SPEC NO: DSAL0864 REV NO: V.2 DATE: APR/09/2011 PAGE: 1 OF 5
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1201006871
3.5x2.8mm PHOTOTRANSISTOR
Part Number: AA3528P3S
Features
zMechanically and spectrally matched to the infrared emitting
LED lamp.
zPackage : 1500pcs / reel.
zMoisture sensitivity level : level 3.
zRoHS compliant.
Description
Made with NPN silicon phototansistor chips.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.
4. The device has a single mounting surface. The device must be mounted according to the specifications.
SPEC NO: DSAL0864 REV NO: V.2 DATE: APR/09/2011 PAGE: 2 OF 5
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1201006871
Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might lead to damage and premature failure of the LED.
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
damage the internal circuitry.
4.1. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diame-
ter of the nozzle should be as large as possible.
4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup
and avoid damage during production.
5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of
leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.
SPEC NO: DSAL0864 REV NO: V.2 DATE: APR/09/2011 PAGE: 3 OF 5
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1201006871
Electrical / Optical Characteristics at TA=25°C
Absolute Maximum Ratings at TA=25° C
Symbol Parameter Min. Typ. Max. Units Test Conditions
VBR CEO Collector-to-Emitter Breakdown Voltage 30 V IC=100uA
Ee=0mW/c ㎡
VBR ECO Emitter-to-Collector Breakdown Voltage 5 V IE=100uA
Ee=0mW/c ㎡
VCE (SAT) Collector-to-Emitter Saturation Voltage 0.8 V IC=2mA
Ee=20mW/c ㎡
I CEO Collector Dark Current 100 nA VCE=10V
Ee=0mW/c ㎡
TR Rise Time (10％ to 90％ ) 15 us
VCE = 5V
IC=1mA
RL=1000Ω
TF Fall Time (90％ to 10％ ) 15 us
I (ON) On State Collector Current 0.2 0.4 mA
VCE = 5V
Ee=1mW/c ㎡
λ=940nm
Parameter Max.Ratings
Collector-to-Emitter Voltage 30V
Emitter-to-Collector Voltage 5V
Power Dissipation at (or below) 25°C Free Air Temperature 100mW
Operating Temperature -40°C To +85°C
Storage Temperature -40°C To +85°C
SPEC NO: DSAL0864 REV NO: V.2 DATE: APR/09/2011 PAGE: 4 OF 5
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1201006871
AA3528P3S
Recommended Soldering Pattern
(Units : mm; Toleranc e: ± 0.1)
Tape Specifications
(Units : mm)
Reel Dimension
Reflow soldering is recommended and the soldering profile is shown below.
Other soldering methods are not recommended as they might cause damage to the product.
SPEC NO: DSAL0864 REV NO: V.2 DATE: APR/09/2011 PAGE: 5 OF 5
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1201006871
PACKING & LABEL SPECIFICATIONS AA3528P3S
