Product Specification PE42424 UltraCMOS(R) SPDT RF Switch 100 MHz-6 GHz Product Description The PE42424 is a HaRPTM technology-enhanced reflective 50 SPDT RF switch designed for use in high power and high performance WLAN 802.11 a/b/g/n/ac applications such as carrier and enterprise Wi-Fi products supporting bandwidths up to 6 GHz. This switch features exceptional port-to-port isolation, fast switching speed, and high power handling, all in a compact 1.5 1.5 mm package. PE42424 also features high linearity that remains invariant over the full power supply range. In addition, this device has robust ESD and temperature performance and does not require blocking capacitors or any external matching components. The PE42424 is manufactured on Peregrine's UltraCMOS(R) process, a patented variation of silicon-oninsulator (SOI) technology on a sapphire substrate. Peregrine's HaRP technology enhancements deliver high linearity and excellent harmonics performance. It is an innovative feature of the UltraCMOS process, offering the performance of GaAs with the economy and integration of conventional CMOS. Features 802.11 a/b/g/n/ac support Exceptional isolation 48 dB @ 2.4 GHz 35 dB @ 5.8 GHz Fast switching 145 ns switching time 125 kHz switching rate High power handling 39 dBm Pulsed 30 dBm CW High linearity across supply range IIP3 of 61 dBm IIP2 of 125 dBm 1.8V control logic compatible 105 C operating temperature ESD performance 2500V HBM on RF pins to GND 1000V CDM on all pins Figure 2. Package Type 6-lead 1.5 1.5 mm DFN Figure 1. Functional Diagram DOC-02108 Document No. DOC-44114-4 www.psemi.com (c)2014-2015 Peregrine Semiconductor Corp. All rights reserved. Page 1 of 11 PE42424 Product Specification Table 1. Electrical Specifications @ 25C, VDD = 3.3V, (ZL = ZS = 50) unless otherwise specified Parameter Path Condition Min Operating frequency Typ 100 Unit 6000 MHz 0.95 1.15 1.20 dB dB dB Insertion loss RFC-RFX 100-2500 MHz 2500-5825 MHz 5825-6000 MHz Isolation RFC-RFX 100-2500 MHz 2500-5825 MHz 5825-6000 MHz 45 33 33 47 35 34 dB dB dB Isolation RFX-RFX 100-2500 MHz 2500-5825 MHz 5825-6000 MHz 37 29 29 39 30 30 dB dB dB RFX 100-6000 MHz 21 dB Return loss (common and active port) Input 1dB compression point1 0.80 0.90 0.95 Max RFC-RFX 6000 MHz 41 dBm 2 RFC-RFX 1900 MHz 61 dBm 2 Input IP2 RFC-RFX 1900 MHz 125 dBm 3rd harmonic RFC-RFX PIN = +30 dBm @ 1900 MHz 74 dBc 2nd harmonic RFC-RFX Input IP3 Switching time Notes: PIN = +30 dBm @ 1900 MHz 85 50% CTRL to 90% or 10% of final value 145 dBc 230 ns 1. The input 1dB compression point is a linearity figure of merit. Refer to Table 3 for the operating RF input power (50). 2. The input intercept point remains invariant over the full supply range as defined in Table 3. (c)2014-2015 Peregrine Semiconductor Corp. All rights reserved. Page 2 of 11 Document No. DOC-44114-4 UltraCMOS(R) RFIC Solutions PE42424 Product Specification Figure 3. Pin Configuration (Top View) Table 3. Operating Ranges Parameter Supply voltage RFC* 3 VDD 4 RF2* 3.3 5.5 V 1301 2002 200 300 A A VIH 1.4 3.6 V VIL -0.3 0.6 V PMAX,CW 30 dBm PMAX,PULSED 39 dBm +105 C 3 -40 TOP +25 1. VIH > 1.7V 2. 1.4V < VIH < 1.7V 3. Pulsed, 5% duty cycle of 4620 s period, 50 Table 4. Absolute Maximum Ratings Table 2. Pin Descriptions 2 Unit Digital input high (V1) Notes: V1 2.3 Max Digital input low (V1) Operating temperature range 1 VDD Typ IDD RF input power, pulsed Pin Name Min Supply current RF input power, CW Pin # Symbol Description Digital control logic input 1 RF common Supply voltage (nominal 3.3V) RF port 2 Parameter/Condition Supply voltage Digital input voltage (V1) Maximum input power Storage temperature range Symbol Min Max Unit VDD -0.3 5.5 V VCTRL -0.3 3.6 V 41 dBm +150 C PMAX,ABS TST -65 1 VESD,HBM RF port 1 ESD voltage HBM All pins RF pins to GND 1000 2500 V V Exposed pad: ground for proper