The documentation and process conversion measures necessary to comply with this revision shall be completed by 9 May 2016. INCH-POUND MIL-PRF-19500/435N 9 February 2016 SUPERSEDING MIL-PRF-19500/435M 5 September 2014 PERFORMANCE SPECIFICATION SHEET * SEMICONDUCTOR DEVICE, DIODE, SILICON, LOW-NOISE VOLTAGE REGULATOR, ENCAPSULATED (AXIAL LEAD THROUGH-HOLE AND SURFACE MOUNT PACKAGES) AND UN-ENCAPSULATED (DIE), TYPES 1N4099 THROUGH 1N4135, 1N4614 THROUGH 1N4627, C AND D TOLERANCE SUFFIX DEVICES, JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC This specification is approved for use by all Departments and Agencies of the Department of Defense. The requirements for acquiring the product described herein shall consist of this specification sheet and MIL-PRF-19500. 1. SCOPE * 1.1 Scope. This specification covers the performance requirements for 500 milliwatt, silicon, low-noise, voltage regulator diodes with voltage tolerances of 5 percent, 2 percent, and 1 percent. Four levels of product assurance (JAN, JANTX, JANTXV, and JANS) are provided for each encapsulated device. Two levels of product assurance (JANHC and JANKC) are provided for each unencapsulated device (die). For JANHC and JANKC quality levels see 6.6.2. * 1.2 Package outlines. The device package outlines are as follows: DO-35 in accordance with figure 1, DO-213AA in accordance with figure 2, die in accordance with figure 3, UB, UBCA, UBD, and UBCC in accordance with figure 4, UB2 and UB2R in accordance with figure 5. 1.3 Maximum ratings Unless otherwise specified TC = 25C. Maximum ratings are as shown in maximum test ratings herein (see 3.8), and as follows: a. PTL = 500 mW (DO-35) at TL = 50C, L = .375 inch (9.53 mm); both ends of case or diode body to heat sink at L = .375 inch (9.53 mm). (Derate to 0 at +175C). b. PTEC = 500 mW (DO-213AA) at TEC = 125C. (Derate to 0 at 175C). -65C TJ +175C; -65C TSTG +175C. c. PTPCB = 400 mW, TA = +55C. (Derate to 0 at +175C). d. PSP(IS) = 500 mW (UB) at TSP(IS) = 125C. (Derate to 0 at 175C). -65C TJ +175C; -65C TSTG +175C. Comments, suggestions, or questions on this document should be addressed to DLA Land and Maritime, ATTN: VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to Semiconductor@dla.mil . Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at https://assist.dla.mil. AMSC N/A FSC 5961 MIL-PRF-19500/435N 1.4 Primary electrical characteristics. Primary electrical characteristics are as shown in primary test ratings herein (see 3.8) and as follows: a. 1.8 V dc VZ 100 V dc. b. RJL = 250C/W (maximum) at L = .375 inch (9.53 mm) (DO-35). c. Noise density see 4.5.5 and figure 6. d. RJEC = 100C/W (maximum) junction to end-caps (DO-213AA). e. See figure 7, 8, and 9 for derating curves. TA = +75C for both axial and Metal Electrical Leadless Face (MELF) (US) on printed circuit board (PCB), PCB = FR4 .0625 inch (1.59 mm) 1-layer 1-Oz Cu, horizontal, still air, pads (US) = .05 inch (1.27 mm) x .087 inch (2.21 mm); pads (Axial) = .092 inch (2.34 mm) diameter, strip = .030 inch (0.762 mm) x 1 inch (25.4 mm) long, axial lead length L .125 inch ( 3.18 mm); RJA with a defined thermal resistance condition included is measured at IO = 1 A. f. RJA = 300C/W. Junction to ambient including PCB, see 1.4.e herein. g. RJSP(IS) = 90C/W (maximum) junction to solder pad (IS) (UB). h. RJA(PCB) = 250C/W (maximum) junction to ambient (PCB) (UB). i. For thermal impedance curves, see figures 10, 11, 12, 13, and 14. * 1.5 Part or Identifying Number (PIN). The PIN is in accordance with MIL-PRF-19500, and as specified herein. See 6.5 for PIN construction example and 6.6 for a list of available PINs. * 1.5.1 JAN certification mark and quality level for encapsulated devices. The quality level designators for encapsulated devices that are applicable for this specification sheet from the lowest to the highest level are as follows: "JAN", "JANTX", "JANTXV" and "JANS". * 1.5.2 JAN certification mark and quality level for unencapsulated devices (die). The quality level designators for unencapsulated devices (die) that are applicable for this specification sheet from the lowest to the highest level are as follows: "JANHC" and "JANKC". * 1.5.3 Device type. The designation system for the device types of diodes covered by this specification sheet are as follows. * 1.5.3.1 First number and first letter symbols. The diodes of this specification sheet use the first number and letter symbols "1N". * 1.5.3.2 Second number symbols. The second number symbols for the diodes covered by this specification sheet are as follows: "4099", "4100", "4101", "4102", "4103", "4104", "4105", "4106", "4107", "4108", "4109", "4110", "4111", "4112", "4113", "4114", "4115", "4116", "4117", "4118", "4119", "4120", "4121", "4122", "4123", "4124", "4125", "4126", "4127", "4128", "4129", "4130", "4131", "4132", "4133", "4134", "4135", "4614", "4615", "4616", "4617", "4618", "4619", "4620", "4621", "4622", "4623", "4624", "4625", "4626", and "4627". * 1.5.3.3 First suffix symbols. Following the second number symbols, no suffix letter indicates 5 percent voltage tolerance. The suffix letter "C" is used on devices that have a 2 percent voltage tolerance, the suffix letter D is used on devices that have a 1 percent voltage tolerance. 