LXES15AAA1-153 - MURATA MANUFACTURING

Ceramic ESD Protection Device LXES**A series

Document No. LX–1-1111

Rev1.3

p1/18

MURATA MFG. CO., LTD.

1. This specification shall be applied to the ESD Protection Device.

LXES15AAA1-133

LXES15AAA1-153

LXES03AAA1-154

LXES03AAA1-193

2. Part Number Configuration

LXES 15 A AA 1 – 133

① ② ③ ④ ⑤ ⑥

① Product ID （LXES = ESD Protection device）

② Dimension Code

Unit : mm

Code

Dimension

03

0.6 x 0.3

15

1.0 x 0.5

③ Type (A:Ceramic ESD)

④ Control Code

⑤ Number of channel

⑥ Serial Number

※RoHS Compliant

Halogen free

T/R only.

MSL 1

p2/18

MURATA MFG. CO., LTD.

3. CONSTRUCTION, DIMENSIONS

3 - 1 DIMENSIONS

Unit : mm

Size L W T a b

0603 0.60±0.03

0.30±0.03

0.33 max

0.15±0.05

0.20 min

1005 1.00±0.05

0.50±0.05

0.33 max

0.20±0.10

0.40 min

3 - 2 Circuit Diagram

TERMINAL CONFIGURATION

This device is bi-directional.

3 - 3 Product Weight

P/N Weight [mg]

LXES03AAA1-154

LXES03AAA1-193 0.2

LXES15AAA1-133

LXES15AAA1-153 0.5

p3/18

MURATA MFG. CO., LTD.

4. CHARACTERISTICS

4 - 1 - 1 Ratings (LXES15AAA1-133)

Parameter Symbol Ratings Units

Rated Voltage VDC 15 V

VAC 0±40※ V

Operating Temperature T

OP

-40 to +85

o

C

Storage Temperature T

STO

-40 to +85

o

C

※Frequency : >1MHz

4 - 1 - 2 Ratings (LXES15AAA1-153/ LXES03AAA1-154)

Parameter Symbol Ratings Units

Rated Voltage VDC 4 V

VAC 0±25※ V

Operating Temperature T

OP

-40 to +85

o

C

Storage Temperature TSTO -40 to +85

o

C

※Frequency : >1MHz

4 - 1 - 3 Ratings (LXES03AAA1-193)

Parameter Symbol Ratings Units

Rated Voltage VDC 6.3 V

VAC 0±80※ V

Operating Temperature T

OP

-40 to +85

o

C

Storage Temperature TSTO -40 to +85

o

C

※Frequency : >1MHz, 1/8 duty

4 - 2 Electrical Characteristics (T=25 deg.C)

Chip

size

[ mm ]

Part No. Capacitance

ESD

IEC 61000-4-2

(Air)

ESD

IEC 61000-4-2

(Contact)

Symbol C - -

Unit [pF] kV kV

Test condition 1MHz

Vbias=0V

0603 LXES03AAA1-154

0.05 typ ±15 ±15

LXES03AAA1-193

0.05typ ±15 ±15

1005 LXES15AAA1-133

0.05 typ ±15 ±15

LXES15AAA1-153

0.05 typ ±15 ±15

p4/18

MURATA MFG. CO., LTD.

4 - 3 Typical Characteristic

LXES03AAA1-154

ESD Waveform (IEC61000-4-2：8kV Contact) Voltage – Capacitance Characteristic

LXES03AAA1-193

ESD Waveform (IEC61000-4-2：8kV Contact) Voltage – Capacitance Characteristic

LXES15AAA1-133

ESD Waveform (IEC61000-4-2：8kV Contact) Voltage – Capacitance Characteristic

0

50

100

150

200

250

-10.0 0.0 10.0 20.0 30.0 40.0 50.0

Voltage [V]

Tine [nsec]

0

50

100

150

200

250

300

-10 0 10 20 30 40 50

Clamping voltage (V)

Time (nsec.)

0.00

0.02

0.04

0.06

0.08

0.10

-15 -10 -5 0 5 10 15

Cline(pF)

VDC(V)

0

50

100

150

200

250

300

350

400

-10 0 10 20 30 40 50

Voltage [V]

Time [nsec]

p5/18

MURATA MFG. CO., LTD.

