2010 Microchip Technology Inc. Preliminary DS39979A
PIC18F87J72 Family
Data Sheet
80-Pin, High-Performance
Microcontrollers with Dual Channel AFE,
LCD Driver and nanoWatt Technology
DS39979A-page 2 Preliminary 2010 Microchip Technology Inc.
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ISBN: 978-1-60932-314-1
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2010 Microchip Technology Inc. Preliminary DS39979A-page 3
Analog Features:
Dual-Channel, 24-Bit Analog Front End (AFE):
- 90 dB SINAD, -101 dBc THD (to 35th harmonic),
103 dB SFDR for each channel
- 10 ppm INL
- Differential voltage input pins
- Low drift internal voltage reference (12 ppm/°C)
- Programmable data rate to 64 ksps
- High-gain PGA on each channel (up to 32 V/V)
- Phase delay compensation between channels
(1 µs resolution)
12-Bit, 12-Channel SAR A/D Converter:
- Auto-acquisition
- Conversion available during Sleep
Two Analog Comparators
Programmable Reference Voltage for Comparators
Charge Time Measurement Unit (CTMU):
- Capacitance measurement
- Time measurement with 1 ns typical resolution
- Temperature sensing
LCD Driver and Keypad Interface
Features:
Direct LCD Panel Drive Capability:
- Can drive LCD panel while in Sleep mode
- Wake-up from interrupt
Up to 33 Segments and 132 Pixels: Software Selectable
Programmable LCD Timing module:
- Multiple LCD timing sources available
- Up to four commons: static, 1/2, 1/3 or
1/4 multiplex
- Static, 1/2 or 1/3 bias configuration
On-Chip LCD Boost Voltage Regulator for
Contrast Control
CTMU for Capacitive Touch Sensing
ADC for Resistive Touch Sensing
Flexible Oscillator Structure:
External Crystal and Clock modes, with operation
up to 48 MHz
4x Phase Lock Loop (PLL)
Internal Oscillator Block with PLL:
- Eight user-selectable frequencies from 31.25 kHz
to 8 MHz
Secondary Oscillator using Timer1 at 32 kHz
Fail-Safe Clock Monitor (FSCM):
- Allows for safe shutdown if peripheral clock fails
Low-Power Features:
Power-Managed modes:
- Run: CPU on, peripherals on
- Idle: CPU off, peripherals on
- Sleep: CPU off, peripherals off
Two-Speed Oscillator Start-up
Peripheral Highlights:
High-Current Sink/Source 25 mA/25 mA
(PORTB and PORTC)
Up to Four External Interrupts
Four 8-Bit/16-Bit Timer/Counter modules
Two Capture/Compare/PWM (CCP) modules
Master Synchronous Serial Port (MSSP) module with
Two Modes of Operation:
- 3-wire/4-wire SPI (supports all four SPI modes)
-I
2C™ Master and Slave mode
One Addressable USART module
One Enhanced Addressable USART module:
- LIN/J2602 support
- Auto-wake-up on Start bit and Break character
- Auto-Baud Detect (ABD)
Hardware Real-Time Clock and Calendar (RTCC) with
Clock, Calendar and Alarm Functions
Special Microcontroller Features:
10,000 Erase/Write Cycle Flash Program
Memory, Typical
Flash Retention 20 Years, Minimum
Self-Programmable under Software Control
Word Write Capability for Flash Program Memory for
Data EEPROM Emulators
Priority Levels for Interrupts
8 x 8 Single-Cycle Hardware Multiplier
Extended Watchdog Timer (WDT):
- Programmable period from 4 ms to 131s
Selectable Open-Drain Configuration for Serial
Communication and CCP pins for Driving Outputs up to 5V
In-Circuit Serial Programming™ (ICSP™) via Two Pins
In-Circuit Debug via Two Pins
Operating Voltage Range: 4.5V to 5.5V (ADC), 2.0V
to 3.6V (digital and SAR ADC)
5.5V Tolerant Input (digital pins only)
On-Chip 2.5V Regulator
Target Applications:
Energy Metering
Power Measurement and Monitoring
Portable Instrumentation
Medical Monitoring
PIC18F87J72 FAMILY
80-Pin, High-Performance Microcontrollers with
Dual-Channel AFE, LCD Driver and nanoWatt Technology
PIC18F87J72 FAMILY
DS39979A-page 4 Preliminary 2010 Microchip Technology Inc.
Pin Diagram
Device
Flash
Program
Memory
(bytes)
SRAM
Data
Memory
(bytes)
LCD
(Pixels) I/O
A/D
Comparators
CCP
BOR/LVD
MSSP
A/EUSART
Timers
8-bit/16-bit
RTCC
CTMU
12-Bit SAR
(channels)
24-bit AFE
(channels)
PIC18F86J72 64K 3,923 132 51 12 2 2 2 Y 1 1/1 1/3 Y Y
PIC18F87J72 128K 3,923 132 51 12 2 2 2 Y 1 1/1 1/3 Y Y
PIC18F86J72
Note 1: Pinouts are subject to change.
2: The CCP2 pin placement depends on the setting of the CCP2MX Configuration bit.
3
4
5
6
7
8
9
10
11
12
13
14
15
16
48
47
46
45
44
43
42
41
40
39
64 63 62 61
21 22 23 24 25 26 27 28 29 30 31 32
1
2
17
18
37
50
49
19
20
33 34 35 36 38
58
57
56
55
54
53
52
51
60
59
68 67 66 6572 71 70 6974 73
78 77 76 75
79
80
RD7/SEG7
RD6/SEG6
RD5/SEG5
RD4/SEG4
RD3/SEG3
RD2/SEG2
RD1/SEG1
SVDD
VSS
RD0/SEG0/CTPLS
RE7/CCP2(2)/SEG31
RE6/COM3
RE5/COM2
RE4/COM1
RE3/COM0
RE2/LCDBIAS3
RE1/LCDBIAS2
RE0/LCDBIAS1
RG0/LCDBIAS0
RG1/TX2/CK2
RG2/RX2/DT2/VLCAP1
RG3/VLCAP2
MCLR
RG4/SEG26/RTCC
VSS
VDDCORE/VCAP
RF7/AN5/SS/SEG25
RF6/AN11/SEG24/C1INA
RF5/AN10/CVREF/SEG23/C1INB
RF4/AN9/SEG22/C2INA
RF3/AN8/SEG21/C2INB
RF2/AN7/C1OUT/SEG20
RF1/AN6/C2OUT/SEG19
ENVREG
AVDD
AVSS
RA3/AN3/VREF+
RA2/AN2/VREF-
RA1/AN1/SEG18
RA0/AN0
VSS
RA5/AN4/SEG15
RA4/T0CKI/SEG14
RC1/T1OSI/CCP2(2)I/SEG32
RC0/T1OSO/T13CKI
RC6/TX1/CK1/SEG27
RC7/RX1/DT1/SEG28
RC2/CCP1/SEG13
RC3/SCK/SCL/SEG17
RC4/SDI/SDA/SEG16
RC5/SDO/SEG12
RB7/KBI3/PGD
VDD
OSC1/CLKI/RA7
OSC2/CLKO/RA6
VSS
RB6/KBI2/PGC
RB5/KBI1/SEG29
RB4/KBI0/SEG11
RB3/INT3/SEG10/CTED2
RB2/INT2/SEG9/CTED1
RB1/INT1/SEG8
RB0/INT0/SEG30
SAVDD
VDD
ARESET
SDIA
CSA
SCKA
SDOA
CLKIA
DR
SVSS
REFIN-
REFIN+/OUT
SAVSS
CH0+
CH0-
CH1-
CH1+
80-Pin TQFP(1)
Pins are tolerant up to 5.5 V Dedicated 24-bit AFE pins
PIC18F87J72
2010 Microchip Technology Inc. Preliminary DS39979A-page 5
PIC18F87J72 FAMILY
Typical Application Circuit: Single-Phase Power Meter
LCD Glass
LN
EEPROM
RS-485
RF/PLC
Current
Sensor(s)(1) SEG/COM
SPI/I2C™
CTMU
CH0+
CH0-
CH1+
CH1-
UART1 UART2
Touc h
Keypad
Temperature
Sensor
Up to 33 SEG/4 COM
24-Bit
AFE with
PGA
PIC18F87J72(2)
Low-Voltage
Detect
12-Bit A/D
H/W RTCC
32 kHz
10 MHz
Note 1: Generic current sense configuration shown. Many circuit configurations using current and/or voltage
sensing are possible, including the use of shunts, transformers or Rogowski coils.
2: Power metering, with the measurement of active and reactive power, is done with the power metering
firmware application available through Microchip Technology.
Line Voltage
Measurement
Digital I/O
Indicator LEDs
Anti-tamper sensors
MAIN OSC
PIC18F87J72 FAMILY
DS39979A-page 6 Preliminary 2010 Microchip Technology Inc.
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 9
2.0 Guidelines for Getting Started with PIC18FJ Microcontrollers ................................................................................................... 21
3.0 Oscillator Configurations ............................................................................................................................................................ 25
4.0 Power-Managed Modes ............................................................................................................................................................. 35
5.0 Reset .......................................................................................................................................................................................... 43
6.0 Memory Organization ................................................................................................................................................................. 55
7.0 Flash Program Memory.............................................................................................................................................................. 77
8.0 8 x 8 Hardware Multiplier............................................................................................................................................................ 87
9.0 Interrupts .................................................................................................................................................................................... 89
10.0 I/O Ports ................................................................................................................................................................................... 105
11.0 Timer0 Module ......................................................................................................................................................................... 123
12.0 Timer1 Module ......................................................................................................................................................................... 127
13.0 Timer2 Module ......................................................................................................................................................................... 133
14.0 Timer3 Module ......................................................................................................................................................................... 135
15.0 Real-Time Clock and Calendar (RTCC) ................................................................................................................................... 139
16.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 157
17.0 Liquid Crystal Display (LCD) Driver Module............................................................................................................................. 167
18.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 195
19.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 239
20.0 Addressable Universal Synchronous Asynchronous Receiver Transmitter (AUSART) ........................................................... 259
21.0 12-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 273
22.0 Dual-Channel, 24-Bit Analog Front End (AFE)......................................................................................................................... 283
23.0 Comparator Module.................................................................................................................................................................. 293
24.0 Comparator Voltage Reference Module................................................................................................................................... 299
25.0 Charge Time Measurement Unit (CTMU) ................................................................................................................................ 303
26.0 Special Features of the CPU.................................................................................................................................................... 319
27.0 Instruction Set Summary .......................................................................................................................................................... 333
28.0 Development Support............................................................................................................................................................... 385
29.0 Electrical Characteristics .......................................................................................................................................................... 389
30.0 Packaging Information.............................................................................................................................................................. 429
Appendix A: Revision History............................................................................................................................................................. 433
Appendix B: Dual-Channel, 24-Bit AFE Reference............................................................................................................................ 434
The Microchip Web Site..................................................................................................................................................................... 477
Customer Change Notification Service .............................................................................................................................................. 477
Customer Support .............................................................................................................................................................................. 477
Reader Response .............................................................................................................................................................................. 478
Product Identification System............................................................................................................................................................. 479
2010 Microchip Technology Inc. Preliminary DS39979A-page 7
PIC18F87J72 FAMILY
TO OUR VALUED CUSTOMERS
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PIC18F87J72 FAMILY
DS39979A-page 8 Preliminary 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. Preliminary DS39979A-page 9
PIC18F87J72 FAMILY
1.0 DEVICE OVERVIEW
This document contains device-specific information for
the following devices:
PIC18F86J72
PIC18F87J72
This family combines the traditional advantages of all
PIC18 microcontrollers – namely, high computational
performance and a rich feature set – with a versatile
on-chip LCD driver and a high-performance,
high-accuracy analog front end. These features make
the PIC18F87J72 family a logical choice for many
high-performance power and metering applications
where price is a primary consideration.
1.1 Core Features
1.1.1 nanoWatt TECHNOLOGY
All of the devices in the PIC18F87J72 family incorporate
a range of features that can significantly reduce power
consumption during operation. Key items include:
Alternate Run Modes: By clocking the controller
from the Timer1 source or the internal RC
oscillator, power consumption during code
execution can be reduced by as much as 90%.
Multiple Idle Modes: The controller can also run
with its CPU core disabled but the peripherals still
active. In these states, power consumption can be
reduced even further, to as little as 4% of normal
operation requirements.
On-the-Fly Mode Switching: The power-managed
modes are invoked by user code during operation,
allowing the user to incorporate power-saving ideas
into their application’s software design.
1.1.2 OSCILLATOR OPTIONS AND
FEATURES
All of the devices in the PIC18F87J72 family offer six
different oscillator options, allowing users a range of
choices in developing application hardware. These
include:
Two Crystal modes using crystals or ceramic
resonators.
Two External Clock modes offering the option of a
divide-by-4 clock output.
A Phase Lock Loop (PLL) frequency multiplier,
available to the external oscillator modes which
allows clock speeds of up to 40 MHz. PLL can
also be used with the internal oscillator.
An internal oscillator block which provides an
8 MHz clock (±2% accuracy) and an INTRC source
(approximately 31 kHz, stable over temperature
and VDD), as well as a range of six user-selectable
clock frequencies, between 125 kHz to 4 MHz, for a
total of eight clock frequencies. This option frees the
two oscillator pins for use as additional general
purpose I/O.
The internal oscillator block provides a stable reference
source that gives the family additional features for
robust operation:
Fail-Safe Clock Monitor: This option constantly
monitors the main clock source against a reference
signal provided by the internal oscillator. If a clock
failure occurs, the controller is switched to the
internal oscillator, allowing for continued low-speed
operation or a safe application shutdown.
Two-Speed Start-up: This option allows the
internal oscillator to serve as the clock source
from Power-on Reset, or wake-up from Sleep
mode, until the primary clock source is available.
1.1.3 MEMORY OPTIONS
The PIC18F87J72 family provides ample room for
application code with 128 Kbytes of code space. The
Flash cells for program memory are rated to last up to
10,000 erase/write cycles. Data retention without
refresh is conservatively estimated to be greater than
20 years.
The Flash program memory is readable and writable.
During normal operation, the PIC18F87J72 family also
provides plenty of room for dynamic application data
with up to 3,923 bytes of data RAM.
1.1.4 EXTENDED INSTRUCTION SET
The PIC18F87J72 family implements the optional
extension to the PIC18 instruction set, adding 8 new
instructions and an Indexed Addressing mode.
Enabled as a device configuration option, the extension
has been specifically designed to optimize re-entrant
application code originally developed in high-level
languages, such as ‘C’.
1.1.5 EASY MIGRATION
Regardless of the memory size, all devices share the
same rich set of peripherals, allowing for a smooth
migration path as applications grow and evolve.
The consistent pinout scheme used throughout the
entire family also aids in migrating to the next larger
device.
The PIC18F87J72 family is also largely pin compatible
with other PIC18 families, such as the PIC18F8720 and
PIC18F8722, the PIC18F85J11, and the PIC18F8490
and PIC18F85J90 families of microcontrollers with
LCD drivers. This allows a new dimension to the
evolution of applications, allowing developers to select
different price points within Microchip’s PIC18 portfolio,
while maintaining a similar feature set.
PIC18F87J72 FAMILY
DS39979A-page 10 Preliminary 2010 Microchip Technology Inc.
1.2 Analog Features
Dual-Channel, 24-Bit ADC Front End (AFE):
This module contains two synchronous sampling,
 Analog-to-Digital (A/D) Converters, plus sup-
porting Programmable Gain Amplifiers (PGAs)
and an internal voltage reference, to perform
high-accuracy and low noise analog conversions.
The AFE is controlled, and its data read, through
a dedicated, high-speed (20 MHz) SPI interface.
12-Bit A/D Converter: In addition to the AFE,
PIC18F87J72 family devices also include a stan-
dard SAR A/D Converter with 12 independent
analog inputs. The module incorporates program-
mable acquisition time, allowing for a channel to
be selected and a conversion to be initiated
without waiting for a sampling period and thus,
reducing code overhead.
Charge Time Measurement Unit (CTMU): The
CTMU is a flexible analog module that provides
accurate differential time measurement between
pulse sources, as well as asynchronous pulse
generation.
Together with other on-chip analog modules, the
CTMU can precisely measure time, measure
capacitance or relative changes in capacitance, or
generate output pulses that are independent of
the system clock.
1.3 LCD Driver
The on-chip LCD driver includes many features that
make the integration of displays in low-power
applications easier. These include an integrated volt-
age regulator with charge pump that allows contrast
control in software and display operation above device
VDD.
1.4 Other Special Features
Communications: The PIC18F87J72 family
incorporates a range of serial communication
peripherals, including an Addressable USART, a
separate Enhanced USART that supports
LIN/J2602 specification 1.2, and one Master SSP
module capable of both SPI and I2C™ (Master and
Slave) modes of operation.
CCP Modules: All devices in the family incorporate
two Capture/Compare/PWM (CCP) modules. Up to
four different time bases may be used to perform
several different operations at once.
Extended Watchdog Timer (WDT): This
enhanced version incorporates a 16-bit prescaler,
allowing an extended time-out range that is stable
across operating voltage and temperature. See
Section 29.0 “Electrical Characteristics” for
time-out periods.
Real Time Clock and Calendar Module (RTCC):
The RTCC module is intended for applications
requiring that accurate time be maintained for
extended periods of time with minimum to no
intervention from the CPU.
The module is a 100-year clock and calendar with
automatic leap year detection. The range of the
clock is from 00:00:00 (midnight) on January 1,
2000 to 23:59:59 on December 31, 2099.
2010 Microchip Technology Inc. Preliminary DS39979A-page 11
PIC18F87J72 FAMILY
1.5 Details on Individual Family
Members
Devices in the PIC18F87J72 family are available in
80-pin packages. Block diagrams for the two groups
are shown in Figure 1-1.
The devices are differentiated in that PIC18F86J72
devices have a Flash program memory of 64 Kbytes
and PIC18F87J72 devices memory is 128 Kbytes
All other features for the devices are identical. These
are summarized in Table 1-1.
The pinouts for all devices are listed in Table 1-2.
TABLE 1-1: DEVICE FEATURES FOR THE PIC18F8XJ72 (80-PIN DEVICES)
Features PIC18F86J72 PIC18F87J72
Operating Frequency DC – 48 MHz
Program Memory (Bytes) 64K 128K
Program Memory (Instructions) 32,768 65,536
Data Memory (Bytes) 3,923 3,923
Interrupt Sources 29
I/O Ports Ports A, B, C, D, E, F, G
LCD Driver (available pixels to drive) 132 (33 SEGs x 4 COMs)
Timers 4
Comparators 2
CTMU Yes
RTCC Yes
Capture/Compare/PWM Modules 2
Serial Communications MSSP, Addressable USART, Enhanced USART
12-Bit Analog-to-Digital Module 12 Input Channels
Dual-Channel 24-Bit Analog Front End Yes
Resets (and Delays) POR, BOR, RESET Instruction, Stack Full, Stack Underflow, MCLR,
WDT (PWRT, OST)
Instruction Set 75 Instructions, 83 with Extended Instruction Set Enabled
Packages 80-Pin TQFP
PIC18F87J72 FAMILY
DS39979A-page 12 Preliminary 2010 Microchip Technology Inc.
FIGURE 1-1: PIC18F8XJ72 (80-PIN) BLOCK DIAGRAM
Instruction
Decode and
Control
PORTA
Data Latch
Data Memory
(2.0, 3.9
Address Latch
Data Address<12>
12
Access
BSR FSR0
FSR1
FSR2
inc/dec
logic
Address
412 4
PCH PCL
PCLATH
8
31-Level Stack
Program Counter
PRODLPRODH
8 x 8 Multiply
8
BITOP
8
8
ALU<8>
Address Latch
Program Memory
(96 Kbytes)
Data Latch
20
8
8
Table Pointer<21>
inc/dec logic
21
8
Data Bus<8>
Table Latch
8
IR
12
3
PCLATU
PCU
Note 1: See Table 1-2 for I/O port pin descriptions.
2: RA6 and RA7 are only available as digital I/O in select oscillator modes. See Section 3.0 “Oscillator Configurations” for more
information
3: Brown-out Reset and Low-Voltage Detect functions are provided when the on-board voltage regulator is enabled.
AUSART
Comparators
MSSP
Timer3Timer2 CTMUTimer1
CCP2
ADC
12-Bit
W
Instruction Bus <16>
STKPTR Bank
8
State Machine
Control Signals
Decode
8
8
EUSART
ROM Latch
LCD
PORTC
PORTD
PORTE
PORTF
PORTG
RA0:RA7(1,2)
RC0:RC7(1)
RD0:RD7(1)
RE0:RE1,
RF1:RF7(1)
RG0:RG4(1)
PORTB
RB0:RB7(1)
OSC1/CLKI
OSC2/CLKO
VDD,
Timing
Generation
VSS MCLR
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
BOR and
LVD(3)
Precision
Reference
Band Gap
INTRC
Oscillator
Regulator
Voltage
VDDCORE/VCAP
ENVREG
Kbytes)
Driver
8 MHz
Oscillator
RE3:RE7(1)
Timer0
CCP1 RTCC
Dual-Channel
SDIA
AFE
SDOA
CSA DR
CLKIA
CHn+
CHn-
SVDD
SVSS
ARESET
SAVDD
SAVSS
2010 Microchip Technology Inc. Preliminary DS39979A-page 13
PIC18F87J72 FAMILY
TABLE 1-2: PIC18F8XJ72 PINOUT I/O DESCRIPTIONS
Pin Name
Pin Number Pin
Type
Buffer
Type Description
TQFP
MCLR 9 I ST Master Clear (input) or programming voltage (input). This pin
is an active-low Reset to the device.
OSC1/CLKI/RA7
OSC1
CLKI
RA7
48
I
I
I/O
CMOS
CMOS
TTL
Oscillator crystal or external clock input.
Oscillator crystal input.
External clock source input. Always associated
with pin function, OSC1. (See related OSC1/CLKI,
OSC2/CLKO pins.)
General purpose I/O pin.
OSC2/CLKO/RA6
OSC2
CLKO
RA6
49
O
O
I/O
TTL
Oscillator crystal or clock output.
Oscillator crystal output. Connects to crystal or
resonator in Crystal Oscillator mode.
In EC modes, OSC2 pin outputs CLKO, which has
1/4 the frequency of OSC1 and denotes the
instruction cycle rate.
General purpose I/O pin.
PORTA is a bidirectional I/O port.
RA0/AN0
RA0
AN0
31
I/O
I
TTL
Analog
Digital I/O.
Analog Input 0.
RA1/AN1/SEG18
RA1
AN1
SEG18
30
I/O
I
O
TTL
Analog
Analog
Digital I/O.
Analog Input 1.
SEG18 output for LCD.
RA2/AN2/VREF-
RA2
AN2
VREF-
27
I/O
I
I
TTL
Analog
Analog
Digital I/O.
Analog Input 2.
A/D reference voltage (low) input.
RA3/AN3/VREF+
RA3
AN3
VREF+
25
I/O
I
I
TTL
Analog
Analog
Digital I/O.
Analog Input 3.
A/D reference voltage (high) input.
RA4/T0CKI/SEG14
RA4
T0CKI
SEG14
34
I/O
I
O
ST
ST
Analog
Digital I/O.
Timer0 external clock input.
SEG14 output for LCD.
RA5/AN4/SEG15
RA5
AN4
SEG15
33
I/O
I
O
TTL
Analog
Analog
Digital I/O.
Analog Input 4.
SEG15 output for LCD.
RA6 See the OSC2/CLKO/RA6 pin.
RA7 See the OSC1/CLKI/RA7 pin.
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels Analog = Analog input
I2C = I2C/SMBus compatible input OD = Open-Drain (no P diode to VDD)
I = Input O = Output
P= Power
Note 1: Default assignment for CCP2 when the CCP2MX Configuration bit is set.
2: Alternate assignment for CCP2 when the CCP2MX Configuration bit is cleared.
PIC18F87J72 FAMILY
DS39979A-page 14 Preliminary 2010 Microchip Technology Inc.
PORTB is a bidirectional I/O port. PORTB can be software
programmed for internal weak pull-ups on all inputs.
RB0/INT0/SEG30
RB0
INT0
SEG30
57
I/O
I
O
TTL
ST
Analog
Digital I/O.
External Interrupt 0.
SEG30 output for LCD.
RB1/INT1/SEG8
RB1
INT1
SEG8
56
I/O
I
O
TTL
ST
Analog
Digital I/O.
External Interrupt 1.
SEG8 output for LCD.
RB2/INT2/SEG9/
CTED1
RB2
INT2
CTED1
SEG9
55
I/O
I
I
O
TTL
ST
ST
Analog
Digital I/O.
External Interrupt 2.
CTMU Edge 1 input.
SEG9 output for LCD.
RB3/INT3/SEG10/
CTED2
RB3
INT3
SEG10
CTED2
54
I/O
I
O
I
TTL
ST
Analog
ST
Digital I/O.
External Interrupt 3.
SEG10 output for LCD.
CTMU Edge 2 input.
RB4/KBI0/SEG11
RB4
KBI0
SEG11
53
I/O
I
O
TTL
TTL
Analog
Digital I/O.
Interrupt-on-change pin.
SEG11 output for LCD.
RB5/KBI1/SEG29
RB5
KBI1
SEG29
52
I/O
I
O
TTL
TTL
Analog
Digital I/O.
Interrupt-on-change pin.
SEG29 output for LCD.
RB6/KBI2/PGC
RB6
KBI2
PGC
51
I/O
I
I/O
TTL
TTL
ST
Digital I/O.
Interrupt-on-change pin.
In-Circuit Debugger and ICSP™ programming clock pin.
RB7/KBI3/PGD
RB7
KBI3
PGD
46
I/O
I
I/O
TTL
TTL
ST
Digital I/O.
Interrupt-on-change pin.
In-Circuit Debugger and ICSP programming data pin.
TABLE 1-2: PIC18F8XJ72 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
Pin Number Pin
Type
Buffer
Type Description
TQFP
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels Analog = Analog input
I2C = I2C/SMBus compatible input OD = Open-Drain (no P diode to VDD)
I = Input O = Output
P= Power
Note 1: Default assignment for CCP2 when the CCP2MX Configuration bit is set.
2: Alternate assignment for CCP2 when the CCP2MX Configuration bit is cleared.
2010 Microchip Technology Inc. Preliminary DS39979A-page 15
PIC18F87J72 FAMILY
PORTC is a bidirectional I/O port.
RC0/T1OSO/T13CKI
RC0
T1OSO
T13CKI
37
I/O
O
I
ST
ST
Digital I/O.
Timer1 oscillator output.
Timer1/Timer3 external clock input.
RC1/T1OSI/CCP2/
SEG32
RC1
T1OSI
CCP2(1)
SEG32
35
I/O
I
I/O
O
ST
CMOS
ST
Analog
Digital I/O.
Timer1 oscillator input.
Capture 2 input/Compare 2 output/PWM2 output.
SEG32 output for LCD.
RC2/CCP1/SEG13
RC2
CCP1
SEG13
42
I/O
I/O
O
ST
ST
Analog
Digital I/O.
Capture 1 input/Compare 1 output/PWM1 output.
SEG13 output for LCD.
RC3/SCK/SCL/SEG17
RC3
SCK
SCL
SEG17
43
I/O
I/O
I/O
O
ST
ST
I2C
Analog
Digital I/O.
Synchronous serial clock input/output for SPI mode.
Synchronous serial clock input/output for I2C™ mode.
SEG17 output for LCD.
RC4/SDI/SDA/SEG16
RC4
SDI
SDA
SEG16
44
I/O
I
I/O
O
ST
ST
I2C
Analog
Digital I/O.
SPI data in.
I2C data I/O.
SEG16 output for LCD.
RC5/SDO/SEG12
RC5
SDO
SEG12
45
I/O
O
O
ST
Analog
Digital I/O.
SPI data out.
SEG12 output for LCD.
RC6/TX1/CK1/SEG27
RC6
TX1
CK1
SEG27
38
I/O
O
I/O
O
ST
ST
Analog
Digital I/O.
EUSART asynchronous transmit.
EUSART synchronous clock (see related RX1/DT1).
SEG27 output for LCD.
RC7/RX1/DT1/SEG28
RC7
RX1
DT1
SEG28
39
I/O
I
I/O
O
ST
ST
ST
Analog
Digital I/O.
EUSART asynchronous receive.
EUSART synchronous data (see related TX1/CK1).
SEG28 output for LCD.
TABLE 1-2: PIC18F8XJ72 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
Pin Number Pin
Type
Buffer
Type Description
TQFP
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels Analog = Analog input
I2C = I2C/SMBus compatible input OD = Open-Drain (no P diode to VDD)
I = Input O = Output
P= Power
Note 1: Default assignment for CCP2 when the CCP2MX Configuration bit is set.
2: Alternate assignment for CCP2 when the CCP2MX Configuration bit is cleared.
PIC18F87J72 FAMILY
DS39979A-page 16 Preliminary 2010 Microchip Technology Inc.
PORTD is a bidirectional I/O port.
RD0/SEG0/CTPLS
RD0
SEG0
CTPLS
73
I/O
O
O
ST
Analog
Digital I/O.
SEG0 output for LCD.
CTMU pulse generator output.
RD1/SEG1
RD1
SEG1
68
I/O
O
ST
Analog
Digital I/O.
SEG1 output for LCD.
RD2/SEG2
RD2
SEG2
67
I/O
O
ST
Analog
Digital I/O.
SEG2 output for LCD.
RD3/SEG3
RD3
SEG3
66
I/O
O
ST
Analog
Digital I/O.
SEG3 output for LCD.
RD4/SEG4
RD4
SEG4
65
I/O
O
ST
Analog
Digital I/O.
SEG4 output for LCD.
RD5/SEG5
RD5
SEG5
63
I/O
O
ST
Analog
Digital I/O.
SEG5 output for LCD.
RD6/SEG6
RD6
SEG6
62
I/O
O
ST
Analog
Digital I/O.
SEG6 output for LCD.
RD7/SEG7
RD7
SEG7
61
I/O
O
ST
Analog
Digital I/O.
SEG7 output for LCD.
TABLE 1-2: PIC18F8XJ72 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
Pin Number Pin
Type
Buffer
Type Description
TQFP
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels Analog = Analog input
I2C = I2C/SMBus compatible input OD = Open-Drain (no P diode to VDD)
I = Input O = Output
P= Power
Note 1: Default assignment for CCP2 when the CCP2MX Configuration bit is set.
2: Alternate assignment for CCP2 when the CCP2MX Configuration bit is cleared.
2010 Microchip Technology Inc. Preliminary DS39979A-page 17
PIC18F87J72 FAMILY
PORTE is a bidirectional I/O port.
RE0/LCDBIAS1
RE0
LCDBIAS1
4
I/O
I
ST
Analog
Digital I/O.
BIAS1 input for LCD.
RE1/LCDBIAS2
RE1
LCDBIAS2
3
I/O
I
ST
Analog
Digital I/O.
BIAS2 input for LCD.
RE2/LCDBIAS3
RE2
LCDBIAS3
80
I/O
I
ST
Analog
Digital I/O.
BIAS3 input for LCD.
RE3/COM0
RE3
COM0
79
I/O
O
ST
Analog
Digital I/O.
COM0 output for LCD.
RE4/COM1
RE4
COM1
78
I/O
O
ST
Analog
Digital I/O.
COM1 output for LCD.
RE5/COM2
RE5
COM2
77
I/O
O
ST
Analog
Digital I/O.
COM2 output for LCD.
RE6/COM3
RE6
COM3
76
I/O
O
ST
Analog
Digital I/O.
COM3 output for LCD.
RE7/CCP2/SEG31
RE7
CCP2(2)
SEG31
75
I/O
I/O
O
ST
ST
Analog
Digital I/O.
Capture 2 input/Compare 2 output/PWM2 output.
SEG31 output for LCD.
TABLE 1-2: PIC18F8XJ72 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
Pin Number Pin
Type
Buffer
Type Description
TQFP
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels Analog = Analog input
I2C = I2C/SMBus compatible input OD = Open-Drain (no P diode to VDD)
I = Input O = Output
P= Power
Note 1: Default assignment for CCP2 when the CCP2MX Configuration bit is set.
2: Alternate assignment for CCP2 when the CCP2MX Configuration bit is cleared.
PIC18F87J72 FAMILY
DS39979A-page 18 Preliminary 2010 Microchip Technology Inc.
PORTF is a bidirectional I/O port.
RF1/AN6/C2OUT/
SEG19
RF1
AN6
C2OUT
SEG19
21
I/O
I
O
O
ST
Analog
Analog
Digital I/O.
Analog Input 6.
Comparator 2 output.
SEG19 output for LCD.
RF2/AN7/C1OUT/
SEG20
RF2
AN7
C1OUT
SEG20
18
I/O
I
O
O
ST
Analog
Analog
Digital I/O.
Analog Input 7.
Comparator 1 output.
SEG20 output for LCD.
RF3/AN8/SEG21/
C2INB
RF3
AN8
SEG21
C2INB
17
I/O
I
O
I
ST
Analog
Analog
Analog
Digital I/O.
Analog Input 8.
SEG21 output for LCD.
Comparator 2 Input B.
RF4/AN9/SEG22/
C2INA
RF4
AN9
SEG22
C2INA
16
I/O
I
O
I
ST
Analog
Analog
Analog
Digital I/O.
Analog Input 9.
SEG22 output for LCD
Comparator 2 Input A.
RF5/AN10/CVREF/
SEG23/C1INB
RF5
AN10
CVREF
SEG23
C1INB
15
I/O
I
O
O
I
ST
Analog
Analog
Analog
Analog
Digital I/O.
Analog Input 10.
Comparator reference voltage output.
SEG23 output for LCD.
Comparator 1 Input B.
RF6/AN11/SEG24/
C1INA
RF6
AN11
SEG24
C1INA
14
I/O
I
O
I
ST
Analog
Analog
Analog
Digital I/O.
Analog Input 11.
SEG24 output for LCD
Comparator 1 Input A.
RF7/AN5/SS/SEG25
RF7
AN5
SS
SEG25
13
I/O
O
I
O
ST
Analog
TTL
Analog
Digital I/O.
Analog Input 5.
SPI slave select input.
SEG25 output for LCD.
TABLE 1-2: PIC18F8XJ72 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
Pin Number Pin
Type
Buffer
Type Description
TQFP
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels Analog = Analog input
I2C = I2C/SMBus compatible input OD = Open-Drain (no P diode to VDD)
I = Input O = Output
P= Power
Note 1: Default assignment for CCP2 when the CCP2MX Configuration bit is set.
2: Alternate assignment for CCP2 when the CCP2MX Configuration bit is cleared.
2010 Microchip Technology Inc. Preliminary DS39979A-page 19
PIC18F87J72 FAMILY
PORTG is a bidirectional I/O port.
RG0/LCDBIAS0
RG0
LCDBIAS0
5
I/O
I
ST
Analog
Digital I/O.
BIAS0 input for LCD.
RG1/TX2/CK2
RG1
TX2
CK2
6
I/O
O
I/O
ST
ST
Digital I/O.
AUSART asynchronous transmit.
AUSART synchronous clock (see related RX2/DT2).
RG2/RX2/DT2/VLCAP1
RG2
RX2
DT2
VLCAP1
7
I/O
I
I/O
I
ST
ST
ST
Analog
Digital I/O.
AUSART asynchronous receive.
AUSART synchronous data (see related TX2/CK2).
LCD charge pump capacitor input.
RG3/VLCAP2
RG3
VLCAP2
8
I/O
I
ST
Analog
Digital I/O.
LCD charge pump capacitor input.
RG4/SEG26/RTCC
RG4
SEG26
RTCC
10
I/O
O
O
ST
Analog
Digital I/O.
SEG26 output for LCD.
RTCC output.
VSS 11,32,50, 71 P Ground reference for logic and I/O pins.
VDD 47, 72 P Positive supply for logic and I/O pins.
AVSS 24 P Ground reference for analog modules.
AVDD 23 P Positive supply for analog modules.
ENVREG 22 I ST Enable for on-chip voltage regulator.
VDDCORE/VCAP
VDDCORE
VCAP
12
P
P
Core logic power or external filter capacitor connection.
Positive supply for microcontroller core logic
(regulator disabled).
External filter capacitor connection (regulator enabled).
TABLE 1-2: PIC18F8XJ72 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
Pin Number Pin
Type
Buffer
Type Description
TQFP
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels Analog = Analog input
I2C = I2C/SMBus compatible input OD = Open-Drain (no P diode to VDD)
I = Input O = Output
P= Power
Note 1: Default assignment for CCP2 when the CCP2MX Configuration bit is set.
2: Alternate assignment for CCP2 when the CCP2MX Configuration bit is cleared.
PIC18F87J72 FAMILY
DS39979A-page 20 Preliminary 2010 Microchip Technology Inc.
RESET 69 I ST AFE Master Reset logic input pin.
SVDD 70 P AFE digital power supply pin.
SAVDD 74 P AFE analog power supply reference pin.
CH0+ 1 I Analog Channel 0 non-inverting analog input pin.
CH0- 2 I Analog Channel 0 inverting analog input pin.
CH1- 19 I Analog Channel 1 inverting analog input pin.
CH1+ 20 I Analog Channel 1 Non-Inverting Analog Input Pin
SAVSS 26 P AFE analog ground pin (return path for analog circuitry).
REFIN+/OUT
REFIN+
REFOUT
28
I
O
Analog
Analog
AFE non-inverting voltage reference input.
Internal reference output pin.
REFIN- 29 I Analog Inverting voltage reference input pin.
SVSS 36 P AFE digital ground pin (return path for digital circuitry).
DR 40 AFE data ready signal output pin.
CLKIA 41 I CMOS AFE oscillator crystal connection pin or external clock input pin.
CSA 58 I TTL AFE serial interface chip select pin.
SCKA 59 I TTL AFE serial interface clock pin.
SDOA 60 O TTL AFE serial interface data output pin.
SDIA 64 I TTL AFE serial interface data input pin.
TABLE 1-2: PIC18F8XJ72 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
Pin Number Pin
Type
Buffer
Type Description
TQFP
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels Analog = Analog input
I2C = I2C/SMBus compatible input OD = Open-Drain (no P diode to VDD)
I = Input O = Output
P= Power
Note 1: Default assignment for CCP2 when the CCP2MX Configuration bit is set.
2: Alternate assignment for CCP2 when the CCP2MX Configuration bit is cleared.
2010 Microchip Technology Inc. DS39979A-page 21
PIC18F87J72 FAMILY
2.0 GUIDELINES FOR GETTING
STARTED WITH PIC18FJ
MICROCONTROLLERS
2.1 Basic Connection Requirements
Getting started with the PIC18F87J72 family family of
8-bit microcontrollers requires attention to a minimal
set of device pin connections before proceeding with
development.
The following pins must always be connected:
•All V
DD and VSS pins
(see Section 2.2 “Power Supply Pins”)
•All AV
DD and AVSS pins, regardless of whether or
not the analog device features are used
(see Section 2.2 “Power Supply Pins”)
•MCLR
pin
(see Section 2.3 “Master Clear (MCLR) Pin”)
ENVREG (if implemented) and VCAP/VDDCORE pins
(see Section 2.4 “Voltage Regulator Pins
(ENVREG and VCAP/VDDCORE)”)
These pins must also be connected if they are being
used in the end application:
PGC/PGD pins used for In-Circuit Serial
Programming™ (ICSP™) and debugging purposes
(see Section 2.5 “ICSP Pins”)
OSCI and OSCO pins when an external oscillator
source is used
(see Section 2.6 “External Oscillator Pins”)
Additionally, the following pins may be required:
•V
REF+/VREF- pins are used when external voltage
reference for analog modules is implemented
The minimum mandatory connections are shown in
Figure 2-1.
FIGURE 2-1: RECOMMENDED MINIMUM
CONNECTIONS
Note: The AVDD and AVSS pins must always be
connected, regardless of whether any of
the analog modules are being used.
PIC18FXXJXX
VDD
VSS
VDD
VSS
VSS
VDD
AVDD
AVSS
VDD
VSS
C1
R1
VDD
MCLR
VCAP/VDDCORE
R2 ENVREG
(1)
C7
C2(2)
C3(2)
C4(2)
C5(2)
C6(2)
Key (all values are recommendations):
C1 through C6: 0.1 F, 20V ceramic
C7: 10 F, 6.3V or greater, tantalum or ceramic
R1: 10 k
R2: 100 to 470
Note 1: See Section 2.4 “Voltage Regulator Pins
(ENVREG and VCAP/VDDCORE)” for
explanation of ENVREG pin connections.
2: The example shown is for a PIC18F device
with five VDD/VSS and AVDD/AVSS pairs.
Other devices may have more or less pairs;
adjust the number of decoupling capacitors
appropriately.
(1)
PIC18F87J72 FAMILY
DS39979A-page 22 2010 Microchip Technology Inc.
2.2 Power Supply Pins
2.2.1 DECOUPLING CAPACITORS
The use of decoupling capacitors on every pair of
power supply pins, such as VDD, VSS, AVDD and
AVSS, is required.
Consider the following criteria when using decoupling
capacitors:
Value and type of capacitor: A 0.1 F (100 nF),
10-20V capacitor is recommended. The capacitor
should be a low-ESR device, with a resonance
frequency in the range of 200 MHz and higher.
Ceramic capacitors are recommended.
Placement on the printed circuit board: The
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is no greater
than 0.25 inch (6 mm).
Handling high-frequency noise: If the board is
experiencing high-frequency noise (upward of
tens of MHz), add a second ceramic type capaci-
tor in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 F to 0.001 F. Place this
second capacitor next to each primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible
(e.g., 0.1 F in parallel with 0.001 F).
Maximizing performance: On the board layout
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum, thereby reducing PCB trace
inductance.
2.2.2 TANK CAPACITORS
On boards with power traces running longer than
six inches in length, it is suggested to use a tank capac-
itor for integrated circuits, including microcontrollers, to
supply a local power source. The value of the tank
capacitor should be determined based on the trace
resistance that connects the power supply source to
the device, and the maximum current drawn by the
device in the application. In other words, select the tank
capacitor so that it meets the acceptable voltage sag at
the device. Typical values range from 4.7 F to 47 F.
2.3 Master Clear (MCLR) Pin
The MCLR pin provides two specific device
functions: Device Reset, and Device Programming
and Debugging. If programming and debugging are
not required in the end application, a direct
connection to VDD may be all that is required. The
addition of other components, to help increase the
application’s resistance to spurious Resets from
voltage sags, may be beneficial. A typical
configuration is shown in Figure 2-1. Other circuit
designs may be implemented, depending on the
application’s requirements.
During programming and debugging, the resistance
and capacitance that can be added to the pin must
be considered. Device programmers and debuggers
drive the MCLR pin. Consequently, specific voltage
levels (VIH and VIL) and fast signal transitions must
not be adversely affected. Therefore, specific values
of R1 and C1 will need to be adjusted based on the
application and PCB requirements. For example, it is
recommended that the capacitor, C1, be isolated
from the MCLR pin during programming and
debugging operations by using a jumper (Figure 2-2).
The jumper is replaced for normal run-time
operations.
Any components associated with the MCLR pin
should be placed within 0.25 inch (6 mm) of the pin.
FIGURE 2-2: EXAMPLE OF MCLR PIN
CONNECTIONS
Note 1: R1  10 k is recommended. A suggested
starting value is 10 k. Ensure that the
MCLR pin VIH and VIL specifications are met.
2: R2  470 will limit any current flowing into
MCLR from the external capacitor, C, in the
event of MCLR pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS). Ensure that the MCLR pin
VIH and VIL specifications are met.
C1
R2
R1
VDD
MCLR
PIC18FXXJXX
JP
2010 Microchip Technology Inc. DS39979A-page 23
PIC18F87J72 FAMILY
2.4 Voltage Regulator Pins (ENVREG
and VCAP/VDDCORE)
The on-chip voltage regulator enable pin, ENVREG,
must always be connected directly to either a supply
voltage or to ground. Tying ENVREG to VDD enables
the regulator, while tying it to ground disables the
regulator. Refer to Section 26.3 “On-Chip Voltage
Regulator” for details on connecting and using the
on-chip regulator.
When the regulator is enabled, a low-ESR (< 5)
capacitor is required on the VCAP/VDDCORE pin to
stabilize the voltage regulator output voltage. The
VCAP/VDDCORE pin must not be connected to VDD and
must use a capacitor of 10 F connected to ground. The
type can be ceramic or tantalum. A suitable example is
the Murata GRM21BF50J106ZE01 (10 F, 6.3V) or
equivalent. Designers may use Figure 2-3 to evaluate
ESR equivalence of candidate devices.
It is recommended that the trace length not exceed
0.25 inch (6 mm). Refer to Section 29.0 “Electrical
Characteristics for additional information.
When the regulator is disabled, the VCAP/VDDCORE pin
must be tied to a voltage supply at the VDDCORE level.
Refer to Section 29.0 “Electrical Characteristics” for
information on VDD and VDDCORE.
Note that the “LF” versions of some low pin count
PIC18FJ parts (e.g., the PIC18LF45J10) do not have
the ENVREG pin. These devices are provided with the
voltage regulator permanently disabled; they must
always be provided with a supply voltage on the
VDDCORE pin.
FIGURE 2-3: FREQUENCY vs. ESR
PERFORMANCE FOR
SUGGESTED VCAP
2.5 ICSP Pins
The PGC and PGD pins are used for In-Circuit Serial
Programming™ (ICSP™) and debugging purposes. It
is recommended to keep the trace length between the
ICSP connector and the ICSP pins on the device as
short as possible. If the ICSP connector is expected to
experience an ESD event, a series resistor is recom-
mended, with the value in the range of a few tens of
ohms, not to exceed 100.
Pull-up resistors, series diodes, and capacitors on the
PGC and PGD pins are not recommended as they will
interfere with the programmer/debugger communica-
tions to the device. If such discrete components are an
application requirement, they should be removed from
the circuit during programming and debugging. Alter-
natively, refer to the AC/DC characteristics and timing
requirements information in the respective device
Flash programming specification for information on
capacitive loading limits, and pin input voltage high
(VIH) and input low (VIL) requirements.
For device emulation, ensure that the “Communication
Channel Select” (i.e., PGCx/PGDx pins) programmed
into the device matches the physical connections for
the ICSP to the Microchip debugger/emulator tool.
For more information on available Microchip
development tools connection requirements, refer to
Section 28.0 “Development Support”.
10
1
0.1
0.01
0.001 0.01 0.1 1 10 100 1000 10,000
Frequency (MHz)
ESR ()
Note: Data for Murata GRM21BF50J106ZE01 shown.
Measurements at 25°C, 0V DC bias.
PIC18F87J72 FAMILY
DS39979A-page 24 2010 Microchip Technology Inc.
2.6 External Oscillator Pins
Many microcontrollers have options for at least two
oscillators: a high-frequency primary oscillator and a
low-frequency secondary oscillator (refer to
Section 3.0 “Oscillator Configurations” for details).
The oscillator circuit should be placed on the same
side of the board as the device. Place the oscillator
circuit close to the respective oscillator pins with no
more than 0.5 inch (12 mm) between the circuit
components and the pins. The load capacitors should
be placed next to the oscillator itself, on the same side
of the board.
Use a grounded copper pour around the oscillator cir-
cuit to isolate it from surrounding circuits. The
grounded copper pour should be routed directly to the
MCU ground. Do not run any signal traces or power
traces inside the ground pour. Also, if using a two-sided
board, avoid any traces on the other side of the board
where the crystal is placed.
Layout suggestions are shown in Figure 2-4. In-line
packages may be handled with a single-sided layout
that completely encompasses the oscillator pins. With
fine-pitch packages, it is not always possible to com-
pletely surround the pins and components. A suitable
solution is to tie the broken guard sections to a mirrored
ground layer. In all cases, the guard trace(s) must be
returned to ground.
In planning the application’s routing and I/O assign-
ments, ensure that adjacent port pins and other signals
in close proximity to the oscillator are benign (i.e., free
of high frequencies, short rise and fall times, and other
similar noise).
For additional information and design guidance on
oscillator circuits, please refer to these Microchip
Application Notes, available at the corporate web site
(www.microchip.com):
AN826, Crystal Oscillator Basics and Crystal
Selection for rfPIC™ and PICmicro® Devices”
AN849, “Basic PICmicro® Oscillator Design”
AN943, “Practical PICmicro® Oscillator Analysis
and Design”
AN949, “Making Your Oscillator Work”
2.7 Unused I/Os
Unused I/O pins should be configured as outputs and
driven to a logic low state. Alternatively, connect a 1 k
to 10 k resistor to VSS on unused pins and drive the
output to logic low.
FIGURE 2-4: SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
GND
`
`
`
OSC1
OSC2
T1OSO
T1OS I
Copper Pour Primary Oscillator
Crystal
Timer1 Oscillator
Crystal
DEVICE PINS
Primary
Oscillator
C1
C2
T1 Oscillator: C1 T1 Oscillator: C2
(tied to ground)
Single-Sided and In-Line Layouts:
Fine-Pitch (Dual-Sided) Layouts:
GND
OSCO
OSCI
Bottom Layer
Copper Pour
Oscillator
Crystal
Top Layer Copper Pour
C2
C1
DEVICE PINS
(tied to ground)
(tied to ground)
2010 Microchip Technology Inc. Preliminary DS39979A-page 25
PIC18F87J72 FAMILY
3.0 OSCILLATOR
CONFIGURATIONS
3.1 Oscillator Types
The PIC18F87J72 family of devices can be operated in
eight different oscillator modes:
1. ECPLL OSC1/OSC2 as primary; ECPLL
oscillator with PLL enabled, CLKO on
RA6
2. EC OSC1/OSC2 as primary; external
clock with FOSC/4 output
3. HSPLL OSC1/OSC2 as primary; high-speed
crystal/resonator with software PLL
control
4. HS OSC1/OSC2 as primary; high-speed
crystal/resonator
5. INTPLL1 Internal oscillator block with software
PLL control, FOSC/4 output on RA6
and I/O on RA7
6. INTIO1 Internal oscillator block with FOSC/4
output on RA6 and I/O on RA7
7. INTPLL2 Internal oscillator block with software
PLL control and I/O on RA6 and RA7
8. INTIO2 Internal oscillator block with I/O on
RA6 and RA7
All of these modes are selected by the user by
programming the FOSC<2:0> Configuration bits.
In addition, PIC18F87J72 family devices can switch
between different clock sources, either under software
control or automatically under certain conditions. This
allows for additional power savings by managing
device clock speed in real time without resetting the
application.
The clock sources for the PIC18F87J72 family of
devices are shown in Figure 3-1.
FIGURE 3-1: PIC18F87J72 FAMILY CLOCK DIAGRAM
4 x PLL
FOSC<2:0>
Secondary Oscillator
T1OSCEN
Enable
Oscillator
T1OSO
T1OSI
Clock Source Option
for Other Modules
OSC1
OSC2
Sleep HSPLL, ECPLL, INTPLL
HS, EC
T1OSC
CPU
Peripherals
IDLEN
Postscaler
MUX
MUX
8 MHz
4 MHz
2 MHz
1 MHz
500 kHz
125 kHz
250 kHz
OSCCON<6:4>
111
110
101
100
011
010
001
000
31 kHz
INTRC
Source
Internal
Oscillator
Block
WDT, PWRT, FSCM
8 MHz
Internal Oscillator
(INTOSC)
OSCCON<6:4>
Clock
Control
OSCCON<1:0>
Source
8 MHz
31 kHz (INTRC)
0
1
OSCTUNE<7>
and Two-Speed Start-up
Primary Oscillator
OSCTUNE<6>
PIC18F87J72 FAMILY
DS39979A-page 26 Preliminary 2010 Microchip Technology Inc.
3.2 Control Registers
The OSCCON register (Register 3-1) controls the main
aspects of the device clock’s operation. It selects the
oscillator type to be used, which of the power-managed
modes to invoke and the output frequency of the
INTOSC source. It also provides status on the oscillators.
The OSCTUNE register (Register 3-2) controls the
tuning and operation of the internal oscillator block. It
also implements the PLLEN bits which control the
operation of the Phase Locked Loop (PLL) (see
Section 3.4.3 “PLL Frequency Multiplier”).
REGISTER 3-1: OSCCON: OSCILLATOR CONTROL REGISTER(1)
R/W-0 R/W-1 R/W-1 R/W-0 R(2) R-0 R/W-0 R/W-0
IDLEN IRCF2(3) IRCF1(3) IRCF0(3) OSTS IOFS SCS1(5) SCS0(5)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 IDLEN: Idle Enable bit
1 = Device enters an Idle mode when a SLEEP instruction is executed
0 = Device enters Sleep mode when a SLEEP instruction is executed
bit 6-4 IRCF<2:0>: INTOSC Source Frequency Select bits(3)
111 = 8 MHz (INTOSC drives clock directly)
110 = 4 MHz (default)
101 = 2 MHz
100 = 1 MHz
011 = 500 kHz
010 = 250 kHz
001 = 125 kHz
000 = 31 kHz (from either INTOSC/256 or INTRC)(4)
bit 3 OSTS: Oscillator Start-up Timer Time-out Status bit(2)
1 = Oscillator Start-up Timer (OST) time-out has expired; primary oscillator is running
0 = Oscillator Start-up Timer (OST) time-out is running; primary oscillator is not ready
bit 2 IOFS: INTOSC Frequency Stable bit
1 = Fast RC oscillator frequency is stable
0 = Fast RC oscillator frequency is not stable
bit 1-0 SCS<1:0>: System Clock Select bits(5)
11 = Internal oscillator block
10 = Primary oscillator
01 = Timer1 oscillator
00 = Default primary oscillator (as defined by FOSC<2:0> Configuration bits)
Note 1: Default (legacy) SFR at this address; available when WDTCON<4> = 0.
2: Reset state depends on the state of the IESO Configuration bit.
3: Modifying these bits will cause an immediate clock frequency switch if the internal oscillator is providing
the device clocks.
4: Source selected by the INTSRC bit (OSCTUNE<7>), see text.
5: Modifying these bits will cause an immediate clock source switch.
2010 Microchip Technology Inc. Preliminary DS39979A-page 27
PIC18F87J72 FAMILY
3.3 Clock Sources and
Oscillator Switching
Essentially, PIC18F87J72 family devices have three
independent clock sources:
Primary oscillators
Secondary oscillators
Internal oscillator
The primary oscillators can be thought of as the main
device oscillators. These are any external oscillators
connected to the OSC1 and OSC2 pins, and include
the External Crystal and Resonator modes and the
External Clock modes. If selected by the FOSC<2:0>
Configuration bits, the internal oscillator block (either
the 31 kHz INTRC or the 8 MHz INTOSC source) may
be considered a primary oscillator. The particular mode
is defined by the FOSC Configuration bits. The details
of these modes are covered in Section 3.4 “External
Oscillator Modes”.
The secondary oscillators are external clock sources
that are not connected to the OSC1 or OSC2 pins.
These sources may continue to operate even after the
controller is placed in a power-managed mode.
PIC18F87J72 family devices offer the Timer1 oscillator
as a secondary oscillator source. This oscillator, in all
power-managed modes, is often the time base for
functions such as a Real-Time Clock (RTC). The
Timer1 oscillator is discussed in greater detail in
Section 12.0 “Timer1 Module”.
In addition to being a primary clock source in some
circumstances, the internal oscillator is available as a
power-managed mode clock source. The INTRC
source is also used as the clock source for several
special features, such as the WDT and Fail-Safe Clock
Monitor. The internal oscillator block is discussed in
more detail in Section 3.5 “Internal Oscillator
Block”.
The PIC18F87J72 family includes features that allow
the device clock source to be switched from the main
oscillator, chosen by device configuration, to one of the
alternate clock sources. When an alternate clock
source is enabled, various power-managed operating
modes are available.
REGISTER 3-2: OSCTUNE: OSCILLATOR TUNING REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
INTSRC PLLEN TUN5 TUN4 TUN3 TUN2 TUN1 TUN0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 INTSRC: Internal Oscillator Low-Frequency Source Select bit
1 = 31.25 kHz device clock derived from 8 MHz INTOSC source (divide-by-256 enabled)
0 = 31 kHz device clock derived from INTRC 31 kHz oscillator
bit 6 PLLEN: Frequency Multiplier PLL Enable bit
1 = PLL is enabled
0 = PLL is disabled
bit 5-0 TUN<5:0>: Fast RC Oscillator (INTOSC) Frequency Tuning bits
011111 = Maximum frequency
000001
000000 = Center frequency. Fast RC oscillator is running at the calibrated frequency.
111111
100000 = Minimum frequency
PIC18F87J72 FAMILY
DS39979A-page 28 Preliminary 2010 Microchip Technology Inc.
3.3.1 CLOCK SOURCE SELECTION
The System Clock Select bits, SCS<1:0>
(OSCCON<1:0>), select the clock source. The avail-
able clock sources are the primary clock defined by the
FOSC<2:0> Configuration bits, the secondary clock
(Timer1 oscillator) and the internal oscillator. The clock
source changes after one or more of the bits is written
to, following a brief clock transition interval.
The OSTS (OSCCON<3>) and T1RUN (T1CON<6>)
bits indicate which clock source is currently providing
the device clock. The OSTS bit indicates that the
Oscillator Start-up Timer (OST) has timed out and the
primary clock is providing the device clock in primary
clock modes. The T1RUN bit indicates when the
Timer1 oscillator is providing the device clock in sec-
ondary clock modes. In power-managed modes, only
one of these bits will be set at any time. If neither of
these bits is set, the INTRC is providing the clock or the
internal oscillator has just started and is not yet stable.
The IDLEN bit determines if the device goes into Sleep
mode or one of the Idle modes when the SLEEP
instruction is executed.
The use of the flag and control bits in the OSCCON
register is discussed in more detail in Section 4.0
“Power-Managed Modes”.
3.3.1.1 System Clock Selection and Device
Resets
Since the SCS bits are cleared on all forms of Reset,
this means the primary oscillator defined by the
FOSC<2:0> Configuration bits is used as the primary
clock source on device Resets. This could either be the
internal oscillator block by itself or one of the other
primary clock source (HS, EC, HSPLL, ECPLL1/2 or
INTPLL1/2).
In those cases, when the internal oscillator block with-
out PLL, is the default clock on Reset, the Fast RC
oscillator (INTOSC) will be used as the device clock
source. It will initially start at 1 MHz, which is the
postscaler selection that corresponds to the Reset
value of the IRCF<2:0> bits (‘100’).
Regardless of which primary oscillator is selected,
INTRC will always be enabled on device power-up. It
serves as the clock source until the device has loaded
its configuration values from memory. It is at this point
that the FOSC Configuration bits are read and the
oscillator selection of the operational mode is made.
Note that either the primary clock source, or the internal
oscillator, will have two bit setting options for the possible
values of the SCS<1:0> bits at any given time.
3.3.2 OSCILLATOR TRANSITIONS
PIC18F87J72 family devices contain circuitry to
prevent clock “glitches” when switching between clock
sources. A short pause in the device clock occurs dur-
ing the clock switch. The length of this pause is the sum
of two cycles of the old clock source and three to four
cycles of the new clock source. This formula assumes
that the new clock source is stable.
Clock transitions are discussed in greater detail in
Section 4.1.2 “Entering Power-Managed Modes”.
Note 1: The Timer1 oscillator must be enabled to
select the secondary clock source. The
Timer1 oscillator is enabled by setting the
T1OSCEN bit in the Timer1 Control regis-
ter (T1CON<3>). If the Timer1 oscillator is
not enabled, then any attempt to select a
secondary clock source when executing a
SLEEP instruction will be ignored.
2: It is recommended that the Timer1
oscillator be operating and stable before
executing the SLEEP instruction or a very
long delay may occur while the Timer1
oscillator starts.
2010 Microchip Technology Inc. Preliminary DS39979A-page 29
PIC18F87J72 FAMILY
3.4 External Oscillator Modes
3.4.1 CRYSTAL OSCILLATOR/CERAMIC
RESONATORS (HS MODES)
In HS or HSPLL Oscillator modes, a crystal or ceramic
resonator is connected to the OSC1 and OSC2 pins to
establish oscillation. Figure 3-2 shows the pin
connections.
The oscillator design requires the use of a crystal rated
for parallel resonant operation.
TABLE 3-1: CAPACITOR SELECTION FOR
CERAMIC RESONATORS
TABLE 3-2: CAPACITOR SELECTION FOR
CRYSTAL OSCILLATOR
FIGURE 3-2: CRYSTAL/CERAMIC
RESONATOR OPERATION
(HS OR HSPLL
CONFIGURATION)
Note: Use of a crystal rated for series resonant
operation may give a frequency out of the
crystal manufacturer’s specifications.
Typical Capacitor Values Used:
Mode Freq. OSC1 OSC2
HS 8.0 MHz
16.0 MHz
27 pF
22 pF
27 pF
22 pF
Capacitor values are for design guidance only.
Different capacitor values may be required to produce
acceptable oscillator operation. The user should test
the performance of the oscillator over the expected
VDD and temperature range for the application. Refer
to the following application notes for oscillator specific
information:
AN588, “PIC® Microcontroller Oscillator Design
Guide”
AN826, “Crystal Oscillator Basics and Crystal
Selection for rfPIC® and PIC® Devices”
AN849, “Basic PIC® Oscillator Design”
AN943, “Practical PIC® Oscillator Analysis and
Design”
AN949, “Making Your Oscillator Work”
See the notes following Table 3-2 for additional
information.
Osc Type Crystal
Freq.
Typical Capacitor Values
Tested:
C1 C2
HS 4 MHz 27 pF 27 pF
8 MHz 22 pF 22 pF
20 MHz 15 pF 15 pF
Capacitor values are for design guidance only.
Different capacitor values may be required to produce
acceptable oscillator operation. The user should test
the performance of the oscillator over the expected
VDD and temperature range for the application.
Refer to the Microchip application notes cited in
Table 3-1 for oscillator specific information. Also see
the notes following this table for additional
information.
Note 1: Higher capacitance increases the stability
of oscillator but also increases the start-up
time.
2: Since each resonator/crystal has its own
characteristics, the user should consult
the resonator/crystal manufacturer for
appropriate values of external
components.
3: Rs may be required to avoid overdriving
crystals with low drive level specification.
4: Always verify oscillator performance over
the VDD and temperature range that is
expected for the application.
Note 1: See Table 3-1 and Table 3-2 for initial values of
C1 and C2.
2: A series resistor (RS) may be required for AT
strip cut crystals.
3: RF varies with the oscillator mode chosen.
C1(1)
C2(1)
XTAL
OSC2
OSC1
RF(3)
Sleep
To
Logic
RS(2)
Internal
PIC18F87J72
PIC18F87J72 FAMILY
DS39979A-page 30 Preliminary 2010 Microchip Technology Inc.
3.4.2 EXTERNAL CLOCK INPUT
(EC MODES)
The EC and ECPLL Oscillator modes require an
external clock source to be connected to the OSC1 pin.
There is no oscillator start-up time required after a
Power-on Reset or after an exit from Sleep mode.
In the EC Oscillator mode, the oscillator frequency
divided by 4 is available on the OSC2 pin. This signal
may be used for test purposes or to synchronize other
logic. Figure 3-3 shows the pin connections for the EC
Oscillator mode.
FIGURE 3-3: EXTERNAL CLOCK
INPUT OPERATION
(EC CONFIGURATION)
An external clock source may also be connected to the
OSC1 pin in the HS mode, as shown in Figure 3-4. In
this configuration, the divide-by-4 output on OSC2 is
not available. Current consumption in this configuration
will be somewhat higher than EC mode, as the internal
oscillator’s feedback circuitry will be enabled (in EC
mode, the feedback circuit is disabled).
FIGURE 3-4: EXTERNAL CLOCK INPUT
OPERATION (HS OSC
CONFIGURATION)
3.4.3 PLL FREQUENCY MULTIPLIER
A Phase Locked Loop (PLL) circuit is provided as an
option for users who want to use a lower frequency
oscillator circuit, or to clock the device up to its highest
rated frequency from a crystal oscillator. This may be
useful for customers who are concerned with EMI due
to high-frequency crystals, or users who require higher
clock speeds from an internal oscillator.
3.4.3.1 HSPLL and ECPLL Modes
The HSPLL and ECPLL modes provide the ability to
selectively run the device at 4 times the external
oscillating source to produce frequencies up to
40 MHz.
The PLL is enabled by programming the FOSC<2:0>
Configuration bits to either ‘111’ (for ECPLL) or ‘101
(for HSPLL). In addition, the PLLEN bit
(OSCTUNE<6>) must also be set. Clearing PLLEN
disables the PLL, regardless of the chosen oscillator
configuration. It also allows additional flexibility for
controlling the application’s clock speed in software.
FIGURE 3-5: PLL BLOCK DIAGRAM
3.4.3.2 PLL and INTOSC
The PLL is also available to the internal oscillator block
when the internal oscillator block is configured as the
primary clock source. In this configuration, the PLL is
enabled in software and generates a clock output of up
to 32 MHz. The operation of INTOSC with the PLL is
described in Section 3.5.2 “INTPLL Modes”.
OSC1/CLKI
OSC2/CLKO
FOSC/4
Clock from
Ext. System PIC18F87J72
OSC1
OSC2
Open
Clock from
Ext. System
(HS Mode)
PIC18F87J72
MUX
VCO
Loop
Filter
OSC2
OSC1
PLL Enable (OSCTUNE)
FIN
FOUT
SYSCLK
Phase
Comparator
HSPLL or ECPLL (CONFIG2L)
4
HS or EC
Mode
2010 Microchip Technology Inc. Preliminary DS39979A-page 31
PIC18F87J72 FAMILY
3.5 Internal Oscillator Block
The PIC18F87J72 family of devices includes an
internal oscillator block which generates two different
clock signals; either can be used as the microcon-
troller’s clock source. This may eliminate the need for
an external oscillator circuit on the OSC1 and/or OSC2
pins.
The main output is the Fast RC oscillator, or INTOSC,
an 8 MHz clock source which can be used to directly
drive the device clock. It also drives a postscaler, which
can provide a range of clock frequencies from 31 kHz
to 4 MHz. INTOSC is enabled when a clock frequency
from 125 kHz to 8 MHz is selected. The INTOSC out-
put can also be enabled when 31 kHz is selected,
depending on the INTSRC bit (OSCTUNE<7>).
The other clock source is the Internal RC (INTRC)
oscillator, which provides a nominal 31 kHz output.
INTRC is enabled if it is selected as the device clock
source. It is also enabled automatically when any of the
following are enabled:
Power-up Timer
Fail-Safe Clock Monitor
Watchdog Timer
Two-Speed Start-up
These features are discussed in greater detail in
Section 26.0 “Special Features of the CPU”.
The clock source frequency (INTOSC direct, INTOSC
with postscaler or INTRC direct) is selected by config-
uring the IRCF bits of the OSCCON register. The
default frequency on device Resets is 4 MHz.
3.5.1 INTIO MODES
Using the internal oscillator as the clock source elimi-
nates the need for up to two external oscillator pins,
which can then be used for digital I/O. Two distinct
oscillator configurations, which are determined by the
FOSC Configuration bits, are available:
In INTIO1 mode, the OSC2 pin outputs FOSC/4
while OSC1 functions as RA7 (see Figure 3-6) for
digital input and output.
In INTIO2 mode, OSC1 functions as RA7 and
OSC2 functions as RA6 (see Figure 3-7), both for
digital input and output.
FIGURE 3-6: INTIO1 OSCILLATOR MODE
FIGURE 3-7: INTIO2 OSCILLATOR MODE
3.5.2 INTPLL MODES
The 4x Phase Locked Loop (PLL) can be used with the
internal oscillator block to produce faster device clock
speeds than are normally possible with the internal
oscillator sources. When enabled, the PLL produces a
clock speed of 16 MHz or 32 MHz.
PLL operation is controlled through software. The con-
trol bit, PLLEN (OSCTUNE<6>), is used to enable or
disable its operation. The PLL is available only to
INTOSC when the device is configured to use one of
the INTPLL modes as the primary clock source
(FOSC<2:0> = 011 or 001). Additionally, the PLL will
only function when the selected output frequency is
either 4 MHz or 8 MHz (OSCCON<6:4> = 111 or 110).
Like the INTIO modes, there are two distinct INTPLL
modes available:
In INTPLL1 mode, the OSC2 pin outputs FOSC/4,
while OSC1 functions as RA7 for digital input and
output. Externally, this is identical in appearance
to INTIO1 (Figure 3-6).
In INTPLL2 mode, OSC1 functions as RA7 and
OSC2 functions as RA6, both for digital input and
output. Externally, this is identical to INTIO2
(Figure 3-7).
OSC2
FOSC/4
I/O (OSC1)
RA7
PIC18F87J72
I/O (OSC2)
RA6
I/O (OSC1)
RA7
PIC18F87J72
PIC18F87J72 FAMILY
DS39979A-page 32 Preliminary 2010 Microchip Technology Inc.
3.5.3 INTERNAL OSCILLATOR OUTPUT
FREQUENCY AND TUNING
The internal oscillator block is calibrated at the factory
to produce an INTOSC output frequency of 8 MHz. It
can be adjusted in the user’s application by writing to
TUN<5:0> (OSCTUNE<5:0>) in the OSCTUNE
register (Register 3-2).
When the OSCTUNE register is modified, the INTOSC
frequency will begin shifting to the new frequency. The
oscillator will stabilize within 1 ms. Code execution
continues during this shift and there is no indication that
the shift has occurred.
The INTRC oscillator operates independently of the
INTOSC source. Any changes in INTOSC across
voltage and temperature are not necessarily reflected
by changes in INTRC or vice versa. The frequency of
INTRC is not affected by OSCTUNE.
3.5.4 INTOSC FREQUENCY DRIFT
The INTOSC frequency may drift as VDD or tempera-
ture changes and can affect the controller operation in
a variety of ways. It is possible to adjust the INTOSC
frequency by modifying the value in the OSCTUNE
register. Depending on the device, this may have no
effect on the INTRC clock source frequency.
Tuning INTOSC requires knowing when to make the
adjustment, in which direction it should be made, and in
some cases, how large a change is needed. Three
compensation techniques are shown here.
3.5.4.1 Compensating with the EUSART
An adjustment may be required when the EUSART
begins to generate framing errors or receives data with
errors while in Asynchronous mode. Framing errors
indicate that the device clock frequency is too high. To
adjust for this, decrement the value in OSCTUNE to
reduce the clock frequency. On the other hand, errors
in data may suggest that the clock speed is too low. To
compensate, increment OSCTUNE to increase the
clock frequency.
3.5.4.2 Compensating with the Timers
This technique compares device clock speed to some
reference clock. Two timers may be used; one timer is
clocked by the peripheral clock, while the other is
clocked by a fixed reference source, such as the
Timer1 oscillator.
Both timers are cleared, but the timer clocked by the
reference generates interrupts. When an interrupt
occurs, the internally clocked timer is read and both
timers are cleared. If the internally clocked timer value
is much greater than expected, then the internal
oscillator block is running too fast. To adjust for this,
decrement the OSCTUNE register.
3.5.4.3 Compensating with the CCP Module
in Capture Mode
A CCP module can use free-running Timer1 (or
Timer3), clocked by the internal oscillator block and an
external event with a known period (i.e., AC power
frequency). The time of the first event is captured in the
CCPRxH:CCPRxL registers and is recorded for use
later. When the second event causes a capture, the
time of the first event is subtracted from the time of the
second event. Since the period of the external event is
known, the time difference between events can be
calculated.
If the measured time is much greater than the
calculated time, the internal oscillator block is running
too fast. To compensate, decrement the OSCTUNE
register. If the measured time is much less than the
calculated time, the internal oscillator block is running
too slow. To compensate, increment the OSCTUNE
register.
2010 Microchip Technology Inc. Preliminary DS39979A-page 33
PIC18F87J72 FAMILY
3.6 Effects of Power-Managed Modes
on the Various Clock Sources
When PRI_IDLE mode is selected, the designated pri-
mary oscillator continues to run without interruption.
For all other power-managed modes, the oscillator
using the OSC1 pin is disabled. The OSC1 pin (and
OSC2 pin if used by the oscillator) will stop oscillating.
In secondary clock modes (SEC_RUN and
SEC_IDLE), the Timer1 oscillator is operating and
providing the device clock. The Timer1 oscillator may
also run in all power-managed modes if required to
clock Timer1 or Timer3.
In RC_RUN and RC_IDLE modes, the internal
oscillator provides the device clock source. The 31 kHz
INTRC output can be used directly to provide the clock
and may be enabled to support various special
features, regardless of the power-managed mode (see
Section 26.2 “Watchdog Timer (WDT)” through
Section 26.5 “Fail-Safe Clock Monitor” for more
information on WDT, Fail-Safe Clock Monitor and
Two-Speed Start-up).
If the Sleep mode is selected, all clock sources are
stopped. Since all the transistor switching currents
have been stopped, Sleep mode achieves the lowest
current consumption of the device (only leakage
currents).
Enabling any on-chip feature that will operate during
Sleep will increase the current consumed during Sleep.
The INTRC is required to support WDT operation. The
Timer1 oscillator may be operating to support a Real-
Time Clock (RTC). Other features may be operating
that do not require a device clock source (i.e., MSSP
slave, INTx pins and others). Peripherals that may add
significant current consumption are listed in
Section 29.2 “DC Characteristics: Power-Down and
Supply Current PIC18F87J72 Family (Industrial)”.
3.7 Power-up Delays
Power-up delays are controlled by two timers, so that
no external Reset circuitry is required for most applica-
tions. The delays ensure that the device is kept in
Reset until the device power supply is stable under nor-
mal circumstances, and the primary clock is operating
and stable. For additional information on power-up
delays, see Section 5.6 “Power-up Timer (PWRT)”.
The first timer is the Power-up Timer (PWRT), which
provides a fixed delay on power-up (parameter 33,
Table 29-11); it is always enabled.
The second timer is the Oscillator Start-up Timer
(OST), intended to keep the chip in Reset until the
crystal oscillator is stable (HS modes). The OST does
this by counting 1024 oscillator cycles before allowing
the oscillator to clock the device.
There is a delay of interval, TCSD (parameter 38,
Table 29-11), following POR, while the controller
becomes ready to execute instructions.
TABLE 3-3: OSC1 AND OSC2 PIN STATES IN SLEEP MODE
Oscillator Mode OSC1 Pin OSC2 Pin
EC, ECPLL Floating, pulled by external clock At logic low (clock/4 output)
HS, HSPLL Feedback inverter disabled at quiescent
voltage level
Feedback inverter disabled at quiescent
voltage level
INTOSC, INTPLL1/2 I/O pin, RA6, direction controlled by
TRISA<6>
I/O pin, RA6, direction controlled by
TRISA<7>
Note: See Section 5.0 “Reset” for time-outs due to Sleep and MCLR Reset.
PIC18F87J72 FAMILY
DS39979A-page 34 Preliminary 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. Preliminary DS39979A-page 35
PIC18F87J72 FAMILY
4.0 POWER-MANAGED MODES
The PIC18F87J72 family devices provide the ability to
manage power consumption by simply managing clock-
ing to the CPU and the peripherals. In general, a lower
clock frequency and a reduction in the number of circuits
being clocked constitutes lower consumed power. For
the sake of managing power in an application, there are
three primary modes of operation:
Run mode
Idle mode
Sleep mode
These modes define which portions of the device are
clocked and at what speed. The Run and Idle modes
may use any of the three available clock sources
(primary, secondary or internal oscillator block); the
Sleep mode does not use a clock source.
The power-managed modes include several
power-saving features offered on previous PIC®
devices. One is the clock switching feature, offered in
other PIC18 devices, allowing the controller to use the
Timer1 oscillator in place of the primary oscillator. Also
included is the Sleep mode, offered by all PIC devices,
where all device clocks are stopped.
4.1 Selecting Power-Managed Modes
Selecting a power-managed mode requires two
decisions: if the CPU is to be clocked or not and which
clock source is to be used. The IDLEN bit
(OSCCON<7>) controls CPU clocking, while the
SCS<1:0> bits (OSCCON<1:0>) select the clock
source. The individual modes, bit settings, clock
sources and affected modules are summarized in
Table 4-1.
4.1.1 CLOCK SOURCES
The SCS<1:0> bits allow the selection of one of three
clock sources for power-managed modes. They are:
the primary clock, as defined by the FOSC<2:0>
Configuration bits
the secondary clock (Timer1 oscillator)
the internal oscillator
4.1.2 ENTERING POWER-MANAGED
MODES
Switching from one power-managed mode to another
begins by loading the OSCCON register. The
SCS<1:0> bits select the clock source and determine
which Run or Idle mode is to be used. Changing these
bits causes an immediate switch to the new clock
source, assuming that it is running. The switch may
also be subject to clock transition delays. These are
discussed in Section 4.1.3 “Clock Transitions and
Status Indicators” and subsequent sections.
Entry to the power-managed Idle or Sleep modes is
triggered by the execution of a SLEEP instruction. The
actual mode that results depends on the status of the
IDLEN bit.
Depending on the current mode and the mode being
switched to, a change to a power-managed mode does
not always require setting all of these bits. Many
transitions may be done by changing the oscillator
select bits, or changing the IDLEN bit, prior to issuing a
SLEEP instruction. If the IDLEN bit is already
configured correctly, it may only be necessary to
perform a SLEEP instruction to switch to the desired
mode.
TABLE 4-1: POWER-MANAGED MODES
Mode
OSCCON Bits Module Clocking
Available Clock and Oscillator Source
IDLEN<7>(1) SCS<1:0> CPU Peripherals
Sleep 0N/A Off Off None – All clocks are disabled
PRI_RUN N/A 10 Clocked Clocked Primary – HS, EC, HSPLL, ECPLL;
this is the normal full-power execution mode
SEC_RUN N/A 01 Clocked Clocked Secondary – Timer1 Oscillator
RC_RUN N/A 11 Clocked Clocked Internal Oscillator
PRI_IDLE 110Off Clocked Primary – HS, EC, HSPLL, ECPLL
SEC_IDLE 101Off Clocked Secondary – Timer1 Oscillator
RC_IDLE 111Off Clocked Internal Oscillator
Note 1: IDLEN reflects its value when the SLEEP instruction is executed.
PIC18F87J72 FAMILY
DS39979A-page 36 Preliminary 2010 Microchip Technology Inc.
4.1.3 CLOCK TRANSITIONS AND STATUS
INDICATORS
The length of the transition between clock sources is
the sum of two cycles of the old clock source and three
to four cycles of the new clock source. This formula
assumes that the new clock source is stable.
Two bits indicate the current clock source and its
status: OSTS (OSCCON<3>) and T1RUN
(T1CON<6>). In general, only one of these bits will be
set while in a given power-managed mode. When the
OSTS bit is set, the primary clock is providing the
device clock. When the T1RUN bit is set, the Timer1
oscillator is providing the clock. If neither of these bits
is set, INTRC is clocking the device.
4.1.4 MULTIPLE SLEEP COMMANDS
The power-managed mode that is invoked with the
SLEEP instruction is determined by the setting of the
IDLEN bit at the time the instruction is executed. If
another SLEEP instruction is executed, the device will
enter the power-managed mode specified by IDLEN at
that time. If IDLEN has changed, the device will enter
the new power-managed mode specified by the new
setting.
4.2 Run Modes
In the Run modes, clocks to both the core and
peripherals are active. The difference between these
modes is the clock source.
4.2.1 PRI_RUN MODE
The PRI_RUN mode is the normal, full-power execu-
tion mode of the microcontroller. This is also the default
mode upon a device Reset unless Two-Speed Start-up
is enabled (see Section 26.4 “Two-Speed Start-up”
for details). In this mode, the OSTS bit is set (see
Section 3.2 “Control Registers”).
4.2.2 SEC_RUN MODE
The SEC_RUN mode is the compatible mode to the
“clock switching” feature offered in other PIC18
devices. In this mode, the CPU and peripherals are
clocked from the Timer1 oscillator. This gives users the
option of lower power consumption while still using a
high-accuracy clock source.
SEC_RUN mode is entered by setting the SCS<1:0>
bits to ‘01’. The device clock source is switched to the
Timer1 oscillator (see Figure 4-1), the primary oscilla-
tor is shut down, the T1RUN bit (T1CON<6>) is set and
the OSTS bit is cleared.
Note: Executing a SLEEP instruction does not
necessarily place the device into Sleep
mode. It acts as the trigger to place the
controller into either the Sleep mode, or
one of the Idle modes, depending on the
setting of the IDLEN bit.
Note: The Timer1 oscillator should already be
running prior to entering SEC_RUN mode.
If the T1OSCEN bit is not set when the
SCS<1:0> bits are set to01’, entry to
SEC_RUN mode will not occur. If the
Timer1 oscillator is enabled, but not yet
running, device clocks will be delayed until
the oscillator has started. In such situa-
tions, initial oscillator operation is far from
stable and unpredictable operation may
result.
2010 Microchip Technology Inc. Preliminary DS39979A-page 37
PIC18F87J72 FAMILY
On transitions from SEC_RUN mode to PRI_RUN
mode, the peripherals and CPU continue to be clocked
from the Timer1 oscillator while the primary clock is
started. When the primary clock becomes ready, a
clock switch back to the primary clock occurs (see
Figure 4-2). When the clock switch is complete, the
T1RUN bit is cleared, the OSTS bit is set and the
primary clock is providing the clock. The IDLEN and
SCS bits are not affected by the wake-up; the Timer1
oscillator continues to run.
FIGURE 4-1: TRANSITION TIMING FOR ENTRY TO SEC_RUN MODE
FIGURE 4-2: TRANSITION TIMING FROM SEC_RUN MODE TO PRI_RUN MODE (HSPLL)
Q4Q3Q2
OSC1
Peripheral
Program
Q1
T1OSI
Q1
Counter
Clock
CPU
Clock
PC + 2PC
123
n-1
n
Clock Transition
Q4Q3Q2 Q1 Q3Q2
PC + 4
Q1 Q3 Q4
OSC1
Peripheral
Program PC
T1OSI
PLL Clock
Q1
PC + 4
Q2
Output
Q3 Q4 Q1
CPU Clock
PC + 2
Clock
Counter
Q2 Q2 Q3
Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.
SCS<1:0> Bits Changed
TPLL(1)
12 n-1n
Clock
OSTS bit Set
Transition
TOST(1)
PIC18F87J72 FAMILY
DS39979A-page 38 Preliminary 2010 Microchip Technology Inc.
4.2.3 RC_RUN MODE
In RC_RUN mode, the CPU and peripherals are
clocked from the internal oscillator; the primary clock is
shut down. This mode provides the best power conser-
vation of all the Run modes while still executing code.
It works well for user applications which are not highly
timing-sensitive or do not require high-speed clocks at
all times.
This mode is entered by setting SCS bits to ‘11’. When
the clock source is switched to the INTRC (see
Figure 4-3), the primary oscillator is shut down and the
OSTS bit is cleared.
On transitions from RC_RUN mode to PRI_RUN mode,
the device continues to be clocked from the INTRC
while the primary clock is started. When the primary
clock becomes ready, a clock switch to the primary
clock occurs (see Figure 4-4). When the clock switch is
complete, the OSTS bit is set and the primary clock is
providing the device clock. The IDLEN and SCS bits
are not affected by the switch. The INTRC source will
continue to run if either the WDT or the Fail-Safe Clock
Monitor is enabled.
FIGURE 4-3: TRANSITION TIMING TO RC_RUN MODE
FIGURE 4-4: TRANSITION TIMING FROM RC_RUN MODE TO PRI_RUN MODE
Q4Q3Q2
OSC1
Peripheral
Program
Q1
INTRC
Q1
Counter
Clock
CPU
Clock
PC + 2PC
123 n-1n
Clock Transition
Q4Q3Q2 Q1 Q3Q2
PC + 4
Q1 Q3 Q4
OSC1
Peripheral
Program PC
INTRC
PLL Clock
Q1
PC + 4
Q2
Output
Q3 Q4 Q1
CPU Clock
PC + 2
Clock
Counter
Q2 Q2 Q3
Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.
SCS<1:0> Bits Changed
TPLL(1)
12 n-1n
Clock
OSTS Bit Set
Transition
TOST(1)
2010 Microchip Technology Inc. Preliminary DS39979A-page 39
PIC18F87J72 FAMILY
4.3 Sleep Mode
The power-managed Sleep mode is identical to the leg-
acy Sleep mode offered in all other PIC devices. It is
entered by clearing the IDLEN bit (the default state on
device Reset) and executing the SLEEP instruction.
This shuts down the selected oscillator (Figure 4-5). All
clock source status bits are cleared.
Entering the Sleep mode from any other mode does not
require a clock switch. This is because no clocks are
needed once the controller has entered Sleep. If the
WDT is selected, the INTRC source will continue to
operate. If the Timer1 oscillator is enabled, it will also
continue to run.
When a wake event occurs in Sleep mode (by interrupt,
Reset or WDT time-out), the device will not be clocked
until the clock source selected by the SCS<1:0> bits
becomes ready (see Figure 4-6), or it will be clocked
from the internal oscillator if either the Two-Speed
Start-up or the Fail-Safe Clock Monitor is enabled (see
Section 26.0 “Special Features of the CPU”). In
either case, the OSTS bit is set when the primary clock
is providing the device clocks. The IDLEN and SCS bits
are not affected by the wake-up.
4.4 Idle Modes
The Idle modes allow the controller’s CPU to be
selectively shut down while the peripherals continue to
operate. Selecting a particular Idle mode allows users
to further manage power consumption.
If the IDLEN bit is set to a ‘1’ when a SLEEP instruction is
executed, the peripherals will be clocked from the clock
source selected using the SCS<1:0> bits; however, the
CPU will not be clocked. The clock source status bits are
not affected. Setting IDLEN and executing a SLEEP
instruction provides a quick method of switching from a
given Run mode to its corresponding Idle mode.
If the WDT is selected, the INTRC source will continue
to operate. If the Timer1 oscillator is enabled, it will also
continue to run.
Since the CPU is not executing instructions, the only
exits from any of the Idle modes are by interrupt, WDT
time-out or a Reset. When a wake event occurs, CPU
execution is delayed by an interval of TCSD
(parameter 38, Table 29-11) while it becomes ready to
execute code. When the CPU begins executing code,
it resumes with the same clock source for the current
Idle mode. For example, when waking from RC_IDLE
mode, the internal oscillator block will clock the CPU
and peripherals (in other words, RC_RUN mode). The
IDLEN and SCS bits are not affected by the wake-up.
While in any Idle mode or the Sleep mode, a WDT
time-out will result in a WDT wake-up to the Run mode
currently specified by the SCS<1:0> bits.
FIGURE 4-5: TRANSITION TIMING FOR ENTRY TO SLEEP MODE
FIGURE 4-6: TRANSITION TIMING FOR WAKE FROM SLEEP (HSPLL)
Q4Q3Q2
OSC1
Peripheral
Sleep
Program
Q1Q1
Counter
Clock
CPU
Clock
PC + 2PC
Q3 Q4 Q1 Q2
OSC1
Peripheral
Program PC
PLL Clock
Q3 Q4
Output
CPU Clock
Q1 Q2 Q3 Q4 Q1 Q2
Clock
Counter PC + 6PC + 4
Q1 Q2 Q3 Q4
Wake Event
Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.
TOST(1) TPLL(1)
OSTS Bit Set
PC + 2
PIC18F87J72 FAMILY
DS39979A-page 40 Preliminary 2010 Microchip Technology Inc.
4.4.1 PRI_IDLE MODE
This mode is unique among the three low-power Idle
modes, in that it does not disable the primary device
clock. For timing-sensitive applications, this allows for
the fastest resumption of device operation with its more
accurate primary clock source, since the clock source
does not have to “warm up” or transition from another
oscillator.
PRI_IDLE mode is entered from PRI_RUN mode by
setting the IDLEN bit and executing a SLEEP instruc-
tion. If the device is in another Run mode, set IDLEN
first, then set the SCS bits to ‘10’ and execute SLEEP.
Although the CPU is disabled, the peripherals continue
to be clocked from the primary clock source specified
by the FOSC<1:0> Configuration bits. The OSTS bit
remains set (see Figure 4-7).
When a wake event occurs, the CPU is clocked from the
primary clock source. A delay of interval, TCSD, is
required between the wake event and when code
execution starts. This is required to allow the CPU to
become ready to execute instructions. After the
wake-up, the OSTS bit remains set. The IDLEN and
SCS bits are not affected by the wake-up (see
Figure 4-8).
4.4.2 SEC_IDLE MODE
In SEC_IDLE mode, the CPU is disabled but the
peripherals continue to be clocked from the Timer1
oscillator. This mode is entered from SEC_RUN by set-
ting the IDLEN bit and executing a SLEEP instruction. If
the device is in another Run mode, set IDLEN first, then
set SCS<1:0> to ‘01’ and execute SLEEP. When the
clock source is switched to the Timer1 oscillator, the
primary oscillator is shut down, the OSTS bit is cleared
and the T1RUN bit is set.
When a wake event occurs, the peripherals continue to
be clocked from the Timer1 oscillator. After an interval
of TCSD, following the wake event, the CPU begins exe-
cuting code being clocked by the Timer1 oscillator. The
IDLEN and SCS bits are not affected by the wake-up;
the Timer1 oscillator continues to run (see Figure 4-8).
FIGURE 4-7: TRANSITION TIMING FOR ENTRY TO IDLE MODE
FIGURE 4-8: TRANSITION TIMING FOR WAKE FROM IDLE TO RUN MODE
Note: The Timer1 oscillator should already be
running prior to entering SEC_IDLE mode.
If the T1OSCEN bit is not set when the
SLEEP instruction is executed, the SLEEP
instruction will be ignored and entry to
SEC_IDLE mode will not occur. If the
Timer1 oscillator is enabled, but not yet
running, peripheral clocks will be delayed
until the oscillator has started. In such
situations, initial oscillator operation is far
from stable and unpredictable operation
may result.
Q1
Peripheral
Program PC PC + 2
OSC1
Q3 Q4 Q1
CPU Clock
Clock
Counter
Q2
OSC1
Peripheral
Program PC
CPU Clock
Q1 Q3 Q4
Clock
Counter
Q2
Wake Event
TCSD
2010 Microchip Technology Inc. Preliminary DS39979A-page 41
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4.4.3 RC_IDLE MODE
In RC_IDLE mode, the CPU is disabled but the periph-
erals continue to be clocked from the internal oscillator.
This mode allows for controllable power conservation
during Idle periods.
From RC_RUN, this mode is entered by setting the
IDLEN bit and executing a SLEEP instruction. If the
device is in another Run mode, first set IDLEN, then
clear the SCS bits and execute SLEEP. When the clock
source is switched to the INTRC, the primary oscillator
is shut down and the OSTS bit is cleared.
When a wake event occurs, the peripherals continue to
be clocked from the INTOSC. After a delay of TCSD,
following the wake event, the CPU begins executing
code being clocked by the INTOSC. The IDLEN and
SCS bits are not affected by the wake-up. The INTOSC
source will continue to run if either the WDT or the
Fail-Safe Clock Monitor is enabled.
4.5 Exiting Idle and Sleep Modes
An exit from Sleep mode, or any of the Idle modes, is
triggered by an interrupt, a Reset or a WDT time-out.
This section discusses the triggers that cause exits
from power-managed modes. The clocking subsystem
actions are discussed in each of the power-managed
mode sections (see Section 4.2 “Run Modes”,
Section 4.3 “Sleep Mode” and Section 4.4 “Idle
Modes”).
4.5.1 EXIT BY INTERRUPT
Any of the available interrupt sources can cause the
device to exit from an Idle mode, or the Sleep mode, to
a Run mode. To enable this functionality, an interrupt
source must be enabled by setting its enable bit in one
of the INTCON or PIE registers. The exit sequence is
initiated when the corresponding interrupt flag bit is set.
On all exits from Idle or Sleep modes, by interrupt, code
execution branches to the interrupt vector if the
GIE/GIEH bit (INTCON<7>) is set. Otherwise, code
execution continues or resumes without branching
(see Section 9.0 “Interrupts”).
A fixed delay of interval, TCSD, following the wake event
is required when leaving Sleep and Idle modes. This
delay is required for the CPU to prepare for execution.
Instruction execution resumes on the first clock cycle
following this delay.
4.5.2 EXIT BY WDT TIME-OUT
A WDT time-out will cause different actions depending
on which power-managed mode the device is in when
the time-out occurs.
If the device is not executing code (all Idle modes and
Sleep mode), the time-out will result in an exit from the
power-managed mode (see Section 4.2 “Run
Modes” and Section 4.3 “Sleep Mode). If the device
is executing code (all Run modes), the time-out will
result in a WDT Reset (see Section 26.2 “Watchdog
Timer (WDT)”).
The Watchdog Timer and postscaler are cleared by one
of the following events:
executing a SLEEP or CLRWDT instruction
the loss of a currently selected clock source (if the
Fail-Safe Clock Monitor is enabled)
4.5.3 EXIT BY RESET
Exiting an Idle or Sleep mode by Reset automatically
forces the device to run from the INTRC.
4.5.4 EXIT WITHOUT AN OSCILLATOR
START-UP DELAY
Certain exits from power-managed modes do not
invoke the OST at all. There are two cases:
PRI_IDLE mode, where the primary clock source
is not stopped; and
the primary clock source is either the EC or
ECPLL mode.
In these instances, the primary clock source either
does not require an oscillator start-up delay, since it is
already running (PRI_IDLE), or normally does not
require an oscillator start-up delay (EC). However, a
fixed delay of interval, T
CSD, following the wake event
is still required when leaving Sleep and Idle modes to
allow the CPU to prepare for execution. Instruction
execution resumes on the first clock cycle following this
delay.
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DS39979A-page 42 Preliminary 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. Preliminary DS39979A-page 43
PIC18F87J72 FAMILY
5.0 RESET
The PIC18F87J72 family of devices differentiates
between various kinds of Reset:
Power-on Reset (POR)
•MCLR
Reset during normal operation
•MCLR Reset during power-managed modes
Watchdog Timer (WDT) Reset (during
execution)
Brown-out Reset (BOR)
Configuration Mismatch (CM)
RESET Instruction
Stack Full Reset
Stack Underflow Reset
This section discusses Resets generated by MCLR,
POR and BOR, and covers the operation of the various
start-up timers. Stack Reset events are covered in
Section 6.1.4.4 “Stack Full and Underflow Resets”.
WDT Resets are covered in Section 26.2 “Watchdog
Timer (WDT)”.
A simplified block diagram of the on-chip Reset circuit
is shown in Figure 5-1.
5.1 RCON Register
Device Reset events are tracked through the RCON
register (Register 5-1). The lower five bits of the
register indicate that a specific Reset event has
occurred. In most cases, these bits can only be set by
the event and must be cleared by the application after
the event. The state of these flag bits, taken together,
can be read to indicate the type of Reset that just
occurred. This is described in more detail in
Section 5.7 “Reset State of Registers”.
The RCON register also has a control bit for setting
interrupt priority (IPEN). Interrupt priority is discussed
in Section 9.0 “Interrupts”.
FIGURE 5-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
S
RQ
External Reset
MCLR
VDD
WDT
Time-out
VDD Rise
Detect
PWRT
INTRC
POR Pulse
PWRT Chip_Reset
11-Bit Ripple Counter
Brown-out
Reset(1)
RESET
Instruction
Stack
Pointer
Stack Full/Underflow Reset
Sleep
IDLE
65.5 ms (typical)
Note 1: The ENVREG pin must be tied high to enable Brown-out Reset. The Brown-out Reset is provided by the on-chip
voltage regulator when there is insufficient source voltage to maintain regulation.
Configuration Word
Mismatch
32 s (typical)
PIC18F87J72 FAMILY
DS39979A-page 44 Preliminary 2010 Microchip Technology Inc.
REGISTER 5-1: RCON: RESET CONTROL REGISTER
R/W-0 U-0 R/W-1 R/W-1 R-1 R-1 R/W-0 R/W-0
IPEN —CMRI TO PD POR BOR
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 IPEN: Interrupt Priority Enable bit
1 = Enable priority levels on interrupts
0 = Disable priority levels on interrupts (PIC16XXXX Compatibility mode)
bit 6 Unimplemented: Read as0
bit 5 CM: Configuration Mismatch (CM) Flag bit
1 = A Configuration Mismatch has not occurred
0 = A Configuration Mismatch has occurred (Must be set in software after a Configuration Mismatch
Reset occurs.)
bit 4 RI: RESET Instruction Flag bit
1 =The RESET instruction was not executed (set by firmware only)
0 =The RESET instruction was executed causing a device Reset (must be set in software after a
Brown-out Reset occurs)
bit 3 TO: Watchdog Time-out Flag bit
1 = Set by power-up, CLRWDT instruction or SLEEP instruction
0 = A WDT time-out occurred
bit 2 PD: Power-Down Detection Flag bit
1 = Set by power-up or by the CLRWDT instruction
0 = Set by execution of the SLEEP instruction
bit 1 POR: Power-on Reset Status bit
1 = A Power-on Reset has not occurred (set by firmware only)
0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)
bit 0 BOR: Brown-out Reset Status bit
1 = A Brown-out Reset has not occurred (set by firmware only)
0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs)
Note 1: It is recommended that the POR bit be set after a Power-on Reset has been detected, so that subsequent
Power-on Resets may be detected.
2: If the on-chip voltage regulator is disabled, BOR remains ‘0 at all times. See Section 5.4.1 “Detecting
BOR” for more information.
3: Brown-out Reset is said to have occurred when BOR is ‘0’ and POR is ‘1’ (assuming that POR was set to
1’ by software immediately after a Power-on Reset).
2010 Microchip Technology Inc. Preliminary DS39979A-page 45
PIC18F87J72 FAMILY
5.2 Master Clear (MCLR)
The MCLR pin provides a method for triggering a hard
external Reset of the device. A Reset is generated by
holding the pin low. PIC18 extended microcontroller
devices have a noise filter in the MCLR Reset path
which detects and ignores small pulses.
The MCLR pin is not driven low by any internal Resets,
including the WDT.
5.3 Power-on Reset (POR)
A Power-on Reset condition is generated on-chip
whenever VDD rises above a certain threshold. This
allows the device to start in the initialized state when
VDD is adequate for operation.
To take advantage of the POR circuitry, tie the MCLR
pin through a resistor (1 k to 10 k) to VDD. This will
eliminate external RC components usually needed to
create a Power-on Reset delay. A minimum rise rate for
VDD is specified (parameter D004). For a slow rise
time, see Figure 5-2.
When the device starts normal operation (i.e., exits the
Reset condition), device operating parameters
(voltage, frequency, temperature, etc.) must be met to
ensure operation. If these conditions are not met, the
device must be held in Reset until the operating
conditions are met.
Power-on Reset events are captured by the POR bit
(RCON<1>). The state of the bit is set to ‘0’ whenever
a Power-on Reset occurs; it does not change for any
other Reset event. POR is not reset to1’ by any
hardware event. To capture multiple events, the user
manually resets the bit to1’ in software following any
Power-on Reset.
5.4 Brown-out Reset (BOR)
The PIC18F87J72 family of devices incorporates a
simple BOR function when the internal regulator is
enabled (ENVREG pin is tied to VDD). The voltage reg-
ulator will trigger a Brown-out Reset when output of the
regulator to the device core approaches the voltage at
which the device is unable to run at full speed. The
BOR circuit also keeps the device in Reset as VDD
rises, until the regulator’s output level is sufficient for
full-speed operation.
Once a BOR has occurred, the Power-up Timer will
keep the chip in Reset for TPWRT (parameter 33). If
VDD drops below the threshold for full-speed operation
while the Power-up Timer is running, the chip will go
back into a Brown-out Reset and the Power-up Timer
will be initialized. Once VDD rises to the point where
regulator output is sufficient, the Power-up Timer will
execute the additional time delay.
FIGURE 5-2: EXTERNAL POWER-ON
RESET CIRCUIT (FOR
SLOW VDD POWER-UP)
5.4.1 DETECTING BOR
The BOR bit always resets to ‘0’ on any Brown-out
Reset or Power-on Reset event. This makes it difficult
to determine if a Brown-out Reset event has occurred
just by reading the state of BOR alone. A more reliable
method is to simultaneously check the state of both
POR and BOR. This assumes that the POR bit is reset
to ‘1’ in software immediately after any Power-on Reset
event. If BOR is ‘0’ while POR is ‘1’, it can be reliably
assumed that a Brown-out Reset event has occurred.
If the voltage regulator is disabled, Brown-out Reset
functionality is disabled. In this case, the BOR bit
cannot be used to determine a Brown-out Reset event.
The BOR bit is still cleared by a Power-on Reset event.
5.5 Configuration Mismatch (CM)
The Configuration Mismatch (CM) Reset is designed to
detect, and attempt to recover from, random memory
corrupting events. These include Electrostatic
Discharge (ESD) events that can cause widespread,
single bit changes throughout the device and result in
catastrophic failure.
In PIC18F87J72 family Flash devices, the device
Configuration registers (located in the configuration
memory space) are continuously monitored during
operation by comparing their values to complimentary
shadow registers. If a mismatch is detected between
the two sets of registers, a CM Reset automatically
occurs. These events are captured by the CM bit
(RCON<5>). The state of the bit is set to ‘0’ whenever
a CM event occurs. The bit does not change for any
other Reset event.
Note 1: External Power-on Reset circuit is required
only if the VDD power-up slope is too slow.
The diode, D, helps discharge the capacitor
quickly when VDD powers down.
2: R < 40 k is recommended to make sure that
the voltage drop across R does not violate
the device’s electrical specification.
3: R1 1 k will limit any current flowing into
MCLR from external capacitor, C, in the event
of MCLR/VPP pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS).
C
R1
R
D
VDD
MCLR
VDD
PIC18F87J72
PIC18F87J72 FAMILY
DS39979A-page 46 Preliminary 2010 Microchip Technology Inc.
5.6 Power-up Timer (PWRT)
PIC18F87J72 family devices incorporate an on-chip
Power-up Timer (PWRT) to help regulate the Power-on
Reset process. The PWRT is always enabled. The
main function is to ensure that the device voltage is
stable before code is executed.
The Power-up Timer (PWRT) of the PIC18F87J72 fam-
ily devices is an 11-bit counter which uses the INTRC
source as the clock input. This yields an approximate
time interval of 2048 x 32 s = 65.6 ms. While the
PWRT is counting, the device is held in Reset.
The power-up time delay depends on the INTRC clock
and will vary from chip to chip due to temperature and
process variation. See DC Parameter 33 for details.
5.6.1 TIME-OUT SEQUENCE
If enabled, the PWRT time-out is invoked after the POR
pulse has cleared. The total time-out will vary based on
the status of the PWRT. Figure 5-3, Figure 5-4,
Figure 5-5 and Figure 5-6 all depict time-out
sequences on power-up with the Power-up Timer
enabled.
Since the time-outs occur from the POR pulse, if MCLR
is kept low long enough, the PWRT will expire. Bringing
MCLR high will begin execution immediately
(Figure 5-5). This is useful for testing purposes, or to
synchronize more than one PIC18FXXXX device
operating in parallel.
FIGURE 5-3: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD, VDD RISE < TPWRT)
FIGURE 5-4: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1
TPWRT
VDD
MCLR
INTERNAL POR
PWRT TIME-OUT
INTERNAL RESET
TPWRT
VDD
MCLR
INTERNAL POR
PWRT TIME-OUT
INTERNAL RESET
2010 Microchip Technology Inc. Preliminary DS39979A-page 47
PIC18F87J72 FAMILY
FIGURE 5-5: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2
FIGURE 5-6: SLOW RISE TIME (MCLR TIED TO VDD, VDD RISE > TPWRT)
VDD
MCLR
INTERNAL POR
PWRT TIME-OUT
INTERNAL RESET
TPWRT
VDD
MCLR
INTERNAL POR
PWRT TIME-OUT
INTERNAL RESET
0V 1V
3.3V
TPWRT
PIC18F87J72 FAMILY
DS39979A-page 48 Preliminary 2010 Microchip Technology Inc.
5.7 Reset State of Registers
Most registers are unaffected by a Reset. Their status
is unknown on POR and unchanged by all other
Resets. The other registers are forced to a “Reset
state” depending on the type of Reset that occurred.
Most registers are not affected by a WDT wake-up,
since this is viewed as the resumption of normal
operation. Status bits from the RCON register, RI, TO,
PD, POR and BOR, are set or cleared differently in
different Reset situations, as indicated in Table 5-1.
These bits are used in software to determine the nature
of the Reset.
Table 5-2 describes the Reset states for all of the
Special Function Registers. These are categorized by
Power-on and Brown-out Resets, Master Clear and
WDT Resets and WDT wake-ups.
TABLE 5-1: STATUS BITS, THEIR SIGNIFICANCE AND THE INITIALIZATION CONDITION FOR
RCON REGISTER
Condition Program
Counter(1)
RCON Register STKPTR Register
RI TO PD POR BOR STKFUL STKUNF
Power-on Reset 0000h 11100 0 0
RESET Instruction 0000h 0uuuu u u
Brown-out Reset 0000h 111u0 u u
MCLR during power-managed
Run modes
0000h u1uuu u u
MCLR during power-managed
Idle modes and Sleep mode
0000h u10uu u u
WDT time-out during full power
or power-managed Run modes
0000h u0uuu u u
MCLR during full power
execution
0000h uuuuu u u
Stack Full Reset (STVREN = 1) 0000h uuuuu 1 u
Stack Underflow Reset
(STVREN = 1)
0000h uuuuu u 1
Stack Underflow Error (not an
actual Reset, STVREN = 0)
0000h uuuuu u 1
WDT time-out during
power-managed Idle or Sleep
modes
PC + 2 u00uu u u
Interrupt exit from
power-managed modes
PC + 2 uu0uu u u
Legend: u = unchanged
Note 1: When the wake-up is due to an interrupt and the GIEH or GIEL bit is set, the PC is loaded with the
interrupt vector (0008h or 0018h).
2010 Microchip Technology Inc. Preliminary DS39979A-page 49
PIC18F87J72 FAMILY
TABLE 5-2: INITIALIZATION CONDITIONS FOR ALL REGISTERS
Register Applicable
Devices
Power-on Reset,
Brown-out Reset
MCLR Resets
WDT Reset
RESET Instruction
Stack Resets
Wake-up via WDT
or Interrupt
TOSU PIC18F8XJ72 ---0 0000 ---0 0000 ---0 uuuu(1)
TOSH PIC18F8XJ72 0000 0000 0000 0000 uuuu uuuu(1)
TOSL PIC18F8XJ72 0000 0000 0000 0000 uuuu uuuu(1)
STKPTR PIC18F8XJ72 uu-0 0000 00-0 0000 uu-u uuuu(1)
PCLATU PIC18F8XJ72 ---0 0000 ---0 0000 ---u uuuu
PCLATH PIC18F8XJ72 0000 0000 0000 0000 uuuu uuuu
PCL PIC18F8XJ72 0000 0000 0000 0000 PC + 2(2)
TBLPTRU PIC18F8XJ72 --00 0000 --00 0000 --uu uuuu
TBLPTRH PIC18F8XJ72 0000 0000 0000 0000 uuuu uuuu
TBLPTRL PIC18F8XJ72 0000 0000 0000 0000 uuuu uuuu
TABLAT PIC18F8XJ72 0000 0000 0000 0000 uuuu uuuu
PRODH PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
PRODL PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
INTCON PIC18F8XJ72 0000 000x 0000 000u uuuu uuuu(3)
INTCON2 PIC18F8XJ72 1111 1111 1111 1111 uuuu uuuu(3)
INTCON3 PIC18F8XJ72 1100 0000 1100 0000 uuuu uuuu(3)
INDF0 PIC18F8XJ72 N/A N/A N/A
POSTINC0 PIC18F8XJ72 N/A N/A N/A
POSTDEC0 PIC18F8XJ72 N/A N/A N/A
PREINC0 PIC18F8XJ72 N/A N/A N/A
PLUSW0 PIC18F8XJ72 N/A N/A N/A
FSR0H PIC18F8XJ72 ---- xxxx ---- uuuu ---- uuuu
FSR0L PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
WREG PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
INDF1 PIC18F8XJ72 N/A N/A N/A
POSTINC1 PIC18F8XJ72 N/A N/A N/A
POSTDEC1 PIC18F8XJ72 N/A N/A N/A
PREINC1 PIC18F8XJ72 N/A N/A N/A
PLUSW1 PIC18F8XJ72 N/A N/A N/A
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as0’, q = value depends on condition.
Shaded cells indicate conditions do not apply for the designated device.
Note 1: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are
updated with the current value of the PC. The STKPTR is modified to point to the next location in the
hardware stack.
2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the
interrupt vector (0008h or 0018h).
3: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).
4: See Table 5-1 for Reset value for specific condition.
5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled depending on the oscillator mode selected. When
not enabled as PORTA pins, they are disabled and read as 0’.
PIC18F87J72 FAMILY
DS39979A-page 50 Preliminary 2010 Microchip Technology Inc.
FSR1H PIC18F8XJ72 ---- xxxx ---- uuuu ---- uuuu
FSR1L PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
BSR PIC18F8XJ72 ---- 0000 ---- 0000 ---- uuuu
INDF2 PIC18F8XJ72 N/A N/A N/A
POSTINC2 PIC18F8XJ72 N/A N/A N/A
POSTDEC2 PIC18F8XJ72 N/A N/A N/A
PREINC2 PIC18F8XJ72 N/A N/A N/A
PLUSW2 PIC18F8XJ72 N/A N/A N/A
FSR2H PIC18F8XJ72 ---- xxxx ---- uuuu ---- uuuu
FSR2L PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
STATUS PIC18F8XJ72 ---x xxxx ---u uuuu ---u uuuu
TMR0H PIC18F8XJ72 0000 0000 0000 0000 uuuu uuuu
TMR0L PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
T0CON PIC18F8XJ72 1111 1111 1111 1111 uuuu uuuu
OSCCON PIC18F8XJ72 0110 q000 0110 q000 uuuu quuu
LCDREG PIC18F8XJ72 -011 1100 -011 1000 -uuu uuuu
WDTCON PIC18F8XJ72 0--- ---0 0--- ---0 u--- ---u
RCON(4) PIC18F8XJ72 0-11 11q0 0-0q qquu u-uu qquu
TMR1H PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
TMR1L PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
T1CON PIC18F8XJ72 0000 0000 u0uu uuuu uuuu uuuu
TMR2 PIC18F8XJ72 0000 0000 0000 0000 uuuu uuuu
PR2 PIC18F8XJ72 1111 1111 1111 1111 1111 1111
T2CON PIC18F8XJ72 -000 0000 -000 0000 -uuu uuuu
SSPBUF PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
SSPADD PIC18F8XJ72 0000 0000 0000 0000 uuuu uuuu
SSPSTAT PIC18F8XJ72 0000 0000 0000 0000 uuuu uuuu
SSPCON1 PIC18F8XJ72 0000 0000 0000 0000 uuuu uuuu
SSPCON2 PIC18F8XJ72 0000 0000 0000 0000 uuuu uuuu
TABLE 5-2: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)
Register Applicable
Devices
Power-on Reset,
Brown-out Reset
MCLR Resets
WDT Reset
RESET Instruction
Stack Resets
Wake-up via WDT
or Interrupt
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as0’, q = value depends on condition.
Shaded cells indicate conditions do not apply for the designated device.
Note 1: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are
updated with the current value of the PC. The STKPTR is modified to point to the next location in the
hardware stack.
2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the
interrupt vector (0008h or 0018h).
3: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).
4: See Table 5-1 for Reset value for specific condition.
5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled depending on the oscillator mode selected. When
not enabled as PORTA pins, they are disabled and read as ‘0’.
2010 Microchip Technology Inc. Preliminary DS39979A-page 51
PIC18F87J72 FAMILY
ADRESH PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
ADRESL PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
ADCON0 PIC18F8XJ72 0-00 0000 0-00 0000 u-uu uuuu
ADCON1 PIC18F8XJ72 0-00 0000 0-00 0000 u-uu uuuu
ADCON2 PIC18F8XJ72 0-00 0000 0-00 0000 u-uu uuuu
LCDDATA4 PIC18F8XJ72 ---- ---x ---- ---u ---- ---u
LCDDATA3 PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
LCDDATA2 PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
LCDDATA1 PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
LCDDATA0 PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
LCDSE4 PIC18F8XJ72 ---- ---0 ---- ---u ---- ---u
LCDSE3 PIC18F8XJ72 0000 0000 uuuu uuuu uuuu uuuu
LCDSE2 PIC18F8XJ72 0000 0000 uuuu uuuu uuuu uuuu
LCDSE1 PIC18F8XJ72 0000 0000 uuuu uuuu uuuu uuuu
CVRCON PIC18F8XJ72 0000 0000 0000 0000 uuuu uuuu
CMCON PIC18F8XJ72 0000 0111 0000 0111 uuuu uuuu
TMR3H PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
TMR3L PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
T3CON PIC18F8XJ72 0000 0000 uuuu uuuu uuuu uuuu
SPBRG1 PIC18F8XJ72 0000 0000 0000 0000 uuuu uuuu
RCREG1 PIC18F8XJ72 0000 0000 0000 0000 uuuu uuuu
TXREG1 PIC18F8XJ72 0000 0000 0000 0000 uuuu uuuu
TXSTA1 PIC18F8XJ72 0000 0010 0000 0010 uuuu uuuu
RCSTA1 PIC18F8XJ72 0000 000x 0000 000x uuuu uuuu
LCDPS PIC18F8XJ72 0000 0000 0000 0000 uuuu uuuu
LCDSE0 PIC18F8XJ72 0000 0000 uuuu uuuu uuuu uuuu
LCDCON PIC18F8XJ72 000- 0000 000- 0000 uuu- uuuu
EECON2 PIC18F8XJ72 ---- ---- ---- ---- ---- ----
EECON1 PIC18F8XJ72 ---0 x00- ---0 u00- ---0 u00-
TABLE 5-2: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)
Register Applicable
Devices
Power-on Reset,
Brown-out Reset
MCLR Resets
WDT Reset
RESET Instruction
Stack Resets
Wake-up via WDT
or Interrupt
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as0’, q = value depends on condition.
Shaded cells indicate conditions do not apply for the designated device.
Note 1: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are
updated with the current value of the PC. The STKPTR is modified to point to the next location in the
hardware stack.
2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the
interrupt vector (0008h or 0018h).
3: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).
4: See Table 5-1 for Reset value for specific condition.
5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled depending on the oscillator mode selected. When
not enabled as PORTA pins, they are disabled and read as 0’.
PIC18F87J72 FAMILY
DS39979A-page 52 Preliminary 2010 Microchip Technology Inc.
IPR3 PIC18F8XJ72 -111 1111 -111 1111 -uuu 1111
PIR3 PIC18F8XJ72 -000 0000 -000 0000 -uuu 0000(3)
PIE3 PIC18F8XJ72 -000 0000 -000 0000 -uuu 0000
IPR2 PIC18F8XJ72 11-- 111- 11-- 111- uu-- uuu-
PIR2 PIC18F8XJ72 00-- 000- 00-- 000- uu-- uuu-(3)
PIE2 PIC18F8XJ72 00-- 000- 00-- 000- uu-- uuu-
IPR1 PIC18F8XJ72 -111 1-11 -111 1-11 -uuu u-uu
PIR1 PIC18F8XJ72 -000 0-00 -000 0-00 -uuu u-uu(3)
PIE1 PIC18F8XJ72 -000 0-00 -000 0-00 -uuu u-uu
OSCTUNE PIC18F8XJ72 0000 0000 0000 0000 uuuu uuuu
TRISG PIC18F8XJ72 0001 1111 0001 1111 uuuu uuuu
TRISF PIC18F8XJ72 1111 111- 1111 111- uuuu uuu-
TRISE PIC18F8XJ72 1111 1-11 1111 1-11 uuuu u-uu
TRISD PIC18F8XJ72 1111 1111 1111 1111 uuuu uuuu
TRISC PIC18F8XJ72 1111 1111 1111 1111 uuuu uuuu
TRISB PIC18F8XJ72 1111 1111 1111 1111 uuuu uuuu
TRISA(5) PIC18F8XJ72 1111 1111(5) 1111 1111(5) uuuu uuuu(5)
LATG PIC18F8XJ72 00-x xxxx 00-u uuuu uu-u uuuu
LATF PIC18F8XJ72 xxxx xxx- uuuu uuu- uuuu uuu-
LATE PIC18F8XJ72 xxxx x-xx uuuu u-uu uuuu u-uu
LATD PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
LATC PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
LATB PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
LATA(5) PIC18F8XJ72 xxxx xxxx(5) uuuu uuuu(5) uuuu uuuu(5)
PORTG PIC18F8XJ72 000x xxxx 000u uuuu 000u uuuu
PORTF PIC18F8XJ72 xxxx xxx- uuuu uuu- uuuu uuu-
PORTE PIC18F8XJ72 xxxx x-xx uuuu u-uu uuuu u-uu
PORTD PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
PORTC PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
PORTB PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
PORTA(5) PIC18F8XJ72 xx0x 0000(5) uu0u 0000(5) uuuu uuuu(5)
TABLE 5-2: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)
Register Applicable
Devices
Power-on Reset,
Brown-out Reset
MCLR Resets
WDT Reset
RESET Instruction
Stack Resets
Wake-up via WDT
or Interrupt
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as0’, q = value depends on condition.
Shaded cells indicate conditions do not apply for the designated device.
Note 1: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are
updated with the current value of the PC. The STKPTR is modified to point to the next location in the
hardware stack.
2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the
interrupt vector (0008h or 0018h).
3: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).
4: See Table 5-1 for Reset value for specific condition.
5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled depending on the oscillator mode selected. When
not enabled as PORTA pins, they are disabled and read as ‘0’.
2010 Microchip Technology Inc. Preliminary DS39979A-page 53
PIC18F87J72 FAMILY
SPBRGH1 PIC18F8XJ72 0000 0000 0000 0000 uuuu uuuu
BAUDCON1 PIC18F8XJ72 0100 0-00 0100 0-00 uuuu u-uu
LCDDATA22 PIC18F8XJ72 ---- ---x ---- ---u ---- ---u
LCDDATA22 PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
LCDDATA21 PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
LCDDATA20 PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
LCDDATA19 PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
LCDDATA18 PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
LCDDATA16 PIC18F8XJ72 ---- ---x ---- ---u ---- ---u
LCDDATA16 PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
LCDDATA15 PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
LCDDATA14 PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
LCDDATA13 PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
LCDDATA12 PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
LCDDATA10 PIC18F8XJ72 ---- ---x ---- ---u ---- ---u
LCDDATA10 PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
LCDDATA9 PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
LCDDATA8 PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
LCDDATA7 PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
LCDDATA6 PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
CCPR1H PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
CCPR1L PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
CCP1CON PIC18F8XJ72 --00 0000 --00 0000 --uu uuuu
CCPR2H PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
CCPR2L PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
CCP2CON PIC18F8XJ72 --00 0000 --00 0000 --uu uuuu
TABLE 5-2: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)
Register Applicable
Devices
Power-on Reset,
Brown-out Reset
MCLR Resets
WDT Reset
RESET Instruction
Stack Resets
Wake-up via WDT
or Interrupt
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as0’, q = value depends on condition.
Shaded cells indicate conditions do not apply for the designated device.
Note 1: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are
updated with the current value of the PC. The STKPTR is modified to point to the next location in the
hardware stack.
2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the
interrupt vector (0008h or 0018h).
3: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).
4: See Table 5-1 for Reset value for specific condition.
5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled depending on the oscillator mode selected. When
not enabled as PORTA pins, they are disabled and read as 0’.
PIC18F87J72 FAMILY
DS39979A-page 54 Preliminary 2010 Microchip Technology Inc.
SPBRG2 PIC18F8XJ72 0000 0000 0000 0000 uuuu uuuu
RCREG2 PIC18F8XJ72 0000 0000 0000 0000 uuuu uuuu
TXREG2 PIC18F8XJ72 0000 0000 0000 0000 uuuu uuuu
TXSTA2 PIC18F8XJ72 0000 -010 0000 -010 uuuu -uuu
RCSTA2 PIC18F8XJ72 0000 000x 0000 000x uuuu uuuu
RTCCFG PIC18F8XJ72 0-00 0000 0-00 0000 u-uu uuuu
RTCCAL PIC18F8XJ72 0000 0000 0000 0000 uuuu uuuu
RTCVALH PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
RTCVALL PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
ALRMCFG PIC18F8XJ72 0000 0000 0000 0000 uuuu uuuu
ALRMRPT PIC18F8XJ72 0000 0000 0000 0000 uuuu uuuu
ALRMVALH PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
ALRMVALL PIC18F8XJ72 xxxx xxxx uuuu uuuu uuuu uuuu
CTMUCONH PIC18F8XJ72 0-00 0000 0-00 0000 u-uu uuuu
CTMUCONL PIC18F8XJ72 0000 0000 0000 0000 uuuu uuuu
CTMUICONH PIC18F8XJ72 0000 0000 0000 0000 uuuu uuuu
PADCFG1 PIC18F8XJ72 ---- -00- ---- -00- ---- -uu-
TABLE 5-2: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)
Register Applicable
Devices
Power-on Reset,
Brown-out Reset
MCLR Resets
WDT Reset
RESET Instruction
Stack Resets
Wake-up via WDT
or Interrupt
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as0’, q = value depends on condition.
Shaded cells indicate conditions do not apply for the designated device.
Note 1: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are
updated with the current value of the PC. The STKPTR is modified to point to the next location in the
hardware stack.
2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the
interrupt vector (0008h or 0018h).
3: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).
4: See Table 5-1 for Reset value for specific condition.
5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled depending on the oscillator mode selected. When
not enabled as PORTA pins, they are disabled and read as ‘0’.
2010 Microchip Technology Inc. Preliminary DS39979A-page 55
PIC18F87J72 FAMILY
6.0 MEMORY ORGANIZATION
There are two types of memory in PIC18 Flash
microcontroller devices:
Program Memory
Data RAM
As Harvard architecture devices, the data and program
memories use separate busses; this allows for
concurrent access of the two memory spaces.
Additional detailed information on the operation of the
Flash program memory is provided in Section 7.0
“Flash Program Memory”.
6.1 Program Memory Organization
PIC18 microcontrollers implement a 21-bit program
counter which is capable of addressing a 2-Mbyte
program memory space. Accessing a location between
the upper boundary of the physically implemented
memory and the 2-Mbyte address will return all ‘0’s (a
NOP instruction).
The PIC18F87J72 family has a Flash program memory
size of 128 Kbytes (65,536 single-word instructions).
The program memory maps for individual family
members are shown in Figure 6-1.
FIGURE 6-1: MEMORY MAPS FOR PIC18F87J72 FAMILY DEVICES
Note: Sizes of memory areas are not to scale. Sizes of program memory areas are enhanced to show detail.
Unimplemented
Read as ‘0
Unimplemented
Read as0
000000h
1FFFFFh
01FFFFh
00FFFFh
PC<20:0>
Stack Level 1
Stack Level 31
CALL, CALLW, RCALL,
RETURN, RETFIE, RETLW,
21
User Memory Space
On-Chip
Memory
ADDULNK, SUBULNK
Config. Words
Config. Words
PIC18F86J72 PIC18F87J72
On-Chip
Memory
PIC18F87J72 FAMILY
DS39979A-page 56 Preliminary 2010 Microchip Technology Inc.
6.1.1 HARD MEMORY VECTORS
All PIC18 devices have a total of three hard-coded
return vectors in their program memory space. The
Reset vector address is the default value to which the
program counter returns on all device Resets; it is
located at 0000h.
PIC18 devices also have two interrupt vector
addresses for the handling of high-priority and
low-priority interrupts. The high-priority interrupt vector
is located at 0008h and the low-priority interrupt vector
is at 0018h. Their locations in relation to the program
memory map are shown in Figure 6-2.
FIGURE 6-2: HARD VECTOR AND
CONFIGURATION WORD
LOCATIONS FOR
PIC18F87J72 FAMILY
FAMILY DEVICES
6.1.2 FLASH CONFIGURATION WORDS
Because PIC18F87J72 family devices do not have per-
sistent configuration memory, the top four words of
on-chip program memory are reserved for configuration
information. On Reset, the configuration information is
copied into the Configuration registers.
The Configuration Words are stored in their program
memory location in numerical order, starting with the
lower byte of CONFIG1 at the lowest address and end-
ing with the upper byte of CONFIG4. For these devices,
only Configuration Words, CONFIG1 through
CONFIG3, are used; CONFIG4 is reserved. The actual
addresses of the Flash Configuration Word for devices
in the PIC18F87J72 family are shown in Table 6-1.
Their location in the memory map is shown with the
other memory vectors in Figure 6-2.
Additional details on the device Configuration Words
are provided in Section 26.1 “Configuration Bits”.
TABLE 6-1: FLASH CONFIGURATION
WORD FOR PIC18F87J72
FAMILY DEVICES
Reset Vector
Low-Priority Interrupt Vector
0000h
0018h
On-Chip
Program Memory
High-Priority Interrupt Vector 0008h
1FFFFFh
(Top of Memory)
(Top of Memory-7)
Flash Configuration Words
Read ‘0
Legend: (Top of Memory) represents upper boundary
of on-chip program memory space (see
Figure 6-1 for device-specific values).
Shaded area represents unimplemented
memory. Areas are not shown to scale.
Device
Program
Memory
(Kbytes)
Configuration Word
Addresses
PIC18F86J72 64 FFF8h to FFFFh
PIC18F87J72 128 1FFF8h to 1FFFFh
2010 Microchip Technology Inc. Preliminary DS39979A-page 57
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6.1.3 PROGRAM COUNTER
The Program Counter (PC) specifies the address of the
instruction to fetch for execution. The PC is 21 bits wide
and is contained in three separate 8-bit registers. The
low byte, known as the PCL register, is both readable
and writable. The high byte, or PCH register, contains
the PC<15:8> bits; it is not directly readable or writable.
Updates to the PCH register are performed through the
PCLATH register. The upper byte is called PCU. This
register contains the PC<20:16> bits; it is also not
directly readable or writable. Updates to the PCU
register are performed through the PCLATU register.
The contents of PCLATH and PCLATU are transferred
to the program counter by any operation that writes
PCL. Similarly, the upper two bytes of the program
counter are transferred to PCLATH and PCLATU by an
operation that reads PCL. This is useful for computed
offsets to the PC (see Section 6.1.6.1 “Computed
GOTO).
The PC addresses bytes in the program memory. To
prevent the PC from becoming misaligned with word
instructions, the Least Significant bit (LSb) of PCL is
fixed to a value of ‘0’. The PC increments by 2 to
address sequential instructions in the program
memory.
The CALL, RCALL, GOTO and program branch
instructions write to the program counter directly. For
these instructions, the contents of PCLATH and
PCLATU are not transferred to the program counter.
6.1.4 RETURN ADDRESS STACK
The return address stack allows any combination of up
to 31 program calls and interrupts to occur. The PC is
pushed onto the stack when a CALL or RCALL instruc-
tion is executed, or an interrupt is Acknowledged. The
PC value is pulled off the stack on a RETURN, RETLW or
a RETFIE instruction (and on ADDULNK and SUBULNK
instructions if the extended instruction set is enabled).
PCLATU and PCLATH are not affected by any of the
RETURN or CALL instructions.
The stack operates as a 31-word by 21-bit RAM and a
5-bit Stack Pointer, STKPTR. The stack space is not
part of either program or data space. The Stack Pointer
is readable and writable and the address on the top of
the stack is readable and writable through the
Top-of-Stack Special Function Registers. Data can also
be pushed to, or popped from the stack, using these
registers.
A CALL type instruction causes a push onto the stack.
The Stack Pointer is first incremented and the location
pointed to by the Stack Pointer is written with the
contents of the PC (already pointing to the instruction
following the CALL). A RETURN type instruction causes
a pop from the stack. The contents of the location
pointed to by the STKPTR are transferred to the PC
and then the Stack Pointer is decremented.
The Stack Pointer is initialized to ‘00000’ after all
Resets. There is no RAM associated with the location
corresponding to a Stack Pointer value of00000’; this
is only a Reset value. Status bits indicate if the stack is
full, has overflowed or has underflowed.
6.1.4.1 Top-of-Stack Access
Only the top of the return address stack (TOS) is
readable and writable. A set of three registers,
TOSU:TOSH:TOSL, holds the contents of the stack
location pointed to by the STKPTR register
(Figure 6-3). This allows users to implement a software
stack if necessary. After a CALL, RCALL or interrupt
(and ADDULNK and SUBULNK instructions if the
extended instruction set is enabled), the software can
read the pushed value by reading the
TOSU:TOSH:TOSL registers. These values can be
placed on a user-defined software stack. At return time,
the software can return these values to
TOSU:TOSH:TOSL and do a return.
The user must disable the global interrupt enable bits
while accessing the stack to prevent inadvertent stack
corruption.
FIGURE 6-3: RETURN ADDRESS STACK AND ASSOCIATED REGISTERS
00011
001A34h
11111
11110
11101
00010
00001
00000
00010
Return Address Stack <20:0>
Top-of-Stack
000D58h
TOSLTOSHTOSU
34h1Ah00h
STKPTR<4:0>
Top-of-Stack Registers Stack Pointer
PIC18F87J72 FAMILY
DS39979A-page 58 Preliminary 2010 Microchip Technology Inc.
6.1.4.2 Return Stack Pointer (STKPTR)
The STKPTR register (Register 6-1) contains the Stack
Pointer value, the STKFUL (Stack Full) status bit and
the STKUNF (Stack Underflow) status bits. The value
of the Stack Pointer can be 0 through 31. The Stack
Pointer increments before values are pushed onto the
stack and decrements after values are popped off the
stack. On Reset, the Stack Pointer value will be zero.
The user may read and write the Stack Pointer value.
This feature can be used by a Real-Time Operating
System (RTOS) for return stack maintenance.
After the PC is pushed onto the stack 31 times (without
popping any values off the stack), the STKFUL bit is
set. The STKFUL bit is cleared by software or by a
POR.
The action that takes place when the stack becomes
full depends on the state of the STVREN (Stack Over-
flow Reset Enable) Configuration bit. (Refer to
Section 26.1 “Configuration Bits” for a description of
the device Configuration bits.) If STVREN is set
(default), the 31st push will push the (PC + 2) value
onto the stack, set the STKFUL bit and reset the
device. The STKFUL bit will remain set and the Stack
Pointer will be set to zero.
If STVREN is cleared, the STKFUL bit will be set on the
31st push and the Stack Pointer will increment to 31.
Any additional pushes will not overwrite the 31st push
and the STKPTR will remain at 31.
When the stack has been popped enough times to
unload the stack, the next pop will return a value of zero
to the PC and set the STKUNF bit while the Stack
Pointer remains at zero. The STKUNF bit will remain
set until cleared by software or until a POR occurs.
6.1.4.3 PUSH and POP Instructions
Since the Top-of-Stack is readable and writable, the
ability to push values onto the stack and pull values off
the stack, without disturbing normal program execu-
tion, is a desirable feature. The PIC18 instruction set
includes two instructions, PUSH and POP, that permit
the TOS to be manipulated under software control.
TOSU, TOSH and TOSL can be modified to place data
or a return address on the stack.
The PUSH instruction places the current PC value onto
the stack. This increments the Stack Pointer and loads
the current PC value onto the stack.
The POP instruction discards the current TOS by
decrementing the Stack Pointer. The previous value
pushed onto the stack then becomes the TOS value.
Note: Returning a value of zero to the PC on an
underflow has the effect of vectoring the
program to the Reset vector, where the
stack conditions can be verified and
appropriate actions can be taken. This is
not the same as a Reset, as the contents
of the SFRs are not affected.
REGISTER 6-1: STKPTR: STACK POINTER REGISTER
R/C-0 R/C-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
STKFUL(1) STKUNF(1) SP4 SP3 SP2 SP1 SP0
bit 7 bit 0
Legend: C = Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 STKFUL: Stack Full Flag bit(1)
1 = Stack became full or overflowed
0 = Stack has not become full or overflowed
bit 6 STKUNF: Stack Underflow Flag bit(1)
1 = Stack underflow occurred
0 = Stack underflow did not occur
bit 5 Unimplemented: Read as0
bit 4-0 SP<4:0>: Stack Pointer Location bits
Note 1: Bit 7 and bit 6 are cleared by user software or by a POR.
2010 Microchip Technology Inc. Preliminary DS39979A-page 59
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6.1.4.4 Stack Full and Underflow Resets
Device Resets on stack overflow and stack underflow
conditions are enabled by setting the STVREN bit in
Configuration Register 1L. When STVREN is set, a full
or underflow condition will set the appropriate STKFUL
or STKUNF bit and then cause a device Reset. When
STVREN is cleared, a full or underflow condition will set
the appropriate STKFUL or STKUNF bit, but not cause
a device Reset. The STKFUL or STKUNF bits are
cleared by the user software or a Power-on Reset.
6.1.5 FAST REGISTER STACK
A Fast Register Stack is provided for the STATUS,
WREG and BSR registers to provide a “fast return”
option for interrupts. This stack is only one level deep
and is neither readable nor writable. It is loaded with the
current value of the corresponding register when the
processor vectors for an interrupt. All interrupt sources
will push values into the Stack registers. The values in
the registers are then loaded back into the working
registers if the RETFIE,FAST instruction is used to
return from the interrupt.
If both low and high-priority interrupts are enabled, the
Stack registers cannot be used reliably to return from
low-priority interrupts. If a high-priority interrupt occurs
while servicing a low-priority interrupt, the Stack
register values stored by the low-priority interrupt will
be overwritten. In these cases, users must save the key
registers in software during a low-priority interrupt.
If interrupt priority is not used, all interrupts may use the
Fast Register Stack for returns from interrupt. If no
interrupts are used, the Fast Register Stack can be
used to restore the STATUS, WREG and BSR registers
at the end of a subroutine call. To use the Fast Register
Stack for a subroutine call, a CALL label,FAST
instruction must be executed to save the STATUS,
WREG and BSR registers to the Fast Register Stack. A
RETURN,FAST instruction is then executed to restore
these registers from the Fast Register Stack.
Example 6-1 shows a source code example that uses
the Fast Register Stack during a subroutine call and
return.
EXAMPLE 6-1: FAST REGISTER STACK
CODE EXAMPLE
6.1.6 LOOK-UP TABLES IN PROGRAM
MEMORY
There may be programming situations that require the
creation of data structures, or look-up tables, in
program memory. For PIC18 devices, look-up tables
can be implemented in two ways:
Computed GOTO
Table Reads
6.1.6.1 Computed GOTO
A computed GOTO is accomplished by adding an offset
to the program counter. An example is shown in
Example 6-2.
A look-up table can be formed with an ADDWF PCL
instruction and a group of RETLW nn instructions. The
W register is loaded with an offset into the table before
executing a call to that table. The first instruction of the
called routine is the ADDWF PCL instruction. The next
instruction executed will be one of the RETLW nn
instructions that returns the value ‘nn’ to the calling
function.
The offset value (in WREG) specifies the number of
bytes that the program counter should advance and
should be multiples of 2 (LSb = 0).
In this method, only one data byte may be stored in
each instruction location and room on the return
address stack is required.
EXAMPLE 6-2: COMPUTED GOTO USING
AN OFFSET VALUE
6.1.6.2 Table Reads
A better method of storing data in program memory
allows two bytes of data to be stored in each instruction
location.
Look-up table data may be stored, two bytes per
program word, while programming. The Table Pointer
(TBLPTR) specifies the byte address and the Table
Latch (TABLAT) contains the data that is read from the
program memory. Data is transferred from program
memory, one byte at a time.
Table read operation is discussed further in
Section 7.1 “Table Reads and Table Writes”.
CALL SUB1, FAST ;STATUS, WREG, BSR
;SAVED IN FAST REGISTER
;STACK
SUB1
RETURN FAST ;RESTORE VALUES SAVED
;IN FAST REGISTER STACK
MOVF OFFSET, W
CALL TABLE
ORG nn00h
TABLE ADDWF PCL
RETLW nnh
RETLW nnh
RETLW nnh
.
.
.
PIC18F87J72 FAMILY
DS39979A-page 60 Preliminary 2010 Microchip Technology Inc.
6.2 PIC18 Instruction Cycle
6.2.1 CLOCKING SCHEME
The microcontroller clock input, whether from an
internal or external source, is internally divided by four
to generate four non-overlapping quadrature clocks
(Q1, Q2, Q3 and Q4). Internally, the program counter is
incremented on every Q1; the instruction is fetched
from the program memory and latched into the
Instruction Register (IR) during Q4. The instruction is
decoded and executed during the following Q1 through
Q4. The clocks and instruction execution flow are
shown in Figure 6-4.
6.2.2 INSTRUCTION FLOW/PIPELINING
An “Instruction Cycle” consists of four Q cycles, Q1
through Q4. The instruction fetch and execute are pipe-
lined in such a manner that a fetch takes one instruction
cycle, while the decode and execute take another
instruction cycle. However, due to the pipelining, each
instruction effectively executes in one cycle. If an
instruction causes the program counter to change (e.g.,
GOTO), then two cycles are required to complete the
instruction (Example 6-3).
A fetch cycle begins with the Program Counter (PC)
incrementing in Q1.
In the execution cycle, the fetched instruction is latched
into the Instruction Register (IR) in cycle Q1. This
instruction is then decoded and executed during the
Q2, Q3 and Q4 cycles. Data memory is read during Q2
(operand read) and written during Q4 (destination
write).
FIGURE 6-4: CLOCK/INSTRUCTION CYCLE
EXAMPLE 6-3: INSTRUCTION PIPELINE FLOW
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
Q1
Q2
Q3
Q4
PC
OSC2/CLKO
(RC mode)
PC PC + 2 PC + 4
Fetch INST (PC)
Execute INST (PC – 2)
Fetch INST (PC + 2)
Execute INST (PC)
Fetch INST (PC + 4)
Execute INST (PC + 2)
Internal
Phase
Clock
All instructions are single cycle, except for any program branches. These take two cycles since the fetch instruction
is “flushed” from the pipeline while the new instruction is being fetched and then executed.
TCY0TCY1TCY2TCY3TCY4TCY5
1. MOVLW 55h Fetch 1 Execute 1
2. MOVWF PORTB Fetch 2 Execute 2
3. BRA SUB_1 Fetch 3 Execute 3
4. BSF PORTA, BIT3 (Forced NOP) Fetch 4 Flush (NOP)
5. Instruction @ address SUB_1 Fetch SUB_1 Execute SUB_1
2010 Microchip Technology Inc. Preliminary DS39979A-page 61
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6.2.3 INSTRUCTIONS IN PROGRAM
MEMORY
The program memory is addressed in bytes. Instruc-
tions are stored as two bytes or four bytes in program
memory. The Least Significant Byte (LSB) of an
instruction word is always stored in a program memory
location with an even address (LSB = 0). To maintain
alignment with instruction boundaries, the PC incre-
ments in steps of 2 and the LSB will always read ‘0
(see Section 6.1.3 “Program Counter”).
Figure 6-5 shows an example of how instruction words
are stored in the program memory.
The CALL and GOTO instructions have the absolute
program memory address embedded into the instruc-
tion. Since instructions are always stored on word
boundaries, the data contained in the instruction is a
word address. The word address is written to PC<20:1>,
which accesses the desired byte address in program
memory. Instruction #2 in Figure 6-5 shows how the
instruction, GOTO 0006h, is encoded in the program
memory. Program branch instructions, which encode a
relative address offset, operate in the same manner. The
offset value stored in a branch instruction represents the
number of single-word instructions that the PC will be
offset by. Section 27.0 “Instruction Set Summary”
provides further details of the instruction set.
FIGURE 6-5: INSTRUCTIONS IN PROGRAM MEMORY
6.2.4 TWO-WORD INSTRUCTIONS
The standard PIC18 instruction set has four two-word
instructions: CALL, MOVFF, GOTO and LSFR. In all
cases, the second word of the instructions always has
1111’ as its four Most Significant bits; the other 12 bits
are literal data, usually a data memory address.
The use of ‘1111’ in the 4 MSbs of an instruction
specifies a special form of NOP. If the instruction is
executed in proper sequence – immediately after the
first word – the data in the second word is accessed
and used by the instruction sequence. If the first word
is skipped for some reason and the second word is
executed by itself, a NOP is executed instead. This is
necessary for cases when the two-word instruction is
preceded by a conditional instruction that changes the
PC. Example 6-4 shows how this works.
EXAMPLE 6-4: TWO-WORD INSTRUCTIONS
Word Address
LSB = 1LSB = 0
Program Memory
Byte Locations
000000h
000002h
000004h
000006h
Instruction 1: MOVLW 055h 0Fh 55h 000008h
Instruction 2: GOTO 0006h EFh 03h 00000Ah
F0h 00h 00000Ch
Instruction 3: MOVFF 123h, 456h C1h 23h 00000Eh
F4h 56h 000010h
000012h
000014h
Note: See Section 6.5 “Program Memory and
the Extended Instruction Set” for
information on two-word instructions in the
extended instruction set.
CASE 1:
Object Code Source Code
0110 0110 0000 0000 TSTFSZ REG1 ; is RAM location 0?
1100 0001 0010 0011 MOVFF REG1, REG2 ; No, skip this word
1111 0100 0101 0110 ; Execute this word as a NOP
0010 0100 0000 0000 ADDWF REG3 ; continue code
CASE 2:
Object Code Source Code
0110 0110 0000 0000 TSTFSZ REG1 ; is RAM location 0?
1100 0001 0010 0011 MOVFF REG1, REG2 ; Yes, execute this word
1111 0100 0101 0110 ; 2nd word of instruction
0010 0100 0000 0000 ADDWF REG3 ; continue code
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DS39979A-page 62 Preliminary 2010 Microchip Technology Inc.
6.3 Data Memory Organization
The data memory in PIC18 devices is implemented as
static RAM. Each register in the data memory has a
12-bit address, allowing up to 4,096 bytes of data
memory. The memory space is divided into as many as
16 banks that contain 256 bytes each. PIC18F86J72
and PIC18F87J72 devices implement all 16 complete
banks, for a total of 4 Kbytes. Figure 6-6 and Figure 6-7
show the data memory organization for the devices.
The data memory contains Special Function Registers
(SFRs) and General Purpose Registers (GPRs). The
SFRs are used for control and status of the controller
and peripheral functions, while GPRs are used for data
storage and scratchpad operations in the user’s
application. Any read of an unimplemented location will
read as ‘0’s.
The instruction set and architecture allow operations
across all banks. The entire data memory may be
accessed by Direct, Indirect or Indexed Addressing
modes. Addressing modes are discussed later in this
section.
To ensure that commonly used registers (select SFRs
and select GPRs) can be accessed in a single cycle,
PIC18 devices implement an Access Bank. This is a
256-byte memory space that provides fast access to
select SFRs and the lower portion of GPR Bank 0 with-
out using the BSR. Section 6.3.2 “Access Bank”
provides a detailed description of the Access RAM.
6.3.1 BANK SELECT REGISTER
Large areas of data memory require an efficient
addressing scheme to make rapid access to any
address possible. Ideally, this means that an entire
address does not need to be provided for each read or
write operation. For PIC18 devices, this is accom-
plished with a RAM banking scheme. This divides the
memory space into 16 contiguous banks of 256 bytes.
Depending on the instruction, each location can be
addressed directly by its full 12-bit address, or an 8-bit
low-order address and a 4-bit Bank Pointer.
Most instructions in the PIC18 instruction set make use
of the Bank Pointer, known as the Bank Select Register
(BSR). This SFR holds the 4 Most Significant bits of a
location’s address; the instruction itself includes the
8 Least Significant bits. Only the four lower bits of the
BSR are implemented (BSR<3:0>). The upper four bits
are unused; they will always read ‘0’ and cannot be
written to. The BSR can be loaded directly by using the
MOVLB instruction.
The value of the BSR indicates the bank in data
memory. The 8 bits in the instruction show the location
in the bank and can be thought of as an offset from the
bank’s lower boundary. The relationship between the
BSR’s value and the bank division in data memory is
shown in Figure 6-7.
Since up to 16 registers may share the same low-order
address, the user must always be careful to ensure that
the proper bank is selected before performing a data
read or write. For example, writing what should be
program data to an 8-bit address of F9h while the BSR
is 0Fh, will end up resetting the program counter.
While any bank can be selected, only those banks that
are actually implemented can be read or written to.
Writes to unimplemented banks are ignored, while
reads from unimplemented banks will return ‘0’s. Even
so, the STATUS register will still be affected as if the
operation was successful. The data memory map in
Figure 6-6 indicates which banks are implemented.
In the core PIC18 instruction set, only the MOVFF
instruction fully specifies the 12-bit address of the
source and target registers. This instruction ignores the
BSR completely when it executes. All other instructions
include only the low-order address as an operand and
must use either the BSR or the Access Bank to locate
their target registers.
Note: The operation of some aspects of data
memory are changed when the PIC18
extended instruction set is enabled. See
Section 6.6 “Data Memory and the
Extended Instruction Set” for more
information.
2010 Microchip Technology Inc. Preliminary DS39979A-page 63
PIC18F87J72 FAMILY
FIGURE 6-6: DATA MEMORY MAP FOR PIC18F86J72 AND PIC18F87J72 DEVICES
00h
5Fh
60h
FFh
Access Bank
When a = 0:
The BSR is ignored and the
Access Bank is used.
The first 96 bytes are general
purpose RAM (from Bank 0).
The second 160 bytes are
Special Function Registers
(from Bank 15).
When a = 1:
The BSR specifies the bank
used by the instruction.
Access RAM High
Access RAM Low
(SFRs)
Bank 0
Bank 1
Bank 14
Bank 15
Data Memory Map
BSR<3:0>
= 0000
= 0001
= 1111
060h
05Fh
F60h
FFFh
F5Fh
F00h
EFFh
1FFh
100h
0FFh
000h
Access RAM
FFh
00h
FFh
00h
FFh
00h
GPR
GPR
SFR
Bank 2
= 0010
2FFh
200h
Bank 3
FFh
00h
GPR
FFh
= 0011
GPR(1)
GPR
GPR
GPR
GPR
GPR
4FFh
400h
5FFh
500h
3FFh
300h
FFh
00h
FFh
00h
FFh
00h
FFh
00h
FFh
00h
00h
= 0110
= 0111
= 0101
= 0100 Bank 4
Bank 5
Bank 6
Bank 7
Bank 8
= 1110
6FFh
600h
7FFh
700h
800h
Bank 9
Bank 10
Bank 11
Bank 12
Bank 13
8FFh
900h
9FFh
A00h
AFFh
B00h
BFFh
C00h
CFFh
D00h
DFFh
E00h
FFh
00h
FFh
00h
FFh
00h
FFh
00h
FFh
00h
FFh
00h
GPR
GPR
GPR
GPR
GPR
GPR
GPR
Note 1: Addresses, F5Ah through F5Fh, are also used by SFRs, but are not part of the Access RAM. Users
must always use the complete address, or load the proper SBR value, to access these registers.
= 1000
= 1001
= 1010
= 1011
= 1100
= 1101
PIC18F87J72 FAMILY
DS39979A-page 64 Preliminary 2010 Microchip Technology Inc.
FIGURE 6-7: USE OF THE BANK SELECT REGISTER (DIRECT ADDRESSING)
6.3.2 ACCESS BANK
While the use of the BSR with an embedded 8-bit
address allows users to address the entire range of data
memory, it also means that the user must always ensure
that the correct bank is selected. Otherwise, data may
be read from, or written to, the wrong location. This can
be disastrous if a GPR is the intended target of an oper-
ation, but an SFR is written to instead. Verifying and/or
changing the BSR for each read or write to data memory
can become very inefficient.
To streamline access for the most commonly used data
memory locations, the data memory is configured with
an Access Bank, which allows users to access a
mapped block of memory without specifying a BSR.
The Access Bank consists of the first 96 bytes of
memory (00h-5Fh) in Bank 0 and the last 160 bytes of
memory (60h-FFh) in Bank 15. The lower half is known
as the “Access RAM” and is composed of GPRs. The
upper half is where the device’s SFRs are mapped.
These two areas are mapped contiguously in the
Access Bank and can be addressed in a linear fashion
by an 8-bit address (Figure 6-6).
The Access Bank is used by core PIC18 instructions
that include the Access RAM bit (the ‘a’ parameter in
the instruction). When ‘a’ is equal to ‘1’, the instruction
uses the BSR and the 8-bit address included in the
opcode for the data memory address. When ‘a’ is ‘0’,
however, the instruction is forced to use the Access
Bank address map; the current value of the BSR is
ignored entirely.
Using this “forced” addressing allows the instruction to
operate on a data address in a single cycle without
updating the BSR first. For 8-bit addresses of 60h and
above, this means that users can evaluate and operate
on SFRs more efficiently. The Access RAM below 60h
is a good place for data values that the user might need
to access rapidly, such as immediate computational
results or common program variables. Access RAM
also allows for faster and more code efficient context
saving and switching of variables.
The mapping of the Access Bank is slightly different
when the extended instruction set is enabled (XINST
Configuration bit = 1). This is discussed in more detail
in Section 6.6.3 “Mapping the Access Bank in
Indexed Literal Offset Mode”.
6.3.3 GENERAL PURPOSE
REGISTER FILE
PIC18 devices may have banked memory in the GPR
area. This is data RAM which is available for use by all
instructions. GPRs start at the bottom of Bank 0
(address 000h) and grow upwards towards the bottom of
the SFR area. GPRs are not initialized by a Power-on
Reset and are unchanged on all other Resets.
Note 1: The Access RAM bit of the instruction can be used to force an override of the selected bank (BSR<3:0>)
to the registers of the Access Bank.
2: The MOVFF instruction embeds the entire 12-bit address in the instruction.
Data Memory
Bank Select(2)
70
From Opcode(2)
0000
000h
100h
200h
300h
F00h
E00h
FFFh
Bank 0
Bank 1
Bank 2
Bank 14
Bank 15
00h
FFh
00h
FFh
00h
FFh
00h
FFh
00h
FFh
00h
FFh
Bank 3
through
Bank 13
0010 11111111
70
BSR(1)
11111111
2010 Microchip Technology Inc. Preliminary DS39979A-page 65
PIC18F87J72 FAMILY
6.3.4 SPECIAL FUNCTION REGISTERS
The Special Function Registers (SFRs) are registers
used by the CPU and peripheral modules for controlling
the desired operation of the device. These registers are
implemented as static RAM. SFRs start at the top of
data memory (FFFh) and extend downward to occupy
more than the top half of Bank 15 (F60h to FFFh). A list
of these registers is given in Table 6-2 and Table 6-3.
The SFRs can be classified into two sets: those
associated with the “core” device functionality (ALU,
Resets and interrupts) and those related to the
peripheral functions. The Reset and Interrupt registers
are described in their respective chapters, while the
ALU’s STATUS register is described later in this section.
Registers related to the operation of the peripheral
features are described in the chapter for that peripheral.
The SFRs are typically distributed among the
peripherals whose functions they control. Unused SFR
locations are unimplemented and read as ‘0’s.
TABLE 6-2: SPECIAL FUNCTION REGISTER MAP FOR PIC18F87J72 FAMILY DEVICES
Addr. Name Addr. Name Addr. Name Addr. Name Addr. Name Addr. Name
FFFh TOSU FDFh INDF2(1) FBFh LCDDATA4 F9Fh IPR1 F7Fh SPBRGH1 F5Fh RTCCFG
FFEh TOSH FDEh POSTINC2(1) FBEh LCDDATA3 F9Eh PIR1 F7Eh BAUDCON1 F5Eh RTCCAL
FFDh TOSL FDDh POSTDEC2(1) FBDh LCDDATA2 F9Dh PIE1 F7Dh (2) F5Dh RTCVALH
FFCh STKPTR FDCh PREINC2(1) FBCh LCDDATA1 F9Ch (2) F7Ch
LCDDATA22
F5Ch RTCVALL
FFBh PCLATU FDBh PLUSW2(1) FBBh LCDDATA0 F9Bh OSCTUNE F7Bh
LCDDATA21
F5Bh ALRMCFG
FFAh PCLATH FDAh FSR2H FBAh (2) F9Ah TRISJ F7Ah
LCDDATA20
F5Ah ALRMRPT
FF9h PCL FD9h FSR2L FB9h LCDSE4 F99h TRISH F79h
LCDDATA19
F59h ALRMVALH
FF8h TBLPTRU FD8h STATUS FB8h LCDSE3 F98h TRISG F78h
LCDDATA18
F58h ALRMVALL
FF7h TBLPTRH FD7h TMR0H FB7h LCDSE2 F97h TRISF F77h (2) F57h CTMUCONH
FF6h TBLPTRL FD6h TMR0L FB6h LCDSE1 F96h TRISE F76h
LCDDATA16
F56h CTMUCONL
FF5h TABLAT FD5h T0CON FB5h CVRCON F95h TRISD F75h
LCDDATA15
F55h CTMUICONH
FF4h PRODH FD4h (2) FB4h CMCON F94h TRISC F74h
LCDDATA14
F54h PADCFG1
FF3h PRODL FD3h OSCCON FB3h TMR3H F93h TRISB F73h
LCDDATA13
FF2h INTCON FD2h LCDREG FB2h TMR3L F92h TRISA F72h
LCDDATA12
FF1h INTCON2 FD1h WDTCON FB1h T3CON F91h LATJ F71h (2)
FF0h INTCON3 FD0h RCON FB0h (2) F90h LATH F70h
LCDDATA10
FEFh INDF0(1) FCFh TMR1H FAFh SPBRG1 F8Fh LATG F6Fh LCDDATA9
FEEh POSTINC0(1) FCEh TMR1L FAEh RCREG1 F8Eh LATF F6Eh LCDDATA8
FEDh POSTDEC0(1) FCDh T1CON FADh TXREG1 F8Dh LATE F6Dh LCDDATA7
FECh PREINC0(1) FCCh TMR2 FACh TXSTA1 F8Ch LATD F6Ch LCDDATA6
FEBh PLUSW0(1) FCBh PR2 FABh RCSTA1 F8Bh LATC F6Bh (2)
FEAh FSR0H FCAh T2CON FAAh LCDPS F8Ah LATB F6Ah CCPR1H
FE9h FSR0L FC9h SSPBUF FA9h LCDSE0 F89h LATA F69h CCPR1L
FE8h WREG FC8h SSPADD FA8h LCDCON F88h PORTJ F68h CCP1CON
FE7h INDF1(1) FC7h SSPSTAT FA7h EECON2 F87h PORTH F67h CCPR2H
FE6h POSTINC1(1) FC6h SSPCON1 FA6h EECON1 F86h PORTG F66h CCPR2L
FE5h POSTDEC1(1) FC5h SSPCON2 FA5h IPR3 F85h PORTF F65h CCP2CON
FE4h PREINC1(1) FC4h ADRESH FA4h PIR3 F84h PORTE F64h SPBRG2
FE3h PLUSW1(1) FC3h ADRESL FA3h PIE3 F83h PORTD F63h RCREG2
FE2h FSR1H FC2h ADCON0 FA2h IPR2 F82h PORTC F62h TXREG2
FE1h FSR1L FC1h ADCON1 FA1h PIR2 F81h PORTB F61h TXSTA2
FE0h BSR FC0h ADCON2 FA0h PIE2 F80h PORTA F60h RCSTA2
Note 1: This is not a physical register.
2: Unimplemented registers are read as ‘0’.
PIC18F87J72 FAMILY
DS39979A-page 66 Preliminary 2010 Microchip Technology Inc.
TABLE 6-3: PIC18F87J72 FAMILY REGISTER FILE SUMMARY
File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Details on
page
TOSU Top-of-Stack Upper Byte (TOS<20:16>)
---0 0000
49, 57
TOSH Top-of-Stack High Byte (TOS<15:8>)
0000 0000
49, 57
TOSL Top-of-Stack Low Byte (TOS<7:0>)
0000 0000
49, 57
STKPTR STKFUL STKUNF Return Stack Pointer
uu-0 0000
49, 58
PCLATU —bit 21
(1)
Holding Register for PC<20:16>
---0 0000
49, 57
PCLATH Holding Register for PC<15:8>
0000 0000
49, 57
PCL PC Low Byte (PC<7:0>)
0000 0000
49, 57
TBLPTRU bit 21 Program Memory Table Pointer Upper Byte (TBLPTR<20:16>)
--00 0000
49, 80
TBLPTRH Program Memory Table Pointer High Byte (TBLPTR<15:8>)
0000 0000
49, 80
TBLPTRL Program Memory Table Pointer Low Byte (TBLPTR<7:0>)
0000 0000
49, 80
TABLAT Program Memory Table Latch
0000 0000
49, 80
PRODH Product Register High Byte
xxxx xxxx
49, 87
PRODL Product Register Low Byte
xxxx xxxx
49, 87
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF
0000 000x
49, 91
INTCON2 RBPU INTEDG0 INTEDG1 INTEDG2 INTEDG3 TMR0IP INT3IP RBIP
1111 1111
49, 92
INTCON3 INT2IP INT1IP INT3IE INT2IE INT1IE INT3IF INT2IF INT1IF
1100 0000
49, 93
INDF0 Uses contents of FSR0 to address data memory – value of FSR0 not changed (not a physical register) N/A 49, 72
POSTINC0 Uses contents of FSR0 to address data memory – value of FSR0 post-incremented (not a physical register) N/A 49, 73
POSTDEC0 Uses contents of FSR0 to address data memory – value of FSR0 post-decremented (not a physical register) N/A 49, 73
PREINC0 Uses contents of FSR0 to address data memory – value of FSR0 pre-incremented (not a physical register) N/A 49, 73
PLUSW0 Uses contents of FSR0 to address data memory – value of FSR0 pre-incremented (not a physical register) –
value of FSR0 offset by W
N/A 49, 73
FSR0H ——— Indirect Data Memory Address Pointer 0 High Byte
---- xxxx
49, 72
FSR0L Indirect Data Memory Address Pointer 0 Low Byte
xxxx xxxx
49, 72
WREG Working Register
xxxx xxxx
49
INDF1 Uses contents of FSR1 to address data memory – value of FSR1 not changed (not a physical register) N/A 49, 72
POSTINC1 Uses contents of FSR1 to address data memory – value of FSR1 post-incremented (not a physical register) N/A 49, 73
POSTDEC1 Uses contents of FSR1 to address data memory – value of FSR1 post-decremented (not a physical register) N/A 49, 73
PREINC1 Uses contents of FSR1 to address data memory – value of FSR1 pre-incremented (not a physical register) N/A 49, 73
PLUSW1 Uses contents of FSR1 to address data memory – value of FSR1 pre-incremented (not a physical register) –
value of FSR1 offset by W
N/A 49, 73
FSR1H ——— Indirect Data Memory Address Pointer 1 High Byte
---- xxxx
50, 72
FSR1L Indirect Data Memory Address Pointer 1 Low Byte
xxxx xxxx
50, 72
BSR ——— Bank Select Register
---- 0000
50, 62
INDF2 Uses contents of FSR2 to address data memory – value of FSR2 not changed (not a physical register) N/A 50, 72
POSTINC2 Uses contents of FSR2 to address data memory – value of FSR2 post-incremented (not a physical register) N/A 50, 73
POSTDEC2 Uses contents of FSR2 to address data memory – value of FSR2 post-decremented (not a physical register) N/A 50, 73
PREINC2 Uses contents of FSR2 to address data memory – value of FSR2 pre-incremented (not a physical register) N/A 50, 73
PLUSW2 Uses contents of FSR2 to address data memory – value of FSR2 pre-incremented (not a physical register) –
value of FSR2 offset by W
N/A 50, 73
FSR2H ——— Indirect Data Memory Address Pointer 2 High Byte
---- xxxx
50, 72
FSR2L Indirect Data Memory Address Pointer 2 Low Byte
xxxx xxxx
50, 72
STATUS —NOVZDCC
---x xxxx
50, 70
Legend:
x
= unknown,
u
= unchanged,
-
= unimplemented,
q
= value depends on condition,
r
= reserved, do not modify
Note 1:
Bit 21 of the PC is only available in Test mode and Serial Programming modes.
2:
Alternate names and definitions for these bits when the MSSP module is operating in I
2
C™ Slave mode. See
Section 18.4.3.2 “Address
Masking”
for details.
3:
The PLLEN bit is only available in specific oscillator configurations; otherwise, it is disabled and reads as ‘
0
’. See
Section 3.4.3 “PLL
Frequency Multiplier”
for details.
4:
RA<7:6> and their associated latch and direction bits are configured as port pins only when the internal oscillator is selected as the default
clock source (FOSC2 Configuration bit =
0
); otherwise, they are disabled and these bits read as ‘
0
’.
2010 Microchip Technology Inc. Preliminary DS39979A-page 67
PIC18F87J72 FAMILY
TMR0H Timer0 Register High Byte
0000 0000
50, 125
TMR0L Timer0 Register Low Byte
xxxx xxxx
50, 125
T0CON TMR0ON T08BIT T0CS T0SE PSA T0PS2 T0PS1 T0PS0
1111 1111
50, 123
OSCCON IDLEN IRCF2 IRCF1 IRCF0 OSTS IOFS SCS1 SCS0
0110 q000
26, 50
LCDREG CPEN BIAS2 BIAS1 BIAS0 MODE13 CKSEL1 CKSEL0
-011 1100
50, 173
WDTCON REGSLP ——————SWDTEN
0--- ---0
50, 326
RCON IPEN —CMRI TO PD POR BOR
0-11 11q0
44, 50
TMR1H Timer1 Register High Byte
xxxx xxxx
50, 131
TMR1L Timer1 Register Low Byte
xxxx xxxx
50, 131
T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON
0000 0000
50, 127
TMR2 Timer2 Register
0000 0000
50, 134
PR2 Timer2 Period Register
1111 1111
50, 134
T2CON T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0
-000 0000
50, 133
SSPBUF MSSP Receive Buffer/Transmit Register
xxxx xxxx
50, 203,
238
SSPADD MSSP Address Register in I
2
C™ Slave mode. MSSP1 Baud Rate Reload Register in I
2
C Master mode.
0000 0000
50, 238
SSPSTAT SMP CKE D/A PSR/WUA BF
0000 0000
50, 196,
205
SSPCON1 WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0
0000 0000
50, 197,
206
SSPCON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN
0000 0000
50, 207,
208
GCEN ACKSTAT ADMSK5
(2)
ADMSK4
(2)
ADMSK3
(2)
ADMSK2
(2)
ADMSK1
(2)
SEN
ADRESH A/D Result Register High Byte
xxxx xxxx
51, 281
ADRESL A/D Result Register Low Byte
xxxx xxxx
51, 281
ADCON0 ADCAL CHS3 CHS2 CHS1 CHS0 GO/DONE ADON
0-00 0000
51, 273
ADCON1 TRIGSEL VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0
0-00 0000
51, 274
ADCON2 ADFM ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0
0-00 0000
51, 275
LCDDATA4 S32C0
xxxx xxxx
51, 171
LCDDATA3 S31C0 S30C0 S29C0 S28C0 S27C0 S26C0 S25C0 S24C0
xxxx xxxx
51, 171
LCDDATA2 S23C0 S22C0 S21C0 S20C0 S19C0 S18C0 S17C0 S16C0
xxxx xxxx
51, 171
LCDDATA1 S15C0 S14C0 S13C0 S12C0 S11C0 S10C0 S09C0 S08C0
xxxx xxxx
51, 171
LCDDATA0 S07C0 S06C0 S05C0 S04C0 S03C0 S02C0 S01C0 S00C0
xxxx xxxx
51, 171
LCDSE4 —SE32
0000 0000
51, 171
LCDSE3 SE31 SE30 SE29 SE28 SE27 SE26 SE25 SE24
0000 0000
51, 171
LCDSE2 SE23 SE22 SE21 SE20 SE19 SE18 SE17 SE16
0000 0000
51, 171
LCDSE1 SE15 SE14 SE13 SE12 SE11 SE10 SE09 SE08
0000 0000
51, 171
CVRCON CVREN CVROE CVRR CVRSS CVR3 CVR2 CVR1 CVR0
0000 0000
51, 299
CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0
0000 0111
51, 293
TMR3H Timer3 Register High Byte
xxxx xxxx
51, 137
TMR3L Timer3 Register Low Byte
xxxx xxxx
51, 137
T3CON RD16 T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON
0000 0000
51, 135
TABLE 6-3: PIC18F87J72 FAMILY REGISTER FILE SUMMARY (CONTINUED)
File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Details on
page
Legend:
x
= unknown,
u
= unchanged,
-
= unimplemented,
q
= value depends on condition,
r
= reserved, do not modify
Note 1:
Bit 21 of the PC is only available in Test mode and Serial Programming modes.
2:
Alternate names and definitions for these bits when the MSSP module is operating in I
2
C™ Slave mode. See
Section 18.4.3.2 “Address
Masking”
for details.
3:
The PLLEN bit is only available in specific oscillator configurations; otherwise, it is disabled and reads as ‘
0
’. See
Section 3.4.3 “PLL
Frequency Multiplier”
for details.
4:
RA<7:6> and their associated latch and direction bits are configured as port pins only when the internal oscillator is selected as the default
clock source (FOSC2 Configuration bit =
0
); otherwise, they are disabled and these bits read as ‘
0
’.
PIC18F87J72 FAMILY
DS39979A-page 68 Preliminary 2010 Microchip Technology Inc.
SPBRG1 EUSART Baud Rate Generator Low Byte
0000 0000
51, 243
RCREG1 EUSART Receive Register
0000 0000
51, 251
TXREG1 EUSART Transmit Register
0000 0000
51, 249
TXSTA1 CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D
0000 0010
51, 240
RCSTA1 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D
0000 000x
51, 241
LCDPS WFT BIASMD LCDA WA LP3 LP2 LP1 LP0
0000 0000
51, 169
LCDSE0 SE07 SE06 SE05 SE04 SE03 SE02 SE01 SE00
0000 0000
51, 170
LCDCON LCDEN SLPEN WERR CS1 CS0 LMUX1 LMUX0
000- 0000
51, 168
EECON2 EEPROM Control Register 2 (not a physical register)
---- ----
51, 78
EECON1 WPROG FREE WRERR WREN WR
--00 x00-
51, 78
IPR3 LCDIP RC2IP TX2IP CTMUIP CCP2IP CCP1IP RTCCIP
-111 1111
52, 102
PIR3 LCDIF RC2IF TX2IF CTMUIF CCP2IF CCP1IF RTCCIF
-000 0000
52, 96
PIE3 LCDIE RC2IE TX2IE CTMUIE CCP2IE CCP1IE RTCCIE
-000 0000
52, 99
IPR2 OSCFIP CMIP BCLIP LVDIP TMR3IP
11-- 111-
52, 101
PIR2 OSCFIF CMIF —BCLIFLVDIFTMR3IF
00-- 000-
52, 95
PIE2 OSCFIE CMIE BCLIE LVDIE TMR3IE
00-- 000-
52, 98
IPR1 ADIP RC1IP TX1IP SSPIP TMR2IP TMR1IP
-111 1-11
52, 100
PIR1 ADIF RC1IF TX1IF SSPIF TMR2IF TMR1IF
-000 0-00
52, 94
PIE1 ADIE RC1IE TX1IE SSPIE TMR2IE TMR1IE
-000 0-00
52, 97
OSCTUNE INTSRC PLLEN
(3)
TUN5 TUN4 TUN3 TUN2 TUN1 TUN0
0000 0000
27, 52
TRISG SPIOD CCP2OD CCP1OD TRISG4 TRISG3 TRISG2 TRISG1 TRISG0
0001 1111
52, 122
TRISF TRISF7TRISF6TRISF5TRISF4TRISF3TRISF2TRISF1
1111 111-
52, 120
TRISE TRISE7 TRISE6 TRISE5 TRISE4 TRISE3 TRISE1 TRISE0
1111 1-11
52, 117
TRISD TRISD7TRISD6TRISD5TRISD4TRISD3TRISD2TRISD1TRISD0
1111 1111
52, 115
TRISC TRISC7TRISC6TRISC5TRISC4TRISC3TRISC2TRISC1TRISC0
1111 1111
52, 113
TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0
1111 1111
52, 110
TRISA TRISA7
(4)
TRISA6
(4)
TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0
1111 1111
52, 107
LATG U2OD U1OD LATG4 LATG3 LATG2 LATG1 LATG0
00-x xxxx
52, 122
LATF LATF7 LATF6 LATF5 LATF4 LATF3 LATF2 LATF1
xxxx xxx-
52, 120
LATE LATE7 LATE6 LATE5 LATE4 LATE3 —LATE1LATE0
xxxx x-xx
52, 117
LATD LATD7 LATD6 LATD5 LATD4 LATD3 LATD2 LATD1 LATD0
xxxx xxxx
52, 115
LATC LATC7 LATC6 LATC5 LATC4 LATC3 LATC2 LATC1 LATC0
xxxx xxxx
52, 113
LATB LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0
xxxx xxxx
52, 110
LATA LATA7
(4)
LATA6
(4)
LATA5 LATA4 LATA3 LATA2 LATA1 LATA0
xxxx xxxx
52, 107
PORTG RDPU REPU RJPU
(2)
RG4RG3RG2RG1RG0
000x xxxx
52, 122
PORTF RF7 RF6 RF5 RF4 RF3 RF2 RF1
xxxx xxx-
52, 120
PORTE RE7 RE6 RE5 RE4 RE3 —RE1RE0
xxxx x-xx
52, 117
PORTD RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0
xxxx xxxx
52, 115
PORTC RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0
xxxx xxxx
52, 113
PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0
xxxx xxxx
52, 110
PORTA RA7
(4)
RA6
(4)
RA5RA4RA3RA2RA1RA0
xx0x 0000
52, 107
TABLE 6-3: PIC18F87J72 FAMILY REGISTER FILE SUMMARY (CONTINUED)
File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Details on
page
Legend:
x
= unknown,
u
= unchanged,
-
= unimplemented,
q
= value depends on condition,
r
= reserved, do not modify
Note 1:
Bit 21 of the PC is only available in Test mode and Serial Programming modes.
2:
Alternate names and definitions for these bits when the MSSP module is operating in I
2
C™ Slave mode. See
Section 18.4.3.2 “Address
Masking”
for details.
3:
The PLLEN bit is only available in specific oscillator configurations; otherwise, it is disabled and reads as ‘
0
’. See
Section 3.4.3 “PLL
Frequency Multiplier”
for details.
4:
RA<7:6> and their associated latch and direction bits are configured as port pins only when the internal oscillator is selected as the default
clock source (FOSC2 Configuration bit =
0
); otherwise, they are disabled and these bits read as ‘
0
’.
2010 Microchip Technology Inc. Preliminary DS39979A-page 69
PIC18F87J72 FAMILY
SPBRGH1 EUSART Baud Rate Generator High Byte
0000 0000
53, 243
BAUDCON1 ABDOVF RCMT RXDTP TXCKP BRG16 —WUEABDEN
0100 0-00
53, 242
LCDDATA22 S32C3
xxxx xxxx
53, 171
LCDDATA21 S31C3 S30C3 S29C3 S28C3 S27C3 S26C3 S25C3 S24C3
xxxx xxxx
53, 171
LCDDATA20 S23C3 S22C3 S21C3 S20C3 S19C3 S18C3 S17C3 S16C3
xxxx xxxx
53, 171
LCDDATA19 S15C3 S14C3 S13C3 S12C3 S11C3 S10C3 S09C3 S08C3
xxxx xxxx
53, 171
LCDDATA18 S07C3 S06C3 S05C3 S04C3 S03C3 S02C3 S01C3 S00C3
xxxx xxxx
53, 171
LCDDATA16 S32C2
xxxx xxxx
53, 171
LCDDATA15 S31C2 S30C2 S29C2 S28C2 S27C2 S26C2 S25C2 S24C2
xxxx xxxx
53, 171
LCDDATA14 S23C2 S22C2 S21C2 S20C2 S19C2 S18C2 S17C2 S16C2
xxxx xxxx
53, 171
LCDDATA13 S15C2 S14C2 S13C2 S12C2 S11C2 S10C2 S09C2 S08C2
xxxx xxxx
53, 171
LCDDATA12 S07C2 S06C2 S05C2 S04C2 S03C2 S02C2 S01C2 S00C2
xxxx xxxx
53, 171
LCDDATA10 S32C1
xxxx xxxx
53, 171
LCDDATA9 S31C1 S30C1 S29C1 S28C1 S27C1 S26C1 S25C1 S24C1
xxxx xxxx
53, 171
LCDDATA8 S23C1 S22C1 S21C1 S20C1 S19C1 S18C1 S17C1 S16C1
xxxx xxxx
53, 171
LCDDATA7 S15C1 S14C1 S13C1 S12C1 S11C1 S10C1 S09C1 S08C1
xxxx xxxx
53, 171
LCDDATA6 S07C1 S06C1 S05C1 S04C1 S03C1 S02C1 S01C1 S00C1
xxxx xxxx
53, 171
CCPR1H Capture/Compare/PWM Register 1 High Byte
xxxx xxxx
53, 158
CCPR1L Capture/Compare/PWM Register 1 Low Byte
xxxx xxxx
53, 158
CCP1CON DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0
--00 0000
53, 157
CCPR2H Capture/Compare/PWM Register 2 High Byte
xxxx xxxx
53, 158
CCPR2L Capture/Compare/PWM Register 2 Low Byte
xxxx xxxx
53, 158
CCP2CON DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0
--00 0000
53, 157
SPBRG2 AUSART Baud Rate Generator Register
0000 0000
54, 262
RCREG2 AUSART Receive Register
0000 0000
54, 267
TXREG2 AUSART Transmit Register
0000 0000
54, 265
TXSTA2 CSRC TX9 TXEN SYNC BRGH TRMT TX9D
0000 -010
54, 260
RCSTA2 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D
0000 000x
54, 261
RTCCFG RTCEN RTCWREN RTCSYNC HALFSEC RTCOE RTCPTR1 RTCPTR0
0-00 0000
54, 141
RTCCAL CAL7 CAL6 CAL5 CAL4 CAL3 CAL2 CAL1 CAL0
0000 0000
54, 142
RTCVALH RTCC Value High Register Window based on RTCPTR<1:0>
xxxx xxxx
54, 144
RTCVALL RTCC Value Low Register Window based on RTCPTR<1:0>
xxxx xxxx
54, 144
ALRMCFG ALRMEN CHIME AMASK3 AMASK2 AMASK1 AMASK0 ALRMPTR1 ALRMPTR0
0000 0000
54, 143
ALRMRPT ARPT7 ARPT6 ARPT5 ARPT4 ARPT3 ARPT2 ARPT1 ARPT0
0000 0000
54, 144
ALRMVALH Alarm Value High Register Window based on ALRMPTR<1:0>
xxxx xxxx
54, 147
ALRMVALL Alarm Value Low Register Window based on ALRMPTR<1:0>
xxxx xxxx
54, 147
CTMUCONH CTMUEN CTMUSIDL TGEN EDGEN EDGSEQEN IDISSEN CTTRIG
0-00 0000
54, 315
CTMUCONL EDG2POL EDG2SEL1 EDG2SEL0 EDG1POL EDG1SEL1 EDG1SEL0 EDG2STAT EDG1STAT
0000 0000
54, 316
CTMUICON ITRIM5 ITRIM4 ITRIM3 ITRIM2 ITRIM1 ITRIM0 IRNG1 IRNG0
0000 0000
54, 317
PADCFG1 RTSECSEL1 RTSECSEL0
---- -00-
54, 142
TABLE 6-3: PIC18F87J72 FAMILY REGISTER FILE SUMMARY (CONTINUED)
File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Details on
page
Legend:
x
= unknown,
u
= unchanged,
-
= unimplemented,
q
= value depends on condition,
r
= reserved, do not modify
Note 1:
Bit 21 of the PC is only available in Test mode and Serial Programming modes.
2:
Alternate names and definitions for these bits when the MSSP module is operating in I
2
C™ Slave mode. See
Section 18.4.3.2 “Address
Masking”
for details.
3:
The PLLEN bit is only available in specific oscillator configurations; otherwise, it is disabled and reads as ‘
0
’. See
Section 3.4.3 “PLL
Frequency Multiplier”
for details.
4:
RA<7:6> and their associated latch and direction bits are configured as port pins only when the internal oscillator is selected as the default
clock source (FOSC2 Configuration bit =
0
); otherwise, they are disabled and these bits read as ‘
0
’.
PIC18F87J72 FAMILY
DS39979A-page 70 Preliminary 2010 Microchip Technology Inc.
6.3.5 STATUS REGISTER
The STATUS register, shown in Register 6-2, contains
the arithmetic status of the ALU. The STATUS register
can be the operand for any instruction, as with any
other register. If the STATUS register is the destination
for an instruction that affects the Z, DC, C, OV or N bits,
then the write to these five bits is disabled.
These bits are set or cleared according to the device
logic. Therefore, the result of an instruction with the
STATUS register as destination may be different than
intended. For example, CLRF STATUS will set the Z bit
but leave the other bits unchanged. The STATUS
register then reads back as ‘000u u1uu. It is recom-
mended, therefore, that only BCF, BSF, SWAPF,
MOVFF and MOVWF instructions are used to alter the
STATUS register because these instructions do not
affect the Z, C, DC, OV or N bits in the STATUS
register.
For other instructions not affecting any Status bits, see
the instruction set summaries in Table 27-2 and
Table 27-3.
Note: The C and DC bits operate as a borrow and
digit borrow bit respectively, in subtraction.
REGISTER 6-2: STATUS REGISTER
U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x
—NOVZDC
(1) C(2)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-5 Unimplemented: Read as0
bit 4 N: Negative bit
This bit is used for signed arithmetic (2’s complement). It indicates whether the result was
negative (ALU MSB = 1).
1 = Result was negative
0 = Result was positive
bit 3 OV: Overflow bit
This bit is used for signed arithmetic (2’s complement). It indicates an overflow of the
7-bit magnitude which causes the sign bit (bit 7) to change state.
1 = Overflow occurred for signed arithmetic (in this arithmetic operation)
0 = No overflow occurred
bit 2 Z: Zero bit
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
bit 1 DC: Digit Carry/Borrow bit(1)
For ADDWF, ADDLW, SUBLW and SUBWF instructions:
1 = A carry-out from the 4th low-order bit of the result occurred
0 = No carry-out from the 4th low-order bit of the result
bit 0 C: Carry/Borrow bit(2)
For ADDWF, ADDLW, SUBLW and SUBWF instructions:
1 = A carry-out from the Most Significant bit of the result occurred
0 = No carry-out from the Most Significant bit of the result occurred
Note 1: For borrow, the polarity is reversed. A subtraction is executed by adding the 2’s complement of the second
operand. For rotate (RRF, RLF) instructions, this bit is loaded with either bit 4 or bit 3 of the source register.
2: For borrow, the polarity is reversed. A subtraction is executed by adding the 2s complement of the second
operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high or low-order bit of the
source register.
2010 Microchip Technology Inc. Preliminary DS39979A-page 71
PIC18F87J72 FAMILY
6.4 Data Addressing Modes
While the program memory can be addressed in only
one way – through the program counter – information
in the data memory space can be addressed in several
ways. For most instructions, the addressing mode is
fixed. Other instructions may use up to three modes,
depending on which operands are used and whether or
not the extended instruction set is enabled.
The addressing modes are:
Inherent
Literal
•Direct
•Indirect
An additional addressing mode, Indexed Literal Offset,
is available when the extended instruction set is
enabled (XINST Configuration bit = 1). Its operation is
discussed in greater detail in Section 6.6.1 “Indexed
Addressing with Literal Offset”.
6.4.1 INHERENT AND LITERAL
ADDRESSING
Many PIC18 control instructions do not need any
argument at all; they either perform an operation that
globally affects the device, or they operate implicitly on
one register. This addressing mode is known as Inherent
Addressing. Examples include SLEEP, RESET and DAW.
Other instructions work in a similar way, but require an
additional explicit argument in the opcode. This is
known as Literal Addressing mode, because they
require some literal value as an argument. Examples
include ADDLW and MOVLW, which respectively, add or
move a literal value to the W register. Other examples
include CALL and GOTO, which include a 20-bit
program memory address.
6.4.2 DIRECT ADDRESSING
Direct Addressing specifies all or part of the source
and/or destination address of the operation within the
opcode itself. The options are specified by the
arguments accompanying the instruction.
In the core PIC18 instruction set, bit-oriented and
byte-oriented instructions use some version of Direct
Addressing by default. All of these instructions include
some 8-bit literal address as their Least Significant
Byte. This address specifies either a register address in
one of the banks of data RAM (Section 6.3.3 “General
Purpose Register File”) or a location in the Access
Bank (Section 6.3.2 “Access Bank”) as the data
source for the instruction.
The Access RAM bit, ‘a’, determines how the address
is interpreted. When ‘a’ is ‘1’, the contents of the BSR
(Section 6.3.1 “Bank Select Register”) are used with
the address to determine the complete 12-bit address
of the register. When ‘a’ is ‘0’, the address is interpreted
as being a register in the Access Bank. Addressing that
uses the Access RAM is sometimes also known as
Direct Forced Addressing mode.
A few instructions, such as MOVFF, include the entire
12-bit address (either source or destination) in their
opcodes. In these cases, the BSR is ignored entirely.
The destination of the operation’s results is determined
by the destination bit, ‘d’. When ‘d’ is ‘1’, the results are
stored back in the source register, overwriting its origi-
nal contents. When ‘d’ is0’, the results are stored in
the W register. Instructions without the ‘d’ argument
have a destination that is implicit in the instruction; their
destination is either the target register being operated
on or the W register.
6.4.3 INDIRECT ADDRESSING
Indirect Addressing allows the user to access a location
in data memory without giving a fixed address in the
instruction. This is done by using File Select Registers
(FSRs) as pointers to the locations to be read or written
to. Since the FSRs are themselves located in RAM as
Special Function Registers, they can also be directly
manipulated under program control. This makes FSRs
very useful in implementing data structures such as
tables and arrays in data memory.
The registers for Indirect Addressing are also
implemented with Indirect File Operands (INDFs) that
permit automatic manipulation of the pointer value with
auto-incrementing, auto-decrementing or offsetting
with another value. This allows for efficient code using
loops, such as the example of clearing an entire RAM
bank in Example 6-5. It also enables users to perform
Indexed Addressing and other Stack Pointer
operations for program memory in data memory.
EXAMPLE 6-5: HOW TO CLEAR RAM
(BANK 1) USING INDIRECT
ADDRESSING
Note: The execution of some instructions in the
core PIC18 instruction set are changed
when the PIC18 extended instruction set is
enabled. See Section 6.6 “Data Memory
and the Extended Instruction Set” for
more information.
LFSR FSR0, 100h ;
NEXT CLRF POSTINC0 ; Clear INDF
; register then
; inc pointer
BTFSS FSR0H, 1 ; All done with
; Bank1?
BRA NEXT ; NO, clear next
CONTINUE ; YES, continue
PIC18F87J72 FAMILY
DS39979A-page 72 Preliminary 2010 Microchip Technology Inc.
6.4.3.1 FSR Registers and the
INDF Operand
At the core of Indirect Addressing are three sets of
registers: FSR0, FSR1 and FSR2. Each represents a
pair of 8-bit registers, FSRnH and FSRnL. The four
upper bits of the FSRnH register are not used, so each
FSR pair holds a 12-bit value. This represents a value
that can address the entire range of the data memory
in a linear fashion. The FSR register pairs, then, serve
as pointers to data memory locations.
Indirect Addressing is accomplished with a set of Indi-
rect File Operands, INDF0 through INDF2. These can
be thought of as “virtual” registers: they are mapped in
the SFR space but are not physically implemented.
Reading or writing to a particular INDF register actually
accesses its corresponding FSR register pair. A read
from INDF1, for example, reads the data at the address
indicated by FSR1H:FSR1L. Instructions that use the
INDF registers as operands actually use the contents
of their corresponding FSR as a pointer to the instruc-
tion’s target. The INDF operand is just a convenient
way of using the pointer.
Because Indirect Addressing uses a full 12-bit address,
data RAM banking is not necessary. Thus, the current
contents of the BSR and the Access RAM bit have no
effect on determining the target address.
FIGURE 6-8: INDIRECT ADDRESSING
FSR1H:FSR1L
0
7
Data Memory
000h
100h
200h
300h
F00h
E00h
FFFh
Bank 0
Bank 1
Bank 2
Bank 14
Bank 15
Bank 3
through
Bank 13
ADDWF, INDF1, 1
07
Using an instruction with one of the
Indirect Addressing registers as the
operand....
...uses the 12-bit address stored in
the FSR pair associated with that
register....
...to determine the data memory
location to be used in that operation.
In this case, the FSR1 pair contains
FCCh. This means the contents of
location, FCCh, will be added to that
of the W register and stored back in
