AP2141D/ AP2151D
Document number: DS32242 Rev. 4 - 2 1 of 18
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AP2141D/ AP2151D
0.5 SINGLE CHANNEL CURRENT-LIMITED
POWER SWITCH WITH OUTPUT DISC HA RGE
Description
The AP2141D and AP2151D are integrated high-side power switches
optimized for Universal Serial Bus (USB) and other hot-swap
applications. The family of devices complies with USB 2.0 and is
available with both polarities of Enable input. They offer current and
thermal limiting and short circuit protection as well as controlled rise
time and under-voltage lockout functionality. A 7ms deglitch capability
on the open-drain Flag output prevents false over-current reporting and
does not require any external components.
All devices are available in SOT25, SO-8, MSOP-8EP, and
U-DFN2018-6 packages.
Features
Single USB Port Power Switches with Output Discharge
Over-Current and Thermal Protection
0.8A accurate Current Limiting
Fast Transient Response
Reverse Current Blocking
90m On-Resistance
Input Voltage Range: 2.7V - 5.5V
0.6ms Typical Rise Time
Very Low Shutdown Current: 1µA (max)
Fault Report (FLG) with Blanking Time (7ms typ)
ESD Protection: 4kV HBM, 300V MM
Active High (AP2151D) or Active Low (AP2141D) enable
Ambient Temperature Range -40°C to +85°C
SOT25, SO-8, MSOP-8EP (Exposed Pad), and U-DFN2018-6:
Available in “Green” Molding Compound (No Br, Sb)
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
UL Recognized, File Number E322375
IEC60950-1 CB Scheme Certified
Applications
Consumer Electronics – LCD TV & Monitor, Game Machines
Communications – Set-Top-Box, GPS, Smartphone
Computing – Laptop, Desktop, Servers, Printers, Docking Station,
HUB
Pin Assignments
SO-8
( Top View )
1
2
3
4
8
7
6
5
NC
OUT
FLG
OUT
GND
EN
IN
IN
EN
OUT
GND
IN
FLG
1
2
3
5
4
SOT25
( Top View )
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as tho se which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
AP2141D/ AP2151D
Document number: DS32242 Rev. 4 - 2 2 of 18
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AP2141D/ AP2151D
Typical Applications Circuit
0.1uF
IN
GND
EN
OUT
ON
120uF
Power Supply
2.7V to 5.5V
0.1uF
OFF
FLG
Load
10k 10uF
AP2151D Enable Active High
Part Number Channel Enable Pin (EN) Current Limit
(Typical) Recommended Maximum
Continuous Load Current
AP2141D 1 Active Low 0.8A 0.5A
AP2151D 1 Active High 0.8A 0.5A
Pin Descriptions
Pin
Name Pin Number Descriptions
SO-8 MSOP-8EP SOT25 U-DFN2018-6
GND 1 1 2 1 Ground
IN 2, 3 2, 3 5 2 Voltage Input Pin. (all IN p ins must be tied together ex ternally)
EN 4 4 4 3 Enable Input , active low (AP2141D) or act ive high (A P2151D).
FLG 5 5 3 4
Over-current and over-temperature fault report; open- drain flag is active low when
triggered.
OUT 6, 7 6, 7 1 5, 6 Voltage Output Pin (all OUT pin s must be tied together externa lly).
NC 8 8 N/A N/A No Internal Conn ection; recomme nd tie to OUT pins.
Exposed tab - Exposed tab - Exposed tab
Exposed pad. Internally connected to GND.
It should be externally connected to GND and thermal mass for enhanced
thermal impedance.
It should not be used as electrical ground condu ction path.
