W24257A & Winbond Electronics Corp. 32K x 8 HIGH SPEED CMOS STATIC RAM GENERAL DESCRIPTION The W24257A is a high speed, low power CMOS static RAM organized as 32768 x 8 bits that operates on a single 5-volt power supply. This device is manufactured using Winbond's high performance CMOS technology. FEATURES + High speed access time: 35 nS (max.) All inputs and outputs directly TTL compatible Low power consumption: Three-state outputs - Active: 350 mW (max.) Availabie packages: 28-pin 600 mil DIP, 330 mil SOP, 300 mil SOJ and standard type * Single +5V power supply one TSOP (8 mm x 13.4 mm) Fully static operation PIN CONFIGURATIONS BLOCK DIAGRAM VOD > Vss > Aa] 40 ras Vo A12 [72 27 1 We AO =H: AT Cy 3 26 [} A13 Ab] 4 25 [1] as ats as [15 24 [7] ae Ast ]6 23 at S(7 zepip | HI oe | A2t]a 21 ate cs a | von AIL 9 20 1 cs oe 7] COM ce, : Ao [} 10 19 H vO8 we ee ~~ vos vot [| 44 18 |] vo7 Sa vo2 [12 7 1 we 103 [] 13 16 [J vos Ves ["] 14 15 [] vo4 PIN DESCRIPTION SYMBOL DESCRIPTION Ged to. 28 f2 A10 A0-A14 Address Inputs acl 8 236 Woe Data Inputs/Output ee : 23 Uo? 01-/08 ata INPUIS/OUTPUTS wea : 2epin z 5 ies Cs Chip Select Input 4 3S Senne . Ne Ae 03 WE Write Enable Input vot ne i i 5 Ag OE Output Enable Input < VpD Power Supply Vss Ground Publication Release Date: January 1998 -l- Revision A6W24257A linbond Electronics Corp. TRUTH TABLE cs | OF | WE MODE 01-08 Vpp CURRENT H x Xx Not Selected High Z IsB, IsB1 L H H Output Disable High Z IDD L L H Read Data Out Ipb L Xx L Write Data In IDD DC CHARACTERISTICS Absolute Maximum Ratings PARAMETER RATING UNIT Supply Voltage to Vss Potential -0.5 to +7.0 V Input/Output to Vss Potential -0.5 to Vop +0.5 Vv Allowable Power Dissipation 1.0 Ww Storage Temperature -65 to +150 C Operating Temperature 0 to +70 C Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device. Operating Characteristics (Von = 5V +10%, Vss= OV, Ta= 0 to 70 C) PARAMETER SYM. TEST CONDITIONS MIN. | TYP. | MAX. | UNIT Input Low Voltage VIL - -0.5 - +0.8 Vv Input High Voltage VIH - +2.2 - Vbb Vv +0.5 Input Leakage Current | Iu! ViN = Vss to VDD -10 - +10 pA Output Leakage LO | Vwo=VsstoVop, CS =Vin(min.) | -10 | - +10 | pA Current or OE = ViH(min.) or WE = Vit (max.) Output Low Voltage VoL | lov =+8.0 mA - - 0.4 Vv Output High Voltage VOH | loH = -4.0 mA 2.4 - - V Operating Power IoD | CS =Vit{max.), VO | f= fmax. - - 100 mA Supply Current =O0mA, Duty = 100% | f= 50 MHz 130 Standby Power ISB_ | CS = Vin (min.) - - 30 mA Supply Current Cycle = min., Duty = 100% ISB1 | CS > Vpp -0.2V - - 10 mA Note: Typical characteristics are at Von = 5V, Ta= 25C.W24257A Winbond Electronics Corp. CAPACITANCE (Vop = 5V, Ta= 25 C, f= 1 MHz) PARAMETER SYM. CONDITIONS MAX. UNIT Input Capacitance CIN VIN = OV 8 pF Input/Output Capacitance Cio Vout = 0V 10 pF Note: These parameters are sampled but not 100% tested. AC CHARACTERISTICS AC Test Conditions PARAMETER CONDITIONS input Pulse Levels OV to 3V Input Rise and Fall Times 5ns Input and Output Timing Reference Level 1.5V Output Load CL = 30 pF, lon/lon = -4 mA/8 mA AC Test Loads and Waveform R1 480 ohm R1.480 ohm 5V or 5V OUTPUT TT a OUTPUT 4 5pF | po 30pF = g ~R2 | ttuan | 255 ohm 1 S Including { 255 ohm Jig and Jig and | = Scope = = Scope = (For Tetz, Towz, Texz, Touz, Twuz, Tow) 3.0V \ 90% fo | ov 10% op 5 nS f- 4 5nS Publication Release Date: January 1998 -3- Revision A6finbond Electronics Corp. AC Characteristics, continued (Vop = 5V +10%, Vss= OV, TA=0 to 70 C) W24257A