operation ESD voltage CDM2, all pins VESD,MM 1000 V 5 GND Ground 6 RF1* Pad GND Note: * RF pins 2, 4 and 6 must be at 0 VDC. The RF pins do not require DC blocking capacitors for proper operation if the 0 VDC requirement is met. Notes: 1. Human Body Model (MIL-STD 883 Method 3015) 2. Charged Device Model (JEDEC JESD22-C101) Exceeding absolute maximum ratings may cause permanent damage. Operation should be restricted to the limits in the Operating Ranges table. Operation between operating range maximum and absolute maximum for extended periods may reduce reliability. Table 5. Control Logic Truth Table Document No. DOC-44114-4 www.psemi.com V1 RFC-RF1 RFC-RF2 0 OFF ON 1 ON OFF (c)2014-2015 Peregrine Semiconductor Corp. All rights reserved. Page 3 of 11 PE42424 Product Specification Electrostatic Discharge (ESD) Precautions Switching Capability When handling this UltraCMOS device, observe the same precautions that you would use with other ESD-sensitive devices. Although this device contains circuitry to protect it from damage due to ESD, precautions should be taken to avoid exceeding the rating specified. The PE42424 has a maximum 125 kHz switching rate with the control pin input capacitance of 2 pF. Switching rate describes the time duration between switching events. Latch-Up Avoidance Unlike conventional CMOS devices, UltraCMOS devices are immune to latch-up. Moisture Sensitivity Level The Moisture Sensitivity Level rating for the PE42424 in the 6-lead 1.5 1.5 mm DFN package is MSL1. (c)2014-2015 Peregrine Semiconductor Corp. All rights reserved. Page 4 of 11 Switching time is the time duration between the point the control signal reaches 50% of the final value and the point the output signal reaches within 10% or 90% of its target value. Spurious Performance The typical spurious performance of the PE42424 is -126 dBm. Document No. DOC-44114-4 UltraCMOS(R) RFIC Solutions PE42424 Product Specification Typical Performance Data @ 25 C and VDD = 3.3V, unless otherwise specified Figure 4. Insertion Loss (RFC-RFX) Figure 5. Insertion Loss vs. Temp (RFC-RFX) Figure 6. Insertion Loss vs. VDD (RFC-RFX) Document No. DOC-44114-4 www.psemi.com (c)2014-2015 Peregrine Semiconductor Corp. All rights reserved. Page 5 of 11 PE42424 Product Specification Typical Performance Data @ 25 C and VDD = 3.3V, unless otherwise specified Figure 7. Return Loss vs. Temp (RFC-RFX) Figure 8. Return Loss vs. VDD (RFC-RFX) Figure 9. Isolation vs. Temp (RFC-RFX) Figure 10. Isolation vs. VDD (RFC-RFX) (c)2014-2015 Peregrine Semiconductor Corp. All rights reserved. Page 6 of 11 Document No. DOC-44114-4 UltraCMOS(R) RFIC Solutions PE42424 Product Specification Typical Performance Data @ 25 C and VDD = 3.3V, unless otherwise specified Figure 11. Isolation vs. Temp (RFX-RFX) Document No. DOC-44114-4 www.psemi.com Figure 12. Isolation vs. VDD (RFX-RFX) (c)2014-2015 Peregrine Semiconductor Corp. All rights reserved. Page 7 of 11 PE42424 Product Specification Evaluation Kit Figure 13. Evaluation Board Layout The SPDT switch evaluation board was designed to ease customer evaluation of Peregrine's PE42424 RF switch. The RF common port is connected to the device through a 50 transmission line via SMA connector J3. RF1 and RF2 ports are connected to the device through 50 transmission lines via SMA connectors J1 and J2, respectively. A transmission line has been included on the reverse side of the PCB, accessible via SMA connectors J4 and J5. This transmission line provides an equivalent length to de-embed PCB trace losses. DC and digital inputs are provided to the device via J6. This PCB is constructed of a four metal layer material with total thickness of 62 mils. The top and bottom RF layers are Rogers RO4003 material with an 8 mil RF core. The middle layers provide ground for the RF transmission lines. The transmission lines were designed using