ASMT-MxK0
MoonstoneTM 1W Power LED Light Source on MCPCB
Data Sheet
Description
1W Power LED Light Source is a high performance energy
ecient device which can handle high thermal and high
driving current. The exposed pad design has excellent
heat transfer from the package to the motherboard.
The 1W Power LED light source is mounted on to metal
core PCB enabling optimum heat dissipation and ease of
installation.
The low prole package design is suitable for a wide variety
of applications especially where height is a constraint.
Applications
• Portable (ash light, bicycle head light)
• Reading light
• Architectural lighting
• Garden lighting
• Decorative lighting
Features
• Available in Red, Amber, Green, Blue, Cool White and
Warm White color.
• Energy ecient
• High current operation.
• Long operation life.
• Wide viewing angle.
• Silicone encapsulation
Specications
• AllnGaP Technology for Red and Amber
• InGaN Technology for Green, Blue, Cool White and
Warm White color
• 2.4V, 350mA (typical) for AlInGaP Technology
• 3.6V, 350 mA (typical) for InGaN Technology
• 110 viewing angle for White Products
• 120 viewing angle for Mono color Products
2
Package Dimensions
Notes:
1. All dimensions in millimeters
2. Tolerance is ±0.1mm unless otherwise specied.
3
Device Selection Guide at Junction Temperature Tj = 25°C
Color
Part Number
Luminous Flux, Φv[1,2,3] (lm) Test Current
Dice TechnologyMin Typ Max (mA)
Red ASMT-MRK0 25.5 40.0 56.0 350 AlInGaP
Amber ASMT-MAK0 25.5 35.0 43.0 350 AlInGaP
Green ASMT-MGK0 43.0 60.0 73.0 350 InGaN
Blue ASMT-MBK0 11.5 15.0 25.5 350 InGaN
Cool White ASMT-MWK0 43.0 60.0 73.0 350 InGaN
Warm White ASMT-MYK0 43.0 50.0 73.0 350 InGaN
Notes:
1. ΦV is the total luminous ux output as measured with an integrating sphere at 25ms mono pulse condition.
2. Flux tolerance is ±10 %
3. ΦV data are only applicable for ASMT-Mx00 component level device only.
Part Numbering System
Absolute Maximum Ratings[4] at TA = 25°C
Parameters ASMT - Mx KO Units
DC Forward Current [5] 350 mA
Peak Pulsing Current [6] 500 mA
Power Dissipation for AllnGaP 1050 mW
Power Dissipation for InGaN 1400 mW
LED Junction Temperature for AllnGaP 120 °C
LED Junction Temperature for InGaN 110 °C
Operating Ambient Temperature Range -40 to + 85 °C
Storage Temperature Range -40 to + 100 °C
Note:
4. Absolute Maximum Rating data are only applicable for ASMT-Mx00 component level device only.
5. DC forward current – derate linearly based on Figure 5 for AlInGaP & Figure 11 for InGaN.
6. Pulse condition duty factor = 10%, Frequency = 1kHz.
ASMT- M x KO -x1 x2 x3
Color Bin Selection
Max Flux Bin Selection
Min Flux Bin Selection
Color
B - Blue
G - Green
W - Cool White
Y - Warm White
4
Optical Characteristics[1] (TA = 25 °C)
Part Number Color
Peak Wavelength
λPEAK (nm)
Dominant Wavelength
λD [2] (nm)
Viewing Angle
2θ½[3] (Degrees)
Luminous Eciency
(lm/W)
Typ. Typ. Typ. Typ.
ASMT-MRK0 Red 635 625 120 48
ASMT-MAK0 Amber 598 590 120 42
ASMT-MGK0 Green 519 525 120 48
ASMT-MBK0 Blue 460 467 120 12
Part Number Color
Correlated Color Temperature, CCT
(Kelvin)
Viewing Angle
2θ½ [2] (Degrees)
Luminous Eciency
(lm/W)
Min Max Typ Typ
ASMT-MWK0 Cool White 4000 10000 110 48
ASMT-MYK0 Warm White 2600 4000 110 40
Notes:
1. Optical Characteristics data are only applicable for ASMT-Mx00 component level device only.
2. The dominant wavelength, λD, is derived from the CIE Chromaticity Diagram and represents the color of the device.
3. θ½ is the o-axis angle where the luminous intensity is ½ the peak intensity.
