PE41901 Document Category: Product Specification UltraCMOS(R) Image Reject Mixer, 10-19 GHz Features Figure 1 * PE41901 Functional Diagram * Complete MMIC mixer solution IF1 * Double balanced high LO-RF isolation of 38 dB IF2 * Conversion loss of 10 dB 90 Coupler * Image rejection of 25 dB 0 * Ku band coverage and broad IF frequency range support RF * Packaging - 24-lead 4 x 4 x 0.85 mm QFN Applications LO 90 * Very small aperture terminal (VSAT) * Point-to-point communication system * Test and measurement (T&M) Product Description The PE41901 is a passive double balanced, Ku band image reject mixer with high dynamic range performance and high local oscillator (LO) isolation capable of operation up to 19 GHz. It can be used as an upconverter or a downconverter. The PE41901 operates with single-ended signals on the radio frequency (RF) and LO ports. The intermediate frequency (IF) port accepts broadband quadrature signals from DC-4 GHz. The device includes two mixers, an LO path 90 coupler and RF port baluns on a single die. Integrating this functionality on a single die reduces LO leakage and improves LO-RF isolation while minimizing board space and design effort. In addition, no external blocking capacitors are required if 0 VDC is present on the LO or RF pins. The PE41901 image reject mixer is ideal for Ku band earth terminals such as very small aperture terminal (VSAT) block upconverters, point-to-point microwave links and test and measurement (T&M) applications. The PE41901 is manufactured on Peregrine's UltraCMOS(R) process, a patented variation of silicon-on-insulator (SOI) technology on a sapphire substrate, offering the performance of GaAs with the economy and integration of conventional CMOS. (c)2015-2016, Peregrine Semiconductor Corporation. All rights reserved. * Headquarters: 9380 Carroll Park Drive, San Diego, CA, 92121 Product Specification DOC-66551-3 - (09/2016) www.psemi.com PE41901 Image Reject Mixer Absolute Maximum Ratings Exceeding absolute maximum ratings listed in Table 1 may cause permanent damage. Operation should be restricted to the limits in Table 2. Operation between operating range maximum and absolute maximum for extended periods may reduce reliability. ESD Precautions When handling this UltraCMOS device, observe the same precautions as with any other ESD-sensitive devices. Although this device contains circuitry to protect it from damage due to ESD, precautions should be taken to avoid exceeding the rating specified in Table 1. Latch-up Immunity Unlike conventional CMOS devices, UltraCMOS devices are immune to latch-up. Table 1 * Absolute Maximum Ratings for PE41901 Parameter/Condition Min Max Unit RF input power, 50 +10 dBm IF input power, 50 +10 dBm LO input power, 50 +25 dBm Maximum junction temperature +150 C +150 C ESD voltage HBM, all pins(1) 250 V ESD voltage CDM, all pins(2) 1000 V Storage temperature range -65 Notes: 1) Human body model (MIL-STD 883 Method 3015). 2) Charged device model (JEDEC JESD22-C101). Recommended Operating Conditions Table 2 lists the recommended operating conditions for the PE41901. Devices should not be operated outside the recommended operating conditions listed below. Table 2 * Recommended Operating Conditions for PE41901 Parameter Min Max Unit RF input power, PRF, 50 +5 dBm IF input power, PIF, 50 +5 dBm +20 dBm +105 C LO input power, PLO, 50 +10 Operating temperature range -40 Page 2 Typ +25 DOC-66551-3 - (09/2016) www.psemi.com PE41901 Image Reject Mixer Electrical Specifications Table 3 provides the PE41901 key electrical specifications at +25 C (Z = 50), unless otherwise specified. Table 3 * PE41901 