Flat panel sensor C7921CA-09 Photodiode area: 52.8 x 52.8 mm, 1.1 Mpixel The C7921CA-09 is a compact, light-weight digital X-ray image sensor developed as a key device for non-destructive inspection, biochemical imaging, and X-ray microscopy. High-resolution, high-definition digital X-ray images can be acquired in real time. Features Applications High quality image: 1.1 Mpixels (Pixel size: 50 x 50 m) Non-destructive inspection Flat panel structure without image distortion Digital X-ray photography 12-bit digital output High-speed imaging: 4 frames/s (single binning), 16 frames/s (4 x 4 binning) Wide dynamic range High cost performance Structure Pixel number 1 2 1055 1056 1057 2111 2112 Photodiode array CsI scintillator 1115135 Charge amp array No. 1 (with horizontal shift register, 132 ch) Vertical shift register The C7921CA-09 is comprised of a sensor board and a control board. Mounted on the sensor board is a CMOS image sensor chip made up of a twodimensional photodiode array, row-scanning vertical shift register, and 8 charge amplifier arrays. Each charge amplifier array has a horizontal shift register and consists of 132 ch charge amplifiers with CDS circuit. A CsI scintillator plate is mounted on the two-dimensional photodiode array. X-rays incident on the scintillator are converted to fluorescence, which then enters the two-dimensional photodiode array where electric charge is accumulated in each pixel according to the light intensity. The accumulated charge on each row is sequentially selected by the row-scanning vertical shift register, transferred to the amplifiers through the data line, and converted to a voltage signal. Then an analog signal is sent out from each amplifier array by scanning the horizontal shift register. The control board converts the analog signal into a 12-bit digital signal, which is then sent to a frame grabber board as a 12-bit parallel output through one port. Sensor board 1115136 External power supply A.vdd, D.vdd (not attached) IntExt Binning (bin0, bin1) Timing pulse generator Charge amp array No. 8 (with horizontal shift register, 132 ch) Oscillator ExtTrgLemo ExtTrgGrb Vsync Hsync Pclk Bias generator Buffer amp Processing amp A/D Buffer amp Processing amp A/D FIFO Video output (12-bit digital) FIFO Control board Note: Signals are read out in order of pixel number. KACCC0358EB KACCC0358EB www.hamamatsu.com 1 Flat panel sensor C7921CA-09 General ratings Parameter Pixel size Photodiode area Number of pixels Number of active pixels Readout Video output (Data1-12) Output data rate Synchronous signal (Vsync, Hsync, Pclk) bin0/1, ExtTrgGrb, ExtTrgLemo, IntExt Scintillator Specification 50 x 50 52.8 x 52.8 1056 x 1056 1032 x 1012 Charge amplifier array RS-422 (differential), 12-bit 6.25 RS-422 (differential) TTL CsI Unit m mm pixels pixels MHz - Absolute maximum ratings (Ta=25 C) Parameter Supply voltage for digital circuitry (+5 V) Supply voltage for analog circuitry (+5 V) Input voltage (bin0/1, ExtTrgGrb, ExtTrgLemo, IntExt) Operating temperature *1 Storage temperature *1 Incident X-ray energy *1: No condensation Symbol D.vdd A.vdd Vin Topr Tstg - Value +6.0 +6.0 0 to 6.0 0 to +35 0 to +50 100 Unit V V V C C kVp Specification (Ta=25 C, A.vdd=5.0 V, D.vdd=5.0 V) Symbol Sf(int) Sf(ext) N(rms) S Csat Reso - Internal trigger mode, single operation At 80 kVp without filter Spatial frequency at CTF=5 % A defect line is a horizontal or vertical line containing 4 or more cosecutive pixels located at the opposite side of an amplifier array or a shift register, that produce 1/8 of the average sensitivity of the surrounding pixels. Adjacent defective lines are not allowed in the vertical or horizontal directions. *6: See P. 7, 8, "Description of terms" *7: Average of all effective pixels in single operation at Sf(int) Note: X-ray energy range is 20 k to 100 kVp. *2: *3: *4: *5: Min. 3.8 14.4 7.1 - Typ. 4 8 16 Sf(int) to 0.1 1000 18 2.9 8 2900 Not allowed 65 - Max. 10 600 4 Unit frames/s frames/s frames/s frames/s electrons LSB/mR M electrons line pairs/mm lines m % % LSB 120 200 Resolution (Ta=25 C, A.vdd=5.0 V, D.vdd=5.0 V) 100 90 80 70 CTF (%) Parameter Frame rate (single operation) Frame rate (2 x 2 binning) Frame rate (4 x 4 binning) Frame rate external (single operation) Noise (rms) *2 Sensitivity *3 Saturation charge Resolution *4 Dynamic range Defect line *5 Blemish *6 Non-uniformity of sensitivity *6 Defect cluster *6 Bright line output adjacent to a defect line *6 Output offset *7 60 50 40 30 20 10 0 0 1 2 3 4 5 6 7 8 9 10 Spatial frequency (line pairs/mm) KACCB0156EB 2 Flat panel sensor C7921CA-09 Timing chart Internal trigger mode To acquire images through a frame grabber board, write parameters in the software program or parameter file by referring to the following timing chart and description. 