GRM2165C1H330JZ01D - Murata

Cat.No.C02E-10

Murata

Manufacturing Co., Ltd.

Chip Monolithic

Ceramic Capacitors

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Part Numbering 2
Selection Guide 6
for Flow/Reflow Soldering  GRM15/18/21/31 Series 7
for Reflow Soldering  GRM32/43/55 Series  15
Ultra-small GRM03 Series 18
Thin Type (Flow/Reflow) 20
GRM Series Specifications and Test Methods 22
Thin Layer Large-capacitance Type 27
Low-dissipation Type 32
GRM Series Data 37
Microchips 39
Capacitor Arrays 42
for Ultrasonic Sensors 48
Low ESL 51
High Frequency for Flow/Reflow Soldering 56
High-Q & High Power Type 61
High Frequency Type 69
ERF/ERH/ERA/ERD Series Data 79
Package 81
! Caution 85
Notice 91
Reference Data 97
Medium-voltage Low Dissipation Factor 104
Medium-voltage High-Capacitance for General-Use 109
Only for Information Devices/Tip & Ring 113
AC250V(r.m.s.) Type 117
Safety Standard Recognized Type GC (UL, IEC60384-14 Class X1/Y2) 121
Safety Standard Recognized Type GD (IEC60384-14 Class Y3) 122
Safety Standard Recognized Type GF (IEC60384-14 Class Y2) 123
CONTENTS
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!Note • Please read rating and !CAUTION (for storage and operating, rating, soldering and mounting, handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specification or transact the approval sheet for product specification before ordering.
Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc. 
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.
!Note C02E10.pdf 04.1.20

Safety Standard Recognized Type GB (IEC60384-14 Class X2) 124

GA3 Series Specifications and Test Methods 125

GRM/GR4/GA2/GA3 Series Data 129

Package 132

! Caution 135

Notice 141

ISO 9000 Certifications 145

Please refer to "Specifications and Test Methods" at the end of each chapter of – .

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Recycled Paper

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16

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Recycled Paper

21

!Note • Please read rating and !CAUTION (for storage and operating, rating, soldering and mounting, handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specification or transact the approval sheet for product specification before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

(Part Number)

w

qProduct ID

wSeries

Chip Monolithic Ceramic Capacitors

GR

ER

GQ

GM

GN

LL

GJ

GA

GC

M

4

F

H

A

D

M

A

M

L

M

6

2

3

P

M

Tin Plated Layer

Only for Information Devices / Tip & Ring

High Frequency and

high Power Type

High Frequency and High Power Type

(Ribbon Terminal)

High Frequency Type

(Ribbon Terminal)

High Frequency for

Flow/Reflow Soldering

Monolithic Microchip

Capacitor Array

Low ESL Wide Width Type

High Frequency Low Loss Type

Tin Plated Type

High Frequency Low Loss Type

for AC250V (r.m.s.)

Safety Standard Recognized Type

Automotive Soldering Electrode

Automotive Tin Plated Layer

Product ID Code Series

GR

q

M

e

18

r

8

t

B1

y

1H

u

102

i

K

o

A01

With the array type GNM series, "Dimension(T)" indicates the number of

elements.

eDimension (LgW)

!0

K

Code

0.6g0.3 mm

0.5g0.5 mm

0.8g0.8 mm

1.25g1.0 mm

1.0g0.5 mm

1.6g0.8 mm

1.4g1.4 mm

2.0g1.25 mm

2.8g2.8 mm

3.2g1.6 mm

3.2g2.5 mm

4.5g2.0 mm

4.5g3.2 mm

5.7g2.8 mm

5.7g5.0 mm

Dimension (LgW)

0201

0202

0303

0504

0402

0603

0805

1111

1206

1210

1808

1812

2211

2220

EIA

03

05

08

11

15

18

1D

1X

21

22

31

32

3X

42

43

52

55

A

B

C

D

E

F

M

N

R

S

Q

X

1.0 mm

1.25 mm

1.6 mm

2.0 mm

2.5 mm

3.2 mm

1.15 mm

1.35 mm

1.8 mm

2.8 mm

1.5 mm

Depends on individual standards.

rDimension (T)

Code

2

3

4

5

6

7

8

9

2-elements (Array Type)

0.3 mm

4-elements (Array Type)

0.5 mm

0.6 mm

0.7 mm

0.8 mm

0.85 mm

Dimension (T)

Depends on individual standards.

Continued on the following page.

o Part Numbering

2

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Continued from the preceding page.

Continued on the following page.

-55 to 85°C

-55 to 125°C

-55 to 85°C

-55 to 125°C

-25 to 85°C

10 to 85°C

-25 to 85°C

-30 to 85°C

-55 to 125°C

-55 to 85°C

-55 to 125°C

-55 to 105°C

-25 to 20°C

20 to 85°C

-220±60ppm/°C

-330±60ppm/°C

-470±60ppm/°C

0±120ppm/°C

-750±120ppm/°C

0±250ppm/°C

±10%

+22, -56%

+30, -80%

+22, -82%

±15%

±22%

-4700+100/-2500ppm/°C

-4700+500/-1000ppm/°C

R2H

S2H

T2H

CJ *1

U2J

CK *1

B *2

B

Z5U

F *2

Y5V

R *2

R

X5R

X7R

X6S

ZLM

6R

6S

6T

7C

7U

8C

B1

B3

E4

F1

F5

R1

R3

R6

R7

C8

9E

-55 to 125°C

-25 to 85°C

10 to 85°C

-25 to 85°C

-30 to 85°C

-55 to 125°C

-55 to 85°C

-55 to 125°C

-55 to 105°C

-25 to 85°C

tTemperature Characteristics

Code

20 to 85°C

-55 to 125°C

-25 to 85°C

-55 to 125°C

-25 to 85°C

-55 to 125°C

-55 to 85°C

Temperature

Range

+350 to -1000ppm/°C

0±60ppm/°C

-150±60ppm/°C

-220±60ppm/°C

-330±60ppm/°C

-470±60ppm/°C

0±120ppm/°C

-150±120ppm/°C

-220±120ppm/°C

-330±120ppm/°C

-470±120ppm/°C

-750±120ppm/°C

0±250ppm/°C

0±30ppm/°C

0±60ppm/°C

-150±60ppm/°C

Capacitance Change or

Temperature Coefficient

SL

CH

PH

RH

SH

TH

CJ

PJ

RJ

SJ

TJ

UJ

CK

C0G

C0H/CH *1

P2H

Temperature

Characteristics

1X

2C

2P

2R

2S

2T

3C

3P

3R

3S

3T

3U

4C

5C

6C

6P

-55 to 125°C

-25 to 85°C

-55 to 125°C

-25 to 85°C

-55 to 125°C

Operating

Temperature Range

*1 ER series only.

*2 Add 50% of the rated voltage.

3

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

uCapacitance

Expressed by three figures. The unit is pico-farad (pF). The first

and second figures are significant digits, and the third figure

expresses the number of zeros which follow the two numbers.

If there is a decimal point, it is expressed by the capital letter "R".

In this case, all figures are significant digits.

R50

1R0

100

103

Ex.)

0.5pF

1.0pF

10pF

10000pF

Code Capacitance

Continued from the preceding page.

Continued on the following page.

iCapacitance Tolerance

Code

B

C

D

G

J

K

M

Z

R

GJM

GRM/ERF/ERH/ERA/ERD/GQM

GJM

GRM

ERF/ERH/ERA/ERD/GQM/GJM

GJM

GQM

GRM/GA3

ERF/ERH/ERA/ERD/GQM/GJM

GRM/GA3

GR4

GRM

GMA/LLL

GA2

GRM

Series

C∆

C∆–SL

C∆

C∆–SL

C∆

C∆–SL

C∆

B,R,X7R,X5R,ZLM

Z5U

B,R,X7R

X7R

F,Y5V

TC

±0.1pF

±0.25pF

±0.5pF

±2%

±5%

±10%

±20%

+80%, -20%

Capacitance Tolerance

V5pF

<10pF

6.0 to 9.0pF

5.1 to 9.1pF

U10pF

E24 Series,1pF

* 1pF

E24 Series,1pF

* 1pF

E24 Series

E12 Series

E24 Series

E12 Series

E24 Series

Capacitance Step

E6 Series

E12 Series

E3 Series

E6 Series

E3 Series

Depends on individual standards.

* E24 series is also available.

yRated Voltage

0G

0J

1A

1C

1E

1H

2A

2D

2E

YD

2H

2J

3A

3D

3F

E2

GB

GC

GD

GF

DC4V

DC6.3V

DC10V

DC16V

DC25V

DC50V

DC100V

DC200V

DC250V

DC300V

DC500V

DC630V

DC1kV

DC2kV

DC3.15kV

AC250V

X2; AC250V (Safety Standard Recognized Type GB)

X1, Y2; AC250V (Safety Standard Recognized Type GC)

Y3; AC250V (Safety Standard Recognized Type GD)

Y2; AC250V (Safety Standard Recognized Type GF)

Code Rated Voltage

Standard Type

Special Dimension Type

(Tolerances of LgWgT are ±0.15mm)

Special Dimension Type

Special Characteristics

(Applied Voltage is g1.25 of Rated Voltage

at High Temperature Load Test)

TC

HiK

Base Metal

Base Metal Base Metal

A01

A11

A12

A35/A39

GRM

*1

GRM

*1

GRM

*1

GRM

*1

GRM

*1

/LLL/GNM

oIndividual Specification Code

Code Series

Individual Specification

Temperature

Characteristics

Type

*4

Inner Electrode Undercoat

Metal of Outer

Electrode

4

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Special Characteristics (Under special control)

Standard Type

Special Dimension Type

(Tolerances of LgW are ±0.2mm, others)

Special Dimension Type (Length is 3.2±0.2,

Width is 1.6±0.2mm, Thickness is 1.2 ±0.1mm)

Standard Type

(Non-coated type for ERH series)

Standard Type (Coated with Resin)

Standard Type (New Ceramic Material)

Tolerance of Thickness is +0/-0.3mm

Tolerance of Thickness is ±0.3mm

Thickness is 2.7±0.3mm

Standard Type

Special Dimension Type (Thickness is 0.25±0.05mm)

Standard Type (Thin Layer Large Capacitance Type)

Special Characteristics (Under Special Control)

Special Dimension Type

Tolerance of Thickness is ±0.2mm

Tolerance of Thickness is ±0.1mm

HiK

TC

HiK

TC

HiK

TC

HiK

TC

HiK

TC

HiK

TC

HiK

TC

HiK

TC

Base Metal

Base Metal (Cu)

Base Metal

Precious Metal

Base Metal

Precious Metal

Base Metal

Precious Metal

Base Metal

Base Metal Base Metal

Base Metal

Precious Metal

A61/A88/A92/A93

B01

C01

C11

C12

D01

D02

DB4

E01

E19

/

E34

E20

V01

W01

W02

W03

W07

Y01

Y02

Y06

Y21

GRM

*1

GRM

*1

GRM

*1

GRM

*1

GRM

*1

GRM

*1

ERH

GJM

GA3

GJM/GQM

GRM

*1

ERA/ERD/ERF/ERH

GRM

*1

/GNM

GRM

*1

/GMA/LLL/GNM

GRM

*2

GRM

*3

/GR4/GA2/GA3

GRM

*3

GRM

*3

GRM

*3

GRM

*3

GRM

*3

GA3

GRM

*3

/GA3

GRM

*2

Standard Type (New Ceramic Material)

TC

Precious Metal Precious Metal

Z01

GRM

*1

Special Dimension Type

HiK

Base Metal Base Metal

E39

GRM

*1

Code Series

Individual Specification

Temperature

Characteristics

Type

*4

Inner Electrode Undercoat

Metal of Outer

Electrode

!0Packaging

Code

L

D

K

J

E

F

B

C

T

ø178mm Plastic Taping

ø178mm Paper Taping

ø330mm Plastic Taping

ø330mm Paper Taping

ø178mm Special Packaging

ø330mm Special Packaging

Bulk

Bulk Case

Bulk Tray

Packaging

Continued from the preceding page.

*1 Apply to rated voltage 100V and under. *2 Apply to rated voltage 200/500V. *3 Apply to rated voltage 250V, 630V to 3.15kV.

*4 "TC" means Temperature Compensating Type and "HiK" means High Dielectric Type.

5

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Selection Guide of Chip Monolithic Ceramic Capacitors

6

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Power-train equipment

Comfort equipment

Security equipment

Safety equipment

Entertainment equipment

Information

Automotive PC

Start

Application

Function and Circuit

*For other automotive equipment such as comfort, security, information,

entertainment, GRM series (for general electronics) are available.

Specific Applications

Soldering Electrode

C0G Char.

GRM_5C Series

0.5pF–47000pF

Capacitor Arrays

C0G Char.

GNM_5C Series

10pF–360pF

Capacitor Arra ys

for temper ature

compensation

GNM_5C Series

10pF–360pF

Soldering Electrodes

Y5V Char.

GRM_F5 Series

2200pF–22µF

Soldering Electrode

X5R/X7R Char.

GRM_R6,R7 Series

220pF–10µF

High-frequency/

High-power type

Soldering Electrode

ERF Series

0.75pF–1000pF

High-frequency type

ERA Series

0.75pF–1000pF

High-frequency

Ribbon Terminal type

ERD Series

0.75pF–1000pF

High-frequency

for flow/reflow

soldering

GQM Series

0.5pF–100pF

Soldering Electrode

C0G/C0H Char.

GRM_6C Series

0.5pF–47000pF

Microchip Y5V Char .

GMA_F5 Series

4700pF–0.1µF

Capacitor Arrays

Y5V Char.

GNM_F5 Series

22000pF–0.15µF

Low-ESL Y5V Char.

LLL31_F5 Series

0.22µF–1.0µF

GCMSeries*

0.5pF–2.2µF

630V/1kV/2kV/3.15kV

Low-dissipation

GRM Series

10pF–1000pF

Capacitor Arrays

GNM Series

390pF–1.0µF

Thin type Soldering

Electrode

GRM15X Series

0.5pF–4700pF

GJM Series

0.5pF–18pF

Ultrasonic Sensors

ZLM Char.

GRM2199E Series

1000pF/1500pF

Low-ESL

LLL Series

2200pF–1.0µF

250V/630V/1kV

High-capacitance

GRM Series

220pF–1µF

2kV

Only for Information

Devices/Tip & Ring

GR4 Series

100pF–4700pF

UL/IEC

Safety Standard

Recognized

GA3 Series

10pF–33000pF

High-frequency/

High-Power

Ribbon Terminal type

ERH Series

0.75pF–1000pF

Thin Layer

Large-capacitance Type

X5R Char.

GRM_R6 Series

47000pF–100µF

Microchip

GMA_R7 Series

470pF–10000pF

Synchronize Circuit

Filtering

Oscillation Circuit

Temperature

Compensation

De-coupling

Bypassing

Time Constant Circuits

Coupling High Frequency Ultra Thin Circuit Medium Voltage

Safety Standard

Recognized

Low Dissipation

Automotive ( Power-train, Safety equipment )

AC250V which meet

Japanese Law

GA2 Series

470pF–0.1µF

Soldering Electrode

for temper ature

compensation

GRM_ Series

0.5pF–47000pF

General Electronics

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

7

1

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Chip Monolithic Ceramic Capacitors

for Flow/Reflow Soldering GRM15/18/21/31 Series

■ Features

1. Terminations are made of metal highly resistant to

migration.

2. The GRM series is a complete line of chip ceramic

capacitors in 6.3V, 10V, 16V, 25V, 50V, 100V, 200V

and 500V ratings. These capacitors have

temperature characteristics ranging from C0G to

Y5V.

3. A wide selection of sizes is available, from the

miniature LxWxT: 1.0x0.5x0.5mm to

LxWxT: 3.2x1.6x1.15mm.

GRM18, 21 and GRM31 types are suited to flow and

reflow soldering.

GRM15 type is applied to only reflow soldering.

4. Stringent dimensional tolerances allow highly

reliable, high speed automatic chip placement on

PCBs.

5. The GRM series is available in paper or plastic

embossed tape and reel packaging for automatic

placement. Bulk case packaging is also available

for GRM15, GRM18 and GRM21.

■ Applications

General electronic equipment

Part Number LWT

Dimensions (mm) e g min.

1.0 ±0.05 0.5 ±0.05 0.5 ±0.05 0.15 to 0.3 0.4

1.6 ±0.1 0.8 ±0.1 0.8 ±0.1 0.2 to 0.5 0.5

0.6 ±0.1

0.85 ±0.1

1.0 +0/-0.2

2.0 ±0.1 1.25 ±0.1 0.2 to 0.7 0.7

1.25 ±0.1

0.6 ±0.1

0.85 ±0.1

1.15 ±0.1

1.6 ±0.153.2 ±0.15 0.3 to 0.8 1.5

1.6 ±0.21.6 ±0.23.2 ±0.2

* Bulk Case : 1.6 ±0.07(L)g0.8 ±0.07(W)g0.8 ±0.07(T)

GRM155

GRM188*

GRM219

GRM21A

GRM216

GRM21B

GRM316

GRM319

GRM31M

GRM31C

L

T

W

e eg

Temperature Compensating Type GRM15 Series (1.0x0.5 mm) 50V/25V

Part Number

L x W [EIA]

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

C0G

(5C)

50

(1H)

P2H

(6P)

50

(1H)

R2H

(6R)

50

(1H)

S2H

(6S)

50

(1H)50

(1H)

SL

(1X)

25

(1E)

T2H

(6T)

50

(1H)

GRM15

1.00x0.50 [0402]

U2J

(7U)

50

(1H)

0.50pF(R50) 0.50(5)

0.75pF(R75) 0.50(5)

1.0pF(1R0) 0.50(5)

2.0pF(2R0) 0.50(5)

3.0pF(3R0) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)

4.0pF(4R0) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)

5.0pF(5R0) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)

6.0pF(6R0) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)

7.0pF(7R0) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)

8.0pF(8R0) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)

9.0pF(9R0) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)

10pF(100) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)

12pF(120) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)

15pF(150) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)

18pF(180) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)

22pF(220) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)

27pF(270) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)

33pF(330) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)

Continued on the following page.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

8

1

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Continued from the preceding page.

Part Number

L x W [EIA]

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

C0G

(5C)

50

(1H)

P2H

(6P)

50

(1H)

R2H

(6R)

50

(1H)

S2H

(6S)

50

(1H)50

(1H)

SL

(1X)

25

(1E)

T2H

(6T)

50

(1H)

GRM15

1.00x0.50 [0402]

U2J

(7U)

50

(1H)

39pF(390) 0.50(5) 0.50(5) 0.50(5) 0.50(5)

47pF(470) 0.50(5) 0.50(5) 0.50(5) 0.50(5)

56pF(560) 0.50(5) 0.50(5) 0.50(5) 0.50(5)

68pF(680) 0.50(5) 0.50(5) 0.50(5) 0.50(5)

82pF(820) 0.50(5) 0.50(5) 0.50(5) 0.50(5)

100pF(101) 0.50(5) 0.50(5) 0.50(5) 0.50(5)

120pF(121) 0.50(5) 0.50(5) 0.50(5)

150pF(151) 0.50(5) 0.50(5) 0.50(5)

180pF(181) 0.50(5) 0.50(5) 0.50(5)

220pF(221) 0.50(5) 0.50(5)

270pF(271) 0.50(5) 0.50(5)

330pF(331) 0.50(5) 0.50(5)

390pF(391) 0.50(5) 0.50(5)

470pF(471) 0.50(5)

560pF(561) 0.50(5)

680pF(681) 0.50(5)

820pF(821) 0.50(5)

1000pF(102) 0.50(5)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

Temperature Compensating Type GRM18 Series (1.60x0.80 mm) 200V/100V/50V/25V

Part Number

L x W [EIA]

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

200

(2D)100

(2A)

C0G

(5C)

50

(1H)

P2H

(6P)

50

(1H)

R2H

(6R)

50

(1H)

S2H

(6S)

50

(1H)200

(2D)100

(2A)50

(1H)

SL

(1X)

25

(1E)

T2H

(6T)

50

(1H)

GRM18

1.60x0.80 [0603]

U2J

(7U)

50

(1H)

0.50pF(R50) 0.80(8) 0.80(8) 0.80(8)

0.75pF(R75) 0.80(8) 0.80(8) 0.80(8)

1.0pF(1R0) 0.80(8) 0.80(8) 0.80(8)

2.0pF(2R0) 0.80(8) 0.80(8) 0.80(8)

3.0pF(3R0) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

4.0pF(4R0) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

5.0pF(5R0) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

6.0pF(6R0) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

7.0pF(7R0) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

8.0pF(8R0) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

9.0pF(9R0) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

10pF(100) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

12pF(120) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

15pF(150) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

18pF(180) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

22pF(220) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

27pF(270) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

33pF(330) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

39pF(390) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

47pF(470) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

56pF(560) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

Continued on the following page.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

9

1

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Continued from the preceding page.

Part Number

L x W [EIA]

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

200

(2D)100

(2A)

C0G

(5C)

50

(1H)

P2H

(6P)

50

(1H)

R2H

(6R)

50

(1H)

S2H

(6S)

50

(1H)200

(2D)100

(2A)50

(1H)

SL

(1X)

25

(1E)

T2H

(6T)

50

(1H)

GRM18

1.60x0.80 [0603]

U2J

(7U)

50

(1H)

68pF(680) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

82pF(820) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

100pF(101) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

120pF(121) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

150pF(151) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

180pF(181) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

220pF(221) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

270pF(271) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

330pF(331) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

390pF(391) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

470pF(471) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

560pF(561) 0.80(8) 0.80(8) 0.80(8) 0.80(8)

680pF(681) 0.80(8) 0.80(8) 0.80(8)

820pF(821) 0.80(8) 0.80(8)

1000pF(102) 0.80(8) 0.80(8)

1200pF(122) 0.80(8) 0.80(8)

1500pF(152) 0.80(8) 0.80(8)

1800pF(182) 0.80(8)

2200pF(222) 0.80(8)

2700pF(272) 0.80(8)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

Temperature Compensating Type GRM21 Series (2.00x1.25 mm) 200V/100V/50V/25V

Part Number

L x W [EIA]

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

200

(2D)100

(2A)

C0G

(5C)

50

(1H)

C0H

(6C)

25

(1E)

P2H

(6P)

50

(1H)

R2H

(6R)

50

(1H)

S2H

(6S)

50

(1H)200

(2D)100

(2A)50

(1H)

SL

(1X)

25

(1E)

T2H

(6T)

50

(1H)

GRM21

2.00x1.25 [0805]

U2J

(7U)

50

(1H)

12pF(120) 0.85(9)

15pF(150) 0.85(9)

18pF(180) 0.85(9)

22pF(220) 0.85(9)

27pF(270) 0.85(9)

33pF(330) 0.85(9)

39pF(390) 0.85(9)

47pF(470) 0.85(9)

56pF(560) 0.85(9)

68pF(680) 1.25(B) 0.85(9)

82pF(820) 1.25(B) 0.85(9)

100pF(101) 1.25(B) 0.60(6)

120pF(121) 1.25(B) 0.60(6) 0.85(9)

150pF(151) 1.25(B) 0.60(6) 1.25(B)

180pF(181) 1.25(B) 0.60(6) 0.85(9) 1.25(B)

220pF(221) 1.25(B) 0.60(6) 0.85(9) 0.85(9) 1.25(B)

270pF(271) 0.60(6) 0.85(9) 0.85(9) 0.85(9) 1.25(B)

330pF(331) 0.60(6) 0.85(9) 0.85(9) 0.85(9) 1.25(B)

390pF(391) 0.60(6) 1.25(B) 0.85(9) 0.85(9) 1.25(B)

Continued on the following page.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

10

1

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Continued from the preceding page.

Part Number

L x W [EIA]

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

200

(2D)100

(2A)

C0G

(5C)

50

(1H)

C0H

(6C)

25

(1E)

P2H

(6P)

50

(1H)

R2H

(6R)

50

(1H)

S2H

(6S)

50

(1H)200

(2D)100

(2A)50

(1H)

SL

(1X)

25

(1E)

T2H

(6T)

50

(1H)

GRM21

2.00x1.25 [0805]

U2J

(7U)

50

(1H)

470pF(471) 0.60(6) 1.25(B) 0.85(9) 0.85(9) 1.25(B) 0.85(9)

560pF(561) 0.60(6) 1.25(B) 1.25(B) 1.25(B) 0.85(9) 1.25(B)

680pF(681) 0.85(9) 1.25(B) 1.25(B) 0.85(9) 1.25(B)

820pF(821) 0.85(9) 1.25(B) 1.25(B) 0.60(6) 1.25(B) 0.60(6)

1000pF(102) 0.85(9) 1.25(B) 0.60(6) 1.25(B) 0.60(6)

1200pF(122) 1.25(B) 0.60(6) 1.25(B) 0.60(6)

1500pF(152) 1.25(B) 0.85(9) 1.25(B) 0.85(9)

1800pF(182) 0.60(6) 1.25(B) 0.85(9) 1.25(B) 0.85(9)

2200pF(222) 0.60(6) 0.85(9) 0.85(9)

2700pF(272) 0.60(6) 1.25(B) 1.25(B) 1.25(B)

3300pF(332) 0.60(6) 1.25(B) 1.25(B) 1.25(B)

3900pF(392) 0.60(6) 1.25(B) 0.85(9)

4700pF(472) 0.60(6) 0.85(9)

5600pF(562) 0.85(9) 1.25(B)

6800pF(682) 0.85(9) 1.25(B)

8200pF(822) 0.85(9)

10000pF(103) 0.85(9) 0.60(6) 0.60(6)

12000pF(123) 0.60(6) 0.60(6)

15000pF(153) 0.60(6) 0.60(6)

18000pF(183) 0.60(6) 0.60(6)

22000pF(223) 0.85(9) 0.85(9)

27000pF(273) 0.85(9) 0.85(9)

33000pF(333) 1.00(A) 1.00(A)

39000pF(393) 1.25(B) 1.25(B)

47000pF(473) 1.25(B) 1.25(B)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

Temperature Compensating Type GRM31 Series (3.20x1.60 mm) 500V/200V/100V/50V/25V

Part Number

L x W [EIA]

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

500

(2H)200

(2D)50

(1H)

C0G

(5C)

25

(1E)

C0H

(6C)

25

(1E)

P2H

(6P)

50

(1H)

R2H

(6R)

50

(1H)

S2H

(6S)

50

(1H)200

(2D)100

(2A)50

(1H)

SL

(1X)

25

(1E)

T2H

(6T)

50

(1H)

GRM31

3.20x1.60 [1206]

U2J

(7U)

50

(1H)

1.0pF(1R0) 1.15(M)

2.0pF(2R0) 1.15(M)

3.0pF(3R0) 1.15(M)

4.0pF(4R0) 1.15(M)

5.0pF(5R0) 1.15(M)

6.0pF(6R0) 1.15(M)

7.0pF(7R0) 1.15(M)

8.0pF(8R0) 1.15(M)

9.0pF(9R0) 1.15(M)

10pF(100) 1.15(M)

12pF(120) 1.15(M)

15pF(150) 1.15(M)

18pF(180) 1.15(M)

22pF(220) 1.15(M)

Continued on the following page.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

11

1

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Continued from the preceding page.

Part Number

L x W [EIA]

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

500

(2H)200

(2D)50

(1H)

C0G

(5C)

25

(1E)

C0H

(6C)

25

(1E)

P2H

(6P)

50

(1H)

R2H

(6R)

50

(1H)

S2H

(6S)

50

(1H)200

(2D)100

(2A)50

(1H)

SL

(1X)

25

(1E)

T2H

(6T)

50

(1H)

GRM31

3.20x1.60 [1206]

U2J

(7U)

50

(1H)

27pF(270) 1.15(M)

33pF(330) 1.15(M)

39pF(390) 1.15(M)

47pF(470) 1.15(M)

56pF(560) 1.15(M)

68pF(680) 1.15(M)

82pF(820) 1.15(M)

270pF(271) 1.15(M)

330pF(331) 1.15(M)

390pF(391) 1.15(M)

470pF(471) 1.15(M)

560pF(561) 1.15(M)

680pF(681) 0.85(9) 1.15(M)

820pF(821) 0.85(9) 0.85(9) 1.15(M)

1000pF(102) 1.15(M) 1.15(M) 0.85(9) 1.15(M)

1200pF(122) 1.15(M) 1.15(M) 1.15(M) 1.15(M)

1500pF(152) 1.15(M) 1.15(M) 1.15(M)

1800pF(182) 1.15(M)

2200pF(222) 1.15(M) 1.15(M)

2700pF(272) 1.15(M) 1.15(M)

3300pF(332) 1.15(M) 1.15(M)

3900pF(392) 1.15(M) 0.85(9) 1.15(M) 0.85(9)

4700pF(472) 1.15(M) 0.85(9) 0.85(9)

5600pF(562) 0.85(9) 0.85(9) 0.85(9)

6800pF(682) 0.85(9) 0.85(9) 1.15(M) 1.15(M)

8200pF(822) 0.85(9) 1.15(M) 1.15(M) 1.15(M)

10000pF(103) 0.85(9) 1.15(M)

12000pF(123) 1.15(M)

15000pF(153) 1.15(M)

27000pF(273) 0.85(9)

33000pF(333) 0.85(9)

47000pF(473) 1.15(M)

56000pF(563) 0.85(9) 0.85(9)

68000pF(683) 1.15(M) 1.15(M)

82000pF(823) 1.15(M) 1.15(M)

0.10µF(104) 1.60(C) 1.15(M) 1.15(M)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

High Dielectric Constant Type X5R (R6) Characteristics

TC

Part Number

L x W [EIA]

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

16

(1C)

GRM15

1.00x0.50 [0402]

10

(1A)10

(1A)

GRM18

1.60x0.80 [0603]

6.3

(0J)10

(1A)

GRM21

2.00x1.25 [0805]

6.3

(0J)10

(1A)

X5R

(R6)

GRM31

3.20x1.60 [1206]

6.3

(0J)

68000pF(683) 0.50(5)

0.10µF(104) 0.50(5) 0.50(5)

0.33µF(334) 0.80(8)

Continued on the following page.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

12

1

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Continued from the preceding page.

TC

Part Number

L x W [EIA]

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

16

(1C)

GRM15

1.00x0.50 [0402]

10

(1A)10

(1A)

GRM18

1.60x0.80 [0603]

6.3

(0J)10

(1A)

GRM21

2.00x1.25 [0805]

6.3

(0J)10

(1A)

X5R

(R6)

GRM31

3.20x1.60 [1206]

6.3

(0J)

0.47µF(474) 0.80(8)

0.68µF(684) 0.80(8)

1.0µF(105) 0.80(8) 0.80(8) 0.85(9)

1.5µF(155) 0.85(9)

2.2µF(225) 1.25(B) 1.25(B) 0.85(9)

3.3µF(335) 1.25(B) 1.30(X)

4.7µF(475) 1.25(B) 1.60(C) 1.15(M)

10µF(106) 1.60(C) 1.60(C)

The part numbering code is shown in each ( ).

3.3µF and 4.7µF, 6.3V rated are GRM21 series of L: 2±0.15, W: 1.25±0.15, T: 1.25±0.15.

T: 1.15±0.1mm is also available for GRM31 1.0µF for 16V.

L: 3.2±0.2, W: 1.6±0.2 for GRM31 16V 1.0µF type. Also L: 3.2±0.2, W: 1.6±0.2, T: 1.15±0.15 for GRM31 16V 1.5µF and 2.2µF type.

Dimensions are shown in mm and Rated Voltage in Vdc.

High Dielectric Constant Type X7R (R7) Characteristics

TC

Part Number

L x W [EIA]

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

50

(1H)25

(1E)16

(1C)

GRM15

1.00x0.50 [0402]

10

(1A)100

(2A)50

(1H)25

(1E)16

(1C)

GRM18

1.60x0.80 [0603]

10

(1A)100

(2A)50

(1H)25

(1E)

GRM21

2.00x1.25 [0805]

16

(1C)100

(2A)50

(1H)25

(1E)16

(1C)

X7R

(R7)

GRM31

3.20x1.60 [1206]

10

(1A)

220pF

(221)0.50

(5)0.80

(8)

330pF

(331)0.50

(5)0.80

(8)

470pF

(471)0.50

(5)0.80

(8)

680pF

(681)0.50

(5)0.80

(8)

1000pF

(102)0.50

(5)0.80

(8)

1500pF

(152)0.50

(5)0.80

(8)

2200pF

(222)0.50

(5)0.80

(8)0.80

(8)

3300pF

(332)0.50

(5)0.80

(8)0.80

(8)

4700pF

(472)0.50

(5)0.80

(8)0.85

(9)

6800pF

(682)0.50

(5)0.80

(8)0.85

(9)

10000pF

(103)0.50

(5)0.80

(8)1.25

(B)

15000pF

(153)0.50

(5)0.80

(8)

22000pF

(223)0.50

(5)0.80

(8)

33000pF

(333)0.50

(5)0.80

(8)0.80

(8)0.85

(9)1.15

(M)

Continued on the following page.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

13

1

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Continued from the preceding page.

TC

Part Number

L x W [EIA]

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

50

(1H)25

(1E)16

(1C)

GRM15

1.00x0.50 [0402]

10

(1A)100

(2A)50

(1H)25

(1E)16

(1C)

GRM18

1.60x0.80 [0603]

10

(1A)100

(2A)50

(1H)25

(1E)

GRM21

2.00x1.25 [0805]

16

(1C)100

(2A)50

(1H)25

(1E)16

(1C)

X7R

(R7)

GRM31

3.20x1.60 [1206]

10

(1A)

68000pF

(683)0.80

(8)0.80

(8)1.25

(B)

0.10µF

(104)0.50

(5)0.50

(5)0.80

(8)0.80

(8)1.25

(B)1.25

(B)

0.15µF

(154)0.80

(8)0.80

(8)1.25

(B)1.25

(B)

0.22µF

(224)0.80

(8)0.80

(8)1.25

(B)0.85

(9)

0.33µF

(334)0.85

(9)1.25

(B)0.85

(9)

0.47µF

(474)1.25

(B)1.25

(B)0.85

(9)1.15

(M)

0.68µF

(684)0.85

(9)0.85

(9)

1.0µF

(105)1.25

(B)1.15

(M)1.15

(M)0.85

(9)0.85

(9)

1.5µF

(155)1.60

(C)1.15

(M)

2.2µF

(225)1.60

(C)1.15

(M)0.85

(9)

3.3µF

(335)1.60

(C)

4.7µF

(475)1.60

(C)

The part numbering code is shown in each ( ).

The tolerance will be changed to L: 3.2±0.2, W: 1.6±0.2 for GRM31 16V 1.0µF type. Also L: 3.2±0.2, W: 1.6±0.2, T: 1.15±0.15 for GRM31 16V 1.5µF and 2.2µF type.

Dimensions are shown in mm and Rated Voltage in Vdc.

High Dielectric Constant Type Y5V (F5) Characteristics

TC

Part Number

L x W [EIA]

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

50

(1H)25

(1E)

GRM15

1.00x0.50 [0402]

16

(1C)100

(2A)50

(1H)25

(1E)16

(1C)

GRM18

1.60x0.80 [0603]

10

(1A)50

(1H)25

(1E)16

(1C)

GRM21

2.00x1.25 [0805]

10

(1A)50

(1H)25

(1E)16

(1C)10

(1A)

Y5V

(F5)

GRM31

3.20x1.60 [1206]

6.3

(0J)

2200pF

(222)0.50

(5)

4700pF

(472)0.50

(5)0.80

(8)

10000pF

(103)0.50

(5)0.80

(8)

22000pF

(223)0.50

(5)0.80

(8)

47000pF

(473)0.50

(5)0.80

(8)

0.10µF

(104)0.50

(5)0.50

(5)0.80

(8)0.80

(8)0.85

(9)

Continued on the following page.

47000pF

(473)0.50

(5)0.80

(8)0.80

(8)1.25

(B)1.15

(M)

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

14

1

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Continued from the preceding page.

TC

Part Number

L x W [EIA]

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

50

(1H)25

(1E)

GRM15

1.00x0.50 [0402]

16

(1C)100

(2A)50

(1H)25

(1E)16

(1C)

GRM18

1.60x0.80 [0603]

10

(1A)50

(1H)25

(1E)16

(1C)

GRM21

2.00x1.25 [0805]

10

(1A)50

(1H)25

(1E)16

(1C)10

(1A)

Y5V

(F5)

GRM31

3.20x1.60 [1206]

6.3

(0J)

0.22µF

(224)0.80

(8)1.25

(B)0.85

(9)

0.47µF

(474)0.80

(8)0.80

(8)1.25

(B)1.15

(M)

1.0µF

(105)0.80

(8)0.80

(8)0.85

(9)0.85

(9)1.15

(M)0.85

(9)

2.2µF

(225)1.25

(B)1.25

(B)1.15

(M)0.85

(9)

4.7µF

(475)1.25

(B)1.15

(M)1.15

(M)

10µF

(106)1.60

(C)1.15

(M)1.15

(M)

The part numbering code is shown in each ( ).

T: 1.25±0.1mm is also available for GRM21 25V or 16V 1.0µF type.

Dimensions are shown in mm and Rated Voltage in Vdc.

High Dielectric Constant Type Z5U (E4) Characteristics

TC

Part Number

L x W [EIA]

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

GRM18

1.60x0.80 [0603]

50

(1H)

GRM21

2.00x1.25 [0805]

50

(1H)

Z5U

(E4)

GRM31

3.20x1.60 [1206]

50

(1H)

10000pF(103) 0.80(8)

22000pF(223) 0.80(8)

47000pF(473) 0.60(6)

0.10µF(104) 0.85(9)

0.22µF(224) 0.85(9)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

15

2

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Chip Monolithic Ceramic Capacitors

for Reflow Soldering GRM32/43/55 Series

■ Features

1. Terminations are made of metal highly resistant to

migration.

2. The GRM series is a complete line of chip ceramic

capacitors in 10V, 16V, 25V, 50V, 100V and 200V

ratings.

These capacitors have temperature characteristics

ranging from C0G to Y5V.

3. This series consists of type LxWxT: 3.2x2.5x0.85mm

to LxWxT: 5.7x5.0x2.5mm. These are suited to only

reflow soldering.

4. Stringent dimensional tolerances allow highly

reliable, high speed automatic chip placement on

PCBs.

5. The GRM series is available in paper or plastic

embossed tape and reel packaging for automatic

placement.

■ Applications

General electronic equipment

Part Number

LW T

Dimensions (mm)

e min. g min.

3.2 ±0.3 2.5 ±0.2 0.3 1.0

2.5 ±0.2

1.8 ±0.2

1.35 ±0.15

1.15 ±0.1

0.85 ±0.1

1.15 ±0.1

4.5 ±0.4 3.2 ±0.3 1.35 ±0.15 0.3 2.0

GRM32N

GRM32R

GRM32E

GRM32M

GRM329

GRM43M

GRM43N

1.8 ±0.2

GRM43R

5.7 ±0.4 5.0 ±0.4

1.15 ±0.1

0.3 2.0

GRM55M

2.0 ±0.2

GRM43D

2.5 ±0.2

GRM43E

1.6 ±0.2

GRM55C

1.35 ±0.15

GRM55N

1.8 ±0.2

GRM55R

2.0 ±0.2

GRM55D

2.5 ±0.2

GRM55E

L

T

W

e eg

Temperature Compensating Type GRM32/43/55 Series

Part Number TC Code

(Standard) Rated Voltage

(Vdc) Capacitance

(pF) Length L

(mm) Width W

(mm) Thickness T

(mm)

GRM32N5C2D561JV01 C0G (EIA) 200 560 ±5% 3.20 2.50 1.35

GRM32N5C2D681JY21 C0G (EIA) 200 680 ±5% 3.20 2.50 1.35

GRM32N5C2D821JY21 C0G (EIA) 200 820 ±5% 3.20 2.50 1.35

GRM32N5C2D102JY21 C0G (EIA) 200 1000 ±5% 3.20 2.50 1.35

GRM43R5C2D122JV01 C0G (EIA) 200 1200 ±5% 4.50 3.20 1.80

GRM43R5C2D152JV01 C0G (EIA) 200 1500 ±5% 4.50 3.20 1.80

GRM43R5C2D182JY21 C0G (EIA) 200 1800 ±5% 4.50 3.20 1.80

GRM43R5C2D222JY21 C0G (EIA) 200 2200 ±5% 4.50 3.20 1.80

GRM43R5C2D272JY21 C0G (EIA) 200 2700 ±5% 4.50 3.20 1.80

GRM55N5C2D332JY21 C0G (EIA) 200 3300 ±5% 5.70 5.00 1.35

GRM55R5C2D392JY21 C0G (EIA) 200 3900 ±5% 5.70 5.00 1.80

GRM55R5C2D472JY21 C0G (EIA) 200 4700 ±5% 5.70 5.00 1.80

GRM55R5C2D562JY21 C0G (EIA) 200 5600 ±5% 5.70 5.00 1.80

GRM32N1X2D152JV01 SL (JIS) 200 1500 ±5% 3.20 2.50 1.35

GRM43N1X2D182JV01 SL (JIS) 200 1800 ±5% 4.50 3.20 1.35

GRM43N1X2D222JV01 SL (JIS) 200 2200 ±5% 4.50 3.20 1.35

GRM43R1X2D272JV01 SL (JIS) 200 2700 ±5% 4.50 3.20 1.80

GRM43R1X2D332JV01 SL (JIS) 200 3300 ±5% 4.50 3.20 1.80

GRM43R1X2D392JV01 SL (JIS) 200 3900 ±5% 4.50 3.20 1.80

GRM55N1X2D472JV01 SL (JIS) 200 4700 ±5% 5.70 5.00 1.35

GRM55R1X2D562JV01 SL (JIS) 200 5600 ±5% 5.70 5.00 1.80

GRM55R1X2D682JV01 SL (JIS) 200 6800 ±5% 5.70 5.00 1.80

GRM55R1X2D822JV01 SL (JIS) 200 8200 ±5% 5.70 5.00 1.80

GRM32N1X2A562JZ01 SL (JIS) 100 5600 ±5% 3.20 2.50 1.35

GRM32N1X2A682JZ01 SL (JIS) 100 6800 ±5% 3.20 2.50 1.35

GRM43N1X2A822JZ01 SL (JIS) 100 8200 ±5% 4.50 3.20 1.35

GRM43R1X2A103JZ01 SL (JIS) 100 10000 ±5% 4.50 3.20 1.80

Continued on the following page.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

16

2

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Part Number TC Code

(Standard) Rated Voltage

(Vdc) Capacitance

(pF) Length L

(mm) Width W

(mm) Thickness T

(mm)

Continued from the preceding page.

