MEMSIC MMC246xMT Rev D Page 1 of 15 5/30/2014
±6 Gauss, Low Noise 2-axis
Magnetic Sensor
MMC246xMT
FEATURES
Fully integrated 2-axis magnetic sensor and
electronic circuits requiring fewer external
components
Superior Dynamic Range and Accuracy:
±6 G FSR with 16/14 bit operation
0.25 mG per LSB resolution
0.8 mG total RMS noise
Enables heading accuracy <1º
Wide operating Voltage ( 1.62 V ~ 3.6 V )
Single 1.8 V supply capable
1.8 V I/O compatibility.
Low power consumption ( 50 µA @ 7Hz )
20 nA power down current function
SET/RESET Function
Allows for elimination of temperature
variation induced offset error (Null Field
output)
Clears the sensors of residual
magnetization resulting from exposure
to strong external fields
On-chip sensitivity temperature
compensation
I
2
C Slave, FAST (400 KHz) mode
Low Profile package 2 x 2 x 1 mm
RoHS compliant
APPLICATIONS
Electronic Compassing
GPS Navigation Assist
Magnetic Field Measurement
DESCRIPTION
The MMC246xMT is a complete 2-axis magnetic sensor
with on-chip signal processing and integrated I
2
C bus.
The device can be connected directly to a
microprocessor, eliminating the need for A/D converters
or timing resources. It can measure magnetic fields
within the full scale range of ±6 G (gauss), with 0.25 mG
per LSB resolution in 16 bit operation mode and 0.8 mG
total RMS noise, enabling heading accuracies of <1° in
electronic compass applications.
Contact MEMSIC for access to advanced calibration
and tilt-compensation algorithms.
An integrated SET/RESET function provides for the
elimination of error due to Null Field output change with
temperature. In addition it clears the sensors of any
residual magnetic polarization resulting from exposure
to strong external magnets. The SET/RESET function
can be performed for each measurement or periodically
as the specific application requires.
The MMC246xMT is packaged in an ultra-small low
profile LGA package (2 x 2 x 1 mm) and operates over
a temperature range from -40 to 85 °C.
The MMC246xMT provides an I
2
C digital output with
400 KHz, fast mode operation.
Information furnished by MEMSIC is believed to be accurate and reliable.
However, no responsibility is assumed by MEMSIC for its use, or for any
infringements of patents or other rights of third parties which may result from
its use. No license is granted by implication or otherwise under any patent or
patent rights of MEMSIC.
MEMSIC, Inc.
One Technology Drive, Suite 325, Andover, MA01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
MEMSIC MMC246xMT Rev D Page 2 of 15 5/30/2013
SPECIFICATIONS:
(Measurements at 25 °C, unless otherwise noted; V
DA
= V
DD
= 1.8 V unless otherwise specified)
Parameter
Conditions
Min
Typ
Max
Units
Field Range (each axis) Total applied field ±6 gauss
Supply Voltage V
DA
1.62
1
1.8 3.6 V
V
DD
(I
2
C interface) 1.62
1
1.8 3.6 V
Supply Voltage rising time 5.0 mS
Supply Current
2
(7measurements/second)
(Max = Mean +4σ at 25 C)
BW[1:0]=00, 16bit mode 50 60 µA
BW[1:0]=01, 16bit mode 25 30 µA
BW[1:0]=10, 14bit mode 20 25 µA
Power Down Current
3
20 50 nA
Operating Temperature -40 85 °C
Storage Temperature -55 125 °C
Linearity Error
(Least Squares Line) H
applied
±6 gauss
H
±4 gauss 0.25
0.15 %FS
Hysteresis ±6 gauss 0.1 %FS
Repeatability Error ±6 gauss 0.25 %FS
Alignment Error
±
0.5
±
1.0 degrees
Transverse Sensitivity ±0.2 ±1.0 %
Total RMS Noise BW[1:0]=00, 16 bit mode 0.8 mG
BW[1:0]=01, 16 bit mode 1.0 mG
BW[1:0]=10, 14 bit mode 2.5 mG
Output resolution 16/14 bits
Heading accuracy
4
±0.5 ±1.0 degrees
Sensitivity
±6 gauss -3 +3 %
14 bit mode 1024 counts/G
16 bit mode 4096 counts/G
Initial sensitivity matching
( X to Y) ±1 %
Sensitivity Change over
Temperature -40 ~ 85 °C
±6 gauss -5 +5 %
Sensitivity Change over
Temperature Matching ( X to Y)
±1 %
Null Field Output ±6 gauss -0.2 +0.2 G
14 bit mode 8192 counts
16 bit mode 32768 counts
Null Field Output Change over
Temperature
5
Delta from 25°C
±120 mG
Null Field Accuracy over
temperature using SET/RESET
-40 to 85C ±2 mG
Disturbing Field 8 G
Maximum Exposed Field 10000 G
1
1.62 V is the minimum operation voltage. Both V
DA
and V
DD
should be equal to or greater than 1.62 V
2
Supply current is proportional to the number of measurements performed per second. See page 2 and 6 for
additional information.
