TB62706BNG/BFG
TOSHIBA Bi-CMOS INTEGRATED CIRCUIT SILICON MONOLITHIC
TB62706BNG, TB62706BFG
16BIT SHIFT REGISTER, LATCHES & CONSTANT CURRENT DRIVERS
The TB62706BNG, TB62706BFG are specifically designed for LED
and LED DISPLAY constant current drivers.
This constant current output circuits are able to set up external
resistor (IOUT = 5~90 mA). (Note)
These devices are monolithic integrated circuit designed to be used
together with Bi-CMOS process.
The devices consist of 16bit shift register, latch, AND-GATE and
Constant Current Drivers.
These products are Pb free.
FEATURES
l Constant Current Output : Can set up all output current with
one resister for 5 to 90 mA.
l Maximum Clock Frequency : fCLK = 15 (MHz) (Cascade
Connected Operate, Topr = 25°C)
l 5 V C-MOS Compatible Input
l Package : SDIP24-P-300-1.78 (TB62706BNG)
SSOP24-P-300- 1.00B (TB62706BFG)
l Constant Output Current Matching:
OUTPUT-GND
VOLTAGE CURRENT
MATCHING OUTPUT
CURRENT
=0.4 V ±6.0% 5~40 mA
=0.7 V ±6.0% 5~90 mA
PIN CONNECTION (Top view)
TB62706BNG
TB62706BFG
Weight
SDIP24-P-300-1.78 : 1.22 g (typ.)
SSOP24-P-300-1.00B : 0.32 g (typ.)
Company Headquarters
3 Northway Lane North
Latham, New York 12110
Toll Free: 800.984.5337
Fax: 518.785.4725 Web: www.marktechopto.com | Email: info@marktechopto.com
California Sales Office:
950 South Coast Drive, Suite 265
Costa Mesa, California 92626
Toll Free: 800.984.5337
Fax: 714.850.9314
Company Headquarters
3 Northway Lane North
Latham, New York 12110
Toll Free: 800.984.5337
Fax: 518.785.4725 Web: www.marktechopto.com | Email: info@marktechopto.com
California Sales Office:
950 South Coast Drive, Suite 265
Costa Mesa, California 92626
Toll Free: 800.984.5337
Fax: 714.850.9314
TB62706BNG/BFG
2004-06-24
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BLOCK DIAGRAM
TIMING DIAGRAM
Note: Latches are level sensitive, not rising edges sensitive and not syncronus CLOCK.
Input of LATCH-terminal to H Level, data passes latches, and input to L level, data hold latches.
Input of ENABLE-terminal to H level, all output (OUT0~15) do off.
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TERMINAL DISCRIPTION
PIN No. PIN NAME FUNCTION
1 GND GND terminal for control logic.
2 SERIAL-IN Input terminal of a serial-data for shift-register.
3 CLOCK Input terminal of a clock for data shift to up-edge.
4 LATCH Input terminal of a data strobe. Latches passes data with “H” level input of
LATCH -terminal, and hold data with "L" level input.
5~20 15~OUT0 Output terminals.
21 ENABLE Input terminal of output enable. All outputs (OUT0~15) do off with “H” level input of
ENABLE -terminal, and do on with "L" level input.
22 SERIAL-OUT Output terminal of a serial-data for next SERIAL-IN terminal.
23 R-EXT Input terminal of connects with a resister for to set up all output current.
24 VDD 5 V Supply voltage terminal.
TRUTH TABLE
CLOCK LATCH ENABLE SERIAL-IN
OUT0 ··· OUT7 ··· OUT15 SERIAL-OUT
UP H L Dn Dn ··· Dn-7
··· Dn-15 Dn-15
UP L L Dn+1 No change Dn-14
UP H L Dn+2 Dn+2 ··· Dn-5
··· Dn-13 Dn-13
DOWN X L Dn+3 Dn+2 ··· Dn-5
··· Dn-13 Dn-13
DOWN X H Dn+3 Off Dn-13
Note: 15~OUT0 = on in case of Dn = H level and 15~OUT0 = off in case of Dn = L level.
