Water Soluble Solder Paste
Features:
- Excellent Wetting - Superior Slump Resistance - Aqueous Wash with Water
- Extended Cleaning Window - 8 Hour + Stencil Life - Large Process Window
Description:
AIM’s WS488 water soluble solder paste has been designed to wet virtually any solderable electronic surfaces,
components, assemblies, and substrates. WS488 offers superior slump resistance, as well as excellent print
characteristics and 8+ hours of stencil life. WS488 is compatible with all leaded and lead-free alloys, and has been
developed for use in a wide range of applications. Easily cleaned in tap water, this all purpose water soluble product
was created to meet the industry’s demand for a consistently reliable water soluble product.
Printing:
- Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle (a bead diameter of 12 to 16
mm (½ to ⅝ inch) is normally sufficient to begin).
- Apply small amounts of fresh solder paste to the stencil at controlled intervals to maintain paste chemistry and
workable properties.
- WS488 provides the necessary tack time and force for today’s high speed placement equipment, which will
enhance product performance and reliability.
Reflow Profile:
Two unique profile families are depicted below; both can be used in ramp-spike or ramp-soak-spike applications, and
they each have similar reflow temperatures. The two profiles differ in where they reach their respective peak
temperatures, as well as the time above liquidus (TAL). The shorter profile of the two would apply to smaller
assemblies, where as the longer profile would apply to larger assemblies, such as backplanes or high-density boards.
The shaded area defines the process window. Oven efficiency, board size/mass, component type and density all
influence the final profile for a given assembly. These profiles are starting points, and processing boards with thermal-
couples attached is recommended to optimize the process.
RECOMMENDED INITIAL PRINTER SETTINGS BELOW ARE DEPENDENT ON PCB AND PAD DESIGN
PARAMETER
RECOMMENDED INITIAL SETTINGS
PARAMETER
RECOMMENDED INITIAL SETTINGS
Squeegee Pressure
0.10-0.30 kg/cm (.6 - 1.7 lbs/In.) of blade
PCB Separation Distance
0.75-2.0 mm (.030-.080”)
Squeegee Speed
12-150 mm/sec (.5-6”/sec)
PCB Separation Speed
Slow
Snap-off Distance
On Contact 0.00 mm (0.00”)
WS488
SAC305
Compatible Products:
- Electropure Solder Bar
- WS Tacky Flux
- WS715; WS375 Spray Flux
- WS482 Cored Wire
- Epoxy 4089 – Chip Bonding Epoxy
- 200AX – Stencil Cleaner
Cleaning:
WS488 can be cleaned easily with normal tap water. Deionized water is recommended for the final rinse. A
temperature of 38°C (100°F) - 66°C (150°F) is sufficient for removing residues. An in-line or other
pressurized spray cleaning system is suggested, but is not required.
Handling and Storage:
- WS488 has a refrigerated shelf life of 1 year at 4°C (40°F) - 12°C (55°F).
- Allow the solder paste to warm naturally to ambient temperature (8 hrs.) prior to breaking the seal for use.
- Mix the product lightly and thoroughly for 1 to 2 minutes to ensure even distribution of any separated
material.
- Do not store new and used paste in the same container, and reseal any opened containers while not in use.
- Replace the internal plug and cap of the 500 gram jars to ensure the best possible seal.
Safety:
- Use with adequate ventilation and proper personal protective equipment.
- Refer to the accompanying Material Safety Data Sheet for any specific emergency information.
- Do not dispose of any lead-containing materials in non-approved containers.
Physical Properties:
RATE OF
RISE 2°C /
SEC MAX
RAMP
TO
150°C
(302°F)
PROGRESS
THROUGH
150°C-175°C
(302°F-347°F)
TO PEAK
TEMP 230°C-
245°C (445°F-
474°F)
TIME ABOVE
217°C (425°F)
COOLDOWN
≤ 4 °C / SEC
PROFILE
LENGTH
AMBIENT
TO COOL
DOWN
Short Profiles
≤ 75 Sec
30-60 Sec
45-75 Sec
30-60 Sec
45± 15 Sec
2.75-3.5 Min
Long Profiles
≤ 90 Sec
60-90 Sec
45-75 Sec
60-90 Sec
45± 15 Sec
4.5-5.0 Min
ITEM
SPECIFICATION
Appearance
Gray, Smooth, Creamy
Alloy
SAC305
Melting Point
217°C
Particle Size
T3, T4, T5
General Metal Loading
88.5% (T3)
Viscosity
Print/Dispense Versions Available
Packaging
Available in all industry standard packaging.