3
See Supplemental Performance Characteristics for typical current change over temperature
4
Noise, resolution and accuracy specifications enable a typical heading accuracy calculation of 0.5 degrees. Actual
heading accuracy depends upon user system design and algorithms.
5
This error can be eliminated by using SET and RESET to determine the actual null field output at any temperature
from -40 to 85 °C
MEMSIC MMC246xMT Rev D Page 3 of 15 5/30/2013
SUPPLEMENTAL PERFORMANCE CHARACTERISITCS
(Vdd = 1.8 V)
MEMSIC MMC246xMT Rev D Page 4 of 15 5/30/2013
I
2
C INTERFACE I/O CHARACTERISTICS (VDD = 1.8 V)
Parameter
Symbol
Test Condition
Min.
Typ.
Max.
Unit
Logic Input Low Level V
IL
-0.5 0.3* V
DD
V
Logic Input High Level V
IH
0.7*V
DD
V
DD
V
Hysteresis of Schmitt input V
hys
0.2 V
Logic Output Low Level V
OL
0.4 V
Input Leakage Current I
i
0.1V
DD
<V
in
<0.9V
DD
-10 10 µA
SCL Clock Frequency f
SCL
0 400 kHz
START Hold Time t
HD;STA
0.6 µS
START Setup Time t
SU;STA
0.6 µS
LOW period of SCL t
LOW
1.3 µS
HIGH period of SCL t
HIGH
0.6 µS
Data Hold Time t
HD;DAT
0 0.9 µS
Data Setup Time t
SU;DAT
0.1 µS
Rise Time t
r
From V
IL
to
V
IH
0.3 µS
Fall Time t
f
From V
IH
to
V
IL
0.3 µS
Bus Free Time Between STOP and
START t
BUF
1.3 µS
STOP Setup Time t
SU;STO
0.6 µS
Timing Definition
ABSOLUTE MAXIMUM RATINGS*
Supply Voltage (V
DD
) ………………...-0.5 to +3.6 V
Storage Temperature ……….……-55 to +125 °C
Maximum Exposed Field ………………..10000 Gauss
*Stresses above those listed under Absolute Maximum Ratings may cause
permanent damage to the device. This is a stress rating only; the functional
operation of the device at these or any other conditions above those indicated
in the operational sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect the
device’s reliability.
SDA
SCL
t
f
tr
t
LOW
t
HD;STA tHD;DAT
t
HIGH
tSU;DAT
t
SU;STA
tHD;STA
S
r
S
t
SU;STO
t
SP
S
P
tf
tr
t
BUF
MEMSIC MMC246xMT Rev D Page 5 of 15 5/30/2013
PIN DESCRIPTIONS: LGA Package
Pin Name Description I/O
1 VDA Power Supply P
2 Vpp Factory Use Only, Leave
Open NC
3 TEST Factory Use Only, Leave
Open/No Connection NC
4 C+ Short together I
5 C- I
6 CAP Connect to External Capacitor I
7
SCL
Serial Clock Line for I
2
C bus
I
8 VDD Power Supply for I
2
C bus P
9 SDA Serial Data Line for I
2
C bus I/O
10 VSA Connect to Ground P
All parts are shipped in tape and reel packaging with
9000 pieces per 13” reel or 3000 pieces per 7” reel.
Caution: ESD (electrostatic discharge) sensitive
device. HBM Class 1C; CDM Class C4
ORDERING GUIDE:
MMC246xMT
Note: I2C Address 0 is available in any quantity. Other
I2C addresses are available in minimum order
quantities of 3000.
