ACFF-1024
ISM Bandpass Filter (2401 – 2482 MHz)
Data Sheet
ANT
(Pin 4)
TX/RX
(Pin 1)
Port 1 Port 2
Features
• 50 Ω Input/Output
• No external matching required
• Low Insertion Loss, High Interference Rejection
- Enables concurrent use of other 2.5 GHz Bands
• Subminiature Size
- 1.1 x 1.4 mm Footprint
- 0.80 mm Max Height
• High Power Rating
- +27 dBm Abs Max Input Power
• Operating Temperature Range
- –40 °C to +85 °C
• Environmental
- RoHS 6 Compliant
- Halogen free
- TBBPA Free
Specications
• Performance guaranteed –30 °C to +85 °C
• Low Insertion Loss
• High Interferer Rejection
Applications
802.11 b/g/n WLAN Access Point and Small Cell BTS with
embedded WLAN functionality
Description
The Avago ACFF-1024 is a miniaturized Bandpass Filter
designed for use in the 2.4 GHz Industrial, Scientic and
Medical (ISM) band.
The ACFF-1024 is designed to enable concurrent opera-
tion of Wireless LAN and Bluetooth applications that coex-
ist with other wireless standards, such as 2.5 GHz WiMAX,
PCS, and LTE Bands 7 and 40, without performance degra-
dations due to interference.
The ACFF-1024 is designed with Avago Technologies’ in-
novative Film Bulk Acoustic Resonator (FBAR) technology,
which makes possible ultra-small, high-Q lters at a frac-
tion of their usual size.
The ACFF-1024 also utilizes Avago Technologies’ advanced
Microcap bonded-wafer technology. This chip scale min-
iaturization process results in a package size of only 1.4 x
1.1 mm and maximum height of 0.80 mm.
The ACFF-1024 is compatible with high volume, lead-free
SMT soldering processes and can be direct surface mount-
ed to a PCB or a transfer molded module.
Functional Block Diagram
2
ACFF-1024 Electrical Specications [2], Z0 = 50 Ω, Tc [1]
Symbol Parameter Units
-30 °C to +85 °C -40 °C
Min Typ [3] Max Typ
S21 Insertion Loss [4]
2402.5 – 2421.5 MHz (Wi-Fi Ch 1)
2407.5 – 2426.5 MHz (Wi-Fi Ch 2)
2412.5 – 2471.5 MHz (Wi-Fi Ch 3 – 11)
2457.5 – 2476.5 MHz (Wi-Fi Ch 12)
2462.5 – 2481.5 MHz (Wi-Fi Ch 13)
dB
1.6
1.4
1.3
1.5
1.7
2.6
2.2
2.0
2.1
3.0
1.8
1.6
1.3
1.5
1.6
ΔS21 Amplitude Ripple (p-p) [4], +25 °C
2402.5 – 2421.5 MHz (Wi-Fi Ch 1)
2407.5 – 2426.5 MHz (Wi-Fi Ch 2)
2412.5 – 2471.5 MHz (Wi-Fi Ch 3 – 11)
2457.5 – 2476.5 MHz (Wi-Fi Ch 12)
2462.5 – 2481.5 MHz (Wi-Fi Ch 13)
dB
1.0
0.8
0.7
0.6
1.0
1.4
1.1
0.9
0.7
0.9
S21 Attenuation, 800 – 2300 MHz dB 45 54 54
S21 Attenuation [5] in LTE Band 40, 2300 – 2365 MHz dB 50 53 52
S21 Attenuation [5] in LTE Band 40, 2365 – 2370 MHz
–40 °C
–30 °C to +25 °C
+25 °C to +55 °C
+55 °C to +85 °C
dB
50
43
30
58
58
53
58
S21 Attenuation [5] in LTE Band 7 (WiMAX), 2500 – 2505 MHz
–40 °C
–30 °C to –10 °C
–10 °C to +25 °C
+25 °C to +85 °C
dB
42
52
55
56
59
64
64
S21 Attenuation [5] in LTE Band 7 (WiMAX), 2505 – 2690 MHz dB 57 67 68
S21 Attenuation [5] in LTE Band 38, 2570 – 2620 MHz dB 55 68 68
S21 Attenuation, 2690 – 7500 MHz dB 40 55 55
2H 2nd Harmonic Level, CW Tone, 2442 MHz, 22.5 dBm at Port 1 dBc 57 67
S11, S22 Return Loss (SWR), 2402.5 – 2481.5 MHz, +25 °CdB 9 16 (1.4) (2.1) 16 (1.4)
Notes:
1. Tc is the case temperature and is dened as the temperature of the underside of the Filter where it makes contact with the circuit board.
