July 2005 1 M9999-072205
MIC4420/4429 Micrel, Inc.
MIC4420/4429
6A-Peak Low-Side MOSFET Driver
Bipolar/CMOS/DMOS Process
General Description
MIC4420, MIC4429 and MIC429 MOSFET drivers are
tough, efficient, and easy to use. The MIC4429 and MIC429
are inverting drivers, while the MIC4420 is a non-inverting
driver.
They are capable of 6A (peak) output and can drive the larg-
est MOSFETs with an improved safe operating margin. The
MIC4420/4429/429 accepts any logic input from 2.4V to VS
without external speed-up capacitors or resistor networks.
Proprietary circuits allow the input to swing negative by as
much as 5V without damaging the part. Additional circuits
protect against damage from electrostatic discharge.
MIC4420/4429/429 drivers can replace three or more
discrete components, reducing PCB area requirements,
simplifying product design, and reducing assembly cost.
Modern BiCMOS/DMOS construction guarantees freedom
from latch-up. The rail-to-rail swing capability insures ad-
equate gate voltage to the MOSFET during power up/down
sequencing.
Note: See MIC4120/4129 for high power and narrow
pulse applications.
Features
• CMOS Construction
• Latch-Up Protected: Will Withstand >500mA
Reverse Output Current
• Logic Input Withstands Negative Swing of Up to 5V
• Matched Rise and Fall Times ................................ 25ns
• High Peak Output Current ............................... 6A Peak
• Wide Operating Range ............................... 4.5V to 18V
• High Capacitive Load Drive ............................10,000pF
• Low Delay Time .............................................. 55ns Typ
• Logic High Input for Any Voltage From 2.4V to VS
• Low Equivalent Input Capacitance (typ) ..................6pF
• Low Supply Current ...............450µA With Logic 1 Input
• Low Output Impedance ......................................... 2.5Ω
• Output Voltage Swing Within 25mV of Ground or VS
Applications
• Switch Mode Power Supplies
• Motor Controls
• Pulse Transformer Driver
• Class-D Switching Amplifiers
Functional Diagram
IN
OUT
MIC4429
INVERTING
MIC4420
NONINVERTING
0.1mA
0.4m
A
2kΩ
VS
GND
Micrel, Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel + 1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
M9999-072205 2 July 2005
MIC4420/4429 Micrel, Inc.
Ordering Information
Part No. Temperature
Standard Pb-Free Range Package Configuration
MIC4420CN MIC4420ZN 0°C to +70°C 8-Pin PDIP Non-Inverting
MIC4420BN MIC4420YN –40°C to +85°C 8-Pin PDIP Non-Inverting
MIC4420CM MIC4420ZM 0°C to +70°C 8-Pin SOIC Non-Inverting
MIC4420BM MIC4420YM –40°C to +85°C 8-Pin SOIC Non-Inverting
MIC4420BMM MIC4420YMM –40°C to +85°C 8-Pin MSOP Non-Inverting
MIC4420CT MIC4420ZT 0°C to +70°C 5-Pin TO-220 Non-Inverting
MIC4429CN MIC4429ZN 0°C to +70°C 8-Pin PDIP Inverting
MIC4429BN MIC4429YN –40°C to +85°C 8-Pin PDIP Inverting
MIC4429CM MIC4429ZM 0°C to +70°C 8-Pin SOIC Inverting
MIC4429BM MIC4429YM –40°C to +85°C 8-Pin SOIC Inverting
MIC4429BMM MIC4429YMM –40°C to +85°C 8-Pin MSOP Inverting
MIC4429CT MIC4429ZT 0°C to +70°C 5-Pin TO-220 Inverting
Pin Configurations
1
2
3
4
8
7
6
5
V S
OUT
OUT
GND
V S
IN
NC
GND
Plastic DIP (N)
SOIC (M)
MSOP (MM)
5 OUT
4 GND
3 VS
2 GND
1 IN
TO-220-5 (T)
Pin Description
Pin Number Pin Number Pin Name Pin Function
TO-220-5
DIP, SOIC, MSOP
1 2 IN Control Input
2, 4 4, 5 GND Ground: Duplicate pins must be externally connected together.
3, TAB 1, 8 VS Supply Input: Duplicate pins must be externally connected together.
