5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com
2REV. 4/01 Products shown covered by patents issued and/or pending. Specifications subject to change without notice. Dimensions shown: inch/(mm).
Ball Grid Array
(BGA) Adapters
Adapter Features
• Soldering BGA to Adapter subjects
BGA to less thermal stress than
soldering BGA directly to a PCB due
to Adapter’s lower mass.
• Uses same footprint as BGA device.
• Custom Adapters available for heat
sink attachments.
Specifications
Terminals:
Brass; Copper Alloy (C36000),
ASTM-B-16
Plating:
G – Gold over Nickel
Body Material:
F – FR-4 Glass Epoxy, U.L. Rated
94V-0
Terminals
1.27mm and
1.5mm Pitch 1.0mm Pitch
0.80mm Pitch 0.75mm Pitch
Standard Adapter (A)
• Mates with Standard Socket (S)
• Adapter size equals BGA device body + .079 in. (2.0mm)
Extraction Slot Adapter (AX)
• Slots allow easy device/Adapter assembly removal from socket with
Advanced® Extraction Tool without damaging valuable PCB
• Mates with Extraction Socket (SB) or Guide Post Socket (SG)
• Adapter size equals BGA device body + .157 in. (4.0mm)
Advanced® BGA Adapter Extraction Tools
How To Order – BGA Adapters
1 F G A XXXX - 638 G
Footprint Dash#
If Applicable* Terminal Plating
G - Gold
Terminal Type
See options at left
Body Type
F - FR-4
Model Type
A = Standard Adapter
AX = Extraction Slot Adapter [1.5, 1.27, & 1.0mm Pitch only]
Pitch
B = .059/(1.5mm)
G = .050/(1.27mm)
H = .039/(1.0mm)
J = .0315/(0.80mm)
K = .0295/(0.75mm)
Number of Positions
*See BGA Footprint Booklet
or web site
.018/(0.46)
Dia.
.182
(4.62)
Type -638
.011/(0.28)
Dia.
.159
(4.04)
Type -715
DEVICE PACKAGE SIZE
< 1.024 (26mm) > 1.024 (26mm)
Tool P/N 5566 5504
Blade Width .373 in. .675 in.
Blade Width
BGA Body + .079/(2.0)
BGA Device
.039/(1.0)
BGA Device
BGA Body + .157/(4.0)
.079/(2.0)
P/N 5504
P/N 5566
.011/(0.28)
Dia.
.146
(3.71)
Type -700
Now A vailable In
0.75mm Pitch
.008/(0.20)
Dia.
.142
(3.61)
Type -757
