HLMP-LD17
4mm Precision Optical Performance Red Oval LED Lamps
Data Sheet
Description
This Precision Optical Performance Oval LED is speci-
cally designed for full color/video and passenger infor-
mation signs. The oval shaped radiation pattern (50° x
100°) and high luminous intensity ensure that this device
is excellent for wide eld of view outdoor applications
where a wide viewing angle and readability in sunlight
are essential. This lamp has very smooth, matched
radiation patterns ensuring consistent color mixing in
full color applications, message uniformity across the
viewing angle of the sign. High eciency LED material is
used in this lamp: Aluminum Indium Gallium Phosphide
(AlInGaP II) is used. It is made with an advanced optical
grade epoxy oering superior high temperature and high
moisture resistance in outdoor applications. The package
epoxy contains both UV-a and UV-b inhibitors to reduce
the eects of long term exposure to direct sunlight.
Designers can select parallel (where the axis of the leads
is parallel to the wide axis of the oval radiation pattern)
or perpendicular orientation. Both of the lamps are red
diused-tinted.
Features
• Well dened spatial radiation pattern
• High brightness material
• AlInGaP
• 630mm Red
• Superior resistance to moisture
• Wide viewing angle
• Major axis: 100°
• Minor axis: 50°
Applications
• Full color signs
• Commercial outdoor advertising.
Package Dimension
3.70 ± 0.20
(0.146 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
0.80
(0.016) MAX. EPOXY MENISCUS
9.80 ± 0.18
(0.386 ± 0.007)
CATHODE
LEAD
B
˘
6.30 ± 0.20
(0.248 ± 0.020)
2.54 ± 0.30
(0.100 ± 0.012)
21.00
(0.827) MIN.
1.00
(0.039) MIN.
0.40 +0.10
Ð0
(0.016 +0.004
Ð0.000)
0.45 +0.10
Ð0.04
(0.018 +0.004
Ð0.002)
No tes:
1. Dimensions in millimeters (inches).
2. Tolerance ± 0.1 mm unless otherwise noted.
2
Part Number
Color and Dominant
Wavelength ld (nm)
Typical
Luminous Intensity Iv (mcd) at
20 mA
Tinting TypeMinimum Maximum
HLMP-LD17-MNTxx Red 630 520 880 Red
HLMP-LD17-MQTxx Red 630 520 1500 Red
HLMP-LD17-NP0xx Red 630 680 1150 Red
HLMP-LD17-NPTxx Red 630 680 1150 Red
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package
2. The tolerance for intensity limit is ±15%
3. The optical axis is closely aligned with the package mechanical axis
4. The dominant wavelength, ld, is derived from the Chromaticity Diagram and represents the color of the lamp.
Device Selection Guide
Part Numbering System
Mechanical Option
00: Bulk
DD: Ammo Pack
H L M P
Color Bin Options
0: No color bin limitation
T: Red Color with max V
F of 2.6V
Maximum Intensity Bin
Refer to Device Selection Guide
Color Options
D: 630 nm Red
Package Options
L: 4mm 50˚ x 100˚
-- 17 X X X XXL x
Minimum Intensity Bin
Refer to Device Selection Guide
3
Absolute Maximum Rating (TA = 25°C)
Parameter Value Unit
DC Forward Current [1] 50 mA
Peak Forward Current [2] 100 mA
Average Forward Current 30 MA
Power Dissipation 120 mW
Reverse Voltage (IR = 100 mA) 5 V
LED Junction Temperature 130 °C
Operating Temperature Range -40 to +100 °C
Storage Temperature Range -40 to +120 °C
Notes:
