Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge
BIPOLAR ANALOG INTEGRATED CIRCUIT
UPC3223TB
Document No. PU10491EJ01V0DS (1st edition)
Date Published May 2004 CP(K)
5 V, SILICON MMIC
MEDIUM OUTPUT POWER AMPLIFIER
DESCRIPTION
The
PC3223TB is a silicon monolithic IC designed as IF amplifier for DBS tuners. This IC is manufactured
using our 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process.
FEATURES
•Wideband response : fu = 3.2 GHz TYP. @ 3 dB bandwidth
•Medium output power : PO (sat) = +12.0 dBm @ f = 1.0 GHz
: PO (sat) = +9.0 dBm @ f = 2.2 GHz
•High linearity : PO (1 dB) = +6.5 dBm @ f = 1.0 GHz
: PO (1 dB) = +5.0 dBm @ f = 2.2 GHz
•Power gain : GP = 23.0 dB TYP. @ f = 1.0 GHz
: GP = 23.0 dB TYP. @ f = 2.2 GHz
•Supply voltage : VCC = 4.5 to 5.5 V
•Port impedance : input/output 50
APPLICATION
•IF amplifiers in DBS converters etc.
ORDERING INFORMATION (Solder Contains Lead)
Part Number
Package
Marking
Supplying Form
PC3223TB-E3
6-pin super minimold
C3J
Embossed tape 8 mm wide
1, 2, 3 pins face the perforation side of tape
Qty 3 kpcs/reel
ORDERING INFORMATION (Pb-Free)
Part Number
Package
Marking
Supplying Form
PC3223TB-E3-A
6-pin super minimold
C3J
Embossed tape 8 mm wide
1, 2, 3 pins face the perforation side of tape
Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order:
PC3223TB-A
Data Sheet PU10491EJ01V0DS
2
UPC3223TB
PIN CONNECTIONS
Pin No.
Pin Name
1
INPUT
2
GND
3
GND
4
OUTPUT
5
GND
6
VCC
PRODUCT LINE-UP OF 5 V-BIAS SILICON MMIC MEDIUM OUTPUT AMPLIFIER
(TA = +25C, f = 1 GHz, VCC = Vout = 5.0 V, ZS = ZL = 50 )
Part No.
fu
(GHz)
PO(sat)
(dBm)
GP
(dB)
NF
(dB)
ICC
(mA)
Package
Marking
PC2708TB
2.9
+10.0
15
6.5
26
6-pin super minimold
C1D
PC2709TB
2.3
+11.5
23
5.0
25
C1E
PC2710TB
1.0
+13.5
33
3.5
22
C1F
PC2776TB
2.7
+8.5
23
6.0
25
C2L
PC3223TB
3.2
+12.0
23
4.5
19
C3J
Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
Data Sheet PU10491EJ01V0DS
3
UPC3223TB
PIN EXPLANATIONS
PIN
No.
Pin Name
Applied
Voltage (V)
Pin Voltage (V)
Note
Function and Applications
1
INPUT
–
0.96
Signal input pin.
A internal matching circuit, configured with resistors, enables 50
connection over a wide band.
A multi-feedback circuits is designed to cancel the deviations of hFE and
resistance.
This pin must be coupled to signal source with capacitor for DC cut.
4
OUTPUT
Voltage as
same as VCC
through
external
inductor
–
Signal output pin.
The inductor must be attached between VCC and output pins to supply
current to the internal output transistors.
6
VCC
4.5 to 5.5
–
Power suplly pin.
Witch biases the internal input transistor. This pin should be externally
equipped with bypass capacitor to minimize its impedance.
2
3
5
GND
0
–
Ground pin.
This pin should be connected to system ground with minimum inductance.
Ground pattern on the board should be formed as wide as possible.
All the ground pins must be connected together with wide ground pattern to
decrease impedance difference.
Note Pin Voltage is measured at VCC = 5.0 V
Data Sheet PU10491EJ01V0DS
4
UPC3223TB
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Conditions
Ratings
Unit
Supply Voltage
VCC
TA = +25C, Pin 4 and 6
6.0
V
Total Circuit Current
ICC
TA = +25C
40
mA
Power Dissipation
PD
TA = +85C Note
270
mW
Operating Ambient Temperature
TA
40 to +85
C
Storage Temperature
Tstg
55 to +150
C
Input Power
Pin
TA = +25C
+10
dBm
Note Mounted on double-sided copper-clad 50 50 1.6 mm epoxy glass PWB
RECOMMENDED OPERATING RANGE
Parameter
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
Supply Voltage
VCC
The same voltage should be applied to
pin 4 and 6.
