TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
Integrated Transceiver Modules for WLAN 802.11 b/g/n, Bluetooth.
Evaluation Kit Available: LSDEV-WI-01-A20
FEATURES
• IEEE 802.11 b,g,n,d,e,h,i,k,r,s compliant.
• Typical WLAN Transmit Power:
o 20.0 dBm, 11 Mbps, CCK (b).
o 14.5 dBm, 54 Mbps, OFDM (g).
o 12.5 dBm, 65 Mbps, OFDM (n).
• Bluetooth 2.1+EDR, Power Class 1.5.
• Typical WLAN Sensitivity:
o - 94 dBm, 8% PER,11 Mbps.
o -76 dBm, 10% PER, 54 Mbps.
o - 73 dBm, 10% PER, 65 Mbps.
• Miniature footprint: 18 mm x 13 mm
• Low height profile: 1.9 mm.
• U.FL connector for external antenna.
• Terminal for PCB/Chip antenna feeds.
• Integrated band-pass filter
• Worldwide accepta nce: FCC (USA), IC
(Canada), and ETSI (Europe)
• Compact design ba sed on Texas
Instruments WL1271WSP Transceiver.
• Seamless integration with TI OMAP™
application processor.
• SDIO Host data path interfaces.
• Bluetooth Advanced Audio Interfaces
• Low power operation mode.
• RoHS compliant
• Streamlined development with LSR design
services.
APPLICATIONS
• Security
• HVAC Control , Smart Energy
• Sensor Networks
• Medical
DESCRIPTION
The TiWi module is a high performance 2.4GHz
IEEE 802.11 b/g/n Bluetooth 2.1+EDR radio in
a cost effective, pre-certified footprint.
The module realizes the necessary PHY/MAC
layers to support WLAN applications in
conjunction with a host processor over a
SDIO/WSPI interface.
The module also provides a Bluetooth platform
through the HCI transport layer. Both WLAN
and Bluetooth share the same antenna port.
Need to get to market quickly? Not an expert in
802.11. or Bluetooth? Need a custom
antenna? Would you like to own the design?
Would you like a custom design? Not quite
what you need? Do you need help with your
host board? LS Research Design Services will
be happy to develop custom hardware or
software, integrate the design, or license the
design so you can manufacture yourself.
Contact us at sales@lsr.com or call us at 262-
375-4400.
The information in this document is subject to change without notice.
Confirm the data is current by downloading the latest revision from www.lsr.com.
WFLX-DATA-0001-01.00 Copyright © 2010 LS Research, LLC Page 1 of 28
TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
ORDERING INFORMATION
Order Number Description
LS240-WI-01-A20 TiWi Module with U.FL connector for external antenna
LSDEV-WI-01-A20 TiWi Evaluation Kit
TMDSEVM3530 TI OMAP
TM
Application Processor Development Kit
Table 1 Orderable TiWi Model Numbers
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WFLX-DATA-0001-01.00 Copyright © 2010 LS Research, LLC Page 2 of 28
TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
BLOCK DIAGRAM
WLAN
BT
FM
FEM
BPF
WL1271
TPS62611
TPS73028
VBAT
VIO
SLOW_CLK
FAST_CLK
HOST_SIGNALLING
HOST_INTERFACE
HOST_DEBUG
BT_TX_RX
WL_RX
WL_TX
PA
PA_BIAS
PA_DETECTOR
FEM_CONTROL
MATCHING
MATCHING
OPTIONAL
SLOW_CLK
2.4
GHZ
RF
Figure 1: TiWi Module Block Diagram – Top-Lev el
EVALUATION KIT
The TiWi Evaluation Kit can be used out of the
box to evaluate RF terminal performance with
the simple user interface.
Users interested in further investigating the
terminal RF performance of the TiWi Module
can use the TiWi Test Tool. This PC-based
software can demonstrate just how easy it is to
collect performance data, change channels,
power levels, and data rates.
Application-driven users can use the TI
OMAP
TM
development board to create and
debug their own application software for the
TiWi module using the Mistral OMAP
TM
Development kit.
Evaluation kit can be externally powered or
powered directly by USB.