GRM43R1X2A123JZ01 SL (JIS) 100 12000 ±5% 4.50 3.20 1.80

GRM43R1X2A153JZ01 SL (JIS) 100 15000 ±5% 4.50 3.20 1.80

GRM55M1X2A183JZ01 SL (JIS) 100 18000 ±5% 5.70 5.00 1.15

GRM55N1X2A223JZ01 SL (JIS) 100 22000 ±5% 5.70 5.00 1.35

GRM55R1X2A273JZ01 SL (JIS) 100 27000 ±5% 5.70 5.00 1.80

GRM55R1X2A333JZ01 SL (JIS) 100 33000 ±5% 5.70 5.00 1.80

GRM55R1X2A393JZ01 SL (JIS) 100 39000 ±5% 5.70 5.00 1.80

GRM32N1X1H103JZ01 SL (JIS) 50 10000 ±5% 3.20 2.50 1.35

GRM32N1X1H123JZ01 SL (JIS) 50 12000 ±5% 3.20 2.50 1.35

GRM43R1X1H153JZ01 SL (JIS) 50 15000 ±5% 4.50 3.20 1.80

GRM55M1X1H183JZ01 SL (JIS) 50 18000 ±5% 5.70 5.00 1.15

GRM55N1X1H223JZ01 SL (JIS) 50 22000 ±5% 5.70 5.00 1.35

GRM55R1X1H273JZ01 SL (JIS) 50 27000 ±5% 5.70 5.00 1.80

GRM55R1X1H333JZ01 SL (JIS) 50 33000 ±5% 5.70 5.00 1.80

GRM55R1X1H393JZ01 SL (JIS) 50 39000 ±5% 5.70 5.00 1.80

High Dielectric Constant Type Type GRM32 Series (3.20x2.50mm)

Part Number TC Code

(Standard) Rated Voltage

(Vdc) Capacitance Length L

(mm) Width W

(mm) Thickness T

(mm)

GRM32ER61A106KC01 X5R (EIA) 10 10µF ±10% 3.20 2.50 2.50

GRM32NR72A683KA01 X7R (EIA) 100 68000pF ±10% 3.20 2.50 1.35

GRM32NR72A104KA01 X7R (EIA) 100 0.10µF ±10% 3.20 2.50 1.35

GRM32ER72A105KA01 X7R (EIA) 100 1.0µF ±10% 3.20 2.50 2.50

GRM32NR71H684KA01 X7R (EIA) 50 0.68µF ±10% 3.20 2.50 1.35

GRM32RR71H105KA01 X7R (EIA) 50 1.0µF ±10% 3.20 2.50 1.80

GRM32RR71E225KC01 X7R (EIA) 25 2.2µF ±10% 3.20 2.50 1.80

GRM32MR71C225KC01 X7R (EIA) 16 2.2µF ±10% 3.20 2.50 1.15

GRM32NR71C335KC01 X7R (EIA) 16 3.3µF ±10% 3.20 2.50 1.35

GRM32RR71C475KC01 X7R (EIA) 16 4.7µF ±10% 3.20 2.50 1.80

GRM32ER71H475KA88 X7R (EIA) 16 4.7µF ±10% 3.20 2.50 2.50

GRM32NF52A104ZA01 Y5V (EIA) 100 0.10µF +80/-20% 3.20 2.50 1.35

GRM32RF51H105ZA01 Y5V (EIA) 50 1.0µF +80/-20% 3.20 2.50 1.8

GRM32DF51H106ZA01 Y5V (EIA) 50 10µF +80/-20% 3.20 2.50 2.00

GRM329F51E475ZA01 Y5V (EIA) 25 4.7µF +80/-20% 3.20 2.50 0.85

GRM32NF51E106ZA01 Y5V (EIA) 25 10µF +80/-20% 3.20 2.50 1.35

GRM32NF51C106ZA01 Y5V (EIA) 16 10µF +80/-20% 3.20 2.50 1.35

High Dielectric Constant Type Type GRM43 Series (4.50x3.20mm)

Part Number TC Code

(Standard) Rated Voltage

(Vdc) Capacitance

(µF) Length L

(mm) Width W

(mm) Thickness T

(mm)

GRM43RR72A154KA01 X7R (EIA) 100 0.15 ±10% 4.50 3.20 1.80

GRM43RR72A224KA01 X7R (EIA) 100 0.22 ±10% 4.50 3.20 1.80

GRM43DR72A474KA01 X7R (EIA) 100 0.47 ±10% 4.50 3.20 2.00

GRM43ER72A225KA01 X7R (EIA) 100 2.2 ±10% 4.50 3.20 2.50

GRM43ER71H225KA01 X7R (EIA) 50 2.2 ±10% 4.50 3.20 2.50

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

17

2

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

High Dielectric Constant Type Type GRM55 Series (5.70x5.00mm)

Part Number TC Code

(Standard) Rated Voltage

(Vdc) Capacitance

(µF) Length L

(mm) Width W

(mm) Thickness T

(mm)

GRM55DR61H106KA01 X5R (EIA) 50 10.0 ±10% 5.70 5.00 2.00

GRM55DR72A105KA01 X7R (EIA) 100 1.0 ±10% 5.70 5.00 2.00

GRM55ER72A475KA01 X7R (EIA) 100 4.7 ±10% 5.70 5.00 2.50

GRM55RR71H105KA01 X7R (EIA) 50 1.0 ±10% 5.70 5.00 1.80

GRM55RR71H155KA01 X7R (EIA) 50 1.5 ±10% 5.70 5.00 1.80

GRM55ER71H475KA01 X7R (EIA) 50 4.7 ±10% 5.70 5.00 2.50

GRM55RF52A474ZA01 Y5V (EIA) 100 0.47 +80/-20% 5.70 5.00 1.80

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

18

3

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Chip Monolithic Ceramic Capacitors

Ultra-small GRM03 Series

■ Features

1. Small chip size (LxWxT: 0.6x0.3x0.3mm).

2. Terminations are made of metal highly resistant to

migration.

3. GRM03 type is suited to only reflow soldering.

4. Stringent dimensional tolerances allow highly

reliable, high speed automatic chip placement on

PCBs.

5. GRM03 series are suited to miniature micro wave

module, portable equipment and high frequency

circuits.

■ Applications

1. Miniature micro wave module

2. Portable equipment

3. High frequency circuit

L

T

Part Number LWT

Dimensions (mm) e g min.

0.6 ±0.03 0.3 ±0.03 0.1 to 0.2 0.20.3 ±0.03

GRM033

W

e eg

Part Number

L x W

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

C0G

(5C)

25

(1E)

X5R

(R6)

10

(1A)16

(1C)

X7R

(R7)

6.3

(0J)

GRM03

0.6x0.3

Y5V

(F5)

10

(1A)

0.50pF(R50) 0.3(3)

1.0pF(1R0) 0.3(3)

2.0pF(2R0) 0.3(3)

3.0pF(3R0) 0.3(3)

4.0pF(4R0) 0.3(3)

5.0pF(5R0) 0.3(3)

6.0pF(6R0) 0.3(3)

7.0pF(7R0) 0.3(3)

8.0pF(8R0) 0.3(3)

9.0pF(9R0) 0.3(3)

10pF(100) 0.3(3)

12pF(120) 0.3(3)

15pF(150) 0.3(3)

18pF(180) 0.3(3)

22pF(220) 0.3(3)

27pF(270) 0.3(3)

33pF(330) 0.3(3)

39pF(390) 0.3(3)

47pF(470) 0.3(3)

56pF(560) 0.3(3)

68pF(680) 0.3(3)

82pF(820) 0.3(3)

100pF(101) 0.3(3) 0.3(3)

150pF(151) 0.3(3)

220pF(221) 0.3(3)

330pF(331) 0.3(3)

470pF(471) 0.3(3)

680pF(681) 0.3(3)

Continued on the following page.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

19

3

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Continued from the preceding page.

Part Number

L x W

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

C0G

(5C)

25

(1E)

X5R

(R6)

10

(1A)16

(1C)

X7R

(R7)

6.3

(0J)

GRM03

0.6x0.3

Y5V

(F5)

10

(1A)

1000pF(102) 0.3(3)

1500pF(152) 0.3(3) 0.3(3)

2200pF(222) 0.3(3) 0.3(3) 0.3(3)

3300pF(332) 0.3(3) 0.3(3)

4700pF(472) 0.3(3) 0.3(3) 0.3(3)

6800pF(682) 0.3(3) 0.3(3)

10000pF(103) 0.3(3) 0.3(3) 0.3(3)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

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20

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Chip Monolithic Ceramic Capacitors

Thin Type (Flow/Reflow)

■ Features

1. This series is suited to flow and reflow soldering.

Capacitor terminations are made of metal highly

resistant to migration.

2. Large capacitance values enable excellent bypass

effects to be realized.

3. Its thin package makes this series ideally suited

for the production of small electronic products

and for mounting underneath ICs.

■ Applications

Thin equipment such as IC cards

L

T

Part Number LWT

Dimensions (mm) e g min.

1.0 ±0.05 0.5 ±0.05 0.1 to 0.3 0.40.25 ±0.05

GRM15X

W

e eg

Temperature Compensating Type

High Dielectric Constant Type

Part Number TC Code

(Standard) Rated Voltage

(Vdc) Capacitance

(pF) Length L

(mm) Width W

(mm) Thickness T

(mm)

GRM15X5C1H1R0CDB4 C0G (EIA) 50 1.0 ±0.25pF 1.00 0.50 0.25

GRM15X5C1H2R0CDB4 C0G (EIA) 50 2.0 ±0.25pF 1.00 0.50 0.25

GRM15X5C1H3R0CDB4 C0G (EIA) 50 3.0 ±0.25pF 1.00 0.50 0.25

GRM15X5C1H4R0CDB4 C0G (EIA) 50 4.0 ±0.25pF 1.00 0.50 0.25

GRM15X5C1H5R0CDB4 C0G (EIA) 50 5.0 ±0.25pF 1.00 0.50 0.25

GRM15X5C1H6R0DDB4 C0G (EIA) 50 6.0 ±0.5pF 1.00 0.50 0.25

GRM15X5C1H7R0DDB4 C0G (EIA) 50 7.0 ±0.5pF 1.00 0.50 0.25

GRM15X5C1H8R0DDB4 C0G (EIA) 50 8.0 ±0.5pF 1.00 0.50 0.25

GRM15X5C1H9R0DDB4 C0G (EIA) 50 9.0 ±0.5pF 1.00 0.50 0.25

GRM15X5C1H100JDB4 C0G (EIA) 50 10 ±5% 1.00 0.50 0.25

GRM15X5C1H120JDB4 C0G (EIA) 50 12 ±5% 1.00 0.50 0.25

GRM15X5C1H150JDB4 C0G (EIA) 50 15 ±5% 1.00 0.50 0.25

GRM15X5C1H180JDB4 C0G (EIA) 50 18 ±5% 1.00 0.50 0.25

GRM15X5C1H220JDB4 C0G (EIA) 50 22 ±5% 1.00 0.50 0.25

GRM15X5C1H270JDB4 C0G (EIA) 50 27 ±5% 1.00 0.50 0.25

GRM15X5C1H330JDB4 C0G (EIA) 50 33 ±5% 1.00 0.50 0.25

GRM15X5C1H390JDB4 C0G (EIA) 50 39 ±5% 1.00 0.50 0.25

GRM15X5C1H470JDB4 C0G (EIA) 50 47 ±5% 1.00 0.50 0.25

Continued on the following page.

GRM15X5C1H560JDB4 C0G (EIA) 50 56 ±5% 1.00 0.50 0.25

GRM15X5C1H680JDB4 C0G (EIA) 50 68 ±5% 1.00 0.50 0.25

GRM15X5C1H820JDB4 C0G (EIA) 50 82 ±5% 1.00 0.50 0.25

GRM15X5C1H101JDB4 C0G (EIA) 50 100 ±5% 1.00 0.50 0.25

GRM15X5C1E121JDB4 C0G (EIA) 25 120 ±5% 1.00 0.50 0.25

GRM15X5C1E151JDB4 C0G (EIA) 25 150 ±5% 1.00 0.50 0.25

GRM15X5C1E181JDB4 C0G (EIA) 25 180 ±5% 1.00 0.50 0.25

GRM15X5C1E221JDB4 C0G (EIA) 25 220 ±5% 1.00 0.50 0.25

Part Number TC Code

(Standard) Rated Voltage

(Vdc) Capacitance

(pF) Length L

(mm) Width W

(mm) Thickness T

(mm)

GRM15XR71H221KA86 X7R (EIA) 50 220 ±10% 1.00 0.50 0.25

GRM15XR71H331KA86 X7R (EIA) 50 330 ±10% 1.00 0.50 0.25

GRM15XR71H471KA86 X7R (EIA) 50 470 ±10% 1.00 0.50 0.25

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

21

4

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Continued from the preceding page.

Part Number TC Code

(Standard) Rated Voltage

(Vdc) Capacitance

(pF) Length L

(mm) Width W

(mm) Thickness T

(mm)

GRM15XR71H681KA86 X7R (EIA) 50 680 ±10% 1.00 0.50 0.25

GRM15XR71H102KA86 X7R (EIA) 50 1000 ±10% 1.00 0.50 0.25

GRM15XR71H152KA86 X7R (EIA) 50 1500 ±10% 1.00 0.50 0.25

GRM15XR71E182KA86 X7R (EIA) 25 1800 ±10% 1.00 0.50 0.25

GRM15XR71E222KA86 X7R (EIA) 25 2200 ±10% 1.00 0.50 0.25

GRM15XR71C332KA86 X7R (EIA) 16 3300 ±10% 1.00 0.50 0.25

GRM15XR71C472KA86 X7R (EIA) 16 4700 ±10% 1.00 0.50 0.25

GRM15XR71C682KA86 X7R (EIA) 16 6800 ±10% 1.00 0.50 0.25

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

No. Item

Specifications

Test Method

Temperature

Compensating Type

See the previous page.

Within the specified dimensions

No defects or abnormalities

More than 10,000MΩor 500Ω• F (Whichever is smaller)

Within the specified tolerance

(Table A)

30pFmin. : QU1000

30pFmax. : QU400+20C

C : Nominal Capacitance (pF)

Within the specified tolerance

No defects or abnormalities

Y55 to W125D

Operating

Temperature

Rated Voltage

Appearance

Dimensions

Dielectric Strength

Insulation

Resistance

Capacitance

Q/

Dissipation Factor

(D.F.)

Capacitance

Temperature

Characteristics

1

2

3

4

5

6

7

8

9

Using calipers on micrometer

The insulation resistance should be measured with a DC

voltage not exceeding the rated voltage at 25Dand 75%RH

max. and within 2 minutes of charging.

The capacitance/Q/D.F. should be measured at 25Dat the

frequency and voltage shown in the table.

(2) High Dielectric Constant Type

The ranges of capacitance change compared with the above

25Dvalue over the temperature ranges shown in the table

should be within the specified ranges.

The capacitance change should be measured after 5 min. at

each specified temperature stage.

(1) Temperature Compensating Type

The temperature coefficient is determined using the

Capacitance measured in step 3 as a reference.

When cycling the temperature sequentially from step 1 through

5 (C0∆: W25Dto W125D : other temp. coeffs. : W25Dto

W85D) the capacitance should be within the specified tolerance

for the temperature coefficient and capacitance change as

Table A.

The capacitance drift is calculated by dividing the differences

between the maximum and minimum measured values in steps

1, 3 and 5 by the capacitance value in step 3.

No failure should be observed when *300% of the rated voltage

(C0∆to U2J and SL) or *250% of the rated voltage (X5R, X7R,

Z5U and Y5V) is applied between the terminations for 1 to 5

seconds, provided the charge/discharge current is less than

50mA. *200% for 500V

Visual inspection

The rated voltage is defined as the maximum voltage which

may be applied continuously to the capacitor.

When AC voltage is superimposed on DC voltage, VP-P or VO-P,

whichever is larger, should be maintained within the rated

voltage range.

High Dielectric Type

R6 : Y55 to W85D

R7 : Y55 to W125D

E4 : W10 to W85D

F5 : Y30 to W85D

[R6, R7]

W.V. : 25Vmin. : 0.025max.

W.V. : 16/10V : 0.035max.

W.V. : 6.3V

0.05max.(CF3.3µF)

0.1max.(CU3.3µF)

[E4]

W.V. : 25Vmin. : 0.025max.

[F5]

W.V. : 25Vmin.

:

0.05max.(CF0.10µF)

:

0.09max.(CU0.10µF)

W.V. : 16V/10V : 0.125max.

W.V. : 6.3Vmax. : 0.15max.

R6 : WithinT15%

(Y55 to W85D)

R7 : Within±15%

(Y55 to W125D)

E4 : Within W22/Y56%

(W10 to W85D)

F5 : Within W22/Y82%

(Y30 to W85D)

Capacitance

Change

Temperature

Coefficient

Item

∆C to 7U, 1X

(1000pF and

below) 1T0.1MHz 0.5 to 5Vrms

Frequency Voltage

∆C to 7U, 1X

(more than

1000pF) 1T0.1kHz 1T0.2Vrms

Char.

R6, R7, F5

(10µF and below) 1T0.1kHz 1T0.2Vrms

R6, R7, F5

(more than 10µF) 120T24Hz 0.5T0.1Vrms

E4 1T0.1kHz 0.5T0.05Vrms

Step

125T2

Temperature(D)

2Y55T3 (for ∆C to 7U/1X/R6/R7)

Y30T3 (for F5)

10T3 (for E4)

325T2

4125T3 (for ∆C/R7)

85T3 (for other TC)

525T2

Capacitance

Drift

Within the specified tolerance

(Table A)

Within T0.2% or T0.05pF

(Whichever is larger.)

*Does not apply to 1X/25V

Continued on the following page.

GRM Series Specifications and Test Methods

22

4

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

No. Item

Specifications

Test Method

Temperature

Compensating Type

30pFmin. : QU1000

30pFmax. : QU400W20C

C : Nominal Capacitance (pF)

[R6, R7]

W.V. : 25Vmin. : 0.025max.

W.V. : 16/10V : 0.035max.

W.V. : 6.3V :

0.05max. (CF3.3µF)

0.1max. (CU3.3µF)

[E4]

W.V. : 25Vmin. : 0.025max.

[F5]

W.V. : 25Vmin.

:

0.05max. (CF0.10µF)

:

0.09max. (CU0.10µF)

W.V. : 16V/10V : 0.125max.

W.V. : 6.3Vmax. : 0.15max.

No defects or abnormalities

Within the specified tolerance

No removal of the terminations or other defect should occur.

Adhesive Strength

of Termination

Vibration

Resistance

Deflection

10

11

12

Solder the capacitor on the test jig (glass epoxy board) shown

in Fig. 2 using a eutectic solder. Then apply a force in the

direction shown in Fig. 3. The soldering should be done either

with an iron or using the reflow method and should be

conducted with care so that the soldering is uniform and free of

defects such as heat shock.

Solder the capacitor to the test jig (glass epoxy board) in the

same manner and under the same conditions as (10). The

capacitor should be subjected to a simple harmonic motion

having a total amplitude of 1.5mm, the frequency being varied

uniformly between the approximate limits of 10 and 55Hz. The

frequency range, from 10 to 55Hz and return to 10Hz, should

be traversed in approximately 1 minute. This motion should be

applied for a period of 2 hours in each of 3 mutually perpendic-

ular directions (total of 6 hours).

Solder the capacitor to the test jig (glass epoxy board) shown in

Fig. 1 using a eutectic solder. Then apply 10N*force in parallel

with the test jig for 10T1sec. The soldering should be done

either with an iron or using the reflow method and should be

conducted with care so that the soldering is uniform and free of

defects such as heat shock. *2N (GRp03) 5N (GRp15,

GRM18)

High Dielectric Type

Appearance

Capacitance

Q/D.F.

a

b

c

Baked electrode or

copper foil

Solder resist

(in mm)

Fig. 1

,QST¢¤¥

b

,QRST¢£¤¥

,



QR

S

S¢£

¤

,QR¢£

a

,Q¢

,QS¢¤

c

,QRST¢£¤¥

S¤

100

ST¤¥

,QR¢£

40

φ4.5

Capacitance meter

Flexure : V1

20 50

R230

Pressurizing

speed : 1.0mm/sec.

Pressurize

45 45

Fig. 3

No crack or marked defect should occur.

Type a b c

GRp03

GRp15

GRM18

GRM21

GRM31

GRM32

GRM43

GRM55

0.3

0.4

1.0

1.2

2.2

3.5

4.5

0.9

1.5

3.0

4.0

5.0

7.0

8.0

0.3

0.5

1.2

1.65

2.0

2.9

3.7

5.6

Type a b c

GRp03

GRp15

GRM18

GRM21

GRM31

GRM32

GRM43

GRM55

0.3

0.4

1.0

1.2

2.2

3.5

4.5

0.9

1.5

3.0

4.0

5.0

7.0

8.0

0.3

0.5

1.2

1.65

2.0

2.9

3.7

5.6

t : 1.6mm (GRp03/15 : 0.8mm)

Continued from the preceding page.

Continued on the following page.

(in mm)

Fig. 2

GRM Series Specifications and Test Methods

23

4

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

No. Item

Specifications

Test Method

Temperature

Compensating Type High Dielectric Type

Temperature

Cycle

15

Fix the capacitor to the supporting jig in the same manner and

under the same conditions as (10). Perform the five cycles

according to the four heat treatments listed in the following

table. Let sit for 24T2 hours (temperature compensating type)

or 48T4 hour (high dielectric constant type) at room

temperature, then measure.

#Initial measurement for high dielectric constant type

Perform a heat treatment at 150

Y10

Dfor one hour and then

let sit for 48T4 hours at room temperature.

Perform the initial measurement.

No marking defects

Within T2.5% or T0.25pF

(Whichever is larger) R6, R7 : Within T7.5%

E4, F5 : Within T20%

Appearance

The measured and observed characteristics should satisfy the

specifications in the following table.

More than 10,000MΩor 500Ω• F (Whichever is smaller)

Within T2.5% or T0.25pF

(Whichever is larger)

30pFmin. : QU1000

30pFmax. : QU400W20C

C : Nominal Capacitance (pF)

Resistance

to

Soldering

Heat

14

Preheat the capacitor at 120 to 150Dfor 1 minute.

Immerse the capacitor in a eutectic solder solution at 270T5D

for 10T0.5 seconds. Let sit at room temperature for 24T2 hours

(temperature compensating type) or 48T4 hours (high dielectric

constant type), then measure.

#Initial measurement for high dielectric constant type

Perform a heat treatment at 150

Y10

D for one hour and then

let sit for 48T4 hours at room temperature.

Perform the initial measurement.

*Preheating for GRM32/43/55

R6, R7 : Within T7.5%

E4, F5 : Within T20%

[R6, R7]

W.V. : 25Vmin. : 0.025max.

W.V. : 16/10V : 0.035max.

W.V. : 6.3V :

0.05max. (CF3.3µF)

0.1max. (CU3.3µF)

[E4]

W.V. : 25Vmin. : 0.025max.

[F5]

W.V. : 25Vmin.

: 0.05max. (CF0.10µF)

: 0.09max. (CU0.10µF)

W.V. : 16V/10V : 0.125max.

W.V. : 6.3Vmax. : 0.15max.

Appearance

I.R.

No failure

Dielectric

Strength

Capacitance

Change

Q/D.F.

75% of the terminations are to be soldered evenly and

continuously.

Solderability of

Termination

13

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion).

Preheat at 80 to 120Dfor 10 to 30 seconds. After preheating,

immerse in eutectic solder solution for 2T0.5 seconds at

230T5D.

No marking defects

Capacitance

Change

The measured and observed characteristics should satisfy the

specifications in the following table.

More than 10,000MΩor 500Ω• F (Whichever is smaller)

30pFmin. : QU1000

30pFmax. : QU400W20C

C : Nominal Capacitance (pF)

[R6, R7]

W.V. : 25Vmin. : 0.025max.

W.V. : 16/10V : 0.035max.

W.V. : 6.3V

0.05max. (CF3.3µF)

0.1max. (CU3.3µF)

[E4]

W.V. : 25Vmin. : 0.025max.

[F5]

W.V. : 25Vmin.

: 0.05max. (CF0.10µF)

: 0.09max. (CU0.10µF)

W.V. : 16V/10V : 0.125max.

W.V. : 6.3Vmax. : 0.15max.

I.R.

No failure

Dielectric

Strength

Q/D.F.

Step

1

2100Dto 120D

170Dto 200D

1 min.

Temperature Time

Step 1234

Temp. (D)

Time (min.)

Min.

Operating

Temp.W0/Y3

Room

Temp.

Max.

Operating

Temp.W3/Y0

Room

Temp.

30T32 to 3 30T32 to 3

Continued from the preceding page.

Continued on the following page.

W0

GRM Series Specifications and Test Methods

24

4

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

No. Item

Specifications

Test Method

Temperature

Compensating Type High Dielectric Type

16

Humidity

Steady

State

The measured and observed characteristics should satisfy the

specifications in the following table.

Let the capacitor sit at 40T2Dand 90 to 95% humidity for

500T12 hours.

Remove and let sit for 24T2 hours (temperature compensating

type) or 48T4 hours (high dielectric constant type) at room tem-

perature, then measure.

Appearance

No marking defects

Capacitance

Change

Within T5% or T0.5pF

(Whichever is larger) R6, R7 : Within T12.5%

E4, F5 : Within T30%

Q/D.F.

30pF and over : QU350

10pF and over

30pF and below :

QU275W5C/2

10pF and below :

QU200W10C

C : Nominal Capacitance (pF)

[R6, R7]

W.V. : 25Vmin. : 0.05max.

W.V. : 16/10V : 0.05max.

W.V. : 6.3V

0.075max. (CF3.3µF)

0.125max. (CU3.3µF)

[E4]

W.V. : 25Vmin. : 0.05max.

[F5]

W.V. : 25Vmin.

:

0.075max. (CF0.10µF)

:

0.125max. (CU0.10µF)

W.V. : 16V/10V : 0.15max.

W.V. : 6.3Vmax. : 0.2max.

I.R. More than 1,000MΩor 50Ω• F (Whichever is smaller)

Dielectric

Strength

No failure

17

Humidity

Load

The measured and observed characteristics should satisfy the

specifications in the following table.

Apply the rated voltage at 40T2Dand 90 to 95% humidity for

500T12 hours. Remove and let sit for 24T2 hours (temperature

compensating type) or 48T4 hours (high dielectric constant

type) at room temperature, then measure. The charge/discharge

current is less than 50mA.

#Initial measurement for F5/10V max.

Apply the rated DC voltage for 1 hour at 40T2D.

Remove and let sit for 48T4 hours at room temperature.

Perform initial measurement.

Appearance

No marking defects

Capacitance

Change

Within T7.5% or T0.75pF

(Whichever is larger)

R6, R7 : Within T12.5%

E4 : Within T30%

F5 : Within T30%

[W.V. : 10Vmax.]

F5 : Within W30/Y40%

Q/D.F.

30pF and over : QU200

30pF and below :

QU100+10C/3

C : Nominal Capacitance (pF)

[R6, R7]

W.V. : 25Vmin. : 0.05max.

W.V. : 16/10V : 0.05max.

W.V. : 6.3V

0.075max. (CF3.3µF)

0.125max. (CU3.3µF)

[E4]

W.V. : 25Vmin. : 0.05max.

[F5]

W.V. : 25Vmin.

: 0.075max. (CF0.10µF)

: 0.125max. (CU0.10µF)

W.V. : 16V/10V : 0.15max.

W.V. : 6.3Vmax. : 0.2max.

Dielectric

Strength

No failure

I.R. More than 500MΩor 25Ω• F (Whichever is smaller)

Continued from the preceding page.

Continued on the following page.

GRM Series Specifications and Test Methods

25

4

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

*Nominal values denote the temperature coefficient within a range of 25Dto 125D(for ∆C)/85D(for other TC).

5C

6C

6P

6R

6S

6T

7U

1X

Y000 T030

Y000 T060

Y150 T060

Y220 T060

Y330 T060

Y470 T060

Y750 T120

W350 to Y1000

0.25

0.38

1.02

1.32

1.79

2.39

3.84

Y

0.40

0.59

1.61

2.08

2.81

3.75

6.04

Y

0.58

0.87

2.33

3.02

4.09

5.46

8.78

Y

Y0.11

Y0.21

0.32

0.56

0.95

1.44

2.21

Y

Y0.17

Y0.33

0.50

0.88

1.49

2.26

3.47

Y

Y0.24

Y0.48

0.72

1.28

2.16

3.28

5.04

Y

Char. Code Nominal Values (ppm/D)* Capacitance Change from 25D(%)

Max. Min.

Y30 Y10

Max. Min.

Table A

No. Item

Specifications

Test Method

Temperature

Compensating Type High Dielectric Type

18

High

Temperature

Load

The measured and observed characteristics should satisfy the

specifications in the following table.

Apply 200% of the rated voltage for 1000T12 hours at the

maximum operating temperature T3D. Let sit for 24T2 hours

(temperature compensating type) or 48T4 hours (high dielectric

constant type) at room temperature, then measure.

The charge/discharge current is less than 50mA.

#Initial measurement for high dielectric constant type.

Apply 200% of the rated DC voltage for one hour at the

maximum operating temperature T3D. Remove and let sit for

48T4 hours at room temperature. Perform initial measurement.

*150% for 500V and CU10µF

Appearance

No marking defects

Capacitance

Change

Within T3% or T0.3pF

(Whichever is larger)

R6, R7 : Within T12.5%

E4 : Within T30%

F5 : Within T30%

(CapF1.0µF)

F5 : Within

W30/Y40% (CapU1.0µF)

Q/D.F.

30pF and over : QU350

10pF and over

30pF and below :

QU275+5C/2

10pF and below :

QU200+10C

C : Nominal Capacitance (pF)

[R6, R7]

W.V. : 25Vmin. : 0.05max.

W.V. : 16/10V : 0.05max.

W.V. : 6.3V

0.075max. (CF3.3µF)

0.125max. (CU3.3µF)

[E4]

W.V. : 25Vmin. : 0.05max

[F5]

W.V. : 25Vmin.

:

0.075max. (CF0.10µF)

:

0.125max. (CU0.10µF)

W.V. : 16V/10V : 0.15max.

W.V. : 6.3Vmax. : 0.2max.

I.R. More than 1,000MΩor 50Ω#F (Whichever is smaller)

Dielectric

Strength

No failure

Y55

Max. Min.

Continued from the preceding page.

GRM Series Specifications and Test Methods

26

4

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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

27

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Chip Monolithic Ceramic Capacitors

Thin Layer Large-capacitance Type

■ Features

1. Smaller size and higher capacitance value.

2. High reliability and no polarity.

3. Excellent pulse responsibility and noise

reduction due to the low impedance at high

frequency.

■ Applications

General electronic equipment

L

T

LWT

Dimensions (mm) e min.

g min.

0.3

2.0 ±0.2

GRM32D 2.5 ±0.2

GRM32E

4.5 ±0.4 3.2 ±0.3 2.0

2.8 ±0.2

GRM43S 2.5 ±0.2

GRM43E 2.0 ±0.2

GRM43D

5.7 ±0.4 5.0 ±0.4 2.03.2 ±0.2

GRM55F

0.85 ±0.1

1.25 ±0.1

GRM21B 2.0 ±0.1 1.25 ±0.1 0.2 to 0.7 0.7

0.6 ±0.1

GRM219

1.6 ±0.1 0.8 ±0.1 0.2 to 0.5 0.50.8 ±0.1

GRM188

GRM216

1.6 ±0.1 0.8 ±0.1 0.2 to 0.5 0.5

0.5 +0/-0.2

GRM185

W

e eg

1.6 ±0.2

GRM31M 0.85 ±0.1

GRM319

1.15 ±0.1

GRM31C 3.2 ±0.3 2.5 ±0.2 0.3 1.0

3.2 ±0.2 1.6 ±0.2 0.3 to 0.8 1.5

3.2 ±0.15 1.6 ±0.15 0.3 to 0.8 1.5

0.6 ±0.1

GRM316

1.0 ±0.05 0.5 ±0.05 0.15 to 0.3 0.40.5 ±0.05

0.6 ±0.03 0.3 ±0.03 0.1 to 0.2 0.20.3 ±0.03

GRM155

GRM033

Part Number

Part Number TC Code

(Standard) Rated Voltage

(Vdc) Capacitance Length L

(mm) Width W

(mm) Thickness T

(mm)

GRM188R61C105KE93 X5R (EIA) 16 1.0µF ±10% 1.60 0.80 0.80

GRM219R61C225KA88 X5R (EIA) 16 2.2µF ±10% 2.00 1.25 0.85

GRM319R61C475KA88 X5R (EIA) 16 4.7µF ±10% 3.20 1.60 0.85

GRM32ER61C226KE20 X5R (EIA) 16 22µF ±10% 3.20 2.50 2.50

GRM185R61A105KE36 X5R (EIA) 10 1.0µF ±10% 1.60 0.80 0.50

GRM155R61A154KE19 X5R (EIA) 10 1.5µF ±10% 1.00 0.50 0.50

GRM155R61A224KE19 X5R (EIA) 10 2.2µF ±10% 1.00 0.50 0.50

GRM188R61A225KE34 X5R (EIA) 10 2.2µF ±10% 1.60 0.80 0.80

GRM188R61A225ME34 X5R (EIA) 10 2.2µF ±10% 1.60 0.80 0.80

GRM216R61A225KE24 X5R (EIA) 10 2.2µF ±10% 2.00 1.25 0.60

GRM219R61A225KA01 X5R (EIA) 10 2.2µF ±10% 2.00 1.25 0.85

GRM219R61A335KE19 X5R (EIA) 10 3.3µF ±10% 2.00 1.25 0.85

GRM316R61A335KE19 X5R (EIA) 10 3.3µF ±10% 3.20 1.60 0.60

GRM219R61A475KE19 X5R (EIA) 10 4.7µF ±10% 2.00 1.25 0.85

GRM219R61A475KE34 X5R (EIA) 10 4.7µF ±10% 2.00 1.25 0.85

GRM316R61A475KE19 X5R (EIA) 10 4.7µF ±10% 3.20 1.60 0.60

GRM319R61A475KA01 X5R (EIA) 10 4.7µF ±10% 3.20 1.60 0.85

GRM31MR61A106KE19 X5R (EIA) 10 10µF ±10% 3.20 1.60 1.15

GRM033R60J153KE01 X5R (EIA) 6.3 15000pF ±10% 0.6 0.3 0.3

GRM033R60J223KE01 X5R (EIA) 6.3 22000pF ±10% 0.6 0.3 0.3

GRM033R60J333KE01 X5R (EIA) 6.3 33000pF ±10% 0.6 0.3 0.3

GRM033R60J393KE19 X5R (EIA) 6.3 39000pF ±10% 0.6 0.3 0.3

GRM033R60J473KE19 X5R (EIA) 6.3 47000pF ±10% 0.6 0.3 0.3

GRM033R60J104KE19 X5R (EIA) 6.3 0.10µF ±10% 0.6 0.3 0.3

GRM155R60J154KE01 X5R (EIA) 6.3 0.15µF ±10% 1.00 0.50 0.50

GRM155R60J224KE01 X5R (EIA) 6.3 0.22µF ±10% 1.00 0.50 0.50

GRM155R60J334KE01 X5R (EIA) 6.3 0.33µF ±10% 1.00 0.50 0.50

GRM155R60J474KE19 X5R (EIA) 6.3 0.47µF ±10% 1.00 0.50 0.50

GRM155R60J105KE19 X5R (EIA) 6.3 1.0µF ±10% 1.00 0.50 0.50

GRM185R60J105KE21 X5R (EIA) 6.3 1.0µF ±10% 1.60 0.80 0.50

GRM185R60J105KE26 X5R (EIA) 6.3 1.0µF ±10% 1.60 0.80 0.50

GRM185R60J225KE26 X5R (EIA) 6.3 2.2µF ±10% 1.60 0.80 0.50

GRM188R60J225KE01 X5R (EIA) 6.3 2.2µF ±10% 1.60 0.80 0.80

GRM188R60J225KE19 X5R (EIA) 6.3 2.2µF ±10% 1.60 0.80 0.80

GRM188R60J475KE19 X5R (EIA) 6.3 4.7µF ±10% 1.60 0.80 0.80

GRM219R60J475KE01 X5R (EIA) 6.3 4.7µF ±10% 2.00 1.25 0.85

GRM219R60J106KE19 X5R (EIA) 6.3 10µF ±10% 2.00 1.25 0.85

GRM219R60J106ME19 X5R (EIA) 6.3 10µF ±20% 2.00 1.25 0.85

Continued on the following page.

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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

28

5

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Part Number TC Code

(Standard) Rated Voltage

(Vdc) Capacitance Length L

(mm) Width W

(mm) Thickness T

(mm)

Continued from the preceding page.

GRM21BR60J106KE01 X5R (EIA) 6.3 10µF ±10% 2.00 1.25 1.25

GRM21BR60J106KE19 X5R (EIA) 6.3 10µF ±10% 2.00 1.25 1.25

GRM21BR60J106ME01 X5R (EIA) 6.3 10µF ±20% 2.00 1.25 1.25

GRM21BR60J106ME19 X5R (EIA) 6.3 10µF +10/-20% 2.00 1.25 1.25

GRM21BR60J226ME39 X5R (EIA) 6.3 22µF ±20% 2.00 1.25 1.25

GRM31CR60J226ME19 X5R (EIA) 6.3 22µF ±20% 3.20 1.60 1.60

GRM32DR60J226KA01 X5R (EIA) 6.3 22µF ±10% 3.20 2.50 2.00

GRM32DR60J336ME19 X5R (EIA) 6.3 33µF ±10% 3.20 2.50 2.00

GRM32ER60J476ME20 X5R (EIA) 6.3 47µF ±20% 3.20 2.50 2.50

GRM32ER60J107ME20 X5R (EIA) 6.3 100µF ±20% 3.20 2.50 2.50

GRM43SR60J107ME20 X5R (EIA) 6.3 100µF ±20% 4.50 3.20 2.80

GRM32ER71A226KE20 X7R (EIA) 10 22µF ±10% 3.20 2.50 2.50

GRM32ER71A226ME20 X7R (EIA) 10 22µF ±20% 3.20 2.50 2.50

GRM188F51A225ZE01 Y5V (EIA) 10 2.2µF +80/-20% 1.60 0.80 0.80

GRM188F50J225ZE01 Y5V (EIA) 6.3 2.2µF +80/-20% 1.60 0.80 0.80

GRM21BF50J106ZE01 Y5V (EIA) 6.3 10µF +80/-20% 2.00 1.25 1.25

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

No. Item Specifications Test Method

See the previous pages.

Within the specified dimension

No defects or abnormalities

50Ω• F min.

R6 / R7 / C8 : 0.1 max.

F5 : 0.2 max.

Within the specified tolerance

No defects or abnormalities

R6 : Y55Dto W85D

R7 : Y55Dto W125D

F5 : Y30Dto W85D

C8 : Y55Dto W105D

Operating

Temperature

Range

Rated Voltage

Appearance

Dimensions

Dielectric Strength

Insulation

Resistance

Capacitance

Dissipation Factor

(D.F.)

Capacitance

Temperature

Characteristics

1

2

3

4

5

6

7

8

9

Using calipers

The insulation resistance should be measured with a DC voltage

not exceeding the rated voltage at 25Dand 75%RH max. and

within 1 minute of charging.

The capacitance/D.F. should be measured at 25Dat the

frequency and voltage shown in the table.

The capacitance change should be measured after 5 min. at

each specified temperature stage.

The ranges of capacitance change compared with the 25D

value over the temperature ranges shown in the table should

be within the specified ranges.

Measuring Voltage : GRM43 R6 0J/1A 336/476 : 1.0+/–0.2Vrms

No failure should be observed when 250% of the rated voltage

is applied between the terminations for 1 to 5 seconds, provided

the charge/discharge current is less than 50mA.

Visual inspection

The rated voltage is defined as the maximum voltage which

may be applied continuously to the capacitor.

When AC voltage is superimposed on DC voltage, VP-P or VO-P,

whichever is larger, should be maintained within the rated

voltage range.

Continued on the following page.

Capacitance

CV10µF (10V min.)*1

CV10µF (6.3V max.)

CG10µF

1T0.1kHz

120T24Hz

1.0T0.2Vrms*1

0.5T0.1Vrms

Frequency Voltage

Char.

R6

R7

F5

C8

Y55 to W85D

Y55 to W125D

Y30 to W85D

Y55 to W105D

25D

Temp. Range

Reference Temp.

WithinT15%

Within+22/–82%

WithinT22%

Cap. Change

No removal of the terminations or other defects should occur.

Adhesive Strength

of Termination

10

Solder the capacitor to the test jig (glass epoxy board) shown in

Fig.1 using a eutectic solder. Then apply *210N force in parallel

with the test jig for 10T1 sec. The soldering should be done

either with an iron or using the reflow method and should be

conducted with care so that the soldering is uniform and free of

defects such as heat shock.

*25N (GRp15, GRM18) / 2N (GRp03)

a

b

c

Baked electrode or

copper foil

Solder resist

Type a b c

GRp03

GRp15

GRM18

GRM21

GRM31

GRM32

GRM43

GRM55

0.3

0.4

1.0

1.2

2.2

3.5

4.5

0.9

1.5

3.0

4.0

5.0

7.0

8.0

0.3

0.5

1.2

1.65

2.0

2.9

3.7

5.6

(in mm)

Fig.1

*1 Table 1 items are applied to 0.5+/-0.1Vrms.

GRM155R61A124~224K

GRM185R61A105K

GRM188R61A225K

GRM219R61A475K

Table 1

Specifications and Test Methods

29

5

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Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

No. Item Specifications Test Method

Deflection12

Solder the capacitor to the test jig (glass epoxy board) shown in

Fig.2 using a eutectic solder. Then apply a force in the direction

shown in Fig.3. The soldering should be done either with an

iron or using the reflow method and should be conducted with

care so that the soldering is uniform and free of defects such as

heat shock.

,QST¢¤¥

b

,QRST¢£¤¥

,



QR

S

S¢£

¤

,QR¢£

a

,Q¢

,QS¢¤

c

,QRST¢£¤¥

S¤

100

ST¤¥

,QR¢£

40

ø4.5

Capacitance meter

Flexure : V1

20 50

R230

Pressurizing

speed : 1.0mm/sec.

Pressurize

45 45

Fig.3

No cracking or marking defects should occur.

Type a b c

GRp03

GRp15

GRM18

GRM21

GRM31

GRM32

GRM43

GRM55

0.3

0.4

1.0

1.2

2.2

3.5

4.5

0.9

1.5

3.0

4.0

5.0

7.0

8.0

0.3

0.5

1.2

1.65

2.0

2.9

3.7

5.6

t : 1.6mm

Continued from the preceding page.

Continued on the following page.

(in mm)

Fig.2

75% of the terminations is to be soldered evenly and

continuously.

Solderability of

Termination

13

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion).

Preheat at 80 to 120Dfor 10 to 30 seconds. After preheating,

immerse in eutectic solder solution for 2T0.5 seconds at

230T5D.

50Ω• F min.

R6 / R7 / C8 : Within T7.5%

F5 : Within T20%

R6 / R7 / C8 : 0.1 max.

F5 : 0.2 max.

Resistance

to

Soldering

Heat

14

Preheat the capacitor at 120 to 150Dfor 1 minute.

Immerse the capacitor in a eutectic solder solution at 270T5D

for 10T0.5 seconds. Let sit at room temperature for 48T4

hours, then measure.

#Initial measurement

Perform a heat treatment at 150

Y10

Dfor one hour and then

let sit for 48T4 hours at room temperature.

Perform the initial measurement.

Appearance

I.R.

No failure

Dielectric

Strength

Capacitance

Change

D.F.

No marking defects

W0

Temperature

Sudden

Change

15

Fix the capacitor to the supporting jig in the same manner and

under the same conditions as (10). Perform the five cycles

according to the four heat treatments listed in the following

table. Let sit for 48T4 hours at room temperature, then mea-

sure.

#Initial measurement

Perform a heat treatment at 150

Y10

Dfor one hour and then

let sit for 48T4 hours at room temperature.

Perform the initial measurement.

No marking defects

R6 / R7 / C8 : Within T7.5%

F5 : Within T20%

Appearance

Capacitance

Change

50Ω• F min.

R6 / R7 / C8 : 0.1 max.

F5 : 0.2 max.

I.R.

No failure

Dielectric

Strength

D.F.

Step 1234

Temp.(D)

Time(min.)

Min.

Operating

Temp.W0/Y3

Room

Temp.

Max.

Operating

Temp.W3/Y0

Room

Temp.

30T32 to 3 30T32 to 3

W0

R6 / R7 / C8 : 0.1 max.

F5 : 0.2 max.

No defects or abnormalities

Within the specified tolerance

Vibration

11

Solder the capacitor to the test jig (glass epoxy board) in the

same manner and under the same conditions as (10).The

capacitor should be subjected to a simple harmonic motion

having a total amplitude of 1.5mm, the frequency being varied

uniformly between the approximate limits of 10 and 55Hz. The

frequency range, from 10 to 55Hz and return to 10Hz, should

be traversed in approximately 1 minute. This motion should be

applied for a period of 2 hours in each 3 mutually perpendicular

directions (total of 6 hours).

Appearance

Capacitance

D.F.

(GRp03, GRp15 : t : 0.8mm)

Specifications and Test Methods

30

5

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Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

No. Item Specifications Test Method

17

Durability

Apply 150% of the rated voltage for 1000T12 hours at the

maximum operating temperature T3D.

The charge/discharge current is less than 50mA.

#Initial measurement

Perform a heat treatment at 150

Y10

Dfor one hour and then

let sit for 48T4 hours at room temperature.

Perform the initial measurement.

#Measurement after test

Perform a heat treatment at 150

Y10

Dfor one hour and then

let sit for 48T4 hours at room temperature, then measure.

Appearance

No marking defects

Capacitance

Change

R6 / R7 / C8 : Within T12.5%

F5 : Within T30%

D.F. R6 / R7 / C8 : 0.2 max.

F5 : 0.4 max.

I.R. 25Ω• F min.

Continued from the preceding page.

W0

16

High

Temperature

High

Humidity

(Steady)

Appearance

No marking defects

Capacitance

Change

R6 / R7 / C8 : Within T12.5%

F5 : Within T30%

D.F. R6 / R7 / C8 : 0.2 max.

F5 : 0.4 max.

I.R. 12.5Ω• F min.

Apply the rated voltage at 40T2Dand 90 to 95% humidity for

500T12 hours. The charge/discharge current is less than 50mA.