2 MIL-PRF-19500/435N * * * 1.5.3.4 Second suffix symbols. The following suffix symbols are incorporated in the PIN for this specification sheet: -1 Indicates an axial through-hole mount (DO-35) package with a metallurgical bond. (see figure 1). UR-1 Indicates a surface mount, round endcap (DO-213AA) package with a metallurgical bond. (see figure 2) UB Indicates a 4 pad surface mount package. The metal lid is connected to pad 4 (one diode with cathode connected to two leads, see figure 4). UBCA Indicates a 4 pad surface mount package. The metal lid is connected to pad 4, (two diodes with common anode, see figure 4). UBD Indicates a 4 pad surface mount package. The metal lid is connected to pad 4, (two diodes with one anode and one cathode common, see figure 4). UBCC Indicates a 4 pad surface mount package. The metal lid is connected to pad 4, (two diodes with common cathode, see figure 4). UB2 Indicates a 4 pad surface mount package. The metal lid is connected to pad 4, (one diode, see figure 5). UB2R Indicates a 4 pad surface mount package. The metal lid is connected to pad 4, (one diode, reverse polarity of UB2, see figure 5). 1.5.4 Lead finish. The lead finishes applicable to this specification sheet are listed on QPDSIS-19500. 1.5.5 Die identifiers for unencapsulated devices (manufacturers and critical interface identifiers). The manufacturer die identifiers that are applicable for this specification sheet is "A" (see figure 3 and 6.6). 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3 and 4 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-19500 - Semiconductor Devices, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-750 - Test Methods for Semiconductor Devices. (Copies of these documents are available online at http://quicksearch.dla.mil.) 2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3 MIL-PRF-19500/435N Dimensions Ltr BD BL LD LL LL1 Inches Min .056 .140 .018 1.000 Max .090 .200 .022 1.500 .050 Millimeters Min Max 1.42 2.29 3.56 5.08 0.46 0.56 25.40 38.10 1.27 Notes 3 3 4 NOTES: 1. Dimensions are in inches. 2. Millimeter equivalents are given for general information only. 3. Package contour optional within BD and length BL. Heat slugs, if any, shall be included within this cylinder but shall not be subject to minimum limit of BD. The BL dimension shall include the entire body including slugs. 4. Within this zone lead, diameter may vary to allow for lead finishes and irregularities other than heat slugs. 5. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. FIGURE 1. Semiconductor device, diode, types 1N4099-1 through 1N4135-1 and 1N4614-1 through 1N4627-1 (DO-35). 4 MIL-PRF-19500/435N Symbol BD ECT BL S Dimensions Inches Millimeters Min Max Min Max .063 .067 1.60 1.70 .016 .022 0.41 0.56 .130 .146 3.30 3.71 .001 min 0.03 min NOTES: 1. Dimensions are in inches. 2. Millimeter equivalents are given for general information only. 3. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. FIGURE 2. Physical dimensions 1N4099UR-1 through 1N4135UR-1 and 1N4614UR-1 through 1N4627UR-1 (DO-213AA). 5 MIL-PRF-19500/435N Ltr A B JANHCA and JANKCA Inches Millimeters Min Max Min Max .021 .025 0.53 0.63 .013 .017 0.33 0.43 Ltr A B Ltr A B JANHCB and JANKCB Inches Millimeters Min Max Min Max .024 .028 0.61 0.71 .017 .021 0.43 0.53 JANHCC and JANKCC Inches Millimeters Min Max Min Max .019 .023 0.48 0.58 .013 .017 0.33 0.43 NOTES: 1. Dimensions are in inches. 2. Millimeter equivalents are given for general information only. 3. The JANHCA and JANKCA die thickness is .010 (0.25 mm) .002 inches (0.05 mm). Anode metallization: Al, thickness = 25,000 A minimum; cathode metallization: Au, thickness = 4,000 A minimum. 4. The JANHCB and JANKCB die thickness is .010 (0.25 mm) .002 inches (0.05 mm). Anode metallization: Al, thickness = 40,000 A minimum; cathode metallization: Au, thickness = 5,000 A minimum. 5. The JANHCC and JANKCC die thickness is .010 (0.25 mm) .002 inches (0.05 mm). Anode metallization: Al, thickness = 25,000 A minimum; cathode metallization: Au, thickness = 4,000 A minimum. 6. Circuit layout data: For zener operation, cathode must be operated positive with respect to anode. 7. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. FIGURE 3. Physical dimensions JANHC and JANKC die. 6 MIL-PRF-19500/435N UB UBCA UBCC UBD Symbol BH BL BW CL CW LL1 LL2 Dimensions Inches Millimeters Min Max Min Max .046 .056 1.17 1.42 .115 .128 2.92 3.25 .085 .108 2.16 2.74 .128 3.25 .108 2.74 .022 .038 0.56 0.97 .017 .035 0.43 0.89 Symbol LS1 LS2 LW r r1 r2 Dimensions Inches Millimeters Min Max Min Max .035 .039 0.89 0.99 .071 .079 1.80 2.01 .016 .024 0.41 0.61 .008 0.20 .012 0.31 .022 0.56 NOTES: 1. Dimensions are in inches. Millimeters are given for general information only. 2. Ceramic package only. 3. Hatched areas on package denote metallized areas. Pad 4 = shielding, connected to the lid. 4. Dimensions are pre-solder dip. 5. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. FIGURE 4. Physical dimensions, surface mount (UB version). 7 MIL-PRF-19500/435N UB2 UB2R Dimensions Symbol Inches Dimensions Millimeters Min Max Min Max BH .046 .056 1.17 1.42 BL .115 .128 2.92 3.25 BW .085 .108 2.16 CL CW .128 .108 Symbol Inches Millimeters Min Max Min Max LS .071 .079 1.80 2.01 LW .016 .024 0.41 0.61 2.74 r .008 TYP 0.20 TYP 3.25 2.74 r1 r2 .012 TYP .022 TYP 0.30 TYP 0.56 TYP LL1 .022 .038 0.56 0.96 r3 .008 TYP 0.20 TYP LL2 .017 .035 0.43 0.89 r4 .012 TYP 0.30 TYP NOTES: 1. Dimensions are in inches. Millimeters are given for general information only. 2. Ceramic package only. 3. Hatched areas on package denote metallized areas. Pad 4 = shielding, connected to the lid. 4. Dimensions are pre-solder dip. 5. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. FIGURE 5. Physical dimensions, surface mount (2 pin UB2 version). 