Part Number Description
LSDEV-WI-01-A20 TiWi Evaluation Kit
TMDSEVM3530 OMAP
TM
development Kit
Figure 2: TiWi Evaluation Board
Kit Contents
• TiWi EvaluationBoard with TiWi Series
Transceiver Module with external antenna
(x1)
• USB Cable (x2)
• Software & Technical Information CD
• Quick Start Guide
The information in this document is subject to change without notice.
Confirm the data is current by downloading the latest revision from www.lsr.com.
WFLX-DATA-0001-01.00 Copyright © 2010 LS Research, LLC Page 3 of 28
TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
TABLE OF CONTENTS
FEATURES .......................................................................................................................... 1
APPLICATIONS ................................................................................................................... 1
DESCRIPTION ..................................................................................................................... 1
ORDERING INFORMATION ................................................................................................ 2
BLOCK DIAGRAM ............................................................................................................... 3
EVALUATION KIT ............................................................................................................... 3
Kit Contents ................................................................................................................................................. 3
TIWI™ MODULE FOOTPRINT AND PIN DEFINITIONS ..................................................... 6
PIN DESCRIPTIONS ............................................................................................................ 7
ELECTRICAL SPECIFICATIONS ........................................................................................ 9
Absolute Maximum Ratings ....................................................................................................................... 9
Recommended Operating Conditions ...................................................................................................... 9
General Characteristics ............................................................................................................................ 10
WLAN RF Characteris tic s ......................................................................................................................... 11
BLUETOOTH RF Characteristics ............................................................................................................ 13
WLAN POWER-UP SEQUENCE ....................................................................................... 14
WLAN POWER-DOWN SEQUENCE ................................................................................. 15
BLUETOOTH POWER-UP SEQUENCE ............................................................................ 16
BLUETOOTH POWER-DOWN SEQUENCE ..................................................................... 17
ENABLE SCHEME ............................................................................................................ 18
IRQ OPERATION ............................................................................................................... 18
SLOW (32 KHZ) CLOCK SOURCE REQUIREMENTS ..................................................... 19
BT HCI UART ..................................................................................................................... 20
SDIO INTERFACE TIMING ................................................................................................ 21
SDIO CLOCK TIMING........................................................................................................ 22
APPLICATION SCHEMATIC ............................................................................................. 23
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TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
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Confirm the data is current by downloading the latest revision from www.lsr.com.
WFLX-DATA-0001-01.00 Copyright © 2010 LS Research, LLC Page 5 of 28
SOLDERING RECOMMENDATIONS ................................................................................ 24
Recommended Reflow Profile ................................................................................................................. 24
Lead (Pb) Free Soldering Paste ............................................................................................................... 24
Cleaning ..................................................................................................................................................... 24
Optical Inspection ..................................................................................................................................... 24
Repeating Reflow Soldering .................................................................................................................... 24
Wave Soldering ......................................................................................................................................... 25
Hand Soldering .......................................................................................................................................... 25
Rework .............................................................................................................................. ......................... 25
Additional Grounding ............................................................................................................................... 25
SHIPPING, HANDLING, AND STORAGE ......................................................................... 25
Shipping ..................................................................................................................................................... 25
Handling ..................................................................................................................................................... 25
Moisture Sensitivity Level (MSL) ............................................................................................................. 25
Storage ....................................................................................................................................................... 25
AGENCY CERTIFICATIONS ............................................................................................. 25
MECHANICAL DATA ......................................................................................................... 26
MODULE REVISION HISTORY ......................................................................................... 27
Rev A .......................................................................................................................................................... 27
CONTACTING LS RESEARCH ......................................................................................... 28
TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
TIWI™ MODULE FOOTPRINT AND PIN DEFINITIONS
To apply the TiWi™ module, it is important to use the module pins in your application as they are
designated in below and in the corresponding pin definition table found on pages 7 and 8. Not all the
pins on the TiWi module may be used, as some are reserved for future functionality.
