MCP6XXXEV-AMP3 - Microchip Technology

MCP6XXX Amplifier

Evaluation Board 3

User’s Guide

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defen d, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,

PICmicro, PICSTART, PRO MATE, rfPIC and SmartShunt

are registered trademarks of Microchip Technology

Incorporated in the U.S.A. and other countries.

AmpLab, FilterLab, Linear Active Thermistor, Migratable

Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The

Embedded Control Solutions Company are registered

trademarks of Microchip Technology Incorporated in the

U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard,

dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,

ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,

In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,

MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,

PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,

PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select

Mode, Smart Serial, SmartTel, Total Endurance, UNI/O,

WiperLock and ZENA are trademarks of Microchip

Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip T echnology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:200 2 certif ication for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in Calif ornia

and India. The Company’s quality system processes and procedures

are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping

devices, Serial EEPROMs, microper ipher als, nonvol ati le memo ry and

analog product s. In addition, Microchip ’s quality system for th e design

and manufacture of development systems is ISO 9001:2000 certified.

MCP6XXX AMPLIFIER EVALUATION
BOARD 3 USER’S GUIDE
© 2007 Microchip Technology Inc. DS51673A-page iii
Table of Contents
Preface ...........................................................................................................................1
Introduction............................................................................................................1
Document Layout..................................................................................................1
Conventions Used in this Guide............................................................................2
Recommended Reading ........................................................................................3
The Microchip Web Site........................................................................................3
Customer Support.................................................................................................3
Document Revision History...................................................................................3
Chapter 1. Product Overview .......................................................................................5
1.1 Introduction .....................................................................................................5
1.2 MCP6XXX Amplifier Evaluation Board 3 Kit Contents ................................... 5
1.3 Microchip’s Web-Based Mindi™ Analog Simulator Tool ................................6
1.4 MCP6XXX Amplifier Evaluation Board 3 Description ..................................... 6
Chapter 2. Installation and Operation .........................................................................7
2.1 Introduction .....................................................................................................7
2.2 Required Tools ...............................................................................................7
2.3 MCP6XXX Amplifier Evaluation Board 3 Set-up ............................................7
2.4 MCP6XXX Amplifier Evaluation Board 3 Operation ..................................... 13
Appendix A. Schematic and Layouts ........................................................................23
A.1 Introduction ..................................................................................................23
A.2 Board - Schematic  .......................................................................................24
A.3 Board - Top Silk Layer  ..............................................................................25
A.4 Board - Top Trace And Silk ..........................................................................26
A.5 Board - Bottom Layer ...................................................................................27
Appendix B. Bill of Materials (BOM) ..........................................................................29
B.1 MCP6XXX Amplifier Evaluation Board 3 BOM ............................................ 29
Worldwide Sales and Service  ....................................................................................32

MCP6XXX Amplifier Evaluation Board 3 User’s Guide

NOTES:

MCP6XXX AMPLIFIER EVALUATION
BOARD 3 USER’S GUIDE
© 2007 Microchip Technology Inc. DS51673A-page 1
Preface
INTRODUCTION
This chapter contains general information that will be useful to know before using the 
MCP6XXX Amplifier Evaluation Board 3. Items discussed in this chapter include:
• Document Layout
• Conventions Used in this Guide
• Recommended Reading
• The Microchip Web Site
• Customer Support
• Document Revision History
DOCUMENT LAYOUT
This document describes how to use the MCP6XXX Amplifier Evaluation Board 3. The 
manual layout is as follows:
•Chapter 1. “Product Overview” - Provides the important information about the 
MCP6XXX Amplifier Evaluation Board 3.
•Chapter 2. “Insta lla tion and Ope rat io n” –  Covers the installation and opera tio n 
of the MCP6XXX Amplifier Evaluation Board 3. It lists the required tools, shows 
how to set up the board, and demonstrates how to verify the amplifier operation.
•Appendix A. “Schematic and Layout s” – Shows the schematic and board 
layouts for the MCP6XXX Amplifier Evaluation Board 3.
•Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the 
MCP6XXX Amplifier Evaluation Board 3.
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and 
documentation are constantly evolving to meet customer needs, so some actual dialogs 
and/or tool descriptions may differ from those in this document. Please refer to our web site 
(www.microchip .com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each 
page, in front of the page number. The numbering convention for the DS number is 
“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the 
document.
For the most up-to-date information on development tools, see the MPLAB® IDE on-line help. 
Select the Help menu, and then Topics to open a list of available on-line help files.

