TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET Integrated Transceiver Modules for WLAN 802.11 b/g/n, Bluetooth. Evaluation Kit Available: LSDEV-WI-01-A20 FEATURES DESCRIPTION * IEEE 802.11 b,g,n,d,e,h,i,k,r,s compliant. * Typical WLAN Transmit Power: o 20.0 dBm, 11 Mbps, CCK (b). o 14.5 dBm, 54 Mbps, OFDM (g). o 12.5 dBm, 65 Mbps, OFDM (n). * Bluetooth 2.1+EDR, Power Class 1.5. * Typical WLAN Sensitivity: o - 94 dBm, 8% PER,11 Mbps. o -76 dBm, 10% PER, 54 Mbps. o - 73 dBm, 10% PER, 65 Mbps. * Miniature footprint: 18 mm x 13 mm * Low height profile: 1.9 mm. * U.FL connector for external antenna. * Terminal for PCB/Chip antenna feeds. * Integrated band-pass filter * Worldwide acceptance: FCC (USA), IC (Canada), and ETSI (Europe) * Compact design based on Texas Instruments WL1271WSP Transceiver. * Seamless integration with TI OMAPTM application processor. * SDIO Host data path interfaces. * Bluetooth Advanced Audio Interfaces * Low power operation mode. * RoHS compliant * Streamlined development with LSR design services. APPLICATIONS * Security * HVAC Control , Smart Energy * Sensor Networks * Medical The TiWi module is a high performance 2.4GHz IEEE 802.11 b/g/n Bluetooth 2.1+EDR radio in a cost effective, pre-certified footprint. The module realizes the necessary PHY/MAC layers to support WLAN applications in conjunction with a host processor over a SDIO/WSPI interface. The module also provides a Bluetooth platform through the HCI transport layer. Both WLAN and Bluetooth share the same antenna port. Need to get to market quickly? Not an expert in 802.11. or Bluetooth? Need a custom antenna? Would you like to own the design? Would you like a custom design? Not quite what you need? Do you need help with your host board? LS Research Design Services will be happy to develop custom hardware or software, integrate the design, or license the design so you can manufacture yourself. Contact us at sales@lsr.com or call us at 262375-4400. The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 1 of 28 TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET ORDERING INFORMATION Order Number Description LS240-WI-01-A20 TiWi Module with U.FL connector for external antenna LSDEV-WI-01-A20 TiWi Evaluation Kit TMDSEVM3530 TI OMAPTM Application Processor Development Kit Table 1 Orderable TiWi Model Numbers The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 2 of 28 TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET BLOCK DIAGRAM TPS73028 TPS62611 VBAT VIO OPTIONAL SLOW_CLK FAST_CLK FEM_CONTROL PA_DETECTOR PA_BIAS WLAN SLOW_CLK WL_TX WL_RX 2.4 GHZ RF PA HOST_SIGNALLING BPF BT_TX_RX HOST_INTERFACE FEM HOST_DEBUG BT MATCHING FM MATCHING WL1271 Figure 1: TiWi Module Block Diagram - Top-Level EVALUATION KIT The TiWi Evaluation Kit can be used out of the box to evaluate RF terminal performance with the simple user interface. Users interested in further investigating the terminal RF performance of the TiWi Module can use the TiWi Test Tool. This PC-based software can demonstrate just how easy it is to collect performance data, change channels, power levels, and data rates. Application-driven users can use the TI OMAPTM development board to create and debug their own application software for the TiWi module using the Mistral OMAPTM Development kit. Evaluation kit can be externally powered or powered directly by USB. Part Number Figure 2: TiWi Evaluation Board Kit Contents * TiWi EvaluationBoard with TiWi Series Transceiver Module with external antenna (x1) Description LSDEV-WI-01-A20 TiWi Evaluation Kit * USB Cable (x2) TMDSEVM3530 OMAPTM development Kit * Software & Technical Information CD * Quick Start Guide The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 3 of 28 TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET TABLE OF CONTENTS FEATURES .......................................................................................................................... 1 APPLICATIONS ................................................................................................................... 1 DESCRIPTION ..................................................................................................................... 1 ORDERING INFORMATION ................................................................................................ 