2. Min/Max specications are guaranteed at the indicated temperature, unless otherwise noted.
3. Unless otherwise noted, Typical data is the average value (arithmetic mean) of the parameter over the indicated band at 25 °C.
4. Channel average Insertion Loss, which is obtained by averaging |S21| over the center 19 MHz of channels and converting to dB value.
5. Channel average Insertion Loss, which is obtained by averaging |S21| over 5 MHz channels and converting to dB value.
Absolute Maximum Ratings [1]
Parameter Unit Value
Storage temperature °C–40 to +125
Maximum RF Input Power to Pin 1
(Port 1, Tx/Rx) [4]
dBm +27
Maximum Recommended Operating Conditions [2]
Parameter Unit Value
Operating temperature, Tc [3] °C–40 to +85
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
2. The device will function over the recommended range without degradation in reliability or permanent change in performance, but is not
guaranteed to meet electrical specications.
3. Tc is dened as case temperature, the temperature of the underside of the Filter where it makes contact with the circuit board.
4. The ACFF-1024 is not symmetrical. Port 1 (Pin 1) is designed for higher power handling and is connected to the Tx/Rx blocks; Port 2 (Pin 4) is
connected to the system antenna.
3
-3.0
-2.5
-2.0
-1.5
-1.0
-0.5
0
2400 2410 2420 2430 2440 2450 2460 2470 2480
Insertion Loss (dB)
Frequency (MHz)
-30
-25
-20
-15
-10
-5
0
2400 2410 2420 2430 2440 2450 2460 2470 2480
Return Loss (dB)
Frequency (MHz)
-80
-70
-60
-50
-40
-30
-20
-10
0
2350 2400 2450 2500 2550
Insertion Loss (dB)
Frequency (MHz)
-80
-70
-60
-50
-40
-30
-20
-10
0
1000 2000 3000 4000 5000 6000 7000 8000
Insertion Loss (dB)
Frequency (MHz)
-80
-70
-60
-50
-40
-30
-20
-10
0
800 1000 1200 1400 1600 1800 2000 2200
Insertion Loss (dB)
Frequency (MHz)
-80
-70
-60
-50
-40
-30
-20
-10
0
2300 2310 2320 2330 2340 2350 2360 2370
Insertion Loss (dB)
Frequency (MHz)
S11
S22
ACFF-1024 Typical Performance at Tc = 25 °C
Figure 1. Insertion Loss, 2400 – 2482 MHz
Figure 3. Attenuation, 2350 – 2550 MHz
Figure 5. Attenuation, 800 – 2300 MHz
Figure 2. Input, Output Port Return Loss, 2400 – 2482 MHz
Figure 4. Wideband Attenuation, 100 – 8000 MHz
Figure 6. Rejection in LTE Band 40 (2300 – 2370 MHz)
4
-80
-70
-60
-50
-40
-30
-20
-10
0
2500 2550 2600 2650
Insertion Loss (dB)
Frequency (MHz)
-80
-70
-60
-50
-40
-30
-20
-10
0
2570 2580 2590 2600 2610
Insertion Loss (dB)
Frequency (MHz)
-80
-70
-60
-50
-40
-30
-20
-10
0
3000 4000 5000 6000 7000
Insertion Loss (dB)
Frequency (MHz)
0
5n
10n
15n
20n
25n
30n
35n
40n
45n
50n
2410 2420 2430 2440 2450 2460 2470 2480
Group Delay (s)
Frequency (MHz)
0.2 0.4 0.6 0.8 1 1.5 2 3 4 5 10 2050
0.2
0.4
0.6
0.8 1
1.5
2
3
4
5
10
20
50
-0.2
-0.4
-0.6