MARKING ILLUSTRATION:
“Number” means the 1
st
two digits of the 1
st
line in
the marking. The 3
rd
digit
in the 1
st
line represents
Year Code (2 stands for
2012), the 2
nd
line
represents Lot Number.
Small circle indicates pin
one (1).
THEORY OF OPERATION
The Anisotropic Magneto-Resistive (AMR) sensors
are special resistors made of permalloy thin film
deposited on a silicon wafer. During manufacturing a
strong magnetic field is applied to the film to orient its
magnetic domains in the same direction, establishing
a magnetization vector. Subsequently, an external
magnetic field applied perpendicularly to the sides of
the film causes the magnetization to rotate and
change angle. This effect causes the film’s resistance
to vary with the intensity of the applied magnetic field.
The MEMSIC AMR sensor is incorporated into a
Wheatstone bridge configuration to maximize Signal
to Noise ratio. A change in magnetic field produces a
proportional change in differential voltage across the
Wheatstone bridge.
However, the influence of a strong magnetic field
(more than 16 Gauss) in any direction could upset, or
flip, the polarity of the film, thus changing the sensor
characteristics. A strong restoring magnetic field must
be applied momentarily to restore, or set, the sensor
characteristics. The MEMSIC magnetic sensor has an
on-chip magnetically coupled strap: a SET/RESET
strap pulsed with a high current, to provide the
restoring magnetic field
Number
2x Part number
20
MMC2460M
T
21 MMC2461MT
22 MMC2462MT
23 MMC2463MT
24 MMC2464MT
25
MMC246
5
M
T
26 MMC2466MT
27
MMC246
7
M
T
Address code: 0~7
Code 7bit I
2
C Address
0 0110000b
1 0110001b
2 0110010b
3 0110011b
4 0110100b
5 0110101b
6 0110110b
7 0110111b
Package type:
Code Type
T LGA10
RoHS compliant
Performance Grade:
Code Performance Grade
M Temp compensated
MEMSIC MMC246xMT Rev D Page 6 of 15 5/30/2013
PIN DESCRIPTIONS
V
DA
This is the supply input for the circuits and the
magnetic sensor. The DC voltage must be between
1.62 and 3.6 V. A 1 uF by-pass capacitor is
recommended.
V
SA
– This is the ground pin for the magnetic sensor.
SDA – This pin is the I
2
C serial data line, and
operates in FAST (400 KHz) mode.
SCL – This pin is the I
2
C serial clock line, and
operates in FAST (400 KHz) mode.
V
DD
– This is the power supply input for the I
2
C bus,
and is 1.8 V compatible. DC voltage must be between
1.62 to 3.6 V. A 1 uF by-pass capacitor is
recommended.
TEST – Factory use only. No Connection.
CAP –Connect a 4.7 uF low ESR (typically smaller
than 0.2ohm) ceramic capacitor.
Vpp – Factory use only. No Connection
C+, C- –Short together on PCB for normal mode
operation.
EXTERNAL CIRCUITRY CONNECTION
(Top View)
HARDWARE DESIGN CONSIDERATION
Provide adequate separation distance to devices
that contain permanent magnets or generate
magnetic fields (IE speakers, coils, inductors...)
The combined magnetic field to be measured and
interference magnetic field must be less than the
full scale range of the MMC2460xMT (±6 G).
Provide adequate separation distance to current
carrying traces. Do not route current carrying
traces under the sensor or on the other side of the
PCB opposite the device.
Do not cover the sensor with magnetized material
or material that may become magnetized, (IE,
shield box, LCD, battery, iron bearing material…).
Do not place the device opposite magnetized
material or material that may become magnetized
located on the other side of the PCB.
Please refer to MEMSIC application note: AN-200-20-
0018 (MEMSIC Magnetic Sensor Hardware Design
Layout Guideline for Electronic Device).
POWER CONSUMPTION
The power consumed by the device is proportional to
the number of measurements taken per second. For
example, when in 16 bit mode The MEMSIC magnetic
sensor consumes 50µA (typical) at 1.8 V while making
7 measurements per second. If only 2 measurements
per second are performed, the current will be 50 * 2 /
7=14 µA.
The SET and RESET operations also contribute to
power consumption. Each time a SET or RESET is
executed the external 4.7uF capacitor delivers a
current pulse into an internal coil. This capacitor is
pre-charged to 3V using an internal dc-dc converter
from the VDA supply. Factoring in leakage and circuit
efficiency, a net charge of approximately 25uC is
required for each SET or RESET operation.
