○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays
1/12 TSZ02201-0H1H0B100180-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 28.JUL.2012 Rev.002
www.rohm.com
TSZ22111・14・001
Datashee
t
DC Brushless Fan Motor Drivers
Multifunction Single-phase Full-wave
Fan Motor Driver
BD6722FS
●General description
BD6722FS is a half pre-driver that controls the source
side motor drive part composed of the power transistors.
Moreover, it corresponds to 800mA motor, because the
driving current and the composition parts are optimized.
●Features
Half pre-driver including power NDMOS FET
Speed c ontrollable by DC / direct PWM input
PWM soft switching
Quick start
Current limit
Lock protection and automatic restart
Rotation speed pulse signal (FG) output
Lock alarm signal (AL) output
●Package W (Typ.) x D (Typ.) x H (M ax.)
SSOP-A16 6.60mm x 6.20mm x 1.71mm
●Application
Fan motors for general consumer equipme nt of desktop PC , and Server, etc.
●Absolute maximum ratings
Parameter Symbol Limit Unit
Supply voltage Vcc 20 V
Power dissipation Pd 812.5 *1 mW
Operating temperature range Topr –40 to +100 °C
Storage temperature range Tstg –55 to +150 °C
High side output voltage Voh 34 V
Low side output voltage Vol 34 V
Low side output current Iol 1.5 *2 A
Rotation speed pulse signal (FG) output voltage Vfg 20 V
Rotation speed pulse signal (FG) output current Ifg 10 mA
Lock alarm signal (AL) output voltage Val 20 V
Lock alarm signal (AL) output current Ial 10 mA
Reference voltage (REF) output current Iref 8 mA
Input voltage (TH) Vin 15 V
Junction temperature Tj 150 °C
*1 Reduce by 6.5mW/°C over Ta=25°C. (On 70.0mm×70.0mm×1.6mm glass epoxy board)
*2 This value is not to exceed Pd.
●Recommended operating conditions
Parameter Symbol Limit Unit
Operating supply voltage range Vcc 4.5 to 17.0 V
Operating input voltage range (H+, H–, MIN)
(more than Vcc=9V) 0 to 7 V
Operating input voltage range (H+, H–, MIN)
(less than Vcc=9V)
Vin 0 to Vcc–2 V
SSOP-A16
2/12
Datasheet
Datasheet
BD6722FS
TSZ02201-0H1H0B100180-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 28.JUL.2012 Rev.002
www.rohm.com
TSZ22111・15・001
●Pin configuration
●Pin description
P/No. T/Name Function
1 GND Ground terminal (signal ground)
2 OSC
Oscillating capacitor connecting
terminal
3 MIN Minimum output duty setting terminal
4 TH Output duty controllable input terminal
5 Vcc Power supply terminal
6 A1H High side output terminal 1
7 A1L Low side output terminal 1
8 RNF
Output current detecting resistor
connecting terminal (motor ground)
9 A2L Low side output terminal 2
10 A2H High side output terminal 2
11 CS Output current detection terminal
12 H+ Hall + input t erminal
13 H– Hall – input te r m inal
14 REF Reference voltage output terminal
15 FG Speed pulse signal output terminal
16 AL Lock alarm signal output terminal
●Block diagram
●I/O truth table
Hall input Driver output
H+ H– A1H A1L A2H A2L FG
H L Hi-Z L L Hi-Z Hi-Z
L H L Hi-Z Hi-Z L L
H; High, L; Low, Hi-Z; High impedance
FG output is open-drain type.
Motor state AL
Rotating L
Locking Hi-Z
L; Low, Hi-Z; High impedance
AL output is open-drain type.
Fig.2 Block diagram
REF
H+
MIN
A1L
TH
OSC
GND
A2H
CS
FG
Vcc
AL
H–
RNF
1
2
3
4
5
6
7
15
A2L
A1H
16
8
14
13
12
11
9
10
Fig.1 Pin configuration
(TOP VIEW)
Vcc
HALL
AMP
Vcl
SIGNAL
OUTPUT
HALL
COMP
CONTROL
LOGIC
PRE-
DRIVER
REF
OSC
QUICK
START LOCK
PROTECT
TSD PWM SOFT
SWITCHING
CURRENT
LIMIT COMP
SIGNAL
OUTPUT
PWM
COMP
PWM
COMP
H–
H+
MIN
TH
OSC
AL
REF
A1L
CS
RNF
GND
A2H
A2L
FG
10
9
14
13
12
11
16
15
1
2
3
4
5
6
7
8
Vcc
A1H
3/12
Datasheet
Datasheet
BD6722FS
TSZ02201-0H1H0B100180-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 28.JUL.2012 Rev.002
www.rohm.com
TSZ22111・15・001
●Electrical charact eristics(Unless ot herwise specified Ta=25°C, Vcc=12V)
Limit
Parameter Symbol Min. Typ. Max. Unit Conditions Ref.
