Datasheet PWM Control Type DC/DC Converter IC for AC/DC Driver BD7673AG General Description BD7673AG is a PWM controller typed DC/DC converter for AC/DC that provides an optimum system for all products that requires an electrical outlet. This product supports both isolated and non-isolated devices. IC enables simple design of low-power converters. With switching MOSFET and current detection resistor as external devices, it enables more freedom in design. Since the peak current control is utilized, peak current is controlled in each cycle, application excels wide bandwidth and transient response. BD7673AG includes various protective functions such as soft start function, burst function, per-cycle over current limiter, VCC overvoltage protection and overload protection. An external latch pin (COMP pin) is provided, so that latch stopping (OFF) can be set by external signals. This function is available as overheating protection and over output voltage protection. The PWM switching frequency is fixed at 65 kHz. A frequency hopping function is included which contributes to low EMI. Key Specifications Power Supply Voltage range: 8.5V to 25.0V Operating Current: Normal: 0.60mA (Typ) Burst: 0.40mA (Typ) Oscillation Frequency: 65kHz (Typ) Operating Temperature range: -40C to +85C W(Typ) x D (Typ) x H (Max) 2.90mm x 2.80mm x1.25mm Package SSOP6 Features PWM frequency of 65kHz PWM current mode method Low circuit current when UVLO is ON (12A at VCC=12V) Low circuit current in no load (Burst operation when load is light) Built-in SW frequency hopping function 250nsec leading-edge blanking VCC UVLO / OVP Per-cycle over current protection circuit Soft start Output overload protection (latch protection) External latch function for COMP pin (Over heating protection function) Applications AC adapters and household appliances (vacuum cleaners, humidifiers, air cleaners, air conditioners, refrigerators, IH cooking heaters, rice cookers, etc.) Typical Application Circuit F2 D4 F1 C2 D1 FL1 ZNR1 C8 R2 R1 + C5 C9 D2 + C1 R4 Q1 D3 + C3 ZD R5 R6 C7 7673 7673A U1 C4 R11 R9 R7 C6 R3 R8 U2 R10 Figure 1, Product structureSilicon monolithic integrated circuit .www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211114001 Application Diagram (12 V 1A Isolated Type) This product is not designed protection against radioactive rays 1/18 TSZ02201-0F2F0A200120-1-2 22.Mar.2017 Rev.003 Datasheet BD7673AG Pin ConfigurationSSOP6 (Unit:mm) Figure 2, External Dimensions of SSOP6 Package Pin Description Table 1 I/O PIN Functions NO. Pin Name I/O 1 GND I/O 2 FB 3 4 Function ESD protection system VCC GND GND pin - I Feedback signal input pin COMP I Comparator input pin CS I Primary current sensor pin 5 VCC I Power supply input pin - 6 OUT O External MOS drive pin I/O Equivalent Circuit Figure 3, I/O Equivalent Circuit www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2/18 TSZ02201-0F2F0A200120-1-2 22.Mar.2017 Rev.003 Datasheet BD7673AG Block Diagram + VH FUSE AC Diode Bridge Filter 85- 265Vac VO CM Rstart Cvcc Vs VCC + - VCC UVLO 13.5V / 7.5V + - Internal Block 4.0V LineReg VCC OVP LATCH (27.5V) 4.0V LineReg Soft Start 01msec Maxduty 15% 18msec Maxduty 25% 25.9k + COMP 0.5V S 4.0V LineReg R OUT Q1 O SC OLP Comparator + DRIVER PWM Control 20k FB Q Timer ( 250 ms) + - Pulse Skip Comparator - CS Current Limit Comparator + PWM Comparator Leading Edge Blanking (typ=250ns) Rs MAX DUTY + Frequency hopping + OSC = 65 kHz Slope Compensation GND FeedBack With Isolation Figure 4, Block Diagram www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 3/18 TSZ02201-0F2F0A200120-1-2 22.Mar.2017 Rev.003 Datasheet BD7673AG Description of Each Block ( 1 ) Start Sequences (Soft Start Operation, Light Load Operation, and Latch Protection for Overload) Start sequences are shown in Figure 5. This is also shown