THE RECOMMENDED REFLOW PROFILE FOR WS488 IS PROVIDED AS A GUIDELINE. OPTIMAL PROFILE MAY DIFFER DUE TO OVEN TYPE, ASSEMBLY
LAYOUT, OR OTHER PROCESS VARIABLES. CONTACT AIM TECHNICAL SUPPORT IF YOU REQUIRE ADDITIONAL PROFILING ASSISTANCE.
THE REFLOW PROFILE FOR THE SAC305 PASTES USING A VAPOR PHASE REFLOW OVEN: PEAK TEMPERATURE RANGE I S 230°C – 245°C.
Test Data Summary:
Manufacturing and Distribution Worldwide
Canada +1-514-494-2000 · USA +1-401-463-5605 · Mexico +52-656-630-0032 · Europe +44-1737-222-258
Asia-Pacific +86-755-2993-6487 · India +91-80-41554753 ·
info@aimsolder.com · www.aimsolder.com
AIM IS ISO9001:2008 CERTIFIED
The information contained herein is based on data considered accurate and is offered at no charge. Product information is based upon the
assumption of proper handling and operating conditions. All information pertaining to solder paste is produced with 45-micron powder. Liability
is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. Please refer to
http://www.aimsolder.com/terms.cfm to review AIM's terms and conditions. 3/12
Document Rev # 7
CLASSIFICATION
Product
Name
IPC Classification to J-STD-004
Copper Mirror to J-STD-004
Silver Chromate to J-STD-004
WS488
ORM1
< 50% Breakthrough – M
Halides Present
POWDER TESTING
No.
Item
Results
Test Method
1
Powder Size
Type 3 – 45-25 micron
Type 4 – 38-20 micron
J-STD-004 IPC TM 650 2.2.14
2
Powder Shape
Spherical
Microscope
FLUX MEDIUM TESTING
No.
Item
Results
Test Method
1
Acid Value
55.17 mg KOH/g Flux
J-STD-004 IPC TM 650 2.3.13
2
Fluorides Spot Test
No Fluoride
J-STD-004 IPC TM 650 2.3.35.1
J-STD-004 IPC TM 650 2.3.35.2
3
Corrosivity Test/ Copper Mirror
< 50% Breakthrough – M
J-STD-004 IPC TM 650 2.3.32
4
Halide-Free/Silver Chromate Paper Test
Halides Present
J-STD-004 IPC TM 650 2.3.33
5
Surface Insulation Resistance
(Solder paste was reflowed on test coupons,
left at ambient temperatures for 2 weeks, then
cleaned with 55-58°C tap water for 120 sec,
and allowed to air dried for 30 min before
testing)
Control Coupons > 1E9 at 96 & 168 h. -
Pass
Sample Coupons > 1E8 at 96 & 168 h. -
Pass
> No dendrite growth or corrosion, after a
visual inspection - pass
J-STD-004 IPC TM 650 2.6.3.3
6
Compatibility Test
See list of recommended products above
GR-78-CORE
VISCOSITY TESTING
No.
Item
Results
Test Method
1
T-Bar Spindle Test Method
Printing: 900 ± 10% kcps
Dispensing: 400 ± 20% kcps
J-STD-005 IPC TM 650 2.4.34
SOLDER PASTE TESTING
No.
Item
Results
Test Method
1
Tack Test
30.5 gf
J-STD-005 IPC TM 650 2.4.44
2
Tack Test
82.8 gf
JIS Z 3284 Annez 9
3
Solder Ball Test
Pass
J-STD-005 IPC TM 650 2.4.43
4
Wetting Test
Pass
J-STD-005 IPC TM 650 2.4.45
5
Paste Shelf Life
4°C (39°F) = 1 year
AIM TM 125-11
6
Solder Paste Slump Test
Pass
J-STD-005 IPC TM 650 2.4.35
