POWER MANAGEMENT
Draft
1www.semtech.com
SC2608B
Simple, Synchronous
Voltage Mode PWM Controller
Features
Revision 4: Jan. 2007
The SC2608B is a versatile voltage-mode PWM control-
ler designed for use in step down DC/DC power supply
applications. A simple, fixed frequency, highly efficient
buck regulator can be implemented using the SC2608B
with minimal external components. The input voltage
range is from +5V to +12V. Internal level shift and drive
circuitry eliminates the need for an expensive P-channel,
high-side MOSFET. The small device footprint allows for
compact circuit design.
SC2608B features include temperature compensated
voltage reference, triangle wave oscillator, current limit
comparator, and an externally compensated error ampli-
fier. Current limit is implemented by sensing the voltage
drop across the bottom MOSFET RDS(ON).
The SC2608B operates at a fixed frequency of 250kHz
providing an optimum compromise between efficiency ,
external component size, and cost.
SC2608B has a thermal protection circuit, which is
activated if the junction temperature exceeds 150 OC.
+5V or +12V input voltage
250kHz operation
High efficiency (>90%)
1.25% Voltage feedback accuracy over tempera-
ture
Hiccup mode over current protection
1.2A output drive
RDS(ON) Current sensing for protection
Industrial temperature range
Available in SO-8 and SO-8 EDP package
Integrated boot strap diode
Termination supplies
Low cost microprocessor supplies
Peripheral card supplies
Industrial power supplies
High density DC/DC conversion
Figure 1
Description
Applications
Typical Application Circuit
Thermal Shut down
Fully WEEE and RoHS Compliant
2
© 2007 Semtech Corp. www.semtech.com
POWER MANAGEMENT
SC2608B
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Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified
in the Electrical Characteristics section is not implied.
Note 1: Under pulsing condition, the peak negative voltage can not be lower than -3.6V with less than 20nS from 50% to 50%.
Absolute Maximum Ratings
Electrical Characteristics
Unless specified: VCC = 12V, VBST - VPhase = 12 V, VOUT = 3.3V, TJ = TA = 25oC.
Note 2: Under pulsing condition, the peak negative voltage can not be lower than -5V with less than 20nS from 50% to 50%.
3
© 2007 Semtech Corp. www.semtech.com
POWER MANAGEMENT
SC2608B
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Electrical Characteristics
Unless specified: VCC = 12V, VBST - VPhase = 12 V, VOUT = 3.3V, TJ = TA = 25oC.
4
© 2007 Semtech Corp. www.semtech.com
POWER MANAGEMENT
SC2608B
Top View
(8-Pin SO-8)
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Notes:
(1) Only available in tape and reel packaging. A reel con-
tains 2500 devices.
(2) This device is fully WEEE and RoHS Compliant
Pin Configuration Ordering information
Pin Descriptions
(8-Pin SOIC-8L EDP)
Top View
VCC
SENSE
COMP/SS
PHASE
DL
GND
DH
BST
4
3
2
1
5
6
7
8
VCC
SENSE
COMP/SS
PHASE
DL
GND
DH
BST
4
3
2
1
5
6
7
8
VCC
SENSE
COMP/SS
PHASE
DL
GND
DH
BST
4
3
2
1
5
6
7
8
VCC
SENSE
COMP/SS
PHASE
DL
GND
DH
BST
4
3
2
1
5
6
7
8
5
© 2007 Semtech Corp. www.semtech.com
POWER MANAGEMENT
SC2608B
Figure 2
Figure 3
Block Diagram
Gate Drive Timing Diagram
S
RQ
BST
E/A
PHASE
0
0
Vcc
-
OSC
DL
VCC
LEVEL
SHIFT
GND
OCP &
UVLO
+
-
NON-OVERLAP
TIMING
VCC
COMP/SS
+
0
DH
REF
0.8V
PWM
-
+
0
OCP PHASE
SENSE
S
RQ
BST
E/A
PHASE
0
0
Vcc
-
OSC
DL
VCC
LEVEL
SHIFT
GND
OCP &
UVLO
+
-
NON-OVERLAP
TIMING
VCC
COMP/SS
+
0
DH
REF
0.8V
PWM
-
+
0
OCP PHASE
SENSE
6
© 2007 Semtech Corp. www.semtech.com
POWER MANAGEMENT
SC2608B
Synchronous Buck ConverterSynchronous Buck Converter
Synchronous Buck ConverterSynchronous Buck Converter
Synchronous Buck Converter
The output voltage of the synchronous converter is set
and controlled by the output of the error amplifier. The
inverting input of the error amplifier receives its voltage
from the SENSE pin. The non-inverting input of the error
amplifier is connected to an internal 0.8V reference. The
error amplifier output is connected to the compensation
pin. The error amplifier generates a current proportional
to (0.8V-Vsense), which is the COMP pin output current
(Transconductance ~ 7mS). The voltage on the COMP
pin is the integral of the error amplifier current. The COMP
voltage is the non-inverting input of the PWM compara-
tor and controls the duty cycle of the MOSFET drivers.