the operation of latch protection for overload. See the sections below for detailed descriptions VH VCC=13.5V VCC7.5V VCC7.0V VCC Internal REF Pull Up Within 250ms 250ms FB Over Load Vout Normal Load Light Load Iout Burst Mode Switching Stop Switing Switching Soft Start A A: B: C: D: E: F: G: H: I: J: BC D E F G H I J Figure 5, Start Sequence Timing Chart Input voltage VH is applied VCC pin voltage rises by being supplied from VH line through start resistor "Rstart" and the IC starts operating when VCC > VUVLO1 (13.5V Typ).Switching operation starts when other protection functions are judged as normal.From startup to be stable output voltage, application should be set to stabilize output voltage during VCC > VUVLO2 (7.5V Typ) because the VCC pin consumption current causes the VCC voltage drop. Operated soft start function, maximum duty is restricted to 15% during a 1ms period to prevent any excessive rise in voltage or current. From 1ms to 8ms, maximum duty is restricted to 25%. Maximum duty is restricted to 75% after 8ms. VOUT voltage rises when the switching operation starts. Once the output voltage starts, it is set to the rated voltage level within the TFOLP period (250ms Typ).The output voltage is regulated within TFOLP (=250ms Typ) from starting. During Light Load, when FB pin voltage < VBST (=0.3V Typ), Burst method is operated to keep power consumption down. Over Load condition occurs when FB pin voltage > VFOLP1A (=2.8V Typ). When FB pin voltage is at VFOLP1A (= 2.8V Typ) for more than TFOLP (250ms Typ), the overload protection function is triggered and switching is stopped by LATCH operation. The IC's internal 250ms timer is reset during the TFOLP period (250ms Typ) if FB < VFOLP1B even once. VCC voltage is changed from VUVLO1 (13.5V Typ) to VUVLO2 (7.5V Typ) because of switching stop by latch protection. In case of high VH voltage if VCC voltage is not changed to less than VLATCH (7.0V Typ), IC is not released from latch protection. If the condition which VH voltage is lower continues, VCC voltage is also lower. When VCC voltage is lower than VLATCH (7.0V Typ), the IC is released from latch protection. Same as B In Figure 4, start resistor Rstart is needed to start the application. When the start resistor Rstart value is reduced, standby power is increased and the startup time is shortened. Conversely, when the start resistor Rstart value is increased, standby power is reduced and the startup time is increased. Standby current is less than 20uA at VCC UVLO is disable, and it can calculate VCC UVLO voltage from VUVLO1=14.5V (Max). ex Starting resistor Rstart setting method; Rstart = (VHmin - VUVLO1Max) / IOFFMax In the case of Vac=100V (-20% of a margin), Rstart requirement can be found by the following formulas: VHmin =100 x 2 x 0.8 = 113V Because of VUVLO1 (Max) =14.5V, Rstart (113V - 14.5V) / 20A4.925M Start-up time can be found by the following formulas: Tstart = -Rstart x CVCC x ln (1-VUVLO1/VHmin) exRstart=3.0M 2 2 Rstart resistor loss in this case is : Pd (Rstart) = (VH-VCC) / Rstart = (141V - 14.5V) / 3.0M = 5.33mW. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4/18 TSZ02201-0F2F0A200120-1-2 22.Mar.2017 Rev.003 Datasheet BD7673AG ( 2 ) VCC Pin Protection BD7673AG includes UVLO (Under Voltage Locked Out) and OVP (Over Voltage Protection) functions to monitor VCC pin voltage (see Figure 6 for OVP latch operation). The UVLO function prevents damage to MOSFET by stopping switching operations by latch protection when the VCC pin voltage drops to VCC < VUVLO2 (= 7.5V Typ). The VCC OVP function prevents damage to MOSFET by stopping switching operations when the VCC pin voltage exceeds VOVP1 (= 27.5V Typ). The latch release condition is when VCC < VLATCH (VUVLO2 - 0.5V, Typ = 7.0V). A latch blanking time is used for protecting mal-function. This time is 100us. VCC 27.5V 13.5V 7. 