AP2141D/ AP2151D
Document number: DS32242 Rev. 4 - 2 3 of 18
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AP2141D/ AP2151D
Functional Block Diagram
Thermal
Sense
FLG
OUT
GND
IN
EN
UVLO
Current
Limit
Current
Sense
Deglitch
Discharge
Control
Driver
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Symbol Parameter Ratings Unit
ESD HBM Human Body Model ESD Protection 4 kV
ESD MM Machine Model ESD Protection 300 V
VIN Input Voltage 6.5 V
VOUT Output Voltage VIN +0.3 V
VEN , VFLG Enable Voltage 6.5 V
ILOAD Maximum Continuous Load Current Internal Limited A
TJ(MAX) Maximum Junction Temperature 150 °C
TST Storage Temperature Range (Note 4) -65 to +150 °C
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices
Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C)
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)
Symbol Parameter Min Max Unit
VIN Input voltage 2.7 5.5 V
IOUT Output Current 0 500 mA
TA Operating Ambient Temperature -40 +85 C
VIH High-Level Input Voltage on EN or EN 2.0 VIN V
VIL Low-Level Input Voltage on EN or EN 0 0.8 V
AP2141D/ AP2151D
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AP2141D/ AP2151D
Electrical Characteristics (@TA = +25°C, VIN = +5V, unless otherwise specified.)
Symbol Parameter Test Conditions Min Typ Max Unit
VUVLO Input UVLO 1.6 1.9 2.5 V
ISHDN Input Shutdown Current Disabled, IOUT = 0 0.5 1 µA
IQ Input Quiescent Current Enabled, IOUT = 0 45 70 µA
ILEAK Input Leakage Current Disabled, OUT grounded 0.1 1 µA
IREV Reverse Leakage Current Disabled, VIN = 0V, VOUT = 5V, IREV at VIN 0.1 1 µA
RDS(ON) Switch On-Resistance
VIN = 5V,
IOUT = 0.5A TA = +25°C SOT25, MSOP-8,
MSOP-8EP, SO-8 95 115
m
U-DFN2018-6 90 110
-40°C TA +85°C 140
VIN = 3.3V, IOUT =
0.5A TA = +25C 120 140
-40°C TA +85°C 170
ISHORT Short-Circuit Current Limit Enabled into short circuit, CL = 22µF 0.6 A
ILIMIT Over-Load Current Limit VIN = 5V, VOUT = 4.0V, CL = 120µF, -40°C TA +85°C 0.6 0.8 1.0 A
ITRIG Current limiting trigger threshold Output Current Slew Rate (<100A/s) , CL = 22µF 1.0 A
ISINK EN Input leakage VEN = 5V 1 µA
tD(ON) Output turn-on delay time CL = 1µF, RLOAD = 10 0.05 ms
tR Output turn-on rise time CL = 1µF, RLOAD = 10 0.6 1.5 ms
tD(OFF) Output turn-off delay time CL = 1µF, RLOAD = 10 0.05 ms
tF Output turn-off fall time CL = 1µF, RLOAD = 10 0.05 0.1 ms
RFLG FLG output FET on-resistance IFLG =10mA 20 40
tBLANK FLG blanking time CIN = 10µF, CL = 22µF 4 7 15 ms
RDIS Discharge resistance (Note 5) VIN = 5V, disabled, IOUT = 1mA 100
tDIS Discharge Time CL = 1µF, VIN = 5V, disabled to VOUT < 0.5V 0.6 ms
TSHDN Thermal Shutdown Threshold Enabled, RLOAD = 1k 140 C
THYS Thermal Shutdown Hysteresis 25 C
JA Thermal Resistance Junction-to-
Ambient
SOT25 (Note 6) 170
°C/W
SO-8 (Note 6) 127
MSOP-8EP (Note 7) 67
U-DFN2018-6 (Note 7) 70
Notes: 5. The discharge function is active when the device is disabled (when enable is de-asserted). The discharge function offers a resistive discharge path
for the external storage capacitor.
6. Device mounted on FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.
7. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground
plane.
AP2141D/ AP2151D
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AP2141D/ AP2151D
Typical Performance Characteristics
Figure 1 Voltage Waveforms: AP2141D (left), AP2151D (right)
All Enable Plots are for AP2151D Active High
Turn-On Delay and Rise Time
100µs/div
Turn-Off Delay and Fall Time
100µs/div
Turn-On Delay and Rise Time
500µs/div
Turn-Off Delay and Fall Time
500µs/div
VEN
5V/div
CL = 1uF
TA = +25°C
RL = 10
VOUT
2V/div
CL = 1uF
TA = +25°C
RL = 10
CL = 120µF
TA = +25°C
RL = 10
CL = 120µF
TA = +25°C
RL = 10
VEN
5V/div
VEN
5V/div
VEN
5V/div
VOUT
2V/div
VOUT
2V/div
VOUT
2V/div
AP2141D/ AP2151D
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AP2141D/ AP2151D
Typical Performance Characteristics (cont.)