2 BLOCK DIAGRAM ............................................................................................................... 3 EVALUATION KIT ............................................................................................................... 3 Kit Contents ................................................................................................................................................. 3 TIWITM MODULE FOOTPRINT AND PIN DEFINITIONS ..................................................... 6 PIN DESCRIPTIONS ............................................................................................................ 7 ELECTRICAL SPECIFICATIONS ........................................................................................ 9 Absolute Maximum Ratings ....................................................................................................................... 9 Recommended Operating Conditions ...................................................................................................... 9 General Characteristics ............................................................................................................................ 10 WLAN RF Characteristics......................................................................................................................... 11 BLUETOOTH RF Characteristics ............................................................................................................ 13 WLAN POWER-UP SEQUENCE ....................................................................................... 14 WLAN POWER-DOWN SEQUENCE ................................................................................. 15 BLUETOOTH POWER-UP SEQUENCE............................................................................ 16 BLUETOOTH POWER-DOWN SEQUENCE ..................................................................... 17 ENABLE SCHEME ............................................................................................................ 18 IRQ OPERATION ............................................................................................................... 18 SLOW (32 KHZ) CLOCK SOURCE REQUIREMENTS ..................................................... 19 BT HCI UART ..................................................................................................................... 20 SDIO INTERFACE TIMING ................................................................................................ 21 SDIO CLOCK TIMING........................................................................................................ 22 APPLICATION SCHEMATIC ............................................................................................. 23 The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 4 of 28 TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET SOLDERING RECOMMENDATIONS ................................................................................ 24 Recommended Reflow Profile ................................................................................................................. 24 Lead (Pb) Free Soldering Paste ............................................................................................................... 24 Cleaning ..................................................................................................................................................... 24 Optical Inspection ..................................................................................................................................... 24 Repeating Reflow Soldering .................................................................................................................... 24 Wave Soldering ......................................................................................................................................... 25 Hand Soldering .......................................................................................................................................... 25 Rework ....................................................................................................................................................... 25 Additional Grounding ............................................................................................................................... 