#Initial measurement

Perform a heat treatment at 150

Y10

Dfor one hour and then

let sit for 48T4 hours at room temperature.

Perform the initial measurement.

#Measurement after test

Perform a heat treatment at 150

Y10

Dfor one hour and then

let sit for 48T4 hours at room temperature, then measure

W0

Specifications and Test Methods

31

5

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

32

6

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Chip Monolithic Ceramic Capacitors

Low-dissipation Type

■ Features

1. Mobile telecommunication and RF module, mainly

2. Quality improvement of telephone calls, Low power

consumption, yield ratio improvement

■ Applications

VCO, PA, Mobile Telecommunications

L

T

Part Number LWT

Dimensions (mm) e g min.

1.0 ±0.05 0.5 ±0.05 0.15 to 0.3 0.40.5 ±0.05

GJM15 0.6 ±0.03 0.3 ±0.03 0.1 to 0.2 0.20.3 ±0.03

GJM03

W

e eg

Part Number TC Code

(Standard) Rated Voltage

(Vdc) Capacitance

(pF) Length L

(mm) Width W

(mm) Thickness T

(mm)

GJM1555C1HR50CB01 C0G (EIA) 50 0.50 ±0.25pF 1.00 0.50 0.50

GJM1555C1HR75CB01 C0G (EIA) 50 0.75 ±0.25pF 1.00 0.50 0.50

GJM1555C1H1R0CB01 C0G (EIA) 50 1.0 ±0.25pF 1.00 0.50 0.50

GJM1555C1H1R1CB01 C0G (EIA) 50 1.1 ±0.25pF 1.00 0.50 0.50

GJM1555C1H1R2CB01 C0G (EIA) 50 1.2 ±0.25pF 1.00 0.50 0.50

GJM1555C1H1R3CB01 C0G (EIA) 50 1.3 ±0.25pF 1.00 0.50 0.50

GJM1555C1H1R5CB01 C0G (EIA) 50 1.5 ±0.25pF 1.00 0.50 0.50

GJM1555C1H1R6CB01 C0G (EIA) 50 1.6 ±0.25pF 1.00 0.50 0.50

GJM1555C1H1R8CB01 C0G (EIA) 50 1.8 ±0.25pF 1.00 0.50 0.50

GJM1555C1H2R0CB01 C0G (EIA) 50 2.0 ±0.25pF 1.00 0.50 0.50

GJM1555C1H2R2CB01 C0G (EIA) 50 2.2 ±0.25pF 1.00 0.50 0.50

GJM1555C1H2R4CB01 C0G (EIA) 50 2.4 ±0.25pF 1.00 0.50 0.50

GJM1555C1H2R7CB01 C0G (EIA) 50 2.7 ±0.25pF 1.00 0.50 0.50

GJM1555C1H3R0CB01 C0G (EIA) 50 3.0 ±0.25pF 1.00 0.50 0.50

GJM1555C1H3R3CB01 C0G (EIA) 50 3.3 ±0.25pF 1.00 0.50 0.50

GJM1555C1H3R6CB01 C0G (EIA) 50 3.6 ±0.25pF 1.00 0.50 0.50

GJM1555C1H3R9CB01 C0G (EIA) 50 3.9 ±0.25pF 1.00 0.50 0.50

GJM1555C1H4R0CB01 C0G (EIA) 50 4.0 ±0.25pF 1.00 0.50 0.50

GJM1555C1H4R3CB01 C0G (EIA) 50 4.3 ±0.25pF 1.00 0.50 0.50

GJM1555C1H4R7CB01 C0G (EIA) 50 4.7 ±0.25pF 1.00 0.50 0.50

GJM1555C1H5R0CB01 C0G (EIA) 50 5.0 ±0.25pF 1.00 0.50 0.50

GJM1555C1H5R1CB01 C0G (EIA) 50 5.1 ±0.25pF 1.00 0.50 0.50

GJM1555C1H5R6CB01 C0G (EIA) 50 5.6 ±0.25pF 1.00 0.50 0.50

GJM1555C1H6R0CB01 C0G (EIA) 50 6.0 ±0.25pF 1.00 0.50 0.50

GJM1555C1H6R0DB01 C0G (EIA) 50 6.0 ±0.5pF 1.00 0.50 0.50

GJM1555C1H6R2CB01 C0G (EIA) 50 6.2 ±0.25pF 1.00 0.50 0.50

GJM1555C1H6R8CB01 C0G (EIA) 50 6.8 ±0.25pF 1.00 0.50 0.50

GJM1555C1H7R0CB01 C0G (EIA) 50 7.0 ±0.25pF 1.00 0.50 0.50

GJM1555C1H7R0DB01 C0G (EIA) 50 7.0 ±0.5pF 1.00 0.50 0.50

GJM1555C1H7R5CB01 C0G (EIA) 50 7.5 ±0.25pF 1.00 0.50 0.50

GJM1555C1H8R0CB01 C0G (EIA) 50 8.0 ±0.25pF 1.00 0.50 0.50

GJM1555C1H8R0DB01 C0G (EIA) 50 8.0 ±0.5pF 1.00 0.50 0.50

GJM1555C1H8R2CB01 C0G (EIA) 50 8.2 ±0.25pF 1.00 0.50 0.50

GJM1555C1H9R0CB01 C0G (EIA) 50 9.0 ±0.25pF 1.00 0.50 0.50

GJM1555C1H9R0DB01 C0G (EIA) 50 9.0 ±0.5pF 1.00 0.50 0.50

GJM1555C1H9R1CB01 C0G (EIA) 50 9.1 ±0.25pF 1.00 0.50 0.50

GJM1555C1H100JB01 C0G (EIA) 50 10 ±5% 1.00 0.50 0.50

GJM1555C1H100RB01 C0G (EIA) 50 10 ±2.5% 1.00 0.50 0.50

Continued on the following page.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

33

6

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Part Number TC Code

(Standard) Rated Voltage

(Vdc) Capacitance

(pF) Length L

(mm) Width W

(mm) Thickness T

(mm)

Continued from the preceding page.

GJM1555C1H120JB01 C0G (EIA) 50 12 ±5% 1.00 0.50 0.50

GJM1555C1H150JB01 C0G (EIA) 50 15 ±5% 1.00 0.50 0.50

GJM1555C1H180JB01 C0G (EIA) 50 18 ±5% 1.00 0.50 0.50

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Capacitance

Change

See the previous pages

Within the specified dimensions

No defects or abnormalities

10,000MΩmin. or 500Ω• F min. (Whichever is smaller)

No defects or abnormalities

Y55 to W125D

Operating

Temperature Range

Rated Voltage

Appearance

Dimensions

Dielectric Strength

Insulation Resistance

(I.R.)

1

2

3

4

5

6

Using calipers

The insulation resistance should be measured with a DC

voltage not exceeding the rated voltage at 25Dand 75%RH

max. and within 2 minutes of charging.

No failure should be observed when 300% of the rated voltage

is applied between the terminations for 1 to 5 seconds,

provided the charge/discharge current is less than 50mA.

Visual inspection

The rated voltage is defined as the maximum voltage which

may be applied continuously to the capacitor.

When AC voltage is superimposed on DC voltage, VP-P or VO-P,

whichever is larger, should be maintained within the rated

voltage range.

30pF max. : QU400W20C

C : Nominal Capacitance (pF)

Within the specified tolerance

Capacitance

Q

7

8

The capacitance/Q should be measured at 25Dat the

frequency and voltage shown in the table.

Continued on the following page.

No removal of the terminations or other defect should occur.

Adhesive Strength

of Termination

10

Solder the capacitor to the test jig (glass epoxy board) shown in

Fig. 1 using a eutectic solder. Then apply a 5N* force in parallel

with the test jig for 10T1sec. The soldering should be done either

with an iron or using the reflow method and should be conducted

with care so that the soldering is uniform and free of defects such

as heat shock. *2N (GJM03)

a

b

c

Baked electrode or

copper foil

Solder resist

Item

Frequency 1T0.1MHz

Voltage 0.5 to 5Vr.m.s.

∆C (1000pF and below)

Char.

Within the specified tolerance (Table A)

Within T0.2% or T0.05pF

(Whichever is larger.)

Temperature

Coefficient

Capacitance

Drift

Within the specified tolerance (Table A)

Capacitance

Temperature

Characteristics

9

The capacitance change should be measured after 5 min. at

each specified temperature stage.

Temperature Compensating Type

The temperature coefficient is determined using the

capacitance measured in step 3 as a reference.

When cycling the temperature sequentially from step 1 through

5, (∆C : W25DtoW125D: other temp. coeffs. : W25Dto 85D)

the capacitance should be within the specified tolerance for the

temperature coefficient and capacitance change as Table A.

The capacitance drift is calculated by dividing the differences

between the maximum and minimum measured values in steps

1, 3 and 5 by the capacitance value in step 3.

Step

1

2

3

4

5

25T2

Y55T3

25T2

125T3

25T2

Temperature (D)

(in mm)

Fig. 1

Type a b c

GJM03

GJM15 0.3

0.4 0.9

1.5 0.3

0.5

No. Item

Specifications

Test Method

Temperature Compensating Type

Specifications and Test Methods

34

6

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Continued from the preceding page.

Continued on the following page.

(in mm)

Fig. 2

Type a b c

GJM03

GJM15 0.3

0.4 0.9

1.5 0.3

0.5

75% of the terminations are to be soldered evenly and

continuously.

Solderability of

Termination

13

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion).

Preheat at 80 to 120Dfor 10 to 30 seconds. After preheating,

immerse in eutectic solder solution for 2T0.5 seconds at 230T5D.

More than 10,000MΩor 500Ω• F (Whichever is smaller)

Within T2.5% or T0.25pF

(Whichever is larger)

30pF and below : QU400W20C

C : Nominal Capacitance (pF)

Appearance

I.R.

Capacitance

Change

Q

No marking defects

The measured and observed characteristics should satisfy the

specifications in the following table.

Resistance

to Soldering

Heat

14

Preheat the capacitor at 120 to 150Dfor 1 minute.

Immerse the capacitor in a eutectic solder solution at 270T5D

for 10T0.5 seconds.

Let sit at room temperature for 24T2 hours.

No failure

Dielectric

Strength

More than 10,000MΩor 500Ω• F (Whichever is smaller)

Within T2.5% or T0.25pF

(Whichever is larger)

30pF and below : QU400W20C

C : Nominal Capacitance (pF)

Appearance

I.R.

Capacitance

Change

Q

No marking defects

The measured and observed characteristics should satisfy the

specifications in the following table.

Temperature

Cycle

15

Fix the capacitor to the supporting jig in the same manner and

under the same conditions as (10). Perform the five cycles

according to the four heat treatments listed in the following table.

Let sit for 24T2 hours at room temperature, then measure.

No failure

Dielectric

Strength

More than 10,000MΩor 500Ω• F (Whichever is smaller)

Within T5% or T0.5pF

(Whichever is larger)

10pF and over, 30pF and below : QU275WC

10pF and below : QU200W10C

C : Nominal Capacitance (pF)

5

2

Appearance

I.R.

Capacitance

Change

Q

No marking defects

The measured and observed characteristics should satisfy the

specifications in the following table.

Humidity,

Steady

State

16

Let the capacitor sit at 40T2Dand 90 to 95% humidity for

500T12 hours.

Remove and let sit for 24T2 hours (temperature compensating

type) at room temperature, then measure.

30pF max. : QU400W20C

C : Nominal Capacitance (pF)

No defects or abnormalities

Within the specified tolerance

Vibration

Resistance

11

Solder the capacitor to the test jig (glass epoxy board) in the

same manner and under the same conditions as (10).

The capacitor should be subjected to a simple harmonic motion

having a total amplitude of 1.5mm, the frequency being varied

uniformly between the approximate limits of 10 and 55Hz.

The frequency range, from 10 to 55Hz and return to 10Hz,

should be traversed in approximately 1 minute. This motion

should be applied for a period of 2 hours in each of 3 mutually

perpendicular directions (total of 6 hours).

Appearance

Capacitance

Q

Deflection12

Solder the capacitor to the test jig (glass epoxy boards) shown

in Fig. 2 using a eutectic solder.

Then apply a force in the direction shown in Fig. 3.

The soldering

should

be done either with an iron or using the

reflow method and

should

be conducted with care so that the

soldering is uniform and free of defects such as heat shock

.

,QST¢¤¥

b

,QRST¢£¤¥

,



QR

S

S¢£

¤

,QR¢£

a

,Q¢

,QS¢¤

c

,QRST¢£¤¥

S¤

100

ST¤¥

,QR¢£

40

φ4.5

Capacitance meter

Flexure : V1

20 50

R230

Pressurizing

speed : 1.0mm/sec.

Pressurize

45 45

Fig. 3

No cracking or marking defects should occur

t : 0.8mm

Step 1234

Temp. (D)

Time (min.)

Min. Operating

Temp.

W0

Y3

Room

Temp.

Max. Operating

Temp.

W3

Y0

Room

Temp.

30T32 to 3 30T32 to 3

No. Item

Specifications

Test Method

Temperature Compensating Type

(in mm)

Specifications and Test Methods

35

6

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Continued from the preceding page.

Note 1 : Nominal values denote the temperature coefficient within a range of 25 to 125D.(for ∆C)

5C 0T30 0.250.400.58 Y0.11Y0.17Y0.24

Char. Code Temp. Coeff.

(ppm/D) Note 1

Capacitance Change from 25DValue (%)

Max. Min.

Y30DY10D

Max. Min.

Table A

Y55D

Max. Min.

No. Item

Specifications

Test Method

Temperature Compensating Type

More than 500MΩor 25Ω• F (Whichever is smaller)

Within T7.5% or T0.75pF

(Whichever is larger)

30pF and below : QU100WC

C : Nominal Capacitance (pF)

10

3

Appearance

I.R.

Capacitance

Change

Q

No marking defects

The measured and observed characteristics should satisfy the

specifications in the following table.

Humidity

Load

17

Apply the rated voltage at 40T2Dand 90 to 95% humidity for

500T12 hours.

Remove and let sit for 24T2 hours at room temperature, then

measure. The charge/discharge current is less than 50mA.

No failure

Dielectric

Strength

More than 1,000MΩor 50Ω• F (Whichever is smaller)

No failure

0.5pFVCV1pF : 350mΩ• pF below

1pFFCV5pF : 300mΩbelow

5pFFCV10pF : 250mΩbelow

10pFFCV20pF : 400mΩbelow

The ESR should be measured at room Temperature. and

frequency 1T0.2GHz with the equivalent of BOONTON Model

34A.

The ESR should be measured at room Temperature. and

frequency 500T50MHz with the equivalent of HP8753B.

Within T3% or T0.3pF

(Whichever is larger)

10pF and over, 30pF and below : QU275WC

10pF and below : QU200W10C

C : Nominal Capacitance (pF)

5

2

Appearance

I.R.

Dielectric

Strength

Capacitance

Change

Q

No marking defects

The measured and observed characteristics should satisfy the

specifications in the following table.

High

Temperature

Load

ESR

18

19

Apply 200% of the rated voltage for 1000T12 hours at the

maximum operating temperature T3D. Let sit for 24T2 hours

(temperature compensating type) at room temperature, then

measure.

The charge/discharge current is less than 50mA.

Specifications and Test Methods

36

6

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

GRM Series Data

37

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■ Capacitance-Temperature Characteristics

−60 −40 −20 0 20 40 60 80 100 120

−10

−5

0

5

10 Measuring condition : 1MHz, 1Vrms

Temperature [˚C]

Capacitance Change [%]

P2H

R2H

S2H

T2H

U2J

C0G

■ Capacitance-DC Voltage Characteristics

01020 4030

−100

−80

−40

0

+40

Capacitance Change [%]

Measuring condition Z5U

X7R, Y5V

C0G

DC Voltage [Vdc]

−60

50

−20

+20

: 1kHz, 0.5Vrms

: 1kHz, 1Vrms

: 1MHz, 1Vrms

C0G 50V

Y5V 50V

X7R 50V

Z5U 50V

■ Capacitance-AC Voltage Characteristics

0123

−20

0

+40

+80

Capacitance Change [%]

Measuring condition C0G

X7R, Z5U, Y5V

AC Voltage [Vrms]

+20

+60

: 1MHz

: 1kHz

Z5U 50V

C0G 50V

Y5V 50V

X7R 50V

■ Capacitance Change-Aging

−40

−30

−10

10

Time [Hr]

−20

0

Y5V, Z5U

X7R

C0G

Capacitance Change [%]

0 50 100 1000 10000

■ Impedance-Frequency Characteristics

100 C0G (GRM21)

10

1

100m

10m

1M 10M 100M 1G

Frequency [Hz]

Impedance [Ω]

1000 [pF]

100 [pF]

10 [pF]

1 [pF]

■ Allowable Voltage-Frequency

10M 100M 1G

Frequency [Hz]

100m

1

10

100 [∆T=20˚C]

GRM55

GRM21

Allowable Voltage [Vrms]

GRM32

1pF

GRM18

GRM43

GRM32

GRM31

GRM21

1000pF

100pF

10pF

0.01µF

GRM32

GRM18

GRM21

Continued on the following page.

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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

GRM Series Data

38

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Continued from the preceding page.

■ Allowable Current-Frequency

10M 100M 1G

Frequency [Hz]

10m

100m

1

10 [∆T=20˚C]

GRM55

GRM21

Allowable Current [Arms]

GRM31

1pF

GRM18

GRM31

GRM18

GRM43

GRM32

GRM31

GRM21

1000pF

100pF

10pF

0.01µF

GRM21

■ Allowable Apparent Power

10M 100M 1G

Frequency [Hz]

100m

1

10

100 [∆T=20˚C]

0.01µF

1000pF

1pF

100pF

10 pF

Allowable Apparent Power [VA]

GRM31

GRM21

GRM18

GRM31

GRM21

GRM18

GRM43

GRM32

GRM31

GRM21

GRM55

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

39

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Chip Monolithic Ceramic Capacitors

Microchips

■ Features

1. Better microwave characteristics

2. Suitable for by-passing

3. High density mounting

■ Applications

1. Optical device for telecommunication

2. IC, IC packaging built-in

3. Measuring equipment Part Number LWT

Dimensions (mm)

0.5 ±0.05 0.5 ±0.05 0.35 ±0.05

0.8 ±0.05 0.8 ±0.05 0.5 ±0.1

GMA05X

GMA085

LW

T

Part Number TC Cod

(Standard) Rated Voltage

(Vdc) Capacitance Length L

(mm) Width W

(mm) Thickness T

(mm)

GMA05XR71H471MD01 X7R (EIA) 50 470pF ±20% 0.5 0.5 0.35

GMA05XR71C102MD01 X7R (EIA) 16 1000pF ±20% 0.5 0.5 0.35

GMA05XR71C152MD01 X7R (EIA) 16 1500pF ±20% 0.5 0.5 0.35

GMA05XR71C222MD01 X7R (EIA) 16 2200pF ±20% 0.5 0.5 0.35

GMA085R71C103MD01 X7R (EIA) 16 10000pF ±20% 0.8 0.8 0.5

GMA05XF51C472ZD01 Y5V (EIA) 16 4700pF +80/-20% 0.5 0.5 0.35

GMA05XF51C682ZD01 Y5V (EIA) 16 6800pF +80/-20% 0.5 0.5 0.35

GMA085F51C473ZD01 Y5V (EIA) 16 47000pF +80/-20% 0.8 0.8 0.5

GMA05XF51A153ZD01 Y5V (EIA) 10 15000pF +80/-20% 0.5 0.5 0.35

GMA085F51A104ZD01 Y5V (EIA) 10 0.10µF +80/-20% 0.8 0.8 0.5

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

See the previous pages.

No defects or abnormalities

10,000MΩmin.

R7 : 0.035 max.

F5 : 0.09 max. (for 16V)

F5 : 0.125 max. (for 10V)

Within the specified tolerance

No defects or abnormalities

R7 : Y55Dto W125D

F5 : Y30Dto W85D

Operating

Temperature

Rated Voltage

Appearance

Dimensions

Dielectric Strength

Insulation Resistance

(I.R.)

Capacitance

Dissipation Factor

(D.F.)

1

2

3

4

5

6

7

8

Visual inspection

The insulation resistance should be measured with a DC volt-

age not exceeding the rated voltage at normal temperature and

humidity and within 2 minutes of charging.

The capacitance should be measured at 25Dwith 1T0.1kHz in

frequency and 1T0.2Vr.m.s. in voltage.

D.F. should be measured under the same conditions at the

capacitance.

No failure should be observed when a voltage of 250% of the rated

voltage is applied between the both terminations for 1 to 5 seconds,

provided the charge/discharge current is less than 50mA.

Visual inspection

The rated voltage is defined as the maximum voltage which

may be applied continuously to the capacitor.

When AC voltage is superimposed on DC voltage, VP-P or VO-P,

whichever is larger, should be maintained within the rated volt-

age range.

Item

No. Test Method

Continued on the following page.

Capacitance

Temperature

Characteristics

9

The range of capacitance change in reference to 25Dwithin

the temperature range shown in the table should be within the

specified ranges.

The capacitance change should be measured after 5 min. at

each specified temperature stage.

MIL-STD-883 Method 2019

Mount the capacitor on a gold metallized alumina substrate

with Au-Sn (80/20). Apply the force parallel to the substrate.

Die Shear force : 200g min.

Pull force : 3.0g min.

10

MIL-STD-883 Method 2011 Condition D

Mount the capacitor on a gold metallized alumina substrate with

Au-Sn (80/20) and bond a 20µm (0.0008 inch) gold wire to the

capacitor terminal using an ultrasonic wedge bond. Then, pull

wire.

Mechanical

Strength

Bond

Strength

Die Shear

Strength

R7 : 0.035 max.

F5 : 0.09 max. (for 16V)

F5 : 0.125 max. (for 10V)

No defects or abnormalities

Within the specified tolerance

Vibration

Resistance

11

Ramp frequency from 10 to 55Hz then return to 10Hz all within

1 minute. Amplitude : 1.5 mm (0.06 inch) max. total excursion.

Apply this motion for a period of 2 hours in each of 3 mutually

perpendicular directions (total 6 hours).

Appearance

Capacitance

D.F.

Specifications

Char.

R7

F5

Temp. Range

Y55 to W125D

Y30 to W85D

Reference Temp.

25D

Cap. Change Rate

WithinT15%

WithinT

22

82

%

The measured values should satisfy the values in the following

table.

Temperature Cycle12

The capacitor should be set for 48T4 hours at room tempera-

ture after one hour heat of treatment at 150 D, then mea-

sure for the initial measurement. Fix the capacitor to the sup-

porting jig in the same manner and under the same conditions

as (11) and conduct the five cycles according to the tempera-

tures and time shown in the following table. Set it for 48T4

hours at room temperature, then measure.

W0

Y10

Item

Appearance

Capacitance Change

I.R.

D.F.

Dielectric Strength

No marked defect

R7 ....... WithinT7.5%

F5 ....... WithinT20%

More than 10,000MΩ

R7 ....... 0.035 max.

F5 ....... 0.09 max.(for 16V)

F5 ....... 0.125 max.(for 10V)

No failure

Specifications

Step 1234

Temp.(D)

Time(min.)

Min. Operating

Temp.

W0

Y3

Room

Temp.

Max. Operating

Temp.

W3

Y0

Room

Temp.

30T32 to 3 30T32 to 3

The measured values should satisfy the values in the following

table.

Humidity

(Steady State)

13

Set the capacitor for 500T12 hours at 40T20D, in 90 to 95%

humidity.

Take it out and set it for 48T4 hours at room temperature, then

measure.

Item

Appearance

Capacitance Change

I.R.

D.F.

Dielectric Strength

No marked defect

R7 ....... WithinT12.5%

F5 ....... WithinT30%

More than 1,000MΩ

R7 ....... 0.05 max.

F5 ....... 0.125 max.(for 16V)

F5 ....... 0.15 max.(for 10V)

No failure

Specifications

Specifications and Test Methods

40

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!Note C02E10.pdf 04.1.20

Continued from the preceding page.

ItemNo. Test Method

Specifications

The measured values should satisfy the values in the following

table.

Humidity Load14

Apply the rated voltage for 500T12 hours at 40T20D, in 90 to

95% humidity and set it for 48T4 hours at room temperature,

then measure. The charge/discharge current is less than

50mA.

#Initial measurement for Y5V

Perform a heat treatment at 150 D for one hour and then

let sit for 48T4 hours at room temperature. Perform the initial

measurement.

W0

Y10

Item

Appearance

Capacitance Change

I.R.

D.F.

Dielectric Strength

No marked defect

R7 ....... WithinT12.5%

F5 ....... WithinT

30

40

%

More than 500MΩ

R7 ....... 0.05 max.

F5 ....... 0.125 max.(for 16V)

F5 ....... 0.15 max.(for 10V)

No failure

Specifications

The measured values should satisfy the values in the following

table.

High Temperature

Load

15

A voltage treatment should be given to the capacitor, in which a

DC voltage of 200% the rated voltage is applied for one hour at

the maximum operating temperature T3Dthen it should be set

for 48T4 hours at room temperature and the initial measurement

should be conducted.

Then apply the above mentioned voltage continuously for

1000T12 hours at the same temperature, remove it from the

bath, and set it for 48T4 hours at room temperature, then

measure. The charge/discharge current is less than 50mA.

Item

Appearance

Capacitance Change

I.R.

D.F.

Dielectric Strength

No marked defect

R7 ....... WithinT12.5%

F5 ....... WithinT

30

40

%

More than 1,000MΩ

R7 ....... 0.05 max.

F5 ....... 0.125 max.(for 16V)

F5 ....... 0.15 max.(for 10V)

No failure

Specifications

Alumina substrate Gold land

Alumina substrate

Capacitor

Die bond

Gold wire

Gold land

Mounting for testing : The capacitors should be mounted on the substrate as shown below using die bonding and wire bonding when tests No. 11 to 15 are performed.

Specifications and Test Methods

41

7

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42

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Chip Monolithic Ceramic Capacitors

Capacitor Arrays

■ Features

1. High density mounting due to mounting space saving

2. Mounting cost saving

■ Applications

General electronic equipment Part Number LWT

Dimensions (mm) P

3.2 ±0.15

2.0 ±0.15

1.37 ±0.15

1.6 ±0.15

1.25 ±0.15

1.0 ±0.15

0.8 ±0.1

0.5 ±0.05

1.0 ±0.1

0.64 ±0.05

0.8 ±0.1

1.0 ±0.1

0.85 ±0.1

0.6 ±0.1

GNM314

GNM1M2

GNM212

GNM214

LW

T

P

LW

T

P

GNM1M2/212 GNM214/314

Temperature Compensating Type

Part Number

L x W

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

100

(2A)

GNM31

3.2x1.6

C0G

(5C)

50

(1H)

10pF(100) 0.8(4) 0.8(4)

11pF(110) 0.8(4) 0.8(4)

12pF(120) 0.8(4) 0.8(4)

13pF(130) 0.8(4) 0.8(4)

15pF(150) 0.8(4) 0.8(4)

16pF(160) 0.8(4) 0.8(4)

18pF(180) 0.8(4) 0.8(4)

20pF(200) 0.8(4) 0.8(4)

22pF(220) 0.8(4) 0.8(4)

24pF(240) 0.8(4) 0.8(4)

27pF(270) 0.8(4) 0.8(4)

30pF(300) 0.8(4) 0.8(4)

33pF(330) 0.8(4) 0.8(4)

36pF(360) 0.8(4) 0.8(4)

39pF(390) 0.8(4) 0.8(4)

43pF(430) 0.8(4) 0.8(4)

47pF(470) 0.8(4) 0.8(4)

51pF(510) 0.8(4) 0.8(4)

56pF(560) 0.8(4) 0.8(4)

62pF(620) 0.8(4) 0.8(4)

68pF(680) 0.8(4) 0.8(4)

75pF(750) 0.8(4) 0.8(4)

82pF(820) 0.8(4) 0.8(4)

91pF(910) 0.8(4) 0.8(4)

100pF(101) 0.8(4) 0.8(4)

110pF(111) 0.8(4) 0.8(4)

120pF(121) 0.8(4) 0.8(4)

130pF(131) 0.8(4) 0.8(4)

150pF(151) 0.8(4) 0.8(4)

160pF(161) 0.8(4)

180pF(181) 0.8(4)

Continued on the following page.

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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

43

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Continued from the preceding page.

Part Number

L x W

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

100

(2A)

GNM31

3.2x1.6

C0G

(5C)

50

(1H)

200pF(201) 0.8(4)

220pF(221) 0.8(4)

240pF(241) 0.8(4)

270pF(271) 0.8(4)

300pF(301) 0.8(4)

330pF(331) 0.8(4)

360pF(361) 0.8(4)

The part numbering code is shown in each ( ). The (4) code in T(mm) means number of elements (four).

Dimensions are shown in mm and Rated Voltage in Vdc.

High Dielectric Constant Type GNM1 Series

Part Number

L x W

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

16

(1C)

GNM1M

1.37x1.00

X7R

(R7)

10

(1A)

22000pF(223) 0.6(2)

47000pF(473) 0.6(2)

0.10µF(104) 0.6(2)

The part numbering code is shown in each ( ). The (2) code in T(mm) means number of elements (two).

Dimensions are shown in mm and Rated Voltage in Vdc.

High Dielectric Constant Type GNM2 Series

Part Number

L x W

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

GNM21

2.0x1.25

X7R

(R7)

50

(1H)

1000pF(102) 0.6(4)

10000pF(103) 0.6(4)

The part numbering code is shown in each ( ). The (4) code in T(mm) means number of elements (four).

Dimensions are shown in mm and Rated Voltage in Vdc.

High Dielectric Constant Type GNM3 Series

Part Number

L x W

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

100

(2A)50

(1H)25

(1E)

X7R

(R7)

16

(1C)100

(2A)50

(1H)

GNM31

3.2x1.6

Y5V

(F5)

16

(1C)

220pF(221) 0.8(4)

Continued on the following page.

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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

44

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Continued from the preceding page.

Part Number

L x W

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

100

(2A)50

(1H)25

(1E)

X7R

(R7)

16

(1C)100

(2A)50

(1H)

GNM31

3.2x1.6

Y5V

(F5)

16

(1C)

270pF(271) 0.8(4)

330pF(331) 0.8(4)

390pF(391) 0.8(4) 0.8(4)

470pF(471) 0.8(4) 0.8(4)

560pF(561) 0.8(4) 0.8(4)

680pF(681) 0.8(4) 0.8(4)

820pF(821) 0.8(4) 0.8(4)

1000pF(102) 0.8(4) 0.8(4)

1200pF(122) 0.8(4) 0.8(4)

1500pF(152) 0.8(4) 0.8(4)

1800pF(182) 0.8(4) 0.8(4)

2200pF(222) 0.8(4) 0.8(4) 0.8(4)

2700pF(272) 0.8(4) 0.8(4)

3300pF(332) 0.8(4) 0.8(4) 0.8(4)

3900pF(392) 0.8(4) 0.8(4)

4700pF(472) 0.8(4) 0.8(4) 0.8(4)

5600pF(562) 0.8(4)

6800pF(682) 0.8(4)

8200pF(822) 0.8(4)

10000pF(103) 0.8(4)

12000pF(123) 0.8(4)

15000pF(153) 0.8(4)

18000pF(183) 0.8(4)

22000pF(223) 0.8(4) 0.8(4)

27000pF(273) 0.8(4)

33000pF(333) 0.8(4) 0.8(4)

39000pF(393) 0.8(4)

47000pF(473) 1.0(4) 0.8(4)

68000pF(683) 1.0(4) 0.8(4)

0.10µF(104) 1.0(4) 0.8(4)

0.15µF(154) 0.8(4)

The part numbering code is shown in each ( ). The (4) code in T(mm) means number of elements (four).

Dimensions are shown in mm and Rated Voltage in Vdc.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

No. Item

Specifications

Test Method

Temperature

Compensating Type

See the previous pages.

Within the specified dimensions

No defects or abnormalities

5C : Y55Dto +125D

Operating

Temperature Range

Rated Voltage

Appearance

Dimension

Dielectric Strength

1

2

3

4

5

Using calipers

No failure should be observed when 300% of the rated voltage

(5C) or 250% of the rated voltage (R7, F5) is applied between

the terminations for 1 to 5 seconds, provided the charge/dis-

charge current is less than 50mA.

Visual inspection

The rated voltage is defined as the maximum voltage which

may be applied continuously to the capacitor.

When AC voltage is superimposed on DC voltage, VP-P or VO-P,

whichever is larger, should be maintained within the rated volt-

age range.

High Dielectric Type

R7 : Y55Dto +125D

F5 : Y30Dto +85D

Continued on the following page.

More than 10,000MΩor 500Ω• F

(Whichever is smaller)

Insulation Resistance

6The insulation resistance should be measured with a DC volt-

age not exceeding the rated voltage at 25Dand 75%RH max.

and within 2 minutes of charging.

30pF min. : QU1000

30pF max. : QU400+20C

C : Nominal Capacitance

(pF)

Within the specified tolerance

Capacitance

Q/Dissipation Factor

(D.F.)

7

8

The capacitance/Q/D.F. should be measured at 25Dat the fre-

quency and voltage shown in the table.

Item

Frequency 1T0.1MHz 1T0.1kHz

Voltage 0.5 to 5Vr.m.s. 1.0T0.2Vr.m.s.

5C R7, F5

Char.

Within the specified

tolerance (Table A)

Capacitance

Temperature

Characteristics

9

(2)High Dielectric Constant Type

The ranges of capacitance change compared with the

above 25Dvalue over the temperature ranges shown in the

table should be within the specified ranges.

The capacitance change should be measured after 5 min. at

each specified temperature stage.

(1)Temperature Compensating Type

The temperature coefficient is determined using the

capacitance measured in step 3 as a reference.

When cycling the temperature sequentially from step1

through 5, the capacitance should be within the specified

tolerance for the temperature coefficient and capacitance

change as Table A.

The capacitance drift is calculated by dividing the

differences between the maximum and minimum measured

values in steps 1, 3 and 5 by the capacitance value in step 3.

Capacitance

Change

Temperature

Coefficient

Step

125T2

Y55T3 (for 5C/ R7), Y30T3 (for F5)

Temperature (D)

2

325T2

125T3 (for 5C/R7), 85T3 (F5)

4

525T2

Capacitance

Drift

Within the specified

tolerance (Table A)

Within T0.2% or T0.05 pF

(Whichever is larger)

Char.

R7

F5

25V min.

0.025 max.

0.05 max.

16V

0.035 max.

0.07 max.

Char.

R7

F5

Temp.

Range

Y55 to W125D

Y30 to W85D

Reference

Temp.

25D

Cap.

Change

Within

T15

%

WithinT%

W22

Y82

No removal of the terminations or other defect should occur.

Adhesive Strength

of Termination

10

Solder the capacitor to the test jig (glass epoxy board) shown in

Fig. 1 using a eutectic solder. Then apply 5N force in parallel

with the test jig for 10T1 sec.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

a

Solder resist

Copper foil

c

d

b

(in mm)

Fig. 1

Type a b c

GNM1M

GNM21

GNM31

0.5

0.4

0.8

Y

1.6

2.5

0.32

0.25

0.4

d

0.32

0.5

0.8

10V

0.035 max.

Y

Specifications and Test Methods

45

8

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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

No. Item

Specifications

Test Method

Temperature

Compensating Type

30pF min. : QU1000

30pF max. : QU400W20C

C : Nominal Capacitance

(pF)

No defects or abnormalities

Within the specified tolerance

Vibration

Resistance

Deflection

11

12

Solder the capacitor on the test jig (glass epoxy board) shown

in Fig. 2 using a eutectic solder. Then apply a force in the direc-

tion shown in Fig. 3 for 5T1 sec. The soldering should be done

either with an iron or using the reflow method and should be

conducted with care so that the soldering is uniform and free of

defects such as heat shock.

Solder the capacitor to the test jig (glass epoxy board) in the

same manner and under the same conditions as (10).

The capacitor should be subjected to a simple harmonic motion

having a total amplitude of 1.5mm, the frequency being varied

uniformly between the approximate limits of 10 and 55Hz.

The frequency range, from 10 to 55Hz and return to 10Hz,

should be traversed in approximately 1 minute. This motion

should be applied for a period of 2 hours in each of 3 mutually

perpendicular directions (total of 6 hours).

High Dielectric Type

Appearance

Capacitance

Q/D.F.

100

1.0

5.0

b

a

T¥

40

c

d

100

1.0

5.0

b

a

T¥

40

c

d

Capacitance meter

Flexure : V1

20 50

R230

Pressurizing

speed : 1.0mm/sec.

Pressurize

45 45

Fig. 3

No cracking or marking defects should occur.

Continued from the preceding page.

Continued on the following page.

Char.

R7

F5

25V min.

0.025 max.

0.05 max.

16V

0.035 max.

0.07 max.

75% of the terminations are to be soldered evenly and

continuously.

Solderability of

Termination

13

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at

80 to 120Dfor 10 to 30 seconds. After preheating, immerse in

eutectic solder solution for 2T0.5 seconds at 230T5D.

Char.

R7

F5

25V min.

0.025 max.

0.05 max.

16V

0.035 max.

0.07 max.

The measured and observed characteristics should satisfy the

specifications in the following table.

More than 10,000MΩor 500Ω• F (Whichever is smaller)

Within T2.5% or T0.25pF

(Whichever is larger)

30pF min. : QU1000

30pF max. : QU400+20C

C : Nominal Capacitance

(pF)

Resistance

to Soldering

Heat

14

Preheat the capacitor at 120 to 150Dfor 1 minute. Immerse the

capacitor in a eutectic solder solution at 270T5Dfor 10T0.5

seconds. Let sit at room temperature for 24T2 hours (tempera-

ture compensating type) or 48T4 hours (high dielectric constant

type), then measure.

#Initial measurement for high dielectric constant type

Perform a heat treatment at 150 Dfor one hour and then

let sit for 48T4 hours at room temperature. Perform the initial

measurement.

W0

Y10

R7 : Within T7.5%

F5 : Within T20%

Appearance

I.R.

No failure

Dielectric

Strength

Capacitance

Change

Q/D.F.

No marking defects

Char.

R7

F5

25V min.

0.025 max.

0.05 max.

16V

0.035 max.

0.07 max.

The measured and observed characteristics should satisfy the

specifications in the following table.

More than 10,000MΩor 500Ω• F (Whichever is smaller)

Within T2.5% or T0.25pF

(Whichever is larger)

30pF min. : QU1000

30pF max. : QU400+20C

C : Nominal Capacitance

(pF)

Temperature

Cycle

15

Fix the capacitor to the supporting jig in the same manner and

under the same conditions as (10). Perform the five cycles

according to the four heat treatments listed in the following

table. Let sit for 24T2 hours (temperature compensating type)

or 48T4 hours (high dielectric constant type) at room tempera-

ture, then measure

#Initial measurement for high dielectric constant type

Perform a heat treatment at 150 D for one hour and then

let sit for 48T4 hours at room temperature. Perform the initial

measurement.

W0

Y10

R7 : Within T7.5%

F5 : Within T20%

Appearance

I.R.

No failure

Dielectric

Strength

Capacitance

Change

Q/D.F.

No marking defects

Step 1234

Temp. (D)

Time (min.)

Min. Operating

Temp.

W0

Y3

Room

Temp.

Max. Operating

Temp.

W3

Y0

Room

Temp.

30T32 to 3 30T32 to 3

(in mm)

10V

0.035 max.

Y

(in mm)

Fig. 2

Type a b c

GNM1M

GNM21

GNM31

2.0T0.05

2.5T0.05

0.5T0.05

0.7T0.05

0.8T0.05

0.32T0.05

0.3T0.05

0.4T0.05

d

0.32T0.05

0.2T0.05

0.4T0.05

#GNMpp4#GNMpp2

10V

0.035 max.

Y

10V

0.035 max.

Y

t=0.8mm (GNM21), 1.6mm (GNM31)

Specifications and Test Methods

46

8

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!Note C02E10.pdf 04.1.20

No. Item

Specifications

Test Method

Temperature

Compensating Type High Dielectric Type

Continued from the preceding page.

Char.

R7

F5

25V min.

0.025 max.

0.05 max.

16V

0.035 max.

0.07 max.

The measured and observed characteristics should satisfy the

specifications in the following table.

More than 1,000MΩor 50Ω• F (Whichever is smaller)

Within T5% or T0.5pF

(Whichever is larger)

30pF and over : QU350

10pF and over, 30pF and

below : QU275+5C/2

10pF and below :

QU200+10C

C : Nominal Capacitance

(pF)

Humidity

Steady

State

16

Let the capacitor sit at 40T2Dand 90 to 95% humidity for

500T12 hours.

Remove and let sit for 24T2 hours (temperature compensating

type) or 48T4 hours (high dielectric constant type) at room tem-

perature, then measure.

R7 : Within T12.5%

F5 : Within T30%

Appearance

I.R.

Capacitance

Change

Q/D.F.

No marking defects

Char.

R7

F5

25V min.

0.025 max.

0.05 max.

16V

0.035 max.

0.07 max.

The measured and observed characteristics should satisfy the

specifications in the following table.

More than 500MΩor 25Ω• F (Whichever is smaller)

Within T7.5% or T0.75pF

(Whichever is larger)

30pF and over : QU200

30pF and below :

QU100+10C/3

C : Nominal Capacitance

(pF)

Humidity

Load

17

Apply the rated voltage at 40T2Dand 90 to 95% humidity for

500T12 hours. Remove and let sit for 24T2 hours (temperature

compensating type) or 48T4 hours (high dielectric constant

type) at room temperature, then measure. The charge/dis-

charge current is less than 50mA.

R7 : Within T12.5%

F5 : Within T30%

Appearance

I.R.

No failure

Dielectric

Strength

Capacitance

Change

Q/D.F.

No marking defects

Char.

R7

F5

25V min.

0.025 max.

0.05 max.

16V

0.035 max.

0.07 max.

The measured and observed characteristics should satisfy the

specifications in the following table.

More than 1,000MΩor 50Ω• F (Whichever is smaller)

Within T3% or T0.3pF

(Whichever is larger)

30pF and over : QU350

10pF and over, 30pF and

below : QU275+5C/2

10pF and below :

QU200+10C

C : Nominal Capacitance

(pF)

High

Temperature

Load

18

Apply 200% of the rated voltage for 1000T12 hours at the

maximum operating temperature T3D. Let sit for 24T2 hours

(temperature compensating type) or 48T4 hours (high dielectric

constant type) at room temperature, then measure.

The charge/discharge current is less than 50mA.

#Initial measurement for high dielectric constant type.

Apply 200% of the rated DC voltage for one hour at the maxi-

mum operating temperature T3D. Remove and let sit for 48T4

hours at room temperature. Perform initial measurement.

R7 : Within T12.5%

F5 : Within T30%

Appearance

I.R.

No failure

Dielectric

Strength

Capacitance

Change

Q/D.F.

No marking defects

Note 1 : Nominal values denote the temperature coefficient within a range of 25Dto 125D.

5C 0T30 0.250.400.58 Y0.11Y0.17Y0.24

Char. Nominal Values

(ppm/D) Note 1

Capacitance Change from 25D(%)

Max. Min.

Y30 Y10

Max. Min.

Table A

Y55

Max. Min.

10V

0.035 max.

Y

No failure

Dielectric

Strength

10V

0.035 max.

Y

10V

0.035 max.

Y

Specifications and Test Methods

47

8

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

48

9

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Chip Monolithic Ceramic Capacitors

for Ultrasonic Sensors

■ Features

1. Proper compensation for ultrasonic sensors

2. Small chip size and high capacitance value

■ Application

Ultrasonic sensor

(back sonar, corner sonar, etc.)

L

T

Part Number LWT

Dimensions (mm) e g min.

2.0 ±0.1 1.25 ±0.1 0.2 to 0.7 0.70.85 ±0.1

GRM219

W

e eg

Part Number TC Code Rated Voltage

(Vdc) Capacitance

(pF) Length L

(mm) Width W

(mm) Thickness T

(mm)

GRM2199E2A102KD42 ZLM (Murata) 100 1000 ±10% 2.0 1.25 0.85

GRM2199E2A152KD42 ZLM (Murata) 100 1500 ±10% 2.0 1.25 0.85

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

See the previous pages.

Within the specified dimensions

No defects or abnormalities

More than 10,000MΩor 500Ω• F. (Whichever is smaller)

No defects or abnormalities

Y25Dto W85D

Operating

Temperature

Rated Voltage

Appearance

Dimensions

Dielectric Strength

Insulation Resistance

(I.R.)

1

2

3

4

5

6

Using calipers.

The insulation resistance should be measured with a DC volt-

age not exceeding the rated voltage at 20Dand 75%RH max.

and within 2 minutes of charging.

