ADC12C080CISQE/NOPB - NATIONAL SEMICONDUCTOR

ADC12C080

ADC12C080 12-Bit, 65/80 MSPS A/D Converter

Literature Number: SNAS379B

August 2007

ADC12C080

12-Bit, 65/80 MSPS A/D Converter

General Description

The ADC12C080 is a high-performance CMOS analog-to-

digital converter capable of converting analog input signals

into 12-bit digital words at rates up to 80 Mega Samples Per

Second (MSPS). This converter uses a differential, pipelined

architecture with digital error correction and an on-chip sam-

ple-and-hold circuit to minimize power consumption and the

external component count, while providing excellent dynamic

performance. A unique sample-and-hold stage yields a full-

power bandwidth of 1 GHz. The ADC12C080 may be oper-

ated from a single +3.0V power supply and consumes low

power. A separate +2.5V supply may be used for the digital

output interface which allows lower power operation with re-

duced noise. A power-down feature reduces the power con-

sumption to very low levels while still allowing fast wake-up

time to full operation. The differential inputs accept a 2V full

scale differential input swing. A stable 1.2V internal voltage

reference is provided, or the ADC12C080 can be operated

with an external 1.2V reference. Output data format (offset

binary versus 2's complement) and duty cycle stabilizer are

pin-selectable. The duty cycle stabilizer maintains perfor-

mance over a wide range of clock duty cycles.

The ADC12C080 is available in a 32-lead LLP package and

operates over the industrial temperature range of −40°C to

+85°C.

Features

■1 GHz Full Power Bandwidth

■Internal reference and sample-and-hold circuit

■Low power consumption

■Data Ready output clock

■Clock Duty Cycle Stabilizer

■Single +3.0V supply operation

■Power-down mode

■32-pin LLP package, (5x5x0.8mm, 0.5mm pin-pitch)

Key Specifications

■Resolution 12 Bits

■Conversion Rate 80 MSPS

■SNR (fIN = 170 MHz) 68 dBFS (typ)

■SFDR (fIN = 170 MHz) 86 dBFS (typ)

■Full Power Bandwidth 1 GHz (typ)

■Power Consumption 300 mW (typ)

Applications

■High IF Sampling Receivers

■Wireless Base Station Receivers

■Test and Measurement Equipment

■Communications Instrumentation

■Portable Instrumentation

Connection Diagram

20211101

ADC12C080 12-Bit, 65/80 MSPS A/D Converter

Block Diagram

20211102

Ordering Information

Industrial (−40°C ≤ TA ≤ +85°C) Package

ADC12C080CISQ 32 Pin LLP

ADC12C080CISQE 32 Pin LLP,

250-Piece Tape and Reel

ADC12C080EB Evaluation Board

www.national.com 2

ADC12C080

Pin Descriptions and Equivalent Circuits

Pin No. Symbol Equivalent Circuit Description

ANALOG I/O

5VIN+

Differential analog input pins. The differential full-scale input signal

level is 2VP-P with each input pin signal centered on a common

mode voltage, VCM.

6VIN-

2VRP These pins should each be bypassed to AGND with a low ESL

(equivalent series inductance) 0.1 µF capacitor placed very close

to the pin to minimize stray inductance. A 0.1 µF capacitor should

be placed between VRP and VRN as close to the pins as possible,

and a 1 µF capacitor should be placed in parallel.

VRP and VRN should not be loaded. VCMO may be loaded to 1mA

for use as a temperature stable 1.5V reference.

It is recommended to use VCMO to provide the common mode

voltage, VCM, for the differential analog inputs, VIN+ and VIN−.

32 VCMO

1VRN

31 VREF

Reference Voltage. This device provides an internally developed

1.2V reference. When using the internal reference, VREF should be

decoupled to AGND with a 0.1 µFand a 1 µF low equivalent series

inductance (ESL) capacitor.

This pin may be driven with an external 1.2V reference voltage.

This pin should not be used to source or sink current.

12 OF/DCS

This is a four-state pin controlling the input clock mode and output

data format.

OF/DCS = VA, output data format is 2's complement without duty

cycle stabilization applied to the input clock

OF/DCS = AGND, output data format is offset binary, without duty

cycle stabilization applied to the input clock.

OF/DCS = (2/3)*VA, output data is 2's complement with duty cycle

stabilization applied to the input clock

OF/DCS = (1/3)*VA, output data is offset binary with duty cycle

stabilization applied to the input clock.

DIGITAL I/O

11 CLK The clock input pin.

The analog input is sampled on the rising edge of the clock input.

30 PD

This is a two-state input controlling Power Down.

PD = VA, Power Down is enabled and power dissipation is reduced.

PD = AGND, Normal operation.

3 www.national.com

ADC12C080

Pin No. Symbol Equivalent Circuit Description

15-19,

23-29 D0–D11

Digital data output pins that make up the 12-bit conversion result.

D0 (pin 15) is the LSB, while D11 (pin 29) is the MSB of the output

word. Output levels are CMOS compatible.

21 DRDY

Data Ready Strobe. The data output transition is synchronized with

the falling edge of this signal. This signal switches at the same

frequency as the CLK input.

ANALOG POWER

3, 8, 10 VA

Positive analog supply pins. These pins should be connected to a

quiet voltage source and be bypassed to AGND with 0.1 µF

capacitors located close to the power pins.

4, 7, 9,

Exposed Pad AGND

The ground return for the analog supply.

The exposed pad on back of package must be soldered to ground

plane to ensure rated performance.

DIGITAL POWER

20 VDR

Positive driver supply pin for the output drivers. This pin should be

connected to a quiet voltage source and be bypassed to DRGND

with a 0.1 µF capacitor located close to the power pin.

