Page 1 of 2 Product Name Series Type Part Number Multilayer Inductor for Ultra High Frequency Range MLK Series 1005 Type MLK1005S5N6DT000 Product Lifecycle Stage PROD Specification Summary/Applications/Feature Mounting Method Flag Yes Processing MULTI-LAYER Shape SMD Size Code 1005 Summary Body Length(L) Nom 1m m Body Breadth(W) Nom 0.5 m m Body Height(T) Nom 0.5 m m Rated Inductance Nom 5.6 n H Inductance Tolerance (Value) Min -0.5 n H Max 0.5 n H Nom 100 M Hz Min 7 Typ 9 Nom 100 M Hz Min 5.7 G Hz Typ 6.7 G Hz Test Frequency of Inductance Q Test Frequency of Q Self Resonant Frequency DC Resistance Max 0.3 Ohm DC Resistance Nom 0.15 Ohm Rated Current Max 400 m A IDC1 ( Inductance Change) Max 400 m A IDC2 ( Temperature Rise) Max 400 m A Temperature Rise Max Cellular,VCO module,PA Applications module,Bluetooth,other high frequency circuit for mobile applications Feature Small size High-Q RF coil for high frequency circuit of mobile application. High Self Resonance Frequency (SRF). No polarity. Lead free, lead free soldering, and RoHS compliant Packaging Punched (Paper)Taping [180mm Reel] Packing Minumum Package Qty Nom 10000 Pcs Minimum Order Qty 10000 Pcs Nom 20 Cel Terminal Material Ag(100%)/Sn plating Polarity Marking No Magnetic Shielding No Soldering Method Reflow,Iron Soldering Measuring Equipment(L, Q, Rdc) L,Q:HP4291A+16193A, Rdc:YOKOGAWA TYPE7561 Min -55 Cel Max 125 Cel Storage Temperature Range Min -55 Cel Category Temperature Range Small size High-Q RF coil for high frequency circuit of mobile application. Pb free and correspond to Pb free soldering. http://roots.tdk.co.jp/rootsme.asp?ID=TJA024&NO=MLK1005S5N6DT00022... 3/27/2009 Page 2 of 2 Max Weight Nom 125 Cel 0.001 g [ Caution ] Specifications which provide more details for the proper and safe use of the described product are available upon request. [ Notice of Revision and Improve ] All specifications are subject to change without notice. Copyright(c) 1996-2008 All rights reserved. http://roots.tdk.co.jp/rootsme.asp?ID=TJA024&NO=MLK1005S5N6DT00022... 3/27/2009