTOP over current event (RSTOP to ground) is 1 mA (typ) and is current limited to 2.2 mA (typ). Output drive currents will limit to typically 65 mA. Note - A feature of the NCV7683 device includes operation of the device during a short circuit on the RSTOP pin. Iout is decreased during the STOP condition and the TAIL duty cycle is reduced to less than 40% by reducing the voltage on the RTAIL pin to 2/3 of normal operation. Output Current Programming Reference Figure 11 (typ performance graph) to choose programming resistor (RSTOP) value for stop current. Reference Figure 13 Typical Performance Graph (Duty Cycle vs. RTAIL) to choose a typical value programming resistor for output duty cycle (with a typical RSTOP value of 3.01 kW). Note the duty cycle is dependent on both RSTOP and RTAIL values. RSTOP should always be chosen first as the stop current is only dependent on this value. Alternatively, the equations below can be used to calculate a typical value and used for worst case analysis. Set the Stop Current using RSTOP I OUTX + 150 @ RSTOP_Bias_Voltage RSTOP Set Back Current Automotive battery systems have wide variations in line supply voltage. Low dropout is a key attribute for providing consistent LED light output at low line voltage. Unlike adjustable regulator based constant current source schemes where the set point resistor resides in the load path, the NCV7683's set point resistor lies outside the LED load path, and aids in the low dropout capability. Setback Current Limit is employed during high voltage. During a Setback Current Limit event, the drive current is reduced resulting in lower power dissipation on the IC. This occurs during high battery voltage (VP > 16 V). In this way the NCV7683 can operate in extreme conditions and still provide a controlled level of light output The Setback Current (-20%) condition is reported on the DIAG Pin. Activation of the set back current feature provides a roll-off rate of -8%/V. (eq. 1) RSTOP Bias Voltage = 1 V (typ) Set the Duty Cycle (DC) using RTAIL RTAIL + 1.8 @ RSTOP(DC ) 0.22) (eq. 2) DC = duty cycle expressed in fractional form. (e.g. 0.50 is equivalent to 50% duty cycle) (ground RTAIL when using external modulation) Output Current is directly tested per the electrical parameter table to be 10% (with RSTOP = 3.01 KW) or 45 mA (min), 50 mA (typ), 55 mA (max) at room and hot temperature. www.onsemi.com 21 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SSOP24 NB EP CASE 940AP ISSUE O SCALE 1:1 DATE 05 MAR 2015 2X 0.20 C A-B NOTE 4 NOTE 6 D D A 2X 0.20 C NOTE 5 EEE EEE e L2 GAUGE PLANE E1 PIN 1 REFERENCE L1 H 13 24 E L DETAIL A A1 C NOTE 7 1 12 B 24X NOTE 6 TOP VIEW SEATING PLANE 0.20 C b 0.12 A 2X 12 TIPS M C A-B D DETAIL A A2 h h 0.10 C M 0.10 C 24X SIDE VIEW 0.15 C A-B D M A1 C SEATING PLANE c END VIEW NOTE 8 D2 0.15 E2 NOTE 8 RECOMMENDED SOLDERING FOOTPRINT 24X 1.15 2.19 6.40 1 0.65 PITCH DIMENSIONS: MILLIMETERS DOCUMENT NUMBER: DESCRIPTION: MILLIMETERS MIN MAX --1.75 0.00 0.10 1.10 1.65 0.19 0.30 0.09 0.20 8.64 BSC 2.37 2.67 6.00 BSC 3.90 BSC 1.79 1.99 0.65 BSC 0.25 0.50 0.40 0.85 1.00 REF 0.25 BSC 0_ 8_ XXXXXXXXXG AWLYYWW 2.72 0.40 C A-B D DIM A A1 A2 b c D D2 E E1 E2 e h L L1 L2 M GENERIC MARKING DIAGRAM* BOTTOM VIEW 24X M NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL BE 0.10 MAX. AT MMC. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OF THE FOOT. DIMENSION b APPLIES TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 TO 0.25 FROM THE LEAD TIP. 4. DIMENSION D DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSION D IS DETERMINED AT DATUM PLANE H. 5. DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 PER SIDE. DIMENSION E1 IS DETERMINED AT DATUM PLANE H. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. 7. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. 8. CONTOURS OF THE THERMAL PAD ARE UNCONTROLLED WITHIN THE REGION DEFINED BY DIMENSIONS D2 AND E2. 98AON96176F SSOP24 NB EP XXXX = Specific Device Code A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb-Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb-Free indicator, "G" or microdot "G", may or may not be present. Some products may not follow the Generic Marking. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped "CONTROLLED COPY" in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. 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