SCLS066D − MARCH 1982 − REVISED SEPTEMBER 2003
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DOperating Voltage Range of 4.5 V to 5.5 V
DOutputs Can Drive Up To 10 LSTTL Loads
DLow Power Consumption, 80-µA Max ICC
DTypical tpd = 10 ns
D±4-mA Output Drive at 5 V
DLow Input Current of 1 µA Max
DInputs Are TTL-Voltage Compatible
DDesigned Specifically for High-Speed
Memory Decoders and Data-Transmission
Systems
DIncorporate Two Enable Inputs to Simplify
Cascading and/or Data Reception
description/ordering information
The ’HCT139 devices are designed for
high-performance memory-decoding or
data-routing applications requiring very short
propagation delay times. In high-performance
memory systems, these decoders can minimize
the effects of system decoding. When employed
with high-speed memories utilizing a fast enable
circuit, the delay time of these decoders and the
enable time of the memory usually are less than
the typical access time of the memory. This means
that the effective system delay introduced by the
decoders is negligible.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
PDIP − N Tube of 25 SN74HCT139N SN74HCT139N
Tube of 40 SN74HCT139D
SOIC − D Reel of 2500 SN74HCT139DR HCT139
−40°C to 85°C
SOIC − D
Reel of 250 SN74HCT139DT
HCT139
−40 C to 85 C
SSOP − DB Reel of 2000 SN74HCT139DBR HT139
TSSOP − PW
Reel of 2000 SN74HCT139PWR
HT139
TSSOP − PW Reel of 250 SN74HCT139PWT HT139
CDIP − J Tube of 25 SNJ54HCT139J SNJ54HCT139J
−55°C to 125°CCFP − W Tube of 150 SNJ54HCT139W SNJ54HCT139W
−55 C to 125 C
LCCC − FK Tube of 55 SNJ54HCT139FK SNJ54HCT139FK
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications o
f
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
3212019
910111213
4
5
6
7
8
18
17
16
15
14
2A
2B
NC
2Y0
2Y1
1B
1Y0
NC
1Y1
1Y2
1A
1G
NC
2Y3
2Y2 V
2G
1Y3
GND
NC
SN54HCT139 . . . FK PACKAGE
(TOP VIEW)
CC
NC − No internal connection
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1G
1A
1B
1Y0
1Y1
1Y2
1Y3
GND
VCC
2G
2A
2B
2Y0
2Y1
2Y2
2Y3
SN54HCT139 ...J OR W PACKAGE
SN74HCT139 . . . D, DB, N, OR PW PACKAGE
(TOP VIEW)
Copyright 2003, Texas Instruments Incorporated
!"#$%&' #"'('
')"*%("' #$**&' ( ") +$,-#("' !(&. *"!$# #"')"*% "
+&#)#("' +&* & &*% ") &/( '*$%&' ('!(*! 0(**('1.
*"!$#"' +*"#&'2 !"& '" '&#&(*-1 '#-$!& &'2 ") (--
+(*(%&&*.
SCLS066D − MARCH 1982 − REVISED SEPTEMBER 2003
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
description/ordering information (continued)
The ’HCT139 devices comprise two individual 2-line to 4-line decoders in a single package. The active-low
enable (G) input can be used as a data line in demultiplexing applications. These decoders/demultiplexers
feature fully buffered inputs, each of which represents only one normalized load to its driving circuit.
FUNCTION TABLE
INPUTS
OUTPUTS
G
SELECT
OUTPUTS
GB A Y0 Y1 Y2 Y3
H X X H H H H
L L LLHHH
L L HHLHH
L H LHHLH
L H H H H H L
logic diagram (positive logic)
1G
1Y0
1Y1
1Y2
1Y3
2Y0
2Y1
2Y2
2Y3
1A
1B
2G
2A
2B
Pin numbers shown are for the D, DB, J, N, PW, and W packages.