25 SHIPPING, HANDLING, AND STORAGE ......................................................................... 25 Shipping ..................................................................................................................................................... 25 Handling ..................................................................................................................................................... 25 Moisture Sensitivity Level (MSL) ............................................................................................................. 25 Storage ....................................................................................................................................................... 25 AGENCY CERTIFICATIONS ............................................................................................. 25 MECHANICAL DATA......................................................................................................... 26 MODULE REVISION HISTORY ......................................................................................... 27 Rev A .......................................................................................................................................................... 27 CONTACTING LS RESEARCH ......................................................................................... 28 The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 5 of 28 TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET TIWITM MODULE FOOTPRINT AND PIN DEFINITIONS To apply the TiWiTM module, it is important to use the module pins in your application as they are designated in below and in the corresponding pin definition table found on pages 7 and 8. Not all the pins on the TiWi module may be used, as some are reserved for future functionality. 2.0 mm between antenna terminal and grounds 1.0 mm pitch througout 56 55 54 53 52 51 50 49 48 47 GND GND GND GND GND ANT GND GND GND GND WL_RS232_RX HCI_RTS 38 10 WL_RS232_TX HCI_RX 37 11 FM_I2S_FSYNC AUD_FSYNC 36 12 WL_EN GND 35 13 VIO FM_AUD_LOUT 34 14 GND FM_AUD_ROUT 33 15 SDIO_D3 GND 32 16 SDIO_D2 FMRFIN 31 17 SDIO_D1 FMRFOUT 30 FM_AUD_RIN 39 9 FM_AUD_LIN HCI_TX 28 FM_EN 29 40 8 FM_I2S_DI AUD_CLK FM_I2S_DO BT_EN 27 41 7 FM_I2S_CLK AUD_OUT 26 WLAN_IRQ FM_SCL 42 6 25 HCI_CTS FM_SDA WL_UART_DBG 24 43 5 23 AUD_IN SLOW_CLK GND FM_IRQ 44 4 22 BT_FUNC2 SDIO_CLK BT_FUNC5 21 45 3 SDIO_CMD 46 BT_FUNC4 20 VDD_LDO_CLASS_1P5 GND SDIO_D0 VBAT 2 19 1 18 18.0 mm 1.0 mm from each corner 13.0 mm Figure 3: TiWiTM PIN DEFINITIONS and Generic Module Footprint The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 6 of 28 TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET PIN DESCRIPTIONS Module Pin Name I/O Type Buffer Type 1 VBAT PI - Battery Voltage 3.6 VDC Nominal (3.0-4.8 VDC) 2 GND GND - Ground 3 BT_FUNC5 DIO 4 mA 4 GND GND - 5 WL_UART_DBG DIO 4 mA WL_UART_DBG 6 WLAN_IRQ DO 4 mA WLAN Interrupt Request 7 BT_EN DI - BT_RST 8 FM_EN DI - FM_RST 9 WL_RS232_RX DIO 4 mA RS232_Rx or I2C_M_SCL 10 WL_RW_232_TX DIO 4 mA RS232_Tx or I2C_M_SDA 11 FM_I2S_FSYNC DIO 4 mA FM_I2S_IF 12 WL_EN DI - WL_RST 13 VIO PI - POWER SUPPLY FOR 1.8 VDC DIGITAL DOMAIN 14 GND GND - Ground 15 SDIO_D3 DIO 8 mA SDIO INTERFACE, HOST PULL UP, GND IF SPI 16 SDIO_D2 DIO 8 mA SDIO INTERFACE, HOST PULL UP, GND IF SPI 17 SDIO_D1 DIO 8 mA SDIO INTERFACE, HOST PULL UP, GND IF SPI 18 SDIO_D0 DIO 8 mA SDIO INTERFACE, HOST PULL UP, GND IF SPI 19 SDIO_CMD DIO 8 mA CAN BE USED AS SPI_DIN, HOST PULL UP 20 SDIO_CLK DI - CAN BE USED AS SPI_CLK, HOST PULL UP 21 SLOW_CLK DI - SLEEP CLOCK (32 kHz), 1.8 VDC DIGITAL DOMAIN 22 FM_IRQ DIO 4 mA FM_I2C_IF 23 FM_SDA DIO 4 mA FM_I2C_IF 24 FM_SCL DIO 4 mA FM_I2C_IF 25 FM_I2S_CLK DIO 4 mA FM_I2C_IF 26 FM_I2S_DI DIO 4 mA FM_I2C_IF 27 FM_I2S_DO DIO 4 mA FM_I2C_IF 28 FM_AUD_RIN AI - FM_AUD_RIN 29 FM_AUD_LIN AI - FM_AUD_LIN 30 FMRFOUT AO - FMRFOUT 31 FMRFIN AI - FMRFIN Description HOST_WU Ground The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 7 of 28 TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET Module Pin Name I/O Type Buffer Type 32 GND GND - Ground 33 FM_AUD_ROUT AO - FM_AUD_ROUT 34 FM_AUD_LOUT AO - FM_AUD_LOUT 35 GND GND - Ground 36 AUD_FSYNC DIO 4 mA PCM I/F or FM_I2S_FSYNC 37 HCI_RX DIO 8 mA BT UART I/F or btSPI_DIN 38 HCI_RTS DIO 4 mA BT UART I/F