Ceramic transient voltage suppressors
SMD multilayer transient voltage suppressors,
standard series
The following products presented in this data sheet are being withdrawn.
Ordering Code Substitute Product Date of
Withdrawal
Deadline Last
Orders
Last Shipments
B72580V0110K062 B72580T0110K062 2012-11-09 2013-03-01 2013-06-01
B72580V0080L062 B72580T0080L062 2012-11-09 2013-03-01 2013-06-01
B72580V0060M062 B72580T0040M062 2012-11-09 2013-03-01 2013-06-01
© EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
EPCOS AG is a TDK Group Company.
Ordering Code Substitute Product Date of
Withdrawal
Deadline Last
Orders
Last Shipments
B72580V0040M062 B72580T0040M062 2012-11-09 2013-03-01 2013-06-01
B72540V0080L062 B72540T0080L062 2012-11-09 2013-03-01 2013-06-01
For further information please contact your nearest EPCOS sales office, which will also support
you in selecting a suitable substitute. The addresses of our worldwide sales network are
presented at www.epcos.com/sales.
EPCOS type designation system for standard series
CT 0603 K 17 G K2
Construction:
CT Single chip with nickel barrier
termination (AgNiSn)
CN Single chip with silver-palladium
termination (AgPd)
CN...K2 Single chip with silver-platinum
termination (AgPt)
Case sizes:
0201
0402
0603
0805
1206
1210
1812
2220
Tolerance of the varistor voltage:
K±10%
L±15%
M±20%
SSpecial tolerance
Maximum RMS operating voltage (VRMS):
17 17 V
Taping mode:
G180-mm reel
AgPt termination
Multilayer varistors (MLVs)
Standard series
Page 2 of 81Please read Cautions and warnings and
Important notes at the end of this document.
Features
ESD acc. to IEC 61000-4-2 level 4
(8 kV contact, 15 kV air discharge)
Surge current up to 1200 A
Bidirectional protection
No derating up to 125°C (for case sizes ≥0603)
Fast response (< 0.5 ns)
RoHS-compatible
CT version suitable for lead-free soldering
PSpice simulation models available
Applications
ESD protection in mobile phones, cordless phones
and accessories
ESD protection in data bus applications
ESD protection in control electronics, detectors and
sensors, touch screens, plug-in cards, remote
controls
Design
Multilayer technology
Lack of plastic or epoxy encapsulation for
flammability rating better than UL 94 V-0
Termination (see “Soldering directions”):
CT types with nickel barrier terminations (AgNiSn),
recommended for lead-free soldering, and
compatible with tin/lead solder.
CN types with silver-palladium terminations
(AgPd) only suitable for reflow and wave soldering
with solder on tin/lead basis.
CN...K2 types with silver-platinum terminations
(AgPt) suitable for reflow lead-free soldering.
V/I characteristics and derating curves
V/I and derating curves are attached to the data sheet.
The curves are sorted by VRMS and then by case size,
which is included in the type designation.
Single chip
Internal circuit
Available case sizes:
EIA Metric
0201 0603
0402 1005
0603 1608
0805 2012
1206 3216
1210 3225
1812 4532
2220 5750
Multilayer varistors (MLVs)
Standard series
Page 3 of 81Please read Cautions and warnings and
Important notes at the end of this document.
General technical data
Maximum RMS operating voltage VRMS,max 4 ... 60 V
Maximum DC operating voltage VDC,max 5.5 ... 85 V
Maximum surge current (8/20 µs) Isurge,max 10 ... 1200 A
Maximum energy absorption (2 ms) Wmax 7.5 ... 12000 mJ
Maximum power dissipation Pdiss,max 3 ... 20 mW
Maximum clamping voltage (8/20 µs) Vclamp,max 17 ... 165 V
Operating temperature for case size 0201, 0402 Top 40/+85 °C
for case size ≥0603 Top 55/+125 °C
Storage temperature for case size 0201, 0402 LCT/UCT 40/+125 °C
for case size ≥0603 LCT/UCT 55/+150 °C
Multilayer varistors (MLVs)
Standard series
Page 4 of 81Please read Cautions and warnings and
Important notes at the end of this document.
Temperature derating
Climatic category:
40/+85 °C for case size 0201 and 0402
Climatic category:
55/+125 °C for case size ≥0603
Multilayer varistors (MLVs)
Standard series
Page 5 of 81Please read Cautions and warnings and
Important notes at the end of this document.
Electrical specifications and ordering codes
Maximum ratings (Top,max)
Type Ordering code VRMS,max
V
VDC,max
V
Isurge,max
(8/20 µs)
A
Wmax
(2 ms)
mJ
Pdiss,max
mW
Top,max
°C
CN standard series
CN1812M4G B72580V0040M062 4 5.5 500 800 15 +125
CN2220M4G B72540V0040M062 4 5.5 1000 1400 20 +125
CN1812M6G B72580V0060M062 6 8 500 1000 15 +125
CN2220M6G B72540V0060M062 6 8 1200 3600 20 +125
CN1812L8G B72580V0080L062 8 11 800 1800 15 +125
CN2220L8G B72540V0080L062 8 11 1200 4200 20 +125
CN1812K11G B72580V0110K062 11 14 800 1900 15 +125
CN2220K11G B72540V0110K062 11 14 1200 5400 20 +125
CN1812K14G B72580V0140K062 14 18 800 2300 15 +125
CN1812K14GK2 B72582V0140K062 14 18 800 2300 15 +125
CN2220K14G B72540V0140K062 14 18 1200 5800 20 +125
CN1812K17G B72580V0170K062 17 22 800 2700 15 +125
CN2220K17G B72540V0170K062 17 22 1200 7200 20 +125
CN1812K20G B72580V0200K062 20 26 800 3000 15 +125
CN2220K20G B72540V0200K062 20 26 1200 7800 20 +125
CN2220K20GK2 B72542V0200K062 20 26 1200 7800 20 +125
CN1812K25G B72580V0250K062 25 31 800 3700 15 +125
CN2220K25G B72540V0250K062 25 31 1200 9600 20 +125
CN2220K25GK2 B72542V0250K062 25 31 1200 9600 20 +125
CN1812K30G B72580V0300K062 30 38 800 4200 15 +125
CN1812K30GK2 B72582V0300K062 30 38 800 4200 15 +125
CN2220K30G B72540V0300K062 30 38 1200 12000 20 +125
CN2220K30GK2 B72542V0300K062 30 38 1200 12000 20 +125
CN1812K35GK2 B72582V0350K062 35 45 500 4000 15 +125
CN2220K35GK2 B72542V0350K062 35 45 1000 7700 20 +125
CN2220K40GK2 B72542V0400K062 40 56 1000 9000 20 +125
CT standard series
CT0201S4AG B72440T0040S160 4 5.5 - - - +85
CT0402M4G B72590T0040M060 4 5.5 20 7.5 3 +85
CT0603M4G B72500T0040M060 4 5.5 30 100 3 +125
CT0805M4G B72510T0040M062 4 5.5 100 100 5 +125
CT1206M4G B72520T0040M062 4 5.5 150 300 8 +125
CT1210M4G B72530T0040M062 4 5.5 250 400 10 +125
CT0603M6G B72500T0060M060 6 8 30 100 3 +125
Multilayer varistors (MLVs)
Standard series
Page 6 of 81Please read Cautions and warnings and
Important notes at the end of this document.