8 MIL-PRF-19500/435N 3. REQUIREMENTS 3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein. 3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturer's list (QML) before contract award (see 4.2 and 6.3). 3.3 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein shall be as specified in MIL-PRF-19500 and as follows: C 2 percent voltage tolerance. D 1 percent voltage tolerance. TEC Temperature of end-cap. 3.4 Interface and physical dimensions. The interface and physical dimensions shall be as specified in MIL-PRF-19500 and on figures 1, 2, 3, 4, and 5 herein. 3.4.1 Lead finish. Lead finish shall be solderable as defined in MIL-PRF-19500, MIL-STD-750, and herein. Where a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2). 3.4.2 Diode construction. All devices shall be in accordance with the requirements of MIL-PRF-19500. 3.4.3 Dash one construction. Dash one (-1) diodes shall be of metallurgically bonded double plug construction or straight through construction in accordance with the requirements of category I, II, or III (see MIL-PRF-19500). 3.4.4 JANS construction. Construction shall be dash one or straight through construction, category I or II metallurgical bond in accordance with MIL-PRF-19500. 3.4.5 Package outline. This specification contains one standard package; DO-35. Any user of this specification that has a specific package outline requirement shall specify their preference in the acquisition order. If package style is not specified, the manufacturer may supply either package. Surface mount devices are in a DO-213AA package. 3.5 Marking. Marking shall be in accordance with MIL-PRF-19500 and as specified herein. 3.5.1 Polarity. The polarity shall be indicated with a contrasting color band to denote the cathode end. Alternately, for surface mount (UR) devices, a minimum of three evenly spaced contrasting color dots around the periphery of the cathode end may be used. No color coding will be permitted. 3.5.2 Marking of UR suffix version devices. For UR suffix (surface mount) devices only, all marking (except polarity) may be omitted from the body of the device, but shall be retained on the initial container. 3.6 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.6.1 Selection of tight tolerance devices. The C and D suffix devices shall be selected from JAN, JANTX, JANTXV, or JANS devices which have successfully completed all applicable screening, table I, and groups B and C testing as 5 percent tolerance devices. All sublots of C and D suffix devices shall pass table I, subgroup 2 at the tightened tolerances. The PTL or PTEC for C and D suffix devices shall be maintained at 30C 2C for VZ correlation on tight tolerances. 9 MIL-PRF-19500/435N 3.7 Electrical test requirements. The electrical test requirements shall be the subgroups specified in 4.4.2, 4.4.3, table I, II, and III. 3.8 Maximum and primary electrical characteristics test requirements. Maximum test ratings for voltage regulator diodes are specified in table III herein. 3.9 Workmanship. Semiconductor devices, diode, silicon, low-noise voltage regulator, shall be processed in such a manner as to be uniform in quality and shall be free from other defects that will affect life, serviceability, or appearance. 4. VERIFICATION 4.1 Classification of inspections. The inspection requirements specified herein are classified as follows: a. Qualification inspection (see 4.2). b. Screening (see 4.3). c. Conformance inspection (see 4.4, tables I and II). 4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as specified herein. 4.2.1 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In case qualification was awarded to a prior revision of the specification sheet that did not request the performance of table II tests, the tests specified in table II herein that were not performed in the prior revision shall be performed on the first inspection lot of this revision to maintain qualification. 4.2.2 JANHC and JANKC devices. JANHC and JANKC devices shall be qualified in accordance with MIL-PRF-19500. 4.2.3 Construction verification. Cross sectional photos from three devices shall be submitted in the qualification report. 10 MIL-PRF-19500/435N * 4.3 Screening (JAN, JANTX, JANTXV, and JANS levels only). Screening shall be in accordance with appendix E, table E-IV of MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of table I herein shall not be acceptable. Screen table E-IV of MIL-PRF-19500 (1) 3c 4 9 10 11 12 (2) 13 Measurement JANS level Required (see 4.3.2) Not applicable Required on Nom VZ > 10 V, IR1 and VZ Required on Nom VZ > 10 V IR1 100 percent of initial reading or 10 nA whichever is greater. VZ 2 percent of initial reading. See 4.3.3, t = 240 hours. Subgroups 2 and 3 of table I herein; IR1 100 percent of initial reading or 10 nA whichever is greater; VZ 2 percent of initial reading. JANTXV and JANTX level Required (see 4.3.2) Not applicable Not applicable Not applicable IR1 and VZ See 4.3.3, t = 48 hours Subgroup 2 of table I herein; IR1 100 percent of initial reading or 10 nA whichever is greater; VZ 2 percent of initial reading. (1) Shall be performed anytime after temperature cycling, screen 3a; TX and TXV levels do not need to be repeated in screening requirements. (2) PDA = 5 percent for screen 13, applies to IR1, VZ, IR1 and VZ (JANS only). 4.3.1 Screening (JANHC and JANKC). Screening of JANHC and JANKC die shall be in accordance with appendix G of MIL-PRF-19500. 