1 frame (Tvc) Dummy lines Vsync+ (grabber) 1st row 2nd row Tvdpw 1st row 2nd row He Last row All pulses are counted in the "High" period of Hsync+. Hsync+ (grabber) Enlarged view Vsync+ (grabber) 1st row 2nd row Hsync+ (grabber) Phe Pg Phe Phd Phe Phd Pclk+ (grabber) All pulses are counted at the riging edge of Pclk+. The effective video output is only included in the "Phe" period. KACCC0362EC Parameter He Phe Effective line Dummy line Effective pixel Dummy pixel Phd Pg Note: "He" is the Hsync count. Phe, Phd and Pg Count 2 x 2 binning 506 22 516 13 894 17 Single operation (1 x 1) 1012 44 1032 25 366 17 are the Pclk count. 4 x 4 binning 253 11 258 7 1158 17 External trigger mode To acquire images in external trigger mode, input an external trigger pulse as shown below. When the time Tvd has passed after the rising edge of the external trigger pulse, synchronous signals and video signals are obtained. When used in synchronization with a pulsed X-ray source, X-rays should be irradiated during the Txray period. 36-pin receptacle Mode Pin No. 15 Pin No. 33 (ExtTrgGrb) (IntExt) Internal trigger (Input signal is Low mode ignored.) Rectangular signal External trigger (See the right figure.) High mode High or Open 2-pin receptacle Pin No. 1 (ExtTrgLemo) (Input signal is ignored.) Frame time (Tvc to Tmax) Recommendation: 50 % of frame time ExtTrgLemo ExtTrgGrb (TTL) Tvd Tvc - Tvdpw Tvl Vsync+ (RS-422) High or Open Txray Hsync+, Pclk+ and effective video output are the same as internal trigger mode. * Tmax is defined as the reciprocal of the minimum value of Sf(ext). * Txray = Frame time - Tvd - (Tvc - Tvdpw) * Tvl = Frame time - (Tvc - Tvdpw) Rectangular signal (See the right figure.) KACCC0393EB (Typ.) Parameter Delay time (only external trigger mode) Cycle time (internal trigger mode) Pulse width of Vsync+ in low period (internal trigger mode) Note: The numbers of significant figures is two. (except Tvc) Vsync Symbol Tvd Tvc Tvdpw Single operation 2 x 2 binning (1 x 1) 450 450 240 122 920 920 4 x 4 binning Unit 450 62 920 s ms s 3 Flat panel sensor C7921CA-09 Accessories Power cable (terminated with an FGG.2B.307.CLAD92Z plug at one end and open at the other end; 2 m; see Table 2.) External trigger cable (terminated with an FFA.0S.302.CLAC37 plug at one end and open at the other end; 5 m; see Table 3.) O Earth cable (AWG18; 4 m) O O The image acquisition software and image processing libraries are excluded from the flat panel sensor. System requirements To operate the C7921CA-09 at full performance, the following system and peripherals are required. PC: IBM compatible PC running on Windows XP Frame grabber board: Monochrome 16 bits or more, pixel clock 7 MHz or more, RS-422 interface synchronous signal * See the frame grabber board manual. * Operation of the C7921CA-09 has been verified with the following frame grabber boards. IMAQ PCI-1424 (NI parts No.777662-01 *8) + Optional memory 64 MB (NI parts No.920130-64 *8) IMAQ PCI-1422 (NI parts No.777959-01 *8) * You can utilize the demonstration software that comes with the frame grabber board as a simple viewer, to acquire and save an image. Refer to the frame grabber board user's guide for how to use the camera information file for the demonstration software. O Power source: A.vdd = +5.0 0.1 V (700 mA), D.vdd = +5.0 0.1 V (800 mA) * The voltages described above are specified at the flat panel sensor side. The impedance of the power cable attached with the flat panel sensor is low enough but it causes 0.1 V approx. drop. Therefore the voltage at the power source side should be set 0.1 V higher than the voltage specified above. * Please