1) Measured @ 1 MHz, 1 V
Characteristics (TA=25°C)
Type VV
(1 mA)
V
∆VV
%
Vclamp,max
V
Iclamp
(8/20 µs)
A
Ctyp
(1 kHz, 1 V)
pF
CN standard series
CN1812M4G 8 ±20 17 5 10000
CN2220M4G 8 ±20 17 10 24000
CN1812M6G 11 ±20 25 5 8000
CN2220M6G 11 ±20 25 10 20000
CN1812L8G 15 ±15 30 5 6000
CN2220L8G 15 ±15 30 10 16000
CN1812K11G 18 ±10 33 5 5000
CN2220K11G 18 ±10 33 10 12000
CN1812K14G 22 ±10 38 5 4500
CN1812K14GK2 22 ±10 38 5 4500
CN2220K14G 22 ±10 38 10 10000
CN1812K17G 27 ±10 44 5 4000
CN2220K17G 27 ±10 44 10 9000
CN1812K20G 33 ±10 54 5 3000
CN2220K20G 33 ±10 54 10 7000
CN2220K20GK2 33 ±10 54 10 7000
CN1812K25G 39 ±10 65 5 2500
CN2220K25G 39 ±10 65 10 5000
CN2220K25GK2 39 ±10 65 10 5000
CN1812K30G 47 ±10 77 5 2000
CN1812K30GK2 47 ±10 77 5 2000
CN2220K30G 47 ±10 77 10 4000
CN2220K30GK2 47 ±10 77 10 4000
CN1812K35GK2 56 ±10 90 5 1200
CN2220K35GK2 56 ±10 90 10 2500
CN2220K40GK2 68 ±10 110 10 2000
CT standard series
CT0201S4AG 15 ±20 35 1 221)
CT0402M4G 10 ±20 24 1 2001)
CT0603M4G 8 ±20 19 1 200
CT0805M4G 8 ±20 19 1 700
CT1206M4G 8 ±20 17 1 1500
CT1210M4G 8 ±20 17 2.5 5000
CT0603M6G 11 ±20 27 1 200
Multilayer varistors (MLVs)
Standard series
Page 7 of 81Please read Cautions and warnings and
Important notes at the end of this document.
Electrical specifications and ordering codes
Maximum ratings (Top,max)
Type Ordering code VRMS,max
V
VDC,max
V
Isurge,max
(8/20 µs)
A
Wmax
(2 ms)
mJ
Pdiss,max
mW
Top,max
°C
CT standard series
CT0805M6G B72510T0060M062 6 8 120 200 5 +125
CT1206M6G B72520T0060M062 6 8 200 400 8 +125
CT1210M6G B72530T0060M062 6 8 300 700 10 +125
CT0603K7G B72500T0070K060 7 9 30 100 3 +125
CT0603M7G B72500T0070M060 7 9 30 100 3 +125
CT0603L8G B72500T0080L060 8 11 30 100 3 +125
CT0805L8G B72510T0080L062 8 11 120 200 5 +125
CT1206L8G B72520T0080L062 8 11 200 500 8 +125
CT1210L8G B72530T0080L062 8 11 400 1000 10 +125
CT0402S11AG B72590T0110S160 11 14 20 7.5 3 +85
CT0603K11G B72500T0110K060 11 14 30 200 3 +125
CT0805K11G B72510T0110K062 11 14 120 200 5 +125
CT1206K11G B72520T0110K062 11 14 200 500 8 +125
CT1210K11G B72530T0110K062 11 14 400 1200 10 +125
CT0402L14G B72590T0140L060 14 16 20 10 3 +85
CT0402L14UG B72590T0140L960 14 16 10 10 3 +85
CT0603K14G B72500T0140K060 14 18 30 200 3 +125
CT0603S14BG B72500T0140S160 14 18 30 200 3 +125
CT0805K14G B72510T0140K062 14 18 120 300 5 +125
CT1206K14G B72520T0140K062 14 18 200 500 8 +125
CT1210K14G B72530T0140K062 14 18 400 1500 10 +125
CT0402S17AG B72590T0170S160 17 19 20 10 3 +85
CT0603K17G B72500T0170K060 17 22 30 200 3 +125
CT0805K17G B72510T0170K062 17 22 120 300 5 +125
CT1206K17G B72520T0170K062 17 22 200 600 8 +125
CT1210K17G B72530T0170K062 17 22 400 1700 10 +125
CT0603K20G B72500T0200K060 20 26 30 200 3 +125
CT0805K20G B72510T0200K062 20 26 80 300 5 +125
CT1206K20G B72520T0200K062 20 26 200 700 8 +125
CT1210K20G B72530T0200K062 20 26 400 1900 10 +125
CT0603K25G B72500T0250K060 25 31 30 300 3 +125
CT0805K25G B72510T0250K062 25 31 80 300 5 +125
CT1206K25G B72520T0250K062 25 31 200 1000 8 +125
CT1210K25G B72530T0250K062 25 31 300 1700 10 +125
CT0805K30G B72510T0300K062 30 38 80 300 5 +125
Multilayer varistors (MLVs)
Standard series
Page 8 of 81Please read Cautions and warnings and
Important notes at the end of this document.
1) Measured @ 1 MHz, 1 V
Characteristics (TA=25°C)
Type VV
(1 mA)
V
∆VV
%
Vclamp,max
V
Iclamp
(8/20 µs)
A
Ctyp
(1 kHz, 1 V)
pF
CT standard series
CT0805M6G 11 ±20 27 1 600
CT1206M6G 11 ±20 25 1 1200
CT1210M6G 11 ±20 25 2.5 4000
CT0603K7G 12.5 ±10 27 1 130
CT0603M7G 12.5 ±20 30 1 200
CT0603L8G 15 ±15 33 1 150
CT0805L8G 15 ±15 33 1 500
CT1206L8G 15 ±15 30 1 1000
CT1210L8G 15 ±15 30 2.5 3000
CT0402S11AG 18.4 ±10 35 1 1201)
CT0603K11G 18 ±10 35 1 100
CT0805K11G 18 ±10 35 1 400
CT1206K11G 18 ±10 33 1 800
CT1210K11G 18 ±10 33 2.5 2400
CT0402L14G 23.5 ±15 46 1 471)
CT0402L14UG 23.5 ±15 46 1 471)
CT0603K14G 22 ±10 40 1 100
CT0603S14BG 22 +23/0 42 1 120
CT0805K14G 22 ±10 40 1 350
CT1206K14G 22 ±10 38 1 700
CT1210K14G 22 ±10 38 2.5 2000
CT0402S17AG 32 ±25 59 1 331)
CT0603K17G 27 ±10 46 1 100
CT0805K17G 27 ±10 46 1 400
CT1206K17G 27 ±10 44 1 650
CT1210K17G 27 ±10 44 2.5 1800
CT0603K20G 33 ±10 56 1 90
CT0805K20G 33 ±10 56 1 300
CT1206K20G 33 ±10 54 1 600
CT1210K20G 33 ±10 54 2.5 1500
CT0603K25G 39 ±10 67 1 901)
CT0805K25G 39 ±10 67 1 250
CT1206K25G 39 ±10 65 1 550
CT1210K25G 39 ±10 65 2.5 1200
CT0805K30G 47 ±10 77 1 200
Multilayer varistors (MLVs)
Standard series
Page 9 of 81Please read Cautions and warnings and
Important notes at the end of this document.