5 6, 7 OUT Output: Duplicate pins must be externally connected together.
3 NC Not connected.
July 2005 3 M9999-072205
MIC4420/4429 Micrel, Inc.
Electrical Characteristics: (TA = 25°C with 4.5V ≤ VS ≤ 18V unless otherwise specified. Note 4.)
Symbol Parameter Conditions Min Typ Max Units
INPUT
VIH Logic 1 Input Voltage 2.4 1.4 V
VIL Logic 0 Input Voltage 1.1 0.8 V
VIN Input Voltage Range –5 VS + 0.3 V
IIN Input Current 0 V ≤ VIN ≤ VS –10 10 µA
OUTPUT
VOH High Output Voltage See Figure 1 VS–0.025 V
VOL Low Output Voltage See Figure 1 0.025 V
RO Output Resistance, IOUT = 10 mA, VS = 18 V 1.7 2.8 Ω
Output Low
RO Output Resistance, IOUT = 10 mA, VS = 18 V 1.5 2.5 Ω
Output High
IPK Peak Output Current VS = 18 V (See Figure 6) 6 A
IR Latch-Up Protection >500 mA
Withstand Reverse Current
SWITCHING TIME (Note 3)
tR Rise Time Test Figure 1, CL = 2500 pF 12 35 ns
tF Fall Time Test Figure 1, CL = 2500 pF 13 35 ns
tD1 Delay Time Test Figure 1 18 75 ns
tD2 Delay Time Test Figure 1 48 75 ns
POWER SUPPLY
IS Power Supply Current VIN = 3 V 0.45 1.5 mA
VIN = 0 V 90 150 µA
VS Operating Input Voltage 4.5 18 V
Absolute Maximum Ratings (Notes 1, 2 and 3)
Supply Voltage ...........................................................20V
Input Voltage ............................... VS + 0.3V to GND – 5V
Input Current (VIN > VS) .......................................... 50mA
Power Dissipation, TA ≤ 25°C
PDIP ....................................................................960W
SOIC ...............................................................1040mW
5-Pin TO-220 ...........................................................2W
Power Dissipation, TC ≤ 25°C
5-Pin TO-220 ......................................................12.5W
Derating Factors (to Ambient)
PDIP .............................................................7.7mW/°C
SOIC .............................................................8.3mW/°C
5-Pin TO-220 .................................................17mW/°C
Storage Temperature ............................. –65°C to +150°C
Lead Temperature (10 sec.) ................................... 300°C
Operating Ratings
Supply Voltage .............................................. 4.5V to 18V
Junction Temperature ............................................. 150°C
Ambient Temperature
C Version ................................................. 0°C to +70°C
B Version ............................................. –40°C to +85°C
Package Thermal Resistance
5-pin TO-220 (θJC) ............................................10°C/W
8-pin MSOP (θJA) ...........................................250°C/W
M9999-072205 4 July 2005
MIC4420/4429 Micrel, Inc.
tD1
90%
10%
tF
10%
0V
5V
t
D2 tR
VS
OUTPUT
INPUT 90%
0V
t
P W ≥ 0.5µs
2.5V
tPW
Figure 1. Inverting Driver Switching Time
IN
MIC4429
OUT
2500pF
VS = 18V
0.1µF 1.0µF
0.1µF
IN
MIC4420
OUT
2500pF
VS = 18V
0.1µF 1.0µF
0.1µF
90%
10%
t
R
10%
0V
5V
tF
VS
OUTPUT
INPUT 90%
0V
t
P W ≥ 0.5µs
tD1
tD2
t
PW
2.5V
Figure 2. Noninverting Driver Switching Time
Test Circuits
Electrical Characteristics: (TA = –55°C to +125°C with 4.5V ≤ VS ≤ 18V unless otherwise specified.)