1
2
3
15
14
13
4
5
6
7
12
11
10
9
SCLS066D − MARCH 1982 − REVISED SEPTEMBER 2003
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±25 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): D package 73°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DB package 82°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 67°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 108°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54HCT139 SN74HCT139
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
VCC Supply voltage 4.5 5 5.5 4.5 5 5.5 V
VIH High-level input voltage VCC = 4.5 V to 5.5 V 2 2 V
VIL Low-level input voltage VCC = 4.5 V to 5.5 V 0.8 0.8 V
VIInput voltage 0 VCC 0 VCC V
VOOutput voltage 0 VCC 0 VCC V
ttInput transition (rise and fall) time 500 500 ns
TAOperating free-air temperature −55 125 −40 85 °C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
TA = 25°C SN54HCT139 SN74HCT139
UNIT
PARAMETER
TEST CONDITIONS
V
CC MIN TYP MAX MIN MAX MIN MAX
UNIT
VOH
VI = VIH or VIL
IOH = −20 µA
4.5 V
4.4 4.499 4.4 4.4
V
VOH VI = VIH or VIL IOH = −4 mA 4.5 V 3.98 4.3 3.7 3.84 V
VOL
VI = VIH or VIL
IOL = 20 µA
4.5 V
0.001 0.1 0.1 0.1
V
VOL VI = VIH or VIL IOL = 4 mA 4.5 V 0.17 0.26 0.4 0.33 V
IIVI = VCC or 0 5.5 V ±0.1 ±100 ±1000 ±1000 nA
ICC VI = VCC or 0, IO = 0 5.5 V 8 160 80 µA
∆ICC‡One input at 0.5 V or 2.4 V,
Other inputs at 0 or VCC 5.5 V 1.4 2.4 3 2.9 mA
Ci4.5 V
to 5.5 V 3 10 10 10 pF
‡This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC.
3 ')"*%("' #"'#&*' +*"!$# ' & )"*%(4& "*
!&2' +(& ") !&4&-"+%&'. (*(#&*# !(( ('! "&*
+&#)#("' (*& !&2' 2"(-. &/( '*$%&' *&&*4& & *2 "
#('2& "* !#"''$& && +*"!$# 0"$ '"#&.
SCLS066D − MARCH 1982 − REVISED SEPTEMBER 2003
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
VCC
TA = 25°C SN54HCT139 SN74HCT139
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
V
CC MIN TYP MAX MIN MAX MIN MAX
UNIT
A or B
Y
4.5 V 14 34 51 43
tpd
A or B Y5.5 V 12 30 50 40
ns
tpd
G
Y
4.5 V 11 34 51 43 ns
GY5.5 V 10 30 50 40
tt
Y
4.5 V 8 15 22 19
ns
t
t
Y
5.5 V 6 14 21 17
ns
operating characteristics, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance per decoder No load 25 pF
PARAMETER MEASUREMENT INFORMATION
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
1.3 V1.3 V 0.3 V0.3 V 2.7 V 2.7 V 3 V
0 V
trtf
Input
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT RISE AND FALL TIMES
1.3 V
1.3 V1.3 V 10%10% 90% 90%
3 V
VOH
VOL
0 V
trtf
Input
In-Phase
Output
1.3 V
tPLH tPHL
1.3 V 1.3 V
10% 10% 90%90% VOH
VOL
tr
tf
tPHL tPLH
Out-of-Phase
Output
Test
Point
From Output
Under Test
LOAD CIRCUIT
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. The outputs are measured one at a time with one input transition per measurement.
D. tPLH and tPHL are the same as tpd.
CL = 50 pF
(see Note A)
Figure 1. Load Circuit and Voltage Waveforms
3 ')"*%("' #"'#&*' +*"!$# ' & )"*%(4& "*
!&2' +(& ") !&4&-"+%&'. (*(#&*# !(( ('! "&*
+&#)#("' (*& !&2' 2"(-. &/( '*$%&' *&&*4& & *2 "
#('2& "* !#"''$& && +*"!$# 0"$ '"#&.
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74HCT139D ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT139DBLE OBSOLETE SSOP DB 16 TBD Call TI Call TI
SN74HCT139DBR ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT139DBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT139DBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT139DE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT139DG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT139DR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT139DRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT139DRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT139DT ACTIVE SOIC D 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT139DTE4 ACTIVE SOIC D 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT139DTG4 ACTIVE SOIC D 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT139N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74HCT139NE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74HCT139PWLE OBSOLETE TSSOP PW 16 TBD Call TI Call TI
SN74HCT139PWR ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT139PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT139PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT139PWT ACTIVE TSSOP PW 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT139PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT139PWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 1
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74HCT139DBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74HCT139DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74HCT139PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74HCT139PWT TSSOP PW 16 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74HCT139DBR SSOP DB 16 2000 367.0 367.0 38.0
SN74HCT139DR SOIC D 16 2500 333.2 345.9 28.6
SN74HCT139PWR TSSOP PW 16 2000 367.0 367.0 35.0
SN74HCT139PWT TSSOP PW 16 250 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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