Therefore, as an example, if a SET and RESET
operation are initiated once every 10 seconds, the
average current would be 2 * 25 uC / 10 sec = 5 uA.
The peak current drawn from the VDA supply during
the pre-charge is approximately 1mA.
I
2
C INTERFACE DESCRIPTION
A slave mode I
2
C circuit has been implemented into
the MEMSIC magnetic sensor as a standard interface
for customer applications. The A/D converter and
MCU functionality have been added to the MEMSIC
sensor, thereby increasing ease-of-use, and lowering
power consumption, footprint and total solution cost.
The I
2
C (or Inter IC bus) is an industry standard bi-
directional two-wire interface bus. A master I
2
C
device can operate READ/WRITE controls to an
unlimited number of devices by device addressing.
The MEMSIC magnetic sensor operates only in a
slave mode, i.e. only responding to calls by a master
device.
1 uF
Power II
Power
1 uF
4.7uF
CAP C- C+
TEST
Vpp SCL
V
DD
SDA V
SA
V
DA
MEMSIC MMC246xMT Rev D Page 7 of 15 5/30/2013
I
2
C BUS CHARACTERISTICS
I
2
C Bus
The two wires in the I
2
C bus are called SDA (serial
data line) and SCL (serial clock line). In order for data
transfer to start, the bus has to be free, which is
defined by both wires in a HIGH output state. Due to
the open-drain/pull-up resistor structure and wired
Boolean “AND” operation, any device on the bus can
pull lines low and overwrite a HIGH signal. The data
on the SDA line has to be stable during the HIGH
period of the SCL line. In other words, valid data can
only change when the SCL line is LOW.
Note: Rp selection guide: 4.7 kOhm for a short I
2
C
bus length (less than 4 inches), and 10 kOhm for a
bus length less than 2 inches.
REGISTER MAP
Register Name
Address
Description
Xout Low 00H Xout LSB
Xout High 01H Xout MSB
Yout Low 02H Yout LSB
Yout High 03H Yout MSB
Status 06H Device status
Internal control 0 07H Control register 0
Internal control 1 08H Control register 1
Product ID 0 10H Product ID
R0 1BH Factor used register
R1 1CH Factory used register
R
2
1
D
H
Factory
used register
R3 1EH Factory used register
R
4
1
F
H
Factory used register
Product ID 1
20
H
Product ID
Register Details
Xout High, Xout Low
Xout
Low
7 6 5 4 3 2 1 0
Addr: 00H Xout[7:0]
Reset Value Xout[7:0]
Mode R
Xout
High
7 6 5 4 3 2 1 0
Addr: 01H Xout[15:8]
Reset Value Xout[15:8]
Mode R
X-axis output, unsigned format, the 2LSB of Xout Low will be fixed as “0” at 14bits mode.
Yout High, Yout Low
Y
out
Low
7 6 5 4 3 2 1 0
Addr: 02H Yout[7:0]
Reset Value Yout[7:0]
Mode R
Rp Rp
SDA
(Serial Data
Line)
SCL (Serial Clock
Line)
DEVICE 1
DEVICE 2
VDD
MEMSIC MMC246xMT Rev D Page 8 of 15 5/30/2013
Y
out
High
7 6 5 4 3 2 1 0
Addr: 03H Yout[15:8]
Reset Value Yout[15:8]
Mode R
Y-axis output, unsigned format, the 2LSB of Yout Low will be fixed as “0” at 14bits mode.
Status
Device Status
7 6 5 4 3 2 1 0
Addr: 06H Reserved ST_XY
_OK Rd_Done
Pump
On Meas
Done
Reset Value 5’h0 0 0 0
Mode R
Bit
Name
Description
Meas Done Indicates measurement event is completed. This bit should be checked before
reading the output
Pump On Indicates the charge pump status, after Refill Cap command, the charge pump will
start running, and this bit will stays high, it will be reset low after the cap reaches its
target voltage and the charge pump is shut off.
Rd_Done Indicates the chip was able to successfully read its memory.
ST_XY_OK Indicates self-test OK once this bit is “1”.
