Voidless-Hermetically-Sealed Bidirectional
Transient Suppressors
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
Copyright © 2010
03-30-2010 REV F; SA4-13.pdf
WWW.Microsemi .COM
SCOTTSDALE DIVISION
1N6103 thru 1N6137A
and 1N6139 thru 1N6173A
1N6103 – 1N6137A
1N6139 – 1N6173A
DESCRIPTION APPEARANCE
This series of industry recognized voidless-hermetically-sealed Bidirectional Transient
Voltage Suppressor (T VS) designs is military qua lified to MIL-PRF-19500/516 and are
ideal for high-relia bility applications where a failur e cannot be tolerated. They prov ide
a Working Peak “Standoff” Voltage selection from 5.2 to 152 Volts with two package
sizes for 500 W and 1500 W ratings. They are very robust in hard-glass construction
and also use an internal metallurgical bond identified as Category I for high reliability
applications. Both of these are also military qualified to MIL-PRF-19500/516. These
devices are availa ble as both a n on-suffix part and an “A” suffix part involv ing different
voltage tolerances as further described in note 4 on page 2. These devices are also
available in a s urface mount MELF packag e configurati on by addi ng a “US” suffix (se e
separate data sheet for 1N6103US thru 1N6173AUS). Microsemi also offers
numerous other TVS products to meet high er and lower peak pulse po wer and voltage
ratings in both through-hole and surface-mount packages.
“E” Package
“G” Package
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES APPLIC ATIONS / BENEFITS
• High surge current and peak pulse power provides
transient voltage protection for sensitive circuits
• Triple-layer passivation
• Internal “Category I” metallurgical bonds
• Voidless hermetically s ealed glass package
• JAN/TX/TXV military qualifications ava ilable per MIL-
PRF-19500/516 by adding JAN, JANTX, or JANTXV
prefix (consult factory for 1N6103 and 1N6138)
• JANS available for 1N6103A thru 1N6118A per MIL-
PRF-19500/516 as well as further options for screening
in accordance with MIL-PRF - 19500 for JANS on all
others in this series by using a “SP” prefix, e.g.
SP6119A, SP6143A, etc.
• Surface Mount equivalents are also available in a
square-end-cap MELF configuration with a “US” suffix
(see separate data sheet)
• Military and other high reliability transient
protection
• Extremely robust construction
• Extensive range in Working Peak “Standoff”
Voltage (VWM) from 5.7 to 152 V
• Available as either 500 W or 1500 W Peak Pulse
Power (PPP) using two different size packages
• ESD and EFT protection per IEC61 00-4-2 and
IEC61000-4-4 respectively
• Secondary lightning protection per select levels
in IEC61000-4-5
• Flexible axial-leaded mo unting terminals
• Nonsensitive to ESD per MIL-STD-750 Method
1020
• Inherently radiation hard as described in
Microsemi MicroNote 050
MAXIMUM RAT ING S MECHANICAL AND PACKAGING
• Operating & Storage Temperature: -55oC to +175oC
• Peak Pulse Power at 25oC: 500 Watts for 1N6103 to
1N6137A and 1500 W atts for 1N6139 to 1 N6 173A @
10/1000 µs (also see Figures 1,2 and 3)
• Impulse repetition rate (duty factor): 0.01%
• Steady-State Power: 3.0 W for 1N6103 to 1N6137A and
5.0 W for 1N6139 to 1N6173A @ T L = 75oC @3/8 inch
lead length from body (see Figure 4)
• Steady-State Power: 2.0 W for 1N6103 to 1N6137A and
3.0 W for 1N6139 to 1N6173A @ T A=25oC (see note
below and Figure 5)
• Thermal Resistance @ 3/8 inch lead length:
33.5 oC/W for 1N6103 to 1N6137A and 20.0 oC/W for
1N6139 thru 1N6173A
• Solder Temperatures: 260oC for 10 s (maximum)
• CASE: Hermetically sealed voidless hard glass
with Tungsten slugs
• TERMINATIONS: Axial-le ads are Tin/Lead (Sn/Pb)
over copper. Note: Previous JANS inventor y had
solid Silver (Ag) axial-leads and no finish
• MARKING: Body painted and part number, etc.