MCP6XXX Amplifier Evaluation Board 3 User’s Guide

CONVENTIONS USED IN THIS GUIDE

This manual uses the following documentation conventions:

DOCUMENTATION CONVENTIONS

Description Represents Examples

Arial font:

Italic characters Referenced books MPLAB® IDE User’s Guide

Emphasized text ...is the only compiler...

Initial caps A window the Output window

A dialog the Settings dialog

A menu selection select Enable Programmer

Quotes A field name in a window or

dialog “Save project before build”

Underlined, italic text with

right angle bracket A menu path File>Save

Bold characters A dialog button Click OK

A tab Click the Power tab

N‘Rnnnn A number in verilog format,

where N is the total number of

digits, R is the radix and n is a

digit.

4‘b0010, 2‘hF1

Text in angle brackets < > A key on the keyboard Press <Enter>, <F1>

Courier New font:

Plain Courier New Sample source code #define START

Filenames autoexec.bat

File paths c:\mcc18\h

Keywords _asm, _endasm, static

Command-li n e op ti o ns -Opa+, -Opa-

Bit values 0, 1

Constants 0xFF, ‘A’

Italic Courier New A variable argument file.o, where file can be

any valid filena me

Square brackets [ ] Optional arguments mcc18 [options] file

[options]

Curly brackets and pipe

character: { | } Choice of mutually exclusive

arguments; an OR selection errorlevel {0|1}

Ellipses... Replaces repeated text var_name [,

var_name...]

Represents code supplied by

user void main (void)

{ ...

}

Preface

RECOMMENDED READING

This user's guide d escribes how to use MCP6XXX Amplifier Evaluation Board 3. Other

useful documents are listed below. The following Microchip documents are available

and recommended as supplemental reference resources.

MCP6021/2/ 3/ 4 Data Sheet, “Rail-to-Rail Input/Output, 10 MHz Op Amps”

(DS21685)

This data sheet provides detailed information regarding the MCP602X product family.

THE MICROCHIP WEB SITE

Microchip provides online support via our web site at www.microchip.com. This web

site is used as a means to make files and information easily available to customers.

Accessible by using your favorite Internet browser, the web site contains the following

information:

•Product Support – Da ta sheets and errata, application notes and sample

programs, design resources, user’s guides and hardware support documents,

latest software releases and archived software

•General Technical Support – Frequently Asked Questions (FAQs), technical

support reque s ts, online dis cus sio n groups, Microchip consultant program

member listing

•Business of Microchip – Product selector and ordering guides, latest Microchip

press releases, listing of seminars and events, listings of Microchip sales offices,

distributors and factory repr esentatives

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative

• Local Sales Of fice

• Field Application Engineer (FAE)

• Technical Support

• Development Systems Information Line

Customers should conta ct their distributor, represent ative or field applica tion engine er

for support. Local sales offices are also available to help customers. A listing of sales

offices and locations is included in the back of th is do cum e nt .

Technical support is available through the web site at: http://support.microchip.com

DOCUMENT REVISION HISTORY

Revision A (July 2007)

• Initial Release of this Document.

MCP6XXX Amplifier Evaluation Board 3 User’s Guide

NOTES:

MCP6XXX AMPLIFIER EVALUATION

BOARD 3 USER’S GUIDE

Chapter 1. Product Overview

1.1 INTRODUCTION

The MCP6XXX Amplifier Evaluation Board 3 is described by the following:

• Assembly # : 114-00153

• Order # : MCP6XXXEV-AMP3

• Name: MCP6XXX Amplifier Evaluation Board 3

Items discussed in this chapter include:

•Section 1.2 “MCP6XXX Amplifier Evaluation Board 3 Kit Contents”

•Section 1.3 “Micro chip’s Web-Based Mindi™ Analog Simulator Tool”

•Section 1.4 “MCP6XXX Amplifier Evaluation Board 3 Description”

1.2 MCP6XXX AMPLIFIER EVALUATION BOARD 3 KIT CONTENTS

• MCP6XXX Amplifier Evaluation Board 3 - One partially assembled board

• Important Information “Read First”

• Accessory Bag - Contains loose parts for populating sockets on board

• Analog and Interface Pr oducts Demonstration Boards CD-ROM (DS21912)

- MCP6XXX Amplifier Evaluation Board 3 User’s Guide (DS51673)

FIGURE 1-1: MCP6XXX Amplifier Evaluation Board 3 Kit.

