379
Rotary
Potentiometers
Slide
Potentiometers
Metal
Shaft
Insulated
Shaft
Knob
Operating
Through
Shaft Type
Ring
Type
Through Shaft Type / Soldering Conditions
Through Shaft Type / Product Specifications
Reference for Manual Soldering
Example of Reflow Soldering Condition
Series Tip temperature Soldering time
RDC80 350±5℃ 3 s
+1
0
1. Cleaning should not be attempted.
2. Type of solder to be used Use cream solder that contains 10 to 15 %wt flux.
3. Number of solder applications - apply solder only once
4. Recommended reflow conditions
Series A B C D E F G H I No. of
reflows
RDC80 250℃ ー18 0 ℃ 15 0 ℃ 90±30s ー10 ±1s ー ー 1 time
1. When using an infrared reflow oven, solder may not always be applied as intended.
Be sure to use a hot air reflow oven or a type that uses infrared rays in combination with hot air.
2. The temperatures given above are the maximum temperatures at the terminals of the products when employing a hot
air reflow method. The temperature of the PC board and the surface temperature of the products may vary greatly
depending on the PC board material, its size and thickness. Ensure that the surface temperature of the products does not
rise to 250℃ or greater.
3. Conditions vary to some extent depending on the type of reflow bath used. Be sure to give due consideration to this prior
to use.
Notes
Method for Regulating the Linearity
Model RDC80
4T output
2T output
±3%
±3%
±165˚
±165˚
180˚(phase difference)
2. The center (0°)
is in the configuration diagram condition
1. Reference taper : 100% / 340˚
100
0
50
0˚
I max.
H max.
300
200
100
Room
temperature
Pre-heating
E max.
Time(s)
Temperature(℃)
A
B
C
D
F max.
G max.