Electrical Specifications Parameter Condition Min Typ Max Unit RF frequency, fRF 10 19 GHz IF frequency, fIF DC 4 GHz LO frequency, fLO 12 19 GHz 11 12 dB dB fRF = 14 GHz Conversion loss PLO = +17 dBm PIF = -5 dBm fRF = 14 GHz fIF = 1 GHz, upper sideband (USB) and lower sideband (LSB) 10 11 fIF = 4 GHz, USB and LSB fIF = 1 GHz, USB Image rejection(1) PLO = +17 dBm fIF = 1 GHz, LSB PIF = -5 dBm fIF = 4 GHz, USB 22 17 20 25 20 22 dB dB dB LO to RF isolation fLO = 12 GHz, PLO = +17 dBm 35 38 dB LO to IF isolation fLO = 12 GHz, PLO = +17 dBm 20 23 dB RF return loss fRF = 14 GHz, PLO = +15 dBm, PIF/RF = 0 dBm 10 dB IF return loss fIF = 1 GHz, PLO = +15 dBm, PIF/RF = 0 dBm 10 dB LO return loss fLO = 12 and 14 GHz, PLO = 0 dBm 12 dB Input 1dB compression point(2) fRF = 14 GHz, fIF = 1 GHz, PLO = +17 dBm, USB and LSB 10 dBm Input IP2 fRF = 14 GHz, fIF1 = 1 GHz, fIF2 = 1.01 GHz, PLO = +17 dBm, PIF = -5 dBm, USB and LSB 45 dBm Input IP3 fRF = 14 GHz, fIF1 = 1 GHz, fIF2 = 1.01 GHz, PLO = +17 dBm, PIF = -5 dBm, USB and LSB 21 dBm 18 Notes: 1) Image rejection is measured in upconversion mode. IF1 and IF2 quadrature input signals are generated using a pair of phase locked signal generators. Employed method eliminates errors associated with traditional 90 hybrid. 2) The input P1dB compression point is a linearity figure of merit. Refer to Table 2 for the operating input power (50). DOC-66551-3 - (09/2016) Page 3 www.psemi.com PE41901 Image Reject Mixer Thermal Data MxN Spurious Outputs Psi-JT (JT), junction top-of-package, is a thermal metric to estimate junction temperature of a device on the customer application PCB (JEDEC JESD51-2). Table 5 and Table 6 show the spurious outputs and LO spurious harmonics of the PE41901. Table 5 * Spurious Outputs(*) JT = (TJ - TT)/P nLO where JT = junction-to-top of package characterization parameter, C/W TJ = die junction temperature, C mIF 0 1 2 3 4 0 X 6 21 20 16 1 23 X 36 49 X TT = package temperature (top surface, in the center), C 2 58 69 52 62 X P = power dissipated by device, Watts 3 47 60 59 X X 4 28 17 38 X X Table 4 * Thermal Data for PE41901 Parameter Note: * Measured in upconversion mode: PRF = -23 dBm @ 14 GHz; Typ Unit JT 28 C/W JA, junction-to-ambient thermal resistance 75 C/W PIF = -10 dBm @ 4 GHz; PLO = +20 dBm @ 10 GHz,. All values in dBc below RF level, measured at RF port. Table 6 * LO Spurious Harmonics(*) nLO Spur at RF Port LO Freq (GHz) 1 2 3 4 10 (PRF = -32 dBm) X 4 14 10 12 (PRF = -25 dBm) X 2 24 X 14 (PRF = -25 dBm) X 10 X X 16 (PRF = -16 dBm) X 16 X X 18 (PRF = -17 dBm) X 13 X X Note: * Measured in upconversion mode: PLO = +17 dBm. Values in dBc below LO level, measured at RF port. Page 4 DOC-66551-3 - (09/2016) www.psemi.com PE41901 Image Reject Mixer Typical Performance Data Figure 2-Figure 23 show the typical performance data at +25 C, PLO = +17 dBm, PIF = -5 dBm (Z = 50), unless otherwise specified. Figure 2 * Conversion Loss vs USB/LSB, fIF = 1 GHz USB LSB 0 Conversion Loss (dB) -2 -4 -6 -8 -10 -12 -14 -16 -18 -20 10 11 12 13 14 15 16 17 18 19 20 17 18 19 20 RF Frequency (GHz) Figure 3 * Conversion Loss vs USB/LSB, fIF = 4 GHz USB LSB 0 -2 Conversion Loss (dB) -4 -6 -8 -10 -12 -14 -16 -18 -20 10 11 12 13 14 15 16 RF Frequency (GHz) DOC-66551-3 - (09/2016) Page 5 www.psemi.com PE41901 Image Reject Mixer Figure 4 * USB Conversion Loss vs Temperature, fIF = 1 GHz -40 C +25 C +85 C +105 C 0 Conversion Loss (dB) -2 -4 -6 -8 -10 -12 -14 -16 -18 -20 10 11 12 13 14 15 16 17 18 19 20 18 19 20 RF Frequency (GHz) Figure 5 * LSB Conversion Loss vs Temperature, fIF = 1 GHz -40 C +25 C +85 C +105 C 0 -2 Conversion Loss (dB) -4 -6 -8 -10 -12 -14 -16 -18 -20 10 11 12 13 14 15 16 17 RF Frequency (GHz) Page 6 DOC-66551-3 - (09/2016) www.psemi.com PE41901 Image Reject Mixer Figure 6 * Image Rejection vs USB/LSB, fIF = 1 GHz USB LSB 40 Image Rejection (dB) 35 30 25 20 15 10 5 0 10 11 12 13 14 15 16 17 18 19 20 17 18 19 20 RF Frequency (GHz) Figure 7 * Image Rejection vs USB/LSB, fIF = 4 GHz USB LSB 40 Image Rejection (dB) 35 30 25 20 15 10 5 0 10 11 12 13 14 15 16 RF Frequency (GHz) DOC-66551-3 - (09/2016) Page 7 www.psemi.com PE41901 Image Reject Mixer Figure 8 * USB Image Rejection vs Temperature, fIF = 1 GHz -40 C +25 C +85 C +105 C 40 Image Rejection (dB) 35 30 25 20 15 10 5 0 10 11 12 13 14 15 16 17 18 19 20 18 19 20 RF Frequency (GHz) Figure 9 * LSB Image Rejection vs Temperature, fIF = 1 GHz -40 C +25 C +85 C +105 C 40 Image Rejection (dB) 35 30 25 20 15 10 5 0 10 11 12 13 14 15 16 17 RF Frequency (GHz) Page 8 DOC-66551-3 - (09/2016) www.psemi.com PE41901 Image Reject Mixer Figure 10 * Input 1dB Compression Point (P1dB) vs USB/LSB, fIF = 1 GHz USB LSB 20 18 Input P1dB (dBm) 16 14 12 10 8 6 4 2 0 10 11 12 13 14 15 16 17 18 17 18 19 20 RF Frequency (GHz) Figure 11 * Input 1dB Compression Point (P1dB) vs USB/LSB, fIF = 4 GHz USB LSB 20 18 Input P1dB (dBm) 16 14 12 10 8 6 4 2 0 10 11 12 13 14 15 16 19 20 RF Frequency (GHz) DOC-66551-3 - (09/2016) Page 9 www.psemi.com PE41901 Image Reject Mixer Figure 12 * Input IP3 vs USB/LSB, fIF = 1 GHz USB LSB 30 Input IP3 (dBm) 25 20 15 10 10 11 12 13 14 15 16 17 18 19 20 17 18 19 20 RF Frequency (GHz) Figure 13 * Input IP3 vs USB/LSB, fIF = 4 GHz USB LSB 30 Input IP3 (dBm) 25 20 15 10 5 10 11 12 13 14 15 16 RF Frequency (GHz) Page 10 DOC-66551-3 - (09/2016) www.psemi.com PE41901 Image Reject Mixer Figure 14 * USB Input IP3 vs Temperature, fIF = 1 GHz -40 C +25 C +85 C +105 C 30 28 Input IP3 (dBm) 26 24 22 20 18 16 14 10 11 12 13 14 15 16 17 18 19 20 18 19 20 RF Frequency (GHz) Figure 15 * LSB Input IP3 vs Temperature, fIF = 1 GHz -40 C +25 C +85 C +105 C 30 Input IP3 (dBm) 28 26 24 22 20 18 16 10 11 12 13 14 15 16 17 RF Frequency (GHz) DOC-66551-3 - (09/2016) Page 11 www.psemi.com PE41901 Image Reject Mixer Figure 16 * USB Input IP3 vs Temperature, fRF = 14 GHz and fIF = 1 GHz -40 C +25 C +85 C +105 C Input IP3 (dBm) 25 20 15 10 10 11 12 13 14 15 16 17 16 17 LO Drive (dBm) Figure 17 * LSB Input IP3 vs Temperature, fRF = 14 GHz and fIF = 1 GHz -40 C +25 C 12 13 +85 C +105 C Input IP3 (dBm) 25 20 15 10 10 11 14 15 LO Drive (dBm) Page 12 DOC-66551-3 - (09/2016) www.psemi.com PE41901 Image Reject Mixer Figure 18 * RF Return Loss vs Temperature, PLO = +15 dBm, PIF/RF = 0 dBm -40 C +25 C +85 C +105 C 0 -5 Return Loss (dB) -10 -15 -20 -25 -30 -35 -40 10 11 12 13 14 15 16 17 18 19 20 RF Frequency (GHz) Figure 19 * IF Return Loss vs Temperature, PLO = +15 dBm, PIF/RF = 0 dBm -40C IF1 -40C IF2 +25C IF1 +25C IF2 +85C IF1 +85C IF2 +105C IF1 +105C IF2 0 Return Loss ( dB) -5 -10 -15 -20 -25 0 1 2 3 4 5 6 IF Frequency (GHz) DOC-66551-3 - (09/2016) Page 13 www.psemi.com PE41901 Image Reject Mixer Figure 20 * LO Return Loss vs Temperature, PLO = 0 dBm -40 C +25 C +85 C +105 C 0 -5 Return Loss (dB) -10 -15 -20 -25 -30 -35 -40 -45 -50 10 11 12 13 14 15 16 17 18 19 20 17 18 19 20 LO Frequency (GHz) Figure 21 * LO-IF Isolation vs IF Path IF1 IF2 60 55 50 Ioslation (dB) 45 40 35 30 25 20 15 10 10 11 12 13 14 15 16 LO Frequency (GHz) Page 14 DOC-66551-3 - (09/2016) www.psemi.com PE41901 Image Reject Mixer Figure 22 * LO-IF Isolation vs Temperature/IF Path -40 C/IF1 -40 C/IF2 +25 C/IF1 +25 C/IF2 +85 C/IF1 +85 C/IF2 +105 C/IF1 +105 C/IF2 60 55 50 Isolation (dB) 45 40 35 30 25 20 15 10 10 11 12 