Symbol Parameter Conditions Min Typ Max Units
INPUT
VIH Logic 1 Input Voltage 2.4 V
VIL Logic 0 Input Voltage 0.8 V
VIN Input Voltage Range –5 VS + 0.3 V
IIN Input Current 0V ≤ VIN ≤ VS –10 10 µA
OUTPUT
VOH High Output Voltage Figure 1 VS–0.025 V
VOL Low Output Voltage Figure 1 0.025 V
RO Output Resistance, IOUT = 10mA, VS = 18V 3 5 Ω
Output Low
RO Output Resistance, IOUT = 10mA, VS = 18V 2.3 5 Ω
Output High
SWITCHING TIME (Note 3)
tR Rise Time Figure 1, CL = 2500pF 32 60 ns
tF Fall Time Figure 1, CL = 2500pF 34 60 ns
tD1 Delay Time Figure 1 50 100 ns
tD2 Delay Time Figure 1 65 100 ns
POWER SUPPLY
IS Power Supply Current VIN = 3V 0.45 3.0 mA
VIN = 0V 0.06 0.4 mA
VS Operating Input Voltage 4.5 18 V
Note 1: Functional operation above the absolute maximum stress ratings is not implied.
Note 2: Static-sensitive device. Store only in conductive containers. Handling personnel and equipment should be grounded to
prevent damage from static discharge.
Note 3: Switching times guaranteed by design.
Note 4: Specification for packaged product only.
July 2005 5 M9999-072205
MIC4420/4429 Micrel, Inc.
Typical Characteristic Curves
30
20
10
5
1000 10,000
CAPACITIVE LOAD (pF)
TIME (ns)
V = 18V
S
Fall Time vs. Capacitive Load
40
50
V = 12V
S
V = 5V
S
60
50
40
30
20
10
–60 –20 20 60 100 140
TEMPERATURE (°C)
TIME (ns)
D1
t
D2
t
Propagation Delay Time
vs. Temperature
0 100 1000 10,000
CAPACITIVE LOAD (pF)
I – SUPPLY CURRENT (mA)
S
Supply Current vs. Capacitive Load
C = 2200 pF
L
V = 18V
S
84
70
56
42
28
14
0
500 kHz
200 kHz
20 kHz
V = 15V
S
60
50
40
30
20
10
0
DELAY TIME (ns)
4 6 8 10 12 14 16 18
SUPPLY VOLTAGE (V)
Delay Time vs. Supply Voltage
tD2
tD1
V = 12V
S
V = 5V
S
30
20
10
5
1000 10,000
CAPACITIVE LOAD (pF)
V = 18V
S
Rise Time vs. Capacitive Load
40
50
TIME (ns)
100
0
0 100 1000 10,000
FREQUENCY (kHz)
SUPPLY CURRENT (mA)
Supply Current vs. Frequency
10
1000
18V
10V
5V
C = 2200 pF
L
–60 –20 20 60 100 140
TEMPERATURE (°C)
5 7 9 11 13 15
V (V)
S
5 7 9 11 13 15
t
RISE
t
25
20
15
10
5
0
TIME (ns)
Rise and Fall Times vs. Temperature
C = 2200 pF
V = 18V
S
FALL
C = 2200 pF
L
60
50
40
30
20
10
0
TIME (ns)
Rise Time vs. Supply Voltage
C = 4700 pF
L
C = 10,000 pF
L
C = 2200 pF
L
TIME (ns)
Fall Time vs. Supply Voltage
C = 4700 pF
L
C = 10,000 pF
L
50
40
30
20
10
0
L
V (V)
S
3000 3000
M9999-072205 6 July 2005
MIC4420/4429 Micrel, Inc.
Typical Characteristic Curves (Cont.)
2.5
2
1.5
15 9 13
V (V)
S
Low-State Output Resistance
R ( )W
OUT
100 mA
50 mA
10 mA
7 11 15
1000
800
600
400
200
0
SUPPLY VOLTAGE (V)
900
800
700
600
500
400
–60 –20 20 60 100 140
TEMPERATURE (°C)
Quiescent Power Supply
Current vs. Temperature
LOGIC “1” INPUT
V = 18V
S
SUPPLY CURRENT (A)
0 4 8 12 16 20
SUPPLY CURRENT (A)
Quiescent Power Supply
Voltage vs. Supply Current
LOGIC “1” INPUT
5
4
3
25 9 13
V (V)
S
High-State Output Resistance
R ( )W
OUT
100 mA
50 mA
10 mA
7 11 15
200
160
120
80
40
0
DELAY (ns)
5 6 7 11 13 15
Effect of Input Amplitude
on Propagation Delay
LOAD = 2200 pF
INPUT 2.4V
INPUT 3.0V
INPUT 5.0V
INPUT 8V AND 10V
8 9 10 12 14
V (V)
S
2.0
1.5
1.0
0.5
0
CROSSOVER AREA (A•s) x 10-8
5 6 7 11 13 15
Crossover Area vs. Supply Voltage
8 9 10 12 14
SUPPLY VOLTAGE V (V)
LOGIC “0” INPUT
PER TRANSITION
S
July 2005 7 M9999-072205
MIC4420/4429 Micrel, Inc.