5V 7.0V Time OUT Switing ON ON OFF OFF Time 100 us Figure 6, VCC UVLO/OVP Operation (Latch) www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 5/18 TSZ02201-0F2F0A200120-1-2 22.Mar.2017 Rev.003 Datasheet BD7673AG ( 3 ) DCDC Driver (PWM Comparator, Frequency Hopping, Slope Compensation, OSC, Burst) BD7673AG uses current mode PWM control. In the internal generator, the average switching frequency is 65 kHz. Furthermore, switching frequency hopping function is built-in while the switching frequency fluctuation is shown as in Figure 7. Fluctuation cycle is 125Hz (=8ms). +4kHz (+6%) -4kHz (-6%) Figure 7, Frequency Hopping Function The max-duty cycle is fix to 75% (Typ) at OUT pin and minimum pulse width is fix at 500ns (Typ). When the duty cycle exceeds 50% at Current Mode control, the sub-harmonic oscillation occurs. To prevent it, IC is built-in slope compensation function. BD7673AG has burst mode function to attain less power consumption when load is light. This function monitors FB pin voltage and detects light load when FB voltage < VBST (=0.3V Typ). The secondary output voltage, the FB voltage and the DCDC function are shown in Figure 8. FB pin is pulled up by RFB (=20k Typ). At light load, when the secondary output voltage rises, the FB pin voltage will drop and when this goes below VBST (=0.3V Typ) burst function will follow to reduce the power consumption. Overload Switching frequency 65kHz Burst 0.3V Figure 8, www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 FB PIN Voltage 2.8V Switching Operation Status Changes by FB Pin Voltage 6/18 TSZ02201-0F2F0A200120-1-2 22.Mar.2017 Rev.003 Datasheet BD7673AG ( 4 ) Over Current Limiter and Leading Edge Blanking Period BD7673AG has over current limiter for each switching cycle. When the CS pin voltage exceeds the VCS voltage (=0.5V Typ), switching is turned OFF. In addition, when the driver MOSFET is turned ON, surge current occurs at each capacitor component and drive current. Therefore, when the CS pin voltage rises temporarily, the detection errors may occur in the over current limiter circuit. To prevent detection errors, the OUT pin is switched from low to high and the CS signal is blanked for 250nsec by the LEB (Leading Edge Blanking) function. This blanking function enables a reduction of CS pin noise filtering in response to noise that occurs when the OUT pin is switched from low to high. ( 5 ) Output Overload Protection Function (FB OLP Comparator ) Overload Protection Function monitors the load status of secondary output through FB pin and stops the switching of OUT pin during excessive load. In over load condition, there is no current in photo-coupler because output voltage decreases (drops) while FB pin voltage rises. When FB pin voltage exceeds VFOLP1A (=2.8V Typ) at TFOLP (=250ms Typ) interval continuously, a load is excessive and OUT pin is fixed to L. The timer of overload protection is reset when FB pin drops further than VFOLP1B (=2.6V Typ) within TFOLP (=250ms Typ) after exceeding VFOLP1A (=2.8V Typ). Switching functions within this TFOLP (=250ms Typ). FB voltage, which is pulled up in resistance to IC internal voltage operates from VFOLP1A (=2.8V Typ) or more at start-up. For this matter, set the start-up time of the secondary output voltage such that the FB voltage is always VFOLP1B (=2.6V Typ) or less within TFOLP (=250ms Typ) at start-up. Excessive load is detected and latch stops when TFOLP (=250ms Typ) passes. Release of latch plugs/unplugs the power supply and is cancelled when VCC VLATCH (=7.0V Typ). Figure 9, Overload Protection Latch www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 7/18 TSZ02201-0F2F0A200120-1-2 22.Mar.2017 Rev.003 Datasheet BD7673AG ( 6 ) COMP Pin External Latch Function IC is latched when the COMP pin