A resistor is connected with R-EXT and GND accompanied with outside, and it is necessary that a correct power
supply voltage is supplied.
EQUIVALENT CIRCUIT OF INPUTS AND OUTPUTS
1.
ENABLE
terminal 2.
LATCH
terminal
3. CLOCK, SERIAL-IN terminal 4. SERIAL-OUT terminal
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MAXIMUM RATINGS (Ta = 25°C)
CHARACTERISTIC SYMBOL RATING UNIT
Supply Voltage VDD 0~7.0 V
Input Voltage VIN -0.4~VDD + 0.4 V
Output Current IOUT 90 mA
Output Voltage VOUT -0.5~17.0 V
Clock Frequency fCK 15 MHz
GND Terminal Current IGND 1440 mA
1.78 (BNG-type : ON PCB, Ta = 25°C )
Power Dissipation PD 1.00 (BFG-type : ON PCB, Ta = 25°C ) W
BNG : 70 (BN-type : ON PCB)
Tharmal Resistance Rth (j-a) BFG : 120 (BF-type : ON PCB) °C / W
Operating Temperature Topr -40~85 °C
Storage Temperature Tstg -55~150 °C
Note: BN-type : Ambient temperature delated above 25°C in the proportion of 14.2 mW / °C
BF-type : Ambient temperature delated above 25°C in the proportion of 8.3 mW / °C
RECOMMENDED OPERATING CONDITION (Ta = -40~85°C unless otherwise noted)
CHARACTERISTIC SYMBOL CONDITION MIN
TYP.
MAX
UNIT
Supply Voltage VDD – 4.5 5.0 5.5 V
Output Voltage VOUT – – – 15.0
V
IO OUTn, DC 1 circuit 5 – 88
IOH SERIAL-OUT – – 1.0
Output Current
IOL SERIAL-OUT – – -1.0
mA
VIH – 0.7
VDD
– VDD
+0.3
Input Voltage VIL – -0.3
– 0.3
VDD
V
LATCH Pulse Width tLATw 100
– – ns
CLOCK Pulse Width tw CLK 50 – – ns
ENABLE Pulse Width tENw 4500
– – ns
Set-Up Time for DATA tsetup (D) 60 – – ns
Hold Time for DATA thold (D) 20 – – ns
Set-Up Time for LATCH tsetup (L) 100
– – ns
Hold Time for LATCH thold (L)
VDD = 4.5~5.5 V
60 – – ns
Clock Frequency fCLK Cascade operation – – 10.0
MHz
Ta = 85°C (BNG-type) – – 0.92
Power Dissipation PD Ta = 85°C (BFG-type) – – 0.50
W
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ELECTRICAL CHARACTERISTICS (VDD = 5.0 V, Ta = 25°C unless otherwise noted)
CHARACTERISTIC SYMBOL TEST
CIR-
CUIT
CONDITION MIN
TYP.
MAX
UNIT
"H" Level VIH – Ta = -40~85°C 0.7
VDD
– VDD
Input Voltage "L" Level VIL – Ta = -40~85°C GND
– 0.3
VDD
V
Output Leakage Current IOH – VOH = 15.0 V – – 10 µA
VOL – IOL = 1.0 mA – – 0.4
Output Voltage SERIAL-OUT VOH – IOH = -1.0 mA 4.6 – – V
IOL1 – VCE = 0.7 V 34.1
40.0
45.9
Output Current 1 IOL2 – VCE = 0.4 V
REXT = 470 Ω
(Include current
matching) 33.7
39.5
45.3
mA
Current Skew ∆ IOL1 – IO = 40 mA,
VCE = 0.4 V REXT = 470 Ω – ±1.5
±6.0
%
IOL3 – VCE = 1.0 V 64.2
75.5
86.8
Output Current 2 IOL4 – VCE = 0.7 V
REXT = 250 Ω
(Include current
matching) 63.8
75.0
86.2
mA
Current Skew ∆ IOL2 – IO = 75 mA,
VCE = 0.7 V REXT = 250 Ω – ±1.5
±6.0
%
Supply Voltage Regulation % / VDD – REXT = 470 Ω,
Ta = -40~85°C – 1.5 5.0 % / V
Pull-Up Resistor RIN (up) – – 150
300
600
Ω
Pull-Down Resistor RIN (down) – – 100
200
400
Ω
IDD (off) 1 – REXT = Open,
15~OUT0 = off – 0.6 1.2
IDD (off) 2 – REXT = 470 Ω, 15~OUT0 = off
3.5 5.8 8.0
"OFF"
IDD (off) 3 – REXT = 250 Ω, 15~OUT0 = off
6.5 10.7
15.0
IDD (on) 1 – REXT = 470 Ω, 15~OUT0 = on
10.0
16.0
22.0
Supply Current
"ON" IDD (on) 2 – REXT = 250 Ω, 15~OUT0 = on
18.0
28.3
38.5
mA
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SWITCHING CHARACTERISTICS (Ta = 25°C unless otherwise noted)