or btSPI_IRQ 39 HCI_TX DIO 8 mA BT UART I/F or btSPI_DOUT 40 AUD_CLK DIO 4 mA PCM I/F or FM_I2S_CLK 41 AUD_OUT DIO 4 mA PCM I/F or FM_I2S_DO 42 HCI_CTS DIO 4 mA BT UART I/F or btSPI_CS 43 AUD_IN DIO 4 mA PCM I/F or FM_I2S_DI 44 BT_FUNC2 DIO 4 mA BT WU/ DC2DC mode 45 BT_FUNC4 DIO 4 mA BT_UARTD 46 VDD_LDO_CLASS_1P5 NC - VBAT VOLTAGE PRESENT, NO CONNECT 47 GND GND - Ground 48 GND GND - Ground 49 GND GND - Ground 50 GND GND - Ground 51 ANT RF 52 GND GND - Ground 53 GND GND - Ground 54 GND GND - Ground 55 GND GND - Ground 56 GND GND - Ground Description Antenna terminal for WLAN and Bluetooth PI = Power Input PO = Power Output DI = Digital Input DO = Digital Output AI = Analog Input AO=Analog Output AIO = Bi-directional Analog Port RF = Bi-directional RF Port GND=Ground Table 2 TiWi Module Pin Descriptions The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 8 of 28 TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET ELECTRICAL SPECIFICATIONS The majority of these characteristics are based on controlling and conditioning the tests using the evaluation kit and TiWi control software application. Other control conditions may require these values to be re-characterized by the customer. Absolute Maximum Ratings Parameter Min Max Unit Power supply voltage (VBAT) -0.5 +5.5 V Digital supply voltage (VIO) -0.5 2.1 V Voltage on any GPIO -0.5 VIO + 0.5 V Voltage on any Analog Pins -0.5 2.1 V +10 dBm +85 C +105 C RF input power, antenna port Operating temperature -40 Storage temperature Table 3 Absolute Maximum Ratings 1 Recommended Operating Conditions Parameter Min Typ Max Unit VBAT 3.0 3.6 4.8 V VIO 1.62 1.8 1.92 V VIH 0.65 X VIO - VIO V VIL 0 - 0.35 X VIO V VOH @ 4, 8 mA VIO-0.45 - VIO V VOL @ 4, 8 mA 0 - 0.45 V -40 25 85 C Ambient temperature range Table 4 Recommended Operating Conditions 1 Under no circumstances should exceeding the ratings specified in the Absolute Maximum Ratings section be allowed. Stressing the module beyond these limits may result permanent damage to the module that is not covered by the warranty. The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 9 of 28 TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET General Characteristics Parameter Min WLAN RF frequency range WLAN RF data rate BT RF frequency Range Typ 2412 1 Max Unit 2472 MHz 65 Mbps 2480 MHz 802.11 b/g/n rates supported 2402 Table 5 General Characteristics Power Consumption Parameter Test Conditions Min Typ Max Unit - 280 - mA - 185 - mA - 165 - mA CCK (b) RX Current - 100 - mA OFDM (g) RX Current - 100 - mA OFDM (n) RX Current - 100 - mA Dynamic Mode [1] - <1.2 - mA 2437 MHz, VBAT =3.6V, Tamb=+25C CCK (b) TX Current Po=20 dBm, 11 Mbps CCK L=1200 bytes, tdelay (idle)=4 S. 2437 MHz, VBAT =3.6V, Tamb=+25C OFDM (g) TX Current Po=14.5 dBm, 54 Mbps OFDM L=1200 bytes, tdelay (idle)=4 S. 2437 MHz, VBAT =3.6V, Tamb=+25C OFDM (n) TX Current Po=12.5 dBm, 65 Mbps OFDM L=1200 bytes, tdelay (idle)=4 S. Table 6 Power Consumption [1] Total Current from VBAT for reception of Beacons with DTIM=1 TBTT=100 mS, Beacon duration 1.6ms, 1 Mbps beacon reception in Listen Mode. The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 10 of 28 TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET DC Characteristics - General Purpose I/O Parameter Test Conditions Min Typ Max Unit Logic input low, VIL 0 - 0.35 X VIO V Logic input high, VIH 0.65 X VIO - VIO V Logic output low, VOL (Full Drive) Iout = 8 mA 0 - 0.45 V Iout = 4 mA 0 - 0.45 V Logic output low, VOL (Reduced Drive) Iout = 1 mA 0 - 0.112 V Iout = 0.09 mA 0 - 0.01 V Logic output high, VOH (Full Drive) Iout = -8 mA VIO-0.45 - VCC V Iout = -4 mA VIO-0.45 - VCC V Logic output high, VOH (Reduced Drive) Iout = -1 mA VIO-0.112 - VCC V Iout = -0.3 mA VIO-0.033 - VCC V Table 7 DC Characteristics General Purpose I/O WLAN RF Characteristics WLAN Transmitter Characteristics (TA =25C, VBAT=3.6 V) Parameter Test Conditions Min Typ Max Unit 11 Mbps CCK (b) TX Output Power 11 Mbps CCK , 802.11(b) Mask Compliance, 35% EVM RMS power over TX packet - 20 - dBm 9 Mbps OFDM (g) TX Output Power 9 Mbps OFDM , 802.11(g) Mask Compliance, -8 dB EVM RMS power over TX packet - 19 - dBm 54 Mbps OFDM (g) TX Output Power 54 Mbps OFDM, 802.11(g) Mask Compliance, -25 dB EVM RMS power over TX packet - 14.5 - dBm - 19 - dBm - 12.5 - dBm 6.5 Mbps OFDM (n) TX Output Power 65 Mbps