LXES15AAA1-153

ESD Waveform (IEC61000-4-2：8kV Contact) Voltage – Capacitance Characteristic

0

50

100

150

200

250

300

-10 0 10 20 30 40 50

Voltage [V]

Time [nsec]

p6/18

MURATA MFG. CO., LTD.

5. Reliability Test

No.

Items Specifications Test Methods Number

Result

(Fail)

1

Vibration Resistance

No severe damages

Satisfy

dimension

specifications

Solder specimens on the testing jig (glass fluorine

boards) shown in appended Fig.1 by a Pb free solder.

The soldering shall be done either by iron or reflow and

be conducted with care so that the soldering is uniform

and free of defect such as by heat shock.

Frequency : 10~2000 Hz

Acceleration : 196 m/s2

Direction : X,Y,Z 3 axis

Period : 2 h on each directionTotal 6 h.

22 G

(0)

2

Shock

Solder specimens on the testing jig (glass fluorine

boards) shown in appended Fig.1 by a Pb free solder.

The soldering shall be done either by iron or reflow and

be conducted with care so that the soldering is uniform

and free of defect such as by heat shock

Acceleration : 14,700 m/s2

Period : 0.3 ms.

Cycle : 3 times

22 G

(0)

3

Deflection

Solder specimens on the testing jig (glass epoxy

boards) shown in appended Fig.2 by a Pb free solder.

The soldering shall be done either by iron or reflow and

be conducted with care so that the soldering is uniform

and free of defect such as by heat shock.

No damage with 1.6mm deflection

22 G

(0)

4

Soldering strength

(Push Strength)

LXES03A series

2N Minimum

LXES15A series

3N Minimum

Solder specimens onto test jig shown below. Apply

pushing force at 0.5mm/s until electrode pads are

peeled off or ceramics are broken. Pushing force is

applied to longitudinal direction.

22 G

(0)

5

Solderability of Termination

95% of the

terminations is to be

soldered evenly and

continuously.

Immerse specimens first an ethanol solution of rosin,

then in a Pb free solder solution for 3±0.5 sec. at

245±5 °C.

Preheat : 100-120 °C, 60 sec.

Solder Paste : Sn-3.0Ag-0.5Cu

Flux : Solution of ethanol and rosin

(25 % rosin in weight proportion)

22 G

(0)

6

Resistance

to Soldering

Heat

(Reflow)

Appearance

Electrical

specifications

No

severe damages

Satisfy specifications

listed in paragraph 4-

2 over operational

temperature range

Preheat Temperature : 150-200 °C

Preheat Period : 120+/-60 s

High Temperature : 217℃

High Temp. Period : 105+/-45 s

Peak Temperature : 260+0/-5 °C

Specimens are soldered twice with the above condition,

and then kept in room condition for 24 h before

measurements.

22 G

(0)

Pushing Direction

Jig

Specimen

p7/18

MURATA MFG. CO., LTD.

No.

Items Specifications Test Methods Number

Result

(Fail)

7

High Temp.

Exposure

Appeara

nce

Electrical

Specifica

tions

No severe damages

Satisfy specifications listed in

paragraph 4-2 over

operational temperature

range

Temperature : 85+2/-0 °C

Period : 1000+48/-0 h

Room Condition : 2 ~ 24 h 22 G

(0)

8

Temperature

Cycle

Set the specimens to the

supporting jig in the same

manner and under the same

conditions as Fig.1 and conduct

the 100 cycles according to the

temperatures and time shown in

the following table. Set it for 2 to

24 h at room temperature, then

measure.

Step

Temp(°C) Time(min)

1

Min.

Operating

Temp.+0/-3

30±3

2

Max.

Operating

Temp.+3/-0

30±3

22 G

(0)

9

Humidity

(Steady

State)

Temperature：85±2 ℃

Humidity：80～90 %RH

Period：1000+48/-0 h

Room Condition：2 ～ 24 h 22 G

(0)

10

Low Temp.

Exposure Temperature：-40±2 ℃

Period：1000+48/-0 h

Room Condition：2 ～ 24 h 22 G

(0)

Fig. 1

Reference Land Pattern

Unit : mm

Size a b c

0603 0.25 0.8 0.3

1005 0.4 1.2 0.5

Notes : this land layout is for reference purpose only.

p8/18

MURATA MFG. CO., LTD.