No failure should be observed when 300% of the rated voltage

is applied between the terminations for 1 to 5 seconds, provid-

ed the charge/discharge current is less than 50mA.

Visual inspection.

The rated voltage is defined as the maximum voltage which

may be applied continuously to the capacitor.

When AC voltage is superimposed on DC voltage, VP-P or VO-P,

whichever is larger, should be maintained within the rated volt-

age range.

Item

No. Test Method

Continued on the following page.

Specifications

0.01 max.

Within the specified tolerance

Capacitance

Dissipation Factor

(D.F.)

7

8The capacitance/D.F. should be measured at 20Dwith

1T0.1kHz in frequency and 1T0.2Vr.m.s. in voltage.

Within Y4,700 ppm/D(at Y25 to W20D)

Within Y4,700 ppm/D(at W20 to W85D)

W500

Y1,000

W1,000

Y2,500

Capacitance

Temperature

Characteristics

9

The temperature coefficient is determined using the

capacitance measured in step 1 as a reference.

When cycling the temperature sequentially from step 1 through

5, the capacitance should be within the specified tolerance for

the temperature coefficient.

The capacitance change should be measured after 5 min. at

each specified temperature stage.

Step

1

2

3

4

5

20T2

Y25T3

20T2

85T3

20T2

Temperature(D)

No removal of the terminations or other defect should occur.

Adhesive Strength

of Termination

10

Solder the capacitor to the test jig (glass epoxy board) shown in

Fig.1 using a eutectic solder. Then apply 10N force in the

direction of the arrow.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

a

b

c

Baked electrode or

copper foil

Solder resist

(in mm)

Fig.1

Type a b c

GRM21 1.2 4.0 1.65

0.01 max.

No defects or abnormalities

Within the specified tolerance

Vibration

Resistance

11

Solder the capacitor to the test jig (glass epoxy board) in the

same manner and under the same conditions as (10).

The capacitor should be subjected to a simple harmonic motion

having a total amplitude of 1.5mm, the frequency being varied

uniformly between the approximate limits of 10 and 55Hz. The

frequency range, from 10 to 55Hz and return to 10Hz, should

be traversed in approximately 1 minute. This motion should be

applied for a period of 2 hours in each of 3 mutually perpendic-

ular directions (total of 6 hours).

Appearance

Capacitance

D.F.

Specifications and Test Methods

49

9

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Deflection12

Solder the capacitor to the test jig (glass epoxy boards) shown

in Fig. 2 using a eutectic solder.

Then apply a force in the direction shown in Fig. 3.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

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Flexure : V1

20 50

R230

Pressurizing

speed : 1.0mm/sec.

Pressurize

45 45

Fig.3

No cracking or marking defects should occur.

(in mm)

Fig. 2

Type a b c

GRM21 1.2 4.0 1.65

t : 1.6mm

Continued from the preceding page.

ItemNo. Test Method

Specifications

75% of the terminations are to be soldered evenly and

continuously

Solderability of

Termination

13

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at

80 to 120Dfor 10 to 30 seconds. After preheating, immerse in

eutectic solder solution for 2T0.5 seconds at 230T5D.

More than 10,000MΩor 500Ω• F (Whichever is smaller)

Within T7.5%

0.01 max.

Appearance

I.R.

Capacitance

Change

D.F.

No defects or abnormalities

Resistance

to Soldering

Heat

14

Preheat the capacitor at 120 to 150Dfor 1 minute. Immerse the

capacitor in a eutectic solder solution at 270T5Dfor 10T0.5

seconds. Let sit at room temperature for 24T2 hours, then

measure.

No failure

Dielectric

Strength

More than 10,000MΩor 500Ω• F (Whichever is smaller)

Within T7.5%

0.01 max.

Appearance

I.R.

Capacitance

Change

D.F.

No defects or abnormalities

Temperature

Cycle

15

Fix the capacitor to the supporting jig in the same manner and

under the same conditions as (11).

Perform the five cycles according to the four heat treatments

listed in the following table. Let sit for 24T2 hours at room tem-

perature, then measure.

No failure

Dielectric

Strength

More than 1,000MΩor 50Ω• F (Whichever is smaller)

Within T12.5%

0.02 max.

Appearance

I.R.

Capacitance

Change

D.F.

No defects or abnormalities

Humidity,

Steady

State

16

Sit the capacitor at 40T2Dand 90 to 95% humidity for 500T12

hours.

Remove and let sit for 24T2 hours at room temperature, then

measure.

No failure

Dielectric

Strength

More than 500MΩor 25Ω• F (Whichever is smaller)

Within T12.5%

0.02 max.

Appearance

I.R.

Capacitance

Change

D.F.

No defects or abnormalities

Humidity

Load

17

Apply the rated voltage at 40T2Dand 90 to 95% humidity for

500T12 hours. Remove and let sit for 24T2 hours at room tem-

perature, then measure. The charge/discharge current is less

than 50mA.

More than 1,000MΩor 50Ω• F (Whichever is smaller)

Within T12.5%

0.02 max.

Appearance

I.R.

Capacitance

Change

D.F.

No defects or abnormalities

High

Temperature

Load

18 Apply 200% of the rated voltage for 1,000T12 hours at 85T3D.

Let sit for 24T2 hours at room temperature, then measure.

The charge/discharge current is less than 50mA.

Step 1234

Temp. (D)

Time (min.)

Y25

W0

Y3

RoomTemp.

85

W3

Y0

RoomTemp.

30T32 to 3 30T32 to 3

(in mm)

Specifications and Test Methods

50

9

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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

51

10

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Chip Monolithic Ceramic Capacitors

Low ESL

■ Features

1. Low ESL, good for noise reduction for high

frequency

2. Small, high capacitance

■ Applications

1. High speed micro processors

2. High frequency digital equipment

Part Number T

Dimensions (mm)

0.6 max.

0.85 ±0.1

0.7 ±0.1

W

0.8 ±0.1

1.25 ±0.1

1.6 ±0.15

L

1.6 ±0.1

2.0 ±0.1

3.2 ±0.15 1.15 ±0.1

0.6 ±0.1

LLL185

LLL216

LLL219

LLL317

LLL31M

WL

T

LLL18 Series

Part Number

L x W

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

50

(1H)25

(1E)16

(1C)

X7R

(R7)

10

(1A)

LLL18

1.6x0.8

Y5V

(F5)

25

(1E)

2200pF(222) 0.5(5)

3300pF(332) 0.5(5)

4700pF(472) 0.5(5)

6800pF(682) 0.5(5)

10000pF(103) 0.5(5)

15000pF(153) 0.5(5)

22000pF(223) 0.5(5) 0.5(5)

33000pF(333) 0.5(5)

47000pF(473) 0.5(5)

68000pF(683) 0.5(5)

0.10µF(104) 0.5(5)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

LLL21 Series

Part Number

L x W

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

50

(1H)25

(1E)16

(1C)

LLL21

2.0x1.25

X7R

(R7)

10

(1A)

4700pF(472) 0.6(6)

6800pF(682) 0.6(6)

10000pF(103) 0.6(6)

15000pF(153) 0.6(6)

22000pF(223) 0.6(6)

33000pF(333) 0.85(9) 0.6(6) 0.6(6)

47000pF(473) 0.6(6) 0.6(6)

Continued on the following page.

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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

52

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Continued from the preceding page.

Part Number

L x W

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

50

(1H)25

(1E)16

(1C)

LLL21

2.0x1.25

X7R

(R7)

10

(1A)

68000pF(683) 0.6(6) 0.6(6)

0.10µF(104) 0.6(6) 0.6(6)

0.15µF(154) 0.85(9) 0.6(6)

0.22µF(224) 0.85(9) 0.6(6)

0.33µF(334) 0.6(6)

0.47µF(474) 0.85(9)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

LLL31 Series

Part Number

L x W

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

50

(1H)25

(1E)16

(1C)

LLL31

3.2x1.6

X7R

(R7)

10

(1A)

10000pF(103) 0.7(7)

15000pF(153) 0.7(7)

22000pF(223) 0.7(7)

33000pF(333) 0.7(7)

47000pF(473) 0.7(7)

68000pF(683) 0.7(7)

0.10µF(104) 1.15(M) 0.7(7) 0.7(7)

0.15µF(154) 0.7(7) 0.7(7)

0.22µF(224) 1.15(M) 0.7(7)

0.33µF(334) 1.15(M) 0.7(7)

0.47µF(474) 1.15(M) 0.7(7)

0.68µF(684) 1.15(M) 0.7(7)

1.0µF(105) 1.15(M) 0.7(7)

1.5µF(155) 1.15(M)

2.2µF(225) 1.15(M)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

R7 : Y55Dto W125D

F5 : Y30Dto W85D

Operating

Temperature

Range

1

Item

No. Test Method

See the previous pages.

Within the specified dimension

No defects or abnormalities

More than 10,000MΩor 500Ω• F (Whichever is smaller)

No defects or abnormalities

Rated Voltage

Appearance

Dimensions

Dielectric Strength

Insulation Resistance

(I.R.)

2

3

4

5

6

Using calipers

The insulation resistance should be measured with a DC volt-

age not exceeding the rated voltage at 25Dand 75%RH max.

and within 2 minutes of charging.

No failure should be observed when 250% of the rated voltage

is applied between the terminations for 1 to 5 seconds, provid-

ed the charge/discharge current is less than 50mA.

Visual inspection

The rated voltage is defined as the maximum voltage which

may be applied continuously to the capacitor.

When AC voltage is superimposed on DC voltage, VP-P or VO-P,

whichever is larger, should be maintained within the rated

voltage range.

Continued on the following page.

Specifications

Capacitance

Temperature

Characteristics

9

The ranges of capacitance change compared with the 25D

value over the temperature ranges shown in the table should

be within the specified ranges.

The capacitance change should be measured after 5 min. at

each specified temperature stage.

Within the specified tolerance

Capacitance

Dissipation Factor

(D.F.)

7

8

The capacitance/D.F. should be measured at 25Dat the

frequency and voltage shown in the table.

Char.

R7

F5 0.025 max.

0.05 max. 0.035 max.

Y

25V min. 16V

Char.

R7

F5 0.025 max.

0.05 max. 0.035 max.

Y

25V min. 16V

Frequency

Voltage 1T0.1kHz

1T0.2Vr.m.s.

R7

Char.

R7

F5 Y55 to W125

Y30 to W85

WithinT15%

WithinW22/Y82%

Temp. Range (D)Cap. Change.

25D

Reference Temp.

No removal of the terminations or other defect should occur.

Adhesive Strength

of Termination

10

Solder the capacitor to the test jig (glass epoxy board) shown in

Fig. 1 using a eutectic solder. Then apply 10N*force in the

direction of the arrow. *5N: LLL18

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

a

b

c

Baked electrode or

copper foil

Solder resist

No defects or abnormalities

Within the specified tolerance

Vibration

Resistance

11

Solder the capacitor to the test jig (glass epoxy board) in the

same manner and under the same conditions as (10).

The capacitor should be subjected to a simple harmonic motion

having a total amplitude of 1.5mm, the frequency being varied

uniformly between the approximate limits of 10 and 55Hz. The

frequency range, from 10 to 55Hz and return to 10Hz, should

be traversed in approximately 1 minute.

This motion should be applied for a period of 2 hours in each of

3 mutually perpendicular directions (total of 6 hours).

Appearance

Capacitance

D.F.

(in mm)

Fig. 1

Type a b c

LLL18

LLL21

LLL31

0.3

0.6

1.0

1.2

1.6

3.0

2.0

2.4

3.7

Char.

Item

Specifications and Test Methods

53

10

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Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Deflection12

Solder the capacitor to the test jig (glass epoxy boards) shown

in Fig. 2 using a eutectic solder.

Then apply a force in the direction shown in Fig. 3.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

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Capacitance meter

Flexure : V1

20 50

R230

Pressurizing

speed : 1.0mm/sec.

Pressurize

45 45

Fig. 3

No crack or marked defect should occur.

t : 1.6mm

Continued from the preceding page.

ItemNo. Test Method

Specifications

75% of the terminations are to be soldered evenly and

continuously.

Solderability of

Termination

13

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at

80 to 120Dfor 10 to 30 seconds. After preheating, immerse in

eutectic solder solution for 2T0.5 seconds at 230T5D.

(in mm)

Fig. 2

Type a b c

LLL18

LLL21

LLL31

0.3

0.6

1.0

1.2

1.6

3.0

2.0

2.4

3.7

More than 10,000MΩor 500Ω• F (Whichever is smaller)

R7 : WithinT7.5%

F5 : WithinT20%

Appearance

I.R.

Capacitance

Change

D.F.

No defects or abnormalities

Resistance

to Soldering

Heat

14

Preheat the capacitor at 120 to 150Dfor 1 minute. Immerse the

capacitor in a eutectic solder solution at 270T5Dfor 10T0.5

seconds. Let sit at room temperature for 48T4 hours , then

measure.

#Initial measurement.

Perform a heat treatment at 150 D for one hour and then

let sit for 48T4 hours at room temperature. Perform the initial

measurement.

W0

Y10

No failure

Dielectric

Strength

Char.

R7

F5 0.025 max.

0.05 max. 0.035 max.

Y

25V min. 16V

More than 10,000MΩor 500Ω• F (Whichever is smaller)

R7 : WithinT7.5%

F5 : WithinT20%

Appearance

I.R.

Capacitance

Change

D.F.

No defects or abnormalities

Temperature

Cycle

15

Fix the capacitor to the supporting jig in the same manner and

under the same conditions as (10).

Perform the five cycles according to the four heat treatments

listed in the following table. Let sit for 48T4 hours at room tem-

perature, then measure.

#Initial measurement.

Perform a heat treatment at 150 D for one hour and then

let sit for 48T4 hours at room temperature. Perform the initial

measurement.

W0

Y10

No failure

Dielectric

Strength

Char.

R7

F5 0.025 max.

0.05 max. 0.035 max.

Y

25V min. 16V

Char.

R7

F5 0.05 max.

0.075 max. 0.05 max.

Y

25V min. 16V

More than 1,000MΩor 50Ω• F (Whichever is smaller)

R7 : WithinT12.5%

F5 : WithinT30%

Appearance

I.R.

Capacitance

Change

D.F.

No defects or abnormalities

Humidity,

Steady

State

16

Let the capacitor sit at 40T2Dand 90 to 95% humidity for

500T12 hours.

Remove and let sit for 48T4 hours at room temperature, then

measure.

Step 1234

Temp. (D)

Time (min.)

Min. Operating

Temp.

W0

Y3

Room

Temp.

Max. Operating

Temp.

W3

Y0

Room

Temp.

30T32 to 3 30T32 to 3

Continued on the following page.

(in mm)

More than 500MΩor 25Ω• F (Whichever is smaller)

R7 : WithinT12.5%

F5 : WithinT30%

Appearance

I.R.

Capacitance

Change

D.F.

No defects or abnormalities

Humidity

Load

17

Apply the rated voltage at 40T2Dand 90 to 95% humidity for

500T12 hours. Remove and let sit for 48T4 hours at room tem-

perature, then measure. The charge/discharge current is less

than 50mA.

No failure

Dielectric

Strength

Char.

R7

F5 0.05 max.

0.075 max. 0.05 max.

Y

25V min. 16V

Specifications and Test Methods

54

10

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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Continued from the preceding page.

ItemNo. Test Method

Specifications

More than 1,000MΩor 50Ω• F (Whichever is smaller)

Appearance

I.R.

Capacitance

Change

D.F.

No defects or abnormalities

High

Temperature

Load

18

Apply 200% of the rated voltage for 1,000T12 hours at maxi-

mum operating temperature T3D. Let sit for 48T4 hours at

room temperature, then measure.

The charge/discharge current is less than 50mA.

#Initial measurement.

Apply 200% of the rated DC voltage for one hour at the maxi-

mum operating temperature T3D.

Remove and let sit for 48T4 hours at room temperature.

Perform initial measurement.

No failure

Dielectric

Strength

Char.

R7

F5 0.05 max.

0.075 max. 0.05 max.

Y

25V min. 16V

R7 : WithinT12.5%

F5 : WithinT30%

Specifications and Test Methods

55

10

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56

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Chip Monolithic Ceramic Capacitors

High Frequency for Flow/Reflow Soldering

■ Features

1. HiQ and low ESR at VHF, UHF, Microwave

2. Feature improvement, low power consumption for

mobile telecommunication. (Base station, terminal,

etc.)

■ Applications

High frequency circuit (Mobile telecommunication, etc.)

L

T

Part Number LWT

Dimensions (mm) e g min.

1.6 ±0.1 0.8 ±0.1 0.2 to 0.5 0.50.8 ±0.1

GQM188 2.0 ±0.1 1.25 ±0.1 0.2 to 0.7 0.70.85 ±0.1

GQM219

W

e eg

Part Number

L x W

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

100

(2A)

GQM18

1.60x0.80

C0G

(5C)

50

(1H)100

(2A)

GQM21

2.00x1.25

C0G

(5C)

50

(1H)

0.50pF(R50) 0.80(8) 0.85(9)

0.75pF(R75) 0.80(8) 0.85(9)

1.0pF(1R0) 0.80(8) 0.85(9)

1.1pF(1R1) 0.80(8) 0.85(9)

1.2pF(1R2) 0.80(8) 0.85(9)

1.3pF(1R3) 0.80(8) 0.85(9)

1.5pF(1R5) 0.80(8) 0.85(9)

1.6pF(1R6) 0.80(8) 0.85(9)

1.8pF(1R8) 0.80(8) 0.85(9)

2.0pF(2R0) 0.80(8) 0.85(9)

2.2pF(2R2) 0.80(8) 0.85(9)

2.4pF(2R4) 0.80(8) 0.85(9)

2.7pF(2R7) 0.80(8) 0.85(9)

3.0pF(3R0) 0.80(8) 0.85(9)

3.3pF(3R3) 0.80(8) 0.85(9)

3.6pF(3R6) 0.80(8) 0.85(9)

3.9pF(3R9) 0.80(8) 0.85(9)

4.0pF(4R0) 0.80(8) 0.85(9)

4.3pF(4R3) 0.80(8) 0.85(9)

4.7pF(4R7) 0.80(8) 0.85(9)

5.0pF(5R0) 0.80(8) 0.85(9)

5.1pF(5R1) 0.80(8) 0.85(9)

5.6pF(5R6) 0.80(8) 0.85(9)

6.0pF(6R0) 0.80(8) 0.85(9)

6.2pF(6R2) 0.80(8) 0.85(9)

6.8pF(6R8) 0.80(8) 0.85(9)

7.0pF(7R0) 0.80(8) 0.85(9)

7.5pF(7R5) 0.80(8) 0.85(9)

8.0pF(8R0) 0.80(8) 0.85(9)

8.2pF(8R2) 0.80(8) 0.85(9)

9.0pF(9R0) 0.80(8) 0.85(9)

9.1pF(9R1) 0.80(8) 0.85(9)

Continued on the following page.

10pF(100) 0.80(8) 0.85(9)

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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

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57

11

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Continued from the preceding page.

Part Number

L x W

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

100

(2A)

GQM18

1.60x0.80

C0G

(5C)

50

(1H)100

(2A)

GQM21

2.00x1.25

C0G

(5C)

50

(1H)

11pF(110) 0.80(8) 0.85(9)

12pF(120) 0.80(8) 0.85(9)

13pF(130) 0.80(8) 0.85(9)

15pF(150) 0.80(8) 0.85(9)

16pF(160) 0.80(8) 0.85(9)

18pF(180) 0.80(8) 0.85(9)

20pF(200) 0.80(8) 0.85(9)

22pF(220) 0.80(8) 0.85(9)

24pF(240) 0.80(8) 0.85(9)

27pF(270) 0.85(9)

30pF(300) 0.85(9)

33pF(330) 0.85(9)

36pF(360) 0.85(9)

39pF(390) 0.85(9)

43pF(430) 0.85(9)

47pF(470) 0.85(9)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

■ Q-Frequency Characteristics

100M

1

10

100

1000

10000

1G

Frequency (Hz)

Q-Frequency Characteristics

GQM18

Q

10G

1pF6.8pF 2.4pF

■ Resonant Frequency-Capacitance

0.1

0

1

10

100

1 10 100

Capacitance (pF)

Resonant Frequency • Capacitance

Resonant Frequency (GHz)

GQM18

GQM21

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!Note C02E10.pdf 04.1.20

See the previous page.

Within the specified dimensions

No defects or abnormalities

More than 10,000MΩor 500Ω• F

(whichever is smaller)

No defects or abnormalities

5C : Y55Dto 125D

Operating

Temperature

Rated Voltage

Appearance

Dimension

Dielectric Strength

Insulation Resistance

1

2

3

4

5

6

Using calipers

The insulation resistance should be measured with a DC

voltage not exceeding the rated voltage at 25Dand 75%RH

max. and within 2 minutes of charging.

No failure should be observed when 300% of the rated voltage

is applied between the terminations for 1 to 5 seconds,

provided the charge/discharge current is less than 50mA.

Visual inspection

The rated voltage is defined as the maximum voltage which

may be applied continuously to the capacitor.

When AC voltage is superimposed on DC voltage, VP-P or VO-P,

whichever is larger, should be maintained within the rated

voltage range.

Item

No. Test Method

Specifications

30pF min. : QU1000

30pF max. : QU400+20C

C : Nominal Capacitance (pF)

Within the specified tolerance

Capacitance

Q

7

8

The capacitance/Q should be measured at 25Dat the

frequency and voltage shown in the table.

Continued on the following page.

Capacitance

Change

No removal of the terminations or other defect should occur.

Adhesive Strength

of Termination

10

Solder the capacitor to the test jig (glass epoxy board) shown in

Fig. 1 using a eutectic solder. Then apply 10N* force in parallel

with the test jig for 10T1sec.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

*5N (GQM188)

a

b

c

Baked electrode or

copper foil

Solder resist

30pF min. : QU1000

30pF max. : QU400+20C

C : NominalCapacitance (pF)

No defects or abnormalities

Within the specified tolerance

Vibration

Resistance

11

Solder the capacitor to the test jig (glass epoxy board) in the

same manner and under the same conditions as (10).

The capacitor should be subjected to a simple harmonic motion

having a total amplitude of 1.5mm, the frequency being varied

uniformly between the approximate limits of 10 and 55Hz. The

frequency range, from 10 to 55Hz and return to 10Hz, should

be traversed in approximately 1 minute.

This motion should be applied for a period of 2 hours in each of

3 mutually perpendicular directions (total of 6 hours).

Appearance

Capacitance

Q

Item

Frequency 1T0.1MHz

Voltage 0.5 to 5Vrms

5C (1000pF and below)

Char.

Within the specified tolerance (Table A)

Within T0.2% or T0.05pF

(Whichever is larger.)

Temperature

Coefficient

Capacitance

Drift

Within the specified tolerance (Table A)

Capacitance

Temperature

Characteristics

9

The temperature coefficient is determined using the capaci-

tance measured in step 3 as a reference.

When cycling the temperature sequentially from step 1 through 5

the capacitance should be within the specified tolerance for the

temperature coefficient and capacitance change as in Table A.

The capacitance drift is calculated by dividing the differences

between the maximum and minimum measured values in the

steps 1, 3 and 5 by the capacitance. value in step 3.

Step

1

2

3

4

5

25T2

Y55T3

25T2

125T3

25T2

Temperature (D)

(in mm)

Fig .1

Type a b c

GQM18

GQM21

GQM32

1.0

1.2

2.2

3.0

4.0

5.0

1.2

1.65

2.9

Specifications and Test Methods

58

11

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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Deflection12

Solder the capacitor on the test jig (glass epoxy board) shown

in Fig. 2 using a eutectic solder.

Then apply a force in the direction shown in Fig. 3.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

,QST¢¤¥

b

,QRST¢£¤¥

,



QR

S

S¢£

¤

,QR¢£

a

,Q¢

,QS¢¤

c

,QRST¢£¤¥

S¤

100

ST¤¥

,QR¢£

40

φ4.5

Capacitance meter

Flexure : V1

20 50

R230

Pressurizing

speed : 1.0mm/sec.

Pressurize

45 45

Fig. 3

No crack or marked defect should occur.

t : 1.6mm

Continued from the preceding page.

ItemNo. Test Method

Specifications

75% of the terminations are to be soldered evenly

and continuously.

Solderability of

Termination

13

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at

80 to 120Dfor 10 to 30 seconds. After preheating, immerse in

eutectic solder solution for 2T0.5 seconds at 230T5D.

More than 10,000MΩor 500Ω• F (Whichever is smaller)

Within T2.5% or T0.25 pF

(Whichever is larger)

30pF min. : QU1000

30pF max. : QU400+20C

C : Nominal Capacitance (pF)

Appearance

I.R.

Capacitance

Change

Q

No marking defects

The measured and observed characteristics should satisfy the

specifications in the following table.

Resistance

to Soldering

Heat

14 Preheat the capacitor at 120 to 150Dfor 1 minute. Immerse the

capacitor in a eutectic solder solution at 270T5Dfor 10T0.5

seconds. Let sit at room temperature for 24T2 hours.

No failure

Dielectric

Strength

More than 10,000MΩor 500Ω• F (Whichever is smaller)

Within T2.5% or T0.25pF

(Whichever is larger)

30pF min. : QU1000

30pF max. : QU400+20C

C : Nominal Capacitance (pF)

Appearance

I.R.

Capacitance

Change

Q

No marking defects

The measured and observed characteristics should satisfy the

specifications in the following table.

Temperature

Cycle

15

Fix the capacitor to the supporting jig in the same manner and

under the same conditions as (10).

Perform the five cycles according to the four heat treatments

listed in the following table.

Let sit for 24T2 hours at room temperature, then measure.

No failure

Dielectric

Strength

More than 1,000MΩor 50Ω• F (Whichever is smaller)

Within T5% or T0.5pF

(Whichever is larger)

30pF min. : QU350

10pF and over, 30pF and below : QU275+5C/2

10pF max. : QU200+10C

C : Nominal Capacitance (pF)

Appearance

I.R.

Capacitance

Change

Q

No marking defects

The measured and observed characteristics should satisfy the

specifications in the following table.

Humidity

Steady

State

16

Let the capacitor sit at 40T2Dand 90 to 95% humidity for

500T12 hours.

Remove and let sit for 24T2 hours (temperature compensating

type) at room temperature, then measure.

No failure

Dielectric

Strength

(in mm)

Fig. 2

Type a b c

GQM18

GQM21

GQM32

1.0

1.2

2.2

3.0

4.0

5.0

1.2

1.65

2.9

Step 1234

Temp. (D)

Time (min.)

Min. Operating

Temp.W0/Y3

Room

Temp.

Max. operating

Temp.W3/Y0

Room

Temp.

30T32 to 3 30T32 to 3

Continued on the following page.

Specifications and Test Methods

59

11

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Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Continued from the preceding page.

ItemNo. Test Method

Specifications

More than 1,000MΩor 50Ω• F (Whichever is smaller)

Within T3% or T0.3pF

(Whichever is larger)

30pF min. : QU350

10pF and over, 30pF and below : QU275+5C/2

10pF max. : QU200+10C

C : Nominal Capacitance (pF)

Appearance

I.R.

Capacitance

Change

Q

No marking defects

The measured and observed characteristics should satisfy the

specifications in the following table.

High

Temperature

Load

18

Apply 200% of the rated voltage for 1000T12 hours at the

maximum operating temperature T3D.

Let sit for 24T2 hours (temperature compensating type) at

room temperature, then measure.

The charge/discharge current is less than 50mA.

No failure

Dielectric

Strength

Note1 : Nominal values denote the temperature coefficient within a range of 25Dto 125D(for 5C)

5C 0T30 0.250.400.58 Y0.11Y0.17Y0.24

Char. Nominal Values

(ppm/D) Note 1

Capacitance Change from 25D(%)

Max. Min.

Y30 Y10

Max. Min.

Table A

Y55

Max. Min.

More than 500MΩor 25Ω• F (Whichever is smaller)

Within T7.5% or T0.75pF

(Whichever is larger)

30pF min. : QU200

30pF max. : QU100+10C/3

C : Nominal Capacitance (pF)

Appearance

I.R.

Capacitance

Change

Q

No marking defects

The measured and observed characteristics should satisfy the

specifications in the following table.

Humidity

Load

17

Apply the rated voltage at 40T2Dand 90 to 95% humidity for

500T12 hours. Remove and let sit for 24T2 hours at room tem-

perature then measure. The charge/discharge current is less

than 50mA.

No failure

Dielectric

Strength

Specifications and Test Methods

60

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Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

61

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Chip Monolithic Ceramic Capacitors

High-Q & High Power Type

SMD Type

■ Features (ERF Series)

1. The dielectric is composed of low dielectric loss

ceramic. This series is perfectly suited to

high frequency applications (VHS-microwave band).

2. The series is ultraminiature, yet has a high-power

capacity. This is the best capacitor available for

transmitter and amplifier circuits such as those

in broadcasting equipment and mobile base stations.

3. ERF1D type is designed for both flow and reflow

soldering and ERF22 type is designed for reflow

soldering.

■ Applications

High frequency and high power circuits

L

T

Part Number LWT

Dimensions (mm) e

1.4 0.25

ERF1DM

ERF22X

W

e e

+0.6

-0.4 1.4+0.6

-0.4 +0.25

-0.15

2.8 0.4

+0.6

-0.4 2.8+0.6

-0.4 +0.4

-0.3

1.15+0.50

-0.35

2.3+0.5

-0.3

Part Number

L x W

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

C0G

(5C)

50

(1H)

ERF1D

1.40x1.40

CH

(6C)

50

(1H)500

(2H)300

(YD)200

(2D)100

(2A)

C0G

(5C)

50

(1H)500

(2H)300

(YD)200

(2D)100

(2A)

ERF22

2.80x2.80

CH

(6C)

50

(1H)

0.50pF(R50) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

0.6pF(R60) 1.15(M) 2.30(X)

0.7pF(R70) 1.15(M) 2.30(X)

0.75pF(R75) 1.15(M) 2.30(X)

0.8pF(R80) 1.15(M) 2.30(X)

0.9pF(R90) 1.15(M) 2.30(X)

1.0pF(1R0) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

1.1pF(1R1) 1.15(M) 2.30(X)

1.2pF(1R2) 1.15(M) 2.30(X)

1.3pF(1R3) 1.15(M) 2.30(X)

1.4pF(1R4) 1.15(M) 2.30(X)

1.5pF(1R5) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

1.6pF(1R6) 1.15(M) 2.30(X)

1.7pF(1R7) 1.15(M) 2.30(X)

1.8pF(1R8) 1.15(M) 2.30(X)

1.9pF(1R9) 1.15(M) 2.30(X)

2.0pF(2R0) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

2.1pF(2R1) 1.15(M) 2.30(X)

2.2pF(2R2) 1.15(M) 2.30(X)

2.4pF(2R4) 1.15(M) 2.30(X)

2.7pF(2R7) 1.15(M) 2.30(X)

3.0pF(3R0) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

3.3pF(3R3) 1.15(M) 2.30(X)

3.6pF(3R6) 1.15(M) 2.30(X)

3.9pF(3R9) 1.15(M) 2.30(X)

4.0pF(4R0) 1.15(M) 2.30(X)

4.3pF(4R3) 1.15(M) 2.30(X)

4.7pF(4R7) 1.15(M) 2.30(X)

Continued on the following page.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

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!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Continued from the preceding page.

Part Number

L x W

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

C0G

(5C)

50

(1H)

ERF1D

1.40x1.40

CH

(6C)

50

(1H)500

(2H)300

(YD)200

(2D)100

(2A)

C0G

(5C)

50

(1H)500

(2H)300

(YD)200

(2D)100

(2A)

ERF22

2.80x2.80

CH

(6C)

50

(1H)

5.0pF(5R0) 1.15(M) 2.30(X)

5.1pF(5R1) 1.15(M) 2.30(X)

5.6pF(5R6) 1.15(M) 2.30(X)

6.0pF(6R0) 1.15(M) 2.30(X)

6.2pF(6R2) 1.15(M) 2.30(X)

6.8pF(6R8) 1.15(M) 2.30(X)

7.0pF(7R0) 1.15(M) 2.30(X)

7.5pF(7R5) 1.15(M) 2.30(X)

8.0pF(8R0) 1.15(M) 2.30(X)

8.2pF(8R2) 1.15(M) 2.30(X)

9.0pF(9R0) 1.15(M) 2.30(X)

9.1pF(9R1) 1.15(M) 2.30(X)

10pF(100) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

11pF(110) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

12pF(120) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

13pF(130) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

15pF(150) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

16pF(160) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

18pF(180) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

20pF(200) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

22pF(220) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

24pF(240) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

27pF(270) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

30pF(300) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

33pF(330) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

36pF(360) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

39pF(390) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

43pF(430) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

47pF(470) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

51pF(510) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

56pF(560) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

62pF(620) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

68pF(680) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

75pF(750) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

82pF(820) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

91pF(910) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

100pF(101) 1.15(M) 1.15(M) 2.30(X) 2.30(X)

110pF(111) 2.30(X) 2.30(X)

120pF(121) 2.30(X) 2.30(X)

130pF(131) 2.30(X) 2.30(X)

150pF(151) 2.30(X) 2.30(X)

160pF(161) 2.30(X) 2.30(X)

180pF(181) 2.30(X) 2.30(X)

200pF(201) 2.30(X) 2.30(X)

220pF(221) 2.30(X) 2.30(X)

240pF(241) 2.30(X) 2.30(X)

270pF(271) 2.30(X) 2.30(X)

300pF(301) 2.30(X) 2.30(X)

330pF(331) 2.30(X) 2.30(X)

360pF(361) 2.30(X) 2.30(X)

390pF(391) 2.30(X) 2.30(X)

430pF(431) 2.30(X) 2.30(X)

Continued on the following page.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

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!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Continued from the preceding page.

Part Number

L x W

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

C0G

(5C)

50

(1H)

ERF1D

1.40x1.40

CH

(6C)

50

(1H)500

(2H)300

(YD)200

(2D)100

(2A)

C0G

(5C)

50

(1H)500

(2H)300

(YD)200

(2D)100

(2A)

ERF22

2.80x2.80

CH

(6C)

50

(1H)

470pF(471) 2.30(X) 2.30(X)

510pF(511) 2.30(X) 2.30(X)

560pF(561) 2.30(X) 2.30(X)

620pF(621) 2.30(X) 2.30(X)

680pF(681) 2.30(X) 2.30(X)

750pF(751) 2.30(X) 2.30(X)

820pF(821) 2.30(X) 2.30(X)

910pF(911) 2.30(X) 2.30(X)

1000pF(102) 2.30(X) 2.30(X)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

Ribbon Terminal

■ Features (ERH Series)

1. The dielectric is composed of low dielectric loss

ceramics. This series is perfectly suited to high

frequency applications (VHS-microwave band).

2. The series is ultraminiature, yet has a high power

capacity. This is the best capacitor available for

transmitter and amplifier circuits such as those

in broadcasting equipment and mobile base stations.

3. ERH1X/3X Series capacitors withstand high

temperatures because ribbon leads are attached with

silver paste.

4. ERH1X/3X Series capacitors are easily soldered and

especially well suited in applications where only

a soldering iron can be used.

■ Applications

High frequency and high power circuits

Part Number L W T max.

Dimensions (mm)

Rw

1.6 ±0.4 1.4 ±0.4 5.0 min. 1.3 ±0.41.6

ERH1XC 3.2 ±0.4 2.8 ±0.4 9.0 ±2.0 2.35 ±0.153.0

ERH3XX

*** : Capacitance Code

R

W

L

w

T

Silver ribbon leads.

0.1 - 0.2

***

Part Number

L x W

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

C0G

(5C)

50

(1H)

ERH1X

1.60x1.40

CH

(6C)

50

(1H)500

(2H)300

(YD)200

(2D)100

(2A)

C0G

(5C)

50

(1H)500

(2H)300

(YD)200

(2D)100

(2A)

ERH3X

3.20x2.80

CH

(6C)

50

(1H)

0.50pF(R50) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

0.6pF(R60) 1.60(C) 3.00(X)

0.7pF(R70) 1.60(C) 3.00(X)

0.75pF(R75) 1.60(C) 3.00(X)

0.8pF(R80) 1.60(C) 3.00(X)

0.9pF(R90) 1.60(C) 3.00(X)

1.0pF(1R0) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

1.1pF(1R1) 1.60(C) 3.00(X)

1.2pF(1R2) 1.60(C) 3.00(X)

1.3pF(1R3) 1.60(C) 3.00(X)

1.4pF(1R4) 1.60(C) 3.00(X)

1.5pF(1R5) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

Continued on the following page.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

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!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Continued from the preceding page.

Part Number

L x W

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

C0G

(5C)

50

(1H)

ERH1X

1.60x1.40

CH

(6C)

50

(1H)500

(2H)300

(YD)200

(2D)100

(2A)

C0G

(5C)

50

(1H)500

(2H)300

(YD)200

(2D)100

(2A)

ERH3X

3.20x2.80

CH

(6C)

50

(1H)

1.6pF(1R6) 1.60(C) 3.00(X)

1.7pF(1R7) 1.60(C) 3.00(X)

1.8pF(1R8) 1.60(C) 3.00(X)

1.9pF(1R9) 1.60(C) 3.00(X)

2.0pF(2R0) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

2.1pF(2R1) 1.60(C) 3.00(X)

2.2pF(2R2) 1.60(C) 3.00(X)

2.4pF(2R4) 1.60(C) 3.00(X)

2.7pF(2R7) 1.60(C) 3.00(X)

3.0pF(3R0) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

3.3pF(3R3) 1.60(C) 3.00(X)

3.6pF(3R6) 1.60(C) 3.00(X)

3.9pF(3R9) 1.60(C) 3.00(X)

4.0pF(4R0) 1.60(C) 3.00(X)

4.3pF(4R3) 1.60(C) 3.00(X)

4.7pF(4R7) 1.60(C) 3.00(X)

5.0pF(5R0) 1.60(C) 3.00(X)

5.1pF(5R1) 1.60(C) 3.00(X)

5.6pF(5R6) 1.60(C) 3.00(X)

6.0pF(6R0) 1.60(C) 3.00(X)

6.2pF(6R2) 1.60(C) 3.00(X)

6.8pF(6R8) 1.60(C) 3.00(X)

7.0pF(7R0) 1.60(C) 3.00(X)

7.5pF(7R5) 1.60(C) 3.00(X)

8.0pF(8R0) 1.60(C) 3.00(X)

8.2pF(8R2) 1.60(C) 3.00(X)

9.0pF(9R0) 1.60(C) 3.00(X)

9.1pF(9R1) 1.60(C) 3.00(X)

10pF(100) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

11pF(110) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

12pF(120) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

13pF(130) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

15pF(150) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

16pF(160) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

18pF(180) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

20pF(200) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

22pF(220) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

24pF(240) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

27pF(270) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

30pF(300) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

33pF(330) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

36pF(360) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

39pF(390) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

43pF(430) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

47pF(470) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

51pF(510) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

56pF(560) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

62pF(620) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

68pF(680) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

75pF(750) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

82pF(820) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

91pF(910) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

Continued on the following page.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

65

12

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Continued from the preceding page.

Part Number

L x W

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

C0G

(5C)

50

(1H)

ERH1X

1.60x1.40

CH

(6C)

50

(1H)500

(2H)300

(YD)200

(2D)100

(2A)

C0G

(5C)

50

(1H)500

(2H)300

(YD)200

(2D)100

(2A)

ERH3X

3.20x2.80

CH

(6C)

50

(1H)

100pF(101) 1.60(C) 1.60(C) 3.00(X) 3.00(X)

110pF(111) 3.00(X) 3.00(X)

120pF(121) 3.00(X) 3.00(X)

130pF(131) 3.00(X) 3.00(X)

150pF(151) 3.00(X) 3.00(X)

160pF(161) 3.00(X) 3.00(X)

180pF(181) 3.00(X) 3.00(X)

200pF(201) 3.00(X) 3.00(X)

220pF(221) 3.00(X) 3.00(X)

240pF(241) 3.00(X) 3.00(X)

270pF(271) 3.00(X) 3.00(X)

300pF(301) 3.00(X) 3.00(X)

330pF(331) 3.00(X) 3.00(X)

360pF(361) 3.00(X) 3.00(X)

390pF(391) 3.00(X) 3.00(X)

430pF(431) 3.00(X) 3.00(X)

470pF(471) 3.00(X) 3.00(X)

510pF(511) 3.00(X) 3.00(X)

560pF(561) 3.00(X) 3.00(X)

620pF(621) 3.00(X) 3.00(X)

680pF(681) 3.00(X) 3.00(X)

750pF(751) 3.00(X) 3.00(X)

820pF(821) 3.00(X) 3.00(X)

910pF(911) 3.00(X) 3.00(X)

1000pF(102) 3.00(X) 3.00(X)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Y55Dto W125D

Operating

Temperature Range

1

Item

No. Test Method

Specifications

See the previous pages.

Within the specified dimension

No defects or abnormalities

Rated Voltage

Appearance

Dimensions

Dielectric Strength

2

3

4

5

Using calipers

No failure should be observed when 250% of the rated voltage

is applied between the terminations for 1 to 5 seconds, provid-

ed the charge/discharge current is less than 50mA.

Visual inspection

The rated voltage is defined as the maximum voltage which

may be applied continuously to the capacitor.

When AC voltage is superimposed on DC voltage, VP-P or VO-P,

whichever is larger, should be maintained within the rated volt-

age range.

The capacitor body is fixed and a load is applied gradually in

the axial direction until its value reaches 10N (5N for ERH1X).

Position the main body of the capacitor so the lead wire termi-

nal is perpendicular, and load 2.5N to the lead wire terminal.

Bend the main body by 90 degrees, bend back to original posi-

tion, bend 90 degrees in the reverse direction, and then bend

back to original position.

220pF<CV1,220pF : QU10,000

220pF<CV1,470pF : QU15,000

470pF<CV1,000pF : QU13,000

C : Nominal Capacitance (pF)

Within the specified tolerance.

Capacitance

Q

7

8

The capacitance/Q should be measured at 25Dat the frequen-

cy and voltage shown in the table.

Frequency

Voltage 1T0.1MHz

0.5 to 5Vr.m.s.

Item

Capacitance

Temperature

Characteristics

Capacitance

Variation

Rate

Within the specified tolerance (Table A-7)

Temperature

Coefficient

Within the specified tolerance (Table A-7)

Capacitance

Drift

Within T0.2% or T0.05pF

(Whichever is larger)

9

The temperature coefficient is determined using the capaci-

tance measured in step 3 as a reference. When cycling the

temperature sequentially from step 1 through 5, the capaci-

tance should be within the specified tolerance for the tempera-

ture coefficient and capacitance change as Table A.

The capacitance drift is calculated by dividing the differences

between the maximum and minimum measured values in steps

1, 3 and 5 by the capacitance value in step 3.

The capacitance change should be measured after 5 min. at

each specified temperature stage.

Terminal

Strength

Adhesive

Strength of

Termination

(for chip type)

No removal of the terminations or other defects should occur.

Tensile

Strength

(for micro-

strip type)

Capacitor should not be broken or damaged.

Bending

Strength of

lead wire

terminal

(for micro-

strip type)

Lead wire should not be cut or broken.

10

Solder the capacitor to the test jig (alumina substrate) shown in

Fig. 1 using solder containing 2.5% silver. The soldering should

be done either with an iron or in furnace and be conducted with

care so the soldering is uniform and free of defects such as heat

shock. Then apply a 10N* force in the direction of the arrow.

Step

1

2

3

4

5

25T2

Y55T3

25T2

125T3

25T2

Temperature (D)

10N*

Alumina substrate

Fig. 1

470pFFCV1,470pF :1,000,000MΩmin.

470pFFCV1,000pF :1,100,000MΩmin.

470pFFCV1,470pF :1,100,000MΩmin.

470pFFCV1,000pF :1,110,000MΩmin.

Insulation

Resistance

(I.R.)

25D

125D

6The insulation resistance should be measured with a DC volt-

age not exceeding the rated voltage at 25Dand 125Dstandard

humidity and within 2 minutes of charging.

Continued on the following page.

*

ERF1D : 5N

Specifications and Test Methods

66

12

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Continued from the preceding page.

ItemNo. Test Method

Specifications

95% of the terminations are to be soldered evenly and continuous-

ly.

Solderability of

Termination

12

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at

80 to 120Dfor 10 to 30 seconds. After preheating immerse in

solder containing 2.5% silver for 5T0.5 seconds at 230T5D.

The dipping depth for microstrip type capacitors is up to 1 mm

from the root of the terminal.

Continued on the following page.

No defects or abnormalities

Within the specified tolerance

Satisfies the initial value.