MCP6XXX Amplifier Evaluation Board 3 User’s Guide

1.3 MICROCHIP’S WEB-BASED MINDI™ ANALOG SIMULATOR TOOL

The Mindi™ Analog Simulator tool is an innovative software tool that simplifies analog

circuit design. The Mindi™ Analog Simulator tool supports the following application

circuits: 1) Active Filte rs, 2) Amplifiers, 3) Battery Chargers, and 4) DC-to-DC

Converters. The Amplifier Designer provides full schematic diagrams of the amplifier

application circuit with recommended component values and displays the responses in

frequency an d time do m ain s.

The Mindi™ Analog Simulator tool is a free web-based design tool available on the

Microchip web site at http://www.microchip.com under “Online Simulation Tools” or

by going directly to the Mindi web site at http://www.microchip.com/mindi. The circuit

simulator within the Mindi™ Analog Simulator tool can be d ownloaded and installed on

a personal computer (PC) for more convenient simulations. Modified circuit files can

also be downloaded to the PC.

1.4 MCP6XXX AMPLIFIER EVALUATION BOARD 3 DESCRIPTION

MCP6XXX Amplifier Evaluation Board 3 is intended to support the difference amplifier

circuits which are generated by the Mindi™ Amplifier Designer.

The MCP6XXX Amplifier Evaluation Board 3 has the following features:

• All amplifier resistors and capacitors are socketed

• All of the component labels on board keep consistent with those on schematic

generated in the Mindi™ Amplifier Designer

• Support s all Microchip single op amps

- PDIP-8 package (e.g., MCP6021) are socketed

- SOIC-8 package can be accomodated; see Section 2.4.3 “Amplifier

Modifications Using 8-Pin SOIC Op Amp s”

• Test points for connecting lab equipment

• Single supply configuration

Figure 1-2 shows the block diagram of the MCP6XXX Amplifier Evaluation Board 3.

Lab equipment can be attached (via test points) to measure the amplifier response.

FIGURE 1-2: MCP6XXX Amplifier Evaluation Board 3 Block Diagram.

Signal Inputs

and

Mid-Supply Ref

and

Test Points

Test Point

Power Supply

and

Test Point

Signal Output

and Test Point

(Op Amp, Resistors

Capacitors)

Amplifier Circu i t

Source

Configuration

MCP6XXX AMPLIFIER EVALUATION

BOARD 3 USER’S GUIDE

Chapter 2. Installation and Operation

2.1 INTRODUCTION

This chapter shows how to set up the MCP6XXX Amplifier Evaluation Board 3.

Items discussed in this chapter include:

• Required Tools

• MCP6XXX Amplifier Evaluation Board 3 Set-Up

• MCP6XXX Amplifier Evaluation Board 3 Operation

2.2 REQUIRED TOOLS

• Lab power supply

• Lab signal source (e.g., function generator)

• Lab measurement equipment (e.g., oscilloscope)

2.3 MCP6XXX AMPLIFIER EVALUATION BOARD 3 SET-UP

The MCP6XXX Amplifier Evaluation Board 3 supports difference amplifier . This section

details the conversion of these topologies to the MCP6XXX Amplifier Evaluation Board

3. Figure 2-1 shows the circuit diagram for the board.

FIGURE 2-1: MCP6XXX Amplifier Evaluation Board 3 Circuit Diagram.

VDD0.1 µF

CU1

CP1

1.0 µF

Power Supply

GND

VDD

DP1

GND

VREF

RISO

RLCL

GND

Mid-supply

Reference

Block

Source

Configuration

Block

* Test Points

MCP6XXX Amplifier Evaluation Board 3 User’s Guide

The power supply voltage needs to be in the allowed range for the installed op amps.