data
Circuit current Icc 5 8 11 mA Fig.3
Hall input hysteresis voltage Vhys ±5 ±10 ±15 mV Fig.4
High side output current Ioh 5 10 15 mA Voh=12V Fig.5
High side output leak current Iohl - - 10 µA Voh=34V Fig.6
Low side output low voltage Voll - 0.30 0.45 V Iol=600mA Fig.7, 8
Lock detection ON t ime Ton 018 0.30 0.42 s Fig.9
Lock detection OFF time Toff 3.6 6. 0 8.4 s Fig.10
FG output lo w voltage Vfgl - 0.15 0.30 V Ifg=5mA Fig.11, 12
FG output leak current Ifgl - - 10 µA Vfg=17V Fig.13
AL out put low voltage Vall - 0.15 0.30 V Ial=5mA Fig.11, 12
AL out put leak current Iall - - 10 µA Val=17V Fig.13
OSC high voltage Vosch 2.24 2.44 2.64 V Fig.14
OSC low voltage Voscl 0.8 1. 0 1.2 V Fig. 14
OSC charge current Icosc –50 –32 –26 µA Fig.15
OSC discharge current Idosc 26 32 50 µA Fig.15
Output ON duty 1 Poh1 75 80 85 % Vth=Vref x 0.429
Pull up resistance 1kΩ,
OSC=470pF -
Output ON duty 2 Poh2 45 50 55 % Vth=Vref x 0.573
Pull up resistance 1kΩ,
OSC=470pF -
Output ON duty 3 Poh3 15 20 25 % Vth=Vref x 0.717
Pull up resistance 1kΩ,
OSC=470pF -
Reference voltage Vref 2.8 3.0 3.2 V Iref=–2mA Fig.16, 17
Current limit sett ing voltage Vcl 320 350 380 mV Fig.18
TH input bias current Ith - - –0.2 µA Vth=0V Fig.19
MIN input bias current Imin - - –0.2 µA Vmin=0V Fig.20
About a current item, define the inflow current to IC as a positive notation, and the outflow current from IC as a negative notation.
4/12
Datasheet
Datasheet
BD6722FS
TSZ02201-0H1H0B100180-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 28.JUL.2012 Rev.002
www.rohm.com
TSZ22111・15・001
●Typical performance curves(Referen ce data)
2
5
8
11
14
17
0 5 10 15 20
Supply voltage: Vcc[V]
High side output current: Ioh[mA]
Operating range
Fig.5 High side output current
100°C
25°C
–
40°C
0
2
4
6
8
10
0 5 10 15 20
Supply voltage: Vcc[V]
Circuit current: Icc[mA]
Fig.3 Circuit current
Operating range
100°C
25°C
–
40°C
-20
-10
0
10
20
0 5 10 15 20
Supply voltage: Vcc[V]
Hall input hysteresis voltage: Vhys[mV]
Operating range
Fig.4 Hall input hysteresis voltage
100°C
25°C
–
40°C
100°C
25°C
–
40°C
-2
0
2
4
6
8
0 10203040
Supply voltage: Voh[V]
High side output leak current: Iohl[uA]
Operating range
Fig.6 High side output leak current
100°C
25°C
–
40°C
5/12
Datasheet
Datasheet
BD6722FS
TSZ02201-0H1H0B100180-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 28.JUL.2012 Rev.002
www.rohm.com
TSZ22111・15・001
●Typical performance curves(Referen ce data)
0.20
0.25
0.30
0.35
0.40
0 5 10 15 20
Supply voltage: Vcc[V]
Lock detection ON time: Ton[s]
Operating range
Fig.9 Lock detection ON time
100°C
25°C
–
40°C
0.0
0.2
0.4
0.6
0.8
1.0
0.0 0.3 0.6 0.9 1.2 1.5
Output sink current: Io[A]
Low side output low voltage: Vol[V]
Fig.7 Low side out put low voltage (Vcc=12V)
100°C
25°C
–
40°C
0.0
0.2
0.4
0.6
0.8
1.0
0.0 0.3 0.6 0.9 1.2 1.5
Output sink current: Io[A]
Low side output low voltage: Vol[V]
Fig.8 Low side out put low voltage (Ta=25°C)
17
V
12
V
5
V
4.0
5.0
6.0
7.0
8.0
0 5 10 15 20
Supply voltage: Vcc[V]
Lock detection OFF time: Toff[s]
Operating range