Internal Control 0
Control
Register 0 7 6 5 4 3 2 1 0
Addr: 07H Refill
Cap RESET SET No
Boost CM
Freq1 CM
Freq0 Cont
Mode
On
TM
Reset Value 0 0 0 0 0 0 0 0
Mode W W W W W W W W
Bit
Name
Description
TM Take measurement, set ‘1’ will initiate measurement.
Cont Mode On When set to a 1 this enables the Continuous Measurement Mode. The chip will
periodically take measurements of the magnetic field; the frequency of these
measurements is determined by bits CM Freq<1:0>.
CM Freq0 These bits determine how often the chip will take measurements in Continuous
Measurement Mode.
CM Freq1 CM Freq0 Frequency
0 0 1.5 Hz
0 1 12 Hz
1 0 25 Hz
1 1 50 Hz
CM Freq1
No Boost Setting this bit high will disable the charge pump and cause the storage capacitor to
be charged off VDD.
SET Writing “1” will set the sensor by passing a large current through Set/Reset Coil
RESET Writing “1” will reset the sensor by passing a large current through Set/Reset Coil at
a reversed direction
Refill Cap Writing “1” will recharge the capacitor at CAP pin, it is requested to be issued before
SET/RESET command.
MEMSIC MMC246xMT Rev D Page 9 of 15 5/30/2013
Internal Control 1
Control
Register 1 7 6 5 4 3 2 1 0
Addr: 08H
SW_RST
Temp_tst
ST_XY
Z
-
inhibit
Y
-
inhibit
X
-
inhibit
BW1
BW0
Reset Value
2’h0
0
0
0
0
0
0
Mode W W W W W W W W
Bit
Name
Description
BW0 Output resolution
BW1
BW0
Output Resolution
M
easurement Time
0
0
16bits
7.92mS
0 1 16bits 4.08mS
1
0
14bits
2.16mS
1
1
reserved
BW1
X-inhibit Factory-use Register
Y-inhibit
Z-inhibit Need to be set to “1”
ST_XY Self-test check, write “1” to this bit and execute a TM command, after TM is
completed the result can be read as bit ST_XY_OK. Write this bit to 0 to return to
normal operation
Temp_tst Factory-use Register
SW_RST Writing 1”will cause the part to reset, similar to power-up. It will clear all registers
and also re-read OTP as part of its startup routine.
R0, R1, R2, R3, R4
R0
7 6 5 4 3 2 1 0
Addr: 1BH Factory-use Register
Reset Value Factory-use Register
Mode R
R1
7 6 5 4 3 2 1 0
Addr: 1CH Factory-use Register
Reset Value Factory-use Register
Mode R
R2
7 6 5 4 3 2 1 0
Addr: 1DH Factory-use Register
Reset Value Factory-use Register
Mode R
R3
7 6 5 4 3 2 1 0
Addr: 1EH Factory-use Register
Reset Value Factory-use Register
Mode R
R
4
7 6 5 4 3 2 1 0
Addr: 1FH Factory-use Register
Reset Value Factory-use Register
Mode R
MEMSIC MMC246xMT Rev D Page 10 of 15 5/30/2013
Product ID 0
Product ID 0
7 6 5 4 3 2 1 0
Addr: 10H Product ID0[2:0] Factory-use Register
Reset Value X X X Factory-use Register
Mode R R R R R R R R
XXX: I
2
C address code.
Product ID 1
Product ID 1
7 6 5 4 3 2 1 0
Addr: 20H Product ID1[7:0]
Reset Value 0 0 0 0 0 1 1 1
Mode R R R R R R R R
DATA TRANSFER
A data transfer is started with a “START” condition
and ended with a “STOP” condition. A “START”
condition is defined by a HIGH to LOW transition on
the SDA line while SCL line is HIGH. A “STOP”
condition is defined by a LOW to HIGH transition on
the SDA line while the SCL line is held HIGH. All data
transfer in I
2
C system are 8-bits long. Each byte has
to be followed by an acknowledge bit. Each data
transfer involves a total of 9 clock cycles. Data is
transferred starting with the most significant bit (MSB).
After a START condition, the master device calls a
specific slave device by sending its 7-bit address with
the 8
th
bit indicating that either a READ or WRITE
operation will follow, [1] for READ and [0] for WRITE.