4.3.1.1 JAN product. JAN product will have temperature cycling and thermal impedance testing performed in accordance with MIL-PRF-19500, JANTX level screening requirements. * 4.3.2 Thermal impedance. The thermal impedance measurements shall be performed in accordance with method 3101 or 4081 as applicable of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tMD (and VC where appropriate). See table II, subgroup 4 herein. 4.3.3 Free air power burn-in conditions. Power burn-in conditions are as follows (see 4.5.4 herein): IZ(min) = IZ(PCB). TA = 75C maximum. Test conditions shall be in accordance with method 1038 of MIL-STD-750, condition B. Adjust IZ or TA to achieve the required TJ. TJ = 125C minimum. With approval of the qualifying activity and preparing activity, alternate burn-in criteria (hours, bias conditions, TJ, mounting conditions) may be used for JANTX and JANTXV quality levels. A justification demonstrating equivalence is required. In addition, the manufacturing site's burn-in data and performance history will be essential criteria for burn-in modification approval. 11 MIL-PRF-19500/435N 4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500, and as specified herein. 4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with appendix E, table E-V of MIL-PRF-19500. End-point electrical measurements shall be in accordance with table I, subgroup 2 herein. * 4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for subgroup testing in appendix E, table E-VIA (JANS) and table E-VIB (JAN, JANTX, and JANTXV) of MIL-PRF-19500 and herein. 4.4.2.1 Group B inspection, appendix E, table E-VIA (JANS) of MIL-PRF-19500. Subgroup Method Condition B3 2101 Decap analysis scribe and break only. B4 1037 2,000 cycles B5 1027 IZM = column 10 of table III minimum for 1,000 hours; adjust IZ or TA to achieve TJ = +175C minimum. Marking legibility requirements shall not apply. B6 3101 or 4081 RJEC = 100C/W (max) at zero lead length (DO-213AA), +25C TR +35C (see 4.5.4). RJL = 250C/W (max) at L = .375 inch (9.53 mm), (DO-35). RJL and RJEC only. 4.4.2.2 Group B inspection, appendix E, table E-VIB (JAN, JANTX, JANTXV) of MIL-PRF-19500. Subgroup Method Condition B2 1056 0C to +100C, 10 cycles. B2 1051 -55C to +175C, 25 cycles. B3 1027 IZM = column 10 of table III herein minimum. Adjust IZ or TA to ensure a TJ = +150C (min). B4 2101 Decap analysis scribe and break only. B5 B6 Not applicable. 1032 TA = +175C. 12 MIL-PRF-19500/435N * * 4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in appendix E, table E-VII of MIL-PRF-19500 and as follows. Subgroup Method C2 1056 0C to +100C, 10 cycles. C2 2036 Tension: condition A; 10 pounds; t = 15 seconds (not applicable to "UR", "UB" and "UB2" suffix devices). Lead fatigue: Condition E, (not applicable to "UR", "UB" and "UB2" suffix devices C2 1071 Test condition E. C3 Condition Not applicable. C5 4081 See 4.3.2, RJL and RJEC only. C6 1027 IZM = column 10 of table III minimum. Adjust IZ or TA to ensure a TJ = +150C (min). C8 4071 IZ = 250 A dc, TA = +25C 5C, T2 = +125C, VZ = column 8 of table III, sampling plan = 22 devices, c = 0. 4.4.4 Group E inspection. Group E inspection shall be conducted in accordance with the conditions specified for subgroup testing in appendix E, table E-IX of MIL-PRF-19500 and in table II herein. Electrical measurements (endpoints) requirements shall be in accordance with table I, subgroup 2 herein. 4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows: 4.5.1 Surge current (IZSM). The peak currents shown in column 5 of table III shall be applied in the reverse direction and these shall be superimposed on the current (IZ = 250 A dc) a total of five surges at 1 minute intervals. Each individual surge shall be one-half square-wave-pulse of 1/120 second duration or an equivalent one-half sinewave with the same effective rms current. 4.5.2 Regulator voltage measurements. The test current shall be applied until thermal equilibrium is attained (20 2 seconds maximum) prior to reading the breakdown voltage. For this test, the diode shall be suspended by its leads with mounting clips whose inside edge is located at .375 inch (9.53 mm) from the body and the mounting clips shall be maintained at a temperature of +25C +8C, -2C. This measurement may be performed after a shorter time following application of the test current than that which provides thermal equilibrium if correlation to stabilized readings can be established to the satisfaction of the qualifying activity. The breakdown voltage on JANHC and JANKC shall be read with a pulse measurement of 10 ms (max). 4.5.3 Temperature coefficient of regulator voltage (VZ). The device shall be temperature stabilized with current applied prior to reading regulator voltage at the specified ambient temperature as specified in table I herein, subgroup 7. 