FCCh.
xxxx1111 11001100
2010 Microchip Technology Inc. Preliminary DS39979A-page 73
PIC18F87J72 FAMILY
6.4.3.2 FSR Registers and POSTINC,
POSTDEC, PREINC and PLUSW
In addition to the INDF operand, each FSR register pair
also has four additional indirect operands. Like INDF,
these are “virtual” registers that cannot be indirectly
read or written to. Accessing these registers actually
accesses the associated FSR register pair, but also
performs a specific action on its stored value. They are:
POSTDEC: accesses the FSR value, then
automatically decrements it by ‘1’ afterwards
POSTINC: accesses the FSR value, then
automatically increments it by ‘1’ afterwards
PREINC: increments the FSR value by ‘1’, then
uses it in the operation
PLUSW: adds the signed value of the W register
(range of -127 to 128) to that of the FSR and uses
the new value in the operation
In this context, accessing an INDF register uses the
value in the FSR registers without changing them.
Similarly, accessing a PLUSW register gives the FSR
value offset by the value in the W register; neither value
is actually changed in the operation. Accessing the
other virtual registers changes the value of the FSR
registers.
Operations on the FSRs with POSTDEC, POSTINC
and PREINC affect the entire register pair; that is, roll-
overs of the FSRnL register from FFh to 00h carry over
to the FSRnH register. On the other hand, results of
these operations do not change the value of any flags
in the STATUS register (e.g., Z, N, OV, etc.).
The PLUSW register can be used to implement a form
of Indexed Addressing in the data memory space. By
manipulating the value in the W register, users can
reach addresses that are fixed offsets from pointer
addresses. In some applications, this can be used to
implement some powerful program control structure,
such as software stacks, inside of data memory.
6.4.3.3 Operations by FSRs on FSRs
Indirect Addressing operations that target other FSRs
or virtual registers represent special cases. For
example, using an FSR to point to one of the virtual
registers will not result in successful operations. As a
specific case, assume that the FSR0H:FSR0L regis-
ters contain FE7h, the address of INDF1. Attempts to
read the value of the INDF1, using INDF0 as an
operand, will return 00h. Attempts to write to INDF1,
using INDF0 as the operand, will result in a NOP.
On the other hand, using the virtual registers to write to
an FSR pair may not occur as planned. In these cases,
the value will be written to the FSR pair but without any
incrementing or decrementing. Thus, writing to INDF2
or POSTDEC2 will write the same value to the
FSR2H:FSR2L.
Since the FSRs are physical registers mapped in the
SFR space, they can be manipulated through all direct
operations. Users should proceed cautiously when
working on these registers, particularly if their code
uses Indirect Addressing.
Similarly, operations by Indirect Addressing are gener-
ally permitted on all other SFRs. Users should exercise
the appropriate caution that they do not inadvertently
change settings that might affect the operation of the
device.
6.5 Program Memory and the
Extended Instruction Set
The operation of program memory is unaffected by the
use of the extended instruction set.
Enabling the extended instruction set adds five
additional two-word commands to the existing PIC18
instruction set: ADDFSR, CALLW, MOVSF, MOVSS and
SUBFSR. These instructions are executed as described
in Section 6.2.4 “Two-Word Instructions”.
PIC18F87J72 FAMILY
DS39979A-page 74 Preliminary 2010 Microchip Technology Inc.
6.6 Data Memory and the Extended
Instruction Set
Enabling the PIC18 extended instruction set (XINST
Configuration bit = 1) significantly changes certain
aspects of data memory and its addressing. Specifically,
the use of the Access Bank for many of the core PIC18
instructions is different. This is due to the introduction of
a new addressing mode for the data memory space.
This mode also alters the behavior of Indirect
Addressing using FSR2 and its associated operands.
What does not change is just as important. The size of
the data memory space is unchanged, as well as its
linear addressing. The SFR map remains the same.
Core PIC18 instructions can still operate in both Direct
and Indirect Addressing mode; inherent and literal
instructions do not change at all. Indirect Addressing
with FSR0 and FSR1 also remains unchanged.
6.6.1 INDEXED ADDRESSING WITH
LITERAL OFFSET
Enabling the PIC18 extended instruction set changes
the behavior of Indirect Addressing using the FSR2
register pair and its associated file operands. Under the
proper conditions, instructions that use the Access
Bank – that is, most bit-oriented and byte-oriented
instructions – can invoke a form of Indexed Addressing
using an offset specified in the instruction. This special
addressing mode is known as Indexed Addressing with
Literal Offset, or Indexed Literal Offset mode.
When using the extended instruction set, this
addressing mode requires the following:
The use of the Access Bank is forced (‘a’ = 0);
and
The file address argument is less than or equal to
5Fh.
Under these conditions, the file address of the
instruction is not interpreted as the lower byte of an
address (used with the BSR in Direct Addressing) or as
an 8-bit address in the Access Bank. Instead, the value
is interpreted as an offset value to an Address Pointer
specified by FSR2. The offset and the contents of FSR2
are added to obtain the target address of the operation.
6.6.2 INSTRUCTIONS AFFECTED BY
INDEXED LITERAL OFFSET MODE
Any of the core PIC18 instructions that can use Direct
Addressing are potentially affected by the Indexed
Literal Offset Addressing mode. This includes all
byte-oriented and bit-oriented instructions, or almost
one-half of the standard PIC18 instruction set. Instruc-
tions that only use Inherent or Literal Addressing
modes are unaffected.
Additionally, byte-oriented and bit-oriented instructions
are not affected if they use the Access Bank (Access
RAM bit is ‘1’) or include a file address of 60h or above.
Instructions meeting these criteria will continue to
execute as before. A comparison of the different
possible addressing modes when the extended
instruction set is enabled is shown in Figure 6-9.
Those who desire to use byte-oriented or bit-oriented
instructions in the Indexed Literal Offset mode should
note the changes to assembler syntax for this mode.
This is described in more detail in Section 27.2.1
“Extended Instruction Syntax”.
2010 Microchip Technology Inc. Preliminary DS39979A-page 75
PIC18F87J72 FAMILY
FIGURE 6-9: COMPARING ADDRESSING OPTIONS FOR BIT-ORIENTED AND BYTE-ORIENTED
INSTRUCTIONS (EXTENDED INSTRUCTION SET ENABLED)
EXAMPLE INSTRUCTION: ADDWF, f, d, a (Opcode: 0010 01da ffff ffff)
When a = 0 and f 60h:
The instruction executes in
Direct Forced mode. ‘f’ is
interpreted as a location in the
Access RAM between 060h
and FFFh. This is the same as
locations, F60h to FFFh
(Bank 15), of data memory.
Locations below 060h are not
available in this addressing
mode.
When a = 0 and f5Fh:
The instruction executes in
Indexed Literal Offset mode. ‘f’
is interpreted as an offset to the
address value in FSR2. The
two are added together to
obtain the address of the target
register for the instruction. The
address can be anywhere in
the data memory space.
Note that in this mode, the
correct syntax is now:
ADDWF [k], d
where ‘k’ is the same as ‘f’.
When a = 1 (all values of f):
The instruction executes in
Direct mode (also known as
Direct Long mode). ‘f’ is
interpreted as a location in
one of the 16 banks of the data
memory space. The bank is
designated by the Bank Select
Register (BSR). The address
can be in any implemented
bank in the data memory
space.
000h
060h
100h
F00h
F40h
FFFh
Vali d range
00h
60h
FFh
Data Memory
Access RAM
Bank 0
Bank 1
through
Bank 14
Bank 15
SFRs
000h
060h
100h
F00h
F40h
FFFh
Data Memory
Bank 0
Bank 1
through
Bank 14
Bank 15
SFRs
FSR2H FSR2L
ffffffff001001da
ffffffff001001da
000h
060h
100h
F00h
F40h
FFFh
Data Memory
Bank 0
Bank 1
through
Bank 14
Bank 15
SFRs
for ‘f’
BSR
00000000
PIC18F87J72 FAMILY
DS39979A-page 76 Preliminary 2010 Microchip Technology Inc.
6.6.3 MAPPING THE ACCESS BANK IN
INDEXED LITERAL OFFSET MODE
The use of Indexed Literal Offset Addressing mode
effectively changes how the lower part of Access RAM
(00h to 5Fh) is mapped. Rather than containing just the
contents of the bottom part of Bank 0, this mode maps
the contents from Bank 0 and a user-defined “window”
that can be located anywhere in the data memory
space. The value of FSR2 establishes the lower bound-
ary of the addresses mapped into the window, while the
upper boundary is defined by FSR2 plus 95 (5Fh).
Addresses in the Access RAM above 5Fh are mapped
as previously described (see Section 6.3.2 “Access
Bank”). An example of Access Bank remapping in this
addressing mode is shown in Figure 6-10.
Remapping of the Access Bank applies only to opera-
tions using the Indexed Literal Offset mode. Operations
that use the BSR (Access RAM bit is ‘1’) will continue
to use Direct Addressing as before. Any Indirect or
Indexed Addressing operation that explicitly uses any
of the indirect file operands (including FSR2) will con-
tinue to operate as standard Indirect Addressing. Any
instruction that uses the Access Bank, but includes a
register address of greater than 05Fh, will use Direct
Addressing and the normal Access Bank map.
6.6.4 BSR IN INDEXED LITERAL
OFFSET MODE
Although the Access Bank is remapped when the
extended instruction set is enabled, the operation of the
BSR remains unchanged. Direct Addressing, using the
BSR to select the data memory bank, operates in the
same manner as previously described.
FIGURE 6-10: REMAPPING THE ACCESS BANK WITH INDEXED LITERAL
OFFSET ADDRESSING
Data Memory
000h
100h
200h
F60h
F00h
FFFh
Bank 1
Bank 15
Bank 2
through
Bank 14
SFRs
05Fh
ADDWF f, d, a
FSR2H:FSR2L = 120h
Locations in the region
from the FSR2 Pointer
(120h) to the pointer plus
05Fh (17Fh) are mapped
to the bottom of the
Access RAM (000h-05Fh).
Special Function Registers
at F60h through FFFh are
mapped to 60h through
FFh, as usual.
Bank 0 addresses below
5Fh are not available in
this mode. They can still
be addressed by using the
BSR.
Access Bank
00h
FFh
Bank 0
SFRs
Bank 1 “Window”
Not Accessible
Window
Example Situation:
120h
17Fh
5Fh
60h
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7.0 FLASH PROGRAM MEMORY
The Flash program memory is readable, writable and
erasable during normal operation over the entire VDD
range.
A read from program memory is executed on one byte
at a time. A write to program memory is executed on
blocks of 64 bytes at a time or two bytes at a time. Pro-
gram memory is erased in blocks of 1,024 bytes at a
time. A bulk erase operation may not be issued from
user code.
Writing or erasing program memory will cease
instruction fetches until the operation is complete. The
program memory cannot be accessed during the write
or erase, therefore, code cannot execute. An internal
programming timer terminates program memory writes
and erases.
A value written to program memory does not need to be
a valid instruction. Executing a program memory
location that forms an invalid instruction results in a
NOP.
7.1 Table Reads and Table Writes
In order to read and write program memory, there are
two operations that allow the processor to move bytes
between the program memory space and the data RAM:
Table Read (TBLRD)
Table Write (TBLWT)
The program memory space is 16 bits wide, while the
data RAM space is 8 bits wide. Table reads and table
writes move data between these two memory spaces
through an 8-bit register (TABLAT).
Table read operations retrieve data from program
memory and place it into the data RAM space.
Figure 7-1 shows the operation of a table read with
program memory and data RAM.
Table write operations store data from the data memory
space into holding registers in program memory. The
procedure to write the contents of the holding registers
into program memory is detailed in Section 7.5 “Writing
to Flash Program Memory”. Figure 7-2 shows the
operation of a table write with program memory and data
RAM.
Table operations work with byte entities. A table block
containing data, rather than program instructions, is not
required to be word-aligned. Therefore, a table block can
start and end at any byte address. If a table write is being
used to write executable code into program memory,
program instructions will need to be word-aligned.
FIGURE 7-1: TABLE READ OPERATION
Table Pointer(1)
Table Latch (8-bit)
Program Memory
TBLPTRH TBLPTRL
TABLAT
TBLPTRU
Instruction: TBLRD*
Note 1: Table Pointer register points to a byte in program memory.
Program Memory
(TBLPTR)
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DS39979A-page 78 Preliminary 2010 Microchip Technology Inc.
FIGURE 7-2: TABLE WRITE OPERATION
7.2 Control Registers
Several control registers are used in conjunction with
the TBLRD and TBLWT instructions. These include the:
EECON1 register
EECON2 register
TABLAT register
TBLPTR registers
7.2.1 EECON1 AND EECON2 REGISTERS
The EECON1 register (Register 7-1) is the control
register for memory accesses. The EECON2 register is
not a physical register; it is used exclusively in the
memory write and erase sequences. Reading
EECON2 will read all ‘0’s.
The WPROG bit, when set, allows the user to program
a single word (two bytes) upon the execution of the WR
command. If this bit is cleared, the WR command
programs a block of 64 bytes.
The FREE bit, when set, will allow a program memory
erase operation. When FREE is set, the erase
operation is initiated on the next WR command. When
FREE is clear, only writes are enabled.
The WREN bit, when set, will allow a write operation.
On power-up, the WREN bit is clear. The WRERR bit is
set in hardware when the WR bit is set and cleared
when the internal programming timer expires and the
write operation is complete.
The WR control bit initiates write operations. The bit
cannot be cleared, only set, in software. It is cleared in
hardware at the completion of the write operation.
Table Pointer(1) Table Latch (8-bit)
TBLPTRH TBLPTRL TABLAT
Program Memory
(TBLPTR)
TBLPTRU
Instruction: TBLWT*
Note 1: Table Pointer actually points to one of 64 holding registers, the address of which is determined by
TBLPTRL<5:0>. The process for physically writing data to the program memory array is discussed in
Section 7.5 “Writing to Flash Program Memory”.
Holding Registers
Program Memory
Note: During normal operation, the WRERR is
read as ‘1’. This can indicate that a write
operation was prematurely terminated by
a Reset, or a write operation was
attempted improperly.
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REGISTER 7-1: EECON1: EEPROM CONTROL REGISTER 1
U-0 U-0 R/W-0 R/W-0 R/W-x R/W-0 R/S-0 U-0
WPROG FREE WRERR(1) WREN WR
bit 7 bit 0
Legend: S = Settable bit (cannot be cleared in software)
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as0
bit 5 WPROG: One Word-Wide Program bit
1 = Program 2 bytes on the next WR command
0 = Program 64 bytes on the next WR command
bit 4 FREE: Flash Erase Enable bit
1 = Performs an erase operation on the next WR command (cleared by completion of erase operation)
0 = Perform write only
bit 3 WRERR: Flash Program Error Flag bit(1)
1 = A write operation is prematurely terminated (any Reset during self-timed programming in normal
operation or an improper write attempt)
0 = The write operation completed
bit 2 WREN: Flash Program Write Enable bit
1 = Allows write cycles to Flash program memory
0 = Inhibits write cycles to Flash program memory
bit 1 WR: Write Control bit
1 = Initiates a program memory erase cycle or write cycle
(The operation is self-timed and the bit is cleared by hardware once write is complete. The WR bit
can only be set (not cleared) in software.)
0 = Write cycle is complete
bit 0 Unimplemented: Read as0
Note 1: When a WRERR occurs, the EEPGD and CFGS bits are not cleared. This allows tracing of the error
condition.
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DS39979A-page 80 Preliminary 2010 Microchip Technology Inc.
7.2.2 TABLE LATCH REGISTER (TABLAT)
The Table Latch (TABLAT) is an 8-bit register mapped
into the SFR space. The Table Latch register is used to
hold 8-bit data during data transfers between program
memory and data RAM.
7.2.3 TABLE POINTER REGISTER
(TBLPTR)
The Table Pointer (TBLPTR) register addresses a byte
within the program memory. The TBLPTR is comprised
of three SFR registers: Table Pointer Upper Byte, Table
Pointer High Byte and Table Pointer Low Byte
(TBLPTRU:TBLPTRH:TBLPTRL). These three regis-
ters join to form a 22-bit wide pointer. The low-order
21 bits allow the device to address up to 2 Mbytes of
program memory space. The 22nd bit allows access to
the device ID, the user ID and the Configuration bits.
The Table Pointer register, TBLPTR, is used by the
TBLRD and TBLWT instructions. These instructions can
update the TBLPTR in one of four ways based on the
table operation. These operations are shown in
Table 7-1. These operations on the TBLPTR only affect
the low-order 21 bits.
7.2.4 TABLE POINTER BOUNDARIES
TBLPTR is used in reads, writes and erases of the
Flash program memory.
When a TBLRD is executed, all 22 bits of the TBLPTR
determine which byte is read from program memory
into TABLAT.
When a TBLWT is executed, the seven LSbs of the
Table Pointer register (TBLPTR<6:0>) determine which
of the 64 program memory holding registers is written
to. When the timed write to program memory begins
(via the WR bit), the 12 MSbs of the TBLPTR
(TBLPTR<21:10>) determine which program memory
block of 1,024 bytes is written to. For more detail, see
Section 7.5 “Writing to Flash Program Memory”.
When an erase of program memory is executed, the
12 MSbs of the Table Pointer register point to the
1,024-byte block that will be erased. The Least
Significant bits are ignored.
Figure 7-3 describes the relevant boundaries of
TBLPTR based on Flash program memory operations.
TABLE 7-1: TABLE POINTER OPERATIONS WITH TBLRD AND TBLWT INSTRUCTIONS
FIGURE 7-3: TABLE POINTER BOUNDARIES BASED ON OPERATION
Example Operation on Table Pointer
TBLRD*
TBLWT* TBLPTR is not modified
TBLRD*+
TBLWT*+ TBLPTR is incremented after the read/write
TBLRD*-
TBLWT*- TBLPTR is decremented after the read/write
TBLRD+*
TBLWT+* TBLPTR is incremented before the read/write
21 16 15 87 0
ERASE: TBLPTR<20:10>
TABLE WRITE: TBLPTR<20:6>
TABLE READ: TBLPTR<21:0>
TBLPTRLTBLPTRH
TBLPTRU
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7.3 Reading the Flash Program
Memory
The TBLRD instruction is used to retrieve data from
program memory and places it into data RAM. Table
reads from program memory are performed one byte at
a time.
TBLPTR points to a byte address in program space.
Executing TBLRD places the byte pointed to into
TABLAT. In addition, TBLPTR can be modified
automatically for the next table read operation.
The internal program memory is typically organized by
words. The Least Significant bit of the address selects
between the high and low bytes of the word. Figure 7-4
shows the interface between the internal program
memory and the TABLAT.
FIGURE 7-4: READS FROM FLASH PROGRAM MEMORY
EXAMPLE 7-1: READING A FLASH PROGRAM MEMORY WORD
(Even Byte Address)
Program Memory
(Odd Byte Address)
TBLRD TABLAT
TBLPTR = xxxxx1
FETCH
Instruction Register
(IR) Read Register
TBLPTR = xxxxx0
MOVLWCODE_ADDR_UPPER ; Load TBLPTR with the base
MOVWFTBLPTRU ; address of the word
MOVLWCODE_ADDR_HIGH
MOVWFTBLPTRH
MOVLWCODE_ADDR_LOW
MOVWFTBLPTRL
READ_WORD
TBLRD*+ ; read into TABLAT and increment
MOVF TABLAT, W ; get data
MOVWFWORD_EVEN
TBLRD*+ ; read into TABLAT and increment
MOVF TABLAT, W ; get data
MOVWFWORD_ODD
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7.4 Erasing Flash Program Memory
The minimum erase block is 512 words or 1,024 bytes.
Only through the use of an external programmer, or
through ICSP control, can larger blocks of program
memory be bulk erased. Word erase in the Flash array
is not supported.
When initiating an erase sequence from the micro-
controller itself, a block of 1,024 bytes of program
memory is erased. The Most Significant 12 bits of the
TBLPTR<21:10> point to the block being erased.
TBLPTR<9:0> are ignored.
The EECON1 register commands the erase operation.
The WREN bit must be set to enable write operations.
The FREE bit is set to select an erase operation. For
protection, the write initiate sequence for EECON2
must be used.
A long write is necessary for erasing the internal Flash.
Instruction execution is halted while in a long write
cycle. The long write will be terminated by the internal
programming timer.
7.4.1 FLASH PROGRAM MEMORY
ERASE SEQUENCE
The sequence of events for erasing a block of internal
program memory location is:
1. Load Table Pointer register with the address
being erased.
2. Set the WREN and FREE bits (EECON1<2,4>)
to enable the erase operation.
3. Disable interrupts.
4. Write 55h to EECON2.
5. Write 0AAh to EECON2.
6. Set the WR bit. This will begin the erase cycle.
7. The CPU will stall for duration of the erase for
TIE (see parameter D133B).
8. Re-enable interrupts.
EXAMPLE 7-2: ERASING FLASH PROGRAM MEMORY
MOVLW CODE_ADDR_UPPER ; load TBLPTR with the base
MOVWF TBLPTRU ; address of the memory block
MOVLW CODE_ADDR_HIGH
MOVWF TBLPTRH
MOVLW CODE_ADDR_LOW
MOVWF TBLPTRL
ERASE
BSF EECON1, WREN
BSF EECON1, FREE ; enable Erase operation
BCF INTCON, GIE ; disable interrupts
Required MOVLW 55h
Sequence MOVWF EECON2 ; write 55h
MOVLW 0AAh
MOVWF EECON2 ; write 0AAh
BSF EECON1, WR ; start erase (CPU stall)
BSF INTCON, GIE ; re-enable interrupts
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7.5 Writing to Flash Program Memory
The programming block is 32 words or 64 bytes.
Programming one word or two bytes at a time is also
supported.
Table writes are used internally to load the holding
registers needed to program the Flash memory. There
are 64 holding registers used by the table writes for
programming.
Since the Table Latch (TABLAT) is only a single byte, the
TBLWT instruction may need to be executed 64 times for
each programming operation (if WPROG = 0). All of the
table write operations will essentially be short writes
because only the holding registers are written. At the
end of updating the 64 holding registers, the EECON1
register must be written to in order to start the
programming operation with a long write.
The long write is necessary for programming the inter-
nal Flash. Instruction execution is halted while in a long
write cycle. The long write will be terminated by the
internal programming timer.
The on-chip timer controls the write time. The
write/erase voltages are generated by an on-chip
charge pump, rated to operate over the voltage range
of the device.
FIGURE 7-5: TABLE WRITES TO FLASH PROGRAM MEMORY
7.5.1 FLASH PROGRAM MEMORY WRITE
SEQUENCE
The sequence of events for programming an internal
program memory location should be:
1. Read 1,024 bytes into RAM.
2. Update data values in RAM as necessary.
3. Load Table Pointer register with the address
being erased.
4. Execute the erase procedure.
5. Load Table Pointer register with the address of
the first byte being written, minus 1.
6. Write the 64 bytes into the holding registers with
auto-increment.
7. Set the WREN bit (EECON1<2>) to enable byte
writes.
8. Disable interrupts.
9. Write 55h to EECON2.
10. Write 0AAh to EECON2.
11. Set the WR bit. This will begin the write cycle.
12. The CPU will stall for the duration of the write for
TIW (parameter D133A).
13. Re-enable interrupts.
14. Repeat steps 6 through 13 until all 1,024 bytes
are written to program memory.
15. Verify the memory (table read).
An example of the required code is shown in
Example 7-3 on the following page.
Note 1: Unlike previous PIC18 Flash devices,
members of the PIC18F87J72 family do
not reset the holding registers after a
write occurs. The holding registers must
be cleared or overwritten before a
programming sequence.
2: To maintain the endurance of the program
memory cells, each Flash byte should not
be programmed more than one time
between erase operations. Before
attempting to modify the contents of the
target cell a second time, an erase of the
target, or a bulk erase of the entire
memory, must be performed.
TBLPTR = xxxx3FTBLPTR = xxxxx1TBLPTR = xxxxx0 TBLPTR = xxxxx2
Program Memory
Holding Register Holding Register Holding Register Holding Register
88 8 8
TABLAT
Write Register
Note: Before setting the WR bit, the Table
Pointer address needs to be within the
intended address range of the 64 bytes in
the holding register.
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DS39979A-page 84 Preliminary 2010 Microchip Technology Inc.
EXAMPLE 7-3: WRITING TO FLASH PROGRAM MEMORY
MOVLW CODE_ADDR_UPPER ; Load TBLPTR with the base address
MOVWF TBLPTRU ; of the memory block, minus 1
MOVLW CODE_ADDR_HIGH
MOVWF TBLPTRH
MOVLW CODE_ADDR_LOW
MOVWF TBLPTRL
ERASE_BLOCK
BSF EECON1, WREN ; enable write to memory
BSF EECON1, FREE ; enable Erase operation
BCF INTCON, GIE ; disable interrupts
MOVLW 55h
MOVWF EECON2 ; write 55h
MOVLW 0AAh
MOVWF EECON2 ; write 0AAh
BSF EECON1, WR ; start erase (CPU stall)
BSF INTCON, GIE ; re-enable interrupts
MOVLW D'16'
MOVWF WRITE_COUNTER ; Need to write 16 blocks of 64 to write
; one erase block of 1024
RESTART_BUFFER
MOVLW D'64'
MOVWF COUNTER
MOVLW BUFFER_ADDR_HIGH ; point to buffer
MOVWF FSR0H
MOVLW BUFFER_ADDR_LOW
MOVWF FSR0L
FILL_BUFFER
... ; read the new data from I2C, SPI,
; PSP, USART, etc.
WRITE_BUFFER
MOVLW D’64 ; number of bytes in holding register
MOVWF COUNTER
WRITE_BYTE_TO_HREGS
MOVFF POSTINC0, WREG ; get low byte of buffer data
MOVWF TABLAT ; present data to table latch
TBLWT+* ; write data, perform a short write
; to internal TBLWT holding register.
DECFSZ COUNTER ; loop until buffers are full
BRA WRITE_BYTE_TO_HREGS
PROGRAM_MEMORY
BSF EECON1, WREN ; enable write to memory
BCF INTCON, GIE ; disable interrupts
MOVLW 55h
Required MOVWF EECON2 ; write 55h
Sequence MOVLW 0AAh
MOVWF EECON2 ; write 0AAh
BSF EECON1, WR ; start program (CPU stall)
BSF INTCON, GIE ; re-enable interrupts
BCF EECON1, WREN ; disable write to memory
DECFSZ WRITE_COUNTER ; done with one write cycle
BRA RESTART_BUFFER ; if not done replacing the erase block
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7.5.2 FLASH PROGRAM MEMORY WRITE
SEQUENCE (WORD
PROGRAMMING).
The PIC18F87J72 family of devices has a feature that
allows programming a single word (two bytes). This
feature is enabled when the WPROG bit is set. If the
memory location is already erased, the following
sequence is required to enable this feature:
1. Load the Table Pointer register with the address
of the data to be written
2. Write the 2 bytes into the holding registers and
perform a table write
3. Set WPROG to enable single-word write.
4. Set WREN to enable write to memory.
5. Disable interrupts.
6. Write 55h to EECON2.
7. Write 0AAh to EECON2.
8. Set the WR bit. This will begin the write cycle.
9. The CPU will stall for duration of the write for TIW
(see parameter D133A).
10. Re-enable interrupts.
EXAMPLE 7-4: SINGLE-WORD WRITE TO FLASH PROGRAM MEMORY
MOVLW CODE_ADDR_UPPER ; Load TBLPTR with the base address
MOVWF TBLPTRU
MOVLW CODE_ADDR_HIGH
MOVWF TBLPTRH
MOVLW CODE_ADDR_LOW
MOVWF TBLPTRL
MOVLW DATA0
MOVWF TABLAT
TBLWT*+
MOVLW DATA1
MOVWF TABLAT
TBLWT*
PROGRAM_MEMORY
BSF EECON1, WPROG ; enable single word write
BSF EECON1, WREN ; enable write to memory
BCF INTCON, GIE ; disable interrupts
MOVLW 55h
Required MOVWF EECON2 ; write 55h
Sequence MOVLW 0AAh
MOVWF EECON2 ; write 0AAh
BSF EECON1, WR ; start program (CPU stall)
BSF INTCON, GIE ; re-enable interrupts
BCF EECON1, WPROG ; disable single word write
BCF EECON1, WREN ; disable write to memory
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DS39979A-page 86 Preliminary 2010 Microchip Technology Inc.
7.5.3 WRITE VERIFY
Depending on the application, good programming
practice may dictate that the value written to the
memory should be verified against the original value.
This should be used in applications where excessive
writes can stress bits near the specification limit.
7.5.4 UNEXPECTED TERMINATION OF
WRITE OPERATION
If a write is terminated by an unplanned event, such as
loss of power or an unexpected Reset, the memory
location just programmed should be verified and repro-
grammed if needed. If the write operation is interrupted
by a MCLR Reset or a WDT time-out Reset during
normal operation, the user can check the WRERR bit
and rewrite the location(s) as needed.
7.6 Flash Program Operation During
Code Protection
See Section 26.6 “Program Verification and Code
Protection” for details on code protection of Flash
program memory.
TABLE 7-2: REGISTERS ASSOCIATED WITH PROGRAM FLASH MEMORY
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values on
Page:
TBLPTRU bit 21 Program Memory Table Pointer Upper Byte
(TBLPTR<20:16>)
49
TBPLTRH Program Memory Table Pointer High Byte (TBLPTR<15:8>) 49
TBLPTRL Program Memory Table Pointer Low Byte (TBLPTR<7:0>) 49
TABLAT Program Memory Table Latch 49
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
EECON2 EEPROM Control Register 2 (not a physical register) 51
EECON1 WPROG FREE WRERR WREN WR —51
Legend: = unimplemented, read as ‘0’. Shaded cells are not used during Flash program memory access.
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8.0 8 x 8 HARDWARE MULTIPLIER
8.1 Introduction
All PIC18 devices include an 8 x 8 hardware multiplier
as part of the ALU. The multiplier performs an unsigned
operation and yields a 16-bit result that is stored in the
product register pair, PRODH:PRODL. The multiplier’s
operation does not affect any flags in the STATUS
register.
Making multiplication a hardware operation allows it to
be completed in a single instruction cycle. This has the
advantages of higher computational throughput and
reduced code size for multiplication algorithms and
allows the PIC18 devices to be used in many applica-
tions previously reserved for digital signal processors.
A comparison of various hardware and software
multiply operations, along with the savings in memory
and execution time, is shown in Table 8-1.
8.2 Operation
Example 8-1 shows the instruction sequence for an 8 x 8
unsigned multiplication. Only one instruction is required
when one of the arguments is already loaded in the
WREG register.
Example 8-2 shows the sequence to do an 8 x 8 signed
multiplication. To account for the sign bits of the argu-
ments, each argument’s Most Significant bit (MSb) is
tested and the appropriate subtractions are done.
EXAMPLE 8-1: 8 x 8 UNSIGNED MULTIPLY
ROUTINE
EXAMPLE 8-2: 8 x 8 SIGNED MULTIPLY
ROUTINE
TABLE 8-1: PERFORMANCE COMPARISON FOR VARIOUS MULTIPLY OPERATIONS
MOVF ARG1, W ;
MULWF ARG2 ; ARG1 * ARG2 ->
; PRODH:PRODL
MOVF ARG1, W
MULWF ARG2 ; ARG1 * ARG2 ->
; PRODH:PRODL
BTFSC ARG2, SB ; Test Sign Bit
SUBWF PRODH, F ; PRODH = PRODH
; - ARG1
MOVF ARG2, W
BTFSC ARG1, SB ; Test Sign Bit
SUBWF PRODH, F ; PRODH = PRODH
; - ARG2
Routine Multiply Method
Program
Memory
(Words)
Cycles
(Max)
Time
@ 48 MHz @ 10 MHz @ 4 MHz
8 x 8 unsigned Without hardware multiply 13 69 5.7 s27.6 s69 s
Hardware multiply 1 1 83.3 ns 400 ns 1 s
8 x 8 signed Without hardware multiply 33 91 7.5 s36.4 s91 s
Hardware multiply 6 6 500 ns 2.4 s6 s
16 x 16 unsigned Without hardware multiply 21 242 20.1 s96.8 s242 s
Hardware multiply 28 28 2.3 s 11.2 s28 s
16 x 16 signed Without hardware multiply 52 254 21.6 s 102.6 s254 s
Hardware multiply 35 40 3.3 s16.0 s40 s
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Example 8-3 shows the sequence to do a 16 x 16
unsigned multiplication. Equation 8-1 shows the
algorithm that is used. The 32-bit result is stored in four
registers (RES3:RES0).
EQUATION 8-1: 16 x 16 UNSIGNED
MULTIPLICATION
ALGORITHM
EXAMPLE 8-3: 16 x 16 UNSIGNED
MULTIPLY ROUTINE
Example 8-4 shows the sequence to do a 16 x 16
signed multiply. Equation 8-2 shows the algorithm
used. The 32-bit result is stored in four registers
(RES3:RES0). To account for the sign bits of the
arguments, the MSb for each argument pair is tested
and the appropriate subtractions are done.
EQUATION 8-2: 16 x 16 SIGNED
MULTIPLICATION
ALGORITHM
EXAMPLE 8-4: 16 x 16 SIGNED MULTIPLY
ROUTINE
RES3:RES0 = ARG1H:ARG1L ARG2H:ARG2L
= (ARG1H ARG2H 216) +
(ARG1H ARG2L 28) +
(ARG1L ARG2H 28) +
(ARG1L ARG2L)
MOVF ARG1L, W
MULWF ARG2L ; ARG1L * ARG2L->
; PRODH:PRODL
MOVFF PRODH, RES1 ;
MOVFF PRODL, RES0 ;
;
MOVF ARG1H, W
MULWF ARG2H ; ARG1H * ARG2H->
; PRODH:PRODL
MOVFF PRODH, RES3 ;
MOVFF PRODL, RES2 ;
;
MOVF ARG1L, W
MULWF ARG2H ; ARG1L * ARG2H->
; PRODH:PRODL
MOVF PRODL, W ;
ADDWF RES1, F ; Add cross
MOVF PRODH, W ; products
ADDWFC RES2, F ;
CLRF WREG ;
ADDWFC RES3, F ;
;
MOVF ARG1H, W ;
MULWF ARG2L ; ARG1H * ARG2L->
; PRODH:PRODL
MOVF PRODL, W ;
ADDWF RES1, F ; Add cross
MOVF PRODH, W ; products
ADDWFC RES2, F ;
CLRF WREG ;
ADDWFC RES3, F ;
RES3:RES0= ARG1H:ARG1L ARG2H:ARG2L
= (ARG1H ARG2H 216) +
(ARG1H ARG2L 28) +
(ARG1L ARG2H 28) +
(ARG1L ARG2L) +
(-1 ARG2H<7> ARG1H:ARG1L 216) +
(-1 ARG1H<7> ARG2H:ARG2L 216)
MOVF ARG1L, W
MULWFARG2L ; ARG1L * ARG2L ->
; PRODH:PRODL
MOVFFPRODH, RES1;
MOVFFPRODL, RES0;
;
MOVF ARG1H, W
MULWFARG2H ; ARG1H * ARG2H ->
; PRODH:PRODL
MOVFFPRODH, RES3;
MOVFFPRODL, RES2;
;
MOVF ARG1L, W
MULWFARG2H ; ARG1L * ARG2H ->
; PRODH:PRODL
MOVF PRODL, W ;
ADDWFRES1, F ; Add cross
MOVF PRODH, W ; products
ADDWFCRES2, F ;
CLRF WREG ;
ADDWFCRES3, F ;
;
MOVF ARG1H, W ;
MULWFARG2L ; ARG1H * ARG2L ->
; PRODH:PRODL
MOVF PRODL, W ;
ADDWFRES1, F ; Add cross
MOVF PRODH, W ; products
ADDWFC RES2, F ;
CLRF WREG ;
ADDWFCRES3, F ;
;
BTFSSARG2H, 7 ; ARG2H:ARG2L neg?
BRA SIGN_ARG1 ; no, check ARG1
MOVF ARG1L, W ;
SUBWFRES2 ;
MOVF ARG1H, W ;
SUBWFBRES3
;
SIGN_ARG1
BTFSSARG1H, 7 ; ARG1H:ARG1L neg?
BRA CONT_CODE ; no, done
MOVF ARG2L, W ;
SUBWFRES2 ;
MOVF ARG2H, W ;
SUBWFBRES3
;
CONT_CODE
:
2010 Microchip Technology Inc. Preliminary DS39979A-page 89
PIC18F87J72 FAMILY
9.0 INTERRUPTS
Members of the PIC18F87J72 family of devices have
multiple interrupt sources and an interrupt priority
feature that allows most interrupt sources to be
assigned a high-priority level or a low-priority level. The
high-priority interrupt vector is at 0008h and the
low-priority interrupt vector is at 0018h. High-priority
interrupt events will interrupt any low-priority interrupts
that may be in progress.
There are thirteen registers which are used to control
interrupt operation. These registers are:
RCON
•INTCON
INTCON2
INTCON3
PIR1, PIR2, PIR3
PIE1, PIE2, PIE3
IPR1, IPR2, IPR3
It is recommended that the Microchip header files
supplied with MPLAB® IDE be used for the symbolic bit
names in these registers. This allows the
assembler/compiler to automatically take care of the
placement of these bits within the specified register.
In general, interrupt sources have three bits to control
their operation. They are:
Flag bit to indicate that an interrupt event
occurred
Enable bit that allows program execution to
branch to the interrupt vector address when the
flag bit is set
Priority bit to select high priority or low priority
The interrupt priority feature is enabled by setting the
IPEN bit (RCON<7>). When interrupt priority is
enabled, there are two bits which enable interrupts
globally. Setting the GIEH bit (INTCON<7>) enables all
interrupts that have the priority bit set (high priority).
Setting the GIEL bit (INTCON<6>) enables all
interrupts that have the priority bit cleared (low priority).
When the interrupt flag, enable bit and appropriate
global interrupt enable bit are set, the interrupt will
vector immediately to address 0008h or 0018h,
depending on the priority bit setting. Individual
interrupts can be disabled through their corresponding
enable bits.
When the IPEN bit is cleared (default state), the
interrupt priority feature is disabled and interrupts are
compatible with PIC® mid-range devices. In
Compatibility mode, the interrupt priority bits for each
source have no effect. INTCON<6> is the PEIE bit
which enables/disables all peripheral interrupt sources.
INTCON<7> is the GIE bit which enables/disables all
interrupt sources. All interrupts branch to address
0008h in Compatibility mode.
When an interrupt is responded to, the global interrupt
enable bit is cleared to disable further interrupts. If the
IPEN bit is cleared, this is the GIE bit. If interrupt priority
levels are used, this will be either the GIEH or GIEL bit.
High-priority interrupt sources can interrupt a
low-priority interrupt. Low-priority interrupts are not
processed while high-priority interrupts are in progress.
The return address is pushed onto the stack and the
PC is loaded with the interrupt vector address (0008h
or 0018h). Once in the Interrupt Service Routine, the
source(s) of the interrupt can be determined by polling
the interrupt flag bits. The interrupt flag bits must be
cleared in software before re-enabling interrupts to
avoid recursive interrupts.
The “return from interrupt” instruction, RETFIE, exits
the interrupt routine and sets the GIE bit (GIEH or GIEL
if priority levels are used) which re-enables interrupts.
For external interrupt events, such as the INTx pins or
the PORTB input change interrupt, the interrupt latency
will be three to four instruction cycles. The exact
latency is the same for one or two-cycle instructions.
Individual interrupt flag bits are set regardless of the
status of their corresponding enable bit or the GIE bit.
Note: Do not use the MOVFF instruction to modify
any of the Interrupt Control registers while
any interrupt is enabled. Doing so may
cause erratic microcontroller behavior.
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DS39979A-page 90 Preliminary 2010 Microchip Technology Inc.
FIGURE 9-1: PIC18F87J72 FAMILY INTERRUPT LOGIC
TMR0IE
GIE/GIEH
PEIE/GIEL
Wake-up if in
Interrupt to CPU
Vector to Location
0008h
INT2IF
INT2IE
INT2IP
INT1IF
INT1IE
INT1IP
TMR0IF
TMR0IE
TMR0IP
RBIF
RBIE
RBIP
IPEN
TMR0IF
TMR0IP
INT1IF
INT1IE
INT1IP
INT2IF
INT2IE
INT2IP
RBIF
RBIE
RBIP
INT0IF
INT0IE
PEIE/GIEL
Interrupt to CPU
Vector to Location
IPEN
IPEN
0018h
PIR1<6:3,1:0>
PIE1<6:3,1:0>
IPR1<6:3,1:0>
High-Priority Interrupt Generation
Low-Priority Interrupt Generation
Idle or Sleep modes
GIE/GIEH
INT3IF
INT3IE
INT3IP
INT3IF
INT3IE
INT3IP
PIR2<7:6,3:1>
PIE2<7:6 3:1>
IPR2<7:6,3:1>
PIR3<6:0>
PIE3<6:0>
IPR3<6:0>
PIR1<6:3,1:0>
PIE1<6:3,1:0>
IPR1<6:3,1:0>
PIR2<7:6,3:1>
PIE2<7:6,3:1>
IPR2<7:6,3:1>
PIR3<6:0>
PIE3<6:0>
IPR3<6:0>
IPEN
2010 Microchip Technology Inc. Preliminary DS39979A-page 91
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9.1 INTCON Registers
The INTCON registers are readable and writable
registers which contain various enable, priority and flag
bits.
Note: Interrupt flag bits are set when an interrupt
condition occurs regardless of the state of
its corresponding enable bit or the global
interrupt enable bit. User software should
ensure the appropriate interrupt flag bits
are clear prior to enabling an interrupt.
This feature allows for software polling.
REGISTER 9-1: INTCON: INTERRUPT CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-x
GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 GIE/GIEH: Global Interrupt Enable bit
When IPEN = 0:
1 = Enables all unmasked interrupts
0 = Disables all interrupts
When IPEN = 1:
1 = Enables all high-priority interrupts
0 = Disables all interrupts
bit 6 PEIE/GIEL: Peripheral Interrupt Enable bit
When IPEN = 0:
1 = Enables all unmasked peripheral interrupts
0 = Disables all peripheral interrupts
When IPEN = 1:
1 = Enables all low-priority peripheral interrupts
0 = Disables all low-priority peripheral interrupts
bit 5 TMR0IE: TMR0 Overflow Interrupt Enable bit
1 = Enables the TMR0 overflow interrupt
0 = Disables the TMR0 overflow interrupt
bit 4 INT0IE: INT0 External Interrupt Enable bit
1 = Enables the INT0 external interrupt
0 = Disables the INT0 external interrupt
bit 3 RBIE: RB Port Change Interrupt Enable bit
1 = Enables the RB port change interrupt
0 = Disables the RB port change interrupt
bit 2 TMR0IF: TMR0 Overflow Interrupt Flag bit
1 = TMR0 register has overflowed (must be cleared in software)
0 = TMR0 register did not overflow
bit 1 INT0IF: INT0 External Interrupt Flag bit
1 = The INT0 external interrupt occurred (must be cleared in software)
0 = The INT0 external interrupt did not occur
bit 0 RBIF: RB Port Change Interrupt Flag bit(1)
1 = At least one of the RB<7:4> pins changed state (must be cleared in software)
0 = None of the RB<7:4> pins have changed state
Note 1: A mismatch condition will continue to set this bit. Reading PORTB, then waiting one instruction cycle, will
end the mismatch condition and allow the bit to be cleared.
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DS39979A-page 92 Preliminary 2010 Microchip Technology Inc.
REGISTER 9-2: INTCON2: INTERRUPT CONTROL REGISTER 2
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
RBPU INTEDG0 INTEDG1 INTEDG2 INTEDG3 TMR0IP INT3IP RBIP
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 RBPU: PORTB Pull-up Enable bit
1 = All PORTB pull-ups are disabled
0 = PORTB pull-ups are enabled by individual port latch values
bit 6 INTEDG0: External Interrupt 0 Edge Select bit
1 = Interrupt on rising edge
0 = Interrupt on falling edge
bit 5 INTEDG1: External Interrupt 1 Edge Select bit
1 = Interrupt on rising edge
0 = Interrupt on falling edge
bit 4 INTEDG2: External Interrupt 2 Edge Select bit
1 = Interrupt on rising edge
0 = Interrupt on falling edge
bit 3 INTEDG3: External Interrupt 3 Edge Select bit
1 = Interrupt on rising edge
0 = Interrupt on falling edge
bit 2 TMR0IP: TMR0 Overflow Interrupt Priority bit
1 =High priority
0 = Low priority
bit 1 INT3IP: INT3 External Interrupt Priority bit
1 =High priority
0 = Low priority
bit 0 RBIP: RB Port Change Interrupt Priority bit
1 =High priority
0 = Low priority
Note: Interrupt flag bits are set when an interrupt condition occurs regardless of the state of its corresponding
enable bit or the global interrupt enable bit. User software should ensure the appropriate interrupt flag bits
are clear prior to enabling an interrupt. This feature allows for software polling.
2010 Microchip Technology Inc. Preliminary DS39979A-page 93
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REGISTER 9-3: INTCON3: INTERRUPT CONTROL REGISTER 3
R/W-1 R/W-1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
INT2IP INT1IP INT3IE INT2IE INT1IE INT3IF INT2IF INT1IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 INT2IP: INT2 External Interrupt Priority bit
1 =High priority
0 = Low priority
bit 6 INT1IP: INT1 External Interrupt Priority bit
1 =High priority
0 = Low priority
bit 5 INT3IE: INT3 External Interrupt Enable bit
1 = Enables the INT3 external interrupt
0 = Disables the INT3 external interrupt
bit 4 INT2IE: INT2 External Interrupt Enable bit
1 = Enables the INT2 external interrupt
0 = Disables the INT2 external interrupt
bit 3 INT1IE: INT1 External Interrupt Enable bit
1 = Enables the INT1 external interrupt
0 = Disables the INT1 external interrupt
bit 2 INT3IF: INT3 External Interrupt Flag bit
1 = The INT3 external interrupt occurred (must be cleared in software)
0 = The INT3 external interrupt did not occur
bit 1 INT2IF: INT2 External Interrupt Flag bit
1 = The INT2 external interrupt occurred (must be cleared in software)
0 = The INT2 external interrupt did not occur
bit 0 INT1IF: INT1 External Interrupt Flag bit
1 = The INT1 external interrupt occurred (must be cleared in software)
0 = The INT1 external interrupt did not occur
Note: Interrupt flag bits are set when an interrupt condition occurs regardless of the state of its corresponding
enable bit or the global interrupt enable bit. User software should ensure the appropriate interrupt flag bits
are clear prior to enabling an interrupt. This feature allows for software polling.
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9.2 PIR Registers
The PIR registers contain the individual flag bits for the
peripheral interrupts. Due to the number of peripheral
interrupt sources, there are three Peripheral Interrupt
Request (Flag) registers (PIR1, PIR2, PIR3).
Note 1: Interrupt flag bits are set when an interrupt
condition occurs regardless of the state of
its corresponding enable bit or the Global
Interrupt Enable bit, GIE (INTCON<7>).
2: User software should ensure the
appropriate interrupt flag bits are cleared
prior to enabling an interrupt and after
servicing that interrupt.
REGISTER 9-4: PIR1: PERIPHERAL INTERRUPT REQUEST (FLAG) REGISTER 1
U-0 R/W-0 R-0 R-0 R/W-0 U-0 R/W-0 R/W-0
ADIF RC1IF TX1IF SSPIF —TMR2IFTMR1IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as0
bit 6 ADIF: A/D Converter Interrupt Flag bit
1 = An A/D conversion completed (must be cleared in software)
0 = The A/D conversion is not complete
bit 5 RC1IF: EUSART Receive Interrupt Flag bit
1 = The EUSART receive buffer, RCREG1, is full (cleared when RCREG1 is read)
0 = The EUSART receive buffer is empty
bit 4 TX1IF: EUSART Transmit Interrupt Flag bit
1 = The EUSART transmit buffer, TXREG1, is empty (cleared when TXREG1 is written)
0 = The EUSART transmit buffer is full
bit 3 SSPIF: Master Synchronous Serial Port Interrupt Flag bit
1 = The transmission/reception is complete (must be cleared in software)
0 = Waiting to transmit/receive
bit 2 Unimplemented: Read as0
bit 1 TMR2IF: TMR2 to PR2 Match Interrupt Flag bit
1 = TMR2 to PR2 match occurred (must be cleared in software)
0 = No TMR2 to PR2 match occurred
bit 0 TMR1IF: TMR1 Overflow Interrupt Flag bit
1 = TMR1 register overflowed (must be cleared in software)
0 = TMR1 register did not overflow
2010 Microchip Technology Inc. Preliminary DS39979A-page 95
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REGISTER 9-5: PIR2: PERIPHERAL INTERRUPT REQUEST (FLAG) REGISTER 2
R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 U-0
OSCFIF CMIF —BCLIFLVDIFTMR3IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 OSCFIF: Oscillator Fail Interrupt Flag bit
1 = Device oscillator failed, clock input has changed to INTOSC (must be cleared in software)
0 = Device clock operating
bit 6 CMIF: Comparator Interrupt Flag bit
1 = Comparator input has changed (must be cleared in software)
0 = Comparator input has not changed
bit 5-4 Unimplemented: Read as0
bit 3 BCLIF: Bus Collision Interrupt Flag bit
1 = A bus collision occurred (must be cleared in software)
0 = No bus collision occurred
bit 2 LVDIF: Low-Voltage Detect Interrupt Flag bit
1 = A low-voltage condition occurred (must be cleared in software)
0 = The device voltage is above the regulator’s low-voltage trip point
bit 1 TMR3IF: TMR3 Overflow Interrupt Flag bit
1 = TMR3 register overflowed (must be cleared in software)
0 = TMR3 register did not overflow
bit 0 Unimplemented: Read as0
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DS39979A-page 96 Preliminary 2010 Microchip Technology Inc.
REGISTER 9-6: PIR3: PERIPHERAL INTERRUPT REQUEST (FLAG) REGISTER 3
U-0 R/W-0 R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0
LCDIF RC2IF TX2IF CTMUIF CCP2IF CCP1IF RTCCIF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as0
bit 6 LCDIF: LCD Interrupt Flag bit (valid when Type-B waveform with Non-Static mode is selected)
1 = LCD data of all COMs is output (must be cleared in software)
0 = LCD data of all COMs is not yet output
bit 5 RC2IF: AUSART Receive Interrupt Flag bit
1 = The AUSART receive buffer, RCREG2, is full (cleared when RCREG2 is read)
0 = The AUSART receive buffer is empty
bit 4 TX2IF: AUSART Transmit Interrupt Flag bit
1 = The AUSART transmit buffer, TXREG2, is empty (cleared when TXREG2 is written)
0 = The AUSART transmit buffer is full
bit 3 CTMUIF: CTMU Interrupt Flag bit
1 = CTMU interrupt occured (must be cleared in software)
0 = No CTMU interrupt occured
bit 2 CCP2IF: CCP2 Interrupt Flag bit
Capture mode:
1 = A TMR1/TMR3 register capture occurred (must be cleared in software)
0 = No TMR1/TMR3 register capture occurred
Compare mode:
1 = A TMR1/TMR3 register compare match occurred (must be cleared in software)
0 = No TMR1/TMR3 register compare match occurred
PWM mode:
Unused in this mode.
bit 1 CCP1IF: CCP1 Interrupt Flag bit
Capture mode:
1 = A TMR1/TMR3 register capture occurred (must be cleared in software)
0 = No TMR1/TMR3 register capture occurred
Compare mode:
1 = A TMR1/TMR3 register compare match occurred (must be cleared in software)
0 = No TMR1/TMR3 register compare match occurred
PWM mode:
Unused in this mode.
bit 0 RTCCIF: RTCC Interrupt Flag bit
1 = RTCC interrupt occured (must be cleared in software)
0 = No RTCC interrupt occured
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9.3 PIE Registers
The PIE registers contain the individual enable bits for
the peripheral interrupts. Due to the number of
peripheral interrupt sources, there are three Peripheral
Interrupt Enable registers (PIE1, PIE2, PIE3). When
IPEN = 0, the PEIE bit must be set to enable any of
these peripheral interrupts.
REGISTER 9-7: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1
U-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0
ADIE RC1IE TX1IE SSPIE TMR2IE TMR1IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as ‘0’
bit 6 ADIE: A/D Converter Interrupt Enable bit
1 = Enables the A/D interrupt
0 = Disables the A/D interrupt
bit 5 RC1IE: EUSART Receive Interrupt Enable bit
1 = Enables the EUSART receive interrupt
0 = Disables the EUSART receive interrupt
bit 4 TX1IE: EUSART Transmit Interrupt Enable bit
1 = Enables the EUSART transmit interrupt
0 = Disables the EUSART transmit interrupt
bit 3 SSPIE: Master Synchronous Serial Port Interrupt Enable bit
1 = Enables the MSSP interrupt
0 = Disables the MSSP interrupt
bit 2 Unimplemented: Read as0
bit 1 TMR2IE: TMR2 to PR2 Match Interrupt Enable bit
1 = Enables the TMR2 to PR2 match interrupt
0 = Disables the TMR2 to PR2 match interrupt
bit 0 TMR1IE: TMR1 Overflow Interrupt Enable bit
1 = Enables the TMR1 overflow interrupt
0 = Disables the TMR1 overflow interrupt
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DS39979A-page 98 Preliminary 2010 Microchip Technology Inc.
REGISTER 9-8: PIE2: PERIPHERAL INTERRUPT ENABLE REGISTER 2
R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 U-0
OSCFIE CMIE BCLIE LVDIE TMR3IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 OSCFIE: Oscillator Fail Interrupt Enable bit
1 = Enabled
0 = Disabled
bit 6 CMIE: Comparator Interrupt Enable bit
1 = Enabled
0 = Disabled
bit 5-4 Unimplemented: Read as0
bit 3 BCLIE: Bus Collision Interrupt Enable bit
1 = Enabled
0 = Disabled
bit 2 LVDIE: Low-Voltage Detect Interrupt Enable bit
1 = Enabled
0 = Disabled
bit 1 TMR3IE: TMR3 Overflow Interrupt Enable bit
1 = Enabled
0 = Disabled
bit 0 Unimplemented: Read as0
2010 Microchip Technology Inc. Preliminary DS39979A-page 99
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REGISTER 9-9: PIE3: PERIPHERAL INTERRUPT ENABLE REGISTER 3
U-0 R/W-0 R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0
LCDIE RC2IE TX2IE CTMUIE CCP2IE CCP1IE RTCCIE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as0
bit 6 LCDIE: LCD Interrupt Enable bit (valid when Type-B waveform with Non-Static mode is selected)
1 = Enabled
0 = Disabled
bit 5 RC2IE: AUSART Receive Interrupt Enable bit
1 = Enabled
0 = Disabled
bit 4 TX2IE: AUSART Transmit Interrupt Enable bit
1 = Enabled
0 = Disabled
bit 3 CTMUIE: CTMU Interrupt Enable bit
1 = Enabled
0 = Disabled
bit 2 CCP2IE: CCP2 Interrupt Enable bit
1 = Enabled
0 = Disabled
bit 1 CCP1IE: CCP1 Interrupt Enable bit
1 = Enables the CCP1 interrupt
0 = Disables the CCP1 interrupt
bit 0 RTCCIE: RTCC Interrupt Enable bit
1 = Enabled
0 = Disabled
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9.4 IPR Registers
The IPR registers contain the individual priority bits for
the peripheral interrupts. Due to the number of
peripheral interrupt sources, there are three Peripheral
Interrupt Priority registers (IPR1, IPR2, IPR3). Using
the priority bits requires that the Interrupt Priority
Enable (IPEN) bit be set.
REGISTER 9-10: IPR1: PERIPHERAL INTERRUPT PRIORITY REGISTER 1
U-0 R/W-1 R/W-1 R/W-1 R/W-1 U-0 R/W-1 R/W-1
ADIP RC1IP TX1IP SSPIP TMR2IP TMR1IP
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as0
bit 6 ADIP: A/D Converter Interrupt Priority bit
1 =High priority
0 = Low priority
bit 5 RC1IP: EUSART Receive Interrupt Priority bit
1 =High priority
0 = Low priority
bit 4 TX1IP: EUSART Transmit Interrupt Priority bit
1 =High priority
0 = Low priority
bit 3 SSPIP: Master Synchronous Serial Port Interrupt Priority bit
1 =High priority
0 = Low priority
bit 2 Unimplemented: Read as0
bit 1 TMR2IP: TMR2 to PR2 Match Interrupt Priority bit
1 =High priority
0 = Low priority
bit 0 TMR1IP: TMR1 Overflow Interrupt Priority bit
1 =High priority
0 = Low priority
2010 Microchip Technology Inc. Preliminary DS39979A-page 101
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REGISTER 9-11: IPR2: PERIPHERAL INTERRUPT PRIORITY REGISTER 2
R/W-1 R/W-1 U-0 U-0 R/W-1 R/W-1 R/W-1 U-0
OSCFIP CMIP BCLIP LVDIP TMR3IP
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 OSCFIP: Oscillator Fail Interrupt Priority bit
1 =High priority
0 = Low priority
bit 6 CMIP: Comparator Interrupt Priority bit
1 =High priority
0 = Low priority
bit 5-4 Unimplemented: Read as0
bit 3 BCLIP: Bus Collision Interrupt Priority bit
1 =High priority
0 = Low priority
bit 2 LVDIP: Low-Voltage Detect Interrupt Priority bit
1 =High priority
0 = Low priority
bit 1 TMR3IP: TMR3 Overflow Interrupt Priority bit
1 =High priority
0 = Low priority
bit 0 Unimplemented: Read as0
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DS39979A-page 102 Preliminary 2010 Microchip Technology Inc.
REGISTER 9-12: IPR3: PERIPHERAL INTERRUPT PRIORITY REGISTER 3
U-0 R/W-1 R-1 R-1 R/W-1 R/W-1 R/W-1 R/W-1
LCDIP RC2IP TX2IP CTMUIP CCP2IP CCP1IP RTCCIP
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as0
bit 6 LCDIP: LCD Interrupt Priority bit (valid when Type-B waveform with Non-Static mode is selected)
1 =High priority
0 = Low priority
bit 5 RC2IP: AUSART Receive Priority Flag bit
1 =High priority
0 = Low priority
bit 4 TX2IP: AUSART Transmit Interrupt Priority bit
1 =High priority
0 = Low priority
bit 3 CTMUIP: CTMU Interrupt Priority bit
1 =High priority
0 = Low priority
bit CCP2IP: CCP2 Interrupt Priority bit
1 =High priority
0 = Low priority
bit CCP1IP: CCP1 Interrupt Priority bit
1 =High priority
0 = Low priority
bit 0 RTCCIP: RTCC Interrupt Priority bit
1 =High priority
0 = Low priority
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9.5 RCON Register
The RCON register contains bits used to determine the
cause of the last Reset or wake-up from Idle or Sleep
modes. RCON also contains the bit that enables
interrupt priorities (IPEN).
REGISTER 9-13: RCON: RESET CONTROL REGISTER
R/W-0 U-0 R/W-1 R/W-1 R-1 R-1 R/W-0 R/W-0
IPEN —CMRI TO PD POR BOR
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 IPEN: Interrupt Priority Enable bit
1 = Enable priority levels on interrupts
0 = Disable priority levels on interrupts (PIC16CXXX Compatibility mode)
bit 6 Unimplemented: Read as0
bit 5 CM: Configuration Mismatch Flag bit
1 = A Configuration Mismatch Reset has not occurred
0 = A Configuration Mismatch Reset has occurred (Must be subsequently set in software.)
bit 4 RI: RESET Instruction Flag bit
For details of bit operation, see Register 5-1.
bit 3 TO: Watchdog Timer Time-out Flag bit
For details of bit operation, see Register 5-1.
bit 2 PD: Power-Down Detection Flag bit
For details of bit operation, see Register 5-1.
bit 1 POR: Power-on Reset Status bit
For details of bit operation, see Register 5-1.
bit 0 BOR: Brown-out Reset Status bit
For details of bit operation, see Register 5-1.
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DS39979A-page 104 Preliminary 2010 Microchip Technology Inc.
9.6 INTx Pin Interrupts
External interrupts on the RB0/INT0, RB1/INT1,
RB2/INT2 and RB3/INT3 pins are edge-triggered. If the
corresponding INTEDGx bit in the INTCON2 register is
set (= 1), the interrupt is triggered by a rising edge; if
the bit is clear, the trigger is on the falling edge. When
a valid edge appears on the RBx/INTx pin, the
corresponding flag bit, INTxIF, is set. This interrupt can
be disabled by clearing the corresponding enable bit,
INTxIE. Flag bit, INTxIF, must be cleared in software in
the Interrupt Service Routine (ISR) before re-enabling
the interrupt.
All external interrupts (INT0, INT1, INT2 and INT3) can
wake-up the processor from the power-managed
modes if bit INTxIE was set prior to going into the
power-managed modes. If the Global Interrupt Enable
bit, GIE, is set, the processor will branch to the interrupt
vector following wake-up.
Interrupt priority for INT1, INT2 and INT3 is determined
by the value contained in the interrupt priority bits,
INT1IP (INTCON3<6>), INT2IP (INTCON3<7>) and
INT3IP (INTCON2<1>). There is no priority bit
associated with INT0. It is always a high-priority
interrupt source.
9.7 TMR0 Interrupt
In 8-bit mode (which is the default), an overflow in the
TMR0 register (FFh 00h) will set flag bit, TMR0IF. In
16-bit mode, an overflow in the TMR0H:TMR0L register
pair (FFFFh 0000h) will set TMR0IF. The interrupt can
be enabled/disabled by setting/clearing enable bit,
TMR0IE (INTCON<5>). Interrupt priority for Timer0 is
determined by the value contained in the interrupt priority
bit, TMR0IP (INTCON2<2>). See Section 11.0 “Timer0
Module” for further details on the Timer0 module.
9.8 PORTB Interrupt-on-Change
An input change on PORTB<7:4> sets flag bit, RBIF
(INTCON<0>). The interrupt can be enabled/disabled
by setting/clearing enable bit, RBIE (INTCON<3>).
Interrupt priority for PORTB interrupt-on-change is
determined by the value contained in the interrupt
priority bit, RBIP (INTCON2<0>).
9.9 Context Saving During Interrupts
During interrupts, the return PC address is saved on
the stack. Additionally, the WREG, STATUS and BSR
registers are saved on the Fast Return Stack. If a fast
return from interrupt is not used (see Section 6.3
“Data Memory Organization”), the user may need to
save the WREG, STATUS and BSR registers on entry
to the Interrupt Service Routine. Depending on the
user’s application, other registers may also need to be
saved. Example 9-1 saves and restores the WREG,
STATUS and BSR registers during an Interrupt Service
Routine.
EXAMPLE 9-1: SAVING STATUS, WREG AND BSR REGISTERS IN RAM
MOVWF W_TEMP ; W_TEMP is in virtual bank
MOVFF STATUS, STATUS_TEMP ; STATUS_TEMP located anywhere
MOVFF BSR, BSR_TEMP ; BSR_TMEP located anywhere
;
; USER ISR CODE
;
MOVFF BSR_TEMP, BSR ; Restore BSR
MOVF W_TEMP, W ; Restore WREG
MOVFF STATUS_TEMP, STATUS ; Restore STATUS
2010 Microchip Technology Inc. Preliminary DS39979A-page 105
PIC18F87J72 FAMILY
10.0 I/O PORTS
Depending on the features enabled, there are up to
seven ports available. Some pins of the I/O ports are
multiplexed with an alternate function from the
peripheral features on the device. In general, when a
peripheral is enabled, that pin may not be used as a
general purpose I/O pin.
Each port has three memory mapped registers for its
operation:
TRIS register (Data Direction register)
PORT register (reads the levels on the pins of the
device)
LAT register (Output Latch register)
Reading the PORT register reads the current status of
the pins, whereas writing to the PORT register, writes
to the Output Latch (LAT) register.
Setting a TRIS bit (= 1) makes the corresponding
PORT pin an input (i.e., put the corresponding output
driver in a high-impedance mode). Clearing a TRIS bit
(= 0) makes the corresponding PORT pin an output
(i.e., put the contents of the corresponding LAT bit on
the selected pin).
The Output Latch (LAT register) is useful for
read-modify-write operations on the value that the I/O
pins are driving. Read-modify-write operations on the
LAT register read and write the latched output value for
the PORT register.
A simplified model of a generic I/O port, without the
interfaces to other peripherals, is shown in Figure 10-1.
FIGURE 10-1: GENERIC I/O PORT
OPERATION
10.1 I/O Port Pin Capabilities
When developing an application, the capabilities of the
port pins must be considered. Outputs on some pins
have higher output drive strength than others. Similarly,
some pins can tolerate higher than VDD input levels.
10.1.1 INPUT PINS AND VOLTAGE
CONSIDERATIONS
The voltage tolerance of pins used as device inputs is
dependent on the pin’s input function. Most of the pins
that are used as digital only inputs are able to handle DC
voltages up to 5.5V, a level typical for digital logic circuits.
In contrast, pins that also have analog input functions of
any kind can only tolerate voltages up to VDD. Table 10-1
summarizes the input voltage capabilities of the I/O pins.
Refer to Section 29.0 “Electrical Characteristics” for
more details. Voltage excursions beyond VDD on these
pins should be avoided.
TABLE 10-1: INPUT VOLTAGE TOLERANCE
10.1.2 PIN OUTPUT DRIVE
When used as digital I/O, the output pin drive strengths
vary for groups of pins intended to meet the needs for
a variety of applications. In general, there are three
classes of output pins in terms of drive capability.
PORTB and PORTC, as well as PORTA<7:6>, are
designed to drive higher current loads, such as LEDs.
PORTD, PORTE and PORTJ can also drive LEDs but
only those with smaller current requirements. PORTF,
PORTG and PORTH, along with PORTA<5:0>, have
the lowest drive level but are capable of driving normal
digital circuit loads with a high input impedance.
Regardless of which port it is located on, all output pins
in LCD Segment or common-mode have sufficient
output to directly drive a display.
Table 10-2 summarizes the output capabilities of the
ports. Refer to the “Absolute Maximum Ratings” in
Section 29.0 “Electrical Characteristics” for more
details.
Data
Bus
WR LAT
WR TRIS
RD PORT
Data Latch
TRIS Latch
RD TRIS
Input
Buffer
I/O Pin
QD
CKx
QD
CKx
EN
QD
EN
RD LAT
or PORT
PORT or Pin Tolerated
Input Description
PORTA<7:0>
VDD
Only VDD input levels
tolerated.
PORTC<1:0>
PORTF<1,0>
PORTF<7:1>
PORTG<3:2, 0>
PORTB<7:0>
5.5V
Tolerates input
levels above VDD,
useful for most
standard logic.
PORTC<7:2>
PORTD<7:0>
PORTE<7:2>
PORTG<4,1>
PIC18F87J72 FAMILY
DS39979A-page 106 Preliminary 2010 Microchip Technology Inc.
TABLE 10-2: OUTPUT DRIVE LEVELS FOR
VARIOUS PORTS
10.1.3 PULL-UP CONFIGURATION
Four of the I/O ports (PORTB, PORTD, PORTE and
PORTJ) implement configurable weak pull-ups on all
pins. These are internal pull-ups that allow floating
digital input signals to be pulled to a consistent level
without the use of external resistors.
The pull-ups are enabled with a single bit for each of the
ports: RBPU (INTCON2<7>) for PORTB, and RDPU,
REPU and PJPU (PORTG<7:5>) for the other ports.
10.1.4 OPEN-DRAIN OUTPUTS
The output pins for several peripherals are also
equipped with a configurable, open-drain output option.
This allows the peripherals to communicate with
external digital logic, operating at a higher voltage
level, without the use of level translators.
The open-drain option is implemented on port pins
specifically associated with the data and clock outputs
of the USARTs, the MSSP module (in SPI mode) and
the CCP modules. This option is selectively enabled by
setting the open-drain control bit for the corresponding
module in TRISG and LATG. Their configuration is dis-
cussed in more detail in Section 10.4 “PORTC, TRISC
and LATC Registers”, Section 10.6 “PORTE, TRISE
and LATE Registers” and Section 10.8 “PORTG,
TRISG and LATG Registers”.
When the open-drain option is required, the output pin
must also be tied through an external pull-up resistor
provided by the user to a higher voltage level, up to 5V
(Figure 10-2). When a digital logic high signal is output,
it is pulled up to the higher voltage level.
FIGURE 10-2: USING THE OPEN-DRAIN
OUTPUT (USART SHOWN
AS EXAMPLE)
10.2 PORTA, TRISA and
LATA Registers
PORTA is an 8-bit wide, bidirectional port. The corre-
sponding Data Direction and Output Latch registers are
TRISA and LATA.
RA4/T0CKI is a Schmitt Trigger input. All other PORTA
pins have TTL input levels and full CMOS output
drivers.
The RA4 pin is multiplexed with the Timer0 clock input
and one of the LCD segment drives. RA5 and RA<3:0>
are multiplexed with analog inputs for the A/D
Converter.
The operation of the analog inputs as A/D Converter
inputs is selected by clearing or setting the PCFG<3:0>
control bits in the ADCON1 register. The corresponding
TRISA bits control the direction of these pins, even
when they are being used as analog inputs. The user
must ensure the bits in the TRISA register are
maintained set when using them as analog inputs.
OSC2/CLKO/RA6 and OSC1/CLKI/RA7 normally
serve as the external circuit connections for the exter-
nal (primary) oscillator circuit (HS Oscillator modes) or
the external clock input and output (EC Oscillator
modes). In these cases, RA6 and RA7 are not available
as digital I/O and their corresponding TRIS and LAT
bits are read as ‘0. When the device is configured to
use INTOSC or INTRC as the default oscillator mode
(FOSC2 Configuration bit is ‘0), RA6 and RA7 are
automatically configured as digital I/O. The oscillator
and clock in/clock out functions are disabled.
RA1, RA4 and RA5 are multiplexed with LCD segment
drives, controlled by bits in the LCDSE1 and LCDSE2
registers. I/O port functionality is only available when
the LCD segments are disabled.
EXAMPLE 10-1: INITIALIZING PORTA
Low Medium High
PORTA<5:0> PORTD PORTA<7:6>
PORTF PORTE PORTB
PORTG PORTC
TXX
+5V
3.3V
(at logic ‘1’)
3.3V
VDD 5V
PIC18F87J72
Note: RA5 and RA<3:0> are configured as
analog inputs on any Reset and are read
as ‘0’. RA4 is configured as a digital input.
CLRF PORTA ; Initialize PORTA by
; clearing output latches
CLRF LATA ; Alternate method to
; clear output data latches
MOVLW 07h ; Configure A/D
MOVWF ADCON1 ; for digital inputs
MOVLW 0BFh ; Value used to initialize
; data direction
MOVWF TRISA ; Set RA<7, 5:0> as inputs,
; RA<6> as output
2010 Microchip Technology Inc. Preliminary DS39979A-page 107
PIC18F87J72 FAMILY
TABLE 10-3: PORTA FUNCTIONS
TABLE 10-4: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA
Pin Name Function TRIS
Setting I/O I/O
Type Description
RA0/AN0 RA0 0O DIG LATA<0> data output; not affected by analog input.
1I TTL PORTA<0> data input; disabled when analog input is enabled.
AN0 1I ANA A/D Input Channel 0. Default input configuration on POR; does not
affect digital output.
RA1/AN1/SEG18 RA1 0O DIG LATA<1> data output; not affected by analog input.
1I TTL PORTA<1> data input; disabled when analog input is enabled.
AN1 1I ANA A/D Input Channel 1. Default input configuration on POR; does not
affect digital output.
SEG18 xO ANA LCD Segment 18 output; disables all other pin functions.
RA2/AN2/VREF-RA20O DIG LATA<2> data output; not affected by analog input.
1I TTL PORTA<2> data input; disabled when analog functions are enabled.
AN2 1I ANA A/D Input Channel 2. Default input configuration on POR.
VREF-1I ANA A/D and comparator low reference voltage input.
RA3/AN3/VREF+RA3 0O DIG LATA<3> data output; not affected by analog input.
1I TTL PORTA<3> data input; disabled when analog input is enabled.
AN3 1I ANA A/D Input Channel 3. Default input configuration on POR.
VREF+1I ANA A/D and comparator high reference voltage input.
RA4/T0CKI/
SEG14
RA4 0O DIG LATA<4> data output.
1I ST PORTA<4> data input. Default configuration on POR.
T0CKI xI ST Timer0 clock input.
SEG14 xO ANA LCD Segment 14 output; disables all other pin functions.
RA5/AN4/SEG15 RA5 0O DIG LATA<5> data output; not affected by analog input.
1I TTL PORTA<5> data input; disabled when analog input is enabled.
AN4 1I ANA A/D Input Channel 4. Default configuration on POR.
SEG15 xO ANA LCD Segment 15 output; disables all other pin functions.
OSC2/CLKO/RA6 OSC2 xO ANA Main oscillator feedback output connection (HS and HSPLL modes).
CLKO xO DIG System cycle clock output (FOSC/4) (EC and ECPLL modes).
RA6 0O DIG LATA<6> data output; disabled when FOSC2 Configuration bit is set.
1I TTL PORTA<6> data input; disabled when FOSC2 Configuration bit is set.
OSC1/CLKI/RA7 OSC1 xI ANA Main oscillator input connection (HS and HSPLL modes).
CLKI xI ANA Main external clock source input (EC and ECPLL modes).
RA7 0O DIG LATA<7> data output; disabled when FOSC2 Configuration bit is set.
1I TTL PORTA<7> data input; disabled when FOSC2 Configuration bit is set.
Legend: O = Output, I = Input, ANA = Analog Signal, DIG = Digital Output, ST = Schmitt Trigger Buffer Input,
TTL = TTL Buffer Input, x = Don’t care (TRIS bit does not affect port direction or is overridden for this option).
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values
on page
PORTA RA7(1) RA6(1) RA5 RA4 RA3 RA2 RA1 RA0 52
LATA LATA7(1) LATA6(1) LATA5 LATA4 LATA3 LATA2 LATA1 LATA0 52
TRISA TRISA7(1) TRISA6(1) TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 52
ADCON1 TRIGSEL VCFG1 VCFG0PCFG3PCFG2PCFG1PCFG0 51
LCDSE1 SE15 SE14 SE13 SE12 SE11 SE10 SE09 SE08 51
LCDSE2 SE23 SE22 SE21 SE20 SE19 SE18 SE17 SE16 51
Legend: = unimplemented, read as ‘0’. Shaded cells are not used by PORTA.
Note 1: These bits are enabled depending on the oscillator mode selected. When not enabled as PORTA pins, they are
disabled and read as x’.
PIC18F87J72 FAMILY
DS39979A-page 108 Preliminary 2010 Microchip Technology Inc.
10.3 PORTB, TRISB and
LATB Registers
PORTB is an 8-bit wide, bidirectional port. The
corresponding Data Direction and Output Latch registers
are TRISB and LATB. All pins on PORTB are digital only
and tolerate voltages up to 5.5V.
EXAMPLE 10-2: INITIALIZING PORTB
Each of the PORTB pins has a weak internal pull-up. A
single control bit can turn on all the pull-ups. This is
performed by clearing bit, RBPU (INTCON2<7>). The
weak pull-up is automatically turned off when the port
pin is configured as an output. The pull-ups are
disabled on a Power-on Reset.
Four of the PORTB pins (RB<7:4>) have an
interrupt-on-change feature. Only pins configured as
inputs can cause this interrupt to occur (i.e., any
RB<7:4> pin configured as an output is excluded from
the interrupt-on-change comparison). The input pins (of
RB<7:4>) are compared with the old value latched on
the last read of PORTB. The “mismatch” outputs of
RB<7:4> are ORed together to generate the RB Port
Change Interrupt with Flag bit, RBIF (INTCON<0>).
This interrupt can wake the device from
power-managed modes. The user, in the Interrupt
Service Routine, can clear the interrupt in the following
manner:
a) Any read or write of PORTB (except with the
MOVFF (ANY), PORTB instruction). This will end
the mismatch condition.
b) Wait one instruction cycle.
c) Clear flag bit, RBIF.
A mismatch condition will continue to set flag bit, RBIF.
Reading PORTB will end the mismatch condition and
allow flag bit, RBIF, to be cleared after a delay of one
T
CY.
The interrupt-on-change feature is recommended for
wake-up on key depression operation and operations
where PORTB is only used for the interrupt-on-change
feature. Polling of PORTB is not recommended while
using the interrupt-on-change feature.
RB<3:2> are multiplexed as CTMU edge inputs.
RB<5:0> are also multiplexed with LCD segment
drives, controlled by bits in the LCDSE1 and LCDSE3
registers. I/O port functionality is only available when
the LCD segments are disabled.
CLRF PORTB ; Initialize PORTB by
; clearing output
; data latches
CLRF LATB ; Alternate method
; to clear output
; data latches
MOVLW 0CFh ; Value used to
; initialize data
; direction
MOVWF TRISB ; Set RB<3:0> as inputs
; RB<5:4> as outputs
; RB<7:6> as inputs
2010 Microchip Technology Inc. Preliminary DS39979A-page 109
PIC18F87J72 FAMILY
TABLE 10-5: PORTB FUNCTIONS
Pin Name Function TRIS
Setting I/O I/O
Type Description
RB0/INT0/SEG30 RB0 0O DIG LATB<0> data output.
1I TTL PORTB<0> data input; weak pull-up when RBPU bit is cleared.
INT0 1I ST External Interrupt 0 input.
SEG30 xO ANA LCD Segment 30 output; disables all other pin functions.
RB1/INT1/SEG8 RB1 0O DIG LATB<1> data output.
1I TTL PORTB<1> data input; weak pull-up when RBPU bit is cleared.
INT1 1I ST External Interrupt 1 input.
SEG8 xO ANA LCD Segment 8 output; disables all other pin functions.
RB2/INT2/SEG9/
CTED1
RB2 0O DIG LATB<2> data output.
1I TTL PORTB<2> data input; weak pull-up when RBPU bit is cleared.
INT2 1I ST External Interrupt 2 input.
SEG9 xO ANA LCD Segment 9 output; disables all other pin functions.
CTED1 xI ST CTMU Edge 1 input.
RB3/INT3/SEG10/
CTED2
RB3 0O DIG LATB<3> data output.
1I TTL PORTB<3> data input; weak pull-up when RBPU bit is cleared.
INT3 1I ST External Interrupt 3 input.
SEG10 xO ANA LCD Segment 10 output; disables all other pin functions.
CTED2 xI ST CTMU Edge 2 input.
RB4/KBI0/SEG11 RB4 0O DIG LATB<4> data output.
1I TTL PORTB<4> data input; weak pull-up when RBPU bit is cleared.
KBI0 1I TTL Interrupt-on-pin change.
SEG11 xO ANA LCD Segment 11 output; disables all other pin functions.
RB5/KBI1/SEG29 RB5 0O DIG LATB<5> data output.
1I TTL PORTB<5> data input; weak pull-up when RBPU bit is cleared.
KBI1 1I TTL Interrupt-on-pin change.
SEG29 xO ANA LCD Segment 29 output; disables all other pin functions.
RB6/KBI2/PGC RB6 0O DIG LATB<6> data output.
1I TTL PORTB<6> data input; weak pull-up when RBPU bit is cleared.
KBI2 1I TTL Interrupt-on-pin change.
PGC xI ST Serial execution (ICSP™) clock input for ICSP and ICD operation.
RB7/KBI3/PGD RB7 0O DIG LATB<7> data output.
1I TTL PORTB<7> data input; weak pull-up when RBPU bit is cleared.
KBI3 1I TTL Interrupt-on-pin change.
PGD xO DIG Serial execution data output for ICSP™ and ICD operation.
xI ST Serial execution data input for ICSP and ICD operation.
Legend: O = Output, I = Input, ANA = Analog Signal, DIG = Digital Output, ST = Schmitt Trigger Buffer Input,
TTL = TTL Buffer Input, x = Don’t care (TRIS bit does not affect port direction or is overridden for this option).
PIC18F87J72 FAMILY
DS39979A-page 110 Preliminary 2010 Microchip Technology Inc.
TABLE 10-6: SUMMARY OF REGISTERS ASSOCIATED WITH PORTB
NameBit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0
Reset
Values on
page
PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 52
LATB LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 52
TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 52
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
INTCON2 RBPU INTEDG0 INTEDG1 INTEDG2 INTEDG3 TMR0IP INT3IP RBIP 49
INTCON3 INT2IP INT1IP INT3IE INT2IE INT1IE INT3IF INT2IF INT1IF 49
LCDSE1 SE15 SE14 SE13 SE12 SE11 SE10 SE09 SE08 51
LCDSE3 SE31 SE30 SE29 SE28 SE27 SE26 SE25 SE24 51
Legend: Shaded cells are not used by PORTB.
2010 Microchip Technology Inc. Preliminary DS39979A-page 111
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10.4 PORTC, TRISC and
LATC Registers
PORTC is an 8-bit wide, bidirectional port. The
corresponding Data Direction and Output Latch registers
are TRISC and LATC. Only PORTC pins, RC2 through
RC7, are digital only pins and can tolerate input voltages
up to 5.5V.
PORTC is multiplexed with CCP, MSSP and EUSART
peripheral functions (Table 10-7). The pins have
Schmitt Trigger input buffers. The pins for CCP, SPI
and EUSART are also configurable for open-drain out-
put whenever these functions are active. Open-drain
configuration is selected by setting the SPIOD,
CCPxOD, and U1OD control bits (TRISG<7:5> and
LATG<6>, respectively).
RC1 is normally configured as the default peripheral
pin for the CCP2 module. Assignment of CCP2 is
controlled by Configuration bit, CCP2MX (default state,
CCP2MX = 1).
When enabling peripheral functions, care should be
taken in defining TRIS bits for each PORTC pin. Some
peripherals override the TRIS bit to make a pin an output,
while other peripherals override the TRIS bit to make a
pin an input. The user should refer to the corresponding
peripheral section for the correct TRIS bit settings.
The contents of the TRISC register are affected by
peripheral overrides. Reading TRISC always returns
the current contents, even though a peripheral device
may be overriding one or more of the pins.
RC<7:1> pins are multiplexed with LCD segment
drives, controlled by bits in the LCDSE1, LCDSE2,
LCDSE3 and LCDSE4 registers. I/O port functionality
is only available when the LCD segments are disabled.
EXAMPLE 10-3: INITIALIZING PORTC
Note: These pins are configured as digital inputs
on any device Reset.
CLRF PORTC ; Initialize PORTC by
; clearing output
; data latches
CLRF LATC ; Alternate method
; to clear output
; data latches
MOVLW 0CFh ; Value used to
; initialize data
; direction
MOVWF TRISC ; Set RC<3:0> as inputs
; RC<5:4> as outputs
; RC<7:6> as inputs
PIC18F87J72 FAMILY
DS39979A-page 112 Preliminary 2010 Microchip Technology Inc.
TABLE 10-7: PORTC FUNCTIONS
Pin Name Function TRIS
Setting I/O I/O
Type Description
RC0/T1OSO/
T13CKI
RC0 0O DIG LATC<0> data output.
1I ST PORTC<0> data input.
T1OSO xO ANA Timer1 oscillator output; enabled when Timer1 oscillator is enabled. Disables
digital I/O and LCD segment driver.
T13CKI 1I ST Timer1/Timer3 counter input.
RC1/T1OSI/
CCP2/SEG32
RC1 0O DIG LATC<1> data output.
1I ST PORTC<1> data input.
T1OSI xI ANA Timer1 oscillator input.
CCP2(1) 0O DIG CCP2 Compare/PWM output.
1I ST CCP2 Capture input.
SEG32 xO ANA LCD Segment 32 output; disables all other pin functions.
RC2/CCP1/
SEG13
RC2 0O DIG LATC<2> data output.
1I ST PORTC<2> data input.
CCP1 0O DIG CCP1 Compare/PWM output; takes priority over port data.
1I ST CCP1 Capture input.
SEG13 xO ANA LCD Segment 13 output; disables all other pin functions.
RC3/SCK/SCL/
SEG17
RC3 0O DIG LATC<3> data output.
1I ST PORTC<3> data input.
SCK 0O DIG SPI clock output (MSSP module); takes priority over port data.
1I ST SPI clock input (MSSP module).
SCL 0ODIGI
2C™ clock output (MSSP module); takes priority over port data.
1II2CI
2C clock input (MSSP module); input type depends on module setting.
SEG17 xO ANA LCD Segment 17 output; disables all other pin functions.
RC4/SDI/SDA/
SEG16
RC4 0O DIG LATC<4> data output.
1I ST PORTC<4> data input.
SDI I ST SPI data input (MSSP module).
SDA 1ODIGI
2C data output (MSSP module); takes priority over port data.
1II2CI
2C data input (MSSP module); input type depends on module setting.
SEG16 xO ANA LCD Segment 16 output; disables all other pin functions.
RC5/SDO/
SEG12
RC5 0O DIG LATC<5> data output.
1I ST PORTC<5> data input.
SDO 0O DIG SPI data output (MSSP module).
SEG12 xO ANA LCD Segment 12 output; disables all other pin functions.
RC6/TX1/CK1/
SEG27
RC6 0O DIG LATC<6> data output.
1I ST PORTC<6> data input.
TX1 1O DIG Synchronous serial data output (EUSART module); takes priority over port data.
CK1 1O DIG Synchronous serial data input (EUSART module); user must configure as an input.
1I ST Synchronous serial clock input (EUSART module).
SEG27 xO ANA LCD Segment 27 output; disables all other pin functions.
RC7/RX1/DT1/
SEG28
RC7 0O DIG LATC<7> data output.
1I ST PORTC<7> data input.
RX1 1I ST Asynchronous serial receive data input (EUSART module).
DT1 1O DIG Synchronous serial data output (EUSART module); takes priority over port data.
1I ST Synchronous serial data input (EUSART module); user must configure as an input.
SEG28 xO ANA LCD Segment 28 output; disables all other pin functions.
Legend: O = Output, I = Input, ANA = Analog Signal, DIG = Digital Output, ST = Schmitt Trigger Buffer Input, TTL = TTL Buffer Input,
I2C = I2C/SMBus Buffer Input, x = Don’t care (TRIS bit does not affect port direction or is overridden for this option).
Note 1: Default assignment for CCP2 when CCP2MX Configuration bit is set.
2010 Microchip Technology Inc. Preliminary DS39979A-page 113
PIC18F87J72 FAMILY
TABLE 10-8: SUMMARY OF REGISTERS ASSOCIATED WITH PORTC
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on page
PORTC RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 52
LATC LATC7 LATBC6 LATC5 LATCB4 LATC3 LATC2 LATC1 LATC0 52
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 52
LATG U2OD U1OD LATG4 LATG3 LATG2 LATG1 LATG0 52
TRISG SPIOD CCP2OD CCP1OD TRISG4 TRISG3 TRISG2 TRISG1 TRISG0 52
LCDSE1 SE15 SE14 SE13 SE12 SE11 SE10 SE09 SE08 51
LCDSE2 SE23 SE22 SE21 SE20 SE19 SE18 SE17 SE16 51
LCDSE3 SE31 SE30 SE29 SE28 SE27 SE26 SE25 SE24 51
LCDSE4 —————— SE32 51
Legend: Shaded cells are not used by PORTC.
PIC18F87J72 FAMILY
DS39979A-page 114 Preliminary 2010 Microchip Technology Inc.
10.5 PORTD, TRISD and
LATD Registers
PORTD is an 8-bit wide, bidirectional port. The
corresponding Data Direction and Output Latch registers
are TRISD and LATD. All pins on PORTD are digital only
and tolerate voltages up to 5.5V.
All pins on PORTD are implemented with Schmitt
Trigger input buffers. Each pin is individually
configurable as an input or output.
Each of the PORTD pins has a weak internal pull-up. A
single control bit can turn off all the pull-ups. This is
performed by clearing bit, RDPU (PORTG<7>). The
weak pull-up is automatically turned off when the port
pin is configured as an output. The pull-ups are
disabled on all device Resets.
All of the PORTD pins are multiplexed with LCD
segment drives, controlled by bits in the LCDSE0
register. RD0 is multiplexed with the CTMU Pulse
Generator output.
I/O port functionality is only available when the LCD
segments are disabled.
EXAMPLE 10-4: INITIALIZING PORTD
Note: These pins are configured as digital inputs
on any device Reset.
CLRF PORTD ; Initialize PORTD by
; clearing output
; data latches
CLRF LATD ; Alternate method
; to clear output
; data latches
MOVLW 0CFh ; Value used to
; initialize data
; direction
MOVWF TRISD ; Set RD<3:0> as inputs
; RD<5:4> as outputs
; RD<7:6> as inputs
2010 Microchip Technology Inc. Preliminary DS39979A-page 115
PIC18F87J72 FAMILY
TABLE 10-9: PORTD FUNCTIONS
TABLE 10-10: SUMMARY OF REGISTERS ASSOCIATED WITH PORTD
Pin Name Function TRIS
Setting I/O I/O
Type Description
RD0/SEG0/
CTPLS
RD0 0O DIG LATD<0> data output.
1I ST PORTD<0> data input.
SEG0 xO ANA LCD Segment 0 output; disables all other pin functions.
CTPLS xO DIG CTMU Pulse Generator output
RD1/SEG1 RD1 0O DIG LATD<1> data output.
1I ST PORTD<1> data input.
SEG1 xO ANA LCD Segment 1 output; disables all other pin functions.
RD2/SEG2 RD2 0O DIG LATD<2> data output.
1I ST PORTD<2> data input.
SEG2 xO ANA LCD Segment 2 output; disables all other pin functions.
RD3/SEG3 RD3 0O DIG LATD<3> data output.
1I ST PORTD<3> data input.
SEG3 xO ANA LCD Segment 3 output; disables all other pin functions.
RD4/SEG4 RD4 0O DIG LATD<4> data output.
1I ST PORTD<4> data input.
SEG4 xO ANA LCD Segment 4 output; disables all other pin functions.
RD5/SEG5 RD5 0O DIG LATD<5> data output.
1I ST PORTD<5> data input.
SEG5 xO ANA LCD Segment 5 output; disables all other pin functions.
RD6/SEG6 RD6 0O DIG LATD<6> data output.
1I ST PORTD<6> data input.
SEG6 xO ANA LCD Segment 6 output; disables all other pin functions.
RD7/SEG7 RD7 0O DIG LATD<7> data output.
1I ST PORTD<7> data input.
SEG7 xI ANA LCD Segment 7 output; disables all other pin functions.
Legend: O = Output, I = Input, ANA = Analog Signal, DIG = Digital Output, ST = Schmitt Trigger Buffer Input,
x = Don’t care (TRIS bit does not affect port direction or is overridden for this option).
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on page
PORTD RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 52
LATD LATD7 LATD6 LATD5 LATD4 LATD3 LATD2 LATD1 LATD0 52
TRISD TRISD7 TRISD6 TRISD5 TRISD4TRISD3TRISD2TRISD1TRISD0 52
PORTG RDPU REPU RJPU RG4 RG3 RG2 RG1 RG0 52
LCDSE0 SE07 SE06 SE05 SE04 SE03 SE02 SE01 SE00 51
Legend: Shaded cells are not used by PORTD.
PIC18F87J72 FAMILY
DS39979A-page 116 Preliminary 2010 Microchip Technology Inc.
10.6 PORTE, TRISE and
LATE Registers
PORTE is a 7-bit wide, bidirectional port. The
corresponding Data Direction and Output Latch registers
are TRISE and LATE. All pins on PORTE are digital only
and tolerate voltages up to 5.5V.
All pins on PORTE are implemented with Schmitt
Trigger input buffers. Each pin is individually
configurable as an input or output. The RE7 pin is also
configurable for open-drain output when CCP2 is active
on this pin. Open-drain configuration is selected by
setting the CCP2OD control bit (TRISG<6>)
Each of the PORTE pins has a weak internal pull-up. A
single control bit can turn off all the pull-ups. This is
performed by clearing bit, REPU (PORTG<6>). The
weak pull-up is automatically turned off when the port
pin is configured as an output. The pull-ups are
disabled on any device Reset.
Pins, RE<6:3>, are multiplexed with the LCD common
drives. I/O port functions are only available on those
PORTE pins depending on which commons are active.
The configuration is determined by the LMUX<1:0>
control bits (LCDCON<1:0>). The availability is
summarized in Table 10-11.
TABLE 10-11: PORTE PINS AVAILABLE IN
DIFFERENT LCD DRIVE
CONFIGURATIONS
Pins, RE1 and RE0, are multiplexed with the functions
of LCDBIAS2 and LCDBIAS1. When LCD bias genera-
tion is required (i.e., any application where the device
is connected to an external LCD), these pins cannot be
used as digital I/O.
RE7 is multiplexed with the LCD segment drive
(SEG31) controlled by the LCDSE3<7> bit. I/O port
function is only available when the segment is disabled.
RE7 can also be configured as the alternate peripheral
pin for the CCP2 module. This is done by clearing the
CCP2MX Configuration bit.
EXAMPLE 10-5: INITIALIZING PORTE
Note: These pins are configured as digital inputs
on any device Reset.
LCDCON
<1:0>
Active LCD
Commons
PORTE Available
for I/O
00 COM0 RE6, RE5, RE4
01 COM0, COM1 RE6, RE5
10 COM0, COM1
and COM2
RE6
11 All (COM0
through COM3)
None
Note: The pin corresponding to RE2 of other
PIC18F parts has the function of
LCDBIAS3 in this device. It cannot be used
as digital I/O.
CLRF PORTE ; Initialize PORTE by
; clearing output
; data latches
CLRF LATE ; Alternate method
; to clear output
; data latches
MOVLW 03h ; Value used to
; initialize data
; direction
MOVWF TRISE ; Set RE<1:0> as inputs
; RE<7:2> as outputs
2010 Microchip Technology Inc. Preliminary DS39979A-page 117
PIC18F87J72 FAMILY
TABLE 10-12: PORTE FUNCTIONS
TABLE 10-13: SUMMARY OF REGISTERS ASSOCIATED WITH PORTE
Pin Name Function TRIS
Setting I/O I/O
Type Description
RE0/LCDBIAS1 RE0 0O DIG LATE<0> data output.
1I ST PORTE<0> data input.
LCDBIAS1 I ANA LCD module bias voltage input.
RE1/LCDBIAS2 RE1 0O DIG LATE<1> data output.
1I ST PORTE<1> data input.
LCDBIAS2 I ANA LCD module bias voltage input.
RE3/COM0 RE3 0O DIG LATE<3> data output.
1I ST PORTE<3> data input.
COM0 xO ANA LCD Common 0 output; disables all other outputs.
RE4/COM1 RE4 0O DIG LATE<4> data output.
1I ST PORTE<4> data input.
COM1 xO ANA LCD Common 1 output; disables all other outputs.
RE5/COM2 RE5 0O DIG LATE<5> data output.
1I ST PORTE<5> data input.
COM2 xO ANA LCD Common 2 output; disables all other outputs.
RE6/COM3 RE6 0O DIG LATE<6> data output.
1I ST PORTE<6> data input.
COM3 xO ANA LCD Common 3 output; disables all other outputs.
RE7/CCP2/
SEG31
RE7 0O DIG LATE<7> data output.
1I ST PORTE<7> data input.
CCP2(1) 0O DIG CCP2 Compare/PWM output; takes priority over port data.
1I ST CCP2 Capture input.
SEG31 xO ANA Segment 31 analog output for LCD; disables digital output.
Legend: O = Output, I = Input, ANA = Analog Signal, DIG = Digital Output, ST = Schmitt Trigger Buffer Input,
x = Don’t care (TRIS bit does not affect port direction or is overridden for this option).
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on page
PORTE RE7 RE6 RE5 RE4 RE3 —RE1RE052
LATE LATE7 LATE6 LATE5 LATE4 LATE3 —LATE1LATE052
TRISE TRISE7 TRISE6 TRISE5 TRISE4 TRISE3 TRISE1 TRISE0 52
PORTG RDPU REPU RJPU RG4 RG3 RG2 RG1 RG0 52
TRISG SPIOD CCP2OD CCP1OD TRISG4 TRISG3 TRISG2 TRISG1 TRISG0 52
LCDCON LCDEN SLPEN WERR CS1 CS0 LMUX1 LMUX0 51
LCDSE3 SE31 SE30 SE29 SE28 SE27 SE26 SE25 SE24 51
Legend: Shaded cells are not used by PORTE.
PIC18F87J72 FAMILY
DS39979A-page 118 Preliminary 2010 Microchip Technology Inc.
10.7 PORTF, LATF and TRISF Registers
PORTF is a 7-bit wide, bidirectional port. The
corresponding Data Direction and Output Latch registers
are TRISF and LATF. All pins on PORTF are
implemented with Schmitt Trigger input buffers. Each pin
is individually configurable as an input or output.
PORTF is multiplexed with analog peripheral functions,
as well as LCD segments. Pins, RF1 through RF6, may
be used as comparator inputs or outputs by setting the
appropriate bits in the CMCON register. To use
RF<6:3> as digital inputs, it is also necessary to turn off
the comparators.
PORTF is also multiplexed with LCD segment drives
controlled by bits in the LCDSE2 and LCDSE3
registers. I/O port functions are only available when the
segments are disabled.
EXAMPLE 10-6: INITIALIZING PORTF
Note 1: On device Resets, pins, RF<6:1>, are
configured as analog inputs and are read
as ‘0’.
2: To configure PORTF as digital I/O, turn off
comparators and set ADCON1 value.
CLRF PORTF ; Initialize PORTF by
; clearing output
; data latches
CLRF LATF ; Alternate method
; to clear output
; data latches
MOVLW 07h ;
MOVWF CMCON ; Turn off comparators
MOVLW 0Fh ;
MOVWF ADCON1 ; Set PORTF as digital I/O
MOVLW 0CEh ; Value used to
; initialize data
; direction
MOVWF TRISF ; Set RF3:RF1 as inputs
; RF5:RF4 as outputs
; RF7:RF6 as inputs
2010 Microchip Technology Inc. Preliminary DS39979A-page 119
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TABLE 10-14: PORTF FUNCTIONS
Pin Name Function TRIS
Setting I/O I/O
Type Description
RF1/AN6/C2OUT/
SEG19
RF1 0O DIG LATF<1> data output; not affected by analog input.
1I ST PORTF<1> data input; disabled when analog input is enabled.
AN6 1I ANA A/D Input Channel 6. Default configuration on POR.
C2OUT 0O DIG Comparator 2 output; takes priority over port data.
SEG19 xO ANA LCD Segment 19 output; disables all other pin functions.
RF2/AN7/C1OUT/
SEG20
RF2 0O DIG LATF<2> data output; not affected by analog input.
1I ST PORTF<2> data input; disabled when analog input is enabled.
AN7 1I ANA A/D Input Channel 7. Default configuration on POR.
C1OUT 0O DIG Comparator 1 output; takes priority over port data.
SEG20 xO ANA LCD Segment 20 output; disables all other pin functions.
RF3/AN8/SEG21/
C2INB
RF3 0O DIG LATF<3> data output; not affected by analog input.
1I ST PORTF<3> data input; disabled when analog input is enabled.
AN8 1I ANA A/D Input Channel 8 and Comparator C2+ input. Default input
configuration on POR; not affected by analog output.
SEG21 xO ANA LCD Segment 21 output; disables all other pin functions.
C2INB 1I ANA Comparator 2 Input B.
RF4/AN9/SEG22/
C2INA
RF4 0O DIG LATF<4> data output; not affected by analog input.
1I ST PORTF<4> data input; disabled when analog input is enabled.
AN9 1I ANA A/D Input Channel 9 and Comparator C2- input. Default input
configuration on POR; does not affect digital output.
SEG22 xO ANA LCD Segment 22 output; disables all other pin functions.
C2INA 1I ANA Comparator 2 Input A.
RF5/AN10/CVREF/
SEG23/C1INB
RF5 0O DIG LATF<5> data output; not affected by analog input. Disabled when
CVREF output is enabled.
1I ST PORTF<5> data input; disabled when analog input is enabled.
Disabled when CVREF output is enabled.
AN10 1I ANA A/D Input Channel 10 and Comparator C1+ input. Default input
configuration on POR.
CVREF xO ANA Comparator voltage reference output. Enabling this feature disables
digital I/O.
SEG23 xO ANA LCD Segment 23 output; disables all other pin functions.
C1INB 1I ANA Comparator 1 Input B.
RF6/AN11/SEG24/
C1INA
RF6 0O DIG LATF<6> data output; not affected by analog input.
1I ST PORTF<6> data input; disabled when analog input is enabled.
AN11 1I ANA A/D Input Channel 11 and Comparator C1- input. Default input
configuration on POR; does not affect digital output.
SEG24 xO ANA LCD Segment 24 output; disables all other pin functions.
C1INA 1I ANA Comparator 1 Input A.
RF7/AN5/SS/
SEG25
RF7 0O DIG LATF<7> data output; not affected by analog input.
1I ST PORTF<7> data input; disabled when analog input is enabled.
AN5 1I ANA A/D Input Channel 5. Default configuration on POR.
SS 1I TTL Slave select input for MSSP module.
SEG25 xO ANA LCD Segment 25 output; disables all other pin functions.
Legend: O = Output, I = Input, ANA = Analog Signal, DIG = Digital Output, ST = Schmitt Trigger Buffer Input,
TTL = TTL Buffer Input, x = Don’t care (TRIS bit does not affect port direction or is overridden for this option).
PIC18F87J72 FAMILY
DS39979A-page 120 Preliminary 2010 Microchip Technology Inc.
TABLE 10-15: SUMMARY OF REGISTERS ASSOCIATED WITH PORTF
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on page
PORTF RF7 RF6 RF5 RF4 RF3 RF2 RF1 —52
LATF LATF7 LATF6 LATF5 LATF4 LATF3 LATF2 LATF1 —52
TRISF TRISF7TRISF6TRISF5TRISF4TRISF3TRISF2TRISF1 —52
ADCON1 TRIGSEL VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 51
CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 51
CVRCON CVREN CVROE CVRR CVRSS CVR3 CVR2 CVR1 CVR0 51
LCDSE2 SE23 SE22 SE21 SE20 SE19 SE18 SE17 SE16 51
LCDSE3 SE31 SE30 SE29 SE28 SE27 SE26 SE25 SE24 51
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PORTF.
2010 Microchip Technology Inc. Preliminary DS39979A-page 121
PIC18F87J72 FAMILY
10.8 PORTG, TRISG and
LATG Registers
PORTG is a 5-bit wide, bidirectional port. The
corresponding Data Direction and Output Latch registers
are TRISG and LATG. All pins on PORTG are digital only
and tolerate voltages up to 5.5V.
PORTG is multiplexed with both AUSART and LCD
functions (Table 10-16). When operating as I/O, all
PORTG pins have Schmitt Trigger input buffers. The
RG1 pin is also configurable for open-drain output
when the AUSART is active. Open-drain configuration
is selected by setting the U2OD control bit (LATG<7>).
RG4 is multiplexed with LCD segment drives controlled
by bits in the LCDSE2 register and as the RTCC pin.
The I/O port function is only available when the
segments are disabled.
RG3 and RG2 are multiplexed with VLCAP pins for the
LCD charge pump and RG0 is multiplexed with the
LCDBIAS0 bias voltage input. When these pins are
used for LCD bias generation, the I/O and other
functions are unavailable.
When enabling peripheral functions, care should be
taken in defining TRIS bits for each PORTG pin. Some
peripherals override the TRIS bit to make a pin an
output, while other peripherals override the TRIS bit to
make a pin an input. The user should refer to the
corresponding peripheral section for the correct TRIS bit
settings. The pin override value is not loaded into the
TRIS register. This allows read-modify-write of the TRIS
register without concern due to peripheral overrides.
Although the port itself is only five bits wide, the
PORTG<7:5> bits are still implemented to control the
weak pull-ups on the I/O ports associated with PORTD,
PORTE and PORTJ. Clearing these bits enables the
respective port pull-ups. By default, all pull-ups are
disabled on device Resets.
Most of the corresponding TRISG and LATG bits are
implemented as open-drain control bits for CCP1,
CCP2 and SPI (TRISG<7:5>), and the USARTs
(LATG<7:6>). Setting these bits configures the output
pin for the corresponding peripheral for open-drain
operation. LATG<5> is not implemented.
EXAMPLE 10-7: INITIALIZING PORTG
CLRF PORTG ; Initialize PORTG by
; clearing output
; data latches
CLRF LATG ; Alternate method
; to clear output
; data latches
MOVLW 04h ; Value used to
; initialize data
; direction
MOVWF TRISG ; Set RG1:RG0 as outputs
; RG2 as input
; RG4:RG3 as inputs
PIC18F87J72 FAMILY
DS39979A-page 122 Preliminary 2010 Microchip Technology Inc.
TABLE 10-16: PORTG FUNCTIONS
TABLE 10-17: SUMMARY OF REGISTERS ASSOCIATED WITH PORTG
Pin Name Function TRIS
Setting I/O I/O
Type Description
RG0/LCDBIAS0 RG0 0O DIG LATG<0> data output.
1I ST PORTG<0> data input.
LCDBIAS0 xI ANA LCD module bias voltage input.
RG1/TX2/CK2 RG1 0O DIG LATG<1> data output.
1I ST PORTG<1> data input.
TX2 1O DIG Synchronous serial data output (AUSART module); takes priority over
port data.
CK2 1O DIG Synchronous serial data input (AUSART module); user must configure
as an input.
1I ST Synchronous serial clock input (AUSART module).
RG2/RX2/DT2/
VLCAP1
RG2 0O DIG LATG<2> data output.
1I ST PORTG<2> data input.
RX2 1I ST Asynchronous serial receive data input (AUSART module).
DT2 1O DIG Synchronous serial data output (AUSART module); takes priority over
port data.
1I ST Synchronous serial data input (AUSART module); user must configure
as an input.
VLCAP1xI ANA LCD charge pump capacitor input.
RG3/VLCAP2RG30O DIG LATG<3> data output.
1I ST PORTG<3> data input.
VLCAP2xI ANA LCD charge pump capacitor input.
RG4/SEG26/
RTCC
RG4 0O DIG LATG<4> data output.
1I ST PORTG<4> data input.
SEG26 xO ANA LCD Segment 26 output; disables all other pin functions.
RTCC xO DIG RTCC output.
Legend: O = Output, I = Input, ANA = Analog Signal, DIG = Digital Output, ST = Schmitt Trigger Buffer Input,
x = Don’t care (TRIS bit does not affect port direction or is overridden for this option).
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values on
page
PORTG RDPU REPU RJPU RG4 RG3 RG2 RG1 RG0 52
LATG U2OD U1OD LATG4 LATG3 LATG2 LATG1 LATG0 52
TRISG SPIOD CCP2OD CCP1OD TRISG4 TRISG3 TRISG2 TRISG1 TRISG0 52
LCDSE3 SE31 SE30 SE29 SE28 SE27 SE26 SE25 SE24 51
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PORTG.
2010 Microchip Technology Inc. Preliminary DS39979A-page 123
PIC18F87J72 FAMILY
11.0 TIMER0 MODULE
The Timer0 module incorporates the following features:
Software selectable operation as a timer or
counter in both 8-bit or 16-bit modes
Readable and writable registers
Dedicated 8-bit, software programmable
prescaler
Selectable clock source (internal or external)
Edge select for external clock
Interrupt-on-overflow
The T0CON register (Register 11-1) controls all
aspects of the module’s operation, including the
prescale selection; it is both readable and writable.
A simplified block diagram of the Timer0 module in 8-bit
mode is shown in Figure 11-1. Figure 11-2 shows a
simplified block diagram of the Timer0 module in 16-bit
mode.
REGISTER 11-1: T0CON: TIMER0 CONTROL REGISTER
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
TMR0ON T08BIT T0CS T0SE PSA T0PS2 T0PS1 T0PS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 TMR0ON: Timer0 On/Off Control bit
1 = Enables Timer0
0 = Stops Timer0
bit 6 T08BIT: Timer0 8-Bit/16-Bit Control bit
1 = Timer0 is configured as an 8-bit timer/counter
0 = Timer0 is configured as a 16-bit timer/counter
bit 5 T0CS: Timer0 Clock Source Select bit
1 = Transition on T0CKI pin input edge
0 = Internal clock (2/4)
bit 4 T0SE: Timer0 Source Edge Select bit
1 = Increment on high-to-low transition on T0CKI pin
0 = Increment on low-to-high transition on T0CKI pin
bit 3 PSA: Timer0 Prescaler Assignment bit
1 = TImer0 prescaler is not assigned. Timer0 clock input bypasses prescaler.
0 = Timer0 prescaler is assigned. Timer0 clock input comes from prescaler output.
bit 2-0 T0PS<2:0>: Timer0 Prescaler Select bits
111 = 1:256 Prescale value
110 = 1:128 Prescale value
101 = 1:64 Prescale value
100 = 1:32 Prescale value
011 = 1:16 Prescale value
010 = 1:8 Prescale value
001 = 1:4 Prescale value
000 = 1:2 Prescale value
PIC18F87J72 FAMILY
DS39979A-page 124 Preliminary 2010 Microchip Technology Inc.
11.1 Timer0 Operation
Timer0 can operate as either a timer or a counter. The
mode is selected with the T0CS bit (T0CON<5>). In
Timer mode (T0CS = 0), the module increments on
every clock by default unless a different prescaler value
is selected (see Section 11.3 “Prescaler”). If the
TMR0 register is written to, the increment is inhibited
for the following two instruction cycles. The user can
work around this by writing an adjusted value to the
TMR0 register.
The Counter mode is selected by setting the T0CS bit
(= 1). In this mode, Timer0 increments either on every
rising or falling edge of pin, RA4/T0CKI. The increment-
ing edge is determined by the Timer0 Source Edge
Select bit, T0SE (T0CON<4>); clearing this bit selects
the rising edge. Restrictions on the external clock input
are discussed below.
An external clock source can be used to drive Timer0,
however, it must meet certain requirements to ensure
that the external clock can be synchronized with the
internal phase clock (T
OSC). There is a delay between
synchronization and the onset of incrementing the
timer/counter.
11.2 Timer0 Reads and Writes in
16-Bit Mode
TMR0H is not the actual high byte of Timer0 in 16-bit
mode. It is actually a buffered version of the real high
byte of Timer0, which is not directly readable nor writ-
able (refer to Figure 11-2). TMR0H is updated with the
contents of the high byte of Timer0 during a read of
TMR0L. This provides the ability to read all 16 bits of
Timer0 without having to verify that the read of the high
and low byte were valid, due to a rollover between
successive reads of the high and low byte.
Similarly, a write to the high byte of Timer0 must also
take place through the TMR0H Buffer register. The high
byte is updated with the contents of TMR0H when a
write occurs to TMR0L. This allows all 16 bits of Timer0
to be updated at once.
FIGURE 11-1: TIMER0 BLOCK DIAGRAM (8-BIT MODE)
FIGURE 11-2: TIMER0 BLOCK DIAGRAM (16-BIT MODE)
Note: Upon Reset, Timer0 is enabled in 8-bit mode with the clock input from T0CKI max. prescale.
T0CKI Pin
T0SE
0
1
1
0
T0CS
FOSC/4
Sync with
Internal
Clocks
TMR0L
(2 TCY Delay)
Internal Data Bus
PSA
T0PS<2:0>
Set
TMR0IF
on Overflow
38
8
Programmable
Prescaler
Note: Upon Reset, Timer0 is enabled in 8-bit mode with the clock input from T0CKI max. prescale.
T0CKI Pin
T0SE
0
1
1
0
T0CS
FOSC/4
Sync with
Internal
Clocks
TMR0L
(2 TCY Delay)
Internal Data Bus
8
PSA
T0PS<2:0>
Set
TMR0IF
on Overflow
3
TMR0
TMR0H
High Byte
88
8
Read TMR0L
Write TMR0L
8
Programmable
Prescaler
2010 Microchip Technology Inc. Preliminary DS39979A-page 125
PIC18F87J72 FAMILY
11.3 Prescaler
An 8-bit counter is available as a prescaler for the Timer0
module. The prescaler is not directly readable or writable.
Its value is set by the PSA and T0PS<2:0> bits
(T0CON<3:0>) which determine the prescaler
assignment and prescale ratio.
Clearing the PSA bit assigns the prescaler to the
Timer0 module. When it is assigned, prescale values
from 1:2 through 1:256, in power-of-2 increments, are
selectable.
When assigned to the Timer0 module, all instructions
writing to the TMR0 register (e.g., CLRF TMR0, MOVWF
TMR0, BSF TMR0, etc.) clear the prescaler count.
11.3.1 SWITCHING PRESCALER
ASSIGNMENT
The prescaler assignment is fully under software
control and can be changed “on-the-fly” during program
execution.
11.4 Timer0 Interrupt
The TMR0 interrupt is generated when the TMR0
register overflows from FFh to 00h in 8-bit mode or
from FFFFh to 0000h in 16-bit mode. This overflow sets
the TMR0IF flag bit. The interrupt can be masked by
clearing the TMR0IE bit (INTCON<5>). Before
re-enabling the interrupt, the TMR0IF bit must be
cleared in software by the Interrupt Service Routine.
Since Timer0 is shut down in Sleep mode, the TMR0
interrupt cannot awaken the processor from Sleep.
TABLE 11-1: REGISTERS ASSOCIATED WITH TIMER0
Note: Writing to TMR0 when the prescaler is
assigned to Timer0 will clear the prescaler
count but will not change the prescaler
assignment.
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on page
TMR0L Timer0 Register Low Byte 50
TMR0H Timer0 Register High Byte 50
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
T0CON TMR0ON T08BIT T0CS T0SE PSA T0PS2 T0PS1 T0PS0 50
TRISA TRISA7(1) TRISA6(1) TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 52
Legend: — = unimplemented, read as 0’. Shaded cells are not used by Timer0.
Note 1: RA<7:6> and their associated latch and direction bits are configured as port pins only when the internal
oscillator is selected as the default clock source (FOSC2 Configuration bit = 0); otherwise, they are
disabled and these bits read as 0’.
PIC18F87J72 FAMILY
DS39979A-page 126 Preliminary 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. Preliminary DS39979A-page 127
PIC18F87J72 FAMILY
12.0 TIMER1 MODULE
The Timer1 timer/counter module incorporates these
features:
Software selectable operation as a 16-bit timer or
counter
Readable and writable 8-bit registers (TMR1H
and TMR1L)
Selectable clock source (internal or external) with
device clock or Timer1 oscillator internal options
Interrupt-on-overflow
Reset on CCP Special Event Trigger
Device clock status flag (T1RUN)
A simplified block diagram of the Timer1 module is
shown in Figure 12-1. A block diagram of the module’s
operation in Read/Write mode is shown in Figure 12-2.
The module incorporates its own low-power oscillator
to provide an additional clocking option. The Timer1
oscillator can also be used as a low-power clock source
for the microcontroller in power-managed operation.
Timer1 can also be used to provide Real-Time Clock
(RTC) functionality to applications with only a minimal
addition of external components and code overhead.
Timer1 is controlled through the T1CON Control
register (Register 12-1). It also contains the Timer1
Oscillator Enable bit (T1OSCEN). Timer1 can be
enabled or disabled by setting or clearing control bit,
TMR1ON (T1CON<0>).
REGISTER 12-1: T1CON: TIMER1 CONTROL REGISTER
R/W-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RD16 T1RUN T1CKPS1 T1CKPS0
T1OSCEN
T1SYNC TMR1CS TMR1ON
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 RD16: 16-Bit Read/Write Mode Enable bit
1 = Enables register read/write of TImer1 in one 16-bit operation
0 = Enables register read/write of Timer1 in two 8-bit operations
bit 6 T1RUN: Timer1 System Clock Status bit
1 = Device clock is derived from Timer1 oscillator
0 = Device clock is derived from another source
bit 5-4 T1CKPS<1:0>: Timer1 Input Clock Prescale Select bits
11 = 1:8 Prescale value
10 = 1:4 Prescale value
01 = 1:2 Prescale value
00 = 1:1 Prescale value
bit 3 T1OSCEN: Timer1 Oscillator Enable bit
1 = Timer1 oscillator is enabled
0 = Timer1 oscillator is shut off
The oscillator inverter and feedback resistor are turned off to eliminate power drain.
bit 2 T1SYNC: Timer1 External Clock Input Synchronization Select bit
When TMR1CS = 1:
1 = Do not synchronize external clock input
0 = Synchronize external clock input
When TMR1CS = 0:
This bit is ignored. Timer1 uses the internal clock when TMR1CS = 0.
bit 1 TMR1CS: Timer1 Clock Source Select bit
1 = External clock from pin, RC0/T1OSO/T13CKI (on the rising edge)
0 = Internal clock (FOSC/4)
bit 0 TMR1ON: Timer1 On bit
1 = Enables Timer1
0 =Stops Timer1
PIC18F87J72 FAMILY
DS39979A-page 128 Preliminary 2010 Microchip Technology Inc.
12.1 Timer1 Operation
Timer1 can operate in one of these modes:
•Timer
Synchronous Counter
Asynchronous Counter
The operating mode is determined by the clock select
bit, TMR1CS (T1CON<1>). When TMR1CS is cleared
(= 0), Timer1 increments on every internal instruction
cycle (FOSC/4). When the bit is set, Timer1 increments
on every rising edge of the Timer1 external clock input
or the Timer1 oscillator, if enabled.
When Timer1 is enabled, the RC1/T1OSI/SEG32 and
RC0/T1OSO/T13CKI pins become inputs. This means
the values of TRISC<1:0> are ignored and the pins are
read as ‘0’.
FIGURE 12-1: TIMER1 BLOCK DIAGRAM (8-BIT MODE)
FIGURE 12-2: TIMER1 BLOCK DIAGRAM (16-BIT READ/WRITE MODE)
T1SYNC
TMR1CS
T1CKPS<1:0>
Sleep Input
T1OSCEN(1)
FOSC/4
Internal
Clock
On/Off
1
0
2
T1OSO/T13CKI
T1OSI
1
0
TMR1ON
TMR1L
Set
TMR1IF
on Overflow
TMR1
High Byte
Clear TMR1
(CCP Special Event Trigger)
Timer1 Oscillator
Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain.
On/Off
Timer1
Timer1 Clock Input
Prescaler
1, 2, 4, 8
Synchronize
Detect
T1SYNC
TMR1CS
T1CKPS<1:0>
Sleep Input
T1OSCEN(1)
FOSC/4
Internal
Clock
1
0
2
T1OSO/T13CKI
T1OSI
Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain.
1
0
TMR1L
Internal Data Bus
8
Set
TMR1IF
on Overflow
TMR1
TMR1H
High Byte
88
8
Read TMR1L
Write TMR1L
8
TMR1ON
Clear TMR1
(CCP Special Event Trigger)
Timer1 Oscillator
On/Off
Timer1
Timer1 Clock Input
Prescaler
1, 2, 4, 8
Synchronize
Detect
2010 Microchip Technology Inc. Preliminary DS39979A-page 129
PIC18F87J72 FAMILY
12.2 Timer1 16-Bit Read/Write Mode
Timer1 can be configured for 16-bit reads and writes
(see Figure 12-2). When the RD16 control bit
(T1CON<7>) is set, the address for TMR1H is mapped
to a buffer register for the high byte of Timer1. A read
from TMR1L will load the contents of the high byte of
Timer1 into the Timer1 High Byte Buffer register. This
provides the user with the ability to accurately read all
16 bits of Timer1 without having to determine whether
a read of the high byte, followed by a read of the low
byte, has become invalid due to a rollover between
reads.
A write to the high byte of Timer1 must also take place
through the TMR1H Buffer register. The Timer1 high
byte is updated with the contents of TMR1H when a
write occurs to TMR1L. This allows a user to write all
16 bits to both the high and low bytes of Timer1 at once.
The high byte of Timer1 is not directly readable or
writable in this mode. All reads and writes must take
place through the Timer1 High Byte Buffer register.
Writes to TMR1H do not clear the Timer1 prescaler.
The prescaler is only cleared on writes to TMR1L.
12.3 Timer1 Oscillator
An on-chip crystal oscillator circuit is incorporated
between pins, T1OSI (input) and T1OSO (amplifier
output). It is enabled by setting the Timer1 Oscillator
Enable bit, T1OSCEN (T1CON<3>). The oscillator is a
low-power circuit rated for 32 kHz crystals. It will
continue to run during all power-managed modes. The
circuit for a typical LP oscillator is shown in Figure 12-3.
Table 12-1 shows the capacitor selection for the Timer1
oscillator.
The user must provide a software time delay to ensure
proper start-up of the Timer1 oscillator.
FIGURE 12-3: EXTERNAL COMPONENTS
FOR THE TIMER1 LP
OSCILLATOR
TABLE 12-1: CAPACITOR SELECTION FOR
THE TIMER1
OSCILLATOR(2,3,4)
12.3.1 USING TIMER1 AS A
CLOCK SOURCE
The Timer1 oscillator is also available as a clock source
in power-managed modes. By setting the System
Clock Select bits, SCS<1:0> (OSCCON<1:0>), to ‘01’,
the device switches to SEC_RUN mode. Both the CPU
and peripherals are clocked from the Timer1 oscillator.
If the IDLEN bit (OSCCON<7>) is cleared and a SLEEP
instruction is executed, the device enters SEC_IDLE
mode. Additional details are available in Section 4.0
“Power-Managed Modes”.
Whenever the Timer1 oscillator is providing the clock
source, the Timer1 system clock status flag, T1RUN
(T1CON<6>), is set. This can be used to determine the
controller’s current clocking mode. It can also indicate
the clock source being currently used by the Fail-Safe
Clock Monitor. If the Clock Monitor is enabled and the
Timer1 oscillator fails while providing the clock, polling
the T1RUN bit will indicate whether the clock is being
provided by the Timer1 oscillator or another source.
Note: See the Notes with Table 12-1 for additional
information about capacitor selection.
C1
C2
XTAL
T1OSI
T1OSO
32.768 kHz
27 pF
27 pF
PIC18F87J72
Oscillator
Type Freq. C1 C2
LP 32.768 kHz 27 pF(1) 27 pF(1)
Note 1: Microchip suggests these values as a
starting point in validating the oscillator
circuit.
2: Higher capacitance increases the stability
of the oscillator but also increases the
start-up time.
3: Since each resonator/crystal has its own
characteristics, the user should consult
the resonator/crystal manufacturer for
appropriate values of external
components.
4: Capacitor values are for design guidance
only.
PIC18F87J72 FAMILY
DS39979A-page 130 Preliminary 2010 Microchip Technology Inc.
12.3.2 TIMER1 OSCILLATOR LAYOUT
CONSIDERATIONS
The Timer1 oscillator circuit draws very little power
during operation. Due to the low-power nature of the
oscillator, it may also be sensitive to rapidly changing
signals in close proximity.
The oscillator circuit, shown in Figure 12-3, should be
located as close as possible to the microcontroller.
There should be no circuits passing within the oscillator
circuit boundaries other than VSS or VDD.
If a high-speed circuit must be located near the oscilla-
tor (such as the CCP1 pin in Output Compare or PWM
mode, or the primary oscillator using the OSC2 pin), a
grounded guard ring around the oscillator circuit, as
shown in Figure 12-4, may be helpful when used on a
single-sided PCB or in addition to a ground plane.
FIGURE 12-4: OSCILLATOR CIRCUIT
WITH GROUNDED
GUARD RING
12.4 Timer1 Interrupt
The TMR1 register pair (TMR1H:TMR1L) increments
from 0000h to FFFFh and rolls over to 0000h. The
Timer1 interrupt, if enabled, is generated on overflow
which is latched in interrupt flag bit, TMR1IF
(PIR1<0>). This interrupt can be enabled or disabled
by setting or clearing the Timer1 Interrupt Enable bit,
TMR1IE (PIE1<0>).
12.5 Resetting Timer1 Using the CCP
Special Event Trigger
If CCP1 or CCP2 is configured to use Timer1 and to
generate a Special Event Trigger in Compare mode
(CCPxM<3:0> = 1011), this signal will reset Timer3.
The trigger from CCP2 will also start an A/D conversion
if the A/D module is enabled (see Section 16.3.4
“Special Event Trigger” for more information).
The module must be configured as either a timer or a
synchronous counter to take advantage of this feature.
When used this way, the CCPRxH:CCPRxL register
pair effectively becomes a period register for Timer1.
If Timer1 is running in Asynchronous Counter mode,
this Reset operation may not work.
In the event that a write to Timer1 coincides with a
Special Event Trigger, the write operation will take
precedence.
12.6 Using Timer1 as a Real-Time Clock
Adding an external LP oscillator to Timer1 (such as the
one described in Section 12.3 “Timer1 Oscillator”
above) gives users the option to include RTC function-
ality to their applications. This is accomplished with an
inexpensive watch crystal to provide an accurate time
base and several lines of application code to calculate
the time. When operating in Sleep mode and using a
battery or supercapacitor as a power source, it can
completely eliminate the need for a separate RTC
device and battery backup.
The application code routine, RTCisr, shown in
Example 12-1, demonstrates a simple method to
increment a counter at one-second intervals using an
Interrupt Service Routine. Incrementing the TMR1
register pair to overflow triggers the interrupt and calls
the routine which increments the seconds counter by
one. Additional counters for minutes and hours are
incremented as the previous counter overflows.
Since the register pair is 16 bits wide, counting up to
overflow the register directly from a 32.768 kHz clock
would take 2 seconds. To force the overflow at the
required one-second intervals, it is necessary to pre-
load it. The simplest method is to set the MSb of
TMR1H with a BSF instruction. Note that the TMR1L
register is never preloaded or altered; doing so may
introduce cumulative error over many cycles.
For this method to be accurate, Timer1 must operate in
Asynchronous mode and the Timer1 overflow interrupt
must be enabled (PIE1<0> = 1) as shown in the
routine, RTCinit. The Timer1 oscillator must also be
enabled and running at all times.
VDD
OSC1
VSS
OSC2
RC0
RC1
RC2
Note: Not drawn to scale.
Note: The Special Event Triggers from the CCPx
module will not set the TMR1IF interrupt
flag bit (PIR1<0>).
2010 Microchip Technology Inc. Preliminary DS39979A-page 131
PIC18F87J72 FAMILY
EXAMPLE 12-1: IMPLEMENTING A REAL-TIME CLOCK USING A TIMER1 INTERRUPT SERVICE
TABLE 12-2: REGISTERS ASSOCIATED WITH TIMER1 AS A TIMER/COUNTER
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR1 ADIF RC1IF TX1IF SSPIF TMR2IF TMR1IF 52
PIE1 ADIE RC1IE TX1IE SSPIE TMR2IE TMR1IE 52
IPR1 ADIP RC1IP TX1IP SSPIP TMR2IP TMR1IP 52
TMR1L Timer1 Register Low Byte 50
TMR1H Timer1 Register High Byte 50
T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 50
Legend: Shaded cells are not used by the Timer1 module.
RTCinit
MOVLW 80h ; Preload TMR1 register pair
MOVWF TMR1H ; for 1 second overflow
CLRF TMR1L
MOVLW b’00001111’ ; Configure for external clock,
MOVWF T1CON ; Asynchronous operation, external oscillator
CLRF secs ; Initialize timekeeping registers
CLRF mins ;
MOVLW .12
MOVWF hours
BSF PIE1, TMR1IE ; Enable Timer1 interrupt
RETURN
RTCisr
BSF TMR1H, 7 ; Preload for 1 sec overflow
BCF PIR1, TMR1IF ; Clear interrupt flag
INCF secs, F ; Increment seconds
MOVLW .59 ; 60 seconds elapsed?
CPFSGT secs
RETURN ; No, done
CLRF secs ; Clear seconds
INCF mins, F ; Increment minutes
MOVLW .59 ; 60 minutes elapsed?
CPFSGT mins
RETURN ; No, done
CLRF mins ; clear minutes
INCF hours, F ; Increment hours
MOVLW .23 ; 24 hours elapsed?
CPFSGT hours
RETURN ; No, done
CLRF hours ; Reset hours
RETURN ; Done
PIC18F87J72 FAMILY
DS39979A-page 132 Preliminary 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. Preliminary DS39979A-page 133
PIC18F87J72 FAMILY
13.0 TIMER2 MODULE
The Timer2 module incorporates the following features:
8-bit Timer and Period registers (TMR2 and PR2,
respectively)
Readable and writable (both registers)
Software programmable prescaler
(1:1, 1:4 and 1:16)
Software programmable postscaler
(1:1 through 1:16)
Interrupt on TMR2 to PR2 match
Optional use as the shift clock for the
MSSP module
The module is controlled through the T2CON register
(Register 13-1), which enables or disables the timer
and configures the prescaler and postscaler. Timer2
can be shut off by clearing control bit, TMR2ON
(T2CON<2>), to minimize power consumption.
A simplified block diagram of the module is shown in
Figure 13-1.
13.1 Timer2 Operation
In normal operation, TMR2 is incremented from 00h on
each clock (FOSC/4). A 4-bit counter/prescaler on the
clock input gives direct input, divide-by-4 and
divide-by-16 prescale options. These are selected by
the prescaler control bits, T2CKPS<1:0>
(T2CON<1:0>). The value of TMR2 is compared to that
of the Period register, PR2, on each clock cycle. When
the two values match, the comparator generates a
match signal as the timer output. This signal also resets
the value of TMR2 to 00h on the next cycle and drives
the output counter/postscaler (see Section 13.2
“Timer2 Interrupt”).
The TMR2 and PR2 registers are both directly readable
and writable. The TMR2 register is cleared on any
device Reset, while the PR2 register initializes at FFh.
Both the prescaler and postscaler counters are cleared
on the following events:
a write to the TMR2 register
a write to the T2CON register
any device Reset (Power-on Reset, MCLR Reset,
Watchdog Timer Reset or Brown-out Reset)
TMR2 is not cleared when T2CON is written.
REGISTER 13-1: T2CON: TIMER2 CONTROL REGISTER
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as0
bit 6-3 T2OUTPS<3:0>: Timer2 Output Postscale Select bits
0000 = 1:1 Postscale
0001 = 1:2 Postscale
1111 = 1:16 Postscale
bit 2 TMR2ON: Timer2 On bit
1 = Timer2 is on
0 = Timer2 is off
bit 1-0 T2CKPS<1:0>: Timer2 Clock Prescale Select bits
00 = Prescaler is 1
01 = Prescaler is 4
1x = Prescaler is 16
PIC18F87J72 FAMILY
DS39979A-page 134 Preliminary 2010 Microchip Technology Inc.
13.2 Timer2 Interrupt
Timer2 can also generate an optional device interrupt.
The Timer2 output signal (TMR2 to PR2 match) pro-
vides the input for the 4-bit output counter/postscaler.
This counter generates the TMR2 match interrupt flag
which is latched in TMR2IF (PIR1<1>). The interrupt is
enabled by setting the TMR2 Match Interrupt Enable
bit, TMR2IE (PIE1<1>).
A range of 16 postscale options (from 1:1 through 1:16
inclusive) can be selected with the postscaler control
bits, T2OUTPS<3:0> (T2CON<6:3>).
13.3 Timer2 Output
The unscaled output of TMR2 is available primarily to
the CCP modules, where it is used as a time base for
operations in PWM mode.
Timer2 can be optionally used as the shift clock source
for the MSSP module operating in SPI mode.
Additional information is provided in Section 18.0
“Master Synchronous Serial Port (MSSP) Module”.
FIGURE 13-1: TIMER2 BLOCK DIAGRAM
TABLE 13-1: REGISTERS ASSOCIATED WITH TIMER2 AS A TIMER/COUNTER
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR1 ADIF RC1IF TX1IF SSPIF —TMR2IFTMR1IF 52
PIE1 ADIE RC1IE TX1IE SSPIE —TMR2IETMR1IE 52
IPR1 ADIP RC1IP TX1IP SSPIP —TMR2IPTMR1IP 52
TMR2 Timer2 Register 50
T2CON T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0 50
PR2 Timer2 Period Register 50
Legend: = unimplemented, read as ‘0’. Shaded cells are not used by the Timer2 module.
Comparator
TMR2 Output
TMR2
Postscaler
Prescaler PR2
2
FOSC/4
1:1 to 1:16
1:1, 1:4, 1:16
4
T2OUTPS<3:0>
T2CKPS<1:0>
Set TMR2IF
Internal Data Bus
8
Reset
TMR2/PR2
8
8
(to PWM or MSSP)
Match
2010 Microchip Technology Inc. Preliminary DS39979A-page 135
PIC18F87J72 FAMILY
14.0 TIMER3 MODULE
The Timer3 timer/counter module incorporates these
features:
Software selectable operation as a 16-bit timer or
counter
Readable and writable 8-bit registers (TMR3H
and TMR3L)
Selectable clock source (internal or external) with
device clock or Timer1 oscillator internal options
Interrupt-on-overflow
Module Reset on CCP Special Event Trigger
A simplified block diagram of the Timer3 module is
shown in Figure 14-1. A block diagram of the module’s
operation in Read/Write mode is shown in Figure 14-2.
The Timer3 module is controlled through the T3CON
register (Register 14-1). It also selects the clock source
options for the CCP modules. See Section 16.2.2
“Timer1/Timer3 Mode Selection” for more
information.
REGISTER 14-1: T3CON: TIMER3 CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RD16 T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 RD16: 16-Bit Read/Write Mode Enable bit
1 = Enables register read/write of Timer3 in one 16-bit operation
0 = Enables register read/write of Timer3 in two 8-bit operations
bit 6,3 T3CCP<2:1>: Timer3 and Timer1 to CCPx Enable bits
1x = Timer3 is the capture/compare clock source for the CCP modules
01 = Timer3 is the capture/compare clock source for CCP2;
Timer1 is the capture/compare clock source for CCP1
00 = Timer1 is the capture/compare clock source for the CCP modules
bit 5-4 T3CKPS<1:0>: Timer3 Input Clock Prescale Select bits
11 = 1:8 Prescale value
10 = 1:4 Prescale value
01 = 1:2 Prescale value
00 = 1:1 Prescale value
bit 2 T3SYNC: Timer3 External Clock Input Synchronization Control bit
(Not usable if the device clock comes from Timer1/Timer3.)
When TMR3CS = 1:
1 = Do not synchronize external clock input
0 = Synchronize external clock input
When TMR3CS = 0:
This bit is ignored. Timer3 uses the internal clock when TMR3CS = 0.
bit 1 TMR3CS: Timer3 Clock Source Select bit
1 = External clock input from Timer1 oscillator or T13CKI (on the rising edge after the first
falling edge)
0 = Internal clock (FOSC/4)
bit 0 TMR3ON: Timer3 On bit
1 = Enables Timer3
0 = Stops Timer3
PIC18F87J72 FAMILY
DS39979A-page 136 Preliminary 2010 Microchip Technology Inc.
14.1 Timer3 Operation
Timer3 can operate in one of three modes:
•Timer
Synchronous Counter
Asynchronous Counter
The operating mode is determined by the clock select
bit, TMR3CS (T3CON<1>). When TMR3CS is cleared
(= 0), Timer3 increments on every internal instruction
cycle (FOSC/4). When the bit is set, Timer3 increments
on every rising edge of the Timer1 external clock input
or the Timer1 oscillator, if enabled.
As with Timer1, the RC1/T1OSI/SEG32 and
RC0/T1OSO/T13CKI pins become inputs when the
Timer1 oscillator is enabled. This means the values of
TRISC<1:0> are ignored and the pins are read as0’.
FIGURE 14-1: TIMER3 BLOCK DIAGRAM (8-BIT MODE)
FIGURE 14-2: TIMER3 BLOCK DIAGRAM (16-BIT READ/WRITE MODE)
T3SYNC
TMR3CS
T3CKPS<1:0>
Sleep Input
T1OSCEN(1)
FOSC/4
Internal
Clock
Prescaler
1, 2, 4, 8
Synchronize
Detect
1
0
2
T1OSO/T13CKI
T1OSI
1
0
TMR3ON
TMR3L Set
TMR3IF
on Overflow
TMR3
High Byte
Timer1 Oscillator
Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain.
On/Off
Timer3
CCPx Special Event Trigger
CCPx Select from T3CON<6,3>
Clear TMR3
Timer1 Clock Input
T3SYNC
TMR3CS
T3CKPS<1:0>
Sleep Input
T1OSCEN(1)
FOSC/4
Internal
Clock
Prescaler
1, 2, 4, 8
Synchronize
Detect
1
0
2
T13CKI/T1OSO
T1OSI
Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain.
1
0
TMR3L
Internal Data Bus
8
Set
TMR3IF
on Overflow
TMR3
TMR3H
High Byte
88
8
Read TMR3L
Write TMR3L
8
TMR3ON
CCPx Special Event Trigger
Timer1 Oscillator
On/Off
Timer3
Timer1 Clock Input
CCPx Select from T3CON<6,3>
Clear TMR3
2010 Microchip Technology Inc. Preliminary DS39979A-page 137
PIC18F87J72 FAMILY
14.2 Timer3 16-Bit Read/Write Mode
Timer3 can be configured for 16-bit reads and writes
(see Figure 14-2). When the RD16 control bit
(T3CON<7>) is set, the address for TMR3H is mapped
to a buffer register for the high byte of Timer3. A read
from TMR3L will load the contents of the high byte of
Timer3 into the Timer3 High Byte Buffer register. This
provides the user with the ability to accurately read all
16 bits of Timer1 without having to determine whether
a read of the high byte, followed by a read of the low
byte, has become invalid due to a rollover between
reads.
A write to the high byte of Timer3 must also take place
through the TMR3H Buffer register. The Timer3 high
byte is updated with the contents of TMR3H when a
write occurs to TMR3L. This allows a user to write all
16 bits to both the high and low bytes of Timer3 at once.
The high byte of Timer3 is not directly readable or
writable in this mode. All reads and writes must take
place through the Timer3 High Byte Buffer register.
Writes to TMR3H do not clear the Timer3 prescaler.
The prescaler is only cleared on writes to TMR3L.
14.3 Using the Timer1 Oscillator as the
Timer3 Clock Source
The Timer1 internal oscillator may be used as the clock
source for Timer3. The Timer1 oscillator is enabled by
setting the T1OSCEN (T1CON<3>) bit. To use it as the
Timer3 clock source, the TMR3CS bit must also be set.
As previously noted, this also configures Timer3 to
increment on every rising edge of the oscillator source.
The Timer1 oscillator is described in Section 12.0
“Timer1 Module”.
14.4 Timer3 Interrupt
The TMR3 register pair (TMR3H:TMR3L) increments
from 0000h to FFFFh and overflows to 0000h. The
Timer3 interrupt, if enabled, is generated on overflow
and is latched in interrupt flag bit, TMR3IF (PIR2<1>).
This interrupt can be enabled or disabled by setting or
clearing the Timer3 Interrupt Enable bit, TMR3IE
(PIE2<1>).
14.5 Resetting Timer3 Using the CCP
Special Event Trigger
If CCP1 or CCP2 is configured to use Timer3 and to
generate a Special Event Trigger in Compare mode
(CCPxM<3:0> = 1011), this signal will reset Timer3.
The trigger from CCP2 will also start an A/D conversion
if the A/D module is enabled (see Section 16.3.4
“Special Event Trigger” for more information).
The module must be configured as either a timer or
synchronous counter to take advantage of this feature.
When used this way, the CCPRxH:CCPRxL register
pair effectively becomes a period register for Timer3.
If Timer3 is running in Asynchronous Counter mode,
the Reset operation may not work.
In the event that a write to Timer3 coincides with a
Special Event Trigger from a CCP module, the write will
take precedence.
TABLE 14-1: REGISTERS ASSOCIATED WITH TIMER3 AS A TIMER/COUNTER
Note: The Special Event Triggers from the CCPx
module will not set the TMR3IF interrupt
flag bit (PIR2<1>).
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR2 OSCFIF CMIF BCLIF LVDIF TMR3IF —52
PIE2 OSCFIE CMIE BCLIE LVDIE TMR3IE —52
IPR2 OSCFIP CMIP BCLIP LVDIP TMR3IP —52
TMR3L Timer3 Register Low Byte 51
TMR3H Timer3 Register High Byte 51
T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 50
T3CON RD16 T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON 51
Legend: — = unimplemented, read as 0’. Shaded cells are not used by the Timer3 module.
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NOTES:
2010 Microchip Technology Inc. Preliminary DS39979A-page 139
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15.0 REAL-TIME CLOCK AND
CALENDAR (RTCC)
The key features of the Real-Time Clock and Calendar
(RTCC) module are:
Time: hours, minutes and seconds
24-hour format (military time)
Calendar: weekday, date, month and year
Alarm configurable
Year range: 2000 to 2099
Leap year correction
BCD format for compact firmware
Optimized for low-power operation
User calibration with auto-adjust
Calibration range: 2.64 seconds error per month
Requirements: external 32.768 kHz clock crystal
Alarm pulse or seconds clock output on RTCC pin
The RTCC module is intended for applications, where
accurate time must be maintained for an extended
period with minimum to no intervention from the CPU.
The module is optimized for low-power usage in order
to provide extended battery life while keeping track of
time.
The module is a 100-year clock and calendar with auto-
matic leap year detection. The range of the clock is
from 00:00:00 (midnight) on January 1, 2000 to
23:59:59 on December 31, 2099. Hours are measured
in 24-hour (military time) format. The clock provides a
granularity of one second with half-second visibility to
the user.
FIGURE 15-1: RTCC BLOCK DIAGRAM
RTCC Prescalers
RTCC Timer
Comparator
Compare Registers
Repeat Counter
YEAR
MTHDY
WKDYHR
MINSEC
ALMTHDY
ALWDHR
ALMINSEC
with Masks
RTCC Interrupt Logic
RTCCFG
ALRMRPT
Alarm
Event
0.5s
RTCC Clock Domain
Alarm Pulse
RTCC Interrupt
CPU Clock Domain
RTCVALx
ALRMVALx
RTCC Pin
RTCOE
32.768 kHz Input
from Timer1 Oscillator
Internal RC
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DS39979A-page 140 Preliminary 2010 Microchip Technology Inc.
15.1 RTCC MODULE REGISTERS
The RTCC module registers are divided into following
categories:
RTCC Control Registers
RTCCFG
RTCCAL
PADCFG1
•ALRMCFG
•ALRMRPT
RTCC Value Registers
RTCVALH and RTCVALL – Can access the fol-
lowing registers
- YEAR
-MONTH
-DAY
- WEEKDAY
-HOUR
- MINUTE
- SECOND
Alarm Value Registers
ALRMVALH and ALRMVALL – Can access the
following registers:
- ALRMMNTH
-ALRMDAY
-ALRMWD
-ALRMHR
- ALRMMIN
- ALRMSEC
Note: The RTCVALH and RTCVALL registers
can be accessed through RTCRPT<1:0>.
ALRMVALH and ALRMVALL can be
accessed through ALRMPTR<1:0>.
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15.1.1 RTCC CONTROL REGISTERS
REGISTER 15-1: RTCCFG: RTCC CONFIGURATION REGISTER(1)
R/W-0 U-0 R/W-0 R-0 R-0 R/W-0 R/W-0 R/W-0
RTCEN(2) RTCWREN RTCSYNC HALFSEC(3) RTCOE RTCPTR1 RTCPTR0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7 RTCEN: RTCC Enable bit(2)
1 = RTCC module is enabled
0 = RTCC module is disabled
bit 6 Unimplemented: Read as ‘0
bit 5 RTCWREN: RTCC Value Registers Write Enable bit
1 = RTCVALH and RTCVALL registers can be written to by the user
0 = RTCVALH and RTCVALL registers are locked out from being written to by the user
bit 4 RTCSYNC: RTCC Value Registers Read Synchronization bit
1 = RTCVALH, RTCVALL and ALRMRPT registers can change while reading due to a rollover ripple
resulting in an invalid data read. If the register is read twice and results in the same data, the data
can be assumed to be valid.
0 = RTCVALH, RTCVALL and ALCFGRPT registers can be read without concern over a rollover
ripple
bit 3 HALFSEC: Half-Second Status bit(3)
1 = Second half period of a second
0 = First half period of a second
bit 2 RTCOE: RTCC Output Enable bit
1 = RTCC clock output is enabled
0 = RTCC clock output is disabled
bit 1-0 RTCPTR<1:0>: RTCC Value Register Window Pointer bits
Points to the corresponding RTCC Value registers when reading RTCVALH and RTCVALL registers.
The RTCPTR<1:0> value decrements on every read or write of RTCVALH<7:0> until it reaches ‘00’.
RTCVALH:
00 = Minutes
01 = Weekday
10 = Month
11 = Reserved
RTCVALL:
00 = Seconds
01 = Hours
10 = Day
11 = Year
Note 1: The RTCCFG register is only affected by a POR. For Resets other than POR, RTCC will continue to run
even if the device is in Reset.
2: A write to the RTCEN bit is only allowed when RTCWREN = 1.
3: This bit is read-only; it is cleared to ‘0’ on a write to the lower half of the MINSEC register.
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REGISTER 15-2: RTCCAL: RTCC CALIBRATION REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CAL7 CAL6 CAL5 CAL4 CAL3 CAL2 CAL1 CAL0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7-0 CAL<7:0>: RTC Drift Calibration bits
01111111 = Maximum positive adjustment; adds 508 RTC clock pulses every minute
.
.
.
00000001 = Minimum positive adjustment; adds four RTC clock pulses every minute
00000000 = No adjustment
11111111 = Minimum negative adjustment; subtracts four RTC clock pulses every minute
.
.
.
10000000 = Maximum negative adjustment; subtracts 512 RTC clock pulses every minute
REGISTER 15-3: PADCFG1: PAD CONFIGURATION REGISTER
U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 U-0
RTSECSEL1(1) RTSECSEL0(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7-3 Unimplemented: Read as ‘0
bit 2-1 RTSECSEL<1:0>: RTCC Seconds Clock Output Select bits(1)
11 = Reserved; do not use
10 = RTCC source clock is selected for the RTCC pin (pin can be INTOSC or Timer1 oscillator,
depending on the RTCOSC (CONFIG3L<1>) bit setting)(2)
01 = RTCC seconds clock is selected for the RTCC pin
00 = RTCC alarm pulse is selected for the RTCC pin
bit 0 Unimplemented: Read as ‘0
Note 1: To enable the actual RTCC output, the RTCOE (RTCCFG<2>) bit must be set.
2: If the Timer1 oscillator is the clock source for RTCC, T1OSCEN bit should be set (T1CON<3> = 1).
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REGISTER 15-4: ALRMCFG: ALARM CONFIGURATION REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ALRMEN CHIME AMASK3 AMASK2 AMASK1 AMASK0 ALRMPTR1 ALRMPTR0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7 ALRMEN: Alarm Enable bit
1 = Alarm is enabled (cleared automatically after an alarm event whenever ARPT<7:0> = 00
and CHIME = 0)
0 = Alarm is disabled
bit 6 CHIME: Chime Enable bit
1 = Chime is enabled; ALRMPTR<1:0> bits are allowed to roll over from 00h to FFh
0 = Chime is disabled; ALRMPTR<1:0> bits stop once they reach 00h
bit 5-2 AMASK<3:0>: Alarm Mask Configuration bits
0000 = Every half second
0001 = Every second
0010 = Every 10 seconds
0011 = Every minute
0100 = Every 10 minutes
0101 = Every hour
0110 = Once a day
0111 = Once a week
1000 = Once a month
1001 = Once a year (except when configured for February 29th, once every four years)
101x = Reserved – do not use
11xx = Reserved – do not use
bit 1-0 ALRMPTR<1:0>: Alarm Value Register Window Pointer bits
Points to the corresponding Alarm Value registers when reading the ALRMVALH and ALRMVALL
registers. The ALRMPTR<1:0> value decrements on every read or write of ALRMVALH until it reaches
00’.
ALRMVALH:
00 = ALRMMIN
01 =ALRMWD
10 =ALRMMNTH
11 = Unimplemented
ALRMVALL:
00 = ALRMSEC
01 =ALRMHR
10 =ALRMDAY
11 = Unimplemented
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DS39979A-page 144 Preliminary 2010 Microchip Technology Inc.
15.1.2 RTCVALH AND RTCVALL
REGISTER MAPPINGS
REGISTER 15-5: ALRMRPT: ALARM CALIBRATION REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ARPT7 ARPT6 ARPT5 ARPT4 ARPT3 ARPT2 ARPT1 ARPT0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7-0 ARPT<7:0>: Alarm Repeat Counter Value bits
11111111 = Alarm will repeat 255 more times
.
.
.
00000000 = Alarm will not repeat
The counter decrements on any alarm event. The counter is prevented from rolling over from 00h to
FFh unless CHIME = 1.
REGISTER 15-6: RESERVED REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7-0 Unimplemented: Read as ‘0
REGISTER 15-7: YEAR: YEAR VALUE REGISTER(1)
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
YRTEN3 YRTEN2 YRTEN1 YRTEN0 YRONE3 YRONE2 YRONE1 YRONE0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7-4 YRTEN<3:0>: Binary Coded Decimal Value of Year’s Tens Digit bits
Contains a value from 0 to 9.
bit 3-0 YRONE<3:0>: Binary Coded Decimal Value of Year’s Ones Digit bits
Contains a value from 0 to 9.
Note 1: A write to the YEAR register is only allowed when RTCWREN = 1.
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REGISTER 15-8: MONTH: MONTH VALUE REGISTER(1)
U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x
MTHTEN0 MTHONE3 MTHONE2 MTHONE1 MTHONE0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7-5 Unimplemented: Read as ‘0
bit 4 MTHTEN0: Binary Coded Decimal Value of Month’s Tens Digit bits
Contains a value of 0 or 1.
bit 3-0 MTHONE<3:0>: Binary Coded Decimal Value of Month’s Ones Digit bits
Contains a value from 0 to 9.
Note 1: A write to this register is only allowed when RTCWREN = 1.
REGISTER 15-9: DAY: DAY VALUE REGISTER(1)
U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
DAYTEN1 DAYTEN0 DAYONE3 DAYONE2 DAYONE1 DAYONE0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as ‘0
bit 5-4 DAYTEN<1:0>: Binary Coded Decimal value of Day’s Tens Digit bits
Contains a value from 0 to 3.
bit 3-0 DAYONE<3:0>: Binary Coded Decimal Value of Day’s Ones Digit bits
Contains a value from 0 to 9.
Note 1: A write to this register is only allowed when RTCWREN = 1.
REGISTER 15-10: WEEKDAY: WEEKDAY VALUE REGISTER(1)
U-0 U-0 U-0 U-0 U-0 R/W-x R/W-x R/W-x
WDAY2 WDAY1 WDAY0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7-3 Unimplemented: Read as ‘0
bit 2-0 WDAY<2:0>: Binary Coded Decimal Value of Weekday Digit bits
Contains a value from 0 to 6.
Note 1: A write to this register is only allowed when RTCWREN = 1.
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REGISTER 15-11: HOUR: HOUR VALUE REGISTER(1)
U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
HRTEN1 HRTEN0 HRONE3 HRONE2 HRONE1 HRONE0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as ‘0
bit 5-4 HRTEN<1:0>: Binary Coded Decimal Value of Hour’s Tens Digit bits
Contains a value from 0 to 2.
bit 3-0 HRONE<3:0>: Binary Coded Decimal Value of Hour’s Ones Digit bits
Contains a value from 0 to 9.
Note 1: A write to this register is only allowed when RTCWREN = 1.
REGISTER 15-12: MINUTE: MINUTE VALUE REGISTER
U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
MINTEN2 MINTEN1 MINTEN0 MINONE3 MINONE2 MINONE1 MINONE0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as ‘0
bit 6-4 MINTEN<2:0>: Binary Coded Decimal Value of Minute’s Tens Digit bits
Contains a value from 0 to 5.
bit 3-0 MINONE<3:0>: Binary Coded Decimal Value of Minute’s Ones Digit bits
Contains a value from 0 to 9.
REGISTER 15-13: SECOND: SECOND VALUE REGISTER
U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
SECTEN2 SECTEN1 SECTEN0 SECONE3 SECONE2 SECONE1 SECONE0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as ‘0
bit 6-4 SECTEN<2:0>: Binary Coded Decimal Value of Second’s Tens Digit bits
Contains a value from 0 to 5.
bit 3-0 SECONE<3:0>: Binary Coded Decimal Value of Second’s Ones Digit bits
Contains a value from 0 to 9.
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15.1.3 ALRMVALH AND ALRMVALL
REGISTER MAPPINGS
REGISTER 15-14: ALRMMNTH: ALARM MONTH VALUE REGISTER(1)
U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x
MTHTEN0 MTHONE3 MTHONE2 MTHONE1 MTHONE0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7-5 Unimplemented: Read as ‘0
bit 4 MTHTEN0: Binary Coded Decimal Value of Month’s Tens Digit bits
Contains a value of 0 or 1.
bit 3-0 MTHONE<3:0>: Binary Coded Decimal Value of Month’s Ones Digit bits
Contains a value from 0 to 9.
Note 1: A write to this register is only allowed when RTCWREN = 1.
REGISTER 15-15: ALRMDAY: ALARM DAY VALUE REGISTER(1)
U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
DAYTEN1 DAYTEN0 DAYONE3 DAYONE2 DAYONE1 DAYONE0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as ‘0
bit 5-4 DAYTEN<1:0>: Binary Coded Decimal Value of Day’s Tens Digit bits
Contains a value from 0 to 3.
bit 3-0 DAYONE<3:0>: Binary Coded Decimal Value of Day’s Ones Digit bits
Contains a value from 0 to 9.
Note 1: A write to this register is only allowed when RTCWREN = 1.
REGISTER 15-16: ALRMWD: ALARM WEEKDAY VALUE REGISTER(1)
U-0 U-0 U-0 U-0 U-0 R/W-x R/W-x R/W-x
WDAY2 WDAY1 WDAY0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7-3 Unimplemented: Read as ‘0
bit 2-0 WDAY<2:0>: Binary Coded Decimal Value of Weekday Digit bits
Contains a value from 0 to 6.
Note 1: A write to this register is only allowed when RTCWREN = 1.
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REGISTER 15-17: ALRMHR: ALARM HOURS VALUE REGISTER(1)
U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
HRTEN1 HRTEN0 HRONE3 HRONE2 HRONE1 HRONE0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as ‘0
bit 5-4 HRTEN<1:0>: Binary Coded Decimal Value of Hour’s Tens Digit bits
Contains a value from 0 to 2.
bit 3-0 HRONE<3:0>: Binary Coded Decimal Value of Hour’s Ones Digit bits
Contains a value from 0 to 9.
Note 1: A write to this register is only allowed when RTCWREN = 1.
REGISTER 15-18: ALRMMIN: ALARM MINUTES VALUE REGISTER
U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
MINTEN2 MINTEN1 MINTEN0 MINONE3 MINONE2 MINONE1 MINONE0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as ‘0
bit 6-4 MINTEN<2:0>: Binary Coded Decimal Value of Minute’s Tens Digit bits
Contains a value from 0 to 5.
bit 3-0 MINONE<3:0>: Binary Coded Decimal Value of Minute’s Ones Digit bits
Contains a value from 0 to 9.
REGISTER 15-19: ALRMSEC: ALARM SECONDS VALUE REGISTER
U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
SECTEN2 SECTEN1 SECTEN0 SECONE3 SECONE2 SECONE1 SECONE0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as ‘0
bit 6-4 SECTEN<2:0>: Binary Coded Decimal Value of Second’s Tens Digit bits
Contains a value from 0 to 5.
bit 3-0 SECONE<3:0>: Binary Coded Decimal Value of Second’s Ones Digit bits
Contains a value from 0 to 9.
2010 Microchip Technology Inc. Preliminary DS39979A-page 149
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15.1.4 RTCEN BIT WRITE
An attempt to write to the RTCEN bit while
RTCWREN = 0 will be ignored. RTCWREN must be
set before a write to RTCEN can take place.
Like the RTCEN bit, the RTCVALH and RTCVALL
registers can only be written to when RTCWREN = 1.
A write to these registers, while RTCWREN = 0, will be
ignored.
15.2 Operation
15.2.1 REGISTER INTERFACE
The register interface for the RTCC and alarm values is
implemented using the Binary Coded Decimal (BCD)
format. This simplifies the firmware when using the
module, as each of the digits is contained within its own
4-bit value (see Figure 15-2 and Figure 15-3).
FIGURE 15-2: TIMER DIGIT FORMAT
FIGURE 15-3: ALARM DIGIT FORMAT
0-60-9 0-9 0-3 0-9
0-9 0-9 0-90-2 0-5 0-5 0/1
Day of WeekYear Day
Hours
(24-hour format) Minutes Seconds
1/2 Second Bit
0-1 0-9
Month
(binary format)
0-60-3 0-9
0-9 0-9 0-90-2 0-5 0-5
Day of WeekDay
Hours
(24-hour format) Minutes Seconds
0-1 0-9
Month
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15.2.2 CLOCK SOURCE
As mentioned earlier, the RTCC module is intended to
be clocked by an external Real-Time Clock crystal
oscillating at 32.768 kHz, but can also be an internal
oscillator. The RTCC clock selection is decided by the
RTCOSC bit (CONFIG3L<1>).
Calibration of the crystal can be done through this mod-
ule to yield an error of 3 seconds or less per month.
(For further details, see Section 15.2.9 “Calibration”.)
FIGURE 15-4: CLOCK SOURCE MULTIPLEXING
15.2.2.1 Real-Time Clock Enable
The RTCC module can be clocked by an external,
32.768 kHz crystal (Timer1 oscillator) or the internal RC
oscillator, which can be selected in CONFIG3L<1>.
If the external clock is used, the Timer1 oscillator
should be enabled by setting the T1OSCEN bit
(T1CON<3> = 1). If INTRC is providing the clock, the
INTRC clock can be brought out to the RTCC pin by the
RTSECSEL<1:0> bits in the PADCFG register.
15.2.3 DIGIT CARRY RULES
This section explains which timer values are affected
when there is a rollover.
Time of Day: from 23:59:59 to 00:00:00 with a
carry to the Day field
Month: from 12/31 to 01/01 with a carry to the
Year field
Day of Week: from 6 to 0 with no carry (see
Table 15-1)
Year Carry: from 99 to 00; this also surpasses the
use of the RTCC
For the day to month rollover schedule, see Table 15-2.
Considering that the following values are in BCD for-
mat, the carry to the upper BCD digit will occur at a
count of 10 and not at 16 (SECONDS, MINUTES,
HOURS, WEEKDAY, DAYS and MONTHS).
TABLE 15-1: DAY OF WEEK SCHEDULE
TABLE 15-2: DAY TO MONTH ROLLOVER
SCHEDULE
Note 1: Writing to the lower half of the MINSEC register resets all counters, allowing fraction of a second
synchronization; clock prescaler is held in Reset when RTCEN = 0.
32.768 kHz XTAL
1:16384
Half Second(1)
Half-Second
Clock One-Second Clock
Year
Month
Day
Day of Week
Second Hour:Minute
Clock Prescaler(1)
from SOSC
Internal RC
CONFIG 3L<1>
Day of Week
Sunday 0
Monday 1
Tuesday 2
Wednesday 3
Thursday 4
Friday 5
Saturday 6
Month Maximum Day Field
01 (January) 31
02 (February) 28 or 29(1)
03 (March) 31
04 (April) 30
05 (May) 31
06 (June) 30
07 (July) 31
08 (August) 31
09 (September) 30
10 (October) 31
11 (November) 30
12 (December) 31
Note 1: See Section 15.2.4 “Leap Year”.
2010 Microchip Technology Inc. Preliminary DS39979A-page 151
PIC18F87J72 FAMILY
15.2.4 LEAP YEAR
Since the year range on the RTCC module is 2000 to
2099, the leap year calculation is determined by any year
divisible by 4 in the above range. Only February is
effected in a leap year.
February will have 29 days in a leap year and 28 days in
any other year.
15.2.5 GENERAL FUNCTIONALITY
All Timer registers containing a time value of seconds or
greater are writable. The user configures the time by
writing the required year, month, day, hour, minutes and
seconds to the Timer registers via register pointers (see
Section 15.2.8 “Register Mapping”).
The timer uses the newly written values and proceeds
with the count from the required starting point.
The RTCC is enabled by setting the RTCEN bit
(RTCCFG<7>). If enabled while adjusting these regis-
ters, the timer still continues to increment. However, any
time the MINSEC register is written to, both of the timer
prescalers are reset to ‘0’. This allows fraction of a
second synchronization.
The Timer registers are updated in the same cycle as
the write instruction’s execution by the CPU. The user
must ensure that when RTCEN = 1, the updated regis-
ters will not be incremented at the same time. This can
be accomplished in several ways:
By checking the RTCSYNC bit (RTCCFG<4>)
By checking the preceding digits from which a
carry can occur
By updating the registers immediately following
the seconds pulse (or alarm interrupt)
The user has visibility to the half-second field of the
counter. This value is read-only and can be reset only
by writing to the lower half of the SECONDS register.
15.2.6 SAFETY WINDOW FOR REGISTER
READS AND WRITES
The RTCSYNC bit indicates a time window during
which the RTCC clock domain registers can be safely
read and written without concern about a rollover.
When RTCSYNC = 0, the registers can be safely
accessed by the CPU.
Whether RTCSYNC = 1 or 0, the user should employ a
firmware solution to ensure that the data read did not
fall on a rollover boundary, resulting in an invalid or
partial read. This firmware solution would consist of
reading each register twice and then comparing the two
values. If the two values matched, then a rollover did
not occur.
15.2.7 WRITE LOCK
In order to perform a write to any of the RTCC Timer
registers, the RTCWREN bit (RTCCFG<5>) must be set.
To avoid accidental writes to the RTCC Timer register,
it is recommended that the RTCWREN bit
(RTCCFG<5>) be kept clear at any time other than
while writing to it. For the RTCWREN bit to be set, there
is only one instruction cycle time window allowed
between the 55h/AA sequence and the setting of
RTCWREN. For that reason, it is recommended that
users follow the code example in Example 15-1.
EXAMPLE 15-1: SETTING THE RTCWREN
BIT
15.2.8 REGISTER MAPPING
To limit the register interface, the RTCC Timer and
Alarm Timer registers are accessed through
corresponding register pointers. The RTCC Value
register window (RTCVALH and RTCVALL) uses the
RTCPTR bits (RTCCFG<1:0>) to select the required
Timer register pair.
By reading or writing to the RTCVALH register, the
RTCC Pointer value (RTCPTR<1:0>) decrements by ‘1
until it reaches ‘00’. Once it reaches ‘00’, the MINUTES
and SECONDS value will be accessible through
RTCVALH and RTCVALL until the pointer value is
manually changed.
TABLE 15-3: RTCVALH AND RTCVALL
REGISTER MAPPING
The Alarm Value register window (ALRMVALH and
ALRMVALL) uses the ALRMPTR bits (ALRMCFG<1:0>)
to select the desired Alarm register pair.
By reading or writing to the ALRMVALH register, the
Alarm Pointer value, ALRMPTR<1:0>, decrements by ‘1
until it reaches ‘00’. Once it reaches ‘00’, the ALRMMIN
and ALRMSEC value will be accessible through
ALRMVALH and ALRMVALL until the pointer value is
manually changed.
movlw 0x55
movwf EECON2
movlw 0xAA
movwf EECON2
bsf RTCCFG,RTCWREN
RTCPTR<1:0>
RTCC Value Register Window
RTCVALH RTCVALL
00 MINUTES SECONDS
01 WEEKDAY HOURS
10 MONTH DAY
11 YEAR
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DS39979A-page 152 Preliminary 2010 Microchip Technology Inc.
TABLE 15-4: ALRMVAL REGISTER
MAPPING
15.2.9 CALIBRATION
The real-time crystal input can be calibrated using the
periodic auto-adjust feature. When properly calibrated,
the RTCC can provide an error of less than three
seconds per month.
To perform this calibration, find the number of error
clock pulses and store the value into the lower half of
the RTCCAL register. The 8-bit, signed value, loaded
into RTCCAL, is multiplied by 4 and will either be added
or subtracted from the RTCC timer, once every minute.
To calibrate the RTCC module:
1. Use another timer resource on the device to find
the error of the 32.768 kHz crystal.
2. Convert the number of error clock pulses per
minute (see Equation 15-1).
If the oscillator is faster than ideal (negative
result from step 2), the RCFGCALL register
value needs to be negative. This causes the
specified number of clock pulses to be
subtracted from the timer counter once every
minute.
If the oscillator is slower than ideal (positive
result from step 2), the RCFGCALL register
value needs to be positive. This causes the
specified number of clock pulses to be added to
the timer counter once every minute.
3. Load the RTCCAL register with the correct
value.
Writes to the RTCCAL register should occur only when
the timer is turned off, or immediately after the rising
edge of the seconds pulse.
15.3 Alarm
The Alarm features and characteristics are:
Configurable from half a second to one year
Enabled using the ALRMEN bit (ALRMCFG<7>,
Register 15-4)
Offers one-time and repeat alarm options
15.3.1 CONFIGURING THE ALARM
The alarm feature is enabled using the ALRMEN bit.
This bit is cleared when an alarm is issued. The bit will
not be cleared if the CHIME bit = 1 or if ALRMRPT 0.
The interval selection of the alarm is configured
through the ALRMCFG bits (AMASK<3:0>). (See
Figure 15-5.) These bits determine which and how
many digits of the alarm must match the clock value for
the alarm to occur.
The alarm can also be configured to repeat based on a
preconfigured interval. The number of times this
occurs, after the alarm is enabled, is stored in the
ALRMRPT register.
ALRMPTR<1:0>
Alarm Value Register Window
ALRMVALH ALRMVALL
00 ALRMMIN ALRMSEC
01 ALRMWD ALRMHR
10 ALRMMNTH ALRMDAY
11 ——
EQUATION 15-1: CONVERTING ERROR
CLOCK PULSES
(Ideal Frequency (32,758) – Measured Frequency) * 60 =
Error Clocks per Minute
Note: In determining the crystal’s error value, it
is the user’s responsibility to include the
crystal’s initial error from drift due to
temperature or crystal aging.
Note: While the alarm is enabled (ALRMEN = 1),
changing any of the registers, other than
the RTCCAL, ALRMCFG and ALRMRPT
registers, and the CHIME bit, can result in
a false alarm event leading to a false
alarm interrupt. To avoid this, only change
the timer and alarm values while the alarm
is disabled (ALRMEN = 0). It is recom-
mended that the ALRMCFG and
ALRMRPT registers and CHIME bit be
changed when RTCSYNC = 0.
2010 Microchip Technology Inc. Preliminary DS39979A-page 153
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FIGURE 15-5: ALARM MASK SETTINGS
When ALRMCFG = 00 and the CHIME bit = 0
(ALRMCFG<6>), the repeat function is disabled and
only a single alarm will occur. The alarm can be
repeated up to 255 times by loading the ALRMRPT
register with FFh.
After each alarm is issued, the ALRMRPT register is
decremented by one. Once the register has reached
00’, the alarm will be issued one last time.
After the alarm is issued a last time, the ALRMEN bit is
cleared automatically and the alarm turned off. Indefinite
repetition of the alarm can occur if the CHIME bit = 1.
When CHIME = 1, the alarm is not disabled when the
ALRMRPT register reaches00’, but it rolls over to FF
and continues counting indefinitely.
Note 1: Annually, except when configured for February 29.
s
ss
mss
mm s s
hh mm ss
dhhmmss
dd hh mm ss
mm d d h h mm s s
Day of the
Week Month Day Hours Minutes Seconds
Alarm Mask Setting
AMASK<3:0>
0000 – Every half second
0001 – Every second
0010 – Every 10 seconds
0011 – Every minute
0100 – Every 10 minutes
0101 – Every hour
0110 – Every day
0111 – Every week
1000 – Every month
1001 – Every year(1)
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DS39979A-page 154 Preliminary 2010 Microchip Technology Inc.
15.3.2 ALARM INTERRUPT
At every alarm event, an interrupt is generated. Addi-
tionally, an alarm pulse output is provided that operates
at half the frequency of the alarm.
The alarm pulse output is completely synchronous with
the RTCC clock and can be used as a trigger clock to
other peripherals. This output is available on the RTCC
pin. The output pulse is a clock with a 50% duty cycle
and a frequency half that of the alarm event (see
Figure 15-6).
The RTCC pin can also output the seconds clock. The
user can select between the alarm pulse, generated by
the RTCC module, or the seconds clock output.
The RTSECSEL<1:0> (PADCFG1<2:1>) bits select
between these two outputs:
Alarm Pulse – RTSECSEL<1:0> = 00
Seconds Clock – RTSECSEL<1:0> = 01
FIGURE 15-6: TIMER PULSE GENERATION
15.4 Sleep Mode
The timer and alarm continue to operate while in Sleep
mode. The operation of the alarm is not affected by
Sleep as an alarm event can always wake-up the CPU.
The Idle mode does not affect the operation of the timer
or alarm.
15.5 Reset
15.5.1 DEVICE RESET
When a device Reset occurs, the ALCFGRPT register
is forced to its Reset state, causing the alarm to be
disabled (if enabled prior to the Reset). If the RTCC
was enabled, it will continue to operate when a basic
device Reset occurs.
15.5.2 POWER-ON RESET (POR)
The RTCCFG and ALRMRPT registers are reset only
on a POR. Once the device exits the POR state, the
clock registers should be reloaded with the desired
values.
The timer prescaler values can be reset only by writing
to the SECONDS register. No device Reset can affect
the prescalers.
RTCEN bit
ALRMEN bit
RTCC Alarm Event
RTCC Pin
2010 Microchip Technology Inc. Preliminary DS39979A-page 155
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15.6 Register Maps
Table 15-5, Table 15-6 and Table 15-7 summarize the
registers associated with the RTCC module.
TABLE 15-5: RTCC CONTROL REGISTERS
File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
All
Resets
on Page
RTCCFG RTCEN RTCWREN RTCSYNC HALFSEC RTCOE RTCPTR1 RTCPTR0 54
RTCCAL CAL7 CAL6 CAL5 CAL4 CAL3 CAL2 CAL1 CAL0 54
PADCFG1 RTSECSEL1 RTSECSEL0 —54
ALRMCFG ALRMEN CHIME AMASK3 AMASK2 AMASK1 AMASK0 ALRMPTR1 ALRMPTR0 54
ALRMRPT ARPT7 ARPT6 ARPT5 ARPT4 ARPT3 ARPT2 ARPT1 ARPT0 54
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal for 80-pin devices.
TABLE 15-6: RTCC VALUE REGISTERS
File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets
on Page
RTCVALH RTCC Value High Register Window Based on RTCPTR<1:0> 54
RTCVALL RTCC Value Low Register Window Based on RTCPTR<1:0> 54
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal for 80-pin devices.
TABLE 15-7: ALARM VALUE REGISTERS
File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets
on Page
ALRMVALH Alarm Value High Register Window Based on ALRMPTR<1:0> 54
ALRMVALL Alarm Value Low Register Window Based on ALRMPTR<1:0> 54
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal for 80-pin devices.
PIC18F87J72 FAMILY
DS39979A-page 156 Preliminary 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. Preliminary DS39979A-page 157
PIC18F87J72 FAMILY
16.0 CAPTURE/COMPARE/PWM
(CCP) MODULES
PIC18F87J72 family devices have two CCP
(Capture/Compare/PWM) modules, designated CCP1
and CCP2. Both modules implement standard capture,
compare and Pulse-Width Modulation (PWM) modes.
Each CCP module contains two 8-bit registers that can
operate as two 8-bit Capture registers, two 8-bit
Compare registers or two PWM Master/Slave Duty
Cycle registers. For the sake of clarity, all CCP module
operation in the following sections is described with
respect to CCP2, but is equally applicable to CCP1.
REGISTER 16-1: CCPxCON: CCPx CONTROL REGISTER (CCP1, CCP2 MODULES)
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
DCxB1 DCxB0 CCPxM3 CCPxM2 CCPxM1 CCPxM0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as0
bit 5-4 DCxB<1:0>: PWM Duty Cycle bit 1 and bit 0 for CCPx Module
Capture mode:
Unused.
Compare mode:
Unused.
PWM mode:
These bits are the two Least Significant bits (bit 1 and bit 0) of the 10-bit PWM duty cycle. The eight
Most Significant bits (DCx<9:2>) of the duty cycle are found in CCPRxL.
bit 3-0 CCPxM<3:0>: CCPx Module Mode Select bits
0000 = Capture/Compare/PWM disabled (resets CCPx module)
0001 = Reserved
0010 = Compare mode, toggle output on match (CCPxIF bit is set)
0011 = Reserved
0100 = Capture mode, every falling edge
0101 = Capture mode, every rising edge
0110 = Capture mode, every 4th rising edge
0111 = Capture mode, every 16th rising edge
1000 = Compare mode: initialize CCPx pin low; on compare match, force CCPx pin high (CCPxIF bit
is set)
1001 = Compare mode: initialize CCPx pin high; on compare match, force CCPx pin low (CCPxIF bit
is set)
1010 = Compare mode: generate software interrupt on compare match (CCPxIF bit is set, CCPx pin
reflects I/O state)
1011 = Compare mode: Special Event Trigger; reset timer; start A/D conversion on CCPx match
(CCPxIF bit is set)(1)
11xx =PWM mode
Note 1: CCPxM<3:0> = 1011 will only reset the timer and not start an A/D conversion on a CCP1 match.
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DS39979A-page 158 Preliminary 2010 Microchip Technology Inc.
16.1 CCP Module Configuration
Each Capture/Compare/PWM module is associated
with a control register (generically, CCPxCON) and a
data register (CCPRx). The data register, in turn, is
comprised of two 8-bit registers: CCPRxL (low byte)
and CCPRxH (high byte). All registers are both
readable and writable.
16.1.1 CCP MODULES AND TIMER
RESOURCES
The CCP modules utilize timers, 1, 2 or 3, depending
on the mode selected. Timer1 and Timer3 are available
to modules in Capture or Compare modes, while
Timer2 is available for modules in PWM mode.
TABLE 16-1: CCP MODE – TIMER
RESOURCE
The assignment of a particular timer to a module is
determined by the Timer to CCP enable bits in the
T3CON register (Register 14-1). Both modules may be
active at any given time and may share the same timer
resource if they are configured to operate in the same
mode (Capture/Compare or PWM) at the same time.
The interactions between the two modules are
summarized in Table 16-2.
Depending on the configuration selected, up to four
timers may be active at once, with modules in the same
configuration (Capture/Compare or PWM) sharing
timer resources. The possible configurations are
shown in Figure 16-1.
16.1.2 OPEN-DRAIN OUTPUT OPTION
When operating in Output mode (i.e., in Compare or
PWM modes), the drivers for the CCPx pins can be
optionally configured as open-drain outputs. This
feature allows the voltage level on the pin to be pulled
to a higher level through an external pull-up resistor
and allows the output to communicate with external
circuits without the need for additional level shifters.
The open-drain output option is controlled by the
CCP2OD and CCP1OD bits (TRISG<6:5>). Setting the
appropriate bit configures the pin for the corresponding
module for open-drain operation.
16.1.3 CCP2 PIN ASSIGNMENT
The pin assignment for CCP2 (capture input, compare
and PWM output) can change, based on device config-
uration. The CCP2MX Configuration bit determines
which pin CCP2 is multiplexed to. By default, it is
assigned to RC1 (CCP2MX = 1). If the Configuration bit
is cleared, CCP2 is multiplexed with RE7.
Changing the pin assignment of CCP2 does not
automatically change any requirements for configuring
the port pin. Users must always verify that the appropri-
ate TRIS register is configured correctly for CCP2
operation, regardless of where it is located.
FIGURE 16-1: CCP AND TIMER INTERCONNECT CONFIGURATIONS
CCP Mode Timer Resource
Capture
Compare
PWM
Timer1 or Timer3
Timer1 or Timer3
Timer2
TMR1
TMR2
TMR3
CCP2
CCP1
TMR1
TMR2
TMR3
CCP2
CCP1
TMR1 TMR3
TMR2
CCP2
CCP1
T3CCP<2:1> = 00 T3CCP<2:1> = 01 T3CCP<2:1> = 1x
Timer1 is used for all capture
and compare operations for
all CCP modules. Timer2 is
used for PWM operations for
all CCP modules. Modules
may share either timer
resource as a common time
base.
Timer1 is used for capture
and compare operations for
CCP1 and Timer 3 is used for
CCP2.
Both the modules use Timer2
as a common time base if they
are in PWM modes.
Timer3 is used for all capture
and compare operations for
all CCP modules. Timer2 is
used for PWM operations for
all CCP modules. Modules
may share either timer
resource as a common time
base.
2010 Microchip Technology Inc. Preliminary DS39979A-page 159
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TABLE 16-2: INTERACTIONS BETWEEN CCP1 AND CCP2 FOR TIMER RESOURCES
CCP1 Mode CCP2 Mode Interaction
Capture Capture Each module can use TMR1 or TMR3 as the time base. The time base can be different
for each CCP.
Capture Compare CCP2 can be configured for the Special Event Trigger to reset TMR1 or TMR3
(depending upon which time base is used). Automatic A/D conversions on trigger event
can also be done. Operation of CCP1 could be affected if it is using the same timer as a
time base.
Compare Capture CCP1 can be configured for the Special Event Trigger to reset TMR1 or TMR3
(depending upon which time base is used). Operation of CCP2 could be affected if it is
using the same timer as a time base.
Compare Compare Either module can be configured for the Special Event Trigger to reset the time base.
Automatic A/D conversions on CCP2 trigger event can be done. Conflicts may occur if
both modules are using the same time base.
Capture PWM None
Compare PWM None
PWM Capture None
PWM Compare None
PWM PWM Both PWMs will have the same frequency and update rate (TMR2 interrupt).
PIC18F87J72 FAMILY
DS39979A-page 160 Preliminary 2010 Microchip Technology Inc.
16.2 Capture Mode
In Capture mode, the CCPR2H:CCPR2L register pair
captures the 16-bit value of the TMR1 or TMR3 register
when an event occurs on the CCP2 pin (RC1 or RE7,
depending on device configuration). An event is
defined as one of the following:
Every falling edge
Every rising edge
Every 4th rising edge
Every 16th rising edge
The event is selected by the mode select bits,
CCP2M<3:0> (CCP2CON<3:0>). When a capture is
made, the interrupt request flag bit, CCP2IF (PIR3<2>), is
set; it must be cleared in software. If another capture
occurs before the value in register, CCPR2, is read, the
old captured value is overwritten by the new captured
value.
16.2.1 CCP PIN CONFIGURATION
In Capture mode, the appropriate CCPx pin should be
configured as an input by setting the corresponding
TRIS direction bit.
16.2.2 TIMER1/TIMER3 MODE SELECTION
The timers that are to be used with the capture feature
(Timer1 and/or Timer3) must be running in Timer mode or
Synchronized Counter mode. In Asynchronous Counter
mode, the capture operation may not work. The timer to
be used with each CCP module is selected in the T3CON
register (see Section 16.1.1 “CCP Modules and Timer
Resources”).
16.2.3 SOFTWARE INTERRUPT
When the Capture mode is changed, a false capture
interrupt may be generated. The user should keep the
CCP2IE bit (PIE3<2>) clear to avoid false interrupts
and should clear the flag bit, CCP2IF, following any
such change in operating mode.
16.2.4 CCP PRESCALER
There are four prescaler settings in Capture mode.
They are specified as part of the operating mode
selected by the mode select bits (CCP2M<3:0>).
Whenever the CCP module is turned off, or the CCP
module is not in Capture mode, the prescaler counter
is cleared. This means that any Reset will clear the
prescaler counter.
Switching from one capture prescaler to another may
generate an interrupt. Also, the prescaler counter will
not be cleared; therefore, the first capture may be from
a non-zero prescaler. Example 16-1 shows the
recommended method for switching between capture
prescalers. This example also clears the prescaler
counter and will not generate the “false” interrupt.
EXAMPLE 16-1: CHANGING BETWEEN
CAPTURE PRESCALERS
FIGURE 16-2: CAPTURE MODE OPERATION BLOCK DIAGRAM
Note: If RC1/CCP2 or RE7/CCP2 is configured
as an output, a write to the port can cause
a capture condition.
CLRF CCP2CON ; Turn CCP module off
MOVLW NEW_CAPT_PS ; Load WREG with the
; new prescaler mode
; value and CCP ON
MOVWF CCP2CON ; Load CCP2CON with
; this value
CCPR1H CCPR1L
TMR1H TMR1L
Set CCP1IF
TMR3
Enable
Q1:Q4
CCP1CON<3:0>
CCP1 Pin
Prescaler
1, 4, 16
and
Edge Detect
TMR1
Enable
T3CCP2
T3CCP2
CCPR2H CCPR2L
TMR1H TMR1L
Set CCP2IF
TMR3
Enable
CCP2CON<3:0>
CCP2 Pin
Prescaler
1, 4, 16
TMR3H TMR3L
TMR1
Enable
T3CCP2
T3CCP1
T3CCP2
T3CCP1
TMR3H TMR3L
and
Edge Detect
4
4
4
2010 Microchip Technology Inc. Preliminary DS39979A-page 161
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16.3 Compare Mode
In Compare mode, the 16-bit CCPR2 register value is
constantly compared against either the TMR1 or TMR3
register pair value. When a match occurs, the CCP2
pin can be:
driven high
driven low
toggled (high-to-low or low-to-high)
remain unchanged (that is, reflects the state of the
I/O latch)
The action on the pin is based on the value of the mode
select bits (CCP2M<3:0>). At the same time, the
interrupt flag bit, CCP2IF, is set.
16.3.1 CCP PIN CONFIGURATION
The user must configure the CCPx pin as an output by
clearing the appropriate TRIS bit.
16.3.2 TIMER1/TIMER3 MODE SELECTION
Timer1 and/or Timer3 must be running in Timer mode,
or Synchronized Counter mode, if the CCP module is
using the compare feature. In Asynchronous Counter
mode, the compare operation may not work.
16.3.3 SOFTWARE INTERRUPT MODE
When the Generate Software Interrupt mode is chosen
(CCP2M<3:0> = 1010), the CCP2 pin is not affected.
Only a CCP interrupt is generated, if enabled, and the
CCP2IE bit is set.
16.3.4 SPECIAL EVENT TRIGGER
Both CCP modules are equipped with a Special Event
Trigger. This is an internal hardware signal generated
in Compare mode to trigger actions by other modules.
The Special Event Trigger is enabled by selecting
the Compare Special Event Trigger mode
(CCP2M<3:0> = 1011).
For either CCP module, the Special Event Trigger resets
the Timer register pair for whichever timer resource is
currently assigned as the module’s time base. This
allows the CCPRx registers to serve as a programmable
period register for either timer.
The Special Event Trigger for CCP2 can also start an
A/D conversion. In order to do this, the A/D Converter
must already be enabled.
FIGURE 16-3: COMPARE MODE OPERATION BLOCK DIAGRAM
Note: Clearing the CCP2CON register will force
the RC1 or RE7 compare output latch
(depending on device configuration) to the
default low level. This is not the PORTC or
PORTE I/O data latch.
Note: The Special Event Trigger of CCP1 only
resets Timer1/Timer3 and cannot start an
A/D conversion even when the A/D
Converter is enabled.
CCPR1H CCPR1L
TMR1H TMR1L
Comparator Q
S
R
Output
Logic
Special Event Trigger
Set CCP1IF
CCP1 Pin
TRIS
CCP1CON<3:0>
Output Enable
TMR3H TMR3L
CCPR2H CCPR2L
Comparator
1
0
T3CCP2
T3CCP1
Set CCP2IF
1
0
Compare
4
(Timer1 Reset)
Q
S
R
Output
Logic
Special Event Trigger
CCP2 Pin
TRIS
CCP2CON<3:0>
Output Enable
4
(Timer1/Timer3 Reset, A/D Trigger)
Match
Compare
Match
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DS39979A-page 162 Preliminary 2010 Microchip Technology Inc.
TABLE 16-3: REGISTERS ASSOCIATED WITH CAPTURE, COMPARE, TIMER1 AND TIMER3
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on Page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
RCON IPEN CM RI TO PD POR BOR 50
PIR3 LCDIF RC2IF TX2IF CTMUIF CCP2IF CCP1IF RTCCIF 52
PIE3 LCDIE RC2IE TX2IE CTMUIE CCP2IE CCP1IE RTCCIE 52
IPR3 LCDIP RC2IP TX2IP CTMUIP CCP2IP CCP1IP RTCCIP 52
PIR2 OSCFIF CMIF BCLIF LVDIF TMR3IF —52
PIE2 OSCFIE CMIE BCLIE LVDIE TMR3IE —52
IPR2 OSCFIP CMIP BCLIP LVDIP TMR3IP —52
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 52
TRISE TRISE7 TRISE6 TRISE5 TRISE4 TRISE3 TRISE1 TRISE0 52
TRISG SPIOD CCP2OD CCP1OD TRISG4 TRISG3 TRISG2 TRISG1 TRISG0 52
TMR1L Timer1 Register Low Byte 50
TMR1H Timer1 Register High Byte 50
T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 50
TMR3H Timer3 Register High Byte 51
TMR3L Timer3 Register Low Byte 51
T3CON RD16 T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON 51
CCPR1L Capture/Compare/PWM Register 1 Low Byte 53
CCPR1H Capture/Compare/PWM Register 1 High Byte 53
CCP1CON DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 53
CCPR2L Capture/Compare/PWM Register 2 Low Byte 53
CCPR2H Capture/Compare/PWM Register 2 High Byte 53
CCP2CON DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 53
Legend: = unimplemented, read as ‘0’. Shaded cells are not used by Capture/Compare, Timer1 or Timer3.
2010 Microchip Technology Inc. Preliminary DS39979A-page 163
PIC18F87J72 FAMILY
16.4 PWM Mode
In Pulse-Width Modulation (PWM) mode, the CCP2 pin
produces up to a 10-bit resolution PWM output. Since
the CCP2 pin is multiplexed with a PORTC or PORTE
data latch, the appropriate TRIS bit must be cleared to
make the CCP2 pin an output.
Figure 16-4 shows a simplified block diagram of the
CCP1 module in PWM mode.
For a step-by-step procedure on how to set up the CCP
module for PWM operation, see Section 16.4.3
“Setup for PWM Operation”.
FIGURE 16-4: SIMPLIFIED PWM BLOCK
DIAGRAM
A PWM output (Figure 16-5) has a time base (period)
and a time that the output stays high (duty cycle). The
frequency of the PWM is the inverse of the period
(1/period).
FIGURE 16-5: PWM OUTPUT
16.4.1 PWM PERIOD
The PWM period is specified by writing to the PR2
register. The PWM period can be calculated using the
following formula:
EQUATION 16-1:
PWM frequency is defined as 1/[PWM period].
When TMR2 is equal to PR2, the following three events
occur on the next increment cycle:
•TMR2 is cleared
The CCP2 pin is set (exception: if PWM duty
cycle = 0%, the CCP2 pin will not be set)
The PWM duty cycle is latched from CCPR2L into
CCPR2H
Note: Clearing the CCP2CON register will force
the RC1 or RE7 output latch (depending
on device configuration) to the default low
level. This is not the PORTC or PORTE
I/O data latch.
CCPR1L
CCPR1H (Slave)
Comparator
TMR2
Comparator
PR2
(Note 1)
RQ
S
Duty Cycle Registers CCP1CON<5:4>
Clear Timer,
CCP1 pin and
latch D.C.
TRISC<2>
RC2/CCP1
Note 1: The 8-bit TMR2 value is concatenated with the 2-bit
internal Q clock, or 2 bits of the prescaler, to create
the 10-bit time base.
Note: The Timer2 postscalers (see Section 13.0
“Timer2 Module”) are not used in the
determination of the PWM frequency. The
postscaler could be used to have a servo
update rate at a different frequency than
the PWM output.
Period
Duty Cycle
TMR2 = PR2
TMR2 = Duty Cycle
TMR2 = PR2
PWM Period = (PR2) + 1] • 4 • TOSC
(TMR2 Prescale Value)
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DS39979A-page 164 Preliminary 2010 Microchip Technology Inc.
16.4.2 PWM DUTY CYCLE
The PWM duty cycle is specified by writing to the
CCPR2L register and to the CCP2CON<5:4> bits. Up
to 10-bit resolution is available. The CCPR2L contains
the eight MSbs and the CCP2CON<5:4> bits contain
the two LSbs. This 10-bit value is represented by
CCPR2L:CCP2CON<5:4>. The following equation is
used to calculate the PWM duty cycle in time:
EQUATION 16-2:
CCPR2L and CCP2CON<5:4> can be written to at any
time, but the duty cycle value is not latched into
CCPR2H until after a match between PR2 and TMR2
occurs (i.e., the period is complete). In PWM mode,
CCPR2H is a read-only register.
The CCPR2H register and a 2-bit internal latch are
used to double-buffer the PWM duty cycle. This
double-buffering is essential for glitchless PWM
operation.
When the CCPR2H and 2-bit latch match TMR2,
concatenated with an internal 2-bit Q clock or 2 bits of
the TMR2 prescaler, the CCP2 pin is cleared.
The maximum PWM resolution (bits) for a given PWM
frequency is given by the equation:
EQUATION 16-3:
TABLE 16-4: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 40 MHz
PWM Duty Cycle = (CCPR2L:CCP2CON<5:4>) •
TOSC • (TMR2 Prescale Value)
Note: If the PWM duty cycle value is longer than
the PWM period, the CCP2 pin will not be
cleared.
FOSC
FPWM
---------------