220pFFCV1,220pF : QU10,000

220pFFCV1,470pF : QU15,000

470pFFCV1,000pF : QU13,000

C : Nominal Capacitance (pF)

Vibration

Resistance

11

Solder the capacitor to the test jig (alumina substrate) shown in

Fig. 2 using solder containing 2.5% silver. The soldering should

be done either with an iron or using the reflow method and should

be conducted with care so the soldering is uniform and free of

defects such as heat shock. The capacitor should be subjected to

a simple harmonic motion having a total amplitude of 1.5mm, the

frequency being varied uniformly between the approximate limits

of 10 and 55Hz. The frequency range, from 10 to 55Hz and

return to 10Hz, should be traversed in approximately 1 minute.

This motion should be applied for a period of 2 hours in each of 3

mutually perpendicular directions (total of 6 hours).

Appearance

Capacitance

Q

Solder resist

Ag/Pd

Alumina substrate

Fig. 2

The measured and observed characteristics should satisfy the

specifications in the following table.

C : Nominal Capacitance (pF)

Resistance

to Soldering Heat

13

Preheat the capacitor at 80 to 100Dfor 2 minutes and then at

150 to 200Dfor 5 minutes.

Immerse in solder containing 2.5% silver for 3T0.5 seconds at

270T5D. Set at room temperature for 24T2 hours, then mea-

sure. The dipping depth for microstrip type capacitors is up to

2mm from the root of the terminal.

Item

Appearance

Capacitance

Change

Q

I.R.

Dielectric Strength

No marked defect

Within T2.5% or T0.25pF

(Whichever is larger)

220pFFCV1,220pF : QU10,000

220pFFCV1,470pF : QU15,000

470pFFCV1,000pF : QU13,000

More than 30% of the initial spec-

ification value at 25D.

No failure

Specifications

Item

Appearance

Capacitance

Change

Q

I.R.

Dielectric Strength

No marked defect

Within T1% or T0.25pF

(Whichever is larger)

220pFFCV1,220pF : QU10,000

220pFFCV1,470pF : QU15,000

470pFFCV1,000pF : QU13,000

More than 30% of the initial spec-

ification value at 25D.

No failure

Specifications

Item

Appearance

Capacitance

Change

Q

I.R.

No marked defect

Within T5% or T0.5pF

(Whichever is larger)

220pFFCV1,220pF : QU10,000

220pFFCV1,470pF : QU15,000

470pFFCV1,000pF : QU13,000

More than 30% of the initial spec-

ification value at 25D.

Specifications

The measured and observed characteristics should satisfy the

specifications in the following table.

C : Nominal Capacitance (pF)

Humidity15

Apply the 24-hour heat (Y10 to W65D) and humidity (80 to 98%)

treatment shown below, 10 consecutive times. Remove, let sit for

24T2 hours at room temperature, and measure.

The measured and observed characteristics should satisfy the

specifications in the following table.

C : Nominal Capacitance (pF)

Temperature

Cycle

14

Fix the capacitor to the supporting jig in the same manner and

under the same conditions as (11). Perform the five cycles

according to the four heat treatments listed in the following table.

Then, repeat twice the successive cycles of immersion, each

cycle consisting of immersion in a fresh water at 65 Dfor 15

minutes and immersion in a saturated aqueous solution of salt at

0T3Dfor 15 minutes.

The capacitor is promptly washed with running water, dried with a

dry cloth, and allowed to sit at room temperature for 24T2 hours.

W5

Y0

Step 1234

Temp.(D)

Time(min.)

Y55

W0

Y3

RoomTemp.

125

W3

Y0

RoomTemp.

30T32 to 3 30T32 to 3

-10

D

0123456789101112131415161718192021222324

One cycle 24 hours

Humidity

80

-

98% Humidity

80

-

98%

Hours

-5

0

5

10

15

20

25

30

35

40

45

50

55

60

65

70 Humidity90

-

98%

Humidity

90

-

98%

Initial measurement

+10

-

2D

Humidity

90

-

98%

Applied voltage 50Vdc

Temperature

Specifications and Test Methods

67

12

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Continued from the preceding page.

ItemNo. Test Method

Specifications

The measured and observed characteristics should satisfy

the specifications in the following table.

C : Nominal Capacitance (pF)

High Temperature

Load

16

Apply 150% of the rated voltage for 2,000T12 hours at 125T3D.

Remove and let sit for 24T2 hours at room temperature, then

measure.

The charge/discharge current is less than 50mA.

Note 1 : Nominal values denote the temperature coefficient within a range of 25 to 125D.

5C 0T30 0.250.400.58 Y0.11Y0.17Y0.24

Char. Code Temp. Coeff.

(ppm/D) Note 1

Capacitance Change from 25DValue (%)

Max. Min.

Y30DY10D

Max. Min.

Table A

Y55D

Max. Min.

Item

Appearance

Capacitance

Change

Q

I.R.

No marked defect

Within T2.5% or T0.25pF

(Whichever is larger)

220pFFCV1,220pF : QU10,000

220pFFCV1,470pF : QU15,000

470pFFCV1,000pF : QU13,000

More than 30% of the initial spec-

ification value at 25D.

Specifications

Specifications and Test Methods

68

12

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

69

13

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Chip Monolithic Ceramic Capacitors

High Frequency Type

SMD Type

■ Features (ERA Series)

1. Negligible inductance is achieved by its monolithic

structure so the series can be used at frequencies

above 1GHz.

2. Nickel barriered terminations of ERA series improve

solderability and decrease solder leaching.

3. ERA11A/21A series are designed for both flow and

reflow soldering and ERA32 series are designed for

reflow soldering.

■ Applications

High frequency and high power circuits

L

T

W

e eg

Part Number L W T max.

Dimensions (mm) e g min.

0.15 min. 0.31.0±0.2

ERA11A

0.2 min. 0.5

1.0±0.2

1.25±0.2

ERA21A

ERA21B 0.3 min. 0.51.7±0.2

ERA32X

1.25+0.5

-0.3

2.0 +0.5

-0.3

3.2 +0.6

-0.4

1.0 +0.5

-0.3

1.25+0.5

-0.3

2.5 +0.5

-0.3

Part Number

L x W

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

200

(2D)100

(2A)

C0G

(5C)

50

(1H)200

(2D)100

(2A)

CH

(6C)

50

(1H)

CJ

(7C)

200

(2D)

ERA11

1.25x1.00

CK

(8C)

200

(2D)200

(2D)100

(2A)

C0G

(5C)

50

(1H)200

(2D)100

(2A)

CH

(6C)

50

(1H)

CJ

(7C)

200

(2D)

ERA21

2.00x1.25

CK

(8C)

200

(2D)200

(2D)100

(2A)

C0G

(5C)

50

(1H)200

(2D)100

(2A)

CH

(6C)

50

(1H)

CJ

(7C)

200

(2D)

ERA32

3.20x2.50

CK

(8C)

200

(2D)

0.50pF

(R50)

1.00

(A)1.20

(A)1.00

(A)1.70

(X)1.70

(X)

0.6pF

(R60)

1.00

(A)1.00

(A)1.70

(X)

0.7pF

(R70)

1.00

(A)1.00

(A)1.70

(X)

0.75pF

(R75)

1.20

(A)1.00

(A)1.70

(X)

0.8pF

(R80)

1.00

(A)1.00

(A)1.70

(X)

0.9pF

(R90)

1.00

(A)1.00

(A)1.70

(X)

1.0pF

(1R0)

1.00

(A)1.20

(A)1.00

(A)1.70

(X)1.70

(X)

1.1pF

(1R1)

1.00

(A)1.00

(A)1.70

(X)

1.2pF

(1R2)

1.00

(A)1.00

(A)1.70

(X)

1.3pF

(1R3)

1.00

(A)1.00

(A)1.70

(X)

1.4pF

(1R4)

1.00

(A)1.00

(A)1.70

(X)

1.5pF

(1R5)

1.00

(A)1.20

(A)1.00

(A)1.70

(X)1.70

(X)

1.6pF

(1R6)

1.00

(A)1.00

(A)1.70

(X)

1.7pF

(1R7)

1.00

(A)1.00

(A)1.70

(X)

1.8pF

(1R8)

1.00

(A)1.00

(A)1.70

(X)

Continued on the following page.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

70

13

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Continued from the preceding page.

Part Number

L x W

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

200

(2D)100

(2A)

C0G

(5C)

50

(1H)200

(2D)100

(2A)

CH

(6C)

50

(1H)

CJ

(7C)

200

(2D)

ERA11

1.25x1.00

CK

(8C)

200

(2D)200

(2D)100

(2A)

C0G

(5C)

50

(1H)200

(2D)100

(2A)

CH

(6C)

50

(1H)

CJ

(7C)

200

(2D)

ERA21

2.00x1.25

CK

(8C)

200

(2D)200

(2D)100

(2A)

C0G

(5C)

50

(1H)200

(2D)100

(2A)

CH

(6C)

50

(1H)

CJ

(7C)

200

(2D)

ERA32

3.20x2.50

CK

(8C)

200

(2D)

1.9pF

(1R9)

1.00

(A)1.00

(A)1.70

(X)

2.0pF

(2R0)

1.00

(A)1.20

(A)1.00

(A)1.70

(X)1.70

(X)

2.1pF

(2R1)

1.00

(A)1.00

(A)1.70

(X)

2.2pF

(2R2)

1.00

(A)1.00

(A)1.70

(X)

2.4pF

(2R4)

1.00

(A)1.00

(A)1.70

(X)

2.7pF

(2R7)

1.00

(A)1.00

(A)1.70

(X)

3.0pF

(3R0)

1.00

(A)1.20

(A)1.00

(A)1.70

(X)1.70

(X)

3.3pF

(3R3)

1.00

(A)1.00

(A)1.70

(X)

3.6pF

(3R6)

1.00

(A)1.00

(A)1.70

(X)

3.9pF

(3R9)

1.00

(A)1.00

(A)1.70

(X)

4.0pF

(4R0)

1.00

(A)1.00

(A)1.70

(X)

4.3pF

(4R3)

1.00

(A)1.00

(A)1.70

(X)

4.7pF

(4R7)

1.00

(A)1.00

(A)1.70

(X)

5.0pF

(5R0)

1.00

(A)1.00

(A)1.70

(X)

5.1pF

(5R1)

1.00

(A)1.00

(A)1.70

(X)

5.6pF

(5R6)

1.00

(A)1.00

(A)1.70

(X)

6.0pF

(6R0)

1.00

(A)1.00

(A)1.70

(X)

6.2pF

(6R2)

1.00

(A)1.00

(A)1.70

(X)

6.8pF

(6R8)

1.00

(A)1.00

(A)1.70

(X)

7.0pF

(7R0)

1.20

(A)1.00

(A)1.70

(X)

7.5pF

(7R5)

1.00

(A)1.00

(A)1.70

(X)

8.0pF

(8R0)

1.20

(A)1.00

(A)1.70

(X)

8.2pF

(8R2)

1.00

(A)1.00

(A)1.70

(X)

9.0pF

(9R0)

1.20

(A)1.00

(A)1.25

(B)1.70

(X)

9.1pF

(9R1)

1.00

(A)1.25

(B)1.70

(X)

10pF

(100)

1.00

(A)1.00

(A)1.25

(B)1.25

(B)1.70

(X)1.70

(X)

Continued on the following page.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

71

13

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Continued from the preceding page.

Part Number

L x W

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

200

(2D)100

(2A)

C0G

(5C)

50

(1H)200

(2D)100

(2A)

CH

(6C)

50

(1H)

CJ

(7C)

200

(2D)

ERA11

1.25x1.00

CK

(8C)

200

(2D)200

(2D)100

(2A)

C0G

(5C)

50

(1H)200

(2D)100

(2A)

CH

(6C)

50

(1H)

CJ

(7C)

200

(2D)

ERA21

2.00x1.25

CK

(8C)

200

(2D)200

(2D)100

(2A)

C0G

(5C)

50

(1H)200

(2D)100

(2A)

CH

(6C)

50

(1H)

CJ

(7C)

200

(2D)

ERA32

3.20x2.50

CK

(8C)

200

(2D)

11pF

(110)

1.00

(A)1.00

(A)1.25

(B)1.25

(B)1.70

(X)1.70

(X)

12pF

(120)

1.00

(A)1.00

(A)1.25

(B)1.25

(B)1.70

(X)1.70

(X)

13pF

(130)

1.00

(A)1.00

(A)1.25

(B)1.25

(B)1.70

(X)1.70

(X)

15pF

(150)

1.00

(A)1.00

(A)1.25

(B)1.25

(B)1.70

(X)1.70

(X)

16pF

(160)

1.00

(A)1.00

(A)1.25

(B)1.25

(B)1.00

(X)1.70

(X)

18pF

(180)

1.00

(A)1.00

(A)1.25

(B)1.25

(B)1.70

(X)1.70

(X)

20pF

(200)

1.00

(A)1.00

(A)1.25

(B)1.25

(B)1.70

(X)1.70

(X)

22pF

(220)

1.00

(A)1.00

(A)1.25

(B)1.25

(B)1.70

(X)1.70

(X)

24pF

(240)

1.00

(A)1.00

(A)1.25

(B)1.25

(B)1.70

(X)1.70

(X)

27pF

(270)

1.00

(A)1.00

(A)1.25

(B)1.25

(B)1.70

(X)1.70

(X)

30pF

(300)

1.00

(A)1.00

(A)1.25

(B)1.25

(B)1.70

(X)1.70

(X)

33pF

(330)

1.00

(A)1.00

(A)1.25

(B)1.25

(B)1.70

(X)1.70

(X)

36pF

(360)

1.00

(A)1.00

(A)1.25

(B)1.25

(B)1.70

(X)1.70

(X)

39pF

(390)

1.00

(A)1.00

(A)1.25

(B)1.25

(B)1.70

(X)1.70

(X)

43pF

(430)

1.00

(A)1.00

(A)1.25

(B)1.25

(B)1.70

(X)1.70

(X)

47pF

(470)

1.00

(A)1.00

(A)1.25

(B)1.25

(B)1.70

(X)1.70

(X)

51pF

(510)

1.00

(A)1.00

(A)1.25

(B)1.25

(B)1.70

(X)1.70

(X)

56pF

(560)

1.25

(B)1.25

(B)1.70

(X)1.70

(X)

62pF

(620)

1.25

(B)1.25

(B)1.70

(X)1.70

(X)

68pF

(680)

1.25

(B)1.25

(B)1.70

(X)1.70

(X)

75pF

(750)

1.25

(B)1.25

(B)1.70

(X)1.70

(X)

82pF

(820)

1.25

(B)1.25

(B)1.70

(X)1.70

(X)

91pF

(910)

1.25

(B)1.25

(B)1.70

(X)1.70

(X)

100pF

(101)

1.00

(A)1.00

(A)1.70

(X)1.70

(X)

110pF

(111)

1.25

(B)1.25

(B)1.70

(X)1.70

(X)

120pF

(121)

1.25

(B)1.25

(B)1.70

(X)1.70

(X)

Continued on the following page.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

72

13

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Continued from the preceding page.

Part Number

L x W

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

200

(2D)100

(2A)

C0G

(5C)

50

(1H)200

(2D)100

(2A)

CH

(6C)

50

(1H)

CJ

(7C)

200

(2D)

ERA11

1.25x1.00

CK

(8C)

200

(2D)200

(2D)100

(2A)

C0G

(5C)

50

(1H)200

(2D)100

(2A)

CH

(6C)

50

(1H)

CJ

(7C)

200

(2D)

ERA21

2.00x1.25

CK

(8C)

200

(2D)200

(2D)100

(2A)

C0G

(5C)

50

(1H)200

(2D)100

(2A)

CH

(6C)

50

(1H)

CJ

(7C)

200

(2D)

ERA32

3.20x2.50

CK

(8C)

200

(2D)

130pF

(131)

1.25

(B)1.25

(B)1.70

(X)1.70

(X)

150pF

(151)

1.25

(B)1.25

(B)1.70

(X)1.70

(X)

160pF

(161)

1.25

(B)1.25

(B)1.70

(X)1.70

(X)

180pF

(181)

1.70

(X)1.70

(X)

200pF

(201)

1.70

(X)1.70

(X)

220pF

(221)

1.70

(X)1.70

(X)

240pF

(241)

1.70

(X)1.70

(X)

270pF

(271)

1.70

(X)1.70

(X)

300pF

(301)

1.70

(X)1.70

(X)

330pF

(331)

1.70

(X)1.70

(X)

360pF

(361)

1.70

(X)1.70

(X)

390pF

(391)

1.70

(X)1.70

(X)

430pF

(431)

1.70

(X)1.70

(X)

470pF

(471)

1.70

(X)1.70

(X)

510pF

(511)

1.70

(X)1.70

(X)

560pF

(561)

1.70

(X)1.70

(X)

620pF

(621)

1.70

(X)1.70

(X)

680pF

(681)

1.70

(X)1.70

(X)

750pF

(751)

1.70

(X)1.70

(X)

820pF

(821)

1.70

(X)1.70

(X)

910pF

(911)

1.70

(X)1.70

(X)

1000pF

(102)

1.70

(X)1.70

(X)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

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13

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Ribbon Terminal

■ Features (ERD Series)

1. Negligible inductance is achieved by its monolithic

structure so the series can be used at frequencies

above 1GHz.

2. ERD Series capacitors withstand at high

temperatures because ribbon leads are attached

with silver paste.

3. ERD Series capacitors are easily soldered and are

especially well suited in applications where only

a soldering iron can be used.

■ Application

High frequency and high power circuits

Part Number L max. W max. T max.

Dimensions (mm)

4.0 3.0 2.3

ERD32D

***

*** : Capacitance Code

L

10T1

w

T

Silver ribbon leads.

0.1

2T0.3

10T1

Part Number

L x W

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

200

(2D)100

(2A)

C0G

(5C)

50

(1H)200

(2D)100

(2A)

CH

(6C)

50

(1H)

CJ

(7C)

200

(2D)

ERD32

4.00x3.00

CK

(8C)

200

(2D)

0.50pF(R50) 2.30(D) 2.30(D)

0.6pF(R60) 2.30(D)

0.7pF(R70) 2.30(D)

0.75pF(R75) 2.30(D)

0.8pF(R80) 2.30(D)

0.9pF(R90) 2.30(D)

1.0pF(1R0) 2.30(D) 2.30(D)

1.1pF(1R1) 2.30(D)

1.2pF(1R2) 2.30(D)

1.3pF(1R3) 2.30(D)

1.4pF(1R4) 2.30(D)

1.5pF(1R5) 2.30(D) 2.30(D)

1.6pF(1R6) 2.30(D)

1.7pF(1R7) 2.30(D)

1.8pF(1R8) 2.30(D)

1.9pF(1R9) 2.30(D)

2.0pF(2R0) 2.30(D) 2.30(D)

2.1pF(2R1) 2.30(D)

2.2pF(2R2) 2.30(D)

2.4pF(2R4) 2.30(D)

2.7pF(2R7) 2.30(D)

3.0pF(3R0) 2.30(D) 2.30(D)

3.3pF(3R3) 2.30(D)

3.6pF(3R6) 2.30(D)

3.9pF(3R9) 2.30(D)

4.0pF(4R0) 2.30(D)

4.3pF(4R3) 2.30(D)

4.7pF(4R7) 2.30(D)

5.0pF(5R0) 2.30(D)

5.1pF(5R1) 2.30(D)

5.6pF(5R6) 2.30(D)

6.0pF(6R0) 2.30(D)

6.2pF(6R2) 2.30(D)

6.8pF(6R8) 2.30(D)

7.0pF(7R0) 2.30(D)

Continued on the following page.

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Continued from the preceding page.

Part Number

L x W

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

200

(2D)100

(2A)

C0G

(5C)

50

(1H)200

(2D)100

(2A)

CH

(6C)

50

(1H)

CJ

(7C)

200

(2D)

ERD32

4.00x3.00

CK

(8C)

200

(2D)

7.5pF(7R5) 2.30(D)

8.0pF(8R0) 2.30(D)

8.2pF(8R2) 2.30(D)

9.0pF(9R0) 2.30(D)

9.1pF(9R1) 2.30(D)

10pF(100) 2.30(D) 2.30(D)

11pF(110) 2.30(D) 2.30(D)

12pF(120) 2.30(D) 2.30(D)

13pF(130) 2.30(D) 2.30(D)

15pF(150) 2.30(D) 2.30(D)

16pF(160) 2.30(D) 2.30(D)

18pF(180) 2.30(D) 2.30(D)

20pF(200) 2.30(D) 2.30(D)

22pF(220) 2.30(D) 2.30(D)

24pF(240) 2.30(D) 2.30(D)

27pF(270) 2.30(D) 2.30(D)

30pF(300) 2.30(D) 2.30(D)

33pF(330) 2.30(D) 2.30(D)

36pF(360) 2.30(D) 2.30(D)

39pF(390) 2.30(D) 2.30(D)

43pF(430) 2.30(D) 2.30(D)

47pF(470) 2.30(D) 2.30(D)

51pF(510) 2.30(D) 2.30(D)

56pF(560) 2.30(D) 2.30(D)

62pF(620) 2.30(D) 2.30(D)

68pF(680) 2.30(D) 2.30(D)

75pF(750) 2.30(D) 2.30(D)

82pF(820) 2.30(D) 2.30(D)

91pF(910) 2.30(D) 2.30(D)

100pF(101) 2.30(D) 2.30(D)

110pF(111) 2.30(D) 2.30(D)

120pF(121) 2.30(D) 2.30(D)

130pF(131) 2.30(D) 2.30(D)

150pF(151) 2.30(D) 2.30(D)

160pF(161) 2.30(D) 2.30(D)

180pF(181) 2.30(D) 2.30(D)

200pF(201) 2.30(D) 2.30(D)

220pF(221) 2.30(D) 2.30(D)

240pF(241) 2.30(D) 2.30(D)

270pF(271) 2.30(D) 2.30(D)

300pF(301) 2.30(D) 2.30(D)

330pF(331) 2.30(D) 2.30(D)

360pF(361) 2.30(D) 2.30(D)

390pF(391) 2.30(D) 2.30(D)

430pF(431) 2.30(D) 2.30(D)

470pF(471) 2.30(D) 2.30(D)

510pF(511) 2.30(D) 2.30(D)

560pF(561) 2.30(D) 2.30(D)

620pF(621) 2.30(D) 2.30(D)

680pF(681) 2.30(D) 2.30(D)

750pF(751) 2.30(D) 2.30(D)

820pF(821) 2.30(D) 2.30(D)

Continued on the following page.

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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Continued from the preceding page.

Part Number

L x W

TC

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

200

(2D)100

(2A)

C0G

(5C)

50

(1H)200

(2D)100

(2A)

CH

(6C)

50

(1H)

CJ

(7C)

200

(2D)

ERD32

4.00x3.00

CK

(8C)

200

(2D)

910pF(911) 2.30(D) 2.30(D)

1000pF(102) 2.30(D) 2.30(D)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Y55Dto W125D

Operating

Temperature Range

1

Item

No. Test Method

Continued on the following page.

Specifications

220pF<CV1,220pF : QU10,000

220pF<CV1,470pF : QU15,000

470pF<CV1,000pF : QU13,000

C : Nominal Capacitance (pF)

See the previous pages.

Within the specified dimension

No defects or abnormalities

10,000MΩmin.

No defects or abnormalities

Rated Voltage

Appearance

Dimensions

Dielectric Strength

Insulation Resistance

(I.R.)

2

3

4

5

6

Using calipers

The insulation resistance should be measured with a DC volt-

age not exceeding the rated voltage at 25Dand standard

humidity and within 2 minutes of charging.

No failure should be observed when 300% of the rated voltage

is applied between the terminations for 1 to 5 seconds, provid-

ed the charge/discharge current is less than 50mA.

Visual inspection

The rated voltage is defined as the maximum voltage which

may be applied continuously to the capacitor.

When AC voltage is superimposed on DC voltage, VP-P or VO-P,

whichever is larger, should be maintained within the rated volt-

age range.

Within the specified tolerance

Capacitance

Q

7

8

The capacitance/Q should be measured at 25Dat the frequen-

cy and voltage shown in the table.

Frequency

Voltage 1T0.1MHz

0.5 to 5Vr.m.s.

C0G (1,000pF and below)

Item Char.

Capacitance

Temperature

Characteristics

Capacitance

Variation

Rate

Within the specified tolerance (Table A-6)

Temperature

Coefficient

Within the specified tolerance (Table A-6)

Capacitance

Drift

Within T0.2% or T0.05pF

(Whichever is larger)

9

The temperature coefficient is determined using the capaci-

tance measured in step 3 as a reference. When cycling the

temperature sequentially from step 1 through 5, the capaci-

tance should be within the specified tolerance for the tempera-

ture coefficient and capacitance change as Table A.

The capacitance drift is calculated by dividing the differences

between the maximum and minimum measured values in steps

1, 3 and 5 by the capacitance value in step 3.

The capacitance change should be measured after 5 min. at

each specified temperature stage.

Terminal

Strength

Adhesive

Strength of

Termination

(for chip type)

No removal of the terminations or other defects should occur.

Tensile

Strength

(for micro-

strip type)

Capacitor should not be broken or damaged. The capacitor body is fixed and a load is applied gradually in

the axial direction until its value reaches 5N.

Bending

Strength of

lead wire

terminal

(for micro-

strip type)

Lead wire should not be cut or broken.

Position the main body of the capacitor so the lead wire termi-

nal is perpendicular, and load 2.5N to the lead wire terminal.

Bend the main body by 90 degrees, bend back to original posi-

tion, bend 90 degrees in the reverse direction, and then bend

back to original position.

10

Solder the capacitor to the test jig (alumina substrate) shown in

Fig.1 using solder containing 2.5% silver. The soldering should

be done either with an iron or in furnace and be conducted with

care so the soldering is uniform and free of defects such as heat

shock. Then apply a 10N*force in the direction of the arrow.

*5N (ERA11)

Step

1

2

3

4

5

25T2

Y55T3

25T2

125T3

25T2

Temperature(D)

10N*

Alumina substrate

Fig.1

Specifications and Test Methods

76

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!Note C02E10.pdf 04.1.20

Continued from the preceding page.

ItemNo. Test Method

Specifications

75% of the terminations are to be soldered evenly and continuous-

ly.

Solderability of

Termination

12

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at

80 to 120Dfor 10 to 30 seconds. After preheating immerse in

solder containing 2.5% silver for 5T0.5 seconds at 230T5D.

The dipping depth for microstrip type capacitors is up to 1 mm

from the root of the terminal.

No defects or abnormalities

Within the specified tolerance

Satisfies the initial value.

220pFFCV1,220pF : QU10,000

220pFFCV1,470pF : QU15,000

470pFFCV1,000pF : QU13,000

C : Nominal Capacitance (pF)

Vibration

Resistance

11

Solder the capacitor to the test jig (alumina substrate) shown in

Fig. 2 using solder containing 2.5% silver. The soldering should

be done either with an iron or using the reflow method and should

be conducted with care so the soldering is uniform and free of

defects such as heat shock. The capacitor should be subjected to

a simple harmonic motion having a total amplitude of 1.5mm, the

frequency being varied uniformly between the approximate limits

of 10 and 55Hz. The frequency range, from 10 to 55Hz and

return to 10Hz, should be traversed in approximately 1 minute.

This motion should be applied for a period of 2 hours in each of 3

mutually perpendicular directions (total of 6 hours).

Appearance

Capacitance

Q

Solder resist

Ag/Pd

Alumina substrate

Fig. 2

The measured and observed characteristics should satisfy the

specifications in the following table.

C : Nominal Capacitance (pF)

Resistance

to Soldering Heat

13

Preheat according to the conditions listed in the table below.

Immerse in solder containing 2.5% silver for 3T0.5 seconds at

270T5D. Set at room temperature for 24T2 hours, then mea-

sure. The dipping depth for microstrip type capacitors is up to

2mm from the root of the terminal.

Item

Appearance

Capacitance

Change

Q

Dielectric Strength

No marked defect

Within T2.5% or T0.25pF

(Whichever is larger)

220pFFCV1,220pF : QU10,000

220pFFCV1,470pF : QU15,000

470pFFCV1,000pF : QU13,000

No failure

Specifications

The measured and observed characteristics should satisfy the

specifications in the following table.

C : Nominal Capacitance (pF)

Humidity15

Apply the 24-hour heat (Y10 to W65D) and humidity (80 to 98%)

treatment shown below, 10 consecutive times. Remove, let sit for

24T2 hours at room temperature, and measure.

Item

Appearance

Capacitance

Change

Q

I.R.

No marked defect

Within T5% or T0.5pF

(Whichever is larger)

10pFVCU30pF : QU350

10pFVCF30pF : QU275WC

10pFVCF10pF : QU200W10C

1,000MΩmin.

5

2

Specifications

Chip Size Preheat Condition

2.0Z1.25mm max.

3.2Z2.5mm 1minute at 120 to 150D

Each 1 minute at 100 to 120Dand then 170 to 200D

The measured and observed characteristics should satisfy the

specifications in the following table.

C : Nominal Capacitance (pF)

Temperature

Cycle

14

Fix the capacitor to the supporting jig in the same manner and

under the same conditions as (11). Perform the five cycles

according to the four heat treatments listed in the following table.

Let sit for 24T2 hours at room temperature, then measure.

Item

Appearance

Capacitance

Change

Q

I.R.

Dielectric Strength

No marked defect

Within T5% or T0.5pF

(Whichever is larger)

10pFVCU30pF : QU350

10pFVCF30pF : QU275WC

10pFVCF10pF : QU200W10C

1,000MΩmin.

No failure

5

2

Specifications

Step 1234

Temp.(D)

Time(min.)

Y55

W0

Y3

RoomTemp.

125

W3

Y0

RoomTemp.

30T32 to 3 30T32 to 3

-10

D

0123456789101112131415161718192021222324

One cycle 24 hours

Humidity

80

-

98% Humidity

80

-

98%

Hours

-5

0

5

10

15

20

25

30

35

40

45

50

55

60

65

70 Humidity90

-

98%

Humidity

90

-

98%

Initial measurement

+10

-

2D

Humidity

90

-

98%

Applied voltage 50Vdc

Temperature

Continued on the following page.

Specifications and Test Methods

77

13

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Continued from the preceding page.

ItemNo. Test Method

Specifications

The measured and observed characteristics should satisfy the

specifications in the following table.

C : Nominal Capacitance (pF)

High Temperature

Load

16

Apply 200% of the rated voltage for 1,000T12 hours at 125T3D.

Remove and let sit for 24T2 hours at room temperature, then

measure.

The charge/discharge current is less than 50mA.

Item

Appearance

Capacitance

Change

Q

I.R.

No marked defect

Within T3% or T0.3pF

(Whichever is larger)

10pFVCU30pF : QU350

10pFVCF30pF : QU275WC

10pFVCF10pF : QU200W10C

1,000MΩmin.

5

2

Specifications

Note 1 : Nominal values denote the temperature coefficient within a range of 25 to 125D.

5C 0T30 0.250.400.58 Y0.11Y0.17Y0.24

Char. Code Temperature Coefficient

(ppm/D) Note 1

Capacitance Change from 25DValue (%)

Max. Min.

Y30DY10D

Max. Min.

Table A

Y55D

Max. Min.

Specifications and Test Methods

78

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

ERA/ERD/ERF/ERH Series Data

79

13

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

■ Q-Frequency Characteristics

ERF Series

measured by

BOONTON RESONANT

COAXIAL-LINE 34A

100M 1G 10G

Frequency [Hz]

0.1

1

10

100

1000

10000

100000

Q

ERF1D

100pF

10pF

1pF

ERA Series

measured by

BOONTON RESONANT

COAXIAL-LINE 34A

100M 1G 10G

Frequency [Hz]

0.1

1

10

100

1000

10000

100000

Q

ERA21

100pF

10pF

1pF

■ Impedance-Frequency Characteristics

ERF Series

1M 10M 100M 1G 10G

1m

10m

100m

1

10

100

1k

10k

100k

Frequency [Hz]

Impedance [Ohm]

PARALLEL

RESONANCE

1pF

10pF

100pF

ERF1D

ERA Series

1M 10M 100M 1G 10G

1m

10m

100m

1

10

100

1k

10k

100k

Frequency [Hz]

Impedance [Ohm]

PARALLEL

RESONANCE

ERA21

1pF

10pF

100pF

■ ESR-Frequency Characteristics

ERF Series

0.01

0.1

1

100M 1G 10G

Frequency [Hz]

ESR [Ohm]

measured by

BOONTON RESONANT

COAXIAL-LINE 34A

ERF1D

1pF

10pF

100pF

ERA Series

0.01

0.1

1

100M 1G 10G

Frequency [Hz]

ESR [Ohm]

measured by

BOONTON RESONANT

COAXIAL-LINE 34A

1pF

10pF

100pF

ERA21

Continued on the following page.

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!Note C02E10.pdf 04.1.20

ERA/ERD/ERF/ERH Series Data

80

13

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Continued from the preceding page.

■ Resonant Frequency-Capacitance

ERF Series

100M

1G

10G

100G

0.1 1 10 100 1000

Capacitance [pF]

Series Resonant Frequency fo [Hz]

ERF1D

ERF22

ERA Series

100M

1G

10G

100G

0.1 1 10 100 1000

Series Resonant Frequency fo [Hz]

ERA21

ERA32

Capacitance [pF]

■ Allowable Voltage-Frequency

0.1

1

10

100

10M 100M 1G 10G

Frequency [Hz]

Va [Vrms]

50V SERIES

[∆T=20˚C]

ERF1D

ERA21

ERF1D

ERF22

ERA32

GRM21

1000pF

100pF

10pF

■ Allowable Current-Frequency

10m

100m

1

10

10M 100M 1G 10G

Frequency [Hz]

Ia [Arms]

50V SERIES

[∆T=20˚C]

1000pF

100pF

10pF

GRM21

ERA32

ERF1D

ERA21

ERF1D

■ Allowable Apparent Power-Frequency

0.1

1

10

100

10M 100M 1G 10G

Frequency [Hz]

Pa [VA]

[∆T=20˚C]

ERF1D

GRM21

ERA21

ERA32

ERF22

GRM21

ERF1D

GRM21

1000pF

100pF

10pF

50V SERIES

■ Allowable Effective Power-Frequency

1m

10m

100m

1

10M 100M 1G 10G

Frequency [Hz]

Pe [W]

[∆T=20˚C]

ERF22

ERA32

GRM21

ERF1D

ERA21

ERF1D

GRM21

10pF

100pF

1000pF

50V SERIES

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Part Number Dimensions (mm)

WT

Bulk BagBulk Case

ø180mm reel

Paper Tape

Plastic Tape

Paper Tape

Plastic Tape

ø330mm reel

L

Quantity (pcs.)

Minimum Quantity Guide

Packaging Code

Packaging Type Bulk Packaging in a bag Bulk Packaging in a tray

Tape Carrier Packaging Bulk Case Packaging Bulk Packaging

Packaging Code BTD, L, K, J, E, F C

Continued on the following page.

1) Available in tape/reel only. 2) Tray 3) 3.3/4.7µF of 6.3 R6 rated are not available by bulk case.

Ultra Miniaturized

For Flow/Reflow

For Reflow

High Power Type

Smoothing 1)

High Frequency

For Ultrasonic

Micro Chip

Array

Low ESL

GRM03

GRM18

GRM21

GRM31

GRM155

GRM15X

GRM32

GRM43

GRM55

GJM03

GJ6/GJM15

GJ221

GJ231

GJ232

GJ243

GQM18

GQM21

ERA11

ERA21

ERA32

ERF1D

ERF22

GRM21

GMA05

GMA08

GNM1M

GNM31

GNM21

LLL18

LLL21

LLL31

0.6

1.6

2.0

3.2

1.0

3.2

4.5

5.7

0.6

1.0

2.0

3.2

4.5

1.6

2.0

1.25

2.0

3.2

1.4

2.8

2.0

0.5

0.8

1.37

3.2

2.0

0.8

1.25

1.6

0.3

0.8

1.25

1.6

0.5

2.5

3.2

5.0

0.3

0.5

1.25

1.6

2.5

3.2

0.8

1.25

1.0

1.25

2.5

1.4

2.8

1.25

0.5

0.8

1.0

1.6

1.25

1.6

2.0

3.2

0.3

0.8

0.6

0.85

1.0

1.25

0.6

0.85

1.15

1.6

0.5

0.25

1.15

1.35

1.8/1.6

2.0

2.5

1.15

2.5

2.8

1.15

2.5

3.2

0.3

0.5

1.25

1.15

1.35

1.6

1.8

2.2

0.8

0.85

1.0

1.0/1.25

1.7

1.15

2.3

0.85

0.35

0.5

0.6

0.8

1.0

0.6/0.85

0.6

0.85

0.7

1.15

1,000

500

1,000

-

1,000

400 2)

1,000

-

15,000

10,000

-

5,000 3)

-

50,000

-

50,000

-

50,000

10,000

-

10,000

-

50,000

-

50,000

-

10,000

-

10,000

-

10,000

-

10,000

-

10,000

-

10,000

6,000

-

10,000

8,000

4,000

5,000

4,000

2,000

1,500

5,000

4,000

2,000

1,500

-

10,000

8,000

6,000

4,000

3,000

2,000

-

10,000

-

10,000

15,000

4,000

-

4,000

-

10,000

-

15,000

10,000

-

4,000

-

4,000

-

4,000

-

4,000

-

3,000

-

3,000

2,000

-

3,000

2,000

1,000

500

1,000

500

300

-

3,000

2,000

1,000

500

-

3,000

2,000

1,000

-

3,000

-

4,000

3,000

4,000

3,000

1.35/1.6

1.8/2.0

1.35/1.6

1.8/2.0

Package

81

13

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Tape Carrier Packaging

(1) Dimensions of Reel

2.0±0.5

φ180mm Reel

10±1.5 for 8mm wide tape

14±1.5 for 12mm wide tape

178±2.0

50 min.

φ13.0±0.5

φ21.0±0.8

(2) Dimensions of Paper Tape

4.0±0.1

8mm width 4mm pitch Tape 8mm width 2mm pitch Tape

φ1.5+0.1

-0

4.0±0.1

1.75±0.1 1.1 max.

8.0±0.3

Direction of Feed

A

B

3.5±0.05

2.0±0.1

APart Number B

GRM18

GQM18

GNM1M

GRM21

(TV0.85mm)

GQM21

GNM21

GRM31

(TV0.85mm)

GNM31

(TV0.8mm)

GRM32

(T=0.85mm)

1.05±0.1

2.0±0.2

2.8±0.2

1.55±0.15

1.85±0.1

3.6±0.2

2.3±0.15

1.17±0.05 1.55±0.05

A*Part Number B*

GJM03

GRM03

GJM15

GRM15

0.37 0.67

0.65 1.15

*Nominal Value

(in mm)

2.0±0.05 φ1.5+0.1

-

0

A

3.5±0.05

4.0±0.1

2.0±0.1

8.0±0.3

1.75±0.1

0.5 max.

(GRM03/GJM03)

0.8 max.

(GRM15/GJM15)

Direction of Feed

B

φ330mm Reel

2.0±0.5

2.5±0.5

10±1.5 for 8mm wide tape

14±1.5 for 12mm wide tape

φ328±2.0

φ50 min.

φ13.0±0.5

φ21.0±0.8

Continued on the following page.

Continued from the preceding page.

Package

82

13

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

(3) Dimensions of Plastic Tape

8mm width 4mm pitch Tape 12mm width 8mm pitch Tape

APart Number B

GRM21

(TU1.0mm)

LLL21, GJ221

GRM31

(TU1.15mm)

LLL31

GNM31

(TU1.0mm)

GJ231

GRM32

(TU1.15mm)

GJ232

ERA21

ERA32

ERF1D

ERF22

1.45±0.2

2.8±0.2

1.8*

2.8*

2.0*

3.1*

1.9±0.2

2.25±0.2

3.5±0.2

2.6*

LLL18 1.05±0.1 1.85±0.1

3.5*

2.1*

3.2*

3.5±0.2

A*Part Number B*

GRM43, GJ243

GRM55

3.6 4.9

5.2 6.1

*Nominal Value

*Nominal Value (in mm)

4.0±0.1

1.75±0.1

8.0±0.3

Direction of feed

A

B

2.0±0.1 0.25±0.1(TV2.0mm)

0.3±0.1(T=2.5mm)

2.5 max.

φ1.5+0.1

-0

3.5±0.05

(3.0 max. T=1.8/2.0 rank)

(3.7 max. for TU2.5 mm)

8.0±0.1

4.0

±

0.1 1.75

±

0.1

12.0±0.3

Direction of feed

5.5±0.1

2.0±0.1 0.3±0.1

2.5 max.

for GRM43/GRM55

(3.7 max. for T=2.5mm)

(4.7 max. for TU3.0mm)

φ1.5+0.1

-0

A

B

(4) Taping Method

q Tapes for capacitors are wound clockwise. The

sprocket holes are to the right as the tape is pulled

toward the user.

w Part of the leader and part of the empty tape should be

attached to the end of the tape as follows.

e The top tape and base tape are not attached at the

end of the tape for a minimum of 5 pitches.

r Missing capacitors number within 0.1% of the number

per reel or 1 pc, whichever is greater, and are not

continuous.

t The top tape and bottom tape should not protrude

beyond the edges of the tape and should not cover

sprocket holes.

y Cumulative tolerance of sprocket holes, 10 pitches :

±0.3mm.

u Peeling off force : 0.1 to 0.6N* in the direction shown

below.

165 to 180˚

Base Tape

Top Tape

Direction of Feed

160 min. 190 min. 210 min.

(Top Tape alone)

(in mm)

Vacant Section Chip-mounting Unit Vacant Section

Leader unit

Continued on the following page.

Continued from the preceding page.

*GRM03

GJM03

}

: 0.05 to 0.5N

Package

83

13

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Dimensions of Bulk Case Packaging

The bulk case uses antistatic materials. Please contact

Murata for details.

6.8

8.8

12.0

2.0

3.0

1.5

110 (in mm)

36.0

31.5

Continued from the preceding page.

Package

84

13

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

!Caution

85

13

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

■ Storage and Operating Conditions

Chip monolithic ceramic capacitors (chips) can

experience degradation of termination solderability

when subjected to high temperature or humidity, or if

exposed to sulfur or chlorine gases.

Storage environment must be at an ambient temperature

of 5-40 degree C and an ambient humidity of 20-70%RH.

Use chip within 6 months. If 6 months or more have

elapsed, check solderability before use.

(Reference Data 1. Solderability)

FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY

RESULT, WORST CASE, IN A SHORT CIRCUIT

AND FUMING WHEN THE PRODUCTS IS USED.

■ Handling

1. Inspection

Thrusting force of the test probe can flex the

PCB, resulting in cracked chips or open solder

joints. Provide support pins on the back side of

the PCB to prevent warping or flexing.

2. Board Separation (or depanalization)

(1) Board flexing at the time of separation causes

cracked chips or broken solder.

(2) Severity of stresses imposed on the chip at the

time of board break is in the order of :

Pushback<Slitter<V Slot<Perforator.

(3) Board separation must be performed using special

jigs, not with hands.

3. Reel and bulk case

In the handling of reel and case, please be careful

and do not drop it.

Please do not use chips from a case which has been

dropped.

FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY

RESULT, WORST CASE, IN A SHORT CIRCUIT

AND FUMING WHEN THE PRODUCTS IS USED.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Choose a mounting position that minimizes the stress

imposed on the chip during flexing or bending of the

board.

(Reference Data 2. Board bending strength for solder fillet height)

(Reference Data 3. Temperature cycling for solder fillet height)

(Reference Data 4. Board bending strength for board material)

2. Solder Paste Printing

1. Mounting Position

Overly thick application of solder paste results in

excessive fillet height solder.

This makes the chip more susceptible to mechanical and

thermal stress on the board and may cause cracked

chips.

Too little solder paste results in a lack of adhesive

strength on the outer electrode, which may result in chips

breaking loose from the PCB.

Make sure the solder has been applied smoothly to the

end surface to a height of 0.2mm min.

Locate chip

horizontal to the

direction in

which stress

acts

Chip arrangement

Worst A-C-(B~D) Best

[Component Direction]

[Chip Mounting Close to Board Separation Point]

A

B

D

C

Perforation

Slit

[Optimum Solder Amount for Reflow Soldering]

0.2mm min.

Continued on the following page.

3. Chip Placing

An excessively low bottom dead point of the suction

nozzle imposes great force on the chip during mounting,

causing cracked chips. So adjust the suction nozzle's

bottom dead point by correcting warp in the board.

Normally, the suction nozzle's bottom dead point must be

set on the upper surface of the board. Nozzle pressure

for chip mounting must be a 1 to 3N static load.