use a low noise series power supply. (Avoid using a switching power supply.) * Install a noise filter on the AC power input line to prevent surges on the AC line. * Always ground the ground terminal to avoid the effects of noise from peripheral devices. O Frame grabber board cable (sold separately, see P.8): For synchronous signal, video output and external control (see Table 1.) O O *8: Made by NI (National Instruments Corporation) [Table 1] Pin assignment of 36-pin receptacle Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 Signal Data12+ (MSB) Data11+ Data10+ Data9+ Data8+ Data7+ Data6+ Data5+ Data4+ Data3+ Data2+ Data1+ (LSB) bin0 (TTL) bin1 (TTL) ExtTrgGrb (TTL) Vsync+ Hsync+ Pclk+ Pin No. 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 Signal Data12- (MSB) Data11Data10Data9Data8Data7Data6Data5Data4Data3Data2Data1- (LSB) GND GND IntExt (TTL) VsyncHsyncPclk- Unless otherwise noted, signal level is RS-422. 36-pin receptacle: TX20A-36R-D2GF1-A1L made by JAE (Japan Aviation Electronics Industry limited) Mating plug: TX20A-36PH1-D2P1-D1E made by JAE (Japan Aviation Electronics Industry limited) 4 Flat panel sensor C7921CA-09 [Table 2] Power pin assignment and cable color Pin No. 1 2 3 4 5 6 7 Shield Color Brown Red Orange Yellow Green Blue Purple - Signal Reserved Reserved Reserved Analog GND Analog +5 V Digital GND Digital +5 V Analog GND 7-pin power receptacle: ECG.2B.307.CLV made by LEMO S.A. Mating power plug: FGG.2B.307.CLAD92Z made by LEMO S.A. Pin No. 1 to 3 are not connected to the electrical circuit inside of flat panel sensor. Therefore, previous power source and cable for the C7921CA-02 can be used without modification. [Table 3] External trigger pin assignment and cable color Pin No. 1 2 Shield Color Red Black - Signal ExtTrgLemo (TTL) Signal GND Analog GND 2-pin receptacle: ECP.0S.302.CLL made by LEMO S.A. Mating plug: FFA.0S.302.CLAC37 made by LEMO S.A. Binning mode The C7921CA-09 has binning mode for reading out signals from multiple pixels at a time. The binning mode setting can be changed by using I/O port. [Table 4] Binning mode setting (Grabber interface: 36-pin receptacle) Operating mode Single operation (1 x 1) 2 x 2 binning 4 x 4 binning Pin No. No. 13 (bin0) Low High High No. 14 (bin1) Low Low High 5 Flat panel sensor C7921CA-09 Connection Install the digital frame grabber board into the PC by the manufacturer's instructions. When a general-purpose frame grabber board with I/O control is used, the binning mode or trigger mode can be set by controlling bin0, bin1, IntExt, and ExtTrgGrb through the I/O line. OS + Image acquisition software Video output (12-bit digital) Vsync, Hsync, Pclk Frame grabber board X-ray source PC/AT (Rear view) Monitor Binning (bin0, bin1) IntExt ExtTrgGrb Voltage source (A. vdd, D. vdd) ExtTrgLemo CMOS FLAT PANEL SENSOR C7921CA-09 C7921CA-09 KACCC0354EA Dimensional outline (unit: mm, tolerance: 1 mm unless otherwise noted) 142 30 11 * 12.4 (4 x) M3 depth 4 17 24 118 * DIGITAL OUT (1031, 1011) EXT.TRG. POWER Active area 50.6 (0, 0) 17.1 * 41 Active area 51.6 33 CMOS FLAT PANEL SENSOR C7921CA-09 142 108 * 10 33 50 Scintillator to top cover 9.3 * CMOS FLAT PANEL SENSOR C7921CA-09 13 Top cover is made of aluminum 1.0 mm thickness. Weight: 1.3 kg * 0.5 96 * 29 * 15 KACCA0201EA 6 Flat panel sensor C7921CA-09 Notice * Do not subject the flat panel sensors to strong vibration or shock. (Strong shock such as drop impacts may cause permanent damage to these sensors.) * Users must take responsibility for implementing X-ray shielding safety measures to avoid the risk of X-ray exposure. * Data listed in this datasheet is defined at the time of shipment. Characteristics may vary somewhat due to exposure to X-rays so take proper countermeasures such as making periodic image correction. * This product is warranted for a period of 12 months after the date of the shipment. The warranty is limited to make a replacement or repair of any defective product due to defects in workmanship or materials used in manufacture. It does not cover loss or damage caused by natural disaster, misuse (including modifications and any use not complying with the environment, application, usage and storage conditions described