log
2log
----------------------------- b i t s=
PWM Resolution (max)
PWM Frequency 2.44 kHz 9.77 kHz 39.06 kHz 156.25 kHz 312.50 kHz 416.67 kHz
Timer Prescaler (1, 4, 16)1641111
PR2 Value FFh FFh FFh 3Fh 1Fh 17h
Maximum Resolution (bits) 14 12 10 8 7 6.58
2010 Microchip Technology Inc. Preliminary DS39979A-page 165
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16.4.3 SETUP FOR PWM OPERATION
The following steps should be taken when configuring
the CCP module for PWM operation:
1. Set the PWM period by writing to the PR2
register.
2. Set the PWM duty cycle by writing to the
CCPR2L register and CCP2CON<5:4> bits.
3. Make the CCP2 pin an output by clearing the
appropriate TRIS bit.
4. Set the TMR2 prescale value, then enable
Timer2 by writing to T2CON.
5. Configure the CCP2 module for PWM operation.
TABLE 16-5: REGISTERS ASSOCIATED WITH PWM AND TIMER2
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on Page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
RCON IPEN CM RI TO PD POR BOR 50
PIR1 ADIF RC1IF TX1IF SSPIF —TMR2IFTMR1IF 52
PIE1 ADIE RC1IE TX1IE SSPIE —TMR2IETMR1IE 52
IPR1 ADIP RC1IP TX1IP SSPIP —TMR2IPTMR1IP 52
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 52
TRISE TRISE7 TRISE6 TRISE5 TRISE4 TRISE3 TRISE1 TRISE0 52
TRISG SPIOD CCP2OD CCP1OD TRISG4 TRISG3 TRISG2 TRISG1 TRISG0 52
TMR2 Timer2 Register 50
PR2 Timer2 Period Register 50
T2CON T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0 50
CCPR1L Capture/Compare/PWM Register 1 Low Byte 53
CCPR1H Capture/Compare/PWM Register 1 High Byte 53
CCP1CON DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 53
CCPR2L Capture/Compare/PWM Register 2 Low Byte 53
CCPR2H Capture/Compare/PWM Register 2 High Byte 53
CCP2CON DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 53
Legend: — = unimplemented, read as 0’. Shaded cells are not used by PWM or Timer2.
PIC18F87J72 FAMILY
DS39979A-page 166 Preliminary 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. Preliminary DS39979A-page 167
PIC18F87J72 FAMILY
17.0 LIQUID CRYSTAL DISPLAY
(LCD) DRIVER MODULE
The Liquid Crystal Display (LCD) driver module
generates the timing control to drive a static or
multiplexed LCD panel. It also provides control of the
LCD pixel data. The module can drive panels of up to
132 pixels (33 segments by 4 commons).
The LCD driver module supports these features:
Direct driving of LCD panel
On-chip bias generator with dedicated charge
pump to support a range of fixed and variable bias
options
Up to four commons, with four Multiplexing modes
Up to 33 segments
Three LCD clock sources with selectable prescaler,
with a fourth source available for use with the LCD
charge pump
A simplified block diagram of the module is shown in
Figure 17-1.
FIGURE 17-1: LCD DRIVER MODULE BLOCK DIAGRAM
COM<3:0>
Timing Control
Data Bus
INTRC Oscillator
FOSC/4
T13CKI
132
to
33
MUX SEG<32:0>
To I/O Pins
20 x 8 (= 4 x 40)
LCD DATA
LCDCON
LCDPS
LCDSEx
LCDDATA0
LCDDATA1
LCDDATA21
LCDDATA22
.
.
.
LCD Bias Generation
LCD Clock
Source Select
LCD
Charge Pump
33
4
Bias
Voltage
8
INTOSC Oscillator
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DS39979A-page 168 Preliminary 2010 Microchip Technology Inc.
17.1 LCD Registers
The LCD driver module has 33 registers:
LCD Control Register (LCDCON)
LCD Phase Register (LCDPS)
LCDREG Register (LCD Regulator Control)
Five LCD Segment Enable Registers
(LCDSE4:LCDSE0)
20 LCD Data Registers (LCDDATAx, for x from 0 to
22, with 5, 11 and 17 not implemented)
17.1.1 LCD CONTROL REGISTERS
The LCDCON register, shown in Register 17-1,
controls the overall operation of the module. Once the
module is configured, the LCDEN (LCDCON<7>) bit is
used to enable or disable the LCD module. The LCD
panel can also operate during Sleep by clearing the
SLPEN (LCDCON<6>) bit.
The LCDPS register, shown in Register 17-2,
configures the LCD clock source prescaler and the type
of waveform: Type-A or Type-B. Details on these
features are provided in Section 17.2 “LCD Clock
Source”, Section 17.3 “LCD Bias Generation” and
Section 17.8 “LCD Waveform Generation”.
The LCDREG register is described in Section 17.3
“LCD Bias Generation”.
The LCD Segment Enable registers (LCDSEx)
configure the functions of the port pins. Setting the
segment enable bit for a particular segment configures
that pin as an LCD driver. The prototype LCDSE
register is shown in Register 17-3. There are five
LCDSE registers (LCDSE4:LCDSE0), listed in
Table 17-1.
REGISTER 17-1: LCDCON: LCD CONTROL REGISTER
R/W-0 R/W-0 R/C-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
LCDEN SLPEN WERR CS1 CS0 LMUX1 LMUX0
bit 7 bit 0
Legend: C = Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 LCDEN: LCD Driver Enable bit
1 = LCD driver module is enabled
0 = LCD driver module is disabled
bit 6 SLPEN: LCD Driver Enable in Sleep mode bit
1 = LCD driver module is disabled in Sleep mode
0 = LCD driver module is enabled in Sleep mode
bit 5 WERR: LCD Write Failed Error bit
1 = LCDDATAx register written while LCDPS<4> = 0 (must be cleared in software)
0 = No LCD write error
bit 4 Unimplemented: Read as0
bit 3-2 CS<1:0>: Clock Source Select bits
1x = INTRC (31 kHz)
01 = T13CKI (Timer1)
00 = System clock (FOSC/4)
bit 1-0 LMUX<1:0>: Commons Select bits
LMUX<1:0> Multiplex Type Maximum Number
of Pixels Bias Type
00 Static (COM0) 33 Static
01 1/2 (COM1:COM0) 66 1/2 or 1/3
10 1/3 (COM2:COM0) 99 1/2 or 1/3
11 1/4 (COM3:COM0) 132 1/3
2010 Microchip Technology Inc. Preliminary DS39979A-page 169
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REGISTER 17-2: LCDPS: LCD PHASE REGISTER
R/W-0 R/W-0 R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0
WFT BIASMD LCDA WA LP3 LP2 LP1 LP0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 WFT: Waveform Type Select bit
1 = Type-B waveform (phase changes on each frame boundary)
0 = Type-A waveform (phase changes within each common type)
bit 6 BIASMD: Bias Mode Select bit
When LMUX<1:0> = 00:
0 = Static Bias mode (do not set this bit to ‘1’)
When LMUX<1:0> = 01 or 10:
1 = 1/2 Bias mode
0 = 1/3 Bias mode
When LMUX<1:0> = 11:
0 = 1/3 Bias mode (do not set this bit to ‘1’)
bit 5 LCDA: LCD Active Status bit
1 = LCD driver module is active
0 = LCD driver module is inactive
bit 4 WA: LCD Write Allow Status bit
1 = Write into the LCDDATAx registers is allowed
0 = Write into the LCDDATAx registers is not allowed
bit 3-0 LP<3:0>: LCD Prescaler Select bits
1111 = 1:16
1110 = 1:15
1101 = 1:14
1100 = 1:13
1011 = 1:12
1010 = 1:11
1001 = 1:10
1000 = 1:9
0111 = 1:8
0110 = 1:7
0101 = 1:6
0100 = 1:5
0011 = 1:4
0010 = 1:3
0001 = 1:2
0000 = 1:1
PIC18F87J72 FAMILY
DS39979A-page 170 Preliminary 2010 Microchip Technology Inc.
TABLE 17-1: LCDSE REGISTERS AND ASSOCIATED SEGMENTS
REGISTER 17-3: LCDSEx: LCD SEGMENT ENABLE REGISTERS
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SE(n + 7) SE(n + 6) SE(n + 5) SE(n + 4) SE(n + 3) SE(n + 2) SE(n + 1) SE(n)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 SEG(n + 7):SEG(n): Segment Enable bits
For LCDSE0: n = 0
For LCDSE1: n = 8
For LCDSE2: n = 16
For LCDSE3: n = 24
For LCDSE4: n = 32
1 = Segment function of the pin is enabled; digital I/O disabled
0 = I/O function of the pin is enabled
Register Segments
LCDSE0 7:0
LCDSE1 15:8
LCDSE2 23:16
LCDSE3 31:24
LCDSE4(1) 32
Note 1: Only LCDSE4<0> (SEG32) is implemented.
2010 Microchip Technology Inc. Preliminary DS39979A-page 171
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17.1.2 LCD DATA REGISTERS
Once the module is initialized for the LCD panel, the
individual bits of the LCDDATA registers are cleared or
set to represent a clear or dark pixel, respectively.
Specific sets of LCDDATA registers are used with
specific segments and common signals. Each bit
represents a unique combination of a specific segment
connected to a specific common.
Individual LCDDATA bits are named by the convention
“SxxCy”, with “xx” as the segment number and “y” as
the common number. The relationship is summarized
in Table 17-2. The prototype LCDDATA register is
shown in Register 17-4.
TABLE 17-2: LCDDATA REGISTERS AND BITS FOR SEGMENT AND COM COMBINATIONS
Note:
LCDDATA5, LCDDATA11 and LCDDATA17
are not implemented.
REGISTER 17-4: LCDDATAx: LCD DATA REGISTERS(1)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
S(n + 7)Cy S(n + 6)Cy S(n + 5)Cy S(n + 4)Cy S(n + 3)Cy S(n + 2)Cy S(n + 1)Cy S(n)Cy
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 S(n + 7)Cy:S(n)Cy: Pixel On bits
For LCDDATA0 through LCDDATA5: n = (8x), y = 0(1)
For LCDDATA6 through LCDDATA10: n = (8(x – 6)), y = 1
For LCDDATA12 through LCDDATA16: n = (8(x – 12)), y = 2(1)
For LCDDATA18 through LCDDATA22: n = (8(x – 18)), y = 3(1)
1 = Pixel on (dark)
0 = Pixel off (clear)
Note 1: LCDDATA5, LCDDATA11 and LCDDATA17 are not implemented.
Segments
COM Lines
0123
0 through 7 LCDDATA0 LCDDATA6 LCDDATA12 LCDDATA18
S00C0:S07C0 S00C1:S07C1 S00C2:S07C2 S00C3:S07C3
8 through 15 LCDDATA1 LCDDATA7 LCDDATA13 LCDDATA19
S08C0:S15C0 S08C1:S15C1 S08C2:S15C2 S08C0:S15C3
16 through 23 LCDDATA2 LCDDATA8 LCDDATA14 LCDDATA20
S16C0:S23C0 S16C1:S23C1 S16C2:S23C2 S16C3:S23C3
24 through 31 LCDDATA3 LCDDATA9 LCDDATA15 LCDDATA21
S24C0:S31C0 S24C1:S31C1 S24C2:S31C2 S24C3:S31C3
32 LCDDATA4(1) LCDDATA10(1) LCDDATA16(1) LCDDATA22(1)
S32C0 S32C1 S32C2 S32C3
Note 1: Only bit<0> of these registers is implemented.
PIC18F87J72 FAMILY
DS39979A-page 172 Preliminary 2010 Microchip Technology Inc.
17.2 LCD Clock Source
The LCD driver module generates its internal clock
from 3 possible sources:
System clock (FOSC/4)
Timer1 oscillator
INTRC source
The LCD clock generator uses a configurable
divide-by-32/divide-by-8192 postscaler to produce a
baseline frequency of about 1 kHz nominal, regardless
of the source selected. The clock source selection and
the postscaler configuration are determined by the
Clock Source Select bits, CS<1:0> (LCDCON<3:2>).
An additional programmable prescaler is used to derive
the LCD frame frequency from the 1 kHz baseline. The
prescaler is configured using the LP<3:0> bits
(LCDPS<3:0>) for any one of 16 options, ranging from
1:1 to 1:16.
Proper timing for waveform generation is set by the
LMUX<1:0> bits (LCDCON<1:0>). These bits
determine which Commons Multiplexing mode is to be
used, and divide down the LCD clock source as
required. They also determine the configuration of the
ring counter that is used to switch the LCD commons
on or off.
17.2.1 LCD VOLTAGE REGULATOR
CLOCK SOURCE
In addition to the clock source for LCD timing, a
separate 31 kHz nominal clock is required for the LCD
charge pump. This is provided from a distinct branch of
the LCD clock source.
The charge pump clock can use either the Timer1
oscillator or the INTRC source, as well as the 8 MHz
INTOSC source (after being divided by 256 by a
prescaler). The charge pump clock source is configured
using the CKSEL<1:0> bits (LCDREG<1:0>).
17.2.2 CLOCK SOURCE
CONSIDERATIONS
When using the system clock as the LCD clock source,
it is assumed that the system clock frequency is a nom-
inal 32 MHz (for a FOSC/4 frequency of 8 MHz).
Because the prescaler option for the FOSC/4 clock
selection is fixed at divide-by-8192, system clock
speeds that differ from 32 MHz will produce frame
frequencies and refresh rates different than discussed
in this chapter. The user will need to keep this in mind
when designing the display application.
The Timer1 and INTRC sources can be used as LCD
clock sources when the device is in Sleep mode. To
use the Timer1 oscillator, it is necessary to set the
T1OSCEN bit (T1CON<3>). Selecting either Timer1 or
INTRC as the LCD clock source will not automatically
activate these sources.
Similarly, selecting the INTOSC as the charge pump
clock source will not turn the oscillator on. To use
INTOSC, it must be selected as the system clock
source by using the FOSC2 Configuration bit.
If Timer1 is used as a clock source for the device, either
as an LCD clock source or for any other purpose, LCD
Segment 32 becomes unavailable.
FIGURE 17-2: LCD CLOCK GENERATION
LCDCON<3:2>
Timer1 Oscillator
Internal 31 kHz Source
÷4
Programmable
÷1, 2, 3, 4
Ring Counter
COM0
COM1
COM2
COM3
÷2 ÷32
LCDCON<1:0>
LCDPS<3:0>
System Clock (FOSC/4)
INTOSC 8 MHz Source
1:1 to 1:16
Prescaler
1x
01
00
11
10
01
00
31 kHz Clock
11
10
01
LCDREG<1:0>
to LCD Charge Pump
÷8192
or
4
2
2
2
÷256
2010 Microchip Technology Inc. Preliminary DS39979A-page 173
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17.3 LCD Bias Generation
The LCD driver module is capable of generating the
required bias voltages for LCD operation with a mini-
mum of external components. This includes the ability
to generate the different voltage levels required by the
different bias types required by the LCD. The driver
module can also provide bias voltages both above and
below microcontroller VDD through the use of an
on-chip LCD voltage regulator.
17.3.1 LCD BIAS TYPES
PIC18F87J72 family devices support three bias types
based on the waveforms generated to control
segments and commons:
Static (two discrete levels)
1/2 Bias (three discrete levels
1/3 Bias (four discrete levels)
The use of different waveforms in driving the LCD is dis-
cussed in more detail in Section 17.8 “LCD Waveform
Generation”.
17.3.2 LCD VOLTAGE REGULATOR
The purpose of the LCD regulator is to provide proper
bias voltage and good contrast for the LCD, regardless
of VDD levels. This module contains a charge pump and
internal voltage reference. The regulator can be config-
ured by using external components to boost bias
voltage above VDD. It can also operate a display at a
constant voltage below VDD. The regulator can also be
selectively disabled to allow bias voltages to be
generated by an external resistor network.
The LCD regulator is controlled through the LCDREG
register (Register 17-5). It is enabled or disabled using
the CKSEL<1:0> bits, while the charge pump can be
selectively enabled using the CPEN bit. When the reg-
ulator is enabled, the MODE13 bit is used to select the
bias type. The peak LCD bias voltage, measured as a
difference between the potentials of LCDBIAS3 and
LCDBIAS0, is configured with the BIAS bits.
REGISTER 17-5: LCDREG: VOLTAGE REGULATOR CONTROL REGISTER
U-0 RW-0RW-1RW-1RW-1RW-1RW-0RW-0
CPEN BIAS2 BIAS1 BIAS0 MODE13 CKSEL1 CKSEL0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as ‘0
bit 6 CPEN: LCD Charge Pump Enable bit
1 = Charge pump enabled; highest LCD bias voltage is 3.6V
0 = Charge pump disabled; highest LCD bias voltage is AVDD
bit 5-3 BIAS<2:0>: Regulator Voltage Output Control bits
111 = 3.60V peak (offset on LCDBIAS0 of 0V)
110 = 3.47V peak (offset on LCDBIAS0 of 0.13V)
101 = 3.34V peak (offset on LCDBIAS0 of 0.26V)
100 = 3.21V peak (offset on LCDBIAS0 of 0.39V)
011 = 3.08V peak (offset on LCDBIAS0 of 0.52V)
010 = 2.95V peak (offset on LCDBIAS0 of 0.65V)
001 = 2.82V peak (offset on LCDBIAS0 of 0.78V)
000 = 2.69V peak (offset on LCDBIAS0 of 0.91V)
bit 2 MODE13: 1/3 LCD Bias Enable bit
1 = Regulator output supports 1/3 LCD Bias mode
0 = Regulator output supports Static LCD Bias mode
bit 1-0 CKSEL<1:0>: Regulator Clock Source Select bits
11 = INTRC
10 = INTOSC 8 MHz source
01 = Timer1 oscillator
00 = LCD regulator disabled
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DS39979A-page 174 Preliminary 2010 Microchip Technology Inc.
17.3.3 BIAS CONFIGURATIONS
PIC18F87J72 family devices have four distinct circuit
configurations for LCD bias generation:
M0: Regulator with Boost
M1: Regulator without Boost
M2: Resistor Ladder with Software Contrast
M3: Resistor Ladder with Hardware Contrast
17.3.3.1 M0 (Regulator with Boost)
In M0 operation, the LCD charge pump feature is
enabled. This allows the regulator to generate voltages
up to +3.6V to the LCD (as measured at LCDBIAS3).
M0 uses a flyback capacitor connected between
VLCAP1 and VLCAP2, as well as filter capacitors on
LCDBIAS0 through LCDBIAS3, to obtain the required
voltage boost (Figure 17-3). The output voltage (VBIAS)
is the difference of potential between LCDBIAS3 and
LCDBIAS0. It is set by the BIAS<2:0> bits which adjust
the offset between LCDBIAS0 and VSS. The flyback
capacitor (CFLY) acts as a charge storage element for
large LCD loads. This mode is useful in those cases
where the voltage requirements of the LCD are higher
than the microcontroller’s VDD. It also permits software
control of the display’s contrast by adjustment of bias
voltage by changing the value of the BIAS bits.
M0 supports Static and 1/3 Bias types. Generation of
the voltage levels for 1/3 Bias is handled automatically,
but must be configured in software.
M0 is enabled by selecting a valid regulator clock
source (CKSEL<1:0> set to any value except00’) and
setting the CPEN bit. If Static Bias type is required, the
MODE13 bit must be cleared.
17.3.3.2 M1 (Regulator without Boost)
M1 operation is similar to M0, but does not use the LCD
charge pump. It can provide VBIAS up to the voltage
level supplied directly to LCDBIAS3. It can be used in
cases where VDD for the application is expected to
never drop below a level that can provide adequate
contrast for the LCD. The connection of external com-
ponents is very similar to M0, except that LCDBIAS3
must be tied directly to VDD (Figure 17-3).
The BIAS<2:0> bits can still be used to adjust contrast
in software by changing VBIAS. As with M0, changing
these bits changes the offset between LCDBIAS0 and
VSS. In M1, this is reflected in the change between the
LCDBIAS0 and the voltage tied to LCDBIAS3. Thus, if
VDD should change, VBIAS will also change; where in
M0, the level of VBIAS is constant.
Like M0, M1 supports Static and 1/3 Bias types.
Generation of the voltage levels for 1/3 Bias is handled
automatically but must be configured in software.
M1 is enabled by selecting a valid regulator clock
source (CKSEL<1:0> set to any value except ‘00’) and
clearing the CPEN bit. If 1/3 Bias type is required, the
MODE13 bit should also be set.
FIGURE 17-3: LCD REGULATOR CONNECTIONS FOR M0 AND M1 CONFIGURATIONS
Note: When the device enters Sleep mode while
operating in Bias modes, M0 or M1, be
sure that the bias capacitors are fully dis-
charged in order to get the lowest Sleep
current.
LCDBIAS3
LCDBIAS2
LCDBIAS1
LCDBIAS0
AVDD
VDD
VLCAP1
VLCAP2
CFLY
C0
C1
C2
C3
C0
C1
C2
VDD
VDD
(VBIAS up to 3.6V)
Mode 0
(VBIAS VDD)
Mode 1
CFLY
Note 1: These values are provided for design guidance only. They should be optimized for the application by the designer based on the
actual LCD specifications.
0.47 µF(1)
0.47 µF(1)
0.47 µF(1)
0.47 µF(1)
0.47 µF(1)
0.47 µF(1)
0.47 µF(1)
0.47 µF(1)
0.47 µF(1)
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17.3.3.3 M2 (Resistor Ladder with
Software Contrast)
M2 operation also uses the LCD regulator but disables
the charge pump. The regulator’s internal voltage refer-
ence remains active as a way to regulate contrast. It is
used in cases where the current requirements of the
LCD exceed the capacity of the regulator’s charge
pump.
In this configuration, the LCD bias voltage levels are
created by an external resistor voltage divider
connected across LCDBIAS0 through LCDBIAS3, with
the top of the divider tied to VDD (Figure 17-4). The
potential at the bottom of the ladder is determined by
the LCD regulator’s voltage reference, tied internally to
LCDBIAS0. The bias type is determined by the volt-
ages on the LCDBIAS pins, which are controlled by the
configuration of the resistor ladder. Most applications
using M2 will use a 1/3 or 1/2 Bias type. While Static
Bias can also be used, it offers extremely limited
contrast range and additional current consumption
over other bias generation modes.
Like M1, the LCDBIAS bits can be used to control con-
trast, limited by the level of VDD supplied to the device.
Also, since there is no capacitor required across
VLCAP1 and VLCAP2, these pins are available as digital
I/O ports, RG2 and RG3.
M2 is selected by clearing the CKSEL<1:0> bits and
setting the CPEN bit.
FIGURE 17-4: RESISTOR LADDER CONNECTIONS FOR M2 CONFIGURATION
LCDBIAS3
Note 1: These values are provided for design guidance only; they should be optimized for the application by the designer
based on the actual LCD specifications.
Bias Level at Pin
Bias Type
1/2 Bias 1/3 Bias
LCDBIAS0 (Internal low reference voltage) (Internal low reference voltage)
LCDBIAS1 1/2 VBIAS 1/3 VBIAS
LCDBIAS2 1/2 VBIAS 2/3 VBIAS
LCDBIAS3 VBIAS (up to AVDD)VBIAS (up to AVDD)
10 k(1)
10 k(1)
1/2 Bias 1/3 Bias
LCDBIAS2
LCDBIAS1
LCDBIAS0
AVDD
10 k(1)
10 k(1)
10 k(1)
VDD
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17.3.3.4 M3 (Hardware Contrast)
In M3, the LCD regulator is completely disabled. Like
M2, LCD bias levels are tied to AVDD, and are generated
using an external divider. The difference is that the inter-
nal voltage reference is also disabled and the bottom of
the ladder is tied to ground (VSS); see Figure 17-5. The
value of the resistors, and the difference between VSS
and VDD, determine the contrast range; no software
adjustment is possible. This configuration is also used
where the LCD’s current requirements exceed the
capacity of the charge pump and software contrast
control is not needed.
Depending on the bias type required, resistors are
connected between some or all of the pins. A potentio-
meter can also be connected between LCDBIAS3 and
VDD to allow for hardware controlled contrast
adjustment.
M3 is selected by clearing the CKSEL<1:0> and CPEN
bits.
FIGURE 17-5: RESISTOR LADDER CONNECTIONS FOR M3 CONFIGURATION
LCDBIAS3
Note 1: These values are provided for design guidance only; they should be optimized for the application by the
designer based on the actual LCD specifications.
2: Potentiometer for manual contrast adjustment is optional; it may be omitted entirely.
Bias Level at Pin
Bias Type
Static 1/2 Bias 1/3 Bias
LCDBIAS0 AVSS AVSS AVSS
LCDBIAS1 AVSS 1/2 AVDD 1/3 AVDD
LCDBIAS2 AVDD 1/2 AVDD 2/3 AVDD
LCDBIAS3 AVDD AVDD AVDD
10 k(1)
10 k(1)
Static Bias 1/2 Bias 1/3 Bias
LCDBIAS2
LCDBIAS1
LCDBIAS0
AVDD
10 k(1)
10 k(1)
10 k(1)
VDD
(2)
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17.3.4 DESIGN CONSIDERATIONS FOR
THE LCD CHARGE PUMP
When designing applications that use the LCD regula-
tor with the charge pump enabled, users must always
consider both the dynamic current and RMS (static)
current requirements of the display, and what the
charge pump can deliver. Both dynamic and static
current can be determined by Equation 17-1:
EQUATION 17-1:
For dynamic current, C is the value of the capacitors
attached to LCDBIAS3 and LCDBIAS2. The variable,
dV, is the voltage drop allowed on C2 and C3 during a
voltage switch on the LCD display, and dT is the dura-
tion of the transient current after a clock pulse occurs.
For practical design purposes, these will be assumed
to be 0.047 F for C, 0.1V for dV and 1 s for dT. This
yields a dynamic current of 4.7 mA for 1 s.
RMS current is determined by the value of CFLY for C,
the voltage across VLCAP1 and VLCAP2 for dV and the
regulator clock period (TPER) for dT. Assuming CFLY of
0.047 F, a value of 1.02V across CFLY and TPER of
30 s, the maximum theoretical static current will be
1.8 mA. Since the charge pump must charge five
capacitors, the maximum current becomes 360 A. For
a real-world assumption of 50% efficiency, this yields a
practical current of 180 A.
Users should compare the calculated current capacity
against the requirements of the LCD. While dV and dT
are relatively fixed by device design, the values of CFLY
and the capacitors on the LCDBIAS pins can be
changed to increase or decrease current. As always,
any changes should be evaluated in the actual circuit
for its impact on the application.
17.4 LCD Multiplex Types
The LCD driver module can be configured into four
multiplex types:
Static (only COM0 used)
1/2 Multiplex (COM0 and COM1 are used)
1/3 Multiplex (COM0, COM1 and COM2 are used)
1/4 Multiplex (all COM0, COM1, COM2 and COM3
are used)
The number of active commons used is configured by
the LMUX<1:0> bits (LCDCON<1:0>), which deter-
mines the function of the PORTE<6:4> pins (see
Table 17-3 for details). If the pin is configured as a COM
drive, the port I/O function is disabled and the TRIS
setting of that pin is overridden.
TABLE 17-3: PORTE<6:4> FUNCTION
17.5 Segment Enables
The LCDSEx registers are used to select the pin
function for each segment pin. Setting a bit configures
the corresponding pin to function as a segment driver.
LCDSEx registers do not override the TRIS bit settings,
so the TRIS bits must be configured as input for that
pin.
17.6 Pixel Control
The LCDDATAx registers contain bits which define the
state of each pixel. Each bit defines one unique pixel.
Table 17-2 shows the correlation of each bit in the
LCDDATAx registers to the respective common and
segment signals. Any LCD pixel location not being
used for display can be used as general purpose RAM.
I = C x dV
dT
Note: On a Power-on Reset, the LMUX<1:0>
bits are ‘00’.
LMUX<1:0> PORTE<6> PORTE<5> PORTE<4>
00 Digital I/O Digital I/O Digital I/O
01 Digital I/O Digital I/O COM1 Driver
10 Digital I/O COM2 Driver COM1 Driver
11 COM3 Driver COM2 Driver COM1 Driver
Note: On a Power-on Reset, these pins are
configured as digital I/O.
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17.7 LCD Frame Frequency
The rate at which the COM and SEG outputs change is
called the LCD frame frequency. Frame frequency is
set by the LP<3:0> bits (LCDPS<3:0>) and is also
affected by the Multiplex mode being used. The rela-
tionship between the Multiplex mode, LP bits setting
and frame rate is shown in Table 17-4 and Table 17-5.
TABLE 17-4: FRAME FREQUENCY
FORMULAS
TABLE 17-5: APPROXIMATE FRAME
FREQUENCY (IN Hz) FOR LP
PRESCALER SETTINGS
17.8 LCD Waveform Generation
LCD waveform generation is based on the principle
that the net AC voltage across the dark pixel should be
maximized and the net AC voltage across the clear
pixel should be minimized. The net DC voltage across
any pixel should be zero.
The COM signal represents the time slice for each
common, while the SEG contains the pixel data. The
pixel signal (COM-SEG) will have no DC component
and it can take only one of the two rms values. The
higher rms value will create a dark pixel and a lower
rms value will create a clear pixel.
As the number of commons increases, the delta
between the two rms values decreases. The delta
represents the maximum contrast that the display can
have.
The LCDs can be driven by two types of waveform:
Type-A and Type-B. In the Type-A waveform, the
phase changes within each common type, whereas in
the Type-B waveform, the phase changes on each
frame boundary. Thus, the Type-A waveform maintains
0 VDC over a single frame, whereas the Type-B
waveform takes two frames.
Figure 17-6 through Figure 17-16 provide waveforms
for static, half multiplex, one-third multiplex and quarter
multiplex drives for Type-A and Type-B waveforms.
Multiplex
Mode Frame Frequency (Hz)
Static Clock source/(4 x 1 x (LP<3:0> + 1))
1/2 Clock source/(2 x 2 x (LP<3:0> + 1))
1/3 Clock source/(1 x 3 x (LP<3:0> + 1))
1/4 Clock source/(1 x 4 x (LP<3:0> + 1))
LP<3:0>
Multiplex Mode
Static 1/2 1/3 1/4
1 125 125 167 125
2 83 83 111 83
3 62628362
4 50506750
5 42425642
6 36364836
7 31314231
Note 1: If the power-managed Sleep mode is
invoked while the LCD Sleep bit is set
(LCDCON<6> is ‘1’), take care to execute
Sleep only when the VDC on all the pixels
is ‘0’.
2: When the LCD clock source is the system
clock, the LCD module will go to Sleep if
the microcontroller goes into Sleep mode,
regardless of the setting of the SPLEN bit.
Thus, always take care to see that the VDC
on all pixels is ‘0’ whenever Sleep mode is
invoked.
2010 Microchip Technology Inc. Preliminary DS39979A-page 179
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FIGURE 17-6: TYPE-A/TYPE-B WAVEFORMS IN STATIC DRIVE
V1
V0
COM0
SEG0
COM0-SEG0
COM0-SEG1
SEG1
V1
V0
V1
V0
V0
V1
-V1
V0
1 Frame
COM0
SEG0
SEG1
SEG2
SEG3
SEG4
SEG5
SEG6
SEG7
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FIGURE 17-7: TYPE-A WAVEFORMS IN 1/2 MUX, 1/2 BIAS DRIVE
V2
V1
V0
V2
V1
V0
V2
V1
V0
V2
V1
V0
V2
V1
V0
-V2
-V1
V2
V1
V0
-V2
-V1
COM0
COM1
SEG0
SEG1
COM0-SEG0
COM0-SEG1
1 Frame
COM1
COM0
SEG0
SEG1
SEG2
SEG3
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FIGURE 17-8: TYPE-B WAVEFORMS IN 1/2 MUX, 1/2 BIAS DRIVE
V2
V1
V0
V2
V1
V0
V2
V1
V0
V2
V1
V0
V2
V1
V0
-V2
-V1
V2
V1
V0
-V2
-V1
COM0
COM1
SEG0
SEG1
COM0-SEG0
COM0-SEG1
COM1
COM0
SEG0
SEG1
SEG2
SEG3
2 Frames
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FIGURE 17-9: TYPE-A WAVEFORMS IN 1/2 MUX, 1/3 BIAS DRIVE
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
-V3
-V2
-V1
V3
V2
V1
V0
-V3
-V2
-V1
COM0
COM1
SEG0
SEG1
COM0-SEG0
COM0-SEG1
1 Frame
COM1
COM0
SEG0
SEG1
SEG2
SEG3
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FIGURE 17-10: TYPE-B WAVEFORMS IN 1/2 MUX, 1/3 BIAS DRIVE
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
-V3
-V2
-V1
V3
V2
V1
V0
-V3
-V2
-V1
COM0
COM1
SEG0
SEG1
COM0-SEG0
COM0-SEG1
COM1
COM0
SEG0
SEG1
SEG2
SEG3
2 Frames
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FIGURE 17-11: TYPE-A WAVEFORMS IN 1/3 MUX, 1/2 BIAS DRIVE
V2
V1
V0
V2
V1
V0
V2
V1
V0
V2
V1
V0
V2
V1
V0
V2
V1
V0
-V2
-V1
V2
V1
V0
-V2
-V1
COM0
COM1
COM2
SEG0
SEG1
COM0-SEG0
COM0-SEG1
1 Frame
COM2
COM1
COM0
SEG0
SEG1
SEG2
SEG2
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FIGURE 17-12: TYPE-B WAVEFORMS IN 1/3 MUX, 1/2 BIAS DRIVE
V2
V1
V0
V2
V1
V0
V2
V1
V0
V2
V1
V0
V2
V1
V0
V2
V1
V0
-V2
-V1
V2
V1
V0
-V2
-V1
COM0
COM1
COM2
SEG0
SEG1
COM0-SEG0
COM0-SEG1
2 Frames
COM2
COM1
COM0
SEG0
SEG1
SEG2
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FIGURE 17-13: TYPE-A WAVEFORMS IN 1/3 MUX, 1/3 BIAS DRIVE
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
-V3
-V2
-V1
V3
V2
V1
V0
-V3
-V2
-V1
COM0
COM1
COM2
SEG0
SEG1
COM0-SEG0
COM0-SEG1
1 Frame
COM2
COM1
COM0
SEG0
SEG1
SEG2
SEG2
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FIGURE 17-14: TYPE-B WAVEFORMS IN 1/3 MUX, 1/3 BIAS DRIVE
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
-V3
-V2
-V1
V3
V2
V1
V0
-V3
-V2
-V1
COM0
COM1
COM2
SEG0
SEG1
COM0-SEG0
COM0-SEG1
2 Frames
COM2
COM1
COM0
SEG0
SEG1
SEG2
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FIGURE 17-15: TYPE-A WAVEFORMS IN 1/4 MUX, 1/3 BIAS DRIVE
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
-V3
-V2
-V1
V3
V2
V1
V0
-V3
-V2
-V1
COM0
COM1
COM2
COM3
SEG0
SEG1
COM0-SEG0
COM0-SEG1
COM3
COM2
COM1
COM0
1 Frame
SEG0
SEG1
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FIGURE 17-16: TYPE-B WAVEFORMS IN 1/4 MUX, 1/3 BIAS DRIVE
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
-V3
-V2
-V1
V3
V2
V1
V0
-V3
-V2
-V1
COM0
COM1
COM2
COM3
SEG0
SEG1
COM0-SEG0
COM0-SEG1
COM3
COM2
COM1
COM0
2 Frames
SEG0
SEG1
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17.9 LCD Interrupts
The LCD timing generation provides an interrupt that
defines the LCD frame timing. This interrupt can be
used to coordinate the writing of the pixel data with the
start of a new frame. Writing pixel data at the frame
boundary allows a visually crisp transition of the image.
This interrupt can also be used to synchronize external
events to the LCD. For example, the interface to an
external segment driver can be synchronized for
segment data update to the LCD frame.
A new frame is defined to begin at the leading edge of
the COM0 common signal. The interrupt will be set
immediately after the LCD controller completes
accessing all pixel data required for a frame. This will
occur at a fixed interval before the frame boundary
(TFINT), as shown in Figure 17-17. The LCD controller
will begin to access data for the next frame within the
interval from the interrupt to when the controller begins
to access data after the interrupt (TFWR). New data
must be written within TFWR, as this is when the LCD
controller will begin to access the data for the next
frame.
When the LCD driver is running with Type-B wave-
forms, and the LMUX<1:0> bits are not equal to00’,
there are some additional issues that must be
addressed. Since the DC voltage on the pixel takes two
frames to maintain zero volts, the pixel data must not
change between subsequent frames. If the pixel data
were allowed to change, the waveform for the odd
frames would not necessarily be the complement of the
waveform generated in the even frames and a DC
component would be introduced into the panel. There-
fore, when using Type-B waveforms, the user must
synchronize the LCD pixel updates to occur within a
subframe after the frame interrupt.
To correctly sequence writing while in Type-B, the
interrupt will only occur on complete phase intervals. If
the user attempts to write when the write is disabled,
the WERR (LCDCON<5>) bit is set.
FIGURE 17-17: EXAMPLE WAVEFORMS AND INTERRUPT TIMING
IN QUARTER DUTY CYCLE DRIVE
Note: The interrupt is not generated when the
Type-A waveform is selected and when the
Type-B with no multiplex (static) is
selected.
Frame
Boundary
Frame
Boundary
LCD
Interrupt
Occurs
Controller Accesses
Next Frame Data
TFINT
TFWR
TFWR =TFRAME/2 * (LMUX<1:0> + 1) + TCY/2
TFINT =(TFWR/2 – (2 TCY + 40 ns)) Minimum = 1.5(TFRAME/4) – (2 TCY + 40 ns)
(TFWR/2 – (1 TCY + 40 ns)) Maximum = 1.5(TFRAME/4) – (1 TCY + 40 ns)
Frame
Boundary
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
COM0
COM1
COM2
COM3
2 Frames
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17.10 Operation During Sleep
The LCD module can operate during Sleep. The selec-
tion is controlled by the SLPEN bit (LCDCON<6>).
Setting the SLPEN bit allows the LCD module to go to
Sleep. Clearing the SLPEN bit allows the module to
continue to operate during Sleep.
If a SLEEP instruction is executed and SLPEN = 1, the
LCD module will cease all functions and go into a very
low-current consumption mode. The module will stop
operation immediately and drive the minimum LCD
voltage on both segment and common lines.
Figure 17-18 shows this operation.
To ensure that no DC component is introduced on the
panel, the SLEEP instruction should be executed imme-
diately after a LCD frame boundary. The LCD interrupt
can be used to determine the frame boundary. See
Section 17.9 “LCD Interrupts” for the formulas to
calculate the delay.
If a SLEEP instruction is executed and SLPEN = 0, the
module will continue to display the current contents of
the LCDDATA registers. To allow the module to
continue operation while in Sleep, the clock source
must be either the Timer1 oscillator or one of the
internal oscillators (either INTRC or INTOSC as the
default system clock). While in Sleep, the LCD data
cannot be changed. The LCD module current
consumption will not decrease in this mode; however,
the overall consumption of the device will be lower due
to shutdown of the core and other peripheral functions.
If the system clock is selected and the module is not
configured for Sleep operation, the module will ignore
the SLPEN bit and stop operation immediately. The
minimum LCD voltage will then be driven onto the
segments and commons
17.10.1 USING THE LCD REGULATOR
DURING SLEEP
Applications that use the LCD regulator for bias
generation may not achieve the same degree of power
reductions in Sleep mode when compared to applica-
tions using Mode 3 (resistor ladder) biasing. This is
particularly true with Mode 0 operation, where the
charge pump is active.
If Modes 0, 1 or 2 are used for bias generation,
software contrast control will not be available.
FIGURE 17-18: SLEEP ENTRY/EXIT WHEN SLPEN = 1 OR CS<1:0> = 00
SLEEP Instruction Execution Wake-up
2 Frames
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
V3
V2
V1
V0
COM0
COM1
COM2
SEG0
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17.11 Configuring the LCD Module
The following is the sequence of steps to configure the
LCD module.
1. Select the frame clock prescale using bits,
LP<3:0> (LCDPS<3:0>).
2. Configure the appropriate pins to function as
segment drivers using the LCDSEx registers.
3. Configure the appropriate pins as inputs using
the TRISx registers.
4. Configure the LCD module for the following
using the LCDCON register:
Multiplex and Bias mode (LMUX<1:0>)
Timing source (CS<1:0>)
Sleep mode (SLPEN)
5. Write initial values to pixel data registers,
LCDDATA0 through LCDDATA23.
6. Configure the LCD regulator:
a) If M2 or M3 bias configuration is to be used,
turn off the regulator by setting
CKSEL<1:0> (LCDREG<1:0>) to ‘00’. Set
or clear the CPEN bit (LCDREG<6>) to
select Mode 2 or Mode 3, as appropriate.
b) If M0 or M1 bias generation is to be used:
•Set the V
BIAS level using the BIAS<2:0>
bits (LCDREG<5:3>).
Set or clear the CPEN bit to enable or
disable the charge pump.
Set or clear the MODE13 bit
(LCDREG<2>) to select the Bias mode.
Select a regulator clock source using the
CKSEL<1:0> bits.
7. Clear LCD Interrupt Flag, LCDIF (PIR3<6>),
and if desired, enable the interrupt by setting the
LCDIE bit (PIE3<6>).
8. Enable the LCD module by setting the LCDEN
bit (LCDCON<7>).
2010 Microchip Technology Inc. Preliminary DS39979A-page 193
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TABLE 17-6: REGISTERS ASSOCIATED WITH LCD OPERATION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on Page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR3 —LCDIFRC2IF TX2IF CTMUIF CCP2IF CCP1IF RTCCIF 52
PIE3 LCDIE RC2IE TX2IE CTMUIE CCP2IE CCP1IE RTCCIE 52
IPR3 LCDIP RC2IP TX2IP CTMUIP CCP2IP CCP1IP RTCCIP 52
RCON IPEN CM RI TO PD POR BOR 50
LCDDATA22 S32C3 53
LCDDATA21 S31C3 S30C3 S29C3 S28C3 S27C3 S26C3 S25C3 S24C3 53
LCDDATA20 S23C3 S22C3 S21C3 S20C3 S19C3 S18C3 S17C3 S16C3 53
LCDDATA19 S15C3 S14C3 S13C3 S12C3 S11C3 S10C3 S09C3 S08C3 53
LCDDATA18 S07C3 S06C3 S05C3 S04C3 S03C3 S02C3 S01C3 S00C3 53
LCDDATA16 S32C2 53
LCDDATA15 S31C2 S30C2 S29C2 S28C2 S27C2 S26C2 S25C2 S24C2 53
LCDDATA14 S23C2 S22C2 S21C2 S20C2 S19C2 S18C2 S17C2 S16C2 53
LCDDATA13 S15C2 S14C2 S13C2 S12C2 S11C2 S10C2 S09C2 S08C2 53
LCDDATA12 S07C2 S06C2 S05C2 S04C2 S03C2 S02C2 S01C2 S00C2 53
LCDDATA10 S32C1 53
LCDDATA9 S31C1 S30C1 S29C1 S28C1 S27C1 S26C1 S25C1 S24C1 53
LCDDATA8 S23C1 S22C1 S21C1 S20C1 S19C1 S18C1 S17C1 S16C1 53
LCDDATA7 S15C1 S14C1 S13C1 S12C1 S11C1 S10C1 S09C1 S08C1 53
LCDDATA6 S07C1 S06C1 S05C1 S04C1 S03C1 S02C1 S01C1 S00C1 53
LCDDATA4 S32C0 51
LCDDATA3 S31C0 S30C0 S29C0 S28C0 S27C0 S26C0 S25C0 S24C0 51
LCDDATA2 S23C0 S22C0 S21C0 S20C0 S19C0 S18C0 S17C0 S16C0 51
LCDDATA1 S15C0 S14C0 S13C0 S12C0 S11C0 S10C0 S09C0 S08C0 51
LCDDATA0 S07C0 S06C0 S05C0 S04C0 S03C0 S02C0 S01C0 S00C0 51
LCDSE4 SE32 51
LCDSE3 SE31 SE30 SE29 SE28 SE27 SE26 SE25 SE24 51
LCDSE2 SE23 SE22 SE21 SE20 SE19 SE18 SE17 SE16 51
LCDSE1 SE15 SE14 SE13 SE12 SE11 SE10 SE09 SE08 51
LCDSE0 SE07 SE06 SE05 SE04 SE03 SE02 SE01 SE00 51
LCDCON LCDEN SLPEN WERR CS1 CS0 LMUX1 LMUX0 51
LCDPS WFT BIASMD LCDA WA LP3 LP2 LP1 LP0 51
LCDREG CPEN BIAS2 BIAS1 BIAS0 MODE13 CKSEL1 CKSEL0 50
Legend: — = unimplemented, read as 0. Shaded cells are not used for LCD operation.
Note 1: These registers or individual bits are unimplemented on PIC18F86J72 devices.
Note: When the device enters Sleep mode while operating in Bias modes, M0 or M1, be sure that the bias
capacitors are fully discharged in order to get the lowest Sleep current.
PIC18F87J72 FAMILY
DS39979A-page 194 Preliminary 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. Preliminary DS39979A-page 195
PIC18F87J72 FAMILY
18.0 MASTER SYNCHRONOUS
SERIAL PORT (MSSP)
MODULE
18.1 Master SSP (MSSP) Module
Overview
The Master Synchronous Serial Port (MSSP) module is
a serial interface, useful for communicating with other
peripheral or microcontroller devices. These peripheral
devices may be serial EEPROMs, shift registers,
display drivers, A/D Converters, etc. The MSSP
module can operate in one of two modes:
Serial Peripheral Interface (SPI)
Inter-Integrated Circuit (I2C™)
- Full Master mode
- Slave mode (with general address call)
The I2C interface supports the following modes in
hardware:
•Master mode
Multi-Master mode
Slave mode
18.2 Control Registers
Each MSSP module has three associated control
registers. These include a status register (SSPSTAT)
and two control registers (SSPCON1 and SSPCON2).
The use of these registers and their individual bits differ
significantly depending on whether the MSSP module
is operated in SPI or I2C mode.
Additional details are provided under the individual
sections.
18.3 SPI Mode
The SPI mode allows 8 bits of data to be synchronously
transmitted and received simultaneously. All four
modes of SPI are supported. To accomplish
communication, typically three pins are used:
Serial Data Out (SDO) – RC5/SDO/SEG12
Serial Data In (SDI) – RC4/SDI/SDA/SEG16
Serial Clock (SCK) – RC3/SCK/SCL/SEG17
Additionally, a fourth pin may be used when in a Slave
mode of operation:
Slave Select (SS) – RF7/AN5/SS/SEG25
Figure 18-1 shows the block diagram of the MSSP
module when operating in SPI mode.
FIGURE 18-1: MSSP BLOCK DIAGRAM
(SPI MODE)
( )
Read Write
Internal
Data Bus
SSPSR reg
SSPM<3:0>
bit 0 Shift
Clock
SS Control
Enable
Edge
Select
Clock Select
TMR2 Output
TOSC
Prescaler
4, 16, 64
2
Edge
Select
2
4
Data to TXx/RXx in SSPSR
TRIS bit
2
SMP:CKE
SDO
SSPBUF reg
SDI
SS
SCK
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DS39979A-page 196 Preliminary 2010 Microchip Technology Inc.
18.3.1 REGISTERS
Each MSSP module has four registers for SPI mode
operation. These are:
MSSP Control Register 1 (SSPCON1)
MSSP Status Register (SSPSTAT)
Serial Receive/Transmit Buffer Register (SSPBUF)
MSSP Shift Register (SSPSR) – Not directly
accessible
SSPCON1 and SSPSTAT are the control and status
registers in SPI mode operation. The SSPCON1
register is readable and writable. The lower 6 bits of
the SSPSTAT are read-only. The upper two bits of the
SSPSTAT are read/write.
SSPSR is the shift register used for shifting data in or
out. SSPBUF is the buffer register to which data bytes
are written to or read from.
In receive operations, SSPSR and SSPBUF together,
create a double-buffered receiver. When SSPSR
receives a complete byte, it is transferred to SSPBUF
and the SSPIF interrupt is set.
During transmission, the SSPBUF is not
double-buffered. A write to SSPBUF will write to both
SSPBUF and SSPSR.
REGISTER 18-1: SSPSTAT: MSSP STATUS REGISTER (SPI MODE)
R/W-0 R/W-0 R-0 R-0 R-0 R-0 R0 R-0
SMP CKE(1) D/A PSR/WUA BF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 SMP: Sample bit
SPI Master mode:
1 = Input data sampled at end of data output time
0 = Input data sampled at middle of data output time
SPI Slave mode:
SMP must be cleared when SPI is used in Slave mode.
bit 6 CKE: SPI Clock Select bit(1)
1 = Transmit occurs on transition from active to Idle clock state
0 = Transmit occurs on transition from Idle to active clock state
bit 5 D/A: Data/Address bit
Used in I2C™ mode only.
bit 4 P: Stop bit
Used in I2C mode only. This bit is cleared when the MSSP module is disabled, SSPEN is cleared.
bit 3 S: Start bit
Used in I2C mode only.
bit 2 R/W: Read/Write Information bit
Used in I2C mode only.
bit 1 UA: Update Address bit
Used in I2C mode only.
bit 0 BF: Buffer Full Status bit (Receive mode only)
1 = Receive complete, SSPBUF is full
0 = Receive not complete, SSPBUF is empty
Note 1: Polarity of clock state is set by the CKP bit (SSPCON1<4>).
2010 Microchip Technology Inc. Preliminary DS39979A-page 197
PIC18F87J72 FAMILY
REGISTER 18-2: SSPCON1: MSSP CONTROL REGISTER 1 (SPI MODE)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
WCOL SSPOV(1) SSPEN(2) CKP SSPM3(3) SSPM2(3) SSPM1(3) SSPM0(3)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 WCOL: Write Collision Detect bit (Transmit mode only)
1 = The SSPBUF register is written while it is still transmitting the previous word (must be cleared in
software)
0 = No collision
bit 6 SSPOV: Receive Overflow Indicator bit(1)
SPI Slave mode:
1 = A new byte is received while the SSPBUF register is still holding the previous data. In case of over-
flow, the data in SSPSR is lost. Overflow can only occur in Slave mode. The user must read the
SSPBUF, even if only transmitting data, to avoid setting overflow (must be cleared in software).
0 = No overflow
bit 5 SSPEN: Master Synchronous Serial Port Enable bit(2)
1 = Enables serial port and configures SCK, SDO, SDI and SS as serial port pins
0 = Disables serial port and configures these pins as I/O port pins
bit 4 CKP: Clock Polarity Select bit
1 = Idle state for clock is a high level
0 = Idle state for clock is a low level
bit 3-0 SSPM<3:0>: Master Synchronous Serial Port Mode Select bits(3)
0101 = SPI Slave mode, clock = SCK pin, SS pin control disabled, SS can be used as an I/O pin
0100 = SPI Slave mode, clock = SCK pin, SS pin control enabled
0011 = SPI Master mode, clock = TMR2 output/2
0010 = SPI Master mode, clock = FOSC/64
0001 = SPI Master mode, clock = FOSC/16
0000 = SPI Master mode, clock = FOSC/4
Note 1: In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by
writing to the SSPBUF register.
2: When enabled, these pins must be properly configured as input or output.
3: Bit combinations not specifically listed here are either reserved or implemented in I2C™ mode only.
PIC18F87J72 FAMILY
DS39979A-page 198 Preliminary 2010 Microchip Technology Inc.
18.3.2 OPERATION
When initializing the SPI, several options need to be
specified. This is done by programming the appropriate
control bits (SSPCON1<5:0> and SSPSTAT<7:6>).
These control bits allow the following to be specified:
Master mode (SCK is the clock output)
Slave mode (SCK is the clock input)
Clock Polarity (Idle state of SCK)
Data Input Sample Phase (middle or end of data
output time)
Clock Edge (output data on rising/falling edge of
SCK)
Clock Rate (Master mode only)
Slave Select mode (Slave mode only)
Each MSSP consists of a transmit/receive shift register
(SSPSR) and a buffer register (SSPBUF). The SSPSR
shifts the data in and out of the device, MSb first. The
SSPBUF holds the data that was written to the SSPSR
until the received data is ready. Once the 8 bits of data
have been received, that byte is moved to the SSPBUF
register. Then, the Buffer Full detect bit, BF
(SSPSTAT<0>), and the interrupt flag bit, SSPIF, are
set. This double-buffering of the received data
(SSPBUF) allows the next byte to start reception before
reading the data that was just received. Any write to the
SSPBUF register during transmission/reception of data
will be ignored and the Write Collision detect bit, WCOL
(SSPCON1<7>), will be set. User software must clear
the WCOL bit so that it can be determined if the follow-
ing write(s) to the SSPBUF register completed
successfully.
When the application software is expecting to receive
valid data, the SSPBUF should be read before the next
byte of data to transfer is written to the SSPBUF. The
Buffer Full bit, BF (SSPSTAT<0>), indicates when
SSPBUF has been loaded with the received data (trans-
mission is complete). When the SSPBUF is read, the BF
bit is cleared. This data may be irrelevant if the SPI is
only a transmitter. Generally, the MSSP interrupt is used
to determine when the transmission/reception has com-
pleted. The SSPBUF must be read and/or written. If the
interrupt method is not going to be used, then software
polling can be done to ensure that a write collision does
not occur. Example 18-1 shows the loading of the
SSPBUF (SSPSR) for data transmission.
The SSPSR is not directly readable or writable and can
only be accessed by addressing the SSPBUF register.
Additionally, the SSPSTAT register indicates the
various status conditions.
EXAMPLE 18-1: LOADING THE SSPBUF (SSPSR) REGISTER
Note: To prevent lost data in Master mode, read
SSPBUF after each transmission to clear
the BF bit.
LOOP BTFSS SSPSTAT, BF ;Has data been received (transmit complete)?
BRA LOOP ;No
MOVF SSPBUF, W ;WREG reg = contents of SSPBUF
MOVWF RXDATA ;Save in user RAM, if data is meaningful
MOVF TXDATA, W ;W reg = contents of TXDATA
MOVWF SSPBUF ;New data to xmit
2010 Microchip Technology Inc. Preliminary DS39979A-page 199
PIC18F87J72 FAMILY
18.3.3 ENABLING SPI I/O
To enable the serial port, MSSP Enable bit, SSPEN
(SSPCON1<5>), must be set. To reset or reconfigure
SPI mode, clear the SSPEN bit, reinitialize the
SSPCON registers and then set the SSPEN bit. This
configures the SDI, SDO, SCK and SS pins as serial
port pins. For the pins to behave as the serial port func-
tion, some must have their data direction bits (in the
TRIS register) appropriately programmed as follows:
SDI is automatically controlled by the SPI module
SDO must have TRISC<5> bit cleared
SCK (Master mode) must have TRISC<3> bit
cleared
SCK (Slave mode) must have TRISC<3> bit set
•SS
must have TRISF<7> bit set
Any serial port function that is not desired may be
overridden by programming the corresponding data
direction (TRIS) register to the opposite value.
18.3.4 OPEN-DRAIN OUTPUT OPTION
The drivers for the SDO output and SCK clock pins can
be optionally configured as open-drain outputs. This
feature allows the voltage level on the pin to be pulled
to a higher level through an external pull-up resistor,
and allows the output to communicate with external
circuits without the need for additional level shifters.
The open-drain output option is controlled by the
SPIOD bit (TRISG<7>). Setting the bit configures both
pins for open-drain operation.
18.3.5 TYPICAL CONNECTION
Figure 18-2 shows a typical connection between two
microcontrollers. The master controller (Processor 1)
initiates the data transfer by sending the SCK signal.
Data is shifted out of both shift registers on their pro-
grammed clock edge and latched on the opposite edge
of the clock. Both processors should be programmed to
the same Clock Polarity (CKP), then both controllers
would send and receive data at the same time.
Whether the data is meaningful (or dummy data)
depends on the application software. This leads to
three scenarios for data transmission:
Master sends dataSlave sends dummy data
Master sends dataSlave sends data
Master sends dummy dataSlave sends data
FIGURE 18-2: SPI MASTER/SLAVE CONNECTION
Serial Input Buffer
(SSPBUF)
Shift Register
(SSPSR)
MSb LSb
SDO
SDI
PROCESSOR 1
SCK
SPI Master SSPM<3:0> = 00xx
Serial Input Buffer
(SSPBUF)
Shift Register
(SSPSR)
LSb
MSb
SDI
SDO
PROCESSOR 2
SCK
SPI Slave SSPM<3:0> = 010x
Serial Clock
PIC18F87J72 FAMILY
DS39979A-page 200 Preliminary 2010 Microchip Technology Inc.
18.3.6 MASTER MODE
The master can initiate the data transfer at any time
because it controls the SCK. The master determines
when the slave (Processor 2, Figure 18-2) will
broadcast data by the software protocol.
In Master mode, the data is transmitted/received as
soon as the SSPBUF register is written to. If the SPI is
only going to receive, the SDO output could be dis-
abled (programmed as an input). The SSPSR register
will continue to shift in the signal present on the SDI pin
at the programmed clock rate. As each byte is
received, it will be loaded into the SSPBUF register as
if a normal received byte (interrupts and status bits
appropriately set). This could be useful in receiver
applications as a “Line Activity Monitor” mode.
The clock polarity is selected by appropriately
programming the CKP bit (SSPCON1<4>). This, then,
would give waveforms for SPI communication as
shown in Figure 18-3, Figure 18-5 and Figure 18-6,
where the MSB is transmitted first. In Master mode, the
SPI clock rate (bit rate) is user-programmable to be one
of the following:
•F
OSC/4 (or TCY)
•FOSC/16 (or 4 • TCY)
•F
OSC/64 (or 16 • TCY)
Timer2 output/2
This allows a maximum data rate (at 40 MHz) of
10.00 Mbps.
Figure 18-3 shows the waveforms for Master mode.
When the CKE bit is set, the SDO data is valid before
there is a clock edge on SCK. The change of the input
sample is shown based on the state of the SMP bit. The
time when the SSPBUF is loaded with the received
data is shown.
FIGURE 18-3: SPI MODE WAVEFORM (MASTER MODE)
SCK
(CKP = 0
SCK
(CKP = 1
SCK
(CKP = 0
SCK
(CKP = 1
4 Clock
Modes
Input
Sample
Input
Sample
SDI
bit 7 bit 0
SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
bit 7
SDI
SSPIF
(SMP = 1)
(SMP = 0)
(SMP = 1)
CKE = 1)
CKE = 0)
CKE = 1)
CKE = 0)
(SMP = 0)
Write to
SSPBUF
SSPSR to
SSPBUF
SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
(CKE = 0)
(CKE = 1)
Next Q4 Cycle
after Q2
bit 0
2010 Microchip Technology Inc. Preliminary DS39979A-page 201
PIC18F87J72 FAMILY
18.3.7 SLAVE MODE
In Slave mode, the data is transmitted and received as
the external clock pulses appear on SCK. When the
last bit is latched, the SSPIF interrupt flag bit is set.
Before enabling the module in SPI Slave mode, the
clock line must match the proper Idle state. The clock
line can be observed by reading the SCK pin. The Idle
state is determined by the CKP bit (SSPCON1<4>).
While in Slave mode, the external clock is supplied by
the external clock source on the SCK pin. This external
clock must meet the minimum high and low times as
specified in the electrical specifications.
While in Sleep mode, the slave can transmit/receive
data. When a byte is received, the device will wake-up
from Sleep.
18.3.8 SLAVE SELECT
SYNCHRONIZATION
The SS pin allows a Synchronous Slave mode. The SPI
must be in Slave mode with SS pin control enabled
(SSPCON1<3:0> = 04h). When the SS pin is low, trans-
mission and reception are enabled and the SDO pin is
driven. When the SS pin goes high, the SDO pin is no
longer driven, even if in the middle of a transmitted byte
and becomes a floating output. External
pull-up/pull-down resistors may be desirable depending
on the application.
When the SPI module resets, the bit counter is forced
to ‘0. This can be done by either forcing the SS pin to
a high level or clearing the SSPEN bit.
To emulate two-wire communication, the SDO pin can
be connected to the SDI pin. When the SPI needs to
operate as a receiver, the SDO pin can be configured
as an input. This disables transmissions from the SDO.
The SDI can always be left as an input (SDI function)
since it cannot create a bus conflict.
FIGURE 18-4: SLAVE SYNCHRONIZATION WAVEFORM
Note 1: When the SPI is in Slave mode with SS pin
control enabled (SSPCON1<3:0> = 0100),
the SPI module will reset if the SS pin is set
to VDD.
2: If the SPI is used in Slave mode with CKE
set, then the SS pin control must be
enabled.
SCK
(CKP = 1
SCK
(CKP = 0
Input
Sample
SDI
bit 7
SDO bit 7 bit 6 bit 7
SSPIF
Interrupt
(SMP = 0)
CKE = 0)
CKE = 0)
(SMP = 0)
Write to
SSPBUF
SSPSR to
SSPBUF
SS
Flag
bit 0
bit 7
bit 0
Next Q4 Cycle
after Q2
PIC18F87J72 FAMILY
DS39979A-page 202 Preliminary 2010 Microchip Technology Inc.
FIGURE 18-5: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 0)
FIGURE 18-6: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 1)
SCK
(CKP = 1
SCK
(CKP = 0
Input
Sample
SDI
bit 7
SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
SSPIF
Interrupt
(SMP = 0)
CKE = 0)
CKE = 0)
(SMP = 0)
Write to
SSPBUF
SSPSR to
SSPBUF
SS
Flag
Optional
Next Q4 Cycle
after Q2
bit 0
SCK
(CKP = 1
SCK
(CKP = 0
Input
Sample
SDI
bit 7 bit 0
SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
SSPIF
Interrupt
(SMP = 0)
CKE = 1)
CKE = 1)
(SMP = 0)
Write to
SSPBUF
SSPSR to
SSPBUF
SS
Flag
Not Optional
Next Q4 Cycle
after Q2
2010 Microchip Technology Inc. Preliminary DS39979A-page 203
PIC18F87J72 FAMILY
18.3.9 OPERATION IN POWER-MANAGED
MODES
In SPI Master mode, module clocks may be operating
at a different speed than when in Full-Power mode; in
the case of Sleep mode, all clocks are halted.
In Idle modes, a clock is provided to the peripherals.
That clock should be from the primary clock source, the
secondary clock (Timer1 oscillator at 32.768 kHz) or
the INTRC source. See Section 3.3 “Clock Sources
and Oscillator Switching” for additional information.
In most cases, the speed that the master clocks SPI
data is not important; however, this should be
evaluated for each system.
If MSSP interrupts are enabled, they can wake the con-
troller from Sleep mode, or one of the Idle modes, when
the master completes sending data. If an exit from
Sleep or Idle mode is not desired, MSSP interrupts
should be disabled.
If the Sleep mode is selected, all module clocks are
halted and the transmission/reception will remain in
that state until the devices wakes. After the device
returns to Run mode, the module will resume
transmitting and receiving data.
In SPI Slave mode, the SPI Transmit/Receive Shift
register operates asynchronously to the device. This
allows the device to be placed in any power-managed
mode and data to be shifted into the SPI
Transmit/Receive Shift register. When all 8 bits have
been received, the MSSP interrupt flag bit will be set,
and if enabled, will wake the device.
18.3.10 EFFECTS OF A RESET
A Reset disables the MSSP module and terminates the
current transfer.
18.3.11 BUS MODE COMPATIBILITY
Table 18-1 shows the compatibility between the
standard SPI modes and the states of the CKP and
CKE control bits.
There is also an SMP bit which controls when the data
is sampled.
TABLE 18-1: SPI BUS MODES
TABLE 18-2: REGISTERS ASSOCIATED WITH SPI OPERATION
Standard SPI Mode
Terminology
Control Bits State
CKP CKE
0, 0(1) 01
0, 1 0 0
1, 0 1 1
1, 1(1) 10
Note 1: Use one of these modes when using the
SPI to communicate with the AFE. See
Section 22.5 “Using the AFE” for more
information.
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR1 ADIF RC1IF TX1IF SSPIF TMR2IF TMR1IF 52
PIE1 ADIE RC1IE TX1IE SSPIE TMR2IE TMR1IE 52
IPR1 ADIP RC1IP TX1IP SSPIP TMR2IP TMR1IP 52
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 52
TRISF TRISF7 TRISF6 TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 —52
TRISG SPIOD CCP2OD CCP1OD TRISG4 TRISG3 TRISG2 TRISG1 TRISG0 52
SSPBUF MSSP Receive Buffer/Transmit Register 50
SSPCON1 WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 50
SSPSTAT SMP CKE D/A P S R/W UA BF 50
Legend: Shaded cells are not used by the MSSP module in SPI mode.
PIC18F87J72 FAMILY
DS39979A-page 204 Preliminary 2010 Microchip Technology Inc.
18.4 I2C Mode
The MSSP module in I2C mode fully implements all
master and slave functions (including general call
support) and provides interrupts on Start and Stop bits
in hardware to determine a free bus (multi-master
function). The MSSP module implements the standard
mode specifications as well as 7-bit and 10-bit
addressing.
Two pins are used for data transfer:
Serial clock (SCL) – RC3/SCK/SCL/SEG17
Serial data (SDA) – RC4/SDI/SDA/SEG16
The user must configure these pins as inputs by setting
the TRISC<4:3> bits.
FIGURE 18-7: MSSP BLOCK DIAGRAM
(I2C™ MODE)
18.4.1 REGISTERS
The MSSP module has six registers for I2C operation.
These are:
MSSP Control Register 1 (SSPCON1)
MSSP Control Register 2 (SSPCON2)
MSSP Status Register (SSPSTAT)
Serial Receive/Transmit Buffer Register
(SSPBUF)
MSSP Shift Register (SSPSR) – Not directly
accessible
MSSP Address Register (SSPADD)
SSPCON1, SSPCON2 and SSPSTAT are the control
and status registers in I2C mode operation. The
SSPCON1 and SSPCON2 registers are readable and
writable. The lower 6 bits of the SSPSTAT are
read-only. The upper two bits of the SSPSTAT are
read/write.
Many of the bits in SSPCON2 assume different
functions, depending on whether the module is operat-
ing in Master or Slave mode; bits<5:2> also assume
different names in Slave mode. The different aspects of
SSPCON2 are shown in Register 18-5 (for Master
mode) and Register 18-6 (Slave mode).
SSPSR is the shift register used for shifting data in or
out. SSPBUF is the buffer register to which data bytes
are written to or read from.
SSPADD register holds the slave device address when
the MSSP is configured in I2C Slave mode. When the
MSSP is configured in Master mode, the lower seven
bits of SSPADD act as the Baud Rate Generator reload
value.
In receive operations, SSPSR and SSPBUF together,
create a double-buffered receiver. When SSPSR
receives a complete byte, it is transferred to SSPBUF
and the SSPIF interrupt is set.
During transmission, the SSPBUF is not double-
buffered. A write to SSPBUF will write to both SSPBUF
and SSPSR.
Read Write
SSPSR reg
Match Detect
SSPADD reg
Start and
Stop bit Detect
SSPBUF reg
Internal
Data Bus
Addr Match
Set, Reset
S, P bits
(SSPSTAT reg)
Shift
Clock
MSb LSb
SCL
SDA
Address Mask
2010 Microchip Technology Inc. Preliminary DS39979A-page 205
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REGISTER 18-3: SSPSTAT: MSSP STATUS REGISTER (I2C™ MODE)
R/W-0 R/W-0 R-0 R-0 R-0 R-0 R-0 R-0
SMP CKE D/A P(1) S(1) R/W UA BF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 SMP: Slew Rate Control bit
In Master or Slave mode:
1 = Slew rate control disabled for Standard Speed mode (100 kHz and 1 MHz)
0 = Slew rate control enabled for High-Speed mode (400 kHz)
bit 6 CKE: SMBus Select bit
In Master or Slave mode:
1 = Enable SMBus specific inputs
0 = Disable SMBus specific inputs
bit 5 D/A: Data/Address bit
In Master mode:
Reserved.
In Slave mode:
1 = Indicates that the last byte received or transmitted was data
0 = Indicates that the last byte received or transmitted was address
bit 4 P: Stop bit(1)
1 = Indicates that a Stop bit has been detected last
0 = Stop bit was not detected last
bit 3 S: Start bit(1)
1 = Indicates that a Start bit has been detected last
0 = Start bit was not detected last
bit 2 R/W: Read/Write Information bit (I2C™ mode only)
In Slave mode:(2)
1 = Read
0 = Write
In Master mode:(3)
1 = Transmit is in progress
0 = Transmit is not in progress
bit 1 UA: Update Address bit (10-Bit Slave mode only)
1 = Indicates that the user needs to update the address in the SSPADD register
0 = Address does not need to be updated
bit 0 BF: Buffer Full Status bit
In Transmit mode:
1 = SSPBUF is full
0 = SSPBUF is empty
In Receive mode:
1 = SSPBUF is full (does not include the ACK and Stop bits)
0 = SSPBUF is empty (does not include the ACK and Stop bits)
Note 1: This bit is cleared on Reset and when SSPEN is cleared.
2: This bit holds the R/W bit information following the last address match. This bit is only valid from the
address match to the next Start bit, Stop bit or not ACK bit.
3: ORing this bit with SEN, RSEN, PEN, RCEN or ACKEN will indicate if the MSSP is in Active mode.
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DS39979A-page 206 Preliminary 2010 Microchip Technology Inc.
REGISTER 18-4: SSPCON1: MSSP CONTROL REGISTER 1 (I2C™ MODE)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
WCOL SSPOV SSPEN(1) CKP SSPM3 SSPM2 SSPM1 SSPM0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 WCOL: Write Collision Detect bit
In Master Transmit mode:
1 = A write to the SSPBUF register is attempted while the I2C™ conditions are not valid for a
transmission to be started (must be cleared in software)
0 = No collision
In Slave Transmit mode:
1 = The SSPBUF register is written while it was still transmitting the previous word (must be cleared in
software)
0 = No collision
In Receive mode (Master or Slave modes):
This is a “don’t care” bit.
bit 6 SSPOV: Receive Overflow Indicator bit
In Receive mode:
1 = A byte is received while the SSPBUF register is still holding the previous byte (must be cleared in
software)
0 = No overflow
In Transmit mode:
This is a “don’t care” bit in Transmit mode.
bit 5 SSPEN: Master Synchronous Serial Port Enable bit(1)
1 = Enables the serial port and configures the SDA and SCL pins as the serial port pins
0 = Disables serial port and configures these pins as I/O port pins
bit 4 CKP: SCK Release Control bit
In Slave mode:
1 = Releases clock
0 = Holds clock low (clock stretch); used to ensure data setup time
In Master mode:
Unused in this mode.
bit 3-0 SSPM<3:0>: Synchronous Serial Port Mode Select bits
1111 = I2C Slave mode, 10-bit address with Start and Stop bit interrupts enabled
1110 = I2C Slave mode, 7-bit address with Start and Stop bit interrupts enabled
1011 = I2C Firmware Controlled Master mode (slave Idle)
1000 = I2C Master mode, clock = FOSC/(4 * (SSPADD + 1))
0111 = I2C Slave mode, 10-bit address
0110 = I2C Slave mode, 7-bit address
Bit combinations not specifically listed here are either reserved or implemented in SPI mode only.
Note 1: When enabled, the SDA and SCL pins must be configured as inputs.
2010 Microchip Technology Inc. Preliminary DS39979A-page 207
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REGISTER 18-5: SSPCON2: MSSP CONTROL REGISTER 2 (I2C™ MASTER MODE)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
GCEN ACKSTAT ACKDT(1) ACKEN(2) RCEN(2) PEN(2) RSEN(2) SEN(2)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 GCEN: General Call Enable bit
Unused in Master mode.
bit 6 ACKSTAT: Acknowledge Status bit (Master Transmit mode only)
1 = Acknowledge was not received from slave
0 = Acknowledge was received from slave
bit 5 ACKDT: Acknowledge Data bit (Master Receive mode only)(1)
1 = Not Acknowledge
0 = Acknowledge
bit 4 ACKEN: Acknowledge Sequence Enable bit(2)
1 = Initiate Acknowledge sequence on SDA and SCL pins and transmit ACKDT data bit. Automatically
cleared by hardware.
0 = Acknowledge sequence Idle
bit 3 RCEN: Receive Enable bit (Master Receive mode only)(2)
1 = Enables Receive mode for I2C™
0 = Receive Idle
bit 2 PEN: Stop Condition Enable bit(2)
1 = Initiate Stop condition on SDA and SCL pins. Automatically cleared by hardware.
0 = Stop condition Idle
bit 1 RSEN: Repeated Start Condition Enable bit(2)
1 = Initiate Repeated Start condition on SDA and SCL pins. Automatically cleared by hardware.
0 = Repeated Start condition Idle
bit 0 SEN: Start Condition Enable bit(2)
1 = Initiate Start condition on SDA and SCL pins. Automatically cleared by hardware.
0 = Start condition Idle
Note 1: Value that will be transmitted when the user initiates an Acknowledge sequence at the end of a receive.
2: If the I2C module is active, these bits may not be set (no spooling) and the SSPBUF may not be written (or
writes to the SSPBUF are disabled).
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DS39979A-page 208 Preliminary 2010 Microchip Technology Inc.
REGISTER 18-6: SSPCON2: MSSP CONTROL REGISTER 2 (I2C™ SLAVE MODE)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
GCEN ACKSTAT ADMSK5 ADMSK4 ADMSK3 ADMSK2 ADMSK1 SEN(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 GCEN: General Call Enable bit
1 = Enable interrupt when a general call address (0000h) is received in the SSPSR
0 = General call address disabled
bit 6 ACKSTAT: Acknowledge Status bit
Unused in Slave mode.
bit 5-2 ADMSK<5:2>: Slave Address Mask Select bits
1 = Masking of corresponding bits of SSPADD is enabled
0 = Masking of corresponding bits of SSPADD is disabled
bit 1 ADMSK1: Slave Address Least Significant bit(s) Mask Select bit
In 7-Bit Addressing mode:
1 = Masking of SSPADD<1> only is enabled
0 = Masking of SSPADD<1> only is disabled
In 10-Bit Addressing mode:
1 = Masking of SSPADD<1:0> is enabled
0 = Masking of SSPADD<1:0> is disabled
bit 0 SEN: Stretch Enable bit(1)
1 = Clock stretching is enabled for both slave transmit and slave receive (stretch enabled)
0 = Clock stretching is disabled
Note 1: If the I2C™ module is active, this bit may not be set (no spooling) and the SSPBUF may not be written (or
writes to the SSPBUF are disabled).
2010 Microchip Technology Inc. Preliminary DS39979A-page 209
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18.4.2 OPERATION
The MSSP module functions are enabled by setting the
MSSP Enable bit, SSPEN (SSPCON1<5>).
The SSPCON1 register allows control of the I2C
operation. Four mode selection bits (SSPCON1<3:0>)
allow one of the following I2C modes to be selected:
•I
2C Master mode,
clock = (FOSC/4) x (SSPADD + 1)
•I
2C Slave mode (7-bit address)
•I
2C Slave mode (10-bit address)
•I
2C Slave mode (7-bit address) with Start and
Stop bit interrupts enabled
•I
2C Slave mode (10-bit address) with Start and
Stop bit interrupts enabled
•I
2C Firmware Controlled Master mode,
slave is Idle
Selection of any I2C mode, with the SSPEN bit set,
forces the SCL and SDA pins to be open-drain,
provided these pins are programmed to inputs by
setting the appropriate TRISC or TRISD bits. To ensure
proper operation of the module, pull-up resistors must
be provided externally to the SCL and SDA pins.
18.4.3 SLAVE MODE
In Slave mode, the SCL and SDA pins must be
configured as inputs (TRISC<4:3> set). The MSSP
module will override the input state with the output data
when required (slave-transmitter).
The I2C Slave mode hardware will always generate an
interrupt on an exact address match. In addition,
address masking will also allow the hardware to gener-
ate an interrupt for more than one address (up to 31 in
7-bit addressing and up to 63 in 10-bit addressing).
Through the mode select bits, the user can also choose
to interrupt on Start and Stop bits.
When an address is matched, or the data transfer after
an address match is received, the hardware auto-
matically will generate the Acknowledge (ACK) pulse
and load the SSPBUF register with the received value
currently in the SSPSR register.
Any combination of the following conditions will cause
the MSSP module not to give this ACK pulse:
The Buffer Full bit, BF (SSPSTAT<0>), was set
before the transfer was received.
The overflow bit, SSPOV (SSPCON1<6>), was
set before the transfer was received.
In this case, the SSPSR register value is not loaded
into the SSPBUF, but bit, SSPIF, is set. The BF bit is
cleared by reading the SSPBUF register, while bit,
SSPOV, is cleared through software.
The SCL clock input must have a minimum high and
low for proper operation. The high and low times of the
I2C specification, as well as the requirement of the
MSSP module, are shown in timing Parameter 100 and
Parameter 101.
18.4.3.1 Addressing
Once the MSSP module has been enabled, it waits for a
Start condition to occur. Following the Start condition, the
8 bits are shifted into the SSPSR register. All incoming
bits are sampled with the rising edge of the clock (SCL)
line. The value of register, SSPSR<7:1>, is compared to
the value of the SSPADD register. The address is com-
pared on the falling edge of the eighth clock (SCL) pulse.
If the addresses match and the BF and SSPOV bits are
clear, the following events occur:
1. The SSPSR register value is loaded into the
SSPBUF register.
2. The Buffer Full bit, BF, is set.
3. An ACK pulse is generated.
4. The MSSP Interrupt Flag bit, SSPIF, is set (and
interrupt is generated, if enabled) on the falling
edge of the ninth SCL pulse.
In 10-Bit Addressing mode, two address bytes need to
be received by the slave. The five Most Significant bits
(MSbs) of the first address byte specify if this is a 10-bit
address. Bit, R/W (SSPSTAT<2>), must specify a write
so the slave device will receive the second address
byte. For a 10-bit address, the first byte would equal
11110 A9 A8 0’, where ‘A9’ and ‘A8’ are the two
MSbs of the address. The sequence of events for 10-bit
addressing is as follows, with steps 7 through 9 for the
slave-transmitter:
1. Receive first (high) byte of address (SSPIF, BF
and UA bits (SSPSTAT<1>) are set).
2. Update the SSPADD register with second (low)
byte of address (clears UA bit and releases the
SCL line).
3. Read the SSPBUF register (clears BF bit) and
clear flag bit, SSPIF.
4. Receive second (low) byte of address (SSPIF,
BF and UA bits are set).
5. Update the SSPADD register with the first (high)
byte of address. If match releases SCL line, this
will clear UA bit.
6. Read the SSPBUF register (clears BF bit) and
clear flag bit, SSPIF.
7. Receive Repeated Start condition.
8. Receive first (high) byte of address (SSPIF and
BF bits are set).
9. Read the SSPBUF register (clears BF bit) and
clear flag bit, SSPIF.
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DS39979A-page 210 Preliminary 2010 Microchip Technology Inc.
18.4.3.2 Address Masking
Masking an address bit causes that bit to become a
“don’t care”. When one address bit is masked, two
addresses will be Acknowledged and cause an
interrupt. It is possible to mask more than one address
bit at a time, which makes it possible to Acknowledge
up to 31 addresses in 7-bit mode and up to
63 addresses in 10-bit mode (see Example 18-2).
The I2C Slave behaves the same way whether address
masking is used or not. However, when address
masking is used, the I2C slave can Acknowledge
multiple addresses and cause interrupts. When this
occurs, it is necessary to determine which address
caused the interrupt by checking SSPBUF.
In 7-Bit Addressing mode, Address Mask bits,
ADMSK<5:1> (SSPCON<5:1>), mask the correspond-
ing address bits in the SSPADD register. For any ADMSK
bits that are set (ADMSK<x> = 1), the corresponding
address bit is ignored (SSPADD<x> = x). For the module
to issue an address Acknowledge, it is sufficient to match
only on addresses that do not have an active address
mask.
In 10-Bit Addressing mode, ADMSK<5:2> bits mask
the corresponding address bits in the SSPADD regis-
ter. In addition, ADMSK1 simultaneously masks the two
LSbs of the address (SSPADD<1:0>). For any ADMSK
bits that are active (ADMSK<x> = 1), the correspond-
ing address bit is ignored (SSPADD<x> = x). Also note,
that although in 10-Bit Addressing mode, the upper
address bits reuse part of the SSPADD register bits; the
address mask bits do not interact with those bits. They
only affect the lower address bits.
EXAMPLE 18-2: ADDRESS MASKING EXAMPLES
Note 1: ADMSK1 masks the two Least Significant
bits of the address.
2: The two Most Significant bits of the
address are not affected by address
masking.
7-Bit Addressing:
SSPADD<7:1> = A0h (1010000) (SSPADD<0> is assumed to be ‘0’)
ADMSK<5:1> = 00111
Addresses Acknowledged: A0h, A2h, A4h, A6h, A8h, AAh, ACh, AEh
10-Bit Addressing:
SSPADD<7:0> = A0h (10100000) (the two MSbs of the address are ignored in this example, since they are
not affected by masking)
ADMSK<5:1> = 00111
Addresses Acknowledged: A0h, A1h, A2h, A3h, A4h, A5h, A6h, A7h, A8h, A9h, AAh, ABh, ACh, ADh, AEh, AFh
2010 Microchip Technology Inc. Preliminary DS39979A-page 211
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18.4.3.3 Reception
When the R/W bit of the address byte is clear and an
address match occurs, the R/W bit of the SSPSTAT
register is cleared. The received address is loaded into
the SSPBUF register and the SDA line is held low
(ACK).
When the address byte overflow condition exists, then
the no Acknowledge (ACK) pulse is given. An overflow
condition is defined as either bit, BF (SSPSTAT<0>), is
set or bit, SSPOV (SSPCON1<6>), is set.
An MSSP interrupt is generated for each data transfer
byte. The interrupt flag bit, SSPIF, must be cleared in
software. The SSPSTAT register is used to determine
the status of the byte.
If SEN is enabled (SSPCON2<0> = 1), SCK/SCL will
be held low (clock stretch) following each data
transfer. The clock must be released by setting bit,
CKP (SSPCON1<4>). See Section 18.4.4 “Clock
Stretching” for more details.
18.4.3.4 Transmission
When the R/W bit of the incoming address byte is set
and an address match occurs, the R/W bit of the
SSPSTAT register is set. The received address is
loaded into the SSPBUF register. The ACK pulse will
be sent on the ninth bit and pin, RC3, is held low,
regardless of SEN (see Section 18.4.4 “Clock
Stretching” for more details). By stretching the clock,
the master will be unable to assert another clock pulse
until the slave is done preparing the transmit data. The
transmit data must be loaded into the SSPBUF register
which also loads the SSPSR register. Then, the RC3
pin should be enabled by setting bit, CKP
(SSPCON1<4>). The eight data bits are shifted out on
the falling edge of the SCL input. This ensures that the
SDA signal is valid during the SCL high time
(Figure 18-10).
The ACK pulse from the master-receiver is latched on
the rising edge of the ninth SCL input pulse. If the SDA
line is high (not ACK), then the data transfer is
complete. In this case, when the ACK is latched by the
slave, the slave logic is reset and the slave monitors for
another occurrence of the Start bit. If the SDA line was
low (ACK), the next transmit data must be loaded into
the SSPBUF register. Again, pin, RC3, must be
enabled by setting bit, CKP.
An MSSP interrupt is generated for each data transfer
byte. The SSPIF bit must be cleared in software and
the SSPSTAT register is used to determine the status
of the byte. The SSPIF bit is set on the falling edge of
the ninth clock pulse.
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DS39979A-page 212 Preliminary 2010 Microchip Technology Inc.
FIGURE 18-8: I2C™ SLAVE MODE TIMING WITH SEN = 0 (RECEPTION, 7-BIT ADDRESSING)
SDA
SCL
SSPIF (PIR1<3>)
BF (SSPSTAT<0>)
SSPOV (SSPCON1<6>)
S1234567891234567891 2345 789 P
A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D1 D0
ACK
Receiving Data
ACK
Receiving Data
R/W = 0
ACK
Receiving Address
Cleared in software
SSPBUF is read
Bus master
terminates
transfer
SSPOV is set
because SSPBUF is
still full. ACK is not sent.
D2
6
CKP
(CKP does not reset to ‘0’ when SEN = 0)
2010 Microchip Technology Inc. Preliminary DS39979A-page 213
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FIGURE 18-9: I2C™ SLAVE MODE TIMING WITH SEN = 0 AND ADMSK<5:1> = 01011
(RECEPTION, 7-BIT ADDRESSING)
SDA
SCL
SSPIF (PIR1<3>)
BF (SSPSTAT<0>)
SSPOV (SSPCON1<6>)
S1 234567 89 12 34567 891 2345 7 89 P
A7 A6 A5 X A3 X X D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D1 D0
ACK
Receiving Data
ACK
Receiving Data
R/W = 0
ACK
Receiving Address
Cleared in software
SSPBUF is read
Bus master
terminates
transfer
SSPOV is set
because SSPBUF is
still full. ACK is not sent.
D2
6
CKP
(CKP does not reset to ‘0’ when SEN = 0)
Note 1: x = Don’t care (i.e., address bit can be either a ‘1’ or a ‘0’).
2: In this example, an address equal to A7.A6.A5.X.A3.X.X will be Acknowledged and cause an interrupt.
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DS39979A-page 214 Preliminary 2010 Microchip Technology Inc.
FIGURE 18-10: I2C™ SLAVE MODE TIMING (TRANSMISSION, 7-BIT ADDRESSING)
SDA
SCL
BF (SSPxSTAT<0>)
A6 A5 A4 A3 A2 A1 D6 D5 D4 D3 D2 D1 D0
1 2 3 4 5 6 7 8 2 3 4 5 6 7 8 9
SSPBUF is written in software
Cleared in software
Data in
sampled
S
ACK
Transmitting Data
R/W = 1
ACK
Receiving Address
A7 D7
9 1
D6 D5 D4 D3 D2 D1 D0
2 3 4 5 6 7 8 9
SSPBUF is written in software
Cleared in software
From SSPIF ISR
Transmitting Data
D7
1
CKP
(SSPxCON1<4>)
P
ACK
CKP is set in software CKP is set in software
SCL held low
while CPU
responds to SSPIF
SSPIF (PIR1<3> or PIR3<7>)
From SSPIF ISR
Clear by reading
2010 Microchip Technology Inc. Preliminary DS39979A-page 215
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FIGURE 18-11: I2C™ SLAVE MODE TIMING WITH SEN = 0 (RECEPTION, 10-BIT ADDRESSING)
SDA
SCL
SSPIF (PIR1<3>)
BF (SSPSTAT<0>)
S123456789 123456789 12345 789 P
1 1 1 1 0 A9A8 A7 A6A5A4A3A2A1A0 D7 D6D5D4D3 D1D0
Receive Data Byte
ACK
R/W = 0
ACK
Receive First Byte of Address
Cleared in software
D2
6
Cleared in software
Receive Second Byte of Address
Cleared by hardware
when SSPADD is updated
with low byte of address
UA (SSPSTAT<1>)
Clock is held low until
update of SSPADD has
taken place
UA is set indicating that
the SSPADD needs to be
updated
UA is set indicating that
SSPADD needs to be
updated
Cleared by hardware when
SSPADD is updated with high
byte of address
SSPBUF is written with
contents of SSPSR
Dummy read of SSPBUF
to clear BF flag
ACK
CKP
12345 789
D7 D6 D5 D4 D3 D1 D0
Receive Data Byte
Bus master
terminates
transfer
D2
6
ACK
Cleared in software Cleared in software
SSPOV (SSPCON1<6>)
SSPOV is set
because SSPBUF is
still full. ACK is not sent.
(CKP does not reset to ‘0’ when SEN = 0)
Clock is held low until
update of SSPADD has
taken place
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DS39979A-page 216 Preliminary 2010 Microchip Technology Inc.
FIGURE 18-12: I2C™ SLAVE MODE TIMING WITH SEN = 0 AND ADMSK<5:1> = 01001
(RECEPTION, 10-BIT ADDRESSING)
SDA
SCL
SSPIF (PIR1<3>)
BF (SSPSTAT<0>)
S123456789 123456789 12345 789 P
1 1 1 1 0 A9 A8 A7 A6 A5 X A3 A2 X X D7 D6 D5 D4 D3 D1 D0
Receive Data Byte
ACK
R/W = 0
ACK
Receive First Byte of Address
Cleared in software
D2
6
Cleared in software
Receive Second Byte of Address
Cleared by hardware
when SSPADD is updated
with low byte of address
UA (SSPSTAT<1>)
Clock is held low until
update of SSPADD has
taken place
UA is set indicating that
the SSPADD needs to be
updated
UA is set indicating that
SSPADD needs to be
updated
Cleared by hardware when
SSPADD is updated with high
byte of address
SSPBUF is written with
contents of SSPSR
Dummy read of SSPBUF
to clear BF flag
ACK
CKP
12345 789
D7 D6 D5 D4 D3 D1 D0
Receive Data Byte
Bus master
terminates
transfer
D2
6
ACK
Cleared in software Cleared in software
SSPOV (SSPCON1<6>)
SSPOV is set
because SSPBUF is
still full. ACK is not sent.
(CKP does not reset to ‘0 when SEN = 0)
Clock is held low until
update of SSPADD has
taken place
Note 1: x = Don’t care (i.e., address bit can be either a ‘1 or a ‘0’).
2: In this example, an address equal to A9.A8.A7.A6.A5.X.A3.A2.X.X will be Acknowledged and cause an interrupt.
3: Note that the Most Significant bits of the address are not affected by the bit masking.
2010 Microchip Technology Inc. Preliminary DS39979A-page 217
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FIGURE 18-13: I2C™ SLAVE MODE TIMING (TRANSMISSION, 10-BIT ADDRESSING)
SDA
SCL
SSPIF (PIR1<3>)
BF (SSPSTAT<0>)
S12345 6789 123456789 12345 789 P
1 1 1 1 0 A9A8 A7 A6A5A4A3A2A1A0 11110 A8
R/W = 1
ACK
ACK
R/W = 0
ACK
Receive First Byte of Address
Cleared in software
Bus master
terminates
transfer
A9
6
Receive Second Byte of Address
Cleared by hardware when
SSPADD is updated with low
byte of address
UA (SSPSTAT<1>)
Clock is held low until
update of SSPADD has
taken place
UA is set indicating that
the SSPADD needs to be
updated
UA is set indicating that
SSPADD needs to be
updated
Cleared by hardware when
SSPADD is updated with high
byte of address.
SSPBUF is written with
contents of SSPSR
Dummy read of SSPBUF
to clear BF flag
Receive First Byte of Address
12345 789
D7 D6 D5 D4 D3 D1
ACK
D2
6
Transmitting Data Byte
D0
Dummy read of SSPBUF
to clear BF flag
Sr
Cleared in software
Write of SSPBUF
initiates transmit
Cleared in software
Completion of
clears BF flag
CKP (SSPCON1<4>)
CKP is set in software
CKP is automatically cleared in hardware, holding SCL low
Clock is held low until
update of SSPADD has
taken place
data transmission
Clock is held low until
CKP is set to ‘1
third address sequence
BF flag is clear
at the end of the
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18.4.4 CLOCK STRETCHING
Both 7-Bit and 10-Bit Slave modes implement
automatic clock stretching during a transmit sequence.
The SEN bit (SSPCON2<0>) allows clock stretching to
be enabled during receives. Setting SEN will cause
the SCL pin to be held low at the end of each data
receive sequence.
18.4.4.1 Clock Stretching for 7-Bit Slave
Receive Mode (SEN = 1)
In 7-Bit Slave Receive mode, on the falling edge of the
ninth clock at the end of the ACK sequence, if the BF
bit is set, the CKP bit in the SSPCON1 register is
automatically cleared, forcing the SCL output to be
held low. The CKP being cleared to ‘0’ will assert the
SCL line low. The CKP bit must be set in the user’s
ISR before reception is allowed to continue. By holding
the SCL line low, the user has time to service the ISR
and read the contents of the SSPBUF before the
master device can initiate another receive sequence.
This will prevent buffer overruns from occurring (see
Figure 18-15).
18.4.4.2 Clock Stretching for 10-Bit Slave
Receive Mode (SEN = 1)
In 10-Bit Slave Receive mode, during the address
sequence, clock stretching automatically takes place
but CKP is not cleared. During this time, if the UA bit is
set after the ninth clock, clock stretching is initiated.
The UA bit is set after receiving the upper byte of the
10-bit address and following the receive of the second
byte of the 10-bit address with the R/W bit cleared to
0’. The release of the clock line occurs upon updating
SSPADD. Clock stretching will occur on each data
receive sequence as described in 7-bit mode.
18.4.4.3 Clock Stretching for 7-Bit Slave
Transmit Mode
The 7-Bit Slave Transmit mode implements clock
stretching by clearing the CKP bit after the falling edge
of the ninth clock if the BF bit is clear. This occurs
regardless of the state of the SEN bit.
The user’s ISR must set the CKP bit before transmis-
sion is allowed to continue. By holding the SCL line
low, the user has time to service the ISR and load the
contents of the SSPBUF before the master device can
initiate another transmit sequence (see Figure 18-10).
18.4.4.4 Clock Stretching for 10-Bit Slave
Transmit Mode
In 10-Bit Slave Transmit mode, clock stretching is con-
trolled during the first two address sequences by the
state of the UA bit, just as it is in 10-Bit Slave Receive
mode. The first two addresses are followed by a third
address sequence which contains the high-order bits
of the 10-bit address and the R/W bit set to ‘1’. After
the third address sequence is performed, the UA bit is
not set, the module is now configured in Transmit
mode and clock stretching is controlled by the BF flag
as in 7-Bit Slave Transmit mode (see Figure 18-13).
Note 1: If the user reads the contents of the
SSPBUF before the falling edge of the
ninth clock, thus clearing the BF bit, the
CKP bit will not be cleared and clock
stretching will not occur.
2: The CKP bit can be set in software
regardless of the state of the BF bit. The
user should be careful to clear the BF bit
in the ISR before the next receive
sequence in order to prevent an overflow
condition.
Note: If the user polls the UA bit and clears it by
updating the SSPADD register before the
falling edge of the ninth clock occurs and if
the user hasn’t cleared the BF bit by read-
ing the SSPBUF register before that time,
then the CKP bit will still NOT be asserted
low. Clock stretching on the basis of the
state of the BF bit only occurs during a
data sequence, not an address sequence.
Note 1: If the user loads the contents of SSPBUF,
setting the BF bit before the falling edge of
the ninth clock, the CKP bit will not be
cleared and clock stretching will not occur.
2: The CKP bit can be set in software
regardless of the state of the BF bit.
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18.4.4.5 Clock Synchronization and
the CKP bit
When the CKP bit is cleared, the SCL output is forced
to ‘0’. However, clearing the CKP bit will not assert the
SCL output low until the SCL output is already
sampled low. Therefore, the CKP bit will not assert the
SCL line until an external I2C master device has
already asserted the SCL line. The SCL output will
remain low until the CKP bit is set and all other
devices on the I2C bus have deasserted SCL. This
ensures that a write to the CKP bit will not violate the
minimum high time requirement for SCL (see
Figure 18-14).
FIGURE 18-14: CLOCK SYNCHRONIZATION TIMING
SDA
SCL
DX – 1DX
WR
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
SSPCON
CKP
Master device
deasserts clock
Master device
asserts clock
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FIGURE 18-15: I2C™ SLAVE MODE TIMING WITH SEN = 1 (RECEPTION, 7-BIT ADDRESSING)
SDA
SCL
SSPIF (PIR1<3>)
BF (SSPSTAT<0>)
SSPOV (SSPCON1<6>)
S1 234 567 89 1 2345 67 89 1 23 45 7 89 P
A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D1 D0
ACK
Receiving Data
ACK
Receiving Data
R/W = 0
ACK
Receiving Address
Cleared in software
SSPBUF is read
Bus master
terminates
transfer
SSPOV is set
because SSPBUF is
still full. ACK is not sent.
D2
6
CKP
CKP
written
to ‘1’ in
If BF is cleared
prior to the falling
edge of the 9th clock,
CKP will not be reset
to ‘0’ and no clock
stretching will occur
software
Clock is held low until
CKP is set to ‘1
Clock is not held low
because buffer full bit is
clear prior to falling edge
of 9th clock
Clock is not held low
because ACK =
1
BF is set after falling
edge of the 9th clock,
CKP is reset to ‘0’ and
clock stretching occurs
2010 Microchip Technology Inc. Preliminary DS39979A-page 221
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FIGURE 18-16: I2C™ SLAVE MODE TIMING WITH SEN = 1 (RECEPTION, 10-BIT ADDRESSING)
SDA
SCL
SSPIF (PIR1<3>)
BF (SSPSTAT<0>)
S123456789 123456789 12345 789 P
1 1 1 1 0 A9A8 A7 A6A5A4A3A2A1A0 D7D6D5D4D3 D1D0
Receive Data Byte
ACK
R/W = 0
ACK
Receive First Byte of Address
Cleared in software
D2
6
Cleared in software
Receive Second Byte of Address
Cleared by hardware when
SSPADD is updated with low
byte of address after falling edge
UA (SSPSTAT<1>)
Clock is held low until
update of SSPADD has
taken place
UA is set indicating that
the SSPADD needs to be
updated
UA is set indicating that
SSPADD needs to be
updated
Cleared by hardware when
SSPADD is updated with high
byte of address after falling edge
SSPBUF is written with
contents of SSPSR
Dummy read of SSPBUF
to clear BF flag
ACK
CKP
12345 789
D7 D6 D5 D4 D3 D1 D0
Receive Data Byte
Bus master
terminates
transfer
D2
6
ACK
Cleared in software Cleared in software
SSPOV (SSPCON1<6>)
CKP written to
1
Note: An update of the SSPADD register before the
falling edge of the ninth clock will have no effect
on UA and UA will remain set.
Note: An update of the SSPADD
register before the falling
edge of the ninth clock will
have no effect on UA and
UA will remain set.
in software
Clock is held low until
update of SSPADD has
taken place
of ninth clock
of ninth clock
SSPOV is set
because SSPBUF is
still full. ACK is not sent.
Dummy read of SSPBUF
to clear BF flag
Clock is held low until
CKP is set to
1
Clock is not held low
because ACK =
1
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18.4.5 GENERAL CALL ADDRESS
SUPPORT
The addressing procedure for the I2C bus is such that
the first byte after the Start condition usually
determines which device will be the slave addressed by
the master. The exception is the general call address
which can address all devices. When this address is
used, all devices should, in theory, respond with an
Acknowledge.
The general call address is one of eight addresses
reserved for specific purposes by the I2C protocol. It
consists of all ‘0s with R/W = 0.
The general call address is recognized when the
General Call Enable bit, GCEN, is enabled
(SSPCON2<7> set). Following a Start bit detect, 8 bits
are shifted into the SSPSR and the address is
compared against the SSPADD. It is also compared to
the general call address and fixed in hardware.
If the general call address matches, the SSPSR is
transferred to the SSPBUF, the BF flag bit is set (eighth
bit), and on the falling edge of the ninth bit (ACK bit),
the SSPIF interrupt flag bit is set.
When the interrupt is serviced, the source for the
interrupt can be checked by reading the contents of the
SSPBUF. The value can be used to determine if the
address was device-specific or a general call address.
In 10-bit mode, the SSPADD is required to be updated
for the second half of the address to match and the UA
bit is set (SSPSTAT<1>). If the general call address is
sampled when the GCEN bit is set, while the slave is
configured in 10-Bit Addressing mode, then the second
half of the address is not necessary, the UA bit will not
be set and the slave will begin receiving data after the
Acknowledge (Figure 18-17).
FIGURE 18-17: SLAVE MODE GENERAL CALL ADDRESS SEQUENCE
(7 OR 10-BIT ADDRESSING MODE)
SDA
SCL
S
SSPIF
BF (SSPSTAT<0>)
SSPOV (SSPCON1<6>)
Cleared in software
SSPBUF is read
R/W = 0
ACK
General Call Address
Address is compared to General Call Address
GCEN (SSPCON2<7>)
Receiving Data ACK
123456789123456789
D7 D6 D5 D4 D3 D2 D1 D0
after ACK, set interrupt
0
1
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18.4.6 MASTER MODE
Master mode is enabled by setting and clearing the
appropriate SSPM bits in SSPCON1 and by setting the
SSPEN bit. In Master mode, the SCL and SDA lines
are manipulated by the MSSP hardware.
Master mode of operation is supported by interrupt
generation on the detection of the Start and Stop con-
ditions. The Stop (P) and Start (S) bits are cleared from
a Reset or when the MSSP module is disabled. Control
of the I2C bus may be taken when the P bit is set, or the
bus is Idle, with both the S and P bits clear.
In Firmware Controlled Master mode, user code
conducts all I2C bus operations based on Start and
Stop bit conditions.
Once Master mode is enabled, the user has six
options.
1. Assert a Start condition on SDA and SCL.
2. Assert a Repeated Start condition on SDA and
SCL.
3. Write to the SSPBUF register initiating
transmission of data/address.
4. Configure the I2C port to receive data.
5. Generate an Acknowledge condition at the end
of a received byte of data.
6. Generate a Stop condition on SDA and SCL.
The following events will cause the MSSP Interrupt
Flag bit, SSPIF, to be set (and MSSP interrupt, if
enabled):
Start condition
Stop condition
Data transfer byte transmitted/received
Acknowledge transmit
Repeated Start
FIGURE 18-18: MSSP BLOCK DIAGRAM (I2C™ MASTER MODE)
Note: The MSSP module, when configured in
I2C Master mode, does not allow queueing
of events. For instance, the user is not
allowed to initiate a Start condition and
immediately write the SSPBUF register to
initiate transmission before the Start con-
dition is complete. In this case, the
SSPBUF will not be written to and the
WCOL bit will be set, indicating that a write
to the SSPBUF did not occur.
Read Write
SSPSR
Start bit, Stop bit,
SSPBUF
Internal
Data Bus
Set/Reset S, P, WCOL (SSPSTAT, SSPCON1)
Shift
Clock
MSb LSb
SDA
Acknowledge
Generate
Stop bit Detect
Write Collision Detect
Clock Arbitration
State Counter for
End of XMIT/RCV
SCL
SCL In
Bus Collision
SDA In
Receive Enable
Clock Cntl
Clock Arbitrate/WCOL Detect
(hold off clock source)
SSPADD<6:0>
Baud
Set SSPIF, BCLIF
Reset ACKSTAT, PEN (SSPCON2)
Rate
Generator
SSPM<3:0>
Start bit Detect
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18.4.6.1 I2C Master Mode Operation
The master device generates all of the serial clock
pulses and the Start and Stop conditions. A transfer is
ended with a Stop condition or with a Repeated Start
condition. Since the Repeated Start condition is also
the beginning of the next serial transfer, the I2C bus will
not be released.
In Master Transmitter mode, serial data is output
through SDA, while SCL outputs the serial clock. The
first byte transmitted contains the slave address of the
receiving device (7 bits) and the Read/Write (R/W) bit.
In this case, the R/W bit will be logic ‘0’. Serial data is
transmitted, 8 bits at a time. After each byte is transmit-
ted, an Acknowledge bit is received. Start and Stop
conditions are output to indicate the beginning and the
end of a serial transfer.
In Master Receive mode, the first byte transmitted
contains the slave address of the transmitting device
(7 bits) and the R/W bit. In this case, the R/W bit will be
logic ‘1’. Thus, the first byte transmitted is a 7-bit slave
address followed by a ‘1’ to indicate the receive bit.
Serial data is received via SDA, while SCL outputs the
serial clock. Serial data is received 8 bits at a time. After
each byte is received, an Acknowledge bit is transmit-
ted. Start and Stop conditions indicate the beginning
and end of transmission.
The Baud Rate Generator, used for the SPI mode
operation, is used to set the SCL clock frequency for
either 100 kHz, 400 kHz or 1 MHz I2C operation. See
Section 18.4.7 “Baud Rate for more detail.
A typical transmit sequence would go as follows:
1. The user generates a Start condition by setting
the Start Enable bit, SEN (SSPCON2<0>).
2. SSPIF is set. The MSSP module will wait the
required start time before any other operation
takes place.
3. The user loads the SSPBUF with the slave
address to transmit.
4. Address is shifted out the SDA pin until all 8 bits
are transmitted.
5. The MSSP module shifts in the ACK bit from the
slave device and writes its value into the
SSPCON2 register (SSPCON2<6>).
6. The MSSP module generates an interrupt at the
end of the ninth clock cycle by setting the SSPIF
bit.
7. The user loads the SSPBUF with eight bits of
data.
8. Data is shifted out the SDA pin until all 8 bits are
transmitted.
9. The MSSP module shifts in the ACK bit from the
slave device and writes its value into the
SSPCON2 register (SSPCON2<6>).
10. The MSSP module generates an interrupt at the
end of the ninth clock cycle by setting the SSPIF
bit.
11. The user generates a Stop condition by setting
the Stop Enable bit, PEN (SSPCON2<2>).
12. Interrupt is generated once the Stop condition is
complete.
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18.4.7 BAUD RATE
In I2C Master mode, the Baud Rate Generator (BRG)
reload value is placed in the lower 7 bits of the
SSPADD register (Figure 18-19). When a write occurs
to SSPBUF, the Baud Rate Generator will automatically
begin counting. The BRG counts down to 0 and stops
until another reload has taken place. The BRG count is
decremented twice per instruction cycle (T
CY) on the
Q2 and Q4 clocks. In I2C Master mode, the BRG is
reloaded automatically.
Once the given operation is complete (i.e., transmis-
sion of the last data bit is followed by ACK), the internal
clock will automatically stop counting and the SCL pin
will remain in its last state.
Table 18-3 demonstrates clock rates based on
instruction cycles and the BRG value loaded into
SSPADD.
18.4.7.1 Baud Rate Generation in
Power-Managed Modes
When the device is operating in one of the
power-managed modes, the clock source to the BRG
may change frequency or even stop, depending on the
mode and clock source selected. Switching to a Run or
Idle mode from either the secondary clock or internal
oscillator is likely to change the clock rate to the BRG.
In Sleep mode, the BRG will not be clocked at all.
FIGURE 18-19: BAUD RATE GENERATOR BLOCK DIAGRAM
TABLE 18-3: I2C™ CLOCK RATE w/BRG
Note: A BRG value of 00h is not supported.
FCY FCY * 2 BRG Value FSCL
(2 Rollovers of BRG)
16 MHz 32 MHz 03h 1 MHz(1)
10 MHz 20 MHz 18h 400 kHz(2)
10 MHz 20 MHz 1Fh 312.5 kHz
10 MHz 20 MHz 63h 100 kHz
4 MHz 8 MHz 09h 400 kHz(2)
4 MHz 8 MHz 0Ch 308 kHz
4 MHz 8 MHz 27h 100 kHz
1 MHz 2 MHz 02h 333 kHz(2)
1 MHz 2 MHz 09h 100 kHz
Note 1: FOSC must be at least 16 MHz for I2C bus operation at this speed.
2: The I2C™ interface does not conform to the 400 kHz I2C specification (which applies to rates greater than
100 kHz) in all details, but may be used with care where higher rates are required by the application.
SSPM<3:0>
BRG Down Counter
CLKO FOSC/4
SSPADD<6:0>
SSPM<3:0>
SCL
Reload
Control
Reload
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18.4.7.2 Clock Arbitration
Clock arbitration occurs when the master, during any
receive, transmit or Repeated Start/Stop condition,
deasserts the SCL pin (SCL allowed to float high).
When the SCL pin is allowed to float high, the Baud
Rate Generator (BRG) is suspended from counting
until the SCL pin is actually sampled high. When the
SCL pin is sampled high, the Baud Rate Generator is
reloaded with the contents of SSPADD<6:0> and
begins counting. This ensures that the SCL high time
will always be at least one BRG rollover count in the
event that the clock is held low by an external device
(Figure 18-20).
FIGURE 18-20: BAUD RATE GENERATOR TIMING WITH CLOCK ARBITRATION
SDA
SCL
SCL deasserted but slave holds
DX – 1DX
BRG
SCL is sampled high, reload takes
place and BRG starts its count
03h 02h 01h 00h (hold off) 03h 02h
Reload
BRG
Value
SCL low (clock arbitration)
SCL allowed to transition high
BRG decrements on
Q2 and Q4 cycles
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18.4.8 I2C MASTER MODE START
CONDITION TIMING
To initiate a Start condition, the user sets the Start
Enable bit, SEN (SSPCON2<0>). If the SDA and SCL
pins are sampled high, the Baud Rate Generator is
reloaded with the contents of SSPADD<6:0> and starts
its count. If SCL and SDA are both sampled high when
the Baud Rate Generator times out (TBRG), the SDA
pin is driven low. The action of the SDA being driven
low while SCL is high is the Start condition and causes
the S bit (SSPSTAT<3>) to be set. Following this, the
Baud Rate Generator is reloaded with the contents of
SSPADD<6:0> and resumes its count. When the Baud
Rate Generator times out (TBRG), the SEN bit
(SSPCON2<0>) will automatically be cleared by
hardware. The Baud Rate Generator is suspended,
leaving the SDA line held low and the Start condition is
complete.
18.4.8.1 WCOL Status Flag
If the user writes the SSPBUF when a Start sequence
is in progress, the WCOL is set and the contents of the
buffer are unchanged (the write doesn’t occur).
FIGURE 18-21: FIRST START BIT TIMING
Note: If, at the beginning of the Start condition,
the SDA and SCL pins are already
sampled low, or if during the Start condi-
tion, the SCL line is sampled low before
the SDA line is driven low, a bus collision
occurs. The Bus Collision Interrupt Flag,
BCLIF, is set, the Start condition is aborted
and the I2C module is reset into its Idle
state.
Note: Because queueing of events is not
allowed, writing to the lower 5 bits of
SSPCON2 is disabled until the Start
condition is complete.
SDA
SCL
S
TBRG
1st bit 2nd bit
TBRG
SDA = 1, At completion of Start bit,
SCL = 1
Write to SSPBUF occurs here
TBRG
hardware clears SEN bit
TBRG
Write to SEN bit occurs here Set S bit (SSPSTAT<3>)
and sets SSPIF bit
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18.4.9 I2C MASTER MODE REPEATED
START CONDITION TIMING
A Repeated Start condition occurs when the RSEN bit
(SSPCON2<1>) is programmed high and the I2C logic
module is in the Idle state. When the RSEN bit is set,
the SCL pin is asserted low. When the SCL pin is
sampled low, the Baud Rate Generator is loaded with
the contents of SSPADD<6:0> and begins counting.
The SDA pin is released (brought high) for one Baud
Rate Generator count (TBRG). When the Baud Rate
Generator times out, if SDA is sampled high, the SCL
pin will be deasserted (brought high). When SCL is
sampled high, the Baud Rate Generator is reloaded
with the contents of SSPADD<6:0> and begins
counting. SDA and SCL must be sampled high for one
TBRG. This action is then followed by assertion of the
SDA pin (SDA = 0) for one TBRG while SCL is high.
Following this, the RSEN bit (SSPCON2<1>) will be
automatically cleared and the Baud Rate Generator will
not be reloaded, leaving the SDA pin held low. As soon
as a Start condition is detected on the SDA and SCL
pins, the S bit (SSPSTAT<3>) will be set. The SSPIF bit
will not be set until the Baud Rate Generator has timed
out.
Immediately following the SSPIF bit getting set, the user
may write the SSPBUF with the 7-bit address in 7-bit
mode or the default first address in 10-bit mode. After the
first eight bits are transmitted and an ACK is received,
the user may then transmit an additional eight bits of
address (10-bit mode) or eight bits of data (7-bit mode).
18.4.9.1 WCOL Status Flag
If the user writes the SSPBUF when a Repeated Start
sequence is in progress, the WCOL is set and the
contents of the buffer are unchanged (the write doesn’t
occur).
FIGURE 18-22: REPEATED START CONDITION WAVEFORM
Note 1: If RSEN is programmed while any other
event is in progress, it will not take effect.
2: A bus collision during the Repeated Start
condition occurs if:
SDA is sampled low when SCL goes
from low-to-high.
SCL goes low before SDA is
asserted low. This may indicate that
another master is attempting to
transmit a data ‘1’.
Note: Because queueing of events is not
allowed, writing of the lower 5 bits of
SSPCON2 is disabled until the Repeated
Start condition is complete.
SDA
SCL
Sr = Repeated Start
Write to SSPCON2
Write to SSPBUF occurs here
on falling edge of ninth clock,
end of XMIT
At completion of Start bit,
hardware clears RSEN bit
1st bit
S bit set by hardware
TBRG
TBRG
SDA = 1,
SDA = 1,
SCL (no change)
SCL = 1
occurs here:
TBRG TBRG
and sets SSPIF
RSEN bit set by hardware
TBRG
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18.4.10 I2C MASTER MODE
TRANSMISSION
Transmission of a data byte, a 7-bit address or the
other half of a 10-bit address, is accomplished by
simply writing a value to the SSPBUF register. This
action will set the Buffer Full bit, BF, and allow the Baud
Rate Generator to begin counting and start the next
transmission. Each bit of address/data will be shifted
out onto the SDA pin after the falling edge of SCL is
asserted (see data hold time specification
Parameter 106). SCL is held low for one Baud Rate
Generator rollover count (TBRG). Data should be valid
before SCL is released high (see data setup time
specification Parameter 107). When the SCL pin is
released high, it is held that way for TBRG. The data on
the SDA pin must remain stable for that duration and
some hold time after the next falling edge of SCL. After
the eighth bit is shifted out (the falling edge of the eighth
clock), the BF flag is cleared and the master releases
SDA. This allows the slave device being addressed to
respond with an ACK bit during the ninth bit time if an
address match occurred, or if data was received prop-
erly. The status of ACK is written into the ACKDT bit on
the falling edge of the ninth clock. If the master receives
an Acknowledge, the Acknowledge Status bit,
ACKSTAT, is cleared; if not, the bit is set. After the ninth
clock, the SSPIF bit is set and the master clock (Baud
Rate Generator) is suspended until the next data byte
is loaded into the SSPBUF, leaving SCL low and SDA
unchanged (Figure 18-23).
After the write to the SSPBUF, each bit of the address
will be shifted out on the falling edge of SCL until all
seven address bits and the R/W bit are completed. On
the falling edge of the eighth clock, the master will
deassert the SDA pin, allowing the slave to respond
with an Acknowledge. On the falling edge of the ninth
clock, the master will sample the SDA pin to see if the
address was recognized by a slave. The status of the
ACK bit is loaded into the ACKSTAT status bit
(SSPCON2<6>). Following the falling edge of the ninth
clock transmission of the address, the SSPIF is set, the
BF flag is cleared and the Baud Rate Generator is
turned off until another write to the SSPBUF takes
place, holding SCL low and allowing SDA to float.
18.4.10.1 BF Status Flag
In Transmit mode, the BF bit (SSPSTAT<0>) is set
when the CPU writes to SSPBUF and is cleared when
all 8 bits are shifted out.
18.4.10.2 WCOL Status Flag
If the user writes to the SSPBUF when a transmit is
already in progress (i.e., SSPSR is still shifting out a
data byte), the WCOL is set and the contents of the buf-
fer are unchanged (the write doesn’t occur) after 2 TCY
after the SSPBUF write. If SSPBUF is rewritten within
2 TCY, the WCOL bit is set and SSPBUF is updated.
This may result in a corrupted transfer.
The user should verify that the WCOL is clear after
each write to SSPBUF to ensure the transfer is correct.
In all cases, WCOL must be cleared in software.
18.4.10.3 ACKSTAT Status Flag
In Transmit mode, the ACKSTAT bit (SSPCON2<6>) is
cleared when the slave has sent an Acknowledge
(ACK =0) and is set when the slave does not Acknowl-
edge (ACK = 1). A slave sends an Acknowledge when
it has recognized its address (including a general call),
or when the slave has properly received its data.
18.4.11 I2C MASTER MODE RECEPTION
Master mode reception is enabled by programming the
Receive Enable bit, RCEN (SSPCON2<3>).
The Baud Rate Generator begins counting and on each
rollover, the state of the SCL pin changes
(high-to-low/low-to-high) and data is shifted into the
SSPSR. After the falling edge of the eighth clock, the
receive enable flag is automatically cleared, the con-
tents of the SSPSR are loaded into the SSPBUF, the
BF flag bit is set, the SSPIF flag bit is set and the Baud
Rate Generator is suspended from counting, holding
SCL low. The MSSP is now in Idle state awaiting the
next command. When the buffer is read by the CPU,
the BF flag bit is automatically cleared. The user can
then send an Acknowledge bit at the end of reception
by setting the Acknowledge Sequence Enable bit,
ACKEN (SSPCON2<4>).
18.4.11.1 BF Status Flag
In receive operation, the BF bit is set when an address
or data byte is loaded into SSPBUF from SSPSR. It is
cleared when the SSPBUF register is read.
18.4.11.2 SSPOV Status Flag
In receive operation, the SSPOV bit is set when 8 bits
are received into the SSPSR and the BF flag bit is
already set from a previous reception.
18.4.11.3 WCOL Status Flag
If the user writes the SSPBUF when a receive is
already in progress (i.e., SSPSR is still shifting in a data
byte), the WCOL bit is set and the contents of the buffer
are unchanged (the write doesn’t occur).
Note: The MSSP module must be in an Idle state
before the RCEN bit is set or the RCEN bit
will be disregarded.
PIC18F87J72 FAMILY
DS39979A-page 230 Preliminary 2010 Microchip Technology Inc.
FIGURE 18-23: I2C™ MASTER MODE WAVEFORM (TRANSMISSION, 7 OR 10-BIT ADDRESSING)
SDA
SCL
SSPIF
BF (SSPSTAT<0>)
SEN
A7 A6 A5 A4 A3 A2 A1 ACK = 0D7 D6 D5 D4 D3 D2 D1 D0
ACK
Transmitting Data or Second Half
R/W = 0Transmit Address to Slave
123456789 123456789 P
Cleared in software service routine
SSPBUF is written in software
from MSSP interrupt
After Start condition, SEN cleared by hardware
S
SSPBUF written with 7-bit address and R/W
start transmit
SCL held low
while CPU
responds to SSPIF
SEN = 0
of 10-bit Address
Write SSPCON2<0> (SEN = 1),
Start condition begins From slave, clear ACKSTAT bit (SSPCON2<6>)
ACKSTAT in
SSPCON2 = 1
Cleared in software
SSPBUF written
PEN
R/W
Cleared in software
2010 Microchip Technology Inc. Preliminary DS39979A-page 231
PIC18F87J72 FAMILY
FIGURE 18-24: I2C™ MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESSING)
P
98765
D0D1D2D3D4D5D6D7
S
A7 A6 A5 A4 A3 A2 A1
SDA
SCL 1 23456 789 12345678 9 12 3 4
Bus master
terminates
transfer
ACK
Receiving Data from Slave
Receiving Data from Slave
D0D1D2D3D4D5D6D7
ACK
R/W = 1
Transmit Address to Slave
SSPIF
BF
ACK is not sent
Write to SSPCON2<0> (SEN = 1),
Write to SSPBUF occurs here, ACK from Slave
Master configured as a receiver
by programming SSPCON2<3> (RCEN = 1)
PEN bit = 1
written here
Data shifted in on falling edge of CLK
Cleared in software
start XMIT
SEN = 0
SSPOV
SDA = 0, SCL = 1
while CPU
(SSPSTAT<0>)
ACK
Cleared in software
Cleared in software
Set SSPIF interrupt
at end of receive
Set P bit
(SSPSTAT<4>)
and SSPIF
ACK from Master,
Set SSPIF at end
Set SSPIF interrupt
at end of Acknowledge
sequence
Set SSPIF interrupt
at end of Acknowledge
sequence
of receive
Set ACKEN, start Acknowledge sequence,
SDA = ACKDT = 1
RCEN cleared
automatically
RCEN = 1, start
next receive
Write to SSPCON2<4>
to start Acknowledge sequence,
SDA = ACKDT (SSPCON2<5>) = 0
RCEN cleared
automatically
ACKEN
begin Start condition
Cleared in software
SDA = ACKDT = 0
Last bit is shifted into SSPSR and
contents are unloaded into SSPBUF
Cleared in
software
SSPOV is set because
SSPBUF is still full
responds to SSPIF
PIC18F87J72 FAMILY
DS39979A-page 232 Preliminary 2010 Microchip Technology Inc.
18.4.12 ACKNOWLEDGE SEQUENCE
TIMING
An Acknowledge sequence is enabled by setting the
Acknowledge Sequence Enable bit, ACKEN
(SSPCON2<4>). When this bit is set, the SCL pin is
pulled low and the contents of the Acknowledge data bit
are presented on the SDA pin. If the user wishes to gen-
erate an Acknowledge, then the ACKDT bit should be
cleared. If not, the user should set the ACKDT bit before
starting an Acknowledge sequence. The Baud Rate
Generator then counts for one rollover period (TBRG)
and the SCL pin is deasserted (pulled high). When the
SCL pin is sampled high (clock arbitration), the Baud
Rate Generator counts for TBRG. The SCL pin is then
pulled low. Following this, the ACKEN bit is automatically
cleared, the Baud Rate Generator is turned off and the
MSSP module then goes into Idle mode (Figure 18-25).
18.4.12.1 WCOL Status Flag
If the user writes the SSPBUF when an Acknowledge
sequence is in progress, then WCOL is set and the
contents of the buffer are unchanged (the write doesn’t
occur).
18.4.13 STOP CONDITION TIMING
A Stop bit is asserted on the SDA pin at the end of a
receive/transmit by setting the Stop Sequence Enable
bit, PEN (SSPCON2<2>). At the end of a
receive/transmit, the SCL line is held low after the fall-
ing edge of the ninth clock. When the PEN bit is set, the
master will assert the SDA line low. When the SDA line
is sampled low, the Baud Rate Generator is reloaded
and counts down to 0. When the Baud Rate Generator
times out, the SCL pin will be brought high and one
TBRG (Baud Rate Generator rollover count) later, the
SDA pin will be deasserted. When the SDA pin is
sampled high while SCL is high, the P bit
(SSPSTAT<4>) is set. A TBRG later, the PEN bit is
cleared and the SSPIF bit is set (Figure 18-26).
18.4.13.1 WCOL Status Flag
If the user writes the SSPBUF when a Stop sequence
is in progress, then the WCOL bit is set and the
contents of the buffer are unchanged (the write doesn’t
occur).
FIGURE 18-25: ACKNOWLEDGE SEQUENCE WAVEFORM
FIGURE 18-26: STOP CONDITION RECEIVE OR TRANSMIT MODE
Note: TBRG = one Baud Rate Generator period.
SDA
SCL
SSPIF set at
Acknowledge sequence starts here,
write to SSPCON2, ACKEN automatically cleared
Cleared in
TBRG TBRG
the end of receive
8
ACKEN = 1, ACKDT = 0
D0
9
SSPIF
software SSPIF set at the end
of Acknowledge sequence
Cleared in
software
ACK
SCL
SDA
SDA asserted low before rising edge of clock
Write to SSPCON2,
set PEN
Falling edge of
SCL = 1 for TBRG, followed by SDA = 1 for TBRG
9th clock
SCL brought high after TBRG
Note: TBRG = one Baud Rate Generator period.
TBRG TBRG
after SDA sampled high. P bit (SSPSTAT<4>) is set.
TBRG
to setup Stop condition
ACK
P
TBRG
PEN bit (SSPCON2<2>) is cleared by
hardware and the SSPIF bit is set
2010 Microchip Technology Inc. Preliminary DS39979A-page 233
PIC18F87J72 FAMILY
18.4.14 SLEEP OPERATION
While in Sleep mode, the I2C module can receive
addresses or data and when an address match or
complete byte transfer occurs, wake the processor
from Sleep (if the MSSP interrupt is enabled).
18.4.15 EFFECTS OF A RESET
A Reset disables the MSSP module and terminates the
current transfer.
18.4.16 MULTI-MASTER MODE
In Multi-Master mode, the interrupt generation on the
detection of the Start and Stop conditions allows the
determination of when the bus is free. The Stop (P) and
Start (S) bits are cleared from a Reset or when the
MSSP module is disabled. Control of the I2C bus may
be taken when the P bit (SSPSTAT<4>) is set, or the
bus is Idle, with both the S and P bits clear. When the
bus is busy, enabling the MSSP interrupt will generate
the interrupt when the Stop condition occurs.
In multi-master operation, the SDA line must be
monitored for arbitration to see if the signal level is the
expected output level. This check is performed in
hardware with the result placed in the BCLIF bit.
The states where arbitration can be lost are:
Address Transfer
Data Transfer
A Start Condition
A Repeated Start Condition
An Acknowledge Condition
18.4.17 MULTI -MASTER COMMUNICATION,
BUS COLLISION AND BUS
ARBITRATION
Multi-Master mode support is achieved by bus arbitra-
tion. When the master outputs address/data bits onto
the SDA pin, arbitration takes place when the master
outputs a ‘1’ on SDA by letting SDA float high, and
another master asserts a ‘0’. When the SCL pin floats
high, data should be stable. If the expected data on
SDA is a1 and the data sampled on the SDA pin = 0,
then a bus collision has taken place. The master will set
the Bus Collision Interrupt Flag, BCLIF, and reset the
I2C port to its Idle state (Figure 18-27).
If a transmit was in progress when the bus collision
occurred, the transmission is halted, the BF flag is
cleared, the SDA and SCL lines are deasserted and the
SSPBUF can be written to. When the user services the
bus collision Interrupt Service Routine, and if the I2C bus
is free, the user can resume communication by asserting
a Start condition.
If a Start, Repeated Start, Stop or Acknowledge condition
was in progress when the bus collision occurred, the
condition is aborted, the SDA and SCL lines are
deasserted, and the respective control bits in the
SSPCON2 register, are cleared. When the user services
the bus collision Interrupt Service Routine and if the I2C
bus is free, the user can resume communication by
asserting a Start condition.
The master will continue to monitor the SDA and SCL
pins. If a Stop condition occurs, the SSPIF bit will be set.
A write to the SSPBUF will start the transmission of
data at the first data bit, regardless of where the
transmitter left off when the bus collision occurred.
In Multi-Master mode, the interrupt generation on the
detection of Start and Stop conditions allows the deter-
mination of when the bus is free. Control of the I2C bus
can be taken when the P bit is set in the SSPSTAT
register, or the bus is Idle and the S and P bits are
cleared.
FIGURE 18-27: BUS COLLISION TIMING FOR TRANSMIT AND ACKNOWLEDGE
SDA
SCL
BCLIF
SDA released
SDA line pulled low
by another source
Sample SDA. While SCL is high,
data doesn’t match what is driven
Bus collision has occurred.
Set bus collision
interrupt (BCLIF)
by the master.
by master
Data changes
while SCL = 0
PIC18F87J72 FAMILY
DS39979A-page 234 Preliminary 2010 Microchip Technology Inc.
18.4.17.1 Bus Collision During a Start
Condition
During a Start condition, a bus collision occurs if:
a) SDA or SCL are sampled low at the beginning of
the Start condition (Figure 18-28).
b) SCL is sampled low before SDA is asserted low
(Figure 18-29).
During a Start condition, both the SDA and the SCL
pins are monitored.
If the SDA pin is already low, or the SCL pin is already
low, then all of the following occur:
the Start condition is aborted;
the BCLIF flag is set; and
the MSSP module is reset to its Idle state
(Figure 18-28).
The Start condition begins with the SDA and SCL pins
deasserted. When the SDA pin is sampled high, the
Baud Rate Generator is loaded from SSPADD<6:0>
and counts down to 0. If the SCL pin is sampled low
while SDA is high, a bus collision occurs, because it is
assumed that another master is attempting to drive a
data ‘1’ during the Start condition.
If the SDA pin is sampled low during this count, the
BRG is reset and the SDA line is asserted early
(Figure 18-30). If, however, a ‘1’ is sampled on the SDA
pin, the SDA pin is asserted low at the end of the BRG
count. The Baud Rate Generator is then reloaded and
counts down to 0. If the SCL pin is sampled as 0
during this time, a bus collision does not occur. At the
end of the BRG count, the SCL pin is asserted low.
FIGURE 18-28: BUS COLLISION DURING START CONDITION (SDA ONLY)
Note: The reason that bus collision is not a factor
during a Start condition is that no two bus
masters can assert a Start condition at the
exact same time. Therefore, one master
will always assert SDA before the other.
This condition does not cause a bus colli-
sion because the two masters must be
allowed to arbitrate the first address
following the Start condition. If the address
is the same, arbitration must be allowed to
continue into the data portion, Repeated
Start or Stop conditions.
SDA
SCL
SEN
SDA sampled low before
SDA goes low before the SEN bit is set.
S bit and SSPIF set because
MSSP module reset into Idle state.
SEN cleared automatically because of bus collision.
S bit and SSPIF set because
Set SEN, enable Start
condition if SDA = 1, SCL = 1
SDA = 0, SCL = 1.
BCLIF
SSPIF
SDA = 0, SCL = 1.
SSPIF and BCLIF are
cleared in software
SSPIF and BCLIF are
cleared in software
Set BCLIF,
Start condition. Set BCLIF.
S
2010 Microchip Technology Inc. Preliminary DS39979A-page 235
PIC18F87J72 FAMILY
FIGURE 18-29: BUS COLLISION DURING START CONDITION (SCL = 0)
FIGURE 18-30: BRG RESET DUE TO SDA ARBITRATION DURING START CONDITION
SDA
SCL
SEN bus collision occurs. Set BCLIF.
SCL = 0 before SDA = 0,
Set SEN, enable Start
sequence if SDA = 1, SCL = 1
TBRG TBRG
SDA = 0, SCL = 1
BCLIF
S
SSPIF
Interrupt cleared
in software
bus collision occurs. Set BCLIF.
SCL = 0 before BRG time-out,
0’‘0
00
SDA
SCL
SEN
Set S
Less than TBRG TBRG
SDA = 0, SCL = 1
BCLIF
S
SSPIF
S
Interrupts cleared
in software
set SSPIF
SDA = 0, SCL = 1,
SCL pulled low after BRG
time-out
Set SSPIF
0
SDA pulled low by other master.
Reset BRG and assert SDA.
Set SEN, enable Start
sequence if SDA = 1, SCL = 1
PIC18F87J72 FAMILY
DS39979A-page 236 Preliminary 2010 Microchip Technology Inc.
18.4.17.2 Bus Collision During a Repeated
Start Condition
During a Repeated Start condition, a bus collision
occurs if:
a) A low level is sampled on SDA when SCL goes
from low level to high level.
b) SCL goes low before SDA is asserted low,
indicating that another master is attempting to
transmit a data ‘1’.
When the user deasserts SDA and the pin is allowed to
float high, the BRG is loaded with SSPADD<6:0> and
counts down to0. The SCL pin is then deasserted and
when sampled high, the SDA pin is sampled.
If SDA is low, a bus collision has occurred (i.e., another
master is attempting to transmit a data ‘0’, see
Figure 18-31). If SDA is sampled high, the BRG is
reloaded and begins counting. If SDA goes from
high-to-low before the BRG times out, no bus collision
occurs because no two masters can assert SDA at
exactly the same time.
If SCL goes from high-to-low before the BRG times out
and SDA has not already been asserted, a bus collision
occurs. In this case, another master is attempting to
transmit a data ‘1’ during the Repeated Start condition
(see Figure 18-32).
If, at the end of the BRG time-out, both SCL and SDA
are still high, the SDA pin is driven low and the BRG is
reloaded and begins counting. At the end of the count,
regardless of the status of the SCL pin, the SCL pin is
driven low and the Repeated Start condition is complete.
FIGURE 18-31: BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
FIGURE 18-32: BUS COLLISION DURING REPEATED START CONDITION (CASE 2)
SDA
SCL
RSEN
BCLIF
S
SSPIF
Sample SDA when SCL goes high.
If SDA = 0, set BCLIF and release SDA and SCL.
Cleared in software
0
0
SDA
SCL
BCLIF
RSEN
S
SSPIF
Interrupt cleared
in software
SCL goes low before SDA,
set BCLIF. Release SDA and SCL.
TBRG TBRG
0
2010 Microchip Technology Inc. Preliminary DS39979A-page 237
PIC18F87J72 FAMILY
18.4.17.3 Bus Collision During a Stop
Condition
Bus collision occurs during a Stop condition if:
a) After the SDA pin has been deasserted and
allowed to float high, SDA is sampled low after
the BRG has timed out.
b) After the SCL pin is deasserted, SCL is sampled
low before SDA goes high.
The Stop condition begins with SDA asserted low.
When SDA is sampled low, the SCL pin is allowed to
float. When the pin is sampled high (clock arbitration),
the Baud Rate Generator is loaded with SSPADD<6:0>
and counts down to 0. After the BRG times out, SDA is
sampled. If SDA is sampled low, a bus collision has
occurred. This is due to another master attempting to
drive a data ‘0’ (Figure 18-33). If the SCL pin is
sampled low before SDA is allowed to float high, a bus
collision occurs. This is another case of another master
attempting to drive a data ‘0’ (Figure 18-34).
FIGURE 18-33: BUS COLLISION DURING A STOP CONDITION (CASE 1)
FIGURE 18-34: BUS COLLISION DURING A STOP CONDITION (CASE 2)
SDA
SCL
BCLIF
PEN
P
SSPIF
TBRG TBRG TBRG
SDA asserted low
SDA sampled
low after TBRG,
set BCLIF
0
0
SDA
SCL
BCLIF
PEN
P
SSPIF
TBRG TBRG TBRG
Assert SDA SCL goes low before SDA goes high,
set BCLIF
0
0
PIC18F87J72 FAMILY
DS39979A-page 238 Preliminary 2010 Microchip Technology Inc.
TABLE 18-4: REGISTERS ASSOCIATED WITH I2C™ OPERATION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on Page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR1 ADIF RC1IF TX1IF SSPIF TMR2IF TMR1IF 52
PIE1 ADIE RC1IE TX1IE SSPIE TMR2IE TMR1IE 52
IPR1 ADIP RC1IP TX1IP SSPIP TMR2IP TMR1IP 52
PIR2 OSCFIF CMIF —BCLIFLVDIF TMR3IF —52
PIE2 OSCFIE CMIE —BCLIELVDIE TMR3IE —52
IPR2 OSCFIP CMIP —BCLIPLVDIP TMR3IP —52
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 52
SSPBUF MSSP Receive Buffer/Transmit Register 50
SSPADD MSSP Address Register (I2C™ Slave mode),
MSSP Baud Rate Reload Register (I2C Master mode)
50
SSPCON1 WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 50
SSPCON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 50
GCEN ACKSTAT ADMSK5(1) ADMSK4(1) ADMSK3(1) ADMSK2(1) ADMSK1(1) SEN
SSPSTAT SMP CKE D/A PSR/WUA BF 50
Legend: = unimplemented, read as ‘0’. Shaded cells are not used by the MSSP module in I2C™ mode.
Note 1: Alternate bit definitions for use in I2C Slave mode operations only.
2010 Microchip Technology Inc. Preliminary DS39979A-page 239
PIC18F87J72 FAMILY
19.0 ENHANCED UNIVERSAL
SYNCHRONOUS
ASYNCHRONOUS RECEIVER
TRANSMITTER (EUSART)
PIC18F87J72 family devices have three serial I/O
modules: the MSSP module, discussed in the previous
chapter and two Universal Synchronous Asynchronous
Receiver Transmitter (USART) modules. (Generically,
the USART is also known as a Serial Communications
Interface or SCI.) The USART can be configured as a
full-duplex asynchronous system that can communi-
cate with peripheral devices, such as CRT terminals
and personal computers. It can also be configured as a
half-duplex synchronous system that can communicate
with peripheral devices, such as A/D or D/A integrated
circuits, serial EEPROMs, etc.
There are two distinct implementations of the USART
module in these devices: the Enhanced USART
(EUSART) discussed here and the Addressable
USART discussed in the next chapter. For this device
family, USART1 always refers to the EUSART, while
USART2 is always the AUSART.
The EUSART and AUSART modules implement the
same core features for serial communications; their
basic operation is essentially the same. The EUSART
module provides additional features, including Auto-
matic Baud Rate Detection and calibration, automatic
wake-up on Sync Break reception and 12-bit Break
character transmit. These features make it ideally
suited for use in Local Interconnect Network bus
(LIN/J2602 bus) systems.
The EUSART can be configured in the following
modes:
Asynchronous (full-duplex) with:
- Auto-wake-up on character reception
- Auto-baud calibration
- 12-bit Break character transmission
Synchronous – Master (half-duplex) with
selectable clock polarity
Synchronous – Slave (half-duplex) with selectable
clock polarity
The pins of the EUSART are multiplexed with the
functions of PORTC (RC6/TX1/CK1/SEG27 and
RC7/RX1/DT1/SEG28). In order to configure these
pins as an EUSART:
SPEN bit (RCSTA1<7>) must be set (= 1)
TRISC<7> bit must be set (= 1)
TRISC<6> bit must be set (= 1)
The driver for the TX1 output pin can also be optionally
configured as an open-drain output. This feature allows
the voltage level on the pin to be pulled to a higher level
through an external pull-up resistor, and allows the out-
put to communicate with external circuits without the
need for additional level shifters.
The open-drain output option is controlled by the U1OD
bit (LATG<6>). Setting this bit configures the pin for
open-drain operation.
19.1 Control Registers
The operation of the Enhanced USART module is
controlled through three registers:
Transmit Status and Control Register 1 (TXSTA1)
Receive Status and Control Register 1 (RCSTA1)
Baud Rate Control Register 1 (BAUDCON1)
The registers are described in Register 19-1,
Register 19-2 and Register 19-3.
Note: The EUSART control will automatically
reconfigure the pin from input to output as
needed.
PIC18F87J72 FAMILY
DS39979A-page 240 Preliminary 2010 Microchip Technology Inc.
REGISTER 19-1: TXSTA1: EUSART TRANSMIT STATUS AND CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-1 R/W-0
CSRC TX9 TXEN(1) SYNC SENDB BRGH TRMT TX9D
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 CSRC: Clock Source Select bit
Asynchronous mode:
Don’t care.
Synchronous mode:
1 = Master mode (clock generated internally from BRG)
0 = Slave mode (clock from external source)
bit 6 TX9: 9-Bit Transmit Enable bit
1 = Selects 9-bit transmission
0 = Selects 8-bit transmission
bit 5 TXEN: Transmit Enable bit(1)
1 = Transmit is enabled
0 = Transmit is disabled
bit 4 SYNC: EUSART Mode Select bit
1 = Synchronous mode
0 = Asynchronous mode
bit 3 SENDB: Send Break Character bit
Asynchronous mode:
1 = Send Sync Break on next transmission (cleared by hardware upon completion)
0 = Sync Break transmission completed
Synchronous mode:
Don’t care.
bit 2 BRGH: High Baud Rate Select bit
Asynchronous mode:
1 = High speed
0 = Low speed
Synchronous mode:
Unused in this mode.
bit 1 TRMT: Transmit Shift Register Status bit
1 = TSR is empty
0 = TSR is full
bit 0 TX9D: 9th bit of Transmit Data
Can be address/data bit or a parity bit.
Note 1: SREN/CREN overrides TXEN in Sync mode.
2010 Microchip Technology Inc. Preliminary DS39979A-page 241
PIC18F87J72 FAMILY
REGISTER 19-2: RCSTA1: EUSART RECEIVE STATUS AND CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-0 R-0 R-x
SPEN RX9 SREN CREN ADDEN FERR OERR RX9D
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 SPEN: Serial Port Enable bit
1 = Serial port is enabled
0 = Serial port is disabled (held in Reset)
bit 6 RX9: 9-Bit Receive Enable bit
1 = Selects 9-bit reception
0 = Selects 8-bit reception
bit 5 SREN: Single Receive Enable bit
Asynchronous mode:
Don’t care.
Synchronous mode – Master:
1 = Enables single receive
0 = Disables single receive
This bit is cleared after reception is complete.
Synchronous mode – Slave:
Don’t care.
bit 4 CREN: Continuous Receive Enable bit
Asynchronous mode:
1 = Enables receiver
0 = Disables receiver
Synchronous mode:
1 = Enables continuous receive until enable bit, CREN, is cleared (CREN overrides SREN)
0 = Disables continuous receive
bit 3 ADDEN: Address Detect Enable bit
Asynchronous mode 9-bit (RX9 = 1):
1 = Enables address detection, enables interrupt and loads the receive buffer when RSR<8> is set
0 = Disables address detection, all bytes are received and ninth bit can be used as parity bit
Asynchronous mode 9-bit (RX9 = 0):
Don’t care.
bit 2 FERR: Framing Error bit
1 = Framing error (can be cleared by reading the RCREG1 register and receiving the next valid byte)
0 = No framing error
bit 1 OERR: Overrun Error bit
1 = Overrun error (can be cleared by clearing bit, CREN)
0 = No overrun error
bit 0 RX9D: 9th bit of Received Data
This can be address/data bit or a parity bit and must be calculated by user firmware.
PIC18F87J72 FAMILY
DS39979A-page 242 Preliminary 2010 Microchip Technology Inc.
REGISTER 19-3: BAUDCON1: BAUD RATE CONTROL REGISTER 1
R/W-0 R-1 R/W - 0 R/W-0 R/W-0 U-0 R/W-0 R/W-0
ABDOVF RCMT RXDTP TXCKP BRG16 WUE ABDEN
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 ABDOVF: Auto-Baud Acquisition Rollover Status bit
1 = A BRG rollover has occurred during Auto-Baud Rate Detect mode (must be cleared in software)
0 = No BRG rollover has occurred
bit 6 RCMT: Receive Operation Idle Status bit
1 = Receive operation is Idle
0 = Receive operation is active
bit 5 RXDTP: Received Data Polarity Select bit (Asynchronous mode only)
1 = RXx data is inverted
0 = RXx data is not inverted
bit 4 TXCKP: Clock and Data Polarity Select bit
Asynchronous mode:
1 = Transmit idle state is low
0 = Transmit idle state is high
Synchronous mode:
1 = CKx clock idle state is high
0 = CKx clock idle state is low
bit 3 BRG16: 16-Bit Baud Rate Register Enable bit
1 = 16-bit Baud Rate Generator – SPBRGH1 and SPBRG1
0 = 8-bit Baud Rate Generator – SPBRG1 only (Compatible mode), SPBRGH1 value is ignored
bit 2 Unimplemented: Read as0
bit 1 WUE: Wake-up Enable bit
Asynchronous mode:
1 = EUSART will continue to sample the RX1 pin – interrupt generated on falling edge; bit cleared in
hardware on following rising edge
0 = RX1 pin is not monitored or a rising edge detected
Synchronous mode:
Unused in this mode.
bit 0 ABDEN: Auto-Baud Detect Enable bit
Asynchronous mode:
1 = Enable baud rate measurement on the next character. Requires reception of a Sync field (55h);
cleared in hardware upon completion.
0 = Baud rate measurement is disabled or completed
Synchronous mode:
Unused in this mode.
2010 Microchip Technology Inc. Preliminary DS39979A-page 243
PIC18F87J72 FAMILY
19.2 EUSART Baud Rate Generator
(BRG)
The BRG is a dedicated, 8-bit or 16-bit generator that
supports both the Asynchronous and Synchronous
modes of the EUSART. By default, the BRG operates
in 8-bit mode; setting the BRG16 bit (BAUDCON1<3>)
selects 16-bit mode.
The SPBRGH1:SPBRG1 register pair controls the
period of a free-running timer. In Asynchronous mode,
BRGH (TXSTA1<2>) and BRG16 (BAUDCON1<3>) bits
also control the baud rate. In Synchronous mode, BRGH
is ignored. Table 19-1 shows the formula for computa-
tion of the baud rate for different EUSART modes that
only apply in Master mode (internally generated clock).
Given the desired baud rate and FOSC, the nearest
integer value for the SPBRGH1:SPBRG1 registers can
be calculated using the formulas in Table 19-1. From this,
the error in baud rate can be determined. An example
calculation is shown in Example 19-1. Typical baud rates
and error values for the various Asynchronous modes
are shown in Table 19-2. It may be advantageous to use
the high baud rate (BRGH = 1) or the 16-bit BRG to
reduce the baud rate error, or achieve a slow baud rate
for a fast oscillator frequency.
Writing a new value to the SPBRGH1:SPBRG1 regis-
ters causes the BRG timer to be reset (or cleared). This
ensures the BRG does not wait for a timer overflow
before outputting the new baud rate.
SPBRGH1:SPBRG1 values of 0000h and 0001h are
not supported in Synchronous mode.
19.2.1 OPERATION IN POWER-MANAGED
MODES
The device clock is used to generate the desired baud
rate. When one of the power-managed modes is
entered, the new clock source may be operating at a
different frequency. This may require an adjustment to
the value in the SPBRG1 register pair.
19.2.2 SAMPLING
The data on the RX1 pin is sampled three times by a
majority detect circuit to determine if a high or a low
level is present at the RX1 pin.
TABLE 19-1: BAUD RATE FORMULAS
EXAMPLE 19-1: CALCULATING BAUD RATE ERROR
TABLE 19-2: REGISTERS ASSOCIATED WITH THE BAUD RATE GENERATOR
Configuration Bits BRG/EUSART Mode Baud Rate Formula
SYNC BRG16 BRGH
000 8-bit/Asynchronous FOSC/[64 (n + 1)]
001 8-bit/Asynchronous FOSC/[16 (n + 1)]
010 16-bit/Asynchronous
011 16-bit/Asynchronous
FOSC/[4 (n + 1)]10x 8-bit/Synchronous
11x 16-bit/Synchronous
Legend: x = Don’t care, n = Value of SPBRGH1:SPBRG1 register pair
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values
on Page
TXSTA1 CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51
RCSTA1 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51
BAUDCON1 ABDOVF RCMT RXDTP TXCKP BRG16 WUE ABDEN 53
SPBRGH1 EUSART Baud Rate Generator Register High Byte 53
SPBRG1 EUSART Baud Rate Generator Register Low Byte 51
Legend: — = unimplemented, read as 0’. Shaded cells are not used by the BRG.
For a device with FOSC of 16 MHz, desired baud rate of 9600, Asynchronous mode, 8-bit BRG:
Desired Baud Rate = FOSC/(64 ([SPBRGH1:SPBRG1] + 1))
Solving for SPBRGH1:SPBRG1:
X = ((FOSC/Desired Baud Rate)/64) – 1
= ((16000000/9600)/64) – 1
= [25.042] = 25
Calculated Baud Rate=16000000/(64 (25 + 1))
= 9615
Error = (Calculated Baud Rate – Desired Baud Rate)/Desired Baud Rate
= (9615 – 9600)/9600 = 0.16%
PIC18F87J72 FAMILY
DS39979A-page 244 Preliminary 2010 Microchip Technology Inc.
TABLE 19-3: BAUD RATES FOR ASYNCHRONOUS MODES
BAUD
RATE
(K)
SYNC = 0, BRGH = 0, BRG16 = 0
FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 10.000 MHz FOSC = 8.000 MHz
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
0.3—————————
1.2 1.221 1.73 255 1.202 0.16 129 1.201 -0.16 103
2.4 2.441 1.73 255 2.404 0.16 129 2.404 0.16 64 2.403 -0.16 51
9.6 9.615 0.16 64 9.766 1.73 31 9.766 1.73 15 9.615 -0.16 12
19.2 19.531 1.73 31 19.531 1.73 15 19.531 1.73 7
57.6 56.818 -1.36 10 62.500 8.51 4 52.083 -9.58 2
115.2 125.000 8.51 4 104.167 -9.58 2 78.125 -32.18 1
BAUD
RATE
(K)
SYNC = 0, BRGH = 0, BRG16 = 0
FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
0.3 0.300 0.16 207 0.300 -0.16 103 0.300 -0.16 51
1.2 1.202 0.16 51 1.201 -0.16 25 1.201 -0.16 12
2.4 2.404 0.16 25 2.403 -0.16 12
9.6 8.929 -6.99 6
19.2 20.833 8.51 2
57.6 62.500 8.51 0
115.2 62.500 -45.75 0
BAUD
RATE
(K)
SYNC = 0, BRGH = 1, BRG16 = 0
FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 10.000 MHz FOSC = 8.000 MHz
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
0.3—————————
1.2—————————
2.4 2.441 1.73 255 2.403 -0.16 207
9.6 9.766 1.73 255 9.615 0.16 129 9.615 0.16 64 9.615 -0.16 51
19.2 19.231 0.16 129 19.231 0.16 64 19.531 1.73 31 19.230 -0.16 25
57.6 58.140 0.94 42 56.818 -1.36 21 56.818 -1.36 10 55.555 3.55 8
115.2 113.636 -1.36 21 113.636 -1.36 10 125.000 8.51 4
BAUD
RATE
(K)
SYNC = 0, BRGH = 1, BRG16 = 0
FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
0.3 0.300 -0.16 207
1.2 1.202 0.16 207 1.201 -0.16 103 1.201 -0.16 51
2.4 2.404 0.16 103 2.403 -0.16 51 2.403 -0.16 25
9.6 9.615 0.16 25 9.615 -0.16 12
19.2 19.231 0.16 12
57.6 62.500 8.51 3
115.2 125.000 8.51 1
2010 Microchip Technology Inc. Preliminary DS39979A-page 245
PIC18F87J72 FAMILY
BAUD
RATE
(K)
SYNC = 0, BRGH = 0, BRG16 = 1
FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 10.000 MHz FOSC = 8.000 MHz
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
0.3 0.300 0.00 8332 0.300 0.02 4165 0.300 0.02 2082 0.300 -0.04 1665
1.2 1.200 0.02 2082 1.200 -0.03 1041 1.200 -0.03 520 1.201 -0.16 415
2.4 2.402 0.06 1040 2.399 -0.03 520 2.404 0.16 259 2.403 -0.16 207
9.6 9.615 0.16 259 9.615 0.16 129 9.615 0.16 64 9.615 -0.16 51
19.2 19.231 0.16 129 19.231 0.16 64 19.531 1.73 31 19.230 -0.16 25
57.6 58.140 0.94 42 56.818 -1.36 21 56.818 -1.36 10 55.555 3.55 8
115.2 113.636 -1.36 21 113.636 -1.36 10 125.000 8.51 4
BAUD
RATE
(K)
SYNC = 0, BRGH = 0, BRG16 = 1
FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
0.3 0.300 0.04 832 0.300 -0.16 415 0.300 -0.16 207
1.2 1.202 0.16 207 1.201 -0.16 103 1.201 -0.16 51
2.4 2.404 0.16 103 2.403 -0.16 51 2.403 -0.16 25
9.6 9.615 0.16 25 9.615 -0.16 12
19.2 19.231 0.16 12
57.6 62.500 8.51 3
115.2 125.000 8.51 1
BAUD
RATE
(K)
SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1
FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 10.000 MHz FOSC = 8.000 MHz
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
0.3 0.300 0.00 33332 0.300 0.00 16665 0.300 0.00 8332 0.300 -0.01 6665
1.2 1.200 0.00 8332 1.200 0.02 4165 1.200 0.02 2082 1.200 -0.04 1665
2.4 2.400 0.02 4165 2.400 0.02 2082 2.402 0.06 1040 2.400 -0.04 832
9.6 9.606 0.06 1040 9.596 -0.03 520 9.615 0.16 259 9.615 -0.16 207
19.2 19.193 -0.03 520 19.231 0.16 259 19.231 0.16 129 19.230 -0.16 103
57.6 57.803 0.35 172 57.471 -0.22 86 58.140 0.94 42 57.142 0.79 34
115.2 114.943 -0.22 86 116.279 0.94 42 113.636 -1.36 21 117.647 -2.12 16
BAUD
RATE
(K)
SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1
FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
0.3 0.300 0.01 3332 0.300 -0.04 1665 0.300 -0.04 832
1.2 1.200 0.04 832 1.201 -0.16 415 1.201 -0.16 207
2.4 2.404 0.16 415 2.403 -0.16 207 2.403 -0.16 103
9.6 9.615 0.16 103 9.615 -0.16 51 9.615 -0.16 25
19.2 19.231 0.16 51 19.230 -0.16 25 19.230 -0.16 12
57.6 58.824 2.12 16 55.555 3.55 8
115.2 111.111 -3.55 8
TABLE 19-3: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED)
PIC18F87J72 FAMILY
DS39979A-page 246 Preliminary 2010 Microchip Technology Inc.
19.2.3 AUTO-BAUD RATE DETECT
The Enhanced USART module supports the automatic
detection and calibration of baud rate. This feature is
active only in Asynchronous mode and while the WUE
bit is clear.
The automatic baud rate measurement sequence
(Figure 19-1) begins whenever a Start bit is received
and the ABDEN bit is set. The calculation is
self-averaging.
In the Auto-Baud Rate Detect (ABD) mode, the clock to
the BRG is reversed. Rather than the BRG clocking the
incoming RX1 signal, the RX1 signal is timing the BRG.
In ABD mode, the internal Baud Rate Generator is
used as a counter to time the bit period of the incoming
serial byte stream.
Once the ABDEN bit is set, the state machine will clear
the BRG and look for a Start bit. The Auto-Baud Rate
Detect must receive a byte with the value, 55h (ASCII
“U”, which is also the LIN/J2602 bus Sync character),
in order to calculate the proper bit rate. The measure-
ment is taken over both a low and a high bit time in
order to minimize any effects caused by asymmetry of
the incoming signal. After a Start bit, the SPBRG1
begins counting up, using the preselected clock source
on the first rising edge of RX1. After eight bits on the
RX1 pin or the fifth rising edge, an accumulated value
totalling the proper BRG period is left in the
SPBRGH1:SPBRG1 register pair. Once the 5th edge is
seen (this should correspond to the Stop bit), the
ABDEN bit is automatically cleared.
If a rollover of the BRG occurs (an overflow from FFFFh
to 0000h), the event is trapped by the ABDOVF status bit
(BAUDCON1<7>). It is set in hardware by BRG rollovers
and can be set or cleared by the user in software. ABD
mode remains active after rollover events and the
ABDEN bit remains set (Figure 19-2).
While calibrating the baud rate period, the BRG
registers are clocked at 1/8th the preconfigured clock
rate. Note that the BRG clock is configured by the
BRG16 and BRGH bits. The BRG16 bit
(BAUDCON1<3>) must be set to use the SPBRG1 and
SPBRGH1 registers as a 16-bit counter. This allows the
user to verify that no carry occurred for 8-bit modes by
checking for 00h in the SPBRGH1 register. Refer to
Table 19-4 for counter clock rates to the BRG.
While the ABD sequence takes place, the EUSART
state machine is held in Idle. The RC1IF interrupt is set
once the fifth rising edge on RX1 is detected. The value
in the RCREG1 needs to be read to clear the RC1IF
interrupt. The contents of RCREG1 should be
discarded.
TABLE 19-4: BRG COUNTER CLOCK
RATES
19.2.3.1 ABD and EUSART Transmission
Since the BRG clock is reversed during ABD acquisi-
tion, the EUSART transmitter cannot be used during
ABD. This means that whenever the ABDEN bit is set,
TXREG1 cannot be written to. Users should also
ensure that ABDEN does not become set during a
transmit sequence. Failing to do this may result in
unpredictable EUSART operation.
Note 1: If the WUE bit is set with the ABDEN bit,
Auto-Baud Rate Detection will occur on
the byte following the Break character.
2: It is up to the user to determine that the
incoming character baud rate is within the
range of the selected BRG clock source.
Some combinations of oscillator frequency
and EUSART baud rates are not possible
due to bit error rates. Overall system
timing and communication baud rates
must be taken into consideration when
using the Auto-Baud Rate Detection
feature.
BRG16 BRGH BRG Counter Clock
00 FOSC/512
01 FOSC/128
10 FOSC/128
11 FOSC/32
Note: During the ABD sequence, SPBRG1 and
SPBRGH1 are both used as a 16-bit
counter, independent of the BRG16 setting.
2010 Microchip Technology Inc. Preliminary DS39979A-page 247
PIC18F87J72 FAMILY
FIGURE 19-1: AUTOMATIC BAUD RATE CALCULATION
FIGURE 19-2: BRG OVERFLOW SEQUENCE
BRG Value
RX1 Pin
ABDEN bit
RC1IF bit
bit 0 bit 1
(Interrupt)
Read
RCREG1
BRG Clock
Start
Auto-Cleared
Set by User
XXXXh 0000h
Edge #1
bit 2 bit 3
Edge #2
bit 4 bit 5
Edge #3
bit 6 bit 7
Edge #4
Stop bit
Edge #5
001Ch
Note: The ABD sequence requires the EUSART module to be configured in Asynchronous mode and WUE = 0.
SPBRG1 XXXXh 1Ch
SPBRGH1 XXXXh 00h
Start bit 0
XXXXh 0000h 0000h
FFFFh
BRG Clock
ABDEN bit
RX1 Pin
ABDOVF bit
BRG Value
PIC18F87J72 FAMILY
DS39979A-page 248 Preliminary 2010 Microchip Technology Inc.
19.3 EUSART Asynchronous Mode
The Asynchronous mode of operation is selected by
clearing the SYNC bit (TXSTA1<4>). In this mode, the
EUSART uses standard Non-Return-to-Zero (NRZ) for-
mat (one Start bit, eight or nine data bits and one Stop
bit). The most common data format is 8 bits. An on-chip
dedicated 8-bit/16-bit Baud Rate Generator can be
used to derive standard baud rate frequencies from the
oscillator.
The EUSART transmits and receives the LSb first. The
EUSART’s transmitter and receiver are functionally
independent, but use the same data format and baud
rate. The Baud Rate Generator produces a clock, either
x16 or x64 of the bit shift rate, depending on the BRGH
and BRG16 bits (TXSTA1<2> and BAUDCON1<3>).
Parity is not supported by the hardware but can be
implemented in software and stored as the 9th data bit.
When operating in Asynchronous mode, the EUSART
module consists of the following important elements:
Baud Rate Generator
Sampling Circuit
Asynchronous Transmitter
Asynchronous Receiver
Auto-Wake-up on Sync Break Character
12-Bit Break Character Transmit
Auto-Baud Rate Detection
19.3.1 EUSART ASYNCHRONOUS
TRANSMITTER
The EUSART transmitter block diagram is shown in
Figure 19-3. The heart of the transmitter is the Transmit
(Serial) Shift register (TSR). The Shift register obtains
its data from the Read/Write Transmit Buffer register,
TXREG1. The TXREG1 register is loaded with data in
software. The TSR register is not loaded until the Stop
bit has been transmitted from the previous load. As
soon as the Stop bit is transmitted, the TSR is loaded
with new data from the TXREG1 register (if available).
Once the TXREG1 register transfers the data to the
TSR register (occurs in one T
CY), the TXREG1 register
is empty and the TX1IF flag bit (PIR1<4>) is set. This
interrupt can be enabled or disabled by setting or clear-
ing the interrupt enable bit, TX1IE (PIE1<4>). TX1IF
will be set regardless of the state of TX1IE; it cannot be
cleared in software. TX1IF is also not cleared immedi-
ately upon loading TXREG1, but becomes valid in the
second instruction cycle following the load instruction.
Polling TX1IF immediately following a load of TXREG1
will return invalid results.
While TX1IF indicates the status of the TXREG1
register, another bit, TRMT (TXSTA1<1>), shows the
status of the TSR register. TRMT is a read-only bit
which is set when the TSR register is empty. No inter-
rupt logic is tied to this bit, so the user has to poll this
bit in order to determine if the TSR register is empty.
To set up an Asynchronous Transmission:
1. Initialize the SPBRGH1:SPBRG1 registers for
the appropriate baud rate. Set or clear the
BRGH and BRG16 bits, as required, to achieve
the desired baud rate.
2. Enable the asynchronous serial port by clearing
bit, SYNC, and setting bit, SPEN.
3. If interrupts are desired, set enable bit, TX1IE.
4. If 9-bit transmission is desired, set transmit bit,
TX9; can be used as address/data bit.
5. Enable the transmission by setting bit, TXEN,
which will also set bit, TX1IF.
6. If 9-bit transmission is selected, the ninth bit
should be loaded in bit, TX9D.
7. Load data to the TXREG1 register (starts
transmission).
8. If using interrupts, ensure that the GIE and PEIE
bits in the INTCON register (INTCON<7:6>) are
set.
FIGURE 19-3: EUSART TRANSMIT BLOCK DIAGRAM
Note 1: The TSR register is not mapped in data
memory so it is not available to the user.
2: Flag bit, TX1IF, is set when enable bit,
TXEN, is set.
TX1IF
TX1IE
Interrupt
TXEN Baud Rate CLK
SPBRG1
Baud Rate Generator TX9D
MSb LSb
Data Bus
TXREG1 Register
TSR Register
(8) 0
TX9
TRMT SPEN
TX1 Pin
Pin Buffer
and Control
8