The MEMSIC device 7-bit device address is
[x110xxx] where the three LSB’s are pre-programmed
into the MMC246xMT by the factory and they are
indicated on the package as shown in the previous
section “Package Marking Illustration”. A total of 8
different addresses can be pre-programmed into
MEMSIC device by the factory. This variation of I
2
C
address avoids a potential address conflict, either by
ICs from other manufacturers or by other MEMSIC
devices on the same bus
The initial addressing of the slave is always followed
by the master writing the number of the slave register
to be read or written, so this initial addressing always
indicates a WRITE operation by sending [0110xxx].
After being addressed, the MEMSIC device being
called should respond by an “Acknowledge” signal by
pulling SDA line LOW. Subsequent communication
bytes can either be:
a) the data to be written to the device register, or
b) Another START condition followed by the
device address indicating a READ operation
[1110xxx], and then the master reads the
register data.
Multiple data bytes can be written or read to
numerically sequential registers without the need of
another START condition. Data transfer is terminated
by a STOP condition or another START condition.
Two detailed examples of communicating with the
MEMSIC device are listed below for the actions of
acquiring a magnetic field measurement and
magnetizing the sensor.
POWER STATE
MEMSIC MR Sensor will enter power down mode
automatically after data acquisition is finished.
VDA VDD Power State
OFF(0 V) OFF(0 V) OFF(0V), no power
consumption
OFF(0V) 1.62~3.6 V OFF(0V), power
consumption is less than
1uA.
1.62~3.6 V OFF(0 V) Power consumption is not
predictable, not
recommended state.
1.62~3.6 V 1.62~3.6 V Normal operation mode,
device will enter into
power down mode
automatically after data
acquisition is finished
EXAMPLE MEASUREMENT
First cycle: A START condition is established by the
Master Device followed by a call to the slave address
[0110xxx] with the eighth bit held low to indicate a
WRITE request. Note: [xxx] is determined by factory
programming and a total of 8 different addresses are
available.
Second cycle: After an acknowledge signal is received
by the master device (MEMSIC device pulls SDA line
low during 9
th
SCL pulse), the master device sends
the address of Control Register 0 or [00000111] as the
target register to be written. The MEMSIC device
should acknowledge receipt of the address (9
th
SCL
pulse, SCL pulled low).
Third cycle: The Master device writes to the Internal
Control Register 0 the code [00000001] (TM high) to
initiate data acquisition. The MEMSIC device should
send an Acknowledge and internally initiate a
MEMSIC MMC246xMT Rev D Page 11 of 15 5/30/2013
measurement (collect x and y data). A STOP condition
indicates the end of the write operation.
Fourth cycle: The Master device sends a START
command followed by the MEMSIC device’s seven bit
address, and finally the eighth bit set low to indicate a
WRITE. An Acknowledge should be send by the
MEMSIC device in response.
Fifth cycle: The Master device sends the MEMSIC
device’s Status Register [00000110] as the address to
read.
Sixth cycle: The Master device sends a START
command followed by the MEMSIC device’s seven bit
address, and finally the eighth bit set high to indicate a
READ. An Acknowledge should be send by the
MEMSIC device in response.
Seventh cycle: The Master device cycles the SCL line.
This causes the Status Register data to appear on
SDA line. Continuously read the Status Register until
the Meas Done bit (bit 0) is set to ‘1’. This indicates
that data for the x and y sensors is available to be
read.
Eighth cycle: The Master device sends a START
command followed by the MEMSIC device’s seven bit
address, and finally the eighth bit set low to indicate a
WRITE. An Acknowledge should be send by the
MEMSIC device in response.
Ninth cycle: The Master device sends a [00000000]
(Xout LSB register address) as the register address to
read.
Tenth cycle: The Master device calls the MEMSIC
device’s address with a READ (8
th
SCL cycle SDA line
high). An Acknowledge should be send by the
MEMSIC device in response.
Eleventh cycle: Master device continues to cycle the
SCL line, and each consecutive byte of data from the
X and Y registers should appear on the SDA line. The
internal memory address pointer automatically moves
to the next byte. The Master device acknowledges
each. Thus:
Eleventh cycle: LSB of X channel.
Twelfth cycle: MSB of X channel.
Thirteenth cycle: LSB of Y channel.
Fourteenth cycle: MSB of Y channel.
Master ends communications by NOT sending an
‘Acknowledge’ and also follows with a ‘STOP’
command.
EXAMPLE OF SET
First cycle: A START condition is established by the
Master Device followed by a call to the slave address
[0110xxx] with the eighth bit held low to indicate a
WRITE request. Note: [xxx] is determined by factory
programming and a total of 8 different addresses are
available.