Short Circuit Current, Device Enabled Into Short
100µs/div
Short Circuit with Blanking Time and Recovery
20ms/div
3Ω Load Connected to Enabled Device
1ms/div
2Ω Load Connected to Enabled Device
1ms/div
Power On Power Of
f
2ms/div 2ms/div
VEN
5V/div
IOUT
200mA/div
VIN = 5V
TA = +25°C
CL = 22µF IOUT
1A/div
IOUT
500mA/div
IOUT
500mA/div
IOUT
200mA/div IOUT
200mA/div
VIN = 5V
TA = +25°C
CL = 22µF
VIN = 5V
TA = +25°C
CL = 22µF
TA = +25°C
CL = 120µF
RL = 10
TA = +25°C
CL = 120µF
RL = 10
VIN = 5V
TA = +25°C
CL = 22µF
VOUT
5V/div
VFLAG
5V/div
VEN
5V/div
VFLAG
5V/div
VFLAG
2V/div
VFLAG
2V/div
VEN
5V/div
VOUT
5V/div
VFLAG
5V/div
VOUT
5V/div
AP2141D/ AP2151D
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AP2141D/ AP2151D
Typical Performance Characteristics (cont.)
UVLO Increasing
2ms/div
UVLO Decreasing
20ms/div
Discharge Time
No Load Resistance
100ms/div
Inrush Current
1ms/div
TA = +25°C
CL = 22µF
RL = 10
TA = +25°C
CL = 22µF
RL = 10
VIN = 5V
TA = +25°C
RL = 10
TA = +25°C
VIN = 5V
No Load
Resistance
CL = 470µF
CL = 120µF
CL = 22µF
IOUT
200mA/div
IOUT
200mA/div
VIN
2V/div
VIN
2V/div
VEN
2V/div
VOUT
2V/div
VEN
5V/div
IIN
200mA/div
CL = 680µF
CL = 220µF
CL = 100µF
AP2141D/ AP2151D
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AP2141D/ AP2151D
Typical Performance Characteristics (cont.)
Turn-On Tim e vs Input Voltage
0
100
200
300
400
500
600
700
800
1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
Input Vo ltage (V)
Turn-On Tim e (us )
Turn-Off Time vs Input Voltage
28
28
29
29
30
30
31
31
1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
Input Voltage (V )
Turn-Off Time (us)
Rise Tim e vs Input Voltage
0
100
200
300
400
500
600
1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
Input Vo ltage (V)
Rise Time (us)
Fal l Tim e vs Input Vol tage
19
20
21
22
23
24
25
1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
Input Voltage (V )
Fall Time (us)
Supply Curr ent , Ou t put Enabl e d vs Ambi e nt Tem per at ure
30
35
40
45
50
55
60
65
-60 -40 -20 0 20 40 60 80 100
Ambient Temperature ( °C)
Supply Current, Output En a b led (uA)
Supply Current , O ut put Di sabl ed vs A mbi ent Tem perat ur e
0.00
0.20
0.40
0.60
0.80
1.00
1.20
1.40
1.60
-45 -25 -5 15 35 55 75 95
Ambient Temperatu re (°C)
Supply Current, Output Disabled (uA)
CL = 1µF
RL = 10
TA = +25°C
V
IN
= 5.0V
CL = 1µF
RL = 10
TA = +25°C
CL = 1µF
RL = 10
TA = +25°C
CL = 1µF
RL = 10
TA = +25°C
V
IN
= 5.5V
V
IN
= 3.3V
V
IN
= 2.7V V
IN
= 2.7V
V
IN
= 3.3V
V
IN
= 5.0V
V
IN
= 5.5V
AP2141D/ AP2151D
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AP2141D/ AP2151D
Typical Performance Characteristics (cont.)