voltage goes below VCOMP (0.5V Typ). A latch timer for TLATCH (100us Typ) added to prevent operation errors caused by noise. The COMP pin is pulled up by RCOMP (25.9k Typ), and when RT (3.7k Typ) is pulled down at the COMP pin, latch protection is operated. Some application examples are shown in Figure 10, Figure 11, and Figure 12. Resistervalue R[k] Overheating Protection by NTC Thermistor A thermistor is attached to the COMP pin so that latching can be stopped when overheating occurs. In the case of this application, it should be designed so that the thermistor resistance becomes RT (3.70k Typ) when overheating is detected. (Figure 10 and Figure 11 are application circuit examples in which latch operation occurs when Ta = 110) The variation in RT (=3.70k Typ) shown in an electrical property includes only IC. Please add the variation of external thermistor resistance to it and design. 20.0 18.0 16.0 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0 RTt(typ3.7k) Detect 0 20 40 60 80 100 120 140 160 180 200 Temparature T[ ] Figure 10, COMP Pin Overheating Protection Application Figure 11, Temperature-Thermistor Resistance Value Secondary Output Voltage Overvoltage Protection A photo-coupler is attached to the COMP pin to perform detection of secondary output overvoltage. VO RCOMP R (typ25.9k ) (Typ=25.9k) LA T CH COMP + Figure 12. Output Overvoltage Protection Application www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 8/18 TSZ02201-0F2F0A200120-1-2 22.Mar.2017 Rev.003 Datasheet BD7673AG Absolute Maximum Ratings Ta=25 Parameter Symbol Rating Unit Maximum Applied Voltage 1 Vmax1 30 V VCC, Maximum Applied Voltage 2 Vmax2 6.5 V CS, OUT pin output Peak Current IOUT 1.0 A Allowable Dissipation Pd 674.9 (Note1) mW Topr -40 to +85 o C -55 to +150 o C Operating Temperature Range Storage Temperature Range Tstr Conditions OUT FB, COMP When implemented (Note1): Derate by 5.399 mW/C when operating above Ta=25C (when mounted on 70 mm x 70 mm, 1.6 mm thick, glass epoxy on single-layer substrate). Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating RatingsTa=25 Parameter Symbol Rating Unit VCC 8.5 to 26.0 V Power Supply Voltage Range Electrical Characteristics (Unless otherwise noted, Ta = 25C, VCC=12V) Specifications Parameter Symbol MIN TYP MAX Conditions VCC pin voltage Unit Conditions Circuit Current Circuit Current (OFF) IOFF - 12 20 A VCC = 12V (UVLO = Detection) Circuit Current (ON) 1 ION1 - 600 1000 A FB = 2.0V COMP: 100k (during pulse operation) Circuit Current (ON) 2 ION2 - 400 650 A FB = 0.0V COMP:100k (during pulse operation when OFF) VCC UVLO Voltage 1 VUVLO1 12.50 13.50 14.50 V VCC rise VCC UVLO Voltage 2 VUVLO2 6.50 7.50 8.50 V VCC drop VCC UVLO Hysteresis VUVLO3 - 6.00 - V VUVLO3= VUVLO1- VUVLO2 VCC OVP Voltage 1 VOVP1 25.0 27.5 30.0 V VCC rise VCC Pin Protection Function www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 9/18 TSZ02201-0F2F0A200120-1-2 22.Mar.2017 Rev.003 Datasheet BD7673AG Electrical Characteristics of control block (Unless otherwise noted, Ta = 25C, VCC=12V) Specifications Parameter Symbol Unit MIN TYP MAX Conditions [PWM Type DCDC Driver Block] Oscillation Frequency FSW1 60 65 70 KHz FB=2.0V average frequency Frequency Hopping Width 1 FDEL1 - 4.0 - KHz FB=2.0V FCH 93 125 157 Hz Hopping Fluctuation Frequency Minimum Pulse Width Tmin - 500 - ns Soft Start Time 1 TSS1 0.75 1.00 1.25 ms Soft Start Time 2 TSS2 6.00 8.00 10.00 ms Maximum Duty 1 Dmax 68.0 75.0 82.0 % During normal operation Maximum Duty 2 DSS1 5.0 15.0 25.0 % During soft start 0[ms] to Tss1[ms] Maximum Duty 3 DSS2 15.0 25.0 35.0 % During soft start TSS1 [ms] to TSS2 [ms] FB pin Pull-up Resistance RFB 15 20 25 k FB / CS Rain Gain - 5 - V/V FB Burst Voltage VBST 0.20 0.30 0.40 V During FB drop FB OLP Voltage 1a VFOLP1A 2.5 2.8 3.1 V When overload is detected (FB rise) FB OLP Voltage 1b VFOLP1B - VFOLP1A-0. 