SPBRGH1
BRG16
2010 Microchip Technology Inc. Preliminary DS39979A-page 249
PIC18F87J72 FAMILY
FIGURE 19-4: ASYNCHRONOUS TRANSMISSION
FIGURE 19-5: ASYNCHRONOUS TRANSMISSION (BACK TO BACK)
TABLE 19-5: REGISTERS ASSOCIATED WITH ASYNCHRONOUS TRANSMISSION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on Page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR1 ADIF RC1IF TX1IF SSPIF TMR2IF TMR1IF 52
PIE1 ADIE RC1IE TX1IE SSPIE TMR2IE TMR1IE 52
IPR1 ADIP RC1IP TX1IP SSPIP TMR2IP TMR1IP 52
RCSTA1 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51
TXREG1 EUSART Transmit Register 51
TXSTA1 CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51
BAUDCON1 ABDOVF RCMT RXDTP TXCKP BRG16 WUE ABDEN 53
SPBRGH1 EUSART Baud Rate Generator Register High Byte 53
SPBRG1 EUSART Baud Rate Generator Register Low Byte 51
LATG U2OD U1OD LATG4 LATG3 LATG2 LATG1 LATG0 52
Legend: — = unimplemented locations read as 0’. Shaded cells are not used for asynchronous transmission.
Word 1
Word 1
Transmit Shift Reg
Start bit bit 0 bit 1 bit 7/8
Write to TXREG1
BRG Output
(Shift Clock)
TX1 (pin)
TX1IF bit
(Transmit Buffer
Reg. Empty Flag)
TRMT bit
(Transmit Shift
Reg. Empty Flag)
1 TCY
Word 1
Stop bit
Transmit Shift Reg.
Write to TXREG1
BRG Output
(Shift Clock)
TX1 (pin)
TX1IF bit
(Interrupt Reg. Flag)
TRMT bit
(Transmit Shift
Reg. Empty Flag)
Word 1 Word 2
Word 1 Word 2
Stop bit Start bit
Transmit Shift Reg.
Word 1 Word 2
bit 0 bit 1 bit 7/8 bit 0
Note: This timing diagram shows two consecutive transmissions.
1 TCY
1 TCY
Start bit
PIC18F87J72 FAMILY
DS39979A-page 250 Preliminary 2010 Microchip Technology Inc.
19.3.2 EUSART ASYNCHRONOUS
RECEIVER
The receiver block diagram is shown in Figure 19-6.
The data is received on the RX1 pin and drives the data
recovery block. The data recovery block is actually a
high-speed shifter operating at x16 times the baud rate,
whereas the main receive serial shifter operates at the
bit rate or at FOSC. This mode would typically be used
in RS-232 systems.
To set up an Asynchronous Reception:
1. Initialize the SPBRGH1:SPBRG1 registers for
the appropriate baud rate. Set or clear the
BRGH and BRG16 bits, as required, to achieve
the desired baud rate.
2. Enable the asynchronous serial port by clearing
bit, SYNC, and setting bit, SPEN.
3. If interrupts are desired, set enable bit, RC1IE.
4. If 9-bit reception is desired, set bit, RX9.
5. Enable the reception by setting bit, CREN.
6. Flag bit, RC1IF, will be set when reception is
complete and an interrupt will be generated if
enable bit, RC1IE, was set.
7. Read the RCSTA1 register to get the 9th bit (if
enabled) and determine if any error occurred
during reception.
8. Read the 8-bit received data by reading the
RCREG1 register.
9. If any error occurred, clear the error by clearing
enable bit, CREN.
10. If using interrupts, ensure that the GIE and PEIE
bits in the INTCON register (INTCON<7:6>) are
set.
19.3.3 SETTING UP 9-BIT MODE WITH
ADDRESS DETECT
This mode would typically be used in RS-485 systems.
To set up an Asynchronous Reception with Address
Detect Enable:
1. Initialize the SPBRGH1:SPBRG1 registers for
the appropriate baud rate. Set or clear the
BRGH and BRG16 bits, as required, to achieve
the desired baud rate.
2. Enable the asynchronous serial port by clearing
the SYNC bit and setting the SPEN bit.
3. If interrupts are required, set the RCEN bit and
select the desired priority level with the RC1IP
bit.
4. Set the RX9 bit to enable 9-bit reception.
5. Set the ADDEN bit to enable address detect.
6. Enable reception by setting the CREN bit.
7. The RC1IF bit will be set when reception is
complete. The interrupt will be Acknowledged if
the RC1IE and GIE bits are set.
8. Read the RCSTA1 register to determine if any
error occurred during reception, as well as read
bit 9 of data (if applicable).
9. Read RCREG1 to determine if the device is
being addressed.
10. If any error occurred, clear the CREN bit.
11. If the device has been addressed, clear the
ADDEN bit to allow all received data into the
receive buffer and interrupt the CPU.
FIGURE 19-6: EUSART RECEIVE BLOCK DIAGRAM
x64 Baud Rate CLK
Baud Rate Generator
RX1
Pin Buffer
and Control
SPEN
Data
Recovery
CREN OERR FERR
RSR Register
MSb LSb
RX9D RCREG1 Register
FIFO
Interrupt RC1IF
RC1IE
Data Bus
8
64
16
or
Stop Start
(8) 7 1 0
RX9

