PHOTOCOUPLER
PS8502,PS8502L1,PS8502L2,PS8502L3
HIGH SPEED ANALOG OUTPUT TYPE
8 mm CREEPAGE 8-PIN PHOTOCOUPLER
Document No. PN10657EJ04V0DS (4th edition)
Date Published September 2009 NS
NEPOC Series
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DESCRIPTION
The PS8502, PS8502L1, PS8502L2 and PS8502L3 are 8-pin high speed photocouplers containing a GaAIAs LED
on input side and a PN photodiode and a high speed amplifier transistor on output side on one chip. The PS8502 is
in a plastic DIP (Dual In-line Package) with 8 mm creepage distance product.
The PS8502L1 is lead bending type for long creepage distance.
The PS8502L2 is lead bending type for long creepage distance (Gull-wing) for surface mount.
The PS8502L3 is lead bending type (Gull-wing) for surface mounting.
FEATURES
Long creepage distance (8 mm MIN.: PS8502L1, PS8502L2)
High common mode transient immunity (CMH, CML = 15 kV/ s MIN.)
High supply voltage (VCC = 35 V MAX.)
High speed response (tPHL, tPLH = 0.8 s MAX.)
High isolation voltage (BV = 5 000 Vr.m.s.)
TTL, CMOS compatible with a resistor
Ordering number of tape product: PS8502L2-E3: 1 000 pcs/reel
: PS8502L3-E3: 1 000 pcs/reel
Pb-Free product
Safety standards
UL approved: No. E72422
CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950)
BSI approved: No. 8937, 8938
SEMKO approved: No. 615433
NEMKO approved: No. P06207243
DEMKO approved: No. 314091
FIMKO approved: No. FI 22827
DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40019182 (Option)
APPLICATIONS
Interface for measurement or control equipment
Substitutions for relays and pulse transformers
Modem, communications device
General purpose inverter
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Data Sheet PN10657EJ04V0DS
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PS8502,PS8502L1,PS8502L2,PS8502L3
PACKAGE DIMENSIONS (UNIT: mm)
DIP Type
Lead Bending Type (Gull-wing) For Surface Mount
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Data Sheet PN10657EJ04V0DS
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PS8502,PS8502L1,PS8502L2,PS8502L3
Lead Bending Type For Long Creepage Distance
Lead Bending Type For Long Creepage Distance (Gull-wing) For Surface Mount
Data Sheet PN10657EJ04V0DS
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PS8502,PS8502L1,PS8502L2,PS8502L3
PHOTOCOUPLER CONSTRUCTION
PS8502, PS8502L3
PS8502L1, PS8502L2
7 mm
8 mm
7 mm
8 mm
0.4 mm
0.4 mm
MARKING EXAMPLE
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Data Sheet PN10657EJ04V0DS
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PS8502,PS8502L1,PS8502L2,PS8502L3
ORDERING INFORMATION
Part Number
Order Number
Solder Plating
Specification
Packing Style
Safety Standard
Approval
Application Part
Number*1
PS8502
PS8502-AX
Pb-Free
Magazine case 50 pcs
Standard products
PS8502
PS8502L1
PS8502L1-AX
(Ni/Pd/Au)
(UL, CSA, BSI,
PS8502L1
PS8502L2
PS8502L2-AX
SEMKO, NEMKO,
PS8502L2
PS8502L3
PS8502L3-AX
DEMKO, FIMKO
PS8502L3
PS8502L2-E3
PS8502L2-E3-AX
Embossed Tape 1 000 pcs/reel
approved)
PS8502L2
PS8502L3-E3
PS8502L3-E3-AX
PS8502L3
PS8502-V
PS8502-V-AX
Magazine case 50 pcs
DIN EN60747-5-2
PS8502
PS8502L1-V
PS8502L1-V-AX
(VDE0884 Part2)
PS8502L1
PS8502L2-V
PS8502L2-V-AX
Approved (Option)
PS8502L2
PS8502L3-V
PS8502L3-V-AX
PS8502L3
PS8502L2-V-E3
PS8502L2-V-E3-AX
Embossed Tape 1 000 pcs/reel
PS8502L2
PS8502L3-V-E3
PS8502L3-V-E3-AX
PS8502L3
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25 C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
Diode
Forward Current *1
IF
25
mA
Reverse Voltage
VR
5
V
Detecto
r
Supply Voltage
VCC
35
V
Output Voltage
VO
35
V
Output Current
IO
8
mA
Power Dissipation *2
PC
100
mW
Isolation Voltage *3
BV
5 000
Vr.m.s.
