©2012-2016 Peregrine Semiconductor Corp. All rights reserved.
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Document No. DOC-33314-4 | www.psemi.com
Product Specification
UltraCMOS® SPDT RF Switch
5–6000 MHz
PE42422
Features
Symmetric SPDT reflective switch
Low insertion loss
0.23 dB typical @ 100 MHz
0.25 dB typical @ 1000 MHz
0.40 dB typical @ 3000 MHz
0.65 dB typical @ 5000 MHz
0.90 dB typical @ 6000 MHz
Wide supply range of 2.3–5.5V
Excellent linearity
IIP2 of 105 dBm @ 17 MHz
IIP3 of 81 dBm @ 17 MHz
High ESD tolerance
4 kV HBM on RF pins to GND
1 kV on all other pins
Logic Select (LS) pin provides
maximum flexibility of control logic
12-lead 2 × 2 mm QFN package
Figure 2. Package Type
12-lead 2 x 2 x 0.55 mm QFN
Figure 1. Functional Diagram
RF1 RF2
V1
RFC
CMOS Control
Driver and ESD
ESD
ESD
ESD
LS
Product Description
The PE42422 is a HaRP™ technology-enhanced SPDT
RF switch designed to cover a broad range of
applications from 5–6000 MHz. This reflective switch
integrates on-board CMOS control logic with a low
voltage CMOS-compatible control interface and requires
no external components.
Peregrine’s HaRP technology enhancements deliver high
linearity and exceptional harmonics performance. It is an
innovative feature of the UltraCMOS® process, providing
performance superior to GaAs with the economy and
integration of conventional CMOS.
71-0068
Product Specification
PE42422
Document No. DOC-33314-4 | UltraCMOS® RFIC Solutions
Page 2 of 16
©2012-2016 Peregrine Semiconductor Corp. All rights reserved.
Table 1. Electrical Specifications @ +25 °C1, VDD = 2.3–5.5V (ZS = ZL = 50Ω), unless otherwise specified
Parameter Path Condition Min Typ Max Unit
Operational frequency 5 6000 MHz
Insertion loss2 RFX–RFC
5–100 MHz 0.23 dB
100–1000 MHz 0.25 0.35 dB
1000–2000 MHz 0.30 0.40 dB
2000–3000 MHz 0.40 0.50 dB
3000–4000 MHz 0.50 0.70 dB
4000–5000 MHz 0.65 0.902 dB
5000–6000 MHz 0.90 1.252 dB
Isolation RFX–RFC
5–100 MHz 68 dB
100–1000 MHz 42 44 dB
1000–2000 MHz 33 35 dB
2000–3000 MHz 27 29 dB
3000–4000 MHz 22 24 dB
4000–5000 MHz 18 20 dB
5000–6000 MHz 15 17 dB
Isolation RFX–RFX
5–100 MHz 61 dB
100–1000 MHz 40 41 dB
1000–2000 MHz 32 33 dB
2000–3000 MHz 26 28 dB
3000–4000 MHz 22 24 dB
4000–5000 MHz 18 20 dB
5000–6000 MHz 15 16 dB
Return loss2 RFX–RFC
5–100 MHz 33 dB
100-1000 MHz 28 dB
1000–2000 MHz 21 dB
2000–3000 MHz 20 dB
3000–4000 MHz 18 dB
4000–5000 MHz 162 dB
5000–6000 MHz 132 dB
2nd harmonic RFX–RFC
+18 dBm input power, 17–204 MHz –92 dBc
+32 dBm output power, 850 / 900 MHz –99 dBc
+32 dBm output power, 1800 / 1900 MHz –101 dBc
3rd harmonic RFX–RFC
+18 dBm input power, 17–204 MHz –125 dBc
+32 dBm output power, 850 / 900 MHz –93 dBc
+32 dBm output power, 1800 / 1900 MHz –87 dBc
IMD3 RF–RFC Bands I, II, V, VIII +17 dBm CW @ TX freq at RFC,
–15 dBm CW @ 2Tx-Rx at RFC, 50Ω –115 dBm
Product Specification
PE42422
©2012-2016 Peregrine Semiconductor Corp. All rights reserved.
Page 3 of 16
Document No. DOC-33314-4 | www.psemi.com
Notes: 1. Typical performance over temperature and VDD shown in Figure 5 through Figure 21.