Fig.10 Lock detect ion OFF time
100°C
25°C
–
40°C
6/12
Datasheet
Datasheet
BD6722FS
TSZ02201-0H1H0B100180-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 28.JUL.2012 Rev.002
www.rohm.com
TSZ22111・15・001
●Typical performance curves(Referen ce data)
-2
0
2
4
6
8
0 5 10 15 20
Supply voltage: Vcc[V]
FG/AL output leak current: Ifgl/Iall[uA]
Operating range
Fig.13 FG/AL output leak current
100°C
25°C
–
40°C
0.0
0.2
0.4
0.6
0.8
0246810
Output sink current: Ifg/Ial[mA]
FG/AL output low voltage: Vfgl/Vall[V]
Fig.11 FG/AL output low voltage (Vcc=12V)
100°C
25°C
–
40°C
0.0
0.2
0.4
0.6
0.8
0246810
Output sink current: Ifg/Ial[mA]
FG/AL output low voltage: Vfgl/Vall[V]
Fig.12 FG/AL output low voltage (Ta=25°C)
17
V
12
V
5
V
0.5
1.0
1.5
2.0
2.5
3.0
0 5 10 15 20
Supply voltage: Vcc[V]
OSC high/low voltage: Vosch/Voscl [V]
Operating range
Fig.14 OSC high/low voltage
100°C
25°C
–
40°C
100°C
25°C
–
40°C
7/12
Datasheet
Datasheet
BD6722FS
TSZ02201-0H1H0B100180-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 28.JUL.2012 Rev.002
www.rohm.com
TSZ22111・15・001
●Typical performance curves(Referen ce data)
-60
-40
-20
0
20
40
60
0 5 10 15 20
Supply voltage: Vcc[V]
OSC charge/discharge current: Icosc/Idosc [uA]
Operating range
Fig.15 OSC charge/discharge current
100°C
25°C
–
40°C
100°C
25°C
–
40°C
320
335
350
365
380
0 5 10 15 20
Supply voltage: Vcc[V]
Current limit setting voltage: Vcl[mV]
Operating range
Fig.18 Current limit setting voltage
100°C
25°C
–
40°C
2.8
2.9
3.0
3.1
3.2
0 5 10 15 20
Supply voltage: Vcc[V]
Reference voltage: Vref[V]
Operating range
Fig.16 Reference voltage
100°C
25°C
–
40°C
2.8
2.9
3.0
3.1
3.2
02468
Output source current: Iref[mA]
Reference voltage: Vref[V]
Fig.17 Reference volt age current ability (Vcc=12V)
100°C
25°C
–
40°C
8/12
Datasheet
Datasheet
BD6722FS
TSZ02201-0H1H0B100180-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 28.JUL.2012 Rev.002
www.rohm.com
TSZ22111・15・001
●Typical performance curves(Referen ce data)
-0.20
-0.15
-0.10
-0.05
0.00
0.05
0 5 10 15 20
Supply voltage: Vcc[V]
TH bias current: Ith[uA]
Operating range
Fig.19 TH bias current
100°C
25°C
–
40°C
-0.20
-0.15
-0.10
-0.05
0.00
0.05
0 5 10 15 20
Supply voltage: Vcc[V]
MIN bias current: Imin[uA]
Operating range
Fig.20 MIN bias current
100°C
25°C
–
40°C
9/12
Datasheet
Datasheet
BD6722FS
TSZ02201-0H1H0B100180-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 28.JUL.2012 Rev.002
www.rohm.com
TSZ22111・15・001
●Application circuit example(Constant values are for reference)
Substrate design note
a) Motor power and ground lines are made as fat as possible.
b) IC power line is made as fat as possible.
c) IC ground line is common with the application ground except motor ground (i.e. hall ground etc.), and arrang ed
near to (–) land.
d) The bypass capacitors (Vcc side and Vm side) are arrangement near to Vcc terminal and FETs, respectively.
e) H+ and H– lines are arranged side by side and made from the hall element to IC as short er as possible,
because it is easy for the noise to influence the hall lines.