VBAT1
GND2
BT_FUNC53
GND4
WL_UART_DBG5
WLAN_IRQ6
BT_EN7
FM_EN8
WL_RS232_RX9
WL_RS232_TX10
FM_I2S_FSYNC11
WL_EN12
VIO13
GND14
SDIO_D315
SDIO_D216
SDIO_D117
GND56
GND54
GND55
GND49
GND47
GND48
GND50
GND53
GND52
ANT51
VDD_LDO_CLASS_1P5 46
BT_FUNC4 45
BT_FUNC2 44
AUD_IN 43
HCI_CTS 42
AUD_OUT 41
AUD_CLK 40
HCI_TX 39
HCI_RTS 38
HCI_RX 37
AUD_FSYNC 36
GND 35
FM_AUD_LOUT 34
FM_AUD_ROUT 33
GND 32
FMRFIN 31
FMRFOUT 30
FM_IRQ22
SDIO_CLK20
SLOW_CLK21
SDIO_CMD19
SDIO_D018
FM_I2S_DO27
FM_I2S_CLK25
FM_I2S_DI26
FM_SCL24
FM_SDA23
FM_AUD_LIN29
FM_AUD_RIN28
1.0 mm pitch througout
2.0 mm between antenna terminal and grounds
1.0 mm from each corner
13.0 mm
18.0 mm
Figure 3: TiWi™ PIN DEFINITIONS a nd Generic Module Footprint
The information in this document is subject to change without notice.
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WFLX-DATA-0001-01.00 Copyright © 2010 LS Research, LLC Page 6 of 28
TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
PIN DESCRIPTIONS
Module
Pin Name
I/O
Type
Buffer
Type Description
1 VBAT PI - Battery Voltage 3.6 VDC Nominal (3.0-4.8 VDC)
2 GND GND - Ground
3 BT_FUNC5 DIO 4 mA HOST_WU
4 GND GND - Ground
5 WL_UART_DBG DIO 4 mA WL_UART_DBG
6 WLAN_IRQ DO 4 mA WLAN Interrupt Request
7 BT_EN DI - BT_RST
8 FM_EN DI - FM_RST
9 WL_RS232_RX DIO 4 mA RS232_Rx or I2C_M_SCL
10 WL_RW_232_TX DIO 4 mA RS232_Tx or I2C_M_S DA
11 FM_I2S_FSYNC DIO 4 mA FM_I2S_IF
12 WL_EN DI - WL_RST
13 VIO PI - POWER SUPPLY FOR 1.8 VDC DIGITAL DOMAIN
14 GND GND - Ground
15 SDIO_D3 DIO 8 mA SDIO INTERFACE, HOST PULL UP, GND IF SPI
16 SDIO_D2 DIO 8 mA SDIO INTERFACE, HOST PULL UP, GND IF SPI
17 SDIO_D1 DIO 8 mA SDIO INTERFACE, HOST PULL UP, GND IF SPI
18 SDIO_D0 DIO 8 mA SDIO INTERFACE, HOST PULL UP, GND IF SPI
19 SDIO_CMD DIO 8 mA CAN BE USED AS SPI_DIN, HOST PULL UP
20 SDIO_CLK DI - CAN BE USED AS SPI_CLK, HOST PULL UP
21 SLOW_CLK DI - SLEEP CLOCK (32 kHz), 1.8 VDC DIGITAL DOMAIN
22 FM_IRQ DIO 4 mA FM_I2C_IF
23 FM_SDA DIO 4 mA FM_I2C_IF
24 FM_SCL DIO 4 mA FM_I2C_IF
25 FM_I2S_CLK DIO 4 mA FM_I2C_IF
26 FM_I2S_DI DIO 4 mA FM_I2C_IF
27 FM_I2S_DO DIO 4 mA FM_I2C_IF
28 FM_AUD_RIN AI - FM_AUD_RIN
29 FM_AUD_LIN AI - FM_AUD_LIN
30 FMRFOUT AO - FMRFOUT
31 FMRFIN AI - FMRFIN
The information in this document is subject to change without notice.
Confirm the data is current by downloading the latest revision from www.lsr.com.