OFDM (n) TX Output Power 6.5 Mbps OFDM, 802.11(n) Mask Compliance, -5 dB EVM RMS power over TX packet 65 Mbps OFDM, 802.11(n) Mask Compliance, -28 dB EVM RMS power over TX packet Table 8 WLAN Transmitter RF Characteristics The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 11 of 28 TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET WLAN Receiver Characteristics (TA =25C, VBAT=3.6 V) [1] Parameter Test Conditions Min Typ Max Unit 1 Mbps CCK (b) RX Sensitivity 8% PER - -97 - dBm 11 Mbps CCK (b) RX Sensitivity 8% PER - -94 - dBm 9 Mbps OFDM (g) RX Sensitivity 10% PER - -90 - dBm 54 Mbps OFDM (g) RX Sensitivity 10% PER - -76 - dBm 6.5 Mbps OFDM (n) RX Sensitivity 10% PER - -91 - dBm 65 Mbps OFDM (n) RX Sensitivity 10% PER - -73 -- dBm 11 Mbps CCK (b) RX Overload Level. 8% PER -10 - - dBm 6 Mbps OFDM(g) RX Overload Level. 10% PER -20 - - dBm 54 Mbps OFDM(g) RX Overload Level. 10% PER -20 - - dBm 65 Mbps OFDM(n) RX Overload Level. 10% PER -20 - - dBm [1] Up to 2 dB degradation at Channel 13 for 11g/n modes and up to 2 dB degradation at Channel 14 for 11b/g/n modes. Table 9 WLAN Receiver RF Characteristics The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 12 of 28 TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET BLUETOOTH RF Characteristics BluetoothTransmitter GFSK and EDR Characteristics , Class 1.5 (TA =25C, VBAT=3.6 V) Parameter Test Conditions Min Typ Max GFSK RF Output Power - 9.5 - EDR RF Output Power - 7 - Power Control Step Size 2 4 EDR Relative Power -2 BT Spec Unit - dBm 8 2-8 dB 1 -4/+1 dB BT Spec Unit Bluetooth Receiver Characteristics (TA =25C, VBAT=3.6 V) Parameter Test Conditions Min Typ Max GFSK Sensitivity BER=0.1% - -92 - EDR 2 Mbps Sensitivity BER=0.01% - -91 - -70 dBm EDR 3 Mbps Sensitivity BER=0.01% - -82 - -70 dBm GFSK Maximum Input Level BER=0.1% - -5 - EDR 2 Maximum Input Level BER=0.1% - -10 - - dBm EDR 3 Maximum Input Level BER=0.1% - -10 - - - -70 -20 dBm dBm The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 13 of 28 TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET WLAN POWER-UP SEQUENCE A. After this sequence is completed, the device is in the low VIO-leakage state while in shutdown. Figure 4-1: TiWi Power-up Sequence Requirements The following sequence describes device power-up from shutdown. Only the WLAN Core is enabled; the BT and FM cores are disabled. 1. No signals are allowed on the IO pins if no IO power supplied, because the IOs are not 'fail safe'.Exceptions are CLK_REQ_OUT, SLOWCLK, XTALP and AUD_xxx, which are failsafe and can tolerate external voltages with no VDDS and DC2DC". 2. VBAT,VIO and SLOWCLK must be available before WL_EN. 3. Twakeup = T1 + T2 The duration of T1 is defined as the time from WL_EN=high until Fref is valid for the SoC, T1 ~55ms The duration of T2 depends on: - Operating system - Host enumeration for the SDIO/WSPI - PLL configuration - Firmware download - Releasing the core from reset - Firmware initialization The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 14 of 28 TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET WLAN POWER-DOWN SEQUENCE Figure 4-2: TiWi Module Power-down Sequence Requirements 1. DC_REQ will go low only if WLAN is the only core working. otherwise if another core is working (e.g BT) it will stay high. 2. CLK_REQ will go low only if WLAN is the only core working. otherwise if another core is working and using the Fref (e.g BT) it will stay high. 3. If WLAN is the only core that is operating, WL_EN must remain de-asserted for at least 64sec before it is re-asserted. The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 15 of 28 TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET BLUETOOTH POWER-UP SEQUENCE The following sequence describes device powerup from shutdown. Only the BT core is enabled; the WLAN core is disabled. Power up requirements: 1. No signals are allowed on the IO pins if no IO power supplied, because the IOs are not 'failsafe'. Exceptions are CLK_REQ_OUT, SLOWCLK, XTALP and AUD_xxx, which are failsafe and can tolerate external voltages with no VDDS and DC2DC. 2. VDDS and SLOWCLK must be stable before releasing BT_EN. 3. Fast clock must be stable maximum 55 ms after BT_EN goes HIGH. Figure 4-3. BT Power-up Sequence The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 16 of 28 TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET BLUETOOTH POWER-DOWN SEQUENCE Figure 4-4. BT Power-down Sequence The TiWi module indicates completion of BT power up sequence by asserting RTS low. This occurs up to 100 ms after BT_EN goes high. The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 17 of 28 TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET ENABLE SCHEME The module has 3 enable pins, one for each core: WL_EN, and BT_EN and FM_EN. Presently, there are 2 modes of active operation now supported: WLAN and BT. It is recommended that the FM_EN pin be grounded to disable the FM section. It is also recommended that the FM section be disabled by Bluetooth HCI commands. 1. Each core is operated independently by asserting each EN to Logic '1'. in this mode it is possible to control each core asynchronously and independently. 2. BT mode operation. WLAN will be operated through WL_EN asynchronously independently of BT IRQ OPERATION 1. The default state of the WLAN_IRQ prior to firmware initialization is 0. 2. During firmware initialization, the WLAN_IRQ is configured by the SDIO module; a WLAN_IRQ changes its state to 1. 3. A WLAN firmware interrupt is handled as follows: a. The WLAN firmware creates an Interrupt-to-Host, indicated by a 1-to-0 transition on the WLAN_IRQ line (host must be configured as active-low or falling-edge detect). b. After the host is available, depending on the interrupt priority and other host tasks, it masks the firmware interrupt. The WLAN_IRQ line returns to 1 (0-to-1 transition on the WLAN_IRQ line). c. The host reads the internal register status to determine the interrupt sources - the register is cleared after the read. d. The host processes in sequence all the interrupts read from this register e. The host unmasks the firmware interrupts. 4. The host is ready to receive another interrupt from the WLAN device. The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 18 of 28 TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET SLOW (32 KHZ) CLOCK SOURCE REQUIREMENTS Characteristics (1) Input slow clock frequency Input slow clock accuracy Input transition time Tr/Tf 10% to 90% Frequency input duty cycle Input voltage limits VIL Input impedence Input capacitance Rise and fall time Phase noise Condition Sym Min Typ Max Unit 32768 Hz WLAN, BT 150 ppm Tr/Tf 100 ns 30 50 70 % Square wave, DCcoupled VIH 0.65 X VDDS VDDS Vpeak 0 0.35X VDDS 1 MW 5 pF 100 ns 1 kHz -125 dBc/Hz 1) Slow clock is a fail safe input The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 19 of 28 TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET BT HCI UART The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 20 of 28 TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET SDIO INTERFACE TIMING The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 21 of 28 TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET SDIO CLOCK TIMING The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 22 of 28 TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET APPLICATION SCHEMATIC The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 23 of 28 TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET SOLDERING RECOMMENDATIONS Recommended Reflow Profile * Ramp up rate (from Tsoakmax to Tpeak) 3/sec max * Minimum Soak Temperature 150C * Maximum Soak Temperature 200C * Soak Time 60-120 sec * TLiquidus 217C * Time above TL 60-150 sec * Tpeak 260C * Time within 5 of Tpeak 20-30 sec * Time from 25 to Tpeak 8 min max * Ramp down rate 6C/sec max * Achieve the brightest possible solder fillets with a good shape and low contact angle. Lead (Pb) Free Soldering Paste Use of a "No Clean" Lead (Pb) free Tin/Silver/Copper solder paste is strongly recommended. Melting temperature 216-221C. * Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels. * Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the RF shield, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels. * Ultrasonic cleaning could damage the module permanently. Consider using a "no clean" soldering paste and thus eliminate the post-soldering cleaning step completely. Optical Inspection Note: The quality of solder joints on the castellations (`half vias') where they contact the host board should meet the appropriate IPC Specification. See IPC-A-610-D Acceptability of Electronic Assemblies, section 8.2.4 Castellated Terminations." The