Any of Microchip’s op amps that operate below 5.5V can be used. Moreover , the power

supply is protected by a zener diode with nominal voltage 6.2V and bypassed by a

1.0 µF capacitor. (See Figure 2-3: “Power Supply Block.”)

The mid-supply reference consists of a voltage divider and a buffer amplifier. (See

Figure 2-4: “Mid-Supply Reference Block.”)

The resistors that are part of an amplifier are placed in pin sockets which are labeled.

All of the component labels on board keep consistent with those on the schematic

generated in the Mindi™ Amplifier Designer. The op amps are bypassed by 0.1 µF

capacitors and the single op amp U1 can have either a PDIP-8 or SOIC-8 package .

• PDIP-8 packages are inserted into the DIP-8 socket to the right of the U1 label

• SOIC-8 packages can be accommodated; see Section 2.4.3 “Amplifier

Modifications Using 8-Pin SOIC Op Amps”

The (surface mount) test points for power supply , ground, input signal and output signal

allow lab equipment to be connected to the board. The MCP6XXX Amplifier Evaluation

Board 3 top view is shown in Figure 2-2.

FIGURE 2-2: MCP6XXX Amplifier Evaluation Board 3 Top View.

Installation and Operation

2.3.1 Top Level Amplifier Circuit Diagrams

2.3.1.1 POWER SUPPLY BLOCK

The power supply is protected by a zener diode and bypassed by a capacitor.

Figure 2-3 shows the circuit diagram for the power supply. CP1 = 1.0 µF.

FIGURE 2-3: Power Supply Block.

2.3.1.2 MID-SUPPLY REFERENCE BLOCK

The mid-supply reference consists of a voltage divider and a buffer amplifier . Figure 2-4

shows the circuit diagram for the mid-supply reference.

CR1 = CR2 = 0.1 µF, RR1 = RR2 = 20.0 k Ω.

FIGURE 2-4: Mid-Supply Reference Block.

Power Supply

VDD

CP1

DP1

Note: DP1 is a zener diode with nominal voltage of 6.2V

Mid-supply Reference

VDD

CR1

RR1

UR1

CR2 RR2

MCP6XXX Amplifier Evaluation Board 3 User’s Guide

2.3.1.3 OUTPUT LOAD BLOCK

The output load con sists of a capacitor and two resistor s. Figure 2-5 shows the circuit

diagram for the output load. RISO is used to stabilize the amplifier when it drives a large

capacitive load (CL). RISO is a short circuit (0Ω) when CL is small.

FIGURE 2-5: Output Load Block.

Output Load

VOUT RISO

Installation and Operation

2.3.1.4 DIFFERENCE AMPLIF I E R

• Amplifies the difference between two voltages, while rejecting the common mode

(average) input volt age. Output volt age is shifted by a reference volt age for single

supply

• The Mindi™ Amplifier Designer gives design recommendations for the difference

amplfier circuit; see the circuit diagram shown in Figure 2-6

- Fill the sockets with the recommended resistors and capacitors

FIGURE 2-6: Difference Amplifier Circuit Diagram.

• Source configuration consists of an inverting amplifier a nd a jumper. Figure 2-4

shows the circuit diagram for the source configu ration.

CS1 = 0.1 uF, RS1 = RS2 = 20.0 kΩ, RS3 = 10.0 kΩ

FIGURE 2-7: Source Configuration Block.

VOUT Output

Load

VRMid-supply

Reference

VDD VS

Power

Supply

Source

Configuration

Source Configuration VDD

RS2

RS1

CS1

RS3

US1 JPS1

# 1

# 2

# 3

MCP6XXX Amplifier Evaluation Board 3 User’s Guide

The jumper JPS1 positions have the following effects:

Figure 2-8 shows an example supported by the MCP6XXX Amplifier Evaluation Board

3. It is assumed that VA is a differential mode input signal.

FIGURE 2-8: Difference Amplifier Example Supported by the MCP6XXX

Amplifier Evaluation Board 3.