2 - V When overload is detected (FB drop) FB OLP Timer TFOLP 187 250 312 ms Latch Release Voltage (VCC pin voltage) VLATCH - VUVLO2-0. 5 - V Latch release voltage VCCUVLO2-0.5 [V] Latch Mask Time TLATCH 50 100 200 us VCCOVP, COMP Mask time Overcurrent Detection Voltage VCS 0.475 0.500 0.525 V Leading Edge Blanking Time TLEB - 250 - ns OUT pin Pch MOS Ron RPOUT 10 25 39 OUT pin Nch MOS Ron RNOUT 3 7 12 [Overcurrent Detection Block] [Output Driver Block] [External Latch Comparator Block] COMP pin Latch Detection Voltage VCOMP - 0.5 - V COMP pin Pull-up Resistance RCOMP - 25.9 - k RT 3.30 3.70 4.10 k Thermistor Resistance Detection Value www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 10/18 Thermistor connected to COMP pin TSZ02201-0F2F0A200120-1-2 22.Mar.2017 Rev.003 Datasheet BD7673AG 85.0 83.0 25.0 23.0 68.0 81.0 79.0 77.0 21.0 19.0 17.0 66.0 64.0 62.0 60.0 -40 -25 -10 5 20 35 50 65 MAXDUTY2 (WhenTYPfrequency)[%] 70.0 MAXDUTY1 (WhenTYPfrequency)[%] TYPFREQ[Hz] Typical Performance Curves (This is not a guarantee since this is the reference data. Figure 37 shows the measurement circuit diagram.) 75.0 73.0 71.0 69.0 67.0 65.0 80 -40 -25 -10 Temp[ ] 20 35 50 65 80 -40 -25 -10 Figure 14, MAXDUTY1 (With Typ frequency) 20 35 50 65 80 Figure 15, MAXDUTY2 (With Typ frequency 20 35 50 65 80 10.8 10.3 9.8 9.3 8.8 8.3 7.8 7.3 6.8 6.3 5.8 5.3 4.8 MAXDUTYSS2(VCC=15)[msec] MAXDUTYSS1(VCC=15[msec] 5 1.30 1.20 1.10 1.00 0.90 0.80 0.70 0.60 -40 -25 -10 Temp[ ] 5 20 35 50 65 80 -40 -25 -10 Temp[ ] Figure 16, MAXDUTY3 (With Typ frequency 5 20 35 50 65 80 Temp[ ] Figure 17, MAXDUTY SS1 (VCC=15 Figure 18, MAXDUTY SS2 (VCC=15) 12.0 200.0 11.0 10.0 9.0 8.0 7.0 6.0 5.0 37.0 31.0 28.0 25.0 22.0 19.0 16.0 4.0 13.0 3.0 10.0 5 20 35 50 65 100.0 5 20 35 50 65 80 -40 -25 -10 FBRES(VCC=12)[k] 15.0 10.0 5.0 23.0 21.0 19.0 17.0 15.0 0.0 20 35 50 65 80 Temp[ ] Figure 22, ICC (VCC) OFF (VCC=12) www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 20 35 50 65 80 Figure 21, Timer Latch 3.10 25.0 20.0 5 Temp[ ] Figure 20, PMOS RON (VCC=12) Figure 19, NMOS RON (VCC=12) 5 75.0 Temp[ ] Temp[ ] -40 -25 -10 125.0 50.0 -40 -25 -10 80 150.0 -40 -25 -10 5 20 35 50 65 80 Temp[ ] Figure 23, FBRES (VCC=12) 11/18 FBOLPVoltage1a(VCC=12)[V] -40 -25 -10 175.0 34.0 TIMERLATCH[us] PMOSRON(VCC=12)[] NMOSRON(VCC=12)[] 5 Temp[ ] 1.40 35.0 33.0 31.0 29.0 27.0 25.0 23.0 21.0 19.0 17.0 15.0 -40 -25 -10 ICC(VCC)OFF(VCC=12)[uA] 9.0 7.0 5.0 Temp[ ] Figure 13, Typ Frequency Fsw1 MAXDUTY3 (WhenTYPfrequency) [%] 5 15.0 13.0 11.0 2.90 2.70 2.50 -40 -25 -10 5 20 35 50 65 80 Temp[ ] Figure 24, FBOLP Voltage 1a (VCC=12) TSZ02201-0F2F0A200120-1-2 22.Mar.2017 Rev.003 Datasheet BD7673AG 0.40 325.0 300.0 275.0 250.0 225.0 200.0 175.0 150.0 -40 -25 -10 5 20 35 50 65 FBBurstVoltage(VCC=12)[V] 0.53 CURLIMVOLTAGE(VCC=12)[V] FBOVP256ms(VCC=12)[ms] 350.0 0.52 0.51 0.50 0.49 0.48 -40 -25 -10 80 5 20 35 50 65 0.35 0.30 0.25 0.20 80 -40 -25 -10 Temp[ ] Temp[ ] Figure 25, FB OVP 256ms(VCC=12) 5 20 35 50 65 80 Temp[ ] Figure 26, CURLIM Voltage (VCC=12) Figure 27, FB Burst Voltage (VCC=12) 0.58 0.55 0.52 0.49 0.46 0.43 COMPpull upRES(VCC=12)[k] 0.61 COMPLATCHdetect voltageerror[%] COMPLATCHdetect voltage[V] 5.00 3.00 1.00 1.00 3.00 0.40 0.37 5.00 -40 -25 -10 5 20 35 50 65 80 -40 -25 -10 Temp[ ] 5 20 35 50 65 31.4 29.4 27.4 25.4 23.4 21.4 19.4 -40 -25 -10 80 Figure 28, COMP Latch Detect Voltage 5 20 35 50 65 80 Temp[ ] Temp[ ] Figure 29, COMP Latch Detect Voltage Error Figure 30, COMP Pull-up RES (VCC=12) 5.0 COMPpull upRES error(VCC=12)[%] 3.0 1.0 1.0 3.0 5.0 -40 -25 -10 5 20 35 50 65 80 Temp[ ] Figure 31, COMP Pull-up RES Error (VCC=12) Figure 32, RCOMP (VCC=12) TYPFREQ[kHz] 68.0 66.0 64.0 62.0 60.0 8.5 14.0 19.5 25.0 VCC[V] Figure 34, Typ Frequency Fsw1 (temp=25) www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Figure 33, RCOMP Error 0.530 0.525 4.02 0.520 0.515 RCOMP(VCC=12)[k] CURLIMVOLTAGE(VCC=12)[V] 70.0 0.510 0.505 0.500 0.495 0.490 0.485 3.92 3.82 3.72 3.62 3.52 3.42 3.32 0.480 8.5 14.0 19.5 25.0 VCC[V] Figure 35, CURLIM Voltage (temp=25) 12/18 8.5 14.0 19.5 25.0 VCC[V] Figure 36, RCOMP (temp=25) TSZ02201-0F2F0A200120-1-2 22.Mar.2017 Rev.003 Datasheet BD7673AG BD7673AG GND OUT FB VCC COMP A A CS A Figure 37, Measurement Circuit Diagram Power Dissipation The thermal design should set the operation for the following conditions. (Since the temperature shown below is the guaranteed temperature, be sure to take margin into account.) 1. The ambient temperature Ta must be 85 or less. 2. The IC's loss must be within the allowable dissipation Pd. The thermal reduction characteristics are as follows. (PCB : 70mmx70mmx1.6mm mounted on glass epoxy single-layer substrate) Figure 38, SSOP6 Thermal Reduction Characteristics www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 13/18 TSZ02201-0F2F0A200120-1-2 22.Mar.2017 Rev.003 Datasheet BD7673AG Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC's power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to GND at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. GND Voltage Ensure that no pins are at a voltage below that of the GND pin at any time, even during transient condition. 4. GND Wiring Pattern When using both small-signal and large-current GND traces, the two GND traces should be routed separately but connected to a single GND at the reference point of the application board to avoid fluctuations in the small-signal GND caused by large currents. Also ensure that the GND traces of external components do not cause variations on the GND voltage. The GND lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction temperature rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, GND the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to GND, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or GND line. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 14/18 TSZ02201-0F2F0A200120-1-2 22.Mar.2017 Rev.003 Datasheet BD7673AG Operational Notes - continued 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Figure xx. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC's maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 15/18 TSZ02201-0F2F0A200120-1-2 22.Mar.2017 Rev.003 Datasheet BD7673AG Ordering Information B D 7 6 7 3 Part Number A G - Package G:SSOP6 TR Packaging and forming specification TR: Embossed tape and reel Marking Diagram SSOP6 (TOP VIEW) 3 A Part Number Marking 1PIN MARK www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 LOT Number 16/18 TSZ02201-0F2F0A200120-1-2 22.Mar.2017 Rev.003 Datasheet BD7673AG Physical Dimension, Tape and Reel Information Package Name SSOP-6 <Tape and Reel information> Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1pin Direction of feed Reel www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Order quantity needs to be multiple of the minimum quantity. 17/18 TSZ02201-0F2F0A200120-1-2 22.Mar.2017 Rev.003 Datasheet BD7673AG Revision History Date Revision 28.May.2013 001 16.Jul.2015 002 22.Mar.2017 003 Changes New preparation P1 Modify Figure 1 P4 Modify Figure 5 P8 Modify written error P9 Modify written error P10 Modify t written error P 13 Modify circuit Figure36 P13 Modify circuit Figure37 P16 Move Physical dimension page P6 Modify written error P7 Modify written error P8 Modify written error P9 explanation of package power + www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 18/18 TSZ02201-0F2F0A200120-1-2 22.Mar.2017 Rev.003 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet bd7673ag - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS bd7673ag SSOP6 3000 3000 Taping inquiry Yes