4.5.4 Free air burn-in and life tests. The use of a current limiting or ballast resistor is permitted provided that each DUT still sees the full Pt (minimum) and that the minimum applied voltage, where applicable, is maintained throughout the burn-in period. Use method 3100 of MIL-STD-750 to measure TJ. 13 MIL-PRF-19500/435N 4.5.5 Noise density. Noise density shall be measured using a noise density test circuit as shown on figure 6. Place a low-noise resistor, equivalent in value to the dynamic impedance of the diode under test, in the test clips and adjust test current (IZT) and measure output-noise voltage. Remove resistor, insert diode under test in test clips, readjust test current to 250 A dc and measure output-noise voltage again. To obtain noise density (ND), subtract rms resistor output-noise voltage from rms diode output-noise voltage and divide by product of overall system gain and square root of bandwidth. All measurements shall be made at +25C. 4.5.6 Decap internal visual scribe and break. Scratch glass at cavity area with diamond scribe. Carefully snap open. Using 30X magnification examine the area where die (or bonding material) are in contact with the plugs, verify metallurgical bonding area. If the verification of the metallurgical bonding area is in question with test method 3101 of MIL-STD-750, and test condition and limits herein, (ZJX) shall be used to determine suitability for use. 14 MIL-PRF-19500/435N * TABLE I. Group A inspection. Inspection 1/ MIL-STD-750 Method Symbol Conditions Limits 2/ Min Unit Max Subgroup 1 Visual and mechanical examination 2071 Subgroup 2 * Forward voltage 4011 Condition A, IF = 200 mA dc VF 1.1 V dc Reverse current leakage 4016 DC method; VR = column 6 of table III IR1 Column 7 A dc Regulator voltage 4022 IZ = 250 A dc (see 4.5.2) VZ Column 2 +VZ tol V dc Thermal impedance 3101 See 4.3.2 Column 2 -VZ tol C/W ZJX Subgroup 3 High-temperature operation Reverse current TA = +150C 4016 DC method; VR = column 6 of table III IR2 Column 3 A dc 4051 IZ = 250 A dc; ISIG = 25 A ac rms ZZT Column 4 Ohms IZ = 250 A dc (see 4.5.5) ND Column 9 V/ Hz VZ Column 8 %/C Subgroup 4 Small-signal reverse breakdown impedance Noise density Subgroup 5 Not applicable Subgroup 6 Surge current 4066 Electrical measurements See 4.5.1 Table I, subgroup 2 Subgroup 7 JANS only Temperature coefficient of regulator voltage 4071 IZ = 250 A dc; T1 = +25C, 5C; T2 = T1 +100C (see 4.5.3) 1/ For sampling plan, see MIL-PRF-19500. 2/ Column references are to table III herein. 15 MIL-PRF-19500/435N * TABLE II. Group E inspection (all quality levels) - for qualification and requalification only. Inspection 1/ MIL-STD-750 Method Conditions 45 devices, c = 0 Subgroup 1 Temperature cycling Qualification conformance inspection (sampling plan) 1051 Electrical measurements 500 cycles. See table I, subgroup 2. Subgroup 2 Intermittent life 1037 Electrical measurements * 6,000 cycles. IZ = column 10 of table III. See table I, subgroup 2. Subgroup 4 Thermal resistance 3101 or 4081 Thermal impedance curves RJSP(IS) can be calculated but shall be measured once in the same package with a similar die size to confirm calculations (may apply to multiple specification sheets) RJSP(AM) need be calculated only See MIL-PRF-19500 15 devices, c=0 N/A Subgroups 5 and 6 Not applicable Subgroup 9 Resistance to glass cracking n = 45 1057 Condition B. Cool down after solder immersion is permitted. Test until failure occurs on all devices or to a maximum of 25 cycles, whichever comes first. Not applicable for UB and UB2 devices. 1/ A separate sample may be pulled for each test. 16 MIL-PRF-19500/435N TABLE III. Test ratings, primary electrical characteristics. 1/ Col 1 Col 2 Col 3 Col 4 Col 5 Col 6 Col 7 Col 8 Col 9 Col 10 2/ VZ nom IR at +150C ZZT max IZSM (surge) IZSM (surge) UB VR IR VZ T1 = +25C T2 = +125C ND IZPCB Volts A dc ohms mA mA Volts A dc %/C ___ V/ Hz mA 1N4614-1 1N4615-1 1N4616-1 1N4617-1 1N4618-1 1.8 2.0 2.2 2.4 2.7 10.0 8.0 6.0 4.0 2.0 1,200 1,250 1,300 1,400 1,500 1,600 1,500 1,350 1,250 1,100 500 469 422 390 343 1.0 1.0 1.0 1.0 1.0 3.5 2.5 2.0 1.0 0.5 -0.075 -0.075 -0.075 -0.075 -0.075 1 1 1 1 1 120 110 100 95 90 1N4619-1 1N4620-1 1N4621-1 1N4622-1 1N4623-1 3.0 3.3 3.6 3.9 4.3 1.0 7.0 10.0 5.0 4.0 1,600 1,650 1,700 1,650 1,600 1,025 950 875 825 800 320 297 273 258 250 1.0 1.5 2.0 2.0 2.0 0.4 3.5 3.5 2.5 2.0 -0.075 -0.075 -0.065 -0.060 -0.050 1 1 1 1 1 87 85 83 80 77 1N4624-1 1N4625-1 1N4626-1 1N4627-1 1N4099-1 4.7 5.1 5.6 6.2 6.8 10.0 10.0 10.0 10.0 5.0 1,550 1,500 1,400 1,200 200 750 725 700 650 650 234 227 219 203 203 3.0 3.0 4.0 5.0 5.2 5.0 5.0 5.0 5.0 1.0 +.020,-.050 +.030,-.045 +.040,-.020 +.050,-.010 +.060 1 2 4 5 40 75 70 65 61 56 1N4100-1 1N4101-1 1N4102-1 1N4103-1 1N4104-1 7.5 8.2 8.7 9.1 10.0 5.0 5.0 5.0 5.0 5.0 200 200 200 200 200 650 650 650 650 650 203 203 203 203 203 5.7 6.3 6.7 7.0 7.6 1.0 0.5 0.5 0.5 0.5 +.065 +.070 +.075 +.080 +.080 40 40 40 40 40 51 46 44 42 38 1N4105-1 1N4106-1 1N4107-1 1N4108-1 1N4109-1 11.0 12.0 13.0 14.0 15.0 5.0 5.0 5.0 5.0 5.0 200 200 200 200 100 590 540 500 464 433 184 169 156 145 135 8.5 9.2 9.9 10.7 11.4 0.05 0.05 0.05 0.05 0.05 +.080 +.080 +.080 +.085 +.085 40 40 40 40 40 35 32 29 27 25 See footnotes at end of table. 17 MIL-PRF-19500/435N TABLE III. Test ratings, primary electrical characteristics - Continued. 1/ Col 1 Col 2 Col 3 Col 4 Col 5 Col 6 Col 7 Col 8 Col 9 Col 10 ND IZPCB VZ nom IR at +150C ZZT max IZSM (surge) IZSM (surge) UB VR IR VZ T1 = +25C T2 = +125C Volts A dc ohms mA mA Volts A dc %/C 1N4110-1 1N4111-1 1N4112-1 1N4113-1 1N4114-1 16.0 17.0 18.0 19.0 20.0 5.0 5.0 5.0 2.5 2.5 100 100 100 150 150 406 382 361 342 325 127 119 113 107 102 12.2 13.0 13.7 14.5 15.2 0.05 0.05 0.05 0.05 0.01 +.085 +.090 +.090 +.090 +.090 40 40 40 40 40 24 22 21 20 19 1N4115-1 1N4116-1 1N4117-1 1N4118-1 1N4119-1 22.0 24.0 25.0 27.0 28.0 2.5 2.5 2.5 2.5 2.5 150 150 150 150 200 295 271 260 240 232 92 85 81 75 73 16.8 18.3 19.0 20.5 21.3 0.01 0.01 0.01 0.01 0.01 +.090 +.090 +.090 +.090 +.095 40 40 40 40 40 17 16 15 14 14 1N4120-1 1N4121-1 1N4122-1 1N4123-1 1N4124-1 30.0 33.0 36.0 39.0 43.0 2.5 2.5 2.5 2.5 2.5 200 200 200 200 250 216 197 180 166 151 68 66 56 52 47 22.8 25.1 27.4 29.7 32.7 0.01 