Electrical Characteristic [4] (TA = 25 °C)
Forward Voltage VF
(Volts) @ IF = 350mA
Reverse Voltage VR
(Volts)
Thermal Resistance
Rθj-b (°C/W) [5]
Dice Type Min Typ Max. Max. Typ.
AlInGaP 2.0 2.4 3.0 5 12
InGaN 3.2 3.6 4.0 5 18
Note:
4. Electrical Characteristic data are only applicable for ASMT-Mx00 component level device only.
5. RΘj-b is Thermal Resistance from LED junction to MCPCB.
5
0
50
100
150
200
250
300
350
400
450
500
0.00 0.50 1.00 1.50 2.00 2.50 3.00
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90 -70 -50 -30 -10 10 30 50 70 90
OFF-AXIS ANGLE(°)
RELATIVE INTENSITY
0
50
100
150
200
250
300
350
400
0 10 20 30 40 50 60 70 80 90
TA AMBIENT TEMPERATURE - °C
IF MAX FORWARD CURRENT - mA
0
0.5
1
1.5
2
-40 -25 -10 5 20 35 50 65 80 95 110
JUNCTION TEMPERATURE - ˚C
RELATIVE LOP (NORMALIZED AT 25⁰C)
RED
AMBER
RJA = 50°C/W
RJA = 40°C/W
RJA = 30°C/W
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630 680 730 780
WAVELENGTH - nm
RELATIVE INTENSITY
RED
AMBER
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0 50 100 150 200 250 300 350 400 450 500
MONO PULSE CURRENT - mA
RELATIVE LUMINOUS FLUX (φv) - lm
Figure 1. Relative Intensity vs. Wavelength for AlInGaP Figure 2. Forward Current vs Forward Voltage for AlInGaP
Figure 3. Relative Luminous Flux vs. Mono Pulse Current for AlInGaP Figure 4. Radiation Pattern for AlInGaP
Figure 5. Maximum forward current vs. ambient temperature for AlInGaP Figure 6. Relative LOP (Normalized at 25°C) vs. junction temperature for
Derated based on TJMAX = 120°C, RθJA = 30°C/W / 40°C/W and 50°C/W AlInGaP
6
0
50
100
150
200
250
300
350
400
0 10 20 30 40 50 60 70 80 90
TA AMBIENT TEMPERATURE - °C
IF MAX FORWARD CURRENT - mA
0
50
100
150
200
250
300
350
400
0 10 20 30 40 50 60 70 80 90
450
460
470
480
490
500
510
520
530
540
100 150 200 250 300 350 400
FORWARD CURRENT - mA
DOMINANT WAVELENGTH - nm
Green
Blue
0.00
0.20
0.40
0.60
0.80
1.00
1.20
1.40
0 50 100 150 200 250 300 350 400 450 500
MONO PULSE CURRENT - mA
RELATIVE LUMINOUS FLUX (Φv) - lm
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
-90 -70 -50 -30 -10 10 30 50 70 90
OFF-AXIS ANGLE (°)
RELATIVE INTENSITY
GREEN
BLUE
COOL WHITE
WARM WHITE
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630 680 730 780
WAVELENGTH - nm
RELATIVE INTENSITY
GREEN
BLUE
COOL WHITE
WARM WHITE
0
50
100
150
200
250
300
350
400
450
500
0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
RJA = 30°C/W
RJA = 40°C/W
RJA = 50°C/W
Figure 7. Relative Intensity vs. Wavelength for InGaN Figure 8. Forward Current vs Forward Voltage for InGaN
Figure 9. Relative Luminous Flux vs. Mono Pulse Current for InGaN Figure 10. Radiation Pattern for InGaN
Figure 11. Maximum forward current vs. ambient temperature for InGaN Figure 12. Dominant wavelength vs. forward current – InGaN devices
Derated based on TJMAX = 110°C, RθJA = 30°C/W / 40°C/W and 50°C/W
7
0.000
0.002
0.004
0.006
0.008
0.010
0.012
0.014
0.016
0.000 0.001 0.002 0.003 0.004 0.005 0.006 0.007 0.008
Y-COORDINATES
100mA
350mA
300mA
250mA
150mA
-300
-250
-200
-150