22 DRGND

The ground return for the digital output driver supply. This pins

should be connected to the system digital ground, but not be

connected in close proximity to the ADC's AGND pins.

www.national.com 4

ADC12C080

Absolute Maximum Ratings (Notes 1, 3)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Supply Voltage (VA, VDR) −0.3V to 4.2V

Voltage on Any Pin

(Not to exceed 4.2V)

−0.3V to (VA +0.3V)

Input Current at Any Pin other

than Supply Pins (Note 4)

±5 mA

Package Input Current (Note 4) ±50 mA

Max Junction Temp (TJ) +150°C

Thermal Resistance (θJA)30°C/W

ESD Rating

Human Body Model (Note 6) 2500V

Machine Model (Note 6) 250V

Storage Temperature −65°C to +150°C

Soldering process must comply with National

Semiconductor's Reflow Temperature Profile

specifications. Refer to www.national.com/packaging.

(Note 7)

Operating Ratings (Notes 1, 3)

Operating Temperature −40°C ≤ TA ≤ +85°C

Supply Voltage (VA) +2.7V to +3.6V

Output Driver Supply (VDR) +2.4V to VA

Clock Duty Cycle

(DCS Enabled) 30/70 %

(DCS disabled) 45/55 %

VCM 1.4V to 1.6V

|AGND-DRGND| ≤100mV

ADC12C080 Converter Electrical Characteristics

Unless otherwise specified, the following specifications apply: AGND = DRGND = 0V, VA = +3.0V, VDR = +2.5V, Internal VREF =

+1.2V, fCLK = 80 MHz, 50% Duty Cycle, DCS Disabled, VCM = VCMO, CL = 5 pF/pin. Typical values are for TA = 25°C. Boldface

limits apply for TMIN ≤ TA ≤ TMAX. All other limits apply for TA = 25°C (Notes 8, 9)

Symbol Parameter Conditions Typical

(Note 10) Limits Units

(Limits)

STATIC CONVERTER CHARACTERISTICS

Resolution with No Missing Codes 12 Bits (min)

INL Integral Non Linearity ±0.5 1.2 LSB (max)

-1.2 LSB (min)

DNL Differential Non Linearity ±0.35 0.7 LSB (max)

-0.6 LSB (min)

PGE Positive Gain Error 0.25 ±1.25 %FS (max)

NGE Negative Gain Error 0.15 ±1.25 %FS (max)

TC PGE Positive Gain Error Tempco −40°C ≤ TA ≤ +85°C -7 ppm/°C

TC NGE Negative Gain Error Tempco −40°C ≤ TA ≤ +85°C -6 ppm/°C

VOFF Offset Error 0.065 ±0.55 %FS (max)

TC VOFF Offset Error Tempco −40°C ≤ TA ≤ +85°C 7.5 ppm/°C

Under Range Output Code 0 0

Over Range Output Code 4095 4095

REFERENCE AND ANALOG INPUT CHARACTERISTICS

VCMO Common Mode Output Voltage 1.5 1.40

1.56

V (min)

V (max)

VCM Analog Input Common Mode Voltage 1.5 1.4

1.6

V (min)

V (max)

CIN

VIN Input Capacitance (each pin to GND)

(Note 11)

VIN = 1.5 Vdc

± 0.5 V

(CLK LOW) 8.5 pF

(CLK HIGH) 3.5 pF

VREF Internal Reference Voltage 1.18 V

TC VREF Internal Reference Voltage Tempco −40°C ≤ TA ≤ +85°C 18 ppm/°C

VRP Internal Reference top (Note 13) 1.98 1.89

2.06

V (min)

V (max)

5 www.national.com

ADC12C080

Symbol Parameter Conditions Typical

(Note 10) Limits Units

(Limits)

VRN Internal Reference bottom (Note 13) 0.98 0.89

1.06

V (min)

V (max)

EXT

VREF

External Reference Voltage (Note 13) 1.20 1.176

1.224

V (min)

V (max)

ADC12C080 Dynamic Converter Electrical Characteristics

Unless otherwise specified, the following specifications apply: AGND = DRGND = 0V, VA = +3.0V, VDR = +2.5V, Internal VREF =

+1.2V, fCLK = 80 MHz, 50% Duty Cycle, DCS Disabled, VCM = VCMO, CL = 5 pF/pin, . Typical values are for TA = 25°C. Boldface

limits apply for TMIN ≤ TA ≤ TMAX. All other limits apply for TA = 25°C (Notes 8, 9)

Symbol Parameter Conditions Typical

(Note 10) Limits

Units

(Limits)

(Note 2)

DYNAMIC CONVERTER CHARACTERISTICS, AIN = -1dBFS

FPBW Full Power Bandwidth -1 dBFS Input, −3 dB Corner 1.0 GHz

SNR Signal-to-Noise Ratio

fIN = 10 MHz 71.2 dBFS

fIN = 70 MHz 70.5 dBFS

fIN = 170 MHz 68.5 67.8 dBFS

SFDR Spurious Free Dynamic Range

fIN = 10 MHz 90 dBFS

fIN = 70 MHz 88 dBFS

fIN = 170 MHz 86 82 dBFS

ENOB Effective Number of Bits

fIN = 10 MHz 11.5 Bits

fIN = 70 MHz 11.3 Bits

fIN = 170 MHz 11.1 10.9 Bits

THD Total Harmonic Disortion

fIN = 10 MHz −88 dBFS

fIN = 70 MHz −86 dBFS

fIN = 170 MHz −85 -80.5 dBFS

H2 Second Harmonic Distortion

fIN = 10 MHz −95 dBFS

fIN = 70 MHz −90 dBFS

fIN = 170 MHz −86 -82 dBFS

H3 Third Harmonic Distortion

fIN = 10 MHz −90 dBFS

fIN = 70 MHz −88 dBFS

fIN = 170 MHz −86 -82 dBFS

SINAD Signal-to-Noise and Distortion Ratio

fIN = 10 MHz 71.1 dBFS

fIN = 70 MHz 70 dBFS

fIN = 170 MHz 68.5 67.6 dBFS

IMD Intermodulation Distortion fIN = 19.5MHz and 20.5MHz, each -7dBFS -82 dBFS

ADC12C080 Logic and Power Supply Electrical Characteristics

Unless otherwise specified, the following specifications apply: AGND = DRGND = 0V, VA = +3.0V, VDR = +2.5V, Internal VREF =

