MIC4607
Features
Applications
General Description
Typical Application Circuit
MIC4607
85V, Three-Phase MOSFET Driver with Adaptive
Dead-Time, Anti-Shoot-Through and Overcurrent
Protection
MIC4607
Package Type
MIC4607-1
MIC4607-1
MIC4607-2
MIC4607-2
MIC4607
Functional Diagram
MIC4607 xPhase Top-Level
Functional Diagram
MIC4607 xPhase Top-Level
Functional Diagram
Input Logic Block
MIC4607
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †, (Note 2)
Operational Characteristics ††, (Note 2)
† Notice:
†† Notice:
Note 1:
2:
MIC4607
DC CHARACTERISTICS (Note 1, 2)
Electrical Characteristics:
Bold
Parameters Symbol Min. Typ. Max. Units Conditions
Supply Current
750
10
150
1.5
75
400
300
Input (TTL: xLI, xHI, xPWM, EN) (Note 3)
0.8
2.2
100 500
50 250
Undervoltage Protection
3.8 4.9
4.0 4.9
Overcurrent Protection
Fault Circuit
Bootstrap Diode
0.70
1
Note 1:
2:
3:
4:
MIC4607
6
xLO Gate Driver
0.6
1
xHO Gate Driver
Switching Specifications (LI/HI mode with inputs non-overlapping, assumes HS low before LI goes high and
LO low before HI goes high).
75
75
75
75
Switching Specifications PWM Mode (MIC4607-2) or LI/HI mode (MIC4607-1) with Overlapping LI/HI Inputs
, 75
75
75
DC CHARACTERISTICS (Note 1, 2) (CONTINUED)
Electrical Characteristics:
Bold
Parameters Symbol Min. Typ. Max. Units Conditions
Note 1:
2:
3:
4:
MIC4607
4
75
100 500
TEMPERATURE SPECIFICATIONS
Electrical Specifications:
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Package Thermal Resistances
DC CHARACTERISTICS (Note 1, 2) (CONTINUED)
Electrical Characteristics:
Bold
Parameters Symbol Min. Typ. Max. Units Conditions
Note 1:
2:
3:
4:
MIC4607
2.0 TYPICAL PERFORMANCE CURVES
FIGURE 2-1: VDD Quiescent Current vs.
VDD Voltage.
FIGURE 2-2: VDD Quiescent Current vs.
Temperature.
FIGURE 2-3: VHB Quiescent Current (All
Channels) vs. VHB Voltage.
FIGURE 2-4: VHB Quiescent Current (All
Channels) vs Temperature.
FIGURE 2-5: VDD+HB Shutdown Current
(Floating Switch Node) vs. Voltage.
FIGURE 2-6: VDD+HB Shutdown Current
(Floating Switch Node) vs. Temperature.
Note:
280
310
340
370
400
430
460
490
5678910111213141516
IVDD QUIESCENT CURRENT (µA)
VDD (V)
-40°C
25°C
125°C
V
xHS
= GND
V
EN
= 5V
280
300
320
340
360
380
400
420
440
460
480
500
-50 -25 0 25 50 75 100 125
I
VDD
QUIESCENT CURRENT (µA)
TEMPERATURE (°C)
V
DD
= 16V
V
DD
= 5.5V V
DD
= 12V
V
xHS
= GND
V
EN
= 5V
20
30
40
50
60
70
80
90
100
5 6 7 8 9 10 11 12 13 14 15 16
I
VHB
QUIESCENT CURRENT (µA)
V
HB
(V)
-40°C
25°C
125°C
V
xHS
= GND
V
EN
= 5V
20
30
40
50
60
70
80
90
100
-50-250 255075100125
IVHB QUIESCENT CURRENT (µA)
TEMPERATURE (°C)
V
HB
= 16V
V
HB
= 5.5V
V
HB
= 12V
V
xHS
= GND
V
EN
= 5V
0
1
2
3
4
5
6
7
8
5 6 7 8 9 10 11 12 13 14 15 16
I
VDD+VHB
SHUTDOWN CURRENT (µA)
V
DD+HB
(V)
-40°C
25°C
125°C
xHI = xLI = 0V
V
xHS
= FLOATING
V
EN
= 0V
V
DD
= V
HB
0
1
2
3
4
5
6
7
8
-50-250 255075100125
IVDD+VHB SHUTDOWN CURRENT (uA)
TEMPERATURE (°C)
V
DD
= 16V
V
DD
= 5.5V
V
DD
= 12V
xHI = xLI = 0V
V
xHS
= FLOATING
V
EN
= 0V
V
DD
= V
HB
MIC4607
FIGURE 2-7: VDD+HB Shutdown Current
(Grounded Switch Node) vs. Voltage.