WFLX-DATA-0001-01.00 Copyright © 2010 LS Research, LLC Page 7 of 28
TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
Module Buffer
Name
Pin I/O Description
Type
Type
32 GND GND - Ground
33 FM_AUD_ROUT AO - FM_AUD_ROUT
34 FM_AUD_LOUT AO - FM_AUD_LOUT
35 GND GND - Ground
36 AUD_FSYNC DIO 4 mA PCM I/F or FM_I2S_FSYNC
37 HCI_RX DIO 8 mA BT UART I/F or btSPI_DIN
38 HCI_RTS DIO 4 mA BT UART I/F or btSPI_IRQ
39 HCI_TX DIO 8 mA BT UART I/F or btSPI_DOUT
40 AUD_CLK DIO 4 mA PCM I/F or FM_I2S_CLK
41 AUD_OUT DIO 4 mA PCM I/F or FM_I2S_DO
42 HCI_CTS DIO 4 mA BT UART I/F or btSPI_CS
43 AUD_IN DIO 4 mA PCM I/F or FM_I2S_DI
44 BT_FUNC2 DIO 4 mA BT WU/ DC2DC mode
45 BT_FUNC4 DIO 4 mA BT_UARTD
46 VDD_LDO_CLASS_1P5 NC - VBAT VOLTAGE PRESENT, NO CONNECT
47 GND GND - Ground
48 GND GND - Ground
49 GND GND - Ground
50 GND GND - Ground
51 ANT RF Antenna terminal for WLAN and Bluetooth
52 GND GND - Ground
53 GND GND - Ground
54 GND GND - Ground
55 GND GND - Ground
56 GND GND - Ground
PI = Power Input
PO = Power Output
DI = Digital Input
DO = Digital Output
AI = Analog Input
AO=Analog Output
AIO = Bi-directional Analog Port
RF = Bi-directional RF Port
GND=Ground
Table 2 TiWi Module Pin Descriptions
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WFLX-DATA-0001-01.00 Copyright © 2010 LS Research, LLC Page 8 of 28
TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
ELECTRICAL SPECIFICATIONS
The majority of these characteristics are based on controlling and conditioning the tests using the
evaluation kit and TiWi control software application. Other control conditions may require these values
to be re-characterized by the customer.
Absolute Maximum Ratings
Parameter Min Max Unit
Power supply voltage (VBAT) -0.5 +5.5 V
Digital supply voltage (VIO) -0.5 2.1 V
Voltage on any GPIO -0.5 VIO + 0.5 V
Voltage on any Analog Pins -0.5 2.1 V
RF input power, antenna port +10 dBm
Operating temperature -40 +85 ºC
Storage temperature - +105 ºC
Table 3 Absolute Maximum Rating s
1
Recommended Operating Conditions
Parameter Min Typ Max Unit
V
BAT
3.0 3.6 4.8 V
VIO 1.62 1.8 1.92 V
V
IH
0.65 X VIO - VIO V
V
IL
0 - 0.35 X VIO V
V
OH
@ 4, 8 mA VIO-0.45 - VIO V
V
OL
@ 4, 8 mA 0 - 0.45 V
Ambient temperature range -40 25 85 ºC
Table 4 Recommended Operating Conditions
1
Under no circumstances should exceed i ng the ratings specified in the Absolute Maximum Ratings section be
allowed. Stressing the module beyond these limits may result pe rmanent da mage to the module that is not
covered by the warranty.
The information in this document is subject to change without notice.
Confirm the data is current by downloading the latest revision from www.lsr.com.
WFLX-DATA-0001-01.00 Copyright © 2010 LS Research, LLC Page 9 of 28
TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
General Characteristics
Parameter Min Typ Max Unit
WLAN RF frequency range 2412 2472 MHz
WLAN RF data rate 1 802.11 b/g/n
rates
supported 65 Mbps
BT RF frequency Range 2402 2480 MHz
Table 5 General Characteristics
Power Consumption
Parameter Test Conditions Min Typ Max Unit
CCK (b) TX Current
2437 MHz, V
BAT
=3.6V, T
amb
=+25°C
Po=20 dBm, 11 Mbps CCK
L=1200 bytes, t
delay
(idle)=4 μS.
- 280 - mA
OFDM (g) TX Current
2437 MHz, V
BAT
=3.6V, T
amb
=+25°C
Po=14.5 dBm, 54 Mbps OFDM
L=1200 bytes, t
delay
(idle)=4 μS.