Fig. 2

Testing board

100

40

Mounted situation

Test method

Land

Land pattern is same as figure1

Glass-fluorine board t＝1.6mm

Copper thickness over 35 mm

(Unit : mm)

45

CHIP

R230

50

20

deflection

p9/18

MURATA MFG. CO., LTD.

6. Tape and Reel Packing

(1) LXES03A series

1）Dimensions of Tape

Unit : mm

Symbol

L W T a b c d e f

Size (0.67) (0.37) 0.5 max 2.00+/-0.05

4.00+/-0.10

3.50+/-0.05

1.75+/-0.1

8.00+/-0.30 φ1.55+/-0.05

(2) LXES15A series

2） Dimensions of Reel

Unit : mm

Symbol

L W T a b c d e f

Size (1.12) (0.62) 0.5 max 2.00+/-0.05

4.00+/-0.10

3.50+/-0.05

1.75+/-0.1

8.00+/-0.30 φ1.55+/-0.05

e

d

c

b

a

Ｗ

f

Ｌ

Ｔ

Feeding direction

p10/18

MURATA MFG. CO., LTD.

(3) Dimensions of Reel

Unit : mm

(4) Packaging

P/N pcs / reel

LXES03AAA1-154

LXES03AAA1-193 15,000

LXES15AAA1-133

LXES15AAA1-153 10,000

Symbol a b c d e

Size 2.0+/-0.5

φ13.0+/-0.2

9.0+1.0/-0

φ60+1.0/-0

φ180+0/-

1.5

d e

c

b

a

p11/18

MURATA MFG. CO., LTD.

(5) Taping Diagrams

1) LXES03A series

[1] Feeding Hole : As specified in (1) (2)

[2] Hole for chip : As specified in (1) (2)

[3] Cover tape : 50 m m in thickness

[4] Base tape : As specified in (1) (2)

Chip

Feeding Direction

Feeding Hole

[1]

[2]

[3]

[4]

p12/18

MURATA MFG. CO., LTD.

2) LXES15A series

[1] Feeding Hole : As specified in (1)

[2] Hole for chip : As specified in (1)

[3] Cover tape : 50 m m in thickness

[4] Base tape : As specified in (1)

[5] Bottom tape : 50 m m in thickness

Chip

Feeding Direction

Feeding Hole

[2]

[3]

[4]

[3]

[1]

[5]

p13/18

MURATA MFG. CO., LTD.

(6) Leader and Tail tape

(7) The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled

toward the user.

(8) Material : Base tape ...... Paper

Reel ...... Plastic

Base tape, Reel and Top tape have an anti-ESD function.

(9) Peeling of force : 0.1~1.0 N in the direction of peeling as shown below.

165 to 180 °

0.1～1.0

N

Cover tape

Tail tape

(No components) Components No components

Feeding direction

Leader tape

(Cover tape alone)

Over160mm

Over100mm

Over400mm

Base tape

p14/18

MURATA MFG. CO., LTD.

NOTICE

1. Storage Conditions:

To avoid damaging the solderability of the external electrodes, be sure to observe the following points.

- Store products where the ambient temperature is 15 to 35 °C and humidity 45 to 75% RH.

(Packing materials, In particular, may be deformed at the temperature over 40 °C.).

- Store products in non corrosive gas (Cl2, NH3,SO2, Nox, etc.).

- Stored products should be used within 6 months of receipt. Solderability should be verified if this period

is exceeded.

This product is applicable to MSL1 (Based on IPC/JEDEC J-STD-020)

2. Handling Conditions:

Be careful in handling or transporting products because excessive stress or mechanical shock may break

products due to the nature of ceramics structure.

Handle with care if products may have cracks or damages on their terminals, the characteristics of products

may change. Do not touch products with bear hands that may result in poor solderability.

3. Standard PCB Design (Land Pattern and Dimensions):

All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern

should be provided between IN and OUT terminals. Please refer to the specifications for the standard

land dimensions.

The recommended land pattern and dimensions is as Murata's standard. The characteristics of products

may vary depending on the pattern drawing method, grounding method, land dimensions, land forming

method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the

characteristics in the actual set. When using non-standard lands, contact Murata beforehand.