Applications Information
Supply Bypassing
Charging and discharging large capacitive loads quickly
requires large currents. For example, charging a 2500pF
load to 18V in 25ns requires a 1.8 A current from the device
power supply.
The MIC4420/4429 has double bonding on the supply pins,
the ground pins and output pins This reduces parasitic lead
inductance. Low inductance enables large currents to be
switched rapidly. It also reduces internal ringing that can
cause voltage breakdown when the driver is operated at
or near the maximum rated voltage.
Internal ringing can also cause output oscillation due to
feedback. This feedback is added to the input signal since
it is referenced to the same ground.
To guarantee low supply impedance over a wide frequency
range, a parallel capacitor combination is recommended for
supply bypassing. Low inductance ceramic disk capacitors
with short lead lengths (< 0.5 inch) should be used. A 1µF
low ESR film capacitor in parallel with two 0.1 µF low ESR
ceramic capacitors, (such as AVX RAM GUARD®), provides
adequate bypassing. Connect one ceramic capacitor di-
rectly between pins 1 and 4. Connect the second ceramic
capacitor directly between pins 8 and 5.
Grounding
The high current capability of the MIC4420/4429 demands
careful PC board layout for best performance Since the
MIC4429 is an inverting driver, any ground lead impedance
will appear as negative feedback which can degrade switch-
ing speed. Feedback is especially noticeable with slow-rise
time inputs. The MIC4429 input structure includes 300mV
of hysteresis to ensure clean transitions and freedom from
oscillation, but attention to layout is still recommended.
Figure 3 shows the feedback effect in detail. As the MIC4429
input begins to go positive, the output goes negative and
several amperes of current flow in the ground lead. As little
as 0.05Ω of PC trace resistance can produce hundreds of
millivolts at the MIC4429 ground pins. If the driving logic is
referenced to power ground, the effective logic input level
is reduced and oscillation may result.
To insure optimum performance, separate ground traces
should be provided for the logic and power connections.
Connecting the logic ground directly to the MIC4429 GND
pins will ensure full logic drive to the input and ensure fast
output switching. Both of the MIC4429 GND pins should,
however, still be connected to power ground.
Figure 3. Self-Contained Voltage Doubler
M9999-072205 8 July 2005
MIC4420/4429 Micrel, Inc.
Table 1: MIC4429 Maximum
Operating Frequency
VS Max Frequency
18V 500kHz
15V 700kHz
10V 1.6MHz
Conditions: 1. DIP Package (θJA = 130°C/W)
2. TA = 25°C
3. CL = 2500pF
Input Stage
The input voltage level of the 4429 changes the quiescent
supply current. The N channel MOSFET input stage tran-
sistor drives a 450µA current source load. With a logic “1”
input, the maximum quiescent supply current is 450µA.
Logic “0” input level signals reduce quiescent current to
55µA maximum.
The MIC4420/4429 input is designed to provide 300mV of
hysteresis. This provides clean transitions, reduces noise
sensitivity, and minimizes output stage current spiking when
changing states. Input voltage threshold level is approxi-
mately 1.5V, making the device TTL compatible over the
4 .5V to 18V operating supply voltage range. Input current
is less than 10µA over this range.
The MIC4429 can be directly driven by the TL494,
SG1526/1527, SG1524, TSC170, MIC38HC42 and similar
switch mode power supply integrated circuits. By offloading
the power-driving duties to the MIC4420/4429, the power
supply controller can operate at lower dissipation. This can
improve performance and reliability.
The input can be greater than the +VS supply, however,
current will flow into the input lead. The propagation delay
for TD2 will increase to as much as 400ns at room tem-
perature. The input currents can be as high as 30mA p-p
(6.4mARMS) with the input, 6 V greater than the supply
voltage. No damage will occur to MIC4420/4429 however,
and it will not latch.
