www.osram-os.com Produktdatenblatt | Version 1.1 SFH 4232 SFH 4232 Platinum DRAGON (R) High Power Infrared Emitter (850 nm) Applications ----3D Sensing ----Safety and Security, CCTV ----CCTV Surveillance ----VMS Features: ----Package: clear silicone ----Corrosion Robustness Class: 3B ----Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification for Automotive Grade Discrete Semiconductors. ----ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) ----IR lightsource with high efficiency ----Low thermal resistance (Max. 9 K/W) ----Centroid wavelength 850 nm ----SMT package Ordering Information Type Total radiant flux1) IF=1000mA; tp=10ms e 320 ... 800 mW Discontinued SFH 4232-Z 1 Version 1.5 | 2019-07-16 Total radiant flux1) typ. IF=1000mA; tp=10ms e 530 mW Ordering Code Q65110A8754 SFH 4232 Maximum Ratings TA=25C Parameter Symbol Operating temperature Top min. max. -40 C 125 C Storage temperature Tstg min. max. -40 C 125 C Junction temperature Tj max. 145 C Forward current IF max. 1000 mA Surge current tp200s; D=0 IFSM max. 5A Reverse current2) IR max. 200 mA Power consumption Ptot max. 1800 mW ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD max. 2 kV Discontinued 2 Version 1.5 | 2019-07-16 Values SFH 4232 Characteristics IF=1000mA; tp=10ms; TA=25C Parameter Symbol Peak wavelength peak typ. 860 nm Centroid wavelength centroid typ. 850 nm Spectral bandwidth at 50% Irel,max (FWHM) typ. 30 nm Half angle typ. 60 Dimensions of active chip area LxW typ. 1x1 mmxmm Rise time (10% / 90%) IF=5A; RL=50 tr typ. 7 ns Fall time (10% / 90%) IF=5A; RL=50 tf typ. 14 ns Forward voltage IF=1A; tp=100s VF typ. max. 1.5 V 1.8 V Forward voltage IF=5A; tp=100s VF typ. max. 2V 2.9 V Reverse voltage2) IR=20mA VR max. 1.2 V Reverse voltage (ESD device)2) VR ESD min. 45 V Radiant intensity3) IF=1A; tp=100s Ie typ. 180 mW/sr Temperature coefficient of voltage TCV typ. -1 mV / K Temperature coefficient of brightness TCI typ. -0.3 % / K Temperature coefficient of wavelength TC typ. 0.3 nm / K Thermal resistance junction solder point real4) RthJS max. 9.0 K / W Discontinued 3 Version 1.5 | 2019-07-16 Values SFH 4232 Brightness Groups TA=25C Group Total radiant flux 1) IF=1000mA; tp=10ms min. e Total radiant flux 1) IF=1000mA; tp=10ms max. e CB 320 mW 500 mW DA 400 mW 630 mW DB 500 mW 800 mW Only one group in one packing unit (variation lower 1.6:1) Relative Spectral Emission 5), 6) Ie,rel=f(); IF=1000mA; tp=10ms OHF04132 100 I rel % 80 60 40 20 Discontinued 0 700 750 800 850 nm 950 4 Version 1.5 | 2019-07-16 SFH 4232 Radiation Characteristics 5), 6) Ie,rel=f() 40 30 20 10 0 50 OHL01660 1.0 0.8 0.6 60 0.4 70 0.2 80 0 90 100 1.0 0.8 Forward current 0.6 OHF03847 10 1 A 20 40 60 80 100 120 5), 6) e/e(1000mA)=f(IF); single pulse; tp=100s OHF03848 101 e e (1 A) 10 0 0 Relative Total Radiant Flux 5), 6) IF=f(VF); single pulse; tp=100s IF 0.4 100 5 10-1 5 10 -1 10-2 5 Discontinued 10 -2 0 0.5 1 1.5 2 V 2.5 VF 5 Version 1.5 | 2019-07-16 10-3 -2 10 5 10 -1 5 10 0 A 10 1 IF SFH 4232 Max. Permissible Forward Current Permissible Pulse Handling Capability IF,max=f(TS); Rthjs=9K / Wsingle pulse IF=f(tp); dutycycle D=parameter; TS=85C IF OHF04369 1.1 A IF 5.5 A 4.5 0.8 4.0 0.7 3.5 0.6 3.0 0.5 2.5 0.4 2.0 0.3 1.5 0.2 1.0 0.1 0.5 0 20 40 60 80 100 C 130 TS Discontinued 6 Version 1.5 | 2019-07-16 t D = TP 0.9 0 OHF04177 tP IF T D= 0.005 0.01 0.02 0.05 0.1 0.2 0.33 0.5 1 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp SFH 4232 Dimensional Drawing 7) Further Information Approximate Weight: 219.0 mg Package marking: Cathode Corrosion test: Class: 3B Test condition: 40C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC 60068-2-43) ESD advice: The device is protected by ESD device which is connected in parallel to the Chip. Discontinued 7 Version 1.5 | 2019-07-16 SFH 4232 Recommended Solder Pad 7) 1.6 (0.063) 