0.01 0.01 0.01 0.01 +.095 +.095 +.095 +.095 +.095 40 40 40 40 40 13 12 11 9.8 8.9 1N4125-1 1N4126-1 1N4127-1 1N4128-1 1N4129-1 47.0 51.0 56.0 60.0 62.0 4.0 5.0 5.0 5.0 5.0 250 300 300 400 500 138 127 116 108 105 43 40 36 34 33 35.8 38.8 42.6 45.6 47.1 0.01 0.01 0.01 0.01 0.01 +.095 +.100 +.100 +.100 +.100 40 40 40 40 40 8.1 7.5 6.7 6.4 6.1 1N4130-1 1N4131-1 1N4132-1 1N4133-1 1N4134-1 68.0 75.0 82.0 87.0 91.0 7.0 7.0 8.0 8.0 10.0 700 700 800 1,000 1,200 95 86 79 75 71 30 27 25 23 22 51.7 57.0 62.4 66.2 69.2 0.01 0.01 0.01 0.01 0.01 +.100 +.100 +.100 +.100 +.100 40 40 40 40 40 5.6 5.1 4.6 4.4 4.2 2/ ___ V/ Hz mA 1N4135-1 100.0 10.0 1,600 65 20 76.0 0.01 +.100 40 3.8 1/ Unless otherwise specified TC = 25C. 2/ Applies to all voltage tolerance devices. (Examples: 1N4099-1 is 5 percent; 1N4099C-1 is 2 percent; and 1N4099D-1 is 1 percent tolerance). 18 MIL-PRF-19500/435N NOTES: 1. Input voltage and lead resistance should be high so that zener can be driven from a constant current source. 2. Input impedance of band pass filter should be high compared with the dynamic impedance of the diode under test. 3. Filter bandwidth characteristics shall be as follows: a. fo = 2,000 Hz. b. Shape factor, -40 db to -3 dB, approximately 2. c. Passband at the -3 dB is 1,000 Hz 50 Hz to 3,000 Hz 150 Hz. d. Passband at the -40 dB is 500 Hz 50 Hz to 6,000 Hz 600 Hz. FIGURE 6. Circuit for determination of noise density. 19 MIL-PRF-19500/435N NOTES: 1. All devices are capable of operating at TJ specified on this curve. Any parallel line to this curve will intersect the appropriate power for the desired maximum TJ allowed. 2. Derate design curve constrained by the maximum junction temperature (TJ 175C) and power rating specified. (See 1.3 herein.) 3. Derate design curve chosen at TJ 150C, where the maximum temperature of electrical test is performed. 4. Derate design curves chosen at TJ 125C, and 110C to show power rating where most users want to limit TJ in their application. FIGURE 7. Temperature-power derating curve (DO-35). 20 MIL-PRF-19500/435N NOTES: 1. All devices are capable of operating at TJ specified on this curve. Any parallel line to this curve will intersect the appropriate power for the desired maximum TJ allowed. 2. Derate design curve constrained by the maximum junction temperature (TJ 175C) and power rating specified. (See 1.3 herein.) 3. Derate design curve chosen at TJ 150C, where the maximum temperature of electrical test is performed. 4. Derate design curves chosen at TJ 125C, and 110C to show power rating where most users want to limit TJ in their application. FIGURE 8. Temperature-power derating curve (DO-213AA). 21 MIL-PRF-19500/435N Thermal Resistance Junction to PCB = 300C/W NOTES: 1. All devices are capable of operating at TJ specified on this curve. Any parallel line to this curve will intersect the appropriate power for the desired maximum TJ allowed. 2. Derate design curve constrained by the maximum junction temperature (TJ 175C) and power rating specified. (See 1.3 herein.) 3. Derate design curve chosen at TJ 150C, where the maximum temperature of electrical test is performed. 4. Derate design curves chosen at TJ 125C, and 110C to show power rating where most users want to limit TJ in their application. FIGURE 9. Temperature-power derating curve (PCB). 22 MIL-PRF-19500/435N Thermal Impedance 1000 Theta (C/W) 100 10 1 0.0001 0.001 0.01 0.1 1 10 100 1000 Time (s) Thermal impedance DO-35 PCB mount, FR4, 1oz Cu, 2.0 x 3.4 inches (50 x 87 mm) pad (MELF) and 3.6 inches (92 mm) diameter (axial with .125 inch (3.18 mm) lead length) at TA = 25C. NOTE: Thermal resistance = 300C/W. Maximum power rating = 400 mW at TA = 55C. FIGURE 10. Thermal impedance DO-35 PCB mount. 23 MIL-PRF-19500/435N Thermal Impedance 1000 Theta (C/W) 100 10 1 0.0001 0.001 0.01 0.1 1 10 Time (s) Thermal impedance DO-35 axial, TL = 25C at .375 inch (9.525 mm) from body. NOTE: Thermal resistance = 250C/W. Maximum power rating = 500 mW at TJ = 50C. FIGURE 11. Thermal impedance DO-35 axial. 24 100 MIL-PRF-19500/435N Thermal Impedance 1000 Theta (C/W) 100 10 1 0.0001 0.001 0.01 0.1 1 Time (s) Thermal impedance DO-213A MELF, TEC = 25C. NOTE: Thermal resistance = 100C/W. Maximum power rating = 500 mW at TEC = 125C. FIGURE 12. Thermal impedance DO-213A MELF. 25 10 MIL-PRF-19500/435N Slash Sheet / 435 UB package RJSP(IS) 1000 Theta In oC/W 100 10 1 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 Time In Seconds Thermal impedance UB, TSP(IS) = 25C. NOTE: Thermal resistance = 90C/W. Maximum power rating = 500 mW at TSP(IS) = 125C. FIGURE 13. Thermal impedance UB. 26 100 MIL-PRF-19500/435N Slash Sheet /435 UB Package RJA(PCB) 1000 Theta In oC/W 100 10 1 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 Time In Seconds Thermal impedance UB, TA(PCB) = 25C. NOTE: Thermal resistance = 250C/W. Maximum power rating = 400 mW at TA(PCB) = 125C. FIGURE 14. Thermal impedance UB. 27 MIL-PRF-19500/435N 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the Inventory Control Point's packaging activities within the Military Service or Defense Agency, or within the Military Service's system commands. Packaging data retrieval is available from the managing Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory. The notes specified in MIL-PRF-19500 are applicable to this specification.) 6.1 Intended use. Semiconductors conforming to this specification are intended for original equipment design applications and logistic support of existing equipment. 