FIGURE 2-8: VDD+HB Shutdown Current
(Grounded Switch Node) vs. Temperature.
FIGURE 2-9: VDD+HB Operating Current
vs. Switching Frequency.
FIGURE 2-10: VDD+HB Operating Current
vs. Switching Frequency.
FIGURE 2-11: HO/LO Sink On-Resistance
vs. VDD.
FIGURE 2-12: HO/LO Sink On-Resistance
vs. Temperature.
20
30
40
50
60
70
80
90
100
110
120
5 6 7 8 9 10 11 12 13 14 15 16
I
VDD+VHB
SHUTDOWN CURRENT (µA)
V
DD+HB
(V)
-40°C
25°C
125°C
xHI = xL I= 0V
VxHS = GND
V
EN
= 0V
VDD = VHB
20
30
40
50
60
70
80
90
100
110
120
-50 -25 0 25 50 75 100 125
I
VDD+VHB
SHUTDOWN CURRENT (µA)
TEMPERATURE (°C)
V
DD
= 16V
V
DD
= 5.5V
V
DD
= 12V
xHI = xLI = 0V
V
xHS
= GND
VEN = 0V
V
DD
= V
HB
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
0 102030405060708090100
I
DD
+V
HB
OPERATING CURRENT (mA)
FREQUENCY (kHz)
–40ºC
25ºC
125ºC
V
DD
= 12V
V
xHS
= 0V
C
LOAD
= 0nF
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2
0 102030405060708090100
I
DD
+V
HB
OPERATING CURRENT (mA)
FREQUENCY (kHz)
–40ºC
25ºC
125ºC
V
DD
= 16V
V
xHS
= 0V
C
LOAD
=0nF
5
10
15
20
25
5 6 7 8 9 10 11 12 13 14 15 16
R
ON
SOURCE (
Ω
)
V
DD
(V)
–40ºC
25ºC
125ºC
I
HO/LO
= −50mA
V
xHS
= GND
V
EN
= V
HB
= V
DD
0
5
10
15
20
-50 -25 0 25 50 75 100 125
R
ON
SINK (
Ω
)
TEMPERATURE (°C)
V
DD
= 16V
V
DD
= 12V
I
HO/LO
= 50mA
V
xHS
= GND
V
EN
= V
HB
= V
DD
V
DD
= 5.5V
MIC4607
FIGURE 2-13: HO/LO Source
On-Resistance vs. VDD.
FIGURE 2-14: HO/LO Source
On-Resistance vs. Temperature.
FIGURE 2-15: Propagation Delay (HI/LI
Input) vs. VDD Voltage.
FIGURE 2-16: Propagation Delay (HI/LI
Input) vs. Temperature.
FIGURE 2-17: Output Rise Time vs. VDD
Voltage.
FIGURE 2-18: Output Fall Time vs. VDD
Voltage.
5
10
15
20
25
5 6 7 8 9 10 11 12 13 14 15 16
R
ON
SOURCE (
Ω
)
V
DD
(V)
–40ºC
25ºC
125ºC
I
HO/LO
= −50mA
V
xHS
= GND
V
EN
= V
HB
= V
DD
5
10
15
20
25
-50 -25 0 25 50 75 100 125
RON SOURCE (
Ω
)
TEMPERATURE (°C)
V
DD
= 16V
V
DD
= 12V
I
HO/LO
= −50mA
V
xHS
= GND
V
EN
= V
HB
= V
DD
V
DD
= 5.5V
20
30
40
50
60
70
5678910111213141516
DELAY (ns)
V
DD
(V)
t
HPLH
t
HPHL
t
LPLH
T
AMB
= 25°C
V
xHS
= 0V
C
L
= 1nF
t
LPHL
20
30
40
50
60
70
-50-25 0 255075100125
DELAY (ns)
TEMPERATURE (°C)
t
HPLH
t
HPHL
t
LPLH
V
DD
= 12V
V
xHS
= 0V
C
L
=1nF
t
LPHL
10
15
20
25
30
35
40
45
50
5678910111213141516
tr (ns)
V
DD
(V)
25°C
–40°C
125°C
V
xHS
= 0V
C
L
= 1nF
5
10
15
20
25
30
35
40
45
5678910111213141516
tf (ns)
V
DD
(V)
25°C
–40°C
125°C
V
xHS
= 0V
C
L
= 1nF
MIC4607
FIGURE 2-19: Rise/Fall Time vs.
Temperature.
FIGURE 2-20: Dead Time vs. VDD Voltage.
FIGURE 2-21: Dead Time vs. Temperature.
FIGURE 2-22: VDD/VHB UVLO vs.
Temperature.
FIGURE 2-23: Overcurrent Threshold vs.
VDD Voltage.
FIGURE 2-24: Overcurrent Threshold vs.