13 14 15 16 17 18 19 20 18 19 20 LO Frequency (GHz) Figure 23 * LO-RF Isolation vs Temperature -40 C +25 C +85 C +105 C 60 55 50 Isolation (dB) 45 40 35 30 25 20 15 10 10 11 12 13 14 15 16 17 LO Frequency (GHz) DOC-66551-3 - (09/2016) Page 15 www.psemi.com PE41901 Image Reject Mixer Evaluation Kit The PE41901 evaluation board (EVB) was designed to ease customer evaluation of the PE41901 mixer. The RF, IF and LO ports are connected through 50 transmission lines via SMA connectors J2, J3, J4 and J1, respectively. A 50 through transmission line is available via SMA connectors J5 and J6, which can be used to deembed the loss of the PCB. Please note that this is a generic PCB and is being used for multiple parts. Pin labeled VDD is GND. J25 is not being used for the PE41901. Figure 24 * Evaluation Kit Layout for PE41901 Page 16 DOC-66551-3 - (09/2016) www.psemi.com PE41901 Image Reject Mixer Typical Test Set Up Figure 25 shows the simplified test circuit of the PE41901. The two IF inputs require a quadrature signal to be applied. The figure shows a method of creating this signal using a 90 hybrid. When measuring the mixer, all cable, connector and board losses must be calibrated and compensated for. The EVK includes a through trace that can be used to calibrate out the board loss. The trace length is equivalent to two times the input or output trace lengths. Please note that 90 hybrids have limited bandwidth, so an appropriate hybrid must be selected for the IF range being tested. Figure 25 * Typical Test Set Up for PE41901 Signal Generator 1 GHz -20 dBm IF Loss 90 Hybrid ZAPDQ-2 IF1 1 2 IF2 IF2 RF Loss 90 Coupler 0 LO Loss RF F Signal Generator 14 GHz +17 dBm L O LO Spectrum Analyzer 13 GHz 90 DOC-66551-3 - (09/2016) Page 17 www.psemi.com PE41901 Image Reject Mixer Pin Information Table 7 * Pin Descriptions for PE41901 This section provides pinout information for the PE41901. Figure 26 shows the pin map of this device for the available package. Table 7 provides a description for each pin. GND IF2 port 19 IF2(2) GND RF port 16 20 RF(1) IF2 LO port 21 LO(1) GND 3 22 Ground IF1 GND 23 1, 2, 4-15, 17-20, 22, 24 GND Pin 1 Dot Marking Pin Name 24 Figure 26 * Pin Configuration (Top View) Pin No. 21 Description GND 1 18 GND 23 IF1(2) IF1 port GND 2 17 GND Pad GND Exposed pad. Ground for proper operation LO 3 16 RF GND 4 GND GND Exposed Ground Pad 15 GND 5 14 GND 6 13 GND Notes: 1) The PE41901 does not generate a DC voltage on the LO or RF pins. Consequently, DC blocking capacitors are not required on these pins. If a DC voltage exists on the LO or RF pins due to neighboring components in the application circuit, DC blocking capacitors should be used to protect the PE41901. 7 8 9 10 11 12 GND GND GND GND GND GND 2) IF1 and IF2 are 90 out of phase. Page 18 DOC-66551-3 - (09/2016) www.psemi.com PE41901 Image Reject Mixer Packaging Information This section provides packaging data including the moisture sensitivity level, package drawing, package marking and tape-and-reel information. Moisture Sensitivity Level The moisture sensitivity level rating for the PE41901 in the 24-lead 4 x 4 x 0.85 mm QFN package is MSL1. Package Drawing Figure 27 * Package Mechanical Drawing for 24-lead 4 x 4 x 0.85 mm QFN 0.10 C A 4.00 2.700.05 (2X) 0.400.05 (x24) B 0.50 13 0.60 (x24) 0.30 (x24) 0.50 (x20) 18 (x20) 12 19 4.00 2.700.05 2.75 0.250.05 (x24) 0.10 C 24 7 6 1 2.50 Ref. (2X) Pin #1 Corner BOTTOM VIEW TOP VIEW 0.10 C 0.10 0.05 0.850.05 0.05 C 4.40 Chamfer 0.30 x 45 2.75 4.40 RECOMMENDED LAND PATTERN C A B C ALL FEATURES SEATING PLANE 0.203 Ref. 0.05 C SIDE VIEW Top-Marking Specification Figure 28 * Package