The compensation network controls the stability and tran-
sient response of the regulator. The larger capacitor,
the slower COMP voltage changes, and slower the duty
cycle changes.
The non-inverting input voltage of the PWM comparator
is the triangular ramp signal generated from the oscilla-
tor. The peak-to-peak voltage of the ramp is 1V, this is a
parameter used in control loop calculation. When the
oscillator ramp signal rises above the COMP voltage, the
comparator output goes high and the PWM latch is re-
set. This pulls DH low, turning off the high-side MOSFET.
After a short delay (dead time), DL is pulled high, turning
on the low-side MOSFET. The oscillator also produces a
set pulse for the PWM latch to turn off the low-side
MOSFET, After a delay time, DH is pulled high to turn on
the high-side MOSFET. The delay time is determined by a
monostable on the chip.
The triangle wave minimum is about 0.8V, and the maxi-
mum is about 1.8V. Thus, if Vcomp = 0.7V, high side duty
cycle is the minimum (~0%) , but if Vcomp is 1.8V, duty
cycle is at maximum ( ~90%).The internal oscillator uses an
on-chip capacitor and trimmed precision current sources
to set the oscillation frequency to 250kHz. Figure 1 shows
a 2.5V output converter. If the Vout <2.5V, then the SENSE
voltage < 0.8V. In this case the error amplifier will be sourc-
ing current into the COMP pin so that COMP voltage and
duty cycle will gradually increase.If Vout > 2.5V, the error
amplifier will sink current and reduce the COMP voltage, so
that duty cycle will decrease.The circuit will be in steady
state when Vout =2.5V , Vsense = 0.8V, Icomp = 0. The
COMP voltage and duty cycle depend on Vin.
UU
UU
Under Vnder V
nder Vnder V
nder Voltage Lockoltage Lock
oltage Lockoltage Lock
oltage Lockoutout
outout
out
The under voltage lockout circuit of the SC2608B as-
sures that both high-side and low-side MOSFET driver
outputs remain in the off state whenever the supply volt-
age drops below the set threshold. Lockout occurs if VCC
falls below 3.6V typ.
Soft StartSoft Start
Soft StartSoft Start
Soft Start
The SC2608B provides a soft start function to prevent large
inrush currents upon power-up or hiccup retry. If both COMP
and SENSE pins are low (<300mV), the device enters soft
start mode, and the compensation capacitor is slowly
charged by an internal 4uA current source. When the COMP
pin reaches 300mV, the low side FET is switched on in order
to refresh the bootstrap capacitor, and begin PWM from a
known state. As the COMP pin rises above 800mV, PWM
begins at minimum duty cycle.
COMP continues to charge, slowly sweeping the device
through the duty cycle range until FB reaches the regulation
point of 800mV. Once FB reaches the regulation point, the
soft start current is switched off, and the strong error amp
is enabled, providing a glitch-free entrance into closed loop
operation. The overcurrent comparator is still active during
soft start mode, and will override soft start in the event
that an overcurrent is detected, such as startup into a
dead short.