Operating Ambient Temperature
TA
55 to +100
C
Storage Temperature
Tstg
55 to +125
C
*1 Reduced to 0.33 mA/ C at TA = 70 C or more.
*2 Reduced to 2.0 mW/ C at TA = 75 C or more.
*3 AC voltage for 1 minute at TA = 25 C, RH = 60% between input and output.
Pins 1-4 shorted together, 5-8 shorted together.
Data Sheet PN10657EJ04V0DS
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PS8502,PS8502L1,PS8502L2,PS8502L3
ELECTRICAL CHARACTERISTICS (TA = 25 C)
Parameter
Symbol
Conditions
MIN.
TYP.*1
MAX.
Unit
Diode
Forward Voltage
VF
IF = 16 mA
1.7
2.2
V
Reverse Current
IR
VR = 3 V
10
A
Forward Voltage
Temperature Coefficent
VF/ TA
IF = 16 mA
2.1
mV/ C
Terminal Capacitance
Ct
V = 0 V, f = 1 MHz
30
pF
Detector
High Level Output Current
IOH (1)
IF = 0 mA, VCC = VO = 5.5 V
3
500
nA
High Level Output Current
IOH (2)
IF = 0 mA, VCC = VO = 35 V
100
A
Low Level Output Voltage
VOL
IF = 16 mA, VCC = 4.5 V, IO = 2.4 mA
0.15
0.4
V
Low Level Supply Current
ICCL
IF = 16 mA, VO = Open, VCC = 35 V
150
A
High Level Supply Current
ICCH
IF = 0 mA, VO = Open, VCC = 35 V
0.01
1
A
Coupled
Current Transfer Ratio
CTR
IF = 16 mA, VCC = 4.5 V, VO = 0.4 V
15
%
Isolation Resistance
RI-O
VI-O = 1 kVDC
1011
Isolation Capacitance
CI-O
V = 0 V, f = 1 MHz
0.7
pF
Propagation Delay Time
tPHL
IF = 16 mA, VCC = 5 V, RL = 1.9 k
0.22
0.8
s
(H L)*2
Propagation Delay Time
tPLH
IF = 16 mA, VCC = 5 V, RL = 1.9 k
0.35
0.8
s
(L H)*2
Common Mode
Transient Immunity at High
Level Output*3
CMH
IF = 0 mA, VCC = 5 V, VCM = 1.5 kV,
RL = 4.1 k
15
kV/ s
Common Mode
Transient Immunity at Low
Level Output*3
CML
IF = 16 mA, VCC = 5 V, VCM = 1.5 kV,
RL = 4.1 k
15
kV/ s
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Data Sheet PN10657EJ04V0DS
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PS8502,PS8502L1,PS8502L2,PS8502L3
*1 Typical values at TA = 25 C
*2 Test circuit for propagation delay time
Remark CL includes probe and stray wiring capacitance.
*3 Test circuit for common mode transient immunity
Remark CL includes probe and stray wiring capacitance.
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static
electricity when handling.
2. By-pass capacitor of more than 0.1 F is used between VCC and GND near device. Also, ensure that the
distance between the leads of the photocoupler and capacitor is no more than 10 mm.
3. Pins 1, 4 (which is an NC*1 pin) can either be connected directly to the GND pin on the LED side or left open.
Also, Pin 7 (which is an NC*1 pin) can either be connected directly to the GND pin on the detector side or left
open.