-0.8 -1
-1.5
-2
-3
-4
-5
-10
-20
-50 0.2 0.4 0.6 0.8 1 1.5 2 3 4 5 10 2050
0.2
0.4
0.6
0.8 1
1.5
2
3
4
5
10
20
50
-0.2
-0.4
-0.6
-0.8 -1
-1.5
-2
-3
-4
-5
-10
-20
-50
ACFF-1024 Typical Performance at Tc = 25 °C
Figure 7. Rejection in 2.5 GHz WiMAX and LTE Band 7 (2500 – 2690 MHz)
Figure 9. Attenuation, 2690 – 7500 MHz
Figure 11. Input Port Impedance, 2400 – 2482 MHz
Figure 8. Rejection in LTE Band 38 (2570 – 2620 MHz)
Figure 10. Group Delay (ns), 2400 – 2482 MHz
Figure 12. Output Port Impedance, , 2400 – 2482 MHz
5
ACFF-1024 Performance at Low Temperature
Typical performance of the ACFF-1024 at low temperature is shown in Figure 13 and Figure 14 for Tc = 25 °C and –40 °C.
-3.0
-2.5
-2.0
-1.5
-1.0
-0.5
0
2400 2410 2420 2430 2440 2450 2460 2470 2480
Insertion Loss (dB)
Frequency (MHz)
-80
-70
-60
-50
-40
-30
-20
-10
0
2350 2400 2450 2500 2550
Insertion Loss (dB)
Frequency (MHz)
Tc = –40 °C
Tc = +25 °C
Tc = –40 °C
Tc = +25 °C
Figure 13. Insertion Loss, 2400 – 2482 MHz, +25 °C and –40 °C Figure 14. Attenuation, 2350 – 2550 MHz, +25 °C and –40 °C
Figure 15. Package Outline Drawing and Marking
Pin Connections:
1 Port 1 (TX/RX)
2, 3, 5 GND
4 Port 2 (ANT)
PIN 1 MARK
ANT
(4)
TX/RX
(1)
GND
(3)
GND
(2)
GND
(5)
(1)
(5) (4)
(3)
1.40
(1.48 MAX)
0.69
(0.80 MAX)
1.10
(1.18 MAX)
0.500
0.575
0.500
0.288
0.075
0.100
PAD DETAIL
0.325
0.250
(2)
Notes:
1. Dimensions in millimeters
2. Tolerance: X.XX ± 0.05
X.XXX ± 0.025
3. Dimensions nominal unless otherwise noted
4. Contact areas are gold plated
5. Package marking:
A = Avago logo
B = ACFF-1024
Y = Year (last digit)
W = Work Week
XXXX = Lot number
XXXX
BYW
TOP VIEW BOTTOM VIEWSIDE VIEW
Note: These data are measured on units dierent from those in previous performance graphs.
6
Figure 16. PCB Layout
Notes:
1. Dimensions in mm
2. Top View
A circuit board layout using the principles illustrated in
Figure 16 is recommended to optimize performance of
the ACFF-1024.
Note: The ACFF-1024 is not symmetrical. Pin 1 (Port 1) is
designed for higher power handling and should be con-
nected to the Tx/Rx block; Pin 4 (Port 2) is connected to
the system antenna.
High isolation between Input and Output is achieved by:
1. Maintaining a continuous ground plane around the I/O
connections and lter land print area, and
2. Surrounding the I/O ports with sucient ground vias
to enclose the connections in a “Faraday cage.”
4×9×2 ARRAY, 0.500 PITCH
Ø 0.250 THRU VIAS
Ø 0.100 µVIA ARRAY
0.200 PITCH, LAYERS 1-2
PLUGGED AND SMOOTHED
0.109
0.109
0.245
0.180
Due to the limitation of the PCB via to PCB thickness as-
pect ratio, micro vias (Ǿ 0.100) are used in the area be-
tween land pads to connect metal Layer1 and Layer2. For
all other areas, larger thru vias are used to connect all lay-
ers.