Electrical specifications and ordering codes
Maximum ratings (Top,max)
Type Ordering code VRMS,max
V
VDC,max
V
Isurge,max
(8/20 µs)
A
Wmax
(2 ms)
mJ
Pdiss,max
mW
Top,max
°C
CT standard series
CT1206K30G B72520T0300K062 30 38 200 1100 8 +125
CT1210K30G B72530T0300K062 30 38 300 2000 10 +125
CT1206K35G B72520T0350K062 35 45 100 400 8 +125
CT1210K35G B72530T0350K062 35 45 250 2000 10 +125
CT1206K40G B72520T0400K062 40 56 100 500 8 +125
CT1210K40G B72530T0400K062 40 56 250 2300 10 +125
CT1206K50G B72520T0500K062 50 65 100 600 8 +125
CT1210K50G B72530T0500K062 50 65 200 1600 10 +125
CT1206K60G B72520T0600K062 60 85 100 700 8 +125
CT1210K60G B72530T0600K062 60 85 200 2000 10 +125
Characteristics (TA=25°C)
Type VV
(1 mA)
V
∆VV
%
Vclamp,max
V
Iclamp
(8/20 µs)
A
Ctyp
(1 kHz, 1 V)
pF
CT standard series
CT1206K30G 47 ±10 77 1 500
CT1210K30G 47 ±10 77 2.5 1000
CT1206K35G 56 ±10 90 1 200
CT1210K35G 56 ±10 90 2.5 600
CT1206K40G 68 ±10 110 1 250
CT1210K40G 68 ±10 110 2.5 500
CT1206K50G 82 ±10 135 1 120
CT1210K50G 82 ±10 135 2.5 250
CT1206K60G 100 ±10 165 1 100
CT1210K60G 100 ±10 165 2.5 200
Multilayer varistors (MLVs)
Standard series
Page 10 of 81Please read Cautions and warnings and
Important notes at the end of this document.
Dimensional drawing
Dimensions in mm
Case size
EIA / mm
l w h k
0201 / 0603 0.6 ±0.03 0.30 ±0.03 0.33 max. 0.15 ±0.05
0402 / 1005 1.0 ±0.15 0.50 ±0.10 0.6 max. 0.10 ... 0.30
0603 / 1608 1.6 ±0.15 0.80 ±0.10 0.9 max. 0.10 ... 0.40
0805 / 2012 2.0 ±0.20 1.25 ±0.15 1.4 max. 0.13 ... 0.75
1206 / 3216 3.2 ±0.30 1.60 ±0.20 1.7 max. 0.25 ... 0.75
1210 / 3225 3.2 ±0.30 2.50 ±0.25 1.7 max. 0.25 ... 0.75
1812 / 4532 4.5 ±0.40 3.20 ±0.30 2.5 max. 0.25 ... 1.00
2220 / 5750 5.7 ±0.40 5.00 ±0.40 2.5 max. 0.25 ... 1.00
Recommended solder pad layout
Dimensions in mm
Case size
EIA / mm
ABC
0201 / 0603 0.30 0.25 0.30
0402 / 1005 0.60 0.60 0.50
0603 / 1608 1.00 1.00 1.00
0805 / 2012 1.40 1.20 1.00
1206 / 3216 1.80 1.20 2.10
1210 / 3225 2.80 1.20 2.10
1812 / 4532 3.60 1.50 3.00
2220 / 5750 5.50 1.50 4.20
Multilayer varistors (MLVs)
Standard series
Page 11 of 81Please read Cautions and warnings and
Important notes at the end of this document.
Delivery mode
EIA case size Taping Reel size
mm
Packing unit
pcs.
Type Ordering code
0201 Cardboard 180 15000 CT0201S4AG B72440T0040S160
0402 Cardboard 180 10000 CT0402L14G B72590T0140L060
0402 Cardboard 180 10000 CT0402L14UG B72590T0140L960
0402 Cardboard 180 10000 CT0402M4G B72590T0040M060
0402 Cardboard 180 10000 CT0402S11AG B72590T0110S160
0402 Cardboard 180 10000 CT0402S17AG B72590T0170S160
0603 Cardboard 180 4000 CT0603K11G B72500T0110K060
0603 Cardboard 180 4000 CT0603K14G B72500T0140K060
0603 Cardboard 180 4000 CT0603K17G B72500T0170K060
0603 Cardboard 180 4000 CT0603K20G B72500T0200K060
0603 Cardboard 180 4000 CT0603K25G B72500T0250K060
0603 Cardboard 180 4000 CT0603K7G B72500T0070K060
0603 Cardboard 180 4000 CT0603L8G B72500T0080L060
0603 Cardboard 180 4000 CT0603M4G B72500T0040M060
0603 Cardboard 180 4000 CT0603M6G B72500T0060M060
0603 Cardboard 180 4000 CT0603M7G B72500T0070M060
0603 Cardboard 180 4000 CT0603S14BG B72500T0140S160
0805 Blister 180 3000 CT0805K11G B72510T0110K062
0805 Blister 180 3000 CT0805K14G B72510T0140K062
0805 Blister 180 3000 CT0805K17G B72510T0170K062
0805 Blister 180 3000 CT0805K20G B72510T0200K062
0805 Blister 180 3000 CT0805K25G B72510T0250K062
0805 Blister 180 3000 CT0805K30G B72510T0300K062
0805 Blister 180 3000 CT0805L8G B72510T0080L062
0805 Blister 180 3000 CT0805M4G B72510T0040M062
0805 Blister 180 3000 CT0805M6G B72510T0060M062
1206 Blister 180 3000 CT1206K11G B72520T0110K062
1206 Blister 180 3000 CT1206K14G B72520T0140K062
1206 Blister 180 3000 CT1206K17G B72520T0170K062
1206 Blister 180 3000 CT1206K20G B72520T0200K062
1206 Blister 180 2000 CT1206K25G B72520T0250K062
1206 Blister 180 2000 CT1206K30G B72520T0300K062
1206 Blister 180 2000 CT1206K35G B72520T0350K062
1206 Blister 180 2000 CT1206K40G B72520T0400K062
1206 Blister 180 2000 CT1206K50G B72520T0500K062
1206 Blister 180 2000 CT1206K60G B72520T0600K062
1206 Blister 180 3000 CT1206L8G B72520T0080L062
1206 Blister 180 3000 CT1206M4G B72520T0040M062
1206 Blister 180 3000 CT1206M6G B72520T0060M062
1210 Blister 180 3000 CT1210K11G B72530T0110K062
1210 Blister 180 3000 CT1210K14G B72530T0140K062
1210 Blister 180 3000 CT1210K17G B72530T0170K062
Multilayer varistors (MLVs)
Standard series
Page 12 of 81Please read Cautions and warnings and
Important notes at the end of this document.
EIA case size Taping Reel size
mm
Packing unit
pcs.