Static Drain-Source O n- Stat e Resist ance vs A m bient
Temperature
100
110
120
130
140
150
160
170
180
190
200
-60 -40 -20 0 20 40 60 80 100
Ambient Temperature (°C)
Static Drain-Source On-State
Resistance (mΩ)
Short- Ci rcuit O ut put Curre nt vs A m bi ent Temper at ur e
630
640
650
660
670
680
690
700
710
-60 -40 -20 0 20 40 60 80 100
Ambient Temperature (°C )
Short-Circuit Output Current (mA)
Undervolt age Lockout vs A m bi ent Temper at ur e
1.95
1.96
1.97
1.98
1.99
2.00
2.01
2.02
2.03
2.04
2.05
-60 -40 -20 0 20 40 60 80 100
Ambient Temperatu re (°C)
Undervoltage Lockout (V)
Threshol d Tr ip Current v s I nput Vol t a ge
1.10
1.11
1.12
1.13
1.14
1.15
2.8 3.3 3.8 4.3 4.8 5.3
Input V oltage (V)
Threshold Trip Current (A)
UVLO Falling
UVLO Rising
TA = +25°C
CL= 22µF
V
IN
= 2.7V
V
IN
= 5V
V
IN
= 2.7V
V
IN
= 3.3V
V
IN
= 5V
V
IN
= 5V
V
IN
= 5.5V
V
IN
= 3.3V
AP2141D/ AP2151D
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AP2141D/ AP2151D
Application Information
The AP2141D and AP2151D are integrated high -side power switches optimized for Universal Serial Bus (USB) that require protection functions. The
power switches are equipped with a driver that controls the gate voltage and incorporates slew-rat e limitation. This, along with the various protection
features and special functions, makes these power switches ideal for hot-swap or hot-plug applications.
Protection Features:
Under-Voltage Lockout (UVLO)
Under-voltage lockout function (UVLO) guarantees that the internal power switch is initially off during start-up. The UVLO functions only when the
switch is enabled. Even if the switch is enabled, the switch is not turned ON until the power supply has reached at least 1.9V. Whenever the input
voltage falls below approximately 1.9V, the power switch is turned off. This facilitates the design of hot-insertion systems where it is n ot possible to
turn off the power switch before input power is removed.
Over-Current and Short Circuit Protection
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
The different overload conditions and the corresponding response of the AP2141D/2151D are outlined below:
S.NO Conditions Explanation Behavior of the AP2141D/2151D
1 Short circuit condition at start-up Output is shorted before input
voltage is applied or before the
part is enabled
The IC senses the short circuit and immediately clamps output
current to a certain safe level namely ILIMIT.
2 Short-circuit or Overcurrent
condition
Short-Circuit or Overload condition
that occurs when the part is
enabled.
At the instance the overload occurs, higher current may flow for
a very short period of time before the current limit function can
react.
After the current limit function has tripped (reached the over-
current trip threshold), the device switches into current limiting
mode and the current is clamped at ILIMIT.
3 Gradual increase from nominal
operating current to ILIMIT Load increases gradually until the
current-limit threshold.(ITRIG)
The current rises until ITRIG or thermal limit. Once the threshold
has been reached, the device switches into its current limiting
mode and is set at ILIMIT.
Note that when the output has been shorted to GND at extremely low temperature (< -20oC), a minimum 120 F electrol ytic capacitor on the output
pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that
capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature
characteristics of less than 10% variation of capacitance change when operated at extremely low temp. Our recommended aluminum electrolytic
capacitor type is Panasonic FC series.
Thermal Protection
Thermal protection prevents the IC from damage when the die tem peratur e e xceeds safe margins. This mainly occurs when heav y-o ve rload or short -
circuit faults are present for extended periods of time. The AP2141D/AP2151D implements thermal sensing to monitor the operating junction
temperature of the power distribution switch. Once the die temperature rises to approximately 140°C, the Thermal protection feature gets activated
as follows: The internal thermal sense circuitry turns the power switch off and the FLG output is asserted thus preventing the power switch from
damage. Hysteresis in the thermal sense circ uit allows the device to cool down to a pproximately 25°C befo re the output is turned back on. The built-
in thermal hysteresis feature avoids undesirable oscillations of the thermal protection circuit. The switch continues to cycle in this manner until the
load fault is removed, resulting in a pulsed output. The FLG open-drain output is asserted when an over-current occurs with 7-ms deglitch.
Reverse Current Pro t ectio n
In a normal MOSFET switch, current can flow in reverse direction (from the output side to the input side) when the output side voltage is higher than
the input side, even when the switch is turned off. A reverse-current blocking feature is implemented in the AP21x1 series to prevent such back
currents. This circuit is activated by the difference between the out put voltage and the input voltage. When the s witch is disabled, this feature blocks
reverse current flow from the output back to the input.