• POLARITY: No polarity marking for these
bidirectional TVSs
• Tape & Reel option: Standard per EIA-296
• Weight: 750 mg for 500 Watt (E Package)
1270 mg for 1500 Watt (G Package)
• See package dimensions on last page for b oth the
“E” and “G” size packages
NOTE: Steady-state power ratings with reference to ambient are for PC boards where thermal resistance from
mounting point to ambient is sufficiently cont rolled where TOP or TJ(MAX) is not exceeded.
Voidless-Hermetically-Sealed Bidirectional
Transient Suppressors
WWW.Microsemi .COM
SCOTTSDALE DIVISION
1N6103 thru 1N6137A
and 1N6139 thru 1N6173A
1N6103 – 1N6137A
1N6139 – 1N6173A
ELECTRICAL CHARACTERISTICS
INDUSTRY TYPE
NUMBER
(Note 4)
PPP Rating
MINIMUM BREAKDOWN
VOLTAGE
V(BR) @ I(BR)
RATED
STANDOFF
VOLTAGE
VWM
MAXIMUM
STANDBY
CURRENT
ID@ VWM
500W 1500W
MAXIMUM
CLAMPING
VOLTAGE
VC @ IPP
MAXIMUM
PEAK PULSE
CURRENT IPP
500 W 1500 W
MAXIMUM
TEMP.
COEF. OF
V(BR)
500W 1500W Volts mA V uA uA Volts Amps Amps %/oC
1N6103A 1N6139A 7.13 175 5.7 50 300 11.2 44.6 133.9 .06
1N6104A 1N6140A 7.79 150 6.2 20 100 12.1 41.3 124.0 .06
1N6105A 1N6141A 8.65 150 6.9 20 100 13.4 37.3 111.9 .06
1N6106A 1N6142A 9.50 125 7.6 20 100 14.5 34.5 103.4 .07
1N6107A 1N6143A 10.45 125 8.4 20 20 15.6 32.0 96.2 .07
1N6108A 1N6144A 11.40 100 9.1 20 20 16.9 29.6 88.8 .07
1N6109A 1N6145A 12.35 100 9.9 20 20 18.2 27.5 82.4 .08
1N6110A 1N6146A 14.25 75 11.4 20 20 21.0 23.8 71.4 .08
1N6111A 1N6147A 15.20 75 12.2 20 20 22.3 22.4 67.3 .08
1N6112A 1N6148A 17.10 65 13.7 1 10 25.1 19.9 59.8 .085
1N6113A 1N6149A 19.0 65 15.2 1 5 27.7 18.0 54.2 .085
1N6114A 1N6150A 20.9 50 16.7 1 5 30.5 16.4 49.2 .085
1N6115A 1N6151A 22.8 50 18.2 1 5 33.3 15.0 45.0 .09
1N6116A 1N6152A 25.7 50 20.6 1 5 37.4 13.4 40.1 .09
1N6117A 1N6153A 28.5 40 22.8 1 5 41.6 12.0 36.0 .09
1N6118A 1N6154A 31.4 40 25.1 1 5 45.7 10.9 32.8 .095
1N6119A 1N6155A 34.2 30 27.4 1 5 49.9 10.0 30.1 .095
1N6120A 1N6156A 37.1 30 29.7 1 5 53.6 9.3 28.0 .095
1N6121A 1N6157A 40.9 30 32.7 1 5 59.1 8.5 25.4 .095
1N6122A 1N6158A 44.7 25 35.8 1 5 64.6 7.7 23.2 .095
1N6123A 1N6159A 48.5 25 38.8 1 5 70.1 7.1 21.4 .095
1N6124A 1N6160A 53.2 20 42.6 1 5 77.0 6.5 19.5 .095
1N6125A 1N6161A 58.9 20 47.1 1 5 85.3 5.9 17.6 .100
1N6126A 1N6162A 64.6 20 51.7 1 5 97.1 5.1 15.4 .100
1N6127A 1N6163A 71.3 20 56.0 1 5 103.1 4.8 14.5 .100
1N6128A 1N6164A 77.9 15 62.2 1 5 112.8 4.4 13.3 .100
1N6129A 1N6165A 86.5 15 69.2 1 5 125.1 4.0 12.0 .100
1N6130A 1N6166A 95.0 12 76.0 1 5 137.6 3.6 10.9 .100
1N6131A 1N6167A 104.5 12 86.6 1 5 151.3 3.3 9.9 .100
1N6132A 1N6168A 114.0 10 91.2 1 5 165.1 3.0 9.1 .100
1N6133A 1N6169A 123.5 10 98.8 1 5 178.8 2.8 8.4 .105
1N6134A 1N6170A 142.5 8 114.0 1 5 206.3 2.4 7.3 .105
1N6135A 1N6171A 152.0 8 121.6 1 5 218.4 2.3 6.9 .105
1N6136A 1N6172A 171.0 5 136.8 1 5 245.7 2.0 6.1 .110
1N6137A 1N6173A 190.0 5 152.0 1 5 273.0 1.8 5.5 .110
Note: 4 1 1 1 2 3 1 2 3 1
Notes: 1. Applies to both 500 W and 1500 W series fo r devices shown (see note 4)