+1.2V, fCLK = 80 MHz, 50% Duty Cycle, DCS Disabled, VCM = VCMO, CL = 5 pF/pin. Typical values are for TA = 25°C. Boldface

limits apply for TMIN ≤ TA ≤ TMAX. All other limits apply for TA = 25°C (Notes 8, 9)

Symbol Parameter Conditions Typical

(Note 10) Limits Units

(Limits)

DIGITAL INPUT CHARACTERISTICS (CLK, PD)

VIN(1) Logical “1” Input Voltage VD = 3.6V 2.0 V (min)

VIN(0) Logical “0” Input Voltage VD = 3.0V 0.8 V (max)

IIN(1) Logical “1” Input Current VIN = 3.3V 10 µA

IIN(0) Logical “0” Input Current VIN = 0V −10 µA

CIN Digital Input Capacitance 5 pF

www.national.com 6

ADC12C080

Symbol Parameter Conditions Typical

(Note 10) Limits Units

(Limits)

DIGITAL OUTPUT CHARACTERISTICS (D0–D11, DRDY)

VOUT(1)(1) Logical “1” Output Voltage IOUT = −0.5 mA , VDR = 2.4V 2.0 V (min)

VOUT(0)(0) Logical “0” Output Voltage IOUT = 1.6 mA, VDR = 2.4V 0.4 V (max)

+ISC Output Short Circuit Source Current VOUT = 0V −10 mA

−ISC Output Short Circuit Sink Current VOUT = VDR 10 mA

COUT Digital Output Capacitance 5 pF

POWER SUPPLY CHARACTERISTICS

IAAnalog Supply Current Full Operation 100 123 mA (max)

IDR Digital Output Supply Current Full Operation (Note 12) 12 mA

Power Consumption Excludes IDR (Note 12) 300 369 mW (max)

Power Down Power Consumption Clock disabled 7 mW

ADC12C080 Timing and AC Characteristics

Unless otherwise specified, the following specifications apply: AGND = DRGND = 0V, VA = +3.0V, VDR = +2.5V, Internal VREF =

+1.2V, fCLK = 80 MHz, 50% Duty Cycle, DCS Disabled, VCM = VCMO, CL = 5 pF/pin. Typical values are for TA = 25°C. Timing

measurements are taken at 50% of the signal amplitude. Boldface limits apply for TMIN ≤ TA ≤ TMAX. All other limits apply for

TA = 25°C (Notes 8, 9)

Symb Parameter Conditions Typical

(Note 10) Limits Units

(Limits)

Maximum Clock Frequency 80 MHz (max)

Minimum Clock Frequency 20 MHz (min)

tCH Clock High Time 6 ns

tCL Clock Low Time 6 ns

tCONV Conversion Latency 7Clock Cycles

tOD Output Delay of CLK to DATA Relative to rising edge of CLK(Note 13) 5.5 3

7.3

ns (min)

ns(max)

tSU Data Output Setup Time Relative to DRDY 6.5 5.5 ns (min)

tHData Output Hold Time Relative to DRDY 6 5ns (min)

tAD Aperture Delay 0.6 ns

tAJ Aperture Jitter 0.1 ps rms

7 www.national.com

ADC12C080

Dynamic Converter Electrical Characteristics at 65MSPS

Unless otherwise specified, the following specifications apply: AGND = DRGND = 0V, VA = +3.0V, VDR = +2.5V, Internal VREF =

+1.2V, fCLK = 65 MHz, 50% Duty Cycle, DCS Disabled, VCM = VCMO, CL = 5 pF/pin, . Typical values are for TA = 25°C. Boldface

limits apply for TMIN ≤ TA ≤ TMAX. All other limits apply for TA = 25°C (Notes 8, 9)

Symbol Parameter Conditions

Typical

(Note

10)

Limits

Units

(Limits)

(Note 2)

DYNAMIC CONVERTER CHARACTERISTICS, AIN = -1dBFS

SNR Signal-to-Noise Ratio

fIN = 10 MHz 71.2 dBFS

fIN = 70 MHz 70.5 dBFS

fIN =170 MHz 68.5 dBFS

SFDR Spurious Free Dynamic Range

fIN = 10 MHz 90 dBFS

fIN = 70 MHz 88 dBFS

fIN = 170 MHz 86 dBFS

ENOB Effective Number of Bits

fIN = 10 MHz 11.5 Bits

fIN = 70 MHz 11.3 Bits

fIN = 170 MHz 11 Bits

THD Total Harmonic Disortion

fIN = 10 MHz −88 dBFS

fIN = 70 MHz −85 dBFS

fIN = 170 MHz −80 dBFS

H2 Second Harmonic Distortion

fIN = 10 MHz -100 dBFS

fIN = 70 MHz −95 dBFS

fIN = 170 MHz −85 dBFS

H3 Third Harmonic Distortion

fIN = 10 MHz −90 dBFS

fIN = 70 MHz −88 dBFS

fIN = 170 MHz −83 dBFS

SINAD Signal-to-Noise and Distortion Ratio

fIN = 10 MHz 71.1 dBFS

fIN = 70 MHz 69.8 dBFS

fIN = 170 MHz 67.7 dBFS

POWER SUPPLY CHARACTERISTICS

IAAnalog Supply Current Full Operation 90 mA (max)

IDR Digital Output Supply Current Full Operation (Note 12) 14.5 mA

Power Consumption Excludes IDR (Note 12) 270 mW (max)

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is

guaranteed to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics.