4.5
5.0
5.5
V
Operating Ambient Temperature
TA
40
+25
+85
C
ELECTRICAL CHARACTERISTICS (TA = +25C, VCC = Vout = 5.0 V, ZS = ZL = 50 )
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Circuit Current
ICC
No input signal
15.0
19.0
24.0
mA
Power Gain
GP
f = 1.0 GHz, Pin = 30 dBm
20.5
23.0
25.5
dB
f = 2.2 GHz, Pin = 30 dBm
20.0
23.0
26.0
Saturated Output Power
PO (sat)
f = 1.0 GHz, Pin = 5 dBm
+9.0
+12.0
dBm
f = 2.2 GHz, Pin = 5 dBm
+6.0
+9.0
Gain 1 dB Compression Output
Power
PO (1 dB)
f = 1.0 GHz
+4.5
+6.5
dBm
f = 2.2 GHz
+3.0
+5.0
Noise Figure
NF
f = 1.0 GHz
4.5
6.0
dB
f = 2.2 GHz
4.0
5.5
Upper Limit Operating Frequency
fu
3 dB down below flat gain at f = 0.1 GHz
2.8
3.2
GHz
Isolation
ISL
f = 1.0 GHz, Pin = 30 dBm
28.0
33.0
dB
f = 2.2 GHz, Pin = 30 dBm
28.0
33.0
Input Return Loss
RLin
f = 1.0 GHz, Pin = 30 dBm
9.0
12.0
dB
f = 2.2 GHz, Pin = 30 dBm
12.0
17.5
Output Return Loss
RLout
f = 1.0 GHz, Pin = 30 dBm
9.0
12.0
dB
f = 2.2 GHz, Pin = 30 dBm
9.0
12.0
Gain Flatness
GP
f = 0.1 to 2.2 GHz
0.9
dB
Data Sheet PU10491EJ01V0DS
5
UPC3223TB
OTHER CHARACTERISTICS, FOR REFERENCE PURPOSES ONLY
(TA = +25C, VCC = Vout = 5.0 V, ZS = ZL = 50 )
Parameter
Symbol
Test Conditions
Reference Value
Unit
Output Intercept Point
OIP3
f = 1.0 GHz
+17.8
dBm
f = 2.2 GHz
+14.8
Data Sheet PU10491EJ01V0DS
6
UPC3223TB
TEST CIRCUIT
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
COMPONENTS OF TEST CIRCUIT FOR
MEASURING ELECTRICAL CHARACTERISTICS
Type
Value
C1, C2
Chip Capacitor
100 pF
C3
Chip Capacitor
1 000 pF
C4
Feed-through Capacitor
1 000 pF
L
Chip Inductor
100 nH
INDUCTOR FOR THE OUTPUT PIN
The internal output transistor of this IC consumes 20 mA, to output medium power. To supply current for output
transistor, connect an inductor between the VCC pin (pin 6) and output pin (pin 4). Select large value inductance, as
listed above.
The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum
voltage drop to output enable high level. In terms of AC, the inductor makes output-port impedance higher to get
enough gain. In this case, large inductance and Q is suitable.
CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS
Capacitors of 1000 pF are recommendable as the bypass capacitor for the VCC pin and the coupling capacitors
for the input and output pins.
The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias
can be supplied against VCC fluctuation.
The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial
impedance. Their capacitances are therefore selected as lower impedance against a 50 load. The capacitors
thus perform as high pass filters, suppressing low frequencies to DC.
To obtain a flat gain from 100 MHz upwards, 1 000 pF capacitors are used in the test circuit. In the case of under
10 MHz operation, increase the value of coupling capacitor such as 10 000 pF. Because the coupling capacitors are
determined by equation, C = 1/(2 Rfc).
Data Sheet PU10491EJ01V0DS
7
UPC3223TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
Notes
1. 30 30 0.4 mm double sided copper clad polyimide board.
2. Back side: GND pattern
3. Solder plated on pattern
4. : Through holes
COMPONENT LIST
Value
C1, C2
100 pF
C3, C4
1 000 pF
L
100 nH
Data Sheet PU10491EJ01V0DS
8
UPC3223TB
TYPICAL CHARACTERISTICS (TA = +25C , unless otherwise specified)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10491EJ01V0DS
9
UPC3223TB
Remark The graphs indicate nominal characteristics.
Data Sheet PU10491EJ01V0DS
10
UPC3223TB
Remark The graphs indicate nominal characteristics.
Data Sheet PU10491EJ01V0DS
11
UPC3223TB
S-PARAMETERS (TA = +25C, VCC = Vout = 5.0 V)
S11FREQUENCY
S22FREQUENCY
Data Sheet PU10491EJ01V0DS
12
UPC3223TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
Data Sheet PU10491EJ01V0DS 13
UPC3223TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired
oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to VCC line.
(4) The inductor must be attached between VCC and output pins. The inductance value should be determined in
accordance with desired frequency.
(5) The DC cut capacitor must be each attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Peak temperature (package surface temperature) : 260C or below
Time at peak temperature : 10 seconds or less
Time at temperature of 220C or higher : 60 seconds or less
Preheating time at 120 to 180C : 12030 seconds
Maximum number of reflow processes : 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
IR260
Wave Soldering
Peak temperature (molten solder temperature) : 260C or below
Time at peak temperature : 10 seconds or less
Preheating temperature (package surface temperature) : 120C or below
Maximum number of flow processes : 1 time
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (pin temperature) : 350C or below
Soldering time (per side of device) : 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
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