Read Cycle PARAMETER SYMBOL W24257A-35 UNIT MIN. MAX. Read Cycle Time TRC 35 - ns Address Access Time TAA - 35 ns Chip Select Access Time TACS - 35 ns Output Enable to Output Valid TAQE - 17 ns Chip Selection to Output in Low Z TcLz? 3 ~ ns Output Enable to Output in Low Z Touz* 0 - ns Chip Deselection to Output in High Z TCcHz* - 17 ns Output Disable to Output in High Z TOH2* - 17 ns Output Hold from Address Change TOH 3 - ns * These parameters are sampled but not 100% tested. Write Cycle PARAMETER SYMBOL W24257A-35 UNIT MIN. MAX. Write Cycle Time Twe 35 - ns Chip Selection to End of Write Tow 20 - ns Address Valid to End of Write TAW 20 - ns Address Setup Time TAS 0 - ns Write Pulse Width Twp 18 - ns Write Recovery Time CS, WE TwrR 0 - ns Data Valid to End of Write Tow 15 - ns Data Hold from End of Write TDH 0 - ns Write to Output in High Z TwHz* - 15 ns Output Disable to Output in High Z ToHz* - 15 ns Output Active from End of Write Tow 0 - nS * These parameters are sampled but not 100% tested.W24257A finbond Electronics Corp. TIMING WAVEFORMS Read Cycle 1 (Address Controlled) <____ A Ton Po Tou Read Cycle 2 (Chip Select Controlled) e \\AAAY LLLLLLLL LL Tacs oo - XXX _, Read Cycle 3 (Output Enable Controlled) Address Dout Publication Release Date: January 1998 -5- Revision A6W24257A finbond Etectronics Corp. Timing Waveforms, continued Write Cycle 1 (OE Clock) = 2 C NAAAARSS PHL LL LLL TAW ctl WE w TAS Twe af ~ >= TOW pte TDA > on C IN I Write Cycle 2 (OE = Vit Fixed) Two _ Address TTT II LL. Ton See i= pe TDH ' / on KX XXX Notes: 1. During this period, 1/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied. 2. The data output from Court are the same as the data written to Dw during the write cycle. 3. DouT provides the read data for the next address. 4. Transition is measured +500 mV from steady state with & = 5 pF. This parameter is guaranteed but not 100% tested. y | C , 7 YY a dt (2) , & 5 | : if z| 3 4 -6-W24257A tinbond Etectronics Corp. ORDERING INFORMATION ACCESS | OPERATING | OPERATING | STANDBY PART NO. TIME CURRENT CURRENT CURRENT PACKAGE (nS) MAX. (mA) | MAX. (mA) | MAX. (mA) f = max. f = 50 MHz W24257A-35 35 100 130 10 600 mil DIP W24257AS-35 35 100 130 10 330 mil SOP W24257AJ-35 35 100 130 10 300 mil SOJ W24257AQ-35 35 100 130 10 Standard type one TSOP Notes: 1. Winbond reserves the right to make changes to its products without prior notice. 2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications where personal injury might occur as a consequence of product failure. Publication Release Date: January 1998 Revision A6inbond Electronics Corp. W24257A PACKAGE DIMENSIONS 28-pin P-DIP 2 ASAAA AAA AAA * YD Q O CART GAT RT GET EET ET TET Dimension in inches: Symbol A _ | G20 _ a 1633 Av [ao | [- [oa | | Az O150 10185 | 0160 | 3.81 3a4 ae B OMS (0.048 |one2 | O41 045 | 056 |_B c D E E. 0.058 jG.080 [6064 | 1.47 482 | 1.63 aces [a0 | G014 | O20 | O25 | 036 aseo lose [aso |sa90 |1624 [15.40 0540 [0.545 10550 | 15-72 [13.84 11397 e@: oso fate [6910 | 229 | 254 | 279 L 0420 jO130 [O140 | 305 3 | 356 a 0 | 8 a | 8 en _| 0830 |osse | 5870 }16.00 | tes1 | 1702 S _ ~~ |oca | --~ = | 23 1. Dimensions. D Max. & S include mold flash or tie bar burrs. 2. Dimension E1 does not include interlead flash. 3. Dimensions 0 & 1 inchude motd mismatch and are determiried at the mold parting fine. 4. Dimension Bi does not include darnbar Protrusion/intrusion. 