The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under

the listed test conditions. Operation of the device beyond the maximum Operating Ratings is not recommended.

Note 2: Parameters specified in dBFS indicate the value that would be attained with a full-scale input signal.

Note 3: All voltages are measured with respect to GND = AGND = DRGND = 0V, unless otherwise specified.

Note 4: When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND, or VIN > VA), the current at that pin should be limited to ±5 mA. The

±50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of ±5 mA to 10.

Note 5: The maximum allowable power dissipation is dictated by TJ,max, the junction-to-ambient thermal resistance, (θJA), and the ambient temperature, (TA), and

can be calculated using the formula PD,max = (TJ,max - TA )/θJA. The values for maximum power dissipation listed above will be reached only when the device is

operated in a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Such

conditions should always be avoided.

Note 6: Human Body Model is 100 pF discharged through a 1.5 kΩ resistor. Machine Model is 220 pF discharged through 0 Ω

Note 7: Reflow temperature profiles are different for lead-free and non-lead-free packages.

Note 8: The inputs are protected as shown below. Input voltage magnitudes above VA or below GND will not damage this device, provided current is limited per

(Note 4). However, errors in the A/D conversion can occur if the input goes above 2.6V or below GND as described in the Operating Ratings section.

www.national.com 8

ADC12C080

20211111

Note 9: With a full scale differential input of 2VP-P , the 12-bit LSB is 488 µV.

Note 10: Typical figures are at TA = 25°C and represent most likely parametric norms at the time of product characterization. The typical specifications are not

guaranteed.

Note 11: The input capacitance is the sum of the package/pin capacitance and the sample and hold circuit capacitance.

Note 12: IDR is the current consumed by the switching of the output drivers and is primarily determined by load capacitance on the output pins, the supply voltage,

VDR, and the rate at which the outputs are switching (which is signal dependent). IDR=VDR(C0 x f0 + C1 x f1 +....C11 x f11) where VDR is the output driver power

supply voltage, Cn is total capacitance on the output pin, and fn is the average frequency at which that pin is toggling.

Note 13: This parameter is guaranteed by design and/or characterization and is not tested in production.

9 www.national.com

ADC12C080

Specification Definitions

APERTURE DELAY is the time after the falling edge of the

clock to when the input signal is acquired or held for conver-

sion.

APERTURE JITTER (APERTURE UNCERTAINTY) is the

variation in aperture delay from sample to sample. Aperture

jitter manifests itself as noise in the output.

CLOCK DUTY CYCLE is the ratio of the time during one cycle

that a repetitive digital waveform is high to the total time of

one period. The specification here refers to the ADC clock

input signal.

COMMON MODE VOLTAGE (VCM) is the common DC volt-

age applied to both input terminals of the ADC.

CONVERSION LATENCY is the number of clock cycles be-

tween initiation of conversion and when that data is presented

to the output driver stage. Data for any given sample is avail-

able at the output pins the Pipeline Delay plus the Output

Delay after the sample is taken. New data is available at every

clock cycle, but the data lags the conversion by the pipeline

delay.

DIFFERENTIAL NON-LINEARITY (DNL) is the measure of

the maximum deviation from the ideal step size of 1 LSB.

EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE

BITS) is another method of specifying Signal-to-Noise and

Distortion Ratio or SINAD. ENOB is defined as (SINAD -

1.76) / 6.02 and says that the converter is equivalent to a

perfect ADC of this (ENOB) number of bits.

FULL POWER BANDWIDTH is a measure of the frequency

at which the reconstructed output fundamental drops 3 dB

below its low frequency value for a full scale input.

GAIN ERROR is the deviation from the ideal slope of the

transfer function. It can be calculated as:

Gain Error = Positive Full Scale Error − Negative Full Scale

Error

It can also be expressed as Positive Gain Error and Negative

Gain Error, which are calculated as:

PGE = Positive Full Scale Error - Offset Error

NGE = Offset Error - Negative Full Scale Error

INTEGRAL NON LINEARITY (INL) is a measure of the de-

viation of each individual code from a best fit straight line. The

deviation of any given code from this straight line is measured

from the center of that code value.

INTERMODULATION DISTORTION (IMD) is the creation of

additional spectral components as a result of two sinusoidal

frequencies being applied to the ADC input at the same time.

It is defined as the ratio of the power in the intermodulation

products to the total power in the original frequencies. IMD is

usually expressed in dBFS.

LSB (LEAST SIGNIFICANT BIT) is the bit that has the small-

est value or weight of all bits. This value is VFS/2n, where

“VFS” is the full scale input voltage and “n” is the ADC reso-

lution in bits.

MISSING CODES are those output codes that will never ap-

pear at the ADC outputs. The ADC is guaranteed not to have

any missing codes.

MSB (MOST SIGNIFICANT BIT) is the bit that has the largest

value or weight. Its value is one half of full scale.

NEGATIVE FULL SCALE ERROR is the difference between

the actual first code transition and its ideal value of ½ LSB

above negative full scale.

OFFSET ERROR is the difference between the two input

voltages [(VIN+) – (VIN-)] required to cause a transition from

code 2047 to 2048.

OUTPUT DELAY is the time delay after the falling edge of the

clock before the data update is presented at the output pins.

PIPELINE DELAY (LATENCY) See CONVERSION LATEN-

CY.

POSITIVE FULL SCALE ERROR is the difference between

the actual last code transition and its ideal value of 1½ LSB

below positive full scale.

POWER SUPPLY REJECTION RATIO (PSRR) is a measure

of how well the ADC rejects a change in the power supply

voltage. PSRR is the ratio of the Full-Scale output of the ADC

with the supply at the minimum DC supply limit to the Full-

Scale output of the ADC with the supply at the maximum DC

supply limit, expressed in dB.

SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in

dB, of the rms value of the input signal to the rms value of the

sum of all other spectral components below one-half the sam-

pling frequency, not including harmonics or DC.

