1
DP0540038_01Thyristors/Triacs
TRIACs
February 2005
TOSHIBA CORPORATION
Semiconductor Company
Discrete Semiconductor Division
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DP0540038_01Thyristors/Triacs
New TRIAC Line up
Sample Mass-Pro Packege Schedule
IT(RMS) VDRM ITSM(A) IGT (mA) Schedule Schedule Name
Product
Name
400V SM2G54
800V SM2L54
400V SM8GZ52
800V SM8LZ52
400V SM10GZ52
800V SM10LZ52
400V SM12GZ52
800V SM12LZ52
400V SM16GZ52
800V SM16LZ52
TO-220
SIS
TO-220
SIS
12 10 TO-126
TO-220
SIS
TO-220
SIS
ok
ok
ok
ok ok
Main Characteristic
2A
16A
80 30
100
8A
12A 120
10A
Note1160
30
30
30
ok
okok
Note1
The maximum junction temperature of 150 degrees C is planned.
Note1: Please contact Tosdhiba
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DP0540038_01Thyristors/Triacs
New Package TO220SIS(Smart ISolation)
Feature
1) Lower Profile Package
To modified Stand off shape, 2.8 mm lower than currentTO-220NIS
2) Bonding Wire-less Assembly
Curtailment of the open fault by serge current
3) Lead free outer lead
100% lead free solder using for outer lead finish
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DP0540038_01Thyristors/Triacs
Mount Height : TO220NIS vs TO220SIS
New Package:
TO-220SIS
Current Package:
TO-220NIS
10 φ3.2
3.0
3.9
15
13.0 MIN.
5.6
MAX.
4.5
2.7
10 φ3.2
3.0
3.9
15
12.5 MIN.
2.8MAX.
4.5
2.7
L1-L2=2.8
L1L2
Board Unit in mm
Lower Profile Package
To modified Stand off shape, 2.8 mm lower than current TO-220NIS
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DP0540038_01Thyristors/Triacs
New
Package
TO-220SIS
φ
3.0
3.9
15±0.3
12.5 M IN.
2.8M AX.
φ
3.0
3.9
15±0.3
13.0 M IN.
5.6M AX.
TO-220NIS
Dimension: TO220NIS vs TO220SIS
Unit in mm
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DP0540038_01Thyristors/Triacs
The heat dissipation efficiency rise by the formation
of T1 terminal copper connector.
<Current Design> <New Design>
It is
transmitted to
a connector
from the Chip
upper part,
and heat is
radiated to a
both-ends
child.
TO-220SIS Series : Introduction of new technology
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DP0540038_01Thyristors/Triacs
The information contained herein is subject to change without notice. 021023_D
The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumedby
TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of TOSHIBA or others. 021023_C
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in
general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress.
It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe
design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss
of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the
most recent TOSHIBA products specifications.
Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or
“TOSHIBA Semiconductor Reliability Handbook” etc. 021023_A
The Toshiba products listed in this document are intended for usage in general electronics applications (computer, personal equipment,
office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).
These Toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or
reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage
include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments,
combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of Toshiba products listed in this
document shall be made at the customer’s own risk. 021023_B
The products described in this document may include products subject to the foreign exchange and foreign trade laws. 021023_F
TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced and sold, under any law and
regulations. 030519_Q
The products described in this document may contain components made in the United States and subject to export control of the U.S.
authorities. Diversion contrary to the U.S. law is prohibited. 021023_H