-100
-50
0
50
100
150
200
250
300
-40 -15 10 35 60 85
TEMPERATURE - °C
RELATIVE FORWARD VOLTAGE SHIFT (mV)
0
0.5
1
1.5
2
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110
JUNCTION TEMPERATURE - °C
RELATIVE LOP (%) Normalized at 25⁰C
GREEN
BLUE
COOL WHITE
WARM WHITE
Figure 13. Chromaticity Shift vs. Current Figure 14. Temperature vs. relative forward voltage shift
*Note: (x,y) values @ 350mA reference to (0.0)
Figure 15. Relative LOP vs. junction temperature for InGaN
Note: All parametric charts are only applicable for ASMT-Mx00 component level device only
8
Bin
Flux (lm) at 350mA
Min Max
A 5.5 7.0
B 7.0 9.0
C 9.0 11.5
D 11.5 15.0
E 15.0 19.5
F 19.5 25.5
G 25.5 33.0
H 33.0 43.0
J 43.0 56.0
K 56.0 73.0
0 Full Distribution
A A only
B B only
C C only
D D only
E E only
F F only
G G only
H H only
Z A and B only
Y B and C only
W C and D only
V D and E only
U E and F only
T F and G only
S G and H only
Q A, B and C only
P B, C and D only
N C, D and E only
M D, E and F only
L E, F and G only
K F, G and H only
J Special Color Bin
1 A, B, C and D only
2 E, F, G and H only
3 B, C, D and E only
4 C, D, E and F only
5 A, B, C, D and E only
6 B, C, D, E, and F only
0 Full Distribution
A A only
B B only
C C only
D D only
E E only
F F only
Z A and B only
Y B and C only
W C and D only
V D and E only
U E and F only
Q A, B and C only
P B, C and D only
N C, D and E only
M D, E and F only
J Special Color Bin
1 A, B, C and D only
2 E, F, G and H only
3 B, C, D and E only
4 C, D, E and F only
5 A, B, C, D and E only
6 B, C, D, E, and F only
Amber Min. (nm) Max. (nm)
A 582.0 584.5
B 584.5 587.0
C 587.0 589.5
D 589.5 592.0
E 592.0 594.5
Blue Min. (nm) Max. (nm)
A 460.0 465.0
B 465.0 470.0
C 470.0 475.0
D 475.0 480.0
Green Min. (nm) Max. (nm)
A 515.0 520.0
B 520.0 525.0
C 525.0 530.0
D 530.0 535.0
Tolerence for each bin limits is ±10 %
Note:
1. Flux Bin Limit is only applicable for ASMT-Mx00 component
level device only
Flux Bin Limit[1] (For reference only) [x1 x2] Color Bin Limits
Color Bin Selections [x3]
Individual reel will contain parts from one full bin only.
Cool White Warm White
9
Cool
White
Color Limits[1]
(Chromaticity Coordinates)
Bin A X
Y
0.367
0.400
0.362
0.372
0.329
0.345
0.329
0.369
Bin B X
Y
0.362
0.372
0.356
0.330
0.329
0.302
0.329
0.345
Bin C X
Y
0.329
0.369
0.329
0.345
0.305
0.322
0.301
0.342
Bin D X
Y
0.329
0.345
0.329
0.302
0.311
0.285
0.305
0.322
Bin E X
Y
0.303
0.333
0.307
0.311
0.283
0.284
0.274
0.301
Bin F X
Y
0.307
0.311
0.311
0.285
0.290
0.265
0.283
0.284
Bin G X
Y
0.388
0.417
0.379
0.383
0.362
0.372
0.367
0.400
Bin H X
Y
0.379
0.383
0.369
0.343
0.356
0.330
0.362
0.372
Warm
White
Color Limits[1]
(Chromaticity Coordinates)
Bin A X
Y
0.452
0.434
0.488
0.447
0.470
0.414
0.438
0.403
Bin B X
Y
0.438
0.403
0.470
0.414
0.452
0.384
0.424
0.376
Bin C X
Y
0.407
0.393
0.418
0.422
0.452
0.434
0.438
0.403
Bin D X
Y
0.395
0.362
0.407
0.393
0.438
0.403
0.424
0.376
Bin E X
Y
0.381
0.377
0.387
0.404
0.418
0.422
0.407
0.393
Bin F X
Y
0.373
0.349
0.381
0.377
0.407
0.393
0.395
0.362
Tolerances ± 0.01