SIGNAL TO NOISE PLUS DISTORTION (S/N+D or

SINAD) Is the ratio, expressed in dB, of the rms value of the

input signal to the rms value of all of the other spectral com-

ponents below half the clock frequency, including harmonics

but excluding d.c.

SPURIOUS FREE DYNAMIC RANGE (SFDR) is the differ-

ence, expressed in dB, between the rms values of the input

signal and the peak spurious signal, where a spurious signal

is any signal present in the output spectrum that is not present

at the input.

TOTAL HARMONIC DISTORTION (THD) is the ratio, ex-

pressed in dB, of the rms total of the first six harmonic levels

at the output to the level of the fundamental at the output. THD

is calculated as

where f1 is the RMS power of the fundamental (output) fre-

quency and f2 through f7 are the RMS power of the first six

harmonic frequencies in the output spectrum.

SECOND HARMONIC DISTORTION (2ND HARM) is the dif-

ference expressed in dB, between the RMS power in the input

frequency at the output and the power in its 2nd harmonic

level at the output.

THIRD HARMONIC DISTORTION (3RD HARM) is the dif-

ference, expressed in dB, between the RMS power in the

input frequency at the output and the power in its 3rd harmonic

level at the output.

www.national.com 10

ADC12C080

Timing Diagram

20211109

FIGURE 1. Output Timing

Transfer Characteristic

20211110

FIGURE 2. Transfer Characteristic

Typical Performance Characteristics DNL, INL Unless otherwise specified, the following

specifications apply: AGND = DRGND = 0V, VA = +3.0V, VDR = +2.5V, Internal VREF = +1.2V, fCLK = 80 MHz, 50% Duty Cycle,

DCS disabled, VCM = VCMO, CL = 5 pF/pin. TA = 25°C.

11 www.national.com

ADC12C080

DNL

20211141

INL

20211142

DNL vs. fCLK

20211143

INL vs. fCLK

20211144

DNL vs. Temperature

20211147

INL vs. Temperature

20211148

www.national.com 12

ADC12C080

DNL vs. VA

20211149

INL vs. VA

20211150

13 www.national.com

ADC12C080

Typical Performance Characteristics Unless otherwise specified, the following specifications apply:

AGND = DRGND = 0V, VA = +3.0V, VDR = +2.5V, Internal VREF = +1.2V, fCLK = 80 MHz, 50% Duty Cycle, DCS disabled, VCM =

VCMO, fIN = 10 MHz, CL = 5 pF/pin. TA = 25°C.

SNR, SINAD, SFDR vs. VA

20211151

Distortion vs. VA

20211152

SNR, SINAD, SFDR vs. VDR

20211153

Distortion vs. VDR

20211154

SNR, SINAD, SFDR vs. fCLK

20211155

Distortion vs. fCLK

20211156

www.national.com 14

ADC12C080

SNR, SINAD, SFDR vs. Clock Duty Cycle

20211157

Distortion vs. Clock Duty Cycle

20211158

SNR, SINAD, SFDR vs. Clock Duty Cycle, DCS Enabled

20211159

Distortion vs. Clock Duty Cycle, DCS Enabled

20211160

SNR, SINAD, SFDR vs. fIN

20211163

Distortion vs. fIN

20211164

15 www.national.com

ADC12C080

SNR, SINAD, SFDR vs. Temperature

20211165

Distortion vs. Temperature

20211166

Spectral Response @ 10 MHz input

20211168

Spectral Response @ 70 MHz input

20211169

Spectral Response @ 170 MHz input

20211170

Intermodulation Distortion, fIN1= 19.5 MHz, fIN2 = 20.5 MHz

20211171

www.national.com 16

ADC12C080

Power vs. fCLK

20211172

17 www.national.com

ADC12C080

Functional Description

Operating on a single +3.0V supply, the ADC12C080 uses a

pipeline architecture and has error correction circuitry to help

ensure maximum performance. The differential analog input

signal is digitized to 12 bits. The user has the choice of using

an internal 1.2V stable reference, or using an external 1.2V

reference. Any external reference is buffered on-chip to ease

the task of driving that pin.

The output word rate is the same as the clock frequency. The

analog input is acquired at the rising edge of the clock and the

digital data for a given sample is delayed by the pipeline for

7 clock cycles. The digital outputs are CMOS compatible sig-

nals that are clocked by a synchronous data ready output

signal (DRDY, pin 21) at the same rate as the clock input. Duty

cycle stabilization and output data format are selectable using

the quad state function OF/DCS pin (pin 12). The output data

can be set for offset binary or two's complement.

Power-down is selectable using the PD pin (pin 30). A logic

high on the PD pin reduces the converter power consumption.

For normal operation, the PD pin should be connected to the

analog ground (AGND).

Applications Information

1.0 OPERATING CONDITIONS

We recommend that the following conditions be observed for

operation of the ADC12C080:

2.7V ≤ VA ≤ 3.6V

2.4V ≤ VDR ≤ VA

20 MHz ≤ fCLK ≤ 80 MHz

1.2V internal reference

VREF = 1.2V (for an external reference)

VCM = 1.5V (from VCMO)

2.0 ANALOG INPUTS

2.1 Signal Inputs

2.1.1 Differential Analog Input Pins

The ADC12C080 has one pair of analog signal input pins,

VIN+ and VIN−, which form a differential input pair. The input

signal, VIN, is defined as

VIN = (VIN+) – (VIN−)

shows the expected input signal range. Note that the common

mode input voltage, VCM, should be 1.5V. Using VCMO (pin 32)

for VCM will ensure the proper input common mode level for

the analog input signal. The positive peaks of the individual

input signals should each never exceed 2.6V. Each analog

input pin of the differential pair should have a maximum peak-

to-peak voltage of 1V, be 180° out of phase with each other

and be centered around VCM.The peak-to-peak voltage swing

at each analog input pin should not exceed the 1V or the out-

put data will be clipped.