Jumper JPS1

Position

Effects

V1 =V

2 =

AVAVA is a common mode input signal

A–VAVA is a diffential mode input signal

AVBVA and VB are connected directly to V1 and V2

Note 1: When JPS1 is in position 2, V2 is actually described by the following equation:

It is assumed that RS2 = RS1.

V2VRVAVR

–()RS2 RS1

⁄

()–=

VR1R

S2 RS1

⁄

+()VARS2 RS1

⁄

()–=

VDD0.1 µF

CU1

CP1

1.0 µF

Power Supply

GND

VDD

DP1

GND

VREF

RISO

RLCL

GND

Mid-supply

Reference

Block

Source

Configuration

Block

* Test Points

Installation and Operation

2.4 MCP6XXX AMPLIFIER EVALUATION BOARD 3 OPERATION

Items discussed in this section include:

• Building the Amplifier

• Testing the Amplifier

• Amplifier Modification: Using 8-Pin SOIC Op Amps

2.4.1 Building the Amplifier

The accessory bag that comes with this kit makes it quick and easy to evaluate the

amplifier described below, which was designed in the Mindi™ Amplifier Designer.

This amplifier is described as follows:

• Difference Amplifier (Single Supply Configuration)

• Power Supply Voltage is 5.0V

• Differential Mode Input Signal

• Desired Closed Loop Gain is 1 V/V

• Load Capacitance is 56 pF

FIGURE 2-9: Difference Amplifier Designed In the Mindi™ Amplifier Designer.

MCP6XXX Amplifier Evaluation Board 3 User’s Guide

Figure 2-10 shows the same circuit redrawn to emphasize the difference amplifier.

FIGURE 2-10: Difference Amplifier Supported by the MCP6XXX Amplifier

Evaluation Board 3 Kit.

Each of the components in Figure 2-10 that needs to be inserted in a socket on the

MCP6XXX Amplifier Evaluation Board 3 is listed in Table 2-1.

TABLE 2-1: AMPLIFIER COMPONENTS LIST

For the differential mode input signal, the jumper JPS1 position is listed in Table 2-2.

TABLE 2-2: JUMPER POSITION

PCB Labels Component Values

R1 1.98 kΩ

R2 1.98 kΩ

R3 1.98 kΩ

R4 1.98 kΩ

RISO 0Ω

RL 1.98 kΩ

CL 56 pF

U1 MCP6021, PDIP-8, 10 MHz

Jumper Position

JPS1 2

VOUT Output

Load

VRMid-supply

Reference

VDD VS

Power

Supply

Source

Configuration

Installation and Operation

The fully assembled difference amplifier circuit diagram is shown in Figure 2-11.

FIGURE 2-11: Fully Assembled Difference Amplifier Supported by the

MCP6XXX Amplifier Evaluation Board 3.

The fully assembled MCP6XXX Amplifier Evaluation Board 3 top view is shown in

Figure 2-12.

FIGURE 2-12: Picture of the Difference Amplifier Supported by the MCP6XXX

Amplifier Evaluation Board 3.

VDD0.1 µF

CU1

CP1

1.0 µF

Power Supply

GND

VDD

DP1

GND

VREF

RISO

GND

Mid-supply

Reference

Block

Source

Configuration

Block

* Test Points

MCP6XXX Amplifier Evaluation Board 3 User’s Guide

2.4.2 Testing the Amplifier

2.4.2.1 CHECKING THE TEST POINTS

The (surface mount) test points for power supply , ground, input signal and output signal

allow lab equipment to be connected to the bo ard. Figure 2-13 shows the test points to

check.

FIGURE 2-13: Checking the Test Points.

GND

Test Point

VDD

Test Point

GND

Test Point

GND

Test Point

VREF

Test Point

Installation and Operation

2.4.2.2 TRANSIENT RESPONSES

This difference amplifier was built, and its response s we re mea sure d. A MCP6021 op

amp, 1% resistors, and 5 % capacitors were us ed. Notice how close the measured and

simulated data are.