CHARACTERISTIC SYMBOL TEST
CIR-
CUIT
CONDITION MIN
TYP
MAX
UNIT
CLK- OUTn – 1200
1500
LATCH - OUTn – 1200
1500
ENABLE - OUTn – 1200
1500
Propagation
Delay Time
(“L” to “H”)
CLK-SOUT
tpLH –
15 30 70
ns
CLK- OUTn – 700 1000
LATCH - OUTn – 700 1000
ENABLE - OUTn – 700 1000
Propagation
Delay Time
(“H” to “L”)
CLK-SOUT
tpHL –
15 30 70
ns
CLK tw CLK – – 20 30 ns
Pulse Width LATCH tw LAT – – 10 25 ns
L-H tsetup (L) – 25 50 ns
Set-up Time H-L tsetup (C) – – 25 50 ns
L-H thold (L) – 0 15 ns
Hold Time H-L thold (C) – – 0 15 ns
Maximum CLOCK Rise Time tr – – – 10 µs
Maximum CLOCK Fall Time tf – – – 10 µs
Output Rise Time tor – 150
300 600
ns
Output Fall Time tof –
VDD = 5.0 V
VCE = 0.4 V
VIH = VDD
VIL = GND
REXT = 470 Ω
VL = 3.0 V
RL = 65 Ω
CL = 10.5 pF
150
300 600
ns
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TEST CIRCUIT
DC ch aracteristic
AC characteristic
PRECAUTIONS for USING
Utmost care is necessary in the design of the output line, VCC (VDD) and GND line since IC may be destroyed due to
short-circuit between outputs, air contamination fault, or fault by improper grounding.
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TIMING WAVEFORM
1. CLOCK-SERIAL OUT, OUTn
2. CLOCK-
LATCH
3.
ENABLE
-OUTn
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Fig.1
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LED DRIVER TB6270X SERIES APPICATION NOTE
[1] Output current (IOUT)
IOUT is set by the enternal resistor (R-EXT) as shown in Fig.1.
[2] Total supply voltage (VLED)
This device can operate 0.4~0.7V (VO).
When a higher voltage is input to the device, the excess voltage is consumed inside the device, that leads to power
dissipation.
In order to minimize power dissipation and loss, we would like to recommend to set the total supply voltage as shown
below,
VLED (total supply voltage) = VCE (Tr Vsat) + Vf (LED Forward voltage) + VO (IC supply voltage)
When the total supply is too high considering the power dissipation of this device, an additional R can decrease the
supply voltage (VO).
[3] Pattern layout
This device owns only one ground pin that means signal ground pin and power ground pin are common.
If ground pattern layout contains large inductance and impedance, and the voltage between ground and LATCH,
CLOCK terminals exceeds 2.5 V by switching noise in operation, this device may miss-operate. So we would lile you to
pay attention to pattern layout to minimize inductance.
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Package Dimensions
Weight: 1.22 g (typ.)
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Package Dimensions
Weight: 0.32 g (typ.)
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• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• The products described in this document are subject to the foreign exchange and foreign trade laws.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
• The information contained herein is subject to change without notice.
000707EBA
RESTRICTIONS ON PRODUCT USE
About solderability, following conditions were confirmed
• Solderability
(1) Use of Sn-63Pb solder Bath
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