Primary Color Binning
0.24
0.26
0.28
0.30
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44
X - COORDINATE
Y - COORDINATE
B
C
E
Black Body Curve
D
A
F
4.5k
5.6k
7k
10k
4.0k
G
H
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.52
X - COORDINATE
Y - COORDINATE
B
C
E
Black Body Curve
D
A
F
3.0k
3.5k
4.0k
2.6k
Tolerance ± 0.01
Note:
1. Color Limit and Color binning chart are only applicable for ASMT-Mx00 component level device only
10
Cool White (Chromaticity Coordinates)
Bin A1 X 0.364 0.367 0.348 0.347
Y 0.383 0.400 0.385 0.372
Bin A2 X 0.364 0.362 0.346 0.347
Y 0.383 0.372 0.359 0.372
Bin A3 X 0.329 0.329 0.348 0.347
Y 0.357 0.369 0.385 0.372
Bin A4 X 0.329 0.329 0.347 0.346
Y 0.345 0.357 0.372 0.359
Bin B1 X 0.362 0.360 0.344 0.346
Y 0.372 0.357 0.344 0.359
Bin B2 X 0.360 0.358 0.343 0.344
Y 0.357 0.343 0.331 0.344
Bin B3 X 0.358 0.356 0.341 0.343
Y 0.343 0.330 0.314 0.331
Bin B4 X 0.329 0.329 0.346 0.344
Y 0.331 0.345 0.359 0.344
Bin B5 X 0.329 0.344 0.343 0.329
Y 0.331 0.344 0.331 0.320
Bin B6 X 0.343 0.341 0.329 0.329
Y 0.331 0.314 0.302 0.320
Bin C1 X 0.329 0.329 0.315 0.314
Y 0.369 0.357 0.344 0.355
Bin C2 X 0.329 0.329 0.316 0.315
Y 0.357 0.345 0.333 0.344
Bin C3 X 0.314 0.315 0.303 0.301
Y 0.355 0.344 0.333 0.342
Bin C4 X 0.315 0.316 0.305 0.303
Y 0.344 0.333 0.322 0.333
0.24
0.26
0.28
0.30
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44
X - COORDINATE
Y - COORDINATE
Black Body Curve
4.5k
5.6k
7k
10k
4.0k
A1
A2
A3
A4
B1
B2
B3
B4
B5
B6
C1
C2
C3
C4
D1
D2
D3
D4
D5
D6
G1
G2
H1
H2
H3
Sub-Color Binning
(Only Applicable for Color Bin A to Bin D and Bin G to Bin H)
Color Limits[1]
Note:
1. Color Limit and Color binning chart are only applicable for ASMT-
Mx00 component level device only
Tolerance ± 0.01
Warm White (Chromaticity Coordinates)
Bin D1 X
Y
0.329
0.345
0.329
0.331
0.317
0.320
0.316
0.33
Bin D2 X
Y
0.329
0.331
0.329
0.320
0.318
0.310
0.317
0.320
Bin D3 X
Y
0.329
0.320
0.329
0.302
0.320
0.293
0.318
0.310
Bin D4 X
Y
0.316
0.333
0.317
0.320
0.307
0.311
0.305
0.322
Bin D5 X
Y
0.317
0.320
0.318
0.310
0.309
0.300
0.307
0.311
Bin D6 X
Y
0.318
0.310
0.320
0.293
0.311
0.285
0.309
0.300
Bin G1 X
Y
0.392
0.421
0.386
0.400
0.364
0.383
0.367
0.400
Bin G2 X
Y
0.386
0.400
0.382
0.385
0.362
0.372
0.364
0.383
Bin H1 X
Y
0.382
0.385
0.378
0.370
0.360
0.357
0.362
0.372
Bin H2 X
Y
0.378
0.370
0.375
0.358
0.358
0.34
0.360
0.357
Bin H3 X
Y
0.375
0.358
0.371
0.344
0.356
0.330
0.358
0.343
Package Tray Dimensions
Handling Precaution
The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft
material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product
and cause premature failure. During assembly or handling, the unit should be held on the body (white plastic).
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHO-
RIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE
OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER
IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL
LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved.
AV02-1086EN - April 1, 2009
6.25