2.4.2.2.1 Transient Step Response

In Bench Measurement:

•Set V

IN as a differential mode signal with a step amplitude of 2.0V and a center

voltage of 2.5V. (i.e. VIN starts 1.0V below center and ends 1.0V above center

• The measured step response is shown in Figure 2-14. It is a signal with a step

amplitude of 4.0V and a center volt age of 2.5V. (i.e. VOUT starts 2.0V below center

and ends 2.0V above center

FIGURE 2-14: Measured Step Response.

Note: The center voltage of VIN is set at VREF = VDD/2 (For VDD = 5.0V,

VREF = 2.5V)

VIN = 3.5V

VOUT = 4.5V

VREF = 2.5V

MCP6XXX Amplifier Evaluation Board 3 User’s Guide

In the Mindi™ Amplifier Designer:

•Set V

IN as a differential mode signal with a step amplitude of 2.0V and a center

voltage of 2.5V. (i.e. VIN starts 1.0V below center and ends 1.0V above center)

• The simulated step response is shown in Figure 2-15. It is a signal with a step

amplitude of 4.0V and a center volt age of 2.5V. (i.e. VOUT starts 2.0V below center

and ends 2.0V above center)

FIGURE 2-15: Simulated Step Response.

Note: The center voltage of VIN is set at VREF = VDD/2 (For VDD = 5.0V,

VREF = 2.5V)

VOUT = 4.5V

VREF = 2.5V

VIN = 3.5V

Installation and Operation

2.4.2.2.2 Transient Sine Wave Response

In Bench Measurement:

•Set V

IN as a sine wave with a frequency of 100.0 Hz, a peak-to-peak voltage of

2.0V and a center voltage of 2.5V

• The measured sine wave response is shown in Figure 2-16. It is a sine wave

signal with a frequency of 100.0 Hz, a peak-to-peak voltage of 4.0V and a center

voltage of 2.5V

FIGURE 2-16: Measured Sine Wave Response.

Note: The center voltage of VIN is set at VREF = VDD/2 (For VDD = 5.0V,

VREF = 2.5V)

VIN

VOUT VREF

MCP6XXX Amplifier Evaluation Board 3 User’s Guide

In the Mindi™ Amplifier Designer:

•Set V

IN as a sine wave with a frequency of 100.0 Hz, a peak-to-peak voltage of

2.0V and a center voltage of 2.5V

• The simulated sine wave response is sh own in Figure 2-17. It is a sine wave

signal with a frequency of 100.0 Hz, a peak-to-peak voltage of 4.0V and a center

voltage of 2.5V

FIGURE 2-17: Simulated Sine Wave Response.

Note: The center voltage of VIN is set at VREF = VDD/2 (For VDD = 5.0V,

VREF = 2.5V)

VIN

VOUT

VREF

Installation and Operation

2.4.3 Amplifier Modifications Using 8-Pin SOIC Op Amps

There are two options available to use single op amps in SOIC-8 packages (150 mil

wide):

• Soldering onto the MCP6XXX Amplifier Evaluation Board 3, or

• Soldering it onto a separate board which is con nected to the DIP-8 socket

Figure 2-18 shows a SOIC-8 op amp soldered onto the MCP6XXX Amplifier Evaluation

Board 3.

FIGURE 2-18: Op Amp in SOIC-8 package soldered onto MCP6XXX Amplifier

Evaluation Board 3.

Figure 2-19 shows a SOIC-8 op amp and a DIP-8 socket, soldered onto the 8-Pin

SOIC/MSOP/TSSOP/DIP Evaluation Board available from Microchip Technology Inc.

(order # SOIC8EV). The two interconnect strips on the bottom are Samtec part #

BBS-14-T -B or equivalent and are soldered into the through holes for the DIP-8 socket.

Figure 2-20 shows this board plugged into the MCP6XXX Amplifier Evaluation Board

Note: The DIP-8 socket must be empty; only one op amp can be used at a time.

Solder an SOIC-8

Op Amp onto the

board

The PDIP socket

must be empty

Note: Insert the interconnect strips into the DIP-8 socket on the MCP6XXX

Amplifier Evaluation Board 3. Place the SOIC8EV board on the top of the

interconnect strips with the same pin orientation. Now solder the strips to

the top board; this procedure ensures correct alignment of the strips. Clip

the pins flush with the top surface of the SOIC8EV board, then solder the

SOIC-8 op amp on the top.