Ground vias under the ACFF-1024 mounting area also
provide heat sinking for the device to minimize shifting of
the pass band over temperature.
Table 1. PCB Stack-up
Layer Type Material Thickness (mm) Dielectric Constant (εr)
Layer 1 Conductor Copper 0.055
Dielectric Nelco N4000 13EP 0.075 3.4
Layer 2 Conductor Copper 0.040
Dielectric Nelco N4000 13EP 0.590 3.4
Layer 3 Conductor Copper 0.040
Dielectric Nelco N4000 13EP 0.075 3.4
Layer 4 Conductor Copper 0.055
7
Figure 17. Recommended PCB Layout
5 x 0.250 x 0.325
0.575
0.500 0.500 0.200 (Typ)
0.200 (Typ)
A recommended PCB layout design is shown in Figure 17.
Transmission line dimensions (*) should be adjusted to
maintain Zo of 50 Ω.
The land pads of this PCB pattern are 1:1 with the ACFF-
1024 bottom metal pads.
2×0.250×0.325
LAND PAD
2×0.550×0.070, CHAMFER 0.100×45°
GROUND PLANE OPENING FOR LAND PAD
0.288
0.420
1.000
0.155
0.553
0.700
(REF)
0.135
TYP* 0.486
Notes:
1. Dimensions in mm
2. Top View
3. Width of transmission line (*) is adjusted for 50 Ω
Figure 18. Recommended Solder Mask (Dimensions in mm)
8
Figure 19. Recommended Solder Stencil (Dimensions in mm)
5 x 0.250 x 0.325
R 0.050 min
0.575
0.500 0.500
The recommended solder stencil is designed such that the
apertures match the opening in the solder mask 1:1.
A minimum corner radius of 50 µm is recommended to
increase reliability of solder paste release from the stencil.
4.0 ± 0.10
4.0 ± 0.10
2.00 ± 0.05
3.50 ± 0.05
1.75 ± 0.10
∅ 1.50 + 0.10
8.00 +0.30
–0.10
∅ 0.50 ± 0.05
Figure 20. SMT Tape Packing
SPROCKET HOLES
TAPE
WIDTH
POCKET
CAVITY
PACKAGE PIN 1
ORIENTATION
XXXX
BYW
XXXX
BYW
XXXX
BYW
XXXX
BYW
XXXX
BYW
Figure 21. Orientation in Tape
9
NOTES:
1. Reel shall be labeled with the following
information (as a minimum).
a. manufacturer’s name or symbol
b. Avago Technologies part number
c. purchase order number
d. date code
e. quantity of units
2. A certicate of compliance (c of c) shall
be issued and accompany each shipment
of product.
3. Reel must not be made with or contain
ozone depleting materials.
4. All dimensions in millimeters (mm)
50 min.
12.4 +2.0
-0.0
18.4 max.
25
min wide (ref)
Slot for carrier tape
insertion for attachment
to reel hub (2 places 180° apart)
BACK VIEW
FRONT VIEW
178
Shading indicates
thru slots
+0.4
-0.2
21.0 ± 0.8
13.0 ± 0.2
1.5 min.
Figure 22. SMT Reel Drawing
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved.
AV02-3973EN - October 2, 2014
Package Moisture Sensitivity
Feature Test Method Performance
Moisture Sensitivity Level (MSL) at 260 °CJESD22-A113D Level 3
Figure 23. Veried SMT Solder Prole
Ordering Information
Part Number No. of Devices Container
ACFF-1024-BLK 100 Tape strip in Anti-static bag
ACFF-1024-TR1 3000 7-inch (178 mm) Reel
0 50 100 150 200 250 300
Time, seconds
0
50
100
150
200
250
300
Temperature, °C
PROFILE.GRF
PROFILE. WMF
6 February 2003
R. Waugh
Tested prole shown.