Dirt particles and dust accumulated between the suction

nozzle and the cylinder inner wall prevent the nozzle from

moving smoothly. This imposes great force on the chip

during mounting, causing cracked chips. And the locating

claw, when worn out, imposes uneven forces on the chip

when positioning, causing cracked chips. The suction

nozzle and the locating claw must be maintained,

checked and replaced periodically.

(Reference Data 5. Break strength)

Board Guide

[Correct]

Suction Nozzle

Board

Support Pin

[Incorrect]

Deflection

■ Soldering and Mounting

■ Notice(Soldering and Mounting)

!Caution

86

13

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

4. Reflow Soldering

Sudden heating of the chip results in distortion due to

excessive expansion and construction forces within the

chip causing cracked chips. So when preheating, keep

temperature differential, ∆T, within the range shown in

Table 1. The smaller the ∆T, the less stress on the chip.

When components are immersed in solvent after

mounting, be sure to maintain the temperature difference

(∆T) between the component and solvent within the

range shown in the above table.

GRM03/15/18/21/31

GJ615, GJ221/31

LLL18/21/31

ERA11/21/32, ERF1D

GQM18/21

GRM32/43/55

GNM, GJ232/43

ERA32, ERF22

∆TV190D

∆TV130D

Part Number Temperature Differential

Table 1

[Standard Conditions for Reflow Soldering]

[Allowable Soldering Temperature and Time]

In case of repeated soldering, the accumulated

soldering time must be within the range shown above.

Infrared Reflow

Vapor Reflow

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∆T

60 seconds min.

120 seconds max.

20 seconds max.

Soldering

Gradual

cooling

(in the air)

60 seconds min.

120 seconds max. 20-40 seconds

,

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∆T

SolderingGradual

cooling

(in the air)

Preheating

200D

Time

Temperature (D)

,

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Soldering time (sec.)

260

270

250

240

230

0306090

Soldering temperature (D)

Inverting the PCB

Make sure not to impose an abnormal mechanical shock on

the PCB.

Continued from the preceding page.

5. Leaded Component Insertion

If the PCB is flexed when leaded components (such as

transformers and ICs) are being mounted, chips may

crack and solder joints may break.

Before mounting leaded components, support the PCB

using backup pins or special jigs to prevent warping.

Continued on the following page.

!Caution

87

13

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Optimum Solder Amount for Flow Soldering

6. Flow Soldering

Sudden heating of the chip results in thermal distortion

causing cracked chips. And an excessively long soldering

time or high soldering temperature results in leaching of

the outer electrodes, causing poor adhesion or a

reduction in capacitance value due to loss of contact

between electrodes and end termination.

When preheating, keep the temperature differential

between solder temperature and chip surface

temperature, ∆T, within the range shown in Table 2. The

smaller the ∆T, the less stress on the chip.

When components are immersed in solvent after

mounting, be sure to maintain the temperature difference

between the component and solvent within the range

shown in Table 2.

Do not apply flow soldering to chips not listed in Table 5.

GRM18/21/31

LLL21/31

ERA11/21, ERF1D

GQM18/21

∆TV150D

Part Number Temperature Differential

Table 2

[Standard Conditions for Flow Soldering]

[Allowable Soldering Temperature and Time]

In case of repeated soldering, the accumulated

soldering time must be within the range shown above.

Soldering

Gradual

Cooling

(in the air)

Preheating

60

-

120 seconds

∆T

5 seconds max.

Temperature (D)

,

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Time

,,

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Soldering Time (sec.)

260

270

250

240

230

0102030

Soldering Temperature (D)

Up to Chip Thickness

Adhesive

Continued from the preceding page.

Continued on the following page.

!Caution

88

13

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Optimum Solder Amount when Corrections Are Made

Using a Soldering lron

Up to Chip Thickness

7. Correction with a Soldering Iron

(1) For Chip Type Capacitors <Except GJ2 Series>

Sudden heating of the chip results in distortion due to a

high internal temperature differential, causing cracked

chips. When preheating, keep temperature differential,

∆T, within the range shown in Table 3. The smaller the

∆T, the less stress on the chip.

[Standard Conditions for Soldering lron Temperature]

GRM15/18/21/31

GJ615

LLL18/21/31

GQM18/21

ERA11/21, ERF1D

GRM32/43/55

GNM

ERA32, ERF22

∆TV190D

∆TV130D

Part Number Temperature Differential

Table 3

[Allowable Time and Temperature for Making

Corrections with a Soldering lron]

The accumulated soldering Time / temperature including reflow /

flow soldering must be within the range shown above.

Soldering

Preheating

Gradual

Cooling

(in the air)

60

-

120 seconds

∆T

Temperature (D)

,

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Time

20 seconds max.

,

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Soldering Time (sec.)

260

270

250

240

230

0306090

Soldering Temperature (D)

Continued on the following page.

Continued from the preceding page.

(3) For Microstrip Types

Solder 1mm away from the ribbon terminal base, being

careful that the solder tip does not directly contact the

capacitor. Preheating is unnecessary.

Complete soldering within 3 seconds with a soldering tip

less than 270°C in temperature.

(2) For GJ2 Series

When solder GJ2 series chip capacitor, keep the following conditions.

GJ221/31/32/43 ∆V130D300D max. 20W max. φ 3mm max. Do not allow the iron tip to

directly touch the ceramic

element.

Part Number Pre-heating Temperature

of iron tip Soldering iron

wattage Diameter of iron tip

5 sec. max.

Soldering time

V1/2 of chip

thickness

Soldering amount Restriction

!Caution

89

13

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

8. Washing

Excessive output of ultrasonic oscillation during cleaning

causes PCBs to resonate, resulting in cracked chips or

broken solder. Take note not to vibrate PCBs.

Failure to follow the above cautions may result, worst case,

in a short circuit and fuming when the product is used.

Continued from the preceding page.

!Caution

90

13

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Notice

91

13

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

■ Rating

Die Bonding/Wire Bonding (GMA Series)

1. Die Bonding of Capacitors

•Use the following materials Braze alloy :

Au-Si (98/2) 400 to 420 degree C in N2 atmosphere

Au-Sn (80/20) 300 to 320 degree C in N2 atmosphere

Au-Ge (88/12) 380 to 400 degree C in N2 atmosphere

•Mounting

(1) Control the temperature of the substrate so

that it matches the temperature of the braze

alloy.

(2) Place braze alloy on substrate and place the

capacitor on the alloy. Hold the capacitor and

gently apply the load. Be sure to complete the

operation in 1 minute.

2. Wire Bonding

•Wire

Gold wire :

20mm (0.0008 inch), 25mm (0.001 inch) diameter

•Bonding

(1) Thermocompression, ultrasonic ball bonding.

(2) Required stage temperature : 150 to 250 degree C

(3) Required wedge or capillary weight : 0.5N to 2N.

(4) Bond the capacitor and base substrate or other

devices with gold wire.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

■ Soldering and Mounting

(1) Notice for Pattern Forms

1. PCB Design

Unlike leaded components, chip components are

susceptible to flexing stresses since they are mounted

directly on the substrate.

They are also more sensitive to mechanical and thermal

stresses than leaded components.

Excess solder fillet height can multiply these stresses and

cause chip cracking. When designing substrates, take

land patterns and dimensions into consideration to

eliminate the possibility of excess solder fillet height.

Pattern Forms

Incorrect

Correct

Lead Wire

Solder Resist

Chassis

Solder (ground)

Electrode Pattern

Solder

Resist

Soldering Iron

Lead Wire

Solder Resist Solder Resist

Placing Close to Chassis Placing of Chip Components

and Leaded Components Placing of Leaded Components

after Chip Component Lateral Mounting

Continued on the following page.

■ Notice(Soldering and Mounting)

Notice

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

GRM18

GQM18

GRM21

GQM21

GRM18

GQM18

GRM31

LLL21

LLL31

ERA11

ERA21

ERF1D

1.6g0.8 0.6e1.0 0.8e0.9 0.6e0.8

2.0g1.25 1.0e1.2 0.9e1.0 0.8e1.1

3.2g1.6 2.2e2.6 1.0e1.1 1.0e1.4

1.25g2.0 0.4e0.7 0.5e0.7 1.4e1.8

1.6g3.2 0.6e1.0 0.8e0.9 2.6e2.8

1.25g1.0 0.4e0.6 0.6e0.8 0.8e1.0

2.0g1.25 1.0e1.2 0.9e1.0 0.8e1.0

1.4g1.4 0.5e0.8 0.8e0.9 1.0e1.2

(in mm)

(2) Land Dimensions

Part Number Dimensions Dimensions (LgW)abc

Table 1 Flow Soldering Method

GRM21

GQM21

GJ221

GRM31

GJ231

GRM32

GRM03

GRM55

LLL18

LLL21

LLL31

ERA11

ERA21

ERA32

ERF1D

ERF22

GRM15

GRM43

GJ232

GJ243

0.6g0.3

1.0g0.5

1.6g0.8

2.0g1.25

3.2g1.6

3.2g2.5

4.5g3.2

5.7g5.0

0.8g1.6

1.25g2.0

0.2e0.3

0.3e0.5

0.6e0.8

1.0e1.2

2.2e2.4

2.0e2.4

3.0e3.5

4.0e4.6

0.2e0.4

0.4e0.6

0.6e0.8

0.4e0.6

1.0e1.2

2.2e2.5

0.4e0.8

1.8e2.1

0.2e0.35

0.35e0.45

0.6e0.7

0.8e0.9

1.0e1.2

1.2e1.4

1.4e1.6

0.3e0.4

0.3e0.5

0.6e0.7

0.6e0.8

0.8e1.0

0.6e0.8

0.7e0.9

0.2e0.4

0.4e0.6

0.6e0.8

0.8e1.1

1.0e1.4

1.8e2.3

2.3e3.0

3.5e4.8

1.0e1.4

1.4e1.8

2.6e2.8

0.8e1.0

1.9e2.3

1.0e1.2

2.2e2.6

1.6g3.2

1.25g1.0

2.0g1.25

3.2g2.5

1.4g1.4

2.8g2.8 (in mm)

Part Number Dimensions Dimensions (LgW)abc

Table 2 Reflow Soldering Method

Chip Capacitor

c

ba

Land

Solder Resist

Continued from the preceding page.

Continued on the following page.

Notice

93

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

GNM Series for reflow soldering method

GNM1M2

GNM212

GNM214

GNM314

1.37

2.0

3.2

1.0

1.25

1.6

0.45~0.5

0.6~0.7

0.8~1.0

0.5~0.55

0.5~0.7

0.7~0.9

0.3~0.35

0.4~0.5

0.25~0.35

0.3~0.4

0.64+/-0.1

1.0+/-0.1

0.5+/-0.05

0.8+/-0.05

Part Number LWabcp

Dimensions (mm)

Table 3

a

Land

Chip Capacitor

b

cp

Continued from the preceding page.

3. Adhesive Curing

Insufficient curing of the adhesive causes chips to

disconnect during flow soldering and causes deteriorated

insulation resistance between outer electrodes due to

moisture absorption.

Control curing temperature and time in order to prevent

insufficient hardening.

2. Adhesive Application

Thin or insufficient adhesive causes chips to loosen or

become disconnected when flow soldered. The amount

of adhesive must be more than dimension C shown in the

drawing below to obtain enough bonding strength.

The chip's electrode thickness and land thickness must

be taken into consideration.

Low viscosity adhesive causes chips to slip after

mounting. Adhesive must have a viscosity of 5000Pa•s

(500ps) min. (at 25D)

Land

Adhesive

Board

Chip Capacitor

a

b

c

c : 50 to 105 µm

b : 30 to 35 µm

a : 20 to 70 µm

Inverting the PCB

Make sure not to impose an abnormal mechanical shock on

the PCB.

Continued on the following page.

GRM18

GQM18

GRM21

GQM21

GRM31

0.05mg Min.

0.1mg Min.

0.15mg Min.

Part Number Adhesive Coverage*

Adhesive Coverage*

*Nominal Value

a

Chip Capacitor

b

cpLand

GNMpp2GNMpp4

Notice

94

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Set temperature and time to ensure that leaching of the

outer electrode does not exceed 25% of the chip end

area as a single chip (full length of the edge A-B-C-D

shown below) and 25% of the length A-B shown below as

mounted on substrate.

(Reference Data 6. Thermal shock)

(Reference Data 7. Solder heat resistance)

[As a Single Chip]

[As Mounted on Substrate]

5. Flow Soldering

A

B

C

D

Outer Electrode

A

B

Continued from the preceding page.

4. Flux Application

An excessive amount of flux generates a large quantity of

flux gas, causing deteriorated solderability. So apply flux

thinly and evenly throughout. (A foaming system is

generally used for flow soldering).

Flux containing too high a percentage of halide may

cause corrosion of the outer electrodes unless sufficiently

cleaned. Use flux with a halide content of 0.2wt% max.

But do not use strong acidic flux.

Wash thoroughly because water soluble flux causes

deteriorated insulation resistance between outer

electrodes unless sufficiently cleaned.

Notice

95

13

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Notice

96

13

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

■ Others

1. Resin Coating

When selecting resin materials, select those with

low contraction.

2. Circuit Design

The capacitors listed in the previous sections of

this catalog are not safety recognized products.

3. Remarks

The above notices are for standard applications and

conditions. Contact us when the products are used

in special mounting conditions. Select optimum

conditions for operation as they determine the

reliability of the product after assembly.

The data herein are given in typical values, not

guaranteed ratings.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

1

GRM21 for flow/reflow soldering 95 to 100% 95 to 100% 95% 90 to 95% 95%

1. Solderability

(1) Test Method

Subject the chip capacitor to the following conditions.

Then apply flux (a ethanol solution of 25% rosin) to the

chip and dip it in 230D eutectic solder for 2 seconds.

Conditions :

Expose prepared at room temperature (for 6 months and

12 months, respectively)

Prepared at high temperature (for 100 hours at 85D)

Prepared left at high humidity (for 100 hours under

90%RH to 95%RH at 40D)

(2) Test Samples

GRM21 : Products for flow/reflow soldering.

(3) Acceptance Criteria

With a 60-power optical microscope, measure the surface

area of the outer electrode that is covered with solder.

(4) Results

Refer to Table 1.

Sample Initial State

Prepared at Room Temperature

6 months 12 months

Prepared at High Humidity

for 100 Hours at 90 to

95% RH and 40D

Prepared at High

Temperature for

100 Hours at 85D

Table 1

2. Board Bending Strength for Solder Fillet Height

(1) Test Method

Solder the chip capacitor to the test PCB with the amount

of solder paste necessary to achieve the fillet heights.

Then bend the PCB using the method illustrated and

measure capacitance.

(2) Test Samples

GRM21 C0G/X7R/Y5V Characteristics T=0.6mm

(3) Acceptance Criteria

Products shall be determined to be defective if the

change in capacitance has exceeded the values specified

in Table 2.

Characteristics Change in Capacitance

C0G Within T5% or T0.5pF, whichever is greater

Within T12.5%

Within T20%

X7R

Y5V

Table 2

Capacitor

Supporting

Base

45 45

Capacitance Meter

Flexure

20 50

R230

Pressurizing

Speed : 1.0mm/sec.

Note : The material of pressure application jig and

support is the quenched metal.

(hardness HB 183

-

255 or superhardness

HRA90 or more)

Solder Amount Larger Fillet.

Fillet up to Chip

Thickness

Pressurize

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Material : Glass Epoxy

: Copper Foil (0.35mm thick)

: Solder Resist

100 4.0

40

1.6

1.0

1.65

1.2

(in mm)

Continued on the following page.

Reference Data

97

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

(4) Results

GRM21 C0G (T=0.6) GRM21 X7R (T=0.6)

GRM21 Y5V (T=0.6)

3. Temperature Cycling for Solder Fillet Height

(1) Test Method

Solder the chips to the substrate various test fixtures

using sufficient amounts of solder to achieve the required

fillet height. Then subject the fixtures to the cycle

illustrated below 200 times.



q Solder Amount

Alumina substrates are typically designed for reflow

soldering.

Glass epoxy or paper phenol substrates are typically

used for flow soldering.

w Material

Alumina (Thickness : 0.64mm)

Glass epoxy (Thickness : 1.6 mm)

Paper phenol (Thickness : 1.6 mm)



e Land Dimension

Solder Amount

q

w

e

Alumina

Substrate

Solder to be used

Glass Epoxy

or Paper Phenol

0.5T

0.7T

T

1.3T

1.6T

6Z4 Eutectic solder

[Solder Amount]

0

20

40

60

80

100

02468

Flexure (mm)

0

20

40

60

80

100

02468

0

20

40

60

80

100

02468

Survival Rate (%)

Flexure (mm)

Survival Rate (%)

Flexure (mm)

Survival Rate (%)

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Fillet up to Chip

Thickness

Larger Fillet

Fillet up to Chip

Thickness

Fillet up to Chip

Thickness

[Temperature Cycling]

+125D

Room Temperature

-

55D

Time (min.)

30 5 305

Ag/Pd=72/28

Thickness : 10 to 12µm

Cu

Thickness : 35

µm

Alumina

Substrate

Glass Epoxy

Substrate

Paper Phenol

Substrate

[Land Dimension]

1.5 1.51.2

1.5

Land Pattern

Continued from the preceding page.

Continued on the following page.

(in mm)

Reference Data

98

13

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Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

(4) Results

(2) Test Samples

GRM40 C0G/X7R/Y5V Characteristics T=0.6mm

(3) Acceptance Criteria

Products are determined to be defective if the change in

capacitance has exceeded the values specified in Table

3.

Characteristics Change in Capacitance

C0G Within T2.5% or T0.25pF, whichever is greater

Within T7.5%

Within T20%

X7R

Y5V

Table 3

Alumina Substrate

Glass Epoxy Substrate

Paper Phenol Substrate

GRM21 C0G (T=0.6)

qw

e

100

80

60

40

20

00 50 100 150 200

Number of Cycles

Accumulated Per-

cent Defective (%)

GRM21 X7R (T=0.6)

q

w

e

100

80

60

40

20

00 50 100 150 200

Number of Cycles

Accumulated Per-

cent Defective (%)

GRM21 Y5V (T=0.6)

q

w

e

100

80

60

40

20

00 50 100 150 200

Number of Cycles

Accumulated Per-

cent Defective (%)

GRM21 X7R (T=0.6)

qw

e

100

80

60

40

20

00 50 100 150 200

Number of Cycles

Accumulated Per-

cent Defective (%)

GRM21 Y5V (T=0.6)

qw

e

100

80

60

40

20

00 50 100 150 200

Number of Cycles

Accumulated Per-

cent Defective (%)

GRM21 C0G (T=0.6)

qwe

100

80

60

40

20

00 50 100 150 200

Number of Cycles

Accumulated Per-

cent Defective (%)

GRM21 C0G (T=0.6)

qw

100

80

60

40

20

00 50 100 150 200

Number of Cycles

Accumulated Per-

cent Defective (%)

e

GRM21 X7R (T=0.6)

qw

100

80

60

40

20

00 50 100 150 200

Number of Cycles

Accumulated Per-

cent Defective (%)

e

GRM21 Y5V (T=0.6)

qw

100

80

60

40

20

00 50 100 150 200

Number of Cycles

Accumulated Per-

cent Defective (%)

e

Continued from the preceding page.

Continued on the following page.

Reference Data

99

13

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Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

4. Board Bending Strength for Board Material

(1) Test Method

Solder the chip to the test board. Then bend the board

using the method illustrated below, to measure

capacitance.

(2) Test Samples

GRM21 C0G/X7R/Y5V Characteristics T=0.6mm typical

(3) Acceptance Criteria

Products shall be determined to be defective if the

change in capacitance has exceeded the values specified

in Table 4.

(4) Results

C0G

X7R

Y5V

Table 4

GRM21 C0G (T=0.6) GRM21 X7R (T=0.6)

GRM21 Y5V (T=0.6)

Capacitor

Supporting

Base

45 45

Capacitance Meter

Flexure

20 50

R230

Pressurizing

Speed : 1.0mm/sec.

Note : Material of the pressurizing jig and

the supporting base must be hardened steel

(Hardness : HB183 to 255 or carbide Hardness

: HRA90 min.)

Solder Amount

(in mm)

Up to Chip

Thickness

Pressurize

,,

,

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: Copper Foil (0.035mm thick)

: Solder Resist

100 4.0

40

1.6

1.0

1.65

1.2

Characteristics Change in Capacitance

Within T5% or T0.5pF, whichever is greater

Within T12.5%

Within T20%

0

20

40

60

80

100

02468

Flexure (mm)

0

20

40

60

80

100

02468

0

20

40

60

80

100

02468

Survival Rate (%)

Flexure (mm)

Survival Rate (%)

Flexure (mm)

Survival Rate (%)

,

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Paper Phenol

Glass Epoxy

Paper Phenol

Glass Epoxy

Continued from the preceding page.

Continued on the following page.

Reference Data

100

13

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Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

5. Break Strength

(1) Test Method

Place the chip on a steel plate as illustrated on the right.

Increase load applied to a point near the center of the

test sample.

(2) Test Samples

GRM21 C0G/X7R/Y5V Characteristics

GRM31 C0G/X7R/Y5V Characteristics

(3) Acceptance Criteria

Define the load that has caused the chip to break or

crack, as the bending force.

(4) Explanation

Break strength, P, is proportionate to the square of the

thickness of the ceramic element and is expressed as a

curve of secondary degree.

The formula is :

W : Width of ceramic element (mm)

T : Thickness of element (mm)

L : Distance between fulcrums (mm)

γ : Bending stress (N/mm2)

(5) Results

Chip Size

LW C0G

Charac-

teristics

X7R

Charac-

teristics

γ

Y5V

Charac-

teristics

GRM21

2.7 1.5

1.5 1.2 300 180 160

GRM31

P= (N)

2γWT2

3L

W

T

L

(in mm)

GRM21 GRM31

6. Thermal Shock

(1) Test method

After applying flux (an ethanol solution of 25% rosin), dip

the chip in a solder bath (6Z4 eutectic solder) in

accordance with the following

conditions :

(2) Test samples

GRM21 C0G/X7R/Y5V Characteristics T=0.6mm typical

(3) Acceptance criteria

Visually inspect the test sample with a 60-power optical

microscope. Chips exhibiting breaks or cracks shall be

determined to be defective.

,

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Storage

scope Amplifier

Load cell

Sample

Steel plate

P Pressurizing

speed : 2.5mm/sec. Loading Jig End

φ1.0mm

P0.5mm

0

20

40

60

80

100

120

140 X7R Y5V

0 0.4 0.8 1.2 1.6

Thickness of Ceramic Element (mm)

Bending-break Strength (N)

C0G

Y5V

X7R

C0G

0

20

40

60

80

100

120

140

0 0.4 0.8 1.2 1.6

Thickness of Ceramic Element (mm)

Bending-break Strength (N)

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Dipping Speed : 25mm/sec.

Chip Capacitor

Solder Bath

Solder

Temperature

Natural

Cooling

2 sec. Time

25D

∆T

Temperature

Continued from the preceding page.

Continued on the following page.

Reference Data

101

13

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

7. Solder Heat Resistance

(1) Test Method

q Reflow soldering :

Apply about 300 µm of solder paste over the alumina

substrate. After reflow soldering, remove the chip and

check for leaching that may have occurred on the

outer electrode.

w Flow soldering :

After dipping the test sample with a pair of tweezers in

wave solder (eutectic solder), check for leaching that

may have occurred on the outer electrode.

(2) Test samples

GRM21 : For flow/reflow soldering T=0.6mm

(3) Acceptance criteria

The starting time of leaching should be defined as the

time when the outer electrode has lost 25 % of the total

edge length of A-B-C-D as illustrated :

e Dip soldering :

After dipping the test sample with a pair of tweezers in

static solder (eutectic solder), check for leaching that

may have occurred on the outer electrode.

r Flux to be used : An ethanol solution of 25% rosin.

(4) Results

Reflow Soldering

Dip Soldering

Flow Soldering

0

20

40

60

80

100

200 240 280 320 360

Temperature Differential ∆T (D)

Incidence of Cracks (%)

Y5V

X7R

C0G

A

B

C

D

Outer Electrode

280

270

260

250

240

230

220

2100

Leaching Starting Time (sec.)

280

270

260

250

240

230

220

2100 102030405060

280

270

260

250

240

230

220

2100 102030405060

60 120 180 240

Soldering Temperature (D)

Leaching Starting Time (sec.)

Soldering Temperature (D)

Leaching Starting Time (sec.)

Soldering Temperature (D)

Continued from the preceding page.

Continued on the following page.

Reference Data

102

13

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

8. Thermal Shock when Making Corrections with a

Soldering Iron

(1) Test Method

Apply a soldering iron meeting the conditions below to

the soldered joint of a chip that has been soldered to a

paper phenol board, while supplying wire solder. (Note:

the soldering iron tip should not directly touch the ceramic

element of the chip.)

(2) Test Samples

GRM21 C0G/X7R/Y5V Characteristics T=0.6mm

(3) Acceptance Criteria for Defects

Observe the appearance of the test sample with a

60-power optical microscope. Those units displaying any

breaks or cracks are determined to be defective.

(4) Results

Soldering Iron Tip diameter

Ceramic heater 20W φ3mm

GRM21 C0G (T=0.6) GRM21 X7R (T=0.6)

GRM21 Y5V (T=0.6)

Mounting Solder

Paper Phenol Substrate

Wire Solder Soldering lron

Duration of

Touching :

Approx. 3 sec.

100

200 Soldering Iron Tip Temperature (D)

80

60

40

20

0240 280 320 360

100

200

80

60

40

20

0240 280 320 360

100

200

80

60

40

20

0240 280 320 360

Incidence of Cracks (D)

Soldering Iron Tip Temperature (D)

Incidence of Cracks (D)

Soldering Iron Tip Temperature (D)

Incidence of Cracks (D)

Continued from the preceding page.

Reference Data

103

13

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

104

14

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Chip Monolithic Ceramic Capacitors

Medium-voltage Low Dissipation Factor

■ Features

1. Murata's original internal electrode structure

realizes high flash-over voltage.

2. A new monolithic structure for small, surface-

mountable devices capable of operating at high

voltage levels.

3. Sn-plated external electrodes realize good

solderability.

4. Use the GRM31 type with flow or reflow soldering,

and other types with reflow soldering only.

5. Low-loss and suitable for high frequency circuits.

6. The temperature characteristics C0G and SL are

temperature compensating type, and R is high

dielectric constant type.

■ Applications

1. Ideal for use on high frequency pulse circuits such

as snubber circuits for switching power supplies,

DC/DC converters, ballasts (inverter fluorescent

lamps), etc.

2. Ideal for use as the ballast in liquid crystal back

lighting inverters.

3. Please contact our sales representatives or

engineers before using our products for other

applications not specified above.

Part Number LW T

Dimensions (mm) e min. g min.

1.5*

3.2 ±0.2 1.6 ±0.2

2.5 ±0.2

2.0 ±0.2

3.2 ±0.3

0.3 1.8

2.9

GRM32Q

GRM42A

GRM42B

GRM31B

GRM31A

GRM42D

GRM43D

GRM43E

3.2 ±0.2

4.5 ±0.3

4.5 ±0.3 2.0 ±0.3

* GRM31B1X3D : 1.8mm min.

L

T

W

e eg

1.0 +0,-0.3

1.5 +0,-0.3

2.0 +0,-0.3

2.5 +0,-0.3

1.25 +0,-0.3

Part Number Rated Voltage

(V) TC Code

(Standard) Capacitance

(pF) Length L

(mm) Width W

(mm) Thickness T

(mm)

Electrode g

min.

(mm)

Electrode e

(mm)

GRM31AR32J101KY01D DC630 R (JIS) 100 ±10% 3.2 1.6 1.0 1.5 0.3 min.

GRM31AR32J151KY01D DC630 R (JIS) 150 ±10% 3.2 1.6 1.0 1.5 0.3 min.

GRM31AR32J221KY01D DC630 R (JIS) 220 ±10% 3.2 1.6 1.0 1.5 0.3 min.

GRM31AR32J331KY01D DC630 R (JIS) 330 ±10% 3.2 1.6 1.0 1.5 0.3 min.

GRM31BR32J471KY01L DC630 R (JIS) 470 ±10% 3.2 1.6 1.25 1.5 0.3 min.

GRM31BR32J681KY01L DC630 R (JIS) 680 ±10% 3.2 1.6 1.25 1.5 0.3 min.

GRM31BR32J102KY01L DC630 R (JIS) 1000 ±10% 3.2 1.6 1.25 1.5 0.3 min.

GRM31AR33A470KY01D DC1000 R (JIS) 47 ±10% 3.2 1.6 1.0 1.5 0.3 min.

GRM31AR33A680KY01D DC1000 R (JIS) 68 ±10% 3.2 1.6 1.0 1.5 0.3 min.

GRM31AR33A101KY01D DC1000 R (JIS) 100 ±10% 3.2 1.6 1.0 1.5 0.3 min.

GRM31AR33A151KY01D DC1000 R (JIS) 150 ±10% 3.2 1.6 1.0 1.5 0.3 min.

GRM31AR33A221KY01D DC1000 R (JIS) 220 ±10% 3.2 1.6 1.0 1.5 0.3 min.

GRM31AR33A331KY01D DC1000 R (JIS) 330 ±10% 3.2 1.6 1.0 1.5 0.3 min.

GRM31BR33A471KY01L DC1000 R (JIS) 470 ±10% 3.2 1.6 1.25 1.5 0.3 min.

GRM31B1X3D100JY01L DC2000 SL (JIS) 10 ±5% 3.2 1.6 1.25 1.8 0.3 min.

GRM31B1X3D120JY01L DC2000 SL (JIS) 12 ±5% 3.2 1.6 1.25 1.8 0.3 min.

GRM31B1X3D150JY01L DC2000 SL (JIS) 15 ±5% 3.2 1.6 1.25 1.8 0.3 min.

GRM31B1X3D180JY01L DC2000 SL (JIS) 18 ±5% 3.2 1.6 1.25 1.8 0.3 min.

GRM31B1X3D220JY01L DC2000 SL (JIS) 22 ±5% 3.2 1.6 1.25 1.8 0.3 min.

GRM32Q1X3D270JY01L DC2000 SL (JIS) 27 ±5% 3.2 2.5 1.5 1.8 0.3 min.

GRM32Q1X3D330JY01L DC2000 SL (JIS) 33 ±5% 3.2 2.5 1.5 1.8 0.3 min.

GRM32Q1X3D390JY01L DC2000 SL (JIS) 39 ±5% 3.2 2.5 1.5 1.8 0.3 min.

GRM32Q1X3D470JY01L DC2000 SL (JIS) 47 ±5% 3.2 2.5 1.5 1.8 0.3 min.

GRM32Q1X3D560JY01L DC2000 SL (JIS) 56 ±5% 3.2 2.5 1.5 1.8 0.3 min.

Continued on the following page.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

105

14

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Part Number Rated Voltage

(V) TC Code

(Standard) Capacitance

(pF) Length L

(mm) Width W

(mm) Thickness T

(mm)

Electrode g

min.

(mm)

Electrode e

(mm)

Continued from the preceding page.

GRM32Q1X3D680JY01L DC2000 SL (JIS) 68 ±5% 3.2 2.5 1.5 1.8 0.3 min.

GRM32Q1X3D820JY01L DC2000 SL (JIS) 82 ±5% 3.2 2.5 1.5 1.8 0.3 min.

GRM43D1X3D121JY01L DC2000 SL (JIS) 120 ±5% 4.5 3.2 2.0 2.9 0.3 min.

GRM43D1X3D151JY01L DC2000 SL (JIS) 150 ±5% 4.5 3.2 2.0 2.9 0.3 min.

GRM43D1X3D181JY01L DC2000 SL (JIS) 180 ±5% 4.5 3.2 2.0 2.9 0.3 min.

GRM43D1X3D221JY01L DC2000 SL (JIS) 220 ±5% 4.5 3.2 2.0 2.9 0.3 min.

GRM42A5C3F100JW01L DC3150 C0G (EIA) 10 ±5% 4.5 2.0 1.0 2.9 0.3 min.

GRM42A5C3F120JW01L DC3150 C0G (EIA) 12 ±5% 4.5 2.0 1.0 2.9 0.3 min.

GRM42A5C3F150JW01L DC3150 C0G (EIA) 15 ±5% 4.5 2.0 1.0 2.9 0.3 min.

GRM42A5C3F180JW01L DC3150 C0G (EIA) 18 ±5% 4.5 2.0 1.0 2.9 0.3 min.

GRM42A5C3F220JW01L DC3150 C0G (EIA) 22 ±5% 4.5 2.0 1.0 2.9 0.3 min.

GRM42D1X3F560JY02L DC3150 SL (JIS) 56 ±5% 4.5 2.0 2.0 2.9 0.3 min.

GRM42D1X3F680JY02L DC3150 SL (JIS) 68 ±5% 4.5 2.0 2.0 2.9 0.3 min.

GRM42D1X3F820JY02L DC3150 SL (JIS) 82 ±5% 4.5 2.0 2.0 2.9 0.3 min.

GRM43E1X3F101JY01L DC3150 SL (JIS) 100 ±5% 4.5 3.2 2.5 2.9 0.3 min.

Please contact us for SL characteristics information.

DC3150V items are considered to use for the application which is not LCD back lighting inverters circuit.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Within the specified dimension

No defects or abnormalities

Y55 to W125D

Operating

Temperature Range

Appearance

Dimensions

Dielectric Strength

1

2

3

4

Using calipers

No failure should be observed when voltage in Table is applied

between the terminations for 1 to 5 sec., provided the charge/

discharge current is less than 50mA.

Visual inspection

Continued on the following page.

No removal of the terminations or other defect should occur.

Adhesive Strength

of Termination

9

Solder the capacitor to the testing jig (glass epoxy board) shown

in Fig. 1 using a eutectic solder.

Then apply 10N force in the direction of the arrow.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

10N, 10T1s

Speed : 1.0mm/s

Glass Epoxy Board

More than 10,000MΩ

Insulation Resistance

(I.R.)

5The insulation resistance should be measured with DC500T50V

and within 60T5 sec. of charging.

C0G char. : QU1,000

SL char. :

CU30pF : QU1,000

CF30pF : QU400W20C*2

D.F.V0.01

Within the specified tolerance

Capacitance

Q/

Dissipation

Factor (D.F.)

6

7

The capacitance/Q/D.F. should be measured at 20Dat the

frequency and voltage shown as follows.

(1) Temperature Compensating Type

Frequency : 1T0.2MHz

Voltage : AC0.5 to 5V (r.m.s.)

(2) High Dielectric Constant Type

Frequency : 1T0.2kHz

Voltage : AC1T0.2V (r.m.s.)

#Pretreatment

Perform a heat treatment at 150 Dfor 60T5 min. and

then let sit for 24T2 hrs. at *1room condition.

W0

Y10

Temp. Coefficient

C0G char. :

0T30ppm/°C

(Temp. Range :-55 to +125°C)

SL char. :

W350 to Y1,000 ppm/D

(Temp. Range : W20 to W85D)

Cap. Change

Within T15%

Capacitance

Temperature

Characteristics

8

(1) Temperature Compensating Type

The temperature coefficient is determined using the

capacitance measured in step 3 as a reference.

When cycling the temperature sequentially from step 1

through 5 (SL : W20 to W85 D) the capacitance should be

within the specified tolerance for the temperature coefficient.

(2) High Dielectric Constant Type

The range of capacitance change compared to the 20Dvalue

within Y55 to W125Dshould be within the specified range.

#Pretreatment

Perform a heat treatment at 150 Dfor 60T5 min. and

then let sit for 24T2 hrs. at *1room condition.

W0

Y10

Fig. 1

No. Item

Specifications

Test Method

Temperature Compensating

Type (C0G, SL Char.) High Dielectric

Constant Type (R Char.)

Rated voltage

DC630V

DC1kV, DC2kV

DC3.15kV

Test voltage

150% of the rated voltage

120% of the rated voltage

DC4095V

Step

1

2

3

4

5

20T2 (25T2 for C0G char.)

Min. Operating Temp.T3

20T2 (25T2 for C0G char.)

Max. Operating Temp.T2

20T2 (25T2 for C0G char.)

Temperature (D)

*1 "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

*2 "C" expresses nominal capacitance value (pF).

Specifications and Test Methods

106

14

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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Continued from the preceding page.

Continued on the following page.

Fig. 2

75% of the terminations are to be soldered evenly

and continuously.

Solderability of

Termination

12

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion). Immerse in

eutectic solder solution for 2T0.5 sec. at 235T5D.

Immersing speed : 25T2.5mm/s

Deflection11

Solder the capacitor to the testing jig (glass epoxy board) shown

in Fig. 2 using a eutectic solder.

Then apply a force in the direction shown in Fig. 3.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

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100

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40

φ4.5

t : 1.6

d

Capacitance meter

Flexure=1

20 50

R230

45 45

Pressurizing

speed : 1.0mm/s

Pressurize

Fig. 3

No cracking or marking defects should occur.

(in mm)

LZW

(mm)

3.2Z1.6

3.2Z2.5

4.5Z2.0

4.5Z3.2

2.2

3.5

5.0

7.0

2.0

2.9

2.4

3.7

1.0

Dimension (mm)

abcd

Step

1

2100Dto 120D

170Dto 200D

1 min.

Temperature Time

More than 10,000MΩ

Within T2.5% or T0.25pF

(Whichever is larger) Within T10%

C0G char. : QU1,000

SL char. :

CU30pF : QU1,000

CF30pF : QU400W20C*2

D.F.V0.01

Appearance

I.R.

Capacitance

Change

Q/D.F.

No marking defects

Resistance

to Soldering

Heat

13

Preheat the capacitor at 120 to 150D*for 1 min.

Immerse the capacitor in eutectic solder solution at 260T5Dfor

10T1 sec. Let sit at *1room condition for 24T2 hrs., then

measure.

#Immersing speed : 25T2.5mm/s

#Pretreatment for high dielectric constant type

Perform a heat treatment at 150 Dfor 60T5 min. and then

let sit for 24T2 hrs. at *1room condition.

*Preheating for more than 3.2Z2.5mm

W0

Y10

In accordance with item No.4

Dielectric

Strength

No. Item

Specifications

Test Method

Temperature Compensating

Type (C0G, SL Char.) High Dielectric

Constant Type (R Char.)

*1 "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

*2 "C" expresses nominal capacitance value (pF).

Solder resist

Cu

Glass Epoxy Board

C0G char. : QU1,000

SL char. :

CU30pF : QU1,000

CF30pF : QU400W20C*2

D.F.V0.01

No defects or abnormalities

Within the specified tolerance

Vibration

Resistance

10

Solder the capacitor to the test jig (glass epoxy board).

The capacitor should be subjected to a simple harmonic motion

having a total amplitude of 1.5mm, the frequency being varied

uniformly between the approximate limits of 10 and 55Hz. The

frequency range, from 10 to 55Hz and return to 10Hz, should be

traversed in approximately 1 min. This motion should be applied

for a period of 2 hrs. in each 3 mutually perpendicular directions

(total of 6 hrs.).

Appearance

Capacitance

Q/D.F.

Specifications and Test Methods

107

14

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Continued from the preceding page.

No. Item

Specifications

Test Method

Temperature Compensating

Type (C0G, SL Char.) High Dielectric

Constant Type (R Char.)

More than 1,000MΩ

Within T3.0% or T0.3pF

(Whichever is larger) Within T10%

C0G char. : QU350

SL char. :

CU30pF : QU350

CF30pF : QU275WC*2

5

2

D.F.V0.02

Appearance

I.R.

Capacitance

Change

Q/D.F.

No marking defects

Life16

Apply the voltage in following table for 1,000 hrs. at

maximum operating temperature T3D.

Remove and let sit for 24T2 hrs. at *1room condition, then

measure.

The charge/discharge current is less than 50mA.

#Pretreatment for high dielectric constant type

Apply test voltage for 60T5 min. at test temperature.

Remove and let sit for 24T2 hrs. at *1room condition.

W48

Y00

In accordance with item No.4

Dielectric

Strength

Rated voltage

More than DC1kV

Less than DC1kV

Test voltage

Rated voltage

120% of the rated voltage

*1 "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

*2 "C" expresses nominal capacitance value (pF).

More than 1,000MΩ

Within T5.0% or T0.5pF

(Whichever is larger) Within T10%

C0G char. : QU350

SL char. :

CU30pF : QU350

CF30pF : QU275WC*2

5

2

D.F.V0.01

Appearance

I.R.

Capacitance

Change

Q/D.F.

No marking defects

Humidity

(Steady

State)

15

Let the capacitor sit at 40T2Dand relative humidity of 90 to 95%

for 500 hrs.

Remove and let sit for 24T2 hrs. at *1room condition, then

measure.

#Pretreatment for high dielectric constant type

Perform a heat treatment at 150 Dfor 60T5 min. and then

let sit for 24T2 hrs. at *1room condition.

W00

Y10

W24

Y00

In accordance with item No.4

Dielectric

Strength

Solder resist

Cu

Glass Epoxy Board

Fig. 4

Step

1

2

3

4

Min. Operating Temp.T3

Room Temp.

Max. Operating Temp.T2

Room Temp.

30T3

2 to 3

30T3

2 to 3

Temperature (D)Time (min.)

More than 10,000MΩ

Within T2.5% or T0.25pF

(Whichever is larger) Within T10%

C0G char. : QU1,000

SL char. :

CU30pF : QU1,000

CF30pF : QU400W20C*2

D.F.V0.01

Appearance

I.R.

Capacitance

Change

Q/D.F.

No marking defects

Temperature

Cycle

14

Fix the capacitor to the supporting jig (glass epoxy board) shown

in Fig. 4 using a eutectic solder.

Perform the 5 cycles according to the 4 heat treatments listed in

the following table.

Let sit for 24T2 hrs. at *1room condition, then measure.

#Pretreatment for high dielectric constant type

Perform a heat treatment at 150 Dfor 60T5 min. and then

let sit for 24T2 hrs. at *1room condition.

W0

Y10

In accordance with item No.4

Dielectric

Strength

Specifications and Test Methods

108

14

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

109

15

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Chip Monolithic Ceramic Capacitors

Medium-voltage High-Capacitance for General-Use

■ Features

1. A new monolithic structure for small, high

capacitance capable of operating at high voltage

levels.

2. Sn-plated external electrodes realized good

solderability.

3. Use the GRM18/21/31 types with flow or reflow

soldering, and other types with reflow soldering

only.

■ Applications

1. Ideal for use as a hot-cold coupling for DC/DC

converter.

2. Ideal for use on line filters and ringer detectors

for telephones, facsimiles and modems.

3. Ideal for use on diode-snubber circuits for

switching power supplies.

L

T

W

e eg

Part Number LW T

Dimensions (mm) g min.

2.0 ±0.2

3.2 ±0.2

1.25 ±0.2

1.6 ±0.2

1.0 +0,-0.3

1.25 +0,-0.3 0.7

1.25 ±0.2

1.2

2.2

3.2*

0.4

1.6 ±0.2

1.5 +0,-0.3

2.0 +0,-0.3

3.2 ±0.3 2.5 ±0.2

4.5 ±0.4 3.2 ±0.3

5.7 ±0.4 5.0 ±0.4

0.8 ±0.1

e

0.2 to 0.5

0.3 min.

1.6 ±0.1 0.8 ±0.1

GRM21A

GRM21B

GRM188

GRM31B

GRM31C

GRM32Q

GRM32D

GRM43Q

GRM43D

GRM55D

* GRM55DR73A : 2.5mm min.

Part Number Rated Voltage

(V) TC Code

(Standard) Capacitance Length L

(mm) Width W

(mm) Thickness T

(mm)

Electrode g

min.

(mm)

Electrode e

(mm)

GRM188R72E221KW07D DC250 X7R (EIA) 220pF ±10% 1.6 0.8 0.8 0.4 0.2 to 0.5

GRM188R72E331KW07D DC250 X7R (EIA) 330pF ±10% 1.6 0.8 0.8 0.4 0.2 to 0.5

GRM188R72E471KW07D DC250 X7R (EIA) 470pF ±10% 1.6 0.8 0.8 0.4 0.2 to 0.5

GRM188R72E681KW07D DC250 X7R (EIA) 680pF ±10% 1.6 0.8 0.8 0.4 0.2 to 0.5

GRM188R72E102KW07D DC250 X7R (EIA) 1000pF ±10% 1.6 0.8 0.8 0.4 0.2 to 0.5

GRM21AR72E102KW01D DC250 X7R (EIA) 1000pF ±10% 2.0 1.25 1.0 0.7 0.3 min.

GRM188R72E152KW07D DC250 X7R (EIA) 1500pF ±10% 1.6 0.8 0.8 0.4 0.2 to 0.5

GRM21AR72E152KW01D DC250 X7R (EIA) 1500pF ±10% 2.0 1.25 1.0 0.7 0.3 min.