5. Controfing dimension: Inches 6. General a spec. should be based on finat sual inspection spec. 28-pin SO Wide Body Fd RRR BRRBR BRAS 16 o xt PHEWEEREGEEREE Seating Piane Dimension in Inches Oirmenaion int men Sy Min. | Nom. | Max.) Min. | Nom. | Max. A a fON2 | om a | 286 Ag 0.008 _ ~ O10 ne Az {0083 foo jos | 235 | 249 | 262 b oot4 foos joao | os [om | ost c oo08 foo foes | o20 | o25 [028 D ~~ [0783 | 0733 | [16.14 | 18.62 E ore josst jase | a78 | eat | ass fi. fooss fouse fosss | riz jf tar | +42 He OaS3 (0.405 [0477 Ja45t [y1at [12.12 L acs joo loo for joe | 132 Le |eote loos joors | 150 | t70 | 1a bn s _ a 1 0.08F | | 1.19 ry | joa] | | 019 6 oi; ] wl od | ~ ] iw Notes: 1, Dimensions O Max. &S include mold flash or-tie bar burrs. 2. Dimension b does not include dambar protusianfntrusion. 3. Dimensions. & E include mold mismatch and determined at the mold parting line. 4. Gantrofing dimension: inches. 5. General eppaarance spec should be based on final visual inspection spec.finbond Electronics Carp. Package Dimensions, continued 28-pin Small Outline J Band W24257A 2 1% CF Oo 1 TCYEILy CIty trtrty CIty tye: 4 ABA A Jae Seating Plane Di jen in inches | Dimension in mm 8 iynbol sain. [Nom.| Max. | Min. [Nom. | Max _ | t40 _ a 1 356 ona Sool ~ | Om ~ O05 | 241 254 | 287 O02 | 0.66 a7t 4.81 B06. | 0.018 az | O41 O46 | 058 a0t4 | 0.20 O28 036 o73G 11803 11854 OMS | 7.4 762 PIS amo pe >>> 5 a 2 2 3 O08 | 1.12 27 142 5 i e : 0s }622 [673 | 724 He | 0307 [0sa7 joa jaar | ase | Ba L corr joosy joo7 | 196 | 221 | 246 s ~~ | -~ Joos | | fata y wa J - | aoe | | Fore e a ~ 10 a | 10 Notes: 1. Dimensions D Max. or Ge bar burrs, & S include mold flash 2. Dimension b does not include dambar protrusiondntrusion. 3. oe General Dimensions 0 & E include mold mismatch and ara determined at the mold parting line. Controling. dimension: inches. Spec, should be based appearance on final visual inspection spec, 28-pin Standard Type One TSOP o | Ho i li m1 | XY LiDGtiLh TTT > > [>t i Las > Dimension In inches | Dimension in mm Symbot Min. | Nom.) Max. | Min. | Nom. | Max. A = -- | 9.047 | | 120 Az. | 0.002! -- | coos] 005; | 015 Az | o035| cose] oo4s} 995 1.00] 7.05 b 0.007 | o.008| 0.017]; 0.17) 0.20] 0.27 c 0.004| oope| c.o08| 010, 048] 9.2 D 0.481| 0465 | 046s | 11.70) 11.80] 11.90 E 0,311/ 0315] 0.919] 790; 800] 3.10 Ho 0.520| 0.528| 6536 | 1220: 13.49] 13.60 8 [oom] - | | oss] L 0.020 | 0024] 0028/ 0.50) o6o| 0.70 Li loo} | ~ | os] Y o.oo | | 000% | aoe | 0.10 8 0 3 8 0 3 5 Controtling dimension: Millimeters Publication Release Date: January 1998 Revision A6W24257A linbond Etectronics Gori VERSION HISTORY VERSION DATE PAGE DESCRIPTION A5 Mar. 1997 1,7 Add TSOP package 2,7 Modify |pp data AB Jan. 1998 2,7 Modify ipp data Winbond e +itTT Electronics Corp. Headquarters No. 4, Creation Rd. Hl, Science-Based Industrial Park, Hsinchu, Talwan TEL: 886-3-5776066 FAX: 886-3-5796096 http:/iwww.winbond.com.tw/ Winbond Electronics (H.K.) Ltd. Winbond Electronics North America Corp. Rm. 803, World Trade Square, Tower Ii, Winbond Memory Lab. 1223 Hoi Bun Rd., Kwun Tong, Kowloon, Hong Kong TEL: 852-27513100 FAX: 852-27552064 Voice & Fax-on-demand: 886-2-27197006 Taipei Office 41F, No. 115, Sec. 3, Min-Sheng East Rd., Taipei, Taiwan TEL: 886-2-27 190505 FAX: 886-2-27197502 Note: All data and specifications are subject to change without notice. -10- Winbond Microelectronics Corp. Winbond Systems Lab. 2727 N. First Street, San Jose, CA 95134, U.S.A. TEL: 408-9436666 FAX: 408-54417938