HLMP-LD17 4mm Precision Optical Performance Red Oval LED Lamps Data Sheet Description Features This Precision Optical Performance Oval LED is specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern (50 x 100) and high luminous intensity ensure that this device is excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. This lamp has very smooth, matched radiation patterns ensuring consistent color mixing in full color applications, message uniformity across the viewing angle of the sign. High efficiency LED material is used in this lamp: Aluminum Indium Gallium Phosphide (AlInGaP II) is used. It is made with an advanced optical grade epoxy offering superior high temperature and high moisture resistance in outdoor applications. The package epoxy contains both UV-a and UV-b inhibitors to reduce the effects of long term exposure to direct sunlight. * Well defined spatial radiation pattern * High brightness material * AlInGaP * 630mm Red * Superior resistance to moisture * Wide viewing angle * Major axis: 100 * Minor axis: 50 Applications * Full color signs * Commercial outdoor advertising. Designers can select parallel (where the axis of the leads is parallel to the wide axis of the oval radiation pattern) or perpendicular orientation. Both of the lamps are red diffused-tinted. Package Dimension 21.00 MIN. (0.827) 9.80 0.18 (0.386 0.007) B 3.70 0.20 (0.146 0.008) 6.30 0.20 (0.248 0.020) 1.00 MIN. (0.039) 1.25 0.20 (0.049 0.008) CATHODE LEAD 2.54 0.30 (0.100 0.012) No tes: 1. Dimensions in millimeters (inches). 2. Tolerance 0.1 mm unless otherwise noted. 0.80 M AX. EPOXY MENISCUS (0.016) +0.10 0.45 0.04 +0.004 (0.018 0.002) +0.10 0.40 0 +0.004 (0.016 0.000) Device Selection Guide Part Number Color and Dominant Wavelength ld (nm) Typical HLMP-LD17-MNTxx Luminous Intensity Iv (mcd) at 20 mA Minimum Maximum Tinting Type Red 630 520 880 Red HLMP-LD17-MQTxx Red 630 520 1500 Red HLMP-LD17-NP0xx Red 630 680 1150 Red HLMP-LD17-NPTxx Red 630 680 1150 Red Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package 2. The tolerance for intensity limit is 15% 3. The optical axis is closely aligned with the package mechanical axis 4. The dominant wavelength, ld, is derived from the Chromaticity Diagram and represents the color of the lamp. Part Numbering System H L M P - L x 17 - X X X XX Mechanical Option 00: Bulk DD: Ammo Pack Color Bin Options 0: No color bin limitation T: Red Color with max VF of 2.6V Maximum Intensity Bin Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide Color Options D: 630 nm Red Package Options L: 4mm 50 x 100 Absolute Maximum Rating (TA = 25C) Parameter Value Unit DC Forward Current [1] 50 mA Peak Forward Current [2] 100 mA Average Forward Current 30 MA Power Dissipation 120 mW Reverse Voltage (IR = 100 mA) 5 V LED Junction Temperature 130 C Operating Temperature Range -40 to +100 C Storage Temperature Range -40 to +120 C Notes: 1. Derate linearly as shown in Figure 3 for temperature above 50C. 2. Duty Factor 30%, frequency 1KHz Electrical/Optical Characteristics (TA = 25C ) Parameter Symbol Typical Viewing Angle Major Minor 2q1/2 Forward Voltage VF Reverse Voltage VR Peak Wavelength Red (ld = 630nm) Min. Typ. Max. 100 50 2.0 Units Test Condition Degree 2.4[1] V IF = 20 mA 20 V IR = 100 A lpeak 639 nm Peak of wavelength of spectral distribution at F = 20 mA Spectral Half width Red (ld = 630nm) 1/2 17 nm Wavelength width at spectral distribution power point at IF = 20 mA Capacitance C 40 pF VF = 0, F = 1 MHz Thermal Resistance RqJ-PIN 240 C/W LED Junction to cathode lead Luminous Efficacy Red (ld = 630nm) v 155 5 Lm/W Emitted luminous power/emitted radiant power Notes: 1. For option -xxTxx, maximum forward voltage, VF is 2.6V. Refer to Vf bin table. 2. 2q1/2 is the off-axis angle where the luminous intensity is 1/2 the on-axis intensity 3. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = Iv/ v where Iv is the luminous intensity in candelas and v is the luminous efficacy in lumens/watt. RELATIVE INTENSITY 1.0 0.5 0 500 550 600 650 700 WAVELENGTH nm Figure 1. Relative intensity vs. wavelength 60 30 20 10 0 0 0.5 1.0 1.5 2.0 2.5 50 40 30 20 10 0 3.0 2.5 RELATIVE LUMINOUS INTENSI TY (NORM ALIZED AT 20 m A) 40 IF FORWARD CURRENT mA IF FORWARD CURRENT mA 50 0 20 Figure 2. AllnGaP forward current vs. forward voltage 80 1.0 1.0 0.8 0.8 0.6 0.4 0.2 0 -90 -75 -60 -45 -30 -15 100 1.0 0.5 0 120 0 10 0 15 30 45 60 Figure 5a. Representative spatial radiation pattern - horizontal. 75 90 20 30 40 50 IF FORWARD CURRENT mA Figure 3. AllnGaP maximum forward current vs. ambient temperature. NORM ALIZED INTENSI TY NORM ALIZED INTENSI TY 60 1.5 TA AMBIENT TEMPERATURE C VF FORWARD VOLTAGE V 40 2.0 Figure 4. AllnGap relative luminous intensity vs. forward current. 0.6 0.4 0.2 0 -90 -75 -60 -45 -30 -15 0 15 30 45 Figure 5b. Representative spatial radiation pattern - vertical. 60 75 90 Intensity Bin Limit Table (mcd at 20 mA) Bin Name Min. Max. L 400 520 M 520 680 N 680 880 P 880 1150 Q 1150 1500 Tolerance for each bin limit is 15% Note: 1. Bin categories are established for classification of products. Products may not be available in all bin categories. 2. Vf bin table only available for those number with option -xxTxx. Precautions: Lead Forming: * The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. * If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. * It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Condition: * Care must be taken during PCB assembly and soldering process to prevent damage to LED component. * Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. * If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. * Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25C before handling. * Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. * Recommended PC board plated through holes * The closest LED is allowed to solder on board is 1.59mm below the body (encapsulant epoxy) for those parts without standoff. * Recommended soldering condition: Wave Soldering Manual Solder Dipping Pre-heat temperature 105 C Max. - Preheat time 30 sec Max - Peak temperature 250 C Max. 260 C Max. Dwell time 3 sec Max. 5 sec Max LED component ead size Diagonal Plated through hole diameter 0.457 x 0.457mm (0.018 x 0.018inch) 0.646 mm (0.025 inch) 0.976 to 1.078 mm (0.038 to 0.042 inch) 0.508 x 0.508mm (0.020 x 0.020inch) 0.718 mm (0.028 inch) 1.049 to 1.150mm (0.041 to 0.045 inch) Note: Refer to application note AN1027 for more information on soldering LED components. Recommended Wave Soldering Profile LAMINAR WAVE TURBULENT WAVE HOT AIR KNIFE 250 200 TEMPERATURE - uC BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD 150 FLUXING CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150 C (100 C PCB) SOLDER WAVE TEMPERATURE = 245 C AIR KNIFE AIR TEMPERATURE = 390 C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA 100 50 30 0 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 10 20 30 40 50 TIME - SECONDS 60 70 80 90 100 For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright (c) 2007 Avago Technologies Limited. All rights reserved. 5989-4175EN - March 21, 2007