INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-CPC1961-R07 1
CPC1961
Dual AC Solid State Relays
e3
Pb
Part # Description
CPC1961G 8-Pin Dip (50/Tube)
CPC1961GS 8-Pin Surface Mount (50/Tube)
CPC1961GSTR 8-Pin Surface Mount (1000/Reel)
Parameters Ratings Units
Blocking Voltage 600 VP
AC Operating Voltage 260 Vrms
Load Current 1250 mArms
On State Voltage Drop 3 Vrms (at IL = 250mArms)
1 One Pole Operating
Applications
Features
Description
Ordering Information
Pin Configuration
Programmable Control
Process Control
Power Control Panels
Remote Switching
Gas Pump Electronics
Contactors
Large Relays
Solenoids
Motors
Heaters
Load Current up to 250 mArms
600VP Blocking Voltage
5mA Sensitivity
Zero-Crossing Detection
DC Control, AC Output
Optically Isolated
TTL and CMOS Compatible
Low EMI and RFI Generation
High Noise Immunity
Machine Insertable, Wave Solderable
Flammability Classification Rating of V-0
The CPC1961 is a dual single-pole AC solid state
relay that uses optical coupling with dual monolithic
SCR outputs to produce an alternative to optocoupler
and Triac circuits. The CPC1961 switches are robust
enough to provide up to a 600VP blocking voltage. In
addition, tightly controlled zero cross circuitry ensures
switching of AC loads without the generation of
transients. The input and output circuits are optically
coupled to provide 3750Vrms of isolation and noise
immunity between control and load circuits. As a result
the CPC1961 is well suited for industrial environments
where electromagnetic interference would disrupt the
operation of electromechanical relays. The CPC1961 is
offered in a space saving 8-pin DIP package with two
independent switches.
Approvals
UL Recognized Component: File 69938
CSA Certified Component: Certificate 1172007
ZC
AC Load
AC Load
– LED
+ LED
3
4
6
5
ZC
AC Load
AC Load
– LED
+ LED
1
2
8
7
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2R07
CPC1961
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Absolute Maximum Ratings @ 25ºC
Electrical Characteristics @ 25ºC
Parameter Ratings Units
Blocking Voltage 600 VP
Reverse Input Voltage 5 VP
Input Control Current
Peak (10ms)
50 mA
1A
Input Power Dissipation 1150 mW
Total Package Dissipation 2800 mW
Isolation Voltage, Input to Output 3750 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 6.67 mW / ºC
Parameters Conditions Symbol Min Typ Max Units
Output Characteristics
Operating Voltage Range VL- 20 - 260 Vrms
Load Current 1, Continuous VL=120-240Vrms IL0.005 - 250 mArms
Non-repetitive Single Cycle Surge Current t < 10ms ITSM --1A
Off State Leakage Current VL=600V ILEAK --1µA
On-State Voltage Drop IL=250 mArms ---3V
rms
Critical Rate of Rise 2- dV/dt 500 - - V/µs
Holding Current IF=5 mA IH- 300 - µA
Switching Speeds
Turn-on IF=5 mA ton - - 0.5 cycles
Turn-off toff - - 0.5
Zero-Cross Turn-On Voltage
1st half-cycle - - 5 20 V
Subsequent half-cycles - - - 5 V
Operating Frequency 3- 20 - 500 Hz
Load Power Factor for Guaranteed Turn-On 4- PF 0.25 - - -
Input Characteristics
Input Control Current to Activate 5-I
F- 1.2 5 mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Input Drop-out Voltage - 0.8 - - V
Reverse Input Current VR=5V IR- - 10 µA
Common Characteristics
Input to Output Capacitance - CI/O -3-pF
1 Maximum continuous load current of a single pole or the sum of the load currents with both poles operating simultaneously.
2 Tested in accordance with EIA/NARM standard RS-443.
3 Zero Cross 1st half-cycle @ <100Hz
4 Snubber circuits may be required at low power factors.
5 For high noise environment use at least 10mA LED current.
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CPC1961
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R07
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
LED Forward Voltage Drop (V)
1.23 1.24 1.25 1.26 1.27
Device Count (N)
0
5
10
15
20
25
30
35
Typical LED Forward Voltage Drop
(IF=5mA, TA=25ºC)
On-State Voltage (V)
2.1 2.2 2.3 2.4 2.5
Device Count (N)
0
5
10
15
20
25
Typical On-State Output
Forward Voltage Distribution
(IF=5mA, IL=250mA, TA=25ºC)
Blocking Voltage (VP)
735 740 745 750 755
Device Count (N)
0
5
10
15
20
25
Typical Blocking Voltage Distribution
(IF=0mA, TA=25ºC)
LED Forward Current (mA)
1.10 1.15 1.20 1.25 1.30
Device Count (N)
0
5
10
15
20
Typical IF for Switch Operation
(IL=250mA, TA=25ºC)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
LED Forward Voltage vs. Temperature
IF=50mA
IF=20mA
IF=10mA
IF=5mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
IF On (mA)
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
Typical IF for Switch Operation
vs. Temperature
(IL=250mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
IF Off (mA)
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
Typical IF for Switch Dropout
vs. Temperature
(IL=250mA)
INTEGRATED CIRCUITS DIVISION
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4R07
CPC1961
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-State Voltage (V)
2.05
2.10
2.15
2.20
2.25
2.30
2.35
2.40
2.45
Typical On-State Voltage
vs. Temperature
(IF=5mA, IL=250mA)
-3-2-10123
-300
-200
-100
0
100
200
300
Output Voltage (V)
Output Current (mA)
Typical Output Voltage
vs. Output Current
(IF=5mA, TA=25ºC)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (mArms)
0
50
100
150
200
250
300
Maximum Concurrent
Total Load Current vs. Temperature
(IF=5mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (VP)
710
720
730
740
750
760
770
780
790
Typical Blocking Voltage
vs. Temperature
(IF=0mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage Current (nA)
0
20
40
60
80
100
120
140
Typical Leakage vs. Temperature
Measured Between Pins 5&6 and 7&8
(IF=0mA, VL=600V)
Time (s)
0.001 0.01 0.1 1 10 100
Current (A)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
Maximum Non-Repetitive Surge Current
(TA=25ºC)
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CPC1961
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R07
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
CPC1961G / CPC1961GS MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
CPC1961G / CPC1961GS 250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
e3
Pb
INTEGRATED CIRCUITS DIVISION
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6R07
CPC1961
MECHANICAL DIMENSIONS
Dimensions
mm
(inches)
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.813 ± 0.102
(0.032 ± 0.004)
8-0.800 DIA.
(8-0.031 DIA.) 2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
PCB Land Pattern
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
0.813 ± 0.102
(0.032 ± 0.004)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
CPC1961G
CPC1961GS
INTEGRATED CIRCUITS DIVISION
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1961-R07
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/17/2012
For additional information please visit our website at: www.ixysic.com
7
CPC1961
Dimensions
mm
(inches)
User Direction of Feed
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K1
=4.20
(0.165)
0
K =4.90
(0.193)
P=12.00
(0.472)
W=16.00
(0.63)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
CPC1961GSTR Tape & Reel