20211115

FIGURE 3. Expected Input Signal Range

For single frequency sine waves the full scale error in LSB

can be described as approximately

EFS = 4096 ( 1 - sin (90° + dev))

Where dev is the angular difference in degrees between the

two signals having a 180° relative phase relationship to each

other (see ). For single frequency inputs, angular errors result

in a reduction of the effective full scale input. For complex

waveforms, however, angular errors will result in distortion.

20211116

FIGURE 4. Angular Errors Between the Two Input Signals

Will Reduce the Output Level or Cause Distortion

It is recommended to drive the analog inputs with a source

impedance less than 100Ω. Matching the source impedance

for the differential inputs will improve even ordered harmonic

performance (particularly second harmonic).

Table 1indicates the input to output relationship of the AD-

C12C080.

www.national.com 18

ADC12C080

TABLE 1. Input to Output Relationship

VIN+VIN−Binary Output 2’s Complement Output

VCM − VREF/2 VCM + VREF/2 0000 0000 0000 1000 0000 0000 Negative Full-Scale

VCM − VREF/4 VCM + VREF/4 0100 0000 0000 1100 0000 0000

VCM VCM 1000 0000 0000 0000 0000 0000 Mid-Scale

VCM + VREF/4 VCM − VREF/4 1100 0000 0000 0100 0000 0000

VCM + VREF/2 VCM − VREF/2 1111 1111 1111 0111 1111 1111 Positive Full-Scale

2.1.2 Driving the Analog Inputs

The VIN+ and the VIN− inputs of the ADC12C080 have an in-

ternal sample-and-hold circuit which consists of an analog

switch followed by a switched-capacitor amplifier.

Figure 5 and Figure 6 show examples of single-ended to dif-

ferential conversion circuits. The circuit in Figure 5 works well

for input frequencies up to approximately 70MHz, while the

circuit in Figure 6 works well above 70MHz.

20211120

FIGURE 5. Low Input Frequency Transformer Drive Circuit

20211121

FIGURE 6. High Input Frequency Transformer Drive Circuit

One short-coming of using a transformer to achieve the sin-

gle-ended to differential conversion is that most RF trans-

formers have poor low frequency performance. A differential

amplifier can be used to drive the analog inputs for low fre-

quency applications. The amplifier must be fast enough to

settle from the charging glitches on the analog input resulting

from the sample-and-hold operation before the clock goes

high and the sample is passed to the ADC core.

The SFDR performance of the converter depends on the ex-

ternal signal conditioning circuity used, as this affects how

quickly the sample-and-hold charging glitch will settle. An ex-

ternal resistor and capacitor network as shown in Figure 7

should be used to isolate the charging glitches at the ADC

input from the external driving circuit and to filter the wideband

noise at the converter input. These components should be

placed close to the ADC inputs because the analog input of

the ADC is the most sensitive part of the system, and this is

the last opportunity to filter that input. For Nyquist applications

the RC pole should be at the ADC sample rate. The ADC input

capacitance in the sample mode should be considered when

setting the RC pole. For wideband undersampling applica-

tions, the RC pole should be set at least 1.5 to 2 times the

maximum input frequency to maintain a linear delay re-

sponse.

2.1.3 Input Common Mode Voltage

The input common mode voltage, VCM, should be in the range

of 1.4V to 1.6V and be a value such that the peak excursions

of the analog signal do not go more negative than ground or

more positive than 2.6V. It is recommended to use VCMO (pin

32) as the input common mode voltage.

If the ADC12C080 is operated with VA=3.6V, a resistor of ap-

proximately 1KΩ should be used from the VCMO pin to

AGND.This will help maintain stability over the entire temper-

ature range when using a high supply voltage.

2.2 Reference Pins

The ADC12C080 is designed to operate with an internal or

external 1.2V reference. The internal 1.2 Volt reference is the

default condition when no external reference input is applied

to the VREF pin. If a voltage is applied to the VREF pin, then

that voltage is used for the reference. The VREF pin should

19 www.national.com

ADC12C080

always be bypassed to ground with a 0.1 µF capacitor close

to the reference input pin.

It is important that all grounds associated with the reference

voltage and the analog input signal make connection to the

ground plane at a single, quiet point to minimize the effects of

noise currents in the ground path.

The Reference Bypass Pins (VRP, VCMO, and VRN) are made

available for bypass purposes. These pins should each be

bypassed to AGND with a low ESL (equivalent series induc-

tance) 1 µF capacitor placed very close to the pin to minimize

stray inductance. A 0.1 µF capacitor should be placed be-

tween VRP and VRN as close to the pins as possible, and a 1

µF capacitor should be placed in parallel. This configuration

is shown in Figure 7. It is necessary to avoid reference oscil-

lation, which could result in reduced SFDR and/or SNR.

VCMO may be loaded to 1mA for use as a temperature stable

1.5V reference. The remaining pins should not be loaded.

Smaller capacitor values than those specified will allow faster

recovery from the power down mode, but may result in de-

graded noise performance. Loading any of these pins, other

than VCMO may result in performance degradation.

The nominal voltages for the reference bypass pins are as

follows:

VCMO = 1.5 V

VRP = 2.0 V

VRN = 1.0 V

2.3 OF/DCS Pin

Duty cycle stabilization and output data format are selectable

using this quad state function pin. When enabled, duty cycle

stabilization can compensate for clock inputs with duty cycles

ranging from 30% to 70% and generate a stable internal clock,

improving the performance of the part. With OF/DCS = VA the

output data format is 2's complement and duty cycle stabi-

lization is not used. With OF/DCS = AGND the output data

format is offset binary and duty cycle stabilization is not used.