Type Ordering code
1210 Blister 180 3000 CT1210K20G B72530T0200K062
1210 Blister 180 2000 CT1210K25G B72530T0250K062
1210 Blister 180 2000 CT1210K30G B72530T0300K062
1210 Blister 180 2000 CT1210K35G B72530T0350K062
1210 Blister 180 2000 CT1210K40G B72530T0400K062
1210 Blister 180 2000 CT1210K50G B72530T0500K062
1210 Blister 180 2000 CT1210K60G B72530T0600K062
1210 Blister 180 3000 CT1210L8G B72530T0080L062
1210 Blister 180 3000 CT1210M4G B72530T0040M062
1210 Blister 180 3000 CT1210M6G B72530T0060M062
1812 Blister 180 1500 CN1812K11G B72580V0110K062
1812 Blister 180 1500 CN1812K14G B72580V0140K062
1812 Blister 180 1500 CN1812K14GK2 B72582V0140K062
1812 Blister 180 1500 CN1812K17G B72580V0170K062
1812 Blister 180 1500 CN1812K20G B72580V0200K062
1812 Blister 180 1000 CN1812K25G B72580V0250K062
1812 Blister 180 1000 CN1812K30G B72580V0300K062
1812 Blister 180 1000 CN1812K30GK2 B72582V0300K062
1812 Blister 180 1000 CN1812K35GK2 B72582V0350K062
1812 Blister 180 1500 CN1812L8G B72580V0080L062
1812 Blister 180 1500 CN1812M4G B72580V0040M062
1812 Blister 180 1500 CN1812M6G B72580V0060M062
2220 Blister 180 1500 CN2220K11G B72540V0110K062
2220 Blister 180 1500 CN2220K14G B72540V0140K062
2220 Blister 180 1500 CN2220K17G B72540V0170K062
2220 Blister 180 1500 CN2220K20G B72540V0200K062
2220 Blister 180 1500 CN2220K20GK2 B72542V0200K062
2220 Blister 180 1000 CN2220K25G B72540V0250K062
2220 Blister 180 1000 CN2220K25GK2 B72542V0250K062
2220 Blister 180 1000 CN2220K30G B72540V0300K062
2220 Blister 180 1000 CN2220K30GK2 B72542V0300K062
2220 Blister 180 1000 CN2220K35GK2 B72542V0350K062
2220 Blister 180 1000 CN2220K40GK2 B72542V0400K062
2220 Blister 180 1500 CN2220L8G B72540V0080L062
2220 Blister 180 1500 CN2220M4G B72540V0040M062
2220 Blister 180 1500 CN2220M6G B72540V0060M062
Multilayer varistors (MLVs)
Standard series
Page 13 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CT0201S4AG
CT0402M4G
Multilayer varistors (MLVs)
Standard series
Page 14 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CT0402S11AG
CT0402L14G
Multilayer varistors (MLVs)
Standard series
Page 15 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CT0402L14UG
CT0402S17AG
Multilayer varistors (MLVs)
Standard series
Page 16 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CT0603M4G
CT0603M6G
Multilayer varistors (MLVs)
Standard series
Page 17 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CT0603K7G
CT0603M7G
Multilayer varistors (MLVs)
Standard series
Page 18 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CT0603L8G
CT0603K11G
Multilayer varistors (MLVs)
Standard series
Page 19 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CT0603K14G
CT0603S14BG
Multilayer varistors (MLVs)
Standard series
Page 20 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CT0603K17G
CT0603K20G
Multilayer varistors (MLVs)
Standard series
Page 21 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CT0603K25G
CT0805M4G
Multilayer varistors (MLVs)
Standard series
Page 22 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CT0805M6G
CT0805L8G
Multilayer varistors (MLVs)
Standard series
Page 23 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CT0805K11G
CT0805K14G
Multilayer varistors (MLVs)
Standard series
Page 24 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CT0805K17G
CT0805K20G
Multilayer varistors (MLVs)
Standard series
Page 25 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CT0805K25G
CT0805K30G
Multilayer varistors (MLVs)
Standard series
Page 26 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CT1206M4G
CT1206M6G
Multilayer varistors (MLVs)
Standard series
Page 27 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CT1206L8G
CT1206K11G
Multilayer varistors (MLVs)
Standard series
Page 28 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CT1206K14G
CT1206K17G
Multilayer varistors (MLVs)
Standard series
Page 29 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CT1206K20G
CT1206K25G
Multilayer varistors (MLVs)
Standard series
Page 30 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CT1206K30G
CT1206K35G
Multilayer varistors (MLVs)
Standard series
Page 31 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CT1206K40G
CT1206K50G
Multilayer varistors (MLVs)
Standard series
Page 32 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CT1206K60G
CT1210M4
Multilayer varistors (MLVs)
Standard series
Page 33 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CT1210M6G
CT1210L8G
Multilayer varistors (MLVs)
Standard series
Page 34 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CT1210K11G
CT1210K14G
Multilayer varistors (MLVs)
Standard series
Page 35 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CT1210K17G
CT1210K20G
Multilayer varistors (MLVs)
Standard series
Page 36 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CT1210K25G
CT1210K30G
Multilayer varistors (MLVs)
Standard series
Page 37 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CT1210K35G
CT1210K40G
Multilayer varistors (MLVs)
Standard series
Page 38 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CT1210K50G
CT1210K60G
Multilayer varistors (MLVs)
Standard series
Page 39 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CN1812M4G
CN1812M6G
Multilayer varistors (MLVs)
Standard series
Page 40 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CN1812L8G
CN1812K11G
Multilayer varistors (MLVs)
Standard series
Page 41 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CN1812K14G(K2)
CN1812K17G
Multilayer varistors (MLVs)
Standard series
Page 42 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CN1812K20G
CN1812K25G
Multilayer varistors (MLVs)
Standard series
Page 43 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CN1812K30G(K2)
CN2220M4G
Multilayer varistors (MLVs)
Standard series
Page 44 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CN1812K35GK2
CN2220M6G
Multilayer varistors (MLVs)
Standard series
Page 45 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CN2220L8G
CN2220K11G
Multilayer varistors (MLVs)
Standard series
Page 46 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CN2220K14G
CN2220K17G
Multilayer varistors (MLVs)
Standard series
Page 47 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CN2220K20G(K2)
CN2220K25G(K2)
Multilayer varistors (MLVs)
Standard series
Page 48 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CN2220K30G(K2)
CN2220K35GK2
Multilayer varistors (MLVs)
Standard series
Page 49 of 81Please read Cautions and warnings and
Important notes at the end of this document.
V/I characteristics
CN2220K40GK2
Multilayer varistors (MLVs)
Standard series
Page 50 of 81Please read Cautions and warnings and
Important notes at the end of this document.
Derating curves
Maximum surge current Isurge,max = f (tr, pulse train)
For explanation of the derating curves refer to "General technical information", chapter 2.7.2
CT0402M4G ... S17AG
CT0402L14UG
Multilayer varistors (MLVs)
Standard series
Page 51 of 81Please read Cautions and warnings and
Important notes at the end of this document.
Derating curves
Maximum surge current Isurge,max = f (tr, pulse train)
For explanation of the derating curves refer to "General technical information", chapter 2.7.2
CT0603M4G ... K25G
CT0805M4G
CT1206K35G ... K60G
Multilayer varistors (MLVs)
Standard series
Page 52 of 81Please read Cautions and warnings and
Important notes at the end of this document.
Derating curves
Maximum surge current Isurge,max = f (tr, pulse train)
For explanation of the derating curves refer to "General technical information", chapter 2.7.2
CT0805M6G ... K17G
CT0805K20G ... K30G
Multilayer varistors (MLVs)
Standard series
Page 53 of 81Please read Cautions and warnings and
Important notes at the end of this document.
Derating curves
Maximum surge current Isurge,max = f (tr, pulse train)
For explanation of the derating curves refer to "General technical information", chapter 2.7.2
CT1206M4G
CT1206M6G ... K30G
CT1210K50G ... K60G
Multilayer varistors (MLVs)
Standard series
Page 54 of 81Please read Cautions and warnings and
Important notes at the end of this document.
Derating curves
Maximum surge current Isurge,max = f (tr, pulse train)
For explanation of the derating curves refer to "General technical information", chapter 2.7.2
CT1210M4G CT1210K35G ... K40G
CT1210M6G CT1210K25G ... K30G
Multilayer varistors (MLVs)
Standard series
Page 55 of 81Please read Cautions and warnings and
Important notes at the end of this document.
Derating curves
Maximum surge current Isurge,max = f (tr, pulse train)
For explanation of the derating curves refer to "General technical information", chapter 2.7.2
CT1210L8G ... K20G
CN1812M4G ... M6G
CN1812K35GK2
Multilayer varistors (MLVs)
Standard series
Page 56 of 81Please read Cautions and warnings and
Important notes at the end of this document.
Derating curves
Maximum surge current Isurge,max = f (tr, pulse train)
For explanation of the derating curves refer to "General technical information", chapter 2.7.2
CN1812L8G ... K30G(K2)
CN2220M4G
CN2220K35GK2, CN2220K40GK2
Multilayer varistors (MLVs)
Standard series
Page 57 of 81Please read Cautions and warnings and
Important notes at the end of this document.