- 185 - mA
OFDM (n) TX Current
2437 MHz, V
BAT
=3.6V, T
amb
=+25°C
Po=12.5 dBm, 65 Mbps OFDM
L=1200 bytes, t
dela
y
(idle)=4 μS.
- 165 - mA
CCK (b) RX Current - 100 - mA
OFDM (g) RX Current - 100 - mA
OFDM (n) RX Current - 100 - mA
Dynamic Mode [1] - <1.2 - mA
Table 6 Power Consumption
[1] Total Current from V
BAT
for reception of Beacons with DTIM=1 TBTT=100 mS, Beacon duration
1.6ms, 1 Mbps beacon reception in Listen Mode.
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TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
DC Characteristics – General Purpose I/O
Parameter Test Conditions Min Typ Max Unit
Logic input low, V
IL
0 - 0.35 X VIO V
Logic input high, V
IH
0.65 X VIO - VIO V
Logic output low, V
OL
(Full Drive) Iout = 8 mA 0 - 0.45 V
Iout = 4 mA 0 - 0.45 V
Logic output low, V
OL
(Reduced Driv e) Iout = 1 mA 0 - 0.112 V
Iout = 0.09 mA 0 - 0.01 V
Logic output high, V
OH
(Full Drive) Iout = -8 mA VIO-0.45 - VCC V
Iout = -4 mA VIO-0.45 - VCC V
Logic output high, V
OH
(Reduced Driv e) Iout = -1 mA VIO-0.112 - VCC V
Iout = -0.3 mA VIO-0.033 - VCC V
Table 7 DC Characteristics General Purpose I/O
WLAN RF Characteristics
WLAN Transmitter Characteristics
(TA =25°C, VBAT=3.6 V)
Parameter Test Conditions Min Typ Max Unit
11 Mbps CCK (b) TX
Output Power
11 Mbps CCK , 802.11(b) Mask
Compliance, 35% EVM
RMS power over TX packet - 20 - dBm
9 Mbps OFDM (g) TX
Output Power
9 Mbps OFDM , 802.11(g) Mask
Compliance, -8 dB EVM
RMS power over TX packet - 19 - dBm
54 Mbps OFDM (g) TX
Output Power
54 Mbps OFDM, 802.11(g) Mask
Compliance, -25 dB EVM
RMS power over TX packet - 14.5 - dBm
6.5 Mbps OFDM (n) TX
Output Power
6.5 Mbps OFDM, 802.11(n) Mask
Compliance, -5 dB EVM
RMS power over TX packet
- 19 - dBm
65 Mbps OFDM (n) TX
Output Power
65 Mbps OFDM, 802.11(n) Mask
Compliance, -28 dB EVM
RMS power over TX packet
- 12.5 - dBm
Table 8 WLAN Transmitter RF Characteristics
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WFLX-DATA-0001-01.00 Copyright © 2010 LS Research, LLC Page 11 of 28
TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
WLAN Receiver Characteristics
(TA =25°C, VBAT=3.6 V) [1]
Parameter Test Conditions Min Typ Max Unit
1 Mbps CCK (b) RX
Sensitivity 8% PER - -97 - dBm
11 Mbps CCK (b) RX
Sensitivity 8% PER - -94 - dBm
9 Mbps OFDM (g) RX
Sensitivity 10% PER - -90 - dBm
54 Mbps OFDM (g) RX
Sensitivity 10% PER - -76 - dBm
6.5 Mbps OFDM (n) RX
Sensitivity 10% PER - -91 - dBm
65 Mbps OFDM (n) RX
Sensitivity 10% PER - -73 -- dBm
11 Mbps CCK (b) RX
Overload Level. 8% PER -10 - - dBm
6 Mbps OFDM(g) RX
Overload Level. 10% PER -20 - - dBm
54 Mbps OFDM(g) RX
Overload Level. 10% PER -20 - - dBm
65 Mbps OFDM(n) RX
Overload Level. 10% PER -20 - - dBm
[1] Up to 2 dB degradation at Channel 13 for 11g/n modes and up to 2 dB degradation at Channel 14 for
11b/g/n modes.
