No. : 205-03-300 INSTRUCTION MANUAL 5861 Series 0.35mm Pitch Board-to-Board Connector C DCN-643 2017/06/29 K. Shiobara B DCN-093 2017/01/26 K. Shiobara O EDN-508 2015/10/27 K. Hirata No. EDNDCN DATE PREPARED by 106-03-003 H. Watanabe K. Yamane A. Tsunemura K. Yamane CHECKED by APPROVED by KYOCERA Corporation TABLE OF CONTENTS 1. OUTLINE ************************************************************************* 2 2. PART NAMES AND MODEL NUMBERS ********************************* 2 2-1. PART NAMES ************************************************************* 2 2-2. MODEL NUMBERS ************************************************************ 3 3. PRECAUTIONS IN HANDLING ******************************************* 4 3-1. USING FOR BOARD-TO-BOARD CONNECTION ********** 4 3-2. USING FOR BOARD-TO-FPC CONNECTION ************* 5 3-3. MOUNTING *********************************************************** 6 3-4. ENGAGEMENT ********************************************************* 8 3-5. CLEANSING ********************************************************** 10 3-6. PCB AND RECOMMENDED DIMENSIONS OF THE OPENING AREA IN THE METAL MASK ** 11 3-7. RECOMMENDED DIMENSIONS OF THE PICK-UP NOZZLE ****************************** 14 5861 SERIES INSTRUCTION MANUAL 106-03-004 No.205-03-300 PAGE 114 KYOCERA Corporation 1. OUTLINE 5861 0.35mm Series 5861 connector is a board-to-board connector with 0.35mm pitch designed to miniaturize outer dimension for high-density mounting. 2. 2-1. PART NAMES AND MODEL NUMBERS PART NAMES (1) Plug Insulator Anchor Plate Contact (2) Receptacle Insulator Anchor Plate Contact 5861 SERIES INSTRUCTION MANUAL 106-03-004 No.205-03-300 PAGE 214 KYOCERA Corporation 2-2. MODEL NUMBERS (1) Plug Plug : 14 5861 XXX 024 829 + 24 5861 XXX 004 829 + 14 : Plug Series Number Number of Pos. Variation Plating Code Lead Free (2) Receptacle Rec. : 24 : Rec. Series Number Number of Pos. Variation Plating Code Lead Free 5861 SERIES INSTRUCTION MANUAL 106-03-004 No.205-03-300 PAGE 314 KYOCERA Corporation 3. PRECAUTIONS IN HANDLING 3-1. USING FOR BOARD-TO-BOARD CONNECTION (1) When the printed circuit boards on which connectors are mounted were fixed by using screw, the mated connector could be twisted due to variations in dimensions of such as screw holes. So great attention should be given not to twist connectors when fixing the boards. PCB Screw (2) When connectors are mounted off-center of the printed circuit board, or when the printed circuit boards to be connected are rather large, mating may tilt. In order to avoid tilting, it is recommended that the printed circuit boards are fixed by the spacer and something that generates a force to retain the proper mated condition. Retaining Force Spacer 5861 SERIES INSTRUCTION MANUAL 106-03-004 No.205-03-300 PAGE 414 KYOCERA Corporation 3-2. USING FOR BOARD-TO-FPC CONNECTION (1) FPC Please make sure to attach reinforcing board to FPC's backso that it will relieve the product from the stress caused by connector insertion /extraction Such reinforcing board should be bigger than our productand its suitable thickness should be decided through actual test connector pattern supporting (2) FPC When such possibility as the product may fallreceive any impact or reaction force from being thrashed is expectedand then it is recommended to fix them in the direction of engagement 5861 SERIES INSTRUCTION MANUAL 106-03-004 No.205-03-300 PAGE 514 KYOCERA Corporation 3-3. MOUNTING (1) Please make sure that the product is free from deformity caused by the unnecessary stress to the contacting points and the tails. (2) When the connectors are automatically mounted, please apply cream soldering printing in the process in accordance with the pattern chart of our recommendation. (For detailed dimensions of the printed circuit board, please refer to our product drawings.) (3) 0.10mm0.12mm 0.10mm0.12mm is recommended for the thickness of screen of the cream solder printing. (4) When the mounting condition differs from those of our profile in any wayplease make sure that you do not observe any deformity nor color change with the mounted connector before the mounted PCB is installed in the unit. (5) N2 If you need to mount on the N2 reflow condition, please make sure to conduct the reflow test in advance. (6) Please do not apply flux onto the tail and PC board, when it is soldered manually. Splattered or migrated flux inside the connector or to the contact points may cause imperfect contact. Also avoid giving any stress to the product with the soldering iron. It could deform tail or melt insulator. Soldering iron 5861 SERIES INSTRUCTION MANUAL 106-03-004 No.205-03-300 PAGE 614 KYOCERA Corporation (7) PLUG In the mounting