Derating curves
Maximum surge current Isurge,max = f (tr, pulse train)
For explanation of the derating curves refer to "General technical information", chapter 2.7.2
CN2220M6G ... K30G(K2)
Multilayer varistors (MLVs)
Standard series
Page 58 of 81Please read Cautions and warnings and
Important notes at the end of this document.
Taping and packing
1 Taping and packing for SMD components
1.1 Blister tape (the taping to IEC 60286-3)
Dimensions in mm
8-mm tape 12-mm tape 16-mm tape
Case size (inch/mm) Case size
(inch/mm)
Case size
(inch/mm)
Tolerance
0508/
1220
0612/
1632
1012/
2532
0603/
1608
0506/
1216
0805/
2012
1206/
3216
1210/
3225
1812/
4532
2220/
5750 3225 4032
A00.9 ±0.10 1.50 1.60 1.90 2.80 3.50 5.10 7.00 8.60 ±0.20
B01.75 ±0.10 1.80 2.40 3.50 3.50 4.80 6.00 8.70 10.60 ±0.20
K01.0 0.80 1.80 2.60 5.00 max.
T 0.30 0.30 0.30 max.
T21.3 1.20 2.50 3.50 5.50 max.
D01.50 1.50 1.50 +0.10/0
D11.00 1.50 1.50 min.
P04.00 4.00 4.00 ±0.101)
P22.00 2.00 2.00 ±0.05
P14.00 8.00 12.00 ±0.10
W 8.00 12.00 16.00 ±0.30
E 1.75 1.75 1.75 ±0.10
F 3.50 5.50 7.50 ±0.05
G 0.75 0.75 0.75 min.
1) ≤±0.2 mm over 10 sprocket holes.
Multilayer varistors (MLVs)
Standard series
Page 59 of 81Please read Cautions and warnings and
Important notes at the end of this document.
Part orientation in tape pocket for blister tape
For discrete chip, case sizes 0603, 0805,
1206, 1210, 1812 and 2220
For array, case sizes 0612
For arrays 0506 and 1012 For filter array, case size 0508
Additional taping information
Reel material Polystyrol (PS)
Tape material Polystyrol (PS) or Polycarbonat (PC) or PVC
Tape break force min. 10 N
Top cover tape strength min. 10 N
Top cover tape peel force 0.2 to 0.6 N for 8-mm tape and 0.2 to 0.8 N for
12-mm tape at a peel speed of 300 mm/min
Tape peel angle Angle between top cover tape and the direction of feed
during peel off: 165°to 180°
Cavity play Each part rests in the cavity so that the angle between
the part and cavity center line is no more than 20°
Multilayer varistors (MLVs)
Standard series
Page 60 of 81Please read Cautions and warnings and
Important notes at the end of this document.
1.2 Cardboard tape (taping to IEC 60286-3)
Dimensions in mm
8-mm tape
Case size (inch/mm) Case size
(inch/mm) Tolerance
0201/0603 0402/1005 0405/1012 0603/1608 1003/2508 0508/1220
A00.38 ±0.05 0.60 1.05 0.95 1.00 1.60 ±0.20
B00.68 ±0.05 1.15 1.60 1.80 2.85 2.40 ±0.20
T 0.35 ±0.02 0.60 0.75 0.95 1.00 0.95 max.
T20.4 min. 0.70 0.90 1.10 1.10 1.12 max.
D01.50 ±0.1 1.50 1.50 +0.10/0
P04.00 ±0.102)
P22.00 ±0.05
P12.00 ±0.05 2.00 4.00 4.00 4.00 4.00 ±0.10
W 8.00 ±0.30
E 1.75 ±0.10
F 3.50 ±0.05
G 1.35 0.75 min.
2) ≤0.2 mm over 10 sprocket holes.
Multilayer varistors (MLVs)
Standard series
Page 61 of 81Please read Cautions and warnings and
Important notes at the end of this document.
Part orientation in tape pocket for cardboard tape
For discrete chip case sizes 0201, 0402, 0603
and 1003
For array case size 0405
For array case size 0508 For filter array, case size 0405
Additional taping information
Reel material Polystyrol (PS)
Tape material Cardboard
Tape break force min. 10 N
Top cover tape strength min. 10 N
Top cover tape peel force 0.1 to 0.65 N at a peel speed of 300 mm/min
Tape peel angle Angle between top cover tape and the direction of feed
during peel off: 165°to 180°
Cavity play Each part rests in the cavity so that the angle between
the part and cavity center line is no more than 20°
Multilayer varistors (MLVs)
Standard series
Page 62 of 81Please read Cautions and warnings and
Important notes at the end of this document.
1.3 Reel packing
Dimensions in mm
8-mm tape 12-mm tape 16-mm tape
180-mm reel 330-mm reel 180-mm reel 330-mm reel 330-mm reel
A 180 3/+0 330 2.0 180 3/+0 330 2.0 330 2.0
W18.4 +1.5/0 8.4 +1.5/0 12.4 +1.5/0 12.4 +1.5/0 16.4 +1.5/0
W214.4 max. 14.4 max. 18.4 max. 18.4 max. 22.4 max.
Leader, trailer
Multilayer varistors (MLVs)
Standard series
Page 63 of 81Please read Cautions and warnings and
Important notes at the end of this document.
1.4 Packing units for discrete chip and array chip
Case size Chip thickness Cardboard tape Blister tape ∅180-mm reel ∅330-mm reel
inch/mm th W Wpcs. pcs.
0201/0603 0.33 mm 8 mm 15000
0402/1005 0.6 mm 8 mm 10000
0405/1012 0.7 mm 8 mm 5000
0506/1216 0.5 mm 8 mm 4000
0508/1220 0.9 mm 8 mm 8 mm 4000
0603/1608 0.9 mm 8 mm 8 mm 4000 16000
0612/1632 0.9 mm 8 mm 3000
0805/2012 0.7 mm 8 mm 3000
0.9 mm 8 mm 3000 12000
1.3 mm 8 mm 3000
1003/2508 0.9 mm 8 mm 4000
1012/2532 1.0 mm 8 mm 2000
1206/3216 0.9 mm 8 mm 3000
1.3 mm 8 mm 3000
1.4 mm 8 mm 2000
1.6 mm 8 mm 2000
1210/3225 0.9 mm 8 mm 3000
1.3 mm 8 mm 3000
1.4 mm 8 mm 2000
1.6 mm 8 mm 2000
1812/4532 1.3 mm 12 mm 1500
1.4 mm 12 mm 1000
1.6 mm 12 mm 4000
2.3 mm 12 mm 3000
2220/5750 1.3 mm 12 mm 1500
1.4 mm 12 mm 1000
2.0 mm 12 mm 3000
2.3 mm 12 mm 3000
3225 3.2 mm 16 mm 1000
4.5 mm 16 mm 1000
4032 3.2 mm 16 mm 1000
4.5 mm 16 mm 1000
Multilayer varistors (MLVs)
Standard series
Page 64 of 81Please read Cautions and warnings and
Important notes at the end of this document.
2 Delivery mode for leaded SHCV varistors
Standard delivery mode for SHCV types is bulk. Alternative taping modes (AMMO pack or taped
on reel) are available upon request.
Packing units for:
Type Pieces
SR6 2000
SR1 / SR2 1000
For types not listed in this data book please contact EPCOS.
Multilayer varistors (MLVs)
Standard series
Page 65 of 81Please read Cautions and warnings and
Important notes at the end of this document.
Soldering directions
1 Terminations
1.1 Nickel barrier termination
The nickel barrier layer of the silver/nickel/tin termination prevents leaching of the silver base met-
allization layer. This allows great flexibility in the selection of soldering parameters. The tin pre-
vents the nickel layer from oxidizing and thus ensures better wetting by the solder. The nickel bar-
rier termination is suitable for all commonly-used soldering methods.