Second cycle: After an acknowledge signal is received
by the master device (The MEMSIC device pulls the
SDA line low during the 9
th
SCL pulse), the master
device sends [00000111] as the target address
(Internal Control Register 0). The MEMSIC device
should acknowledge receipt of the address (9
th
SCL
pulse).
Third cycle: The Master device writes to the MEMSIC
device’s Internal Control Register 0 the code
[10000000] (Refill Cap) to prepare for SET action.*
A minimum of 50ms wait should be provided to allow
the MEMSIC device to finish its preparation for the
SET action.
Fourth cycle: The Master device writes to the
MEMSIC device’s Internal Control 0 register the code
[00100000] (SET bit) to initiate a SET action. The
MEMSIC device should send an Acknowledge.
EXAMPLE OF RESET*
First cycle: A START condition is established by the
Master Device followed by a call to the slave address
[0110xxx] with the eighth bit held low to indicate a
WRITE request. Note: [xxx] is determined by factory
programming and a total of 8 different addresses are
available.
Second cycle: After an acknowledge signal is received
by the master device (The MEMSIC device pulls the
SDA line low during the 9
th
SCL pulse), the master
device sends [00000111] as the target address
(Internal Control Register 0). The MEMSIC device
should acknowledge receipt of the address (9
th
SCL
pulse).
Third cycle: The Master device writes to the MEMSIC
device’s Internal Control Register 0 the code
[10000000] (Refill Cap) to prepare for RESET action.
A minimum of 50ms wait should be provided to allow
the MEMSIC device to finish its preparation for the
RESET action.
Fourth cycle: The Master device writes to the
MEMSIC device’s Internal Control 0 register the code
[01000000] (RESET bit) to initiate a RESET action.
The MEMSIC device should send an Acknowledge.
At this point, the MEMSIC AMR sensors have been
conditioned for optimum performance and data
measurements can commence.
Note *: The RESET action can be skipped for most
applications
MEMSIC MMC246xMT Rev D Page 12 of 15 5/30/2013
USING SET AND RESET TO REMOVE BRIDGE OFFSET
The integrated SET and RESET functions of the
MMC246xMT enables the user to remove the error
associated with bridge Null Field Output (Offset)
change as a function of temperature, thereby enabling
more precise heading measurements over a wider
temperature than competitive technologies. The SET
and RESET functions effectively alternately flip the
magnetic sensing polarity of the sensing elements of
the device.
The most accurate magnetic field measurements can
be obtained by using the protocol described as
follows:
1) Perform SET. This sets the internal
magnetization of the sensing resistors in the
direction of the SET field.
2) Perform MEASUREMENT. This measurement
will contain not only the sensors response to the
external magnetic field, H, but also the Offset; in
other words,
Output1 = +H + Offset.
3) Perform a RESET. This resets the internal
magnetization of the sensing resistors in the
direction of the RESET field, which is opposite to
the SET field (180
o
opposed).
4) Perform a MEASUREMENT. This measurement
will contain both the sensors response to the
external field and also the Offset. In other words,
Output2 = -H + Offset.
5) Finally, calculate H by subtracting the two
measurements and dividing by 2. This procedure
effectively eliminates the Offset from the
measurement and therefore any changes in the
Offset over temperature.
Note: To calculate and store the offset; add the two
measurements and divide by 2. This calculated offset
value can be subtracted from subsequent
measurements to obtain H directly from each
measurement.
Time between the SET/Measure and RESET/Measure
operation needs to be kept as short as possible to
minimize error induced by the applied magnetic field
changing between the two operations.
The two measurement examples below show how
using SET/RESET eliminates the error due to the
offset changing as a function of temperature. The
explanation only examines the X axis but is applicable
to all axes.
Given:
Sensitivity = 4096 counts/gauss
Offset = 8192 at 25 °C
Offset Temperature coefficient = 0.4mG/C
Hx = Applied Magnetic field = 0.5 gauss
Case 1: Measurement NOT using SET/RESET
At 25C a measurement is taken. The device reports
34816 (Offset + Hx * Sensitivity) => (32768 +
0.5Gauss * 4096Counts/Gauss). The measurement is
converted to magnetic field intensity using the
equation:
Hx = (Measurement – Offset) /Sensitivity = (34816
– 32768)/4096 = 0.5 gauss
At -40 °C a measurement is taken. The reported value
reported could be 34816 ±(0.4mGauss/C *
65C*4096counts/Gauss) = 34923 to 34710. Let us
assume it was 34923. Now the calculated magnetic
field is:
Hx = (34923 – 23768) /4096 = 0.525 gauss
There is 25 mGauss of error. This error is due to Null
Field output value changing with temperature.