processspecial care is needed so that the exposed contact points on the plug side will be free from splattered flux Contact area 5861 SERIES INSTRUCTION MANUAL 106-03-004 No.205-03-300 PAGE 714 KYOCERA Corporation 3-4. ENGAGEMENT (1) If something touches the contact points or with some foreign object, the spring could be deformed. (2) We minimized the thickness of this product to achieve downsizing and light weightiness. Because of this, uneven pressure or distorted attachment at engagementdisengagement could cause destruction, terminal deformity, plating detachment on the tail. Uneven Pressure Distorted Attachment uneven pressure distorted attachment FPC If it is required to unmate connectors with uneven pressure, apply such pressure to the long side of the connector. Applying the uneven pressure to the long side of the connector may cause doomed warpage or destruction on the connector depending on the PCB/FPC thickness. Please make sure beforehand when you apply the uneven pressure to the long side of the connector. 5861 SERIES INSTRUCTION MANUAL 106-03-004 x No.205-03-300 PAGE 814 KYOCERA Corporation (3) The connector is impossible to support the PCB by itself. Without other supporting objects, imperfect mating , peeling of tails or contacting failure may be caused. As supporting objects, use spacers fixed by screws. NG 5861 SERIES INSTRUCTION MANUAL 106-03-004 OK No.205-03-300 PAGE 914 KYOCERA Corporation 3-5. CLEANSING Following cleansing condition should be recommended in case the cleansing is done in your production process. <> ST-100S 80 15 5 <> ST-100S 60 85 60 120 60 10 <Test Condition for Resistance to Solvent> Solvent PINE ALPHA ST-100S (ARAKAWA CHEMICAL INDUSTRIES, LTD.) Content POLYETHYLENE-GLYCOL (solvent classified as ALKYL-ETHER) NON-ION SYSTEM SURFACE-ACTIVE AGENT PURE WATER Content Ratio 80% Content Ratio 15% Content Ratio 5% <Cleansing Process and Condition> Process Cleansing Washing System Up and Down Movement in Hot Liquid with Ultrasonic Wave Detergent Liquid Medicine Drying Wiping Drying Up and Down Movement with Ultrasonic Wave Air Knife Warm Blow PINE ALPHA ST-100S Isopropyl Alcohol Industrial Air Temperature 60 Normal Temperature Normal Temperature 85 Time 60 Seconds 120 Seconds 60 Seconds 10 Minutes 5861 SERIES INSTRUCTION MANUAL 106-03-004 No.205-03-300 PAGE 1014 KYOCERA Corporation 3-6. PCB AND RECOMMENDED DIMENSIONS OF THE OPENING AREA IN THE METAL MASK 0.35mm PLUG REC. This series of connector is required to be mounted in the high density due to its 0.35mm pitches. The connectors mounted in the high density need to be controlled adequate amount of solder in order to prevent failures in the mounting process such as short-circuit caused by solder bridge. For the dimensions of the metal mask opening, therefore, please refer to our recommended dimensions shown in the attached drawing. (For detailed dimensions of the printed circuit board, please refer to our product drawings.) If excessive solder is applied on the retaining metal of the plug connector, especially, it interferes with the receptacle connector, which leads to incomplete mate of the connectors. As dimensions shown in the drawings are our recommendations. Please feel free to contact us if you have any questions andor concerns about these dimensions. 5861 SERIES INSTRUCTION MANUAL 106-03-004 No.205-03-300 PAGE 1114 KYOCERA Corporation 5 8 61 S e ri e s: 0 . 35 mm P i tc h Recommended Pad & Stencil size SIGNAL CONTACT 0.55mm (21.7mil) Pad Stencil 0.18mm7.1mil 0.35mm (14.0mil) 0.12mm 4.7mil Stencil 0.18mm7.1mil 0.18mm7.1mil 0.38mm (14.9mil) 0.18mm7.1mil REC. 0.18mm7.1mil 0.32mm (12.6mil) PLUG 0.18mm7.1mil 5861 SERIES INSTRUCTION MANUAL 106-03-004 0.38mm (14.9mil) 3.9mil 0.39mm (15.3mil) 0.1mm No.205-03-300 PAGE 1214 KYOCERA Corporation 5 8 61 S e ri e s : 0 .3 5 m m P it c h Recommended Pad & Stencil size ANCHOR PLATE 0.3mm 11.8mil REC.(PITCH) 0.35m (13.8mil) 0.3mm (11.8mil 1.0mm (39.8mil) REC.(SPAN) 0.8mm (31.5mil) 0.4mm (15.7mil) PLUG Pad Stencil 0.34mm (13.4mil) 0.2mm (7.87mil) 0.18mm (7.09mil) 0.315mm 12.4mil 0.25mm 11.8mil 0.3mm (11.8mil 0.35mm 13.8mil 1.0mm (39.8mil) 0.12mm 4.7mil 0.21mm 8.3mil 0.8mm (31.5mil) Stencil 0.28mm (11.0mil) 0.35mm 13.8mil 0.3mm (11.8mil 0.35mm (13.8mil) 0.2mm (7.87mil) 0.35mm 13.8mil 1.2mm (47.2mil) 3.9mil 0.8m (31.5mil) 0.1mm SIGNAL REC. MOUNTING LAYOUT PITCH 5861 SERIES INSTRUCTION MANUAL 106-03-004 No.205-03-300 PAGE 1314 KYOCERA Corporation 3-7. RECOMMENDED DIMENSIONS OF THE PICK-UP NOZZLE The following is the recommended dimensions of the pick-up nozzle. 20N Maximum pressure when the connector is placed on a PCB: 5861 SERIES INSTRUCTION MANUAL 106-03-004 20N No.205-03-300 PAGE 1414