2. High frequency performance can be improved by external matching (see Figure 22 through Figure 27 and Figure 30).
3. The input P0.1dB compression point is a linearity figure of merit. Refer to Table 4 for the operating RF input power.
Table 1. Electrical Specifications @ +25 °C1, VDD = 2.3–5.5V (ZS = ZL = 50Ω), unless otherwise specified
Parameter Path Condition Min Typ Max Unit
IIP2 RFX
5 MHz
17 MHz
100–6000 MHz
96
105
115
dBm
dBm
dBm
IIP3 RFX
5 MHz
17 MHz
100–6000 MHz
75
81
75
dBm
dBm
dBm
Input 0.1dB compression point3 RFX or RFC 5–100 MHz
100–6000 MHz 33
34 dBm
dBm
Switching time 50% CTRL to (10%–90%) or (90%–10%) RF 2 4 μs
Product Specification
PE42422
Document No. DOC-33314-4 | UltraCMOS® RFIC Solutions
Page 4 of 16
©2012-2016 Peregrine Semiconductor Corp. All rights reserved.
1
2
3
9
8
7
4 5 6
101112
V1LSVDD
GNDRFC
GND/NC
GND
RF2
GND
DGND
RF1
GND
Exposed
Ground
Pad
Pin 1 dot
marking
Table 5. Absolute Maximum Ratings
Notes: 1. VDD within operating range specified in Table 4.
2. Human Body Model (MIL_STD 883 Method 3015.7).
3. Machine Model (JEDEC JESD22-A115-A).
Table 4. Operating Ranges
Parameter Min Typ Max Unit
VDD Supply voltage 2.3 3.3 5.5 V
IDD Power supply current 120 200 µA
RFX–RFC input power Fig. 4 dBm
Control voltage high 1.2 1.5 3.3 V
Control voltage low 0 0 0.5 V
Operating temperature range –40 +25 +85 °C
Parameter/Condition Min Unit Max
RF input power, 50Ω1
5–100 MHz
100–6000 MHz
dBm
dBm
33
34
ESD voltage HBM2
RF pins to GND
All other pins
V
V
4000
1000
ESD voltage MM, all pins3 V 200
TST Storage temperature –65 +150 °C
Figure 3. Pin Configuration (Top View)
Table 2. Pin Descriptions
Pin No. Pin Name Description
1 GND Ground
2 RF21 RF port 2
3 GND Ground
4 GND/NC2 Ground or no connect
5 RFC1 RF common
6 GND Ground
7 GND Ground
8 RF11 RF port 1
9 DGND Digital Ground
10 V1 Switch control input, CMOS logic level
11 LS Logic Select, CMOS logic level
12 VDD Supply
Pad GND Exposed pad: ground for proper operation
Notes: 1. RF pins 2, 5 and 8 must be at 0 VDC. The RF pins do not required DC
blocking capacitors for proper operation if the 0 VDC requirement is met.
2. Pin 4 can be grounded or left unconnected externally.
Table 3. Truth Table
Path V1 LS
RFC–RF2 1 1
RFC–RF1 0 1
RFC–RF1 1 0
RFC–RF2 0 0
Latch-Up Avoidance
Unlike conventional CMOS devices, UltraCMOS
devices are immune to latch-up.
Electrostatic Discharge (ESD) Precautions
When handling this UltraCMOS device, observe
the same precautions that you would use with
other ESD-sensitive devices. Although this device
contains circuitry to protect it from damage due to
ESD, precautions should be taken to avoid
exceeding the specified rating.
Moisture Sensitivity Level
The Moisture Sensitivity Level rating for the
PE42422 in the 12-lead 2 × 2 × 0.55 mm QFN
package is MSL1.
Exceeding absolute maximum ratings may cause
permanent damage. Operation should be restricted
to the limits in the Operating Ranges table.
Product Specification
PE42422
©2012-2016 Peregrine Semiconductor Corp. All rights reserved.
Page 5 of 16
Document No. DOC-33314-4 | www.psemi.com
Figure 4. Power De-rating Curve for 5–6000 MHz
Product Specification
PE42422
Document No. DOC-33314-4 | UltraCMOS® RFIC Solutions
Page 6 of 16
©2012-2016 Peregrine Semiconductor Corp. All rights reserved.