SPBRG1SPBRGH1
BRG16
or
4
2010 Microchip Technology Inc. Preliminary DS39979A-page 251
PIC18F87J72 FAMILY
FIGURE 19-7: ASYNCHRONOUS RECEPTION
TABLE 19-6: REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on Page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR1 ADIF RC1IF TX1IF SSPIF TMR2IF TMR1IF 52
PIE1 ADIE RC1IE TX1IE SSPIE TMR2IE TMR1IE 52
IPR1 ADIP RC1IP TX1IP SSPIP TMR2IP TMR1IP 52
RCSTA1 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51
RCREG1 EUSART Receive Register 51
TXSTA1 CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51
BAUDCON1 ABDOVF RCMT RXDTP TXCKP BRG16 WUE ABDEN 53
SPBRGH1 EUSART Baud Rate Generator Register High Byte 51
SPBRG1 EUSART Baud Rate Generator Register Low Byte 51
Legend: — = unimplemented locations read as 0’. Shaded cells are not used for asynchronous reception.
Start
bit bit 7/8
bit 1bit 0 bit 7/8 bit 0Stop
bit
Start
bit
Start
bit
bit 7/8 Stop
bit
RX1 (pin)
Rcv Buffer Reg
Rcv Shift Reg
Read Rcv
Buffer Reg
RCREG1
RC1IF
(Interrupt Flag)
OERR bit
CREN bit
Word 1
RCREG1
Word 2
RCREG1
Stop
bit
Note: This timing diagram shows three words appearing on the RX1 input. The RCREG1 (Receive Buffer register) is read after the third word
causing the OERR (Overrun) bit to be set.
PIC18F87J72 FAMILY
DS39979A-page 252 Preliminary 2010 Microchip Technology Inc.
19.3.4 AUTO-WAKE-UP ON SYNC BREAK
CHARACTER
During Sleep mode, all clocks to the EUSART are
suspended. Because of this, the Baud Rate Generator
is inactive and a proper byte reception cannot be per-
formed. The auto-wake-up feature allows the controller
to wake-up, due to activity on the RX1/DT1 line, while
the EUSART is operating in Asynchronous mode.
The auto-wake-up feature is enabled by setting the
WUE bit (BAUDCON<1>). Once set, the typical receive
sequence on RX1/DT1 is disabled and the EUSART
remains in an Idle state, monitoring for a wake-up event
independent of the CPU mode. A wake-up event
consists of a high-to-low transition on the RX1/DT1
line. (This coincides with the start of a Sync Break or a
Wake-up Signal character for the LIN/J2602 protocol.)
Following a wake-up event, the module generates an
RC1IF interrupt. The interrupt is generated synchro-
nously to the Q clocks in normal operating modes
(Figure 19-8) and asynchronously, if the device is in
Sleep mode (Figure 19-9). The interrupt condition is
cleared by reading the RCREG1 register.
The WUE bit is automatically cleared once a low-to-high
transition is observed on the RX1 line following the
wake-up event. At this point, the EUSART module is in
Idle mode and returns to normal operation. This signals
to the user that the Sync Break event is over.
19.3.4.1 Special Considerations Using
Auto-Wake-up
Since auto-wake-up functions by sensing rising edge
transitions on RX1/DT1, information with any state
changes before the Stop bit may signal a false
End-of-Character (EOC and cause data or framing
errors. Therefore, to work properly, the initial character
in the transmission must be all ‘0s. This can be 00h
(8 bits) for standard RS-232 devices, or 000h (12 bits)
for LIN/J2602 bus.
Oscillator start-up time must also be considered,
especially in applications using oscillators with longer
start-up intervals (i.e., XT or HS mode). The Sync
Break (or Wake-up Signal) character must be of
sufficient length and be followed by a sufficient interval
to allow enough time for the selected oscillator to start
and provide proper initialization of the EUSART.
19.3.4.2 Special Considerations Using
the WUE Bit
The timing of WUE and RC1IF events may cause some
confusion when it comes to determining the validity of
received data. As noted, setting the WUE bit places the
EUSART in an Idle mode. The wake-up event causes
a receive interrupt by setting the RC1IF bit. The WUE
bit is cleared after this when a rising edge is seen on
RX1/DT1. The interrupt condition is then cleared by
reading the RCREG1 register. Ordinarily, the data in
RCREG1 will be dummy data and should be discarded.
The fact that the WUE bit has been cleared (or is still
set) and the RC1IF flag is set should not be used as an
indicator of the integrity of the data in RCREG1. Users
should consider implementing a parallel method in
firmware to verify received data integrity.
To assure that no actual data is lost, check the RCMT
bit to verify that a receive operation is not in process. If
a receive operation is not occurring, the WUE bit may
then be set just prior to entering the Sleep mode.
FIGURE 19-8: AUTO-WAKE-UP BIT (WUE) TIMINGS DURING NORMAL OPERATION
FIGURE 19-9: AUTO-WAKE-UP BIT (WUE) TIMINGS DURING SLEEP
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
WUE bit(1)
RX1/DT1 Line
RC1IF
Cleared due to user read of RCREG1
Note 1: The EUSART remains in Idle while the WUE bit is set.
Bit set by user Auto-Cleared
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
WUE bit(2)
RX1/DT1 Line
RC1IF
Cleared due to user read of RCREG1
SLEEP Command Executed
Note 1: If the wake-up event requires long oscillator warm-up time, the auto-clear of the WUE bit can occur while the stposc signal is still active.
This sequence should not depend on the presence of Q clocks.
2: The EUSART remains in Idle while the WUE bit is set.
Sleep Ends
Auto-Cleared
Note 1
Bit set by user
2010 Microchip Technology Inc. Preliminary DS39979A-page 253
PIC18F87J72 FAMILY
19.3.5 BREAK CHARACTER SEQUENCE
The Enhanced USART module has the capability of
sending the special Break character sequences that are
required by the LIN/J2602 bus standard. The Break
character transmit consists of a Start bit, followed by
twelve ‘0’ bits and a Stop bit. The Frame Break character
is sent whenever the SENDB and TXEN bits
(TXSTA<3> and TXSTA<5>) are set while the Transmit
Shift register is loaded with data. Note that the value of
data written to TXREG1 will be ignored and all ‘0s will be
transmitted.
The SENDB bit is automatically reset by hardware after
the corresponding Stop bit is sent. This allows the user
to preload the transmit FIFO with the next transmit byte
following the Break character (typically, the Sync
character in the LIN/J2602 specification).
Note that the data value written to the TXREG1 for the
Break character is ignored. The write simply serves the
purpose of initiating the proper sequence.
The TRMT bit indicates when the transmit operation is
active or Idle, just as it does during normal transmis-
sion. See Figure 19-10 for the timing of the Break
character sequence.
19.3.5.1 Break and Sync Transmit Sequence
The following sequence will send a message frame
header made up of a Break, followed by an Auto-Baud
Sync byte. This sequence is typical of a LIN/J2602 bus
master.
1. Configure the EUSART for the desired mode.
2. Set the TXEN and SENDB bits to set up the
Break character.
3. Load the TXREG1 with a dummy character to
initiate transmission (the value is ignored).
4. Write ‘55h’ to TXREG1 to load the Sync
character into the transmit FIFO buffer.
5. After the Break has been sent, the SENDB bit is
reset by hardware. The Sync character now
transmits in the preconfigured mode.
When the TXREG1 becomes empty, as indicated by the
TX1IF, the next data byte can be written to TXREG1.
19.3.6 RECEIVING A BREAK CHARACTER
The Enhanced USART module can receive a Break
character in two ways.
The first method forces configuration of the baud rate
at a frequency of 9/13 the typical speed. This allows for
the Stop bit transition to be at the correct sampling
location (13 bits for Break versus Start bit and 8 data
bits for typical data).
The second method uses the auto-wake-up feature
described in Section 19.3.4 “Auto-Wake-up On Sync
Break Character”. By enabling this feature, the
EUSART will sample the next two transitions on
RX1/DT1, cause an RC1IF interrupt and receive the
next data byte followed by another interrupt.
Note that following a Break character, the user will
typically want to enable the Auto-Baud Rate Detect
feature. For both methods, the user can set the ABD bit
once the TX1IF interrupt is observed.
FIGURE 19-10: SEND BREAK CHARACTER SEQUENCE
Write to TXREG1
BRG Output
(Shift Clock)
Start bit bit 0 bit 1 bit 11 Stop bit
Break
TX1IF bit
(Transmit Buffer
Reg. Empty Flag)
TX1 (pin)
TRMT bit
(Transmit Shift
Reg. Empty Flag)
SENDB
(Transmit Shift
Reg. Empty Flag)
SENDB sampled here Auto-Cleared
Dummy Write
PIC18F87J72 FAMILY
DS39979A-page 254 Preliminary 2010 Microchip Technology Inc.
19.4 EUSART Synchronous
Master Mode
The Synchronous Master mode is entered by setting
the CSRC bit (TXSTA<7>). In this mode, the data is
transmitted in a half-duplex manner (i.e., transmission
and reception do not occur at the same time). When
transmitting data, the reception is inhibited and vice
versa. Synchronous mode is entered by setting bit,
SYNC (TXSTA<4>). In addition, enable bit, SPEN
(RCSTA1<7>), is set in order to configure the TX1 and
RX1 pins to CK1 (clock) and DT1 (data) lines,
respectively.
The Master mode indicates that the processor trans-
mits the master clock on the CK1 line. Clock polarity is
selected with the TXCKP bit (BAUDCON<4>). Setting
TXCKP sets the Idle state on CK1 as high, while clear-
ing the bit sets the Idle state as low. This option is
provided to support Microwire devices with this module.
19.4.1 EUSART SYNCHRONOUS MASTER
TRANSMISSION
The EUSART transmitter block diagram is shown in
Figure 19-3. The heart of the transmitter is the Transmit
(Serial) Shift register (TSR). The Shift register obtains
its data from the Read/Write Transmit Buffer register,
TXREG1. The TXREG1 register is loaded with data in
software. The TSR register is not loaded until the last
bit has been transmitted from the previous load. As
soon as the last bit is transmitted, the TSR is loaded
with new data from the TXREG1 (if available).
Once the TXREG1 register transfers the data to the
TSR register (occurs in one TCYCLE), the TXREG1 is
empty and the TX1IF flag bit (PIR1<4>) is set. The
interrupt can be enabled or disabled by setting or clear-
ing the interrupt enable bit, TX1IE (PIE1<4>). TX1IF is
set regardless of the state of enable bit, TX1IE; it can-
not be cleared in software. It will reset only when new
data is loaded into the TXREG1 register.
While flag bit, TX1IF, indicates the status of the TXREG1
register, another bit, TRMT (TXSTA<1>), shows the
status of the TSR register. TRMT is a read-only bit which
is set when the TSR is empty. No interrupt logic is tied to
this bit so the user has to poll this bit in order to deter-
mine if the TSR register is empty. The TSR is not
mapped in data memory so it is not available to the user.
To set up a Synchronous Master Transmission:
1. Initialize the SPBRGH1:SPBRG1 registers for
the appropriate baud rate. Set or clear the
BRG16 bit, as required, to achieve the desired
baud rate.
2. Enable the synchronous master serial port by
setting bits, SYNC, SPEN and CSRC.
3. If interrupts are desired, set enable bit, TX1IE.
4. If 9-bit transmission is desired, set bit, TX9.
5. Enable the transmission by setting bit, TXEN.
6. If 9-bit transmission is selected, the ninth bit
should be loaded in bit, TX9D.
7. Start transmission by loading data to the
TXREG1 register.
8. If using interrupts, ensure that the GIE and PEIE
bits in the INTCON register (INTCON<7:6>) are
set.
FIGURE 19-11: SYNCHRONOUS TRANSMISSION
bit 0 bit 1 bit 7
Word 1
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
bit 2 bit 0 bit 1 bit 7
RC7/RX1/DT1/SEG28
Write to
TXREG1 Reg
TX1IF bit
(Interrupt Flag)
TXEN bit 1 1
Word 2
TRMT bit
Write Word 1 Write Word 2
Note: Sync Master mode, SPBRG1 = 0; continuous transmission of two 8-bit words.
Pin
RC6/TX1/CK1/SEG27 pin
(TXCKP = 0)
(TXCKP = 1)
RC6/TX1/CK1/SEG27 pin
2010 Microchip Technology Inc. Preliminary DS39979A-page 255
PIC18F87J72 FAMILY
FIGURE 19-12: SYNCHRONOUS TRANSMISSION (THROUGH TXEN)
TABLE 19-7: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER TRANSMISSION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on Page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR1 ADIF RC1IF TX1IF SSPIF TMR2IF TMR1IF 52
PIE1 ADIE RC1IE TX1IE SSPIE TMR2IE TMR1IE 52
IPR1 ADIP RC1IP TX1IP SSPIP TMR2IP TMR1IP 52
RCSTA1 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51
TXREG1 EUSART Transmit Register 51
TXSTA1 CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51
BAUDCON1 ABDOVF RCMT RXDTP TXCKP BRG16 WUE ABDEN 53
SPBRGH1 EUSART Baud Rate Generator Register High Byte 53
SPBRG1 EUSART Baud Rate Generator Register Low Byte 51
LATG U2OD U1OD LATG4 LATG3 LATG2 LATG1 LATG0 52
Legend: — = unimplemented, read as 0’. Shaded cells are not used for synchronous master transmission.
RC7/RX1/DT1/SEG28 Pin
RC6/TX1/CK1/SEG27 Pin
Write to
TXREG1 Reg
TX1IF bit
TRMT bit
bit 0 bit 1 bit 2 bit 6 bit 7
TXEN bit
PIC18F87J72 FAMILY
DS39979A-page 256 Preliminary 2010 Microchip Technology Inc.
19.4.2 EUSART SYNCHRONOUS
MASTER RECEPTION
Once Synchronous mode is selected, reception is
enabled by setting either the Single Receive Enable bit,
SREN (RCSTA1<5>), or the Continuous Receive
Enable bit, CREN (RCSTA1<4>). Data is sampled on
the RX1 pin on the falling edge of the clock.
If enable bit, SREN, is set, only a single word is
received. If enable bit, CREN, is set, the reception is
continuous until CREN is cleared. If both bits are set,
then CREN takes precedence.
To set up a Synchronous Master Reception:
1. Initialize the SPBRGH1:SPBRG1 registers for the
appropriate baud rate. Set or clear the BRG16 bit,
as required, to achieve the desired baud rate.
2. Enable the synchronous master serial port by
setting bits, SYNC, SPEN and CSRC.
3. Ensure bits, CREN and SREN, are clear.
4. If interrupts are desired, set enable bit, RC1IE.
5. If 9-bit reception is desired, set bit, RX9.
6. If a single reception is required, set bit, SREN.
For continuous reception, set bit, CREN.
7. Interrupt flag bit, RC1IF, will be set when recep-
tion is complete and an interrupt will be generated
if the enable bit, RC1IE, was set.
8. Read the RCSTA1 register to get the 9th bit (if
enabled) and determine if any error occurred
during reception.
9. Read the 8-bit received data by reading the
RCREG1 register.
10. If any error occurred, clear the error by clearing
bit, CREN.
11. If using interrupts, ensure that the GIE and PEIE
bits in the INTCON register (INTCON<7:6>) are
set.
FIGURE 19-13: SYNCHRONOUS RECEPTION (MASTER MODE, SREN)
TABLE 19-8: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER RECEPTION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on Page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR1 ADIF RC1IF TX1IF SSPIF TMR2IF TMR1IF 52
PIE1 ADIE RC1IE TX1IE SSPIE TMR2IE TMR1IE 52
IPR1 ADIP RC1IP TX1IP SSPIP TMR2IP TMR1IP 52
RCSTA1 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51
RCREG1 EUSART Receive Register 51
TXSTA1 CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51
BAUDCON1 ABDOVF RCMT RXDTP TXCKP BRG16 WUE ABDEN 53
SPBRGH1 EUSART Baud Rate Generator Register High Byte 53
SPBRG1 EUSART Baud Rate Generator Register Low Byte 51
Legend: — = unimplemented, read as0’. Shaded cells are not used for synchronous master reception.
CREN bit
RC7/RX1/DT1/
RC6/TX1/CK1/SEG27
Write to
SREN bit
SREN bit
RC1IF bit
(Interrupt)
Read
RCREG1
Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4Q2 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
0
bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7
0
Q1 Q2 Q3 Q4
Note: Timing diagram demonstrates Sync Master mode with bit, SREN = 1, and bit, BRGH = 0.
RC6/TX1/CK1/SEG27
SEG28 pin
pin (TXCKP = 0)
pin (TXCKP = 1)
2010 Microchip Technology Inc. Preliminary DS39979A-page 257
PIC18F87J72 FAMILY
19.5 EUSART Synchronous Slave Mode
Synchronous Slave mode is entered by clearing bit,
CSRC (TXSTA<7>). This mode differs from the
Synchronous Master mode in that the shift clock is
supplied externally at the CK1 pin (instead of being
supplied internally in Master mode). This allows the
device to transfer or receive data while in any
low-power mode.
19.5.1 EUSART SYNCHRONOUS SLAVE
TRANSMIT
The operation of the Synchronous Master and Slave
modes are identical except in the case of Sleep mode.
If two words are written to the TXREG1 and then the
SLEEP instruction is executed, the following will occur:
a) The first word will immediately transfer to the
TSR register and transmit.
b) The second word will remain in the TXREG1
register.
c) Flag bit, TX1IF, will not be set.
d) When the first word has been shifted out of TSR,
the TXREG1 register will transfer the second
word to the TSR and flag bit, TX1IF, will now be
set.
e) If enable bit, TX1IE, is set, the interrupt will wake
the chip from Sleep. If the global interrupt is
enabled, the program will branch to the interrupt
vector.
To set up a Synchronous Slave Transmission:
1. Enable the synchronous slave serial port by
setting bits, SYNC and SPEN, and clearing bit,
CSRC.
2. Clear bits, CREN and SREN.
3. If interrupts are desired, set enable bit, TX1IE.
4. If 9-bit transmission is desired, set bit, TX9.
5. Enable the transmission by setting enable bit,
TXEN.
6. If 9-bit transmission is selected, the ninth bit
should be loaded in bit, TX9D.
7. Start transmission by loading data to the
TXREG1 register.
8. If using interrupts, ensure that the GIE and PEIE
bits in the INTCON register (INTCON<7:6>) are
set.
TABLE 19-9: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE TRANSMISSION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on Page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR1 ADIF RC1IF TX1IF SSPIF TMR2IF TMR1IF 52
PIE1 ADIE RC1IE TX1IE SSPIE TMR2IE TMR1IE 52
IPR1 ADIP RC1IP TX1IP SSPIP TMR2IP TMR1IP 52
RCSTA1 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51
TXREG1 EUSART Transmit Register 51
TXSTA1 CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51
BAUDCON1 ABDOVF RCMT RXDTP TXCKP BRG16 WUE ABDEN 53
SPBRGH1 EUSART Baud Rate Generator Register High Byte 53
SPBRG1 EUSART Baud Rate Generator Register Low Byte 51
LATG U2OD U1OD LATG4 LATG3 LATG2 LATG1 LATG0 52
Legend: — = unimplemented, read as 0’. Shaded cells are not used for synchronous slave transmission.
PIC18F87J72 FAMILY
DS39979A-page 258 Preliminary 2010 Microchip Technology Inc.
19.5.2 EUSART SYNCHRONOUS SLAVE
RECEPTION
The operation of the Synchronous Master and Slave
modes is identical except in the case of Sleep or any
Idle mode, and bit, SREN, which is a “don’t care” in
Slave mode.
If receive is enabled by setting the CREN bit prior to
entering Sleep or any Idle mode, then a word may be
received while in this low-power mode. Once the word
is received, the RSR register will transfer the data to the
RCREG1 register; if the RC1IE enable bit is set, the
interrupt generated will wake the chip from the
low-power mode. If the global interrupt is enabled, the
program will branch to the interrupt vector.
To set up a Synchronous Slave Reception:
1. Enable the synchronous master serial port by
setting bits, SYNC and SPEN, and clearing bit,
CSRC.
2. If interrupts are desired, set enable bit, RC1IE.
3. If 9-bit reception is desired, set bit, RX9.
4. To enable reception, set enable bit, CREN.
5. Flag bit, RC1IF, will be set when reception is
complete. An interrupt will be generated if
enable bit, RC1IE, was set.
6. Read the RCSTA1 register to get the 9th bit (if
enabled) and determine if any error occurred
during reception.
7. Read the 8-bit received data by reading the
RCREG1 register.
8. If any error occurred, clear the error by clearing
bit, CREN.
9. If using interrupts, ensure that the GIE and PEIE
bits in the INTCON register (INTCON<7:6>) are
set.
TABLE 19-10: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE RECEPTION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on Page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR1 ADIF RC1IF TX1IF SSPIF TMR2IF TMR1IF 52
PIE1 ADIE RC1IE TX1IE SSPIE TMR2IE TMR1IE 52
IPR1 ADIP RC1IP TX1IP SSPIP TMR2IP TMR1IP 52
RCSTA1 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51
RCREG1 EUSART Receive Register 51
TXSTA1 CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51
BAUDCON1 ABDOVF RCMT RXDTP TXCKP BRG16 WUE ABDEN 53
SPBRGH1 EUSART Baud Rate Generator Register High Byte 53
SPBRG1 EUSART Baud Rate Generator Register Low Byte 51
Legend: = unimplemented, read as ‘0’. Shaded cells are not used for synchronous slave reception.
2010 Microchip Technology Inc. Preliminary DS39979A-page 259
PIC18F87J72 FAMILY
20.0 ADDRESSABLE UNIVERSAL
SYNCHRONOUS
ASYNCHRONOUS RECEIVER
TRANSMITTER (AUSART)
The Addressable Universal Synchronous Asynchro-
nous Receiver Transmitter (AUSART) module is very
similar in function to the Enhanced USART module,
discussed in the previous chapter. It is provided as an
additional channel for serial communication with
external devices, for those situations that do not require
auto-baud detection or LIN/J2602 bus support.
The AUSART can be configured in the following modes:
Asynchronous (full-duplex)
Synchronous – Master (half-duplex)
Synchronous – Slave (half-duplex)
The pins of the AUSART module are multiplexed with
the functions of PORTG (RG1/TX2/CK2 and
RG2/RX2/DT2/VLCAP1, respectively). In order to
configure these pins as an AUSART:
PEN bit (RCSTA2<7>) must be set (= 1)
TXEN bit (TXSTA2<5>) must also be set (= 1) to
configure TX2/CK2 to transmit
TRISG<2> bit must be set (= 1)
TRISG<1> bit must be cleared (= 0) for
Asynchronous and Synchronous Master modes
TRISG<1> bit must be set (= 1) for Synchronous
Slave mode
The driver for the TX2 output pin can also be optionally
configured as an open-drain output. This feature allows
the voltage level on the pin to be pulled to a higher level
through an external pull-up resistor and allows the
output to communicate with external circuits without the
need for additional level shifters.
The open-drain output option is controlled by the U2OD
bit (LATG<7>). Setting the bit configures the pin for
open-drain operation.
20.1 Control Registers
The operation of the Addressable USART module is
controlled through two registers: TXSTA2 and
RXSTA2. These are detailed in Register 20-1 and
Register 20-2, respectively.
Note: The AUSART control will automatically
reconfigure the pin from input to output as
needed.
PIC18F87J72 FAMILY
DS39979A-page 260 Preliminary 2010 Microchip Technology Inc.
REGISTER 20-1: TXSTA2: AUSART TRANSMIT STATUS AND CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R-1 R/W-0
CSRC TX9 TXEN(1) SYNC BRGH TRMT TX9D
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 CSRC: Clock Source Select bit
Asynchronous mode:
Don’t care.
Synchronous mode:
1 = Master mode (clock generated internally from BRG)
0 = Slave mode (clock from external source)
bit 6 TX9: 9-Bit Transmit Enable bit
1 = Selects 9-bit transmission
0 = Selects 8-bit transmission
bit 5 TXEN: Transmit Enable bit(1)
1 = Transmit enabled
0 = Transmit disabled
bit 4 SYNC: AUSART Mode Select bit
1 = Synchronous mode
0 = Asynchronous mode
bit 3 Unimplemented: Read as0
bit 2 BRGH: High Baud Rate Select bit
Asynchronous mode:
1 = High speed
0 = Low speed
Synchronous mode:
Unused in this mode.
bit 1 TRMT: Transmit Shift Register Status bit
1 = TSR empty
0 = TSR full
bit 0 TX9D: 9th bit of Transmit Data
Can be address/data bit or a parity bit.
Note 1: SREN/CREN overrides TXEN in Sync mode.
2010 Microchip Technology Inc. Preliminary DS39979A-page 261
PIC18F87J72 FAMILY
REGISTER 20-2: RCSTA2: AUSART RECEIVE STATUS AND CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-0 R-0 R-x
SPEN RX9 SREN CREN ADDEN FERR OERR RX9D
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 SPEN: Serial Port Enable bit
1 = Serial port enabled (configures RX2/DT2 and TX2/CK2 pins as serial port pins; TXEN must also
be set to configure TX2/CK2 to transmit)
0 = Serial port disabled (held in Reset)
bit 6 RX9: 9-Bit Receive Enable bit
1 = Selects 9-bit reception
0 = Selects 8-bit reception
bit 5 SREN: Single Receive Enable bit
Asynchronous mode:
Don’t care.
Synchronous mode – Master:
1 = Enables single receive
0 = Disables single receive
This bit is cleared after reception is complete.
Synchronous mode – Slave:
Don’t care.
bit 4 CREN: Continuous Receive Enable bit
Asynchronous mode:
1 = Enables receiver
0 = Disables receiver
Synchronous mode:
1 = Enables continuous receive until enable bit, CREN, is cleared (CREN overrides SREN)
0 = Disables continuous receive
bit 3 ADDEN: Address Detect Enable bit
Asynchronous mode 9-bit (RX9 = 1):
1 = Enables address detection, enables interrupt and loads the receive buffer when RSR<8> is set
0 = Disables address detection, all bytes are received and ninth bit can be used as parity bit
Asynchronous mode 9-bit (RX9 = 0):
Don’t care.
bit 2 FERR: Framing Error bit
1 = Framing error (can be cleared by reading RCREG2 register and receiving next valid byte)
0 = No framing error
bit 1 OERR: Overrun Error bit
1 = Overrun error (can be cleared by clearing bit CREN)
0 = No overrun error
bit 0 RX9D: 9th bit of Received Data
This can be an address/data bit or a parity bit and must be calculated by user firmware.
PIC18F87J72 FAMILY
DS39979A-page 262 Preliminary 2010 Microchip Technology Inc.
20.2 AUSART Baud Rate Generator
(BRG)
The BRG is a dedicated, 8-bit generator that supports
both the Asynchronous and Synchronous modes of the
AUSART.
The SPBRG2 register controls the period of a
free-running timer. In Asynchronous mode, the BRGH
(TXSTA<2>) bit also controls the baud rate. In
Synchronous mode, BRGH is ignored. Table 20-1
shows the formula for computation of the baud rate for
different AUSART modes, which only apply in Master
mode (internally generated clock).
Given the desired baud rate and FOSC, the nearest
integer value for the SPBRG2 register can be calculated
using the formulas in Table 20-1. From this, the error in
baud rate can be determined. An example calculation is
shown in Example 20-1. Typical baud rates and error
values for the various Asynchronous modes are shown
in Table 20-2. It may be advantageous to use the high
baud rate (BRGH = 1) to reduce the baud rate error, or
achieve a slow baud rate for a fast oscillator frequency.
Writing a new value to the SPBRG2 register causes the
BRG timer to be reset (or cleared). This ensures the
BRG does not wait for a timer overflow before outputting
the new baud rate.
20.2.1 OPERATION IN POWER-MANAGED
MODES
The device clock is used to generate the desired baud
rate. When one of the power-managed modes is
entered, the new clock source may be operating at a
different frequency. This may require an adjustment to
the value in the SPBRG2 register.
20.2.2 SAMPLING
The data on the RX2 pin is sampled three times by a
majority detect circuit to determine if a high or a low
level is present on the RX2 pin.
TABLE 20-1: BAUD RATE FORMULAS
EXAMPLE 20-1: CALCULATING BAUD RATE ERROR
TABLE 20-2: REGISTERS ASSOCIATED WITH THE BAUD RATE GENERATOR
Configuration Bits
BRG/AUSART Mode Baud Rate Formula
SYNC BRGH
00 Asynchronous FOSC/[64 (n + 1)]
01 Asynchronous FOSC/[16 (n + 1)]
1x Synchronous FOSC/[4 (n + 1)]
Legend: x = Don’t care, n = Value of SPBRG2 register
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values on
Page
TXSTA2 CSRC TX9 TXEN SYNC —BRGHTRMT TX9D 54
RCSTA2 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 54
SPBRG2 AUSART Baud Rate Generator Register 54
Legend: Shaded cells are not used by the BRG.
For a device with FOSC of 16 MHz, desired baud rate of 9600, Asynchronous mode, BRGH = 0:
Desired Baud Rate = FOSC/(64 ([SPBRG2] + 1))
Solving for SPBRG2:
X = ((FOSC/Desired Baud Rate)/64) – 1
= ((16000000/9600)/64) – 1
= [25.042] = 25
Calculated Baud Rate=16000000/(64 (25 + 1))
= 9615
Error = (Calculated Baud Rate – Desired Baud Rate)/Desired Baud Rate
= (9615 – 9600)/9600 = 0.16%
2010 Microchip Technology Inc. Preliminary DS39979A-page 263
PIC18F87J72 FAMILY
TABLE 20-3: BAUD RATES FOR ASYNCHRONOUS MODES
BRGH = 0
FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 10.000 MHz FOSC = 8.000 MHz
BAUD
RATE
(K)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
0.3——————————
1.2 1.221 1.73 255 1.202 0.16 129 1.201 -0.16 103
2.4 2.441 1.73 255 2.404 0.16 129 2.404 0.16 64 2.403 -0.16 51
9.6 9.615 0.16 64 9.766 1.73 31 9.766 1.73 15 9.615 -0.16 12
19.2 19.531 1.73 31 19.531 1.73 15 19.531 1.73 7
57.6 56.818 -1.36 10 62.500 8.51 4 52.083 -9.58 2
115.2 125.000 8.51 4 104.167 -9.58 2 78.125 -32.18 1
BRGH = 0
FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz
BAUD
RATE
(K)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
0.3 0.300 0.16 207 0.300 -0.16 103 0.300 -0.16 51
1.2 1.202 0.16 51 1.201 -0.16 25 1.201 -0.16 12
2.4 2.404 0.16 25 2.403 -0.16 12
9.6 8.929 -6.99 6
19.2 20.833 8.51 2
57.6 62.500 8.51 0
115.2 62.500 -45.75 0
BAUD
RATE
(K)
BRGH = 1
FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 10.000 MHz FOSC = 8.000 MHz
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
0.3——————————
1.2——————————
2.4 2.441 1.73 255 2.403 -0.16 207
9.6 9.766 1.73 255 9.615 0.16 129 9.615 0.16 64 9.615 -0.16 51
19.2 19.231 0.16 129 19.231 0.16 64 19.531 1.73 31 19.230 -0.16 25
57.6 58.140 0.94 42 56.818 -1.36 21 56.818 -1.36 10 55.555 3.55 8
115.2 113.636 -1.36 21 113.636 -1.36 10 125.000 8.51 4
BAUD
RATE
(K)
BRGH = 1
FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
Actual
Rate
(K)
%
Error
SPBRG
value
(decimal)
0.3 0.300 -0.16 207
1.2 1.202 0.16 207 1.201 -0.16 103 1.201 -0.16 51
2.4 2.404 0.16 103 2.403 -0.16 51 2.403 -0.16 25
9.6 9.615 0.16 25 9.615 -0.16 12
19.2 19.231 0.16 12
57.6 62.500 8.51 3
115.2 125.000 8.51 1
PIC18F87J72 FAMILY
DS39979A-page 264 Preliminary 2010 Microchip Technology Inc.
20.3 AUSART Asynchronous Mode
The Asynchronous mode of operation is selected by
clearing the SYNC bit (TXSTA2<4>). In this mode, the
AUSART uses standard Non-Return-to-Zero (NRZ)
format (one Start bit, eight or nine data bits and one
Stop bit). The most common data format is 8 bits. An
on-chip, dedicated, 8-bit Baud Rate Generator can be
used to derive standard baud rate frequencies from the
oscillator.
The AUSART transmits and receives the LSb first. The
AUSART’s transmitter and receiver are functionally
independent but use the same data format and baud
rate. The Baud Rate Generator produces a clock,
either x16 or x64 of the bit shift rate, depending on the
BRGH bit (TXSTA2<2>). Parity is not supported by the
hardware but can be implemented in software and
stored as the 9th data bit.
When operating in Asynchronous mode, the AUSART
module consists of the following important elements:
Baud Rate Generator
Sampling Circuit
Asynchronous Transmitter
Asynchronous Receiver
20.3.1 AUSART ASYNCHRONOUS
TRANSMITTER
The AUSART transmitter block diagram is shown in
Figure 20-1. The heart of the transmitter is the Transmit
(Serial) Shift register (TSR). The Shift register obtains
its data from the Read/Write Transmit Buffer register,
TXREG2. The TXREG2 register is loaded with data in
software. The TSR register is not loaded until the Stop
bit has been transmitted from the previous load. As
soon as the Stop bit is transmitted, the TSR is loaded
with new data from the TXREG2 register (if available).
Once the TXREG2 register transfers the data to the
TSR register (occurs in one T
CY), the TXREG2 register
is empty and the TX2IF flag bit (PIR3<4>) is set. This
interrupt can be enabled or disabled by setting or
clearing the interrupt enable bit, TX2IE (PIE3<4>).
TX2IF will be set regardless of the state of TX2IE; it
cannot be cleared in software. TX2IF is also not
cleared immediately upon loading TXREG2, but
becomes valid in the second instruction cycle following
the load instruction. Polling TX2IF immediately
following a load of TXREG2 will return invalid results.
While TX2IF indicates the status of the TXREG2
register, another bit, TRMT (TXSTA2<1>), shows the
status of the TSR register. TRMT is a read-only bit
which is set when the TSR register is empty. No inter-
rupt logic is tied to this bit so the user has to poll this bit
in order to determine if the TSR register is empty.
To set up an Asynchronous Transmission:
1. Initialize the SPBRG2 register for the appropriate
baud rate. Set or clear the BRGH bit, as required,
to achieve the desired baud rate.
2. Enable the asynchronous serial port by clearing
bit, SYNC, and setting bit, SPEN.
3. If interrupts are desired, set enable bit, TX2IE.
4. If 9-bit transmission is desired, set transmit bit,
TX9. Can be used as address/data bit.
5. Enable the transmission by setting bit, TXEN,
which will also set bit, TX2IF.
6. If 9-bit transmission is selected, the ninth bit
should be loaded in bit, TX9D.
7. Load data to the TXREG2 register (starts
transmission).
8. If using interrupts, ensure that the GIE and PEIE
bits in the INTCON register (INTCON<7:6>) are
set.
FIGURE 20-1: AUSART TRANSMIT BLOCK DIAGRAM
Note 1: The TSR register is not mapped in data
memory so it is not available to the user.
2: Flag bit, TX2IF, is set when enable bit,
TXEN, is set.
TX2IF
TX2IE
Interrupt
TXEN Baud Rate CLK
SPBRG2
Baud Rate Generator
TX9D
MSb LSb
Data Bus
TXREG2 Register
TSR Register
(8) 0
TX9
TRMT SPEN
TX2 Pin
Pin Buffer
and Control
8