RR
RR
RDS(ON)DS(ON)
DS(ON)DS(ON)
DS(ON) Current Limiting Current Limiting
Current Limiting Current Limiting
Current Limiting
In case of a short circuit or overload, the low-side (LS) FET
will conduct large currents. To protect the regulator in this
situation, the controller will shut down the regulator and
begin a soft start cycle later. While the LS driver is on,the
Phase voltage is compared to the OCP trip voltage. If the
phase voltage is lower than OCP trip voltage, an over cur-
rent condition is detected. The low-side Rdson sense is imple-
mented at end of each LS-FET turn-on duration. The mini-
mum turn-on time of the LS-FET is set to be 400nS. This
will ensure the sampled signal is noise free by giving enough
time for the switching noise to die down.
Theory of Operation
OCP HiccupOCP Hiccup
OCP HiccupOCP Hiccup
OCP Hiccup
In the event that an overcurrent is detected, the SC2608B
latches the fault and begins a hiccup cycle. Switching is
immediately stopped, and the drivers are set to a tristate
condition (Both DH and DL are low). COMP is slowly
discharged to 300mV with an internal 4uA current source,
providing a long cooldown time to keep power dissipation
low in the event of a continuous dead short. Once COMP
and SENSE both fall below the 300mV threshold, the part
re-enables the 4uA soft start current , and the device begins
a normal startup cycle again.
7
© 2007 Semtech Corp. www.semtech.com
POWER MANAGEMENT
SC2608B
Applications Information (Cont.)
The control model of SC2608B is depicted in Fig. 4.
This model can also be used to generate loop gain Bode
plots. The bandgap reference is 0.8V and trimmed to
+/-1% accuracy. The desired output voltage can be
achieved by setting the resistive divider network, R1 and
R2. The error amplifier is transconductance type with fixed
gain of:
The compensation network includes a resistor and a ca-
pacitor in series, which terminates the output of the
error amplifier to the ground.
The task here is to properly choose the compensation
network for a nicely shaped loop-gain Bode plot. The
following design procedures are recommended to accom-
plish the goal:
(1) Calculate the corner frequency of the output filter:
(2) Calculate the ESR zero frequency of the output filter
capacitor:
(3) Check that the ESR zero frequency is not too high.
If this condition is not met, the compensation structure
may not provide loop stability. The solution is to add
some electrolytic capacitors to the output capacitor bank
to correct the output filter corner frequency and the ESR
zero frequency. In some cases, the filter inductance may
also need to be adjusted to shift the filter corner fre-
quency. It is not recommended to use only high frequency
multi-layer ceramic capacitors for output filter.
(4) Choose the loop gain cross over frequency (0 dB fre-
quency). It is recommended that the crossover frequency
is always less than one fifth of the switching frequency :
If the transient specification is not stringent, it is better
to choose a crossover frequency that is less than one
tenth of the switching frequency for good noise immu-
nity. The resistor in the compensation network can then
be calculated as:
when
Fig. 4. SC2608B small signal model.
VIN
C
G_PWM
RcR
E/A
VBG
0.8V
Ro
LR1
Ci R2Co
() ()
++
++
+
=
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c
o
o
oc
oc
c
o
bg
inpwmm
R
R
LCs
R
L
CRs
CsR
sH
V
V
VGGsT
11
1
2
()
i
csC
sC
R
sH +
+
=
1
11
o
oLC
F
π
2
1
=
oc
esr CR
F
π
21
=
5
SW
esr F
F<
SWOVERX FF = 5
1
_
=
bg
o
esr
OVERX
o
esr
minpwm V
V
F
F
F
F
GVG
R_
2
1
FoFesr
<Fsw
5
<
VA
Gm007.0
=
The total control loop-gain can then be derived as
follows:
where the ramp amplitude is fixed at 1 volts.
ramp
pwm V
G1
=
Compensation Network DesignCompensation Network Design
Compensation Network DesignCompensation Network Design
Compensation Network Design
A note to the user is needed: The device cannot restart
until both COMP and SENSE are low, to prevent start up
into a charged output. In the event of an overcurrent
condition, the output is quickly discharged by the load,
therefore bringing SENSE below the 300mV threshold. If
the COMP pin is pulled low by an external device (such as
an open-drain logic gate used for system shutdown), and
SENSE is high(above 300mV) while COMP is low, then the
SC2608B turns on the low side FET to discharge the output
before changing to shutdown or soft-start mode. The low
side FET turns off when SENSE drops below 300mV and
the converter remains in the tri-state condition until COMP
is released. Although this shutdown technique can be used
successfully on the SC2608B, the system designer using
COMP for external shutdown will need to consider the load
on the low side FET when discharging the output capacitor
bank. For large capacitor bank, this peak current can be
quite large as it is limited only by the RDS(ON) of the low side
FET. Fortunately the duration of this event is quite short,
and has been shown in the lab to have no detrimental effect
on the performance of the external FETs.