MCP6XXX Amplifier Evaluation Board 3 User’s Guide

FIGURE 2-19: Op Amp in SOIC-8 package soldered onto a separate board.

FIGURE 2-20: Connecting Adaptor Board onto MCP6XXX Amplifier Evaluation

Board 3.

(Front View) (Back View)

MCP6XXX AMPLIFIER EVALUATION

BOARD 3 USER’S GUIDE

Appendix A. Schematic and Layouts

A.1 INTRODUCTION

This appendix contains the following schematics and layouts for the MCP6XXX Ampli-

fier Evaluation Board 3:

• Board – Schematic

• Board – Top Silk Layer

• Board – Top Trace and Silk Layer

• Board – Bottom Layer

MCP6XXX Amplifier Evaluation Board 3 User’s Guide

A.2 BOARD - SCHEMATIC

Schematic and Layouts

A.3 BOARD - TOP SILK LAYER

MCP6XXX Amplifier Evaluation Board 3 User’s Guide

A.4 BOARD - TOP TRACE AND SILK

Schematic and Layouts

A.5 BOARD - BOTTOM LAYER

MCP6XXX Amplifier Evaluation Board 3 User’s Guide

NOTES:

MCP6XXX AMPLIFIER EVALUATION

BOARD 3 USER’S GUIDE

Appendix B. Bill of Materials (BOM)

B.1 MCP6XXX AMPLIFIER EVALUATION BOARD 3 BOM

The Bill of Materials (BOM) in Table B-1 corresponds to Figure 2-1 and Figure 2-2.

Unpopulated parts are in Table B-2.

TABLE B-1: BILL OF MATERIALS (102-00153R1) (NOTE 1)

Qty Reference Description M anufacturer Part Number

1 CP1 CAP CERAMIC 1UF 10% 25V

X5R 0805 Panasonic® - ECG ECJ-2FB1E105K

5 CR1,CR2 CS1

CU1,CU2 CAP CERAMIC .1UF 10% 25V

X7R 0805 Panasonic - ECG ECJ-2VB1E104K

4 EA Corner BUMPER CLEAR

.375X.15"DOME Richco Plastic Co RBS-12

1 JPS1 CONN HEADR BRKWAY .100

06POS STR Tyco® Electronics/Amp 4-103327-0-06

1 PCB RoHS Compliant Bare PCB Microchip Technology Inc. 104-00153

14 Pin Socket PIN RECPT .015/.025 DIA 0667

SER Mill-Max®0667-0-15-01-30-27-10-0

4 RR1,RR2

RS1,RS2 RES 20.0K OHM 1/8W 1% 0805

SMD Panasonic - ECG ERJ-6ENF2002V

1 RS3 RES 10.0K OHM 1/8W 1% 0805

SMD Panasonic - ECG ERJ-6ENF1002V

1 Shunt for JPS1 SOCKET,SHORT BLKS W TAB

BLK JAMECO VALUEPRO 2012JH-R

8 Test Points PC TEST POINT COMPACT

SMT Keystone Electronics®5016

2 UR1,US1 MCP6021 SOT-23-5 Single

OpAmp Microchip Technology Inc. MCP6021T-E/OT

1 For U1 CONN IC SOCKET 8POS DIP

TIN Tyco Electronics/Amp 2-641260-1

Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM

used in manufacturing uses all RoHS-compliant components.

Bill of Materials (BOM)

TABLE B-2: BILL OF MATERIALS – UNPOPULATED PARTS (102-00153R1)

The BOM in Table B-3 corre sponds to the colle ction of resistors, cap acitorys, jumpers

and MCP6021 op amps that come in the Accessory Bag which is shipped in the

MCP6XXX Amplifier Evaluation Board 3 Kit. These components are placed in an

separate ESD bag. They support the circuit in Section 2.4.1 “Building the Amplifier”.

Customers need to provide the resistors and capacitors for more amplifier circuits.