Temperature.
5
10
15
20
25
30
35
40
45
50
55
-50 -25 0 25 50 75 100 125
tr/tf (ns)
TEMPERATURE (°C)
RISE TIME
V
DD
= 5.5V
V
xHS
= 0V
C
L
=1nF
RISE TIME
V
DD
= 12V
FALL TIME
V
DD
= 12V
FALL TIME
V
DD
= 5.5V
10
20
30
40
50
60
70
80
90
100
110
120
130
5678910111213141516
DEAD TIME (ns)
V
DD
(V)
–40°C
V
xHS
= 0V
C
L
=1nF
T
AMB
= 25°C
25°C
125°C
10
20
30
40
50
60
70
80
90
100
110
120
130
-50 -25 0 25 50 75 100 125
DEAD TIME (ns)
TEMPERATURE (°C)
V
DD
= 12V
V
xHS
= 0V
C
L
=1nF V
DD
= 5.5V
V
DD
= 12V
V
DD
= 16V
4
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
-50-25 0 255075100125
UVLO THRESHOLD (V)
TEMPERATURE (°C)
V
xHS
= 0V
V
HB
RISING
V
HB
FALLING
V
DD
RISING
V
DD
FALLING
MIC4607
FIGURE 2-25: Overcurrent Propagation
Delay vs. VDD Voltage.
FIGURE 2-26: Overcurrent Propagation
Delay vs. Temperature.
FIGURE 2-27: Bootstrap Diode Reverse
Current.
FIGURE 2-28: Bootstrap Diode I-V
Characteristics.
50
60
70
80
90
100
110
120
5 6 7 8 9 10111213141516
PROPAGATION DELAY (ns)
V
DD
(V)
25°C
–40°C
125°C
V
HS
= 0V
50
60
70
80
90
100
110
120
-50 -25 0 25 50 75 100 125
PROPAGATION DELAY (ns)
TEMPERATURE (°C)
V
DD
= 16V
V
DD
= 12V
V
DD
= 5.5V
V
xHS
= 0V
MIC4607
3.0 PIN DESCRIPTIONS
TABLE 3-1: QFN PIN FUNCTION TABLE
Pin Number
QFN
Pin Name
Description
MIC4607-1 MIC4607-2
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
MIC4607
TABLE 3-2: TSSOP PIN FUNCTION TABLE
Pin Number
TSSOP
Pin Name
Description
MIC4607-1 MIC4607-2
.
.
.
.
.
.
.
.
.
TABLE 3-1: QFN PIN FUNCTION TABLE (CONTINUED)
Pin Number
QFN
Pin Name
Description
MIC4607-1 MIC4607-2
MIC4607
.
.
.
.
.
.
.
.
.
.
TABLE 3-2: TSSOP PIN FUNCTION TABLE (CONTINUED)
Pin Number
TSSOP
Pin Name
Description
MIC4607-1 MIC4607-2
MIC4607
4.0 TIMING DIAGRAMS
4.1 Non-Overlapping LI/HI Input Mode
(MIC4607-1)
FIGURE 4-1: Separate Non-Overlapping LI/HI Input Mode (MIC4607-1).
Note 1:
2:
t
LPLH
t
R
t
LPHL
t
HPLH
t
HPHL
t
F
t
F
t
R
xHS
xHO
xLO
xHI
xLI
0V
MIC4607
4.2 Overlapping LI/HI Input Mode
(MIC4607-1)
FIGURE 4-2: Separate Overlapping LI/HI Input Mode (MIC4607-1).
tLOOFF
tHOOFF
tLOON
tHOON
xHS
xHO
xLO
xHI
xLI
2.2V
(typ)
1.9V
(typ)
0V
MIC4607
4.3 PWM Input Mode (MIC4607-2)
FIGURE 4-3: PWM Mode (MIC4607-2).
t
LOOFF
(V
LOOFF
)
t
HOON
xHS
xHO
xLO
xPWM
t
F
t
LOON
t
R
t
HOOFF
t
R
t
F
(V
SWTH
)
4
3
2
5
6
1
7
0V
MIC4607
4.4 Overcurrent Timing Diagram
FIGURE 4-4: Overcurrent Timing Diagram.
MIC4607
5.0 FUNCTIONAL DESCRIPTION
5.1 Startup and UVLO
5.2 Enable Inputs
5.3 Input Stage
5.4 Low-Side Driver
FIGURE 5-1: Low-Side Driver Block
Diagram.
5.5 High-Side Driver and Bootstrap
Circuit
FIGURE 5-2: High-Side Driver and
Bootstrap-Circuit Block Diagram.