Multilayer CTVS: Structure of nickel barrier termination
1.2 Silver-palladium termination
Silver-palladium terminations are used for the large case sizes 1812 and 2220 and for chips in-
tended for conductive adhesion. This metallization improves the resistance of large chips to ther-
mal shock.
In case of conductive adhesion, the silver-palladium metallization reduces susceptibility to corro-
sion. Silver-palladium termination can be used for smaller case sizes (only chip) for hybrid appli-
cations as well. The silver-palladium termination is not approved for lead-free soldering.
Multilayer varistor: Structure of silver-palladium termination
Multilayer varistors (MLVs)
Standard series
Page 66 of 81Please read Cautions and warnings and
Important notes at the end of this document.
1.3 Silver-platinum termination
Silver-platinum terminations are mainly used for the large case sizes 1812 and 2220. The silver-
platinum termination is approved for reflow soldering, SnPb soldering and lead-free soldering with
a silver containing solder paste. In case of SnPb soldering, a solder paste Sn62Pb36Ag2 is rec-
ommended. For lead-free reflow soldering, a solder paste SAC, e.g. Sn95.5Ag3.8Cu0.7, is rec-
ommended.
Multilayer varistor: Structure of silver-platinum termination
2 Recommended soldering temperature profiles
2.1 Reflow soldering temperature profile
Recommended temperature characteristic for reflow soldering following
JEDEC J-STD-020D
Multilayer varistors (MLVs)
Standard series
Page 67 of 81Please read Cautions and warnings and
Important notes at the end of this document.
Profile feature Sn-Pb eutectic assembly Pb-free assembly
Preheat and soak
- Temperature min Tsmin 100 °C 150 °C
- Temperature max Tsmax 150 °C 200 °C
- Time tsmin to tsmax 60 ... 120 s 60 ... 180 s
Average ramp-up rate Tsmax to Tp3°C/ s max. 3 °C/ s max.
Liquidous temperature TL183 °C 217 °C
Time at liquidous tL60 ... 150 s 60 ... 150 s
Peak package body temperature Tp1) 220 °C ... 235 °C2) 245 °C ... 260 °C2)
Time (tP)3) within 5 °C of specified
classification temperature (Tc)20 s3) 30 s3)
Average ramp-down rate Tpto Tsmax 6°C/ s max. 6 °C/ s max.
Time 25 °C to peak temperature maximum 6 min maximum 8 min
1) Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum.
2) Depending on package thickness. For details please refer to JEDEC J-STD-020D.
3) Tolerance for time at peak profile temperature (tP) is defined as a supplier minimum and a user maximum.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Number of reflow cycles: 3
2.2 Wave soldering temperature profile
Temperature characteristics at component terminal with dual-wave soldering
Multilayer varistors (MLVs)
Standard series
Page 68 of 81Please read Cautions and warnings and
Important notes at the end of this document.
2.3 Lead-free soldering processes
EPCOS multilayer CTVS with AgNiSn termination are designed for the requirements of lead-free
soldering processes only.
Soldering temperature profiles to JEDEC J-STD-020D, IEC 60068-2-58 and ZVEI recommenda-
tions.
3 Recommended soldering methods - type-specific releases by EPCOS
3.1 Overview
Reflow soldering Wave soldering
Type Case size SnPb Lead-free SnPb Lead-free
CT... / CD... 0201/ 0402 Approved Approved No No
CT... / CD... 0603 ... 2220 Approved Approved Approved Approved
CN... 0603 ... 2220 Approved No Approved No
CN...K2 1812, 2220 Approved Approved No No
Arrays 0405 ... 1012 Approved Approved No No
ESD/EMI filters 0405, 0508 Approved Approved No No
CU 3225, 4032 Approved Approved Approved Approved
SHCV - No No Approved Approved
3.2 Nickel barrier and AgPt terminated multilayer CTVS
All EPCOS MLVs with nickel barrier and AgPt termination are suitable and fully qualiyfied for lead-
free soldering. The nickel barrier layer is 100% matte tin-plated.
3.3 Silver-palladium terminated MLVs
AgPd-terminated MLVs are mainly designed for conductive adhesion technology on hybrid materi-
al. Additionally MLVs with AgPd termination are suitable for reflow and wave soldering with SnPb
solder.
Note:
Lead-free soldering is not approved for MLVs with AgPd termination.
3.4 Silver-platinum terminated MLVs
The silver-platinum termination is approved for reflow soldering, SnPb soldering and lead-free
with a silver containing solder paste. In case of SnPb soldering, a solder paste Sn62Pb36Ag2 is
recommended. For lead-free reflow soldering, a solder paste SAC, e.g. Sn95.5Ag3.8Cu0.7, is
recommended.
Multilayer varistors (MLVs)
Standard series
Page 69 of 81Please read Cautions and warnings and
Important notes at the end of this document.
3.5 Tinned copper alloy
All EPCOS CU types with tinned termination are approved for lead-free and SnPb soldering.
3.6 Tinned iron wire
All EPCOS SHCV types with tinned termination are approved for lead-free and SnPb soldering.
4 Solder joint profiles / solder quantity
4.1 Nickel barrier termination
If the meniscus height is too low, that means the solder quantity is too low, the solder joint may
break, i.e. the component becomes detached from the joint. This problem is sometimes interpret-
ed as leaching of the external terminations.
If the solder meniscus is too high, i.e. the solder quantity is too large, the vise effect may occur.
As the solder cools down, the solder contracts in the direction of the component. If there is too
much solder on the component, it has no leeway to evade the stress and may break, as in a vise.
The figures below show good and poor solder joints for dual-wave and infrared soldering.
4.1.1 Solder joint profiles for nickel barrier termination - dual-wave soldering
Good and poor solder joints caused by amount of solder in dual-wave soldering.
4.1.2 Solder joint profiles for nickel barrier termination / silver-palladium / silver-platinum
termination - reflow soldering
Multilayer varistors (MLVs)
Standard series
Page 70 of 81Please read Cautions and warnings and
Important notes at the end of this document.
Good and poor solder joints caused by amount of solder in reflow soldering.
5 Conductive adhesion
Attaching surface-mounted devices (SMDs) with electrically conductive adhesives is a commer-
cially attractive method of component connection to supplement or even replace conventional sol-
dering methods.
Electrically conductive adhesives consist of a non-conductive plastic (epoxy resin, polyimide or
silicon) in which electrically conductive metal particles (gold, silver, palladium, nickel, etc) are em-
bedded. Electrical conduction is effected by contact between the metal particles.
Adhesion is particularly suitable for meeting the demands of hybrid technology. The adhesives
can be deposited ready for production requirements by screen printing, stamping or by dis-
pensers. As shown in the following table, conductive adhesion involves two work operations fewer
than soldering.
Reflow soldering Wave soldering Conductive adhesion
Screen-print solder paste Apply glue dot Screen-print conductive adhesive
Mount SMD Mount SMD Mount SMD
Predry solder paste Cure glue Cure adhesive
Reflow soldering Wave soldering Inspect
Wash Wash
Inspect Inspect
Multilayer varistors (MLVs)
Standard series
Page 71 of 81Please read Cautions and warnings and
Important notes at the end of this document.
A further advantage of adhesion is that the components are subjected to virtually no temperature
shock at all. The curing temperatures of the adhesives are between 120 °C and 180 °C, typical
curing times are between 30 minutes and one hour.
The bending strength of glued chips is, in comparison with that of soldered chips, higher by a fac-
tor of at least 2, as is to be expected due to the elasticity of the glued joints.
The lower conductivity of conductive adhesive may lead to higher contact resistance and thus re-
sult in electrical data different to those of soldered components. Users must pay special attention
to this in RF applications.