AP2141D/ AP2151D
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AP2141D/ AP2151D
Application Information (cont.)
Special Functions:
Discharge Function
When enable is de-asserted, the discharge function is active. The output capacitor is discharged through an internal NMOS that has a discharge
resistance of 100. Hence, the output voltage drops down to zero. The time taken for discharge is dependent on the RC time constant of the
resistance and the output capacitor.
FLG Response
The FLG open-drain output goes active low for an y of the t wo conditions: Over-Cur rent or Ove r-Tem perature. The time from when a fault condition is
encountered to when the FLG output goes low is 7-ms (typ). The FLG output remains low until both over-current and over-tempera ture conditions
are removed. Connecting a heavy capac itive load to the output of the device can cause a momentary Over-current condition, which does not trigger
the FLG due to the 7-ms deglitch timeout. The 7-ms timeout is also applicable for Over-current recovery and Thermal recovery. The
AP2141D/AP2151D are designed to eliminate erroneous Over-current reporting without the need for external components, such as an RC delay
network.
Power Supply Considerations
A 0.01-F to 0.1-F X7R or X5R ceramic b ypass capacitor between IN and GND, close to the device, is recommended. This limits the input voltage
drop during line transients. Placing a high-value electrolytic capacitor on the input (10-F minimum) and output pin(s) is recommended when the
output load is heavy. This precaution also reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output
with a 0.01-F to 0.1-F ceramic capacitor improves the immunity of the device to short-circuit transients. This capacitor also prevents the output
from going negative during turn-off due to inductive parasitics.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by:
PD = RDS(ON)× I2
The junction temperature can be calculated by:
TJ = PD x RJA + TA
Where:
TA= Ambient temperature °C
RJA = Thermal resistance
PD = Total power dissipation
Generic Hot-Plug Applications
In many applications it may be necessary to remove modules or PC boards while the main unit is still operating. These are considered hot-plug
applications. Such implementations require the control of current surges as seen by the main power supply and the card being inserted. The most
effective way to control these surges is to limit and slowly ramp up the current and voltage being applied to the card, similar to the way in which a
power supply normally turns on. Due to the controlled rise and fall times of the AP2141D/AP2151D, these devices can be used to provide a softer
start-up to devices being hot-plugged into a powered s ystem. The UVLO feature of the AP2141D/AP2151D also e nsures that the switch is off after
the card has been removed, and that the switch is off during the next insertion.
By placing the AP2141D/AP2151D between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion.
The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls the
system surge current and provides a hot-plugging mechanism for any device.
AP2141D/ AP2151D
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AP2141D/ AP2151D
Ordering Information
Part Number Package Code Packaging 7”/13” Tape and Reel
Quantity Part Number Suffix
AP21X1DSG-13 S SO-8 2500/Tape & Reel -13
AP21X1DMPG-13 MP MSOP-8EP 2500/Tape & Reel -13
AP21X1DWG-7 W SOT25 3000/Tape & Reel -7
AP21X1DFMG-7 FM U-DFN2018-6 3000/Tape & Reel -7
Marking Information
(1) SO-8
AP21X X D
( Top View )
YY WW X X
Part Number
Logo
WW : Week : 01~52; 52
YY : Year : 08, 09,10~
G : Green
X : Internal Code
8765
1234
4 : Active Low
5 : Active High
1 : 1 Channel
represents 52 and 53 week
AP2141D/ AP2151D
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AP2141D/ AP2151D
Marking Information (cont.)