in this datasheet), or total radiation dose over 1 million Roentgen (incident X-ray energy: less than 100 kVp) even within the warranty period. * As described above, flat panel sensors have limited resistance to radiation. This must be taken into account when using a flat panel sensor under continuous irradiation (in-line non-destructive inspection, etc.) When using flat panel sensors in non-destructive inspection equipment, please contact us and provide information such as irradiation conditions. C7921CA-09 conforms to European EMC directives: EN61326 Class A Description of terms Blemish Length of pixel cluster which has less sensitivity than 90 % of the average sensitivity of the surrounding pixels. Column Bright line output adjacent to a defect line A B C D E F G H I The relative sensitivity ratio "a/b" should be 120 % or less for both vertical and horizontal lines, where "a" and "b" are defined as follows: Note that the average sensitivity of the bright line is calculated from the region adjacent to the defect region in the defect line. Example: See the right figure Defect region in defect line: From pixel (J, 1) to pixel (J, 15) a: Average sensitivity from pixel (I, 1) to pixel (I, 15) or from pixel (K, 1) to pixel (K, 15) b: Average sensitivity from pixel (H, 1) to pixel (H, 15) or from pixel (L, 1) to pixel (L, 15) Row a: Average sensitivity of bright line (Line A) adjacent to defect line b: Average sensitivity of standard line (Line B) adjacent to Line A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 J K L M N O P Q R S Line B (Column H, L) Line A (Column I, K) Defect line (Column J) KACCC0385EB Defect cluster Formed with more than 3 x 3 pixels which have less sensitivity than 1/8 of the average sensitivity of the surrounding pixels. This is defined as defect cluster. Normal pixel This is not defined as defect cluster. Defective pixel KACCC0384EB 7 Flat panel sensor C7921CA-09 Non-uniformity of sensitivity 16 x 16 segments are 16 x 16-divided active area excluded 1 mm from the whole edge. Xij is defined as the average sensitivity of each segment. Uniformity of sensitivity is calculated as following equation. Non-unifomity of sensitivity = x : standard deviation of 16 x 16 "Xij" x : average value of 16 x 16 "Xij" 20 pixels 62 Pixels 62 pixels 20 62 pixels pixels 20 61 pixels 61 pixels pixels 1 mm 62 pixels *********** 20 Pixels 57 pixels 61 pixels Active area *********** *********** 16 segments 16 segments *********** 1 mm *********** 1 mm 1 mm Active area KACCC0404EA Optional cable for frame grabber board Frame grabber board General-purpose IMAQ PCI-1424 *9 Cable type No. A8406-31 A8406-36 A8406-37 A8406-38 A8406-32 A8406-33 A8406-34 A8406-35 Cable length 5m 7m 10 m 12 m 5m 7m 10 m 12 m Cable end Open TX20A-36PH1-D2P1-D1E *10 PCS-XE100MA+ *11 *9: Made by NI (National Instrument Corporation) *10: Made by JAE (Japan Aviation Electronics Industry, Limited) *11: Made by Honda Tsushin Kogyo Co.Ltd. Note: The detailed information for these optional cables is shown in the datasheet of the A8406 series. Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions. Specifications are subject to change without notice. No patent rights are granted to any of the circuits described herein. (c)2008 Hamamatsu Photonics K.K. www.hamamatsu.com HAMAMATSU PHOTONICS K.K., Solid State Division 1126-1 Ichino-cho, Higashi-ku, Hamamatsu City, 435-8558 Japan, Telephone: (81) 53-434-3311, Fax: (81) 53-434-5184 U.S.A.: Hamamatsu Corporation: 360 Foothill Road, P.O.Box 6910, Bridgewater, N.J. 08807-0910, U.S.A., Telephone: (1) 908-231-0960, Fax: (1) 908-231-1218 Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49) 08152-3750, Fax: (49) 08152-2658 France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: 33-(1) 69 53 71 00, Fax: 33-(1) 69 53 71 10 United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44) 1707-294888, Fax: (44) 1707-325777 North Europe: Hamamatsu Photonics Norden AB: Smidesvagen 12, SE-171 41 Solna, Sweden, Telephone: (46) 8-509-031-00, Fax: (46) 8-509-031-01 Italy: Hamamatsu Photonics Italia S.R.L.: Strada della Moia, 1/E, 20020 Arese, (Milano), Italy, Telephone: (39) 02-935-81-733, Fax: (39) 02-935-81-741 Cat. No. KACC1138E05 Jul. 2008 DN 8