WS488 SAC305 Water Soluble Solder Paste Features: - Excellent Wetting - Extended Cleaning Window - Superior Slump Resistance - 8 Hour + Stencil Life - Aqueous Wash with Water - Large Process Window Description: AIM's WS488 water soluble solder paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 offers superior slump resistance, as well as excellent print characteristics and 8+ hours of stencil life. WS488 is compatible with all leaded and lead-free alloys, and has been developed for use in a wide range of applications. Easily cleaned in tap water, this all purpose water soluble product was created to meet the industry's demand for a consistently reliable water soluble product. Printing: - Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle (a bead diameter of 12 to 16 mm (1/2 to inch) is normally sufficient to begin). Apply small amounts of fresh solder paste to the stencil at controlled intervals to maintain paste chemistry and workable properties. WS488 provides the necessary tack time and force for today's high speed placement equipment, which will enhance product performance and reliability. RECOMMENDED INITIAL PRINTER SETTINGS BELOW ARE DEPENDENT ON PCB AND PAD DESIGN PARAMETER RECOMMENDED INITIAL SETTINGS PARAMETER Squeegee Pressure Squeegee Speed Snap-off Distance 0.10-0.30 kg/cm (.6 - 1.7 lbs/In.) of blade 12-150 mm/sec (.5-6"/sec) On Contact 0.00 mm (0.00") PCB Separation Distance PCB Separation Speed RECOMMENDED INITIAL SETTINGS 0.75-2.0 mm (.030-.080") Slow Reflow Profile: Two unique profile families are depicted below; both can be used in ramp-spike or ramp-soak-spike applications, and they each have similar reflow temperatures. The two profiles differ in where they reach their respective peak temperatures, as well as the time above liquidus (TAL). The shorter profile of the two would apply to smaller assemblies, where as the longer profile would apply to larger assemblies, such as backplanes or high-density boards. The shaded area defines the process window. Oven efficiency, board size/mass, component type and density all influence the final profile for a given assembly. These profiles are starting points, and processing boards with thermalcouples attached is recommended to optimize the process. RATE OF RISE 2C / SEC MAX RAMP TO 150C (302F) Short Profiles Long Profiles 75 Sec 90 Sec PROGRESS THROUGH 150C-175C (302F-347F) 30-60 Sec 60-90 Sec TO PEAK TEMP 230C245C (445F474F) TIME ABOVE 217C (425F) 45-75 Sec 45-75 Sec 30-60 Sec 60-90 Sec COOLDOWN PROFILE 4 C / SEC LENGTH AMBIENT TO COOL DOWN 45 15 Sec 2.75-3.5 Min 45 15 Sec 4.5-5.0 Min THE RECOMMENDED REFLOW PROFILE FOR WS488 IS PROVIDED AS A GUIDELINE. OPTIMAL PROFILE MAY DIFFER DUE TO OVEN TYPE, ASSEMBLY LAYOUT, OR OTHER PROCESS VARIABLES. CONTACT AIM TECHNICAL SUPPORT IF YOU REQUIRE ADDITIONAL PROFILING ASSISTANCE. THE REFLOW PROFILE FOR THE SAC305 PASTES USING A VAPOR PHASE REFLOW OVEN: PEAK TEMPERATURE RANGE I S 230C - 245C. Compatible Products: - Electropure Solder Bar - WS Tacky Flux - WS715; WS375 Spray Flux - WS482 Cored Wire - Epoxy 4089 - Chip Bonding Epoxy - 200AX - Stencil Cleaner Cleaning: WS488 can be cleaned easily with normal tap water. Deionized water is recommended for the final rinse. A temperature of 38C (100F) - 66C (150F) is sufficient for removing residues. An in-line or other pressurized spray cleaning system is suggested, but is not required. Handling and Storage: - WS488 has a refrigerated shelf life of 1 year at 4C (40F) - 12C (55F). - Allow the solder paste to warm naturally to ambient temperature (8 hrs.) prior to breaking the seal for use. - Mix the product lightly and thoroughly for 1 to 2 minutes to ensure even distribution of any separated material. - Do not store new and used paste in the same container, and reseal any opened containers while not in use. - Replace the internal plug and cap of the 500 gram jars to ensure the best possible seal. Safety: - Use with adequate ventilation and proper personal protective equipment. - Refer to the accompanying Material Safety Data Sheet for any specific emergency information. - Do not dispose of any lead-containing materials in non-approved containers. Physical Properties: ITEM Appearance Alloy Melting Point Particle Size General Metal Loading Viscosity Packaging SPECIFICATION Gray, Smooth, Creamy SAC305 217C T3, T4, T5 88.5% (T3) Print/Dispense Versions Available Available in all industry standard packaging. Test Data Summary: CLASSIFICATION Product Name WS488 POWDER TESTING No. Item 1 IPC Classification to J-STD-004 Copper Mirror to J-STD-004 Silver Chromate to J-STD-004 ORM1 < 50% Breakthrough - M Halides Present Powder Size 2 Powder Shape FLUX MEDIUM TESTING No. Item 1 Acid Value 2 Fluorides Spot Test 3 4 T-Bar Spindle Test Method SOLDER PASTE TESTING No. Item 1 Tack Test 2 Tack Test 3 Solder Ball Test 4 Wetting Test 5 Paste Shelf Life 6 Solder Paste Slump Test Test Method Results 55.17 mg KOH/g Flux Test Method J-STD-004 IPC TM 650 2.3.13 J-STD-004 IPC TM 650 2.3.35.1 J-STD-004 IPC TM 650 2.3.35.2 J-STD-004 IPC TM 650 2.3.32 J-STD-004 IPC TM 650 2.3.33 No Fluoride Corrosivity Test/ Copper Mirror Halide-Free/Silver Chromate Paper Test Surface Insulation Resistance (Solder paste was reflowed on test coupons, left at ambient temperatures for 2 weeks, then 5 cleaned with 55-58C tap water for 120 sec, and allowed to air dried for 30 min before testing) 6 Compatibility Test VISCOSITY TESTING No. Item 1 Results Type 3 - 45-25 micron Type 4 - 38-20 micron Spherical < 50% Breakthrough - M Halides Present Control Coupons > 1E9 at 96 & 168 h. Pass Sample Coupons > 1E8 at 96 & 168 h. Pass > No dendrite growth or corrosion, after a visual inspection - pass See list of recommended products above J-STD-004 IPC TM 650 2.2.14 Microscope J-STD-004 IPC TM 650 2.6.3.3 GR-78-CORE Results Printing: 900 10% kcps Dispensing: 400 20% kcps Test Method Results 30.5 gf 82.8 gf Pass Pass 4C (39F) = 1 year Pass Test Method J-STD-005 IPC TM 650 2.4.44 JIS Z 3284 Annez 9 J-STD-005 IPC TM 650 2.4.43 J-STD-005 IPC TM 650 2.4.45 AIM TM 125-11 J-STD-005 IPC TM 650 2.4.35 J-STD-005 IPC TM 650 2.4.34 Manufacturing and Distribution Worldwide Canada +1-514-494-2000 * USA +1-401-463-5605 * Mexico +52-656-630-0032 * Europe +44-1737-222-258 Asia-Pacific +86-755-2993-6487 * India +91-80-41554753 * info@aimsolder.com * www.aimsolder.com AIM IS ISO9001:2008 CERTIFIED The information contained herein is based on data considered accurate and is offered at no charge. Product information is based upon the assumption of proper handling and operating conditions. All information pertaining to solder paste is produced with 45-micron powder. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. Please refer to http://www.aimsolder.com/terms.cfm to review AIM's terms and conditions. 3/12 Document Rev # 7 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: AIM - American Iron and Metal: 21366 21381 21383 21393 21601 21602 21634 22407 22408 22456 22634 22641