VSS
VDD
LO
EXTERNAL
FET
MIC4607
SWITCH
NODE
HS
HB
HO
EXTERNAL
FET
VDD
C
B
MIC4607
LEVEL
SHIFT
VIN
R
HS
SWITCH
NODE
MIC4607
FIGURE 5-3: MIC4607 Motor Driver
Example.
5.6 Programmable Gate Drive
FIGURE 5-4: MOSFET RDS(ON) vs. VGS.
5.7 Overcurrent Protection Circuitry
EQUATION 5-1:
tDLY
CDLY VDLY-
IDLY
-------------------------------------=
MIC4607
MIC4607
6.0 APPLICATION INFORMATION
6.1 Adaptive Dead-Time
FIGURE 6-1: MIC4607 Driving an
External MOSFET.
FIGURE 6-2: Adaptive Dead-Time Logic
Diagram.
FIGURE 6-3: Low-Side Drive Gate
Resistor Configuration.
MIC4607
FIGURE 6-4: Adaptive Dead-Time LO
(LOW) to HO (HIGH).
6.2 HS Pin Clamp
TABLE 6-1: MIC4607-1 TRUTH TABLE
xLI xHI xLO xHO Comments
TABLE 6-2: MIC4607-2 TRUTH TABLE
xPWM xLO xHO Comments
MIC4607
FIGURE 6-5: Negative HS Pin Voltage.
6.3 Power Dissipation Considerations
6.4 Bootstrap Circuit Power
Dissipation
EQUATION 6-1:
EQUATION 6-2:
EQUATION 6-3:
Level
Shift
CVDD
AHI
VDD
DBST
ALI
MIC4607
VSS
AHB
AHO
AHS
ALO
DCLAMP
RG
RHS
RG
ȍ
CB
VIN
M
VNEG
Phase
A
Phases
B & C
IFAVE
QGATE fS
=
PdiodeFWD IFAVE
VF
=
PdiodeREV IRVREV 1D–=
MIC4607
FIGURE 6-6: Optional External Bootstrap
Diode.
6.5 Gate Driver Power Dissipation
FIGURE 6-7: MIC4607 Driving an
External High-Side MOSFET.
EQUATION 6-4:
EQUATION 6-5:
EQUATION 6-6:
FIGURE 6-8: Typical Gate Charge vs.
VGS.
E1
2
---CISS
VGS
2
=
QCV=
E1
2
---QG
VGS
=
MIC4607
EQUATION 6-7:
EQUATION 6-8:
6.6 Supply Current Power Dissipation
EQUATION 6-9:
6.7 Total Power Dissipation and
Thermal Considerations
EQUATION 6-10:
EQUATION 6-11:
EQUATION 6-12:
6.8 Other Timing Considerations
6.9 Decoupling and Bootstrap
Capacitor Selection
EDRIVER QGVGS
=
PDRIVER QGVGS
fS
=
PdissSUPPLY VDD IDD VHB
+IHB
=
PdissTOTAL PdissSUPPLY PdissDRIVE PDIODE
++=
PdissDRIVER PDRIVER
RON
RON RGRG_FET
++
-------------------------------------------------=
TJTAPdissTOTAL JA
+=
MIC4607
EQUATION 6-13:
EQUATION 6-14:
6.10 Grounding, Component
Placement and Circuit Layout
CB
QGATE
VHB
-----------------
Δ
CB
IHBS tON
VHB
----------------------------
MIC4607
FIGURE 6-9: Turn-On Current Paths.
FIGURE 6-10: Turn-Off Current Paths.
MIC4607
7.0 MOTOR APPLICATIONS
FIGURE 7-1: Automotive or Power Tool Application.
MIC4607
FIGURE 7-2: Industrial Motor Driver.
FIGURE 7-3: Blender Motor Drive Application Diagram.
MIC4607
FIGURE 7-4: Three-Phase Synchronous Rectification.
MIC4607
8.0 PACKAGING INFORMATION
8.1 Package Marking Information
XXXX-X
WNNN
XXXX
-XXXX
WNNN
4607-1
8943
4607
-2YTS
1612
24-lead VQFN* Example
28-lead TSSOP* Example
Legend:
*
Note
3
e
3
e
MIC4607
28-Lead QFN Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
MIC4607
28-Lead TSSOP Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
MIC4607
NOTES:
MIC4607
APPENDIX A: REVISION HISTORY
Revision A (August 2016)
Revision B (January 2018)
Revision C (August 2018)
Revision D (April 2019)
MIC4607
NOTES:
MIC4607
PRODUCT IDENTIFICATION SYSTEM
Examples:
PART NO. X XX
PackageJunction
Temperature
Device
Device:
Input Option:
Temperature Range:
Package:
Media Type:
–X
Input
Option
Range
XX
Media
–
Type
MIC4607
NOTES:
.
Trademarks
Note the following details of the code protection feature on Microchip devices:
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
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