2010 Microchip Technology Inc. Preliminary DS39979A-page 265
PIC18F87J72 FAMILY
FIGURE 20-2: ASYNCHRONOUS TRANSMISSION
FIGURE 20-3: ASYNCHRONOUS TRANSMISSION (BACK TO BACK)
TABLE 20-4: REGISTERS ASSOCIATED WITH ASYNCHRONOUS TRANSMISSION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on Page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR3 LCDIF RC2IF TX2IF CTMUIF CCP2IF CCP1IF RTCCIF 52
PIE3 LCDIE RC2IE TX2IE CTMUIE CCP2IE CCP1IE RTCCIE 52
IPR3 LCDIP RC2IP TX2IP CTMUIP CCP2IP CCP1IP RTCCIP 52
RCSTA2 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 54
TXREG2 AUSART Transmit Register 54
TXSTA2 CSRC TX9 TXEN SYNC BRGH TRMT TX9D 54
SPBRG2 AUSART Baud Rate Generator Register 54
LATG U2OD U1OD LATG4 LATG3 LATG2 LATG1 LATG0 52
Legend: — = unimplemented locations read as 0’. Shaded cells are not used for asynchronous transmission.
Word 1
Word 1
Transmit Shift Reg
Start bit bit 0 bit 1 bit 7/8
Write to TXREG2
BRG Output
(Shift Clock)
TX2 (pin)
TX2IF bit
(Transmit Buffer
Reg. Empty Flag)
TRMT bit
(Transmit Shift
Reg. Empty Flag)
1 TCY
Word 1
Stop bit
Transmit Shift Reg.
Write to TXREG2
BRG Output
(Shift Clock)
TX2 (pin)
TX2IF bit
(Interrupt Reg. Flag)
TRMT bit
(Transmit Shift
Reg. Empty Flag)
Word 1 Word 2
Word 1 Word 2
Stop bit Start bit
Transmit Shift Reg.
Word 1 Word 2
bit 0 bit 1 bit 7/8 bit 0
Note: This timing diagram shows two consecutive transmissions.
1 TCY
1 TCY
Start bit
PIC18F87J72 FAMILY
DS39979A-page 266 Preliminary 2010 Microchip Technology Inc.
20.3.2 AUSART ASYNCHRONOUS
RECEIVER
The receiver block diagram is shown in Figure 20-4.
The data is received on the RX2 pin and drives the data
recovery block. The data recovery block is actually a
high-speed shifter operating at x16 times the baud rate,
whereas the main receive serial shifter operates at the
bit rate or at FOSC. This mode would typically be used
in RS-232 systems.
To set up an Asynchronous Reception:
1. Initialize the SPBRG2 register for the appropriate
baud rate. Set or clear the BRGH bit, as required,
to achieve the desired baud rate.
2. Enable the asynchronous serial port by clearing
bit, SYNC, and setting bit, SPEN.
3. If interrupts are desired, set enable bit, RC2IE.
4. If 9-bit reception is desired, set bit, RX9.
5. Enable the reception by setting bit, CREN.
6. Flag bit, RC2IF, will be set when reception is
complete and an interrupt will be generated if
enable bit, RC2IE, was set.
7. Read the RCSTA2 register to get the 9th bit (if
enabled) and determine if any error occurred
during reception.
8. Read the 8-bit received data by reading the
RCREG2 register.
9. If any error occurred, clear the error by clearing
enable bit, CREN.
10. If using interrupts, ensure that the GIE and PEIE
bits in the INTCON register (INTCON<7:6>) are
set.
20.3.3 SETTING UP 9-BIT MODE WITH
ADDRESS DETECT
This mode would typically be used in RS-485 systems.
To set up an Asynchronous Reception with Address
Detect Enable:
1. Initialize the SPBRG2 register for the appropriate
baud rate. Set or clear the BRGH and BRG16
bits, as required, to achieve the desired baud
rate.
2. Enable the asynchronous serial port by clearing
the SYNC bit and setting the SPEN bit.
3. If interrupts are required, set the RCEN bit and
select the desired priority level with the RC2IP
bit.
4. Set the RX9 bit to enable 9-bit reception.
5. Set the ADDEN bit to enable address detect.
6. Enable reception by setting the CREN bit.
7. The RC2IF bit will be set when reception is
complete. The interrupt will be Acknowledged if
the RC2IE and GIE bits are set.
8. Read the RCSTA2 register to determine if any
error occurred during reception, as well as read
bit 9 of data (if applicable).
9. Read RCREG2 to determine if the device is
being addressed.
10. If any error occurred, clear the CREN bit.
11. If the device has been addressed, clear the
ADDEN bit to allow all received data into the
receive buffer and interrupt the CPU.
FIGURE 20-4: AUSART RECEIVE BLOCK DIAGRAM
x64 Baud Rate CLK
Baud Rate Generator
RX2 Pin
Pin Buffer
and Control
SPEN
Data
Recovery
CREN OERR FERR
RSR Register
MSb LSb
RX9D RCREG2 Register
FIFO
Interrupt RC2IF
RC2IE
Data Bus
8
64
16
or
Stop Start
(8) 7 1 0
RX9