a coplanar waveguide with ground plane model using a trace width of 16 mils and 10 mil trace gap, with 2.1 mils of metal thickness. For the true performance of the PE42424 to be realized, the PCB should be designed in such a way that RF transmission lines and sensitive DC I/O traces are heavily isolated from one another. PRT-40105 Document No. DOC-44114-4 www.psemi.com (c)2014-2015 Peregrine Semiconductor Corp. All rights reserved. Page 8 of 11 PE42424 Product Specification Figure 14. Evaluation Board Schematic CAUTION: Contains parts and assemblies susceptible to damage by electrostatic discharge (ESD). Document No. DOC-44114-4 www.psemi.com DOC-44126 (c)2014-2015 Peregrine Semiconductor Corp. All rights reserved. Page 9 of 11 PE42424 Product Specification Figure 15. Package Drawing 6-lead 1.5 1.5 mm DFN 0.30 (x6) 0.10 C A 1.50 1.200.10 (2X) B 0.1750.10 (x6) 0.05 (x2) 1.50 0.700.10 0.50 0.28 (x6) (x4) 0.80 1.60 0.20 Ref. Chamfer 0.15 x 45 +0.05 0.25 -0.07 (x6) 0.10 C (2X) 0.50 PIN #1 CORNER (x4) TOP VIEW BOTTOM VIEW 1.30 RECOMMENDED LAND PATTERN DOC-51810 0.10 C 0.10 0.08 0.55 MAX C A B C ALL FEATURES 0.08 C SEATING PLANE 0.10 Ref. 0.02 C SIDE VIEW Figure 16. Top Marking Specification = Pin 1 designator PZZ YWW DOC-51207 P = Part number code* ZZ = Last two characters of the assembly lot code Y = Last digit of year, starting from 2010 WW = Work week Note: * The part number marking for PE42424 is E. (c)2014-2015 Peregrine Semiconductor Corp. All rights reserved. Page 10 of 11 Document No. DOC-44114-4 UltraCMOS(R) RFIC Solutions PE42424 Product Specification Figure 17. Tape and Reel Specifications Drawing not drawn to scale Pocket hole diameter 0.6 0.05 mm Bumped die are oriented active side down Maximum cavity angle 5o Table 6. Ordering Information Ordering Code Description Package Shipping Method PE42424A-Z PE42424 SPDT RF switch Green 6-lead 1.5 x 1.5 mm DFN 3000 units/T&R EK42424-01 PE42424 Evaluation kit Evaluation kit 1/Box Sales Contact and Information For Sales and contact information please visit www.psemi.com. Advance Information: The product is in a formative or design stage. The datasheet contains design target specifications for product development. Specifications and features may change in any manner without notice. Preliminary Specification: The datasheet contains preliminary data. Additional data may be added at a later date. Peregrine reserves the right to change specifications at any time without notice in order to supply the best possible product. Product Specification: The datasheet contains final data. In the event Peregrine decides to change the specifications, Peregrine will notify customers of the intended changes by issuing a CNF (Customer Notification Form). The information in this datasheet is believed to be reliable. However, Peregrine assumes no liability for the use of this information. Use shall be entirely at the user's own risk. Document No. DOC-44114-4 www.psemi.com No patent rights or licenses to any circuits described in this datasheet are implied or granted to any third party. Peregrine's products are not designed or intended for use in devices or systems intended for surgical implant, or in other applications intended to support or sustain life, or in any application in which the failure of the Peregrine product could create a situation in which personal injury or death might occur. Peregrine assumes no liability for damages, including consequential or incidental damages, arising out of the use of its products in such applications. The Peregrine name, logo, UltraCMOS and UTSi are registered trademarks and HaRP, MultiSwitch and DuNE are trademarks of Peregrine Semiconductor Corp. Peregrine products are protected under one or more of the following U.S. Patents: http://patents.psemi.com (c)2014-2015 Peregrine Semiconductor Corp. All rights reserved. Page 11 of 11