Table 9 WLAN Receiver RF Characteristics
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WFLX-DATA-0001-01.00 Copyright © 2010 LS Research, LLC Page 12 of 28
TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
BLUETOOTH RF Characteristics
BluetoothTransmitter GFSK and EDR Characteristics , Class 1.5
(TA =25°C, VBAT=3.6 V)
Parameter Test
Conditions Min Typ Max BT Spec Unit
GFSK RF Output Power - 9.5 - - dBm
EDR RF Output Powe r - 7 -
Power Control Step Size 2 4 8 2-8 dB
EDR Relative Power -2 1 -4/+1 dB
Bluetooth Receiver Characteristics
(TA =25°C, VBAT=3.6 V)
Parameter Test
Conditions Min Typ Max BT Spec Unit
GFSK Sensitivity BER=0.1% - -92 - -70
dBm
EDR 2 Mbps Sensitivity BER=0.01% - -91 - -70 dBm
EDR 3 Mbps Sensitivity BER=0.01% - -82 - -70 dBm
GFSK Maximum Input Level BER=0.1% - -5 - -20
dBm
EDR 2 Maximum Input Level BER=0.1% - -10 - - dBm
EDR 3 Maximum Input Level BER=0.1% - -10 - - -
The information in this document is subject to change without notice.
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TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
WLAN POWER-UP SEQUENCE
A. After this sequence is completed, the device is in the low VIO-leakage state while in shutdown.
Figure 4-1: TiWi Power-up Sequence Requirements
The following sequen ce describes device power-up from shutdown. Only the WLAN Core is enabled; the
BT and FM cores are disabled.
1. No signals are allowed on the IO pins if no IO power supplied, because the IOs are not 'fail
safe'.Exceptions are CLK_REQ_OUT, SLOWCLK, XTALP and AUD_xxx, which are failsafe and
can tolerate external voltages with no VDDS and DC2DC".
2. VBAT,VIO and SLOWCLK must be available before WL_EN.
3. T
wakeup
= T1 + T2
The duration of T1 is defined as the time from WL _EN=high until Fref is valid for the SoC, T1 ~55ms
The duration of T2 depends on:
– Operating system
– Host enumeration for the SDIO/WSPI
– PLL configuration
– Firmware download
– Releasing the core from reset
– Firmware initialization
The information in this document is subject to change without notice.
Confirm the data is current by downloading the latest revision from www.lsr.com.
WFLX-DATA-0001-01.00 Copyright © 2010 LS Research, LLC Page 14 of 28
TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
WLAN POWER-DOWN SEQUENCE
Figure 4-2: TiWi Module Power-down Sequence Requirements
1. DC_REQ will go low only if WLAN is the only core working. otherwise if another core is working (e.g
BT) it will stay high.
2. CLK_REQ will go low only if WLAN is the only core working. otherwise if another core is working and
using the Fref (e.g BT) it will stay high.
3. If WLAN is the only core that is operating, WL_EN must remain de-asserted for at least 64μsec before
it is re-asserted.
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TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
BLUETOOTH POWER-UP SEQUENCE
The following sequen ce describes device powerup from shutdown. Only the BT core is enabled; the
WLAN core is disabled.
Power up requirem ents:
1. No signals are allowed on the IO pins if no IO power supplied, because the IOs are not 'failsafe'.
Exceptions are CLK_REQ_OUT, SLOWCLK, XTALP and AUD_xxx, which are failsafe and can tolerate
external voltages with no VDDS and DC2DC.
2. VDDS and SLOWCLK must be stable before releasi ng BT_EN.
3. Fast clock must be stable maximum 55 ms after BT_EN goes HIGH.
The information in this document is subject to change without notice.
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Figure 4-3. BT Power-up Sequence
TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
BLUETOOTH POWER-DOWN SEQUENCE
Figure 4-4. BT Power-down Sequence
The TiWi module indicates completion of BT power up sequence by asserting RTS low. This occurs up to
100 ms after BT_EN goes high.
The information in this document is subject to change without notice.
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TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
ENABLE SCHEME
The module has 3 enable pi ns, one for each core: WL_EN, and BT_EN and FM_EN. Presently, there are 2
modes of active operation now supported: WLAN and BT. It is recommended that the FM_EN pin be grounded to
disable the FM section. It is also recommended that the FM section be disabled by Bluetooth HCI commands.
