Application Note 1828
2AN1828.0
March 19, 2013
Quick Start
The inputs are P2A (VIN) and P2B (GND). The outputs are P1A
(VOUT) and P1B (GND). Refer to Figure 1 for connections. There
are two ways to evaluate this evaluation board: I2C/PMBus
programing (Steps 1 through 4) and quick pinstrap power-up
(Step 6).
1. Install the PowerNavigator™ software using the CD included
in the ZL9006M, ZL9010M kit. For PMBus operation, connect
the USB-to-PMBus dongle board to J7 of the ZL9006M,
ZL9010M board and connect the USB cable from the
computer to the dongle board.
2. Connect a power supply capable of sourcing at least 5A to the
input (VIN P2A & GND P2B) of the ZL9006M, ZL9010M
evaluation board, with a voltage between 4.5V to 13.5V.
Connect an electronic load or the device to be powered to the
output (VOUT P1A & GND P1B) of the board. All connections,
the low voltage and high current VOUT lines should be able to
carry the desired load current and should be made as short as
possible.
3. Check the connections of "VOUT select" and "address select".
Make sure that the selections are correct. When changing the
output voltage through the I2C/PMBus, the voltage pinstrap
sets the maximum allowed voltage. Thus, check the pinstrap
setting on J5 before programming to a higher output voltage.
For single board operations, the "address select" connection
can be floating or any address listed on the board. But for
multiple board operations, each board should have a unique
address.
4. Move the ENABLE switch to “DISABLE” and turn on the power
to program the power module using powerNavigator
evaluation software. It allows modification of all
ZL9006/9010M PMBus parameters. See Application Note
AN2033 for PMBus command details. Use the mouse-over
pop-ups for PowerNavigator help.
5. After programming, the ENABLE switch can then be moved to
“ENABLE” and the ZL9006M, ZL9010M can be tested.
Alternately, the PMBus ONOFF, CONFIG, and OPERATION
commands can be used.
6. Pinstrap power-up option: if no I2C/PMBus device is available
to program the power module, the pinstrap option can allow
users to power up the device to check the electrical functions
without I2C/PMBus connections. Simply follow Step 2 to
connect the wires, then turn on the ENABLE switch. There are
two pinstrap functions to be configured: Voltage and PMBus
address. Ensure that input power is turned off, and then set
the address and voltage pinstraps using J4 and J5. If no
voltage is selected on J5, the default output voltage is 1.5V.
For different input and output voltages, the switching frequency
will need to be adjusted, as shown in Table 1. The default
frequency is 615kHz.
Evaluation Board Information
The evaluation board size is 3 inches x 3 inches. It is a 4-layer
board, containing 2-ounce copper on the top and bottom layers
and 1-ounce copper on all internal layers. The board can be used
as a 6A/10A reference design. Refer to the “Layout” section
beginning on page 4. The board is made up of FR4 material and
all components including the solder attachment are lead-free.
Thermal Considerations and Current Derating
Board layout is very critical in order to make the module operate
safely and deliver maximum allowable power. To work in the high
temperature environments and carry large currents, the board
layout needs to be carefully designed to maximize thermal
performance. To achieve this, select enough trace width, copper
weight and the proper connectors.
This evaluation board is designed for running 6A/10A at room
temperature without additional cooling systems needed.
However, if the output voltage is increased or the board is
operated at elevated temperatures, then the available current is
derated. Refer to the derated current curves in the datasheets
(FN8422 and FN7959) to determine the output current available.
For layout of designs using the ZL9006M, ZL9010M, the thermal
performance can be improved by adhering to the following
design tips:
1. Use the top and bottom layers to carry the large current. VOUT,
SW, PGND and VIN should have large, solid planes. Place
enough thermal vias to connect the power planes in different
layers under and around the module.
2. SW pad is switching node that generate switching noise. Keep
the pad under the module. For noise-sensitive applications, it
is recommended to keep SW pads only on the top and inner
layers of the PCB; do not place SW pads exposed to the
outside on the bottom layer of the PCB. To improve the
thermal performance, the SW pads can be extended in the
inner layer, as shown in SW pad on layer 3 (Figure 6). Make
sure that layer 2 and layer 4 have the GND layers to cover the
extended areas of phase pads at layer 3 to avoid noise
coupling.
3. If the ambient temperature is high or the board space is
limited, airflow is needed to dissipate more heat from the
modules. A heat sink can also be applied to the top side of the
module to further improve the thermal performance (heat
sink recommendation: Aavid Thermalloy, part number
375224B00032G, www.aavid.com). Place the heat sink on
the module’s top surface on the power side that has the VIN
and VOUT pads underneath.
TABLE 1. RECOMMENDED FREQUENCY FOR DIFFERENT INPUT AND
OUTPUT VOLTAGES
V0UT--VIN 3.3V 5.0V 12.0V
0.6 - 1.5 300kHz 400kHz 400kHz
1.5 - 2.5 300kHz 615kHz 615kHz
2.5 - 3.6 300kHz 471kHz 800kHz