With OF/DCS = (2/3)*VA the output data format is 2's com-

plement and duty cycle stabilization is applied to the clock. If

OF/DCS is (1/3)*VA the output data format is offset binary and

duty cycle stabilization is applied to the clock. While the sense

of this pin may be changed "on the fly," doing this is not rec-

ommended as the output data could be erroneous for a few

clock cycles after this change is made.

3.0 DIGITAL INPUTS

Digital CMOS compatible inputs consist of CLK, and PD.

3.1 Clock Input

The CLK controls the timing of the sampling process. To

achieve the optimum noise performance, the clock input

should be driven with a stable, low jitter clock signal in the

range indicated in the Electrical Table. The clock input signal

should also have a short transition region. This can be

achieved by passing a low-jitter sinusoidal clock source

through a high speed buffer gate. The trace carrying the clock

signal should be as short as possible and should not cross

any other signal line, analog or digital, not even at 90°.

The clock signal also drives an internal state machine. If the

clock is interrupted, or its frequency is too low, the charge on

the internal capacitors can dissipate to the point where the

accuracy of the output data will degrade. This is what limits

the minimum sample rate.

The clock line should be terminated at its source in the char-

acteristic impedance of that line. Take care to maintain a

constant clock line impedance throughout the length of the

line. Refer to Application Note AN-905 for information on set-

ting characteristic impedance.

It is highly desirable that the the source driving the ADC clock

pins only drive that pin. However, if that source is used to drive

other devices, then each driven pin should be AC terminated

with a series RC to ground, such that the resistor value is

equal to the characteristic impedance of the clock line and the

capacitor value is

where tPD is the signal propagation rate down the clock line,

"L" is the line length and ZO is the characteristic impedance

of the clock line. This termination should be as close as pos-

sible to the ADC clock pin but beyond it as seen from the clock

source. Typical tPD is about 150 ps/inch (60 ps/cm) on FR-4

board material. The units of "L" and tPD should be the same

(inches or centimeters).

The duty cycle of the clock signal can affect the performance

of the A/D Converter. Because achieving a precise duty cycle

is difficult, the ADC12C080 has a Duty Cycle Stabilizer.

3.2 Power-Down (PD)

The PD pin, when high, holds the ADC12C080 in a power-

down mode to conserve power when the converter is not

being used. The power consumption in this state is 5 mW if

the clock is stopped when PD is high. The output data pins

are undefined and the data in the pipeline is corrupted while

in the power down mode.

The Power Down Mode Exit Cycle time is determined by the

value of the components on pins 1, 2, and 32 and is about 3

ms with the recommended components on the VRP, VCMO and

VRN reference bypass pins. These capacitors loose their

charge in the Power Down mode and must be recharged by

on-chip circuitry before conversions can be accurate. Smaller

capacitor values allow slightly faster recovery from the power

down mode, but can result in a reduction in SNR, SINAD and

ENOB performance.

4.0 DIGITAL OUTPUTS

Digital outputs consist of the CMOS signals D0-D11, and

DRDY.

The ADC12C080 has 13 CMOS compatible data output pins

corresponding to the converted input value and a data ready

(DRDY) signal that should be used to capture the output data.

Valid data is present at these outputs while the PD pin is low.

Data should be captured and latched with the rising edge of

the DRDY signal.

Be very careful when driving a high capacitance bus. The

more capacitance the output drivers must charge for each

conversion, the more instantaneous digital current flows

through VDR and DRGND. These large charging current

spikes can cause on-chip ground noise and couple into the

analog circuitry, degrading dynamic performance. Adequate

bypassing, limiting output capacitance and careful attention

to the ground plane will reduce this problem. The result could

be an apparent reduction in dynamic performance.

www.national.com 20

ADC12C080

20211119

FIGURE 7. Application Circuit

5.0 POWER SUPPLY CONSIDERATIONS

The power supply pins should be bypassed with a 0.1 µF ca-

pacitor and with a 100 pF ceramic chip capacitor close to each

power pin. Leadless chip capacitors are preferred because

they have low series inductance.

As is the case with all high-speed converters, the AD-

C12C080 is sensitive to power supply noise. Accordingly, the

noise on the analog supply pin should be kept below 100

mVP-P.

No pin should ever have a voltage on it that is in excess of the

supply voltages, not even on a transient basis. Be especially

careful of this during power turn on and turn off.

The VDR pin provides power for the output drivers and may be

operated from a supply in the range of 2.4V to VA. This en-

ables lower power operation, reduces the noise coupling

effects from the digital outputs to the analog circuitry and sim-

plifies interfacing to lower voltage devices and systems.

6.0 LAYOUT AND GROUNDING

Proper grounding and proper routing of all signals are essen-

tial to ensure accurate conversion. Maintaining separate ana-

log and digital areas of the board, with the ADC12C080

between these areas, is required to achieve specified perfor-

mance.

The ground return for the data outputs (DRGND) carries the

ground current for the output drivers. The output current can

exhibit high transients that could add noise to the conversion

process. To prevent this from happening, the DRGND pins

should NOT be connected to system ground in close proximity

to any of the ADC12C080's other ground pins.

Capacitive coupling between the typically noisy digital circuit-

ry and the sensitive analog circuitry can lead to poor perfor-

mance. The solution is to keep the analog circuitry separated

from the digital circuitry, and to keep the clock line as short as

possible.

The effects of the noise generated from the ADC output

switching can be minimized through the use of 22Ω resistors

in series with each data output line. Locate these resistors as

close to the ADC output pins as possible.

Since digital switching transients are composed largely of

high frequency components, total ground plane copper

weight will have little effect upon the logic-generated noise.

This is because of the skin effect. Total surface area is more

important than is total ground plane area.

Generally, analog and digital lines should cross each other at

90° to avoid crosstalk. To maximize accuracy in high speed,

high resolution systems, however, avoid crossing analog and

digital lines altogether. It is important to keep clock lines as

short as possible and isolated from ALL other lines, including

other digital lines. Even the generally accepted 90° crossing

should be avoided with the clock line as even a little coupling

can cause problems at high frequencies. This is because oth-

er lines can introduce jitter into the clock line, which can lead

to degradation of SNR. Also, the high speed clock can intro-

duce noise into the analog chain.