Fig.21 PWM controllable 4 wires type (FG) motor application circuit
Protection of FG open-drain
Stabilization of REF voltage
Hall bias is set according to the
amplitude of hall element
output and hall input voltage
range.
Noise m easures of substrate
Drive the PMOS FET gate by
constant current flowing to IC
Adjustment the PMOS FET
slew rate
Low-pass filter for RNF v o ltage
smoothing
So bypass capacitor,
arrangement near to FETs as
much as
p
ossible
So bypass capacitor,
arrangement near to Vcc
terminal as much as
p
ossible
Reverse-connected prevention
of the FAN connector
Reverse-connected prevention
of the FAN connector
Circuit that convert s PWM du ty
into DC voltage
Minimum output duty setting
Output PWM frequency setting
To limit motor current, the
current is detected.
Note the power consumption of
detection resistance.
Maximum output voltage and
current are 34V and 1.5A.
H
SIG
0Ω to
330pF
to 1000pF
0.1µ F to
PWM
＋
M
470Ω to 1kΩ
0Ω to 2kΩ
1µF to
1µF to
－
200Ω
to 20kΩ
100pF
to 0.1µF
0.24Ω to
Vcc
HALL
AMP
Vcl
SIGNAL
OUTPUT
HALL
COMP
CONTROL
LOGIC
PRE-
DRIVER
REF
OSC
QUICK
START LOCK
PROTECT
TSD PWM SO FT
SWITCHING
CURRENT
LIMIT COMP
SIGNAL
OUTPUT
PWM
COMP
PWM
COMP
H–
H+
MIN
TH
OSC
AL
REF
A1L
CS
RNF
GND
A2H
A2L
FG
10
9
14
13
12
11
16
15
1
2
3
4
5
6
7
8
Vcc
A1H
10/12
Datasheet
Datasheet
BD6722FS
TSZ02201-0H1H0B100180-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 28.JUL.2012 Rev.002
www.rohm.com
TSZ22111・15・001
●Power dissipation
Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25°C (normal temperature). IC is
heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The
temperature that can be accepted by IC chip depen ds on circui t configurati on, manufact uring process, et c, and consumabl e
power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature)
and thermal resistance of package (heat dissipation capability). The maximum junction temperature is in general equal to
the maximum value in the storage temperature range.
Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which
indicates this heat dissipation capability (hardness of heat release) is called heat resistance, represented by the symbol
θja[°C/W]. This heat resistance can estimate the temperature of IC inside the package. Fig.22 shows the model of heat
resistance of the package. Heat resistance θja, ambient temperatur e Ta, junction temp erat ure Tj, and power consumpt ion P
can be calculated by the equation belo w:
Thermal de-rating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that
can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal
resistance θja. Thermal resistance θja depends on chip siz e, po wer consumption, package ambient t emperatur e, packaging
condition, wind velocity, etc., even when the same package is used. Thermal de-rating curve indicates a reference value
measured at a specified condition. Fig.23 shows a thermal de-rating curve (Value when mounting FR4 glass epoxy board
70[mm] x 70[mm] x 1.6[mm] (copper foil area below 3[%])). Thermal resistance θjc from IC chip joint part to the package
surface part of mounting the above-ment ioned same substrate is shown in the following as a reference value.
＊Reduce by 6.5mW/°C over 25°C
(On 70.0mm x 70.0mm x 1. 6mm glass epoxy board)
●I/O equivalence circuit(Resistance values are typical)
1) Power supply terminal, 2) Hall input terminals, 3) Minimum output duty setting 4) High side output 1, 2
and Ground terminal Output duty controllable input terminal terminals,
terminal, and Speed pulse signal output
Output current detection terminal, and
terminal Lock alarm signal output
terminal
5) Low side output 1, 2 6) Reference voltage output 7) Oscillating capacitor
terminals, and terminal connecting terminal
Output current detecting
resistor connecting terminal
50
0
75
0
Pd[mW]
0
25 50 75 100 125 150Ta[°C]
25
0
812.