10 (0.394) o2.5 (0.098) o4.0 (0.157) 2.3 (0.091) 11.6 (0.457) 2.3 (0.091) 11.6 (0.457) 0.3 (0.012) 12.0 (0.472) 1.6 (0.063) Kupfer Copper o4.0 (0.157) Heatsink attach 3 Lotstellen 3 solder points Thermisch optimiertes PCB Thermal enhanced PCB Lotstopplack Solder resist Lotpasten Schablone Solder paste stencil Bare Copper Freies Kupfer OHAY0681 Anode and heatsink are electrically connected. Discontinued 8 Version 1.5 | 2019-07-16 SFH 4232 Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E OHA04525 300 C T 250 Tp 245 C 240 C tP 217 C 200 tL 150 tS 100 50 25 C 0 0 50 100 150 200 250 s 300 t Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 C to 150 C tS Time tS TSmin to TSmax Ramp-up rate to peak*) TSmax to TP Liquidus temperature 60 2 3 100 120 2 3 K/s s K/s TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 C Time within 5 C of the specified peak temperature TP - 5 K tP 20 30 3 6 Ramp-down rate* TP to 100 C 10 Time 25 C to TP Discontinued Unit All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 9 Version 1.5 | 2019-07-16 C 480 s K/s s SFH 4232 Taping 7) 6.35 (0.250) 8 (0.315) Discontinued 10 Version 1.5 | 2019-07-16 7.35 (0.289) 0.3 (0.012) 24 (0.945) 2 (0.079) 0.3 (0.012) 12.4 (0.488) 1.55 (0.061) 11.5 (0.453) 4 (0.157) 1.75 (0.069) Cathode/Collector Side 1.9 (0.075) OHAY0508 SFH 4232 Tape and Reel 8) W1 D0 P0 A N F W E 13.0 0.25 P2 Label P1 Direction of unreeling Direction of unreeling W2 Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 Reel Dimensions A 180 mm W Nmin 24 + 0.3 / - 0.1 mm Discontinued 11 Version 1.5 | 2019-07-16 60/100 mm W1 W2 max 24.4 + 2 mm 30.4 mm Pieces per PU 800 SFH 4232 Barcode-Product-Label (BPL) Dry Packing Process and Materials 7) Moisture-sensitive label or print L E E V l e be sela ). k, H de L If an bl r co ba (R id m ity . H R hu 0% e e /6 tiv C la ared ag ck re fr 30 _ < in pa % k of to 90 rs ea s d ). rs ou or te (p on rs H de , ou iti H an bjec ng ou rs co C 72 si nd H ou 5 te 48 C su es e H co 24 6 da e y 40 be oc tim C e or < ith tim ill pr). or ct w O w nt 23 tim e at lo or fa M TO F s al tim at le C at lo at or e. P th F l tic th va lo or ur O F lo s ui on be if: read en w ed l 4 5 F m la ce eq id lo g, n oc l ve vi 5a is in or be 24 de pr ve l 6 Le de , nt whe e te co g: , w e Le ve l ke r ou se da ba ed flo ur e Le ve m % ba e ba al st ur e Le r en re ed e re> 10 oi st e e fo tim ur se al op fo M se oi st ur as k, is or . 33 se is M oi st bed k, lo H an , g ph -0 M oi in an in F R ng ar rbl D M e ba T r po If bl ith % lif ki r C. (if S is p. w ea r ks lf J10 ba to et th va Y ea m rs m _ r w, < he ed 1 ee te Y d, EC iredicat S fte at nt > 1 W Hou D A flody qu In no ire 1. d e ou 4 8 re reity is qu/JE re 2. bo e M tim to es id 2b re C 16 : e a) S tim is IP ic ed loor tim e b) ev Humor or e en F tim lo or D 2a king nc te F op a) lo or 3. b) ba re F lo da e fe l 1 2 F If al re tim ve l 4. se d l 2a ve Le 3 an ve l ag e Le e B ve ur e Le at st ur e Le D oi st ur e M oi st ur M oi st M oi M N E RS s in IV O IT T S C nta N U TIO U coSEND Ais bUagRMEICO T E CThIS S d Barcode label < M RA OS Humidity indicator Barcode label Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Comparator check dot WET If wet, examine units, if necessary bake units 15% If wet, examine units, if necessary bake units 10% 5% If wet, parts still adequately dry. change desiccant Humidity Indicator MIL-I-8835 Discontinued Desiccant AM OSR OHA00539 Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033. 