6 Solderability tests
Test Standard Test conditions
Sn-Pb soldering
Test conditions
Pb-free soldering
Criteria/ test results
Wettability IEC
60068-2-58
Immersion in
60/40 SnPb solder
using non-activated
flux at 215 ±3°C
for 3 ±0.3 s
Immersion in
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
at 245 ±5°C
for 3 ±0.3 s
Covering of 95% of
end termination,
checked by visual
inspection
Leaching
resistance
IEC
60068-2-58
Immersion in
60/40 SnPb
solder using
mildly activated flux
without preheating
at 260 ±5°C
for 10 ±1 s
Immersion in
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
without preheating
at 255 ±5°C
for 10 ±1 s
No leaching of
contacts
Thermal shock
(solder shock)
Dip soldering at
300 °C/5 s
Dip soldering at
300 °C/5 s
No deterioration of
electrical parameters.
Capacitance change:
≤ ±15%
Tests of resistance
to soldering heat
for SMDs
IEC
60068-2-58
Immersion in
60/40 SnPb for 10 s
at 260 °C
Immersion in
Sn96.5Ag3.0Cu0.5
for 10 s at 260 °C
Change of varistor
voltage:
≤ ±5%
Tests of resistance
to soldering heat
for radial leaded
components
(SHCV)
IEC
60068-2-20
Immersion
of leads in
60/40 SnPb
for 10 s at 260 °C
Immersion
of leads in
Sn96.5Ag3.0Cu0.5
for 10 s at 260 °C
Change of varistor
voltage: ≤ ±5%
Change of
capacitance X7R:
≤5/+10%
Multilayer varistors (MLVs)
Standard series
Page 72 of 81Please read Cautions and warnings and
Important notes at the end of this document.
Note:
Leaching of the termination
Effective area at the termination might be lost if the soldering temperature and/or immersion time
are not kept within the recommended conditions. Leaching of the outer electrode should not ex-
ceed 25% of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B,
shown below as mounted on substrate.
As a single chip As mounted on substrate
7 Notes for proper soldering
7.1 Preheating and cooling
According to JEDEC J-STD-020D. Please refer to chapter 2.
7.2 Repair / rework
Manual soldering with a soldering iron must be avoided, hot-air methods are recommended for
rework purposes.
7.3 Cleaning
All environmentally compatible agents are suitable for cleaning. Select the appropriate cleaning
solution according to the type of flux used. The temperature difference between the components
and cleaning liquid must not be greater than 100 °C. Ultrasonic cleaning should be carried out
with the utmost caution. Too high ultrasonic power can impair the adhesive strength of the metal-
lized surfaces.
7.4 Solder paste printing (reflow soldering)
An excessive application of solder paste results in too high a solder fillet, thus making the chip
more susceptible to mechanical and thermal stress. Too little solder paste reduces the adhesive
strength on the outer electrodes and thus weakens the bonding to the PCB. The solder should be
applied smoothly to the end surface.
Multilayer varistors (MLVs)
Standard series
Page 73 of 81Please read Cautions and warnings and
Important notes at the end of this document.
7.5 Adhesive application
Thin or insufficient adhesive causes chips to loosen or become disconnected during curing.
Low viscosity of the adhesive causes chips to slip after mounting. It is advised to consult the
manufacturer of the adhesive on proper usage and amounts of adhesive to use.
7.6 Selection of flux
Used flux should have less than or equal to 0.1 wt % of halogenated content, since flux residue
after soldering could lead to corrosion of the termination and/or increased leakage current on the
surface of the component. Strong acidic flux must not be used. The amount of flux applied should
be carefully controlled, since an excess may generate flux gas, which in turn is detrimental to sol-
derability.
7.7 Storage of CTVSs
Solderability is guaranteed for one year from date of delivery for multilayer varistors, CeraDiodes
and ESD/EMI filters (half a year for chips with AgPd and AgPt terminations) and two years for
SHCV and CU components, provided that components are stored in their original packages.
Storage temperature: 25 °C to +45 °C
Relative humidity: ≤75% annual average, ≤95% on 30 days a year
The solderability of the external electrodes may deteriorate if SMDs and leaded components are
stored where they are exposed to high humidity, dust or harmful gas (hydrogen chloride, sulfurous
acid gas or hydrogen sulfide).
Do not store SMDs and leaded components where they are exposed to heat or direct sunlight.
Otherwise the packing material may be deformed or SMDs/ leaded components may stick togeth-
er, causing problems during mounting.
After opening the factory seals, such as polyvinyl-sealed packages, it is recommended to use the
SMDs or leaded components as soon as possible.
7.8 Placement of components on circuit board
Especially in the case of dual-wave soldering, it is of advantage to place the components on the
board before soldering in that way that their two terminals do not enter the solder bath at different
times.
Ideally, both terminals should be wetted simultaneously.
7.9 Soldering cautions
An excessively long soldering time or high soldering temperature results in leaching of the outer
electrodes, causing poor adhesion and a change of electrical properties of the varistor due to
the loss of contact between electrodes and termination.
Wave soldering must not be applied for MLVs designated for reflow soldering only.
Keep the recommended down-cooling rate.
Multilayer varistors (MLVs)
Standard series
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Important notes at the end of this document.
7.10 Standards
CECC 00802
IEC 60068-2-58
IEC 60068-2-20
JEDEC J-STD-020D
Multilayer varistors (MLVs)
Standard series
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Important notes at the end of this document.
Symbols and terms
Symbol Term
Cline,typ Typical capacitance per line
Cmax Maximum capacitance
Cmin Minimum capacitance
Cnom Nominal capacitance
∆Cnom Tolerance of nominal capacitance
Ctyp Typical capacitance
fcut-off,min Minimum cut-off frequency
I Current
Iclamp Clamping current
Ileak Leakage current
Ileak,typ Typical leakage current
IPP Peak pulse current
Isurge,max Maximum surge current (also termed peak current)
LCT Lower category temperature
Ltyp Typical inductance
Pdiss,max Maximum power dissipation
PPP Peak pulse power
Rins Insulation resistance
Rmin Minimum resistance
RSResistance per line
TAAmbient temperature
Top Operating temperature
Tstg Storage temperature
trDuration of equivalent rectangular wave
tresp Response time
UCT Upper category temperature
V Voltage
VBR,min Minimum breakdown voltage
Vclamp,max Maximum clamping voltage
VDC,max Maximum DC operating voltage (also termed working voltage)
VESD,air Air discharge ESD capability
VESD,contact Contact discharge ESD capability
Vjump Maximum jump start voltage
Multilayer varistors (MLVs)
Standard series
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Important notes at the end of this document.
VRMS,max Maximum AC operating voltage, root-mean-square value
VVVaristor voltage (also termed breakdown voltage)
VV,min Minimum varistor voltage
VV,max Maximum varistor voltage
∆VVTolerance of varistor voltage
WLD Maximum load dump
Wmax Maximum energy absorption (also termed transient energy)
αtyp Typical insertion loss
Lead spacing
*Maximum possible application conditions
All dimensions are given in mm.
The commas used in numerical values denote decimal points.
Multilayer varistors (MLVs)
Standard series
Page 77 of 81Please read Cautions and warnings and
Important notes at the end of this document.
Cautions and warnings
General
Some parts of this publication contain statements about the suitability of our ceramic transient
voltage suppressor (CTVS) components (multilayer varistors (MLVs), CeraDiodes, ESD/EMI
filters, SMD disk varistors (CU types), leaded transient voltage/ RFI suppressors (SHCV types))
for certain areas of application, including recommendations about incorporation/design-in of these
products into customer applications. The statements are based on our knowledge of typical
requirements often made of our CTVS devices in the particular areas. We nevertheless expressly
point out that such statements cannot be regarded as binding statements about the suitability of
our CTVS components for a particular customer application. As a rule, EPCOS is either unfamiliar
with individual customer applications or less familiar with them than the customers themselves.