1. Each core is operated independently by asserting each EN to Logic '1'. in this mode it is possible to
control each core asynchronou sly and independently.
2. BT mode operation. WLAN will be operated through WL_EN asynchronously independently
of BT
IRQ OPERATION
1. The default state of the WLAN_IRQ prior to firmware initialization is 0.
2. During firmware initialization, the WLAN_IRQ is configured by the SDIO module; a WLAN_IRQ
changes its state to 1.
3. A WLAN firmware interrupt is handled as follows:
a. The WLAN firmware creates an Interrupt-to-Host, indicated by a 1-to-0 transition on the
WLAN_IRQ line (host must be configured as active-low or falling-edge detect).
b. After the host is available, depending on the interrupt priority and other host tasks, it masks the
firmware interrupt. The WLAN_IRQ line returns to 1 (0-to-1 transition on the WLAN_IRQ line).
c. The host reads the internal register status to determine the interrupt sources - the register is
cleared after the read.
d. The host processes in sequence all the interrupts read from this register
e. The host unmasks the firmware interrupt s.
4.
The host is ready to receive another interrupt from the WLAN device.
The information in this document is subject to change without notice.
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WFLX-DATA-0001-01.00 Copyright © 2010 LS Research, LLC Page 18 of 28
TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
SLOW (32 KHZ) CLOCK SOURCE REQUIREMENTS
Characteristics(1)ConditionSymMinTypMaxUnit
Inputslowclockfrequency32768 Hz
InputslowclockaccuracyWLAN,BT ±150ppm
InputtransitiontimeTr/Tf‐10%to90%Tr/Tf100 ns
Frequencyinputdutycycle30 50 70 %
InputvoltagelimitsSquarewave,DC‐coupledVIH0.65XVDDSVDDSVpeak
VIL0 0.35XVDDS
Inputimpedence1MW
Inputcapacitance5pF
Riseandfalltime100 ns
Phasenoise1kHz–125dBc/Hz
1)Slowclockisafailsafeinput
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WFLX-DATA-0001-01.00 Copyright © 2010 LS Research, LLC Page 19 of 28
TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
BT HCI UART
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WFLX-DATA-0001-01.00 Copyright © 2010 LS Research, LLC Page 20 of 28
TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
SDIO INTERFACE TIMING
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WFLX-DATA-0001-01.00 Copyright © 2010 LS Research, LLC Page 21 of 28
TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
SDIO CLOCK TIMING
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WFLX-DATA-0001-01.00 Copyright © 2010 LS Research, LLC Page 22 of 28
TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
APPLICATION SCHEMATIC
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TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
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WFLX-DATA-0001-01.00 Copyright © 2010 LS Research, LLC Page 24 of 28
SOLDERING RECOMMENDATIONS
Recommended Reflow Profile
• Ramp up rate (from Tsoakmax to Tpeak)
3º/sec max
• Minimum Soak Temperature 150°C
• Maximum Soak Temperature 200°C
• Soak Time 60-120 sec
• TLiquidus 217°C
• Time above TL 60-150 sec
• Tpeak 260°C
• Time within 5º of Tpeak 20-30 sec
• Time from 25º to Tpeak 8 min max
• Ramp down rate 6°C/sec max
• Achieve the brightest possible solder fillets
with a good shape and low contact angle.
Lead (Pb) Free Soldering Paste
Use of a “No Clean” Lead (Pb) free
Tin/Silver/Copper solder paste is strongly
recommended. Melting temperature 216-221°C.
Note: The quality of solder joints on
the castellations (‘half vias’) where
they contact the host board should
meet the appropriate IPC
Specification. See IPC-A-610-D
Acceptability of Electronic
Assemblies, section 8.2.4 Castellated
Terminations.”
The soldering temperatures and profile chosen
depends on additional factors such as choice of
soldering paste, size, thickness and other
properties of the host board.
Cleaning
In general, cleaning the populated modules is
strongly discouraged. Residuals under the
module cannot be easily removed with any
cleaning process.
• Cleaning with water can lead to capillary
effects where water is absorbed into the gap
between the host board an d the module.
