Advanced Power N-CHANNEL ENHANCEMENT MODE
Electronics Corp. POWER MOSFET
▼ Simple Drive Requirement BVDSS 60V
▼ Lower Gate Charge RDS(ON) 72mΩ
▼ Fast Switching Characteristic ID9.3A
▼ RoHS Compliant & Halogen-Free
Description
Absolute Maximum Ratings
Symbol Units
VDS V
VGS V
ID@TC=25℃A
ID@TC=100℃A
IDM A
PD@TC=25℃W
PD@TA=25℃W
TSTG ℃
TJ℃
Symbol Value Units
Rthj-c Maximum Thermal Resistance, Junction-case 10 ℃/W
Rthj-a 62.5 ℃/W
Data and specifications subject to change without notice
Total Power Dissipation 2
200909291
1
Maximum Thermal Resistance, Junction-ambient (PCB mount)3
AP9871GH-HF
Halogen-Free Product
-55 to 150
Parameter Rating
Drain-Source Voltage 60
Gate-Source Voltage +20
Continuous Drain Current, VGS @ 10V 9.3
Continuous Drain Current, VGS @ 10V 6
Pulsed Drain Current140
Thermal Data
Parameter
Storage Temperature Range
Total Power Dissipation 12.5
-55 to 150
Operating Junction Temperature Range
G
D
S
A
dvanced Power MOSFETs from APEC provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and cost-effectiveness.
The TO-252 package is widely preferred for commercial-industrial
surface mount applications and suited for low voltage applications
such as DC/DC converters.
GDSTO-252(H)
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol Parameter Test Conditions Min. Typ. Max. Units
BVDSS Drain-Source Breakdown Voltage VGS=0V, ID=250uA 60 - - V
RDS(ON) Static Drain-Source On-Resistance2VGS=10V, ID=9A - - 72 mΩ
VGS=4.5V, ID=6A - - 100 mΩ
VGS(th) Gate Threshold Voltage VDS=VGS, ID=250uA 1 - 3 V
gfs Forward Transconductance VDS=10V, ID=9A - 11 - S
IDSS Drain-Source Leakage Current VDS=60V, VGS=0V - - 25 uA
IGSS Gate-Source Leakage VGS= +20V, VDS=0V - - +100 nA
QgTotal Gate Charge2ID=9A - 6.4 10.2 nC
Qgs Gate-Source Charge VDS=48V - 2 - nC
Qgd Gate-Drain ("Miller") Charge VGS=4.5V - 4 - nC
td(on) Turn-on Delay Time2VDS=30V - 6 - ns
trRise Time ID=9A - 16 - ns
td(off) Turn-off Delay Time RG=3.3Ω,VGS=10V - 15 - ns
tfFall Time RD=3.3Ω-3-
ns
Ciss Input Capacitance VGS=0V - 460 740 pF
Coss Output Capacitance VDS=25V - 40 - pF
Crss Reverse Transfer Capacitance f=1.0MHz - 35 - pF
RgGate Resistance f=1.0MHz - 1.7 - Ω
Source-Drain Diode
Symbol Parameter Test Conditions Min. Typ. Max. Units
VSD Forward On Voltage2IS=9A, VGS=0V - - 1.3 V
trr Reverse Recovery Time2IS=9A, VGS=0V - 19 - ns
Qrr Reverse Recovery Charge dI/dt=100A/µs - 16 - nC
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse test
3.Surface mounted on 1 in2 copper pad of FR4 board
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
2
AP9871GH-HF
AP9871GH-HF
Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics
Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance
v.s. Junction Temperature
Fig 5. Forward Characteristic of Fig 6. Gate Threshold Voltage v.s.
Reverse Diode Junction Temperature
3
0
5
10
15
20
25
02468
VDS , Drain-to-Source Voltage (V)
ID , Drain Current (A)
TC=25oC10V
7.0V
6.0V
5.0V
VGS =4.0V
0
4
8
12
16
20
0123456
VDS , Drain-to-Source Voltage (V)
ID , Drain Current (A)
TC=150oC10V
7.0V
6.0V
5.0V
VGS =4.0V
0.4
0.8
1.2
1.6
2.0
2.4
-50 0 50 100 150
Tj , Junction Temperature ( oC)
Normalized RDS(ON)
ID=9A
VG=10V
0
2
4
6
8
10
0 0.2 0.4 0.6 0.8 1 1.2 1.4
VSD , Source-to-Drain Voltage (V)
IS(A)
Tj=25oCTj=150oC
0.0
0.4
0.8
1.2
1.6
-50 0 50 100 150
Tj , Junction Temperature ( oC)
Normalized VGS(th) (V)
45
55
65
75
85
95
105
246810
VGS ,Gate-to-Source Voltage (V)
RDS(ON) (m
Ω
)
I
D=6A
TA=25oC
AP9871GH-HF
Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics
Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance
Fig 11. Switching Time Waveform Fig 12. Gate Charge Waveform
4
0
2
4
6
8
10
024681012
QG , Total Gate Charge (nC)
VGS , Gate to Sourc e Voltage ( V)
VDS =30V
VDS =36V
V DS =48V
ID=9A
Q
VG
4.5V
QGS QGD
QG
Charge
0
200
400
600
800
1 5 9 1317212529
VDS , Drain-to-Source Voltage (V)
C (pF)
f
=1.0MH
z
Ciss
Coxx
Crss
0.01
0.1
1
0.00001 0.0001 0.001 0.01 0.1 1
t , Pulse Width (s)
Normalized Th e rmal Re sponse (Rthjc)
PDM
Duty factor = t/T
Peak Tj = PDM x Rthjc + TC
t
T
0.02
0.01
0.05
0.1
0.2
Duty factor=0.5
Single Pulse
0.1
1
10
100
0.1 1 10 100
VDS , Drain-to-Source Voltage (V)
ID (A)
Tc=25oC
S
in
g
le Puls
e
10us
100us
1ms
10ms
100ms
DC
td(on) trtd(off) tf
VDS
VGS
10%
90%
Operation in this
area limited by
RDS(ON)