Disabling the output by pulling down COMP/SS pin is only
recommended when the output capacitor bank is not too
large.
The PWM gain is inversion of the ramp amplitude, and
this gain is given by:
8
© 2007 Semtech Corp. www.semtech.com
POWER MANAGEMENT
SC2608B
(6) The final step is to generate the Bode plot by using
the simulation model in Fig. 4 or using the equations pro-
vided here with Mathcad. The phase margin can then be
checked using the Bode plot.
Applications Information (Cont.)
(5) The compensation capacitor is determined by choos-
ing the compensator zero to be about one fifth of the
output filter corner frequency:
SC2608B soft start time is determined by the
compensation capacitor. Capacitance can be adjusted
to satisfy the soft start requirement.
An example is given below to demonstrate the proce-
dure introduced above.
set to
for suitable soft start time
Fig. 5. Bode plot of the loop
10 100 1.1031.1041.1051.106
50
0
50
100 Loop Gain Mag (dB)
mag i()
Fi
10 100 1.1031.1041.1051.106
180
135
90
45
0Loop Gain Phase (Degree)
phase i()
Fi
set
5o
zero F
F=
zero
FR
C
=
π
21
Vin=12V
Vo=2.5V
Fsw=250KHz
Io=15A
Ci=1nF
Co=4400uF
Rc=0.009
Vramp=1V
Gm=0.007A/V
Vbg=0.8V
C=327.95nF
Rc=1.33KRc=1.5K
C=100nFset to
L=2.2uH
9
© 2007 Semtech Corp. www.semtech.com
POWER MANAGEMENT
SC2608B
Application Information
Bill of MaterialsBill of Materials
Bill of MaterialsBill of Materials
Bill of Materials
metIytitnauQecnerefeRtraPredneV
111CV61/Fu7.4oegaY
22 3C,2CV61/Fu0051JFcinosanaP
314CV05/Fp001oegaY
42 31C,5CV61/Fu1oegaY
516CV52/F
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412 5R,4R0R1oegaY
5111UB8062CSHCETMES
T T
T T
T
ypical Application Schematicypical Application Schematic
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ypical Application Schematic
10
© 2007 Semtech Corp. www.semtech.com
POWER MANAGEMENT
SC2608B
Application Information
T T
T T
T
ypical DDR VDDQ Application Schematicypical DDR VDDQ Application Schematic
ypical DDR VDDQ Application Schematicypical DDR VDDQ Application Schematic
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Bill of MaterialsBill of Materials
Bill of MaterialsBill of Materials
Bill of Materials
metIytitnauQecnerefeRtraPredneV
14 31C,21C,11C,1CV3.6/Fu7.4oegaY
23 4C,3C,2CV3.6/Fu0051JFcinosanaP
315CV05/Fp001oegaY
42 51C,6
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517CV52/Fn86oegaY
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912D8414N1dlihcriaF
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3114R%5,2R2oegaY
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7111UB8062
CSHCETMES
BST 1
DH 2
GND 3
DL 4
VCC
5SENSE
6COMP/SS
7Phase
8U1
SC2608B
C3
1500uF/16V
C2
1500uF/16V
C1
4.7uF/16V
C11
4.7uF/6.3V
C12
4.7uF/6.3V
C13
4.7uF/6.3V
C8
1800uF/6.3V
C9
1800uF/6.3V
Q1
IPB09N03LA
Q2
IPB09N03LA
L1
1.2uH/40A
C6
1uF/16V R4
2R2
C14
1n
D2
1N4148
+12V
D1
BAT54H C15
1uF/16V
5VDual
5VDual
R3
1.27k
R5
1k
Sense Sense
C7 68nF
C5
100pF
R2
1k
1.8VOUT/24A
C4
1500uF/16V
C10
1800uF/6.3V
11
© 2007 Semtech Corp. www.semtech.com
POWER MANAGEMENT
SC2608B
SEE DETAIL DETAIL A
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0.17
1.25
0.10
.041
.010
.069
.065
.010 1.35
(1.04)
0.72
-
1.04
0.25
-
-
-1.75
1.65
0.25
0.25
-
.010 .020 0.50
-
c
L
(L1) 01
0.25
GAGE
PLANE
h
h
3. DIM ENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
-B-
CO NTRO LLING DIM ENSIONS ARE IN M ILLIMETERS (ANGLES IN DEG REES).