4. Notice for Chip Placer:

When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out

chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the

specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be

aware that mechanical chucking may damage products.

p15/18

MURATA MFG. CO., LTD.

5. Soldering Conditions:

Carefully perform preheating so that the temperature difference (DT) between the solder and products surface

should be in the following range. When products are immersed in solvent after mounting, pay special attention

to maintain the temperature difference within 100 °C. Soldering must be carried out by the above mentioned

conditions to prevent products from damage. Contact Murata before use if concerning other soldering

conditions.

Soldering method Temperature

Soldering iron method DT<=130 °C

Reflow method

- Soldering iron method conditions are indicated below.

Kind of iron Item Ceramics heater

Soldering iron wattage <=18 W

Temperature of iron-tip <=350 °C

Iron contact time within 3 sec

- Diameter of iron-tip : f3.0 mm max.

- Do not allow the iron-tip to directly touch the ceramic element.

Reflow soldering standard conditions (Example)

Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.

60-180 sec

DT

Temperature (°C)

Pre-heating

Time (s.)

217 °C

60-150 sec.

Cooling down

slowly

255-260 °C

20-40 sec

MAX260 °C

1

50 °C

200

°C

255

°C

p16/18

MURATA MFG. CO., LTD.

Amount of Solder Paste:

- Ensure that solder is applied smoothly to a minimum height of 0.2 to 0.5 mm at the end surface of the

external electrodes. If too much or little solder is applied, there is high possibility that the mechanical

strength will be insufficient, creating the variation of characteristics.

Chassis

Lead wire of leaded

component

Soldering iron

Solder resist

High

Chip

Amount of solder paste

Chip

PCB

Land

Solder (Grounding solder)

Solder resist

Lead wire of component

mounted later

p17/18

MURATA MFG. CO., LTD.

6. Cleaning Conditions:

Any cleaning is not permitted..

7. Operational Environment Conditions:

Products are designed to work for electronic products under normal environmental conditions (ambient

temperature, humidity and pressure). Therefore, products have no problems to be used under the similar

conditions to the above-mentioned. However, if products are used under the following circumstances, it

may damage products and leakage of electricity and abnormal temperature may occur.

- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).

- In an atmosphere containing combustible and volatile gases.

- In a dusty environment.

- Direct sunlight

- Water splashing place.

- Humid place where water condenses.

- In a freezing environment.

If there are possibilities for products to be used under the preceding clause, consult with Murata before

actual use.

If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe

measures must be taken, including the following:

(1) Installation of protection circuits or other protective device to improve system safety

(2) Installation of redundant circuits in the case of single-circuit failure

8. Limitation of Applications:

The products are designed and produced for application in ordinary electronic equipment

(AV equipment, OA equipment, telecommunication, etc). If the products are to be used in devices requiring

extremely high reliability following the application listed below, you should consult with the Murata staff in

advance.

- Aircraft equipment.

- Aerospace equipment

- Undersea equipment.

- Power plant control equipment.

- Medical equipment.

- Transportation equipment (vehicles, trains, ships, etc.).

- Traffic signal equipment.

- Disaster prevention / crime prevention equipment.

- Data-procession equipment.

- Application which malfunction or operational error may endanger human life and property of assets.

- Application which related to occurrence the serious damage

- Application of similar complexity and/ or reliability requirements to the applications listed in the above.

9. Place of use

LXES15AAA1-153 / LXES03AAA1-154 are developed mainly for antenna line and signal line use.

We do not recommend that you use it in places where DC voltage is always applied, even if it is within rated

voltage. LXES15AAA1-133 / LXES03AAA1-193 are withstand voltage products and can be used within the rated

voltage in places where the constant DC voltage such as the power supply line is applied.

p18/18

MURATA MFG. CO., LTD.

! Note:

Please make sure that your product has been evaluated and confirmed against your specifications when

our product is mounted to your product.

Product specifications are subject to change or our products in it may be discontinued without advance

notice.

This catalog is for reference only and not an official product specification document, therefore, please

review and approve our official product specification before ordering this product.

Note:

This catalog is for reference only and not an official product specification document, therefore, please review and approve our official

product specification before ordering this product.