Typical Performance Data @ +25 °C and VDD = 3.3V, unless otherwise specified
Figure 5. Insertion Loss RFX*
Figure 6. Insertion Loss vs Temp (RF1–RFC)*
Figure 7. Insertion Loss vs Temp (RF2–RFC)*
Note: * High frequency performance can be improved by external matching (see Figure 22 through Figure 27 and Figure 30).
Figure 8. Insertion Loss vs VDD (RF1–RFC)*
Figure 9. Insertion Loss vs VDD (RF2–RFC)*
Product Specification
PE42422
©2012-2016 Peregrine Semiconductor Corp. All rights reserved.
Page 7 of 16
Document No. DOC-33314-4 | www.psemi.com
Figure 10. RFX–RFX Isolation vs Temp
Figure 11. RFC–RFX Isolation vs Temp Figure 13. RFC–RFX Isolation vs VDD
Figure 12. RFX–RFX Isolation vs VDD
Typical Performance Data @ +25 °C and VDD = 3.3V, unless otherwise specified (cont.)
Product Specification
PE42422
Document No. DOC-33314-4 | UltraCMOS® RFIC Solutions
Page 8 of 16
©2012-2016 Peregrine Semiconductor Corp. All rights reserved.
Figure 14. RFC Port Return Loss vs Temp
(RF1 Active)*
Figure 16. RFC Port Return Loss vs VDD
(RF1 Active)*
Figure 15. RFC Port Return Loss vs Temp
(RF2 Active)*
Figure 17. RFC Port Return Loss vs VDD
(RF2 Active)*
Typical Performance Data @ +25 °C and VDD = 3.3V, unless otherwise specified (cont.)
Note: * High frequency performance can be improved by external matching (see Figure 22 through Figure 27 and Figure 30).
Product Specification
PE42422
©2012-2016 Peregrine Semiconductor Corp. All rights reserved.
Page 9 of 16
Document No. DOC-33314-4 | www.psemi.com
Typical Performance Data @ +25 °C and VDD = 3.3V, unless otherwise specified (cont.)
Figure 18. Active Port Return Loss vs Temp
(RF1 Active)*
Figure 20. Active Port Return Loss vs VDD
(RF1 Active)*
Figure 21. Active Port Return Loss vs VDD
(RF2 Active)*
Figure 19. Active Port Return Loss vs Temp
(RF2 Active)*
Note: * High frequency performance can be improved by external matching (see Figure 22 through Figure 27 and Figure 30).
Product Specification
PE42422
Document No. DOC-33314-4 | UltraCMOS® RFIC Solutions
Page 10 of 16
©2012-2016 Peregrine Semiconductor Corp. All rights reserved.
Performance Comparison @ +25 °C and VDD = 3.3V, with or without matching
Note: * High frequency performance can be improved by external matching (see Figure 22 through Figure 27 and Figure 30).
Figure 22. Insertion Loss RF1* Figure 25. Insertion Loss RF2*
Figure 26. Active Port Return Loss (RF2 Active)* Figure 23. Active Port Return Loss (RF1 Active)*
Figure 24. RFC Port Return Loss (RF1 Active)* Figure 27. RFC Port Return Loss (RF2 Active)*
Product Specification
PE42422
©2012-2016 Peregrine Semiconductor Corp. All rights reserved.
Page 11 of 16
Document No. DOC-33314-4 | www.psemi.com
Figure 28. Evaluation Board Layout
Evaluation Board
The SPDT switch evaluation board was designed
to ease customer evaluation of Peregrine’s
PE42422. The RF common port is connected
through a 50Ω transmission line via the top SMA
connector, J2. RF1 and RF2 ports are connected
through 50Ω transmission lines via SMA
connectors J1 and J3, respectively. A through 50Ω
transmission is available via SMA connectors J4
and J5. This transmission line can be used to
estimate the loss of the PCB over the
environmental conditions being evaluated. J8
provides DC and digital inputs to the device.
The board is constructed of a four metal layer
material with a total thickness of 62 mils. The top
and bottom RF layers are Rogers RO4350 material
with a 10 mil RF core. The middle layers provide
ground for the transmission lines. The transmission
lines were designed using a coplanar waveguide
with ground plane model using a trace width of
22 mils, trace gaps of 7 mils, and metal thickness
of 2.1 mils.
PRT-29005
Product Specification
PE42422
Document No. DOC-33314-4 | UltraCMOS® RFIC Solutions
Page 12 of 16
©2012-2016 Peregrine Semiconductor Corp. All rights reserved.