(2) MSOP-8EP
(3) SOT25
1 2 3
5
7
4
XX YW X
XX : Identification co de
W : Week : A~Z : 1~26 week;
X : A~Z : Green
( Top View )
Y : Year 0~9
a~z : 27~52 week; z represents
52 and 53 week
(4) U-DFN2018-6
Device Package Type Identification Code
AP2141DW SOT25 JA
AP2151DW SOT25 JB
Device Package type Identification Code
AP2141DFM U-DFN2018-6 JA
AP2151DFM U-DFN2018-6 JB
AP2141D/ AP2151D
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AP2141D/ AP2151D
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
(1) Package type: SO-8
(2) Package Type: MSOP-8EP
SO-8
Dim Min Max
A - 1.75
A1 0.10 0.20
A2 1.30 1.50
A3 0.15 0.25
b 0.3 0.5
D 4.85 4.95
E 5.90 6.10
E1 3.85 3.95
e 1.27 Typ
h - 0.35
L 0.62 0.82
0 8
All Dimensions in mm
MSOP-8EP
Dim Min Max Typ
A - 1.10 -
A1 0.05 0.15 0.10
A2 0.75 0.95 0.86
A3 0.29 0.49 0.39
b 0.22 0.38 0.30
c 0.08 0.23 0.15
D 2.90 3.10 3.00
D1 1.60 2.00 1.80
E 4.70 5.10 4.90
E1 2.90 3.10 3.00
E2 1.30 1.70 1.50
E3 2.85 3.05 2.95
e - - 0.65
L 0.40 0.80 0.60
a 0° 8° 4°
x - - 0.750
y - - 0.750
All Dimensions in mm
Gauge Plan e
Seating Plane
Det ail ‘A’
Det ail ‘A’
E
E1
h
L
D
eb
A2
A1
A
45
°
7
°~
9
°
A3
0.254
1
D
A
A1
A2
E
e
y
x
Seating Plane
Gauge Plane
L
D
8Xb
See Detail C
Deta il C
c
a
E1
E3
A3
E2
4X10°
4X10°
0.25
D1
AP2141D/ AP2151D
Document number: DS32242 Rev. 4 - 2 15 of 18
www.diodes.com May 2013
© Diodes Incorporated
AP2141D/ AP2151D
Package Outline Dimensions (cont.) (All dimensions in mm.)
(3) Package Type: SOT25
(4) Package Type: U-DFN2018 -6
SOT25
Dim Min Max Typ
A 0.35 0.50 0.38
B 1.50 1.70 1.60
C 2.70 3.00 2.80
D 0.95
H 2.90 3.10 3.00
J 0.013 0.10 0.05
K 1.00 1.30 1.10
L 0.35 0.55 0.40
M 0.10 0.20 0.15
N 0.70 0.80 0.75
0° 8°
All Dimensions in mm
U-DFN2018-6
Dim Min Max Typ
A 0.545 0.605 0.575
A1 0 0.05 0.02
A3 0.13
b 0.15 0.25 0.20
D 1.750 1.875 1.80
D2 1.30 1.50 1.40
e 0.50
E 1.95 2.075 2.00
E2 0.90 1.10 1.00
L 0.20 0.30 0.25
z 0.30
All Dimensions in mm
A
M
JL
D
B C
H
KN
SEATING PLANE
EE2
L
A
D
D2
A3
A1
eb
Pin#1 ID
z
AP2141D/ AP2151D
Document number: DS32242 Rev. 4 - 2 16 of 18
www.diodes.com May 2013
© Diodes Incorporated
AP2141D/ AP2151D
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1) Package Type: SO-8
(2) Package Type: MSOP-8EP
(3) Package Type: SOT25
Dimensions Value (in mm)
X 0.60
Y 1.55
C1 5.4
C2 1.27
Dimensions Value
(in mm)
C 0.650
G 0.450
X 0.450
X1 2.000
Y 1.350
Y1 1.700
Y2 5.300
Dimensions Value (in mm)
Z 3.20
G 1.60
X 0.55
Y 0.80
C1 2.40
C2 0.95
G
X C
Y
Y2 Y1
X1
X
Z
Y
C1
C2C2
G
X
C1
C2
Y
AP2141D/ AP2151D
Document number: DS32242 Rev. 4 - 2 17 of 18
www.diodes.com May 2013
© Diodes Incorporated
AP2141D/ AP2151D
Suggested Pad Layout (cont.)
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(4) Package type: U-DFN2018 -6
Taping Orientation (Note 8)
For U-DFN2018-6
Note: 8. The taping orient ation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf
Dimensions Value (in mm)
C 0.50
G 0.20
X 0.25
X1 1.60
Y 0.35
Y1 1.20
Y
XC
X1
G
Y1
AP2141D/ AP2151D
Document number: DS32242 Rev. 4 - 2 18 of 18
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© Diodes Incorporated
AP2141D/ AP2151D
IMPORTANT NOTICE
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2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
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Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
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