3
Electronic Solutions Division
Interconnect Solutions
http://www.3Mconnector.com
3M and MetPak are trademarks of 3M Company.
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3M™ MetPak™ CP2 Press-Fit Header
2 mm Type B, 95, 110 and 125 Signal Contacts CP2 Series
• 25 mm basic system unit
• 38, 44 and 50 mm module
• 2 mm grid spacing allows for high signal density at low cost
• “Eye of the Needle” compliant pin press-fit design helps reduce
manufacturing time and cost
• Three contact mating levels for Early Mate Late Break or “Hot
Swap” applications help reduce manufacturing time and cost
• Feed through termination available for midplane applications
• Additional grounding rows available for improved ground bounce
and EMI immunity
• Mates with 5 row 3M™ MetPak™ HSHM, HM, and CP2 sockets
• End to end stackable with 5 row 3M™ MetPak™ HSHM, HM, and
CP2 headers
• See the Regulatory Information Appendix (RIA) in the “RoHS
compliance” section of www.3Mconnector.com for compliance
information (RIA E1 & C1 apply)
Date Modied: January 19, 2010 TS-2267-B
Sheet 1 of 7
Physical
Insulation:
Material: Glass Filled Polyester (PBT)
Flammability: UL94V-0
Contact:
Material: Copper Alloy
Plating: See Ordering Information
Mechanical
Mating Force: ≤ 0.75N/PIN
Withdrawl Force: ≥ 0.15N/PIN
Mating and Un-mating Operations: 50
Electrical
Electrical Load: 1.0 A at +70°C
Contact Resistance: ≤ 20 mΩ
Insulation Resistance: ≥ 10,000 MΩ
Test Voltage: 750 VACRMS
Environmental
Temperature Ratings: -55°C to +125°C
PCB Data
Recommended PCB Plated Through Hole: ϴ 0.6±0.05 mm
Drill Hole Diameter: Ө 0.7±0.02 mm
Hole platings: Cu 25~50 μm, Sn or SnPb<10 μm
PCB thickness: 2.4-5.6 mm for 3.7 mm tails, 1.4-5.6 mm for 2.3 mm tails
Press-In Force: ≤ 204N/pin on nominal hole diameter
Retention Force: ≥ 13.5N/pin on nominal hole diameter