6.2 Acquisition requirements. Acquisition documents should specify the following: a. Title, number, and date of this specification. b. Packaging requirements (see 5.1). c. Lead finish (see 3.4.1). * d. The complete PIN, see 1.5 and 6.6. 6.3 Qualification. With respect to products requiring qualification, awards will be made only for products which are, at the time of award of contract, qualified for inclusion in Qualified Manufacturers List (QML 19500) whether or not such products have actually been so listed by that date. The attention of the contractors is called to these requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal Government tested for qualification in order that they may be eligible to be awarded contracts or orders for the products covered by this specification. Information pertaining to qualification of products may be obtained from DLA Land and Maritime, ATTN: /VQE, P.O. Box 3990, Columbus, OH 43218-3990 or e-mail vqe.chief@dla.mil. An online listing of products qualified to this specification may be found in the Qualified Products Database (QPD) at https://assist.dla.mil. 6.4 Substitution information. 6.4.1 Substitutability of 2 percent and 1 percent tolerance devices. Devices of tighter tolerance are a direct one way substitute for the looser tolerance devices (example: JANTX1N4614D-1 substitutes for JANTX1N4614-1). 28 MIL-PRF-19500/435N 6.4.2 Substitutability of dash-one parts. Non-dash-one devices have been deleted from this specification. Dashone devices are a direct substitute for non dash-one devices and are preferred. The following table shows the direct substitutability. Superseded part number 1N4614 1N4615 1N4616 1N4617 1N4618 1N4619 1N4620 1N4621 1N4622 1N4623 1N4624 1N4625 1N4626 1N4627 1N4099 1N4100 1N4101 Superseding part number 1N4614-1 1N4615-1 1N4616-1 1N4617-1 1N4618-1 1N4619-1 1N4620-1 1N4621-1 1N4622-1 1N4623-1 1N4624-1 1N4625-1 1N4626-1 1N4627-1 1N4099-1 1N4100-1 1N4101-1 Superseded part number 1N4102 1N4103 1N4104 1N4105 1N4106 1N4107 1N4108 1N4109 1N4110 1N4111 1N4112 1N4113 1N4114 1N4115 1N4116 1N4117 1N4118 Superseding part number 1N4102-1 1N4103-1 1N4104-1 1N4105-1 1N4106-1 1N4107-1 1N4108-1 1N4109-1 1N4110-1 1N4111-1 1N4112-1 1N4113-1 1N4114-1 1N4115-1 1N4116-1 1N4117-1 1N4118-1 Superseded part number 1N4119 1N4120 1N4121 1N4122 1N4123 1N4124 1N4125 1N4126 1N4127 1N4128 1N4129 1N4130 1N4131 1N4132 1N4133 1N4134 1N4135 Superseding part number 1N4119-1 1N4120-1 1N4121-1 1N4122-1 1N4123-1 1N4124-1 1N4125-1 1N4126-1 1N4127-1 1N4128-1 1N4129-1 1N4130-1 1N4131-1 1N4132-1 1N4133-1 1N4134-1 1N4135-1 * 6.5 PIN construction example. * 6.5.1 Encapsulated devices The PINs for encapsulated devices are constructed using the following form. JANTXV 1N 4099 C UBCC JAN certification mark and quality level (see 1.5.1) First number and first letter symbols (see 1.5.3.1) Second number symbols (see 1.5.3.2) First suffix symbol (see 1.5.3.3) Second suffix symbol (see 1.5.3.4) * 6.5.2 Unencapsulated devices. The PINs for un-encapsulated devices are constructed using the following form. JANHC JAN certification mark and quality level (see 1.5.2) Die identifier for unencapsulated devices (see 1.5.5) First number and first letter symbols (see 1.5.3.1) Second number symbols (see 1.5.3.2) First suffix symbol (see 1.5.3.3) 29 A 1N 4099 D MIL-PRF-19500/435N * * 6.6 List of PINs. 6.6.1 List of PINs for encapsulated devices. The following is a list of possible PINs for encapsulated devices available on this specification sheet. PINs for devices of the base quality level PINs for devices of the "TX" quality level PINs for devices of the "TXV" quality level PINs for devices of the "S" quality level JAN1N4099#$ JANTX1N4099#$ JANTXV1N4099#$ JANS1N4099#$ JAN1N4100#$ JANTX1N4100#$ JANTXV1N4100#$ JANS1N4100#$ JAN1N4101#$ JANTX1N4101#$ JANTXV1N4101#$ JANS1N4101#$ JAN1N4102#$ JANTX1N4102#$ JANTXV1N4102#$ JANS1N4102#$ JAN1N4103#$ JANTX1N4103#$ JANTXV1N4103#$ JANS1N4103#$ JAN1N4104#$ JANTX1N4104#$ JANTXV1N4104#$ JANS1N4104#$ JAN1N4105#$ JANTX1N4105#$ JANTXV1N4105#$ JANS1N4105#$ JAN1N4106#$ JANTX1N4106#$ JANTXV1N4106#$ JANS1N4106#$ JAN1N4107#$ JANTX1N4107#$ JANTXV1N4107#$ JANS1N4107#$ JAN1N4108#$ JANTX1N4108#$ JANTXV1N4108#$ JANS1N4108#$ JAN1N4109#$ JANTX1N4109#$ JANTXV1N4109#$ JANS1N4109#$ JAN1N4110#$ JANTX1N4110#$ JANTXV1N4110#$ JANS1N4110#$ JAN1N4111#$ JANTX1N4111#$ JANTXV1N4111#$ JANS1N4111#$ JAN1N4112#$ JANTX1N4112#$ JANTXV1N4112#$ JANS1N4112#$ JAN1N4113#$ JANTX1N4113#$ JANTXV1N4113#$ JANS1N4113#$ JAN1N4114#$ JANTX1N4114#$ JANTXV1N4114#$ JANS1N4114#$ JAN1N4115#$ JANTX1N4115#$ JANTXV1N4115#$ JANS1N4115#$ JAN1N4116#$ JANTX1N4116#$ JANTXV1N4116#$ JANS1N4116#$ JAN1N4117#$ JANTX1N4117#$ JANTXV1N4117#$ JANS1N4117#$ JAN1N4118#$ JANTX1N4118#$ JANTXV1N4118#$ JANS1N4118#$ JAN1N4119#$ JANTX1N4119#$ JANTXV1N4119#$ JANS1N4119#$ JAN1N4120#$ JANTX1N4120#$ JANTXV1N4120#$ JANS1N4120#$ JAN1N4121#$ JANTX1N4121#$ JANTXV1N4121#$ JANS1N4121#$ JAN1N4122#$ JANTX1N4122#$ JANTXV1N4122#$ JANS1N4122#$ JAN1N4123#$ JANTX1N4123#$ JANTXV1N4123#$ JANS1N4123#$ JAN1N4124#$ JANTX1N4124#$ JANTXV1N4124#$ JANS1N4124#$ JAN1N4125#$ JANTX1N4125#$ JANTXV1N4125#$ JANS1N4125#$ JAN1N4126#$ JANTX1N4126#$ JANTXV1N4126#$ JANS1N4126#$ JAN1N4127#$ JANTX1N4127#$ JANTXV1N4127#$ JANS1N4127#$ JAN1N4128#$ JANTX1N4128#$ JANTXV1N4128#$ JANS1N4128#$ JAN1N4129#$ JANTX1N4129#$ JANTXV1N4129#$ JANS1N4129#$ JAN1N4130#$ JANTX1N4130#$ JANTXV1N4130#$ JANS1N4130#$ JAN1N4131#$ JANTX1N4131#$ JANTXV1N4131#$ JANS1N4131#$ JAN1N4132#$ JANTX1N4132#$ JANTXV1N4132#$ JANS1N4132#$ JAN1N4133#$ JANTX1N4133#$ JANTXV1N4133#$ JANS1N4133#$ See footnotes at end of table. 