Figure 29. Evaluation Board Schematic
DOC-33327
Product Specification
PE42422
©2012-2016 Peregrine Semiconductor Corp. All rights reserved.
Page 13 of 16
Document No. DOC-33314-4 | www.psemi.com
Figure 30. Evaluation Board Schematic with Matching
DOC-33327
Product Specification
PE42422
Document No. DOC-33314-4 | UltraCMOS® RFIC Solutions
Page 14 of 16
©2012-2016 Peregrine Semiconductor Corp. All rights reserved.
2.00
2.00
A
0.10 C
C
0.10 C
TOP VIEW
SIDE VIEW
BOTTOM VIEW
0.05 C
SEATING PLANE
PIN #1 Identifier
B
(X2)
0.10 C A B
0.05 C
ALL FEATURES
RECOMMENDED LAND PATTERN
0.10 C
(X2)
1.10±0.05
1.10±0.05
0.50
0.20±0.05
(X12) 0.275±0.05
(X12)
1.00
1
3
4
6
79
10
12
2.40
0.475
(X12)
0.25
(X12)
0.50
1.10
2.40
1.10
0.152 REF. 0.05 MAX
0.60 MAX
Figure 31. Package Drawing
12-lead 2 × 2 × 0.55 mm QFN
DOC-01882
Product Specification
PE42422
©2012-2016 Peregrine Semiconductor Corp. All rights reserved.
Page 15 of 16
Document No. DOC-33314-4 | www.psemi.com
Figure 32. Top Marking Specifications
PPZZ
YWW
Marking Spec
Symbol
Package
Marking Definition
PP DE Part number marking for PE42422
ZZ 00-99 Last two digits of lot code
Y 0-9 Last digit of year, starting from 2009
(0 for 2010, 1 for 2011, etc)
WW 01-53 Work week
17-0112
PPZZ
YYWW
Marking Spec
Symbol
Package
Marking Definition
PP DE Part number marking for PE42422
ZZ 00-99 Last two digits of lot code
YY 00-99 Last two digits of assembly year
(Ex: 15 for 2015)
WW 01-53 Work week
DOC-66046
Product Specification
PE42422
Document No. DOC-33314-4 | UltraCMOS® RFIC Solutions
Page 16 of 16
©2012-2016 Peregrine Semiconductor Corp. All rights reserved.
Figure 33. Tape and Reel Specifications
12-lead 2 × 2 × 0.55 mm QFN
Device Orientation in Tape
Top of
Device
Pin 1
Nominal Tolerance
Ao 2.20 ±0.1
Bo 2.20 ±0.1
Ko 0.75 ±0.1
Tape Feed Direction
Table 6. Ordering Information
Order Code Description Package Shipping Method
PE42422MLAA-Z PE42422 SPDT RF switch Green 12-lead 2 × 2mm QFN 3000 units T/R
EK42422-01 PE42422 Evaluation board Evaluation kit 1/Box
Advance Information:
The product is in a formative or design stage. The datasheet contains design target
specifications for product development. Specifications and features may change in any manner without notice.
Preliminary Specification:
The datasheet contains preliminary data. Additional data may be added at a later
date. Peregrine reserves the right to change specifications at any time without notice in order to supply the best
possible product.
Product Specification:
The datasheet contains final data. In the event Peregrine decides to
change the specifications, Peregrine will notify customers of the intended changes by issuing a CNF (Customer
Notification Form).
The information in this datasheet is believed to be reliable. However, Peregrine assumes no liability for the use
of this information. Use shall be entirely at the user’s own risk.
No patent rights or licenses to any circuits described in this datasheet are implied or granted to any third party.
Peregrine’s products are not designed or intended for use in devices or systems intended for surgical implant,
or in other applications intended to support or sustain life, or in any application in which the failure of the
Peregrine product could create a situation in which personal injury or death might occur. Peregrine assumes no
liability for damages, including consequential or incidental damages, arising out of the use of its products in
such applications.
The Peregrine name, logo, UltraCMOS and UTSi are registered trademarks and HaRP, MultiSwitch and DuNE
are trademarks of Peregrine Semiconductor Corp.
Peregrine products are protected under one or more of
the following U.S. Patents: http://patents.psemi.com.
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For sales and contact information please visit www.psemi.com.