Unconnected pins should not be used as a bypass for signals or for any other similar purpose because this
may degrade the internal noise environment of the device.
*1 NC: Non-Connection (No Connection)
4. Avoid storage at a high temperature and high humidity.
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Data Sheet PN10657EJ04V0DS
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PS8502,PS8502L1,PS8502L2,PS8502L3
TYPICAL CHARACTERISTICS (TA = 25 C, unless otherwise specified)
Remark The graphs indicate nominal characteristics.
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Data Sheet PN10657EJ04V0DS
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PS8502,PS8502L1,PS8502L2,PS8502L3
Remark The graphs indicate nominal characteristics.
Data Sheet PN10657EJ04V0DS
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PS8502,PS8502L1,PS8502L2,PS8502L3
TAPING SPECIFICATIONS (UNIT: mm)
Data Sheet PN10657EJ04V0DS
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PS8502,PS8502L1,PS8502L2,PS8502L3
Data Sheet PN10657EJ04V0DS
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PS8502,PS8502L1,PS8502L2,PS8502L3
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
Data Sheet PN10657EJ04V0DS
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PS8502,PS8502L1,PS8502L2,PS8502L3
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
Peak reflow temperature 260 C or below (package surface temperature)
Time of peak reflow temperature 10 seconds or less
Time of temperature higher than 220 C 60 seconds or less
Time to preheat temperature from 120 to 180 C 120 30 s
Number of reflows Three
Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(2) Wave soldering
Temperature 260 C or below (molten solder temperature)
Time 10 seconds or less
Preheating conditions 120 C or below (package surface temperature)
Number of times One (Allowed to be dipped in solder including plastic mold portion.)
Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
Peak temperature (lead part temperature) 350 C or below
Time (each pins) 3 seconds or less
Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100 C.
Data Sheet PN10657EJ04V0DS
14
PS8502,PS8502L1,PS8502L2,PS8502L3
(4) Cautions
Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between VCC-
emitters at startup, the output side may enter the on state, even if the voltage is within the absolute maximum
ratings.
Data Sheet PN10657EJ04V0DS
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PS8502,PS8502L1,PS8502L2,PS8502L3
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
Parameter
Symbol
Speck
Unit
Climatic test class (IEC 60068-1/DIN EN 60068-1)
55/100/21
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
Upr = 1.5 UIORM, Pd 5 pC
UIORM
Upr
1 130
1 695
Vpeak
Vpeak
Test voltage (partial discharge test, procedure b for all devices)
Upr = 1.875 UIORM, Pd 5 pC
Upr
2 119
Vpeak
Highest permissible overvoltage
UTR
8 000
Vpeak
Degree of pollution (DIN EN 60664-1 VDE0110 Part 1)
2
Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11))
CTI
175
Material group (DIN EN 60664-1 VDE0110 Part 1)
III a
Storage temperature range
Tstg
55 to +125
°C
Operating temperature range
TA
55 to +100
°C
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25°C
VIO = 500 V dc at TA MAX. at least 100°C
Ris MIN.
Ris MIN.
1012
1011
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Package temperature
Current (input current IF, Psi = 0)
Power (output or total power dissipation)
Isolation resistance
VIO = 500 V dc at TA = Tsi
Tsi
Isi
Psi
Ris MIN.
175
400
700
109
°C
mA
mW
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PS8502,PS8502L1,PS8502L2,PS8502L3
Caution GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the
following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
NOTICE
1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and
application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. California
Eastern Laboratories and Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits,
software, or information.
2. California Eastern Laboratories has used reasonable care in preparing the information included in this document, but California Eastern Laboratories does
not warrant that such information is error free. California Eastern Laboratories and Renesas Electronics assumes no liability whatsoever for any damages
incurred by you resulting from errors in or omissions from the information included herein.
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rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express,
implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of California Eastern Laboratories or Renesas
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the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation
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