GRM188R72E222KW07D DC250 X7R (EIA) 2200pF ±10% 1.6 0.8 0.8 0.4 0.2 to 0.5

GRM21AR72E222KW01D DC250 X7R (EIA) 2200pF ±10% 2.0 1.25 1.0 0.7 0.3 min.

GRM21AR72E332KW01D DC250 X7R (EIA) 3300pF ±10% 2.0 1.25 1.0 0.7 0.3 min.

GRM21AR72E472KW01D DC250 X7R (EIA) 4700pF ±10% 2.0 1.25 1.0 0.7 0.3 min.

GRM21AR72E682KW01D DC250 X7R (EIA) 6800pF ±10% 2.0 1.25 1.0 0.7 0.3 min.

GRM21BR72E103KW03L DC250 X7R (EIA) 10000pF ±10% 2.0 1.25 1.25 0.7 0.3 min.

GRM31BR72E153KW01L DC250 X7R (EIA) 15000pF ±10% 3.2 1.6 1.25 1.2 0.3 min.

GRM31BR72E223KW01L DC250 X7R (EIA) 22000pF ±10% 3.2 1.6 1.25 1.2 0.3 min.

GRM31CR72E333KW03L DC250 X7R (EIA) 33000pF ±10% 3.2 1.6 1.6 1.2 0.3 min.

GRM31CR72E473KW03L DC250 X7R (EIA) 47000pF ±10% 3.2 1.6 1.6 1.2 0.3 min.

GRM32QR72E683KW01L DC250 X7R (EIA) 68000pF ±10% 3.2 2.5 1.5 1.2 0.3 min.

GRM31CR72E104KW03L DC250 X7R (EIA) 0.10µF ±10% 3.2 1.6 1.6 1.2 0.3 min.

GRM32DR72E104KW01L DC250 X7R (EIA) 0.10µF ±10% 3.2 2.5 2.0 1.2 0.3 min.

GRM43QR72E154KW01L DC250 X7R (EIA) 0.15µF ±10% 4.5 3.2 1.5 2.2 0.3 min.

GRM32DR72E224KW01L DC250 X7R (EIA) 0.22µF ±10% 3.2 2.5 2.0 1.2 0.3 min.

GRM43DR72E224KW01L DC250 X7R (EIA) 0.22µF ±10% 4.5 3.2 2.0 2.2 0.3 min.

GRM43DR72E334KW01L DC250 X7R (EIA) 0.33µF ±10% 4.5 3.2 2.0 2.2 0.3 min.

GRM55DR72E334KW01L DC250 X7R (EIA) 0.33µF ±10% 5.7 5.0 2.0 3.2 0.3 min.

GRM43DR72E474KW01L DC250 X7R (EIA) 0.47µF ±10% 4.5 3.2 2.0 2.2 0.3 min.

GRM55DR72E474KW01L DC250 X7R (EIA) 0.47µF ±10% 5.7 5.0 2.0 3.2 0.3 min.

GRM55DR72E105KW01L DC250 X7R (EIA) 1.0µF ±10% 5.7 5.0 2.0 3.2 0.3 min.

GRM31BR72J102KW01L DC630 X7R (EIA) 1000pF ±10% 3.2 1.6 1.25 1.2 0.3 min.

GRM31BR72J152KW01L DC630 X7R (EIA) 1500pF ±10% 3.2 1.6 1.25 1.2 0.3 min.

GRM31BR72J222KW01L DC630 X7R (EIA) 2200pF ±10% 3.2 1.6 1.25 1.2 0.3 min.

Continued on the following page.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

110

15

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Part Number Rated Voltage

(V) TC Code

(Standard) Capacitance Length L

(mm) Width W

(mm) Thickness T

(mm)

Electrode g

min.

(mm)

Electrode e

(mm)

Continued from the preceding page.

GRM31BR72J332KW01L DC630 X7R (EIA) 3300pF ±10% 3.2 1.6 1.25 1.2 0.3 min.

GRM31BR72J472KW01L DC630 X7R (EIA) 4700pF ±10% 3.2 1.6 1.25 1.2 0.3 min.

GRM31BR72J682KW01L DC630 X7R (EIA) 6800pF ±10% 3.2 1.6 1.25 1.2 0.3 min.

GRM31BR72J103KW01L DC630 X7R (EIA) 10000pF ±10% 3.2 1.6 1.25 1.2 0.3 min.

GRM31CR72J153KW03L DC630 X7R (EIA) 15000pF ±10% 3.2 1.6 1.6 1.2 0.3 min.

GRM32QR72J223KW01L DC630 X7R (EIA) 22000pF ±10% 3.2 2.5 1.5 1.2 0.3 min.

GRM32DR72J333KW01L DC630 X7R (EIA) 33000pF ±10% 3.2 2.5 2.0 1.2 0.3 min.

GRM32DR72J473KW01L DC630 X7R (EIA) 47000pF ±10% 3.2 2.5 2.0 1.2 0.3 min.

GRM43QR72J683KW01L DC630 X7R (EIA) 68000pF ±10% 4.5 3.2 1.5 2.2 0.3 min.

GRM43DR72J104KW01L DC630 X7R (EIA) 0.10µF ±10% 4.5 3.2 2.0 2.2 0.3 min.

GRM55DR72J154KW01L DC630 X7R (EIA) 0.15µF ±10% 5.7 5.0 2.0 3.2 0.3 min.

GRM55DR72J224KW01L DC630 X7R (EIA) 0.22µF ±10% 5.7 5.0 2.0 3.2 0.3 min.

GRM31BR73A102KW01L DC1000 X7R (EIA) 1000pF ±10% 3.2 1.6 1.25 1.2 0.3 min.

GRM31BR73A152KW01L DC1000 X7R (EIA) 1500pF ±10% 3.2 1.6 1.25 1.2 0.3 min.

GRM31BR73A222KW01L DC1000 X7R (EIA) 2200pF ±10% 3.2 1.6 1.25 1.2 0.3 min.

GRM31BR73A332KW01L DC1000 X7R (EIA) 3300pF ±10% 3.2 1.6 1.25 1.2 0.3 min.

GRM31BR73A472KW01L DC1000 X7R (EIA) 4700pF ±10% 3.2 1.6 1.25 1.2 0.3 min.

GRM32QR73A682KW01L DC1000 X7R (EIA) 6800pF ±10% 3.2 2.5 1.5 1.2 0.3 min.

GRM32QR73A103KW01L DC1000 X7R (EIA) 10000pF ±10% 3.2 2.5 1.5 1.2 0.3 min.

GRM32DR73A153KW01L DC1000 X7R (EIA) 15000pF ±10% 3.2 2.5 2.0 1.2 0.3 min.

GRM32DR73A223KW01L DC1000 X7R (EIA) 22000pF ±10% 3.2 2.5 2.0 1.2 0.3 min.

GRM43DR73A333KW01L DC1000 X7R (EIA) 33000pF ±10% 4.5 3.2 2.0 2.2 0.3 min.

GRM43DR73A473KW01L DC1000 X7R (EIA) 47000pF ±10% 4.5 3.2 2.0 2.2 0.3 min.

GRM55DR73A104KW01L DC1000 X7R (EIA) 0.10µF ±10% 5.7 5.0 2.0 2.5 0.3 min.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Continued on the following page.

No removal of the terminations or other defect should occur.

Adhesive Strength

of Termination

9

Solder the capacitor to the testing jig (glass epoxy board) shown

in Fig. 1 using a eutectic solder.

Then apply 10N force in the direction of the arrow.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

10N (5N : Size 1.6g0.8mm only), 10T1s

Speed : 1.0mm/s

Glass Epoxy Board

Solder resist

Cu

Glass Epoxy Board

Cap. Change

Within T15%

(Temp. Range : Y55 to W125D)

Capacitance

Temperature

Characteristics

8

The range of capacitance change compared with the 25D value

within Y55 to W125Dshould be within the specified range.

#Pretreatment

Perform a heat treatment at 150 Dfor 60T5 min. and then

let sit for 24T2 hrs. at *room condition.

W0

Y10

Fig. 1

No. Item Specifications Test Method

Within the specified dimensions

No defects or abnormalities

Y55 to W125D

Operating

Temperature Range

Appearance

Dimensions

Dielectric Strength

1

2

3

4

Using calipers

No failure should be observed when 150% of the rated voltage

(200% of the rated voltage in case of rated voltage : DC250V,

120% of the rated voltage in case of rated voltage : DC1kV) is

applied between the terminations for 1 to 5 sec., provided the

charge/discharge current is less than 50mA.

Visual inspection

Y

CU0.01µF : More than 100MΩ• µF

CF0.01µF : More than 10,000MΩ

Insulation Resistance

(I.R.)

5The insulation resistance should be measured with DC500T50V

(DC250T50V in case of rated voltage : DC250V) and within 60T5

sec. of charging.

0.025 max.

Within the specified tolerance

Capacitance

Dissipation

Factor (D.F.)

6

7

The capacitance/D.F. should be measured at 25Dat a frequency

of 1T0.2kHz and a voltage of AC1T0.2V (r.m.s.)

#Pretreatment

Perform a heat treatment at 150 Dfor 60T5 min. and then

let sit for 24T2 hrs. at *room condition.

W0

Y10

* "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

0.025 max.

No defects or abnormalities

Within the specified tolerance

Vibration

Resistance

10

Solder the capacitor to the test jig (glass epoxy board).

The capacitor should be subjected to a simple harmonic motion

having a total amplitude of 1.5mm, the frequency being varied

uniformly between the approximate limits of 10 and 55Hz. The

frequency range, from 10 to 55Hz and return to 10Hz, should be

traversed in approximately 1 min. This motion should be applied

for a period of 2 hrs. in each 3 mutually perpendicular directions

(total of 6 hrs.).

Appearance

Capacitance

D.F.

Fig. 2

Deflection11

Solder the capacitor to the testing jig (glass epoxy board) shown

in Fig. 2 using a eutectic solder.

Then apply a force in the direction shown in Fig. 3.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

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φ4.5

t : 1.6

d

Capacitance meter

Flexure=1

20 50

R230

45 45

Pressurizing

speed : 1.0mm/s

Pressurize

Fig. 3

No cracking or marking defects should occur.

(in mm)

LZW

(mm)

1.6Z0.80

2.0Z1.25

3.2Z1.60

3.2Z2.50

4.5Z3.20

5.7Z5.00

1.0

1.2

2.2

3.5

4.5

3.0

4.0

5.0

7.0

8.0

1.25

1.65

2.05

2.95

3.75

5.65

1.0

Dimension (mm)

abcd

Specifications and Test Methods

111

15

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Continued from the preceding page.

No. Item Specifications Test Method

* "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

75% of the terminations are to be soldered evenly and continuously.

Solderability of

Termination

12

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion).

Immerse in eutectic solder solution for 2T0.5 sec. at 235T5D.

Immersing speed : 25T2.5mm/s

Solder resist

Cu

Glass Epoxy Board

Fig. 4

Step

1

2100Dto 120D

170Dto 200D

1 min.

Temperature Time

Step

1

2

3

4

Min. Operating Temp.T3

Room Temp.

Max. Operating Temp.T2

Room Temp.

30T3

2 to 3

30T3

2 to 3

Temperature (D)Time (min.)

CU0.01µF : More than 100MΩ• µF

CF0.01µF : More than 10,000MΩ

Within T10%

0.025 max.

Appearance

I.R.

Capacitance

Change

D.F.

No marking defects

Resistance

to Soldering

Heat

13

Preheat the capacitor at 120 to 150D*for 1 min.

Immerse the capacitor in eutectic solder solution at 260T5Dfor

10T1 sec. Let sit at *room condition for 24T2 hrs., then measure.

#Immersing speed : 25T2.5mm/s

#Pretreatment

Perform a heat treatment at 150 Dfor 60T5 min. and then

let sit for 24T2 hrs. at *room condition.

*Preheating for more than 3.2Z2.5mm

W00

Y10

In accordance with item No.4

Dielectric

Strength

CU0.01µF : More than 100MΩ• µF

CF0.01µF : More than 10,000MΩ

Within T7.5%

0.025 max.

Appearance

I.R.

Capacitance

Change

D.F.

No marking defects

Temperature

Cycle

14

Fix the capacitor to the supporting jig (glass epoxy board) shown

in Fig. 4 using a eutectic solder.

Perform the 5 cycles according to the 4 heat treatments listed in

the following table.

Let sit for 24T2 hrs. at *room condition, then measure.

#Pretreatment

Perform a heat treatment at 150 Dfor 60T5 min. and then

let sit for 24T2 hrs. at *room condition.

W00

Y10

In accordance with item No.4

Dielectric

Strength

CU0.01µF : More than 10MΩ• µF

CF0.01µF : More than 1,000MΩ

Within T15%

0.05 max.

Appearance

I.R.

Capacitance

Change

D.F.

No marking defects

Humidity

(Steady

State)

15

Let the capacitor sit at 40T2Dand relative humidity of 90 to 95%

for 500 hrs.

Remove and let sit for 24T2 hrs. at *room condition, then

measure.

#Pretreatment

Perform a heat treatment at 150 Dfor 60T5 min. and then

let sit for 24T2 hrs. at *room condition.

W00

Y10

W24

Y00

In accordance with item No.4

Dielectric

Strength

CU0.01µF : More than 10MΩ• µF

CF0.01µF : More than 1,000MΩ

Within T15% (rated voltage : DC250V, DC630V)

Within T20% (rated voltage : DC1kV)

0.05 max.

Appearance

I.R.

Capacitance

Change

D.F.

No marking defects

Life16

Apply 120% of the rated voltage (150% of the rated voltage in

case of rated voltage : DC250V, 110% of the rated voltage in

case of rated voltage : DC1kV) for 1,000 hrs. at maximum

operating temperature T3D. Remove and let sit for 24 T2 hrs. at

*room condition, then measure.

The charge/discharge current is less than 50mA.

#Pretreatment

Apply test voltage for 60T5 min. at test temperature.

Remove and let sit for 24T2 hrs. at *room condition.

W48

Y00

In accordance with item No.4

Dielectric

Strength

CU0.01µF : More than 10MΩ• µF

CF0.01µF : More than 1,000MΩ

Within T15%

0.05 max.

Appearance

I.R.

Capacitance

Change

D.F.

No marking defects

Humidity

Loading

(Application :

DC250V,

DC630V

item)

17

Apply the rated voltage at 40T2Dand relative humidity of 90 to

95% for 500 hrs.

Remove and let sit for 24T2 hrs. at *room condition, then

measure.

#Pretreatment

Apply test voltage for 60T5 min. at test temperature.

Remove and let sit for 24T2 hrs. at *room condition.

W24

Y00

In accordance with item No.4

Dielectric

Strength

Specifications and Test Methods

112

15

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

113

16

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Chip Monolithic Ceramic Capacitors

Only for Information Devices/Tip & Ring

■ Features

1. These items are designed specifically for tele-

communication devices (IEEE802.3) in Ethernet LAN.

2. A new monolithic structure for small, high

capacitance capable of operating at high voltage

levels.

3. Sn-plated external electrodes realizes good

solderability.

4. Only for reflow soldering.

5. The low-profile type (thickness: 1.5mm max.) is

available. Fit for use on thinner type equipment.

■ Applications

Ideal for use on telecommunication devices in Ethernet

LAN.

Part Number LW T

Dimensions (mm) g min.

GR442Q

GR443D

* GR443DR73D : 2.5mm min.

2.0 ±0.24.5 ±0.3 1.5 +0, -0.3 2.5

3.2 ±0.34.5 ±0.4 2.0 +0, -0.3 2.2*

2.5

GR443Q 1.5 +0, -0.3

L

T

W

0.3 min. 0.3 min.g

Part Number Rated Voltage

(V) TC Code

(Standard) Capacitance

(pF) Length L

(mm) Width W

(mm) Thickness T

(mm)

Electrode g

min.

(mm)

Electrode e

(mm)

GR442QR73D101KW01L DC2000 X7R (EIA) 100 ±10% 4.5 2.0 1.5 2.5 0.3 min.

GR442QR73D121KW01L DC2000 X7R (EIA) 120 ±10% 4.5 2.0 1.5 2.5 0.3 min.

GR442QR73D151KW01L DC2000 X7R (EIA) 150 ±10% 4.5 2.0 1.5 2.5 0.3 min.

GR442QR73D181KW01L DC2000 X7R (EIA) 180 ±10% 4.5 2.0 1.5 2.5 0.3 min.

GR442QR73D221KW01L DC2000 X7R (EIA) 220 ±10% 4.5 2.0 1.5 2.5 0.3 min.

GR442QR73D271KW01L DC2000 X7R (EIA) 270 ±10% 4.5 2.0 1.5 2.5 0.3 min.

GR442QR73D331KW01L DC2000 X7R (EIA) 330 ±10% 4.5 2.0 1.5 2.5 0.3 min.

GR442QR73D391KW01L DC2000 X7R (EIA) 390 ±10% 4.5 2.0 1.5 2.5 0.3 min.

GR442QR73D471KW01L DC2000 X7R (EIA) 470 ±10% 4.5 2.0 1.5 2.5 0.3 min.

GR442QR73D561KW01L DC2000 X7R (EIA) 560 ±10% 4.5 2.0 1.5 2.5 0.3 min.

GR442QR73D681KW01L DC2000 X7R (EIA) 680 ±10% 4.5 2.0 1.5 2.5 0.3 min.

GR442QR73D821KW01L DC2000 X7R (EIA) 820 ±10% 4.5 2.0 1.5 2.5 0.3 min.

GR442QR73D102KW01L DC2000 X7R (EIA) 1000 ±10% 4.5 2.0 1.5 2.5 0.3 min.

GR442QR73D122KW01L DC2000 X7R (EIA) 1200 ±10% 4.5 2.0 1.5 2.5 0.3 min.

GR442QR73D152KW01L DC2000 X7R (EIA) 1500 ±10% 4.5 2.0 1.5 2.5 0.3 min.

GR443QR73D182KW01L DC2000 X7R (EIA) 1800 ±10% 4.5 3.2 1.5 2.5 0.3 min.

GR443QR73D222KW01L DC2000 X7R (EIA) 2200 ±10% 4.5 3.2 1.5 2.5 0.3 min.

GR443QR73D272KW01L DC2000 X7R (EIA) 2700 ±10% 4.5 3.2 1.5 2.5 0.3 min.

GR443QR73D332KW01L DC2000 X7R (EIA) 3300 ±10% 4.5 3.2 1.5 2.5 0.3 min.

GR443QR73D392KW01L DC2000 X7R (EIA) 3900 ±10% 4.5 3.2 1.5 2.5 0.3 min.

GR443DR73D472KW01L DC2000 X7R (EIA) 4700 ±10% 4.5 3.2 2.0 2.5 0.3 min.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Continued on the following page.

Solder resist

Cu

Glass Epoxy Board

Capacitance

Temperature

Characteristics

9

The range of capacitance change compared with the 25Dvalue

within the specified range.

#Pretreatment

Perform a heat treatment at 150 Dfor 60T5 min. and then

let sit for 24T2 hrs. at *room condition.

W0

Y10

No removal of the terminations or other defect should occur.

Adhesive Strength

of Termination

10

Solder the capacitor to the testing jig (glass epoxy board) shown

in Fig. 1 using a eutectic solder.

Then apply 10N force in the direction of the arrow.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

10N, 10T1s

Speed : 1.0mm/s

Glass Epoxy Board

Fig. 1

No. Item Specifications Test Method

Within the specified dimensions

No defects or abnormalities

Y55 to W125D

Operating

Temperature Range

Appearance

Dimensions

Dielectric Strength

1

2

3

4

Using calipers

No failure should be observed when voltage in table is applied

between the terminations, provided the charge/discharge current

is less than 50mA.

Visual inspection

Y

More than 6,000MΩ

Insulation Resistance

(I.R.)

6The insulation resistance should be measured with DC500T50V

and within 60T5 sec. of charging.

No self healing break downs or flash-overs have taken place in

the capacitor.

Pulse Voltage

(Application :

DC2kV item)

5

10 impulse of alternating polarity is subjected.

(5 impulse for each polarity)

The interval between impulse is 60 sec.

Applied Voltage : 2.5kV zero to peak

0.025 max.

Cap. Change

within ±15%

(Temp. Range : Y55 to W125D)

Within the specified tolerance

Capacitance

Dissipation

Factor (D.F.)

7

8

The capacitance/D.F. should be measured at 25Dat a frequency

of 1T0.2kHz and a voltage of AC1T0.2V (r.m.s.)

#Pretreatment

Perform a heat treatment at 150 Dfor 60T5 min. and then

let sit for 24T2 hrs. at *room condition.

W0

Y10

* "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

0.025 max.

No defects or abnormalities

Within the specified tolerance

Vibration

Resistance

11

Solder the capacitor to the test jig (glass epoxy board).

The capacitor should be subjected to a simple harmonic motion

having a total amplitude of 1.5mm, the frequency being varied

uniformly between the approximate limits of 10 and 55Hz. The

frequency range, from 10 to 55Hz and return to 10Hz, should be

traversed in approximately 1 min. This motion should be applied

for a period of 2 hrs. in each 3 mutually perpendicular directions

(total of 6 hrs.).

Appearance

Capacitance

D.F.

Rated voltage

DC2kV 120% of the rated voltage

AC1500V (r.m.s.) 60±1 sec.

60±1 sec.

Test Voltage Time

Specifications and Test Methods

114

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Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Continued from the preceding page.

No. Item Specifications Test Method

* "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

75% of the terminations are to be soldered evenly and continuously.

Solderability of

Termination

13

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion).

Immerse in eutectic solder solution for 2T0.5 sec. at 235T5D.

Immersing speed : 25T2.5mm/s

Solder resist

Cu

Glass Epoxy Board

Fig. 4

Step

1

2100Dto 120D

170Dto 200D

1 min.

Temperature Time

Step

1

2

3

4

Min. Operating Temp.T3

Room Temp.

Max. Operating Temp.T2

Room Temp.

30T3

2 to 3

30T3

2 to 3

Temperature (D)Time (min.)

More than 1,000MΩ

Within T10%

0.025 max.

Appearance

I.R.

Capacitance

Change

D.F.

No marking defects

Resistance

to Soldering

Heat

14

Preheat the capacitor at 120 to 150D*for 1 min.

Immerse the capacitor in eutectic solder solution at 260T5Dfor

10T1 sec. Let sit at *room condition for 24T2 hrs., then measure.

#Immersing speed : 25T2.5mm/s

#Pretreatment

Perform a heat treatment at 150 Dfor 60T5 min. and then

let sit for 24T2 hrs. at *room condition.

*Preheating for more than 3.2Z2.5mm

W00

Y10

In accordance with item No.4

Dielectric

Strength

More than 3,000MΩ

Within T15%

0.05 max.

Appearance

I.R.

Capacitance

Change

D.F.

No marking defects

Temperature

Cycle

15

Fix the capacitor to the supporting jig (glass epoxy board) shown

in Fig. 4 using a eutectic solder.

Perform the 5 cycles according to the 4 heat treatments listed in

the following table.

Let sit for 24T2 hrs. at *room condition, then measure.

#Pretreatment

Perform a heat treatment at 150 Dfor 60T5 min. and then

let sit for 24T2 hrs. at *room condition.

W00

Y10

In accordance with item No.4

Dielectric

Strength

More than 1,000MΩ

Within T15%

0.05 max.

Appearance

I.R.

Capacitance

Change

D.F.

No marking defects

Humidity

(Steady

State)

16

Let the capacitor sit at 40T2Dand relative humidity of 90 to 95%

for 500 hrs.

Remove and let sit for 24T2 hrs. at *room condition, then

measure.

#Pretreatment

Perform a heat treatment at 150 Dfor 60T5 min. and then

let sit for 24T2 hrs. at *room condition.

W00

Y10

W24

Y00

In accordance with item No.4

Dielectric

Strength

Fig. 2

Deflection12

Solder the capacitor to the testing jig (glass epoxy board) shown

in Fig. 2 using a eutectic solder.

Then apply a force in the direction shown in Fig. 3.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

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d

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Flexure=1

20 50

R230

45 45

Pressurizing

speed : 1.0mm/s

Pressurize

Fig. 3

No cracking or marking defects should occur.

(in mm)

LZW

(mm)

4.5Z2.00

4.5Z3.203.5

3.5 7.0

7.0 2.45

3.751.0

Dimension (mm)

abcd

Continued on the following page.

Specifications and Test Methods

115

16

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Continued from the preceding page.

No. Item Specifications Test Method

* "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

More than 10MΩ• µF

Within T15%

0.05 max.

Appearance

I.R.

Capacitance

Change

D.F.

No marking defects

Humidity

Loading

(Applicat

ion :

DC250V

item)

18

Apply the rated voltage at 40T2Dand relative humidity of 90 to

95% for 500 hrs.

Remove and let sit for 24T2 hrs. at *room condition, then

measure.

#Pretreatment

Apply test voltage for 60T5 min. at test temperature.

Remove and let sit for 24T2 hrs. at *room condition.

W24

Y00

In accordance with item No.4

Dielectric

Strength

More than 2,000MΩ

Within T20%

0.05 max.

Appearance

I.R.

Capacitance

Change

D.F.

No marking defects

Life17

Apply 110% of the rated voltage for 1,000 hrs. at maximum

operating temperature T3D. Remove and let sit for 24 T2 hrs. at

*room condition, then measure.

The charge/discharge current is less than 50mA.

#Pretreatment

Apply test voltage for 60T5 min. at test temperature.

Remove and let sit for 24T2 hrs. at *room condition.

W48

Y00

In accordance with item No.4

Dielectric

Strength

Specifications and Test Methods

116

16

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

117

17

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Chip Monolithic Ceramic Capacitors

AC250V Type (Which Meet Japanese Law)

■ Features

1. Chip monolithic ceramic capacitor for AC lines.

2. A new monolithic structure for small, high

capacitance capable of operating at high voltage

levels.

3. Sn-plated external electrodes realizes good

solderability.

4. Only for reflow soldering.

5. Capacitance 0.01 to 0.1 uF for connecting lines and

470 to 4700 pF for connecting lines to earth.

■ Applications

Noise suppression filters for switching power supplies,

telephones, facsimiles, modems.

■ Reference Standard

GA2 series obtains no safety approval.

This series is based on JIS C 5102, JIS C 5150, and

the standards of the electrical appliance and material

safety law of Japan (separated table 4).

Part Number LW T

Dimensions (mm) g min.e min.

2.0 ±0.2

GA242Q

2.50.3

4.5 ±0.3 1.5 +0, -0.3

3.2 ±0.3

GA243D 4.5 ±0.4 2.0 +0, -0.3

GA243Q 1.5 +0, -0.3

5.0 ±0.4GA255D 5.7 ±0.4 2.0 +0, -0.3

L

T

W

e eg

Part Number Rated Voltage

(V) TC Code

(Standard) Capacitance Length L

(mm) Width W

(mm) Thickness T

(mm)

Electrode g

min.

(mm)

Electrode e

(mm)

GA242QR7E2471MW01L AC250 (r.m.s.) X7R (EIA) 470pF ±20% 4.5 2.0 1.5 2.5 0.3 min.

GA242QR7E2102MW01L AC250 (r.m.s.) X7R (EIA) 1000pF ±20% 4.5 2.0 1.5 2.5 0.3 min.

GA243QR7E2222MW01L AC250 (r.m.s.) X7R (EIA) 2200pF ±20% 4.5 3.2 1.5 2.5 0.3 min.

GA243QR7E2332MW01L AC250 (r.m.s.) X7R (EIA) 3300pF ±20% 4.5 3.2 1.5 2.5 0.3 min.

GA243DR7E2472MW01L AC250 (r.m.s.) X7R (EIA) 4700pF ±20% 4.5 3.2 2.0 2.5 0.3 min.

GA243QR7E2103MW01L AC250 (r.m.s.) X7R (EIA) 10000pF ±20% 4.5 3.2 1.5 2.5 0.3 min.

GA243QR7E2223MW01L AC250 (r.m.s.) X7R (EIA) 22000pF ±20% 4.5 3.2 1.5 2.5 0.3 min.

GA243DR7E2473MW01L AC250 (r.m.s.) X7R (EIA) 47000pF ±20% 4.5 3.2 2.0 2.5 0.3 min.

GA255DR7E2104MW01L AC250 (r.m.s.) X7R (EIA) 0.10µF ±20% 5.7 5.0 2.0 2.5 0.3 min.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Continued on the following page.

No. Item Specifications Test Method

Within the specified dimensions

No defects or abnormalities

Y55 to W125D

Operating

Temperature Range

Appearance

Dimensions

Dielectric Strength

1

2

3

4

Using calipers

No failure should be observed when voltage in table is applied

between the terminations for 60T1 sec., provided the

charge/discharge current is less than 50mA.

Visual inspection

Y

* "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

Cap. Change

Within T15%

(Temp. Range : Y55 to W125D)

Capacitance

Temperature

Characteristics

8

The range of capacitance change compared with the 25Dvalue

within Y55 to W125Dshould be within the specified range.

#Pretreatment

Perform a heat treatment at 150 Dfor 60T5 min. and then

let sit for 24T2 hrs. at *room condition.

W00

Y10

More than 2,000MΩ

Insulation Resistance

(I.R.)

5The insulation resistance should be measured with DC500T50V

and within 60T5 sec. of charging.

0.025 max.

Within the specified tolerance

Capacitance

Dissipation

Factor (D.F.)

6

7

The capacitance/D.F. should be measured at 25Dat a frequency

of 1T0.2kHz and a voltage of AC1T0.2V (r.m.s.)

#Pretreatment

Perform a heat treatment at 150 Dfor 60T5 min. and then

let sit for 24T2 hrs. at *room condition.

W00

Y10

No removal of the terminations or other defects should occur.

Adhesive Strength

of Termination

10

Solder the capacitor to the testing jig (glass epoxy board) shown

in Fig. 1 using a eutectic solder. Then apply 10N force in the

direction of the arrow. The soldering should be done either with

an iron or using the reflow method and should be conducted with

care so that the soldering is uniform and free of defects such as

heat shock.

10N, 10T1s

Speed : 1.0mm/s

Glass Epoxy Board

Solder resist

Cu

Glass Epoxy Board

Fig. 1

0.025 max.

No defects or abnormalities

Within the specified tolerance

Vibration

Resistance

11

Solder the capacitor to the test jig (glass epoxy board).

The capacitor should be subjected to a simple harmonic motion

having a total amplitude of 1.5mm, the frequency being varied

uniformly between the approximate limits of 10 and 55Hz. The

frequency range, from 10 to 55Hz and return to 10Hz, should be

traversed in approximately 1 min. This motion should be applied

for a period of 2 hrs. in each 3 mutually perpendicular directions

(total of 6 hrs.).

Appearance

Capacitance

D.F.

R3 R1

R2

Ct

Cd

10kV V

No defects or abnormalities

Discharge

Test

(Application:

Nominal

Capacitance

CF10,000pF)

9

As in Fig., discharge is made 50 times at 5 sec. intervals from

the capacitor (Cd) charged at DC voltage of specified.

Ct : Capacitor under test Cd : 0.001µF

R1 : 1,000ΩR2 : 100MΩR3 : Surge resistance

Appearance

Nominal Capacitance

CU10,000pF

CF10,000pF

Test voltage

AC575V (r.m.s.)

AC1500V (r.m.s.)

Specifications and Test Methods

118

17

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Continued from the preceding page.

Continued on the following page.

75% of the terminations are to be soldered evenly and continuously.

Solderability of

Termination

13

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion).

Immerse in eutectic solder solution for 2T0.5 sec. at 235T5D.

Immersing speed : 25T2.5mm/s

Step

1

2100Dto 120D

170Dto 200D

1 min.

Temperature Time

More than 2,000MΩ

Within T10%

0.025 max.

Appearance

I.R.

Capacitance

Change

D.F.

No marking defects

Resistance

to Soldering

Heat

15

Preheat the capacitor as table.

Immerse the capacitor in eutectic solder solution at 260T5Dfor

10T1 sec. Let sit at *room condition for 24T2 hrs., then

measure.

#Immersing speed : 25T2.5mm/s

#Pretreatment

Perform a heat treatment at 150 Dfor 60T5 min. and then

let sit for 24T2 hrs. at *room condition.

*Preheating

W00

Y10

In accordance with item No.4

Dielectric

Strength

More than 1,000MΩ

Within T15%

0.05 max.

Appearance

I.R.

Capacitance

Change

D.F.

No marking defects

Humidity

Insulation

14 The capacitor should be subjected to 40T2D, relative humidity of

90 to 98% for 8 hrs., and then removed in *room condition for 16

hrs. until 5 cycles.

In accordance with item No.4

Dielectric

Strength

No. Item Specifications Test Method

* "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

Solder resist

Cu

Glass Epoxy Board

Fig. 4

Step

1

2

3

4

Min. Operating Temp.T3

Room Temp.

Max. Operating Temp.T2

Room Temp.

30T3

2 to 3

30T3

2 to 3

Temperature (D)Time (min.)

More than 2,000MΩ

Within T15%

0.05 max.

Appearance

I.R.

Capacitance

Change

D.F.

No marking defects

Temperature

Cycle

16

Fix the capacitor to the supporting jig (glass epoxy board) shown

in Fig. 4 using a eutectic solder.

Perform the 5 cycles according to the 4 heat treatments listed in

the following table.

Let sit for 24T2 hrs. at *room condition, then measure.

#Pretreatment

Perform a heat treatment at 150 Dfor 60T5 min. and then

let sit for 24T2 hrs. at *room condition.

W00

Y10

In accordance with item No.4

Dielectric

Strength

Fig. 2

Deflection12

Solder the capacitor to the testing jig (glass epoxy board) shown

in Fig. 2 using a eutectic solder. Then apply a force in the

direction shown in Fig. 3. The soldering should be done either

with an iron or using the reflow method and should be conducted

with care so that the soldering is uniform and free of defects such

as heat shock.

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d

Capacitance meter

Flexure=1

20 50

R230

45 45

Pressurizing

speed : 1.0mm/s

Pressurize

Fig. 3

No cracking or marking defects should occur.

(in mm)

LZW

(mm)

4.5Z2.0

4.5Z3.2

5.7Z5.0

3.5

4.5

7.0

8.0

2.4

3.7

5.6 1.0

Dimension (mm)

abcd

Specifications and Test Methods

119

17

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Continued from the preceding page.

No. Item Specifications Test Method

* "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

More than 1,000MΩ

Within T20%

0.05 max.

Appearance

I.R.

Capacitance

Change

D.F.

No marking defects

Life18

Apply voltage and time as Table at 85T2D. Remove and let sit

for 24 T2 hrs. at *room condition, then measure. The charge /

discharge current is less than 50mA.

*Except that once each hour the voltage is increased to

AC1,000V (r.m.s.) for 0.1 sec.

#Pretreatment

Apply test voltage for 60T5 min. at test temperature.

Remove and let sit for 24T2 hrs. at *room condition.

In accordance with item No.4

Dielectric

Strength

More than 1,000MΩ

Within T15%

0.05 max.

Appearance

I.R.

Capacitance

Change

D.F.

No marking defects

Humidity

Loading

19

Apply the rated voltage at 40T2Dand relative humidity of 90 to

95% for 500 hrs.

Remove and let sit for 24T2 hrs. at *room condition, then

measure.

#Pretreatment

Apply test voltage for 60T5 min. at test temperature.

Remove and let sit for 24T2 hrs. at *room condition.

W24

Y00

In accordance with item No.4

Dielectric

Strength

More than 1,000MΩ

Within T15%

0.05 max.

Appearance

I.R.

Capacitance

Change

D.F.

No marking defects

Humidity

(Steady

State)

17

Let the capacitor sit at 40T2Dand relative humidity of 90 to 95%

for 500 hrs.

Remove and let sit for 24T2 hrs. at *room condition, then

measure.

#Pretreatment

Perform a heat treatment at 150 Dfor 60T5 min. and then

let sit for 24T2 hrs. at *room condition.

W00

Y10

W24

Y00

In accordance with item No.4

Dielectric

Strength

Nominal Capacitance

CU10,000pF

CF10,000pF

Test Time

1,000

W48

Y10

hrs.

1,500

W48

Y10

hrs.

Test voltage

AC300V (r.m.s.)

AC500V (r.m.s.)

*

Specifications and Test Methods

120

17

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Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

121

18

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Chip Monolithic Ceramic Capacitors

Safety Standard Recognized Type GC (UL, IEC60384-14 Class X1/Y2)

■ Features

1. Chip monolithic ceramic capacitor (certified as

conforming to safety standards) for AC lines.

2. A new monolithic structure for small, high

capacitance capable of operating at high voltage

levels.

3. Compared to lead type capacitors, this new

capacitor is greatly downsized and low-profiled to

1/10 or less in volume, and 1/4 or less in height.

4. The type GC can be used as an X1-class and Y2-class

capacitor, line-by-pass capacitor of UL1414.

5. +125 degree C guaranteed.

6. Only for reflow soldering.

■ Applications

1. Ideal for use as Y capacitor or X capacitor for

various switching power supplies

2. Ideal for modem applications

Part Number LTW

Dimensions (mm) g min.e min.

2.0 ±0.3

GA355D 5.7 ±0.4 4.00.35.0 ±0.4

L

T

W

e eg

■ Standard Recognition

UL

BSI

VDE

SEV

SEMKO

EN132400 Class

Status of Recognition Rated

Voltage

Standard No.

∗: Line-By-Pass only

UL1414

EN132400 AC250V

(r.m.s.)

Type GB Type GC

Y

Y

X2

∗

X1, Y2

Part Number Rated Voltage

(V) TC Code

(Standard) Capacitance

(pF) Length L

(mm) Width W

(mm) Thickness T

(mm)

Electrode g

min.

(mm)

Electrode e

(mm)

GA355DR7GC101KY02L AC250 (r.m.s.) X7R (EIA) 100 ±10% 5.7 5.0 2.0 4.0 0.3 min.

GA355DR7GC151KY02L AC250 (r.m.s.) X7R (EIA) 150 ±10% 5.7 5.0 2.0 4.0 0.3 min.

GA355DR7GC221KY02L AC250 (r.m.s.) X7R (EIA) 220 ±10% 5.7 5.0 2.0 4.0 0.3 min.

GA355DR7GC331KY02L AC250 (r.m.s.) X7R (EIA) 330 ±10% 5.7 5.0 2.0 4.0 0.3 min.

GA355DR7GC471KY02L AC250 (r.m.s.) X7R (EIA) 470 ±10% 5.7 5.0 2.0 4.0 0.3 min.

GA355DR7GC681KY02L AC250 (r.m.s.) X7R (EIA) 680 ±10% 5.7 5.0 2.0 4.0 0.3 min.

GA355DR7GC102KY02L AC250 (r.m.s.) X7R (EIA) 1000 ±10% 5.7 5.0 2.0 4.0 0.3 min.

GA355DR7GC152KY02L AC250 (r.m.s.) X7R (EIA) 1500 ±10% 5.7 5.0 2.0 4.0 0.3 min.

GA355DR7GC222KY02L AC250 (r.m.s.) X7R (EIA) 2200 ±10% 5.7 5.0 2.0 4.0 0.3 min.

GA355DR7GC332KY02L AC250 (r.m.s.) X7R (EIA) 3300 ±10% 5.7 5.0 2.0 4.0 0.3 min.

GA355DR7GC472KY02L AC250 (r.m.s.) X7R (EIA) 4700 ±10% 5.7 5.0 2.0 4.0 0.3 min.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

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!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Chip Monolithic Ceramic Capacitors

Safety Standard Recognized Type GD (IEC60384-14 Class Y3)

■ Features

1. A new monolithic structure for small, high

capacitance capable of operating at high voltage

levels.

2. The type GD can be used as a Y3-class capacitor.

3. Available for equipment based on IEC/EN60950

and UL1950.

4. +125 degree C guaranteed.

5. Only for reflow soldering.

6. The low-profile type (thickness: 1.5mm max.) is

available. Fit for use on thinner type equipment.

■ Applications

1. Ideal for use on line filters and couplings for

DAA modems without transformers.

2. Ideal for use on line filters for information

equipment.

Part Number LTW

Dimensions (mm) g min.e min.

2.0 ±0.2*

GA342D

GA342Q

GA343D

GA343Q

4.5 ±0.3 2.5

0.3

2.0 ±0.2

4.5 ±0.4 3.2 ±0.3 1.5 +0, -0.3

2.0 +0, -0.3

1.5 +0, -0.3

L

T

W

e eg

* GA342D1X : 2.0±0.3

■ Standard Recognition

SEMKO

Status of Recognition

Rated

Voltage

Standard

No. Class

EN132400 Y3 AC250V (r.m.s.)

Type GD

Applications Communication

network devices

such as a modem

Size Switching power

supplies

4.5×3.2mm and under Y

Part Number Rated Voltage

(V) TC Code

(Standard) Capacitance

(pF) Length L

(mm) Width W

(mm) Thickness T

(mm)

Electrode g

min.

(mm)

Electrode e

(mm)

GA342D1XGD100JY02L AC250 (r.m.s.) SL (JIS) 10 ±5% 4.5 2.0 2.0 2.5 0.3 min.

GA342D1XGD120JY02L AC250 (r.m.s.) SL (JIS) 12 ±5% 4.5 2.0 2.0 2.5 0.3 min.

GA342D1XGD150JY02L AC250 (r.m.s.) SL (JIS) 15 ±5% 4.5 2.0 2.0 2.5 0.3 min.

GA342D1XGD180JY02L AC250 (r.m.s.) SL (JIS) 18 ±5% 4.5 2.0 2.0 2.5 0.3 min.

GA342D1XGD220JY02L AC250 (r.m.s.) SL (JIS) 22 ±5% 4.5 2.0 2.0 2.5 0.3 min.

GA342D1XGD270JY02L AC250 (r.m.s.) SL (JIS) 27 ±5% 4.5 2.0 2.0 2.5 0.3 min.

GA342D1XGD330JY02L AC250 (r.m.s.) SL (JIS) 33 ±5% 4.5 2.0 2.0 2.5 0.3 min.

GA342D1XGD390JY02L AC250 (r.m.s.) SL (JIS) 39 ±5% 4.5 2.0 2.0 2.5 0.3 min.

GA342D1XGD470JY02L AC250 (r.m.s.) SL (JIS) 47 ±5% 4.5 2.0 2.0 2.5 0.3 min.

GA342D1XGD560JY02L AC250 (r.m.s.) SL (JIS) 56 ±5% 4.5 2.0 2.0 2.5 0.3 min.

GA342D1XGD680JY02L AC250 (r.m.s.) SL (JIS) 68 ±5% 4.5 2.0 2.0 2.5 0.3 min.

GA342D1XGD820JY02L AC250 (r.m.s.) SL (JIS) 82 ±5% 4.5 2.0 2.0 2.5 0.3 min.

GA342QR7GD101KW01L AC250 (r.m.s.) X7R (EIA) 100 ±10% 4.5 2.0 1.5 2.5 0.3 min.

GA342QR7GD151KW01L AC250 (r.m.s.) X7R (EIA) 150 ±10% 4.5 2.0 1.5 2.5 0.3 min.

GA342QR7GD221KW01L AC250 (r.m.s.) X7R (EIA) 220 ±10% 4.5 2.0 1.5 2.5 0.3 min.

GA342QR7GD331KW01L AC250 (r.m.s.) X7R (EIA) 330 ±10% 4.5 2.0 1.5 2.5 0.3 min.

GA342QR7GD471KW01L AC250 (r.m.s.) X7R (EIA) 470 ±10% 4.5 2.0 1.5 2.5 0.3 min.

GA342QR7GD681KW01L AC250 (r.m.s.) X7R (EIA) 680 ±10% 4.5 2.0 1.5 2.5 0.3 min.

GA342QR7GD102KW01L AC250 (r.m.s.) X7R (EIA) 1000 ±10% 4.5 2.0 1.5 2.5 0.3 min.

GA342QR7GD152KW01L AC250 (r.m.s.) X7R (EIA) 1500 ±10% 4.5 2.0 1.5 2.5 0.3 min.

GA343QR7GD182KW01L AC250 (r.m.s.) X7R (EIA) 1800 ±10% 4.5 3.2 1.5 2.5 0.3 min.

GA343QR7GD222KW01L AC250 (r.m.s.) X7R (EIA) 2200 ±10% 4.5 3.2 1.5 2.5 0.3 min.

GA343DR7GD472KW01L AC250 (r.m.s.) X7R (EIA) 4700 ±10% 4.5 3.2 2.0 2.5 0.3 min.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

123

20

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Chip Monolithic Ceramic Capacitors

Safety Standard Recognized Type GF (IEC60384-14 Class Y2)

■ Features

1. A new monolithic structure for small, high

capacitance capable of operating at high voltage

levels.