soldering temperatures and profile chosen depends on additional factors such as choice of soldering paste, size, thickness and other properties of the host board. Cleaning After soldering the Module to the host board, consider optical inspection to check the following: * Proper alignment and centering of the module over the pads. * Proper solder joints on all pads. * Excessive solder or contacts to neighboring pads, or vias. Repeating Reflow Soldering Only a single reflow process is encouraged boards. soldering for host In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 24 of 28 TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET Wave Soldering Handling If wave soldering is required on the host boards due to the presence of leaded components, only a single wave soldering process on the side opposite the module is encouraged. The TiWi modules are designed and packaged to be processed in an automated assembly line. Hand Soldering Hand soldering is possible. Use a soldering iron temperature setting equivalent to 350C, follow IPC recommendations/reference document IPC-7711. Rework The TiWi module can be unsoldered from the host board. Use of a hot air rework tool and hot plate for pre-heating from underneath is recommended. Avoid overheating. Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will terminate warranty coverage. Warning! The TiWi modules contain a highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. Warning! According to JEDEC ISP, the TiWi modules are moisture sensitive devices. Appropriate handling instructions and precautions are summarized in Section 2.1. Read carefully to prevent permanent damage due to moisture intake. Moisture Sensitivity Level (MSL) MSL 3, per J-STD-033 Storage Additional Grounding Attempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover is done at the customers own risk. The numerous ground pins at the module perimeter should be sufficient for optimum immunity to external RF interference. SHIPPING, HANDLING, AND STORAGE Shipping Bulk orders of the TiWi modules are delivered in trays of TBD. Storage/shelf life in sealed bags is 12 months at <40C and <90% relative humidity. AGENCY CERTIFICATIONS FCC ID: TBD, 15.247. IC ID: TBD, RSS 210 ETSI: The European Telecommunications Standards Institute. It produces the radio and communication standards for Europe. Our testing is to the ETSI standard EN 300 328, which is the portion of the relevant directives needed for a radio to obtain a CE mark. See the User's Guide for detailed information regarding agency approvals. The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 25 of 28 TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET MECHANICAL DATA 2.0 mm between antenna terminal and grounds 1.0 mm pitch througout 1.0 mm from each corner 13.0 mm Figure 4: Module Mechanical Dimensions (Maximum Module Height = 1.9 mm) Figure 5: Soldering Footprint for Host Board and Module Placement (PAD details TBD) The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 26 of 28 TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET MODULE REVISION HISTORY Rev A * Initial production release. The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 27 of 28 TiWi TRANSCEIVER MODULE LS240-WI-01-A20 DATASHEET CONTACTING LS RESEARCH Headquarters LS Research, LLC W66 N220 Commerce Court Cedarburg, WI 53012-2636 USA Tel: 1(262) 375-4400 Fax: 1(262) 375-4248 Website www.lsr.com Technical Support support@lsr.com Sales Contact sales@lsr.com The information in this document is provided in connection with LS Research (hereafter referred to as "LSR") products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of LSR products. EXCEPT AS SET FORTH IN LSR'S TERMS AND CONDITIONS OF SALE LOCATED ON LSR'S WEB SITE, LSR ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL LSR BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF LSR HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. LSR makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. LSR does not make any commitment to update the information contained herein. Unless specifically provided otherwise, LSR products are not suitable for, and shall not be used in, automotive applications. LSR's products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. WFLX-DATA-0001-01.00 Copyright (c) 2010 LS Research, LLC Page 28 of 28