TABLE B-3: BILL OF MATERIALS – ACCESSORY BAG PART S (102-00153R1)

Qty Reference Description Manufacturer Part Number

1 U1 MCP6021 PDIP-8, Single Op

Amp Microchip

Technology Inc MCP6021T-E/P

1 U2 MCP6021 SOIC-8, Single Op

Amp Microchip

Technology Inc MCP6021T-E/SN

7 R1-R4, RISO, RL,

CL Not Populated when shipped to

customer ——

Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM

used in manufacturing uses all RoHS-compliant components.

Qty Reference Description Manufacturer Part Number

1 Accessory Bag CAP CER 56PF 50V C0G

RADIAL Murata Electronics®RPE5C1H560J2P1Z03B

1 Accessory Bag JUMPER ZERO OHM 1/8W Yageo® Corporation ZOR-12-B-52

5 Accessory Bag RES 1.96K OHM 1/4W 1%

METAL FILM Yageo Corporation MFR-25FBF-1K96

1 ESD Sample Box MCP602 1 Single OpAmp

PDIP-8 Microchip Technology Inc MCP6021-E/P

Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM

used in manufacturing uses all RoHS-compliant components.

Bill of Materials (BOM)

NOTES:

AMERICAS

Corporate Office

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://support.microchip.com

Web Address:

www.microchip.com

Atlanta

Duluth, GA

Tel: 678-957-9614

Fax: 678-957-1455

Boston

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

Detroit

Farmington Hills, MI

Tel: 248-538-2250

Fax: 248-538-2260

Kokomo

Kokomo, IN

Tel: 765-864-8360

Fax: 765-864-8387

Los Angeles

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

Santa Clara

Santa Clara, CA

Tel: 408-961-6444

Fax: 408-961-6445

Toronto

Mississauga, Ontario,

Canada

Tel: 905-673-0699

Fax: 905-673-6509

ASIA/PACIFIC

Asia Pacific Office

Suites 3707-14, 37th Floor

Tower 6, The Gateway

Harbour City, Kowloon

Hong Kong

Tel: 852-2401-1200

Fax: 852-2401-3431

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

China - Beijing

Tel: 86-10-8528-2100

Fax: 86-10-8528-2104

China - Chengdu

Tel: 86-28-8665-5511

Fax: 86-28-8665-7889

China - Fuzhou

Tel: 86-591-8750-3506

Fax: 86-591-8750-3521

China - Hong Kong SAR

Tel: 852-2401-1200

Fax: 852-2401-3431

China - Qingdao

Tel: 86-532-8502-7355

Fax: 86-532-8502-7205

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

China - Shenzhen

Tel: 86-755-8203-2660

Fax: 86-755-8203-1760

China - Shunde

Tel: 86-757-2839-5507

Fax: 86-757-2839-5571

China - Wuhan

Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

China - Xian

Tel: 86-29-8833-7252

Fax: 86-29-8833-7256

ASIA/PACIFIC

India - Bangalore

Tel: 91-80-4182-8400

Fax: 91-80-4182-8422

India - New Delhi

Tel: 91-11-4160-8631

Fax: 91-11-4160-8632

India - Pune

Tel: 91-20-2566-1512

Fax: 91-20-2566-1513

Japan - Yokohama

Tel: 81-45-471- 6166

Fax: 81-45-471-6122

Korea - Daegu

Tel: 82-53-744-4301

Fax: 82-53-744-4302

Korea - Seoul

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

Malaysia - Penang

Tel: 60-4-646-8870

Fax: 60-4-646-5086

Philippines - Manila

Tel: 63-2-634-9065

Fax: 63-2-634-9069

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

Taiwan - Hsin Chu

Tel: 886-3-572-9526

Fax: 886-3-572-6459

Taiwan - Kaohsiung

Tel: 886-7-536-4818

Fax: 886-7-536-4803

Taiwan - Taipei

Tel: 886-2-2500-6610

Fax: 886-2-2508-0102

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

EUROPE

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

Denmark - Copenhagen

Tel: 45-4450-2828

Fax: 45-4485-2829

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

UK - Wokingham

Tel: 44-118-921-5869

Fax: 44-118-921-5820

WORLDWIDE SALES AND SERVICE

06/25/07

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

Microchip:

MCP6XXXEV-AMP3