2. The type GF can be used as a Y2-class capacitor.

3. Available for equipment based on IEC/EN60950

and UL1950. Besides, the GA352/355 types are

available for equipment based on IEC/EN60065,

UL1492, and UL6500.

4. +125 degree C guaranteed.

5. Only for reflow soldering.

6. The low-profile type (thickness: 1.5mm max.) is

available. Fit for use on thinner type equipment.

■ Applications

1. Ideal for use on line filters and couplings for

DAA modems without transformers.

2. Ideal for use on line filters for information

equipment.

3. Ideal for use as Y capacitor or X capacitor for

various switching power supplies. (GA352/355 types

only)

Part Number LTW

Dimensions (mm) g min.e min.

2.0 ±0.2*

GA342D

GA342Q

GA352Q

GA355Q

4.5 ±0.3 2.5

4.0

0.3

2.0 ±0.2

5.7 ±0.4 2.8 ±0.3

5.0 ±0.4

1.5 +0, -0.3

L

T

W

e eg

* GA342D1X : 2.0±0.3

■ Standard Recognition

UL

SEMKO

Status of Recognition

Rated

Voltage

Standard

No. Class

UL1414

EN132400

X1, Y2

Y2 AC250V

(r.m.s.)

Size : 4.5×2.0mm Size : 5.7×2.8mm

and over

Type GF

Y

Applications Communication

network devices

such as a modem

Size Switching power

supplies

4.5×2.0mm

5.7×2.8mm and over

Y

Part Number Rated Voltage

(V) TC Code

(Standard) Capacitance

(pF) Length L

(mm) Width W

(mm) Thickness T

(mm)

Electrode g

min.

(mm)

Electrode e

(mm)

GA342D1XGF100JY02L AC250 (r.m.s.) SL (JIS) 10 ±5% 4.5 2.0 2.0 2.5 0.3 min.

GA342D1XGF120JY02L AC250 (r.m.s.) SL (JIS) 12 ±5% 4.5 2.0 2.0 2.5 0.3 min.

GA342D1XGF150JY02L AC250 (r.m.s.) SL (JIS) 15 ±5% 4.5 2.0 2.0 2.5 0.3 min.

GA342D1XGF180JY02L AC250 (r.m.s.) SL (JIS) 18 ±5% 4.5 2.0 2.0 2.5 0.3 min.

GA342D1XGF220JY02L AC250 (r.m.s.) SL (JIS) 22 ±5% 4.5 2.0 2.0 2.5 0.3 min.

GA342D1XGF270JY02L AC250 (r.m.s.) SL (JIS) 27 ±5% 4.5 2.0 2.0 2.5 0.3 min.

GA342D1XGF330JY02L AC250 (r.m.s.) SL (JIS) 33 ±5% 4.5 2.0 2.0 2.5 0.3 min.

GA342D1XGF390JY02L AC250 (r.m.s.) SL (JIS) 39 ±5% 4.5 2.0 2.0 2.5 0.3 min.

GA342D1XGF470JY02L AC250 (r.m.s.) SL (JIS) 47 ±5% 4.5 2.0 2.0 2.5 0.3 min.

GA342D1XGF560JY02L AC250 (r.m.s.) SL (JIS) 56 ±5% 4.5 2.0 2.0 2.5 0.3 min.

GA342D1XGF680JY02L AC250 (r.m.s.) SL (JIS) 68 ±5% 4.5 2.0 2.0 2.5 0.3 min.

GA342D1XGF820JY02L AC250 (r.m.s.) SL (JIS) 82 ±5% 4.5 2.0 2.0 2.5 0.3 min.

GA342QR7GF101KW01L AC250 (r.m.s.) X7R (EIA) 100 ±10% 4.5 2.0 1.5 2.5 0.3 min.

GA342QR7GF151KW01L AC250 (r.m.s.) X7R (EIA) 150 ±10% 4.5 2.0 1.5 2.5 0.3 min.

GA342DR7GF221KW02L AC250 (r.m.s.) X7R (EIA) 220 ±10% 4.5 2.0 2.0 2.5 0.3 min.

GA342DR7GF331KW02L AC250 (r.m.s.) X7R (EIA) 330 ±10% 4.5 2.0 2.0 2.5 0.3 min.

GA352QR7GF471KW01L AC250 (r.m.s.) X7R (EIA) 470 ±10% 5.7 2.8 1.5 4.0 0.3 min.

GA352QR7GF681KW01L AC250 (r.m.s.) X7R (EIA) 680 ±10% 5.7 2.8 1.5 4.0 0.3 min.

GA352QR7GF102KW01L AC250 (r.m.s.) X7R (EIA) 1000 ±10% 5.7 2.8 1.5 4.0 0.3 min.

GA352QR7GF152KW01L AC250 (r.m.s.) X7R (EIA) 1500 ±10% 5.7 2.8 1.5 4.0 0.3 min.

GA355QR7GF182KW01L AC250 (r.m.s.) X7R (EIA) 1800 ±10% 5.7 5.0 1.5 4.0 0.3 min.

GA355QR7GF222KW01L AC250 (r.m.s.) X7R (EIA) 2200 ±10% 5.7 5.0 1.5 4.0 0.3 min.

GA355QR7GF332KW01L AC250 (r.m.s.) X7R (EIA) 3300 ±10% 5.7 5.0 1.5 4.0 0.3 min.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

124

21

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Chip Monolithic Ceramic Capacitors

Safety Standard Recognized Type GB (IEC60384-14 Class X2)

■ Features

1. Chip monolithic ceramic capacitor (certified as

conforming to safety standards) for AC lines.

2. A new monolithic structure for small, high

capacitance capable of operating at high voltage

levels.

3. Compared to lead type capacitors, this new

capacitor is greatly downsized and low-profiled to

1/10 or less in volume, and 1/4 or less in height.

4. The type GB can be used as an X2-class capacitor.

5. +125 degree C guaranteed.

6. Only for reflow soldering.

■ Applications

Ideal for use as X capacitor for various switching

power supplies.

Part Number LTW

Dimensions (mm) g min.e min.

2.0 ±0.3

GA355D 5.7 ±0.4 4.00.35.0 ±0.4 2.7 ±0.3

GA355X

L

T

W

e eg

■ Standard Recognition

UL

BSI

VDE

SEV

SEMKO

EN132400 Class

Status of Recognition Rated

Voltage

Standard No.

∗: Line-By-Pass only

UL1414

EN132400 AC250V

(r.m.s.)

Type GB Type GC

Y

Y

X2

∗

X1, Y2

Part Number Rated Voltage

(V) TC Code

(Standard) Capacitance

(pF) Length L

(mm) Width W

(mm) Thickness T

(mm)

Electrode g

min.

(mm)

Electrode e

(mm)

GA355DR7GB103KY02L AC250 (r.m.s.) X7R (EIA) 10000 ±10% 5.7 5.0 2.0 4.0 0.3 min.

GA355DR7GB153KY02L AC250 (r.m.s.) X7R (EIA) 15000 ±10% 5.7 5.0 2.0 4.0 0.3 min.

GA355DR7GB223KY02L AC250 (r.m.s.) X7R (EIA) 22000 ±10% 5.7 5.0 2.0 4.0 0.3 min.

GA355XR7GB333KY06L AC250 (r.m.s.) X7R (EIA) 33000 ±10% 5.7 5.0 2.7 4.0 0.3 min.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Continued on the following page.

No. Item Specifications Test Method

Within the specified dimensions

No defects or abnormalities

Y55 to W125D

Operating

Temperature Range

Appearance

Dimensions

Dielectric Strength

1

2

3

4

Using calipers

No failure should be observed when voltage in table is applied

between the terminations for 60T1 sec., provided the

charge/discharge current is less than 50mA.

Visual inspection

Y

*1 "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

*2 "C" expresses nominal capacitance value (pF).

9

More than 6,000MΩ

Insulation Resistance

(I.R.)

6The insulation resistance should be measured with DC500T50V

and within 60T5 sec. of charging.

Within the specified tolerance

Capacitance

Dissipation

Factor (D.F.)

Q

7

8

The capacitance/Q/D.F. should be measured at 20Dat a

frequency of 1T0.2kHz (SL char. : 1T0.2MHz) and a voltage of

AC1T0.2V (r.m.s.).

#Pretreatment for X7R char.

Perform a heat treatment at 150 Dfor 60T5 min. and then

let sit for 24T2 hrs. at *1room condition.

W00

Y10

No removal of the terminations or other defect should occur.

Adhesive Strength

of Termination

11

Solder the capacitor to the testing jig (glass epoxy board) shown

in Fig. 1 using a eutectic solder. Then apply 10N force in the

direction of the arrow. The soldering should be done either with

an iron or using the reflow method and should be conducted with

care so that the soldering is uniform and free of defects such as

heat shock.

10N, 10T1s

Speed : 1.0mm/s

Glass Epoxy Board

Fig. 1

R3 R1

R2

Ct

Cd

10kV V

Ct : Capacitor under test Cd : 0.001µF

R1 : 1,000ΩR2 : 100MΩR3 : Surge resistance

Type GB

Type GC/GD/GF

Test voltage

DC1075V

AC1500V (r.m.s.)

No defects or abnormalities

More than 1,000MΩ

In accordance with item No.4

Discharge

Test

(Application:

Type GC)

10

As in Fig., discharge is made 50 times at 5 sec. intervals from

the capacitor (Cd) charged at DC voltage of specified.

Appearance

I.R.

Dielectric

Strength

Char.

X7R

SL

D.F.V0.025

QU400+20C*2(CF30pF)

QU1000 (CU30pF)

Specification

No self healing break downs or flash-overs have taken place in

the capacitor.

Pulse Voltage

(Application: Type

GD/GF)

5

10 impulse of alternating polarity is subjected.

(5 impulse for each polarity)

The interval between impulse is 60 sec.

Applied Voltage : 2.5kV zero to peak

Char.

X7R Within T15%

Capacitance Change

Temperature characteristic guarantee is Y55 to W125D

Char.

SL +350 to -1000ppm/D

Temperature Coefficient

Temperature characteristic guarantee is W20 to W85D

Capacitance

Temperature

Characteristics

The range of capacitance change compared with the 25D (SL

char. : 20D) value within Y55 to W125Dshould be within the

specified range.

#Pretreatment for X7R char.

Perform a heat treatment at 150 Dfor 60T5 min. and then

let sit for 24T2 hrs. at *1room condition.

W00

Y10

GA3 Series Specifications and Test Methods

125

21

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Continued from the preceding page.

Continued on the following page.

75% of the terminations are to be soldered evenly and continuously.

Solderability of

Termination

14

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion).

Immerse in eutectic solder solution for 2T0.5 sec. at 235T5D.

Immersing speed : 25T2.5mm/s

No. Item Specifications Test Method

Step

1

2100Dto 120D

170Dto 200D

1 min.

Temperature Time

More than 1,000MΩ

Appearance

I.R.

Capacitance

Change

No marking defects

Resistance

to Soldering

Heat

15

Preheat the capacitor as table. Immerse the capacitor in

eutectic solder solution at 260T5Dfor 10T1 sec. Let sit at

*1room condition for 24T2 hrs., then measure.

#Immersing speed : 25T2.5mm/s

#Pretreatment for X7R char.

Perform a heat treatment at 150 Dfor 60T5 min. and then

let sit for 24T2 hrs. at *1room condition.

*Preheating

W00

Y10

In accordance with item No.4

Dielectric

Strength

Fig. 2

Deflection13

Solder the capacitor to the testing jig (glass epoxy board) shown

in Fig. 2 using a eutectic solder. Then apply a force in the

direction shown in Fig. 3. The soldering should be done either

with an iron or using the reflow method and should be conducted

with care so that the soldering is uniform and free of defects such

as heat shock.

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,QR¢£

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,QR¢£

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ST¤¥

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φ4.5

t : 1.6

d

Capacitance meter

Flexure=1

20 50

R230

45 45

Pressurizing

speed : 1.0mm/s

Pressurize

Fig. 3

No cracking or marking defects should occur.

(in mm)

LZW

(mm)

4.5Z2.0 3.5 7.0 2.4

4.5Z3.2 3.5 7.0 3.7

5.7Z2.8 4.5 8.0 3.2

5.7Z5.0 4.5 8.0 5.6

1.0

Dimension (mm)

abcd

Solder resist

Cu

Glass Epoxy Board

No defects or abnormalities

Within the specified tolerance

Vibration

Resistance

12

Solder the capacitor to the test jig (glass epoxy board).

The capacitor should be subjected to a simple harmonic motion

having a total amplitude of 1.5mm, the frequency being varied

uniformly between the approximate limits of 10 and 55Hz. The

frequency range, from 10 to 55Hz and return to 10Hz, should be

traversed in approximately 1 min. This motion should be applied

for a period of 2 hrs. in each 3 mutually perpendicular directions

(total of 6 hrs.).

Appearance

Capacitance

D.F.

Q

*1 "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

*2 "C" expresses nominal capacitance value (pF).

Char.

X7R

SL

D.F.V0.025

QU400+20C*2(CF30pF)

QU1000 (CU30pF)

Specification

Char.

X7R

SL

Within T10%

Within T2.5% or T0.25pF

(Whichever is larger)

Capacitance Change

GA3 Series Specifications and Test Methods

126

21

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Continued from the preceding page.

No. Item Specifications Test Method

Apply voltage as Table for 1,000 hrs. at 125 D, relative

humidity 50% max.

W2

Y0

More than 3,000MΩ

Appearance

I.R.

Capacitance

Change

D.F.

Q

No marking defects

Life18

Impulse Voltage

Each individual capacitor should

be subjected to a 2.5kV (Type

GC/GF : 5kV) Impulses (the

voltage value means zero to

peak) for three times. Then the

capacitors are applied to life test.

In accordance with item No.4

Dielectric

Strength

Tt

T2

030

50

90

100 (%) T1

=

1.2µs=1.67T

T2

=

50µs

Type

GB

GC

GD

GF

Applied voltage

AC312.5V (r.m.s.), except that once each hour the

voltage is increased to AC1,000V (r.m.s.) for 0.1 sec.

AC425V (r.m.s.), except that once each hour the

voltage is increased to AC1,000V (r.m.s.) for 0.1 sec.

More than 3,000MΩ

Appearance

I.R.

Capacitance

Change

D.F.

Q

No marking defects

Humidity

(Steady

State)

17

Let the capacitor sit at 40T2Dand relative humidity of 90 to 95%

for 500T12 hrs.

Remove and let sit for 24T2 hrs. at *1room condition, then

measure.

#Pretreatment for X7R char.

Perform a heat treatment at 150 Dfor 60T5 min. and then

let sit for 24T2 hrs. at *1room condition.

W00

Y10

In accordance with item No.4

Dielectric

Strength

#Pretreatment for X7R char.

Perform a heat treatment at 150 Dfor 60T5 min. and then

let sit for 24T2 hrs. at *1room condition.

W00

Y10

Solder resist

Cu

Glass Epoxy Board

Fig. 4

Step

1

2

3

4

Min. Operating Temp.T3

Room Temp.

Max. Operating Temp.T2

Room Temp.

30T3

2 to 3

30T3

2 to 3

Temperature (D)Time (min.)

More than 3,000MΩ

Appearance

I.R.

Capacitance

Change

D.F.

Q

No marking defects

Temperature

Cycle

16

Fix the capacitor to the supporting jig (glass epoxy board) shown

in Fig. 4 using a eutectic solder.

Perform the 5 cycles according to the 4 heat treatments listed in

the following table.

Let sit for 24T2 hrs. at *1room condition, then measure.

In accordance with item No.4

Dielectric

Strength

Char.

X7R

SL

D.F.V0.05

QU400+20C*2(CF30pF)

QU1000 (CU30pF)

Specification

Char.

X7R

SL

Within T15%

Within T2.5% or T0.25pF

(Whichever is larger)

Capacitance Change

*1 "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

*2 "C" expresses nominal capacitance value (pF).

Char.

X7R

SL

D.F.V0.05

QU275+5/2C*2(CF30pF)

QU350 (CU30pF)

Specification

Char.

X7R

SL

Within T15%

Within T5.0% or T0.5pF

(Whichever is larger)

Capacitance Change

Continued on the following page.

Char.

X7R

SL

D.F.V0.05

QU275+5/2C*2(CF30pF)

QU350 (CU30pF)

Specification

Char.

X7R

SL

Within T20%

Within T3.0% or T0.3pF

(Whichever is larger)

Capacitance Change

Let sit for 24T2 hrs. at *1room condition, then measure.

#Pretreatment for X7R char.

Perform a heat treatment at 150 Dfor 60T5 min. and then

let sit for 24T2 hrs. at *1room condition.

W00

Y10

GA3 Series Specifications and Test Methods

127

21

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Continued from the preceding page.

No. Item Specifications Test Method

More than 3,000MΩ

Appearance

I.R.

Capacitance

Change

D.F.

Q

No marking defects

Humidity

Loading

19

Apply the rated voltage at 40T2Dand relative humidity of 90 to

95% for 500 hrs. Remove and let sit for 24T2 hrs. at *1room

condition, then measure.

#Pretreatment for X7R char.

Perform a heat treatment at 150 Dfor 60T5 min. and then

let sit for 24T2 hrs. at *1room condition.

W00

Y10

W24

Y00

In accordance with item No.4

Dielectric

Strength

Char.

X7R

SL

Within T15%

Within T5.0% or T0.5pF

(Whichever is larger)

Capacitance Change

Char.

X7R

SL

D.F.V0.05

QU275+5/2C*2(CF30pF)

QU350 (CU30pF)

Specification

*1 "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

*2 "C" expresses nominal capacitance value (pF).

GA3 Series Specifications and Test Methods

128

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

GRM/GR4/GA2/GA3 Series Data (Typical Example)

129

21

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

■ Capacitance-Temperature Characteristics

GRM/GR4/GA2 Series

Cap. Change [%]

Temperature [°C]

−20

0

5

10

−60 −40 −20 0 20 40 60 80 100 120 140

−15

−10

−5

15

20

B

BC0G

C0G

SL

R

SL

R

X7R

GA3 Series (type GB/GC)

−30−60 −40 −20 0 20 40 60 80 100 120 140

−20

−10

0

10

20

30

Cap. Change (%)

Temperature (°C)

X7R Char. Spec.(upper)

X7R Char. Spec.(lower)

Type G C ( 681)

Type G C (102 )

Type G B

GA3 Series (type GD/GF)

-30

-20

-10

0

10

20

30

-60 -40 -20 0 20 40 60 80 100 120 140

Temperature (°C)

Cap. Change (%)

X7R Char. Spec.(upper)

X7R Char. Spec.(lower)

■ Impedance-Frequency Characteristics

GRM Series (SL Characteristics)

Z [ohm]

Frequency [Hz]

100m

100

1k

1M 10M 100M 1G 3G

1

10

10k

100k

10pF

22pF

47pF

100pF

220pF

GRM Series (R Characteristics)

Z [ohm]

Frequency [Hz]

10m

10

100

1M 10M 100M 1G

100m

1

1k

10k

100pF

220pF

470pF

1000pF

Continued on the following page.

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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

GRM/GR4/GA2/GA3 Series Data (Typical Example)

130

21

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Continued from the preceding page.

■ Impedance-Frequency Characteristics

GRM Series (X7R Char. 250V)

1k

100

10

1

100m

10m

1M 10M 100M 1G

Frequency [Hz]

Z [ohm]

1000pF

10000pF

100000pF

GRM Series (X7R Char. 630V)

1k

100

10

1

100m

10m

1M 10M 100M 1G

Frequency [Hz]

Z [ohm]

1000pF

10000pF

100000pF

GA2 Series

Z [ohm]

Frequency [Hz]

10m

10

1M 10M 100M 1G

1

100

1k

100m

10000pF

1000pF

100000pF

GA3 Series (Type GC)

Z (ohm)

1000

100

10

1

0.1

0.011 10 100 1000

Frequency (MHz)

4.7nF 0.68nF

GA3 Series (Type GD)

1K

100

10

1

100m

10m

1M 10M 100M 1G

Frequency [Hz]

Z [ohm]

150pF

1000pF

2200pF

GA3 Series (Type GF)

1K

100

10

1

100m

10m

1M 10M 100M 1G

Frequency [Hz]

Z [ohm]

1000pF

2200pF

Continued on the following page.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

GRM/GR4/GA2/GA3 Series Data (Typical Example)

131

21

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Continued from the preceding page.

■ Impedance-Frequency Characteristics

GA3 Series (Type GB)

1000

100

10

1

0.1

0.011 10 100 1000

Frequency (MHz)

33nF

10nF

Z (ohm)

■ Capacitance-AC Voltage Characteristics

GA3 Series (Type GC)

−20

−60

Cap. Change (%)

at Room Condition (25°C)

−40

0

20

4.7nF

0.68nF

40

60

0 100 200 300 400 500

AC-Voltage [V(r.m.s.)]

GA3 Series (Type GD/GF, X7R char.)

-60

-40

-20

0

20

40

60

0 100 200 300 400 500

AC-Voltage [V(r.m.s.)]

Cap. Change (%)

at Room Condition (25°C)

GA3 Series (Type GB)

−20

−60

Cap. Change (%)

at Room Condition (25°C)

−40

0

20

40

60

0 100 200 300 400 500

AC-Voltage [V(r.m.s.)]

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Taping is standard packaging method.

Part Number Dimensions (mm)

WT

φ180mm reel

Paper Tape Plastic Tape

L

Quantity (pcs.)

Medium-voltage

AC250V

Safety Std.

Recognition

GRM18

GRM21

GRM31/GR431

GRM32/GR432

GRM42/GR442

GRM43/GR443

GRM55/GR455

GA242

GA243

GA255

GA342

GA343

GA352

GA355

1.6

2.0

3.2

4.5

5.7

4.5

5.7

4.5

5.7

0.8

1.25

1.6

2.5

2.0

3.2

5.0

2.0

3.2

5.0

2.0

3.2

2.8

5.0

0.8

1.0

1.25

1.0

1.25

1.6

1.5

2.0

1.0

1.25

1.5

2.0

1.5

2.0

2.5

2.0

1.5

2.0

1.5

2.0

1.5

2.0

1.5

2.0

1.5

2.0

2.7

4,000

-

4,000

-

3,000

-

3,000

2,000

1,000

3,000

2,000

1,000

500

1,000

2,000

1,000

2,000

1,000

500

■ Minimum Quantity Guide

■ Tape Carrier Packaging

(1) Appearance of Taping

qPlastic Tape wPaper Tape

Top Tape : 0.05mm in thickness

Sprocket Hole : As specified in (2)

Cavity for Chip : As specified in (2)

Base Tape : As specified in (2)

Bottom Tape : 0.05mm in thickness

Chip

Packed Chips

Cover Tape : 0.06mm in thickness

Sprocket Hole : As specified in (2)

Cavity for Chip : As specified in (2)

Base Tape : As specified in (2)

Chip

Packed Chips

Continued on the following page.

Package

132

21

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

(2) Dimensions of Tape

q Plastic Tape

w Paper Tape (3) Dimensions of Reel

8mm width 4mm pitch Tape

12mm width 8mm/4mm pitch Tape

A*Part Number A*Part NumberB*

GRM21

(TU1.25mm) 1.45 2.25

GRM31/GR431

(TU1.25mm) 2.0 3.6

GRM32/GR432 2.9 3.6

B*

2.5 5.1

3.6 4.9

3.2 6.1

GRM42/GR442/GA242/GA342

GRM43/GR443/GA243/GA343

GA252/GA352

GRM55/GR455/

GA255/GA355 5.4

*1 4.0±0.1mm in case of GRM42/GR442/GA242/GA342

6.1

*Nominal Value

A*Part Number B*

GRM21

(T=1.0mm) 1.45 2.25

GRM18 1.05 1.85

GRM31

(T=1.0mm) 2.0 3.6

*Nominal value

(in mm)

4.0T0.1

4.0T0.05

1.75T0.1

8.0T0.3

Direction of Feed

A

B

2.0T0.05 0.25T0.1

2.5 max.

3.5T0.05

φ1.5W0.1

Y08.0T0.1*1

4.0

T

0.1 1.75

T

0.1

12.0T0.3

Direction of Feed

5.5T0.05

2.0T0.05 0.3T0.1

3.7 max.

B

A

φ1.5W0.1

Y0

4.0T0.1 φ1.5W0.1

Y0

4.0T0.1

1.75T0.1 1.1 max.

8.0T0.3

Direction of Feed

A

B

3.5T0.05

2.0T0.05

2.0T0.5

9.0 (Tape width 8mm)

13.0 (Tape width 12 mm)

φ13T0.2

φ21T0.8

60 +1

-

0

-

3

180+0

-

0

+1.0

-

0

+1.0

Continued from the preceding page.

Continued on the following page.

Package

133

21

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

(4) Taping Method

q Tapes for capacitors are wound clockwise. The

sprocket holes are to the right as the tape is pulled

toward the user.

w Part of the leader and part of the empty tape shall be

attached to the end of the tape as shown at right.

e The top tape or cover tape and base tape are not

attached at the end of the tape for a minimum of 5

pitches.

r Missing capacitors number within 0.1% of the number

per reel or 1 pc, whichever is greater, and are not

continuous.

t The top tape or cover tape and bottom tape shall not

protrude beyond the edges of the tape and shall not

cover sprocket holes.

y Cumulative tolerance of sprocket holes, 10 pitches :

T0.3mm.

u Peeling off force : 0.1 to 0.7N in the direction shown at

right.

(in mm)

165 to 180°

Base Tape

Top Tape or Cover Tape

Direction of feed

40 to 200 100 to 200

250 to 560

(Top Tape or Cover Tape alone)

Vacant section Chip-mounting unit Vacant section

Leader unit

Continued from the preceding page.

Package

134

21

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Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

!Caution

135

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■ Storage and Operating Conditions

Operating and storage environment

Do not use or store capacitors in a corrosive

atmosphere, especially where chloride gas, sulfide

gas, acid, alkali, salt or the like are present. And

avoid exposure to moisture. Before cleaning, bonding

or molding this product, verify that these processes

do not affect product quality by testing the

performance of a cleaned, bonded or molded product

in the intended equipment. Store the capacitors

where the temperature and relative humidity do not

exceed 5 to 40 degrees centigrade and 20 to 70%.

Use capacitors within 6 months. Check the

solderability after 6 months or more.

FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY

RESULT, WORST CASE, IN A SHORT CIRCUIT

AND CAUSE FUMING OR PARTIAL DISPERSION

WHEN THE PRODUCT IS USED.

■ Handling

1. Vibration and impact

Do not expose a capacitor to excessive shock or

vibration during use.

2. Do not directly touch the chip capacitor, especially

the ceramic body. Residue from hands/fingers may

create a short circuit environment.

FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY

RESULT, WORST CASE, IN A SHORT CIRCUIT

AND CAUSE FUMING OR PARTIAL DISPERSION

WHEN THE PRODUCT IS USED.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Caution (Rating)

When DC-rated capacitors are to be used in AC or ripple

current circuits, be sure to maintain the Vp-p value of the

applied voltage or the Vo-p which contains DC bias within

the rated voltage range.

When the voltage is applied to the circuit, starting or

stopping may generate irregular voltage for a transit

period because of resonance or switching. Be sure to use

a capacitor with a rated voltage range that includes these

irregular voltages.

Voltage

Positional

Measurement

DC Voltage DC+AC Voltage AC Voltage Pulse Voltage (1) Pulse Voltage (2)

V0-p V0-p Vp-p Vp-p Vp-p

1. Operating Voltage

Keep the surface temperature of a capacitor below the

upper limit of its rated operating temperature range.

Be sure to take into account the heat generated by the

capacitor itself. When the capacitor is used in a high-

frequency current, pulse current or the like, it may

have the self-generated heat due to dielectric-loss.

Applied voltage should be the load such as self-

generated heat is within 20°C on the condition of

atmosphere temperature 25°C. When measuring, use a

thermocouple of small thermal capacity-K of ø0.1mm

in conditions where the capacitor is not affected by

radiant heat from other components or surrounding

ambient fluctuations. Excessive heat may lead to

deterioration of the capacitor's characteristics and

reliability. (Never attempt to perform measurement

with the cooling fan running. Otherwise, accurate

measurement cannot be ensured.)

2. Operating Temperature and Self-generated Heat

Continued on the following page.

(1) In case of X7R char. and GA3 series SL char.

Keep the surface temperature of a capacitor below the

upper limit of its rated operating temperature range.

Be sure to take into account the heat generated by the

capacitor itself. When the capacitor is used in a high-

frequency current, pulse current or similar current, it may

self-generate heat due to dielectric loss.

The frequency of the applied sine wave voltage should be

less than 500kHz (less than 100kHz in case of rated

voltage: DC3.15kV). The applied voltage should be less

than the value shown in figure at right.

In case of non-sine wave which include a harmonic

frequency, please contact our sales representatives or

product engineers. Excessive heat may lead to

deterioration of the capacitor's characteristics and

reliability. (Never attempt to perform measurement with

the cooling fan running.

Otherwise, accurate measurement cannot be ensured.)

(2) In case of C0G/R char.

100

1000

10000

to 470pF

Rated Voltage: DC630V

Frequency [kHz]

1000(500)100101

100

(630)

Allowable voltage [Vp-p]Allowable voltage [Vp-p]

1000

to 1000pF

The sine-wave frequency VS allowable voltage

Rated Voltage: DC1kV

The temperature of the surface

of capacitor: 125˚ C (including self- heating)

Rated Voltage: DC3.15kV

Frequency [kHz] 1000100101

1000

(3150)

Allowable voltage [Vp-p]

10000

to 47pF

!Caution

136

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Tests for AC withstanding voltage should be made with

equipment capable of creating a wave similar to a

50/60 Hz sine wave.

If the distorted sine wave or overload exceeding the

specified voltage value is applied, a defect may be

caused.

3. Test condition for AC withstanding Voltage

(1) Test Equipment

The capacitor's leads or terminals should be firmly

connected to the output of the withstanding voltage test

equipment, and then the voltage should be raised from

near zero to the test voltage. If the test voltage is applied

directly to the capacitor without raising it from near zero,

it should be applied with the *zero cross. At the end of the

test time, the test voltage should be reduced to near zero,

and then the capacitor's leads or terminals should be

taken off the output of the withstanding voltage test

equipment. If the test voltage is applied directly to the

capacitor without raising it from near zero, surge voltage

may occur and cause a defect.

*ZERO CROSS is the point where voltage sine wave

pass 0V.

- See the figure at right -

(2) Voltage applied method

Continued on the following page.

Keep the surface temperature of a capacitor below the

upper limit of its rated operating temperature range.

Be sure to take into account the heat generated by the

capacitor itself. When the capacitor is used in a high-

frequency current, pulse current or similar current, it may

self-generate heat due to dielectric loss.

The frequency of the applied sine wave voltage should be

less than 500kHz. The applied voltage should be less

than the value shown in figure at right.

In case of non-sine wave which include a harmonic

frequency, please contact our sales representatives or

product engineers. Excessive heat may lead to

deterioration of the capacitor's characteristics and

reliability. (Never attempt to perform measurement with

the cooling fan running.

Otherwise, accurate measurement cannot be ensured.)

(3) In case of GRM series SL char.

0V

zero cross

Voltage sine wave

Continued from the preceding page.

The sine-wave frequency VS allowable voltage

The temperature of the surface

of capacitor: 125˚ C (including self- heating)

Rated Voltage: DC2kV

to 220pF

Frequency [kHz]

Allowable voltage [Vp-p]

1000(500)100101

100

1000

10000

Rated Voltage: DC3.15kV

100pF

Frequency [kHz]

Allowable voltage [Vp-p]

1000(500)100101

100

1000

10000

!Caution

137

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Failure of a capacitor may result in a short circuit. Be sure

to provide an appropriate fail-safe function such as a fuse

on your product to help eliminate possible electric shock,

fire, or fumes.

Please consider using fuses on each AC line if the

capacitors are used between the AC input lines and earth

(line bypass capacitors), to prepare for the worst case,

such as a short circuit.

FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY

RESULT, WORST CASE, IN A SHORT CIRCUIT AND

CAUSE FUMING OR PARTIAL DISPERSION WHEN THE

PRODUCT IS USED.

4. Fail-Safe

Continued from the preceding page.

AC IN

FUSE

!Caution

138

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

[Chip Mounting Close to Board Separation Point]

A

B

D

C

Perforation

Slit

Locate chip

horizontal to the

direction in which

stress acts.

Chip arrangement

Worst AGCGB~D Best

[Component Direction]

Caution (Soldering and Mounting)

1. Vibration and Impact

Do not expose a capacitor to excessive shock or vibration

during use.

2. Circuit Board Material

In case that chip size is 4.5g3.2mm or more, a metal-

board or metal-frame such as Aluminum board is not

available because soldering heat causes expansion and

shrinkage of a board or frame, which will cause a chip to

crack.

3. Land Layout for Cropping PC Board

Choose a mounting position that minimizes the stress

imposed on the chip during flexing or bending of the

board.

Continued on the following page.

!Caution

139

21

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

4. Soldering (Prevention of the thermal shock)

If a chip component is heated or cooled abruptly during

soldering, it may crack due to the thermal shock. To

prevent this, follow our recommendations below for

adequate soldering conditions.

5. Soldering Method

GR/GA products whose sizes are 3.2Z1.6mm and under

for flow and reflow soldering, and other sizes for reflow

soldering.

Be sure to contact our sales representatives or engineers

in case that GR/GA products (size 3.2Z2.5mm and over)

are to be mounted with flow soldering. It may crack due

to the thermal shock.

FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY

RESULT, WORST CASE, IN A SHORT CIRCUIT AND

FUMING WHEN THE PRODUCT IS USED.

Carefully perform pre-heating so that temperature

difference (∆T) between the solder and component

surface is in the following range. When components

are immersed in solvent after mounting, pay special

attention to keep the temperature difference within

100˚C.

When correcting chips with a soldering iron, no

preheating is required if the chip is listed in following

table and the following conditions are met.

Preheating should be performed on chips not listed in

following table.

3.2g1.6mm

and under 3.2g2.5mm

and over

Chip Size

Soldering Method

Reflow Method or

Soldering Iron Method

Flow Method or

Dip Soldering Method

∆TV190˚C

∆TV150˚C

∆TV130˚C

Conditions

Item

Chip Size

Temperature of Iron tip

Soldering Iron Wattage

Diameter of Iron tip

Soldering Time

Caution

V2.0g1.25mm 3.2g1.6mm

300˚C max. 270˚C max.

20W max.

φ 3.0mm max.

3 sec. max.

Do not allow the iron tip to directly

touch the ceramic element.

Infrared Reflow Soldering Conditions

(Example)

,,,,,

,,,

,,,,,,,

,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,

,,,,,,,,,,,

,,,,,,,

,,,

220 to 230D

Within 10 sec.

∆T

200D

Pre-heating

60 sec. min.

Within120 sec. Within 20 sec.

Temperature (D)

Vapor Reflow Soldering (VPS)

Conditions (Example)

,,,,

,,,,,,,,,

,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,

,,,,,,,,,

,,,,

∆T

Pre-heating

60 sec. min.

Within120 sec. Within 20 sec.

215

D

Temperature(D)

Dip Soldering/Soldering Iron

Conditions (Example)

,,,,,

,,,,,,,,,

,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,

,,,,,,,,,,

,,,,,,

,

∆

T

Pre-heating

60 to 120 sec. Within 20 sec.

Temperature (D)

Flow Soldering Conditions

(Example)

,,

,,,,,,

,,,,,,,,,,,

,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,

,,,,,,,,,,,,

,,,,,,,,

,,,,

∆

T

Pre-heating

60 to 120 sec. Within 5 sec.

230 to 240D

Temperature (D)

Continued from the preceding page.

!Caution

140

21

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

1. Mounting of Chips

Mechanical shock of the chip placer

When the positioning claws and pick-up nozzle are worn,

the load is applied to the chip while positioning is

concentrated in one position, thus causing cracks,

breakage, faulty positioning accuracy, etc.

Careful checking and maintenance are necessary to

prevent unexpected trouble.

An excessively low bottom dead point of the suction

nozzle imposes great force on the chip during mounting,

causing cracked chips. Please set the suction nozzle's

bottom dead point on the upper surface of the board.

2. Construction of Board Pattern

After installing chips, if solder is excessively applied to

the circuit board, mechanical stress will cause destruction

resistance characteristics to lower. To prevent this, be

extremely careful in determining shape and dimension

before designing the circuit board diagram.

Termination Thickness of Chip Capacitor and Desirable

Thickness of Adhesives Applied

Construction and Dimensions of Pattern (Example)

Preparing slit helps flux

cleaning and resin coating on

the back of the capacitor.

LgWa b c

2.0g1.25 1.0-1.2 0.9-1.0 0.8-1.1

1.6g0.8 0.6-1.0 0.8-0.9 0.6-0.8

2.2-2.6 1.0-1.1 1.0-1.43.2g1.6

Flow Soldering

LgWa b c d e

2.0g1.25 1.0-1.2 0.9-1.0 0.8-1.1

2.2-2.4 0.8-0.9 1.0-1.4

-

1.0-2.0

-

1.6g0.8 0.6-0.8 0.6-0.7 0.6-0.8 - -

3.2-3.73.2g1.6

2.0-2.4 1.0-1.2 1.8-2.3 1.0-2.0 4.1-4.63.2g2.5

2.8-3.4 1.2-1.4 1.4-1.8 1.0-2.8 3.6-4.14.5g2.0

2.8-3.4 1.2-1.4 2.3-3.0 1.0-2.8 4.8-5.34.5g3.2

4.0-4.6 1.4-1.6 2.1-2.6 1.0-4.0 4.4-4.95.7g2.8

4.0-4.6 1.4-1.6 3.5-4.8 1.0-4.0 6.6-7.1

(in mm)

5.7g5.0

Reflow Soldering

,QRT¢£¥

0.3mm min. 0.3mm min.

Adhesive

Land

100 to 120µm

ST¤¥

Land

Adhesive

Base Board

Chip Capacitor

a

b

c

a : 20 to 70µm

c : 50 to 105µm

b : 30 to 35µm

Land

Chip Capacitor Slit

cSolder Resist

de

ab

L

W

Continued on the following page.

Notice (Soldering and Mounting)

Notice

141

21

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

3. Soldering

(1) Care for minimizing loss of the terminations.

The information below illustrates the soldering conditions

needed to minimize the loss of the effective area on the

terminations.

(2) Flux

Use rosin-type flux and do not use a highly acidic flux

(any containing a minimum of 0.2wt% chlorine).

(3) Solder Buildup

q Flow soldering and iron soldering

When soldering, use less than the maximum and more

than the minimum solder buildup as shown in the

illustration to the right.

During the soldering process, insure that the solder is

securely placed.

Depending on the conditions of the soldering

temperature and/or immersion (melting time),

effective areas may be lost in some part of the

terminations.

To prevent this, be careful in soldering so that any

possible loss of the effective area on the

terminations will securely remain at a maximum of

25% on all edge length A-B-C-D-A of part with A, B,

C, D, shown in the Figure below.

Soldering Allowance Time

In case of repeated soldering, the accumulated

soldering time must be within the range shown above.

A

B

C

D

Termination

Soldering Temperature (D)

Time (sec.)

260

270

250

240

230

0306090

,

,,

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Flow

Soldering Dip Soldering

(Static Solder)

Reflow Soldering and

Soldering Iron Methods

Solder : 6Z4 Eutectic Solder

[Solder Buildup by Flow Method and Soldering Iron Method]

,QS¢¤

,QRS¢£¤

Max. Buildup (T)

Min. Buildup

Adhesive

,



Q

ST

¢

¤¥

RST£¤¥

Excessive Solder

Buildup (1.3T)

Continued from the preceding page.

in section

in section in section

in section

Land Layout to Prevent Excessive Solder

Mounting Close to a Chassis Mounting with Leaded Components Mounting Leaded Components Later

Examples of

Arrangements to

be Avoided

Examples of

Improvements

by the Land

Division

Lead Wire Connected

to a Part Provided

with Lead Wires.

ChassisSolder (Ground solder)

Adhesive

Base board

Land Pattern

d1Soldering Iron

Lead Wire of

Component to be

Connected Later.

Solder Resist

d2d1<d2Solder Resist

Continued on the following page.

Notice

142

21

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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

w Reflow soldering

When soldering, confirm that the solder is placed over

0.2mm of the surface of the terminations.

4. Cleaning

To perform ultrasonic cleaning, observe the following

conditions.

Rinse bath capacity : Output of 20 watts per liter or less.

Rinsing time : 5 min maximum.

Do not vibrate the PWBs.

5. Resin Coating

When selecting resin materials, select those with low

contraction and low moisture absorption coefficient

(generally epoxy resin is used).

Buffer coat can decrease the influence of the resin

shrinking (generally silicone resin).

[Solder Buildup by Reflow Method]

0.2mm min.

,QR¢£

,Q¢

Chip Capacitor

Continued from the preceding page.

Notice

143

21

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Notice

144

21

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

■ Rating

Capacitance change of capacitor

1. In case of X7R char.

Capacitors have an aging characteristic, whereby

the capacitor continually decreases its

capacitance slightly if the capacitor is left on

for a long time. Moreover, capacitance might change

greatly depending on the surrounding temperature

or an applied voltage. So, it is not likely to be

suitable for use in a time constant circuit.

Please contact us if you need detailed information.

2. In case of C0G/R/SL char.

Capacitance might change a little depending on the

surrounding temperature or an applied voltage.

Please contact us if you intend to use this product

in a strict time constant circuit.

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

ISO 9000 Certifications

Plant

Fukui Murata Manufacturing

Co., Ltd.

Certified Date

Apr. 2, '97

Organization

UL *1

ISO9001

Registration No.

A5287

Izumo Murata Manufacturing

Co., Ltd. Jul. 25, '97 A5587

Murata Electronics

Singapore (Pte.) Ltd. Nov. 3, '99 PSB *2

ISO9001 99-2-1085

Murata Manufacturing

(UK) Ltd. Jun. 24, '98 BSI *3

ISO9001 FM 22169

Murata Amazonia

Industria Comercio Ltda. Jul. 28, '98 FUNDACAO VANZOLINI

ISO9002 SQ-480-675/98

Murata Electronics North America

State College Plant Mar. 7, '96 UL *1

ISO9001 A1734

Beijing Murata

Electronics Co., Ltd. Dec. 10, '98 UL *1

ISO9002 A7123

*1 UL : Underwriters Laboratories Inc.

*2 PSB : Singapore Productivity and Standards Board

*3 BSI : British Standards Institution

145

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Head Office

2-26-10, Tenjin Nagaokakyo-shi, Kyoto 617-8555, Japan Phone: 81-75-951-9111 International Division

3-29-12, Shibuya, Shibuya-ku, Tokyo 150-0002, Japan

Phone: 81-3-5469-6123 Fax: 81-3-5469-6155 E-mail: intl@murata.co.jp

http://www.murata.com/

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note C02E10.pdf 04.1.20

Note:

1. Export Control

<

For customers outside Japan

>

Murata products should not be used or sold for use in the development, production, stockpiling or utilization of any conventional weapons or mass-destructive

weapons (nuclear weapons, chemical or biological weapons, or missiles), or any other weapons.

<

For customers in Japan

>

For products which are controlled items subject to the “Foreign Exchange and Foreign Trade Law” of Japan, the export license specified by the law is required

for export.

2. Please contact our sales representatives or product engineers before using the products in this catalog for the applications listed below, which require especially

high reliability for the prevention of defects which might directly damage to a third party's life, body or property, or when one of our products is intended for use

in applications other than those specified in this catalog.

qAircraft equipment wAerospace equipment

eUndersea equipment rPower plant equipment

tMedical equipment yTransportation equipment (vehicles, trains, ships, etc.)

uTraffic signal equipment iDisaster prevention / crime prevention equipment

oData-processing equipment !0 Application of similar complexity and/or reliability requirements to the applications listed in the above

3. Product specifications in this catalog are as of August 2003. They are subject to change or our products in it may be discontinued without advance notice.

Please check with our sales representatives or product engineers before ordering. If there are any questions, please contact our sales representatives or

product engineers.

4. Please read rating and CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

5. This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or

transact the approval sheet for product specifications before ordering.

6. Please note that unless otherwise specified, we shall assume no responsibility whatsoever for any conflict or dispute that may occur in connection with the effect

of our and/or a third party's intellectual property rights and other related rights in consideration of your use of our products and/or information described or

contained in our catalogs. In this connection, no representation shall be made to the effect that any third parties are authorized to use the rights mentioned

above under licenses without our consent.

7. No ozone depleting substances (ODS) under the Montreal Protocol are used in our manufacturing process.