For these reasons, it is always incumbent on the customer to check and decide whether the
CTVS devices with the properties described in the product specification are suitable for use in a
particular customer application.
Do not use EPCOS CTVS components for purposes not identified in our specifications,
application notes and data books.
Ensure the suitability of a CTVS in particular by testing it for reliability during design-in. Always
evaluate a CTVS component under worst-case conditions.
Pay special attention to the reliability of CTVS devices intended for use in safety-critical
applications (e.g. medical equipment, automotive, spacecraft, nuclear power plant).
Design notes
Always connect a CTVS in parallel with the electronic circuit to be protected.
Consider maximum rated power dissipation if a CTVS has insufficient time to cool down
between a number of pulses occurring within a specified isolated time period. Ensure that
electrical characteristics do not degrade.
Consider derating at higher operating temperatures. Choose the highest voltage class
compatible with derating at higher temperatures.
Surge currents beyond specified values will puncture a CTVS. In extreme cases a CTVS will
burst.
If steep surge current edges are to be expected, make sure your design is as low-inductance
as possible.
In some cases the malfunctioning of passive electronic components or failure before the end of
their service life cannot be completely ruled out in the current state of the art, even if they are
operated as specified. In applications requiring a very high level of operational safety and
especially when the malfunction or failure of a passive electronic component could endanger
human life or health (e.g. in accident prevention, life-saving systems, or automotive battery line
applications such as clamp 30), ensure by suitable design of the application or other measures
(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by
third parties in the event of such a malfunction or failure. Only use CTVS components from the
automotive series in safety-relevant applications.
Multilayer varistors (MLVs)
Standard series
Page 78 of 81Please read Cautions and warnings and
Important notes at the end of this document.
Specified values only apply to CTVS components that have not been subject to prior electrical,
mechanical or thermal damage. The use of CTVS devices in line-to-ground applications is
therefore not advisable, and it is only allowed together with safety countermeasures like
thermal fuses.
Storage
Only store CTVS in their original packaging. Do not open the package before storage.
Storage conditions in original packaging: temperature 25 to +45°C, relative humidity ≤75%
annual average, maximum 95%, dew precipitation is inadmissible.
Do not store CTVS devices where they are exposed to heat or direct sunlight. Otherwise the
packaging material may be deformed or CTVS may stick together, causing problems during
mounting.
Avoid contamination of the CTVS surface during storage, handling and processing.
Avoid storing CTVS devices in harmful environments where they are exposed to corrosive
gases for example (SOx, Cl).
Use CTVS as soon as possible after opening factory seals such as polyvinyl-sealed packages.
Solder CTVS components after shipment from EPCOS within the time specified:
CTVS with Ni barrier termination, 12 months
CTVS with AgPd and AgPt termination, 6 months
SHCV and CU series, 24 months
Handling
Do not drop CTVS components and allow them to be chipped.
Do not touch CTVS with your bare hands - gloves are recommended.
Avoid contamination of the CTVS surface during handling.
Mounting
When CTVS devices are encapsulated with sealing material or overmolded with plastic
material, electrical characteristics might be degraded and the life time reduced.
Make sure an electrode is not scratched before, during or after the mounting process.
Make sure contacts and housings used for assembly with CTVS components are clean before
mounting.
The surface temperature of an operating CTVS can be higher. Ensure that adjacent
components are placed at a sufficient distance from a CTVS to allow proper cooling.
Avoid contamination of the CTVS surface during processing.
Multilayer varistors (MLVs) with AgPd termination are not approved for lead-free soldering.
Soldering
Complete removal of flux is recommended to avoid surface contamination that can result in an
instable and/or high leakage current.
Use resin-type or non-activated flux.
Bear in mind that insufficient preheating may cause ceramic cracks.
Rapid cooling by dipping in solvent is not recommended, otherwise a component may crack.
Multilayer varistors (MLVs)
Standard series
Page 79 of 81Please read Cautions and warnings and
Important notes at the end of this document.
Conductive adhesive gluing
Only multilayer varistors (MLVs) with an AgPd termination are approved for conductive
adhesive gluing.
Operation
Use CTVS only within the specified operating temperature range.
Use CTVS only within specified voltage and current ranges.
Environmental conditions must not harm a CTVS. Only use them in normal atmospheric
conditions. Reducing the atmosphere (e.g. hydrogen or nitrogen atmosphere) is prohibited.
Prevent a CTVS from contacting liquids and solvents. Make sure that no water enters a CTVS
(e.g. through plug terminals).
Avoid dewing and condensation.
EPCOS CTVS components are mainly designed for encased applications. Under all
circumstances avoid exposure to:
direct sunlight
rain or condensation
steam, saline spray
corrosive gases
atmosphere with reduced oxygen content
EPCOS CTVS devices are not suitable for switching applications or voltage stabilization where
static power dissipation is required.
Multilayer varistors (MLVs) are designed for ESD protection and transient suppression.
CeraDiodes are designed for ESD protection only, ESD/EMI filters are designed for ESD and
EMI protection only.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
Multilayer varistors (MLVs)
Standard series
Page 80 of 81Please read Cautions and warnings and
Important notes at the end of this document.
Page 81 of 81
Important notes
The following applies to all products named in this publication:
1.
Some parts of this publication contain
statements about the suitability of our products for certain
areas of application
. These statements are based on our knowledge of typical requirements that are
often placed on our products in the areas of application concerned. We nevertheless expressly point
out
that such statements cannot be regarded as binding statements about the suitability of our
products for a particular customer application.
As a rule we are either unfamiliar with individual
customer applications or less familiar with them than the customers themselves. For these reasons, it is
always ultimately incumbent on the customer to check and decide whether a product with the properties
described in the product specification is suitable for use in a particular customer application.
2.
We also point out that
in individual cases, a malfunction of electronic components or failure
before the end of their usual service life cannot be completely ruled out in the current state of the
art, even if they are operated as specified.
In customer applications requiring a very high level of
operational safety and especially in customer applications in which the malfunction or failure of an
electronic component could endanger human life or health (e.g. in accident prevention or life-saving
systems), it must therefore be ensured by means of suitable design of the customer application or other
action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or
damage is sustained by third parties in the event of malfunction or failure of an electronic component.
3.
The warnings, cautions and product-specific notes must be observed.
4.
In order to satisfy certain technical requirements,
some of the products described in this publication
may contain substances subject to restrictions in certain jurisdictions (e.g. because they are
classed as hazardous)
. Useful information on this will be found in our Material Data Sheets on the
Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please
contact our sales offices.
5.
We constantly strive to improve our products. Consequently,
the products described in this
publication may change from time to time
. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications contained
in this publication are still applicable before or when you place an order.
We also
reserve the right to discontinue production and delivery of products
. Consequently, we
cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the foregoing for
customer-specific products.
6.
Unless otherwise agreed in individual contracts,
all orders are subject to our General Terms and
Conditions of Supply.
7.
Our manufacturing sites serving the automotive business apply the IATF 16949 standard.
The
IATF certifications confirm our compliance with requirements regarding the quality management system
in the automotive industry. Referring to customer requirements and customer specific requirements
(“CSR”) TDK always has and will continue to have the policy of respecting individual agreements. Even
if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to
emphasize that
only requirements mutually agreed upon can and will be implemented in our
Quality Management System.
For clarification purposes we like to point out that obligations from IATF
16949 shall only become legally binding if individually agreed upon.
8.
The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,
DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap,
PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI,
SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are
trademarks registered or pending
in Europe and in other countries. Further information will be found
on the Internet at www.tdk-electronics.tdk.com/trademarks.
Release 2018-10