12 Version 1.5 | 2019-07-16 SFH 4232 Schematic Transportation Box 7) Barcode label N O : (Q )Q TY :2 00 0 (9 D ) D /C :0 (X ) Packing Sealing label Length 195 5 mm 195 5 mm Discontinued 13 Version 1.5 | 2019-07-16 M Y DE -1 +Q -1 R 18 P OHA02044 Dimensions of Transportation Box Width RO UP : M RA OS PR O D 5 14 2 110 0 G 4 01 4 C: D/ (9 D) 20 00 (Q )Q TY : O TC P) (6 T LO (1 T) O D PR D EM Y 18 R -1 : Q + P -1 G R O U P: u L lt S iT Y O T6 P 7 L 6 M 14 4 (G ) E Bi D Bi n1 Bi n2 : Pn3 : Q 1: -1 20 M -2 2 L 0 Te 2a 22 m 3 24 0 p ST Ad 26 0 C R C R ditio 0 C R 07 PA 7 na RT l TE C KV XT AR Muster A o M n O d u p cto to rs R 34 ic N O : O S H 12 G BA TC H (1 T) LO T N O :1 (6 P) 23 em 8 2199 2100 5 14 2 110 0 (X ) O M O PT O M 998 NO : CThISTU SE S 21 2100 BA _ < s ur s ). Ho ururs s de Ho co 72 Ho ur te 48 e Ho 24 6 da 40 be tim e e C or th r pr < ll tim ct ). 23 oo r wi nt tim e at l wi fa r Fl oo tim s at at le C at e. ica l Fl th oo r th va ur nt Fl oo s ui be on if: read w ed l 4 5 Fl la m ide ce eq lo g, oc ve l vi is in en de be 24 de or l 5a6 pr Le ve nt wh e te co , w, g: ve l Le ke r re ou se da ba ed flo ba Le ve tu re m % ba e al e Le r en re e ed re 10 ois stu ur e tim se fo al op se fo > , M oi r se st ur 3 is is ha se M oi st nk be k, oo . 03 rd g M oi in an in Fl RH g, r-p bla DM ba Ca po If bl th % kinr life is (if . ar ST f p. wi 10 ba to et Jel r th va Ye ar ks s m _ < cat m d, C ed 1 Ye ee ur ire Sh te w, te di at nt > 1 W Ho Af flody qu In no ire DE 1. e ou 4 8 re ed re qu JE 2. bo ity is M or tim e e 16 re C/ : es id 2b r a) St tim mor is IP ed oo r tim e vic b) g e r Hu Fl oo en tim De 2a kin nc te Fl oo r a) op 3. b) ba re Fl oo da e fe l 1 Fl If al re tim ve l 2 4. se d l 2a3 Le ve g an ve l e Le Ba te ur e Le ve Le Da oist stur e ur e M oi st ur M oi st M oi H 12 34 . RH 0% /6 C : L e el selab . , H) nk de co (R bla r S S em R ic AM o n O d u p ct to o H rs NO If 23 G E V E ba ity id m hu e e d tiv re ag NO :1 L la re fra ck 30 Nns IVE RS in pa % k of ai IT TO to 90 ea d ntNS < ns UC or TIO te (p d , g itio ND U g coSE an bjec C sin nd O 5 C su es Ais baRE co IC y M oc (G ) M u L lt S iT Y O T6 P 7 L 6 E D Muster Bi Bi n1 Bi n2 : P- n3 : Q 1: -1 20 M -2 2 L 0 Te 2a 22 m 3 24 0 p ST Ad 26 0 C R C R0 ditio 0 C R PA 77 na RT l TE CK VA XT R: Barcode label Height 42 5 mm SFH 4232 Notes Depending on the mode of operation, these devices emit highly concentrated visible and non visible light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. For further application related information please visit www.osram-os.com/appnotes Discontinued 14 Version 1.5 | 2019-07-16 SFH 4232 Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS website. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product and functional safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. OSRAM OS products are not qualified at module and system level for such application. In case buyer - or customer supplied by buyer - considers using OSRAM OS components in product safety devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordinate the customer-specific request between OSRAM OS and buyer and/or customer. Discontinued 15 Version 1.5 | 2019-07-16 SFH 4232 Glossary 1) Total radiant flux:Measured with integrating sphere. 2) Reverse Operation:Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed. 3) Radiant intensity:Measured at a solid angle of = 0.01 sr 4) Thermal resistance:junction - soldering point, of the device only, mounted on an ideal heatsink (e.g. metal block) 5) Typical Values:Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 6) Testing temperature:TA = 25C (unless otherwise specified) 7) Tolerance of Measure:Unless otherwise noted in drawing, tolerances are specified with 0.1 and dimensions are specified in mm. 8) Tape and Reel:All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm. Discontinued 16 Version 1.5 | 2019-07-16 SFH 4232 Revision History Version Date Change 1.5 2019-07-15 Discontinued Discontinued 17 Version 1.5 | 2019-07-16 SFH 4232 Discontinued Published by OSRAM Opto Semiconductors GmbH Leibnizstrae 4, D-93055 Regensburg www.osram-os.com (c) All Rights Reserved. 18 Version 1.5 | 2019-07-16