The combination of soldering flux residuals
and encapsulated water could lead to short
circuits between neighboring pads. Water
could also damage any stickers or labels.
• Cleaning with alcohol or a similar organic
solvent will likely flood soldering flux
residuals into the RF shi eld, which is not
accessible for post-washing inspection. The
solvent could also damage any stickers or
labels.
• Ultrasonic cleaning could damage the
module permanently.
Consider using a “no clean”
soldering paste and thus eliminate
the post-soldering cleaning step
completely.
Optical Inspection
After soldering the Module to the host board,
consider optical inspection to check the
following:
• Proper alignment and centering of the
module over the pads.
• Proper solder joints on all pads.
• Excessive solder or contacts to neigh boring
pads, or vias.
Repeating Reflow Soldering
Only a single reflow soldering
process is encouraged for host
boards.
TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
Wave Soldering
If wave soldering is required on the host boards
due to the presence of leaded components,
only a single wave soldering process on the
side opposite the module is encouraged.
Hand Soldering
Hand soldering is possible. Use a soldering
iron temperature setting equivalent to 350°C,
follow IPC recommendations/reference
document IPC-7711.
Rework
The TiWi module can be unsoldered from the
host board. Use of a hot air rework tool and hot
plate for pre-heating from underneath is
recommended. Avoid overheating.
Never attempt a rework on the
module itself, e.g. replacing
individual components. Such actions
will terminate warranty coverage.
Additional Grounding
Attempts to improve module or system
grounding by soldering braids, wires, or cables
onto the module RF shield cover is done at the
customers own risk. The numerous ground
pins at the module perimeter should be
sufficient for optimum immunity to external RF
interference.
SHIPPING, HANDLING, AND STORAGE
Shipping
Bulk orders of the TiWi modules are delivered
in trays of TBD.
Handling
The TiWi modules are designed and packaged
to be processed in an automated assembly line.
Warning! The TiWi modules contain
a highly sensitive electronic circuitry.
Handling without proper ESD
protection may destroy or damage
the module permanently.
Warning! According to JEDEC ISP,
the TiWi modules are moisture
sensitive devices. Appropriate
handling instructions and
precautions are summarized in
Section 2.1. Read carefully to
prevent permanent damage due to
moisture intake.
Moisture Sensitivity Level (MSL)
MSL 3, per J-STD-033
Storage
Storage/shelf life in sealed bags is 12 months at
<40°C and <90% relative humidity.
AGENCY CERTIFICATIONS
FCC ID: TBD, 15.247.
IC ID: TBD, RSS 210
ETSI: The European Telecommunications
Standards Institute. It produces the radio and
communication standards for Europe. Our
testing is to the ETSI standard EN 300 328,
which is the portion of the relevant directives
needed for a radio to obtain a CE mark.
See the User’s Guide for detailed information
regarding agency approvals.
The information in this document is subject to change without notice.
Confirm the data is current by downloading the latest revision from www.lsr.com.
WFLX-DATA-0001-01.00 Copyright © 2010 LS Research, LLC Page 25 of 28
TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
MECHANICAL DATA
1.0 mm pitch througout
2.0 mm between antenna terminal and ground s
1.0 mm from each corner
13.0 mm
Figure 4: Module Mechanical Dimensions (Maximum Module Height = 1.9 mm)
Figure 5: Soldering Footprint for Host Board and Module Placement (PAD details TBD)
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WFLX-DATA-0001-01.00 Copyright © 2010 LS Research, LLC Page 26 of 28
TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
MODULE REVISION HISTORY
Rev A
• Initial production release.
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WFLX-DATA-0001-01.00 Copyright © 2010 LS Research, LLC Page 27 of 28
TiWi TRANSCEIVER MODULE
LS240-WI-01-A20 DATASHEET
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WFLX-DATA-0001-01.00 Copyright © 2010 LS Research, LLC Page 28 of 28
CONTACTING LS RESEARCH
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Cedarburg, WI 53012-2636
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Tel: 1(262) 375-4400
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Website www.lsr.com
Technical Support support@lsr.com
Sales Contact sales@lsr.com
The information in this document is provided in connection with LS Research (hereafter referred to as “LSR”)
products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by
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PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL LSR BE LIABLE FOR ANY
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