1. Derate linearly as shown in Figure 3 for temperature above 50°C.
2. Duty Factor 30%, frequency 1KHz
Electrical/Optical Characteristics (TA = 25°C )
Parameter Symbol Min. Typ. Max. Units Test Condition
Typical Viewing Angle
Major
Minor 2q1/2
100
50 Degree
Forward Voltage VF2.0 2.4[1] V IF = 20 mA
Reverse Voltage VR5 20 V IR = 100 µA
Peak Wavelength
Red (ld = 630nm) lpeak 639 nm
Peak of wavelength of spectral distribution at
ΙF = 20 mA
Spectral Half width
Red (ld = 630nm) Δl1/2 17 nm
Wavelength width at spectral distribution power point
at IF = 20 mA
Capacitance C 40 pF VF = 0, F = 1 MHz
Thermal Resistance RqJ-PIN 240 °C/W LED Junction to cathode lead
Luminous Ecacy
Red (ld = 630nm) ηv155
Lm/W
Emitted luminous power/emitted radiant power
Notes:
1. For option –xxTxx, maximum forward voltage, VF is 2.6V. Refer to Vf bin table.
2. 2q1/2 is the o-axis angle where the luminous intensity is ½ the on-axis intensity
3. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = Iv/ ηv where Iv is the luminous intensity in candelas and ηv is
the luminous ecacy in lumens/watt.
4
Figure 1. Relative intensity vs. wavelength
Figure 2. AllnGaP forward current vs. forward
voltage
Figure 3. AllnGaP maximum forward current
vs. ambient temperature.
Figure 4. AllnGap relative luminous intensity vs.
forward current.
Figure 5a. Representative spatial radiation pattern - horizontal. Figure 5b. Representative spatial radiation pattern - vertical.
NORMALIZED INTENSI TY
1.0
0
0.8
0.6
0.2
-90
0.4
-60 -30 15 45 90-15 30-75 75-45 600
NORMALIZED INTENSI TY
1.0
0
0.8
0.6
0.2
-90
0.4
-60 -30 15 45 90-15 30-75 75-45 600
WAVELENGTH Ð nm
RELATIVE INTENSITY
1.0
0.5
0600 700500 650550
0
40
20
IF Ð FORWARD CURRENT Ð mA
VF Ð FORWARD VOLTAGE Ð V
0 3.01.5 2.0 2.5
10
30
50
1.00.5
IF Ð FORWARD CURRENT Ð mA
0
0
TA Ð AMBIENT TEMPERATURE Ð C
40 80
50
40
30
20
10
20 60 100
60
120
RELATIVE LUMINOUS INTENSI TY
(NORM ALIZED AT 20 m A)
0
0
IF Ð FORWARD CURRENT Ð mA
20 40
2.0
1.0
50
0.5
1.5
2.5
3010
5
Intensity Bin Limit Table (mcd at 20 mA)
Bin Name Min. Max.
L 400 520
M 520 680
N 680 880
P 880 1150
Q 1150 1500
Tolerance for each bin limit is ±15%
Note:
1. Bin categories are established for classication of products. Products may not be available in all bin categories.
2. Vf bin table only available for those number with option –xxTxx.
6
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
• It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Condition:
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• The closest LED is allowed to solder on board is
1.59mm below the body (encapsulant epoxy) for those
parts without stando.
• Recommended soldering condition:
Wave Soldering Manual Solder Dipping
Pre-heat temperature 105 °C Max. -
Preheat time 30 sec Max -
Peak temperature 250 °C Max. 260 °C Max.
Dwell time 3 sec Max. 5 sec Max
• Wave soldering parameter must be set and maintain
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering prole to ensure
the soldering prole used is always conforming to
recommended soldering condition.
• If necessary, use xture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25°C before handling.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
• Recommended PC board plated through holes
LED component
ead size Diagonal
Plated through hole
diameter
0.457 x 0.457mm
(0.018 x 0.018inch)
0.646 mm
(0.025 inch)
0.976 to 1.078 mm
(0.038 to 0.042 inch)
0.508 x 0.508mm
(0.020 x 0.020inch)
0.718 mm
(0.028 inch)
1.049 to 1.150mm
(0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more information on
soldering LED components.
Recommended Wave Soldering Prole
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Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved.
5989-4175EN - March 21, 2007