Marking Specifications for PE41901 41901 YYWW ZZZZZZ = YY = WW = ZZZZZZ = Pin 1 indicator Last two digits of assembly year Assembly work week Assembly lot code (maximum six characters) DOC-66551-3 - (09/2016) Page 19 www.psemi.com PE41901 Image Reject Mixer Tape and Reel Specification Figure 29 * Tape and Reel Specifications for 24-lead 4 x 4 x 0.85 mm QFN Direction of Feed Section A-A P1 P0 see note 1 T P2 see note 3 D1 D0 A E F see note 3 B0 A0 K0 A0 B0 K0 D0 D1 E F P0 P1 P2 T W0 4.35 4.35 1.10 1.50 + 0.10/ -0.00 1.50 min 1.75 0.10 5.50 0.05 4.00 8.00 2.00 0.05 0.30 0.05 12.00 0.30 A W0 Pin 1 Notes: 1. 10 Sprocket hole pitch cumulative tolerance 0.2 2. Camber in compliance with EIA 481 3. Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole Dimensions are in millimeters unless otherwise specified Page 20 Device Orientation in Tape DOC-66551-3 - (09/2016) www.psemi.com PE41901 Image Reject Mixer Ordering Information Table 8 lists the available ordering codes for the PE41901 as well as available shipping methods. Table 8 * Order Codes for PE41901 Order Codes Description Packaging Shipping Method PE41901A-X PE41901 image reject mixer Green 24-lead 4 x 4 mm QFN 500 units/T&R EK41901-01 Evaluation kit Evaluation kit 1/box Document Categories Advance Information Product Brief The product is in a formative or design stage. The datasheet contains design target specifications for product development. Specifications and features may change in any manner without notice. This document contains a shortened version of the datasheet. For the full datasheet, contact sales@psemi.com. Preliminary Specification Not Recommended for New Designs (NRND) This product is in production but is not recommended for new designs. The datasheet contains preliminary data. Additional data may be added at a later date. Peregrine reserves the right to change specifications at any time without notice in order to supply the best possible product. Product Specification The datasheet contains final data. In the event Peregrine decides to change the specifications, Peregrine will notify customers of the intended changes by issuing a CNF (Customer Notification Form). End of Life (EOL) This product is currently going through the EOL process. It has a specific last-time buy date. Obsolete This product is discontinued. Orders are no longer accepted for this product. Sales Contact For additional information, contact Sales at sales@psemi.com. Disclaimers The information in this document is believed to be reliable. However, Peregrine assumes no liability for the use of this information. Use shall be entirely at the user's own risk. No patent rights or licenses to any circuits described in this document are implied or granted to any third party. Peregrine's products are not designed or intended for use in devices or systems intended for surgical implant, or in other applications intended to support or sustain life, or in any application in which the failure of the Peregrine product could create a situation in which personal injury or death might occur. Peregrine assumes no liability for damages, including consequential or incidental damages, arising out of the use of its products in such applications. Patent Statement Peregrine products are protected under one or more of the following U.S. patents: patents.psemi.com Copyright and Trademark (c)2015-2016, Peregrine Semiconductor Corporation. All rights reserved. The Peregrine name, logo, UTSi and UltraCMOS are registered trademarks and HaRP, MultiSwitch and DuNE are trademarks of Peregrine Semiconductor Corp. Product Specification www.psemi.com DOC-66551-3 - (09/2016)