3.5x2.8mm PHOTOTRANSISTOR Part Number: AA3528P3S Description Features z Mechanically and spectrally matched to the infrared emitting Made with NPN silicon phototansistor chips. LED lamp. z Package : 1500pcs / reel. z Moisture sensitivity level : level 3. z RoHS compliant. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.25(0.01") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SPEC NO: DSAL0864 REV NO: V.2 DATE: APR/09/2011 PAGE: 1 OF 5 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1201006871 Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter of the nozzle should be as large as possible. 4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. SPEC NO: DSAL0864 REV NO: V.2 DATE: APR/09/2011 PAGE: 2 OF 5 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1201006871 Electrical / Optical Characteristics at TA=25C Symbol Parameter Min. VBR CEO Collector-to-Emitter Breakdown Voltage VBR ECO Emitter-to-Collector Breakdown Voltage VCE (SAT) Collector-to-Emitter Saturation Voltage Collector Dark Current I CEO Typ. Max. Units Test Conditions 30 V IC=100uA Ee=0mW/c 5 V IE=100uA Ee=0mW/c 0.8 V IC=2mA Ee=20mW/c 100 nA VCE=10V Ee=0mW/c TR Rise Time (10 to 90 ) 15 us TF Fall Time (90 to 10 ) 15 us 0.4 mA I (ON) On State Collector Current 0.2 VCE = 5V IC=1mA RL=1000 VCE = 5V Ee=1mW/c =940nm Absolute Maximum Ratings at TA=25C Parameter Max.Ratings Collector-to-Emitter Voltage 30V Emitter-to-Collector Voltage 5V Power Dissipation at (or below) 25C Free Air Temperature 100mW Operating Temperature -40C To +85C Storage Temperature -40C To +85C SPEC NO: DSAL0864 REV NO: V.2 DATE: APR/09/2011 PAGE: 3 OF 5 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1201006871 AA3528P3S Reflow soldering is recommended and the soldering profile is shown below. Other soldering methods are not recommended as they might cause damage to the product. Recommended Soldering Pattern (Units : mm; Tolerance: 0.1) Reel Dimension Tape Specifications (Units : mm) SPEC NO: DSAL0864 REV NO: V.2 DATE: APR/09/2011 PAGE: 4 OF 5 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1201006871 PACKING & LABEL SPECIFICATIONS AA3528P3S SPEC NO: DSAL0864 REV NO: V.2 DATE: APR/09/2011 PAGE: 5 OF 5 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1201006871