5
θja=153.8 [°C/W ]
θja = (Tj – Ta) / P [°C/W]
θjc = (Tj – Tc) / P [°C/W]
Fig.22 Thermal resistance Fig.23 Thermal de-rating curve
θja = (Tj – Ta) / P [°C/W]
θjc = 43 [°C/W] (reference value)
Chip su rface temperatur e Tj[°C]
Package surface t em perature Tc[ °C]
Power consumption P[W]
Ambient tem perature Ta[°C]
TH
1kΩ
H+
H–
CS
Vcc
20Ω
FG
AL
A1H
A2H
Vcc
GND
MIN
1
k
Ω
Vcc
30Ω
A1L
A2L
RNF
REF
31kΩ
Vcc Vcc
OSC
Vcc
1kΩ
Vcc
1kΩ
11/12
Datasheet
Datasheet
BD6722FS
TSZ02201-0H1H0B100180-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 28.JUL.2012 Rev.002
www.rohm.com
TSZ22111・15・001
●Operational Notes
1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc.,
can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open
circuit. If any o ver rated values will expect to excee d the absolute m aximum ratings, con sider adding circuit prot ection
devices, such as fuses.
2) Connecting the power supply connector backwar d
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power
supply lines. An external direction diode can be added.
3) Power supply line
Back electromotive f orce cau ses reg en erate d current to p o wer suppl y lin e, theref ore take a me asure s u ch as plac ing a
capacitor between power supply and GND for routing regenerated current. And fully ensure that the capacitor
characteristics have no problem before determine a capacitor value. (When applying electrolytic capacitors,
capacitance characteristic values are reduced at low temperatures)
4) GND potential
It is possible that the motor output terminal may deflect below GND terminal because of influence by back
electromotive force of motor. The potential of GND terminal must be minimum potential in all operating conditions,
except that th e levels of t he motor outp uts terminals are under GND lev el by the back elect romotive force of the motor
coil. Also ensure that all terminals except GND and motor output terminals do not fall below GND voltage including
transient characteristics. Malfunction may possibly occur depending on use condition, environment, and property of
individual motor. Please make fully confirmation that no pr oblem is found on operati on of IC.
5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating
conditions.
6) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
7) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
8) ASO
When using the IC, set the output transistor so that it does not exceed absolut e maximum rations or ASO.
9) Thermal shut down circuit
The IC incorporates a b uilt-in thermal shutdown circuit (TSD circuit). Operation temperat ure is 175°C (typ.) and has a
hysteresis width of 25°C (typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes an
open state. TSD circuit is des igned only to shut the I C off to prevent thermal runaway. It is not desi gned to protect the
IC or guarantee its operatio n. Do not continu e to use the IC after operati on this circuit or use the I C in an environm ent
where the operation of this circuit is assumed.
10) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to
stress. Always discharge capacitors after each process or step. Always turn the IC’s power supply off before
connecting it to or removing it from a jig or f ixture during the inspecti on process. Ground the IC during ass embly steps
as an antistatic measure. Use similar precaution when transporting or storing the IC.
11) GND wiring pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to
change the GND wiring pattern of any external components, either.
12) Capacitor between output and GND
When a large capacitor is connected bet ween output and GND, if V cc is shorted with 0V or GND for some cause, it is
possible that the current charged in the capacitor may flow into the outp ut resulting in destruction. Keep t he capacitor
between outpu t and GND below 100µF.
13) IC terminal input
When Vcc voltage is not appl ied to IC, do not apply v oltage to each input terminal. When voltage abov e Vcc or below
GND is applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic
element causes mut ual interferenc e between circuits, resul ting in malfunct ion as well as destruction in the l ast. Do not
use in a manner where parasitic element is act uated.
14) In use
We are sure that the example of application circuit is preferable, but please check the character further more in
application to a part that requires high precision. In using the unit with external circuit constant changed, consider the
variation of externally equipped parts and our IC including not only static character but also transient character and
allow sufficient margin in determining.
●Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a
reference to help reading the formal version.
If there are any differences in translation version of this doc ument, formal version takes priorit y.
12/12
Datasheet
Datasheet
BD6722FS
TSZ02201-0H1H0B100180-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 28.JUL.2012 Rev.002
www.rohm.com
TSZ22111・15・001
●Physical dimension tape and reel information
●Marking diagram
●Revision history
Date Revision Comments
07.JUL.2012 001 New Release
28.JUL.2012 002 Color appearance change (There is no change in the content.)
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
(Unit : mm)
SSOP-A16
13
87
0.8
9
0.11
15
453
11
0.3MIN
2
1216 14
61
10
6.6±0.2
0.15±0.1
0.36±0.1
1.5±0.1 6.2±0.3
4.4±0.2
(MAX 6.95 include BURR)
0.1
BD6722F
SSOP-A16
(TOP VIEW)
Part Number
LOT Number
1PIN Mark
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