30 MIL-PRF-19500/435N * 6.6.1 List of PINs for encapsulated devices. Continued. PINs for devices of the base quality level PINs for devices of the "TX" quality level PINs for devices of the "TXV" quality level PINs for devices of the "S" quality level JAN1N4134#$ JANTX1N4134#$ JANTXV1N4134#$ JANS1N4134#$ JAN1N4135#$ JANTX1N4135#$ JANTXV1N4135#$ JANS1N4135#$ JAN1N4614#$ JANTX1N4614#$ JANTXV1N4614#$ JANS1N4614#$ JAN1N4615#$ JANTX1N4615#$ JANTXV1N4615#$ JANS1N4615#$ JAN1N4616#$ JANTX1N4616#$ JANTXV1N4616#$ JANS1N4616#$ JAN1N4617#$ JANTX1N4617#$ JANTXV1N4617#$ JANS1N4617#$ JAN1N4618#$ JANTX1N4618#$ JANTXV1N4618#$ JANS1N4618#$ JAN1N4619#$ JANTX1N4619#$ JANTXV1N4619#$ JANS1N4619#$ JAN1N4620#$ JANTX1N4620#$ JANTXV1N4620#$ JANS1N4620#$ JAN1N4621#$ JANTX1N4621#$ JANTXV1N4621#$ JANS1N4621#$ JAN1N4622#$ JANTX1N4622#$ JANTXV1N4622#$ JANS1N4622#$ JAN1N4623#$ JANTX1N4623#$ JANTXV1N4623#$ JANS1N4623#$ JAN1N4624#$ JANTX1N4624#$ JANTXV1N4624#$ JANS1N4624#$ JAN1N4625#$ JANTX1N4625#$ JANTXV1N4625#$ JANS1N4625#$ JAN1N4626#$ JANTX1N4626#$ JANTXV1N4626#$ JANS1N4626#$ JAN1N4627#$ JANTX1N4627#$ JANTXV1N4627#$ JANS1N4627#$ (1) The pound sign (#) represents the first suffix symbol (see 1.5.3.3). The dollar sign ($) represents the second suffix symbol, see 1.5.3.2. 31 MIL-PRF-19500/435N * 6.6.2 List of PINs for unencapsulated devices. The following is a list of possible PINs available on this specification sheet. The qualified die suppliers with the applicable letter version (e.g., JANHCA1N4614) will be identified on the QML. PIN (1) 1N4614-1 1N4615-1 1N4616-1 1N4617-1 1N4618-1 1N4619-1 1N4620-1 1N4621-1 1N4622-1 1N4623-1 1N4624-1 1N4625-1 1N4626-1 1N4627-1 1N4099-1 1N4100-1 1N4101-1 1N4102-1 1N4103-1 1N4104-1 1N4105-1 1N4106-1 1N4107-1 1N4108-1 1N4109-1 1N4110-1 1N4111-1 1N4112-1 1N4113-1 1N4114-1 1N4115-1 1N4116-1 1N4117-1 1N4118-1 1N4119-1 1N4120-1 1N4121-1 1N4122-1 1N4123-1 1N4124-1 1N4125-1 1N4126-1 1N4127-1 1N4128-1 1N4129-1 1N4130-1 1N4131-1 1N4132-1 1N4133-1 1N4134-1 1N4135-1 JANC ordering information Manufacturer CAGE 43611 (2) 12954 (2) JANHCA1N4614 JANHCB1N4614 JANHCA1N4615 JANHCB1N4615 JANHCA1N4616 JANHCB1N4616 JANHCA1N4617 JANHCB1N4617 JANHCA1N4618 JANHCB1N4618 JANHCA1N4619 JANHCB1N4619 JANHCA1N4620 JANHCB1N4620 JANHCA1N4621 JANHCB1N4621 JANHCA1N4622 JANHCB1N4622 JANHCA1N4623 JANHCB1N4623 JANHCA1N4624 JANHCB1N4624 JANHCA1N4625 JANHCB1N4625 JANHCA1N4626 JANHCB1N4626 JANHCA1N4627 JANHCB1N4627 JANHCA1N4099 JANHCB1N4099 JANHCA1N4100 JANHCB1N4100 JANHCA1N4101 JANHCB1N4101 JANHCA1N4102 JANHCB1N4102 JANHCA1N4103 JANHCB1N4103 JANHCA1N4104 JANHCB1N4104 JANHCA1N4105 JANHCB1N4105 JANHCA1N4106 JANHCB1N4106 JANHCA1N4107 JANHCB1N4107 JANHCA1N4108 JANHCB1N4108 JANHCA1N4109 JANHCB1N4109 JANHCA1N4110 JANHCB1N4110 JANHCA1N4111 JANHCB1N4111 JANHCA1N4112 JANHCB1N4112 JANHCA1N4113 JANHCB1N4113 JANHCA1N4114 JANHCB1N4114 JANHCA1N4115 JANHCB1N4115 JANHCA1N4116 JANHCB1N4116 JANHCA1N4117 JANHCB1N4117 JANHCA1N4118 JANHCB1N4118 JANHCA1N4119 JANHCB1N4119 JANHCA1N4120 JANHCB1N4120 JANHCA1N4121 JANHCB1N4121 JANHCA1N4122 JANHCB1N4122 JANHCA1N4123 JANHCB1N4123 JANHCA1N4124 JANHCB1N4124 JANHCA1N4125 JANHCB1N4125 JANHCA1N4126 JANHCB1N4126 JANHCA1N4127 JANHCB1N4127 JANHCA1N4128 JANHCB1N4128 JANHCA1N4129 JANHCB1N4129 JANHCA1N4130 JANHCB1N4130 JANHCA1N4131 JANHCB1N4131 JANHCA1N4132 JANHCB1N4132 JANHCA1N4133 JANHCB1N4133 JANHCA1N4134 JANHCB1N4134 JANHCA1N4135 JANHCB1N4135 (1) C and D tolerance suffix are applicable to JANC chips. (2) For JANKC level, replace "JANHC" with "JANKC". 32 52GC4 (2) JANHCC1N4614 JANHCC1N4615 JANHCC1N4616 JANHCC1N4617 JANHCC1N4618 JANHCC1N4619 JANHCC1N4620 JANHCC1N4621 JANHCC1N4622 JANHCC1N4623 JANHCC1N4624 JANHCC1N4625 JANHCC1N4626 JANHCC1N4627 JANHCC1N4099 JANHCC1N4100 JANHCC1N4101 JANHCC1N4102 JANHCC1N4103 JANHCC1N4104 JANHCC1N4105 JANHCC1N4106 JANHCC1N4107 JANHCC1N4108 JANHCC1N4109 JANHCC1N4110 JANHCC1N4111 JANHCC1N4112 JANHCC1N4113 JANHCC1N4114 JANHCC1N4115 JANHCC1N4116 JANHCC1N4117 JANHCC1N4118 JANHCC1N4119 JANHCC1N4120 JANHCC1N4121 JANHCC1N4122 JANHCC1N4123 JANHCC1N4124 JANHCC1N4125 JANHCC1N4126 JANHCC1N4127 JANHCC1N4128 JANHCC1N4129 JANHCC1N4130 JANHCC1N4131 JANHCC1N4132 JANHCC1N4133 JANHCC1N4134 JANHCC1N4135 MIL-PRF-19500/435N * 6.7 Request for new types and configurations. Requests for new device types or configurations for inclusions in this specification sheet should be submitted to: DLA Land and Maritime, ATTN: VAC, Post Office Box 3990, Columbus, OH 43218-3990 or by electronic mail at Semiconductor@.dla.mil or by facsimile (614) 693-1642 or DSN 850-6939. 6.8 Changes from previous issue. The margins of this specification are marked with asterisks to indicate where changes from the previous issue were made. This was done as a convenience only and the Government assumes no liability whatsoever for any inaccuracies in these notations. Bidders and contractors are cautioned to evaluate the requirements of this document based on the entire content irrespective of the marginal notations and relationship to the previous issue. Custodians: Army - CR Navy - EC Air Force - 85 NASA - NA DLA - CC Preparing activity: DLA - CC (Project 5961-2016-009) Review activities: Army - AR, MI, SM Navy - AS, MC Air Force - 19, 70, 99 NOTE: The activities listed above were interested in this document as of the date of this document. Since organizations and responsibilities can change, you should verify the currency of the information above using the ASSIST Online database at https://assist.dla.mil. 33