2. Applies only to 500 W series (1N61 03 thru 1N6137A).
3. Applies only to 1500 W series (1N6139 thru 1N6173A).
4. Part number without the A suffix has 5% higher VC, 5% lower minimum V(BR), and 5% lower IPP.
SYMBOLS & DEFINITI ONS
Symbol Definition
VBR Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current.
VWM Working Peak Voltage: The maximum peak voltage that can be applied over the operatin g temperature range.
This is also referred to as Standoff Voltage.
ID Maximum Standoff Current: The maximum current that will flow at the specified voltage an d temperature.
VC Maximum clamping voltage at specified IPP (Peak Pulse Current) at the specified pulse conditi ons.
PPP Peak Pulse Power: The peak power dissipation resulting from the peak impulse current IPP.
Microsemi
Scottsdale Division Page 2
Copyright © 2010
03-30-2010 REV F; SA4-13.pdf
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Voidless-Hermetically-Sealed Bidirectional
Transient Suppressors
WWW.Microsemi .COM
SCOTTSDALE DIVISION
1N6103 thru 1N6137A
and 1N6139 thru 1N6173A
1N6103 – 1N6137A
1N6139 – 1N6173A
GRAPHS
PULSE TIME (tp)
FIGURE 1
PEAK PULSE POWER vs. PULSE TIME
MAX PEAK PULSE POWER (PPP) OR
CURRENT (IPP) IN PERCENT OF MAX RATINGS
Peak Pulse Power (PPP)
100 1000 10,000
JUNCTION TEMPERATURE (TJ) IN oC
FIGURE 2
PEAK PULSE POWER vs. TJ
(prior to impulse)
PULSE CURRENT (IPP)
IN PERCENT OF I
PP
TIME (t) IN MILLISECONDS
FIGURE 3
PULSE WAVE FORM
Microsemi
Scottsdale Division Page 3
Copyright © 2010
03-30-2010 REV F; SA4-13.pdf
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Voidless-Hermetically-Sealed Bidirectional
Transient Suppressors
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 4
WWW.Microsemi .COM
SCOTTSDALE DIVISION
1N6103 thru 1N6137A
and 1N6139 thru 1N6173A
1N6103 – 1N6137A
1N6139 – 1N6173A
MAXIMUM STEADY-STATE POWER IN WATTS
LEAD TEMPERATURE LEAD TEMPERATURE AMBIENT TEMPERATURE (TA) in oC
FIGURE 4 FIGURE 5
MAXIMUM POWER vs. LEAD TEMPERATURE STEADY-STATE DERATING CURVE
FOR FREE-AIR MOUNTING
Maximum lead temperature in oC (TL) at point “L” from body (For PC boards where thermal resistance from
(for maximum operating junction temperature with equal two-lead conditions.) mounting point to ambient is sufficiently controlled
whe r e T OP or TJ(MAX) rating is not exceeded)
PACKAGE DIMENSIONS Inches [mm]
PACKAGE E for 1N6103 thru 1N6137A (500 W)
Note: Package E lead dimension diameter is 0.030 inch nominal with –.004 +.003 inch tolerance
PACKAGE G for 1N6139 thru 1N6173A (1500 W)
Note: Package G lead dimension diameter is 0.040 inch nominal with –.004 +.002 inch tolerance
Copyright © 2010
03-30-2010 REV F; SA4-13.pdf
