Noise Suppression Products/EMI Suppression Filters > EMIFILr (Inductor type) > Chip Ferrite Bead for GHz Noise Data Sheet 1 EMIFILr (Inductor type) Chip Ferrite Bead for GHz Noise BLM03E Series (0201 Size) c Dimensions c Equivalent Circuit 0.30.03 0.30.03 0.60.03 0.150.05 (Resistance element becomes dominant at high frequencies.) : Electrode (in mm) c Packaging Code Packaging Minimum Quantity D 180mm Paper Tape 15000 J 330mm Paper Tape 50000 B Bulk(Bag) 1000 c Rated Value (p: packaging code) Impedance (at 100MHz/20C) Impedance (at 1GHz/20C) Rated Current DC Resistance Operating Temperature Range BLM03EB250SN1p 25ohm 25% 105ohm 40% 600mA 0.26ohm max. -55 to +125C BLM03EB500SN1p 50ohm 25% 255ohm 40% 400mA 0.58ohm max. -55 to +125C Part Number Number of Circuits: 1 c Derating of Rated Current In operating temperature exceeding +85C, derating of current is necessary for BLM03E series. Please apply the derating curve shown in chart according to the operating temperature. Derating of Rated Current Rated Current (mA) 700 BLM03EB250SN1 600 500 BLM03EB500SN1 400 300 200 100 0 0 50 85 100 125 Operating Temperature (C) 150 Continued on the following page. oThis data sheet is applied for CHIP FERRITE BEAD used for General Electronics equipment for your design. !Note: 1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it's specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering. 2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 2013.3.7 http://www.murata.com/ Noise Suppression Products/EMI Suppression Filters > EMIFILr (Inductor type) > Chip Ferrite Bead for GHz Noise Data Sheet 2 Continued from the preceding page. c Impedance-Frequency Characteristics (Main Items) c Impedance-Frequency Characteristics BLM03EB250SN1 400 160 Z 120 Impedance () Impedance () 300 200 BLM03EB500SN1 R 80 X 40 BLM03EB250SN1 100 0 1 10 100 Frequency (MHz) 1000 3000 0 1 10 100 Frequency (MHz) 1000 3000 c Impedance-Frequency Characteristics BLM03EB500SN1 400 Z Impedance () 300 R 200 X 100 0 1 10 100 Frequency (MHz) 1000 3000 c !Caution/Notice !Caution (Rating) Do not use products beyond the rated current as this may create excessive heat and deteriorate the insulation resistance. Notice Solderability of Tin plating termination chip might be deteriorated when low temperature soldering profile where peak solder temperature is below the Tin melting point is used. Please confirm the solderability of Tin plating termination chip before use. oThis data sheet is applied for CHIP FERRITE BEAD used for General Electronics equipment for your design. !Note: 1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it's specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering. 2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 2013.3.7 http://www.murata.com/