Best performance at high frequencies and at high resolution

is obtained with a straight signal path. That is, the signal path

through all components should form a straight line wherever

possible.

Be especially careful with the layout of inductors and trans-

formers. Mutual inductance can change the characteristics of

the circuit in which they are used. Inductors and transformers

should not be placed side by side, even with just a small part

of their bodies beside each other. For instance, place trans-

formers for the analog input and the clock input at 90° to one

another to avoid magnetic coupling.

The analog input should be isolated from noisy signal traces

to avoid coupling of spurious signals into the input. Any ex-

ternal component (e.g., a filter capacitor) connected between

the converter's input pins and ground or to the reference input

pin and ground should be connected to a very clean point in

the ground plane.

All analog circuitry (input amplifiers, filters, reference compo-

nents, etc.) should be placed in the analog area of the board.

All digital circuitry and dynamic I/O lines should be placed in

the digital area of the board. The ADC12C080 should be be-

tween these two areas. Furthermore, all components in the

reference circuitry and the input signal chain that are con-

nected to ground should be connected together with short

21 www.national.com

ADC12C080

traces and enter the ground plane at a single, quiet point. All

ground connections should have a low inductance path to

ground.

7.0 DYNAMIC PERFORMANCE

To achieve the best dynamic performance, the clock source

driving the CLK input must have a sharp transition region and

be free of jitter. Isolate the ADC clock from any digital circuitry

with buffers, as with the clock tree shown in Figure 8. The

gates used in the clock tree must be capable of operating at

frequencies much higher than those used if added jitter is to

be prevented.

As mentioned in Section 6.0, it is good practice to keep the

ADC clock line as short as possible and to keep it well away

from any other signals. Other signals can introduce jitter into

the clock signal, which can lead to reduced SNR perfor-

mance, and the clock can introduce noise into other lines.

Even lines with 90° crossings have capacitive coupling, so try

to avoid even these 90° crossings of the clock line.

20211117

FIGURE 8. Isolating the ADC Clock from other Circuitry

with a Clock Tree

www.national.com 22

ADC12C080

Physical Dimensions inches (millimeters) unless otherwise noted

TOP View...............................SIDE View...............................BOTTOM View

32-Lead LLP Package

Ordering Numbers:

ADC12C080CISQ

NS Package Number SQA32A

23 www.national.com

ADC12C080

Notes

ADC12C080 12-Bit, 65/80 MSPS A/D Converter

THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION

(“NATIONAL”) PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY

OR COMPLETENESS OF THE CONTENTS OF THIS PUBLICATION AND RESERVES THE RIGHT TO MAKE CHANGES TO

SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITHOUT NOTICE. NO LICENSE, WHETHER EXPRESS,

IMPLIED, ARISING BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS

DOCUMENT.

TESTING AND OTHER QUALITY CONTROLS ARE USED TO THE EXTENT NATIONAL DEEMS NECESSARY TO SUPPORT

NATIONAL’S PRODUCT WARRANTY. EXCEPT WHERE MANDATED BY GOVERNMENT REQUIREMENTS, TESTING OF ALL

PARAMETERS OF EACH PRODUCT IS NOT NECESSARILY PERFORMED. NATIONAL ASSUMES NO LIABILITY FOR

APPLICATIONS ASSISTANCE OR BUYER PRODUCT DESIGN. BUYERS ARE RESPONSIBLE FOR THEIR PRODUCTS AND

APPLICATIONS USING NATIONAL COMPONENTS. PRIOR TO USING OR DISTRIBUTING ANY PRODUCTS THAT INCLUDE

NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS.

EXCEPT AS PROVIDED IN NATIONAL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NATIONAL ASSUMES NO

LIABILITY WHATSOEVER, AND NATIONAL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO THE SALE

AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR

PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY

RIGHT.

LIFE SUPPORT POLICY

NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR

SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL

COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:

Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and

whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected

to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform

can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness.

National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. All other

brand or product names may be trademarks or registered trademarks of their respective holders.

For the most current product information visit us at www.national.com

National Semiconductor

Americas Customer

Support Center

Email:

new.feedback@nsc.com

Tel: 1-800-272-9959

National Semiconductor Europe

Customer Support Center

Fax: +49 (0) 180-530-85-86

Email: europe.support@nsc.com

Deutsch Tel: +49 (0) 69 9508 6208

English Tel: +49 (0) 870 24 0 2171

Français Tel: +33 (0) 1 41 91 8790

National Semiconductor Asia

Pacific Customer Support Center

Email: ap.support@nsc.com

National Semiconductor Japan

Customer Support Center

Fax: 81-3-5639-7507

Email: jpn.feedback@nsc.com

Tel: 81-3-5639-7560

www.national.com

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,

and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should

obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are

sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard

warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where

mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and

applications using TI components. To minimize the risks associated with customer products and applications, customers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,

or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information

published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a

warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual

property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied

by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive

business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional

restrictions.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all

express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not

responsible or liable for any such statements.

TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably

be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing

such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products

and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be

provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in

such safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are

specifically designated by TI as military-grade or "enhanced plastic."Only products designated by TI as military-grade meet military

specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at

the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are

designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated

products in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Audio www.ti.com/audio Communications and Telecom www.ti.com/communications

Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers

Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps

DLP®Products www.dlp.com Energy and Lighting www.ti.com/energy

DSP dsp.ti.com Industrial www.ti.com/industrial

Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical

Interface interface.ti.com Security www.ti.com/security

Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Mobile Processors www.ti.com/omap

Wireless Connectivity www.ti.com/wirelessconnectivity

TI E2E Community Home Page e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265