The input appears as a 7pF capacitance, and does not
change even if the input is driven from an AC source. Care
should be taken so that the input does not go more than 5
volts below the negative rail.
Power Dissipation
CMOS circuits usually permit the user to ignore power dis-
sipation. Logic families such as 4000 and 74C have outputs
which can only supply a few milliamperes of current, and
even shorting outputs to ground will not force enough cur-
rent to destroy the device. The MIC4420/4429 on the other
hand, can source or sink several amperes and drive large
capacitive loads at high frequency. The package power
dissipation limit can easily be exceeded. Therefore, some
attention should be given to power dissipation when driving
low impedance loads and/or operating at high frequency.
The supply current vs frequency and supply current vs
capacitive load characteristic curves aid in determining
power dissipation calculations. Table 1 lists the maximum
safe operating frequency for several power supply volt-
ages when driving a 2500pF load. More accurate power
dissipation figures can be obtained by summing the three
dissipation sources.
Given the power dissipation in the device, and the thermal
resistance of the package, junction operating temperature
for any ambient is easy to calculate. For example, the
thermal resistance of the 8-pin MSOP package, from the
data sheet, is 250°C/W. In a 25°C ambient, then, using a
maximum junction temperature of 150°C, this package will
dissipate 500mW.
Accurate power dissipation numbers can be obtained by
summing the three sources of power dissipation in the
device:
• Load Power Dissipation (PL)
• Quiescent power dissipation (PQ)
• Transition power dissipation (PT)
Calculation of load power dissipation differs depending on
whether the load is capacitive, resistive or inductive.
Resistive Load Power Dissipation
Dissipation caused by a resistive load can be calculated
as:
PL = I2 RO D
where:
I = the current drawn by the load
RO = the output resistance of the driver when the output
is high, at the power supply voltage used. (See data
sheet)
D = fraction of time the load is conducting (duty cycle)
Figure 4. Switching Time Degradation Due to
Negative Feedback
MIC4429
1
86, 7
5
4
+18 V
0.1µF
0.1µF
TE K C U RR E N T
PROBE 6302
2,500 pF
P O L YC AR BO N AT E
5.0V
0 V
18 V
0 V
WIMA
MKS-2
1 µF
LOGIC
GROUND
POWER
GROUND
6 AMPS
300 mV PC TRACE RESISTANCE = 0.05Ω
July 2005 9 M9999-072205
MIC4420/4429 Micrel, Inc.
where:
IH = quiescent current with input high
IL = quiescent current with input low
D = fraction of time input is high (duty cycle)
VS = power supply voltage
Transition Power Dissipation
Transition power is dissipated in the driver each time its
output changes state, because during the transition, for a
very brief interval, both the N- and P-channel MOSFETs in
the output totem-pole are ON simultaneously, and a cur-
rent is conducted through them from V+S to ground. The
transition power dissipation is approximately:
PT = 2 f VS (A•s)
where (A•s) is a time-current factor derived from the typical
characteristic curves.
Total power (PD) then, as previously described is:
PD = PL + PQ +PT
Definitions
CL = Load Capacitance in Farads.
D = Duty Cycle expressed as the fraction of time the
input to the driver is high.
f = Operating Frequency of the driver in Hertz
IH = Power supply current drawn by a driver when both
inputs are high and neither output is loaded.
IL = Power supply current drawn by a driver when both
inputs are low and neither output is loaded.
ID = Output current from a driver in Amps.
PD = Total power dissipated in a driver in Watts.
PL = Power dissipated in the driver due to the driver’s
load in Watts.
PQ = Power dissipated in a quiescent driver in
Watts.
PT = Power dissipated in a driver when the output
changes states (“shoot-through current”) in Watts.
NOTE: The “shoot-through” current from a dual
transition (once up, once down) for both drivers
is shown by the "Typical Characteristic Curve :
Crossover Area vs. Supply Voltage and is in am-
pere-seconds. This figure must be multiplied by
the number of repetitions per second (frequency)
to find Watts.
RO = Output resistance of a driver in Ohms.
VS = Power supply voltage to the IC in Volts.