SPBRG2
or
4
2010 Microchip Technology Inc. Preliminary DS39979A-page 267
PIC18F87J72 FAMILY
FIGURE 20-5: ASYNCHRONOUS RECEPTION
TABLE 20-5: REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on Page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR3 LCDIF RC2IF TX2IF CTMUIF CCP2IF CCP1IF RTCCIF 52
PIE3 LCDIE RC2IE TX2IE CTMUIE CCP2IE CCP1IE RTCCIE 52
IPR3 LCDIP RC2IP TX2IP CTMUIP CCP2IP CCP1IP RTCCIP 52
RCSTA2 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 54
RCREG2 AUSART Receive Register 54
TXSTA2 CSRC TX9 TXEN SYNC —BRGHTRMT TX9D 54
SPBRG2 AUSART Baud Rate Generator Register 54
Legend: — = unimplemented locations read as 0’. Shaded cells are not used for asynchronous reception.
Start
bit bit 7/8
bit 1bit 0 bit 7/8 bit 0Stop
bit
Start
bit
Start
bit
bit 7/8 Stop
bit
RX2 (pin)
Rcv Buffer Reg
Rcv Shift Reg
Read Rcv
Buffer Reg
RCREG2
RC2IF
(Interrupt Flag)
OERR bit
CREN
Word 1
RCREG2
Word 2
RCREG2
Stop
bit
Note: This timing diagram shows three words appearing on the RX2 input. The RCREG2 (Receive Buffer register) is read after the third word
causing the OERR (Overrun) bit to be set.
PIC18F87J72 FAMILY
DS39979A-page 268 Preliminary 2010 Microchip Technology Inc.
20.4 AUSART Synchronous
Master Mode
The Synchronous Master mode is entered by setting
the CSRC bit (TXSTA2<7>). In this mode, the data is
transmitted in a half-duplex manner (i.e., transmission
and reception do not occur at the same time). When
transmitting data, the reception is inhibited and vice
versa. Synchronous mode is entered by setting bit,
SYNC (TXSTA2<4>). In addition, enable bit, SPEN
(RCSTA2<7>), is set in order to configure the TX2 and
RX2 pins to CK2 (clock) and DT2 (data) lines,
respectively.
The Master mode indicates that the processor transmits
the master clock on the CK2 line.
20.4.1 AUSART SYNCHRONOUS MASTER
TRANSMISSION
The AUSART transmitter block diagram is shown in
Figure 20-1. The heart of the transmitter is the Transmit
(Serial) Shift register (TSR). The Shift register obtains
its data from the Read/Write Transmit Buffer register:
TXREG2. The TXREG2 register is loaded with data in
software. The TSR register is not loaded until the last
bit has been transmitted from the previous load. As
soon as the last bit is transmitted, the TSR is loaded
with new data from the TXREG2 (if available).
Once the TXREG2 register transfers the data to the
TSR register (occurs in one TCYCLE), the TXREG2 is
empty and the TX2IF flag bit (PIR3<4>) is set. The
interrupt can be enabled or disabled by setting or clear-
ing the interrupt enable bit, TX2IE (PIE3<4>). TX2IF is
set regardless of the state of enable bit, TX2IE; it
cannot be cleared in software. It will reset only when
new data is loaded into the TXREG2 register.
While flag bit, TX2IF, indicates the status of the TXREG2
register, another bit, TRMT (TXSTA2<1>), shows the
status of the TSR register. TRMT is a read-only bit which
is set when the TSR is empty. No interrupt logic is tied to
this bit so the user has to poll this bit in order to deter-
mine if the TSR register is empty. The TSR is not
mapped in data memory so it is not available to the user.
To set up a Synchronous Master Transmission:
1. Initialize the SPBRG2 register for the appropriate
baud rate.
2. Enable the synchronous master serial port by
setting bits, SYNC, SPEN and CSRC.
3. If interrupts are desired, set enable bit, TX2IE.
4. If 9-bit transmission is desired, set bit, TX9.
5. Enable the transmission by setting bit, TXEN.
6. If 9-bit transmission is selected, the ninth bit
should be loaded in bit, TX9D.
7. Start transmission by loading data to the
TXREG2 register.
8. If using interrupts, ensure that the GIE and PEIE
bits in the INTCON register (INTCON<7:6>) are
set.
FIGURE 20-6: SYNCHRONOUS TRANSMISSION
bit 0 bit 1 bit 7
Word 1
Q1 Q2 Q3Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
bit 2 bit 0 bit 1 bit 7
RX2/DT2 pin
TX2/CK2 pin
Write to
TXREG2 Reg
TX2IF bit
(Interrupt Flag)
TXEN bit 1 1
Word 2
TRMT bit
Write Word 1 Write Word 2
Note: Sync Master mode, SPBRG2 = 0; continuous transmission of two 8-bit words.
2010 Microchip Technology Inc. Preliminary DS39979A-page 269
PIC18F87J72 FAMILY
FIGURE 20-7: SYNCHRONOUS TRANSMISSION (THROUGH TXEN)
TABLE 20-6: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER TRANSMISSION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on Page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR3 LCDIF RC2IF TX2IF CTMUIF CCP2IF CCP1IF RTCCIF 52
PIE3 LCDIE RC2IE TX2IE CTMUIE CCP2IE CCP1IE RTCCIE 52
IPR3 LCDIP RC2IP TX2IP CTMUIP CCP2IP CCP1IP RTCCIP 52
RCSTA2 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 54
TXREG2 AUSART Transmit Register 54
TXSTA2 CSRC TX9 TXEN SYNC BRGH TRMT TX9D 54
SPBRG2 AUSART Baud Rate Generator Register 54
LATG U2OD U1OD LATG4 LATG3 LATG2 LATG1 LATG0 52
Legend: — = unimplemented, read as 0’. Shaded cells are not used for synchronous master transmission.
RX2/DT2 Pin
TX2/CK2 Pin
Write to
TXREG2 Reg
TX2IF bit
TRMT bit
bit 0 bit 1 bit 2 bit 6 bit 7
TXEN bit
PIC18F87J72 FAMILY
DS39979A-page 270 Preliminary 2010 Microchip Technology Inc.
20.4.2 AUSART SYNCHRONOUS
MASTER RECEPTION
Once Synchronous mode is selected, reception is
enabled by setting either the Single Receive Enable bit,
SREN (RCSTA2<5>), or the Continuous Receive
Enable bit, CREN (RCSTA2<4>). Data is sampled on
the RX2 pin on the falling edge of the clock.
If enable bit, SREN, is set, only a single word is
received. If enable bit, CREN, is set, the reception is
continuous until CREN is cleared. If both bits are set,
then CREN takes precedence.
To set up a Synchronous Master Reception:
1. Initialize the SPBRG2 register for the appropriate
baud rate.
2. Enable the synchronous master serial port by
setting bits, SYNC, SPEN and CSRC.
3. Ensure bits, CREN and SREN, are clear.
4. If interrupts are desired, set enable bit, RC2IE.
5. If 9-bit reception is desired, set bit, RX9.
6. If a single reception is required, set bit, SREN.
For continuous reception, set bit, CREN.
7. Interrupt flag bit, RC2IF, will be set when recep-
tion is complete and an interrupt will be generated
if the enable bit, RC2IE, was set.
8. Read the RCSTA2 register to get the 9th bit (if
enabled) and determine if any error occurred
during reception.
9. Read the 8-bit received data by reading the
RCREG2 register.
10. If any error occurred, clear the error by clearing
bit, CREN.
11. If using interrupts, ensure that the GIE and PEIE
bits in the INTCON register (INTCON<7:6>) are
set.
FIGURE 20-8: SYNCHRONOUS RECEPTION (MASTER MODE, SREN)
TABLE 20-7: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER RECEPTION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on Page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR3 LCDIF RC2IF TX2IF CTMUIF CCP2IF CCP1IF RTCCIF 52
PIE3 LCDIE RC2IE TX2IE CTMUIE CCP2IE CCP1IE RTCCIE 52
IPR3 LCDIP RC2IP TX2IP CTMUIP CCP2IP CCP1IP RTCCIP 52
RCSTA2 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 54
RCREG2 AUSART Receive Register 54
TXSTA2 CSRC TX9 TXEN SYNC BRGH TRMT TX9D 54
SPBRG2 AUSART Baud Rate Generator Register 54
Legend: — = unimplemented, read as0’. Shaded cells are not used for synchronous master reception.
CREN bit
RX2/DT2 pin
TX2/CK2 pin
Write to
bit SREN
SREN bit
RC2IF bit
(Interrupt)
Read
RCREG2
Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4Q2 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
0
bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7
0
Q1 Q2 Q3 Q4
Note: Timing diagram demonstrates Sync Master mode with bit SREN = 1 and bit BRGH = 0.
2010 Microchip Technology Inc. Preliminary DS39979A-page 271
PIC18F87J72 FAMILY
20.5 AUSART Synchronous Slave Mode
Synchronous Slave mode is entered by clearing bit,
CSRC (TXSTA2<7>). This mode differs from the
Synchronous Master mode in that the shift clock is
supplied externally at the CK2 pin (instead of being
supplied internally in Master mode). This allows the
device to transfer or receive data while in any
low-power mode.
20.5.1 AUSART SYNCHRONOUS
SLAVE TRANSMIT
The operation of the Synchronous Master and Slave
modes are identical except in the case of the Sleep
mode.
If two words are written to the TXREG2 and then the
SLEEP instruction is executed, the following will occur:
a) The first word will immediately transfer to the
TSR register and transmit.
b) The second word will remain in the TXREG2
register.
c) Flag bit, TX2IF, will not be set.
d) When the first word has been shifted out of TSR,
the TXREG2 register will transfer the second
word to the TSR and flag bit, TX2IF, will now be
set.
e) If enable bit, TX2IE, is set, the interrupt will wake
the chip from Sleep. If the global interrupt is
enabled, the program will branch to the interrupt
vector.
To set up a Synchronous Slave Transmission:
1. Enable the synchronous slave serial port by
setting bits, SYNC and SPEN, and clearing bit,
CSRC.
2. Clear bits, CREN and SREN.
3. If interrupts are desired, set enable bit, TX2IE.
4. If 9-bit transmission is desired, set bit, TX9.
5. Enable the transmission by setting enable bit,
TXEN.
6. If 9-bit transmission is selected, the ninth bit
should be loaded in bit, TX9D.
7. Start transmission by loading data to the
TXREG2 register.
8. If using interrupts, ensure that the GIE and PEIE
bits in the INTCON register (INTCON<7:6>) are
set.
TABLE 20-8: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE TRANSMISSION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on Page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR3 LCDIF RC2IF TX2IF CTMUIF CCP2IF CCP1IF RTCCIF 52
PIE3 LCDIE RC2IE TX2IE CTMUIE CCP2IE CCP1IE RTCCIE 52
IPR3 LCDIP RC2IP TX2IP CTMUIP CCP2IP CCP1IP RTCCIP 52
RCSTA2 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 54
TXREG2 AUSART Transmit Register 54
TXSTA2 CSRC TX9 TXEN SYNC BRGH TRMT TX9D 54
SPBRG2 AUSART Baud Rate Generator Register 54
LATG U2OD U1OD LATG4 LATG3 LATG2 LATG1 LATG0 52
Legend: — = unimplemented, read as 0’. Shaded cells are not used for synchronous slave transmission.
PIC18F87J72 FAMILY
DS39979A-page 272 Preliminary 2010 Microchip Technology Inc.
20.5.2 AUSART SYNCHRONOUS
SLAVE RECEPTION
The operation of the Synchronous Master and Slave
modes is identical except in the case of Sleep or any
Idle mode, and bit SREN, which is a “don’t care” in
Slave mode.
If receive is enabled by setting the CREN bit prior to
entering Sleep, or any Idle mode, then a word may be
received while in this low-power mode. Once the word
is received, the RSR register will transfer the data to the
RCREG2 register; if the RC2IE enable bit is set, the
interrupt generated will wake the chip from low-power
mode. If the global interrupt is enabled, the program will
branch to the interrupt vector.
To set up a Synchronous Slave Reception:
1. Enable the synchronous master serial port by
setting bits, SYNC and SPEN, and clearing bit,
CSRC.
2. If interrupts are desired, set enable bit, RC2IE.
3. If 9-bit reception is desired, set bit, RX9.
4. To enable reception, set enable bit, CREN.
5. Flag bit, RC2IF, will be set when reception is
complete. An interrupt will be generated if
enable bit, RC2IE, was set.
6. Read the RCSTA2 register to get the 9th bit (if
enabled) and determine if any error occurred
during reception.
7. Read the 8-bit received data by reading the
RCREG2 register.
8. If any error occurred, clear the error by clearing
bit, CREN.
9. If using interrupts, ensure that the GIE and PEIE
bits in the INTCON register (INTCON<7:6>) are
set.
TABLE 20-9: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE RECEPTION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on Page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR3 LCDIF RC2IF TX2IF CTMUIF CCP2IF CCP1IF RTCCIF 52
PIE3 LCDIE RC2IE TX2IE CTMUIE CCP2IE CCP1IE RTCCIE 52
IPR3 LCDIP RC2IP TX2IP CTMUIP CCP2IP CCP1IP RTCCIP 52
RCSTA2 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 54
RCREG2 AUSART Receive Register 54
TXSTA2 CSRC TX9 TXEN SYNC BRGH TRMT TX9D 54
SPBRG2 AUSART Baud Rate Generator Register 54
Legend: = unimplemented, read as ‘0’. Shaded cells are not used for synchronous slave reception.
2010 Microchip Technology Inc. Preliminary DS39979A-page 273
PIC18F87J72 FAMILY
21.0 12-BIT ANALOG-TO-DIGITAL
CONVERTER (A/D) MODULE
The Analog-to-Digital (A/D) Converter module has
12 inputs for all PIC18F87J72 family devices. This
module allows conversion of an analog input signal to
a corresponding 12-bit digital number.
The module has these registers:
A/D Result High Register (ADRESH)
A/D Result Low Register (ADRESL)
A/D Control Register 0 (ADCON0)
A/D Control Register 1 (ADCON1)
A/D Control Register 2 (ADCON2)
The ADCON0 register, shown in Register 21-1,
controls the operation of the A/D module. The
ADCON1 register, shown in Register 21-2, configures
the functions of the port pins. The ADCON2 register,
shown in Register 21-3, configures the A/D clock
source, programmed acquisition time and justification.
REGISTER 21-1: ADCON0: A/D CONTROL REGISTER 0
R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ADCAL CHS3 CHS2 CHS1 CHS0 GO/DONE ADON
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 ADCAL: A/D Calibration bit
1 = Calibration is performed on the next A/D conversion
0 = Normal A/D Converter operation (no calibration is performed)
bit 6 Unimplemented: Read as ‘0
bit 5-2 CHS<3:0>: Analog Channel Select bits
0000 = Channel 00 (AN0)
0001 = Channel 01 (AN1)
0010 = Channel 02 (AN2)
0011 = Channel 03 (AN3)
0100 = Channel 04 (AN4)
0101 = Channel 05 (AN5)
0110 = Channel 06 (AN6)
0111 = Channel 07 (AN7)
1000 = Channel 08 (AN8)
1001 = Channel 09 (AN9)
1010 = Channel 10 (AN10)
1011 = Channel 11 (AN11)
11xx = Unused
bit 1 GO/DONE: A/D Conversion Status bit
When ADON = 1:
1 = A/D conversion is in progress
0 = A/D is Idle
bit 0 ADON: A/D On bit
1 = A/D Converter module is enabled
0 = A/D Converter module is disabled
PIC18F87J72 FAMILY
DS39979A-page 274 Preliminary 2010 Microchip Technology Inc.
REGISTER 21-2: ADCON1: A/D CONTROL REGISTER 1
R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
TRIGSEL VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 TRIGSEL: Special Trigger Select bit
1 = Selects the special trigger from the CTMU
0 = Selects the special trigger from the CCP2
bit 6 Unimplemented: Read as ‘0
bit 5 VCFG1: Voltage Reference Configuration bit (VREF- source)
1 =V
REF- (AN2)
0 =AV
SS
bit 4 VCFG0: Voltage Reference Configuration bit (VREF+ source)
1 =VREF+ (AN3)
0 =AV
DD
bit 3-0 PCFG<3:0>: A/D Port Configuration Control bits:
A = Analog input D = Digital I/O
PCFG<3:0> AN11 AN10 AN9 AN8 AN7 AN6 AN5 AN4 AN3 AN2 AN1 AN0
0000 AAAAAAAAAAAA
0001 AAAAAAAAAAAA
0010 AAAAAAAAAAAA
0011 AAAAAAAAAAAA
0100 DAAAAAAAAAAA
0101 DDAAAAAAAAAA
0110 DDDAAAAAAAAA
0111 DDDDAAAAAAAA
1000 DDDDDAAAAAAA
1001 DDDDDDAAAAAA
1010 DDDDDDDAAAAA
1011 DDDDDDDDAAAA
1100 DDDDDDDDDAAA
1101 DDDDDDDDDDAA
1110 DDDDDDDDDDDA
1111 DDDDDDDDDDDD
2010 Microchip Technology Inc. Preliminary DS39979A-page 275
PIC18F87J72 FAMILY
REGISTER 21-3: ADCON2: A/D CONTROL REGISTER 2
R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ADFM ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 ADFM: A/D Result Format Select bit
1 = Right justified
0 = Left justified
bit 6 Unimplemented: Read as ‘0
bit 5-3 ACQT<2:0>: A/D Acquisition Time Select bits
111 = 20 T
AD
110 = 16 TAD
101 = 12 TAD
100 = 8 TAD
011 = 6 TAD
010 = 4 TAD
001 = 2 TAD
000 = 0 TAD(1)
bit 2-0 ADCS<2:0>: A/D Conversion Clock Select bits
111 = FRC (clock derived from A/D RC oscillator)(1)
110 = FOSC/64
101 = FOSC/16
100 = FOSC/4
011 = FRC (clock derived from A/D RC oscillator)(1)
010 = FOSC/32
001 = FOSC/8
000 = FOSC/2
Note 1: If the A/D FRC clock source is selected, a delay of one TCY (instruction cycle) is added before the A/D
clock starts. This allows the SLEEP instruction to be executed before starting a conversion.
PIC18F87J72 FAMILY
DS39979A-page 276 Preliminary 2010 Microchip Technology Inc.
The analog reference voltage is software selectable to
either the device’s positive and negative supply voltage
(AVDD and AVSS) or the voltage level on the RA3/AN3/
VREF+ and RA2/AN2/VREF- pins.
The A/D Converter has a unique feature of being able
to operate while the device is in Sleep mode. To
operate in Sleep, the A/D conversion clock must be
derived from the A/D’s internal RC oscillator.
The output of the sample and hold is the input into the
converter, which generates the result via successive
approximation.
Each port pin associated with the A/D Converter can be
configured as an analog input or as a digital I/O. The
ADRESH and ADRESL registers contain the result of the
A/D conversion. When the A/D conversion is complete,
the result is loaded into the ADRESH:ADRESL register
pair, the GO/DONE bit (ADCON0<1>) is cleared and the
A/D Interrupt Flag bit, ADIF, is set.
A device Reset forces all registers to their Reset state.
This forces the A/D module to be turned off and any
conversion in progress is aborted. The value in the
ADRESH:ADRESL register pair is not modified for a
Power-on Reset. These registers will contain unknown
data after a Power-on Reset.
The block diagram of the A/D module is shown in
Figure 21-1.
FIGURE 21-1: A/D BLOCK DIAGRAM(1,2)
(Input Voltage)
VAIN
VREF+
Reference
Voltage
AVDD
VCFG<1:0>
CHS<3:0>
AN7
AN6
AN4
AN3
AN2
AN1
AN0
0111
0110
0100
0011
0010
0001
0000
12-Bit
A/D
VREF-
AVSS
Converter
AN11
AN10
AN9
AN8
1011
1010
1001
1000
Note 1: Channels, AN15 through AN12, are not available on PIC18F87J62 devices.
2: I/O pins have diode protection to VDD and VSS.
AN5
0101
2010 Microchip Technology Inc. Preliminary DS39979A-page 277
PIC18F87J72 FAMILY
After the A/D module has been configured as desired,
the selected channel must be acquired before the
conversion is started. The analog input channels must
have their corresponding TRIS bits selected as inputs.
To determine acquisition time, see Section 21.1 “A/D
Acquisition Requirements”. After this acquisition
time has elapsed, the A/D conversion can be started.
An acquisition time can be programmed to occur
between setting the GO/DONE bit and the actual start
of the conversion.
The following steps should be followed to do an A/D
conversion:
1. Configure the A/D module:
Configure analog pins, voltage reference and
digital I/O (ADCON1)
Select A/D input channel (ADCON0)
Select A/D acquisition time (ADCON2)
Select A/D conversion clock (ADCON2)
Turn on A/D module (ADCON0)
2. Configure A/D interrupt (if desired):
Clear ADIF bit
Set ADIE bit
Set GIE bit
3. Wait the required acquisition time (if required).
4. Start conversion:
Set GO/DONE bit (ADCON0<1>)
5. Wait for A/D conversion to complete, by either:
Polling for the GO/DONE bit to be cleared
OR
Waiting for the A/D interrupt
6. Read A/D Result registers (ADRESH:ADRESL);
clear ADIF bit, if required.
7. For next conversion, go to step 1 or step 2, as
required. The A/D conversion time per bit is
defined as T
AD. A minimum wait of 2 TAD is
required before the next acquisition starts.
FIGURE 21-2: ANALOG INPUT MODEL
VAIN CPIN
RSANx
5 pF
VDD
VT = 0.6V
VT = 0.6V ILEAKAGE
RIC 1k
Sampling
Switch
SS RSS
CHOLD = 25 pF
VSS
Sampling Switch
1234
(k)
VDD
±100 nA
Legend: CPIN
VT
ILEAKAGE
RIC
SS
CHOLD
= Input Capacitance
= Threshold Voltage
= Leakage Current at the pin due to
= Interconnect Resistance
= Sampling Switch
= Sample/Hold Capacitance (from DAC)
various junctions
= Sampling Switch ResistanceRSS
PIC18F87J72 FAMILY
DS39979A-page 278 Preliminary 2010 Microchip Technology Inc.
21.1 A/D Acquisition Requirements
For the A/D Converter to meet its specified accuracy,
the Charge Holding Capacitor (CHOLD) must be
allowed to fully charge to the input channel voltage
level. The analog input model is shown in Figure 21-2.
The source impedance (RS) and the internal sampling
switch (RSS) impedance directly affect the time
required to charge the capacitor, CHOLD. The sampling
switch (RSS) impedance varies over the device voltage
(VDD). The source impedance affects the offset voltage
at the analog input (due to pin leakage current). The
maximum recommended impedance for analog
sources is 2.5 k. After the analog input channel is
selected (changed), the channel must be sampled for
at least the minimum acquisition time before starting a
conversion.
To calculate the minimum acquisition time,
Equation 21-1 may be used. This equation assumes
that 1/2 LSb error is used (1,024 steps for the A/D). The
1/2 LSb error is the maximum error allowed for the A/D
to meet its specified resolution.
Equation 21-3 shows the calculation of the minimum
required acquisition time, T
ACQ. This calculation is
based on the following application system
assumptions:
EQUATION 21-1: ACQUISITION TIME
EQUATION 21-2: A/D MINIMUM CHARGING TIME
EQUATION 21-3: CALCULATING THE MINIMUM REQUIRED ACQUISITION TIME
Note: When the conversion is started, the
holding capacitor is disconnected from the
input pin.
CHOLD =25 pF
Rs = 2.5 k
Conversion Error 1/2 LSb
VDD =3VRss = 2 k
Temperature = 85C (system max.)
TACQ = Amplifier Settling Time + Holding Capacitor Charging Time + Temperature Coefficient
=T
AMP + TC + TCOFF
VHOLD = (VREF – (VREF/2048)) • (1 – e(-TC/CHOLD(RIC + RSS + RS)))
or
TC = -(CHOLD)(RIC + RSS + RS) ln(1/2048)
TACQ =TAMP + TC + TCOFF
TAMP =0.2 s
TCOFF = (Temp – 25C)(0.02 s/C)
(85C – 25C)(0.02 s/C)
1.2 s
Temperature coefficient is only required for temperatures > 25C. Below 25C, TCOFF = 0 ms.
TC = -(CHOLD)(RIC + RSS + RS) ln(1/2048) s
-(25 pF) (1 k + 2 k + 2.5 k) ln(0.0004883) s
1.05 s
TACQ =0.2 s + 1 s + 1.2 s
2.4 s
2010 Microchip Technology Inc. Preliminary DS39979A-page 279
PIC18F87J72 FAMILY
21.2 Selecting and Configuring
Automatic Acquisition Time
The ADCON2 register allows the user to select an
acquisition time that occurs each time the GO/DONE
bit is set.
When the GO/DONE bit is set, sampling is stopped and
a conversion begins. The user is responsible for ensur-
ing the required acquisition time has passed between
selecting the desired input channel and setting the
GO/DONE bit. This occurs when the ACQT<2:0> bits
(ADCON2<5:3>) remain in their Reset state (‘000’) and
is compatible with devices that do not offer
programmable acquisition times.
If desired, the ACQT bits can be set to select a
programmable acquisition time for the A/D module.
When the GO/DONE bit is set, the A/D module continues
to sample the input for the selected acquisition time, then
automatically begins a conversion. Since the acquisition
time is programmed, there may be no need to wait for an
acquisition time between selecting a channel and setting
the GO/DONE bit.
In either case, when the conversion is completed, the
GO/DONE bit is cleared, the ADIF flag is set and the
A/D begins sampling the currently selected channel
again. If an acquisition time is programmed, there is
nothing to indicate if the acquisition time has ended or
if the conversion has begun.
21.3 Selecting the A/D Conversion
Clock
The A/D conversion time per bit is defined as TAD. The
A/D conversion requires 11 T
AD per 12-bit conversion.
The source of the A/D conversion clock is software
selectable.
There are seven possible options for TAD:
•2 T
OSC
•4 TOSC
•8 TOSC
•16 TOSC
•32 TOSC
•64 T
OSC
Internal RC Oscillator
For correct A/D conversions, the A/D conversion clock
(T
AD) must be as short as possible but greater than the
minimum TAD.
Table 21-1 shows the resultant T
AD times derived from
the device operating frequencies and the A/D clock
source selected.
TABLE 21-1: TAD vs. DEVICE OPERATING
FREQUENCIES
21.4 Configuring Analog Port Pins
The ADCON1, TRISA, TRISF and TRISH registers
control the operation of the A/D port pins. The port pins
needed as analog inputs must have their correspond-
ing TRIS bits set (input). If the TRIS bit is cleared
(output), the digital output level (VOH or VOL) will be
converted.
The A/D operation is independent of the state of the
CHS<3:0> bits and the TRIS bits.
AD Clock Source (TAD)Maximum
Device
Frequency
Operation ADCS<2:0>
2 T
OSC 000 2.86 MHz
4 T
OSC 100 5.71 MHz
8 TOSC 001 11.43 MHz
16 TOSC 101 22.86 MHz
32 TOSC 010 40.0 MHz
64 TOSC 110 40.0 MHz
RC(2) x11 1.00 MHz(1)
Note 1: The RC source has a typical TAD time of
4s.
2: For device frequencies above 1 MHz, the
device must be in Sleep mode for the entire
conversion or the A/D accuracy may be out
of specification.
Note 1: When reading the PORT register, all pins
configured as analog input channels will
read as cleared (a low level). Pins config-
ured as digital inputs will convert an
analog input. Analog levels on a digitally
configured input will be accurately
converted.
2: Analog levels on any pin defined as a
digital input may cause the digital input
buffer to consume current out of the
device’s specification limits.
PIC18F87J72 FAMILY
DS39979A-page 280 Preliminary 2010 Microchip Technology Inc.
21.5 A/D Conversions
Figure 21-1 shows the operation of the A/D Converter
after the GO/DONE bit has been set and the
ACQT<2:0> bits are cleared. A conversion is started
after the following instruction to allow entry into Sleep
mode before the conversion begins.
Figure 21-2 shows the operation of the A/D Converter
after the GO/DONE bit has been set. The ACQT<2:0>
bits are set to010’ and a 4 T
AD acquisition time is
selected before the conversion starts.
Clearing the GO/DONE bit during a conversion will abort
the current conversion. The A/D Result register pair will
NOT be updated with the partially completed A/D
conversion sample. This means the ADRESH:ADRESL
registers will continue to contain the value of the last
completed conversion (or the last value written to the
ADRESH:ADRESL registers).
After the A/D conversion is completed or aborted, a
2T
AD wait is required before the next acquisition can
be started. After this wait, acquisition on the selected
channel is automatically started.
21.6 Use of the CCP2 Trigger
An A/D conversion can be started by the “Special Event
Trigger” of the CCP2 module. This requires that the
CCP2M<3:0> bits (CCP2CON<3:0>) be programmed
as ‘1011and that the A/D module is enabled (ADON
bit is set). When the trigger occurs, the GO/DONE bit
will be set, starting the A/D acquisition and conversion,
and the Timer1 (or Timer3) counter will be reset to zero.
Timer1 (or Timer3) is reset to automatically repeat the
A/D acquisition period with minimal software overhead
(moving ADRESH:ADRESL to the desired location).
The appropriate analog input channel must be selected
and the minimum acquisition period is either timed by
the user or an appropriate TACQ time is selected before
the Special Event Trigger sets the GO/DONE bit (starts
a conversion).
If the A/D module is not enabled (ADON is cleared), the
Special Event Trigger will be ignored by the A/D module,
but will still reset the Timer1 (or Timer3) counter.
FIGURE 21-1: A/D CONVERSION TAD CYCLES (ACQT<2:0> = 000, TACQ = 0)
FIGURE 21-2: A/D CONVERSION TAD CYCLES (ACQT<2:0> = 010, TACQ = 4 TAD)
Note: The GO/DONE bit should NOT be set in
the same instruction that turns on the A/D.
TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD11
Set GO/DONE bit
Holding capacitor is disconnected from analog input (typically 100 ns)
TAD9 TAD10TCY – TAD
ADRESH:ADRESL are loaded, GO/DONE bit is cleared,
ADIF bit is set, holding capacitor is connected to analog input
Conversion starts
b2
b11 b8 b7 b6 b5 b4 b3
b10 b9
On the following cycle:
Discharge
TAD13TAD12
b0b1
TAD1
(typically 200 ns)
123 4 567813
Set GO/DONE bit
(Holding capacitor is disconnected)
912
Conversion starts
1234
(Holding capacitor continues
acquiring input)
T
ACQT Cycles TAD Cycles
Automatic
Acquisition
Time
b0b11 b8 b7 b6 b5 b4 b1
b10 b9
ADRESH:ADRESL are loaded, GO/DONE bit is cleared,
ADIF bit is set, holding capacitor is connected to analog input
On the following cycle:
TAD1
Discharge
10 11
b3 b2
(typically
200 ns)
2010 Microchip Technology Inc. Preliminary DS39979A-page 281
PIC18F87J72 FAMILY
21.7 A/D Converter Calibration
The A/D Converter in the PIC18F87J72 family of
devices includes a self-calibration feature which
compensates for any offset generated within the
module. The calibration process is automated and is
initiated by setting the ADCAL bit (ADCON0<7>). The
next time the GO/DONE bit is set, the module will per-
form a “dummy” conversion (which means it is reading
none of the input channels) and store the resulting value
internally to compensate for the offset. Thus,
subsequent offsets will be compensated.
The calibration process assumes that the device is in a
relatively steady-state operating condition. If A/D
calibration is used, it should be performed after each
device Reset or if there are other major changes in
operating conditions.
21.8 Operation in Power-Managed
Modes
The selection of the automatic acquisition time and A/D
conversion clock is determined in part by the clock
source and frequency while in a power-managed mode.
If the A/D is expected to operate while the device is in
a power-managed mode, the ACQT<2:0> and
ADCS<2:0> bits in ADCON2 should be updated in
accordance with the power-managed mode clock that
will be used. After the power-managed mode is entered
(either of the power-managed Run modes), an A/D
acquisition or conversion may be started. Once an
acquisition or conversion is started, the device should
continue to be clocked by the same power-managed
mode clock source until the conversion has been
completed. If desired, the device may be placed into
the corresponding power-managed Idle mode during
the conversion.
If the power-managed mode clock frequency is less
than 1 MHz, the A/D RC clock source should be
selected.
Operation in Sleep mode requires the A/D RC clock to
be selected. If bits, ACQT<2:0>, are set to ‘000’ and a
conversion is started, the conversion will be delayed
one instruction cycle to allow execution of the SLEEP
instruction and entry to Sleep mode. The IDLEN and
SCSx bits in the OSCCON register must have already
been cleared prior to starting the conversion.
TABLE 21-2: SUMMARY OF A/D REGISTERS
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on Page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR1 —ADIFRC1IF TX1IF SSPIF TMR2IF TMR1IF 52
PIE1 —ADIERC1IE TX1IE SSPIE TMR2IE TMR1IE 52
IPR1 —ADIPRC1IP TX1IP SSPIP TMR2IP TMR1IP 52
PIR3 LCDIF RC2IF TX2IF CTMUIF CCP2IF CCP1IF RTCCIF 52
PIE3 LCDIE RC2IE TX2IE CTMUIE CCP2IE CCP1IE RTCCIE 52
IPR3 LCDIP RC2IP TX2IP CTMUIP CCP2IP CCP1IP RTCCIP 52
ADRESH A/D Result Register High Byte 51
ADRESL A/D Result Register Low Byte 51
ADCON0 ADCAL CHS3 CHS2 CHS1 CHS0 GO/DONE ADON 51
ADCON1 TRIGSEL VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 51
ADCON2 ADFM ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0 51
CCP2CON DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 53
PORTA RA7(1) RA6(1) RA5 RA4 RA3 RA2 RA1 RA0 52
TRISA TRISA7(1) TRISA6(1) TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 52
PORTF RF7 RF6 RF5 RF4 RF3 RF2 RF1 —52
TRISF TRISF5 TRISF4 TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 —52
Legend: — = unimplemented, read as ‘0. Shaded cells are not used for A/D conversion.
Note 1: RA<7:6> and their associated latch and direction bits are configured as port pins only when the internal
oscillator is selected as the default clock source (FOSC2 Configuration bit = 0); otherwise, they are
disabled and these bits read as 0’.
PIC18F87J72 FAMILY
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NOTES:
2010 Microchip Technology Inc. Preliminary DS39979A-page 283
PIC18F87J72 FAMILY
22.0 DUAL-CHANNEL, 24-BIT
ANALOG FRONT END (AFE)
The dual-channel, 24-bit Analog Front End (AFE) is an
integrated, high-performance analog subsystem that
has been tailored for energy metering and power
measurement applications. The AFE contains two
synchronous sampling Delta-Sigma Analog-to-Digital
Converters ( ADC), two PGAs, a phase delay
compensation block, an internal voltage reference and
a dedicated, high-speed 20 MHz SPI compatible serial
interface. A functional block diagram of the AFE is
shown in Figure 22-1.
The A/D Converters contain a proprietary dithering
algorithm for reduced Idle tones and improved THD.
Each converter is preceded by a PGA, allowing for
weak signal amplification and true differential voltage
inputs to the converters. This allows the AFE to inter-
face with a large variety of voltage and current sensors
including shunts, current transformers, Rogowski coils
and Hall effect sensors.
AFE data and control functions are accessed through a
dedicated register map. The map contains 24-bit wide
data words for each ADC (readable as 8-bit registers),
as well as five writable control registers to program
amplifier gain, oversampling, phase, resolution, dither-
ing, shutdown, Reset and communication features.
Communication is largely simplified with various
continuous read modes that can be accessed through
the serial interface and with a separate data ready pin
that can directly be connected to a microcontroller’s
IRQ input.
Because of the complexity of and comprehensive
options available on the AFE, a detailed explanation of
all of its functional elements is not provided in this
chapter. These are described in Appendix B:
“Dual-Channel, 24-Bit AFE Reference”. This chapter
explains the important points of configuring and using
the AFE in a PIC18F8XJ72 based application. Direct
links to relevant information in the AFE reference are
provided throughout the chapter for the reader’s
convenience.
FIGURE 22-1: DUAL-CHANNEL ANALOG FRONT END FUNCTIONAL DIAGRAM
CH0+
CH0-
CH1+
CH1-
SDOA
SDIA
SCKA
DUAL-DS ADC
ANALOG DIGITAL
SINC3
-
+
PGA
MCLK CLKIA
DR
ARESET
Digital SPI
Interface
Clock
Generation
SINC3
-
+
PGA Modulator
AMCLK
DMCLK/DRCLK
DMCLK
Phase
Shifter
PHASE <7:0>
OSR<1:0>
PRE<1:0>
DATA_CH0<23:0>
DATA_CH1<23:0>
SDN<1:0>, RESET<1:0>, GAIN<7:0>
CSA
REFIN+/OUT+
REFIN -
SAVDD
SAVSS SVSS
SVDD
POR
SVDD
Monitoring POR
Modulator
VREF+VREF-/
VREFEXT
Voltage
Reference
VREF
+
-
D-S
D-S
F
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DS39979A-page 284 Preliminary 2010 Microchip Technology Inc.
22.1 Functional Overview
While it is convenient to think of the dual-channel AFE
as a high-precision ADC, there are actually many more
components involved. The main components are
described below. The dual-channel AFE reference
provides more in-depth information on each.
22.1.1 DELTA-SIGMA ADC
ARCHITECTURE
Each Delta-Sigma ADC is an oversampling converter
that incorporates a built-in modulator which is digitizing
the quantity of charge integrated by the modulator loop.
The quantizer is the block that is performing the
analog-to-digital conversion. The quantizer is typically
1-bit, or a simple comparator, which helps to maintain
the linearity performance of the ADC (the DAC
structure is, in this case, inherently linear).
Multi-bit quantizers help to lower the quantization error
(the error fed back in the loop can be very large with
1-bit quantizers) without changing the order of the
modulator or the OSR which leads to better SNR
figures. However, typically, the linearity of such
architectures is more difficult to achieve since the DAC
is no more simple to realize and its linearity limits the
THD of such ADCs.
The 5-level quantizer is a Flash ADC composed of
4 comparators arranged with equally spaced thresholds
and a thermometer coding. The AFE also includes pro-
prietary 5-level DAC architecture that is inherently linear
for improved THD figures.
The resulting channel data is either a 16-bit or 24-bit
word, presented in 23-bit or 15-bit plus sign, two’s
complement format and is MSb (left) justified.
22.1.2 ANALOG INPUTS (CHn+/-)
The analog inputs can be connected directly to current
and voltage transducers. Each input pin is protected by
specialized ESD structures that are certified to pass
7 kV HBM and 400V MM contact charge. These
structures allow bipolar ±6V continuous voltage with
respect to SAVSS, to be present at their inputs without
the risk of permanent damage.
22.1.3 PROGRAMMABLE GAIN
AMPLIFIERS (PGA)
The two Programmable Gain Amplifiers (PGAs) reside
at the front-end of each Delta-Sigma ADC. They have
two functions: translate the common-mode of the input
from SAVss to an internal level between SAVSS and
SAVDD, and amplify the input differential signal. The
translation of the common-mode does not change the
differential signal, but recenters the common-mode so
that the input signal can be properly amplified.
The PGA block can be used to amplify very low signals,
but the differential input range of the Delta-Sigma
modulator must not be exceeded.
22.1.4 SINC3 FILTER
Both ADCs include a decimation filter that is a
third-order sinc (or notch) filter. This filter processes the
multi-bit stream into either 16-bit or 24-bit words,
depending on the configuration chosen. The settling
time of the filter is three DMCLK periods. The resolution
achievable at the output of the sinc filter (the output of
the ADC) is dependent on the oversampling ratio
selected.
22.1.4.1 Internal Voltage Reference
The AFE contains an internal voltage reference source
specially designed to minimize drift over temperature.
This internal VREF supplies reference voltage to both
channels. The typical value of this voltage reference is
2.37V ±2%. The internal reference has a very low typi-
cal temperature coefficient of ±12 ppm/°C, allowing the
output codes to have minimal variation with respect to
temperature since they are proportional to (1/VREF).
The output pin for the internal voltage reference is
REFIN+/OUT.
Optionally, the AFE can be configured to use an exter-
nal voltage reference supplied on the REFIN+ and
REFIN- pins.
22.1.5 PHASE DELAY BLOCK
The AFE incorporates a phase delay generator which
ensures that the two ADCs are converting the inputs
with a fixed delay between them. The two ADCs are
synchronously sampling but the averaging of
modulator outputs is delayed, so that the SINC filter
outputs (thus, the ADC outputs) show a fixed phase
delay, configured by the PHASE register.
22.1.6 INTERNAL AFE CLOCK
The AFE uses an external clock signal to operate its
internal digital logic. The AFE includes a clock genera-
tion chain of back-to-back dividers to produce a range
of sampling frequencies.
22.1.7 SERIAL INTERFACE
The AFE uses an SPI-compatible slave serial interface.
Its operation is discussed in Section 22.3 “Serial
Interface”.
2010 Microchip Technology Inc. Preliminary DS39979A-page 285
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22.2 AFE Register Map
The dual-channel AFE uses its own internal registers
for data and control. This memory is not mapped to the
microcontroller’s SFR space, but is accessed through
the AFE’s serial interface. The memory space is
divided into eight registers:
Two 24-bit registers, one for the data of each ADC
Five 8-bit control registers
One reserved 8-bit register address
Although the data registers are 24 bits wide, they may
be directly addressed as three different 8-bit registers.
The complete memory map is listed in Table 22-1.
All registers are fully described in Section B.6 “Internal
Registers” of the AFE reference.
Registers may be read singly in a single read opera-
tion; continuously, as part of a group of registers; or
continuously, by type (i.e., data registers vs. control
registers). The type of read operation is handled
through the AFE’s serial interface by selecting the type
of read operation. The grouping of registers is shown in
Table 22-2. A complete description of the different read
operations and how to implement them is described in
Section B.5.3 “Reading from the Device” of the AFE
reference.
.
TABLE 22-2: REGISTER MAP GROUPING FOR CONTINUOUS READ MODES
TABLE 22-1: AFE REGISTER MAP
Address Name Bits R/W Description
00h DATA_CH0 24 R Channel 0 ADC Data <23:0>, MSB First
03h DATA_CH1 24 R Channel 1 ADC Data <23:0>, MSB First
06h Reserved 8 Reserved; ignore reads, do not write
07h PHASE 8 R/W Phase Delay Configuration Register
08h GAIN 8 R/W Gain Configuration Register
09h STATUS/COM 8 R/W Status/Communication Register
0Ah CONFIG1 8 R/W Configuration Register 1
0Bh CONFIG2 8 R/W Configuration Register 2
Function Address READ<1:0>
01”“10”“11
DATA_CH0
00h
Group
Type
Loop Entire
Register Map
01h
02h
DATA_CH1
03h
Group04h
05h
PHASE 07h Group
Type
GAIN 08h
STATUS/COM 09h
GroupCONFIG1 0Ah
CONFIG2 0Bh
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DS39979A-page 286 Preliminary 2010 Microchip Technology Inc.
22.3 Serial Interface
22.3.1 OVERVIEW
All communication with the dual-channel AFE is
handled through its serial interface; this includes the
exchange of data with the PIC18F8XJ72 device itself.
This arrangement allows the AFE to direct data with
other microcontrollers on an SPI bus in complex appli-
cations, and work cooperatively with other SPI enabled
analog devices.
The serial interface is an SPI-compatible slave inter-
face, compatible with SPI modes, 0,0 and 1,1. Data is
clocked out of the AFE on the falling edge of SCKA
and, clocked into the device on the rising edge of
SCKA. In these modes, SCKA can Idle either high or
low.
A complete discussion of the serial interface is pro-
vided in Section B.5 “Serial Interface Description” of
the AFE Reference.
22.3.2 CONTROL BYTE
The first byte transmitted to the AFE is always a control
byte. This byte is composed of three fields
(Figure 22-2):
Two address bits (A<6:5>, the MSbs)
Five register address bits (A<4:0>)
One Read/Write bit (R/W, the LSbs)
The AFE interface is device-addressable (through
A<6:5>), so that multiple devices can be present on the
same SPI bus with no data bus contention. This
functionality allows external SPI Master devices on the
bus, such as another microcontroller, to read and share
data. It also enables three-phase power metering
systems containing two additional analog front end
devices, controlled by a single SPI bus (single CS,
SCK, SDI and SDO pins).
The SPI device address bits of the PIC18F87J72
interface are always ‘00’; they cannot be changed.
FIGURE 22-2: CONTROL BYTE
A read on undefined addresses gives an output of all
zeros on the first and all subsequent transmitted bytes.
Writing to an undefined address has no effect and does
not increment the address counter either.
22.3.3 READING FROM THE DEVICE
The first data byte read is the one defined by the
address given in the control byte. After this first byte is
transmitted, if the CSA pin is held low, the communica-
tion continues and the address of the next transmitted
byte is determined by the configuration of the interface,
set by the read bits in the STATUS/COM register.
22.3.4 WRITING TO THE DEVICE
The first data byte written is the one defined by the
address given in the control byte. The write
communication automatically increments the address
for subsequent bytes.
The address of the next transmitted byte within the
same communication (CSA stays low) is the next
address defined on the register map. At the end of the
register map, the address loops to the beginning of the
register map. Writing a non-writable register has no
effect.
The SDOA pin remains in a high-impedance state
during a write communication.
22.3.5 CONTINUOUS COMMUNICATION
AND LOOPING ON ADDRESS SETS
If the user wishes to read back one or both of the ADC
channels continuously, the internal address counter of
the AFE can be set to loop on specific register sets.
This method also makes it possible to continuously
read specific register groups, one of the register types
or all of the registers.
In each case, one control byte on SDIA starts the
communication. The part stays within the same loop
until CSA returns high.
Continuous communication is described in more detail
in Section B.5.7 “Continuous Communication,
Looping On Address Sets” of the AFE Reference.
22.3.6 DATA READY PIN (DR)
In addition to the standard SPI interface pins (SDIA,
SDOA, SCKA and CSA), the AFE provides an addi-
tional Data Ready (DR) signal. This signifies to an
external device when conversion data is available. The
DR signal, available on the pin of the same name, is an
active-low pulse at the end of a channel conversion,
with a period that is equal to the DRCLK clock period
and with a width equal to one DMCLK period.
The DR pin can be configured to operate in different
modes that are defined by the availability of conversion
data on the ADC channels. The various Data Ready
modes and configuration options for the DR pin are
described in Section B.5.9 “Data Ready Pin (DR)” of
the AFE Reference.
A6 A5 A4 A3 A2 A1 A0 R/W
Read
Write Bit
Register
Device
Address Bits
Address
Bits
2010 Microchip Technology Inc. Preliminary DS39979A-page 287
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22.4 AFE Connections
The dual-channel AFE has multiple data and power con-
nections that are independent of the digital side of the
microcontroller. These connections are required to use
the AFE, and are in addition to the connection and layout
connections provided in Section 2.0 “Guidelines for
Getting Started with PIC18FJ Microcontrollers”.
All of the connections required for proper operation of
the AFE are shown in Figure 22-3.
22.4.1 VOLTAGE AND GROUND
CONNECTIONS
The AFE has independent voltage supply requirements
that differ from the rest of the microcontroller. Digital cir-
cuits are supplied through the SVDD pin, which requires
a voltage of 2.7V to 5.5V. Typically, SVDD can be tied to
3.3V, the same as the VDD and AVDD pins. Analog cir-
cuits are separately supplied through the SAVDD pin,
which requires a voltage of 4.5V to 5.5V (5V ±10%).
Independent ground returns are provided through the
SVss and SAVss pins, respectively.
As with the microcontroller’s VDD/VSS and AVDD/AVSS
pins, bypass capacitors are required on the AFE power
and return pin pairs. Requirements for these capacitors
are identical to those for the VDD/VSS and AVDD/AVSS
pins.
It is recommended that designs using PIC18F87J72
family devices incorporate a separate ground return
path for analog circuits. SAVss, as well as other AFE
analog pins (e.g., REFIN-) that require grounding,
should be tied to this analog return. SVSS can be tied to
the digital ground, along with VSS and AVSS. The ana-
log and digital grounds may be tied to a single point at
the power source.
FIGURE 22-3: REQUIRED CONNECTIONS FOR AFE OPERATION
PIC18F8XJ72
SDIA
GPIO(1)
SDO
SDI
CH1-
SAVSS
REFIN+/OUT
REFIN-
DR
SCKA
SDOA
Key (all values are recommendations):
C1 and C2: 0.1 F, 20V ceramic
C3 and C4: 100 nF, 20V ceramic.
Bold lines show SPI connections.
Note 1: Any available I/O pins may be used to control ARESET and CSA. The software examples discussed in this chapter
use RD0 and RD7, respectively.
2: The software examples discussed in this chapter use CCP1 to generate the AFE clock source. Other clock sources
may be used, as required.
GPIO(1)
ARESET
CSA
INT0
SCK
CCP1(2)
CLKIA
C3 C4
CH1+
CH0-
CH0+
Differential
Analog
Inputs
SVSS
SAVDD
SVDD
C1 C2
Analog GND
SVDD (3.3V)
SAVDD (5V)
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DS39979A-page 288 Preliminary 2010 Microchip Technology Inc.
22.4.2 SERIAL INTERFACE
CONNECTIONS
The AFE uses its own dedicated Serial Peripheral
Interface (SPI) to both send output data from its A/D
Converters, and send and receive control information.
The interface allows the AFE to operate directly with
other microcontrollers and analog peripherals that use
SPI on a common serial bus.
To use the interface, the following connections are
required between the AFE and the MSSP module:
from SDO (RC5) to SDIA
from SDI (RC4) to SDOA
from SCK (RC3) to SCKA
In addition, the AFE requires a chip select signal on the
CSA pin (active-low) to function properly. The chip
select signal can be supplied by any available I/O pin.
22.4.3 OTHER INTERFACE
CONNECTIONS
In addition to the SPI connections, the AFE requires
three other digital signals for proper control:
the Data Ready (DR) output, asserted low to
signal that a conversion has been completed and
is ready to be transferred;
a module Reset (ARESET), asserted low to inde-
pendently force the AFE into a POR event; and
a clock for the AFE’s digital circuits, supplied on
the CLKIA pin.
To use the Data Ready, tie the DR pin to an external
interrupt pin, such as INT0. Asserting DR will cause an
interrupt, the ISR for which can be used to read the
AFE’s data through the SPI. Note that whatever inter-
rupt trigger is used, it must be properly configured to
trigger when the pin is asserted low.
For the Reset input, use an available I/O pin to drive
ARESET low when needed.
For the AFE clock signal, any suitable clock signal in
the proper frequency range (1 MHz to 5 MHz) can be
used. One convenient and low pin count method is to
use a CCP module in PWM mode to generate an
appropriate clock, then connect the module’s output pin
to CLKIA.
22.4.4 ANALOG INPUTS
The analog signals to be converted to digital values are
connected to the pins of CH0 and/or CH1. Each chan-
nel has inverting and non-inverting inputs (CHn- and
CHn+, respectively), and is fully differential. Limits and
absolute maximums for the inputs are described in
Section 29.0 “Electrical Characteristics”.
The REFIN+/OUT and REFIN- pins are used to supply
an external voltage reference to the AFE; the
REFIN+/OUT pin can also be configured to provide
voltage generated by the AFE’s internal voltage refer-
ence. If the internal voltage reference is enabled,
bypass capacitors to analog ground are recommended
for the REFIN+/OUT pin. The REFIN- pin should be
directly connected to analog ground (as shown in
Figure 22-3).
22.5 Using the AFE
To configure the AFE and read A/D conversion data,
follow this sequence:
1. Initialize the MSSP module:
a) Configure for SPI Master mode, in either
SPI mode 0,0 (CKP = 0, CKE = 1) or mode
1,1 (CKP = 1, CKE = 0).
b) Configure TRISC for SCK and SDO as out-
puts, and SDI as input.
2. Reset the AFE by pulling ARESET low.
3. Pull CSA high.
4. Disable the chip select signals of all the devices
connected to the same SPI bus.
5. Pull CSA low, then write the register address
with command (read or write selection) to the
AFE through the SPI.
As long as CSA
is enabled, the address will
increment automatically after each SPI transfer
is completed. After sending the address and
command, the registers of the AFE can be
written or read.
Disable CSA after read or write to a set of AFE
registers.
6. When the DR signal is asserted, signalling that
an A/D conversion is complete, use an interrupt
routine to read the data from one or both chan-
nels. The overall method is similar to that for
reading other AFE registers over the SPI,
described in step 5.
Note that SPI operations to read or write the AFE’s reg-
isters can be performed even without providing CLKIA
to the AFE. The CLKIA signal is required to perform
A/D conversions and make the Data Ready (DR) signal
available after conversions are done.
Note: The first byte sent to the AFE upon
initialization must always be a control byte.
See Appendix B.5 “Serial Interface
Description” for more information.
2010 Microchip Technology Inc. Preliminary DS39979A-page 289
PIC18F87J72 FAMILY
Example 22-1 provides a general outline for imple-
menting a driver routine for the AFE. Example 22-2
through Example 22-5 show the details for each step.
The example shown here assumes the following
loopback connections:
RC4 (SDI) to SDOA
RC5 (SDO) to SDIA
RC3 (SCK) to SCKA
RD0 to ARESET
RD7 to CSA
RC2 (CCP1) to CLKIA
RB0 (INT0) to DR
Aside from the SPI, which is determined by the
microcontroller’s single MSSP module, the other
connections may change based on the particular appli-
cation’s requirements. For example, the AFE clock on
CLKIA is generated from the PWM of CCP1 in this
demonstration; other clock sources may be available.
Users should modify the individual code segments
accordingly.
EXAMPLE 22-1: OVERALL STRUCTURE FOR USING THE AFE
///////////////////////////////////////////////////////////////////////////////////////////////
// Outline of a typical driver routine for the dual-channel AFE.
///////////////////////////////////////////////////////////////////////////////////////////////
#include "p18F87J72.h"
void main(void)
{
///////////////////////////////////////////////////////////////////////////////////
// STEP 1:Initialize MSSP (Example 22-2)
////////////////////////////////////////////////////////////////////////////////////
/////////////////////////////////////////////////////////////////////////////////////
// STEP 2: Issue Reset to AFE (Example 22-2)
/////////////////////////////////////////////////////////////////////////////////////
////////////////////////////////////////////////////////////////////////////////////
// STEPS 3: Disable all Chip Selects on all SPI devices (Example 22-2)
////////////////////////////////////////////////////////////////////////////////////
////////////////////////////////////////////////////////////////////////////////////////////
// STEP 4: Write to AFE registers; read back (optionally) to confirm settings (Example 22-4)
////////////////////////////////////////////////////////////////////////////////////////////
/////////////////////////////////////////////////////////////////////////////////////////////
// STEP 5: Configure CCP1 to serve as AFE clock source (Example 22-3)
/////////////////////////////////////////////////////////////////////////////////////////////
/////////////////////////////////////////////////////////////////////////////////////////////
///STEP 6: Configure Interrupt INT0 for use with DR pin (Example 22-3)
/////////////////////////////////////////////////////////////////////////////////////////////
while(1);
}
/////////////////////////////////////////////////////////////////////////////////////////////
//STEP 7: ISR for reading AFE data (Example 22-5)
////////////////////////////////////////////////////////////////////////////////////////////
PIC18F87J72 FAMILY
DS39979A-page 290 Preliminary 2010 Microchip Technology Inc.
EXAMPLE 22-2: INITIALIZING THE MSSP MODULE
EXAMPLE 22-3: AFE CLOCK SOURCE AND INTERRUPT CONFIGURATION
///////////////////////////////////////////////////////////////////////////////////
// STEP 1: Initialize the MSSP in SPI Master mode to access the AFE
// Connections: SCK--SCKA, SDI--SDOA, SDO--SDIA
////////////////////////////////////////////////////////////////////////////////////
SSPCON1bits.CKP = 1; // SPI mode 1,1: idle state for SCK is high,
SSPCON1bits.CKE = 0; // data transmitted on transition from idle to active state
// SSPCON1bits.CKP = 0; // If SPI mode 0,0 is used instead, SCK idle state is low,
// SSPCON1bits.CKE = 1; // data trasmitted on transition from active to idle state
SSPCON1bits.SSPEN = 1; // Enable SPI
TRISCbits.TRISC3 = 0; // define SCK pin as output
TRISCbits.TRISC4 = 1; // define SDI pin as input
TRISCbits.TRISC5 = 0; // define SDO pin as output
///////////////////////////////////////////////////////////////////////////////
// STEP 2: Issue Reset to AFE. ARESET pin is connected to RD0 in this example
/////////////////////////////////////////////////////////////////////////////////////
LATDbits.LATD0 = 0;
TRISDbits.TRISD0=0; // Put the Delta Sigma ADC module in reset
LATDbits.LATD0 = 1; // Release the Delta Sigma ADC module from reset
////////////////////////////////////////////////////////////////////////////////////
// STEP 3:
// Disable all chip selects for all devices connected to SPI, including chip select
// for the AFE. CSA is connected to RD7 in this example
////////////////////////////////////////////////////////////////////////////////////
TRISDbits.TRISD7=0;
LATDbits.LATD7=1;
///////////////////////////////////////////////////////////////////////////////////////////////
// STEP 5: Set up Clock to AFE.
// Connections: In this example CLKIA is connected to CCP1.
///////////////////////////////////////////////////////////////////////////////////////////////
CCP1CON |= 0b00001100; // ccpxm3:ccpxm0 11xx=pwm mode
CCPR1L=0x01; // 50% Duty Cycle Clock
TRISCbits.TRISC2 = 0; // Make RC2 Output; RC2 is connected to CLKIA of AFE
T2CONbits.TMR2ON = 0; // STOP TIMER2 registers to POR state
PR2 = 0x01; // Set period
T2CONbits.TMR2ON = 1; // Turn on PWM1
///////////////////////////////////////////////////////////////////////////////////////////////
// STEP 6: Interrupt Configuration
// DR output of AFE can be used as interrupt. It can be connected to any external interrupt,
// like INT0. It can be declared as low or high priority interrupt.
// This example configures INT0 (connected to DR)as a high-priority interrupt.
///////////////////////////////////////////////////////////////////////////////////////////////
RCONbits.IPEN=1; //Priority Interrupt
INTCON2bits.RBPU=0; //Enable INT0 pull-up; required
INTCON2bits.INTEDG0=0; //Falling edge select; DR is active low pulse
INTCONbits.GIEH = 1; //Enable high pririty interrupts
INTCONbits.INT0IE = 1; //Enable INT0 interrupt
2010 Microchip Technology Inc. Preliminary DS39979A-page 291
PIC18F87J72 FAMILY
EXAMPLE 22-4: WRITING AND READING AFE REGISTERS THROUGH THE MSSP
///////////////////////////////////////////////////////////////////////////////////////////////
// STEP 4: Write to AFE registers
// Initialize the AFE by writing to PHASE, GAIN, STATUS, CONFIG1 and CONFIG2 registers.
// Below is an example. The registers can be programmed with values as required
// by the application.
///////////////////////////////////////////////////////////////////////////////////////////////
LATDbits.LATD7=0; //Chipselect enable for Delta Sigma ADC
if (SSPSTATbits.BF==1)
Dummy_Read=SSPBUF;
SSPBUF = 0x0E; //Address and Write command for Gain Register
// A6-A5--->00;A4-A0---->0x07;R/W---0 for write
while(!SSPSTATbits.BF);
Dummy_Read=SSPBUF; //Dummy read to clear Buffer Full Status bit
SSPBUF =0x00; //PHASE Register: No Delay
while(!SSPSTATbits.BF);
Dummy_Read=SSPBUF;
SSPBUF =0x04; //Address automatically incremented GAIN Register
//CH1 gain 16, CH0 gain 1, No Boost
while(!SSPSTATbits.BF);
Dummy_Read=SSPBUF;
SSPBUF = 0xA0; //Address automatically incremented STATUS Register
//Default values
while(!SSPSTATbits.BF);
Dummy_Read=SSPBUF;
SSPBUF = 0x10; //Address automatically incrementedData for CONFIG1 Register
//No Dither, Other values are default
while(!SSPSTATbits.BF);
Dummy_Read=SSPBUF;
SSPBUF = 0x01; //Address automatically incremented Data for CONFIG2 Register
//CLKEXT bit should be always programmed to 1
while(!SSPSTATbits.BF);
Dummy_Read=SSPBUF;
LATDbits.LATD7=1; //Disable chip select after read/write of each set of registers
///////////////////////////////////////////////////////////////////////////////////////////////
// Read from AFE registers to verify; this step is optional and does not affect AFE Operation.
// As an example, only GAIN, STATUS, CONFIG1 and CONFIG2 are read.
///////////////////////////////////////////////////////////////////////////////////////////////
LATDbits.LATD7=0; //Chip select enable for AFE
SSPBUF = 0x11; //Address and Read command for Gain Register
// A6-A5--->00;A4-A0---->0x08;R/W---1 for read
while(!SSPSTATbits.BF);
Dummy_Read=SSPBUF; //Dummy read to clear Buffer Full Status bit
SSPBUF =0x00;
while(!SSPSTATbits.BF);
D_S_ADC_data1=SSPBUF; //Data from GAIN Register
SSPBUF =0x00;
while(!SSPSTATbits.BF);
D_S_ADC_data2=SSPBUF; //Data from STATUS Register, Address automatically incremented
SSPBUF =0x00;
while(!SSPSTATbits.BF);
D_S_ADC_data3=SSPBUF; //Data from CONFIG1 Register, Address automatically incremented
SSPBUF = 0x00;
while(!SSPSTATbits.BF);
D_S_ADC_data4=SSPBUF; //Data from CONFIG2 Register, Address automatically incremented
LATDbits.LATD7=1; //Disable chip select after read/write of each set of registers
PIC18F87J72 FAMILY
DS39979A-page 292 Preliminary 2010 Microchip Technology Inc.
EXAMPLE 22-5: READING DATA FROM AFE DURING INTERRUPT
/////////////////////////////////////////////////////////////////////////////////////////////
// STEP 7: Reading AFE results in Interrupt Routine.
// ADC is configured in 16-bit result mode, thus 16-bit result of each Channel can be read.
// In this example DR is connected to INT0; after each convesion, DR issues interrupt to INT0.
// INT0 is configured as high priority interrupt
////////////////////////////////////////////////////////////////////////////////////////////
#pragma interrupt High_isr_routine
void High_isr_routine(void)
{
char D_S_ADC_data1=0,D_S_ADC_data2=0,D_S_ADC_data3=0,D_S_ADC_data4=0,Dummy_Read=0;
if((INTCONbits.INT0IF)&&(INTCONbits.INT0IE))
{
// Disable all Chip selects of other devices connected to SPI
LATDbits.LATD7=0; //Chip select enable for Delta Sigma ADC
SSP1BUF = 0x01; //Address and Read command for Channel0 result MSB register
while(!SSPSTATbits.BF);
Dummy_Read=SSPBUF; //Dummy read to clear Buffer Full Status bit
SSPBUF =0x00;
while(!SSPSTATbits.BF);
D_S_ADC_data1=SSPBUF; //Data from Channel0 MSB
SSPBUF = 0x00;
while(!SSPSTATbits.BF);
D_S_ADC_data2=SSPBUF; //Data from Channel0 LSB, Address automatically incremented
SSPBUF = 0x00;
while(!SSPSTATbits.BF);
D_S_ADC_data3=SSPBUF; //Data from Channel1 MSB, Address automatically incremented
SSPBUF = 0x00;
while(!SSPSTATbits.BF);
D_S_ADC_data4=SSPBUF; //Data from Channel1 LSB, Address automatically incremented
LATDbits.LATD7=1; //Disable chip select after read/write of registers
INTCONbits.INT0IF=0; //Clear INT0IF for next interrupt
}
}
#pragma code High_isr=0x08
void High_ISR(void)
{
_asm goto High_isr_routine _endasm
}
2010 Microchip Technology Inc. Preliminary DS39979A-page 293
PIC18F87J72 FAMILY
23.0 COMPARATOR MODULE
The analog comparator module contains two
comparators that can be configured in a variety of
ways. The inputs can be selected from the analog
inputs multiplexed with pins, RF1 through RF6, as well
as the on-chip voltage reference (see Section 24.0
“Comparator Voltage Reference Module”). The digi-
tal outputs (normal or inverted) are available at the pin
level and can also be read through the control register.
The CMCON register (Register 23-1) selects the
comparator input and output configuration. Block
diagrams of the various comparator configurations are
shown in Figure 23-1.
REGISTER 23-1: CMCON: COMPARATOR MODULE CONTROL REGISTER
R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-1 R/W-1
C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 C2OUT: Comparator 2 Output bit
When C2INV = 0:
1 = C2 VIN+ > C2 VIN-
0 = C2 VIN+ < C2 VIN-
When C2INV = 1:
1 = C2 VIN+ < C2 VIN-
0 = C2 VIN+ > C2 VIN-
bit 6 C1OUT: Comparator 1 Output bit
When C1INV = 0:
1 = C1 VIN+ > C1 VIN-
0 = C1 VIN+ < C1 VIN-
When C1INV = 1:
1 = C1 VIN+ < C1 VIN-
0 = C1 VIN+ > C1 VIN-
bit 5 C2INV: Comparator 2 Output Inversion bit
1 = C2 output is inverted
0 = C2 output is not inverted
bit 4 C1INV: Comparator 1 Output Inversion bit
1 = C1 output is inverted
0 = C1 output is not inverted
bit 3 CIS: Comparator Input Switch bit
When CM<2:0> = 110:
1 =C1 VIN- connects to RF5/AN10/CVREF/SEG23/C1INB
C2 VIN- connects to RF3/AN8/SEG21/C2INB
0 =C1 V
IN- connects to RF6/AN11/SEG24/C1INA
C2 VIN- connects to RF4/AN9/SEG22/C2INA
bit 2-0 CM<2:0>: Comparator Mode bits
Figure 23-1 shows the Comparator modes and the CM<2:0> bit settings.
PIC18F87J72 FAMILY
DS39979A-page 294 Preliminary 2010 Microchip Technology Inc.
23.1 Comparator Configuration
There are eight modes of operation for the compara-
tors, shown in Figure 23-1. The CM<2:0> bits of the
CMCON register are used to select these modes. The
TRISF register controls the data direction of the
comparator pins for each mode. If the Comparator
mode is changed, the comparator output level may not
be valid for the specified mode change delay shown in
Section 29.0 “Electrical Characteristics”.
FIGURE 23-1: COMPARATOR I/O OPERATING MODES
Note: Comparator interrupts should be disabled
during a Comparator mode change;
otherwise, a false interrupt may occur.
C1
VIN-
VIN+Off (Read as ‘0’)
Comparator Outputs Disabled
A
A
CM<2:0> = 000
C2
VIN-
VIN+Off (Read as ‘0’)
A
A
C1
VIN-
VIN+C1OUT
Two Independent Comparators
A
A
CM<2:0> = 010
C2
VIN-
VIN+C2OUT
A
A
C1
VIN-
VIN+C1OUT
Two Common Reference Comparators
A
A
CM<2:0> = 100
C2
VIN-
VIN+C2OUT
A
D
C2
VIN-
VIN+Off (Read as ‘0’)
One Independent Comparator with Output
D
D
CM<2:0> = 001
C1
VIN-
VIN+C1OUT
A
A
C1
VIN-
VIN+Off (Read as ‘0’)
Comparators Off (POR Default Value)
D
D
CM<2:0> = 111
C2
VIN-
VIN+Off (Read as ‘0’)
D
D
C1
VIN-
VIN+C1OUT
Four Inputs Multiplexed to Two Comparators
A
A
CM<2:0> = 110
C2
VIN-
VIN+C2OUT
A
A
From VREF module
CIS = 0
CIS = 1
CIS = 0
CIS = 1
C1
VIN-
VIN+C1OUT
Two Common Reference Comparators with Outputs
A
A
CM<2:0> = 101
C2
VIN-
VIN+C2OUT
A
D
A = Analog Input, port reads zeros always D = Digital Input CIS (CMCON<3>) is the Comparator Input Switch
CVREF
C1
VIN-
VIN+C1OUT
Two Independent Comparators with Outputs
A
A
CM<2:0> = 011
C2
VIN-
VIN+C2OUT
A
A
RF1/AN6/C2OUT*/SEG19
RF2/AN7/C1OUT*/SEG20
* Setting the TRISF<2:1> bits will disable the comparator outputs by configuring the pins as inputs.
C1INA
C1INB
C2INA
C2INB
C1INB
C2INA
C2INB
C1INA
C1INA
C1INB
C2INA
RF2/AN7/C1OUT*/SEG20
RF1/AN6/C2OUT*/SEG19
RF2/AN7/C1OUT*/
SEG20
C1INA
C1INB
C2INA
C2INB
C1INA
C1INB
C2INA
C2INB
C1INA
C1INB
C2INA
C2INB
C1INA
C1INB
C2INA
C2INB
C1INA
C1INB
C2INA
C2INB
C2INB
2010 Microchip Technology Inc. Preliminary DS39979A-page 295
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23.2 Comparator Operation
A single comparator is shown in Figure 23-2, along with
the relationship between the analog input levels and
the digital output. When the analog input at VIN+ is less
than the analog input VIN-, the output of the comparator
is a digital low level. When the analog input at VIN+ is
greater than the analog input VIN-, the output of the
comparator is a digital high level. The shaded areas of
the output of the comparator in Figure 23-2 represent
the uncertainty due to input offsets and response time.
23.3 Comparator Reference
Depending on the comparator operating mode, either
an external or internal voltage reference may be used.
The analog signal present at VIN- is compared to the
signal at VIN+ and the digital output of the comparator
is adjusted accordingly (Figure 23-2).
FIGURE 23-2: SINGLE COMPARATOR
23.3.1 EXTERNAL REFERENCE SIGNAL
When external voltage references are used, the
comparator module can be configured to have the com-
parators operate from the same or different reference
sources. However, threshold detector applications may
require the same reference. The reference signal must
be between VSS and VDD and can be applied to either
pin of the comparator(s).
23.3.2 INTERNAL REFERENCE SIGNAL
The comparator module also allows the selection of an
internally generated voltage reference from the
comparator voltage reference module. This module is
described in more detail in Section 24.0 “Comparator
Voltage Reference Module”.
The internal reference is only available in the mode
where four inputs are multiplexed to two comparators
(CM<2:0> = 110). In this mode, the internal voltage
reference is applied to the VIN+ pin of both comparators.
23.4 Comparator Response Time
Response time is the minimum time, after selecting a
new reference voltage or input source, before the
comparator output has a valid level. If the internal ref-
erence is changed, the maximum delay of the internal
voltage reference must be considered when using the
comparator outputs. Otherwise, the maximum delay of
the comparators should be used (see Section 29.0
“Electrical Characteristics”).
23.5 Comparator Outputs
The comparator outputs are read through the CMCON
register. These bits are read-only. The comparator
outputs may also be directly output to the RF1 and RF2
I/O pins. When enabled, multiplexers in the output path
of the RF1 and RF2 pins will switch and the output of
each pin will be the unsynchronized output of the
comparator. The uncertainty of each of the
comparators is related to the input offset voltage and
the response time given in the specifications.
Figure 23-3 shows the comparator output block
diagram.
The TRISF bits will still function as an output enable/
disable for the RF1 and RF2 pins while in this mode.
The polarity of the comparator outputs can be changed
using the C2INV and C1INV bits (CMCON<5:4>).
+
VIN+
VIN-
Output
Output
VIN-
VIN+
Note 1: When reading the PORT register, all pins
configured as analog inputs will read as
0’. Pins configured as digital inputs will
convert an analog input according to the
Schmitt Trigger input specification.
2: Analog levels on any pin defined as a
digital input may cause the input buffer to
consume more current than is specified.
PIC18F87J72 FAMILY
DS39979A-page 296 Preliminary 2010 Microchip Technology Inc.
FIGURE 23-3: COMPARATOR OUTPUT BLOCK DIAGRAM
23.6 Comparator Interrupts
The comparator interrupt flag is set whenever there is
a change in the output value of either comparator.
Software will need to maintain information about the
status of the output bits, as read from CMCON<7:6>, to
determine the actual change that occurred. The CMIF
bit (PIR2<6>) is the Comparator Interrupt Flag. The
CMIF bit must be reset by clearing it. Since it is also
possible to write a ‘1’ to this register, a simulated
interrupt may be initiated.
Both the CMIE bit (PIE2<6>) and the PEIE bit
(INTCON<6>) must be set to enable the interrupt. In
addition, the GIE bit (INTCON<7>) must also be set. If
any of these bits are clear, the interrupt is not enabled,
though the CMIF bit will still be set if an interrupt
condition occurs.
The user, in the Interrupt Service Routine, can clear the
interrupt in the following manner:
a) Any read or write of CMCON will end the
mismatch condition.
b) Clear flag bit, CMIF.
A mismatch condition will continue to set flag bit, CMIF.
Reading CMCON will end the mismatch condition and
allow flag bit, CMIF, to be cleared.
23.7 Comparator Operation
During Sleep
When a comparator is active and the device is placed
in Sleep mode, the comparator remains active and the
interrupt is functional, if enabled. This interrupt will
wake-up the device from Sleep mode, when enabled.
Each operational comparator will consume additional
current, as shown in the comparator specifications. To
minimize power consumption while in Sleep mode, turn
off the comparators (CM<2:0> = 111) before entering
Sleep. If the device wakes up from Sleep, the contents
of the CMCON register are not affected.
23.8 Effects of a Reset
A device Reset forces the CMCON register to its Reset
state, causing the comparator modules to be turned off
(CM<2:0> = 111). However, the input pins (RF3
through RF6) are configured as analog inputs by
default on device Reset. The I/O configuration for these
pins is determined by the setting of the PCFG<3:0> bits
(ADCON1<3:0>). Therefore, device current is
minimized when analog inputs are present at Reset
time.
DQ
EN
To RF1 or
RF2 Pin
Bus
Data
Set
MULTIPLEX
CMIF
bit
-+
Port Pins
Read CMCON
Reset
From
Other
Comparator
CxINV
DQ
EN CL
Note: If a change in the CMCON register
(C1OUT or C2OUT) should occur when a
read operation is being executed (start of
the Q2 cycle), then the CMIF (PIR2<6>)
interrupt flag may not get set.
2010 Microchip Technology Inc. Preliminary DS39979A-page 297
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23.9 Analog Input Connection
Considerations
A simplified circuit for an analog input is shown in
Figure 23-4. Since the analog pins are connected to a
digital output, they have reverse biased diodes to VDD
and VSS. The analog input, therefore, must be between
VSS and VDD. If the input voltage deviates from this
range by more than 0.6V in either direction, one of the
diodes is forward biased and a latch-up condition may
occur. A maximum source impedance of 10 k is
recommended for the analog sources. Any external
component connected to an analog input pin, such as
a capacitor or a Zener diode, should have very little
leakage current.
FIGURE 23-4: COMPARATOR ANALOG INPUT MODEL
TABLE 23-1: REGISTERS ASSOCIATED WITH COMPARATOR MODULE
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR2 OSCFIF CMIF BCLIF LVDIF TMR3IF —52
PIE2 OSCFIE CMIE BCLIE LVDIE TMR3IE —52
IPR2 OSCFIP CMIP BCLIP LVDIP TMR3IP —52
CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 51
CVRCON CVREN CVROE CVRR CVRSS CVR3 CVR2 CVR1 CVR0 51
PORTF RF7 RF6 RF5 RF4 RF3 RF2 RF1 —52
LATF LATF7 LATF6 LATF5 LATF4 LATF3 LATF2 LATF1 —52
TRISF TRISF7 TRISF6 TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 —52
Legend: — = unimplemented, read as ‘0’. Shaded cells are unused by the comparator module.
VA
RS < 10k
AIN
CPIN
5 pF
VDD
VT = 0.6V
VT = 0.6V
RIC
ILEAKAGE
±100 nA
VSS
Legend: CPIN = Input Capacitance
VT= Threshold Voltage
ILEAKAGE = Leakage Current at the pin due to various junctions
RIC = Interconnect Resistance
RS= Source Impedance
VA = Analog Voltage
Comparator
Input
PIC18F87J72 FAMILY
DS39979A-page 298 Preliminary 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. Preliminary DS39979A-page 299
PIC18F87J72 FAMILY
24.0 COMPARATOR VOLTAGE
REFERENCE MODULE
The comparator voltage reference is a 16-tap resistor
ladder network that provides a selectable reference
voltage. Although its primary purpose is to provide a
reference for the analog comparators, it may also be
used independently of them.
A block diagram of the module is shown in Figure 24-1.
The resistor ladder is segmented to provide two ranges
of CVREF values and has a power-down function to
conserve power when the reference is not being used.
The module’s supply reference can be provided from
either device VDD/VSS or an external voltage reference.
24.1 Configuring the Comparator
Voltage Reference
The comparator voltage reference module is controlled
through the CVRCON register (Register 24-1). The
comparator voltage reference provides two ranges of
output voltage, each with 16 distinct levels.
The range to be used is selected by the CVRR bit
(CVRCON<5>). The primary difference between the
ranges is the size of the steps selected by the CVREF
Selection bits (CVR<3:0>), with one range offering finer
resolution. The equations used to calculate the output
of the comparator voltage reference are as follows:
If CVRR = 1:
CVREF = ((CVR<3:0>)/24) x (CVRSRC)
If CVRR = 0:
CVREF = (CVRSRC/4) + ((CVR<3:0>)/32) x (CVRSRC)
The comparator reference supply voltage can come
from either VDD and VSS, or the external VREF+ and
VREF- that are multiplexed with RA2 and RA3. The
voltage source is selected by the CVRSS bit
(CVRCON<4>).
The settling time of the comparator voltage reference
must be considered when changing the CVREF
output (see Table 29-3 in Section 29.0 “Electrical
Characteristics).
REGISTER 24-1: CVRCON: COMPARATOR VOLTAGE REFERENCE CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CVREN CVROE(1) CVRR CVRSS CVR3 CVR2 CVR1 CVR0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 CVREN: Comparator Voltage Reference Enable bit
1 =CV
REF circuit powered on
0 =CV
REF circuit powered down
bit 6 CVROE: Comparator VREF Output Enable bit(1)
1 =CVREF voltage level is also output on the RF5/AN10/CVREF/SEG23/C1INB pin
0 =CV
REF voltage is disconnected from the RF5/AN10/CVREF/SEG23/C1INB pin
bit 5 CVRR: Comparator VREF Range Selection bit
1 = 0 to 0.667 CVRSRC, with CVRSRC/24 step size (low range)
0 = 0.25 CVRSRC to 0.75 CVRSRC, with CVRSRC/32 step size (high range)
bit 4 CVRSS: Comparator VREF Source Selection bit
1 = Comparator reference source, CVRSRC = (VREF+) – (VREF-)
0 = Comparator reference source, CVRSRC = VDD – VSS
bit 3-0 CVR<3:0>: Comparator VREF Value Selection bits (0 (CVR<3:0>) 15)
When CVRR = 1:
CVREF = ((CVR<3:0>)/24) (CVRSRC)
When CVRR = 0:
CVREF = (CVRSRC/4) + ((CVR<3:0>)/32) (CVRSRC)
Note 1: CVROE overrides the TRISF<5> bit setting.
PIC18F87J72 FAMILY
DS39979A-page 300 Preliminary 2010 Microchip Technology Inc.
FIGURE 24-1: COMPARATOR VOLTAGE REFERENCE BLOCK DIAGRAM
24.2 Voltage Reference Accuracy/Error
The full range of voltage reference cannot be realized
due to the construction of the module. The transistors
on the top and bottom of the resistor ladder network
(Figure 24-1) keep CVREF from approaching the refer-
ence source rails. The voltage reference is derived
from the reference source; therefore, the CVREF output
changes with fluctuations in that source. The tested
absolute accuracy of the voltage reference can be
found in Section 29.0 “Electrical Characteristics.
24.3 Operation During Sleep
When the device wakes up from Sleep through an
interrupt or a Watchdog Timer time-out, the contents of
the CVRCON register are not affected. To minimize
current consumption in Sleep mode, the voltage
reference should be disabled.
24.4 Effects of a Reset
A device Reset disables the voltage reference by
clearing bit, CVREN (CVRCON<7>). This Reset also
disconnects the reference from the RA2 pin by clearing
bit, CVROE (CVRCON<6>) and selects the high-voltage
range by clearing bit, CVRR (CVRCON<5>). The CVR
value select bits are also cleared.
24.5 Connection Considerations
The voltage reference module operates independently
of the comparator module. The output of the reference
generator may be connected to the RF5 pin if the
CVROE bit is set. Enabling the voltage reference out-
put onto RA2 when it is configured as a digital input will
increase current consumption. Connecting RF5 as a
digital output with CVRSS enabled will also increase
current consumption.
The RF5 pin can be used as a simple D/A output with
limited drive capability. Due to the limited current drive
capability, a buffer must be used on the voltage
reference output for external connections to VREF.
Figure 24-2 shows an example buffering technique.
16-to-1 MUX
CVR<3:0>
8R
R
CVREN
CVRSS = 0
VDD
VREF+CVRSS = 1
8R
CVRSS = 0
VREF-CVRSS = 1
R
R
R
R
R
R
16 Steps
CVRR
CVREF
2010 Microchip Technology Inc. Preliminary DS39979A-page 301
PIC18F87J72 FAMILY
FIGURE 24-2: COMPARATOR VOLTAGE REFERENCE OUTPUT BUFFER EXAMPLE
TABLE 24-1: REGISTERS ASSOCIATED WITH COMPARATOR VOLTAGE REFERENCE
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on page
CVRCON CVREN CVROE CVRR CVRSS CVR3 CVR2 CVR1 CVR0 51
CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 51
TRISF TRISF7 TRISF6 TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 —52
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used with the comparator voltage reference.
CVREF Output
+
CVREF
Module
Voltage
Reference
Output
Impedance
R(1)
RF5
Note 1: R is dependent upon the Comparator Voltage Reference bits, CVRCON<5> and CVRCON<3:0>.
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NOTES:
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25.0 CHARGE TIME
MEASUREMENT UNIT (CTMU)
The Charge Time Measurement Unit (CTMU) is a
flexible analog module that provides accurate differen-
tial time measurement between pulse sources, as well
as asynchronous pulse generation. By working with
other on-chip analog modules, the CTMU can be used
to precisely measure time, measure capacitance,
measure relative changes in capacitance or generate
output pulses with a specific time delay. The CTMU is
ideal for interfacing with capacitive-based sensors.
The module includes the following key features:
Up to 13 channels available for capacitive or time
measurement input
On-chip precision current source
Four-edge input trigger sources
Polarity control for each edge source
Control of edge sequence
Control of response to edges
Time measurement resolution of 1 nanosecond
High-precision time measurement
Time delay of external or internal signal
asynchronous to system clock
Accurate current source suitable for capacitive
measurement
The CTMU works in conjunction with the A/D Converter
to provide up to 13 channels for time or charge
measurement, depending on the specific device and
the number of A/D channels available. When config-
ured for time delay, the CTMU is connected to one of
the analog comparators. The level-sensitive input edge
sources can be selected from four sources: two
external inputs or CCP1/CCP2 Special Event Triggers.
Figure 25-1 provides a block diagram of the CTMU.
FIGURE 25-1: CTMU BLOCK DIAGRAM
CTEDG1
CTEDG2
Current Source
Edge
Control
Logic
CTMUCON
Pulse
Generator
A/D Converter Comparator 2
Input
CCP2
CCP1
Current
Control
ITRIM<5:0>
IRNG<1:0>
CTMUICON
CTMU
Control
Logic
EDGEN
EDGSEQEN
EDG1SELx
EDG1POL
EDG2SELx
EDG2POL
EDG1STAT
EDG2STAT
TGEN
IDISSEN
CTTRIG
A/D Trigger
CTPLS
Comparator 2 Output
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25.1 CTMU Operation
The CTMU works by using a fixed current source to
charge a circuit. The type of circuit depends on the type
of measurement being made. In the case of charge
measurement, the current is fixed, and the amount of
time the current is applied to the circuit is fixed. The
amount of voltage read by the A/D is then a measure-
ment of the capacitance of the circuit. In the case of
time measurement, the current, as well as the capaci-
tance of the circuit, is fixed. In this case, the voltage
read by the A/D is then representative of the amount of
time elapsed from the time the current source starts
and stops charging the circuit.
If the CTMU is being used as a time delay, both capaci-
tance and current source are fixed, as well as the voltage
supplied to the comparator circuit. The delay of a signal
is determined by the amount of time it takes the voltage
to charge to the comparator threshold voltage.
25.1.1 THEORY OF OPERATION
The operation of the CTMU is based on the equation
for charge:
More simply, the amount of charge measured in
coulombs in a circuit is defined as current in amperes
(I) multiplied by the amount of time in seconds that the
current flows (t). Charge is also defined as the capaci-
tance in farads (C) multiplied by the voltage of the
circuit (V). It follows that:
The CTMU module provides a constant, known current
source. The A/D Converter is used to measure (V) in
the equation, leaving two unknowns: capacitance (C)
and time (t). The above equation can be used to calcu-
late capacitance or time, by either the relationship
using the known fixed capacitance of the circuit:
or by:
using a fixed time that the current source is applied to
the circuit.
25.1.2 CURRENT SOURCE
At the heart of the CTMU is a precision current source,
designed to provide a constant reference for measure-
ments. The level of current is user-selectable across
three ranges or a total of two orders of magnitude, with
the ability to trim the output in ±2% increments
(nominal). The current range is selected by the
IRNG<1:0> bits (CTMUICON<1:0>), with a value of
00’ representing the lowest range.
Current trim is provided by the ITRIM<5:0> bits
(CTMUICON<7:2>). These six bits allow trimming of
the current source in steps of approximately 2% per
step. Note that half of the range adjusts the current
source positively and the other half reduces the current
source. A value of ‘000000’ is the neutral position (no
change). A value of100000’ is the maximum negative
adjustment (approximately -62%) and011111’ is the
maximum positive adjustment (approximately +62%).
25.1.3 EDGE SELECTION AND CONTROL
CTMU measurements are controlled by edge events
occurring on the module’s two input channels. Each
channel, referred to as Edge 1 and Edge 2, can be con-
figured to receive input pulses from one of the edge
input pins (CTEDG1 and CTEDG2) or CCPx Special
Event Triggers. The input channels are level-sensitive,
responding to the instantaneous level on the channel
rather than a transition between levels. The inputs are
selected using the EDG1SEL and EDG2SEL bit pairs
(CTMUCONL<3:2, 6:5>).
In addition to source, each channel can be configured for
event polarity using the EDGE2POL and EDGE1POL
bits (CTMUCONL<7,4>). The input channels can also
be filtered for an edge event sequence (Edge 1 occur-
ring before Edge 2) by setting the EDGSEQEN bit
(CTMUCONH<2>).
25.1.4 EDGE STATUS
The CTMUCON register also contains two status bits,
EDG2STAT and EDG1STAT (CTMUCONL<1:0>).
Their primary function is to show if an edge response
has occurred on the corresponding channel. The
CTMU automatically sets a particular bit when an edge
response is detected on its channel. The level-sensitive
nature of the input channels also means that the status
bits become set immediately if the channel’s configura-
tion is changed and is the same as the channels
current state.
The module uses the edge status bits to control the cur-
rent source output to external analog modules (such as
the A/D Converter). Current is only supplied to external
modules when only one (but not both) of the status bits
is set, and shuts current off when both bits are either
set or cleared. This allows the CTMU to measure cur-
rent only during the interval between edges. After both
status bits are set, it is necessary to clear them before
another measurement is taken. Both bits should be
cleared simultaneously, if possible, to avoid re-enabling
the CTMU current source.
In addition to being set by the CTMU hardware, the
edge status bits can also be set by software. This is
also the user’s application to manually enable or dis-
able the current source. Setting either one (but not
both) of the bits enables the current source. Setting or
clearing both bits at once disables the source.
CI
dV
dT
-------=
ItCV.=
tCVI=
CItV=
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25.1.5 INTERRUPTS
The CTMU sets its interrupt flag (PIR3<2>) whenever
the current source is enabled, then disabled. An inter-
rupt is generated only if the corresponding interrupt
enable bit (PIE3<2>) is also set. If edge sequencing is
not enabled (i.e., Edge 1 must occur before Edge 2), it
is necessary to monitor the edge status bits and
determine which edge occurred last and caused the
interrupt.
25.2 CTMU Module Initialization
The following sequence is a general guideline used to
initialize the CTMU module:
1. Select the current source range using the IRNG
bits (CTMUICON<1:0>).
2. Adjust the current source trim using the ITRIM
bits (CTMUICON<7:2>).
3. Configure the edge input sources for Edge 1 and
Edge 2 by setting the EDG1SEL and EDG2SEL
bits (CTMUCONL<3:2 and 6:5>).
4. Configure the input polarities for the edge inputs
using the EDG1POL and EDG2POL bits
(CTMUCONL<4,7>). The default configuration
is for negative edge polarity (high-to-low
transitions).
5. Enable edge sequencing using the EDGSEQEN
bit (CTMUCONH<2>). By default, edge
sequencing is disabled.
6. Select the operating mode (Measurement or
Time Delay) with the TGEN bit. The default
mode is Time/Capacitance Measurement.
7. Configure the module to automatically trigger
an A/D conversion when the second edge
event has occurred using the CTTRIG bit
(CTMUCONH<0>). The conversion trigger is
disabled by default.
8. Discharge the connected circuit by setting the
IDISSEN bit (CTMUCONH<1>); after waiting a
sufficient time for the circuit to discharge, clear
IDISSEN.
9. Disable the module by clearing the CTMUEN bit
(CTMUCONH<7>).
10. Clear the Edge Status bits, EDG2STAT and
EDG1STAT (CTMUCONL<1:0>).
11. Enable both edge inputs by setting the EDGEN
bit (CTMUCONH<3>).
12. Enable the module by setting the CTMUEN bit.
Depending on the type of measurement or pulse
generation being performed, one or more additional
modules may also need to be initialized and configured
with the CTMU module:
Edge Source Generation: In addition to the
external edge input pins, CCPx Special Event
Triggers can be used as edge sources for the
CTMU.
Capacitance or Time Measurement: The CTMU
module uses the A/D Converter to measure the
voltage across a capacitor that is connected to one
of the analog input channels.
Pulse Generation: When generating system clock
independent output pulses, the CTMU module
uses Comparator 2 and the associated
comparator voltage reference.
25.3 Calibrating the CTMU Module
The CTMU requires calibration for precise measure-
ments of capacitance and time, as well as for accurate
time delay. If the application only requires measurement
of a relative change in capacitance or time, calibration is
usually not necessary. An example of this type of appli-
cation would include a capacitive touch switch, in which
the touch circuit has a baseline capacitance, and the
added capacitance of the human body changes the
overall capacitance of a circuit.
If actual capacitance or time measurement is required,
two hardware calibrations must take place: the current
source needs calibration to set it to a precise current,
and the circuit being measured needs calibration to
measure and/or nullify all other capacitance other than
that to be measured.
25.3.1 CURRENT SOURCE CALIBRATION
The current source onboard the CTMU module has a
range of ±60% nominal for each of three current
ranges. Therefore, for precise measurements, it is
possible to measure and adjust this current source by
placing a high-precision resistor, RCAL, onto an unused
analog channel. An example circuit is shown in
Figure 25-2. The current source measurement is
performed using the following steps:
1. Initialize the A/D Converter.
2. Initialize the CTMU.
3. Enable the current source by setting EDG1STAT
(CTMUCONL<0>).
4. Issue settling time delay.
5. Perform A/D conversion.
6. Calculate the current source current using
I=V/RCAL, where RCAL is a high-precision
resistance and V is measured by performing an
A/D conversion.
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The CTMU current source may be trimmed with the
trim bits in CTMUICON using an iterative process to get
an exact desired current. Alternatively, the nominal
value without adjustment may be used; it may be
stored by the software for use in all subsequent
capacitive or time measurements.
To calculate the value for RCAL, the nominal current
must be chosen, and then the resistance can be
calculated. For example, if the A/D Converter reference
voltage is 3.3V, use 70% of full scale or 2.31V as the
desired approximate voltage to be read by the A/D
Converter. If the range of the CTMU current source is
selected to be 0.55 A, the resistor value needed is cal-
culated as RCAL = 2.31V/0.55 A, for a value of 4.2 M.
Similarly, if the current source is chosen to be 5.5 A,
RCAL would be 420,000, and 42,000 if the current
source is set to 55 A.
FIGURE 25-2: CTMU CURRENT SOURCE
CALIBRATION CIRCUIT
A value of 70% of full-scale voltage is chosen to make
sure that the A/D Converter was in a range that is well
above the noise floor. Keep in mind that if an exact cur-
rent is chosen to incorporate the trimming bits from
CTMUICON, the resistor value of RCAL may need to be
adjusted accordingly. RCAL may be also adjusted to
allow for available resistor values. RCAL should be of
the highest precision available, keeping in mind the
amount of precision needed for the circuit that the
CTMU will be used to measure. A recommended
minimum would be 0.1% tolerance.
The following examples show one typical method for
performing a CTMU current calibration. Example 25-1
demonstrates how to initialize the A/D Converter and the
CTMU. This routine is typical for applications using both
modules. Example 25-2 demonstrates one method for
the actual calibration routine. Note that this method
manually triggers the A/D Converter, which is done to
demonstrate the entire stepwise process. It is also
possible to automatically trigger the conversion by
setting the CTMU’s CTTRIG bit (CTMUCONH<0>).
A/D Converter
CTMU
ANx
RCAL
Current Source
A/D
Trigger
MUX
A/D
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EXAMPLE 25-1: SETUP FOR CTMU CALIBRATION ROUTINES
#include "p18cxxx.h"
/**************************************************************************/
/*Setup CTMU *****************************************************************/
/**************************************************************************/
void setup(void)
{ //CTMUCON - CTMU Control register
CTMUCONH = 0x00; //make sure CTMU is disabled
CTMUCONL = 0X90;
//CTMU continues to run when emulator is stopped,CTMU continues
//to run in idle mode,Time Generation mode disabled, Edges are blocked
//No edge sequence order, Analog current source not grounded, trigger
//output disabled, Edge2 polarity = positive level, Edge2 source =
//source 0, Edge1 polarity = positive level, Edge1 source = source 0,
// Set Edge status bits to zero
//CTMUICON - CTMU Current Control Register
CTMUICON = 0x01; //0.55uA, Nominal - No Adjustment
/**************************************************************************/
//Setup AD converter;
/**************************************************************************/
TRISA=0x04; //set channel 2 as an input
// Configured AN2 as an analog channel
// ANCON0
ANCON0 = 0XFB;
// ANCON1
ANCON1 = 0X1F;
// ADCON1
ADCON1bits.ADFM=1; // Resulst format 1= Right justified
ADCON1bits.ADCAL=0; // Normal A/D conversion operation
ADCON1bits.ACQT=1; // Acquition time 7 = 20TAD 2 = 4TAD 1=2TAD
ADCON1bits.ADCS=2; // Clock conversion bits 6= FOSC/64 2=FOSC/32
ANCON1bits.VBGEN=1; // Turn on the Bandgap needed for Rev A0 parts
// ADCON0
ADCON0bits.VCFG0 =0; // Vref+ = AVdd
ADCON0bits.VCFG1 =0; // Vref- = AVss
ADCON0bits.CHS=2; // Select ADC channel
ADCON0bits.ADON=1; // Turn on ADC
}
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EXAMPLE 25-2: CURRENT CALIBRATION ROUTINE
#include "p18cxxx.h"
#define COUNT 500 //@ 8MHz = 125uS.
#define DELAY for(i=0;i<COUNT;i++)
#define RCAL .027 //R value is 4200000 (4.2M)
//scaled so that result is in
//1/100th of uA
#define ADSCALE 1023 //for unsigned conversion 10 sig bits
#define ADREF 3.3 //Vdd connected to A/D Vr+
int main(void)
{
int i;
int j = 0; //index for loop
unsigned int Vread = 0;
double VTot = 0;
float Vavg=0, Vcal=0, CTMUISrc = 0; //float values stored for calcs
//assume CTMU and A/D have been setup correctly
//see Example 25-1 for CTMU & A/D setup
setup();
CTMUCONHbits.CTMUEN = 1; //Enable the CTMU
for(j=0;j<10;j++)
{
CTMUCONHbits.IDISSEN = 1; //drain charge on the circuit
DELAY; //wait 125us
CTMUCONHbits.IDISSEN = 0; //end drain of circuit
CTMUCONLbits.EDG1STAT = 1; //Begin charging the circuit
//using CTMU current source
DELAY; //wait for 125us
CTMUCONLbits.EDG1STAT = 0; //Stop charging circuit
PIR1bits.ADIF = 0; //make sure A/D Int not set
ADCON0bits.GO=1; //and begin A/D conv.
while(!PIR1bits.ADIF); //Wait for A/D convert complete
Vread = ADRES; //Get the value from the A/D
PIR1bits.ADIF = 0; //Clear A/D Interrupt Flag
VTot += Vread; //Add the reading to the total
}
Vavg = (float)(VTot/10.000); //Average of 10 readings
Vcal = (float)(Vavg/ADSCALE*ADREF);
CTMUISrc = Vcal/RCAL; //CTMUISrc is in 1/100ths of uA
}
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25.3.2 CAPACITANCE CALIBRATION
There is a small amount of capacitance from the inter-
nal A/D Converter sample capacitor as well as stray
capacitance from the circuit board traces and pads that
affect the precision of capacitance measurements. A
measurement of the stray capacitance can be taken by
making sure the desired capacitance to be measured
has been removed. The measurement is then
performed using the following steps:
1. Initialize the A/D Converter and the CTMU.
2. Set EDG1STAT (= 1).
3. Wait for a fixed delay of time, t.
4. Clear EDG1STAT.
5. Perform an A/D conversion.
6. Calculate the stray and A/D sample capacitances:
where I is known from the current source measurement
step, t is a fixed delay and V is measured by performing
an A/D conversion.
This measured value is then stored and used for
calculations of time measurement, or subtracted for
capacitance measurement. For calibration, it is
expected that the capacitance of CSTRAY +CAD is
approximately known. CAD is approximately 4 pF.
An iterative process may need to be used to adjust the
time, t, that the circuit is charged to obtain a reasonable
voltage reading from the A/D Converter. The value of t
may be determined by setting COFFSET to a theoretical
value, then solving for t. For example, if CSTRAY is
theoretically calculated to be 11 pF, and V is expected
to be 70% of VDD, or 2.31V, then t would be:
or 63 s.
See Example 25-3 for a typical routine for CTMU
capacitance calibration.
COFFSET CSTRAY CAD
+ItV==
(4 pF + 11 pF) • 2.31V/0.55 A
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DS39979A-page 310 Preliminary 2010 Microchip Technology Inc.
EXAMPLE 25-3: CAPACITANCE CALIBRATION ROUTINE
#include "p18cxxx.h"
#define COUNT 25 //@ 8MHz INTFRC = 62.5 us.
#define ETIME COUNT*2.5 //time in uS
#define DELAY for(i=0;i<COUNT;i++)
#define ADSCALE 1023 //for unsigned conversion 10 sig bits
#define ADREF 3.3 //Vdd connected to A/D Vr+
#define RCAL .027 //R value is 4200000 (4.2M)
//scaled so that result is in
//1/100th of uA
int main(void)
{
int i;
int j = 0; //index for loop
unsigned int Vread = 0;
float CTMUISrc, CTMUCap, Vavg, VTot, Vcal;
//assume CTMU and A/D have been setup correctly
//see Example 25-1 for CTMU & A/D setup
setup();
CTMUCONHbits.CTMUEN = 1; //Enable the CTMU
for(j=0;j<10;j++)
{
CTMUCONHbits.IDISSEN = 1; //drain charge on the circuit
DELAY; //wait 125us
CTMUCONHbits.IDISSEN = 0; //end drain of circuit
CTMUCONLbits.EDG1STAT = 1; //Begin charging the circuit
//using CTMU current source
DELAY; //wait for 125us
CTMUCONLbits.EDG1STAT = 0; //Stop charging circuit
PIR1bits.ADIF = 0; //make sure A/D Int not set
ADCON0bits.GO=1; //and begin A/D conv.
while(!PIR1bits.ADIF); //Wait for A/D convert complete
Vread = ADRES; //Get the value from the A/D
PIR1bits.ADIF = 0; //Clear A/D Interrupt Flag
VTot += Vread; //Add the reading to the total
}
Vavg = (float)(VTot/10.000); //Average of 10 readings
Vcal = (float)(Vavg/ADSCALE*ADREF);
CTMUISrc = Vcal/RCAL; //CTMUISrc is in 1/100ths of uA
CTMUCap = (CTMUISrc*ETIME/Vcal)/100;
}
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25.4 Measuring Capacitance with the
CTMU
There are two separate methods of measuring capaci-
tance with the CTMU. The first is the absolute method,
in which the actual capacitance value is desired. The
second is the relative method, in which the actual
capacitance is not needed, rather an indication of a
change in capacitance is required.
25.4.1 ABSOLUTE CAPACITANCE
MEASUREMENT
For absolute capacitance measurements, both the
current and capacitance calibration steps found in
Section 25.3 “Calibrating the CTMU Module” should
be followed. Capacitance measurements are then
performed using the following steps:
1. Initialize the A/D Converter.
2. Initialize the CTMU.
3. Set EDG1STAT.
4. Wait for a fixed delay, T.
5. Clear EDG1STAT.
6. Perform an A/D conversion.
7. Calculate the total capacitance, CTOTAL = (I * T)/V,
where I is known from the current source
measurement step (Section 25.3.1 “Current
Source Calibration”), T is a fixed delay and V is
measured by performing an A/D conversion.
8. Subtract the stray and A/D capacitance
(COFFSET from Section 25.3.2 “Capacitance
Calibration”) from CTOTAL to determine the
measured capacitance.
25.4.2 RELATIVE CHARGE
MEASUREMENT
An application may not require precise capacitance
measurements. For example, when detecting a valid
press of a capacitance-based switch, detecting a relative
change of capacitance is of interest. In this type of appli-
cation, when the switch is open (or not touched), the total
capacitance is the capacitance of the combination of the
board traces, the A/D Converter, etc. A larger voltage will
be measured by the A/D Converter. When the switch is
closed (or is touched), the total capacitance is larger due
to the addition of the capacitance of the human body to
the above listed capacitances and a smaller voltage will
be measured by the A/D Converter.
Detecting capacitance changes is easily accomplished
with the CTMU using these steps:
1. Initialize the A/D Converter and the CTMU.
2. Set EDG1STAT.
3. Wait for a fixed delay.
4. Clear EDG1STAT.
5. Perform an A/D conversion.
The voltage measured by performing the A/D conver-
sion is an indication of the relative capacitance. Note
that in this case, no calibration of the current source or
circuit capacitance measurement is needed. See
Example 25-4 for a sample software routine for a
capacitive touch switch.
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EXAMPLE 25-4: ROUTINE FOR CAPACITIVE TOUCH SWITCH
#include "p18cxxx.h"
#define COUNT 500 //@ 8MHz = 125uS.
#define DELAY for(i=0;i<COUNT;i++)
#define OPENSW 1000 //Un-pressed switch value
#define TRIP 300 //Difference between pressed
//and un-pressed switch
#define HYST 65 //amount to change
//from pressed to un-pressed
#define PRESSED 1
#define UNPRESSED 0
int main(void)
{
unsigned int Vread; //storage for reading
unsigned int switchState;
int i;
//assume CTMU and A/D have been setup correctly
//see Example 25-1 for CTMU & A/D setup
setup();
CTMUCONHbits.CTMUEN = 1; //Enable the CTMU
CTMUCONHbits.IDISSEN = 1; //drain charge on the circuit
DELAY; //wait 125us
CTMUCONHbits.IDISSEN = 0; //end drain of circuit
CTMUCONLbits.EDG1STAT = 1; //Begin charging the circuit
//using CTMU current source
DELAY; //wait for 125us
CTMUCONLbits.EDG1STAT = 0; //Stop charging circuit
PIR1bits.ADIF = 0; //make sure A/D Int not set
ADCON0bits.GO=1; //and begin A/D conv.
while(!PIR1bits.ADIF); //Wait for A/D convert complete
Vread = ADRES; //Get the value from the A/D
if(Vread < OPENSW - TRIP)
{
switchState = PRESSED;
}
else if(Vread > OPENSW - TRIP + HYST)
{
switchState = UNPRESSED;
}
}
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25.5 Measuring Time with the CTMU
Module
Time can be precisely measured after the ratio (C/I) is
measured from the current and capacitance calibration
step by following these steps:
1. Initialize the A/D Converter and the CTMU.
2. Set EDG1STAT.
3. Set EDG2STAT.
4. Perform an A/D conversion.
5. Calculate the time between edges as T = (C/I) * V,
where I is calculated in the current calibration step
(Section 25.3.1 “Current Source Calibration”),
C is calculated in the capacitance calibration step
(Section 25.3.2 “Capacitance Calibration”) and
V is measured by performing the A/D conversion.
It is assumed that the time measured is small enough
that the capacitance COFFSET provides a valid voltage to
the A/D Converter. For the smallest time measurement,
always set the A/D Channel Select register (AD1CHS)
to an unused A/D channel; the corresponding pin for
which is not connected to any circuit board trace. This
minimizes added stray capacitance, keeping the total
circuit capacitance close to that of the A/D Converter
itself (25 pF). To measure longer time intervals, an
external capacitor may be connected to an A/D
channel, and this channel selected when making a time
measurement.
FIGURE 25-3: TYPICAL CONNECTIONS AND INTERNAL CONFIGURATION FOR TIME
MEASUREMENT
A/D Converter
CTMU
CTEDG1
CTEDG2
ANX
Output
Pulse
EDG1
EDG2
CAD
RPR
Current Source
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25.6 Creating a Delay with the CTMU
Module
A unique feature on board the CTMU module is its ability
to generate system clock independent output pulses
based on an external capacitor value. This is accom-
plished using the internal comparator voltage reference
module, Comparator 2 input pin and an external capaci-
tor. The pulse is output onto the CTPLS pin. To enable
this mode, set the TGEN bit.
See Figure 25-4 for an example circuit. CPULSE is
chosen by the user to determine the output pulse width
on CTPLS. The pulse width is calculated by
T=(CPULSE /I)*V, where I is known from the current
source measurement step (Section 25.3.1 “Current
Source Calibration”) and V is the internal reference
voltage (CVREF).
An example use of this feature is for interfacing with
variable capacitive-based sensors, such as a humidity
sensor. As the humidity varies, the pulse-width output
on CTPLS will vary. The CTPLS output pin can be con-
nected to an input capture pin and the varying pulse
width is measured to determine the humidity in the
application.
Follow these steps to use this feature:
1. Initialize Comparator 2.
2. Initialize the comparator voltage reference.
3. Initialize the CTMU and enable time delay
generation by setting the TGEN bit.
4. Set EDG1STAT.
5. When CPULSE charges to the value of the voltage
reference trip point, an output pulse is generated
on CTPLS.
FIGURE 25-4: TYPICAL CONNECTIONS AND INTERNAL CONFIGURATION FOR PULSE DELAY
GENERATION
25.7 Operation During Sleep/Idle Modes
25.7.1 SLEEP MODE AND DEEP SLEEP
MODES
When the device enters any Sleep mode, the CTMU
module current source is always disabled. If the CTMU
is performing an operation that depends on the current
source when Sleep mode is invoked, the operation may
not terminate correctly. Capacitance and time
measurements may return erroneous values.
25.7.2 IDLE MODE
The behavior of the CTMU in Idle mode is determined
by the CTMUSIDL bit (CTMUCONH<5>). If CTMUSIDL
is cleared, the module will continue to operate in Idle
mode. If CTMUSIDL is set, the module’s current source
is disabled when the device enters Idle mode. If the
module is performing an operation when Idle mode is
invoked, in this case, the results will be similar to those
with Sleep mode.
25.8 Effects of a Reset on CTMU
Upon Reset, all registers of the CTMU are cleared. This
leaves the CTMU module disabled, its current source is
turned off and all configuration options return to their
default settings. The module needs to be re-initialized
following any Reset.
If the CTMU is in the process of taking a measurement
at the time of Reset, the measurement will be lost. A
partial charge may exist on the circuit that was being
measured, and should be properly discharged before
the CTMU makes subsequent attempts to make a
measurement. The circuit is discharged by setting and
then clearing the IDISSEN bit (CTMUCONH<1>) while
the A/D Converter is connected to the appropriate
channel.
C2
CVREF
CTPLS
Current Source
Comparator
CTMU
CTEDG1
C2INB
CDELAY
EDG1
PIC18F87J72
2010 Microchip Technology Inc. Preliminary DS39979A-page 315
PIC18F87J72 FAMILY
25.9 Registers
There are three control registers for the CTMU:
CTMUCONH
CTMUCONL
CTMUICON
The CTMUCONH and CTMUCONL registers
(Register 25-1 and Register 25-2) contain control bits
for configuring the CTMU module edge source selec-
tion, edge source polarity selection, edge sequencing,
A/D trigger, analog circuit capacitor discharge and
enables. The CTMUICON register (Register 25-3) has
bits for selecting the current source range and current
source trim.
REGISTER 25-1: CTMUCONH: CTMU CONTROL HIGH REGISTER
R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CTMUEN CTMUSIDL TGEN EDGEN EDGSEQEN IDISSEN CTTRIG
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 CTMUEN: CTMU Enable bit
1 = Module is enabled
0 = Module is disabled
bit 6 Unimplemented: Read as ‘0
bit 5 CTMUSIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 4 TGEN: Time Generation Enable bit
1 = Enables edge delay generation
0 = Disables edge delay generation
bit 3 EDGEN: Edge Enable bit
1 = Edges are not blocked
0 = Edges are blocked
bit 2 EDGSEQEN: Edge Sequence Enable bit
1 = Edge 1 event must occur before Edge 2 event can occur
0 = No edge sequence is needed
bit 1 IDISSEN: Analog Current Source Control bit
1 = Analog current source output is grounded
0 = Analog current source output is not grounded
bit 0 CTTRIG: Trigger Control bit
1 = Trigger output is enabled
0 = Trigger output is disabled
PIC18F87J72 FAMILY
DS39979A-page 316 Preliminary 2010 Microchip Technology Inc.
REGISTER 25-2: CTMUCONL: CTMU CONTROL LOW REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
EDG2POL EDG2SEL1 EDG2SEL0 EDG1POL EDG1SEL1 EDG1SEL0 EDG2STAT EDG1STAT
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 EDG2POL: Edge 2 Polarity Select bit
1 = Edge 2 is programmed for a positive edge response
0 = Edge 2 is programmed for a negative edge response
bit 6-5 EDG2SEL<1:0>: Edge 2 Source Select bits
11 = CTEDG1 pin
10 = CTEDG2 pin
01 = CCP1 Special Event Trigger
00 = CCP2 Special Event Trigger
bit 4 EDG1POL: Edge 1 Polarity Select bit
1 = Edge 1 is programmed for a positive edge response
0 = Edge 1 is programmed for a negative edge response
bit 3-2 EDG1SEL<1:0>: Edge 1 Source Select bits
11 = CTEDG1 pin
10 = CTEDG2 pin
01 = CCP1 Special Event Trigger
00 = CCP2 Special Event Trigger
bit 1 EDG2STAT: Edge 2 Status bit
1 = Edge 2 event has occurred
0 = Edge 2 event has not occurred
bit 0 EDG1STAT: Edge 1 Status bit
1 = Edge 1 event has occurred
0 = Edge 1 event has not occurred
2010 Microchip Technology Inc. Preliminary DS39979A-page 317
PIC18F87J72 FAMILY
TABLE 25-1: REGISTERS ASSOCIATED WITH CTMU MODULE
REGISTER 25-3: CTMUICON: CTMU CURRENT CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ITRIM5 ITRIM4 ITRIM3 ITRIM2 ITRIM1 ITRIM0 IRNG1 IRNG0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-2 ITRIM<5:0>: Current Source Trim bits
011111 = Maximum positive change from nominal current
011110
.
.
.
000001 = Minimum positive change from nominal current
000000 = Nominal current output specified by IRNG<1:0>
111111 = Minimum negative change from nominal current
.
.
.
100010
100001 = Maximum negative change from nominal current
bit 1-0 IRNG<1:0>: Current Source Range Select bits
11 = 100 x Base current
10 = 10 x Base current
01 = Base current level (0.55 A nominal)
00 = Current source disabled
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on page:
CTMUCONH CTMUEN CTMUSIDL TGEN EDGEN EDGSEQEN IDISSEN CTTRIG
CTMUCONL EDG2POL EDG2SEL1 EDG2SEL0 EDG1POL EDG1SEL1 EDG1SEL0 EDG2STAT EDG1STAT
CTMUICON ITRIM5 ITRIM4 ITRIM3 ITRIM2 ITRIM1 ITRIM0 IRNG1 IRNG0
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used during CCP operation.
PIC18F87J72 FAMILY
DS39979A-page 318 Preliminary 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. Preliminary DS39979A-page 319
PIC18F87J72 FAMILY
26.0 SPECIAL FEATURES OF THE
CPU
PIC18F87J72 family devices include several features
intended to maximize reliability and minimize cost
through elimination of external components. These are:
Oscillator Selection
Resets:
- Power-on Reset (POR)
- Power-up Timer (PWRT)
- Oscillator Start-up Timer (OST)
- Brown-out Reset (BOR)
Interrupts
Watchdog Timer (WDT)
Fail-Safe Clock Monitor
Two-Speed Start-up
Code Protection
In-Circuit Serial Programming
The oscillator can be configured for the application
depending on frequency, power, accuracy and cost. All
of the options are discussed in detail in Section 3.0
“Oscillator Configurations.
A complete discussion of device Resets and interrupts
is available in previous sections of this data sheet.
In addition to their Power-up and Oscillator Start-up
Timers provided for Resets, the PIC18F87J72 family of
devices has a configurable Watchdog Timer which is
controlled in software.
The inclusion of an internal RC oscillator also provides
the additional benefits of a Fail-Safe Clock Monitor
(FSCM) and Two-Speed Start-up. FSCM provides for
background monitoring of the peripheral clock and
automatic switchover in the event of its failure.
Two-Speed Start-up enables code to be executed
almost immediately on start-up, while the primary clock
source completes its start-up delays.
All of these features are enabled and configured by
setting the appropriate Configuration register bits.
26.1 Configuration Bits
The Configuration bits can be programmed (read as
0’), or left unprogrammed (read as ‘1), to select
various device configurations. These bits are mapped
starting at program memory location, 300000h. A
complete list is shown in Table 26-2. A detailed
explanation of the various bit functions is provided in
Register 26-1 through Register 26-6.
26.1.1 CONSIDERATIONS FOR
CONFIGURING PIC18F87J72
FAMILY DEVICES
Devices of the PIC18F87J72 family do not use persis-
tent memory registers to store configuration information.
The configuration bytes are implemented as volatile
memory which means that configuration data must be
programmed each time the device is powered up.
Configuration data is stored in the three words at the
top of the on-chip program memory space, known as
the Flash Configuration Words. It is stored in program
memory in the same order shown in Table 26-2, with
CONFIG1L at the lowest address and CONFIG3H at
the highest. The data is automatically loaded in the
proper Configuration registers during device power-up.
When creating applications for these devices, users
should always specifically allocate the location of the
Flash Configuration Word for configuration data. This is
to make certain that program code is not stored in this
address when the code is compiled.
The volatile memory cells used for the Configuration
bits always reset to ‘1’ on Power-on Resets. For all
other types of Reset events, the previously
programmed values are maintained and used without
reloading from program memory.
The four Most Significant bits of CONFIG1H,
CONFIG2H and CONFIG3H in program memory
should also be ‘1111’. This makes these Configuration
Words appear to be NOP instructions in the remote
event that their locations are ever executed by
accident. Since Configuration bits are not implemented
in the corresponding locations, writing ‘1’s to these
locations has no effect on device operation.
To prevent inadvertent configuration changes during
code execution, all programmable Configuration bits
are write-once. After a bit is initially programmed during
a power cycle, it cannot be written to again. Changing
a device configuration requires that power to the device
be cycled.
TABLE 26-1: MAPPING OF THE FLASH
CONFIGURATION WORDS TO
THE CONFIGURATION
REGISTERS
Configuration
Byte
Code Space
Address
Configuration
Register
Address
CONFIG1L XXXF8h 300000h
CONFIG1H XXXF9h 300001h
CONFIG2L XXXFAh 300002h
CONFIG2H XXXFBh 300003h
CONFIG3L XXXFCh 300004h
CONFIG3H XXXFDh 300005h
PIC18F87J72 FAMILY
DS39979A-page 320 Preliminary 2010 Microchip Technology Inc.
TABLE 26-2: CONFIGURATION BITS AND DEVICE IDs
File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Default/
Unprogrammed
Value(1)
300000h CONFIG1L DEBUG XINST STVREN ————WDTEN111- ---1
300001h CONFIG1H (2) (2) (2) (2) (3) CP0 ---- 01--
300002h CONFIG2L IESO FCMEN LPT1OSC T1DIG FOSC2 FOSC1 FOSC0 11-1 1111
300003h CONFIG2H (2) (2) (2) (2) WDTPS3 WDTPS2 WDTPS1 WDTPS0 ---- 1111
300004h CONFIG3L (2) (2) (2) (2) —RTCOSC---- --1-
300005h CONFIG3H (2) (2) (2) (2) CCP2MX ---- ---1
3FFFFEh DEVID1 DEV2 DEV1 DEV0 REV4 REV3 REV2 REV1 REV0 01xx xxxx(4)
3FFFFFh DEVID2 DEV10 DEV9 DEV8 DEV7 DEV6 DEV5 DEV4 DEV3 0101 0000(4)
Legend: x = unknown, - = unimplemented. Shaded cells are unimplemented, read as ‘0’.
Note 1: Values reflect the unprogrammed state as received from the factory and following Power-on Resets. In all other Reset
states, the configuration bytes maintain their previously programmed states.
2: The value of these bits in program memory should always be ‘1’. This ensures that the location is executed as a NOP if it
is accidentally executed.
3: This bit should always be maintained as 0’.
4: These registers are read-only and cannot be programmed by the user. See Register 26-7 for device-specific values for
DEVID1.
2010 Microchip Technology Inc. Preliminary DS39979A-page 321
PIC18F87J72 FAMILY
REGISTER 26-1: CONFIG1L: CONFIGURATION REGISTER 1 LOW (BYTE ADDRESS 300000h)
R/WO-1 R/WO-1 R/WO-1 U-0 U-0 U-0 U-0 R/WO-1
DEBUG XINST STVREN ————WDTEN
bit 7 bit 0
Legend:
R = Readable bit WO = Write-Once bit U = Unimplemented bit, read as ‘0’
-n = Value when device is unprogrammed ‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 DEBUG: Background Debugger Enable bit
1 = Background debugger is disabled; RB6 and RB7 are configured as general purpose I/O pins
0 = Background debugger is enabled; RB6 and RB7 are dedicated to In-Circuit Debug
bit 6 XINST: Extended Instruction Set Enable bit
1 = Instruction set extension and Indexed Addressing mode are enabled
0 = Instruction set extension and Indexed Addressing mode are disabled (Legacy mode)
bit 5 STVREN: Stack Overflow/Underflow Reset Enable bit
1 = Reset on stack overflow/underflow is enabled
0 = Reset on stack overflow/underflow is disabled
bit 4-1 Unimplemented: Read as0
bit 0 WDTEN: Watchdog Timer Enable bit
1 = WDT is enabled
0 = WDT is disabled (control is placed on SWDTEN bit)
REGISTER 26-2: CONFIG1H: CONFIGURATION REGISTER 1 HIGH (BYTE ADDRESS 300001h)
U-0 U-0 U-0 U-0 U-0 R/WO-1 U-0 U-0
(1) (1) (1) (1) (2) CP0
bit 7 bit 0
Legend:
R = Readable bit WO = Write-Once bit U = Unimplemented bit, read as ‘0’
-n = Value when device is unprogrammed ‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-3 Unimplemented: Read as0
bit 2 CP0: Code Protection bit
1 = Program memory is not code-protected
0 = Program memory is code-protected
bit 1-0 Unimplemented: Read as0
Note 1: The value of these bits in program memory should always be ‘1’. This ensures that the location is
executed as a NOP if it is accidentally executed.
2: This bit should always be maintained as ‘0’.
PIC18F87J72 FAMILY
DS39979A-page 322 Preliminary 2010 Microchip Technology Inc.
REGISTER 26-3: CONFIG2L: CONFIGURATION REGISTER 2 LOW (BYTE ADDRESS 300002h)
R/WO-1 R/WO-1 U-0 R/WO-1 R/WO-1 R/WO-1 R/WO-1 R/WO-1
IESO FCMEN LPT1OSC T1DIG FOSC2 FOSC1 FOSC0
bit 7 bit 0
Legend:
R = Readable bit WO = Write-Once bit U = Unimplemented bit, read as ‘0’
-n = Value when device is unprogrammed ‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 IESO: Two-Speed Start-up (Internal/External Oscillator Switchover) Control bit
1 = Two-Speed Start-up is enabled
0 = Two-Speed Start-up is disabled
bit 6 FCMEN: Fail-Safe Clock Monitor Enable bit
1 = Fail-Safe Clock Monitor is enabled
0 = Fail-Safe Clock Monitor is disabled
bit 5 Unimplemented: Read as0
bit 4 LPT1OSC: T1OSC/SOSC Power Selection Configuration bit
1 = High-power T1OSC/SOSC circuit is selected
0 = Low-power T1OSC/SOSC circuit is selected
bit 3 T1DIG: T1CKI for Digital Input Clock Enable bit
1 = T1CKI is available as a digital input without enabling T1OSCEN
0 = T1CKI is not available as a digital input without enabling T1OSCEN
bit 2-0 FOSC<2:0>: Oscillator Selection bits
111 = ECPLL OSC1/OSC2 as primary; ECPLL oscillator with PLL is enabled; CLKO on RA6
110 = EC OSC1/OSC2 as primary; external clock with FOSC/4 output
101 = HSPLL OSC1/OSC2 as primary; high-speed crystal/resonator with software PLL control
100 = HS OSC1/OSC2 as primary; high-speed crystal/resonator
011 = INTPLL1 internal oscillator block with software PLL control; FOSC/4 output
010 = INTIO1 internal oscillator block with FOSC/4 output on RA6 and I/O on RA7
001 = INTPLL2 internal oscillator block with software PLL control and I/O on RA6 and RA7
000 = INTIO2 internal oscillator block with I/O on RA6 and RA7
2010 Microchip Technology Inc. Preliminary DS39979A-page 323
PIC18F87J72 FAMILY
REGISTER 26-4: CONFIG2H: CONFIGURATION REGISTER 2 HIGH (BYTE ADDRESS 300003h)
U-0 U-0 U-0 U-0 R/WO-1 R/WO-1 R/WO-1 R/WO-1
(1) (1) (1) (1) WDTPS3 WDTPS2 WDTPS1 WDTPS0
bit 7 bit 0
Legend:
R = Readable bit WO = Write-Once bit U = Unimplemented bit, read as ‘0’
-n = Value when device is unprogrammed ‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-4 Unimplemented: Read as0
bit 3-0 WDTPS<3:0>: Watchdog Timer Postscale Select bits
1111 = 1:32,768
1110 = 1:16,384
1101 = 1:8,192
1100 = 1:4,096
1011 = 1:2,048
1010 = 1:1,024
1001 = 1:512
1000 = 1:256
0111 = 1:128
0110 = 1:64
0101 = 1:32
0100 = 1:16
0011 = 1:8
0010 = 1:4
0001 = 1:2
0000 = 1:1
Note 1: The value of these bits in program memory should always be ‘1’. This ensures that the location is
executed as a NOP if it is accidentally executed.
REGISTER 26-5: CONFIG3L: CONFIGURATION REGISTER 3 LOW (BYTE ADDRESS 300004h)
U-0 U-0 U-0 U-0 U-0 U-0 R/WO-1 U-0
(1) (1) (1) (1) —RTCOSC
bit 7 bit 0
Legend:
R = Readable bit WO = Write-Once bit U = Unimplemented bit, read as ‘0’
-n = Value when device is unprogrammed ‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-2 Unimplemented: Read as0
bit 1 RTCOSC: RTCC Reference Clock Select bit
1 = RTCC uses T1OSC/T1CKI as the reference clock
0 = RTCC uses INTRC as the reference clock
bit 0 Unimplemented: Read as0
Note 1: The value of these bits in program memory should always be ‘1’. This ensures that the location is
executed as a NOP if it is accidentally executed.
PIC18F87J72 FAMILY
DS39979A-page 324 Preliminary 2010 Microchip Technology Inc.
REGISTER 26-6: CONFIG3H: CONFIGURATION REGISTER 3 HIGH (BYTE ADDRESS 300005h)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/WO-1
(1) (1) (1) (1) CCP2MX
bit 7 bit 0
Legend:
R = Readable bit WO = Write-Once bit U = Unimplemented bit, read as ‘0’
-n = Value when device is unprogrammed ‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-1 Unimplemented: Read as0
bit 0 CCP2MX: CCP2 MUX bit
1 = CCP2 is multiplexed with RC1
0 = CCP2 is multiplexed with RE7
Note 1: The value of these bits in program memory should always be ‘1’. This ensures that the location is
executed as a NOP if it is accidentally executed.
REGISTER 26-7: DEVID1: DEVICE ID REGISTER 1
RRRRRRRR
DEV2 DEV1 DEV0 REV4 REV3 REV2 REV1 REV0
bit 7 bit 0
Legend:
R = Read-only bit
bit 7-5 DEV<2:0>: Device ID bits
011 = PIC18F87J72
010 = PIC18F86J72
bit 4-0 REV<4:0>: Revision ID bits
These bits are used to indicate the device revision.
REGISTER 26-8: DEVID2: DEVICE ID REGISTER 2
RRRRRRRR
DEV10(1) DEV9(1) DEV8(1) DEV7(1) DEV6(1) DEV5(1) DEV4(1) DEV3(1)
bit 7 bit 0
Legend:
R = Read-only bit
bit 7-0 DEV<10:3>: Device ID bits(1)
These bits are used with the DEV<2:0> bits in the Device ID Register 1 to identify the part number.
0101 0000 = PIC18F87J72 family devices
Note 1: The values for DEV<10:3> may be shared with other device families. The specific device is always
identified by using the entire DEV<10:0> bit sequence.
2010 Microchip Technology Inc. Preliminary DS39979A-page 325
PIC18F87J72 FAMILY
26.2 Watchdog Timer (WDT)
For PIC18F87J72 family devices, the WDT is driven by
the INTRC oscillator. When the WDT is enabled, the
clock source is also enabled. The nominal WDT period is
4 ms and has the same stability as the INTRC oscillator.
The 4 ms period of the WDT is multiplied by a 16-bit
postscaler. Any output of the WDT postscaler is
selected by a multiplexer, controlled by the WDTPS bits
in Configuration Register 2H. Available periods range
from 4 ms to 131.072 seconds (2.18 minutes). The
WDT and postscaler are cleared whenever a SLEEP or
CLRWDT instruction is executed, or a clock failure
(primary or Timer1 oscillator) has occurred.
26.2.1 CONTROL REGISTER
The WDTCON register (Register 26-9) is a readable
and writable register. The SWDTEN bit enables or dis-
ables WDT operation. This allows software to override
the WDTEN Configuration bit and enable the WDT only
if it has been disabled by the Configuration bit.
FIGURE 26-1: WDT BLOCK DIAGRAM
Note 1: The CLRWDT and SLEEP instructions
clear the WDT and postscaler counts
when executed.
2: When a CLRWDT instruction is executed,
the postscaler count will be cleared.
INTRC Oscillator
WDT
Wake-up from
Reset
WDT
WDT Counter
Programmable Postscaler
1:1 to 1:32,768
Enable WDT
WDTPS<3:0>
SWDTEN
CLRWDT
4
Power-Managed
Reset
All Device Resets
Sleep
INTRC Control
128 Modes
PIC18F87J72 FAMILY
DS39979A-page 326 Preliminary 2010 Microchip Technology Inc.
TABLE 26-3: SUMMARY OF WATCHDOG TIMER REGISTERS
REGISTER 26-9: WDTCON: WATCHDOG TIMER CONTROL REGISTER
R/W-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0
REGSLP(1) —SWDTEN
(2)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 REGSLP: Voltage Regulator Low-Power Operation Enable bit(1)
1 = On-chip regulator enters low-power operation when device enters Sleep mode
0 = On-chip regulator continues to operate normally in Sleep mode
bit 6-1 Unimplemented: Read as 0
bit 0 SWDTEN: Software Controlled Watchdog Timer Enable bit(2)
1 = Watchdog Timer is on
0 = Watchdog Timer is off
Note 1: The REGSLP bit is automatically cleared when a Low-Voltage Detect condition occurs.
2: This bit has no effect if the Configuration bit, WDTEN, is enabled.
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values
on page
RCON IPEN CM RI TO PD POR BOR 50
WDTCON REGSLP —SWDTEN 50
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Watchdog Timer.
2010 Microchip Technology Inc. Preliminary DS39979A-page 327
PIC18F87J72 FAMILY
26.3 On-Chip Voltage Regulator
All of the PIC18F87J72 family devices power their core
digital logic at a nominal 2.5V. For designs that are
required to operate at a higher typical voltage, such as
3.3V, all devices in the PIC18F87J72 family incorporate
an on-chip regulator that allows the device to run its
core logic from VDD.
The regulator is controlled by the ENVREG pin. Tying
VDD to the pin enables the regulator, which in turn, pro-
vides power to the core from the other VDD pins. When
the regulator is enabled, a low-ESR filter capacitor
must be connected to the VDDCORE/VCAP pin
(Figure 26-2). This helps to maintain the stability of the
regulator. The recommended value for the filter capac-
itor is provided in Section 29.3 “DC Characteristics:
PIC18F87J72 Family (Industrial)”.
If ENVREG is tied to VSS, the regulator is disabled. In
this case, separate power for the core logic, at a nomi-
nal 2.5V, must be supplied to the device on the
VDDCORE/VCAP pin to run the I/O pins at higher voltage
levels, typically 3.3V. Alternatively, the VDDCORE/VCAP
and VDD pins can be tied together to operate at a lower
nominal voltage. Refer to Figure 26-2 for possible
configurations.
26.3.1 VOLTAGE REGULATION AND
LOW-VOLTAGE DETECTION
When it is enabled, the on-chip regulator provides a
constant voltage of 2.5V nominal to the digital core
logic. The regulator can provide this level from a VDD of
about 2.5V, all the way up to the device’s VDDMAX. It
does not have the capability to boost VDD levels below
2.5V.
In order to prevent “brown-out” conditions, when the
voltage drops too low for the regulator, the regulator
enters Tracking mode. In Tracking mode, the regulator
output follows VDD, with a typical voltage drop of
100 mV.
The on-chip regulator includes a simple Low-Voltage
Detect (LVD) circuit. If VDD drops too low to maintain
approximately 2.45V on VDDCORE, the circuit sets the
Low-Voltage Detect Interrupt Flag, LVDIF (PIR2<2>),
and clears the REGSLP (WDTCON<7>) bit if it was set.
This can be used to generate an interrupt and puts the
application into a low-power operational mode or
triggers an orderly shutdown. Low-Voltage Detection is
only available when the regulator is enabled.
FIGURE 26-2: CONNECTIONS FOR THE
ON-CHIP REGULATOR
VDD
ENVREG
VDDCORE/VCAP
VSS
3.3V(1)
2.5V(1)
VDD
ENVREG
VDDCORE/VCAP
VSS
CF
3.3V
Regulator Enabled (ENVREG tied to VDD):
Regulator Disabled (ENVREG tied to ground):
VDD
ENVREG
VDDCORE/VCAP
VSS
2.5V(1)
Regulator Disabled (VDD tied to VDDCORE):
Note 1: These are typical operating voltages. For
the full operating ranges of VDD and
VDDCORE, refer to Section 29.1 “DC
Characteristics: Supply Voltage
PIC18F87J72 Family (Industrial)”.
PIC18F87J72
PIC18F87J72
PIC18F87J72
PIC18F87J72 FAMILY
DS39979A-page 328 Preliminary 2010 Microchip Technology Inc.
26.3.2 ON-CHIP REGULATOR AND BOR
When the on-chip regulator is enabled, PIC18F87J72
family devices also have a simple Brown-out Reset
capability. If the voltage supplied to the regulator falls to
a level that is inadequate to maintain a regulated output
for full-speed operation, the regulator Reset circuitry
will generate a Brown-out Reset. This event is captured
by the BOR flag bit (RCON<0>).
The operation of the BOR is described in more detail in
Section 5.4 “Brown-out Reset (BOR)” and
Section 5.4.1 “Detecting BOR.
26.3.3 POWER-UP REQUIREMENTS
The on-chip regulator is designed to meet the power-up
requirements for the device. If the application does not
use the regulator, then strict power-up conditions must
be adhered to. While powering up, VDDCORE must
never exceed VDD by 0.3 volts.
26.3.4 OPERATION IN SLEEP MODE
When enabled, the on-chip regulator always consumes
a small incremental amount of current over IDD. This
includes when the device is in Sleep mode, even
though the core digital logic does not require power. To
provide additional savings in applications where power
resources are critical, the regulator can be configured
to automatically disable itself whenever the device
goes into Sleep mode. This feature is controlled by the
REGSLP bit (WDTCON<7>). Setting this bit disables
the regulator in Sleep mode and reduces its current
consumption to a minimum.
Substantial Sleep mode power savings can be
obtained by setting the REGSLP bit, but device
wake-up time will increase in order to ensure the
regulator has enough time to stabilize.
The REGSLP bit is automatically cleared by hardware
when a Low-Voltage Detect condition occurs. The
REGSLP bit can be set again in software, which would
continue to keep the voltage regulator in Low-Power
mode. This, however, is not recommended if any write
operations to the Flash will be performed.
26.4 Two-Speed Start-up
The Two-Speed Start-up feature helps to minimize the
latency period, from oscillator start-up to code execu-
tion, by allowing the microcontroller to use the INTRC
oscillator as a clock source until the primary clock
source is available. It is enabled by setting the IESO
Configuration bit.
Two-Speed Start-up should be enabled only if the
primary oscillator mode is HS or HSPLL
(Crystal-Based) modes. Since the EC and ECPLL
modes do not require an OST start-up delay,
Two-Speed Start-up should be disabled.
When enabled, Resets and wake-ups from Sleep mode
cause the device to configure itself to run from the inter-
nal oscillator block as the clock source, following the
time-out of the Power-up Timer after a Power-on Reset
is enabled. This allows almost immediate code
execution while the primary oscillator starts and the
OST is running. Once the OST times out, the device
automatically switches to PRI_RUN mode.
In all other power-managed modes, Two-Speed
Start-up is not used. The device will be clocked by the
currently selected clock source until the primary clock
source becomes available. The setting of the IESO bit
is ignored.
FIGURE 26-3: TIMING TRANSITION FOR TWO-SPEED START-UP (INTRC TO HSPLL)
Q1 Q3 Q4
OSC1
Peripheral
Program PC PC + 2
INTRC
PLL Clock
Q1
PC + 6
Q2
Output
Q3 Q4 Q1
CPU Clock
PC + 4
Clock
Counter
Q2 Q2 Q3
Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.
Wake from Interrupt Event
TPLL(1)
12 n-1n
Clock
OSTS bit Set
Transition
TOST(1)
2010 Microchip Technology Inc. Preliminary DS39979A-page 329
PIC18F87J72 FAMILY
26.4.1 SPECIAL CONSIDERATIONS FOR
USING TWO-SPEED START-UP
While using the INTRC oscillator in Two-Speed
Start-up, the device still obeys the normal command
sequences for entering power-managed modes,
including serial SLEEP instructions (refer to
Section 4.1.4 “Multiple Sleep Commands”). In prac-
tice, this means that user code can change the
SCS<1:0> bit settings or issue SLEEP instructions
before the OST times out. This would allow an applica-
tion to briefly wake-up, perform routine “housekeeping”
tasks and return to Sleep before the device starts to
operate from the primary oscillator.
User code can also check if the primary clock source is
currently providing the device clocking by checking the
status of the OSTS bit (OSCCON<3>). If the bit is set,
the primary oscillator is providing the clock. Otherwise,
the internal oscillator block is providing the clock during
wake-up from Reset or Sleep mode.
26.5 Fail-Safe Clock Monitor
The Fail-Safe Clock Monitor (FSCM) allows the
microcontroller to continue operation in the event of an
external oscillator failure by automatically switching the
device clock to the internal oscillator block. The FSCM
function is enabled by setting the FCMEN Configuration
bit.
When FSCM is enabled, the INTRC oscillator runs at
all times to monitor clocks to peripherals and provides
a backup clock in the event of a clock failure. Clock
monitoring (shown in Figure 26-4) is accomplished by
creating a sample clock signal, which is the INTRC out-
put divided by 64. This allows ample time between
FSCM sample clocks for a peripheral clock edge to
occur. The peripheral device clock and the sample
clock are presented as inputs to the Clock Monitor
(CM) latch. The CM is set on the falling edge of the
device clock source but cleared on the rising edge of
the sample clock.
FIGURE 26-4: FSCM BLOCK DIAGRAM
Clock failure is tested for on the falling edge of the
sample clock. If a sample clock falling edge occurs
while CM is still set, a clock failure has been detected
(Figure 26-5). This causes the following:
the FSCM generates an oscillator fail interrupt by
setting bit, OSCFIF (PIR2<7>);
the device clock source is switched to the internal
oscillator block (OSCCON is not updated to show
the current clock source – this is the fail-safe
condition); and
the WDT is reset.
During switchover, the postscaler frequency from the
internal oscillator block may not be sufficiently stable
for timing-sensitive applications. In these cases, it may
be desirable to select another clock configuration and
enter an alternate power-managed mode. This can be
done to attempt a partial recovery or execute a
controlled shutdown. See Section 4.1.4 “Multiple
Sleep Commands” and Section 26.4.1 “Special
Considerations for Using Two-Speed Start-up” for
more details.
The FSCM will detect failures of the primary or secondary
clock sources only. If the internal oscillator block fails, no
failure would be detected, nor would any action be
possible.
26.5.1 FSCM AND THE WATCHDOG TIMER
Both the FSCM and the WDT are clocked by the
INTRC oscillator. Since the WDT operates with a
separate divider and counter, disabling the WDT has
no effect on the operation of the INTRC oscillator when
the FSCM is enabled.
As already noted, the clock source is switched to the
INTRC clock when a clock failure is detected. This may
mean a substantial change in the speed of code execu-
tion. If the WDT is enabled with a small prescale value,
a decrease in clock speed allows a WDT time-out to
occur and a subsequent device Reset. For this reason,
Fail-Safe Clock Monitor events also reset the WDT and
postscaler, allowing it to start timing from when execu-
tion speed was changed and decreasing the likelihood
of an erroneous time-out.
If the interrupt is disabled, subsequent interrupts while
in Idle mode will cause the CPU to begin executing
instructions while being clocked by the INTRC source.
Peripheral
INTRC ÷ 64
S
C
Q
(32 s) 488 Hz
(2.048 ms)
Clock Monitor
Latch (CM)
(edge-triggered)
Clock
Failure
Detected
Source
Clock
Q
PIC18F87J72 FAMILY
DS39979A-page 330 Preliminary 2010 Microchip Technology Inc.
FIGURE 26-5: FSCM TIMING DIAGRAM
26.5.2 EXITING FAIL-SAFE OPERATION
The fail-safe condition is terminated by either a device
Reset or by entering a power-managed mode. On
Reset, the controller starts the primary clock source
specified in Configuration Register 2H (with any
required start-up delays that are required for the oscil-
lator mode, such as OST or PLL timer). The INTRC
oscillator provides the device clock until the primary
clock source becomes ready (similar to a Two-Speed
Start-up). The clock source is then switched to the
primary clock (indicated by the OSTS bit in the
OSCCON register becoming set). The Fail-Safe Clock
Monitor then resumes monitoring the peripheral clock.
The primary clock source may never become ready
during start-up. In this case, operation is clocked by the
INTOSC multiplexer. The OSCCON register will remain
in its Reset state until a power-managed mode is
entered.
26.5.3 FSCM INTERRUPTS IN
POWER-MANAGED MODES
By entering a power-managed mode, the clock
multiplexer selects the clock source selected by the
OSCCON register. Fail-Safe Clock Monitoring of the
power-managed clock source resumes in the
power-managed mode.
If an oscillator failure occurs during power-managed
operation, the subsequent events depend on whether
or not the oscillator failure interrupt is enabled. If
enabled (OSCFIF = 1), code execution will be clocked
by the INTRC multiplexer. An automatic transition back
to the failed clock source will not occur.
26.5.4 POR OR WAKE-UP FROM SLEEP
The FSCM is designed to detect oscillator failure at any
point after the device has exited Power-on Reset
(POR) or low-power Sleep mode. When the primary
device clock is either EC or INTRC mode, monitoring
can begin immediately following these events.
For HS or HSPLL modes, the situation is somewhat dif-
ferent. Since the oscillator may require a start-up time
considerably longer than the FSCM sample clock time,
a false clock failure may be detected. To prevent this,
the internal oscillator block is automatically configured
as the device clock and functions until the primary clock
is stable (the OST and PLL timers have timed out). This
is identical to Two-Speed Start-up mode. Once the
primary clock is stable, the INTRC returns to its role as
the FSCM source.
As noted in Section 26.4.1 “Special Considerations
for Using Two-Speed Start-up”, it is also possible to
select another clock configuration and enter an alternate
power-managed mode while waiting for the primary
clock to become stable. When the new power-managed
mode is selected, the primary clock is disabled.
OSCFIF
CM Output
Device
Clock
Output
Sample Clock
Failure
Detected
Oscillator
Failure
Note: The device clock is normally at a much higher frequency than the sample clock. The relative frequencies in
this example have been chosen for clarity.
(Q)
CM Test CM Test CM Test
Note: The same logic that prevents false
oscillator failure interrupts on POR, or
wake from Sleep, will also prevent the
detection of the oscillator’s failure to start
at all following these events. This can be
avoided by monitoring the OSTS bit and
using a timing routine to determine if the
oscillator is taking too long to start. Even
so, no oscillator failure interrupt will be
flagged.
2010 Microchip Technology Inc. Preliminary DS39979A-page 331
PIC18F87J72 FAMILY
26.6 Program Verification and
Code Protection
For all devices in the PIC18F87J72 family of devices,
the on-chip program memory space is treated as a
single block. Code protection for this block is controlled
by one Configuration bit, CP0. This bit inhibits external
reads and writes to the program memory space. It has
no direct effect in normal execution mode.
26.6.1 CONFIGURATION REGISTER
PROTECTION
The Configuration registers are protected against
untoward changes or reads in two ways. The primary
protection is the write-once feature of the Configuration
bits, which prevents reconfiguration once the bit has
been programmed during a power cycle. To safeguard
against unpredictable events, Configuration bit
changes resulting from individual cell-level disruptions
(such as ESD events) will cause a parity error and
trigger a device Reset.
The data for the Configuration registers is derived from
the Flash Configuration Words in program memory.
When the CP0 bit set, the source data for device
configuration is also protected as a consequence.
26.7 In-Circuit Serial Programming
PIC18F87J72 family microcontrollers can be serially
programmed while in the end application circuit. This is
simply done with two lines for clock and data, and three
other lines for power, ground and the programming
voltage. This allows customers to manufacture boards
with unprogrammed devices and then program the
microcontroller just before shipping the product. This
also allows the most recent firmware or a custom
firmware to be programmed.
26.8 In-Circuit Debugger
When the DEBUG Configuration bit is programmed to
a ‘0’, the In-Circuit Debugger functionality is enabled.
This function allows simple debugging functions when
used with MPLAB® IDE. When the microcontroller has
this feature enabled, some resources are not available
for general use. Table 26-4 shows which resources are
required by the background debugger.
TABLE 26-4: DEBUGGER RESOURCES
I/O Pins: RB6, RB7
Stack: 2 levels
Program Memory: 512 bytes
Data Memory: 10 bytes
PIC18F87J72 FAMILY
DS39979A-page 332 Preliminary 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. Preliminary DS39979A-page 333
PIC18F87J72 FAMILY
27.0 INSTRUCTION SET SUMMARY
The PIC18F87J72 family of devices incorporates the
standard set of 75 PIC18 core instructions, as well as
an extended set of 8 new instructions for the optimiza-
tion of code that is recursive or that utilizes a software
stack. The extended set is discussed later in this
section.
27.1 Standard Instruction Set
The standard PIC18 MCU instruction set adds many
enhancements to the previous PIC® MCU instruction
sets, while maintaining an easy migration from these
PIC MCU instruction sets. Most instructions are a
single program memory word (16 bits), but there are
four instructions that require two program memory
locations.
Each single-word instruction is a 16-bit word divided
into an opcode, which specifies the instruction type and
one or more operands, which further specify the
operation of the instruction.
The instruction set is highly orthogonal and is grouped
into four basic categories:
Byte-oriented operations
Bit-oriented operations
Literal operations
Control operations
The PIC18 instruction set summary in Table 27-2 lists
byte-oriented, bit-oriented, literal and control
operations. Table 27-1 shows the opcode field
descriptions.
Most byte-oriented instructions have three operands:
1. The file register (specified by ‘f’)
2. The destination of the result (specified by ‘d’)
3. The accessed memory (specified by ‘a’)
The file register designator, ‘f’, specifies which file reg-
ister is to be used by the instruction. The destination
designator, ‘d’, specifies where the result of the
operation is to be placed. If ‘d’ is zero, the result is
placed in the WREG register. If ‘d’ is one, the result is
placed in the file register specified in the instruction.
All bit-oriented instructions have three operands:
1. The file register (specified by ‘f’)
2. The bit in the file register (specified by ‘b’)
3. The accessed memory (specified by ‘a’)
The bit field designator, ‘b’, selects the number of the bit
affected by the operation, while the file register desig-
nator, ‘f’, represents the number of the file in which the
bit is located.
The literal instructions may use some of the following
operands:
A literal value to be loaded into a file register
(specified by ‘k’)
The desired FSR register to load the literal value
into (specified by ‘f’)
No operand required
(specified by ‘—’)
The control instructions may use some of the following
operands:
A program memory address (specified by ‘n’)
The mode of the CALL or RETURN instructions
(specified by ‘s’)
The mode of the table read and table write
instructions (specified by ‘m’)
No operand required
(specified by ‘—’)
All instructions are a single word, except for four
double-word instructions. These instructions were
made double-word to contain the required information
in 32 bits. In the second word, the 4 MSbs are 1s. If
this second word is executed as an instruction (by
itself), it will execute as a NOP.
All single-word instructions are executed in a single
instruction cycle, unless a conditional test is true or the
program counter is changed as a result of the instruc-
tion. In these cases, the execution takes two instruction
cycles with the additional instruction cycle(s) executed
as a NOP.
The double-word instructions execute in two instruction
cycles.
One instruction cycle consists of four oscillator periods.
Thus, for an oscillator frequency of 4 MHz, the normal
instruction execution time is 1 s. If a conditional test is
true, or the program counter is changed as a result of
an instruction, the instruction execution time is 2 s.
Two-word branch instructions (if true) would take 3 s.
Figure 27-1 shows the general formats that the instruc-
tions can have. All examples use the convention ‘nnh’
to represent a hexadecimal number.
The Instruction Set Summary, shown in Table 27-2,
lists the standard instructions recognized by the
Microchip MPASMTM Assembler.
Section 27.1.1 “Standard Instruction Set” provides
a description of each instruction.
PIC18F87J72 FAMILY
DS39979A-page 334 Preliminary 2010 Microchip Technology Inc.
TABLE 27-1: OPCODE FIELD DESCRIPTIONS
Field Description
aRAM access bit:
a = 0: RAM location in Access RAM (BSR register is ignored)
a = 1: RAM bank is specified by BSR register
bbb Bit address within an 8-bit file register (0 to 7).
BSR Bank Select Register. Used to select the current RAM bank.
C, DC, Z, OV, N ALU Status bits: Carry, Digit Carry, Zero, Overflow, Negative.
dDestination select bit:
d = 0: store result in WREG
d = 1: store result in file register f
dest Destination: either the WREG register or the specified register file location.
f8-bit register file address (00h to FFh), or 2-bit FSR designator (0h to 3h).
fs12-bit register file address (000h to FFFh). This is the source address.
fd12-bit register file address (000h to FFFh). This is the destination address.
GIE Global Interrupt Enable bit.
kLiteral field, constant data or label (may be either an 8-bit, 12-bit or a 20-bit value).
label Label name.
mm The mode of the TBLPTR register for the table read and table write instructions.
Only used with table read and table write instructions:
*No Change to register (such as TBLPTR with table reads and writes)
*+ Post-Increment register (such as TBLPTR with table reads and writes)
*- Post-Decrement register (such as TBLPTR with table reads and writes)
+* Pre-Increment register (such as TBLPTR with table reads and writes)
nThe relative address (2’s complement number) for relative branch instructions or the direct address for
Call/Branch and Return instructions.
PC Program Counter.
PCL Program Counter Low Byte.
PCH Program Counter High Byte.
PCLATH Program Counter High Byte Latch.
PCLATU Program Counter Upper Byte Latch.
PD Power-Down bit.
PRODH Product of Multiply High Byte.
PRODL Product of Multiply Low Byte.
sFast Call/Return mode select bit:
s = 0: do not update into/from shadow registers
s = 1: certain registers loaded into/from shadow registers (Fast mode)
TBLPTR 21-bit Table Pointer (points to a Program Memory location).
TABLAT 8-bit Table Latch.
TO Time-out bit.
TOS Top-of-Stack.
uUnused or Unchanged.
WDT Watchdog Timer.
WREG Working register (accumulator).
xDon’t care (‘0’ or ‘1’). The assembler will generate code with x = 0. It is the recommended form of use for
compatibility with all Microchip software tools.
zs7-bit offset value for Indirect Addressing of register files (source).
zd7-bit offset value for Indirect Addressing of register files (destination).
{ } Optional argument.
[text] Indicates an Indexed Address.
(text) The contents of text.
2010 Microchip Technology Inc. Preliminary DS39979A-page 335
PIC18F87J72 FAMILY
[expr]<n> Specifies bit n of the register indicated by the pointer expr.
Assigned to.
< > Register bit field.
In the set of.
italics User-defined term (font is Courier New).
TABLE 27-1: OPCODE FIELD DESCRIPTIONS (CONTINUED)
Field Description
PIC18F87J72 FAMILY
DS39979A-page 336 Preliminary 2010 Microchip Technology Inc.
FIGURE 27-1: GENERAL FORMAT FOR INSTRUCTIONS
Byte-oriented file register operations
15 10 9 8 7 0
d = 0 for result destination to be WREG register
OPCODE d a f (FILE #)
d = 1 for result destination to be file register (f)
a = 0 to force Access Bank
Bit-oriented file register operations
15 12 11 9 8 7 0
OPCODE b (BIT #) a f (FILE #)
b = 3-bit position of bit in file register (f)
Literal operations
15 8 7 0
OPCODE k (literal)
k = 8-bit immediate value
Byte to Byte move operations (2-word)
15 12 11 0
OPCODE f (Source FILE #)
CALL, GOTO and Branch operations
15 8 7 0
OPCODE n<7:0> (literal)
n = 20-bit immediate value
a = 1 for BSR to select bank
f = 8-bit file register address
a = 0 to force Access Bank
a = 1 for BSR to select bank
f = 8-bit file register address
15 12 11 0
1111 n<19:8> (literal)
15 12 11 0
1111 f (Destination FILE #)
f = 12-bit file register address
Control operations
Example Instruction
ADDWF MYREG, W, B
MOVFF MYREG1, MYREG2
BSF MYREG, bit, B
MOVLW 7Fh
GOTO Label
15 8 7 0
OPCODE S n<7:0> (literal)
15 12 11 0
1111 n<19:8> (literal)
CALL MYFUNC
15 11 10 0
OPCODE n<10:0> (literal)
S = Fast bit
BRA MYFUNC
15 8 7 0
OPCODE n<7:0> (literal) BC MYFUNC
2010 Microchip Technology Inc. Preliminary DS39979A-page 337
PIC18F87J72 FAMILY
TABLE 27-2: PIC18F87J72 FAMILY INSTRUCTION SET
Mnemonic,
Operands Description Cycles
16-Bit Instruction Word Status
Affected Notes
MSb LSb
BYTE-ORIENTED OPERATIONS
ADDWF
ADDWFC
ANDWF
CLRF
COMF
CPFSEQ
CPFSGT
CPFSLT
DECF
DECFSZ
DCFSNZ
INCF
INCFSZ
INFSNZ
IORWF
MOVF
MOVFF
MOVWF
MULWF
NEGF
RLCF
RLNCF
RRCF
RRNCF
SETF
SUBFWB
SUBWF
SUBWFB
SWAPF
TSTFSZ
XORWF
f, d, a
f, d, a
f, d, a
f, a
f, d, a
f, a
f, a
f, a
f, d, a
f, d, a
f, d, a
f, d, a
f, d, a
f, d, a
f, d, a
f, d, a
fs, fd
f, a
f, a
f, a
f, d, a
f, d, a
f, d, a
f, d, a
f, a
f, d, a
f, d, a
f, d, a
f, d, a
f, a
f, d, a
Add WREG and f
Add WREG and Carry bit to f
AND WREG with f
Clear f
Complement f
Compare f with WREG, Skip =
Compare f with WREG, Skip >
Compare f with WREG, Skip <
Decrement f
Decrement f, Skip if 0
Decrement f, Skip if Not 0
Increment f
Increment f, Skip if 0
Increment f, Skip if Not 0
Inclusive OR WREG with f
Move f
Move fs (source) to 1st word
fd (destination) 2nd word
Move WREG to f
Multiply WREG with f
Negate f
Rotate Left f through Carry
Rotate Left f (No Carry)
Rotate Right f through Carry
Rotate Right f (No Carry)
Set f
Subtract f from WREG with
Borrow
Subtract WREG from f
Subtract WREG from f with
Borrow
Swap Nibbles in f
Test f, Skip if 0
Exclusive OR WREG with f
1
1
1
1
1
1 (2 or 3)
1 (2 or 3)
1 (2 or 3)
1
1 (2 or 3)
1 (2 or 3)
1
1 (2 or 3)
1 (2 or 3)
1
1
2
1
1
1
1
1
1
1
1
1
1
1
1
1 (2 or 3)
1
0010
0010
0001
0110
0001
0110
0110
0110
0000
0010
0100
0010
0011
0100
0001
0101
1100
1111
0110
0000
0110
0011
0100
0011
0100
0110
0101
0101
0101
0011
0110
0001
01da
00da
01da
101a
11da
001a
010a
000a
01da
11da
11da
10da
11da
10da
00da
00da
ffff
ffff
111a
001a
110a
01da
01da
00da
00da
100a
01da
11da
10da
10da
011a
10da
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
C, DC, Z, OV, N
C, DC, Z, OV, N
Z, N
Z
Z, N
None
None
None
C, DC, Z, OV, N
None
None
C, DC, Z, OV, N
None
None
Z, N
Z, N
None
None
None
C, DC, Z, OV, N
C, Z, N
Z, N
C, Z, N
Z, N
None
C, DC, Z, OV, N
C, DC, Z, OV, N
C, DC, Z, OV, N
None
None
Z, N
1, 2
1, 2
1,2
2
1, 2
4
4
1, 2
1, 2, 3, 4
1, 2, 3, 4
1, 2
1, 2, 3, 4
4
1, 2
1, 2
1
1, 2
1, 2
1, 2
1, 2
4
1, 2
Note 1: When a PORT register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be
that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and
is driven low by an external device, the data will be written back with a ‘0’.
2: If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared
if assigned.
3: If the Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The
second cycle is executed as a NOP.
4: Some instructions are two-word instructions. The second word of these instructions will be executed as a NOP
unless the first word of the instruction retrieves the information embedded in these 16 bits. This ensures that
all program memory locations have a valid instruction.
PIC18F87J72 FAMILY
DS39979A-page 338 Preliminary 2010 Microchip Technology Inc.
BIT-ORIENTED OPERATIONS
BCF
BSF
BTFSC
BTFSS
BTG
f, b, a
f, b, a
f, b, a
f, b, a
f, b, a
Bit Clear f
Bit Set f
Bit Test f, Skip if Clear
Bit Test f, Skip if Set
Bit Toggle f
1
1
1 (2 or 3)
1 (2 or 3)
1
1001
1000
1011
1010
0111
bbba
bbba
bbba
bbba
bbba
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
None
None
None
None
None
1, 2
1, 2
3, 4
3, 4
1, 2
CONTROL OPERATIONS
BC
BN
BNC
BNN
BNOV
BNZ
BOV
BRA
BZ
CALL
CLRWDT
DAW
GOTO
NOP
NOP
POP
PUSH
RCALL
RESET
RETFIE
RETLW
RETURN
SLEEP
n
n
n
n
n
n
n
n
n
n, s
n
n
s
k
s
Branch if Carry
Branch if Negative
Branch if Not Carry
Branch if Not Negative
Branch if Not Overflow
Branch if Not Zero
Branch if Overflow
Branch Unconditionally
Branch if Zero
Call Subroutine 1st word
2nd word
Clear Watchdog Timer
Decimal Adjust WREG
Go to Address 1st word
2nd word
No Operation
No Operation
Pop Top of Return Stack (TOS)
Push Top of Return Stack (TOS)
Relative Call
Software Device Reset
Return from Interrupt Enable
Return with Literal in WREG
Return from Subroutine
Go into Standby mode
1 (2)
1 (2)
1 (2)
1 (2)
1 (2)
1 (2)
1 (2)
2
1 (2)
2
1
1
2
1
1
1
1
2
1
2
2
2
1
1110
1110
1110
1110
1110
1110
1110
1101
1110
1110
1111
0000
0000
1110
1111
0000
1111
0000
0000
1101
0000
0000
0000
0000
0000
0010
0110
0011
0111
0101
0001
0100
0nnn
0000
110s
kkkk
0000
0000
1111
kkkk
0000
xxxx
0000
0000
1nnn
0000
0000
1100
0000
0000
nnnn
nnnn
nnnn
nnnn
nnnn
nnnn
nnnn
nnnn
nnnn
kkkk
kkkk
0000
0000
kkkk
kkkk
0000
xxxx
0000
0000
nnnn
1111
0001
kkkk
0001
0000
nnnn
nnnn
nnnn
nnnn
nnnn
nnnn
nnnn
nnnn
nnnn
kkkk
kkkk
0100
0111
kkkk
kkkk
0000
xxxx
0110
0101
nnnn
1111
000s
kkkk
001s
0011
None
None
None
None
None
None
None
None
None
None
TO, PD
C
None
None
None
None
None
None
All
GIE/GIEH,
PEIE/GIEL
None
None
TO, PD
4
TABLE 27-2: PIC18F87J72 FAMILY INSTRUCTION SET (CONTINUED)
Mnemonic,
Operands Description Cycles
16-Bit Instruction Word Status
Affected Notes
MSb LSb
Note 1: When a PORT register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be
that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and
is driven low by an external device, the data will be written back with a ‘0’.
2: If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared
if assigned.
3: If the Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The
second cycle is executed as a NOP.
4: Some instructions are two-word instructions. The second word of these instructions will be executed as a NOP
unless the first word of the instruction retrieves the information embedded in these 16 bits. This ensures that
all program memory locations have a valid instruction.
2010 Microchip Technology Inc. Preliminary DS39979A-page 339
PIC18F87J72 FAMILY
LITERAL OPERATIONS
ADDLW
ANDLW
IORLW
LFSR
MOVLB
MOVLW
MULLW
RETLW
SUBLW
XORLW
k
k
k
f, k
k
k
k
k
k
k
Add Literal and WREG
AND Literal with WREG
Inclusive OR Literal with WREG
Move literal (12-bit) 2nd word
to FSR(f) 1st word
Move Literal to BSR<3:0>
Move Literal to WREG
Multiply Literal with WREG
Return with Literal in WREG
Subtract WREG from Literal
Exclusive OR Literal with WREG
1
1
1
2
1
1
1
2
1
1
0000
0000
0000
1110
1111
0000
0000
0000
0000
0000
0000
1111
1011
1001
1110
0000
0001
1110
1101
1100
1000
1010
kkkk
kkkk
kkkk
00ff
kkkk
0000
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
C, DC, Z, OV, N
Z, N
Z, N
None
None
None
None
None
C, DC, Z, OV, N
Z, N
DATA MEMORY PROGRAM MEMORY OPERATIONS
TBLRD*
TBLRD*+
TBLRD*-
TBLRD+*
TBLWT*
TBLWT*+
TBLWT*-
TBLWT+*
Table Read
Table Read with Post-Increment
Table Read with Post-Decrement
Table Read with Pre-Increment
Table Write
Table Write with Post-Increment
Table Write with Post-Decrement
Table Write with Pre-Increment
2
2
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
1000
1001
1010
1011
1100
1101
1110
1111
None
None
None
None
None
None
None
None
TABLE 27-2: PIC18F87J72 FAMILY INSTRUCTION SET (CONTINUED)
Mnemonic,
Operands Description Cycles
16-Bit Instruction Word Status
Affected Notes
MSb LSb
Note 1: When a PORT register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be
that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and
is driven low by an external device, the data will be written back with a ‘0’.
2: If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared
if assigned.
3: If the Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The
second cycle is executed as a NOP.
4: Some instructions are two-word instructions. The second word of these instructions will be executed as a NOP
unless the first word of the instruction retrieves the information embedded in these 16 bits. This ensures that
all program memory locations have a valid instruction.
PIC18F87J72 FAMILY
DS39979A-page 340 Preliminary 2010 Microchip Technology Inc.
27.1.1 STANDARD INSTRUCTION SET
ADDLW ADD Literal to W
Syntax: ADDLW k
Operands: 0 k 255
Operation: (W) + k W
Status Affected: N, OV, C, DC, Z
Encoding: 0000 1111 kkkk kkkk
Description: The contents of W are added to the
8-bit literal ‘k’ and the result is placed in
W.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
literal ‘k’
Process
Data
Write to
W
Example: ADDLW 15h
Before Instruction
W = 10h
After Instruction
W = 25h
ADDWF ADD W to f
Syntax: ADDWF f {,d {,a}}
Operands: 0 f 255
d [0,1]
a [0,1]
Operation: (W) + (f) dest
Status Affected: N, OV, C, DC, Z
Encoding: 0010 01da ffff ffff
Description: Add W to register ‘f’. If ‘d’ is ‘0’, the
result is stored in W. If ‘d’ is ‘1’, the
result is stored back in register ‘f’.
If ‘a’ is ‘0, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write to
destination
Example: ADDWF REG, 0, 0
Before Instruction
W = 17h
REG = 0C2h
After Instruction
W = 0D9h
REG = 0C2h
Note: All PIC18 instructions may take an optional label argument preceding the instruction mnemonic for use in
symbolic addressing. If a label is used, the instruction format then becomes: {label} instruction argument(s).
2010 Microchip Technology Inc. Preliminary DS39979A-page 341
PIC18F87J72 FAMILY
ADDWFC ADD W and Carry bit to f
Syntax: ADDWFC f {,d {,a}}
Operands: 0 f 255
d [0,1]
a [0,1]
Operation: (W) + (f) + (C) dest
Status Affected: N,OV, C, DC, Z
Encoding: 0010 00da ffff ffff
Description: Add W, the Carry flag and data memory
location ‘f’. If ‘d’ is ‘0’, the result is
placed in W. If ‘d’ is ‘1’, the result is
placed in data memory location ‘f’.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write to
destination
Example: ADDWFC REG, 0, 1
Before Instruction
Carry bit = 1
REG = 02h
W=4Dh
After Instruction
Carry bit = 0
REG = 02h
W = 50h
ANDLW AND Literal with W
Syntax: ANDLW k
Operands: 0 k 255
Operation: (W) .AND. k W
Status Affected: N, Z
Encoding: 0000 1011 kkkk kkkk
Description: The contents of W are ANDed with the
8-bit literal ‘k’. The result is placed in W.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read literal
‘k’
Process
Data
Write to
W
Example: ANDLW 05Fh
Before Instruction
W=A3h
After Instruction
W = 03h
PIC18F87J72 FAMILY
DS39979A-page 342 Preliminary 2010 Microchip Technology Inc.
ANDWF AND W with f
Syntax: ANDWF f {,d {,a}}
Operands: 0 f 255
d [0,1]
a [0,1]
Operation: (W) .AND. (f) dest
Status Affected: N, Z
Encoding: 0001 01da ffff ffff
Description: The contents of W are ANDed with
register ‘f’. If ‘d’ is ‘0’, the result is stored
in W. If ‘d’ is1’, the result is stored back
in register ‘f’.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write to
destination
Example: ANDWF REG, 0, 0
Before Instruction
W = 17h
REG = C2h
After Instruction
W = 02h
REG = C2h
BC Branch if Carry
Syntax: BC n
Operands: -128 n 127
Operation: if Carry bit is 1’,
(PC) + 2 + 2n PC
Status Affected: None
Encoding: 1110 0010 nnnn nnnn
Description: If the Carry bit is ’1’, then the program
will branch.
The 2’s complement number ‘2n’ is
added to the PC. Since the PC will have
incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is then a
two-cycle instruction.
Words: 1
Cycles: 1(2)
Q Cycle Activity:
If Jump:
Q1 Q2 Q3 Q4
Decode Read literal
‘n’
Process
Data
Write to
PC
No
operation
No
operation
No
operation
No
operation
If No Jump:
Q1 Q2 Q3 Q4
Decode Read literal
‘n’
Process
Data
No
operation
Example: HERE BC 5
Before Instruction
PC = address (HERE)
After Instruction
If Carry = 1;
PC = address (HERE + 12)
If Carry = 0;
PC = address (HERE + 2)
2010 Microchip Technology Inc. Preliminary DS39979A-page 343
PIC18F87J72 FAMILY
BCF Bit Clear f
Syntax: BCF f, b {,a}
Operands: 0 f 255
0 b 7
a [0,1]
Operation: 0 f<b>
Status Affected: None
Encoding: 1001 bbba ffff ffff
Description: Bit ‘b’ in register ‘f’ is cleared.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write
register ‘f’
Example: BCF FLAG_REG, 7, 0
Before Instruction
FLAG_REG = C7h
After Instruction
FLAG_REG = 47h
BN Branch if Negative
Syntax: BN n
Operands: -128 n 127
Operation: if Negative bit is ‘1’,
(PC) + 2 + 2n PC
Status Affected: None
Encoding: 1110 0110 nnnn nnnn
Description: If the Negative bit is ‘1’, then the
program will branch.
The 2’s complement number ‘2n’ is
added to the PC. Since the PC will have
incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is then a
two-cycle instruction.
Words: 1
Cycles: 1(2)
Q Cycle Activity:
If Jump:
Q1 Q2 Q3 Q4
Decode Read literal
‘n’
Process
Data
Write to
PC
No
operation
No
operation
No
operation
No
operation
If No Jump:
Q1 Q2 Q3 Q4
Decode Read literal
‘n’
Process
Data
No
operation
Example: HERE BN Jump
Before Instruction
PC = address (HERE)
After Instruction
If Negative = 1;
PC = address (Jump)
If Negative = 0;
PC = address (HERE + 2)
PIC18F87J72 FAMILY
DS39979A-page 344 Preliminary 2010 Microchip Technology Inc.
BNC Branch if Not Carry
Syntax: BNC n
Operands: -128 n 127
Operation: if Carry bit is ‘0’,
(PC) + 2 + 2n PC
Status Affected: None
Encoding: 1110 0011 nnnn nnnn
Description: If the Carry bit is ‘0’, then the program
will branch.
The 2’s complement number ‘2n’ is
added to the PC. Since the PC will have
incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is then a
two-cycle instruction.
Words: 1
Cycles: 1(2)
Q Cycle Activity:
If Jump:
Q1 Q2 Q3 Q4
Decode Read literal
‘n’
Process
Data
Write to
PC
No
operation
No
operation
No
operation
No
operation
If No Jump:
Q1 Q2 Q3 Q4
Decode Read literal
‘n’
Process
Data
No
operation
Example: HERE BNC Jump
Before Instruction
PC = address (HERE)
After Instruction
If Carry = 0;
PC = address (Jump)
If Carry = 1;
PC = address (HERE + 2)
BNN Branch if Not Negative
Syntax: BNN n
Operands: -128 n 127
Operation: if Negative bit is 0’,
(PC) + 2 + 2n PC
Status Affected: None
Encoding: 1110 0111 nnnn nnnn
Description: If the Negative bit is ‘0’, then the
program will branch.
The 2’s complement number ‘2n’ is
added to the PC. Since the PC will have
incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is then a
two-cycle instruction.
Words: 1
Cycles: 1(2)
Q Cycle Activity:
If Jump:
Q1 Q2 Q3 Q4
Decode Read literal
‘n’
Process
Data
Write to
PC
No
operation
No
operation
No
operation
No
operation
If No Jump:
Q1 Q2 Q3 Q4
Decode Read literal
‘n’
Process
Data
No
operation
Example: HERE BNN Jump
Before Instruction
PC = address (HERE)
After Instruction
If Negative = 0;
PC = address (Jump)
If Negative = 1;
PC = address (HERE + 2)
2010 Microchip Technology Inc. Preliminary DS39979A-page 345
PIC18F87J72 FAMILY
BNOV Branch if Not Overflow
Syntax: BNOV n
Operands: -128 n 127
Operation: if Overflow bit is ‘0’,
(PC) + 2 + 2n PC
Status Affected: None
Encoding: 1110 0101 nnnn nnnn
Description: If the Overflow bit is ‘0’, then the
program will branch.
The 2’s complement number ‘2n’ is
added to the PC. Since the PC will have
incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is then a
two-cycle instruction.
Words: 1
Cycles: 1(2)
Q Cycle Activity:
If Jump:
Q1 Q2 Q3 Q4
Decode Read literal
‘n’
Process
Data
Write to
PC
No
operation
No
operation
No
operation
No
operation
If No Jump:
Q1 Q2 Q3 Q4
Decode Read literal
‘n’
Process
Data
No
operation
Example: HERE BNOV Jump
Before Instruction
PC = address (HERE)
After Instruction
If Overflow = 0;
PC = address (Jump)
If Overflow = 1;
PC = address (HERE + 2)
BNZ Branch if Not Zero
Syntax: BNZ n
Operands: -128 n 127
Operation: if Zero bit is ‘0’,
(PC) + 2 + 2n PC
Status Affected: None
Encoding: 1110 0001 nnnn nnnn
Description: If the Zero bit is ‘0’, then the program
will branch.
The 2’s complement number ‘2n’ is
added to the PC. Since the PC will have
incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is then a
two-cycle instruction.
Words: 1
Cycles: 1(2)
Q Cycle Activity:
If Jump:
Q1 Q2 Q3 Q4
Decode Read literal
‘n’
Process
Data
Write to
PC
No
operation
No
operation
No
operation
No
operation
If No Jump:
Q1 Q2 Q3 Q4
Decode Read literal
‘n’
Process
Data
No
operation
Example: HERE BNZ Jump
Before Instruction
PC = address (HERE)
After Instruction
If Zero = 0;
PC = address (Jump)
If Zero = 1;
PC = address (HERE + 2)
PIC18F87J72 FAMILY
DS39979A-page 346 Preliminary 2010 Microchip Technology Inc.
BRA Unconditional Branch
Syntax: BRA n
Operands: -1024 n 1023
Operation: (PC) + 2 + 2n PC
Status Affected: None
Encoding: 1101 0nnn nnnn nnnn
Description: Add the 2’s complement number ‘2n’ to
the PC. Since the PC will have
incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is a
two-cycle instruction.
Words: 1
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read literal
‘n’
Process
Data
Write to
PC
No
operation
No
operation
No
operation
No
operation
Example: HERE BRA Jump
Before Instruction
PC = address (HERE)
After Instruction
PC = address (Jump)
BSF Bit Set f
Syntax: BSF f, b {,a}
Operands: 0 f 255
0 b 7
a [0,1]
Operation: 1 f<b>
Status Affected: None
Encoding: 1000 bbba ffff ffff
Description: Bit ‘b’ in register ‘f’ is set.
If ‘a’ is ‘0, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write
register ‘f’
Example: BSF FLAG_REG, 7, 1
Before Instruction
FLAG_REG = 0Ah
After Instruction
FLAG_REG = 8Ah
2010 Microchip Technology Inc. Preliminary DS39979A-page 347
PIC18F87J72 FAMILY
BTFSC Bit Test File, Skip if Clear
Syntax: BTFSC f, b {,a}
Operands: 0 f 255
0 b 7
a [0,1]
Operation: skip if (f<b>) = 0
Status Affected: None
Encoding: 1011 bbba ffff ffff
Description: If bit ‘b’ in register ‘f’ is ‘0’, then the next
instruction is skipped. If bit ‘b’ is 0’, then
the next instruction fetched during the
current instruction execution is discarded
and a NOP is executed instead, making
this a two-cycle instruction.
If ‘a’ is ‘0’, the Access Bank is selected. If
‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction set
is enabled, this instruction operates in
Indexed Literal Offset Addressing mode
whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1(2)
Note: 3 cycles if skip and followed
by a 2-word instruction.
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
No
operation
If skip:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
If skip and followed by 2-word instruction:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
Example: HERE
FALSE
TRUE
BTFSC
:
:
FLAG, 1, 0
Before Instruction
PC = address (HERE)
After Instruction
If FLAG<1> = 0;
PC = address (TRUE)
If FLAG<1> = 1;
PC = address (FALSE)
BTFSS Bit Test File, Skip if Set
Syntax: BTFSS f, b {,a}
Operands: 0 f 255
0 b < 7
a [0,1]
Operation: skip if (f<b>) = 1
Status Affected: None
Encoding: 1010 bbba ffff ffff
Description: If bit ‘b’ in register ‘f’ is ‘1’, then the next
instruction is skipped. If bit ‘b’ is ‘1’, then
the next instruction fetched during the
current instruction execution is discarded
and a NOP is executed instead, making
this a two-cycle instruction.
If ‘a’ is ‘0’, the Access Bank is selected. If
‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates in
Indexed Literal Offset Addressing mode
whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1(2)
Note: 3 cycles if skip and followed
by a 2-word instruction.
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
No
operation
If skip:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
If skip and followed by 2-word instruction:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
Example: HERE
FALSE
TRUE
BTFSS
:
:
FLAG, 1, 0
Before Instruction
PC = address (HERE)
After Instruction
If FLAG<1> = 0;
PC = address (FALSE)
If FLAG<1> = 1;
PC = address (TRUE)
PIC18F87J72 FAMILY
DS39979A-page 348 Preliminary 2010 Microchip Technology Inc.
BTG Bit Toggle f
Syntax: BTG f, b {,a}
Operands: 0 f 255
0 b < 7
a [0,1]
Operation: (f<b>) f<b>
Status Affected: None
Encoding: 0111 bbba ffff ffff
Description: Bit ‘b’ in data memory location ‘f’ is
inverted.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write
register ‘f’
Example: BTG PORTC, 4, 0
Before Instruction:
PORTC = 0111 0101 [75h]
After Instruction:
PORTC = 0110 0101 [65h]
BOV Branch if Overflow
Syntax: BOV n
Operands: -128 n 127
Operation: if Overflow bit is ‘1’,
(PC) + 2 + 2n PC
Status Affected: None
Encoding: 1110 0100 nnnn nnnn
Description: If the Overflow bit is ‘1, then the
program will branch.
The 2’s complement number ‘2n’ is
added to the PC. Since the PC will have
incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is then a
two-cycle instruction.
Words: 1
Cycles: 1(2)
Q Cycle Activity:
If Jump:
Q1 Q2 Q3 Q4
Decode Read literal
‘n’
Process
Data
Write to PC
No
operation
No
operation
No
operation
No
operation
If No Jump:
Q1 Q2 Q3 Q4
Decode Read literal
‘n’
Process
Data
No
operation
Example: HERE BOV Jump
Before Instruction
PC = address (HERE)
After Instruction
If Overflow = 1;
PC = address (Jump)
If Overflow = 0;
PC = address (HERE + 2)
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BZ Branch if Zero
Syntax: BZ n
Operands: -128 n 127
Operation: if Zero bit is ‘1’,
(PC) + 2 + 2n PC
Status Affected: None
Encoding: 1110 0000 nnnn nnnn
Description: If the Zero bit is ‘1’, then the program
will branch.
The 2’s complement number ‘2n’ is
added to the PC. Since the PC will have
incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is then a
two-cycle instruction.
Words: 1
Cycles: 1(2)
Q Cycle Activity:
If Jump:
Q1 Q2 Q3 Q4
Decode Read literal
‘n’
Process
Data
Write to
PC
No
operation
No
operation
No
operation
No
operation
If No Jump:
Q1 Q2 Q3 Q4
Decode Read literal
‘n’
Process
Data
No
operation
Example: HERE BZ Jump
Before Instruction
PC = address (HERE)
After Instruction
If Zero = 1;
PC = address (Jump)
If Zero = 0;
PC = address (HERE + 2)
CALL Subroutine Call
Syntax: CALL k {,s}
Operands: 0 k 1048575
s [0,1]
Operation: (PC) + 4 TOS,
k PC<20:1>;
if s = 1
(W) WS,
(STATUS) STATUSS,
(BSR) BSRS
Status Affected: None
Encoding:
1st word (k<7:0>)
2nd word(k<19:8>)
1110
1111
110s
k19kkk
k7kkk
kkkk
kkkk0
kkkk8
Description: Subroutine call of entire 2-Mbyte
memory range. First, return address
(PC+ 4) is pushed onto the return stack.
If ‘s’ = 1, the W, STATUS and BSR
registers are also pushed into their
respective shadow registers, WS,
STATUSS and BSRS. If ‘s’ = 0, no
update occurs. Then, the 20-bit value ‘k’
is loaded into PC<20:1>. CALL is a
two-cycle instruction.
Words: 2
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read literal
‘k’<7:0>,
Push PC to
stack
Read literal
’k’<19:8>,
Write to PC
No
operation
No
operation
No
operation
No
operation
Example: HERE CALL THERE,1
Before Instruction
PC = address (HERE)
After Instruction
PC = address (THERE)
TOS = address (HERE + 4)
WS = W
BSRS = BSR
STATUSS = STATUS
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CLRF Clear f
Syntax: CLRF f {,a}
Operands: 0 f 255
a [0,1]
Operation: 000h f,
1 Z
Status Affected: Z
Encoding: 0110 101a ffff ffff
Description: Clears the contents of the specified
register.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write
register ‘f’
Example: CLRF FLAG_REG,1
Before Instruction
FLAG_REG = 5Ah
After Instruction
FLAG_REG = 00h
CLRWDT Clear Watchdog Timer
Syntax: CLRWDT
Operands: None
Operation: 000h WDT,
000h WDT postscaler,
1 TO,
1 PD
Status Affected: TO, PD
Encoding: 0000 0000 0000 0100
Description: CLRWDT instruction resets the
Watchdog Timer. It also resets the post-
scaler of the WDT. Status bits, TO and
PD, are set.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode No
operation
Process
Data
No
operation
Example: CLRWDT
Before Instruction
WDT Counter = ?
After Instruction
WDT Counter = 00h
WDT Postscaler = 0
TO =1
PD =1
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COMF Complement f
Syntax: COMF f {,d {,a}}
Operands: 0 f 255
d [0,1]
a [0,1]
Operation: f dest
Status Affected: N, Z
Encoding: 0001 11da ffff ffff
Description: The contents of register ‘f’ are
complemented. If ‘d’ is ‘0’, the result is
stored in W. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write to
destination
Example: COMF REG, 0, 0
Before Instruction
REG = 13h
After Instruction
REG = 13h
W=ECh
CPFSEQ Compare f with W, Skip if f = W
Syntax: CPFSEQ f {,a}
Operands: 0 f 255
a [0,1]
Operation: (f) – (W),
skip if (f) = (W)
(unsigned comparison)
Status Affected: None
Encoding: 0110 001a ffff ffff
Description: Compares the contents of data memory
location ‘f’ to the contents of W by
performing an unsigned subtraction.
If ‘f’ = W, then the fetched instruction is
discarded and a NOP is executed
instead, making this a two-cycle
instruction.
If ‘a’ is ‘0, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1(2)
Note: 3 cycles if skip and followed
by a 2-word instruction.
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
No
operation
If skip:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
If skip and followed by 2-word instruction:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
Example: HERE CPFSEQ REG, 0
NEQUAL :
EQUAL :
Before Instruction
PC Address = HERE
W=?
REG = ?
After Instruction
If REG = W;
PC = Address (EQUAL)
If REG W;
PC = Address (NEQUAL)
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CPFSGT Compare f with W, Skip if f > W
Syntax: CPFSGT f {,a}
Operands: 0 f 255
a [0,1]
Operation: (f) –W),
skip if (f) > (W)
(unsigned comparison)
Status Affected: None
Encoding: 0110 010a ffff ffff
Description: Compares the contents of data memory
location ‘f’ to the contents of the W by
performing an unsigned subtraction.
If the contents of ‘f’ are greater than the
contents of WREG, then the fetched
instruction is discarded and a NOP is
executed instead, making this a
two-cycle instruction.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1(2)
Note: 3 cycles if skip and followed
by a 2-word instruction.
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
No
operation
If skip:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
If skip and followed by 2-word instruction:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
Example: HERE CPFSGT REG, 0
NGREATER :
GREATER :
Before Instruction
PC = Address (HERE)
W= ?
After Instruction
If REG W;
PC = Address (GREATER)
If REG W;
PC = Address (NGREATER)
CPFSLT Compare f with W, Skip if f < W
Syntax: CPFSLT f {,a}
Operands: 0 f 255
a [0,1]
Operation: (f) –W),
skip if (f) < (W)
(unsigned comparison)
Status Affected: None
Encoding: 0110 000a ffff ffff
Description: Compares the contents of data memory
location ‘f’ to the contents of W by
performing an unsigned subtraction.
If the contents of ‘f’ are less than the
contents of W, then the fetched
instruction is discarded and a NOP is
executed instead, making this a
two-cycle instruction.
If ‘a’ is ‘0, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
Words: 1
Cycles: 1(2)
Note: 3 cycles if skip and followed
by a 2-word instruction.
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
No
operation
If skip:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
If skip and followed by 2-word instruction:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
Example: HERE CPFSLT REG, 1
NLESS :
LESS :
Before Instruction
PC = Address (HERE)
W= ?
After Instruction
If REG < W;
PC = Address (LESS)
If REG W;
PC = Address (NLESS)
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DAW Decimal Adjust W Register
Syntax: DAW
Operands: None
Operation: If [W<3:0> > 9] or [DC = 1], then
(W<3:0>) + 6 W<3:0>;
else
(W<3:0>) W<3:0>
If [W<7:4> > 9] or [C = 1], then
(W<7:4>) + 6 W<7:4>;
C =1;
else
(W<7:4>) W<7:4>
Status Affected: C
Encoding: 0000 0000 0000 0111
Description: DAW adjusts the eight-bit value in W,
resulting from the earlier addition of two
variables (each in packed BCD format)
and produces a correct packed BCD
result.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register W
Process
Data
Write
W
Example 1: DAW
Before Instruction
W=A5h
C=0
DC = 0
After Instruction
W = 05h
C=1
DC = 0
Example 2:
Before Instruction
W=CEh
C=0
DC = 0
After Instruction
W = 34h
C=1
DC = 0
DECF Decrement f
Syntax: DECF f {,d {,a}}
Operands: 0 f 255
d [0,1]
a [0,1]
Operation: (f)1 dest
Status Affected: C, DC, N, OV, Z
Encoding: 0000 01da ffff ffff
Description: Decrement register ‘f’. If ‘d’ is ‘0’, the
result is stored in W. If ‘d’ is ‘1’, the
result is stored back in register ‘f’.
If ‘a’ is ‘0, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write to
destination
Example: DECF CNT, 1, 0
Before Instruction
CNT = 01h
Z=0
After Instruction
CNT = 00h
Z=1
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DECFSZ Decrement f, Skip if 0
Syntax: DECFSZ f {,d {,a}}
Operands: 0 f 255
d [0,1]
a [0,1]
Operation: (f) – 1 dest,
skip if result = 0
Status Affected: None
Encoding: 0010 11da ffff ffff
Description: The contents of register ‘f’ are
decremented. If ‘d’ is 0’, the result is
placed in W. If ‘d’ is ‘1’, the result is
placed back in register ‘f’.
If the result is ‘0’, the next instruction
which is already fetched is discarded
and a NOP is executed instead, making
it a two-cycle instruction.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1(2)
Note: 3 cycles if skip and followed
by a 2-word instruction.
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write to
destination
If skip:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
If skip and followed by 2-word instruction:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
Example: HERE DECFSZ CNT, 1, 1
GOTO LOOP
CONTINUE
Before Instruction
PC = Address (HERE)
After Instruction
CNT = CNT – 1
If CNT = 0;
PC = Address (CONTINUE)
If CNT 0;
PC = Address (HERE + 2)
DCFSNZ Decrement f, Skip if Not 0
Syntax: DCFSNZ f {,d {,a}}
Operands: 0 f 255
d [0,1]
a [0,1]
Operation: (f) – 1 dest,
skip if result 0
Status Affected: None
Encoding: 0100 11da ffff ffff
Description: The contents of register ‘f’ are
decremented. If ‘d’ is 0’, the result is
placed in W. If ‘d’ is ‘1’, the result is
placed back in register ‘f’.
If the result is not 0’, the next
instruction which is already fetched is
discarded and a NOP is executed
instead, making it a two-cycle
instruction.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1(2)
Note: 3 cycles if skip and followed
by a 2-word instruction.
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write to
destination
If skip:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
If skip and followed by 2-word instruction:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
Example: HERE DCFSNZ TEMP, 1, 0
ZERO :
NZERO :
Before Instruction
TEMP = ?
After Instruction
TEMP = TEMP – 1,
If TEMP = 0;
PC = Address (ZERO)
If TEMP 0;
PC = Address (NZERO)
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GOTO Unconditional Branch
Syntax: GOTO k
Operands: 0 k 1048575
Operation: k PC<20:1>
Status Affected: None
Encoding:
1st word (k<7:0>)
2nd word(k<19:8>)
1110
1111
1111
k19kkk
k7kkk
kkkk
kkkk0
kkkk8
Description: GOTO allows an unconditional branch
anywhere within entire 2-Mbyte memory
range. The 20-bit value ‘k’ is loaded into
PC<20:1>. GOTO is always a two-cycle
instruction.
Words: 2
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read literal
‘k’<7:0>,
No
operation
Read literal
‘k’<19:8>,
Write to PC
No
operation
No
operation
No
operation
No
operation
Example: GOTO THERE
After Instruction
PC = Address (THERE)
INCF Increment f
Syntax: INCF f {,d {,a}}
Operands: 0 f 255
d [0,1]
a [0,1]
Operation: (f) + 1 dest
Status Affected: C, DC, N, OV, Z
Encoding: 0010 10da ffff ffff
Description: The contents of register ‘f’ are
incremented. If ‘d’ is 0’, the result is
placed in W. If ‘d’ is1’, the result is
placed back in register ‘f’.
If ‘a’ is ‘0, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write to
destination
Example: INCF CNT, 1, 0
Before Instruction
CNT = FFh
Z=0
C=?
DC = ?
After Instruction
CNT = 00h
Z=1
C=1
DC = 1
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INCFSZ Increment f, Skip if 0
Syntax: INCFSZ f {,d {,a}}
Operands: 0 f 255
d [0,1]
a [0,1]
Operation: (f) + 1 dest,
skip if result = 0
Status Affected: None
Encoding: 0011 11da ffff ffff
Description: The contents of register ‘f’ are
incremented. If ‘d’ is ‘0’, the result is
placed in W. If ‘d’ is ‘1’, the result is
placed back in register ‘f’.
If the result is ‘0’, the next instruction
which is already fetched is discarded
and a NOP is executed instead, making
it a two-cycle instruction.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1(2)
Note: 3 cycles if skip and followed
by a 2-word instruction.
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write to
destination
If skip:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
If skip and followed by 2-word instruction:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
Example: HERE INCFSZ CNT, 1, 0
NZERO :
ZERO :
Before Instruction
PC = Address (HERE)
After Instruction
CNT = CNT + 1
If CNT = 0;
PC = Address (ZERO)
If CNT 0;
PC = Address (NZERO)
INFSNZ Increment f, Skip if Not 0
Syntax: INFSNZ f {,d {,a}}
Operands: 0 f 255
d [0,1]
a [0,1]
Operation: (f) + 1 dest,
skip if result 0
Status Affected: None
Encoding: 0100 10da ffff ffff
Description: The contents of register ‘f’ are
incremented. If ‘d’ is ‘0’, the result is
placed in W. If ‘d’ is ‘1’, the result is
placed back in register ‘f’.
If the result is not 0’, the next
instruction which is already fetched is
discarded and a NOP is executed
instead, making it a two-cycle
instruction.
If ‘a’ is ‘0, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1(2)
Note: 3 cycles if skip and followed
by a 2-word instruction.
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write to
destination
If skip:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
If skip and followed by 2-word instruction:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
Example: HERE INFSNZ REG, 1, 0
ZERO
NZERO
Before Instruction
PC = Address (HERE)
After Instruction
REG = REG + 1
If REG 0;
PC = Address (NZERO)
If REG = 0;
PC = Address (ZERO)
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IORLW Inclusive OR Literal with W
Syntax: IORLW k
Operands: 0 k 255
Operation: (W) .OR. k W
Status Affected: N, Z
Encoding: 0000 1001 kkkk kkkk
Description: The contents of W are ORed with the
eight-bit literal ‘k’. The result is placed
in W.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
literal ‘k’
Process
Data
Write to
W
Example: IORLW 35h
Before Instruction
W=9Ah
After Instruction
W=BFh
IORWF Inclusive OR W with f
Syntax: IORWF f {,d {,a}}
Operands: 0 f 255
d [0,1]
a [0,1]
Operation: (W) .OR. (f) dest
Status Affected: N, Z
Encoding: 0001 00da ffff ffff
Description: Inclusive OR W with register ‘f’. If ‘d’ is
0’, the result is placed in W. If ‘d’ is ‘1’,
the result is placed back in register ‘f’.
If ‘a’ is ‘0, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write to
destination
Example: IORWF RESULT, 0, 1
Before Instruction
RESULT = 13h
W = 91h
After Instruction
RESULT = 13h
W = 93h
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LFSR Load FSR
Syntax: LFSR f, k
Operands: 0 f 2
0 k 4095
Operation: k FSRf
Status Affected: None
Encoding: 1110
1111
1110
0000
00ff
k7kkk
k11kkk
kkkk
Description: The 12-bit literal ‘k’ is loaded into the
file select register pointed to by ‘f’.
Words: 2
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read literal
‘k’ MSB
Process
Data
Write
literal ‘k’
MSB to
FSRfH
Decode Read literal
‘k’ LSB
Process
Data
Write literal
‘k’ to FSRfL
Example: LFSR 2, 3ABh
After Instruction
FSR2H = 03h
FSR2L = ABh
MOVF Move f
Syntax: MOVF f {,d {,a}}
Operands: 0 f 255
d [0,1]
a [0,1]
Operation: f dest
Status Affected: N, Z
Encoding: 0101 00da ffff ffff
Description: The contents of register ‘f’ are moved to
a destination dependent upon the
status of ‘d’. If ‘d’ is ‘0’, the result is
placed in W. If ‘d’ is ‘1’, the result is
placed back in register ‘f’. Location ‘f’
can be anywhere in the
256-byte bank.
If ‘a’ is ‘0, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write
W
Example: MOVF REG, 0, 0
Before Instruction
REG = 22h
W=FFh
After Instruction
REG = 22h
W = 22h
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MOVFF Move f to f
Syntax: MOVFF fs,fd
Operands: 0 fs 4095
0 fd 4095
Operation: (fs) fd
Status Affected: None
Encoding:
1st word (source)
2nd word (destin.)
1100
1111
ffff
ffff
ffff
ffff
ffffs
ffffd
Description: The contents of source register ‘fs’ are
moved to destination register ‘fd’.
Location of source ‘fs’ can be anywhere
in the 4096-byte data space (000h to
FFFh) and location of destination ‘fd
can also be anywhere from 000h to
FFFh.
Either source or destination can be W
(a useful special situation).
MOVFF is particularly useful for
transferring a data memory location to a
peripheral register (such as the transmit
buffer or an I/O port).
The MOVFF instruction cannot use the
PCL, TOSU, TOSH or TOSL as the
destination register
Words: 2
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
(src)
Process
Data
No
operation
Decode No
operation
No dummy
read
No
operation
Write
register ‘f’
(dest)
Example: MOVFF REG1, REG2
Before Instruction
REG1 = 33h
REG2 = 11h
After Instruction
REG1 = 33h
REG2 = 33h
MOVLB Move Literal to Low Nibble in BSR
Syntax: MOVLW k
Operands: 0 k 255
Operation: k BSR
Status Affected: None
Encoding: 0000 0001 kkkk kkkk
Description: The eight-bit literal ‘k’ is loaded into the
Bank Select Register (BSR). The value
of BSR<7:4> always remains ‘0
regardless of the value of k7:k4.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
literal ‘k’
Process
Data
Write literal
‘k’ to BSR
Example: MOVLB 5
Before Instruction
BSR Register = 02h
After Instruction
BSR Register = 05h
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MOVLW Move Literal to W
Syntax: MOVLW k
Operands: 0 k 255
Operation: k W
Status Affected: None
Encoding: 0000 1110 kkkk kkkk
Description: The eight-bit literal ‘k’ is loaded into W.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
literal ‘k’
Process
Data
Write to
W
Example: MOVLW 5Ah
After Instruction
W=5Ah
MOVWF Move W to f
Syntax: MOVWF f {,a}
Operands: 0 f 255
a [0,1]
Operation: (W) f
Status Affected: None
Encoding: 0110 111a ffff ffff
Description: Move data from W to register ‘f’.
Location ‘f’ can be anywhere in the
256-byte bank.
If ‘a’ is0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write
register ‘f’
Example: MOVWF REG, 0
Before Instruction
W=4Fh
REG = FFh
After Instruction
W=4Fh
REG = 4Fh
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MULLW Multiply Literal with W
Syntax: MULLW k
Operands: 0 k 255
Operation: (W) x k PRODH:PRODL
Status Affected: None
Encoding: 0000 1101 kkkk kkkk
Description: An unsigned multiplication is carried
out between the contents of W and the
8-bit literal ‘k’. The 16-bit result is
placed in the PRODH:PRODL register
pair. PRODH contains the high byte.
W is unchanged.
None of the Status flags are affected.
Note that neither Overflow nor Carry is
possible in this operation. A Zero result
is possible but not detected.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
literal ‘k’
Process
Data
Write
registers
PRODH:
PRODL
Example: MULLW 0C4h
Before Instruction
W=E2h
PRODH = ?
PRODL = ?
After Instruction
W=E2h
PRODH = ADh
PRODL = 08h
MULWF Multiply W with f
Syntax: MULWF f {,a}
Operands: 0 f 255
a [0,1]
Operation: (W) x (f) PRODH:PRODL
Status Affected: None
Encoding: 0000 001a ffff ffff
Description: An unsigned multiplication is carried out
between the contents of W and the
register file location ‘f’. The 16-bit result is
stored in the PRODH:PRODL register
pair. PRODH contains the high byte. Both
W and ‘f’ are unchanged.
None of the Status flags are affected.
Note that neither Overflow nor Carry is
possible in this operation. A Zero result is
possible but not detected.
If ‘a’ is0’, the Access Bank is selected. If
‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction set
is enabled, this instruction operates in
Indexed Literal Offset Addressing mode
whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f
Process
Data
Write
registers
PRODH:
PRODL
Example: MULWF REG, 1
Before Instruction
W=C4h
REG = B5h
PRODH = ?
PRODL = ?
After Instruction
W=C4h
REG = B5h
PRODH = 8Ah
PRODL = 94h
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NEGF Negate f
Syntax: NEGF f {,a}
Operands: 0 f 255
a [0,1]
Operation: (f) + 1 f
Status Affected: N, OV, C, DC, Z
Encoding: 0110 110a ffff ffff
Description: Location ‘f’ is negated using two’s
complement. The result is placed in the
data memory location ‘f’.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write
register ‘f’
Example: NEGF REG, 1
Before Instruction
REG = 0011 1010 [3Ah]
After Instruction
REG = 1100 0110 [C6h]
NOP No Operation
Syntax: NOP
Operands: None
Operation: No operation
Status Affected: None
Encoding: 0000
1111
0000
xxxx
0000
xxxx
0000
xxxx
Description: No operation.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode No
operation
No
operation
No
operation
Example:
None.
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POP Pop Top of Return Stack
Syntax: POP
Operands: None
Operation: (TOS) bit bucket
Status Affected: None
Encoding: 0000 0000 0000 0110
Description: The TOS value is pulled off the return
stack and is discarded. The TOS value
then becomes the previous value that
was pushed onto the return stack.
This instruction is provided to enable
the user to properly manage the return
stack to incorporate a software stack.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode No
operation
POP TOS
value
No
operation
Example: POP
GOTO NEW
Before Instruction
TOS = 0031A2h
Stack (1 level down) = 014332h
After Instruction
TOS = 014332h
PC = NEW
PUSH Push Top of Return Stack
Syntax: PUSH
Operands: None
Operation: (PC + 2) TOS
Status Affected: None
Encoding: 0000 0000 0000 0101
Description: The PC + 2 is pushed onto the top of
the return stack. The previous TOS
value is pushed down on the stack.
This instruction allows implementing a
software stack by modifying TOS and
then pushing it onto the return stack.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode PUSH
PC + 2 onto
return stack
No
operation
No
operation
Example: PUSH
Before Instruction
TOS = 345Ah
PC = 0124h
After Instruction
PC = 0126h
TOS = 0126h
Stack (1 level down) = 345Ah
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RCALL Relative Call
Syntax: RCALL n
Operands: -1024 n 1023
Operation: (PC) + 2 TOS,
(PC) + 2 + 2n PC
Status Affected: None
Encoding: 1101 1nnn nnnn nnnn
Description: Subroutine call with a jump up to 1K
from the current location. First, return
address (PC + 2) is pushed onto the
stack. Then, add the 2’s complement
number ‘2n’ to the PC. Since the PC will
have incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is a
two-cycle instruction.
Words: 1
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read literal
‘n’
PUSH PC
to stack
Process
Data
Write to PC
No
operation
No
operation
No
operation
No
operation
Example: HERE RCALL Jump
Before Instruction
PC = Address (HERE)
After Instruction
PC = Address (Jump)
TOS = Address (HERE + 2)
RESET Reset
Syntax: RESET
Operands: None
Operation: Reset all registers and flags that are
affected by a MCLR Reset.
Status Affected: All
Encoding: 0000 0000 1111 1111
Description: This instruction provides a way to
execute a MCLR Reset in software.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Start
reset
No
operation
No
operation
Example: RESET
After Instruction
Registers = Reset Value
Flags* = Reset Value
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RETFIE Return from Interrupt
Syntax: RETFIE {s}
Operands: s [0,1]
Operation: (TOS) PC,
1 GIE/GIEH or PEIE/GIEL;
if s = 1,
(WS) W,
(STATUSS) STATUS,
(BSRS) BSR,
PCLATU, PCLATH are unchanged
Status Affected: GIE/GIEH, PEIE/GIEL.
Encoding: 0000 0000 0001 000s
Description: Return from interrupt. Stack is popped
and Top-of-Stack (TOS) is loaded into
the PC. Interrupts are enabled by
setting either the high or low-priority
global interrupt enable bit. If ‘s’ = 1, the
contents of the shadow registers WS,
STATUSS and BSRS are loaded into
their corresponding registers W,
STATUS and BSR. If ‘s’ = 0, no update
of these registers occurs.
Words: 1
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode No
operation
No
operation
POP PC
from stack
Set GIEH or
GIEL
No
operation
No
operation
No
operation
No
operation
Example: RETFIE 1
After Interrupt
PC = TOS
W=WS
BSR = BSRS
STATUS = STATUSS
GIE/GIEH, PEIE/GIEL = 1
RETLW Return Literal to W
Syntax: RETLW k
Operands: 0 k 255
Operation: k W,
(TOS) PC,
PCLATU, PCLATH are unchanged
Status Affected: None
Encoding: 0000 1100 kkkk kkkk
Description: W is loaded with the eight-bit literal ‘k’.
The program counter is loaded from the
top of the stack (the return address).
The high address latch (PCLATH)
remains unchanged.
Words: 1
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
literal ‘k’
Process
Data
POP PC
from stack,
write to W
No
operation
No
operation
No
operation
No
operation
Example:
CALL TABLE ; W contains table
; offset value
; W now has
; table value
:
TABLE
ADDWF PCL ; W = offset
RETLW k0 ; Begin table
RETLW k1 ;
:
:
RETLW kn ; End of table
Before Instruction
W = 07h
After Instruction
W = value of kn
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RETURN Return from Subroutine
Syntax: RETURN {s}
Operands: s [0,1]
Operation: (TOS) PC;
if s = 1,
(WS) W,
(STATUSS) STATUS,
(BSRS) BSR,
PCLATU, PCLATH are unchanged
Status Affected: None
Encoding: 0000 0000 0001 001s
Description: Return from subroutine. The stack is
popped and the top of the stack (TOS)
is loaded into the program counter. If
‘s’= 1, the contents of the shadow
registers WS, STATUSS and BSRS are
loaded into their corresponding
registers W, STATUS and BSR. If
‘s’ = 0, no update of these registers
occurs.
Words: 1
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode No
operation
Process
Data
POP PC
from stack
No
operation
No
operation
No
operation
No
operation
Example: RETURN
After Instruction:
PC = TOS
RLCF Rotate Left f through Carry
Syntax: RLCF f {,d {,a}}
Operands: 0 f 255
d [0,1]
a [0,1]
Operation: (f<n>) dest<n + 1>,
(f<7>) C,
(C) dest<0>
Status Affected: C, N, Z
Encoding: 0011 01da ffff ffff
Description: The contents of register ‘f’ are rotated
one bit to the left through the Carry flag.
If ‘d’ is0’, the result is placed in W. If ‘d’
is ‘1’, the result is stored back in register
‘f’.
If ‘a’ is0’, the Access Bank is selected.
If ‘a’ is1’, the BSR is used to select the
GPR bank.
If ‘a’ is0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write to
destination
Example: RLCF REG, 0, 0
Before Instruction
REG = 1110 0110
C=0
After Instruction
REG = 1110 0110
W=1100 1100
C=1
Cregister f
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RLNCF Rotate Left f (No Carry)
Syntax: RLNCF f {,d {,a}}
Operands: 0 f 255
d [0,1]
a [0,1]
Operation: (f<n>) dest<n + 1>,
(f<7>) dest<0>
Status Affected: N, Z
Encoding: 0100 01da ffff ffff
Description: The contents of register ‘f’ are rotated
one bit to the left. If ‘d’ is ‘0’, the result
is placed in W. If ‘d’ is 1’, the result is
stored back in register ‘f’.
If ‘a’ is0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write to
destination
Example: RLNCF REG, 1, 0
Before Instruction
REG = 1010 1011
After Instruction
REG = 0101 0111
RRCF Rotate Right f through Carry
Syntax: RRCF f {,d {,a}}
Operands: 0 f 255
d [0,1]
a [0,1]
Operation: (f<n>) dest<n – 1>,
(f<0>) C,
(C) dest<7>
Status Affected: C, N, Z
Encoding: 0011 00da ffff ffff
Description: The contents of register ‘f’ are rotated
one bit to the right through the Carry
flag. If ‘d’ is ‘0’, the result is placed in W.
If ‘d’ is ‘1’, the result is placed back in
register ‘f’.
If ‘a’ is ‘0, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write to
destination
Example: RRCF REG, 0, 0
Before Instruction
REG = 1110 0110
C=0
After Instruction
REG = 1110 0110
W=0111 0011
C=0
Cregister f
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RRNCF Rotate Right f (No Carry)
Syntax: RRNCF f {,d {,a}}
Operands: 0 f 255
d [0,1]
a [0,1]
Operation: (f<n>) dest<n – 1>,
(f<0>) dest<7>
Status Affected: N, Z
Encoding: 0100 00da ffff ffff
Description: The contents of register ‘f’ are rotated
one bit to the right. If ‘d’ is ‘0’, the result
is placed in W. If ‘d’ is ‘1’, the result is
placed back in register ‘f’.
If ‘a’ is ‘0’, the Access Bank will be
selected, overriding the BSR value. If ‘a’
is ‘1’, then the bank will be selected as
per the BSR value.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write to
destination
Example 1: RRNCF REG, 1, 0
Before Instruction
REG = 1101 0111
After Instruction
REG = 1110 1011
Example 2: RRNCF REG, 0, 0
Before Instruction
W=?
REG = 1101 0111
After Instruction
W=1110 1011
REG = 1101 0111
register f
SETF Set f
Syntax: SETF f {,a}
Operands: 0 f 255
a [0,1]
Operation: FFh f
Status Affected: None
Encoding: 0110 100a ffff ffff
Description: The contents of the specified register
are set to FFh.
If ‘a’ is ‘0, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write
register ‘f’
Example: SETF REG,1
Before Instruction
REG = 5Ah
After Instruction
REG = FFh
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SLEEP Enter Sleep Mode
Syntax: SLEEP
Operands: None
Operation: 00h WDT,
0 WDT postscaler,
1 TO,
0 PD
Status Affected: TO, PD
Encoding: 0000 0000 0000 0011
Description: The Power-Down status bit (PD) is
cleared. The Time-out status bit (TO)
is set. The Watchdog Timer and its
postscaler are cleared.
The processor is put into Sleep mode
with the oscillator stopped.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode No
operation
Process
Data
Go to
Sleep
Example: SLEEP
Before Instruction
TO =?
PD =?
After Instruction
TO =1
PD =0
† If WDT causes wake-up, this bit is cleared.
SUBFWB Subtract f from W with Borrow
Syntax: SUBFWB f {,d {,a}}
Operands: 0 f 255
d [0,1]
a [0,1]
Operation: (W) – (f) – (C) dest
Status Affected: N, OV, C, DC, Z
Encoding: 0101 01da ffff ffff
Description: Subtract register ‘f’ and Carry flag
(borrow) from W (2’s complement
method). If ‘d’ is ‘0’, the result is stored in
W. If ‘d’ is ‘1’, the result is stored in
register ‘f’.
If ‘a’ is0’, the Access Bank is selected. If
‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates in
Indexed Literal Offset Addressing mode
whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write to
destination
Example 1: SUBFWB REG, 1, 0
Before Instruction
REG = 3
W=2
C=1
After Instruction
REG = FF
W=2
C=0
Z=0
N = 1 ; result is negative
Example 2: SUBFWB REG, 0, 0
Before Instruction
REG = 2
W=5
C=1
After Instruction
REG = 2
W=3
C=1
Z=0
N = 0 ; result is positive
Example 3: SUBFWB REG, 1, 0
Before Instruction
REG = 1
W=2
C=0
After Instruction
REG = 0
W=2
C=1
Z = 1 ; result is zero
N=0
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SUBLW Subtract W from Literal
Syntax: SUBLW k
Operands: 0 k 255
Operation: k – (W) W
Status Affected: N, OV, C, DC, Z
Encoding: 0000 1000 kkkk kkkk
Description: W is subtracted from the eight-bit
literal ‘k’. The result is placed in W.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
literal ‘k’
Process
Data
Write to
W
Example 1: SUBLW 02h
Before Instruction
W = 01h
C=?
After Instruction
W = 01h
C=1 ; result is positive
Z=0
N=0
Example 2: SUBLW 02h
Before Instruction
W = 02h
C=?
After Instruction
W = 00h
C=1 ; result is zero
Z=1
N=0
Example 3: SUBLW 02h
Before Instruction
W = 03h
C=?
After Instruction
W = FFh ; (2’s complement)
C=0 ; result is negative
Z=0
N=1
SUBWF Subtract W from f
Syntax: SUBWF f {,d {,a}}
Operands: 0 f 255
d [0,1]
a [0,1]
Operation: (f) – (W) dest
Status Affected: N, OV, C, DC, Z
Encoding: 0101 11da ffff ffff
Description: Subtract W from register ‘f’ (2’s
complement method). If ‘d’ is0’, the
result is stored in W. If ‘d’ is ‘1’, the result
is stored back in register ‘f’.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write to
destination
Example 1: SUBWF REG, 1, 0
Before Instruction
REG = 3
W=2
C=?
After Instruction
REG = 1
W=2
C = 1 ; result is positive
Z=0
N=0
Example 2: SUBWF REG, 0, 0
Before Instruction
REG = 2
W=2
C=?
After Instruction
REG = 2
W=0
C = 1 ; result is zero
Z=1
N=0
Example 3: SUBWF REG, 1, 0
Before Instruction
REG = 1
W=2
C=?
After Instruction
REG = FFh ;(2’s complement)
W=2
C = 0 ; result is negative
Z=0
N=1
2010 Microchip Technology Inc. Preliminary DS39979A-page 371
PIC18F87J72 FAMILY
SUBWFB Subtract W from f with Borrow
Syntax: SUBWFB f {,d {,a}}
Operands: 0 f 255
d [0,1]
a [0,1]
Operation: (f) – (W) – (C) dest
Status Affected: N, OV, C, DC, Z
Encoding: 0101 10da ffff ffff
Description: Subtract W and the Carry flag (borrow)
from register ‘f’ (2’s complement
method). If ‘d’ is ‘0’, the result is stored
in W. If ‘d’ is ‘1’, the result is stored back
in register ‘f’.
If ‘a’ is ‘0, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write to
destination
Example 1: SUBWFB REG, 1, 0
Before Instruction
REG = 19h (0001 1001)
W=0Dh (0000 1101)
C=1
After Instruction
REG = 0Ch (0000 1011)
W=0Dh (0000 1101)
C=1
Z=0
N=0 ; result is positive
Example 2: SUBWFB REG, 0, 0
Before Instruction
REG = 1Bh (0001 1011)
W=1Ah (0001 1010)
C=0
After Instruction
REG = 1Bh (0001 1011)
W = 00h
C=1
Z=1 ; result is zero
N=0
Example 3: SUBWFB REG, 1, 0
Before Instruction
REG = 03h (0000 0011)
W=0Eh (0000 1101)
C=1
After Instruction
REG = F5h (1111 0100)
; [2’s comp]
W=0Eh (0000 1101)
C=0
Z=0
N=1 ; result is negative
SWAPF Swap f
Syntax: SWAPF f {,d {,a}}
Operands: 0 f 255
d [0,1]
a [0,1]
Operation: (f<3:0>) dest<7:4>,
(f<7:4>) dest<3:0>
Status Affected: None
Encoding: 0011 10da ffff ffff
Description: The upper and lower nibbles of register
‘f’ are exchanged. If ‘d’ is ‘0’, the result
is placed in W. If ‘d’ is ‘1’, the result is
placed in register ‘f’.
If ‘a’ is ‘0, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write to
destination
Example: SWAPF REG, 1, 0
Before Instruction
REG = 53h
After Instruction
REG = 35h
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TBLRD Table Read
Syntax: TBLRD ( *; *+; *-; +*)
Operands: None
Operation: if TBLRD *,
(Prog Mem (TBLPTR)) TABLAT;
TBLPTR – No Change
if TBLRD *+,
(Prog Mem (TBLPTR)) TABLAT;
(TBLPTR) + 1 TBLPTR
if TBLRD *-,
(Prog Mem (TBLPTR)) TABLAT;
(TBLPTR)1 TBLPTR
if TBLRD +*,
(TBLPTR) + 1 TBLPTR;
(Prog Mem (TBLPTR)) TABLAT
Status Affected: None
Encoding: 0000 0000 0000 10nn
nn=0 *
=1 *+
=2 *-
=3 +*
Description: This instruction is used to read the contents
of Program Memory (P.M.). To address the
program memory, a pointer called Table
Pointer (TBLPTR) is used.
The TBLPTR (a 21-bit pointer) points to
each byte in the program memory. TBLPTR
has a 2-Mbyte address range.
TBLPTR<0> = 0:Least Significant Byte of
Program Memory Word
TBLPTR<0> = 1:Most Significant Byte of
Program Memory Word
The TBLRD instruction can modify the value
of TBLPTR as follows:
no change
post-increment
post-decrement
pre-increment
Words: 1
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode No
operation
No
operation
No
operation
No
operation
No operation
(Read Program
Memory)
No
operation
No operation
(Write
TABLAT)
TBLRD Table Read (Continued)
Example 1: TBLRD *+ ;
Before Instruction
TABLAT = 55h
TBLPTR = 00A356h
MEMORY(00A356h) = 34h
After Instruction
TABLAT = 34h
TBLPTR = 00A357h
Example 2: TBLRD +* ;
Before Instruction
TABLAT = AAh
TBLPTR = 01A357h
MEMORY(01A357h) = 12h
MEMORY(01A358h) = 34h
After Instruction
TABLAT = 34h
TBLPTR = 01A358h
2010 Microchip Technology Inc. Preliminary DS39979A-page 373
PIC18F87J72 FAMILY
TBLWT Table Write
Syntax: TBLWT ( *; *+; *-; +*)
Operands: None
Operation: if TBLWT*,
(TABLAT) Holding Register;
TBLPTR – No Change
if TBLWT*+,
(TABLAT) Holding Register;
(TBLPTR) + 1 TBLPTR
if TBLWT*-,
(TABLAT) Holding Register;
(TBLPTR) – 1 TBLPTR
if TBLWT+*,
(TBLPTR) + 1 TBLPTR;
(TABLAT) Holding Register
Status Affected: None
Encoding: 0000 0000 0000 11nn
nn=0 *
=1 *+
=2 *-
=3 +*
Description: This instruction uses the 3 LSBs of
TBLPTR to determine which of the
8 holding registers the TABLAT is written
to. The holding registers are used to
program the contents of Program Memory
(P.M.). (Refer to Section 6.0 “Memory
Organization” for additional details on
programming Flash memory.)
The TBLPTR (a 21-bit pointer) points to
each byte in the program memory.
TBLPTR has a 2-Mbyte address range.
The LSb of the TBLPTR selects which
byte of the program memory location to
access.
TBLPTR[0] = 0:Least Significant Byte
of Program Memory
Word
TBLPTR[0] = 1:Most Significant Byte of
Program Memory
Word
The TBLWT instruction can modify the
value of TBLPTR as follows:
no change
post-increment
post-decrement
pre-increment
Words: 1
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode No
operation
No
operation
No
operation
No
operation
No
operation
(Read
TABLAT)
No
operation
No
operation
(Write to
Holding
Register)
TBLWT Table Write (Continued)
Example 1: TBLWT *+;
Before Instruction
TABLAT = 55h
TBLPTR = 00A356h
HOLDING REGISTER
(00A356h) = FFh
After Instructions (table write completion)
TABLAT = 55h
TBLPTR = 00A357h
HOLDING REGISTER
(00A356h) = 55h
Example 2: TBLWT +*;
Before Instruction
TABLAT = 34h
TBLPTR = 01389Ah
HOLDING REGISTER
(01389Ah) = FFh
HOLDING REGISTER
(01389Bh) = FFh
After Instruction (table write completion)
TABLAT = 34h
TBLPTR = 01389Bh
HOLDING REGISTER
(01389Ah) = FFh
HOLDING REGISTER
(01389Bh) = 34h
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TSTFSZ Test f, Skip if 0
Syntax: TSTFSZ f {,a}
Operands: 0 f 255
a [0,1]
Operation: skip if f = 0
Status Affected: None
Encoding: 0110 011a ffff ffff
Description: If ‘f’ = 0, the next instruction fetched
during the current instruction execution
is discarded and a NOP is executed,
making this a two-cycle instruction.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1(2)
Note: 3 cycles if skip and followed
by a 2-word instruction.
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
No
operation
If skip:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
If skip and followed by 2-word instruction:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
Example: HERE TSTFSZ CNT, 1
NZERO :
ZERO :
Before Instruction
PC = Address (HERE)
After Instruction
If CNT = 00h,
PC = Address (ZERO)
If CNT 00h,
PC = Address (NZERO)
XORLW Exclusive OR Literal with W
Syntax: XORLW k
Operands: 0 k 255
Operation: (W) .XOR. k W
Status Affected: N, Z
Encoding: 0000 1010 kkkk kkkk
Description: The contents of W are XORed with
the 8-bit literal ‘k’. The result is placed
in W.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
literal ‘k’
Process
Data
Write to
W
Example: XORLW 0AFh
Before Instruction
W=B5h
After Instruction
W=1Ah
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XORWF Exclusive OR W with f
Syntax: XORWF f {,d {,a}}
Operands: 0 f 255
d [0,1]
a [0,1]
Operation: (W) .XOR. (f) dest
Status Affected: N, Z
Encoding: 0001 10da ffff ffff
Description: Exclusive OR the contents of W with
register ‘f’. If ‘d’ is ‘0’, the result is stored
in W. If ‘d’ is ‘1’, the result is stored back
in the register ‘f’.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 27.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write to
destination
Example: XORWF REG, 1, 0
Before Instruction
REG = AFh
W=B5h
After Instruction
REG = 1Ah
W=B5h
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DS39979A-page 376 Preliminary 2010 Microchip Technology Inc.
27.2 Extended Instruction Set
In addition to the standard 75 instructions of the PIC18
instruction set, the PIC18F87J72 family of devices also
provides an optional extension to the core CPU func-
tionality. The added features include eight additional
instructions that augment Indirect and Indexed
Addressing operations and the implementation of
Indexed Literal Offset Addressing for many of the
standard PIC18 instructions.
The additional features of the extended instruction set
are enabled by default on unprogrammed devices.
Users must properly set or clear the XINST Configura-
tion bit during programming to enable or disable these
features.
The instructions in the extended set can all be
classified as literal operations, which either manipulate
the File Select Registers, or use them for Indexed
Addressing. Two of the instructions, ADDFSR and
SUBFSR, each have an additional special instantiation
for using FSR2. These versions (ADDULNK and
SUBULNK) allow for automatic return after execution.
The extended instructions are specifically implemented
to optimize re-entrant program code (that is, code that
is recursive or that uses a software stack) written in
high-level languages, particularly C. Among other
things, they allow users working in high-level
languages to perform certain operations on data
structures more efficiently. These include:
Dynamic allocation and deallocation of software
stack space when entering and leaving
subroutines
Function Pointer invocation
Software Stack Pointer manipulation
Manipulation of variables located in a software
stack
A summary of the instructions in the extended instruc-
tion set is provided in Table 27-3. Detailed descriptions
are provided in Section 27.2.2 “Extended Instruction
Set”. The opcode field descriptions in Table 27-1
(page 334) apply to both the standard and extended
PIC18 instruction sets.
27.2.1 EXTENDED INSTRUCTION SYNTAX
Most of the extended instructions use indexed argu-
ments, using one of the File Select Registers and some
offset to specify a source or destination register. When
an argument for an instruction serves as part of
Indexed Addressing, it is enclosed in square brackets
(“[ ]”). This is done to indicate that the argument is used
as an index or offset. The MPASM™ Assembler will
flag an error if it determines that an index or offset value
is not bracketed.
When the extended instruction set is enabled, brackets
are also used to indicate index arguments in
byte-oriented and bit-oriented instructions. This is in
addition to other changes in their syntax. For more
details, see Section 27.2.3.1 “Extended Instruction
Syntax with Standard PIC18 Commands”.
TABLE 27-3: EXTENSIONS TO THE PIC18 INSTRUCTION SET
Note: The instruction set extension and the
Indexed Literal Offset Addressing mode
were designed for optimizing applications
written in C; the user may likely never use
these instructions directly in assembler.
The syntax for these commands is
provided as a reference for users who may
be reviewing code that has been
generated by a compiler.
Note: In the past, square brackets have been
used to denote optional arguments in the
PIC18 and earlier instruction sets. In this
text and going forward, optional
arguments are denoted by braces (“{ }”).
Mnemonic,
Operands Description Cycles
16-Bit Instruction Word Status
Affected
MSb LSb
ADDFSR
ADDULNK
CALLW
MOVSF
MOVSS
PUSHL
SUBFSR
SUBULNK
f, k
k
zs, fd
zs, zd
k
f, k
k
Add Literal to FSR
Add Literal to FSR2 and Return
Call Subroutine using WREG
Move zs (source) to 1st word
fd (destination) 2nd word
Move zs (source) to 1st word
zd (destination) 2nd word
Store Literal at FSR2,
Decrement FSR2
Subtract Literal from FSR
Subtract Literal from FSR2 and
return
1
2
2
2
2
1
1
2
1110
1110
0000
1110
1111
1110
1111
1110
1110
1110
1000
1000
0000
1011
ffff
1011
xxxx
1010
1001
1001
ffkk
11kk
0001
0zzz
ffff
1zzz
xzzz
kkkk
ffkk
11kk
kkkk
kkkk
0100
zzzz
ffff
zzzz
zzzz
kkkk
kkkk
kkkk
None
None
None
None
None
None
None
None
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27.2.2 EXTENDED INSTRUCTION SET
ADDFSR Add Literal to FSR
Syntax: ADDFSR f, k
Operands: 0 k 63
f [ 0, 1, 2 ]
Operation: FSR(f) + k FSR(f)
Status Affected: None
Encoding: 1110 1000 ffkk kkkk
Description: The 6-bit literal ‘k’ is added to the
contents of the FSR specified by ‘f’.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
literal ‘k’
Process
Data
Write to
FSR
Example: ADDFSR 2, 23h
Before Instruction
FSR2 = 03FFh
After Instruction
FSR2 = 0422h
ADDULNK Add Literal to FSR2 and Return
Syntax: ADDULNK k
Operands: 0 k 63
Operation: FSR2 + k FSR2,
(TOS) PC
Status Affected: None
Encoding: 1110 1000 11kk kkkk
Description: The 6-bit literal ‘k’ is added to the
contents of FSR2. A RETURN is then
executed by loading the PC with the
TOS.
The instruction takes two cycles to
execute; a NOP is performed during
the second cycle.
This may be thought of as a special
case of the ADDFSR instruction,
where f = 3 (binary ‘11’); it operates
only on FSR2.
Words: 1
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
literal ‘k’
Process
Data
Write to
FSR
No
Operation
No
Operation
No
Operation
No
Operation
Example: ADDULNK 23h
Before Instruction
FSR2 = 03FFh
PC = 0100h
After Instruction
FSR2 = 0422h
PC = (TOS)
Note: All PIC18 instructions may take an optional label argument preceding the instruction mnemonic for use in
symbolic addressing. If a label is used, the instruction format then becomes: {label} instruction argument(s).
PIC18F87J72 FAMILY
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CALLW Subroutine Call Using WREG
Syntax: CALLW
Operands: None
Operation: (PC + 2) TOS,
(W) PCL,
(PCLATH) PCH,
(PCLATU) PCU
Status Affected: None
Encoding: 0000 0000 0001 0100
Description First, the return address (PC + 2) is
pushed onto the return stack. Next, the
contents of W are written to PCL; the
existing value is discarded. Then, the
contents of PCLATH and PCLATU are
latched into PCH and PCU,
respectively. The second cycle is
executed as a NOP instruction while the
new next instruction is fetched.
Unlike CALL, there is no option to
update W, STATUS or BSR.
Words: 1
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
WREG
Push PC to
stack
No
operation
No
operation
No
operation
No
operation
No
operation
Example: HERE CALLW
Before Instruction
PC = address (HERE)
PCLATH = 10h
PCLATU = 00h
W = 06h
After Instruction
PC = 001006h
TOS = address (HERE + 2)
PCLATH = 10h
PCLATU = 00h
W = 06h
MOVSF Move Indexed to f
Syntax: MOVSF [zs], fd
Operands: 0 zs 127
0 fd 4095
Operation: ((FSR2) + zs) fd
Status Affected: None
Encoding:
1st word (source)
2nd word (destin.)
1110
1111
1011
ffff
0zzz
ffff
zzzzs
ffffd
Description: The contents of the source register are
moved to destination register ‘fd’. The
actual address of the source register is
determined by adding the 7-bit literal
offset ‘zs’, in the first word, to the value
of FSR2. The address of the destination
register is specified by the 12-bit literal
‘fd’ in the second word. Both addresses
can be anywhere in the 4096-byte data
space (000h to FFFh).
The MOVSF instruction cannot use the
PCL, TOSU, TOSH or TOSL as the
destination register.
If the resultant source address points to
an Indirect Addressing register, the
value returned will be 00h.
Words: 2
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Determine
source addr
Determine
source addr
Read
source reg
Decode No
operation
No dummy
read
No
operation
Write
register ‘f’
(dest)
Example: MOVSF [05h], REG2
Before Instruction
FSR2 = 80h
Contents
of 85h = 33h
REG2 = 11h
After Instruction
FSR2 = 80h
Contents
of 85h = 33h
REG2 = 33h
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MOVSS Move Indexed to Indexed
Syntax: MOVSS [zs], [zd]
Operands: 0 zs 127
0 zd 127
Operation: ((FSR2) + zs) ((FSR2) + zd)
Status Affected: None
Encoding:
1st word (source)
2nd word (dest.)
1110
1111
1011
xxxx
1zzz
xzzz
zzzzs
zzzzd
Description The contents of the source register are
moved to the destination register. The
addresses of the source and destination
registers are determined by adding the
7-bit literal offsets, ‘zs’ or ‘zd’,
respectively, to the value of FSR2. Both
registers can be located anywhere in
the 4096-byte data memory space
(000h to FFFh).
The MOVSS instruction cannot use the
PCL, TOSU, TOSH or TOSL as the
destination register.
If the resultant source address points to
an Indirect Addressing register, the
value returned will be 00h. If the
resultant destination address points to
an Indirect Addressing register, the
instruction will execute as a NOP.
Words: 2
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Determine
source addr
Determine
source addr
Read
source reg
Decode Determine
dest addr
Determine
dest addr
Write
to dest reg
Example: MOVSS [05h], [06h]
Before Instruction
FSR2 = 80h
Contents
of 85h = 33h
Contents
of 86h = 11h
After Instruction
FSR2 = 80h
Contents
of 85h = 33h
Contents
of 86h = 33h
PUSHL Store Literal at FSR2, Decrement FSR2
Syntax: PUSHL k
Operands: 0k 255
Operation: k (FSR2),
FSR2 – 1 FSR2
Status Affected: None
Encoding: 1111 1010 kkkk kkkk
Description: The 8-bit literal ‘k’ is written to the data
memory address specified by FSR2.
FSR2 is decremented by 1 after the
operation.
This instruction allows users to push
values onto a software stack.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read ‘k’ Process
data
Write to
destination
Example: PUSHL 08h
Before Instruction
FSR2H:FSR2L = 01ECh
Memory (01ECh) = 00h
After Instruction
FSR2H:FSR2L = 01EBh
Memory (01ECh) = 08h
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SUBFSR Subtract Literal from FSR
Syntax: SUBFSR f, k
Operands: 0 k 63
f [ 0, 1, 2 ]
Operation: FSRf – k FSRf
Status Affected: None
Encoding: 1110 1001 ffkk kkkk
Description: The 6-bit literal ‘k’ is subtracted from
the contents of the FSR specified
by ‘f’.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write to
destination
Example: SUBFSR 2, 23h
Before Instruction
FSR2 = 03FFh
After Instruction
FSR2 = 03DCh
SUBULNK Subtract Literal from FSR2 and Return
Syntax: SUBULNK k
Operands: 0 k 63
Operation: FSR2 – k FSR2,
(TOS) PC
Status Affected: None
Encoding: 1110 1001 11kk kkkk
Description: The 6-bit literal ‘k’ is subtracted from the
contents of the FSR2. A RETURN is then
executed by loading the PC with the
TOS.
The instruction takes two cycles to
execute; a NOP is performed during the
second cycle.
This may be thought of as a special case
of the SUBFSR instruction, where f = 3
(binary ‘11’); it operates only on FSR2.
Words: 1
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write to
destination
No
Operation
No
Operation
No
Operation
No
Operation
Example: SUBULNK 23h
Before Instruction
FSR2 = 03FFh
PC = 0100h
After Instruction
FSR2 = 03DCh
PC = (TOS)
2010 Microchip Technology Inc. Preliminary DS39979A-page 381
PIC18F87J72 FAMILY
27.2.3 BYTE-ORIENTED AND
BIT-ORIENTED INSTRUCTIONS IN
INDEXED LITERAL OFFSET MODE
In addition to eight new commands in the extended set,
enabling the extended instruction set also enables
Indexed Literal Offset Addressing (Section 6.6.1
“Indexed Addressing with Literal Offset”). This has
a significant impact on the way that many commands of
the standard PIC18 instruction set are interpreted.
When the extended set is disabled, addresses embed-
ded in opcodes are treated as literal memory locations:
either as a location in the Access Bank (a = 0) or in a
GPR bank designated by the BSR (a = 1). When the
extended instruction set is enabled and a = 0, however,
a file register argument of 5Fh or less is interpreted as
an offset from the pointer value in FSR2 and not as a
literal address. For practical purposes, this means that
all instructions that use the Access RAM bit as an
argument – that is, all byte-oriented and bit-oriented
instructions, or almost half of the core PIC18 instruc-
tions – may behave differently when the extended
instruction set is enabled.
When the content of FSR2 is 00h, the boundaries of the
Access RAM are essentially remapped to their original
values. This may be useful in creating
backward-compatible code. If this technique is used, it
may be necessary to save the value of FSR2 and
restore it when moving back and forth between C and
assembly routines in order to preserve the Stack
Pointer. Users must also keep in mind the syntax
requirements of the extended instruction set (see
Section 27.2.3.1 “Extended Instruction Syntax with
Standard PIC18 Commands”).
Although the Indexed Literal Offset mode can be very
useful for dynamic stack and pointer manipulation, it
can also be very annoying if a simple arithmetic opera-
tion is carried out on the wrong register. Users who are
accustomed to the PIC18 programming must keep in
mind that, when the extended instruction set is
enabled, register addresses of 5Fh or less are used for
Indexed Literal Offset Addressing.
Representative examples of typical byte-oriented and
bit-oriented instructions in the Indexed Literal Offset
mode are provided on the following page to show how
execution is affected. The operand conditions shown in
the examples are applicable to all instructions of these
types.
27.2.3.1 Extended Instruction Syntax with
Standard PIC18 Commands
When the extended instruction set is enabled, the file
register argument ‘f’ in the standard byte-oriented and
bit-oriented commands is replaced with the literal offset
value ‘k’. As already noted, this occurs only when ‘f’ is
less than or equal to 5Fh. When an offset value is used,
it must be indicated by square brackets (“[ ]”). As with
the extended instructions, the use of brackets indicates
to the compiler that the value is to be interpreted as an
index or an offset. Omitting the brackets, or using a
value greater than 5Fh within the brackets, will
generate an error in the MPASM™ Assembler.
If the index argument is properly bracketed for Indexed
Literal Offset Addressing, the Access RAM argument is
never specified; it will automatically be assumed to be
0’. This is in contrast to standard operation (extended
instruction set disabled), when ‘a’ is set on the basis of
the target address. Declaring the Access RAM bit in
this mode will also generate an error in the MPASM
Assembler.
The destination argument ‘d’ functions as before.
In the latest versions of the MPASM Assembler,
language support for the extended instruction set must
be explicitly invoked. This is done with either the
command line option, /y, or the PE directive in the
source listing.
27.2.4 CONSIDERATIONS WHEN
ENABLING THE EXTENDED
INSTRUCTION SET
It is important to note that the extensions to the instruc-
tion set may not be beneficial to all users. In particular,
users who are not writing code that uses a software
stack may not benefit from using the extensions to the
instruction set.
Additionally, the Indexed Literal Offset Addressing
mode may create issues with legacy applications
written to the PIC18 assembler. This is because
instructions in the legacy code may attempt to address
registers in the Access Bank below 5Fh. Since these
addresses are interpreted as literal offsets to FSR2
when the instruction set extension is enabled, the
application may read or write to the wrong data
addresses.
When porting an application to the PIC18F87J72
family, it is very important to consider the type of code.
A large, re-entrant application that is written in C and
would benefit from efficient compilation will do well
when using the instruction set extensions. Legacy
applications that heavily use the Access Bank will most
likely not benefit from using the extended instruction
set.
Note: Enabling the PIC18 instruction set exten-
sion may cause legacy applications to
behave erratically or fail entirely.
PIC18F87J72 FAMILY
DS39979A-page 382 Preliminary 2010 Microchip Technology Inc.
ADDWF ADD W to Indexed
(Indexed Literal Offset mode)
Syntax: ADDWF [k] {,d}
Operands: 0 k 95
d [0,1]
Operation: (W) + ((FSR2) + k) dest
Status Affected: N, OV, C, DC, Z
Encoding: 0010 01d0 kkkk kkkk
Description: The contents of W are added to the
contents of the register indicated by
FSR2, offset by the value ‘k’.
If ‘d’ is ‘0’, the result is stored in W. If ‘d’
is ‘1’, the result is stored back in
register ‘f’.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read ‘k’ Process
Data
Write to
destination
Example: ADDWF [OFST] ,0
Before Instruction
W = 17h
OFST = 2Ch
FSR2 = 0A00h
Contents
of 0A2Ch = 20h
After Instruction
W = 37h
Contents
of 0A2Ch = 20h
BSF Bit Set Indexed
(Indexed Literal Offset mode)
Syntax: BSF [k], b
Operands: 0 f 95
0 b 7
Operation: 1 ((FSR2) + k)<b>
Status Affected: None
Encoding: 1000 bbb0 kkkk kkkk
Description: Bit ‘b’ of the register indicated by FSR2,
offset by the value ‘k’, is set.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register ‘f’
Process
Data
Write to
destination
Example: BSF [FLAG_OFST], 7
Before Instruction
FLAG_OFST = 0Ah
FSR2 = 0A00h
Contents
of 0A0Ah = 55h
After Instruction
Contents
of 0A0Ah = D5h
SETF Set Indexed
(Indexed Literal Offset mode)
Syntax: SETF [k]
Operands: 0 k 95
Operation: FFh ((FSR2) + k)
Status Affected: None
Encoding: 0110 1000 kkkk kkkk
Description: The contents of the register indicated by
FSR2, offset by ‘k’, are set to FFh.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read ‘k’ Process
Data
Write
register
Example: SETF [OFST]
Before Instruction
OFST = 2Ch
FSR2 = 0A00h
Contents
of 0A2Ch = 00h
After Instruction
Contents
of 0A2Ch = FFh
2010 Microchip Technology Inc. Preliminary DS39979A-page 383
PIC18F87J72 FAMILY
27.2.5 SPECIAL CONSIDERATIONS WITH
MICROCHIP MPLAB® IDE TOOLS
The latest versions of Microchip’s software tools have
been designed to fully support the extended instruction
set for the PIC18F87J72 family. This includes the
MPLAB C18 C Compiler, MPASM assembly language
and MPLAB Integrated Development Environment
(IDE).
When selecting a target device for software
development, MPLAB IDE will automatically set default
Configuration bits for that device. The default setting for
the XINST Configuration bit is ‘1’, enabling the
extended instruction set and Indexed Literal Offset
Addressing. For proper execution of applications
developed to take advantage of the extended
instruction set, XINST must be set during
programming.
To develop software for the extended instruction set,
the user must enable support for the instructions and
the Indexed Addressing mode in their language tool(s).
Depending on the environment being used, this may be
done in several ways:
A menu option or dialog box within the
environment that allows the user to configure the
language tool and its settings for the project
A command line option
A directive in the source code
These options vary between different compilers,
assemblers and development environments. Users are
encouraged to review the documentation accompany-
ing their development systems for the appropriate
information.
PIC18F87J72 FAMILY
DS39979A-page 384 Preliminary 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. Preliminary DS39979A-page 385
PIC18F87J72 FAMILY
28.0 DEVELOPMENT SUPPORT
The PIC® microcontrollers and dsPIC® digital signal
controllers are supported with a full range of software
and hardware development tools:
Integrated Development Environment
- MPLAB® IDE Software
Compilers/Assemblers/Linkers
- MPLAB C Compiler for Various Device
Families
- HI-TECH C for Various Device Families
- MPASMTM Assembler
-MPLINK
TM Object Linker/
MPLIBTM Object Librarian
- MPLAB Assembler/Linker/Librarian for
Various Device Families
Simulators
- MPLAB SIM Software Simulator
•Emulators
- MPLAB REAL ICE™ In-Circuit Emulator
In-Circuit Debuggers
- MPLAB ICD 3
- PICkit™ 3 Debug Express
Device Programmers
- PICkit™ 2 Programmer
- MPLAB PM3 Device Programmer
Low-Cost Demonstration/Development Boards,
Evaluation Kits, and Starter Kits
28.1 MPLAB Integrated Development
Environment Software
The MPLAB IDE software brings an ease of software
development previously unseen in the 8/16/32-bit
microcontroller market. The MPLAB IDE is a Windows®
operating system-based application that contains:
A single graphical interface to all debugging tools
- Simulator
- Programmer (sold separately)
- In-Circuit Emulator (sold separately)
- In-Circuit Debugger (sold separately)
A full-featured editor with color-coded context
A multiple project manager
Customizable data windows with direct edit of
contents
High-level source code debugging
Mouse over variable inspection
Drag and drop variables from source to watch
windows
Extensive on-line help
Integration of select third party tools, such as
IAR C Compilers
The MPLAB IDE allows you to:
Edit your source files (either C or assembly)
One-touch compile or assemble, and download to
emulator and simulator tools (automatically
updates all project information)
Debug using:
- Source files (C or assembly)
- Mixed C and assembly
- Machine code
MPLAB IDE supports multiple debugging tools in a
single development paradigm, from the cost-effective
simulators, through low-cost in-circuit debuggers, to
full-featured emulators. This eliminates the learning
curve when upgrading to tools with increased flexibility
and power.
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DS39979A-page 386 Preliminary 2010 Microchip Technology Inc.
28.2 MPLAB C Compilers for Various
Device Families
The MPLAB C Compiler code development systems
are complete ANSI C compilers for Microchip’s PIC18,
PIC24 and PIC32 families of microcontrollers and the
dsPIC30 and dsPIC33 families of digital signal control-
lers. These compilers provide powerful integration
capabilities, superior code optimization and ease of
use.
For easy source level debugging, the compilers provide
symbol information that is optimized to the MPLAB IDE
debugger.
28.3 HI-TECH C for Various Device
Families
The HI-TECH C Compiler code development systems
are complete ANSI C compilers for Microchip’s PIC
family of microcontrollers and the dsPIC family of digital
signal controllers. These compilers provide powerful
integration capabilities, omniscient code generation
and ease of use.
For easy source level debugging, the compilers provide
symbol information that is optimized to the MPLAB IDE
debugger.
The compilers include a macro assembler, linker, pre-
processor, and one-step driver, and can run on multiple
platforms.
28.4 MPASM Assembler
The MPASM Assembler is a full-featured, universal
macro assembler for PIC10/12/16/18 MCUs.
The MPASM Assembler generates relocatable object
files for the MPLINK Object Linker, Intel® standard HEX
files, MAP files to detail memory usage and symbol
reference, absolute LST files that contain source lines
and generated machine code and COFF files for
debugging.
The MPASM Assembler features include:
Integration into MPLAB IDE projects
User-defined macros to streamline
assembly code
Conditional assembly for multi-purpose
source files
Directives that allow complete control over the
assembly process
28.5 MPLINK Object Linker/
MPLIB Object Librarian
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler and the
MPLAB C18 C Compiler. It can link relocatable objects
from precompiled libraries, using directives from a
linker script.
The MPLIB Object Librarian manages the creation and
modification of library files of precompiled code. When
a routine from a library is called from a source file, only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
Efficient linking of single libraries instead of many
smaller files
Enhanced code maintainability by grouping
related modules together
Flexible creation of libraries with easy module
listing, replacement, deletion and extraction
28.6 MPLAB Assembler, Linker and
Librarian for Various Device
Families
MPLAB Assembler produces relocatable machine
code from symbolic assembly language for PIC24,
PIC32 and dsPIC devices. MPLAB C Compiler uses
the assembler to produce its object file. The assembler
generates relocatable object files that can then be
archived or linked with other relocatable object files and
archives to create an executable file. Notable features
of the assembler include:
Support for the entire device instruction set
Support for fixed-point and floating-point data
Command line interface
Rich directive set
Flexible macro language
MPLAB IDE compatibility
2010 Microchip Technology Inc. Preliminary DS39979A-page 387
PIC18F87J72 FAMILY
28.7 MPLAB SIM Software Simulator
The MPLAB SIM Software Simulator allows code
development in a PC-hosted environment by simulat-
ing the PIC MCUs and dsPIC® DSCs on an instruction
level. On any given instruction, the data areas can be
examined or modified and stimuli can be applied from
a comprehensive stimulus controller. Registers can be
logged to files for further run-time analysis. The trace
buffer and logic analyzer display extend the power of
the simulator to record and track program execution,
actions on I/O, most peripherals and internal registers.
The MPLAB SIM Software Simulator fully supports
symbolic debugging using the MPLAB C Compilers,
and the MPASM and MPLAB Assemblers. The soft-
ware simulator offers the flexibility to develop and
debug code outside of the hardware laboratory envi-
ronment, making it an excellent, economical software
development tool.
28.8 MPLAB REAL ICE In-Circuit
Emulator System
MPLAB REAL ICE In-Circuit Emulator System is
Microchip’s next generation high-speed emulator for
Microchip Flash DSC and MCU devices. It debugs and
programs PIC® Flash MCUs and dsPIC® Flash DSCs
with the easy-to-use, powerful graphical user interface of
the MPLAB Integrated Development Environment (IDE),
included with each kit.
The emulator is connected to the design engineer’s PC
using a high-speed USB 2.0 interface and is connected
to the target with either a connector compatible with in-
circuit debugger systems (RJ11) or with the new high-
speed, noise tolerant, Low-Voltage Differential Signal
(LVDS) interconnection (CAT5).
The emulator is field upgradable through future firmware
downloads in MPLAB IDE. In upcoming releases of
MPLAB IDE, new devices will be supported, and new
features will be added. MPLAB REAL ICE offers signifi-
cant advantages over competitive emulators including
low-cost, full-speed emulation, run-time variable
watches, trace analysis, complex breakpoints, a rugge-
dized probe interface and long (up to three meters) inter-
connection cables.
28.9 MPLAB ICD 3 In-Circuit Debugger
System
MPLAB ICD 3 In-Circuit Debugger System is Micro-
chip’s most cost effective high-speed hardware
debugger/programmer for Microchip Flash Digital Sig-
nal Controller (DSC) and microcontroller (MCU)
devices. It debugs and programs PIC® Flash microcon-
trollers and dsPIC® DSCs with the powerful, yet easy-
to-use graphical user interface of MPLAB Integrated
Development Environment (IDE).
The MPLAB ICD 3 In-Circuit Debugger probe is con-
nected to the design engineer’s PC using a high-speed
USB 2.0 interface and is connected to the target with a
connector compatible with the MPLAB ICD 2 or MPLAB
REAL ICE systems (RJ-11). MPLAB ICD 3 supports all
MPLAB ICD 2 headers.
28.10 PICkit 3 In-Circuit Debugger/
Programmer and
PICkit 3 Debug Express
The MPLAB PICkit 3 allows debugging and program-
ming of PIC® and dsPIC® Flash microcontrollers at a
most affordable price point using the powerful graphical
user interface of the MPLAB Integrated Development
Environment (IDE). The MPLAB PICkit 3 is connected
to the design engineer’s PC using a full speed USB
interface and can be connected to the target via an
Microchip debug (RJ-11) connector (compatible with
MPLAB ICD 3 and MPLAB REAL ICE). The connector
uses two device I/O pins and the reset line to imple-
ment in-circuit debugging and In-Circuit Serial Pro-
gramming™.
The PICkit 3 Debug Express include the PICkit 3, demo
board and microcontroller, hookup cables and CDROM
with user’s guide, lessons, tutorial, compiler and
MPLAB IDE software.
PIC18F87J72 FAMILY
DS39979A-page 388 Preliminary 2010 Microchip Technology Inc.
28.11 PICkit 2 Development
Programmer/Debugger and
PICkit 2 Debug Express
The PICkit™ 2 Development Programmer/Debugger is
a low-cost development tool with an easy to use inter-
face for programming and debugging Microchip’s Flash
families of microcontrollers. The full featured
Windows® programming interface supports baseline
(PIC10F, PIC12F5xx, PIC16F5xx), midrange
(PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30,
dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit
microcontrollers, and many Microchip Serial EEPROM
products. With Microchip’s powerful MPLAB Integrated
Development Environment (IDE) the PICkit™ 2
enables in-circuit debugging on most PIC® microcon-
trollers. In-Circuit-Debugging runs, halts and single
steps the program while the PIC microcontroller is
embedded in the application. When halted at a break-
point, the file registers can be examined and modified.
The PICkit 2 Debug Express include the PICkit 2, demo
board and microcontroller, hookup cables and CDROM
with user’s guide, lessons, tutorial, compiler and
MPLAB IDE software.
28.12 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at VDDMIN and VDDMAX for
maximum reliability. It features a large LCD display
(128 x 64) for menus and error messages and a modu-
lar, detachable socket assembly to support various
package types. The ICSP™ cable assembly is included
as a standard item. In Stand-Alone mode, the MPLAB
PM3 Device Programmer can read, verify and program
PIC devices without a PC connection. It can also set
code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or USB cable.
The MPLAB PM3 has high-speed communications and
optimized algorithms for quick programming of large
memory devices and incorporates an MMC card for file
storage and data applications.
28.13 Demonstration/Development
Boards, Evaluation Kits, and
Starter Kits
A wide variety of demonstration, development and
evaluation boards for various PIC MCUs and dsPIC
DSCs allows quick application development on fully func-
tional systems. Most boards include prototyping areas for
adding custom circuitry and provide application firmware
and source code for examination and modification.
The boards support a variety of features, including LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displays, potentiometers and additional
EEPROM memory.
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM™ and dsPICDEM™ demon-
stration/development board series of circuits, Microchip
has a line of evaluation kits and demonstration software
for analog filter design, KEELOQ® security ICs, CAN,
IrDA®, PowerSmart battery management, SEEVAL®
evaluation system, Sigma-Delta ADC, flow rate
sensing, plus many more.
Also available are starter kits that contain everything
needed to experience the specified device. This usually
includes a single application and debug capability, all
on one board.
Check the Microchip web page (www.microchip.com)
for the complete list of demonstration, development
and evaluation kits.
2010 Microchip Technology Inc. Preliminary DS39979A-page 389
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29.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings(†)
Ambient temperature under bias.............................................................................................................-40°C to +100°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any digital only I/O pin or MCLR with respect to VSS (except VDD) ........................................... -0.3V to 5.6V
Voltage on any combined digital and analog pin with respect to VSS (except VDD and MCLR)...... -0.3V to (VDD + 0.3V)
Voltage on VDDCORE with respect to VSS................................................................................................... -0.3V to 2.75V
Voltage on VDD with respect to VSS ........................................................................................................... -0.3V to 3.6V
Total power dissipation (Note 1) ...............................................................................................................................1.0W
Maximum current out of VSS pin ...........................................................................................................................300 mA
Maximum current into VDD pin ..............................................................................................................................250 mA
Maximum output current sunk by PORTA<7:6> and any PORTB and PORTC I/O pins.........................................25 mA
Maximum output current sunk by any PORTD, PORTE and PORTJ I/O pins ..........................................................8 mA
Maximum output current sunk by PORTA<5:0> and any PORTF, PORTG and PORTH I/O pins ............................2 mA
Maximum output current sourced by PORTA<7:6> and any PORTB and PORTC I/O pins ...................................25 mA
Maximum output current sourced by any PORTD, PORTE and PORTJ I/O pins.....................................................8 mA
Maximum output current sourced by PORTA<5:0> and any PORTF, PORTG and PORTH I/O pins .......................2 mA
Maximum current sunk byall ports combined.......................................................................................................200 mA
Voltage on AFE SVDD ................................................................................................................................................7.0V
AFE digital inputs and outputs with respect to SAVSS ..................................................................-0.6V to (SVDD + 0.6V)
AFE analog input with respect to SAVSS...................................................................................................... ....-6V to +6V
AFE VREF input with respect to SAVSS .........................................................................................-0.6V to (SVDD + 0.6V)
ESD on the AFE analog inputs (HBM(2),MM(3)) ............................................................................................7.0 kV, 400V
ESD on all other AFE pins (HBM(2),MM(3))................................................................................................... 7.0 kV, 400V
Note 1: Power dissipation is calculated as follows:
Pdis = VDD x {IDD IOH} + {(VDD – VOH) x IOH} + (VOL x IOL)
2: Human Body Model for ESD testing.
3: Machine Model for ESD testing.
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
PIC18F87J72 FAMILY
DS39979A-page 390 Preliminary 2010 Microchip Technology Inc.
FIGURE 29-1: VOLTAGE-FREQUENCY GRAPH,
REGULATOR ENABLED (INDUSTRIAL)(1)
FIGURE 29-2: VOLTAGE-FREQUENCY GRAPH,
REGULATOR DISABLED (INDUSTRIAL)(1,2)
Frequency
Voltage (VDD)
4.0V
2.0V
48 MHz
3.5V
3.0V
2.5V
3.6V
2.35V
0
Note 1: When the on-chip regulator is enabled, its BOR circuit will automatically trigger a device Reset
before VDD reaches a level at which full-speed operation is not possible.
8 MHz
PIC18F8XJ72
Frequency
Voltage (VDDCORE)
3.00V
2.00V
48 MHz
2.75V
2.50V
2.25V
2.7V
8 MHz
2.35V
Note 1: When the on-chip voltage regulator is disabled, VDD and VDDCORE must be maintained so that
VDDCORE VDD 3.6V.
PIC18F8XJ72
2010 Microchip Technology Inc. Preliminary DS39979A-page 391
PIC18F87J72 FAMILY
29.1 DC Characteristics: Supply Voltage
PIC18F87J72 Family (Industrial)
PIC18F87J72 Family
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
Param
No. Symbol Characteristic Min Typ Max Units Conditions
D001 VDD Supply Voltage VDDCORE
2.0
3.6
3.6
V
V
ENVREG tied to VSS
ENVREG tied to VDD
D001B VDDCORE External Supply for
Microcontroller Core
2.0 2.70 V ENVREG tied to VSS
D001C AVDD Analog Supply Voltage VDD0.3 VDD + 0.3 V
D001D AVSS Analog Ground Potential VSS0.3 VSS + 0.3 V
D002 VDR RAM Data Retention
Voltage(1)
1.5 V
D003 VPOR VDD Start Voltage
to Ensure Internal
Power-on Reset Signal
——0.7VSee Section 5.3 “Power-on
Reset (POR)” for details
D004 SVDD VDD Rise Rate
to Ensure Internal
Power-on Reset Signal
0.05 V/ms See Section 5.3 “Power-on
Reset (POR)” for details
D005 VBOR Brown-out Reset Voltage —1.8—V
Note 1: This is the limit to which VDD can be lowered in Sleep mode, or during a device Reset, without losing RAM data.
PIC18F87J72 FAMILY
DS39979A-page 392 Preliminary 2010 Microchip Technology Inc.
29.2 DC Characteristics: Power-Down and Supply Current
PIC18F87J72 Family (Industrial)
PIC18F87J72 Family
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
Param
No. Device Typ Max Units Conditions
Power-Down Current (IPD)(1)
All devices 0.5 1.4 A -40°C
VDD = 2.0V(4)
(Sleep mode)
0.1 1.4 A+25°C
0.8 6 A+60°C
5.5 10.2 A+85°C
All devices 0.5 1.5 A -40°C
VDD = 2.5V(4)
(Sleep mode)
0.1 1.5 A+25°C
18A+60°C
6.8 12.6 A+85°C
All devices 2.9 7 A -40°C
VDD = 3.3V(5)
(Sleep mode)
3.6 7 A+25°C
4.1 10 A+60°C
9.6 19 A+85°C
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: Standard, low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature
crystals are available at a much higher cost.
4: Voltage regulator is disabled (ENVREG = 0, tied to VSS).
5: Voltage regulator is enabled (ENVREG = 1, tied to VDD, REGSLP = 1).
2010 Microchip Technology Inc. Preliminary DS39979A-page 393
PIC18F87J72 FAMILY
Supply Current (IDD)(2,3)
All devices 5 14.2 A -40°C
VDD = 2.0V,
VDDCORE = 2.0V(4)
FOSC = 31 kHz
(RC_RUN mode,
internal oscillator source)
5.5 14.2 A +25°C
10 19.0 A +85°C
All devices 6.8 16.5 A -40°C
VDD = 2.5V,
VDDCORE = 2.5V(4)
7.6 16.5 A +25°C
14 22.4 A +85°C
All devices 37 84 A -40°C
51 84 A +25°C VDD = 3.3V(5)
72 108 A +85°C
All devices 0.43 0.82 mA -40°C
VDD = 2.0V,
VDDCORE = 2.0V(4)
FOSC = 1 MHz
(RC_RUN mode,
internal oscillator source)
0.47 0.82 mA +25°C
0.52 0.95 mA +85°C
All devices 0.52 0.98 mA -40°C
VDD = 2.5V,
VDDCORE = 2.5V(4)
0.57 0.98 mA +25°C
0.63 1.10 mA +85°C
All devices 0.59 0.96 mA -40°C
0.65 0.96 mA +25°C VDD = 3.3V(5)
0.72 1.18 mA +85°C
All devices 0.88 1.45 mA -40°C
VDD = 2.0V,
VDDCORE = 2.0V(4)
FOSC = 4 MHz
(RC_RUN mode,
internal oscillator source)
1 1.45 mA +25°C
1.1 1.58 mA +85°C
All devices 1.2 1.72 mA -40°C
VDD = 2.5V,
VDDCORE = 2.5V(4)
1.3 1.72 mA +25°C
1.4 1.85 mA +85°C
All devices 1.3 2.87 mA -40°C
1.4 2.87 mA +25°C VDD = 3.3V(5)
1.5 2.96 mA +85°C
29.2 DC Characteristics: Power-Down and Supply Current
PIC18F87J72 Family (Industrial) (Continued)
PIC18F87J72 Family
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
Param
No. Device Typ Max Units Conditions
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: Standard, low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature
crystals are available at a much higher cost.
4: Voltage regulator is disabled (ENVREG = 0, tied to VSS).
5: Voltage regulator is enabled (ENVREG = 1, tied to VDD, REGSLP = 1).
PIC18F87J72 FAMILY
DS39979A-page 394 Preliminary 2010 Microchip Technology Inc.
Supply Current (IDD) Cont.(2,3)
All devices 3 9.4 A -40°C
VDD = 2.0V,
VDDCORE = 2.0V(4)
FOSC = 31 kHz
(RC_IDLE mode,
internal oscillator source)
3.3 9.4 A +25°C
8.5 17.2 A +85°C
All devices 4 10.5 A -40°C
VDD = 2.5V,
VDDCORE = 2.5V(4)
4.3 10.5 A +25°C
10.3 19.5 A +85°C
All devices 34 82 A -40°C
48 82 A +25°C VDD = 3.3V(5)
69 105 A +85°C
All devices 0.33 0.75 mA -40°C
VDD = 2.0V,
VDDCORE = 2.0V(4)
FOSC = 1 MHz
(RC_IDLE mode,
internal oscillator source)
0.37 0.75 mA +25°C
0.41 0.84 mA +85°C
All devices 0.39 0.78 mA -40°C
VDD = 2.5V,
VDDCORE = 2.5V(4)
0.42 0.78 mA +25°C
0.47 0.91 mA +85°C
All devices 0.43 0.82 mA -40°C
0.48 0.82 mA +25°C VDD = 3.3V(5)
0.54 0.95 mA +85°C
All devices 0.53 0.98 mA -40°C
VDD = 2.0V,
VDDCORE = 2.0V(4)
FOSC = 4 MHz
(RC_IDLE mode,
internal oscillator source)
0.57 0.98 mA +25°C
0.61 1.12 mA +85°C
All devices 0.63 1.14 mA -40°C
VDD = 2.5V,
VDDCORE = 2.5V(4)
0.67 1.14 mA +25°C
0.72 1.25 mA +85°C
All devices 0.7 1.27 mA -40°C
0.76 1.27 mA +25°C VDD = 3.3V(5)
0.82 1.45 mA +85°C
29.2 DC Characteristics: Power-Down and Supply Current
PIC18F87J72 Family (Industrial) (Continued)
PIC18F87J72 Family
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
Param
No. Device Typ Max Units Conditions
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: Standard, low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature
crystals are available at a much higher cost.
4: Voltage regulator is disabled (ENVREG = 0, tied to VSS).
5: Voltage regulator is enabled (ENVREG = 1, tied to VDD, REGSLP = 1).
2010 Microchip Technology Inc. Preliminary DS39979A-page 395
PIC18F87J72 FAMILY
Supply Current (IDD) Cont.(2,3)
All devices 0.17 0.35 mA -40°C
VDD = 2.0V,
VDDCORE = 2.0V(4)
FOSC = 1 MHZ
(PRI_RUN mode,
EC oscillator)
0.18 0.35 mA +25°C
0.20 0.42 mA +85°C
All devices 0.29 0.52 mA -40°C
VDD = 2.5V,
VDDCORE = 2.5V(4)
0.31 0.52 mA +25°C
0.34 0.61 mA +85°C
All devices 0.59 1.1 mA -40°C
0.44 0.85 mA +25°C VDD = 3.3V(5)
0.42 0.85 mA +85°C
All devices 0.70 1.25 mA -40°C
VDD = 2.0V,
VDDCORE = 2.0V(4)
FOSC = 4 MHz
(PRI_RUN mode,
EC oscillator)
0.75 1.25 mA +25°C
0.79 1.36 mA +85°C
All devices 1.10 1.7 mA -40°C
VDD = 2.5V,
VDDCORE = 2.5V(4)
1.10 1.7 mA +25°C
1.12 1.82 mA +85°C
All devices 1.55 1.95 mA -40°C
1.47 1.89 mA +25°C VDD = 3.3V(5)
1.54 1.92 mA +85°C
All devices 9.9 14.8 mA -40°C
VDD = 2.5V,
VDDCORE = 2.5V(4)
FOSC = 48 MHZ
(PRI_RUN mode,
EC oscillator)
9.5 14.8 mA +25°C
10.1 15.2 mA +85°C
All devices 13.3 23.2 mA -40°C
12.2 22.7 mA +25°C VDD = 3.3V(5)
12.1 22.7 mA +85°C
29.2 DC Characteristics: Power-Down and Supply Current
PIC18F87J72 Family (Industrial) (Continued)
PIC18F87J72 Family
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
Param
No. Device Typ Max Units Conditions
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: Standard, low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature
crystals are available at a much higher cost.
4: Voltage regulator is disabled (ENVREG = 0, tied to VSS).
5: Voltage regulator is enabled (ENVREG = 1, tied to VDD, REGSLP = 1).
PIC18F87J72 FAMILY
DS39979A-page 396 Preliminary 2010 Microchip Technology Inc.
Supply Current (IDD) Cont.(2,3)
All devices 4.5 5.2 mA -40°C
VDD = 2.5V,
VDDCORE = 2.5V(4)
FOSC = 4 MHZ,
16 MHz internal
(PRI_RUN HSPLL mode)
4.4 5.2 mA +25°C
4.5 5.2 mA +85°C
All devices 5.7 6.7 mA -40°C
VDD = 3.3V(5)
5.5 6.3 mA +25°C
5.3 6.3 mA +85°C
All devices 10.8 13.5 mA -40°C
VDD = 2.5V,
VDDCORE = 2.5V(4)
FOSC = 10 MHZ,
40 MHz internal
(PRI_RUN HSPLL mode)
10.8 13.5 mA +25°C
9.9 13.0 mA +85°C
All devices 13.4 24.1 mA -40°C
VDD = 3.3V(5)
12.3 20.2 mA +25°C
11.2 19.5 mA +85°C
29.2 DC Characteristics: Power-Down and Supply Current
PIC18F87J72 Family (Industrial) (Continued)
PIC18F87J72 Family
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
Param
No. Device Typ Max Units Conditions
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: Standard, low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature
crystals are available at a much higher cost.
4: Voltage regulator is disabled (ENVREG = 0, tied to VSS).
5: Voltage regulator is enabled (ENVREG = 1, tied to VDD, REGSLP = 1).
2010 Microchip Technology Inc. Preliminary DS39979A-page 397
PIC18F87J72 FAMILY
Supply Current (IDD) Cont.(2,3)
All devices 0.10 0.26 mA -40°C
VDD = 2.0V,
VDDCORE = 2.0V(4)
FOSC = 1 MHz
(PRI_IDLE mode,
EC oscillator)
0.07 0.18 mA +25°C
0.09 0.22 mA +85°C
All devices 0.25 0.48 mA -40°C
VDD = 2.5V,
VDDCORE = 2.5V(4)
0.13 0.30 mA +25°C
0.10 0.26 mA +85°C
All devices 0.45 0.68 mA -40°C
0.26 0.45 mA +25°C VDD = 3.3V(5)
0.30 0.54 mA +85°C
All devices 0.36 0.60 mA -40°C
VDD = 2.0V,
VDDCORE = 2.0V(4)
FOSC = 4 MHz
(PRI_IDLE mode,
EC oscillator)
0.33 0.56 mA +25°C
0.35 0.56 mA +85°C
All devices 0.52 0.81 mA -40°C
VDD = 2.5V,
VDDCORE = 2.5V(4)
0.45 0.70 mA +25°C
0.46 0.70 mA +85°C
All devices 0.80 1.15 mA -40°C
0.66 0.98 mA +25°C VDD = 3.3V(5)
0.65 0.98 mA +85°C
All devices 5.2 6.5 mA -40°C
VDD = 2.5V,
VDDCORE = 2.5V(4)
FOSC = 48 MHz
(PRI_IDLE mode,
EC oscillator)
4.9 5.9 mA +25°C
3.4 4.5 mA +85°C
All devices 6.2 12.4 mA -40°C
5.9 11.5 mA +25°C VDD = 3.3V(5)
5.8 11.5 mA +85°C
29.2 DC Characteristics: Power-Down and Supply Current
PIC18F87J72 Family (Industrial) (Continued)
PIC18F87J72 Family
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
Param
No. Device Typ Max Units Conditions
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: Standard, low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature
crystals are available at a much higher cost.
4: Voltage regulator is disabled (ENVREG = 0, tied to VSS).
5: Voltage regulator is enabled (ENVREG = 1, tied to VDD, REGSLP = 1).
PIC18F87J72 FAMILY
DS39979A-page 398 Preliminary 2010 Microchip Technology Inc.
Supply Current (IDD) Cont.(2,3)
All devices 18 35 µA -40°C
VDD = 2.0V,
VDDCORE = 2.0V(4)
FOSC = 32 kHz(3)
(SEC_RUN mode,
Timer1 as clock)
19 35 µA +25°C
28 49 µA +85°C
All devices 20 45 µA -40°C
VDD = 2.5V,
VDDCORE = 2.5V(4)
21 45 µA +25°C
32 61 µA +85°C
All devices 0.06 0.11 mA -40°C
0.07 0.11 mA +25°C VDD = 3.3V(5)
0.09 0.15 mA +85°C
All devices 14 28 µA -40°C
VDD = 2.0V,
VDDCORE = 2.0V(4)
FOSC = 32 kHz(3)
(SEC_IDLE mode,
Timer1 as clock)
15 28 µA +25°C
24 43 µA +85°C
All devices 15 31 µA -40°C
VDD = 2.5V,
VDDCORE = 2.5V(4)
16 31 µA +25°C
27 50 µA +85°C
All devices 0.05 0.10 mA -40°C
0.06 0.10 mA +25°C VDD = 3.3V(5)
0.08 0.14 mA +85°C
29.2 DC Characteristics: Power-Down and Supply Current
PIC18F87J72 Family (Industrial) (Continued)
PIC18F87J72 Family
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
Param
No. Device Typ Max Units Conditions
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: Standard, low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature
crystals are available at a much higher cost.
4: Voltage regulator is disabled (ENVREG = 0, tied to VSS).
5: Voltage regulator is enabled (ENVREG = 1, tied to VDD, REGSLP = 1).
2010 Microchip Technology Inc. Preliminary DS39979A-page 399
PIC18F87J72 FAMILY
D022 Module Differential Currents (IWDT, IOSCB, IAD)
Watchdog Timer 2.1 7.0 A -40°C VDD = 2.0V,
VDDCORE = 2.0V(4)
2.2 7.0 A +25°C
4.3 9.5 A +85°C
3.0 8.0 A -40°C VDD = 2.5V,
VDDCORE = 2.5V(4)
3.1 8.0 A +25°C
5.5 10.4 A +85°C
5.9 12.1 A -40°C
VDD = 3.3V
6.2 12.1 A +25°C
6.9 13.6 A +85°C
D024
(ILCD)
LCD Module 2(6,7) 5 µA +25°C VDD = 2.0V Resistive Ladder
CPEN = 0;
CKSEL<1:0> = 00;
CS<1:0> = 10;
LP<3:0> = 0100
2.7(6,7) 5 µA +25°C VDD = 2.5V
3.5(6,7) 7 µA +25°C VDD = 3.0V
16(7) 25 µA +25°C VDD = 2.0V Charge Pump
BIAS<2:0> = 111;
CPEN = 1;
CKSEL<1:0> = 11;
CS<1:0> = 10
17(7) 25 µA +25°C VDD = 2.5V
24(7) 40 µA +25°C VDD = 3.0V
D025
(IOSCB)
RTCC + Timer1 Osc. with
32 kHz Crystal(6)
0.9 4.0 A -10°C VDD = 2.0V,
VDDCORE = 2.0V(4) 32 kHz on Timer1(3)
1.0 4.5 A +25°C
1.1 4.5 A +85°C
1.1 4.5 A -10°C VDD = 2.5V,
VDDCORE = 2.5V(4) 32 kHz on Timer1(3)
1.2 5.0 A +25°C
1.2 5.0 A +85°C
1.6 6.5 A -10°C
VDD = 3.3V 32 kHz on Timer1(3)
1.6 6.5 A +25°C
2.1 8.0 A +85°C
D026
(IAD)
A/D Converter 3.0 10.0 A -40°C to +85°C VDD = 2.0V,
VDDCORE = 2.0V(4) A/D on, not converting
3.0 10.0 A -40°C to +85°C VDD = 2.5V,
29.2 DC Characteristics: Power-Down and Supply Current
PIC18F87J72 Family (Industrial) (Continued)
PIC18F87J72 Family
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
Param
No. Device Typ Max Units Conditions
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: Standard, low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature
crystals are available at a much higher cost.
4: Voltage regulator is disabled (ENVREG = 0, tied to VSS).
5: Voltage regulator is enabled (ENVREG = 1, tied to VDD, REGSLP = 1).
PIC18F87J72 FAMILY
DS39979A-page 400 Preliminary 2010 Microchip Technology Inc.
29.3 DC Characteristics: PIC18F87J72 Family (Industrial)
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
Param
No. Symbol Characteristic Min Max Units Conditions
VIL Input Low Voltage
All I/O Ports:
D030 with TTL Buffer VSS 0.15 VDD VVDD < 3.3V
D030A 0.8 V 3.3V VDD 3.6V
D031 with Schmitt Trigger Buffer VSS 0.2 VDD V
D031A RC3 and RC4 only VSS 0.3 VDD VI
2C™ enabled
D031B VSS 0.8 V SMBus
D032 MCLR VSS 0.2 VDD V
D033 OSC1 VSS 0.3 VDD V HS, HSPLL modes
D033A OSC1 VSS 0.2 VDD V EC, ECPLL modes
D034 T13CKI VSS 0.3 V
VIH Input High Voltage
I/O Ports (not 5.5V tolerant):
D040 with TTL Buffer 0.25 VDD + 0.8V VDD VVDD < 3.3V
D040A 2.0 VDD 3.3V VDD 3.6V
D041 with Schmitt Trigger Buffer 0.8 VDD VDD V
D041A RC3 and RC4 only 0.7 VDD VDD VI
2C enabled
D041B 2.1 VDD VSMBus
I/O Ports (5.5V tolerant):
with TTL Buffer 0.25 VDD + 0.8V 5.5 V VDD < 3.3V
2.0 5.5 V 3.3V VDD 3.6V
with Schmitt Trigger Buffer 0.8 VDD 5.5 V
D042 MCLR 0.8 VDD VDD V
D043 OSC1 0.7 VDD VDD V HS, HSPLL modes
D043A
D044
OSC1
T13CKI
0.8 VDD
1.6
VDD
VDD
V
V
EC, ECPLL modes
IIL Input Leakage Current(1)
D060 I/O Ports with Analog Functions 200 nA VSS VPIN VDD,
Pin at high-impedance
Digital Only I/O Ports 200 nA VSS VPIN 5.5V,
Pin at high-impedance
D061 MCLR 1AVss VPIN VDD
D063 OSC1 1AVss VPIN VDD
IPU Weak Pull-up Current
D070 IPURB PORTB Weak Pull-up Current 80 400 AVDD = 3.3V, VPIN = VSS
Note 1: Negative current is defined as current sourced by the pin.
2010 Microchip Technology Inc. Preliminary DS39979A-page 401
PIC18F87J72 FAMILY
29.4 DC Characteristics: CTMU Current Source Specifications
VOL Output Low Voltage
D080 I/O Ports:
PORTA, PORTF, PORTG, 0.4 V IOL = 2 mA, VDD = 3.3V,
-40C to +85C
PORTD, PORTE 0.4 V IOL = 3.4 mA, VDD = 3.3V,
-40C to +85C
PORTB, PORTC 0.4 V IOL = 3.4 mA, VDD = 3.3V,
-40C to +85C
D083 OSC2/CLKO
(EC, ECPLL modes)
—0.4VI
OL = 1.6 mA, VDD = 3.3V,
-40C to +85C
VOH Output High Voltage(1)
D090 I/O Ports: V
PORTA, PORTF, PORTG 2.4 V IOH = -2 mA, VDD = 3.3V,
-40C to +85C
PORTD, PORTE 2.4 V IOH = -2 mA, VDD = 3.3V,
-40C to +85C
PORTB, PORTC 2.4 V IOH = -2 mA, VDD = 3.3V,
-40C to +85C
D092 OSC2/CLKO
(INTOSC, EC, ECPLL modes)
2.4 V IOH = -1 mA, VDD = 3.3V,
-40C to +85C
Capacitive Loading Specs
on Output Pins
D100(4) COSC2 OSC2 Pin 15 pF In HS mode when
external clock is used to drive
OSC1
D101 CIO All I/O Pins and OSC2 50 pF To meet the AC Timing
Specifications
D102 CBSCL, SDA 400 pF I2C™ Specification
DC CHARACTERISTICS Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
Param
No. Sym Characteristic Min Typ(1) Max Units Conditions
IOUT1 CTMU Current Source,
Base Range
550 nA CTMUICON<1:0> = 01
IOUT2 CTMU Current Source,
10x Range
—5.5—A CTMUICON<1:0> = 10
IOUT3 CTMU Current Source,
100x Range
—55—A CTMUICON<1:0> = 11
Note 1: Nominal value at center point of current trim range (CTMUICON<7:2> = 000000).
29.3 DC Characteristics: PIC18F87J72 Family (Industrial) (Continued)
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
Param
No. Symbol Characteristic Min Max Units Conditions
Note 1: Negative current is defined as current sourced by the pin.
PIC18F87J72 FAMILY
DS39979A-page 402 Preliminary 2010 Microchip Technology Inc.
TABLE 29-1: MEMORY PROGRAMMING REQUIREMENTS
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
Param
No. Sym Characteristic Min Typ† Max Units Conditions
Program Flash Memory
D130 EPCell Endurance 10K E/W -40C to +85C
D131 VPR VDD for Read VMIN —3.6VVMIN = Minimum operating
voltage
D132B VPEW Voltage for Self-Timed Erase or
Write operations
VDD
VDDCORE
2.35
2.25
3.6
2.7
V
V
ENVREG tied to VDD
ENVREG tied to VSS
D133A TIW Self-Timed Write Cycle Time 2.8 ms
D133B TIE Self-Timed Block Erased Cycle
Time
—33—ms
D134 TRETD Characteristic Retention 20 Year Provided no other
specifications are violated
D135 IDDP Supply Current during
Programming
—314mA
D140 TWE Writes per Erase Cycle 1 For each physical address
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
2010 Microchip Technology Inc. Preliminary DS39979A-page 403
PIC18F87J72 FAMILY
TABLE 29-2: COMPARATOR SPECIFICATIONS
TABLE 29-3: VOLTAGE REFERENCE SPECIFICATIONS
TABLE 29-4: INTERNAL VOLTAGE REGULATOR SPECIFICATIONS
TABLE 29-5: INTERNAL LCD VOLTAGE REGULATOR SPECIFICATIONS
Operating Conditions: 3.0V VDD 3.6V, -40°C TA +85°C (unless otherwise stated)
Param
No. Sym Characteristics Min Typ Max Units Comments
D300 VIOFF Input Offset Voltage ±5.0 ±25 mV
D301 VICM Input Common-Mode Voltage 0 AVDD1.5 V
D302 CMRR Common-Mode Rejection Ratio 55 dB
D303 TRESP Response Time(1) —150400 ns
D304 TMC2OV Comparator Mode Change to
Output Valid*
—— 10 s
Note 1: Response time measured with one comparator input at (AVDD – 1.5)/2, while the other input transitions
from VSS to VDD.
Operating Conditions: 3.0V VDD 3.6V, -40°C TA +85°C (unless otherwise stated)
Param
No. Sym Characteristics Min Typ Max Units Comments
D310 VRES Resolution VDD/24 VDD/32 LSb
D311 VRAA Absolute Accuracy 1/2 LSb
D312 VRUR Unit Resistor Value (R) 2k
310 TSET Settling Time(1) — — 10 s
Note 1: Settling time measured while CVRR = 1 and CVR<3:0> transitions from ‘0000’ to ‘1111’.
Operating Conditions: -40°C TA +85°C (unless otherwise stated)
Param
No. Sym Characteristics Min Typ Max Units Comments
VRGOUT Regulator Output Voltage* 2.5 V
CEFC External Filter Capacitor Value* 4.7 10 F Capacitor must be
low-ESR, a low series
resistance (< 5)
Operating Conditions: 2.0V VDD 3.6V, -40°C TA +85°C (unless otherwise stated)
Param
No. Sym Characteristics Min Typ Max Units Comments
CFLY Fly Back Capacitor 0.47 4.7 F Capacitor must be low-ESR
VBIAS VPK-PK between LCDBIAS0 &
LCDBIAS3
3.40 3.6 V BIAS<2:0> = 111
3.27 V BIAS<2:0> = 110
3.14 V BIAS<2:0> = 101
3.01 V BIAS<2:0> = 100
2.88 V BIAS<2:0> = 011
2.75 V BIAS<2:0> = 010
2.62 V BIAS<2:0> = 001
2.49 V BIAS<2:0> = 000
PIC18F87J72 FAMILY
DS39979A-page 404 Preliminary 2010 Microchip Technology Inc.
29.5 AC (Timing) Characteristics
29.5.1 TIMING PARAMETER SYMBOLOGY
The timing parameter symbols have been created
following one of the following formats:
1. TppS2ppS 3. TCC:ST (I2C specifications only)
2. TppS 4. Ts (I2C specifications only)
T
F Frequency T Time
Lowercase letters (pp) and their meanings:
pp
cc CCP1 osc OSC1
ck CLKO rd RD
cs CS rw RD or WR
di SDI sc SCK
do SDO ss SS
dt Data in t0 T0CKI
io I/O port t1 T13CKI
mc MCLR wr WR
Uppercase letters and their meanings:
S
F Fall P Period
HHigh RRise
I Invalid (High-impedance) V Valid
L Low Z High-impedance
I2C only
AA output access High High
BUF Bus free Low Low
T
CC:ST (I2C specifications only)
CC
HD Hold SU Setup
ST
DAT DATA input hold STO Stop condition
STA Start condition
2010 Microchip Technology Inc. Preliminary DS39979A-page 405
PIC18F87J72 FAMILY
29.5.2 TIMING CONDITIONS
The temperature and voltages specified in Table 29-6
apply to all timing specifications unless otherwise
noted. Figure 29-3 specifies the load conditions for the
timing specifications.
TABLE 29-6: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC
FIGURE 29-3: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
AC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
Operating voltage VDD range as described in Section 29.1 and Section 29.3.
VDD/2
CL
RL
Pin Pin
VSS VSS
CL
RL= 464
CL= 50 pF for all pins except OSC2/CLKO/RA6
and including D and E outputs as ports
CL= 15 pF for OSC2/CLKO/RA6
Load Condition 1 Load Condition 2
PIC18F87J72 FAMILY
DS39979A-page 406 Preliminary 2010 Microchip Technology Inc.
29.5.3 TIMING DIAGRAMS AND SPECIFICATIONS
FIGURE 29-4: EXTERNAL CLOCK TIMING
TABLE 29-7: EXTERNAL CLOCK TIMING REQUIREMENTS
Param.
No. Symbol Characteristic Min Max Units Conditions
1A FOSC External CLKI Frequency(1) DC 48 MHz EC Oscillator mode
DC 10 ECPLL Oscillator mode
Oscillator Frequency(1) 4 25 MHz HS Oscillator mode
4 10 HSPLL Oscillator mode
1T
OSC External CLKI Period(1) 20.8 ns EC Oscillator mode
100 ECPLL Oscillator mode
Oscillator Period(1) 40.0 250 ns HS Oscillator mode
100 250 HSPLL Oscillator mode
2T
CY Instruction Cycle Time(1) 83.3 ns TCY = 4/FOSC, Industrial
3TOSL,
TOSH
External Clock in (OSC1)
High or Low Time
10 ns HS Oscillator mode
4TOSR,
TOSF
External Clock in (OSC1)
Rise or Fall Time
7.5 ns HS Oscillator mode
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period for all configurations
except PLL. All specified values are based on characterization data for that particular oscillator type under
standard operating conditions with the device executing code. Exceeding these specified limits may result
in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested
to operate at “min.” values with an external clock applied to the OSC1/CLKI pin. When an external clock
input is used, the “max.” cycle time limit is “DC” (no clock) for all devices.
OSC1
CLKO
Q4 Q1 Q2 Q3 Q4 Q1
1
2
3344
2010 Microchip Technology Inc. Preliminary DS39979A-page 407
PIC18F87J72 FAMILY
TABLE 29-8: PLL CLOCK TIMING SPECIFICATIONS (VDD = 2.15V TO 3.6V)
TABLE 29-9: INTERNAL RC ACCURACY (INTOSC AND INTRC SOURCES)
Param
No. Sym Characteristic Min Typ† Max Units Conditions
F10 FOSC Oscillator Frequency Range 4 10 MHz HS mode only
F11 FSYS On-Chip VCO System Frequency 16 40 MHz HS mode only
F12 trc PLL Start-up Time (Lock Time) 2 ms
F13 CLK CLKO Stability (Jitter) -2 +2 %
Data in “Typ” column is at 3.3V, 25C, unless otherwise stated. These parameters are for design guidance
only and are not tested.
PIC18F87J72 Family
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
Param
No. Device Min Typ Max Units Conditions
INTOSC Accuracy @ Freq = 8 MHz, 4 MHz, 2 MHz, 1 MHz, 500 kHz, 250 kHz, 125 kHz, 31 kHz(1)
All Devices -2 +/-1 2 % +25°C VDD = 2.7-3.3V
-5 5 % -10°C to +85°C VDD = 2.0-3.3V
-10 +/-1 10 % -40°C to +85°C VDD = 2.0-3.3V
INTRC Accuracy @ Freq = 31 kHz(1)
All Devices 21.7 40.3 kHz -40°C to +85°C VDD = 2.0-3.3V
Note 1: The accuracy specification of the 31 kHz clock is determined by which source is providing it at a given
time. When INTSRC (OSCTUNE<7>) is ‘1’, use the INTOSC accuracy specification. When INTSRC is0’,
use the INTRC accuracy specification.
PIC18F87J72 FAMILY
DS39979A-page 408 Preliminary 2010 Microchip Technology Inc.
FIGURE 29-5: CLKO AND I/O TIMING
TABLE 29-10: CLKO AND I/O TIMING REQUIREMENTS
Param
No. Symbol Characteristic Min Typ Max Units Conditions
10 TOSH2CKLOSC1 to CLKO —75200ns(Note 1)
11 TOSH2CKHOSC1 to CLKO —75200ns(Note 1)
12 TCKRCLKO Rise Time 15 30 ns(Note 1)
13 TCKF CLKO Fall Time 15 30 ns (Note 1)
14 TCKL2IOVCLKO to Port Out Valid 0.5 TCY + 20 ns
15 TIOV2CKH Port In Valid before CLKO 0.25 TCY + 25 ns
16 TCKH2IOI Port In Hold after CLKO 0—ns
17 TOSH2IOVOSC1 (Q1 cycle) to Port Out Valid 50 150 ns
18 TOSH2IOIOSC1 (Q2 cycle) to Port Input Invalid
(I/O in hold time)
100 ns
19 TIOV2OSH Port Input Valid to OSC1 
(I/O in setup time)
0—ns
20 TIOR Port Output Rise Time 6 ns
21 TIOF Port Output Fall Time 5 ns
22† TINP INTx Pin High or Low Time TCY ——ns
23† TRBP RB<7:4> Change INTx High or Low
Time
TCY ——ns
These parameters are asynchronous events not related to any internal clock edges.
Note 1: Measurements are taken in EC mode, where CLKO output is 4 x TOSC.
Note: Refer to Figure 29-3 for load conditions.
OSC1
CLKO
I/O pin
(Input)
I/O pin
(Output)
Q4 Q1 Q2 Q3
10
13
14
17
20, 21
19 18
15
11
12
16
Old Value New Value
2010 Microchip Technology Inc. Preliminary DS39979A-page 409
PIC18F87J72 FAMILY
FIGURE 29-6: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND
POWER-UP TIMER TIMING
TABLE 29-11: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
AND BROWN-OUT RESET REQUIREMENTS
Param.
No. Symbol Characteristic Min Typ Max Units Conditions
30 TMCLMCLR Pulse Width (low) 2 TCY 10
T
CY
(Note 1)
31 TWDT Watchdog Timer Time-out Period
(no postscaler)
3.4 4.0 4.6 ms
32 T
OST Oscillation Start-up Timer Period 1024 TOSC 1024 TOSC TOSC = OSC1 period
33 TPWRT Power-up Timer Period 45.8 65.5 85.2 ms
34 TIOZ I/O High-Impedance from MCLR
Low or Watchdog Timer Reset
—2µs
38 T
CSD CPU Start-up Time 10 µs
200 µs Voltage Regulator
enabled and put to
sleep
39 TIOBST Time for INTOSC to Stabilize 1 µs
Note 1: To ensure device Reset, MCLR must be low for at least 2 TCY or 400 s, whichever is lower.
VDD
MCLR
Internal
POR
PWRT
Time-out
Oscillator
Time-out
Internal
Reset
Watchdog
Timer
Reset
33
32
30
31
34
I/O pins
34
Note: Refer to Figure 29-3 for load conditions.
PIC18F87J72 FAMILY
DS39979A-page 410 Preliminary 2010 Microchip Technology Inc.
FIGURE 29-7: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS
TABLE 29-12: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS
Param
No. Symbol Characteristic Min Max Units Conditions
40 TT0H T0CKI High Pulse Width No prescaler 0.5 TCY + 20 ns
With prescaler 10 ns
41 TT0L T0CKI Low Pulse Width No prescaler 0.5 TCY + 20 ns
With prescaler 10 ns
42 TT0P T0CKI Period No prescaler TCY + 10 ns
With prescaler Greater of:
20 ns or
(TCY + 40)/N
—nsN = prescale
value
(1, 2, 4,..., 256)
45 TT1H T13CKI High
Time
Synchronous, no prescaler 0.5 TCY + 20 ns
Synchronous, with prescaler 10 ns
Asynchronous 30 ns
46 TT1L T13CKI Low
Time
Synchronous, no prescaler 0.5 TCY + 5 ns
Synchronous, with prescaler 10 ns
Asynchronous 30 ns
47 TT1P T13CKI Input
Period
Synchronous Greater of:
20 ns or
(TCY + 40)/N
—nsN = prescale
value
(1, 2, 4, 8)
Asynchronous 60 ns
FT1 T13CKI Oscillator Input Frequency Range DC 50 kHz
48 T
CKE2TMRI Delay from External T13CKI Clock Edge to
Timer Increment
2 TOSC 7 TOSC
Note: Refer to Figure 29-3 for load conditions.
46
47
45
48
41
42
40
T0CKI
T1OSO/T13CKI
TMR0 or
TMR1
2010 Microchip Technology Inc. Preliminary DS39979A-page 411
PIC18F87J72 FAMILY
FIGURE 29-8: CAPTURE/COMPARE/PWM TIMINGS (CCP1, CCP2 MODULES)
TABLE 29-13: CAPTURE/COMPARE/PWM REQUIREMENTS (CCP1, CCP2 MODULES)
Param
No. Symbol Characteristic Min Max Units Conditions
50 TCCL CCPx Input Low
Time
No prescaler 0.5 TCY + 20 ns
With prescaler 10 ns
51 TCCH CCPx Input
High Time
No prescaler 0.5 TCY + 20 ns
With prescaler 10 ns
52 TCCP CCPx Input Period 3 TCY + 40
N
ns N = prescale
value (1, 4 or 16)
53 TCCR CCPx Output Fall Time 25 ns
54 TCCF CCPx Output Fall Time 25 ns
Note: Refer to Figure 29-3 for load conditions.
CCPx
(Capture Mode)
50 51
52
CCPx
53 54
(Compare or PWM Mode)
PIC18F87J72 FAMILY
DS39979A-page 412 Preliminary 2010 Microchip Technology Inc.
FIGURE 29-9: EXAMPLE SPI MASTER MODE TIMING (CKE = 0)
TABLE 29-14: EXAMPLE SPI MODE REQUIREMENTS (MASTER MODE, CKE = 0)
Param
No. Symbol Characteristic Min Max Units Conditions
73 TDIV2SCH,
TDIV2SCL
Setup Time of SDI Data Input to SCK Edge 20 ns
73A TB2BLast Clock Edge of Byte 1 to the 1st Clock Edge
of Byte 2
1.5 TCY + 40 ns
74 T
SCH2DIL,
T
SCL2DIL
Hold Time of SDI Data Input to SCK Edge 40 ns
75 TDOR SDO Data Output Rise Time 25 ns
76 TDOF SDO Data Output Fall Time 25 ns
78 TSCR SCK Output Rise Time (Master mode) 25 ns
79 T
SCF SCK Output Fall Time (Master mode) 25 ns
80 T
SCH2DOV,
T
SCL2DOV
SDO Data Output Valid after SCK Edge 50 ns
Note 1: Requires the use of Parameter #73A.
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
73
74
75, 76
78
79
80
79
78
MSb LSb
bit 6 - - - - - - 1
LSb In
bit 6 - - - - 1
Note: Refer to Figure 29-3 for load conditions.
MSb In
2010 Microchip Technology Inc. Preliminary DS39979A-page 413
PIC18F87J72 FAMILY
FIGURE 29-10: EXAMPLE SPI MASTER MODE TIMING (CKE = 1)
TABLE 29-15: EXAMPLE SPI MODE REQUIREMENTS (MASTER MODE, CKE = 1)
Param.
No. Symbol Characteristic Min Max Units Conditions
73 TDIV2SCH,
TDIV2SCL
Setup Time of SDI Data Input to SCK Edge 20 ns
73A TB2BLast Clock Edge of Byte 1 to the 1st Clock Edge
of Byte 2
1.5 TCY + 40 ns (Note 2)
74 T
SCH2DIL,
T
SCL2DIL
Hold Time of SDI Data Input to SCK Edge 40 ns
75 TDOR SDO Data Output Rise Time 25 ns
76 TDOF SDO Data Output Fall Time 25 ns
78 T
SCR SCK Output Rise Time (Master mode) 25 ns
79 T
SCF SCK Output Fall Time (Master mode) 25 ns
80 TSCH2DOV,
T
SCL2DOV
SDO Data Output Valid after SCK Edge 50 ns
81 TDOV2SCH,
TDOV2SCL
SDO Data Output Setup to SCK Edge T
CY —ns
Note 1: Requires the use of Parameter #73A.
2: Only if Parameter #71A and #72A are used.
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
81
74
75, 76
78
80
MSb
79
73
bit 6 - - - - - - 1
LSb In
bit 6 - - - - 1
LSb
Note: Refer to Figure 29-3 for load conditions.
MSb In
PIC18F87J72 FAMILY
DS39979A-page 414 Preliminary 2010 Microchip Technology Inc.
FIGURE 29-11: EXAMPLE SPI SLAVE MODE TIMING (CKE = 0)
TABLE 29-16: EXAMPLE SPI MODE REQUIREMENTS (SLAVE MODE TIMING, CKE = 0)
Param
No. Symbol Characteristic Min Max Units Conditions
70 T
SSL2SCH,
T
SSL2SCL
SS to SCK or SCK Input 3 TCY —ns
70A T
SSL2WB SS to write to SSPBUF 3 TCY —ns
71 T
SCH SCK Input High Time
(Slave mode)
Continuous 1.25 TCY + 30 ns
71A Single Byte 40 ns (Note 1)
72 TSCL SCK Input Low Time
(Slave mode)
Continuous 1.25 TCY + 30 ns
72A Single Byte 40 ns (Note 1)
73 TDIV2SCH,
TDIV2SCL
Setup Time of SDI Data Input to SCK Edge 100 ns
73A TB2BLast Clock Edge of Byte 1 to the First Clock Edge of Byte 2 1.5 TCY + 40 ns (Note 2)
74 TSCH2DIL,
T
SCL2DIL
Hold Time of SDI Data Input to SCK Edge 100 ns
75 TDOR SDO Data Output Rise Time 25 ns
76 TDOF SDO Data Output Fall Time 25 ns
77 T
SSH2DOZSS to SDO Output High-Impedance 10 50 ns
78 TSCR SCK Output Rise Time (Master mode) 25 ns
79 T
SCF SCK Output Fall Time (Master mode) 25 ns
80 TSCH2DOV,
T
SCL2DOV
SDO Data Output Valid after SCK Edge 50 ns
83 T
SCH2SSH,
T
SCL2SSH
SS after SCK Edge 1.5 TCY + 40 ns
Note 1: Requires the use of Parameter #73A.
2: Only if Parameter #71A and #72A are used.
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
73
74
75, 76 77
78
79
80
79
78
MSb LSb
bit 6 - - - - - - 1
bit 6 - - - - 1 LSb In
83
Note: Refer to Figure 29-3 for load conditions.
MSb In
2010 Microchip Technology Inc. Preliminary DS39979A-page 415
PIC18F87J72 FAMILY
FIGURE 29-12: EXAMPLE SPI SLAVE MODE TIMING (CKE = 1)
TABLE 29-17: EXAMPLE SPI SLAVE MODE REQUIREMENTS (CKE = 1)
Param
No. Symbol Characteristic Min Max Units Conditions
70 T
SSL2SCH,
T
SSL2SCL
SS to SCK or SCK Input 3 TCY —ns
70A TSSL2WB SS to Write to SSPBUF 3 TCY —ns
71 TSCH SCK Input High Time
(Slave mode)
Continuous 1.25 TCY + 30 ns
71A Single Byte 40 ns (Note 1)
72 T
SCL SCK Input Low Time
(Slave mode)
Continuous 1.25 TCY + 30 ns
72A Single Byte 40 ns (Note 1)
73A TB2BLast Clock Edge of Byte 1 to the First Clock Edge of Byte 2 1.5 TCY + 40 ns (Note 2)
74 TSCH2DIL,
T
SCL2DIL
Hold Time of SDI Data Input to SCK Edge 100 ns
75 TDOR SDO Data Output Rise Time 25 ns
76 TDOF SDO Data Output Fall Time 25 ns
77 T
SSH2DOZSS to SDO Output High-Impedance 10 50 ns
78 T
SCR SCK Output Rise Time (Master mode) 25 ns
79 TSCF SCK Output Fall Time (Master mode) 25 ns
80 TSCH2DOV,
T
SCL2DOV
SDO Data Output Valid after SCK Edge 50 ns
82 T
SSL2DOV SDO Data Output Valid after SS Edge 50 ns
83 T
SCH2SSH,
T
SCL2SSH
SS after SCK Edge 1.5 TCY + 40 ns
Note 1: Requires the use of Parameter #73A.
2: Only if Parameter #71A and #72A are used.
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
82
74
75, 76
MSb bit 6 - - - - - - 1 LSb
77
bit 6 - - - - 1 LSb In
80
83
Note: Refer to Figure 29-3 for load conditions.
MSb In
PIC18F87J72 FAMILY
DS39979A-page 416 Preliminary 2010 Microchip Technology Inc.
FIGURE 29-13: I2C™ BUS START/STOP BITS TIMING
TABLE 29-18: I2C™ BUS START/STOP BITS REQUIREMENTS (SLAVE MODE)
Param.
No. Symbol Characteristic Min Max Units Conditions
90 TSU:STA Start Condition
Setup Time
100 kHz mode 4700 ns Only relevant for Repeated
Start condition
400 kHz mode 600
91 THD:STA Start Condition
Hold Time
100 kHz mode 4000 ns After this period, the first
clock pulse is generated
400 kHz mode 600
92 TSU:STO Stop Condition
Setup Time
100 kHz mode 4700 ns
400 kHz mode 600
93 THD:STO Stop Condition
Hold Time
100 kHz mode 4000 ns
400 kHz mode 600
Note: Refer to Figure 29-3 for load conditions.
91
92
93
SCL
SDA
Start
Condition
Stop
Condition
90
2010 Microchip Technology Inc. Preliminary DS39979A-page 417
PIC18F87J72 FAMILY
FIGURE 29-14: I2C™ BUS DATA TIMING
TABLE 29-19: I2C™ BUS DATA REQUIREMENTS (SLAVE MODE)
Param.
No. Symbol Characteristic Min Max Units Conditions
100 THIGH Clock High Time 100 kHz mode 4.0 s
400 kHz mode 0.6 s
MSSP Module 1.5 TCY
101 TLOW Clock Low Time 100 kHz mode 4.7 s
400 kHz mode 1.3 s
MSSP Module 1.5 TCY
102 TRSDA and SCL Rise Time 100 kHz mode 1000 ns
400 kHz mode 20 + 0.1 CB300 ns CB is specified to be from
10 to 400 pF
103 TFSDA and SCL Fall Time 100 kHz mode 300 ns
400 kHz mode 20 + 0.1 CB300 ns CB is specified to be from
10 to 400 pF
90 TSU:STA Start Condition Setup Time 100 kHz mode 4.7 s Only relevant for Repeated
Start condition
400 kHz mode 0.6 s
91 THD:STA Start Condition Hold Time 100 kHz mode 4.0 s After this period, the first clock
pulse is generated
400 kHz mode 0.6 s
106 THD:DAT Data Input Hold Time 100 kHz mode 0 ns
400 kHz mode 0 0.9 s
107 TSU:DAT Data Input Setup Time 100 kHz mode 250 ns (Note 2)
400 kHz mode 100 ns
92 TSU:STO Stop Condition Setup Time 100 kHz mode 4.7 s
400 kHz mode 0.6 s
109 TAA Output Valid from Clock 100 kHz mode 3500 ns (Note 1)
400 kHz mode ns
110 TBUF Bus Free Time 100 kHz mode 4.7 s Time the bus must be free before
a new transmission can start
400 kHz mode 1.3 s
D102 CBBus Capacitive Loading 400 pF
Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region (min. 300 ns) of
the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
2: A Fast mode I2C™ bus device can be used in a Standard mode I2C bus system, but the requirement, TSU:DAT 250 ns,
must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If
such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line,
TR max. + TSU:DAT = 1000 + 250 = 1250 ns (according to the Standard mode I2C bus specification), before the SCL line
is released.
Note: Refer to Figure 29-3 for load conditions.
90
91 92
100
101
103
106 107
109 109
110
102
SCL
SDA
In
SDA
Out
PIC18F87J72 FAMILY
DS39979A-page 418 Preliminary 2010 Microchip Technology Inc.
FIGURE 29-15: MSSP I2C™ BUS START/STOP BITS TIMING WAVEFORMS
TABLE 29-20: MSSP I2C™ BUS START/STOP BITS REQUIREMENTS
FIGURE 29-16: MSSP I2C™ BUS DATA TIMING
Param.
No. Symbol Characteristic Min Max Units Conditions
90 TSU:STA Start Condition
Setup Time
100 kHz mode 2(TOSC)(BRG + 1) ns Only relevant for
Repeated Start
condition
400 kHz mode 2(T
OSC)(BRG + 1)
1 MHz mode(1,2) 2(TOSC)(BRG + 1)
91 THD:STA Start Condition
Hold Time
100 kHz mode 2(TOSC)(BRG + 1) ns After this period, the
first clock pulse is
generated
400 kHz mode 2(T
OSC)(BRG + 1)
1 MHz mode(1,2) 2(TOSC)(BRG + 1)
92 TSU:STO Stop Condition
Setup Time
100 kHz mode 2(TOSC)(BRG + 1) ns
400 kHz mode 2(TOSC)(BRG + 1)
1 MHz mode(1,2) 2(TOSC)(BRG + 1)
93 THD:STO Stop Condition
Hold Time
100 kHz mode 2(TOSC)(BRG + 1) ns
400 kHz mode 2(TOSC)(BRG + 1)
1 MHz mode(1,2) 2(TOSC)(BRG + 1)
Note 1: Maximum pin capacitance = 10 pF for all I2C™ pins.
2: FOSC must be at least 16 MHz for I2C bus operation at this speed.
Note: Refer to Figure 29-3 for load conditions.
91 93
SCL
SDA
Start
Condition
Stop
Condition
90 92
Note: Refer to Figure 29-3 for load conditions.
90 91 92
100
101
103
106 107
109 109 110
102
SCL
SDA
In
SDA
Out
2010 Microchip Technology Inc. Preliminary DS39979A-page 419
PIC18F87J72 FAMILY
TABLE 29-21: MSSP I2C™ BUS DATA REQUIREMENTS
Param.
No. Symbol Characteristic Min Max Units Conditions
100 THIGH Clock High
Time
100 kHz mode 2(TOSC)(BRG + 1) µs
400 kHz mode 2(TOSC)(BRG + 1) µs
1 MHz mode(1,2) 2(TOSC)(BRG + 1) µs
101 TLOW Clock Low Time 100 kHz mode 2(TOSC)(BRG + 1) µs
400 kHz mode 2(TOSC)(BRG + 1) µs
1 MHz mode(1,2) 2(TOSC)(BRG + 1) µs
102 TRSDA and SCL
Rise Time
100 kHz mode 1000 ns CB is specified to be
from 10 to 400 pF
400 kHz mode 20 + 0.1 CB300 ns
1 MHz mode(1,2) 300 ns
103 TFSDA and SCL
Fall Time
100 kHz mode 300 ns CB is specified to be
from 10 to 400 pF
400 kHz mode 20 + 0.1 CB 300 ns
1 MHz mode(1,2) 100 ns
90 TSU:STA Start Condition
Setup Time
100 kHz mode 2(TOSC)(BRG + 1) µs Only relevant for
Repeated Start condition
400 kHz mode 2(TOSC)(BRG + 1) µs
1 MHz mode(1,2) 2(TOSC)(BRG + 1) µs
91 THD:STA Start Condition
Hold Time
100 kHz mode 2(TOSC)(BRG + 1) µs After this period, the first
clock pulse is generated
400 kHz mode 2(TOSC)(BRG + 1) µs
1 MHz mode(1,2) 2(TOSC)(BRG + 1) µs
106 THD:DAT Data Input
Hold Time
100 kHz mode 0 ns
400 kHz mode 0 0.9 µs
1 MHz mode(1,2) ——ns
107 TSU:DAT Data Input
Setup Time
100 kHz mode 250 ns (Note 3)
400 kHz mode 100 ns
1 MHz mode(1,2) ——ns
92 TSU:STO Stop Condition
Setup Time
100 kHz mode 2(TOSC)(BRG + 1) µs
400 kHz mode 2(TOSC)(BRG + 1) µs
1 MHz mode(1,2) 2(TOSC)(BRG + 1) µs
109 TAA Output Valid
from Clock
100 kHz mode 3500 ns
400 kHz mode 1000 ns
1 MHz mode(1,2) ——ns
110 TBUF Bus Free Time 100 kHz mode 4.7 µs Time the bus must be
free before a new trans-
mission can start
400 kHz mode 1.3 µs
1 MHz mode(1,2) ——µs
D102 CBBus Capacitive Loading 400 pF
Legend: TBD = To Be Determined
Note 1: Maximum pin capacitance = 10 pF for all I2C™ pins.
2: FOSC must be at least 16 MHz for I2C bus operation at this speed.
3: A Fast mode I2C bus device can be used in a Standard mode I2C bus system, but parameter
#107 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW
period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the
next data bit to the SDA line, parameter #102 + parameter #107 = 1000 + 250 = 1250 ns (for 100 kHz
mode), before the SCL line is released.
PIC18F87J72 FAMILY
DS39979A-page 420 Preliminary 2010 Microchip Technology Inc.
FIGURE 29-17: EUSART/AUSART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING
TABLE 29-22: EUSART/AUSART SYNCHRONOUS TRANSMISSION REQUIREMENTS
FIGURE 29-18: EUSART/AUSART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING
TABLE 29-23: EUSART/AUSART SYNCHRONOUS RECEIVE REQUIREMENTS
Param
No. Symbol Characteristic Min Max Units Conditions
120 T
CKH2DTV SYNC XMIT (MASTER and SLAVE)
Clock High to Data Out Valid 40 ns
121 TCKRF Clock Out Rise Time and Fall Time (Master mode) 20 ns
122 TDTRF Data Out Rise Time and Fall Time 20 ns
Param.
No. Symbol Characteristic Min Max Units Conditions
125 TDTV2CKL SYNC RCV (MASTER and SLAVE)
Data Hold before CKx (DTx hold time) 10 ns
126 TCKL2DTL Data Hold after CKx (DTx hold time) 15 ns
121 121
120 122
TXx/CKx
RXx/DTx
pin
pin
Note: Refer to Figure 29-3 for load conditions.
125
126
TXx/CKx
RXx/DTx
Pin
Pin
Note: Refer to Figure 29-3 for load conditions.
2010 Microchip Technology Inc. Preliminary DS39979A-page 421
PIC18F87J72 FAMILY
TABLE 29-24: A/D CONVERTER CHARACTERISTICS: PIC18F87J72 FAMILY (INDUSTRIAL)
Param
No. Sym Characteristic Min Typ Max Units Conditions
A01 NRResolution 12 bit VREF 3.0V
A03 EIL Integral Linearity Error 1 ±2.0 LSB VREF 3.0V
A04 EDL Differential Linearity
Error
<±1 ±1.5 LSB VREF 3.0V
A06 EOFF Offset Error 1 ±5 LSB VREF 3.0V
A07 EGN Gain Error 1 ±3 LSB VREF 3.0V
A10 Monotonicity Guaranteed(1) —VSS VAIN VREF
A20 VREF Reference Voltage
Range (VREFH – VREFL)
3—V
DD – VSS V For 12-bit resolution
A21 VREFH Reference Voltage High VSS + 3.0V VDD + 0.3V V For 12-bit resolution
A22 VREFL Reference Voltage Low VSS – 0.3V VDD – 3.0V V For 12-bit resolution
A25 VAIN Analog Input Voltage VREFL —VREFH VNote 2
A30 ZAIN Recommended
Impedance of Analog
Voltage Source
——2.5k
A50 IREF VREF Input Current(2)
5
150
A
A
During VAIN acquisition.
During A/D conversion cycle.
Note 1: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes.
2: VREFH current is from the RA3/AN3/VREF+ pin or VDD, whichever is selected as the VREFH source. VREFL
current is from the RA2/AN2/VREF- pin or VSS, whichever is selected as the VREFL source.
PIC18F87J72 FAMILY
DS39979A-page 422 Preliminary 2010 Microchip Technology Inc.
FIGURE 29-19: A/D CONVERSION TIMING
TABLE 29-25: A/D CONVERSION REQUIREMENTS
Param
No. Symbol Characteristic Min Max Units Conditions
130 TAD A/D Clock Period 0.8 12.5(1) sTOSC based, VREF 3.0V
131 TCNV Conversion Time
(not including acquisition time)(2)
13 14 TAD
132 TACQ Acquisition Time(3) 1.4 s
135 TSWC Switching Time from Convert Sample (Note 4)
137 TDIS Discharge Time 0.2 s
Note 1: The time of the A/D clock period is dependent on the device frequency and the TAD clock divider.
2: ADRES registers may be read on the following T
CY cycle.
3: The time for the holding capacitor to acquire the “New” input voltage when the voltage changes full scale
after the conversion (VDD to VSS or VSS to VDD). The source impedance (RS) on the input channels is 50.
4: On the following cycle of the device clock.
131
130
132
BSF ADCON0, GO
Q4
A/D CLK(1)
A/D DATA
ADRES
ADIF
GO
SAMPLE
OLD_DATA
SAMPLING STOPPED
DONE
NEW_DATA
(Note 2)
11 10 9 3 2 1
Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction
to be executed.
2: This is a minimal RC delay (typically 100 ns), which also disconnects the holding capacitor from the analog input.
. . . . . .
TCY
0
2010 Microchip Technology Inc. Preliminary DS39979A-page 423
PIC18F87J72 FAMILY
TABLE 29-26: DUAL-CHANNEL AFE ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated: SAVDD = 4.5 to 5.5V, SVDD = 2.7 to 5.5V, -40°C < TA <+85°C,
MCLK = 4 MHz, PRESCALE = 1, OSR = 64, GAIN = 1, Dithering Off, VIN = -0.5, dBFS = 353 mVRMS @ 50/60 Hz
Parameters Symbol Min Typical Max Units Conditions
Internal Voltage Reference
Internal Voltage Reference
To l e r a n ce
VREF -2% 2.37 +2% V VREFEXT = 0
Temperature Coefficient TCREF 12 ppm/°C VREFEXT = 0
Output Impedance ZOUTREF —7 —kSAVDD = 5V,
VREFEXT = 0
Voltage Reference Input
Input Capacitance 10 pF
Differential Input Voltage Range
(VREF+ – VREF-)
VREF 2.2 2.6 V VREF = (VREF+ – VREF-),
VREFEXT = 1
Absolute Voltage on REFIN+ Pin VREF+ 1.9 2.9 V VREFEXT = 1
Absolute Voltage on REFIN- Pin VREF--0.30.3V
ADC Performance
Resolution (no missing codes) 24 bits OSR = 256
Sampling Frequency fS125 1000 kHz fS = DMCLK = MCLK/
(4 x Prescale)
Output Data Rate fD0.4882 31.25 ksps fD = DRCLK = DMCLK/
OSR = MCLK/
(4 x Prescale x OSR)
Analog Input Absolute Voltage on
CH0+, CH0-, CH1+, CH1- Pins
CHn+/- -1 +1 V All analog input channels,
measured to SAVss
(Note 1)
Analog Input Leakage Current AIN —1 —nA(Note 2)
Differential Input Voltage Range (CHn+ – CHn-) 500/GAIN mV (Note 3)
Offset Error (Note 4) VOS -3 +3 mV (Note 5)
Offset Error Drift 3 V/°C From -40°C to +125°C
Gain Error (Note 4) GE -0.4 % G = 1
-2.5 +2.5 % All gains
Gain Error Drift 1 ppm/°C From -40°C to +125°C
Note 1: Outside of this range, the ADC accuracy is not specified. An extended input range of ±6V can be applied
continuously to the part with no risk of damage.
2: For these operating currents, the following bit settings apply: SHUTDOWN<1:0> = 00, RESET<1:0> = 00,
VREFEXT = 0, CLKEXT = 0.
3: This specification implies that the ADC output is valid over this entire differential range and that there is no
distortion or instability across this input range. Dynamic performance is specified at -0.5 dB below the maximum
signal range, VIN = -0.5 dBFS @ 50/60 Hz = 353 mVRMS, mVREF = 2.4V.
4: See Appendix B.3 “Terminology and Formulas for definitions.
5: Applies to all gains. Offset error is dependent on PGA gain setting.
6: This parameter is established by characterization and is not 100% tested.
7: For proper operation and to keep ADC accuracy, AMCLK should always be in the range of 1 to 5 MHz with
BOOST bits off. With BOOST bits on, AMCLK should be in the range of 1 to 8.192 MHz.
AMCLK = MCLK/PRESCALE.
8: For these operating currents, the following Configuration bit settings apply: SHUTDOWN<1:0> = 11,
VREFEXT = 1, CLKEXT = 1.
PIC18F87J72 FAMILY
DS39979A-page 424 Preliminary 2010 Microchip Technology Inc.
ADC Performance (continued)
Integral Non-Linearity (Note 4) INL 15 ppm GAIN = 1,
DITHER = ON
Input Impedance ZIN 350——kProportional to
1/AMCLK
Signal-to-Noise and Distortion
Ratio (Notes 4, 6)
SINAD 90 dB OSR = 256,
DITHER = ON
—78 dBOSR = 64,
DITHER = OFF
Total Harmonic Distortion
(Notes 4, 6)
THD -101 dB OSR = 256,
DITHER = ON
-82 dB OSR = 64,
DITHER = OFF
Signal-to-Noise Ratio
(Notes 4, 6)
SNR 91 dB OSR = 256,
DITHER = ON
—81 dBOSR = 64,
DITHER = OFF
Spurious Free Dynamic Range
(Note 4)
SFDR 103 dB OSR = 256,
DITHER = ON
—83 dBOSR = 64,
DITHER = OFF
Crosstalk (50/60 Hz) (Note 4) CTALK -133 dB OSR = 256,
DITHER = ON
AC Power Supply Rejection AC PSRR -77 dB SAVDD and SVDD = 5V +
1V
PP @ 50/60 Hz
DC Power Supply Rejection DC PSRR -77 dB SAVDD and SVDD = 4.5 to
5.5V
DC Common-Mode Rejection
Ratio (Note 4)
CMRR -72 dB VCM varies from -1V to
+1V
TABLE 29-26: DUAL-CHANNEL AFE ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated: SAVDD = 4.5 to 5.5V, SVDD = 2.7 to 5.5V, -40°C < TA <+85°C,
MCLK = 4 MHz, PRESCALE = 1, OSR = 64, GAIN = 1, Dithering Off, VIN = -0.5, dBFS = 353 mVRMS @ 50/60 Hz
Parameters Symbol Min Typical Max Units Conditions
Note 1: Outside of this range, the ADC accuracy is not specified. An extended input range of ±6V can be applied
continuously to the part with no risk of damage.
2: For these operating currents, the following bit settings apply: SHUTDOWN<1:0> = 00, RESET<1:0> = 00,
VREFEXT = 0, CLKEXT = 0.
3: This specification implies that the ADC output is valid over this entire differential range and that there is no
distortion or instability across this input range. Dynamic performance is specified at -0.5 dB below the maximum
signal range, VIN = -0.5 dBFS @ 50/60 Hz = 353 mVRMS, mVREF = 2.4V.
4: See Appendix B.3 “Terminology and Formulas for definitions.
5: Applies to all gains. Offset error is dependent on PGA gain setting.
6: This parameter is established by characterization and is not 100% tested.
7: For proper operation and to keep ADC accuracy, AMCLK should always be in the range of 1 to 5 MHz with
BOOST bits off. With BOOST bits on, AMCLK should be in the range of 1 to 8.192 MHz.
AMCLK = MCLK/PRESCALE.
8: For these operating currents, the following Configuration bit settings apply: SHUTDOWN<1:0> = 11,
VREFEXT = 1, CLKEXT = 1.
2010 Microchip Technology Inc. Preliminary DS39979A-page 425
PIC18F87J72 FAMILY
Oscillator Input
Master Clock Frequency Range MCLK 1 16.384 MHz (Note 7)
Power Specifications
Operating Voltage, Analog SAVDD 4.5 5.5 V
Operating Voltage, Digital SVDD 2.7 3.6 5.5 V
Operating Current, Analog
(Note 2)
AIDD 2 2.8 BOOST<1:0> = 00
3.5 5.6 mA BOOST<1:0> = 11
Operating Current, Digital DIDD —0.650.9 mASVDD = 5V,
MCLK = 4 MHz
—0.30.4mASV
DD = 2.7V,
MCLK = 4 MHz
—1.21.6mASV
DD = 5V,
MCLK = 8.192 MHz
Shutdown Current, Analog IDDS,A—— 1 µASAVDD pin only (Note 8)
Shutdown Current, Digital IDDS,D—— 1 µASVDD pin only (Note 8)
TABLE 29-26: DUAL-CHANNEL AFE ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated: SAVDD = 4.5 to 5.5V, SVDD = 2.7 to 5.5V, -40°C < TA <+85°C,
MCLK = 4 MHz, PRESCALE = 1, OSR = 64, GAIN = 1, Dithering Off, VIN = -0.5, dBFS = 353 mVRMS @ 50/60 Hz
Parameters Symbol Min Typical Max Units Conditions
Note 1: Outside of this range, the ADC accuracy is not specified. An extended input range of ±6V can be applied
continuously to the part with no risk of damage.
2: For these operating currents, the following bit settings apply: SHUTDOWN<1:0> = 00, RESET<1:0> = 00,
VREFEXT = 0, CLKEXT = 0.
3: This specification implies that the ADC output is valid over this entire differential range and that there is no
distortion or instability across this input range. Dynamic performance is specified at -0.5 dB below the maximum
signal range, VIN = -0.5 dBFS @ 50/60 Hz = 353 mVRMS, mVREF = 2.4V.
4: See Appendix B.3 “Terminology and Formulas for definitions.
5: Applies to all gains. Offset error is dependent on PGA gain setting.
6: This parameter is established by characterization and is not 100% tested.
7: For proper operation and to keep ADC accuracy, AMCLK should always be in the range of 1 to 5 MHz with
BOOST bits off. With BOOST bits on, AMCLK should be in the range of 1 to 8.192 MHz.
AMCLK = MCLK/PRESCALE.
8: For these operating currents, the following Configuration bit settings apply: SHUTDOWN<1:0> = 11,
VREFEXT = 1, CLKEXT = 1.
PIC18F87J72 FAMILY
DS39979A-page 426 Preliminary 2010 Microchip Technology Inc.
TABLE 29-27: DUAL-CHANNEL AFE SERIAL PERIPHERAL INTERFACE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all parameters apply at SAVDD = 4.5 to 5.5V,
DVDD = 2.7 to 5.5V, -40°C < TA <+85°C, CLOAD = 30 pF.
Parameters Sym Min Typ Max Units Conditions
Serial Clock Frequency fSCK
20
10
MHz
MHz
4.5 SVDD 5.5
2.7 SVDD 5.5
CS Setup Time tCSS 25
50
ns
ns
4.5 SVDD 5.5
2.7 SVDD 5.5
CS Hold Time tCSH 50
100
ns
ns
4.5 SVDD 5.5
2.7 SVDD 5.5
CS Disable Time tCSD 50 ns
Data Setup Time tSU 5
10
ns
ns
4.5 SVDD 5.5
2.7 SVDD 5.5
Data Hold Time tHD 10
20
ns
ns
4.5 SVDD 5.5
2.7SVDD 5.5
Serial Clock High Time tHI 25
50
ns
ns
4.5SVDD 5.5
2.7 SVDD 5.5
Serial Clock Low Time tLO 25
50
ns
ns
4.5 DVDD 5.5
2.7 DVDD 5.5
Serial Clock Delay Time tCLD 50 ns
Serial Clock Enable Time tCLE 50 ns
Output Valid from SCK Low tDO 50 ns 2.7 SVDD 5.5
Output hold time tHO 0—ns(Note 1)
Output disable time tDIS
25
50
ns
ns
4.5 SVDD 5.5
2.7 SVDD 5.5 (Note 1)
Reset Pulse Width (RESET)t
MCLR 100 ns 2.7 SVDD 5.5
Data Transfer Time to DR (Data Ready) tDODR 50 ns 2.7 SVDD 5.5
Data Ready Pulse Low Time tDRP —1/DMCLK µs2.7 SVDD 5.5
Schmitt Trigger High-Level Input
Voltage
VIH1 0.7 SVDD —SVDD + 1 V
Schmitt Trigger Low-Level Input Voltage VIL1 -0.3 0.2 SVDD V
Hysteresis of Schmitt Trigger Inputs
(all digital inputs)
VHYS 300 mV
Low-Level Output Voltage, SDOA Pin VOL ——0.4VIOL = +2.5 mA, SVDD = 5.0V
Low-Level Output Voltage, DR Pin VOL —0.4VIOL = +1.25 mA, SVDD = 5.0V
High-Level Output Voltage, SDOA Pin VOH SVDD – 0.5 V IOH = -2.5 mA, SVDD = 5.0V
High-Level Output Voltage, DR Pin VOH SVDD – 0.5 V IOH = -1.25 mA, SVDD = 5.0V
Input Leakage Current ILI ——±1µACSA = SVDD, VIN = SVSS
or SVDD
Output Leakage Current ILO ——±1µACSA = SVDD, VOUT = SVSS
or SVDD
Internal Capacitance (all inputs and
outputs)
CINT ——7pFTA = 25°C,
SCKA = 1.0 MHz,
SVDD = 5.0V (Note 1)
Note 1: This parameter is periodically sampled and is not 100% tested.
2010 Microchip Technology Inc. Preliminary DS39979A-page 427
PIC18F87J72 FAMILY
FIGURE 29-20: SERIAL OUTPUT TIMING DIAGRAM
FIGURE 29-21: SERIAL INPUT TIMING DIAGRAM
FIGURE 29-22: DATA READY PULSE TIMING DIAGRAM
tCSH
tDIS
tHI tLO
fSCK
CS
SCK
SDO MSB Out LSB Out
Don’t Care
SDI
Mode 1,1
Mode 0,0
tHO
tDO
CS
SCK
SDI LSB In
MSB In
Mode 1,1
Mode 0,0
tCSS
tSU tHD
tCSD
tCSH
tCLD
tCLE
SDO
HI-Z
tHI tLO
fSCK
DR
SCK
SDO
1/DRCLK
tDODR
tDRP
PIC18F87J72 FAMILY
DS39979A-page 428 Preliminary 2010 Microchip Technology Inc.
FIGURE 29-23: SPECIFIC TIMING DIAGRAMS
CS VIH
Timing Waveform for tDIS
HI-Z
90%
10%
tDIS
SDO
SCK
SDO
tDO
Timing Waveform for tDO
2010 Microchip Technology Inc. Preliminary DS39979A-page 429
PIC18F87J72 FAMILY
30.0 PACKAGING INFORMATION
30.1 Package Marking Information
3
e
80-Lead TQFP
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
Example
PIC18F86J72
-I/PT
1002017
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
PIC18F87J72 FAMILY
DS39979A-page 430 Preliminary 2010 Microchip Technology Inc.
30.2 Package Details
The following sections give the technical details of the packages.
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2010 Microchip Technology Inc. Preliminary DS39979A-page 431
PIC18F87J72 FAMILY
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PIC18F87J72 FAMILY
DS39979A-page 432 Preliminary 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. Preliminary DS39979A-page 433
PIC18F87J72 FAMILY
APPENDIX A: REVISION HISTORY
Revision A (June 2010)
Original data sheet for the PIC18F87J72 family
devices.
PIC18F87J72 FAMILY
DS39979A-page 434 Preliminary 2010 Microchip Technology Inc.
APPENDIX B: DUAL-CHANNEL,
24-BIT AFE
REFERENCE
B.1 Introduction
B.1.1 DESCRIPTION
The dual-channel Analog Front End (AFE) contains two
synchronous sampling Delta-Sigma Analog-to-Digital
Converters (ADC), two PGAs, phase delay compensa-
tion block, internal voltage reference, modulator output
block and high-speed 20 MHz SPI compatible serial
interface. The converters contain a proprietary dithering
algorithm for reduced Idle tones and improved THD.
The internal register map contains 24-bit wide ADC
data words, as well as six writable control registers to
program gain, oversampling ratio, phase, resolution,
dithering, shutdown, Reset and communication
features. The communication is largely simplified with
various continuous read modes that can be accessed
by the DMA of an external device, and with a separate
Data Ready (DR) pin that can directly be connected to
an IRQ input of an external microcontroller.
The AFE is capable of interfacing to a large variety of
voltage and current sensors, including shunts, current
transformers, Rogowski coils and Hall effect sensors.
B.1.2 DELTA-SIGMA ADC
ARCHITECTURE
The AFE incorporates two Delta-Sigma ADCs with a
multi-bit architecture. A Delta-Sigma ADC is an
oversampling converter that incorporates a built-in
modulator which is digitizing the quantity of charge
integrated by the modulator loop. The quantizer is the
block that is performing the analog-to-digital
conversion. The quantizer is typically 1-bit or a simple
comparator which helps to maintain the linearity
performance of the ADC (the DAC structure is in this
case inherently linear).
Multi-bit quantizers help to lower the quantization error
(the error fed back in the loop can be very large with
1-bit quantizers) without changing the order of the
modulator or the OSR which leads to better SNR
figures. However, typically, the linearity of such
architectures is more difficult to achieve since the DAC
is no more simple to realize and its linearity limits the
THD of such ADCs.
The 5-level quantizer is a Flash ADC composed of
4 comparators, arranged with equally spaced thresh-
olds and a thermometer coding. The AFE also includes
proprietary, 5-level DAC architecture that is inherently
linear for improved THD figures.
B.1.3 FEATURES
Two synchronous sampling 16/24-bit resolution
Delta-Sigma A/D Converters with proprietary
multi-bit architecture
91 dB SINAD, -104 dBc THD (up to 35
th
harmonic),
109 dB SFDR for each channel
Programmable data rate of up to 64 ksps
Ultra Low-Power Shutdown mode with <2 µA
-133 dB crosstalk between the two channels
Low drift internal voltage reference: 12 ppm/°C
Differential voltage reference input pins
High gain PGA on each channel (up to 32V/V)
Phase delay compensation between the two
channels with 1 µs time resolution
Separate modulator outputs for each channel
High-speed addressable 20 MHz SPI interface
with Mode 0,0 and 1,1 compatibility
Independent analog and digital power supplies
4.5V-5.5V SAVDD, 2.7V-5.5V SVDD
Low-power consumption (14 mW typical at 5V)
B.1.4 APPLICATIONS
Energy Metering and Power Measurement
Automotive
Portable Instrumentation
Medical and Power Monitoring
2010 Microchip Technology Inc. Preliminary DS39979A-page 435
PIC18F87J72 FAMILY
FIGURE B-1: DUAL-CHANNEL AFE FUNCTIONAL BLOCK DIAGRAM
CH0+
CH0-
CH1+
CH1-
SDOA
SDIA
SCKA
DUAL-DS ADC
Digital
SINC3
-
+
PGA
MCLK CLKIA
DR
ARESET
Digital SPI
Interface
Clock
Generation
SINC3
-
+
PGA Modulator
AMCLK
DMCLK/DRCLK
DMCLK
Phase
Shifter
PHASE<7:0>
OSR<1:0>
PRE<1:0>
DATA_CH0<23:0>
DATA_CH1<23:0>
CSA
REFIN+/OUT+
REFIN-
SAVDD
SAVSS SVSS
SVDD
POR
AVDD
Monitoring POR
Modulator
VREF+VREF-
VREFEXT
Voltage
Reference
VREF
+
-
D-S
D-S
F
SDN<1:0>, RESET<1:0>, GAIN<7:0>
Analog
PIC18F87J72 FAMILY
DS39979A-page 436 Preliminary 2010 Microchip Technology Inc.
B.2 Pin Description
B.2.1 AFE RESET (ARESET)
This pin is active-low and places the AFE in a Reset
state when active.
When ARESET = 0, all registers are reset to their
default value, no communication can take place and no
clock is distributed to internal circuitry. This state is
equivalent to a POR state.
Since the default state of the ADCs is on, the analog
power consumption when ARESET = 0 is equivalent to
when ARESET = 1. Only the digital power consumption
is largely reduced because this current consumption is
essentially dynamic and is reduced drastically when
there is no clock running.
All the analog biases are enabled during a Reset, so
that the part is fully operational just after a ARESET
rising edge.
This input is Schmitt triggered.
B.2.2 DIGITAL VDD (SVDD)
SVDD is the power supply pin for the AFE’s digital cir-
cuitry. This pin requires appropriate bypass capacitors
and should be maintained between 2.7V and 5.5V for
specified operation.
B.2.3 ANALOG VDD (SAVDD)
AVDD is the power supply pin for the AFE’s analog cir-
cuitry. This pin requires appropriate bypass capacitors
and should be maintained to 5V ±10% for specified
operation.
B.2.4 ADC DIFFERENTIAL ANALOG
INPUTS (CHn+/CHn-)
CH0-/CH0+ and CH1-/CH1+ are the two fully differential,
analog voltage inputs for the Delta-Sigma ADCs.
The linear and specified region of the channels are
dependent on the PGA gain. This region corresponds
to a differential voltage range of ±500 mV/GAIN with
VREF = 2.4V.
The maximum absolute voltage, with respect to SAVSS,
for each CHn+/- input pin is ±1V with no distortion and
±6V with no breaking after continuous voltage.
B.2.5 ANALOG GROUND (SAVSS)
SAVss is the ground connection to internal analog
circuitry (ADCs, PGA, voltage reference, POR). To
ensure accuracy and noise cancellation, this pin must
be connected to the same ground as SVSS, preferably
with a star connection. If an analog ground plane is
available, it is recommended that this pin be tied to this
plane of the PCB. This plane should also reference all
other analog circuitry in the system.
B.2.6 NON-INVERTING REFERENCE
INPUT, INTERNAL REFERENCE
OUTPUT (REFIN+/OUT)
This pin is the non-inverting side of the differential
voltage reference input for both ADCs or the internal
voltage reference output.
When VREFEXT = 1, and an external voltage
reference source can be used, the internal voltage ref-
erence is disabled. When using an external differential
voltage reference, it should be connected to its VREF+
pin. When using an external single-ended reference, it
should be connected to this pin.
When VREFEXT = 0, the internal voltage reference is
enabled and connected to this pin through a switch.
This voltage reference has minimal drive capability, and
thus, needs proper buffering and bypass capacitances
(10 µF tantalum in parallel with 0.1 µF ceramic) if used
as a voltage source.
For optimal performance, bypass capacitances should
be connected between this pin and AGND at all times,
even when the internal voltage reference is used.
However, these capacitors are not mandatory to
ensure proper operation.
B.2.7 INVERTING REFERENCE INPUT
(REFIN-)
This pin is the inverting side of the differential voltage
reference input for both ADCs. When using an external
differential voltage reference, it should be connected to
its VREF- pin. When using an external, single-ended
voltage reference, or when VREFEXT = 0 (default) and
using the internal voltage reference, this pin should be
directly connected to SAVss.
B.2.8 DIGITAL GROUND CONNECTION
(SVSS)
SVss is the ground connection to internal digital
circuitry (SINC filters, oscillator, serial interface). To
ensure accuracy and noise cancellation, SVss must be
connected to the same ground as SAVss, preferably
with a star connection. If a digital ground plane is
available, it is recommended that this pin be tied to this
plane of the Printed Circuit Board (PCB). This plane
should also reference all other digital circuitry in the
system.
B.2.9 DATA READY (DR)
The Data Ready pin indicates if a new conversion
result is ready to be read. The default state of this pin
is high when DR_HIZN = 1 and is high impedance
when DR_HIZN = 0 (default). After each conversion is
finished, a low pulse will take place on the Data Ready
pin to indicate the conversion result is ready as an
interrupt. This pulse is synchronous with the master
clock and has a defined and constant width.
2010 Microchip Technology Inc. Preliminary DS39979A-page 437
PIC18F87J72 FAMILY
The Data Ready pin is independent of the SPI interface
and acts like an interrupt output. The pin state is not
latched and the pulse width (and period) are both deter-
mined by the MCLK frequency, oversampling rate and
internal clock prescale settings. The DR pulse width is
equal to one DMCLK period and the frequency of the
pulses is equal to DRCLK (see Figure 29-22 in
Section 29.0 “Electrical Characteristics” of the data
sheet).
B.2.10 MASTER CLOCK INPUT (CLKIA)
CLKIA provides the master clock for the device. The
typical clock frequency specified is 4 MHz. However,
the clock frequency can be 1 MHz to 5 MHz without
disturbing ADC accuracy. With the current boost circuit
enabled, the master clock can be used up to
8.192 MHz without disturbing ADC accuracy. Appropri-
ate load capacitance should be connected to these
pins for proper operation.
B.2.11 CHIP SELECT (CSA)
This pin is the SPI chip select that enables the serial
communication. When this pin is high, no
communication can take place. A chip select falling
edge initiates the serial communication and a chip
select rising edge terminates the communication. No
communication can take place even when CSA is low
and when ARESET is low.
This input is Schmitt triggered.
B.2.12 SERIAL DATA CLOCK (SCKA)
This is the serial clock pin for SPI communication.
Data is clocked into the device on the rising edge of
SCK. Data is clocked out of the device on the falling
edge of SCK.
The AFE interface is compatible with both SPI 0,0 and
1,1 modes. SPI modes can only be changed during a
Reset.
The maximum clock speed specified is 20 MHz when
SVDD > 4.5V and 10 MHz otherwise.
This input is Schmitt triggered.
B.2.13 SERIAL DATA OUTPUT (SDOA)
This is the SPI data output pin. Data is clocked out of
the device on the falling edge of SCK.
This pin stays high impedance during the first command
byte. It also stays high impedance during the whole com-
munication for write commands and when the CSA pin
is high or when the ARESET pin is low. This pin is active
only when a read command is processed. Each read is
processed by a packet of 8 bits.
B.2.14 SERIAL DATA INPUT (SDIA)
This is the SPI data input pin. Data is clocked into the
device on the rising edge of SCK.
When CS is low, this pin is used to communicate with
series of 8-bit commands.
The interface is half-duplex (inputs and outputs do not
happen at the same time).
Each communication starts with a chip select falling
edge, followed by an 8-bit command word entered
through the SDI pin. Each command is either a read or
a write command. Toggling SDI during a read
command has no effect.
This input is Schmitt triggered.
Note: This pin should not be left floating when the
DR_HIZN bit is low; a 10 k pull-up resistor
connected to DVDD is recommended.
PIC18F87J72 FAMILY
DS39979A-page 438 Preliminary 2010 Microchip Technology Inc.
B.3 Terminology and Formulas
This section defines the terms and formulas used
throughout this data sheet. The following terms are
defined:
MCLK – Master Clock
AMCLK – Analog Master Clock
DMCLK – Digital Master Clock
DRCLK – Data Rate Clock
OSR – Oversampling Ratio
Offset Error
Gain Error
Integral Non-Linearity Error
Signal-To-Noise Ratio (SNR)
Signal-To-Noise Ratio And Distortion (SINAD)
Total Harmonic Distortion (THD)
Spurious-Free Dynamic Range (SFDR)
Idle Tones
Dithering
•Crosstalk
PSRR
•CMRR
ADC Reset Mode
Hard Reset Mode (ARESET = 0)
ADC Shutdown Mode
Full Shutdown Mode
B.3.1 MCLK – MASTER CLOCK
This is the fastest clock present in the device. This is
the frequency of the clock input at the CLKIA.
B.3.2 AMCLK – ANALOG MASTER CLOCK
This is the clock frequency that is present on the analog
portion of the device, after prescaling has occurred via
the CONFIG1 PRESCALE<1:0> register bits. The ana-
log portion includes the PGAs and the two sigma-delta
modulators.
EQUATION B-1:
B.3.3 DMCLK – DIGITAL MASTER CLOCK
This is the clock frequency that is present on the digital
portion of the device, after prescaling and division by 4.
This is also the sampling frequency, that is the rate at
which the modulator outputs are refreshed. Each
period of this clock corresponds to one sample and one
modulator output.
EQUATION B-2:
B.3.4 DRCLK – DATA RATE CLOCK
This is the output data rate (i.e., the rate at which the
ADCs output new data). Each new data is signaled by
a data ready pulse on the DR pin.
This data rate is depending on the OSR and the
prescaler with the following formula:
EQUATION B-3:
Since this is the output data rate, and since the
decimation filter is a SINC (or notch) filter, there is a
notch in the filter transfer function at each integer
multiple of this rate.
Table B-2 describes the various combinations of OSR
and PRESCALE and their associated AMCLK, DMCLK
and DRCLK rates.
AMCLK MCLK
PRESCALE
-------------------------------
=
TABLE B-1: OVERSAMPLING RATIO
SETTINGS
PRESCALE
(CONFIG1<15:14>)
Analog Master Clock
Prescale
00AMCLK = MCLK/1 (default)
01 AMCLK = MCLK/2
10 AMCLK = MCLK/4
11 AMCLK = MCLK/8
DMCLK AMCLK
4
---------------------MCLK
4 PRESCALE
----------------------------------------==
DRCLK DMCLK
OSR
---------------------- AMCLK
4OSR
--------------------- MCLK
4 OSR PRESCALE
-----------------------------------------------------------===
2010 Microchip Technology Inc. Preliminary DS39979A-page 439
PIC18F87J72 FAMILY
B.3.5 OSR – OVERSAMPLING RATIO
The ratio of the sampling frequency to the output data
rate, OSR = DMCLK/DRCLK. The default OSR is 64, or
with MCLK = 4 MHz, PRESCALE = 1, AMCLK = 4 MHz,
fS = 1 MHz, fD = 15.625 ksps. The following bits in the
CONFIG1 register are used to change the oversampling
ratio (OSR).
B.3.6 OFFSET ERROR
This is the error induced by the ADC when the inputs
are shorted together (VIN = 0V). The specification
incorporates both PGA and ADC offset contributions.
This error varies with PGA and OSR settings. The
offset is different on each channel and varies from chip
to chip. This offset error can easily be calibrated out by
a MCU with a subtraction. The offset is specified in mV.
The offset on the dual-channel AFE has a low
temperature coefficient.
B.3.7 GAIN ERROR
This is the error induced by the ADC on the slope of the
transfer function. It is the deviation expressed in per-
cent compared to the ideal transfer function defined by
Equation B-15. The specification incorporates both
PGA and ADC gain error contributions, but not the
VREF contribution (it is measured with an external
VREF).This error varies with PGA and OSR settings.
The gain error of the dual-channel AFE has a low
temperature coefficient.
B.3.8 INTEGRAL NON-LINEARITY ERROR
Integral nonlinearity error is the maximum deviation of
an ADC transition point from the corresponding point of
an ideal transfer function, with the offset and gain
errors removed, or with the endpoints equal to zero.
It is the maximum remaining error after calibration of
offset and gain errors for a DC input signal.
B.3.9 SIGNAL-TO-NOISE RATIO (SNR)
For the AFE, the signal-to-noise ratio is a ratio of the
output fundamental signal power to the noise power
(not including the harmonics of the signal), when the
input is a sine wave at a predetermined frequency. It is
measured in dB. Usually, only the maximum signal to
noise ratio is specified. The SNR figure depends mainly
on the OSR and DITHER settings of the device.
TABLE B-2: DEVICE DATA RATES IN FUNCTION OF MCLK, OSR AND PRESCALE
PRE<1:0> OSR<1:0> OSR AMCLK DMCLK DRCLK DRCLK
(ksps)
SINAD
(dB)
ENOB
(bits)
1111256 MCLK/8 MCLK/32 MCLK/8192 0.4882 91.4 14.89
1110128 MCLK/8 MCLK/32 MCLK/4096 0.976 86.6 14.10
110164 MCLK/8 MCLK/32 MCLK/2048 1.95 78.7 12.78
110032 MCLK/8 MCLK/32 MCLK/1024 3.9 68.2 11.04
1011256 MCLK/4 MCLK/16 MCLK/4096 0.976 91.4 14.89
1010128 MCLK/4 MCLK/16 MCLK/2048 1.95 86.6 14.10
100164 MCLK/4 MCLK/16 MCLK/1024 3.9 78.7 12.78
100032 MCLK/4 MCLK/16 MCLK/512 7.8125 68.2 11.04
0111256 MCLK/2 MCLK/8 MCLK/2048 1.95 91.4 14.89
0110128 MCLK/2 MCLK/8 MCLK/1024 3.9 86.6 14.10
010164 MCLK/2 MCLK/8 MCLK/512 7.8125 78.7 12.78
010032 MCLK/2 MCLK/8 MCLK/256 15.625 68.2 11.04
0011256 MCLK MCLK/4 MCLK/1024 3.9 91.4 14.89
0010128 MCLK MCLK/4 MCLK/512 7.8125 86.6 14.10
000164 MCLK MCLK/4 MCLK/256 15.625 78.7 12.78
000032 MCLK MCLK/4 MCLK/128 31.25 68.2 11.04
Note: For OSR = 32 and 64, DITHER = 0. For OSR = 128 and 256, DITHER = 1.
TABLE B-3: OVERSAMPLING RATIO
SETTINGS
CONFIG OVERSAMPLING RATIO
(OSR)
OSR<1:0>
00 32
01 64 (default)
10 128
11 256
PIC18F87J72 FAMILY
DS39979A-page 440 Preliminary 2010 Microchip Technology Inc.
EQUATION B-4: SIGNAL-TO-NOISE RATIO
B.3.10 SIGNAL-TO-NOISE RATIO AND
DISTORTION (SINAD)
The most important figure of merit for the analog
performance of the ADCs is the Signal-to-Noise and
Distortion (SINAD) specification.
Signal-to-noise and distortion ratio is similar to
signal-to-noise ratio, with the exception that you must
include the harmonics power in the noise power calcu-
lation. The SINAD specification depends mainly on the
OSR and DITHER settings.
EQUATION B-5: SINAD EQUATION
The calculated combination of SNR and THD per the
following formula also yields SINAD:
EQUATION B-6: SINAD, THD AND SNR
RELATIONSHIP
B.3.11 TOTAL HARMONIC DISTORTION
(THD)
The total harmonic distortion is the ratio of the output
harmonics power to the fundamental signal power for a
sine wave input and is defined by the following
equation.
EQUATION B-7:
The THD calculation includes the first 35 harmonics for
the AFE’s specifications. The THD is usually only
measured with respect to the first 10 harmonics. This
specification depends mainly on the DITHER setting.
THD is sometimes expressed in percentage. For
converting the THD to a percentage, here is the formula:
EQUATION B-8:
B.3.12 SPURIOUS-FREE DYNAMIC RANGE
(SFDR)
The ratio between the output power of the fundamental
and the highest spur in the frequency spectrum. The
spur frequency is not necessarily a harmonic of the
fundamental even though it is usually the case. This
figure represents the dynamic range of the ADC when
a full-scale signal is used at the input. This specification
depends mainly on the DITHER setting.
EQUATION B-9:
B.3.13 IDLE TONES
A Delta-Sigma Converter is an integrating converter. It
also has a finite quantization step (LSB) which can be
detected by its quantizer. A DC input voltage that is
below the quantization step should only provide an all
zeros result, since the input is not large enough to be
detected. As an integrating device, any Delta-Sigma
will show, in this case, Idle tones. This means that the
output will have spurs in the frequency content that are
depending on the ratio between quantization step
voltage and the input voltage. These spurs are the
result of the integrated subquantization step inputs that
will eventually cross the quantization steps after a long
enough integration. This will induce an AC frequency at
the output of the ADC and can be shown in the ADC
output spectrum.
These Idle tones are residues that are inherent to the
quantization process and the fact that the converter is
integrating at all times without being reset. They are
residues of the finite resolution of the conversion
process. They are very difficult to attenuate and they
are heavily signal dependent. They can degrade both
SFDR and THD of the converter, even for DC inputs.
They can be localized in the baseband of the converter,
and thus, difficult to filter from the actual input signal.
For power metering applications, Idle tones can be very
disturbing because energy can be detected even at the
50 or 60 Hz frequency, depending on the DC offset of
the ADCs, while no power is really present at the
inputs. The only practical way to suppress or attenuate
Idle tones phenomenon is to apply dithering to the
ADC. The Idle tones amplitudes are a function of the
order of the modulator, the OSR and the number of
levels in the quantizer of the modulator. A higher order,
a higher OSR or a higher number of levels for the
quantizer will attenuate the Idle tones amplitude.
SNR dB 10 SignalPower
NoisePower
----------------------------------