DAT U M S AND TO BE DET ERM INED A T DAT U M PL ANE
NOTES:
1.
2. -A- -H-
SIDE VIEW
A
B
C
D
e
H
PLANE
L1
N
01
bbb
aaa
ccc
A
b
A2
A1
D
E
E1
L
h
e
c
DIM MIN
MILLIMETERS
NOM
DIMENSIONS
INCHES
MIN MAX MAXNOM
E
Outline Drawing - SO-8
Land Pattern - SO-8
(.205) (5.20)
ZG
Y
P
(C) 3.00
.118 1.27.050 0.60.024 2.20.087 7.40.291
X
INCHES
DIMENSIONS
Z
P
Y
X
DIM
C
G
MILLIMETERS
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CO NSULT YO UR MANU FACTURIN G GRO UP TO ENSURE YOUR
CO MPANY'S M ANUFACTURING G UIDELINES ARE M ET.
NOTES:
1.
REFERENCE IPC-SM-782A, RLP NO. 300A.
2.
12
© 2007 Semtech Corp. www.semtech.com
POWER MANAGEMENT
SC2608B
Outline Drawing - Power SOIC-8L (EDP)
Land Pattern - Power SOIC-8L (EDP)
Y
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
NOTES:
1.
REFERENCE IPC-SM-782A, RLP NO. 300A.
2.
INCHES
DIMENSIONS
Z
P
Y
X
DIM
C
G
MILLIMETERS
E.201 5.10
X
FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR
FUNCTIONAL PERFORMANCE OF THE DEVICE.
SHALL BE CONNECTED TO A SYSTEM GROUND PLANE.
THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD
3.
F
E
D
SOLDER MAS K
THERMAL VIA
?0.36mm
D.098 2.49
F.096 2.44
Z
(C) G(.205) (5.20)
P
3.00.118 1.27.050 0.60.024 2.20.087 7.40.291
E
SEE DETAIL DETAIL
A
A
.050 BSC
.236 BSC
8
.010
.150
.189 .154
.193
.012 -
8
0.25
1.27 BSC
6.00 BSC
3.90
4.90
-
.157
.197 3.80
4.80
.020 0.31
4.00
5.00
0.51
bxN
2X N/2 TIPS
SEATING
aaa C
E/2
2X
12
N
A
D
A1
E1
bbb CA-B D
ccc Ce/2
A2
(.041)
.004
.008
-
.028
-
-
-
-
0
.016
.007
.049
.000
.053
80
0.20
0.10
-8
0.40
0.17
1.25
0.00
.041
.010
.069
.065
.005 1.35
(1.05)
0.72
-
1.04
0.25
-
-
-1.75
1.65
0.13
0.25
-
.010 .020 0.50
-
c
L
(L1) 01
0.25
GAGE
PLANE
h
3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
-B-
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
DATUMS AND TO BE DETERMINED AT DATUM PLANE
NOTES:
1.
2. -A- -H-
SIDE VIEW
A
B
C
D
e
H
PLANE
F
F
EXPOSED PAD
L1
N
01
bbb
aaa
ccc
A
b
A2
A1
D
E
E1
L
h
e
c
DIM MIN
MILLIMETERS
NOM
DIMENSIONS
INCHES
MIN MAX MAXNOM
F.086 .090 .094 2.19 2.29 2.39
h
4. REFERENCE JEDEC STD MS-012, VARIATION BA.
Contact Information Semtech Corporation
Power Management Products Division
200 Flynn R oad, Camarillo, CA 93012
Phone: (805)498-2 11 1 F AX (805)498-3804