Capacitive Load Power Dissipation
Dissipation caused by a capacitive load is simply the en-
ergy placed in, or removed from, the load capacitance by
the driver. The energy stored in a capacitor is described
by the equation:
E = 1/2 C V2
As this energy is lost in the driver each time the load is
charged or discharged, for power dissipation calculations
the 1/2 is removed. This equation also shows that it is
good practice not to place more voltage on the capacitor
than is necessary, as dissipation increases as the square
of the voltage applied to the capacitor. For a driver with a
capacitive load:
PL = f C (VS)2
where:
f = Operating Frequency
C = Load Capacitance
VS = Driver Supply Voltage
Inductive Load Power Dissipation
For inductive loads the situation is more complicated. For
the part of the cycle in which the driver is actively forcing
current into the inductor, the situation is the same as it is
in the resistive case:
PL1 = I2 RO D
However, in this instance the RO required may be either
the on resistance of the driver when its output is in the high
state, or its on resistance when the driver is in the low state,
depending on how the inductor is connected, and this is
still only half the story. For the part of the cycle when the
inductor is forcing current through the driver, dissipation is
best described as
PL2 = I VD (1-D)
where VD is the forward drop of the clamp diode in the
driver (generally around 0.7V). The two parts of the load
dissipation must be summed in to produce PL
PL = PL1 + PL2
Quiescent Power Dissipation
Quiescent power dissipation (PQ, as described in the input
section) depends on whether the input is high or low. A low
input will result in a maximum current drain (per driver) of
≤0.2mA; a logic high will result in a current drain of ≤2.0mA.
Quiescent power can therefore be found from:
PQ = VS [D IH + (1-D) IL]
M9999-072205 10 July 2005
MIC4420/4429 Micrel, Inc.
Figure 5. Peak Output Current Test Circuit
MIC4429
1
86, 7
5
4
+18 V
0.1µF
0.1µF
TEK C UR RE NT
PROBE 6302
10,000 pF
P OL Y C AR BO N A T E
5.0V
0 V
18 V
0 V
WIMA
MK22
1 µF
2
July 2005 11 M9999-072205
MIC4420/4429 Micrel, Inc.
Package Information
0.380 (9.65)
0.370 (9.40) 0.135 (3.43)
0.125 (3.18)
PIN 1
DIMENSIONS:
INCH (MM)
0.018 (0.57)
0.100 (2.54)
0.013 (0.330)
0.010 (0.254)
0.300 (7.62)
0.255 (6.48)
0.245 (6.22)
0.380 (9.65)
0.320 (8.13)
0.0375 (0.952)
0.130 (3.30)
8-Pin Plastic DIP (N)
8-Pin SOIC (M)
M9999-072205 12 July 2005
MIC4420/4429 Micrel, Inc.
0.004 (0.10)
0.035 (0.89)
0.021 (0.53)
0.012 (0.03) R
0.0256 (0.65) TYP
0.012 (0.30) R
5°
0° MIN
0.112 (2.84)
0.116 (2.95)
0.012 (0.03)
0.007 (0.18)
0.005 (0.13)
0.038 (0.97)
0.032 (0.81)
INCH (MM)
0.187 (4.74)
8-Pin MSOP (MM)
0.018 ±0.008
(0.46 ±0.20)
0.268 REF
(6.81 REF)
0.032 ±0.005
(0.81 ±0.13)
0.550 ±0.010
(13.97 ±0.25)
7°
Typ.
SEATING
PLANE
0.578 ±0.018
(14.68 ±0.46)
0.108 ±0.005
(2.74 ±0.13)
0.050 ±0.005
(1.27 ±0.13)
0.150 D ±0.005
(3.81 D ±0.13)
0.400 ±0.015
(10.16 ±0.38)
0.177 ±0.008
(4.50 ±0.20)
0.103 ±0.013
(2.62 ±0.33)
0.241 ±0.017
(6.12 ±0.43)
0.067 ±0.005
(1.70 ±0.127)
inch
(mm)
Dimensions:
5-Lead TO-220 (T)
MICREL INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL + 1 (408) 944-0800 FAX + 1 (408) 474-1000 WEB http://www.micrel.com
This information furnished by Micrel in this data sheet is believed to be accurate and reliable. However no responsibility is assumed by Micrel for its
use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product
can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical
implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the
user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser
agrees to fully indemnify Micrel for any damages resulting from such use or sale.
© 2001 Micrel, Inc.