log=
SINAD dB 10 SignalPower
Noise HarmonicsPower+
--------------------------------------------------------------------


log=
SINAD dB 10 10
SNR
10
-----------


10
THD
10
----------------


+log=
THD dB 10 HarmonicsPower
FundamentalPower
-----------------------------------------------------


log=
THD % 100 10
THD dB
20
------------------------
=
SFDR dB 10 FundamentalPower
HighestSpurPower
-----------------------------------------------------


log=
2010 Microchip Technology Inc. Preliminary DS39979A-page 441
PIC18F87J72 FAMILY
B.3.14 DITHERING
In order to suppress or attenuate the Idle tones present
in any Delta-Sigma ADCs, dithering can be applied to
the ADC. Dithering is the process of adding an error to
the ADC feedback loop in order to “decorrelate” the
outputs and “break” the Idle tones behavior. Usually a
random or pseudo-random generator adds an analog
or digital error to the feedback loop of the Delta-Sigma
ADC in order to ensure that no tonal behavior can
happen at its outputs. This error is filtered by the feed-
back loop and typically has a zero average value so
that the converter static transfer function is not dis-
turbed by the dithering process. However, the dithering
process slightly increases the noise floor (it adds noise
to the part) while reducing its tonal behavior, and thus,
improving SFDR and THD.
The dithering process scrambles the Idle tones into
baseband white noise and ensures that dynamic specs
(SNR, SINAD, THD, SFDR) are less signal dependent.
The AFE incorporates a proprietary dithering algorithm
on both ADCs in order to remove Idle tones and
improve THD, which is crucial for power metering
applications.
B.3.15 CROSSTALK
The crosstalk is defined as the perturbation caused by
one ADC channel on the other ADC channel. It is a
measurement of the isolation between the two ADCs
present in the chip.
This measurement is a two-step procedure:
1. Measure one ADC input with no perturbation on
the other ADC (ADC inputs shorted).
2. Measure the same ADC input with a
perturbation sine wave signal on the other ADC
at a certain predefined frequency.
The crosstalk is then the ratio between the output
power of the ADC when the perturbation is present and
when it is not divided by the power of the perturbation
signal.
A lower crosstalk value implies more independence
and isolation between the two channels.
The measurement of this signal is performed under the
following conditions:
•GAIN = 1
PRESCALE = 1
OSR = 256
MCLK = 4 MHz
Step 1
CH0+ = CH0- = SAVSS
CH1+ = CH1- = SAVSS
Step 2
CH0+ = CH0- = SAVSS
CH1+ – CH1- = 1VP-P @ 50/60 Hz (full-scale
sine wave)
The crosstalk is then calculated with the following
formula:
EQUATION B-10:
B.3.16 PSRR
This is the ratio between a change in the power supply
voltage and the ADC output codes. It measures the
influence of the power supply voltage on the ADC
outputs.
The PSRR specification can be DC (the power supply
is taking multiple DC values) or AC (the power supply
is a sine wave at a certain frequency with a certain
common-mode). In AC, the amplitude of the sine wave
is representing the change in the power supply.
It is defined as:
EQUATION B-11:
Where VOUT is the equivalent input voltage that the
output code translates to with the ADC transfer
function. For the AFE, SAVDD ranges from 4.5V to
5.5V, and for AC PSRR, a 50/60 Hz sine wave is
chosen, centered around 5V, with a maximum 500 mV
amplitude. The PSRR specification is measured with
SAVDD = SVDD.
CTalk dB 10
CH0Power
CH1Power
---------------------------------


log=
PSRR dB 20
VOUT
SAVDD
----------------------


log=
PIC18F87J72 FAMILY
DS39979A-page 442 Preliminary 2010 Microchip Technology Inc.
B.3.17 CMRR
This is the ratio between a change in the
common-mode input voltage and the ADC output
codes. It measures the influence of the common-mode
input voltage on the ADC outputs.
The CMRR specification can be DC (the
common-mode input voltage is taking multiple DC
values) or AC (the common-mode input voltage is a
sine wave at a certain frequency with a certain
common-mode). In AC, the amplitude of the sine wave
is representing the change in the power supply.
It is defined as:
EQUATION B-12:
When VCM = (CHn+ + CHn-)/2, the common-mode
input voltage, and VOUT is the equivalent input voltage
that is what the output code translates to with the ADC
transfer function. For the AFE, VCM varies from -1V to
+1V, and for the AC specification, a 50/60 Hz sine wave
is chosen centered around 0V with a 500 mV
amplitude.
B.3.18 ADC RESET MODE
ADC Reset mode (also called Soft Reset mode) can
only be entered through setting the RESET<1:0> bits
high in the Configuration register. This mode is defined
as the condition where the converters are active but
their output is forced to ‘0’.
The registers are not affected in this Reset mode and
retain their values.
The ADCs can immediately output meaningful codes
after leaving Reset mode (and after the sinc filter settling
time of 3/DRCLK). This mode is both entered and exited
through the setting of the bits in the Configuration
register.
Each converter can be placed in Soft Reset mode
independently. The Configuration registers are not
modified by the Soft Reset mode.
A data ready pulse will not be generated by any ADC
while in Reset mode.
When an ADC exits ADC Reset mode, any phase delay
present before Reset was entered will still be present.
If one ADC was not in Reset, the ADC leaving Reset
mode will automatically resynchronize the phase delay,
relative to the other ADC channel, per the Phase Delay
register block and give DR pulses accordingly.
If an ADC is placed in Reset mode while the other is
converting, it is not shutting down the internal clock.
When going back out of Reset, it will be resynchronized
automatically with the clock that did not stop during
Reset.
If both ADCs are in Soft Reset or Shutdown modes, the
clock is no longer distributed to the digital core for
low-power operation. Once any of the ADC is back to
normal operation, the clock is automatically distributed
again.
B.3.19 HARD RESET MODE (ARESET = 0)
This mode is only available during a POR or when the
ARESET pin is pulled low. The ARESET pin low state
places the device in a Hard Reset mode.
In this mode, all internal registers are reset to their
default state.
The DC biases for the analog blocks are still active (i.e.,
the AFE is ready to convert). However, this pin clears
all conversion data in the ADCs. The comparator
outputs of both ADCs are forced to their Reset state
(‘0011’). The SINC filters are all reset as well as their
double output buffers. See serial timing for minimum
pulse low time in Section 29.0 “Electrical
Characteristics of the data sheet.
During a Hard Reset, no communication with the part is
possible. The digital interface is maintained in a Reset
state.
B.3.20 ADC SHUTDOWN MODE
ADC Shutdown mode is defined as a state where the
converters and their biases are off, consuming only
leakage current. After this is removed, start-up delay
time (SINC filter settling time will occur before
outputting meaningful codes). The start-up delay is
needed to power up all DC biases in the channel that
were in shutdown. This delay is the same than tPOR
and any DR pulse coming within this delay should be
discarded.
Each converter can be placed in Shutdown mode
independently. The CONFIG registers are not modified
by the Shutdown mode. This mode is only available
through programming of the SHUTDOWN<1:0> bits in
the CONFIG2 register.
The output data is flushed to all zeros while in ADC
shutdown. No data ready pulses are generated by any
ADC while in ADC Shutdown mode.
CMRR dB 20
VOUT
VCM
-----------------


log=
2010 Microchip Technology Inc. Preliminary DS39979A-page 443
PIC18F87J72 FAMILY
When an ADC exits ADC Shutdown mode, any phase
delay present before shutdown was entered will still be
present. If one ADC was not in shutdown, the ADC
leaving Shutdown mode will resynchronize
automatically the phase delay relative to the other ADC
channel per the Phase Delay register block and give
DR pulses accordingly.
If an ADC is placed in Shutdown mode while the other
is converting, it is not shutting down the internal clock.
When going back out of shutdown, it will be
resynchronized automatically with the clock that did not
stop during Reset.
If both ADCs are in ADC Reset or ADC Shutdown
modes, the clock is no more distributed to the digital
core for low-power operation. Once any of the ADC is
back to normal operation, the clock is automatically
distributed again.
B.3.21 FULL SHUTDOWN MODE
The lowest power consumption can be achieved when
SHUTDOWN<1:0> = 11, VREFEXT = CLKEXT = 1.
This mode is called “Full Shutdown mode” and no ana-
log circuitry is enabled. In this mode, the POR SVDD
monitoring circuit is also disabled. When the clock is
Idle (CLKIA = 0 or 1 continuously), no clock is propa-
gated throughout the chip. Both ADCs are in shutdown,
the internal voltage reference is disabled and the
internal oscillator is disabled.
The only circuit that remains active is the SPI interface,
but this circuit does not induce any static power
consumption. If SCK is Idle, the only current
consumption comes from the leakage currents induced
by the transistors and is less than 1 µA on each power
supply.
This mode can be used to power down the chip
completely and avoid power consumption when there
is no data to convert at the analog inputs. Any SCK or
MCLK edge coming, while on this mode, will induce
dynamic power consumption.
Once any of the SHUTDOWN, CLKEXT and VREFEXT
bits returns to ‘0’, the POR SVDD monitoring block is
back to operation and SVDD monitoring can take place.
B.4 Device Overview
B.4.1 ANALOG INPUTS (CHn+/-)
The analog inputs of the dual-channel AFE can be con-
nected directly to current and voltage transducers (such
as shunts, current transformers or Rogowski coils). Each
input pin is protected by specialized ESD structures that
are certified to pass 7 kV HBM and 400V MM contact
charge. These structures allow bipolar ±6V continuous
voltage, with respect to SAVSS, to be present at their
inputs without the risk of permanent damage.
Both channels have fully differential voltage inputs for
better noise performance. The absolute voltage at each
pin relative to SAVSS should be maintained in the ±1V
range during operation in order to ensure the specified
ADC accuracy. The common-mode signals should be
adapted to respect both the previous conditions and
the differential input voltage range. For best
performance, the common-mode signals should be
maintained to SAVSS.
B.4.2 PROGRAMMABLE GAIN
AMPLIFIERS (PGA)
The two Programmable Gain Amplifiers (PGAs) reside
at the front end of each Delta-Sigma ADC. They have
two functions: translate the common-mode of the input
from SAVSS to an internal level between SAVSS and
SAVDD, and amplify the input differential signal. The
translation of the common-mode does not change the
differential signal, but re-centers the common-mode so
that the input signal can be properly amplified.
The PGA block can be used to amplify very low signals,
but the differential input range of the Delta-Sigma
modulator must not be exceeded. The PGA is
controlled by the PGA_CHn<2:0> bits in the GAIN
register. Table B-4 represents the gain settings for the
PGA:
TABLE B-4: PGA CONFIGURATION
SETTING
PGA Gain
(PGA_CHn<2:0>)
Gain VIN Range
(V)
(V/V) (dB)
000 10±0.5
001 26±0.25
010 4 12 ±0.125
011 8 18 ±0.0625
100 16 24 ±0.03125
101 32 30 ±0.015625
PIC18F87J72 FAMILY
DS39979A-page 444 Preliminary 2010 Microchip Technology Inc.
B.4.3 DELTA-SIGMA MODULATOR
B.4.3.1 Architecture
Both of the ADCs in the AFE are identical and they
include a second-order modulator with a multi-bit DAC
architecture (see Figure B-2). The quantizer is a Flash
ADC composed of 4 comparators with equally spaced
thresholds and a thermometer output coding. The
proprietary 5-level architecture ensures minimum
quantization noise at the outputs of the modulators
without disturbing linearity or inducing additional
distortion. The sampling frequency is DMCLK (typically
1 MHz with MCLK = 4 MHz) so the modulator outputs
are refreshed at a DMCLK rate.
Both modulators also include a dithering algorithm that
can be enabled through the DITHER<1:0> bits in the
Configuration register. This dithering process improves
THD and SFDR (for high OSR settings) while
increasing slightly the noise floor of the ADCs. For
power metering applications and applications that are
distortion-sensitive, it is recommended to keep
DITHER enabled for both ADCs. In the case of power
metering applications, THD and SFDR are critical
specifications to optimize SNR (noise floor). This is not
really problematic due to the large averaging factor at
the output of the ADCs; therefore, even for low OSR
settings, the dithering algorithm will show a positive
impact on the performance of the application.
Figure B-2 represents a simplified block diagram of the
Delta-Sigma ADC present on the AFE.
FIGURE B-2: SIMPLIFIED DELTA-SIGMA
ADC BLOCK DIAGRAM
B.4.3.2 Modulator Input Range and
Saturation Point
For a specified voltage reference value of 2.4V, the mod-
ulators’ specified differential input range is ±500 mV. The
input range is proportional to VREF and scales according
to the VREF voltage. This range ensures the stability of
the modulator over amplitude and frequency. Outside of
this range, the modulator is still functional, however, its
stability is no longer ensured, and therefore, it is not rec-
ommended to exceed this limit. The saturation point for
the modulator is VREF/3 since the transfer function of the
ADC includes a gain of 3 by default (independent from
the PGA setting). See Section B.4.5 “ADC Output
Coding”.
B.4.3.3 Boost Mode
The Delta-Sigma modulators also include an
independent Boost mode for each channel. If the
corresponding BOOST<1:0> bit is enabled, the power
consumption of the modulator is multiplied by 2 and its
bandwidth is increased to be able to sustain AMCLK
clock frequencies, up to 8.192 MHz, while keeping the
ADC accuracy. When disabled, the power consumption
is back to normal and the AMCLK clock frequencies
can only reach up to 5 MHz without affecting ADC
accuracy.
B.4.4 SINC3 FILTER
Both of the ADCs include a decimation filter that is a
third-order sinc (or notch) filter. This filter processes the
multi-bit bitstream into 16 or 24-bit words (depending
on the WIDTH Configuration bit). The settling time of
the filter is 3 DMCLK periods. It is recommended to dis-
card unsettled data to avoid data corruption, which can
be done easily by setting the DR_LTY bit high in the
STATUS/COM register.
The resolution achievable at the output of the sinc filter
(the output of the ADC) is dependant on the OSR and
is summarized with the following table:
For 24-Bit Output mode (WIDTH = 1), the output of the
sinc filter is padded with least significant zeros for any
resolution less than 24 bits.
For 16-Bit Output modes, the output of the sinc filter is
rounded to the closest 16-bit number in order to
conserve only 16-bit words and to minimize truncation
error.
Second
Order
Integrator
Loop
Filter
Quantizer
DAC
Differential
Voltage Input
Output
Bitstream
5-Level
Flash ADC
Delta-Sigma Modulator
TABLE B-5: ADC RESOLUTION vs. OSR
OSR<1:0> OSR ADC Resolution (bits)
No Missing Codes
00 32 17
01 64 20
10 128 23
11 256 24
2010 Microchip Technology Inc. Preliminary DS39979A-page 445
PIC18F87J72 FAMILY
The gain of the transfer function of this filter is 1 at each
multiple of DMCLK (typically 1 MHz), so a proper
anti-aliasing filter must be placed at the inputs to
attenuate the frequency content around DMCLK and
keep the desired accuracy over the baseband of the
converter. This anti-aliasing filter can be a simple
first-order RC network with a sufficiently low time
constant to generate high rejection at DMCLK
frequency.
EQUATION B-13: SINC FILTER TRANSFER
FUNCTION H(z)
The Normal-Mode Rejection Ratio (NMRR) or gain of
the transfer function is given by the following equation:
EQUATION B-14: MAGNITUDE OF
FREQUENCY RESPONSE
H(f)
Figure B-3 shows the sinc filter frequency response:
FIGURE B-3: SINC FILTER RESPONSE
WITH MCLK = 4 MHZ,
OSR = 64, PRESCALE = 1
B.4.5 ADC OUTPUT CODING
The second-order modulator, SINC3 filter, PGA, VREF
and analog input structure all work together to produce
the device transfer function for the analog to digital
conversion (see Equation B-15).
The channel data is either a 16-bit or 24-bit word,
presented in 23-bit or 15-bit plus sign, two’s
complement format and is MSB (left) justified.
The ADC data is two or three bytes wide depending on
the WIDTH bit of the associated channel. The 16-bit
mode includes a round to the closest 16-bit word
(instead of truncation) in order to improve the accuracy
of the ADC data.
In case of positive saturation (CHn+ – CHn- > VREF/3),
the output is locked to 7FFFFF for 24-bit mode (7FFF
for 16-bit mode). In case of negative saturation
(CHn+ CHn- VREF/3), the output code is locked to
800000 for 24-bit mode (8000 for 16-bit mode).
Equation B-15 is only true for DC inputs. For AC inputs,
this transfer function needs to be multiplied by the
transfer function of the SINC3 filter (see Equation B-13
and Equation B-14).
EQUATION B-15:
Hz 1z
OSR
OSR 1 z 1

---------------------------------



3
=
z2fj
DMCLK
----------------------


exp=
where
NMRR f
c
f
DMCLK
----------------------


sin
c
f
DRCLK
--------------------


sin
----------------------------------------------
3
=
NMRR f
cf
fS
----


sin
cf
fD
-----


sin
-----------------------------
3
=
cxsin xsin
x
---------------
=
or,
where
-120
-100
-80
-60
-40
-20
0
20
1 10 100 1000 10000 100000 1000000
Input Frequency (Hz)
Magnitude (dB)
DATA_CHn CHn+ CHn-

VREF+ VREF-
--------------------------------------


8,388,608 G 3
=
DATA_CHn CHn+ CHn-

VREF+ VREF-
--------------------------------------


32 768,G3
=
(For 24-bit Mode Or WIDTH = 1)
(For 16-bit Mode Or WIDTH = 0)
PIC18F87J72 FAMILY
DS39979A-page 446 Preliminary 2010 Microchip Technology Inc.
B.4.5.1 ADC Resolution as a Function of
OSR
The ADC resolution is a function of the OSR
(Section B.4.4 “SINC3 Filter”). The resolution is the
same for both channels. No matter what the resolution
is, the ADC output data is always presented in 24-bit
words, with added zeros at the end, if the OSR is not
large enough to produce 24-bit resolution (left
justification).
TABLE B-6: OSR = 256 OUTPUT CODE EXAMPLES
ADC Output Code (MSB First) Hexadecimal Decimal
0111 1111 1111 1111 1111 1111 0x7FFFFF + 8,388,607
0111 1111 1111 1111 1111 1110 0x7FFFFE + 8,388,606
0000 0000 0000 0000 0000 0000 0x000000 0
1111 1111 1111 1111 1111 1111 0xFFFFFF -1
1000 0000 0000 0000 0000 0001 0x800001 - 8,388,607
1000 0000 0000 0000 0000 0000 0x800000 - 8,388,608
TABLE B-7: OSR = 128 OUTPUT CODE EXAMPLES
ADC Output Code (MSB First) Hexadecimal Decimal
23-Bit Resolution
0111 1111 1111 1111 1111 11100x7FFFFE + 4,194,303
0111 1111 1111 1110 1111 11000x7FFFFC + 4,194,302
0000 0000 0000 0000 0000 0000 0x000000 0
1111 1111 1111 1111 1111 11100xFFFFFE -1
1000 0000 0000 0000 0000 00100x800002 - 4,194,303
1000 0000 0000 0000 0000 00000x800000 - 4,194,304
TABLE B-8: OSR = 64 OUTPUT CODE EXAMPLES
ADC Output Code (MSB First) Hexadecimal Decimal
20-Bit resolution
0111 1111 1111 1111 1111 0 0 0 0 0x7FFFF0 + 524, 287
0111 1111 1111 1111 1110 0 0 0 0 0x7FFFE0 + 524, 286
0000 0000 0000 0000 0000 0 0 0 0 0x000000 0
1111 1111 1111 1111 1111 0 0 0 0 0xFFFFF0 -1
1000 0000 0000 0000 0001 0 0 0 0 0x800010 - 524,287
1000 0000 0000 0000 0000 0 0 0 0 0x800000 - 524, 288
TABLE B-9: OSR = 32 OUTPUT CODE EXAMPLES
ADC Output Code (MSB First) Hexadecimal Decimal
17-Bit resolution
0111 1111 1111 1111 1000 0000 0x7FFF80 + 65, 535
0111 1111 1111 1111 0000 0000 0x7FFF00 + 65, 534
0000 0000 0000 0000 0000 0000 0x000000 0
1111 1111 1111 1111 1000 0000 0xFFFF80 -1
1000 0000 0000 0000 1000 0000 0x800080 - 65,535
1000 0000 0000 0000 0000 0000 0x800000 - 65, 536
2010 Microchip Technology Inc. Preliminary DS39979A-page 447
PIC18F87J72 FAMILY
B.4.6 VOLTAGE REFERENCE
B.4.6.1 Internal Voltage Reference
The AFE contains an internal voltage reference source
specially designed to minimize drift over temperature.
In order to enable the internal voltage reference, the
VREFEXT bit in the Configuration register must be set
to ‘0’ (Default mode). This internal VREF supplies refer-
ence voltage to both channels. The typical value of this
voltage reference is 2.37V ±2%. The internal reference
has a very low typical temperature coefficient of
±12 ppm/°C, allowing the output codes to have minimal
variation with respect to temperature since they are
proportional to (1/VREF).
The noise of the internal voltage reference is low
enough not to significantly degrade the SNR of the
ADC if compared to a precision external low-noise
voltage reference.
The output pin for the internal voltage reference is
REFIN+/OUT.
When the internal voltage reference is enabled, the
REFIN- pin should always be connected to SAVSS.
For optimal ADC accuracy, appropriate bypass
capacitors should be placed between REFIN+/OUT
and SAVSS. Decoupling at the sampling frequency,
around 1 MHz is important, for any noise around this
frequency will be aliased back into the conversion data.
0.1 µF ceramic and 10 µF tantalum capacitors are
recommended.
These bypass capacitors are not mandatory for correct
ADC operation, but removing these capacitors may
degrade accuracy of the ADC. The bypass capacitors
also help for applications where the voltage reference
output is connected to other circuits. In this case,
additional buffering may be needed as the output drive
capability of this output is low.
B.4.6.2 Differential External Voltage Inputs
When the VREFEXT bit is high, the two reference pins
(REFIN+/OUT, REFIN-) become a differential voltage
reference input. The voltage at the REFIN+/OUT is
noted VREF+ and the voltage at the REFIN- pin is noted
VREF-. The differential voltage input value is given by
the following equation:
VREF = VREF+ – VREF-
The specified VREF range is from 2.2V to 2.6V. The
REFIN- pin voltage (VREF-) should be limited to ±0.3V.
Typically, for single-ended reference applications, the
REFIN- pin should be directly connected to SAVSS.
B.4.7 POWER-ON RESET
The AFE contains its own internal POR circuit that
monitors analog supply voltage AVDD during operation.
The typical threshold for a power-up event detection is
4.2V, ±5%. The POR circuit has a built-in hysteresis for
improved transient spikes immunity that has a typical
value of 200 mV. Proper decoupling capacitors (0.1 µF
ceramic and 10 µF tantalum) should be mounted as
close as possible to the AVDD pin, providing additional
transient immunity.
Figure B-4 illustrates the different conditions at
power-up and a power-down event in the typical
conditions. All internal DC biases are not settled until at
least 50 µs after system POR. Any DR pulses during
this time after system Reset should be ignored. After
POR, DR pulses are present at the pin with all the
default conditions in the Configuration registers.
The analog and digital power supplies are indepen-
dent. Since AVDD is the only power supply that is mon-
itored, it is highly recommended to power up DVDD first
as a power-up sequence. If AVDD is powered up first, it
is highly recommended to keep the RESET pin low
during the whole power-up sequence.
FIGURE B-4: POWER-ON RESET
OPERATION
AVDD
5V
4.2V
4V
0V
Device
Mode Reset Proper
Operation Reset
Time
50 µs
tPOR
PIC18F87J72 FAMILY
DS39979A-page 448 Preliminary 2010 Microchip Technology Inc.
B.4.8 ARESET EFFECT ON DELTA-SIGMA
MODULATOR/SINC FILTER
When the ARESET pin is low, both ADCs will be in
Reset and output code, 0x0000h. The RESET pin per-
forms a Hard Reset (DC biases still on, part ready to
convert) and clears all charges contained in the
Sigma-Delta modulators. The comparator output is
0011’ for each ADC.
The sinc filters are all reset, as well as their double
output buffers. This pin is independent of the serial
interface. It brings the CONFIG registers to the default
state. When RESET is low, any write with the SPI
interface will be disabled and will have no effect. The
output pins (SDOA, DR) are high impedance and no
clock is propagated through the chip.
B.4.9 PHASE DELAY BLOCK
The AFE incorporates a phase delay generator which
ensures that the two ADCs are converting the inputs
with a fixed delay between them. The two ADCs are
synchronously sampling, but the averaging of
modulator outputs is delayed so that the sinc filter
outputs (thus, the ADC outputs) show a fixed phase
delay, as determined by the PHASE register setting.
The PHASE register (PHASE<7:0>) is a 7-bit + sign,
MSB first, two’s complement register, that indicates
how much phase delay there is to be between
Channel 0 and Channel 1. The reference channel for
the delay is Channel 1 (typically the voltage channel for
power metering applications). When PHASE<7:0> bits
are positive, Channel 0 is lagging versus Channel 1.
When PHASE<7:0> are negative, Channel 0 is leading
versus Channel 1. The amount of delay between two
ADC conversions is given by the following formula:
EQUATION B-16:
The timing resolution of the phase delay is 1/DMCLK or
1 µs in the default configuration with MCLK = 4 MHz.
The data ready signals are affected by the phase delay
settings. Typically, the time difference between the data
ready pulses of Channel 0 and Channel 1 is equal to
the phase delay setting.
B.4.9.1 Phase Delay Limits
The phase delay can only go from -OSR/2 to +OSR/2 1.
This sets the fine phase resolution. The PHASE register is
coded with 2’s complement.
If larger delays between the two channels are needed,
they can be implemented by the microcontroller. A
FIFO can save incoming data from the leading channel
for a number N of DRCLK clocks. In this case, DRCLK
would represent the coarse timing resolution, and
DMCLK the fine timing resolution. The total delay will
then be equal to:
Delay = N/DRCLK + PHASE/DMCLK
The Phase Delay register can be programmed once
with the OSR = 256 setting, and will adjust to the OSR
automatically afterwards, without the need to change
the value of the PHASE register.
OSR = 256: the delay can go from -128 to +127.
PHASE<7> is the sign bit. PHASE<6> is the MSB
and PHASE<0> is the LSB.
OSR = 128: the delay can go from -64 to +63.
PHASE<6> is the sign bit. PHASE<5> is the MSB
and PHASE<0> is the LSB.
OSR = 64: the delay can go from -32 to +31.
PHASE<5> is the sign bit. PHASE<4> is the MSB
and PHASE<0> is the LSB.
OSR = 32: the delay can go from -16 to +15.
PHASE<4> is the sign bit. PHASE<3> is the MSB
and PHASE<0> is the LSB.
Note: A detailed explanation of the Data Ready
pin (DR) with phase delay is present in
Section B.5.9.1 “Data Ready Latches
And Data Ready Modes
(DRMODE<1:0>)”.
Delay Phase Register Code
DMCLK
--------------------------------------------------=
TABLE B-10: PHASE VALUES WITH
MCLK = 4 MHZ, OSR = 256
PHASE Register Value Delay
(CH0 relative
to CH1)
Binary Hex
01111111 0x7F +127 µs
01111110 0x7E +126 µs
00000001 0x01 +1 µs
00000000 0x00 0 µs
11111111 0xFF -1 µs
10000001 0x81 -127 µs
10000000 0x80 -128 µs
2010 Microchip Technology Inc. Preliminary DS39979A-page 449
PIC18F87J72 FAMILY
B.4.10 INTERNAL AFE CLOCK
The AFE uses an external clock signal to operate its
internal digital logic. An internal clock generation chain
(Figure B-5) is used to produce a range of DRCLK
sampling frequencies.
For keeping specified ADC accuracy, AMCLK should
be kept between 1 and 5 MHz with BOOST off, or 1 and
8.192 MHz with BOOST on. Larger MCLK frequencies
can be used provided the prescaler clock settings allow
the AMCLK to respect these ranges.
FIGURE B-5: AFE INTERNAL CLOCK DETAIL
B.5 Serial Interface Description
B.5.1 OVERVIEW
The AFE is accessed for control and data output exclu-
sively through its dedicated Serial Peripheral Interface
(SPI). The interface is compatible with SPI Modes 0,0
and 1,1. Data is clocked out of the AFE on the falling
edge of SCK, and data is clocked in on the rising edge
of SCK. In these modes, SCK can Idle either high or
low.
Each SPI communication starts with a CS falling edge
and stops with the CS rising edge. Each SPI
communication is independent. When CS is high, SDO
is in high-impedance, transitions on SCK and SDI have
no effect. Additional controls pins (ARESET and DR)
are also provided on separate pins for advanced
communication.
The AFE’s SPI interface has a simple command
structure. The first byte transmitted is always the
control byte and is followed by data bytes that are 8-bit
wide. Both ADCs are continuously converting data by
default and can be reset or shut down through a
CONFIG2 register setting.
Since each ADC data is either 16 or 24 bits (depending
on the WIDTH bits), the internal registers can be
grouped together with various configurations (through
the READ bits) in order to allow easy data retrieval
within only one communication. For device reads, the
internal address counter can be automatically
incremented in order to loop through groups of data
within the register map. SDOA will then output the data
located at the ADDRESS (A<4:0>) defined in the con-
trol byte and then ADDRESS + 1 depending on the
READ<1:0> bits, which select the groups of registers.
These groups are defined in Section B.6.1 “ADC
Channel Data Output Registers” (Register Map).
The Data Ready pin (DR) can be used as an interrupt for
a microcontroller and outputs pulses when new ADC
channel data is available. The ARESET pin acts like a
Hard Reset and can reset the AFE to its default power-up
configuration, independent of the microcontroller.
B.5.2 CONTROL BYTE
The control byte of the AFE contains two device
address bits (A<6:5>), 5 register address bits (A<4:0>)
and a read/write bit (R/W). The first byte transmitted to
the AFE is always the control byte.
The AFE interface is device-addressable (through
A<6:5>) so that multiple devices can be present on the
same SPI bus with no data bus contention. This
functionality enables three-phase power metering
systems containing an AFE and two other external
AFE-type chips, controlled by a single SPI bus (single
CS, SCK, SDI and SDO pins). The default device
address bits are ‘00’.
FIGURE B-6: CONTROL BYTE
A read on undefined addresses will give an all zeros
output on the first and all subsequent transmitted bytes.
A write on an undefined address will have no effect and
will not increment the address counter either.
The register map is defined in Section B.6.1 “ADC
Channel Data Output Registers”.
PRESCALE<1:0>
1/
MCLK AMCLK
1/4
DMCLK
1/OSR
DRCLK
OSR<1:0>
Clock Divider Clock Divider Clock Divider
CLKIA Prescale
fS ADC
Sampling
Rate
fD ADC
Output
Data Rate
Digital Buffer
A6 A5 A4 A3 A2 A1 A0 R/W
Read
Write Bit
Register
Device
Address Bits
Address
Bits
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DS39979A-page 450 Preliminary 2010 Microchip Technology Inc.
B.5.3 READING FROM THE DEVICE
The first data byte read is the one defined by the
address given in the control byte. After this first byte is
transmitted, if the CS pin is maintained low, the com-
munication continues and the address of the next
transmitted byte is determined by the status of the
READ bits in the STATUS/COM register. Multiple
looping configurations can be defined through the
READ<1:0> bits for the address increment (see
Section B.5.6 “SPI Mode 0,0 - Clock Idle Low,
Read/Write Examples”).
B.5.4 WRITING TO THE DEVICE
The first data byte written is the one defined by the
address given in the control byte. The write
communication automatically increments the address
for subsequent bytes.
The address of the next transmitted byte within the
same communication (CSA stays low) is the next
address defined on the register map. At the end of the
register map, the address loops to the beginning of the
register map. Writing a non-writable register has no
effect.
The SDOA pin stays in a high-impedance state during
a write communication.
B.5.5 SPI MODE 1,1 – CLOCK IDLE HIGH,
READ/WRITE EXAMPLES
In this SPI mode, the clock Idles high. For the AFE, this
means that there will be a falling edge before there is a
rising edge.
FIGURE B-7: DEVICE READ (SPI MODE 1,1 – CLOCK IDLES HIGH)
FIGURE B-8: DEVICE WRITE (SPI MODE 1,1 – CLOCK IDLES HIGH)
Note: Changing from an SPI Mode 1,1 to an SPI
Mode 0,0 is possible, but needs a Reset
pulse in-between to ensure correct
communication.
SCK
SDI
SDO
CS
A6 A5 A4 A3 A2 A1 A0
D6 D5 D4 D3 D2 D1 D0
(ADDRESS) DATA (ADDRESS + 1) DATA
D6 D5 D4 D3 D2 D1
Data Transitions on
the Falling Edge
AFE Latches
Bits on the Rising Edge
D0
HI-Z HI-Z
D7 D7
R/W
HI-Z
SCK
SDI
SDO
CS
R/W
A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1
(ADDRESS) DATA (ADDRESS + 1) DATA
D6 D5 D4 D3 D2 D1
D0
Data Transitions on
the Falling Edge
AFE Latches
Bits on the Rising Edge
D0
HI-Z HI-Z
D7
HI-Z
2010 Microchip Technology Inc. Preliminary DS39979A-page 451
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B.5.6 SPI MODE 0,0 - CLOCK IDLE LOW,
READ/WRITE EXAMPLES
In this SPI mode, the clock Idles low. For the AFE, this
means that there will be a rising edge before there is a
falling edge.
FIGURE B-9: DEVICE READ (SPI MODE 0,0 – CLOCK IDLES LOW)
FIGURE B-10: DEVICE WRITE (SPI MODE 0,0 – CLOCK IDLES LOW)
SCK
SDI
SDO
CS
R/W
A6 A5 A4 A3 A2 A1 A0
D7 D6 D5 D4 D3 D2 D1 D0
(ADDRESS) DATA (ADDRESS + 1) DATA
D7 D6 D5 D4 D3 D2 D1
Data Transitions on
the Falling Edge
AFE Latches
Bits on the Rising Edge
D0 D7 OF (ADDRESS + 2) DATA
HI-Z HI-Z
HI-Z
SCK
SDI
SDO
CS
R/W
A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D7
(ADDRESS) DATA (ADDRESS + 1) DATA
D6 D5 D4 D3 D2 D1 D7 OF (ADDRESS + 2) DATA
D0
Data Transitions on
the Falling Edge
AFE Latches
Bits on the Rising Edge
D0
HI-Z HI-Z
HI-Z
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DS39979A-page 452 Preliminary 2010 Microchip Technology Inc.
B.5.7 CONTINUOUS COMMUNICATION,
LOOPING ON ADDRESS SETS
If the user wishes to read back either of the ADC
channels continuously, or both channels continuously,
the internal address counter can be set to loop on spe-
cific register sets. In this case, there is only one control
byte on SDI to start the communication. The part stays
within the same loop until CS returns high.
This internal address counter allows the following
functionality:
Read one ADC channel data continuously
Read both ADC channel data continuously (both
ADC data can be independent or linked with
DRMODE settings)
Read continuously the entire register map
Read continuously each separate register
Read continuously all Configuration registers
Write all Configuration registers in one
communication (see Figure B-11)
The STATUS/COM register contains the loop settings
for the internal address counter (READ<1:0>). The
internal address counter can either stay constant
(READ<1:0> = 00) and read continuously the same
byte, or it can auto-increment and loop through the
register groups defined below (READ<1:0> = 01),
register types (READ<1:0> = 10) or the entire register
map (READ<1:0> = 11).
Each channel is configured independently as either a
16-bit or 24-bit data word depending on the setting of
the corresponding WIDTH bit in the CONFIG1 register.
For continuous reading, in the case of WIDTH = 0
(16-bit), the lower byte of the ADC data is not accessed
and the part jumps automatically to the following
address (the user does not have to clock out the lower
byte since it becomes undefined for WIDTH = 0).
The following figure represents a typical, continuous
read communication with the default settings
(DRMODE<1:0> = 00, READ<1:0> = 10) for both width
settings. This configuration is typically used for power
metering applications.
FIGURE B-11: TYPICAL CONTINUOUS READ COMMUNICATION
CH0 ADC
ADDR/R
CS
SCK
SDI
CH0 ADC
Upper byte
SDO CH0 ADC
Middle byte
CH0 ADC
Lower byte
DR
CH1 ADC
Upper byte
CH1 ADC
Middle byte
CH1 ADC
Lower byte
CH0 ADC
Upper byte
CH0 ADC
Middle byte
CH0 ADC
Lower byte
CH1 ADC
Upper byte
CH1 ADC
Middle byte
CH1 ADC
Lower byte
These bytes are not present when WIDTH=0 (16-bit mode)
2010 Microchip Technology Inc. Preliminary DS39979A-page 453
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B.5.7.1 Continuous Write
Both ADCs are powered up with their default
configurations and begin to output DR pulses
immediately (RESET<1:0> and SHUTDOWN<1:0>
bits are all0’ by default).
The default output codes for both ADCs are all zeros.
The default modulator output for both ADCs is ‘0011
(corresponding to a theoretical zero voltage at the
inputs). The default phase is zero between the two
channels.
It is recommended to enter into ADC Reset mode for
both ADCs just after power-up because the desired
register configuration may not be the default one, and
in this case, the ADC would output undesired data.
Within the ADC Reset mode (RESET<1:0> = 11), the
user can configure the whole part with a single commu-
nication. The write commands increment the address
automatically so that the user can start writing the
PHASE register, and finish with the CONFIG2 register,
in only one communication (see Figure B-11). The
RESET<1:0> bits are in the CONFIG2 register to allow
exiting of the Soft Reset mode, and have the whole part
configured and ready to run in only one command.
The following register sets are defined as groups:
The following register sets are defined as types:
B.5.8 SITUATIONS THAT RESET ADC
DATA
Immediately after the following actions, the ADCs are
temporarily reset in order to provide proper operation:
1. Change in the PHASE register.
2. Change in the OSR setting.
3. Change in the PRESCALE setting.
4. Overwrite of the same PHASE register value.
5. Change in the CLKEXT bit in the CONFIG2
register, modifying the internal oscillator state.
After these temporary Resets, the ADCs go back to the
normal operation with no need for an additional
command. These are also the settings where the DR
position is affected. The PHASE register can be used
to serially soft reset the ADCs without using the RESET
bits in the Configuration register if the same value is
written in the PHASE register.
FIGURE B-12: RECOMMENDED CONFIGURATION SEQUENCE AT POWER UP
TABLE B-11: REGISTER GROUPS
GROUP ADDRESSES
ADC DATA CH0 0x00-0x02
ADC DATA CH1 0x03-0x05
PHASE, GAIN 0x07-0x08
CONFIG, STATUS 0x09-0x0B
TABLE B-12: REGISTER TYPES
TYPE ADDRESSES
ADC DATA
(Both Channels)
0x00-x05
CONFIGURATION 0x07-0x0B
00011000
CS
SCK
SDI
AVDD
11XXXXX1
CONFIG2 ADDR/W CONFIG2
Optional Reset of Both ADCs One Command for Writing Complete Configuration
PHASE ADDR/W GAIN STATUS/COM CONFIG1 CONFIG2PHASE
00001110 xxxxxxxx xxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxx
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DS39979A-page 454 Preliminary 2010 Microchip Technology Inc.
B.5.9 DATA READY PIN (DR)
To signify when channel data is ready for transmission,
the data ready signal is available on the Data Ready pin
(DR) through an active-low pulse at the end of a
channel conversion.
The Data Ready pin outputs an active-low pulse with a
period that is equal to the DRCLK clock period and with
a width equal to one DMCLK period.
When not active-low, this pin can either be in high
impedance (when DR_HIZN = 0) or in a defined logic
high state (when DR_HIZN = 1). This is controlled
through the Configuration registers. This allows multiple
devices to share the same Data Ready pin (with a
pull-up resistor connected between DR and DVDD) in
3-phase energy meter designs to reduce microcontroller
pin count. A single device on the bus does not require a
pull-up resistor.
After a data ready pulse has occurred, the ADC output
data can be read through SPI communication. Two sets
of latches at the output of the ADC prevent the
communication from outputting corrupted data (see
Section B.5.9.1 “Data Ready Latches And Data
Ready Modes (DRMODE<1:0>)”).
The CS pin has no effect on the DR pin, which means
even if CS is high, data ready pulses will be provided
(except when the configuration prevents from
outputting data ready pulses). The DR pin can be used
as an interrupt when connected to an external micro-
controller. When the ARESET pin is low, the DR pin is
not active.
B.5.9.1 Data Ready Latches And Data
Ready Modes (DRMODE<1:0>)
To ensure that both channel ADC data are present at
the same time for SPI read, regardless of phase delay
settings for either or both channels, there are two sets
of latches in series with both the data ready and the
‘read start’ triggers.
The first set of latches holds each output when data is
ready and latches both outputs together when
DRMODE<1:0> = 00. When this mode is on, both
ADCs work together and produce one set of available
data after each data ready pulse (that corresponds to
the lagging ADC data ready). The second set of latches
ensures that when reading starts on an ADC output, the
corresponding data is latched so that no data
corruption can occur.
If an ADC read has started, in order to read the
following ADC output, the current reading needs to be
completed (all bits must be read from the ADC output
data registers).
B.5.9.2 Data Ready Pin (DR) Control Using
DRMODE Bits
There are four modes that control the data ready
pulses and these modes are set with the
DRMODE<1:0> bits in the STATUS/COM register. For
power metering applications, DRMODE<1:0> = 00 is
recommended (Default mode).
The position of DR pulses vary with respect to this
mode, to the OSR and to the PHASE settings:
DRMODE<1:0> = 11: Both Data Ready pulses
from ADC Channel 0 and ADC Channel 1 are
output on the DR pin.
DRMODE<1:0> = 10: Data Ready pulses from
ADC Channel 1 are output on the DR pin. DR
pulses from ADC Channel 0 are not present on
the pin.
DRMODE<1:0> = 01: Data Ready pulses from
ADC Channel 0 are output on the DR pin. DR
pulses from ADC Channel 1 are not present on
the pin.
DRMODE<1:0> = 00: (Recommended and
Default mode). Data Ready pulses from the
lagging ADC, between the two, are output on the
DR pin. The lagging ADC depends on the PHASE
register and on the OSR. In this mode, the two
ADCs are linked together so their data is latched
together when the lagging ADC output is ready.
B.5.9.3 DR Pulses with Shutdown or Reset
Conditions
There will be no DR pulses if DRMODE<1:0> = 00
when either one or both of the ADCs are in Reset or
Shutdown. In Mode 00, a DR pulse only happens when
both ADCs are ready. Any DR pulse will correspond to
one data on both ADCs. The two ADCs are linked
together and act as if there was only one channel with
the combined data of both ADCs. This mode is very
practical when both ADC channel data retrieval and
processing need to be synchronized, as in power
metering applications.
Figure B-13 represents the behavior of the Data Ready
pin with the different DRMODE and DR_LTY
configurations, while shutdown or Resets are applied.
Note: If DRMODE<1:0> = 11, the user will still
be able to retrieve the DR pulse for the
ADC not in shutdown or Reset (i.e., only
one ADC channel needs to be awake).
2010 Microchip Technology Inc. Preliminary DS39979A-page 455
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FIGURE B-13: DATA READY BEHAVIOR
D0 D1 D2
D0 D1 D2 D3 D4 D5
D3 D4 D5
D0 D1 D2 D3 D4 D5 D6 D7 D8
D1 D3 D5 D6 D7 D8 D10 D12D0 D2 D4 D9 D11 D13 D14
D6
D6 D12
D9 D13
D16 D17 D18 D19 D21 D24D15 D20 D22 D25 D26
D7 D8 D9 D10 D11
D10 D11 D12
D10D7 D8 D9
D23
D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16 D17 D18 D19
D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D11D10 D12 D13 D14 D15 D16
D0 D1 D2 D4 D5D3 D7 D8 D9 D10 D11 D12 D13D6 D15 D16
D14
D0 D1 D2 D6 D10 D11 D12 D13
D11
D13 D14 D15 D16
D12 D13 D14
D14
D28 D29 D31 D33D27 D30 D32 D34
D15 D16 D17
D8D7 D9D4 D5D3
RESET<1> or
SHUTDOWN<1>
RESET<0> or
SHUTDOWN<0>
RESET
D0 D1 D2 D3 D4 D5
D0 D1 D2 D3 D4 D5 D6 D7 D8
D1 D3 D5 D6 D7 D8 D11 D13D0 D2 D4 D10 D12 D14 D15
D6
D9 D13
D17 D18 D21 D24D16 D19 D22 D25 D26
D10 D11 D12
D10D8 D9
D23
D11 D12 D13 D14
D28 D29 D31 D33D27 D30 D32 D34
D14 D15 D16
D0 D1 D2 D3 D4 D5 D12D11 D13 D15 D16 D17D8 D9 D10
D7
PHASE < 0 PHASE = 0 PHASE > 0
D6 D7
DRCLK Period
DRCLK Period
Internal Reset Synchronisation
(1 DMCLK Period)
3*DRCLK Period
3*DRCLK Period
D14
D9 D20
DRMODE =
00
; DR
DRMODE =
01
; DR
DRMODE =
10
; DR
DRMODE =
11
; DR
DRMODE =
00
; DR
DRMODE =
01
; DR
DRMODE =
10
; DR
DRMODE =
11
; DR
DRMODE =
00
; DR
DRMODE =
01
; DR
DRMODE=
10
; DR
DRMODE =
11
; DR
DRMODE =
00
: Select the lagging Data Ready
DRMODE =
01
: Select the Data Ready on Channel 0
DRMODE =
10
: Select the Data Ready on Channel 1
DRMODE =
11
: Select both Data ready
Data Ready pulse that appears only when DR_LTY =
0
DRCLK Period
1 DMCLK Period
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DS39979A-page 456 Preliminary 2010 Microchip Technology Inc.
B.6 Internal Registers
The addresses associated with the internal registers
are listed below. A detailed description of the registers
follows. All registers are 8 bits long and can be
addressed separately. Read modes define the groups
and types of registers for continuous read
communication or looping on address sets. .
TABLE B-14: REGISTER MAP GROUPING FOR CONTINUOUS READ MODES
TABLE B-13: REGISTER MAP
Address Name Bits R/W Description
0x00 DATA_CH0 24 R Channel 0 ADC Data<23:0>, MSB First
0x03 DATA_CH1 24 R Channel 1 ADC Data<23:0>, MSB First
0x06 reserved 8 Reserved; Ignore Reads, Do Not Write
0x07 PHASE 8 R/W Phase Delay Configuration Register
0x08 GAIN 8 R/W Gain Configuration Register
0x09 STATUS/COM 8 R/W Status/Communication Register
0x0A CONFIG1 8 R/W Configuration Register 1
0x0B CONFIG2 8 R/W Configuration Register 2
Function Address READ<1:0>
01”“10”“11
DATA_CH0
0x00
GROUP
TYPE
Loop Entire
Register Map
0x01
0x02
DATA_CH1
0x03
GROUP0x04
0x05
PHASE 0x07 GROUP
TYPE
GAIN 0x08
STATUS/COM 0x09
GROUPCONFIG1 0x0A
CONFIG2 0x0B
2010 Microchip Technology Inc. Preliminary DS39979A-page 457
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B.6.1 ADC CHANNEL DATA OUTPUT
REGISTERS
The ADC Channel Data Output registers always con-
tain the most recent A/D conversion data for each
channel. These registers are read-only. They can be
accessed independently as three 8-bit registers or
linked together (with READ<1:0> bits).
These registers are latched when an ADC read com-
munication occurs. When a data ready event occurs
during a read communication, the most current ADC
data is also latched to avoid data corruption issues.
The three bytes of each channel are updated synchro-
nously at a DRCLK rate. The three bytes can be
accessed separately if needed but are refreshed
synchronously.
REGISTER B-1: DATA_CHn: CHANNEL OUTPUT REGISTERS
(CH0, ADDRESSES 0x00-0x02; CH1; 0x03-0x05)
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
DATA_CHn
<23>
DATA_CHn
<22>
DATA_CHn
<21>
DATA_CHn
<20>
DATA_CHn
<19>
DATA_CHn
<18>
DATA_CHn
<17>
DATA_CHn
<16>
bit 23 bit 16
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
DATA_CHn
<15>
DATA_CHn
<14>
DATA_CHn
<13>
DATA_CHn
<12>
DATA_CHn
<11>
DATA_CHn
<10>
DATA_CHn
<9>
DATA_CHn
<8>
bit 15 bit 8
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
DATA_CHn
<7>
DATA_CHn
<6>
DATA_CHn
<5>
DATA_CHn
<4>
DATA_CHn
<3>
DATA_CHn
<2>
DATA_CHn
<1>
DATA_CHn
<0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
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DS39979A-page 458 Preliminary 2010 Microchip Technology Inc.
B.6.2 PHASE REGISTER
The PHASE register (PHASE<7:0>) is a 7 bits + sign,
MSB first, two’s complement register that indicates how
much phase delay there should be between Channel 0
and Channel 1.
The reference channel for the delay is Channel 1
(typically, the voltage channel when used in energy
metering applications) i.e., when PHASE register code
is positive, Channel 0 is lagging Channel 1.
When PHASE register code is negative, Channel 0 is
leading versus Channel 1.
The delay is give by the following formula:
EQUATION B-17:
B.6.2.1 Phase Resolution from OSR
The timing resolution of the phase delay is 1/DMCLK or
1 µs in the default configuration (MCLK = 4 MHz). The
PHASE register coding depends on the OSR setting,
as shown in Table B-15.
Delay Phase Register Code
DMCLK
--------------------------------------------------=
TABLE B-15: PHASE ENCODING
RESOLUTION BY
OVERSAMPLING RATIO
Oversampling
Ratio Encoding
OSR
<1:0> Value
#
Significant
Digits
Sign
Bit Range
00 32 7 <6:0> <7> -128 to
+127
01 64 6 <5:0> <6> -64 to +63
10 128 5 <4:0> <5> -32 to +31
11 256 4 <3:0> <4> -16 to +15
REGISTER B-2: PHASE: PHASE REGISTER (ADDRESS 0x07)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PHASE<7> PHASE<6> PHASE<5> PHASE<4> PHASE<3> PHASE<2> PHASE<1> PHASE<0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 PHASE<7-0>: CH0 Relative to CH1 Phase Delay bits
Delay = PHASE register two’s complement code/DMCLK (Default PHASE = 0)
2010 Microchip Technology Inc. Preliminary DS39979A-page 459
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B.6.3 GAIN CONFIGURATION REGISTER
This registers contains the settings for the PGA gains
for each channel, as well as the BOOST options for
each channel.
REGISTER B-3: GAIN: GAIN CONFIGURATION REGISTER (ADDRESS 0x08)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PGA_CH1
<2>
PGA_CH1
<1>
PGA_CH1
<0>
BOOST<1> BOOST<0> PGA_CH0
<2>
PGA_CH0
<1>
PGA_CH0
<0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-5 PGA_CH1<2:0>: PGA Setting for Channel 1 bits
111 = Reserved (Gain = 1)
110 = Reserved (Gain = 1)
101 = Gain is 32
100 = Gain is 16
011 = Gain is 8
010 = Gain is 4
001 = Gain is 2
000 = Gain is 1
bit 4-3 BOOST<1:0>: Current Scaling for High-Speed Operation bits
11 = Both channels have current x 2
10 = Channel 1 has current x 2
01 = Channel 0 has current x 2
00 = Neither channel has current x 2
bit 2-0 PGA_CH0<2:0>: PGA Setting for Channel 0 bits
111 = Reserved (Gain = 1)
110 = Reserved (Gain = 1)
101 = Gain is 32
100 = Gain is 16
011 = Gain is 8
010 = Gain is 4
001 = Gain is 2
000 = Gain is 1
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DS39979A-page 460 Preliminary 2010 Microchip Technology Inc.
B.6.4 STATUS AND COMMUNICATION
REGISTER
This register contains all settings related to the
communication, including data ready settings and
status, and Read mode settings.
B.6.4.1 Data Ready (DR) Latency Control
DR_LTY
This bit determines if the first data ready pulses
correspond to settled data, or unsettled data, from each
SINC3 filter. Unsettled data will provide DR pulses
every DRCLK period. If this bit is set, unsettled data will
wait for 3 DRCLK periods before giving DR pulses and
will then give DR pulses every DRCLK period.
B.6.4.2 Data Ready (DR) Pin High-Z –
DR_HIZN
This bit defines the non-active state of the Data Ready
pin (logic1’ or high-impedance). Using this bit, the
user can connect multiple chips with the same DR pin
with a pull-up resistor (DR_HIZN = 0) or a single chip
with no external component (DR_HIZN = 1).
B.6.4.3 Data Ready Mode – DRMODE<1:0>
If one of the channels is in Reset or shutdown, only one
of the data ready pulses is present and the situation is
similar to DRMODE = 01 or 10. In the 01’, ‘10’ and ‘11
modes, the ADC channel data to be read is latched at
the beginning of a reading, in order to prevent the case
of erroneous data when a DR pulse happens during a
read. In these modes the two channels are independent.
When these bits are equal to ‘11’, ‘10’ or ‘01’, they con-
trol which ADC’s data ready is present on the DR pin.
When DRMODE = 00, the Data Ready pin output is
synchronized with the lagging ADC channel (defined by
the PHASE register) and the ADCs are linked together.
In this mode, the output of the two ADCs are latched
synchronously at the moment of the DR event. This
prevents having bad synchronization between the two
ADCs. The output is also latched at the beginning of a
reading in order not to be updated during a read and
not to give erroneous data.
This mode is very useful for power metering
applications because the data from both ADCs can be
retrieved using this single data ready event which is
processed synchronously, even in case of a large
phase difference. This mode works as if there was one
ADC channel and its data would be 48 bits long, and
contain both channel data. As a consequence, if one
channel is in Reset or shutdown when DRMODE = 00,
no data ready pulse will be present at the outputs (if
both channels are not ready in this mode, the data is
not considered as ready).
See Section B.5.9 “Data Ready Pin (DR)” for more
details about Data Ready pin behavior.
B.6.4.4 DR Status Flag – DRSTATUS<1:0>
These bits indicate the DR status of both channels,
respectively. These flags are set to logic high after each
read of the STATUS/COM register. These bits are
cleared when a DR event has happened on its
respective ADC channel. Writing these bits has no
effect.
Note: These bits are useful if multiple devices
share the same DR output pin
(DR_HIZN = 0) in order to understand
from which device the DR event has
happened. This configuration can be used
for three-phase power metering systems
where all three phases share the same
Data Ready pin. In case the DRMODE = 00
(linked ADCs), these data ready status bits
will be updated synchronously upon the
same event (lagging ADC is ready). These
bits are also useful in systems where the
DR pin is not used to save MCU I/O.
2010 Microchip Technology Inc. Preliminary DS39979A-page 461
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REGISTER B-4: STATUS AND COMMUNICATION REGISTER (ADDRESS 0x09)
R/W-1 R/W-0 R/W-1 R/W-0 R/W-0 R/W-0 R-1 R-1
READ<1> READ<0> DR_LTY DR_HIZN DRMODE<1> DRMODE<0> DRSTATUS
<1>
DRSTATUS
<0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 READ: Address Loop Setting bits
11= Address counter loops on entire register map
10= Address counter loops on register TYPES (default)
01= Address counter loops on register GROUPS
00= Address not incremented, continually read same single register
bit 5 DR_LTY: Data Ready Latency Control bit
1 = “No Latency” conversion, DR pulses after 3 DRCLK periods (default)
0 = Unsettled data is available after every DRCLK period
bit 4 DR_HIZn: Data Ready Pin Inactive State Control bit
1 = The Data Ready pin default state is a logic high when data is NOT ready
0 = The Data Ready pin default state is high impedance when data is NOT ready (default)
bit 3-2 DRMODE<1:0>: Data Ready Pin (DR) Control bits
11= Both data ready pulses from ADC0 and ADC Channel 1 are output on the DR pin
10= Data ready pulses from ADC Channel 1 are output on the DR pin; DR from ADC Channel 0 are
not present on the pin
01= Data ready pulses from ADC Channel 0 are output on the DR pin; DR from ADC Channel 1 are
not present on the pin
00= Data ready pulses from the lagging ADC between the two are output on the DR pin; the lagging
ADC selection depends on the PHASE register and on the OSR (default)
bit 1-0 DRSTATUS<1:0>: Data Ready Status bits
11= ADC Channel 1 and Channel 0 data not ready (default)
10= ADC Channel 1 data not ready, ADC Channel 0 data ready
01= ADC Channel 0 data not ready, ADC Channel 1 data ready
00= ADC Channel 1 and Channel 0 data ready
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DS39979A-page 462 Preliminary 2010 Microchip Technology Inc.
B.6.5 CONFIGURATION REGISTERS
The Configuration registers contain settings for the
internal clock prescaler, the oversampling ratio, the
Channel 0 and Channel 1 width settings, the state of
the channel Resets and shutdowns, the dithering algo-
rithm control (for Idle tones suppression), and the
control bits for the external VREF and external CLK.
REGISTER B-5: CONFIG1: CONFIGURATION REGISTER 1: (ADDRESS 0x0A)
R/W-0 R/W-0 R/W-0 R/W-1 R/W-0 R/W-0 r-0 r-0
PRESCALE
<1>
PRESCALE
<0>
OSR<1> OSR<0> WIDTH<1> WIDTH<0> r r
bit 7 bit 0
Legend: r = Reserved bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 PRESCALE<1:0>: Internal Master Clock (AMCLK) Prescaler Value bits
11 = AMCLK = MCLK/8
10 = AMCLK = MCLK/4
01 = AMCLK = MCLK/2
00 = AMCLK = MCLK (default)
bit 5-4 OSR<1:0>: Oversampling Ratio for Delta-Sigma A/D Conversion bits (all channels, DMCLK/DRCLK)
11 = 256
10 = 128
01 = 64 (default)
00 = 32
bit 3-2 WIDTH<1:0>: ADC Channel Output Data Word Width bits
11 = 24-bit mode on both channels
10 = 24-bit mode on Channel 1, 16-bit mode on Channel 0
01 = 16-bit mode on Channel 1, 24-bit mode on Channel 0
00 = 16 bit mode on both channels (default)
bit 1-0 Reserved: Maintain as ‘0
2010 Microchip Technology Inc. Preliminary DS39979A-page 463
PIC18F87J72 FAMILY
REGISTER B-6: CONFIG2: CONFIGURATION REGISTER 2 (ADDRESS 0x0B)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-1 R/W-0 r-0
RESET_CH1 RESET_CH0 SHUTDOWN
<1>
SHUTDOWN
<0>
DITHER<1> DITHER<0>
VREFEXT r
bit 7 bit 0
Legend: r = Reserved bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 RESET<1:0>: Reset Mode Setting for ADCs bits
11 = Both CH0 and CH1 ADC are in Reset mode
10 = CH1 ADC in Reset mode
01 = CH0 ADC in Reset mode
00 = Neither Channel in Reset mode (default)
bit 5-4 SHUTDOWN<1:0>: Shutdown Mode Setting for ADCs bits
11 = Both CH0 and CH1 ADC are in Shutdown
10 = CH1 ADC is in Shutdown
01 = CH0 ADC is in Shutdown
00 = Neither Channel in Shutdown(default)
bit 3-2 DITHER<1:0>: Control for Dithering Circuit bits
11 = Both CH0 and CH1 ADC have dithering circuit applied (default)
10 = Only CH1 ADC has dithering circuit applied
01 = Only CH0 ADC has dithering circuit applied
00 = Neither channel has dithering circuit applied
bit 1 VREFEXT: Internal Voltage Reference Shutdown Control bit
1 = Internal Voltage reference disabled; an external voltage reference must be placed between
REFIN+/OUT and REFIN-
0 = Internal voltage reference enabled (default)
bit 0 Reserved: Resets as0’; program as ‘1’ after any Reset event
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DS39979A-page 464 Preliminary 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. Preliminary DS39979A-page 465
PIC18F87J72 FAMILY
INDEX
A
A/D
A/D Converter Interrupt, Configuring ........................ 277
Acquisition Requirements ......................................... 278
ADCAL Bit................................................................. 281
ADCON0 Register..................................................... 273
ADCON1 Register..................................................... 273
ADCON2 Register..................................................... 273
ADRESH Register............................................. 273, 276
ADRESL Register ..................................................... 273
Analog Port Pins, Configuring................................... 279
Associated Registers ................................................ 281
Configuring the Module............................................. 277
Conversion Clock (TAD) ............................................ 279
Conversion Status (GO/DONE Bit) ........................... 276
Conversions .............................................................. 280
Converter Calibration................................................ 281
Converter Characteristics ......................................... 421
Operation in Power-Managed Modes ....................... 281
Overview ................................................................... 273
Selecting and Configuring Automatic
Acquisition Time ............................................... 279
Special Event Trigger (CCP)..................................... 280
Use of the CCP2 Trigger........................................... 280
Absolute Maximum Ratings .............................................. 389
AC (Timing) Characteristics .............................................. 404
Load Conditions for Device Timing
Specifications.................................................... 405
Parameter Symbology .............................................. 404
Temperature and Voltage Specifications .................. 405
Timing Conditions ..................................................... 405
ACKSTAT ......................................................................... 229
ACKSTAT Status Flag ...................................................... 229
ADCAL Bit......................................................................... 281
ADCON0 Register............................................................. 273
GO/DONE Bit............................................................ 276
ADCON1 Register............................................................. 273
ADCON2 Register............................................................. 273
ADDFSR ........................................................................... 377
ADDLW ............................................................................. 340
Addressable Universal Synchronous Asynchronous
Receiver Transmitter (AUSART). See AUSART.
ADDULNK......................................................................... 377
ADDWF............................................................................. 340
ADDWFC .......................................................................... 341
ADRESH Register............................................................. 273
ADRESL Register ..................................................... 273, 276
AFE
Analog Inputs ............................................................ 284
Block Diagram........................................................... 435
Boost Mode............................................................... 444
Data Ready Pin (DR) ................................................ 454
Delta-Sigma ADC Architecture ................................. 284
Block Diagram .................................................. 444
Delta-Sigma Modulator ............................................. 444
Electrical Characteristics................................... 423–425
External Voltage Reference ...................................... 447
Internal Clock Chain.................................................. 449
Internal Registers...................................................... 456
Internal Voltage Reference ............................... 284, 447
Output Coding........................................................... 445
Output Data Rates (table) ......................................... 439
Phase Delay Block............................................ 284, 448
Power-On Reset ....................................................... 447
Programmable Gain Amplifiers................................. 284
Register Map .................................................... 285, 456
Registers
CONFIG1.......................................................... 462
CONFIG2.......................................................... 463
DATA_CHn....................................................... 457
GAIN................................................................. 459
PHASE ............................................................. 458
STATUS/COM.................................................. 461
Required Connections .............................................. 287
Resolution................................................................. 446
Serial Interface ................................................. 286, 449
Continuous Communication ............................. 452
Serial Interface Characteristics................................. 426
SINC3 Filter ...................................................... 284, 444
Terminology...................................................... 438–443
Using ........................................................................ 288
Voltage Reference.................................................... 447
Analog-to-Digital Converter. See A/D.
ANDLW............................................................................. 341
ANDWF............................................................................. 342
Assembler
MPASM Assembler .................................................. 386
AUSART
Asynchronous Mode................................................. 264
Associated Registers, Receive......................... 267
Associated Registers, Transmit........................ 265
Receiver ........................................................... 266
Setting up 9-Bit Mode with
Address Detect......................................... 266
Transmitter ....................................................... 264
Baud Rate Generator (BRG) .................................... 262
Associated Registers........................................ 262
Baud Rate Error, Calculating............................ 262
Baud Rates, Asynchronous Modes .................. 263
High Baud Rate Select (BRGH Bit) .................. 262
Operation in Power-Managed Modes............... 262
Sampling .......................................................... 262
Synchronous Master Mode....................................... 268
Associated Registers, Receive......................... 270
Associated Registers, Transmit........................ 269
Reception ......................................................... 270
Transmission .................................................... 268
Synchronous Slave Mode......................................... 271
Associated Registers, Receive......................... 272
Associated Registers, Transmit........................ 271
Reception ......................................................... 272
Transmission .................................................... 271
B
Baud Rate Generator ....................................................... 225
BC..................................................................................... 342
BCF .................................................................................. 343
BF ..................................................................................... 229
BF Status Flag.................................................................. 229
Bias Generation (LCD)
Charge Pump Design Considerations ...................... 177
Block Diagrams
A/D............................................................................ 276
AFE, Required Connections ..................................... 287
Analog Input Model................................................... 277
AUSART Receive ..................................................... 266
AUSART Transmit .................................................... 264
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DS39979A-page 466 Preliminary 2010 Microchip Technology Inc.
Baud Rate Generator................................................ 225
Capture Mode Operation .......................................... 160
Comparator Analog Input Model ............................... 297
Comparator I/O Operating Modes............................. 294
Comparator Output ...................................................296
Comparator Voltage Reference ................................ 300
Comparator Voltage Reference Output
Buffer Example ................................................. 301
Compare Mode Operation ........................................ 161
Connections for On-Chip Voltage Regulator............. 327
CTMU........................................................................ 303
CTMU Current Source Calibration Circuit................. 306
CTMU Typical Connections and Internal
Configuration for Pulse Delay Generation ........ 314
CTMU Typical Connections and Internal
Configuration for Time Measurement ............... 313
Delta-Sigma ADC (Simplified)................................... 444
Device Clock ............................................................... 25
Dual-Channel AFE .................................................... 435
EUSART Receive .....................................................250
EUSART Transmit .................................................... 248
External Power-on Reset Circuit
(Slow VDD Power-up).......................................... 45
Fail-Safe Clock Monitor (FSCM) ...............................329
Generic I/O Port Operation ....................................... 105
Interrupt Logic .............................................................90
LCD Clock Generation .............................................. 172
LCD Driver Module ................................................... 167
LCD Regulator Connections (M0 and M1)................ 174
MSSP (I2C Master Mode) ......................................... 223
MSSP (I2C Mode) ..................................................... 204
MSSP (SPI Mode)..................................................... 195
On-Chip Reset Circuit .................................................43
PIC18F8XJ72.............................................................. 12
PLL.............................................................................. 30
PWM Operation (Simplified) ..................................... 163
Reads From Flash Program Memory.......................... 81
Resistor Ladder Connections for
M2 Configuration............................................... 175
Resistor Ladder Connections for
M3 Configuration............................................... 176
RTCC ........................................................................ 139
Single Comparator ....................................................295
SPI Master/Slave Connection ................................... 199
Table Read Operation.................................................77
Table Write Operation.................................................78
Table Writes to Flash Program Memory ..................... 83
Timer0 in 16-Bit Mode............................................... 124
Timer0 in 8-Bit Mode.................................................124
Timer1 (16-Bit Read/Write Mode) ............................. 128
Timer1 (8-Bit Mode) .................................................. 128
Timer2....................................................................... 134
Timer3 (16-Bit Read/Write Mode) ............................. 136
Timer3 (8-Bit Mode) .................................................. 136
Watchdog Timer........................................................ 325
BN ..................................................................................... 343
BNC................................................................................... 344
BNN................................................................................... 344
BNOV ................................................................................ 345
BNZ ................................................................................... 345
BOR. See Brown-out Reset.
BOV................................................................................... 348
BRA................................................................................... 346
Break Character (12-Bit) Transmit and Receive ............... 253
BRG. See Baud Rate Generator.
BRGH Bit
TXSTA1 Register...................................................... 243
TXSTA2 Register...................................................... 262
Brown-out Reset (BOR)...................................................... 45
and On-Chip Voltage Regulator................................ 328
Detecting .................................................................... 45
BSF................................................................................... 346
BTFSC .............................................................................. 347
BTFSS .............................................................................. 347
BTG .................................................................................. 348
BZ ..................................................................................... 349
C
C Compilers
MPLAB C18.............................................................. 386
CALL................................................................................. 349
CALLW ............................................................................. 378
Capture (CCP Module) ..................................................... 160
Associated Registers ................................................ 162
CCP Pin Configuration.............................................. 160
CCPR2H:CCPR2L Registers.................................... 160
Software Interrupt ..................................................... 160
Timer1/Timer3 Mode Selection................................. 160
Capture/Compare/PWM (CCP) ........................................ 157
Capture Mode. See Capture.
CCP Mode and Timer Resources............................. 158
CCPRxH Register..................................................... 158
CCPRxL Register ..................................................... 158
Compare Mode. See Compare.
Configuration ............................................................ 158
Interaction of CCP1 and CCP2 for
Timer Resources .............................................. 159
Interconnect Configurations...................................... 158
Charge Time Measurement Unit (CTMU)......................... 303
Associated Registers ................................................ 317
Calibrating the Module.............................................. 305
Creating a Delay ....................................................... 314
Effects of a Reset ..................................................... 314
Measuring Capacitance with the CTMU ................... 311
Measuring Time........................................................ 313
Module Initialization .................................................. 305
Operation.................................................................. 304
During Sleep and Idle Modes ........................... 314
CLKIA ................................................................................. 20
Clock Sources..................................................................... 27
Default System Clock on Reset.................................. 28
Selection Using OSCCON Register............................ 28
CLRF ................................................................................ 350
CLRWDT .......................................................................... 350
Code Examples
16 x 16 Signed Multiply Routine ................................. 88
16 x 16 Unsigned Multiply Routine ............................. 88
8 x 8 Signed Multiply Routine ..................................... 87
8 x 8 Unsigned Multiply Routine ................................. 87
AFE Clock Source and Interrupt Configuration......... 290
Capacitance Calibration Routine .............................. 310
Changing Between Capture Prescalers.................... 160
Computed GOTO Using an Offset Value.................... 59
Current Calibration Routine ...................................... 308
Erasing a Flash Program Memory Row...................... 82
Fast Register Stack .................................................... 59
How to Clear RAM (Bank 1) Using Indirect Addressing .
71
2010 Microchip Technology Inc. Preliminary DS39979A-page 467
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Implementing a Real-Time Clock Using a
Timer1 Interrupt Service ................................... 131
Initializing PORTA..................................................... 106
Initializing PORTB..................................................... 108
Initializing PORTC..................................................... 111
Initializing PORTD..................................................... 114
Initializing PORTE..................................................... 116
Initializing PORTF..................................................... 118
Initializing PORTG .................................................... 121
Initializing the MSSP Module for Using the AFE....... 290
Loading the SSPBUF (SSPSR) Register.................. 198
Overall Structure for Using the AFE.......................... 289
Reading a Flash Program Memory Word ................... 81
Reading Data From AFE During Interrupt................. 292
Routine for Capacitive Touch Switch ........................ 312
Saving STATUS, WREG and BSR
Registers in RAM.............................................. 104
Setting the RTCWREN Bit ........................................ 151
Setup for CTMU Calibration Routines....................... 307
Single-Word Write to Flash Program Memory ............ 85
Writing and Reading AFE Registers
Through MSSP ................................................. 291
Writing to Flash Program Memory .............................. 84
Code Protection ................................................................ 319
COMF ............................................................................... 351
Comparator ....................................................................... 293
Analog Input Connection Considerations.................. 297
Associated Registers ................................................ 297
Configuration............................................................. 294
Effects of a Reset...................................................... 296
Interrupts................................................................... 296
Operation .................................................................. 295
Operation During Sleep ............................................ 296
Outputs ..................................................................... 295
Reference ................................................................. 295
External Signal.................................................. 295
Internal Signal................................................... 295
Response Time......................................................... 295
Comparator Specifications................................................ 403
Comparator Voltage Reference ........................................ 299
Accuracy and Error ................................................... 300
Associated Registers ................................................ 301
Configuring................................................................ 299
Connection Considerations....................................... 300
Effects of a Reset...................................................... 300
Operation During Sleep ............................................ 300
Compare (CCP Module) ................................................... 161
Associated Registers ................................................ 162
CCP Pin Configuration.............................................. 161
CCPR2 Register ....................................................... 161
Software Interrupt ..................................................... 161
Special Event Trigger................................ 137, 161, 280
Timer1/Timer3 Mode Selection................................. 161
Computed GOTO................................................................ 59
Configuration Bits.............................................................. 319
Configuration Mismatch (CM) ............................................. 45
Configuration Register Protection ..................................... 331
Core Features
Easy Migration .............................................................. 9
Extended Instruction Set............................................... 9
Memory Options............................................................ 9
nanoWatt Technology ................................................... 9
Oscillator Options and Features ................................... 9
CPFSEQ ........................................................................... 351
CPFSGT ........................................................................... 352
CPFSLT............................................................................ 352
Crystal Oscillator/Ceramic Resonator................................. 29
Customer Change Notification Service............................. 475
Customer Notification Service .......................................... 475
Customer Support............................................................. 475
D
Data Addressing Modes ..................................................... 71
Comparing Addressing Modes with the
Extended Instruction Set Enabled ...................... 75
Direct .......................................................................... 71
Indexed Literal Offset ................................................. 74
BSR .................................................................... 76
Instructions Affected ........................................... 74
Mapping Access Bank ........................................ 76
Indirect........................................................................ 71
Inherent and Literal..................................................... 71
Data Memory ...................................................................... 62
Access Bank ............................................................... 64
Bank Select Register (BSR) ....................................... 62
Extended Instruction Set ............................................ 74
General Purpose Registers ........................................ 64
Memory Maps
PIC18F86J72/87J72 Devices ............................. 63
Special Function Registers................................. 65
Special Function Registers......................................... 65
DAW ................................................................................. 353
DC Characteristics............................................................ 400
Power-Down and Supply Current ............................. 392
Supply Voltage ......................................................... 391
DCFSNZ ........................................................................... 354
DECF ................................................................................ 353
DECFSZ ........................................................................... 354
Default System Clock ......................................................... 28
Details on Individual Family Members................................ 11
Development Support....................................................... 385
Device Overview................................................................... 9
Features (80-Pin Devices).......................................... 11
Direct Addressing ............................................................... 72
Dual-Channel Analog Front End (AFE) ............................ 434
Dual-Channel Analog Front End (AFE). See AFE.
E
Effect on Standard PIC18 Instructions.............................. 381
Effects of Power-Managed Modes on Various
Clock Sources ............................................................ 33
Electrical Characteristics .................................................. 389
Enhanced Universal Synchronous Asynchronous Receiver
Transmitter (EUSART). See EUSART.
ENVREG Pin .................................................................... 327
Equations
A/D Acquisition Time ................................................ 278
A/D Minimum Charging Time ................................... 278
Calculating the Minimum Required
Acquisition Time ............................................... 278
LCD Static and Dynamic Current ............................. 177
Errata .................................................................................... 7
EUSART
Asynchronous Mode................................................. 248
12-Bit Break Transmit and Receive.................. 253
Associated Registers, Receive......................... 251
Associated Registers, Transmit........................ 249
Auto-Wake-up on Sync Break Character ......... 252
Receiver ........................................................... 250
Setting up 9-Bit Mode with Address Detect ...... 250
Transmitter ....................................................... 248
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DS39979A-page 468 Preliminary 2010 Microchip Technology Inc.
Baud Rate Generator (BRG)..................................... 243
Auto-Baud Rate Detect ..................................... 246
Baud Rate Error, Calculating ............................ 243
Baud Rates, Associated Registers ................... 243
Baud Rates, Asynchronous Modes................... 244
High Baud Rate Select (BRGH Bit)................... 243
Operation in Power-Managed Modes ............... 243
Sampling ........................................................... 243
Synchronous Master Mode ....................................... 254
Associated Registers, Receive ......................... 256
Associated Registers, Transmit ........................ 255
Reception.......................................................... 256
Transmission..................................................... 254
Synchronous Slave Mode ......................................... 257
Associated Registers, Receive ......................... 258
Associated Registers, Transmit ........................ 257
Reception.......................................................... 258
Transmission..................................................... 257
Extended Instruction Set
ADDFSR ................................................................... 377
ADDULNK................................................................. 377
CALLW...................................................................... 378
MOVSF ..................................................................... 378
MOVSS ..................................................................... 379
PUSHL ...................................................................... 379
SUBFSR ................................................................... 380
SUBULNK ................................................................. 380
External Oscillator Modes
Clock Input (EC and ECPLL Modes) .......................... 30
HS ............................................................................... 29
F
Fail-Safe Clock Monitor............................................. 319, 329
Exiting Fail-Safe Operation ....................................... 330
Interrupts in Power-Managed Modes ........................ 330
POR or Wake-up From Sleep ................................... 330
WDT During Oscillator Failure .................................. 329
Fast Register Stack............................................................. 59
Firmware Instructions........................................................333
Flash Configuration Words................................................ 319
Flash Program Memory.......................................................77
Associated Registers .................................................. 86
Control Registers ........................................................78
EECON1 and EECON2 ...................................... 78
TABLAT (Table Latch) Register.......................... 80
TBLPTR (Table Pointer) Register.......................80
Erase Sequence ......................................................... 82
Erasing........................................................................ 82
Operation During Code-Protect .................................. 86
Reading....................................................................... 81
Table Pointer
Boundaries Based on Operation......................... 80
Table Pointer Boundaries ........................................... 80
Table Reads and Table Writes ...................................77
Write Sequence .......................................................... 83
Write Sequence (Word Programming) ........................ 85
Writing......................................................................... 83
Unexpected Termination..................................... 86
Write Verify ......................................................... 86
FSCM. See Fail-Safe Clock Monitor.
G
GOTO................................................................................ 355
H
Hardware Multiplier............................................................. 87
8 x 8 Multiplication Algorithms .................................... 87
Operation.................................................................... 87
Performance Comparison (table)................................ 87
I
I/O Ports............................................................................ 105
Input Voltage Considerations.................................... 105
Open-Drain Outputs.................................................. 106
Output Pin Drive ....................................................... 105
Pin Capabilities......................................................... 105
Pull-up Configuration ................................................ 106
I2C Mode (MSSP)............................................................. 204
Acknowledge Sequence Timing ............................... 232
Associated Registers ................................................ 238
Baud Rate Generator ............................................... 225
Bus Collision
During a Repeated Start Condition................... 236
During a Stop Condition ................................... 237
Clock Arbitration ....................................................... 226
Clock Stretching........................................................ 218
10-Bit Slave Receive Mode (SEN = 1) ............. 218
10-Bit Slave Transmit Mode ............................. 218
7-Bit Slave Receive Mode (SEN = 1) ............... 218
7-Bit Slave Transmit Mode ............................... 218
Clock Synchronization and the CKP Bit.................... 219
Effects of a Reset ..................................................... 233
General Call Address Support .................................. 222
I2C Clock Rate w/BRG.............................................. 225
Master Mode............................................................. 223
Baud Rate Generator ....................................... 225
Operation.......................................................... 224
Reception ......................................................... 229
Repeated Start Condition Timing ..................... 228
Start Condition Timing ...................................... 227
Transmission .................................................... 229
Multi-Master Communication, Bus Collision
and Arbitration .................................................. 233
Multi-Master Mode.................................................... 233
Operation.................................................................. 209
Read/Write Bit Information (R/W Bit)................ 209, 211
Registers .................................................................. 204
Serial Clock (SCK/SCL)............................................ 211
Slave Mode............................................................... 209
Address Masking .............................................. 210
Addressing........................................................ 209
Reception ......................................................... 211
Transmission .................................................... 211
Sleep Operation........................................................ 233
Stop Condition Timing .............................................. 232
INCF ................................................................................. 355
INCFSZ............................................................................. 356
In-Circuit Debugger........................................................... 331
In-Circuit Serial Programming (ICSP)....................... 319, 331
Indexed Literal Offset Addressing
and Standard PIC18 Instructions.............................. 381
Indexed Literal Offset Mode.............................................. 381
Indirect Addressing ............................................................. 72
INFSNZ............................................................................. 356
Initialization Conditions for all Registers ....................... 49–54
Instruction Cycle ................................................................. 60
Clocking Scheme........................................................ 60
Flow/Pipelining............................................................ 60
2010 Microchip Technology Inc. Preliminary DS39979A-page 469
PIC18F87J72 FAMILY
Instruction Set ................................................................... 333
ADDLW ..................................................................... 340
ADDWF..................................................................... 340
ADDWF (Indexed Literal Offset Mode) ..................... 382
ADDWFC .................................................................. 341
ANDLW ..................................................................... 341
ANDWF..................................................................... 342
BC ............................................................................. 342
BCF........................................................................... 343
BN ............................................................................. 343
BNC .......................................................................... 344
BNN .......................................................................... 344
BNOV........................................................................ 345
BNZ........................................................................... 345
BOV .......................................................................... 348
BRA........................................................................... 346
BSF ........................................................................... 346
BSF (Indexed Literal Offset Mode) ........................... 382
BTFSC ...................................................................... 347
BTFSS ...................................................................... 347
BTG........................................................................... 348
BZ ............................................................................. 349
CALL ......................................................................... 349
CLRF......................................................................... 350
CLRWDT................................................................... 350
COMF ....................................................................... 351
CPFSEQ ................................................................... 351
CPFSGT ................................................................... 352
CPFSLT .................................................................... 352
DAW.......................................................................... 353
DCFSNZ ................................................................... 354
DECF ........................................................................ 353
DECFSZ.................................................................... 354
Extended Instructions ............................................... 376
Considerations when Enabling ......................... 381
Syntax............................................................... 376
Use with MPLAB IDE Tools .............................. 383
General Format......................................................... 336
GOTO ....................................................................... 355
INCF.......................................................................... 355
INCFSZ ..................................................................... 356
INFSNZ ..................................................................... 356
IORLW ...................................................................... 357
IORWF ...................................................................... 357
LFSR......................................................................... 358
MOVF........................................................................ 358
MOVFF ..................................................................... 359
MOVLB ..................................................................... 359
MOVLW .................................................................... 360
MOVWF .................................................................... 360
MULLW ..................................................................... 361
MULWF..................................................................... 361
NEGF ........................................................................ 362
NOP .......................................................................... 362
Opcode Field Descriptions........................................ 334
POP .......................................................................... 363
PUSH ........................................................................ 363
RCALL ...................................................................... 364
RESET ...................................................................... 364
RETFIE ..................................................................... 365
RETLW ..................................................................... 365
RETURN ................................................................... 366
RLCF......................................................................... 366
RLNCF ...................................................................... 367
RRCF ........................................................................ 367
RRNCF ..................................................................... 368
SETF ........................................................................ 368
SETF (Indexed Literal Offset Mode)......................... 382
SLEEP ...................................................................... 369
Standard Instructions................................................ 333
SUBFWB .................................................................. 369
SUBLW..................................................................... 370
SUBWF..................................................................... 370
SUBWFB .................................................................. 371
SWAPF..................................................................... 371
TBLRD...................................................................... 372
TBLWT ..................................................................... 373
TSTFSZ .................................................................... 374
XORLW .................................................................... 374
XORWF .................................................................... 375
INTCON Register
RBIF Bit .................................................................... 108
Inter-Integrated Circuit. See I2C Mode.
Internal LCD Voltage Regulator Specifications................. 403
Internal Oscillator Block ...................................................... 31
Adjustment.................................................................. 32
INTIO Modes .............................................................. 31
INTOSC Frequency Drift ............................................ 32
INTOSC Output Frequency ........................................ 32
INTPLL Modes............................................................ 31
Internal RC Oscillator
Use with WDT........................................................... 325
Internal Voltage Regulator Specifications......................... 403
Internet Address ............................................................... 475
Interrupt Sources .............................................................. 319
A/D Conversion Complete ........................................ 277
Capture Complete (CCP) ......................................... 160
Compare Complete (CCP) ....................................... 161
Interrupt-on-Change (RB7:RB4)............................... 108
TMR0 Overflow......................................................... 125
TMR2 to PR2 Match (PWM)..................................... 163
TMR3 Overflow......................................................... 137
Interrupts ............................................................................ 89
During, Context Saving............................................. 104
Interrupt-on-Change (RB7:RB4) Flag
(RBIF Bit).......................................................... 108
INTx Pin.................................................................... 104
PORTB, Interrupt-on-Change................................... 104
TMR0........................................................................ 104
INTOSC, INTRC. See Internal Oscillator Block.
IORLW .............................................................................. 357
IORWF.............................................................................. 357
L
LCD
Associated Registers ................................................ 193
Bias Generation........................................................ 173
Bias Configurations .......................................... 174
M0 and M1 ............................................... 174
M2 ............................................................ 175
M3 ............................................................ 176
Bias Types........................................................ 173
Voltage Regulator............................................. 173
Charge Pump ................................................... 174, 177
Clock Source Selection ............................................ 172
Configuring the Module ............................................ 192
Frame Frequency ..................................................... 178
Interrupts .................................................................. 190
LCDCON Register .................................................... 168
LCDDATA Register .................................................. 168
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DS39979A-page 470 Preliminary 2010 Microchip Technology Inc.
LCDPS Register........................................................ 168
LCDREG Register.....................................................168
LCDSE Register........................................................ 168
Multiplex Types ......................................................... 177
Operation During Sleep ............................................191
Pixel Control..............................................................177
Segment Enables...................................................... 177
Waveform Generation............................................... 178
LCD Driver ..........................................................................10
LCDCON Register............................................................. 168
LCDDATA Register ........................................................... 168
LCDPS Register................................................................168
LCDREG Register.............................................................168
LCDSE Register................................................................168
LFSR ................................................................................. 358
Liquid Crystal Display (LCD) Driver ..................................167
Low-Voltage Detection ...................................................... 327
M
Master Clear (MCLR) .......................................................... 45
Master Synchronous Serial Port (MSSP). See MSSP.
Memory Organization.......................................................... 55
Data Memory .............................................................. 62
Program Memory ........................................................ 55
Memory Programming Requirements ............................... 402
Microchip Internet Web Site .............................................. 475
MOVF................................................................................ 358
MOVFF.............................................................................. 359
MOVLB.............................................................................. 359
MOVLW............................................................................. 360
MOVSF ............................................................................. 378
MOVSS ............................................................................. 379
MOVWF ............................................................................ 360
MPLAB ASM30 Assembler, Linker, Librarian ................... 386
MPLAB Integrated Development
Environment Software...............................................385
MPLAB PM3 Device Programmer..................................... 388
MPLAB REAL ICE In-Circuit Emulator System.................387
MPLINK Object Linker/MPLIB Object Librarian ................386
MSSP
ACK Pulse......................................................... 209, 211
Control Registers (general)....................................... 195
Module Overview ...................................................... 195
SSPBUF Register .....................................................200
SSPSR Register .......................................................200
MULLW ............................................................................. 361
MULWF ............................................................................. 361
N
NEGF ................................................................................ 362
NOP .................................................................................. 362
O
Oscillator Configuration.......................................................25
EC ............................................................................... 25
ECPLL......................................................................... 25
HS ............................................................................... 25
HSPLL......................................................................... 25
Internal Oscillator Block .............................................. 31
INTIO1 ........................................................................ 25
INTIO2 ........................................................................ 25
INTPLL1...................................................................... 25
INTPLL2...................................................................... 25
Oscillator Selection ........................................................... 319
Oscillator Start-up Timer (OST) .......................................... 33
Oscillator Switching............................................................. 27
Oscillator Transitions .......................................................... 28
Oscillator, Timer1...................................................... 127, 137
Oscillator, Timer3.............................................................. 135
P
Packaging ......................................................................... 429
Details....................................................................... 430
Marking ..................................................................... 429
Pin Functions
AVDD........................................................................... 19
AVSS ........................................................................... 19
CH0+/CH0- ................................................................. 20
CH1+/CH1- ................................................................. 20
CSA ............................................................................ 20
DR .............................................................................. 20
ENVREG .................................................................... 19
MCLR ......................................................................... 13
OSC1/CLKI/RA7......................................................... 13
OSC2/CLKO/RA6 ....................................................... 13
RA0/AN0..................................................................... 13
RA1/AN1/SEG18 ........................................................ 13
RA2/AN2/VREF- .......................................................... 13
RA3/AN3/VREF+ ......................................................... 13
RA4/T0CKI/SEG14..................................................... 13
RA5/AN4/SEG15 ........................................................ 13
RB0/INT0/SEG30 ....................................................... 14
RB1/INT1/SEG8 ......................................................... 14
RB2/INT2/SEG9/CTED1............................................. 14
RB3/INT3/SEG10/CTED2........................................... 14
RB4/KBI0/SEG11 ....................................................... 14
RB5/KBI1/SEG29 ....................................................... 14
RB6/KBI2/PGC ........................................................... 14
RB7/KBI3/PGD ........................................................... 14
RC0/T1OSO/T13CKI .................................................. 15
RC1/T1OSI/CCP2/SEG32.......................................... 15
RC2/CCP1/SEG13 ..................................................... 15
RC3/SCK/SCL/SEG17................................................ 15
RC4/SDI/SDA/SEG16................................................. 15
RC5/SDO/SEG12 ....................................................... 15
RC6/TX1/CK1/SEG27 ................................................ 15
RC7/RX1/DT1/SEG28 ................................................ 15
RD0/SEG0/CTPLS ..................................................... 16
RD0/SEG1.................................................................. 16
RD2/SEG2.................................................................. 16
RD3/SEG3.................................................................. 16
RD4/SEG4.................................................................. 16
RD5/SEG5.................................................................. 16
RD6/SEG6.................................................................. 16
RD7/SEG7.................................................................. 16
RE0/LCDBIAS1 .......................................................... 17
RE1/LCDBIAS2 .......................................................... 17
RE2/LCDBIAS3 .......................................................... 17
RE3/COM0 ................................................................. 17
RE4/COM1 ................................................................. 17
RE5/COM2 ................................................................. 17
RE6/COM3 ................................................................. 17
RE7/CCP2/SEG31...................................................... 17
REFIN-........................................................................ 20
REFIN+/OUT .............................................................. 20
RESET........................................................................ 20
RF1/AN6/C2OUT/SEG19 ........................................... 18
RF2/AN7/C1OUT/SEG20 ........................................... 18
RF3/AN8/SEG21/C2INB............................................. 18
RF4/AN9/SEG22/C2INA............................................. 18
RF5/AN10/CVREF/SEG23/C1INB ............................... 18
RF6/AN11/SEG24/C1INA........................................... 18
2010 Microchip Technology Inc. Preliminary DS39979A-page 471
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RF7/AN5/SS/SEG25................................................... 18
RG0/LCDBIAS0 .......................................................... 19
RG1/TX2/CK2 ............................................................. 19
RG2/RX2/DT2/VLCAP1................................................ 19
RG3/VLCAP2................................................................ 19
RG4/SEG26/RTCC ..................................................... 19
SAVDD......................................................................... 20
SAVSS ......................................................................... 20
SCKA .......................................................................... 20
SDIA............................................................................ 20
SDOA.......................................................................... 20
SVDD ........................................................................... 20
SVSS ........................................................................... 20
VDD ............................................................................. 19
VDDCORE/VCAP............................................................ 19
VSS.............................................................................. 19
Pinout I/O Descriptions ....................................................... 13
PLL...................................................................................... 30
HSPLL and ECPLL Oscillator Modes ......................... 30
Use with INTOSC........................................................ 30
POP .................................................................................. 363
POR. See Power-on Reset.
PORTA
Associated Registers ................................................ 107
LATA Register........................................................... 106
PORTA Register ....................................................... 106
TRISA Register ......................................................... 106
PORTB
Associated Registers ................................................ 110
LATB Register........................................................... 108
PORTB Register ....................................................... 108
RB7:RB4 Interrupt-on-Change Flag (RBIF Bit)......... 108
TRISB Register ......................................................... 108
PORTC
Associated Registers ................................................ 113
LATC Register .......................................................... 111
PORTC Register ....................................................... 111
RC3/SCK/SCL/SEG17 Pin........................................ 211
TRISC Register......................................................... 111
PORTD
Associated Registers ................................................ 115
LATD Register .......................................................... 114
PORTD Register ....................................................... 114
TRISD Register......................................................... 114
PORTE
Associated Registers ................................................ 117
LATE Register........................................................... 116
PORTE Register ....................................................... 116
TRISE Register ......................................................... 116
PORTF
Associated Registers ................................................ 120
LATF Register........................................................... 118
PORTF Register ....................................................... 118
TRISF Register ......................................................... 118
PORTG
Associated Registers ................................................ 122
LATG Register .......................................................... 121
PORTG Register....................................................... 121
TRISG Register......................................................... 121
Power-Managed Modes...................................................... 35
and SPI Operation .................................................... 203
Clock Sources............................................................. 35
Clock Transitions and Status Indicators...................... 36
Entering....................................................................... 35
Exiting Idle and Sleep Modes ..................................... 41
By Interrupt ......................................................... 41
By Reset............................................................. 41
By WDT Time-out ............................................... 41
Without an Oscillator Start-up Delay .................. 41
Idle Modes .................................................................. 39
PRI_IDLE ........................................................... 40
RC_IDLE ............................................................ 41
SEC_IDLE .......................................................... 40
Multiple Sleep Commands.......................................... 36
Run Modes ................................................................. 36
PRI_RUN............................................................ 36
RC_RUN............................................................. 38
SEC_RUN .......................................................... 36
Selecting..................................................................... 35
Sleep Mode ................................................................ 39
OSC1 and OSC2 Pin States............................... 33
Summary (table) ......................................................... 35
Power-on Reset (POR)....................................................... 45
Power-up Delays ................................................................ 33
Power-up Timer (PWRT) .............................................. 33, 46
Time-out Sequence .................................................... 46
Prescaler, Capture............................................................ 160
Prescaler, Timer0 ............................................................. 125
Prescaler, Timer2 ............................................................. 164
PRI_IDLE Mode.................................................................. 40
PRI_RUN Mode.................................................................. 36
Program Counter ................................................................ 57
PCL, PCH and PCU Registers ................................... 57
PCLATH and PCLATU Registers ............................... 57
Program Memory
Extended Instruction Set ............................................ 73
Flash Configuration Words ......................................... 56
Hard Memory Vectors................................................. 56
Instructions ................................................................. 61
Two-Word ........................................................... 61
Interrupt Vector........................................................... 56
Look-up Tables........................................................... 59
Memory Maps ............................................................. 55
Hard Vectors and Configuration Words.............. 56
Reset Vector............................................................... 56
Program Verification and Code Protection ....................... 331
Programming, Device Instructions.................................... 333
Pulse-Width Modulation. See PWM (CCP Module).
PUSH................................................................................ 363
PUSH and POP Instructions............................................... 58
PUSHL.............................................................................. 379
PWM (CCP Module)
Associated Registers ................................................ 165
Duty Cycle ................................................................ 164
Example Frequencies/Resolutions ........................... 164
Period ....................................................................... 163
Setup for PWM Operation ........................................ 165
TMR2 to PR2 Match ................................................. 163
Q
Q Clock............................................................................. 164
R
RAM. See Data Memory.
RC_IDLE Mode................................................................... 41
RC_RUN Mode................................................................... 38
RCALL .............................................................................. 364
RCON Register
Bit Status During Initialization..................................... 48
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DS39979A-page 472 Preliminary 2010 Microchip Technology Inc.
Reader Response ............................................................. 476
Real-Time Clock and Calendar
Operation .................................................................. 149
Registers................................................................... 140
Real-Time Clock and Calendar (RTCC)............................ 139
Register File ........................................................................64
Register File Summary.................................................. 66–69
Registers
ADCON0 (A/D Control 0) .......................................... 273
ADCON1 (A/D Control 1) .......................................... 274
ADCON2 (A/D Control 2) .......................................... 275
ALRMCFG (Alarm Configuration) .............................143
ALRMDAY (Alarm Day Value) ..................................147
ALRMHR (Alarm Hours Value) ................................. 148
ALRMMIN (Alarm Minutes Value).............................148
ALRMMNTH (Alarm Month Value)............................ 147
ALRMRPT (Alarm Calibration)..................................144
ALRMSEC (Alarm Seconds Value)........................... 148
ALRMWD (Alarm Weekday Value) ...........................147
BAUDCON1 (Baud Rate Control) ............................. 242
CCPxCON (CCPx Control) .......................................157
CMCON (Comparator Control) .................................293
CONFIG1 (AFE Configuration 1) ..............................462
CONFIG1H (Configuration 1 High) ........................... 321
CONFIG1L (Configuration 1 Low)............................. 321
CONFIG2 (AFE Configuration 2) ..............................463
CONFIG2H (Configuration 2 High) ........................... 323
CONFIG2L (Configuration 2 Low)............................. 322
CONFIG3H (Configuration 3 High) ........................... 324
CONFIG3L (Configuration 3 High)............................323
CTMUCONH (CTMU Control High) .......................... 315
CTMUCONL (CTMU Control Low)............................316
CTMUICON (CTMU Current Control) .......................317
CVRCON (Comparator Voltage
Reference Control)............................................ 299
DATA_CHn (AFE Channel Output)........................... 457
DAY (Day Value).......................................................145
DEVID1 (Device ID Register 1).................................324
DEVID2 (Device ID Register 2).................................324
EECON1 (EEPROM Control 1)................................... 79
GAIN (AFE Gain Configuration)................................ 459
HOUR (Hour Value) ..................................................146
INTCON (Interrupt Control)......................................... 91
INTCON2 (Interrupt Control 2)....................................92
INTCON3 (Interrupt Control 3)....................................93
IPR1 (Peripheral Interrupt Priority 1)......................... 100
IPR2 (Peripheral Interrupt Priority 2)......................... 101
IPR3 (Peripheral Interrupt Priority 3)......................... 102
LCDCON (LCD Control)............................................ 168
LCDDATAx (LCD Data) ............................................ 171
LCDPS (LCD Phase) ................................................ 169
LCDREG (LCD Voltage Regulator Control) .............. 173
LCDSEx (LCD Segment Enable) ..............................170
MINUTE (Minute Value)............................................ 146
MONTH (Month Value) .............................................145
OSCCON (Oscillator Control) .....................................26
OSCTUNE (Oscillator Tuning) .................................... 27
PADCFG1 (Pad Configuration).................................142
PHASE (AFE Phase Delay) ......................................458
PIE1 (Peripheral Interrupt Enable 1) ........................... 97
PIE2 (Peripheral Interrupt Enable 2) ........................... 98
PIE3 (Peripheral Interrupt Enable 3) ........................... 99
PIR1 (Peripheral Interrupt Request (Flag) 1) .............. 94
PIR2 (Peripheral Interrupt Request (Flag) 2) .............. 95
PIR3 (Peripheral Interrupt Request (Flag) 3) .............. 96
RCON (Reset Control)........................................ 44, 103
RCSTA1 (EUSART Receive Status
and Control)...................................................... 241
RCSTA2 (AUSART Receive Status
and Control)...................................................... 261
Reserved .................................................................. 144
RTCCAL (RTCC Calibration).................................... 142
RTCCFG (RTCC Configuration)............................... 141
SECOND (Second Value)......................................... 146
SSPCON1 (MSSP Control 1, I2C Mode) .................. 206
SSPCON1 (MSSP Control 1, SPI Mode).................. 197
SSPCON2 (MSSP Control 2,
I2C Master Mode) ............................................. 207
SSPCON2 (MSSP Control 2, I2C Slave Mode) ........ 208
SSPSTAT (MSSP Status, I2C Mode) ....................... 205
SSPSTAT (MSSP Status, SPI Mode)....................... 196
STATUS ..................................................................... 70
STATUS/COM (AFE Status/Communications)......... 461
STKPTR (Stack Pointer)............................................. 58
T0CON (Timer0 Control) .......................................... 123
T1CON (Timer1 Control) .......................................... 127
T2CON (Timer2 Control) .......................................... 133
T3CON (Timer3 Control) .......................................... 135
TXSTA1 (EUSART Transmit Status
and Control)...................................................... 240
TXSTA2 (AUSART Transmit Status
and Control)...................................................... 260
WDTCON (Watchdog Timer Control) ....................... 326
WEEKDAY (Weekday Value) ................................... 145
YEAR (Year Value)................................................... 144
RESET.............................................................................. 364
Reset .................................................................................. 43
Brown-out Reset (BOR).............................................. 43
Configuration Mismatch (CM)..................................... 43
MCLR Reset, During Power-Managed Modes ........... 43
MCLR Reset, Normal Operation................................. 43
Power-on Reset (POR)............................................... 43
RESET Instruction ...................................................... 43
Stack Full Reset.......................................................... 43
Stack Underflow Reset ............................................... 43
Watchdog Timer (WDT) Reset ................................... 43
Resets............................................................................... 319
Brown-out Reset (BOR)............................................ 319
Oscillator Start-up Timer (OST)................................ 319
Power-on Reset (POR)............................................. 319
Power-up Timer (PWRT) .......................................... 319
RETFIE ............................................................................. 365
RETLW ............................................................................. 365
RETURN........................................................................... 366
Return Address Stack......................................................... 57
Return Stack Pointer (STKPTR) ......................................... 58
Revision History................................................................ 433
RLCF ................................................................................ 366
RLNCF.............................................................................. 367
RRCF................................................................................ 367
RRNCF ............................................................................. 368
RTCC
Alarm ........................................................................ 152
Configuring ....................................................... 152
Interrupt ............................................................ 154
Mask Settings ................................................... 153
Alarm Value Registers (ALRMVAL).......................... 147
Control Registers ...................................................... 141
2010 Microchip Technology Inc. Preliminary DS39979A-page 473
PIC18F87J72 FAMILY
Operation
Calibration......................................................... 152
Clock Source .................................................... 150
Digit Carry Rules............................................... 150
General Functionality........................................ 151
Leap Year ......................................................... 151
Register Mapping.............................................. 151
ALRMVAL ................................................. 152
RTCVAL.................................................... 151
Safety Window for Register Reads
and Writes................................................. 151
Write Lock......................................................... 151
Register Interface...................................................... 149
Register Maps........................................................... 155
Reset......................................................................... 154
Device............................................................... 154
Power-on Reset (POR)..................................... 154
Sleep Mode............................................................... 154
Value Registers (RTCVAL) ....................................... 144
RTCEN Bit Write ............................................................... 149
S
SCK................................................................................... 195
SDI .................................................................................... 195
SDO .................................................................................. 195
SEC_IDLE Mode................................................................. 40
SEC_RUN Mode................................................................. 36
Serial Clock, SCK ............................................................. 195
Serial Data In (SDI)........................................................... 195
Serial Data Out (SDO) ...................................................... 195
Serial Peripheral Interface. See SPI Mode.
SETF................................................................................. 368
Slave Select (SS).............................................................. 195
SLEEP .............................................................................. 369
Software Simulator (MPLAB SIM)..................................... 387
Special Event Trigger. See Compare (CCP Module).
Special Features of the CPU ............................................ 319
SPI Mode (MSSP)
Associated Registers ................................................ 203
Bus Mode Compatibility ............................................ 203
Effects of a Reset...................................................... 203
Enabling SPI I/O ....................................................... 199
Master Mode............................................................. 200
Operation .................................................................. 198
Operation in Power-Managed Modes ....................... 203
Serial Clock............................................................... 195
Serial Data In ............................................................ 195
Serial Data Out ......................................................... 195
Slave Mode............................................................... 201
Slave Select.............................................................. 195
Slave Select Synchronization ................................... 201
SPI Clock .................................................................. 200
Typical Connection ................................................... 199
SS ..................................................................................... 195
SSPOV.............................................................................. 229
SSPOV Status Flag .......................................................... 229
SSPSTAT Register
R/W Bit.............................................................. 209, 211
Stack Full/Underflow Resets ............................................... 59
SUBFSR ........................................................................... 380
SUBFWB........................................................................... 369
SUBLW ............................................................................. 370
SUBULNK ......................................................................... 380
SUBWF ............................................................................. 370
SUBWFB........................................................................... 371
SWAPF ............................................................................. 371
T
Table Pointer Operations (table)......................................... 80
Table Reads/Table Writes .................................................. 59
TBLRD.............................................................................. 372
TBLWT ............................................................................. 373
Timer0 .............................................................................. 123
Associated Registers ................................................ 125
Clock Source Select (T0CS Bit) ............................... 124
Operation.................................................................. 124
Overflow Interrupt ..................................................... 125
Prescaler .................................................................. 125
Switching Assignment ...................................... 125
Prescaler Assignment (PSA Bit)............................... 125
Prescaler Select (T0PS2:T0PS0 Bits) ...................... 125
Prescaler. See Prescaler, Timer0.
Reads and Writes in 16-Bit Mode............................. 124
Source Edge Select (T0SE Bit) ................................ 124
Timer1 .............................................................................. 127
16-Bit Read/Write Mode ........................................... 129
Associated Registers ................................................ 131
Interrupt .................................................................... 130
Operation.................................................................. 128
Oscillator........................................................... 127, 129
Layout Considerations...................................... 130
Oscillator, as Secondary Clock................................... 27
Resetting, Using the CCP Special
Event Trigger.................................................... 130
TMR1H Register....................................................... 127
TMR1L Register ....................................................... 127
Use as a Clock Source ............................................. 129
Use as a Real-Time Clock ........................................ 130
Timer2 .............................................................................. 133
Associated Registers ................................................ 134
Interrupt .................................................................... 134
Operation.................................................................. 133
Output....................................................................... 134
PR2 Register ............................................................ 163
TMR2 to PR2 Match Interrupt................................... 163
Timer3 .............................................................................. 135
16-Bit Read/Write Mode ........................................... 137
Associated Registers ................................................ 137
Operation.................................................................. 136
Oscillator........................................................... 135, 137
Overflow Interrupt ..................................................... 137
Special Event Trigger (CCP) .................................... 137
TMR3H Register....................................................... 135
TMR3L Register ....................................................... 135
Timing Diagrams
A/D Conversion ........................................................ 422
Acknowledge Sequence ........................................... 232
AFE Continuous Read.............................................. 452
AFE Data Ready Behavior ....................................... 455
AFE Data Ready Pulse............................................. 427
AFE Read/Write (SPI Mode 0,0) .............................. 451
AFE Read/Write (SPI Mode 1,1) .............................. 450
AFE Recommended Configuration Sequence.......... 453
AFE Serial Input ....................................................... 427
AFE Serial Output..................................................... 427
AFE Specific Diagrams............................................. 428
Asynchronous Reception.................................. 251, 267
Asynchronous Transmission ............................ 249, 265
Asynchronous Transmission
(Back to Back) .......................................... 249, 265
Automatic Baud Rate Calculation............................. 247
PIC18F87J72 FAMILY
DS39979A-page 474 Preliminary 2010 Microchip Technology Inc.
Auto-Wake-up Bit (WUE) During
Normal Operation.............................................. 252
Auto-Wake-up Bit (WUE) During Sleep .................... 252
Baud Rate Generator with Clock Arbitration ............. 226
BRG Overflow Sequence .......................................... 247
BRG Reset Due to SDA Arbitration During
Start Condition .................................................. 235
Bus Collision During a Repeated Start
Condition (Case 1) ............................................ 236
Bus Collision During a Repeated Start
Condition (Case 2) ............................................ 236
Bus Collision During a Start Condition
(SCL = 0) ..........................................................235
Bus Collision During a Stop Condition
(Case 1) ............................................................ 237
Bus Collision During a Stop Condition
(Case 2) ............................................................ 237
Bus Collision During Start Condition
(SDA Only)........................................................234
Bus Collision for Transmit and Acknowledge............ 233
Capture/Compare/PWM............................................ 411
CLKO and I/O ........................................................... 408
Clock Synchronization ..............................................219
Clock/Instruction Cycle ............................................... 60
EUSART/AUSART Synchronous Receive
(Master/Slave)................................................... 420
EUSART/AUSART Synchronous Transmission
(Master/Slave)................................................... 420
Example SPI Master Mode (CKE = 0) ...................... 412
Example SPI Master Mode (CKE = 1) ...................... 413
Example SPI Slave Mode (CKE = 0) ........................ 414
Example SPI Slave Mode (CKE = 1) ........................ 415
External Clock...........................................................406
Fail-Safe Clock Monitor (FSCM) ...............................330
First Start Bit Timing .................................................227
I2C Bus Data .............................................................417
I2C Bus Start/Stop Bits.............................................. 416
I2C Master Mode (7 or 10-Bit Transmission) ............ 230
I2C Master Mode (7-Bit Reception)........................... 231
I2C Slave Mode (10-Bit Reception, SEN = 0,
ADMSK = 01001).............................................. 216
I2C Slave Mode (10-Bit Reception, SEN = 0) ........... 215
I2C Slave Mode (10-Bit Reception, SEN = 1) ........... 221
I2C Slave Mode (10-Bit Transmission)...................... 217
I2C Slave Mode (7-Bit Reception, SEN = 0,
ADMSK = 01011).............................................. 213
I2C Slave Mode (7-Bit Reception, SEN = 0) ............. 212
I2C Slave Mode (7-Bit Reception, SEN = 1) ............. 220
I2C Slave Mode (7-Bit Transmission)........................ 214
I2C Slave Mode General Call Address Sequence
(7 or 10-Bit Addressing Mode) .......................... 222
I2C Stop Condition Receive or Transmit Mode ......... 232
LCD Interrupt in Quarter Duty Cycle Drive................190
LCD Sleep Entry/Exit When SLPEN = 1 or
CS1:CS0 = 00...................................................191
MSSP I2C Bus Data.................................................. 418
MSSP I2C Bus Start/Stop Bits ..................................418
PWM Output ............................................................. 163
Repeated Start Condition.......................................... 228
Reset, Watchdog Timer (WDT), Oscillator Start-up
Timer (OST) and Power-up Timer (PWRT) ...... 409
Send Break Character Sequence ............................. 253
Slave Synchronization ..............................................201
Slow Rise Time (MCLR Tied to VDD,
VDD Rise > TPWRT) ............................................. 47
SPI Mode (Master Mode).......................................... 200
SPI Mode (Slave Mode, CKE = 0) ............................ 202
SPI Mode (Slave Mode, CKE = 1) ............................ 202
Synchronous Reception (Master Mode,
SREN) ...................................................... 256, 270
Synchronous Transmission .............................. 254, 268
Synchronous Transmission
(Through TXEN) ....................................... 255, 269
Time-out Sequence on Power-up
(MCLR Not Tied to VDD), Case 1 ....................... 46
Time-out Sequence on Power-up
(MCLR Not Tied to VDD), Case 2 ....................... 47
Time-out Sequence on Power-up
(MCLR Tied to VDD, VDD Rise TPWRT) ............... 46
Timer Pulse Generation............................................ 154
Timer0 and Timer1 External Clock ........................... 410
Transition for Entry to Idle Mode................................. 40
Transition for Entry to SEC_RUN Mode ..................... 37
Transition for Entry to Sleep Mode ............................. 39
Transition for Two-Speed Start-up
(INTRC to HSPLL)............................................ 328
Transition for Wake From Idle to Run Mode............... 40
Transition for Wake From Sleep (HSPLL) .................. 39
Transition From RC_RUN Mode to
PRI_RUN Mode.................................................. 38
Transition From SEC_RUN Mode to
PRI_RUN Mode (HSPLL) ................................... 37
Transition to RC_RUN Mode ...................................... 38
Type-A in 1/2 MUX, 1/2 Bias Drive ........................... 180
Type-A in 1/2 MUX, 1/3 Bias Drive ........................... 182
Type-A in 1/3 MUX, 1/2 Bias Drive ........................... 184
Type-A in 1/3 MUX, 1/3 Bias Drive ........................... 186
Type-A in 1/4 MUX, 1/3 Bias Drive ........................... 188
Type-A/Type-B in Static Drive .................................. 179
Type-B in 1/2 MUX, 1/2 Bias Drive ........................... 181
Type-B in 1/2 MUX, 1/3 Bias Drive ........................... 183
Type-B in 1/3 MUX, 1/2 Bias Drive ........................... 185
Type-B in 1/3 MUX, 1/3 Bias Drive ........................... 187
Type-B in 1/4 MUX, 1/3 Bias Drive ........................... 189
Timing Diagrams and Specifications
A/D Conversion Requirements ................................. 422
Capture/Compare/PWM Requirements .................... 411
CLKO and I/O Requirements.................................... 408
EUSART/AUSART Synchronous Receive
Requirements ................................................... 420
EUSART/AUSART Synchronous Transmission
Requirements ................................................... 420
Example SPI Mode Requirements
(Master Mode, CKE = 0)................................... 412
Example SPI Mode Requirements
(Master Mode, CKE = 1)................................... 413
Example SPI Mode Requirements
(Slave Mode, CKE = 0)..................................... 414
Example SPI Slave Mode Requirements
(CKE = 1).......................................................... 415
External Clock Requirements ................................... 406
I2C Bus Data Requirements (Slave Mode) ............... 417
I2C Bus Start/Stop Bits Requirements |(Slave Mode).....
416
Internal RC Accuracy (INTOSC and INTRC)............ 407
MSSP I2C Bus Data Requirements .......................... 419
MSSP I2C Bus Start/Stop Bits Requirements........... 418
PLL Clock ................................................................. 407
2010 Microchip Technology Inc. Preliminary DS39979A-page 475
PIC18F87J72 FAMILY
Reset, Watchdog Timer, Oscillator Start-up
Timer, Power-up Timer and Brown-out
Reset Requirements ......................................... 409
Timer0 and Timer1 External
Clock Requirements ......................................... 410
Top-of-Stack Access........................................................... 57
TSTFSZ ............................................................................ 374
Two-Speed Start-up .................................................. 319, 328
Two-Word Instructions
Example Cases........................................................... 61
V
VDDCORE/VCAP Pin............................................................ 327
Voltage Reference Specifications ..................................... 403
Voltage Regulator (On-Chip) ............................................ 327
Brown-out Reset (BOR)............................................ 328
Low-Voltage Detection (LVD) ................................... 327
Operation in Sleep Mode .......................................... 328
Power-up Requirements ........................................... 328
W
Watchdog Timer (WDT)............................................ 319, 325
Associated Registers ................................................ 326
Control Register........................................................ 325
During Oscillator Failure ........................................... 329
Programming Considerations ................................... 325
WCOL ....................................................... 227, 228, 229, 232
WCOL Status Flag.................................... 227, 228, 229, 232
WWW Address ................................................................. 475
WWW, On-Line Support ....................................................... 7
X
XORLW ............................................................................ 374
XORWF ............................................................................ 375
PIC18F87J72 FAMILY
DS39979A-page 476 Preliminary 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. Preliminary DS39979A-page 477
PIC18F87J72 FAMILY
THE MICROCHIP WEB SITE
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Customers should contact their distributor, representa-
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Local sales offices are also available to help custom-
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Technical support is available through the web site
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PIC18F87J72 FAMILY
DS39979A-page 478 Preliminary 2010 Microchip Technology Inc.
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
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DS39979APIC18F87J72 Family
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
2010 Microchip Technology Inc. Preliminary DS39979A-page 479
PIC18F87J72 FAMILY
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X/XX XXX
PatternPackageTemperature
Range
Device
Device(1,2) PIC18F86J72, PIC18F86J72T
PIC18F87J72, PIC18F87J72T
Temperature Range I = -40C to +85C (Industrial)
Package PT = TQFP (Thin Quad Flatpack)
Pattern QTP, SQTP, Code or Special Requirements
(blank otherwise)
Examples:
a) PIC18F87J72-I/PT 301 = Industrial temperature,
TQFP package, QTP pattern #301.
b) PIC18F87J72T-I/PT = Tape and reel, Industrial
temperature, TQFP package.
Note 1: F = Standard Voltage Range
2: T = In tape and reel
DS39979A-page 480 Preliminary 2010 Microchip Technology Inc.
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