Case 2: Measurement using SET/RESET
At 25C a SET command is issued and a measurement
is taken. The value reported is 34816 (32768 +
0.5Gauss * 4096 Counts/Gauss).
Now a RESET Command is issued which reverses the
polarity of the sensor and another measurement is
taken. The reported value is 30720, (32768 -
0.5Gauss* 4096 Counts/Gauss). The field is
calculated from the two measurements as:
Hx = (Measurement1 – Measurement2) /2
/Sensitivity = (34816 – 30720) /2 /4096 = 0.5 gauss
At -40C the same procedure is used to make the
measurement
A SET command is issued and a measurement is
taken. The value reported is 34923 (32768 +
0.5Gauss * 4096Counts/Gauss + 0.4mGauss/C *
65C*4096counts/Gauss).
Now a RESET Command is issued flipping the polarity
of the sensor and another measurement is taken. The
reported value is 30827, (32768 - 0.5Gauss *
4096Counts/Gauss + 0.4mGauss/C *
65C*4096Counts/Gauss).
Hx = (Measurement1 – Measurement2) /2
/Sensitivity = (34923 – 30827) /2 /4096 = 0.5 gauss
The temperature variation induced offset error has
been eliminated.
MEMSIC MMC246xMT Rev D Page 13 of 15 5/30/2013
OPERATING TIMING
Operating Timing Diagram
Parameter Symbol Min. Typ. Max. Unit
Time to operate device after Vdd valid t
op
5 mS
Time from Refill Cap to SET/RESET
6
t
RF
50 mS
Wait time to complete SET/RESET t
SR
1 mS
Wait time to complete measurement
t
TM
BW=00 10 mS
t
TM
BW=01 5 mS
t
TM
BW=10 3 mS
6
The device requires a maximum of 50 ms to charge the capacitor after receiving the Refill Cap command.
V
DD
S
T
R
T
R
T
R
S
T
R
t
RF
t
op
I
2
C
t
SR
t
TM
t
SR
t
TM
t
TM
t
TM
S
T
R
SET/
RESET
Take
M
easurement
Read data
Re
peat T & R
W
ait the device
to be
ready for next operation
MEMSIC MMC246xMT Rev D Page 14 of 15 5/30/2013
STORAGE CONDITIONS
Temperature: <30 °C
Humidity: <60%RH
Period: 1 year (after delivery)
Moisture Sensitivity Level: 3
Bake Prior to Reflow: Storage period more than 1 year, or humidity indicator card reads >10% at 23 ±5 ° C
Bake Procedure: Refer to J-STD-033
Bake to Soldering: <1 week under 30 °C, 60% RH condition
SOLDERING RECOMMENDATIONS
MEMSIC magnetic sensor is capable of withstanding an MSL3 / 260C solder reflow. Following is the reflow profile:
Max Gradient 2.8℃/s
260℃Peak Temperature For 10s
100
260Max
195
180180
50
Package Surface Temp(
)
Time(s)
300 350 400 450250200150100500
300
250
200
150
100
50
0
Slope 2/s Max
Note:
Reflow is limited by 2 times
The second reflow cycle should be applied after device has cooled down to 25 °C (room temperature)
This is the reflow profile for Pb free process
The peak temperature on the sensor surface should be limited under 260 °C for 10 seconds.
Solder paste’s reflow recommendation should be followed to get the best SMT quality.
If the part is mounted manually, please ensure the temperature could not exceed 260 °C for 10 seconds.
MEMSIC MMC246xMT Rev D Page 15 of 15 5/30/2013
PACKAGE DRAWING (LGA package)
Positive X and Y direction indicated above is after a SET operation. Positive X and Y direction is reversed
after a RESET operation.
LAND PATTERN
10X0.35±0.05
10X0.3±0.05
2.0±0.1
3X0.52
1.56±0.05
2.0±0.1
SCL
VDD
CAP
C-
C+
VSA SDA
VPP
VDA
TEST
1.52±0.05