ne | ~ | | | | | Lee i a a eset eee ay are 47s Ato.1 240.05 -O-@ a | vr 0-6-6 0.8%! / RECOMMENDED PCB LAYOUT PCB THICKNESS t=1.6 P10.05 | TABLE 1 PART NO, LPC-APMe ( ) > > LPC-18PMe 16 ( ) LPC-20PM2 ( ) () 2 | LPC-26PMe2 C4 MPM} ] O1 1] | co}- POP MEM A TA BLE e@ PART NO. PLATING L PC- (n) PMe TIN/LEAD 2um L PC- (n) PM2G GOLD 0.2m NO TET. *n SHOWS NUMBER OF CONTACTS. 2.AS FOR THE DIMENTION, SEE TABLE #1. A /A | AR06.200T. } ADD P/N AND PLATING} 2 | CONTACT CRONge | on | SEE TABLE #2 /A\ ABIK. Ki26 POS. ADD | 1 | INSULATOR PAG6B Po ee | BURA LTR.ADATE| BY |REV. DESCRIPT No, PART NAME MATERIAL QTY FINISH NOTE DATE SCALE UNIT SRD. A. P JAN. 25 (1999) 5/1 mm (INCH) oo HONDA TSUSHIN KOGYO CO., LTD. APP, DATE@REV. DR, DE. CHK. CHK. APP. NAME MALE CONNECTOR T bda |\T bla | ~ ah ai [Part No.| Lpc-()pme() aw REY 1D= LPC-@PM2@ EB